Intrinsic high-thermal-conductivity bio-based liquid crystal epoxy resin and preparation method thereof

By preparing intrinsically high thermal conductivity bio-based liquid crystal epoxy resin, combining dynamic covalent bonds and imine bonds, the shortcomings of epoxy resin materials in thermal conductivity, mechanical properties and recyclability are solved, and are suitable for high-frequency, high-density microelectronic equipment and aerospace fields.

CN120365529APending Publication Date: 2025-07-25ANHUI KEZHILAN NEW MATERIAL CO LTD
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Patent Information

Application Number
CN202510502507.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-21
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

Existing epoxy resin materials have shortcomings in thermal conductivity, thermal mechanical properties and recyclability, and it is difficult to meet the high thermal conductivity and sustainable development needs of modern electronic equipment.

Method used

By introducing bio-based liquid crystal epoxy resin and dynamic covalent bonds, an intrinsic high thermal conductivity bio-based liquid crystal epoxy resin is prepared, and the controlled degradation and reprocessing capabilities of the material are achieved by combining imine bonds.

Benefits of technology

It achieves high thermal conductivity and excellent mechanical properties, and is also recyclable, and is suitable for electronic packaging of high-frequency and high-density microelectronic devices and aerospace.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of heat-conducting epoxy resin, in particular to intrinsic high-heat-conductivity bio-based liquid crystal epoxy resin and a preparation method thereof. According to the method, the intrinsic high-thermal-conductivity liquid crystal epoxy resin with dynamic imine bonds is synthesized by taking vanillin derivatives and aminobiphenyl compounds as monomers. The intrinsic high-thermal-conductivity liquid crystal epoxy resin has the characteristics of high thermal conductivity, excellent mechanical property, recyclability and the like. According to the intrinsic high-thermal-conductivity liquid crystal epoxy resin disclosed by the invention, the thermal conductivity of a material is improved by highly ordered distribution formed by a highly ordered rigid biphenyl main chain in a curing process, and the material is endowed with reprocessability and chemical recovery characteristics by dynamic imine bonds. The invention effectively solves the key problems of joint debugging contradiction between the thermal conductivity and the thermal mechanical property of the traditional epoxy resin and incapability of reprocessing and recycling, and is expected to be applied to the fields of high frequency, high density, microelectronics and the like.
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Description

Technical Field

[0001] The present invention relates to the technical field of thermally conductive epoxy resins, and more particularly, to an intrinsically highly thermally conductive bio-based liquid crystal epoxy resin and a preparation method thereof. Background Art

[0002] With the development of electronic devices towards high power, high frequency and high integration, the problem of thermal management has become increasingly severe. Traditional epoxy resin materials have limitations in thermal conductivity, dielectric properties and thermomechanical properties, and it is difficult to meet the higher requirements for heat dissipation performance of modern electronic devices. Liquid crystal epoxy resins, due to their unique molecular structure and self-assembly characteristics, can form highly ordered mesoscopic domains, thus significantly improving thermal conductivity while retaining the excellent physical properties of epoxy resins, and have become a research hotspot in the field of thermal management. However, traditional epoxy resin materials are difficult to degrade or recycle at the end of their life cycle, resulting in resource waste and environmental pollution problems, which is contrary to the goal of global sustainable development.

[0003] The present invention introduces bio-based liquid crystal epoxy and dynamic covalent bonds into the epoxy resin cross-linking network to prepare an intrinsically highly thermally conductive bio-based liquid crystal epoxy resin. Through molecular design and structural innovation, imine bonds are introduced into the liquid crystal epoxy resin, endowing the material with the ability to be controllably degraded or reprocessed under specific conditions. This design not only retains the high thermal conductivity and excellent mechanical properties of the liquid crystal epoxy resin, but also realizes the recyclability and environmental friendliness of the material, providing a new solution for the sustainable development of fields such as electronic packaging, aerospace, and energy equipment. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an intrinsically highly thermally conductive bio-based liquid crystal epoxy resin and a preparation method thereof, so as to solve the key technical problems that it is impossible to have both high thermal conductivity and good thermomechanical properties and non-recyclability in the existing thermally conductive epoxy resins.

[0005] To solve the above technical problems, the present invention provides an intrinsically highly thermally conductive bio-based liquid crystal epoxy resin and a preparation method thereof, which are obtained by the following method:

[0006] Vanillin, an aminobiphenyl compound and a solvent are heated under reflux at 60 - 80 °C for 3 - 5 h. After the reaction is completed, filtration and drying are carried out to obtain the product diphenolic hydroxybiphenyl compound; the diphenolic hydroxybiphenyl compound, epichlorohydrin and tetrabutylammonium bromide are mixed evenly and stirred at 80 - 120 °C for 1 - 4 h, and then 10 wt% - 40 wt% aqueous sodium hydroxide solution is added and the reaction is continued at 10 - 30 °C for 4 - 8 h. After the reaction is completed, washing with water, liquid separation and vacuum distillation are carried out to obtain the intrinsically highly thermally conductive bio-based liquid crystal epoxy resin.

[0007] Furthermore, the aminobiphenyl compound is One of the following, the solvent is one of N,N-dimethylformamide, methanol, ethanol, acetonitrile and chloroform, and the mass ratio of the aminobiphenyl compound, vanillin and the solvent is 1.0:(2 - 2.2):20.

[0008] Furthermore, the mass ratio of the diphenolic hydroxyl biphenyl compound, epichlorohydrin, tetrabutylammonium bromide and sodium hydroxide is 1.0:(10.0 - 20.0):(0.01 - 0.02):(2.0 - 4.0).

[0009] Furthermore, the recoverable intrinsic thermotropic liquid crystal epoxy resin is

[0010]

[0011] The present invention also provides a recovery method for the above-mentioned intrinsic highly thermally conductive bio-based liquid crystal epoxy resin:

[0012] Mix the intrinsic highly thermally conductive bio-based liquid crystal epoxy resin, an acid anhydride curing agent and a curing accelerator, and cure at 120 - 160 °C for 4 - 8 h to obtain a cured product of the intrinsic highly thermally conductive bio-based liquid crystal epoxy resin. Degrade the above-mentioned cured product of the intrinsic highly thermally conductive bio-based liquid crystal epoxy resin in a 0.1 mol / L - 1 mol / L hydrochloric acid - tetrahydrofuran solution at 25 °C for 8 - 24 h, then filter the degradation solution, and neutralize the filtered product with triethylamine to pH = 7, wash with water and dry to obtain the recovered aminobiphenyl compound.

[0013] Furthermore, the acid anhydride curing agent is one of methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride and methylnadic anhydride, the accelerator is one of 2,4,6-tris(dimethylaminomethyl)phenol, 1-methylimidazole, and 2-ethyl-4-methylimidazole, and the mass ratio of the intrinsic highly thermally conductive bio-based liquid crystal epoxy resin, the acid anhydride curing agent and the curing accelerator is 100:30 - 60:0.5 - 1.

[0014] The effective beneficial effects of the present invention are:

[0015] 1. The intrinsic highly thermally conductive bio-based liquid crystal epoxy resin prepared by the present invention introduces dynamic imine bonds into the epoxy resin crosslinking network, endows the epoxy resin with the function of being recyclable, can be degraded and recycled to obtain aminobiphenyl compound monomers, and realizes the green closed-loop recycling of thermally conductive epoxy resin.

[0016] 2. The intrinsic highly thermally conductive bio-based liquid crystal epoxy resin prepared by the present invention has high thermal conductivity and at the same time maintains the required mechanical properties, and can be used as an electronic packaging material for high-frequency and high-performance microelectronics and high-voltage power equipment.

[0017] 3. The preparation process and recovery method of the intrinsic highly thermally conductive bio-based liquid crystal epoxy resin of the present invention are simple and suitable for industrial production. Detailed implementation manners

[0018] The present invention will be described in detail below in conjunction with specific embodiments, but the protection scope of the present invention is not limited to these embodiments.

[0019] Example 1

[0020] 334.73 g of vanillin, 184.24 g of 4,4-diaminobiphenyl, and 6694.60 g of ethanol were heated under reflux at 75 °C for 3 h. After the reaction was completed, filtration and drying were performed to obtain the product diphenolic hydroxyl biphenyl compound, and the yield was 84.3%.

[0021] 300 g of diphenolic hydroxyl biphenyl, 462.60 g of epichlorohydrin, and 13.78 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 385.33 g of 40 wt% aqueous sodium hydroxide solution was added and stirred at 10 °C for 8 h. After the reaction was completed, washing, liquid separation, and vacuum distillation were performed to obtain the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 82.4% and an epoxy value of 0.35 mol / 100 g.

[0022] 100 g of the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin, 55 g of methylhexahydrophthalic anhydride, and 1 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin. 100 g of the above-mentioned cured product of the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin was placed in 300 ml of 0.2 mol / L hydrochloric acid-tetrahydrofuran solution for 24 h. Then, the degradation solution was filtered, and the filtered product was neutralized with triethylamine to pH = 7, washed, and dried to obtain the recovered 4,4-diaminobiphenyl.

[0023] 33.47 g of vanillin, 18.42 g of the recovered 4,4-diaminobiphenyl, and 669.46 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction was completed, filtration and drying were performed to obtain the product diphenolic hydroxyl biphenyl compound, and the yield was 84.3%.

[0024] 30 g of diphenolic hydroxyl biphenyl, 46.26 g of epichlorohydrin, and 1.38 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 38.53 g of 40 wt% aqueous sodium hydroxide solution was added and stirred at 10 °C for 8 h. After the reaction was completed, washing, liquid separation, and vacuum distillation were performed to obtain the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 82.4% and an epoxy value of 0.35 mol / 100 g.

[0025] 20 g of the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin, 11 g of methylhexahydrophthalic anhydride, and 0.2 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high-thermal conductivity bio-based liquid crystal epoxy resin.

[0026] Example 2

[0027] 334.73 g of vanillin, 244.29 g of 3,3'-dimethoxydiphenylamine and 6694.60 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound with a yield of 85.2%.

[0028] 226.25 g of diphenolic hydroxyl biphenyl, 613.38 g of epichlorohydrin and 18.27 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 510.92 g of 40 wt% sodium hydroxide aqueous solution was added and stirred at 10 °C for 8 h. After the reaction, washing, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin with a yield of 82.1% and an epoxy value of 0.26 mol / 100 g.

[0029] 100 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 40.85 g of methylhexahydrophthalic anhydride and 1 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin. 100 g of the above-mentioned cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin was placed in 300 ml of 0.2 mol / L hydrochloric acid-tetrahydrofuran solution for 24 h. Then, the degradation solution was filtered, and the filtered product was neutralized with triethylamine to pH = 7, washed and dried to obtain the recovered 3,3'-dimethoxydiphenylamine.

[0030] 33.47 g of vanillin, 24.43 g of the recovered 3,3'-dimethoxydiphenylamine and 669.46 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound with a yield of 85.1%.

[0031] 22.63 g of diphenolic hydroxyl biphenyl, 61.34 g of epichlorohydrin and 1.83 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 38.53 g of 40 wt% sodium hydroxide aqueous solution was added and stirred at 10 °C for 8 h. After the reaction, washing, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin with a yield of 82.1% and an epoxy value of 0.26 mol / 100 g.

[0032] 20 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 8.17 g of methylhexahydrophthalic anhydride and 0.2 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin

[0033] Example 3

[0034] 334.73 g of vanillin, 328.17 g of 4,4'-diaminooctafluorobiphenyl and 6694.60 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound with a yield of 85.2%.

[0035] 300 g of diphenolic hydroxyl biphenyl, 824.43 g of epichlorohydrin and 24.53 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then 685.89 g of 40 wt% aqueous sodium hydroxide solution was added and stirred at 10 °C for 8 h. After the reaction, washing with water, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin with a yield of 81.4% and an epoxy value of 0.20 mol / 100 g.

[0036] 100 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 31.43 g of methylhexahydrophthalic anhydride and 1 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin. 100 g of the above-mentioned cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin was placed in 300 ml of 0.2 mol / L hydrochloric acid-tetrahydrofuran solution for 24 h. Then the degradation solution was filtered, and the filtered product was neutralized with triethylamine to pH = 7, washed with water and dried to obtain the recovered 4,4'-diaminooctafluorobiphenyl.

[0037] 33.47 g of vanillin, 328.17 g of the recovered 4,4'-diaminooctafluorobiphenyl and 669.46 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound with a yield of 84.1%.

[0038] 30 g of diphenolic hydroxyl biphenyl, 82.44 g of epichlorohydrin and 2.45 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then 68.61 g of 40 wt% aqueous sodium hydroxide solution was added and stirred at 10 °C for 8 h. After the reaction, washing with water, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin with a yield of 81.4% and an epoxy value of 0.35 mol / 100 g.

[0039] 20 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 6.28 g of methylhexahydrophthalic anhydride and 0.2 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin.

[0040] Example 4

[0041] 334.73 g of vanillin, 240.35 g of 3,3’,5,5’-tetramethylbenzidine and 6694.60 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound with a yield of 85.3%.

[0042] Mix 295.15 g of diphenolic hydroxyl biphenyl, 603.48 g of epichlorohydrin and 18.00 g of tetrabutylammonium bromide uniformly, stir and react at 80 °C for 4 h, then add 502.68 g of 40 wt% aqueous sodium hydroxide solution and stir and react at 10 °C for 8 h. After the reaction, wash with water, separate the liquid, and perform vacuum distillation to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 83.0% and an epoxy value of 0.27 mol / 100 g.

[0043] Mix 100 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 42.31 g of methylhexahydrophthalic anhydride and 1 g of 1-methylimidazole, and cure at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin. Immerse 100 g of the above-mentioned cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin in 300 ml of 0.5 mol / L hydrochloric acid-tetrahydrofuran solution for 16 h, then filter the degradation solution, neutralize the filtered product with triethylamine to pH = 7, wash with water, and dry to obtain the recovered 3,3',5,5'-tetramethylbenzidine.

[0044] Heat 33.47 g of vanillin, 24.04 g of the recovered 3,3',5,5'-tetramethylbenzidine and 669.46 g of ethanol under reflux at 80 °C for 5 h. After the reaction, filter and dry to obtain the product diphenolic hydroxyl biphenyl compound, with a yield of 85.3%.

[0045] Mix 29.52 g of diphenolic hydroxyl biphenyl, 60.35 g of epichlorohydrin and 1.80 g of tetrabutylammonium bromide uniformly, stir and react at 80 °C for 4 h, then add 50.27 g of 40 wt% aqueous sodium hydroxide solution and stir and react at 10 °C for 8 h. After the reaction, wash with water, separate the liquid, and perform vacuum distillation to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 83.0% and an epoxy value of 0.27 mol / 100 g.

[0046] Mix 20 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 8.46 g of methylhexahydrophthalic anhydride and 0.2 g of 1-methylimidazole, and cure at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin.

[0047] Example 5

[0048] Heat 334.73 g of vanillin, 212.29 g of 3,3'-dimethylbenzidine and 6694.60 g of ethanol under reflux at 80 °C for 5 h. After the reaction, filter and dry to obtain the product diphenolic hydroxyl biphenyl compound, with a yield of 84.9%.

[0049] 260.75 g of diphenolic hydroxyl biphenyl, 533.14 g of epichlorohydrin and 15.88 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 444.09 g of 40 wt% sodium hydroxide aqueous solution was added and stirred at 10 °C for 8 h. After the reaction, washing with water, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 81.6% and an epoxy value of 0.30 mol / 100 g.

[0050] 100 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 47.14 g of methylhexahydrophthalic anhydride and 1 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin. 100 g of the above-mentioned cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin was placed in 300 ml of 1 mol / L hydrochloric acid-tetrahydrofuran solution for 8 h. Then, the degradation solution was filtered, and the filtered product was neutralized with triethylamine to pH = 7, washed with water and dried to obtain the recovered 3,3'-dimethylbenzidine.

[0051] 33.47 g of vanillin, 22.23 g of the recovered 3,3'-dimethylbenzidine and 669.46 g of ethanol were heated under reflux at 80 °C for 5 h. After the reaction, filtration and drying were carried out to obtain the product diphenolic hydroxyl biphenyl compound, with a yield of 84.7%.

[0052] 26.08 g of diphenolic hydroxyl biphenyl, 53.31 g of epichlorohydrin and 1.59 g of tetrabutylammonium bromide were mixed evenly and stirred at 80 °C for 4 h. Then, 44.41 g of 40 wt% sodium hydroxide aqueous solution was added and stirred at 10 °C for 8 h. After the reaction, washing with water, liquid separation and vacuum distillation were carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, with a yield of 81.5% and an epoxy value of 0.30 mol / 100 g.

[0053] 20 g of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, 9.43 g of methylhexahydrophthalic anhydride and 0.2 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin.

[0054] Comparative Example 1

[0055] This comparative example corresponds to Examples 1-5, and its epoxy resin preparation method is as follows:

[0056] 100 g of bisphenol A epoxy resin, 87 g of methylhexahydrophthalic anhydride and 1 g of 1-methylimidazole were mixed and cured at 120 °C for 8 h to obtain the cured epoxy resin product.

[0057] After the epoxy resin cured products obtained in Examples 1 to 5 and Comparative Example 1 in this specific embodiment were placed at 25°C for 24 hours, the tensile strength, notchless impact strength, and thermal conductivity were measured according to ASTM 3039, ASTM D256, and ASTM D5470.

[0058] Table 1 Mechanical properties and thermal conductivity of Examples 1 to 5 and Comparative Example 1

[0059] Example Tensile strength (MPa) <![CDATA[Impact strength (kJ / m 2 )]]> Thermal conductivity (W / mK) Example 1 58 36 1.62 Example 2 54 33 1.43 Example 3 67 47 1.66 Example 4 55 41 1.52 Example 5 51 28 1.39 Comparative Example 1 36 13 0.37

[0060] Table 2 Mechanical properties and thermal conductivity of the recycled liquid crystal epoxy resins obtained in Examples 1 to 5

[0061]

[0062]

Claims

1. An intrinsically highly thermally conductive bio-based liquid crystal epoxy resin and a preparation method thereof, characterized in that It includes the following steps: Vanillin, aminobiphenyl compounds and a solvent are heated under reflux at 60 - 80 °C for 3 - 5 h. After the reaction ends, filtration and drying are carried out to obtain the product diphenolic hydroxyl biphenyl compounds; the diphenolic hydroxyl biphenyl compounds, epichlorohydrin and tetrabutylammonium bromide are mixed evenly and stirred at 80 - 120 °C for 1 - 4 h, then 10 wt% - 40 wt% sodium hydroxide aqueous solution is added and the reaction continues at 10 - 30 °C for 4 - 8 h. After the reaction ends, washing, liquid separation and vacuum distillation are carried out to obtain the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin.

2. The intrinsic high thermal conductivity bio-based liquid crystal epoxy resin according to claim 1 and its preparation method, characterized in that, The aminobiphenyl compound is one of them, the solvent is one of N,N-dimethylformamide, methanol, ethanol, acetonitrile and chloroform, and the mass ratio of the aminobiphenyl compound, vanillin and the solvent is 1.0:(2-2.2):

20.

3. An intrinsic high thermal conductivity bio-based liquid crystal epoxy resin according to claim 1 and its preparation method, characterized in that, The mass ratio of the diphenolic hydroxyl biphenyl compounds, epichlorohydrin, tetrabutylammonium bromide and sodium hydroxide is 1.0:(10.0 - 20.0):(0.01 - 0.02):(2.0 - 4.0).

4. An intrinsic high thermal conductivity bio-based liquid crystal epoxy resin and its preparation method according to claim 1, characterized in that, The recyclable intrinsic thermal liquid crystal epoxy resin is 5. An intrinsic high thermal conductivity bio-based liquid crystal epoxy resin and a preparation method thereof according to claim 1, characterized in that, The recycling method is as follows: the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, an acid anhydride curing agent and a curing accelerator are mixed and cured at 120 - 160 °C for 4 - 8 h to obtain the cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin. The above-mentioned cured product of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin is degraded in a 0.1 mol / L - 1 mol / L hydrochloric acid - tetrahydrofuran solution at 25 °C for 8 - 24 h, then the degradation solution is filtered, and the filtered product is neutralized with triethylamine, washed and dried to obtain the recycled aminobiphenyl compounds.

6. An intrinsic high thermal conductivity bio-based liquid crystal epoxy resin and its preparation method according to claim 5, characterized in that, The acid anhydride curing agent is one of methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride and methylnadic anhydride, the accelerator is one of 2,4,6-tris(dimethylaminomethyl)phenol, 1-methylimidazole and 2-ethyl-4-methylimidazole, and the mass ratio of the intrinsic high thermal conductivity bio-based liquid crystal epoxy resin, the acid anhydride curing agent and the curing accelerator is 100:30 - 60:0.5 - 1.