Cleaning nozzle for multilayer circuit board

Abstract

The invention discloses a cleaning nozzle for a multilayer circuit board, which comprises a metal nozzle, the shape of the metal nozzle is a straight pipe, one end of the metal nozzle is provided with a deformable water jacket, the deformable water jacket is a soft pipe jacket, and one end, far away from the metal nozzle, of the deformable water jacket is connected with a water outlet ring; the deformable water jacket is sleeved with a supporting spring, one end of the supporting spring is connected to the end of the metal nozzle, and the other end of the supporting spring is connected to the water outlet ring. According to the cleaning nozzle of the multilayer circuit board, the deformable water jacket is arranged at one end of the metal nozzle, the shape of the deformable water jacket is supported through the supporting spring, the cleaning nozzle is not affected during normal use, and when the nozzle makes contact with the multilayer circuit board, the pressure of the nozzle on the multilayer circuit board forces the deformable water jacket to deform; therefore, rigid contact between the nozzle and the multilayer circuit board is avoided, the multilayer circuit board is protected, and the cleaning safety is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-layer circuit board production, and particularly to a cleaning nozzle for a multi-layer circuit board. Background Art

[0002] During the production process of multi-layer circuit boards, cleaning is required. To ensure the cleaning effect, during the cleaning process, the cleaning nozzle often needs to be as close as possible to the surface of the multi-layer circuit board to be cleaned, and the distance is usually in centimeters. However, due to mechanical operation errors, positioning errors, etc., the error in distance control may become larger, resulting in contact between the cleaning nozzle and the multi-layer circuit board to be cleaned. In such a case, it is possible for the cleaning nozzle to scrape or collide with the multi-layer circuit board, damaging the multi-layer circuit board. Summary of the Invention

[0003] To solve the deficiencies in the prior art, the present invention provides a cleaning nozzle for a multi-layer circuit board. The cleaning nozzle for the multi-layer circuit board is provided with a deformable water jacket at one end of the metal nozzle, and its shape is supported by a support spring. It is not affected during normal use. When the nozzle contacts the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board, and improving cleaning safety.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a cleaning nozzle for a multi-layer circuit board, including a metal nozzle. The shape of the metal nozzle is straight tubular. A deformable water jacket is provided at one end of the metal nozzle. The deformable water jacket is a soft tube sleeve. One end of the deformable water jacket away from the metal nozzle is connected with a water outlet ring;

[0006] The outside of the deformable water jacket is sleeved with a support spring. One end of the support spring is connected to the end of the metal nozzle, and the other end of the support spring is connected to the water outlet ring.

[0007] The cleaning nozzle for the multi-layer circuit board is provided with a deformable water jacket at one end of the metal nozzle, and its shape is supported by a support spring. It is not affected during normal use. When the nozzle contacts the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board, and improving cleaning safety.

[0008] In a further technical solution, both the deformable water jacket and the support spring are conical.

[0009] Since the deformable water jacket itself will also have a certain expansion and deformation due to water pressure during normal use, resulting in a decrease in water pressure, it is designed to be conical to increase the water pressure to compensate for the decrease in water pressure caused by its deformation.

[0010] In a further technical solution, the outer diameter of one end of the deformable water jacket is smaller than the outer diameter of the metal nozzle, and the outer diameter of the other end of the deformable water jacket is smaller than the outer diameter of the water outlet ring.

[0011] A part of the radial position is left at the connection of both ends of the deformable water jacket to provide sufficient support positions for the support springs and ensure the support effect.

[0012] In a further technical solution, the water outlet ring is a rubber ring.

[0013] The rubber ring can further prevent hard contact between the nozzle and the multi-layer circuit board and further improve safety.

[0014] In a further technical solution, the axial length of the deformable water jacket is 5 mm.

[0015] The beneficial effects are as follows:

[0016] 1. The cleaning nozzle of the multi-layer circuit board is provided with a deformable water jacket at one end of the metal nozzle and its shape is supported by a support spring. It is not affected during normal use. When the nozzle contacts the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board and improving cleaning safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the cleaning nozzle of the multi-layer circuit board according to an embodiment of the present invention.

[0018] 10. Metal nozzle; 20. Water outlet ring; 30. Deformable water jacket; 40. Support spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The present invention will be further described below with reference to the drawings:

[0020] Embodiment:

[0021] A cleaning nozzle for a multi-layer circuit board, as Figure 1 shown, includes a metal nozzle 10. The shape of the metal nozzle 10 is a straight tube. A deformable water jacket 30 is provided at one end of the metal nozzle 10. The deformable water jacket 30 is a soft tube sleeve. One end of the deformable water jacket 30 away from the metal nozzle 10 is connected to a water outlet ring 20;

[0022] The outer part of the deformable water jacket 30 is sleeved with a support spring 40. One end of the support spring 40 is connected to the end of the metal nozzle 10, and the other end of the support spring 40 is connected to the water outlet ring 20.

[0023] The cleaning nozzle of the multi-layer circuit board is provided with a deformable water jacket 30 at one end of the metal nozzle 10, and its shape is supported by the support spring 40. It is not affected during normal use. When the nozzle contacts the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket 30 to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board, and improving the cleaning safety.

[0024] It can be understood that the support spring 40 is wound around the periphery of the deformable water jacket 30. On the one hand, it plays a role in supporting its axial length. On the other hand, it can also serve as a limiting function to prevent the deformable water jacket 30 from being overly enlarged by water pressure during normal use.

[0025] In another embodiment, both the deformable water jacket 30 and the support spring 40 are conical.

[0026] Since the deformable water jacket 30 itself will also have a certain expansion deformation due to water pressure during normal use, resulting in a decrease in water pressure, it is designed to be conical to increase the water pressure to compensate for the decrease in water pressure caused by its deformation.

[0027] In another embodiment, the outer diameter of one end of the deformable water jacket 30 is smaller than the outer diameter of the metal nozzle 10, and the outer diameter of the other end of the deformable water jacket 30 is smaller than the outer diameter of the water outlet ring 20.

[0028] A part of the radial position is left at the connection of both ends of the deformable water jacket 30 to provide sufficient support positions for the support spring 40 and ensure the support effect.

[0029] In another embodiment, the water outlet ring 20 is a rubber ring.

[0030] The rubber ring can further prevent hard contact between the nozzle and the multi-layer circuit board and further improve the safety.

[0031] In another embodiment, the axial length of the deformable water jacket 30 is 5 mm.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A cleaning nozzle for a multi-layer circuit board, characterized in that, It includes a metal nozzle. The shape of the metal nozzle is a straight tube. One end of the metal nozzle is provided with a deformable water jacket. The deformable water jacket is a soft tube sleeve. One end of the deformable water jacket away from the metal nozzle is connected with a water outlet ring. A support spring is sleeved outside the deformable water jacket. One end of the support spring is connected to the end of the metal nozzle, and the other end of the support spring is connected to the water outlet ring.

2. The cleaning nozzle for a multi-layer circuit board according to claim 1, wherein Both the deformable water jacket and the support spring are conical.

3. The cleaning nozzle for the multi-layer circuit board according to claim 1 or 2, characterized in that, The outer diameter of one end of the deformable water jacket is smaller than the outer diameter of the metal nozzle, and the outer diameter of the other end of the deformable water jacket is smaller than the outer diameter of the water outlet ring.

4. The cleaning nozzle for a multi-layer circuit board according to claim 1, wherein The water outlet ring is a rubber ring.

5. The cleaning nozzle for a multi-layer circuit board according to claim 1, wherein, The axial length of the deformable water jacket is 5 mm.

Images