Liquid-cooled server heat dissipation device with composite cold plate and phase change cold storage coupling

Abstract

The present invention discloses a liquid-cooled server heat dissipation device with a composite cold plate and phase change cold storage coupling, comprising a composite plate assembly, the composite plate assembly including a cold plate seat, a cold plate module, a phase change cooling module, an input port, an output port, and an assembly mechanism. The cold plate seat is internally provided with a support groove, the phase change cooling module is embedded and mounted on the lower end of the cold plate module, the input port and the output port are respectively mounted on the upper end surface of the cold plate module, the lower end surface of the cold plate module is movably connected to the upper end surface of the support groove, and the cold plate module is sleeved with the inner cavity of the cold plate seat, a circulating pump, a first connecting pipe is installed between the circulating pump and the output port for circulating the coolant in the pipe, and a cold storage assembly, the cold storage assembly including a liquid storage box, a cover plate, heat dissipation fins, and a cooling fan. The present invention adopts a design that couples a composite cold plate with a phase change material to achieve efficient absorption, dynamic buffering, and multi-stage recovery of server heat, breaking through the bottleneck of traditional liquid cooling heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation for liquid-cooled servers, and in particular to a liquid-cooled server heat dissipation device coupled with a composite cold plate and phase-change cold storage. Background Art

[0002] In today's digital age, with the rapid development of information technology, servers, as core equipment for data processing and storage, have continuously improved their performance, but their power density has also increased dramatically. Traditional air-cooling heat dissipation systems face many limitations when dealing with high-power servers. Air cooling relies on air as a heat transfer medium. Due to the low heat transfer coefficient of air, in order to achieve sufficient heat dissipation, high-speed fans need to be equipped. This not only consumes a lot of energy, but also produces significant noise pollution, affecting the working environment of the computer room. In addition, it is difficult for air-cooling systems to accurately control the operating temperature of the server. When running at high load, the server is prone to hardware failures and performance degradation due to overheating, which reduces the reliability and service life of the server. In this context, liquid cooling technology should be used. As a result, a liquid-cooled server system that combines a cold plate with phase change cooling has become a highly promising solution. The cold plate uses high-thermal conductivity metal materials to fit tightly with the server's heating elements, and efficiently transfers heat to the coolant through internal microchannels or heat pipe structures. Phase change cooling uses the coolant's characteristic of absorbing a large amount of latent heat during the phase change process to further enhance the heat dissipation capacity. This combination fully utilizes the advantages of both, greatly improves the heat dissipation efficiency, and effectively solves the heat dissipation problem of high-power servers. At the same time, compared with the air-cooled system, the liquid cooling system has lower energy consumption and less noise, can more accurately control the server temperature, and significantly improve the server's reliability and stability. It has broad application prospects in data centers, high-performance computing and other fields.

[0003] Currently, when cooling heat-generating components of servers, such as CPU or GPU cold plates, traditional cold plate liquid cooling technology has limited cooling efficiency and is unable to meet the cooling requirements of ultra-high power density servers. Therefore, we propose a liquid cooling server heat dissipation device that combines a composite cold plate and phase change cold storage to solve this problem. Summary of the Invention

[0004] The object of the present invention is to provide a liquid-cooled server heat dissipation device coupled with a composite cold plate and phase change cold storage to solve the problems raised in the above background technology.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A liquid cooling server heat dissipation device coupled with a composite cold plate and phase change cold storage includes:

[0007] A composite plate assembly, the composite plate assembly includes a cold plate seat, a cold plate module, a phase change cooling module, an input port, an output port and an assembly mechanism, the cold plate seat is provided with a supporting groove, the phase change cooling module is embedded in the lower end of the cold plate module, the input port and the output port are respectively installed on the upper end surface of the cold plate module, the lower end surface of the cold plate module is movably connected to the upper end surface of the supporting groove, and the cold plate module is sleeved with the inner cavity of the cold plate seat;

[0008] A circulating pump, wherein a first connecting pipe is installed between the circulating pump and the output port for circulating the coolant in the pipe;

[0009] A cold storage assembly, comprising a liquid storage box, a cover plate, heat dissipation fins, and a heat dissipation fan. The cover plate is movably connected to the upper end surface of the liquid storage box, the heat dissipation fins are fixedly engaged inside the cover plate, the heat dissipation fan is assembled and connected to the upper end surface of the heat dissipation fins by bolts, and a second connecting pipe is installed between the liquid storage box and the output end of the circulating pump;

[0010] The liquid delivery component includes a heat exchange plate, a storage bin and a sealing plate. The inner cavity of the heat exchange plate is provided with a guide groove. The storage bin is fixedly installed on the upper end surface of the heat exchange plate. The upper end surface of the storage bin is provided with a mounting groove. Three mounting bolts are respectively sleeved on all four sides of the sealing plate. A third connecting pipe is installed between one end of the guide groove and the liquid storage box, and a fourth connecting pipe is installed between the other end of the guide groove and the input port.

[0011] Preferably, the assembly mechanism includes a threaded barrel, an assembly frame and a mounting bolt. The threaded barrel is fixedly installed around the upper end surface of the cold plate seat. The assembly frame is arranged above the cold plate seat, and the assembly frame is movably connected to the upper end surface of the cold plate module. The mounting bolt passes through the assembly frame and is threadedly connected to the threaded barrel.

[0012] Preferably, the assembly frame forms a fixable structure between the mounting bolt 1 and the threaded barrel, which is used to assemble and fix the cold plate module in the cold plate seat.

[0013] Preferably, a plurality of guide holes are provided at the lower end of the heat dissipation fins for circulating the coolant in the liquid storage box.

[0014] Preferably, two mounting bolts are respectively sleeved around the cover plate, and the two mounting bolts are threadedly connected to the upper end surface of the liquid storage box, and the cover plate forms an assemblable structure with the liquid storage box through the two mounting bolts.

[0015] Preferably, the lower end of the heat dissipation fin is arranged in the inner cavity of the liquid storage box, and the upper end of the heat dissipation fin is arranged at the outer end of the liquid storage box, which is used to exchange heat and cool the coolant in the liquid storage box.

[0016] Preferably, the lower end of the inner cavity of the storage bin is connected to the upper end surface of the heat exchange plate, and the storage bin stores phase change material.

[0017] Preferably, the lower end surface of the sealing plate is movably connected to the upper end surface of the mounting groove, and the sealing plate is sleeved with the inner cavity of the storage bin.

[0018] Preferably, the third mounting bolt is threadedly connected to the upper end surface of the storage bin, and the sealing plate forms an assemblable structure with the storage bin through the third mounting bolt.

[0019] The beneficial effects of the present invention are:

[0020] 1. Compared with traditional cold plate liquid cooling technology, which has insufficient heat dissipation efficiency when used with ultra-high power density servers, this cold plate combined with phase change cooling liquid cooling server system achieves a breakthrough in efficient heat dissipation. The cold plate is tightly fitted with the server's heating elements, quickly conducting heat through high thermal conductivity materials, and then transferring heat to the coolant through internal microchannels. The phase change cooling module works at the heat concentration point, and the coolant absorbs a large amount of latent heat during the phase change process, greatly enhancing the heat dissipation capacity. This composite heat dissipation method enables the system to easily cope with the large amount of heat generated by high-power servers, effectively solving the heat dissipation problem of traditional technologies in high-power scenarios and ensuring stable server operation.

[0021] 2. In this invention, the synergistic effect of the cold plate and phase change cooling can accurately adjust the operating temperature of the server. The cold plate can quickly remove heat from the heat-generating components, while the phase change cooling module quickly activates when the temperature is too high to absorb excess heat. At the same time, the control system in the system monitors the server temperature in real time and adjusts the coolant flow rate and heat dissipation strategy according to actual conditions. Compared with the traditional air cooling system that has difficulty in precise temperature control, this liquid cooling system can create a stable working environment for the server, reduce performance degradation and hardware failure caused by temperature fluctuations, and extend the service life of the server.

[0022] 3. In terms of energy consumption, the present invention has significant advantages in the liquid cooling server system. Unlike traditional air cooling systems that require a large amount of electricity to drive fans, the liquid cooling system utilizes the efficient heat transfer characteristics of the coolant to greatly reduce energy consumption. The combination of cold plates and phase change cooling improves heat dissipation efficiency, so that the system requires less energy to achieve the same heat dissipation effect. The power of the circulation pump is relatively low, further reducing energy consumption. In the long run, it can save a lot of operating costs for users such as data centers, and is in line with the development trend of energy conservation and environmental protection.

[0023] 4. Compared with the traditional air cooling system, the high-speed fan generates huge noise, which greatly disturbs the working environment of the server room. The liquid cooling server system of the present invention abandons the high-speed fan and adopts the coolant circulation heat dissipation method. The noise is significantly reduced during operation, which not only creates a quiet working environment for the staff in the server room, which is conducive to improving work efficiency and physical and mental health, but also reduces the impact of noise on the surrounding environment.

[0024] 5. In the present invention, the composite plate assembly of the device can be flexibly set according to the number of components of the server. Expansion can be easily achieved by simply connecting the input and output ports of multiple composite plate assemblies through connecting pipes. This design enables the system to adapt to servers of different sizes and power requirements. Whether it is a small enterprise server or a cluster server in a large data center, it can be customized according to actual conditions. The quick-release joints used in the system facilitate the installation and disassembly of the pipeline, and facilitate subsequent maintenance and upgrades, ensuring that the system can operate stably for a long time and meet ever-changing business needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the liquid-cooled server heat dissipation device of the composite cold plate-phase change cold storage coupling proposed in the present invention;

[0026] Figure 2 Schematic diagram of the exploded structure of the composite plate assembly in the present invention;

[0027] Figure 3 This is an exploded bottom-up structural diagram of the composite panel assembly in this embodiment;

[0028] Figure 4 Schematic diagram of the structure of the cold storage component in this invention;

[0029] Figure 5 This is a structural diagram of the liquid delivery component in this invention;

[0030] Figure 6 This is a structural diagram of the cross section of the heat exchange plate in this invention.

[0031] In the figure: 1. Composite plate assembly; 101. Cold plate seat; 102. Supporting groove; 103. Cold plate module; 104. Phase change cooling module; 105. Input port; 106. Output port; 107. Threaded barrel; 108. Assembly frame; 109. Mounting bolt one; 2. Circulating pump; 3. Cold storage assembly; 301. Liquid storage box; 302. Cover plate; 303. Heat dissipation fin; 304. Guide hole; 305. Mounting bolt two; 306. Cooling fan; 4. Liquid delivery assembly; 401. Heat exchange plate; 402. Guide groove; 403. Storage bin; 404. Mounting groove; 405. Sealing plate; 406. Mounting bolt three; 5. First connecting pipe; 6. Second connecting pipe; 7. Third connecting pipe; 8. Fourth connecting pipe. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0033] Reference Figure 1 - Figure 6 , a liquid cooling server heat dissipation device coupled with a composite cold plate and phase change cold storage, comprising:

[0034] Composite plate assembly 1, composite plate assembly 1 includes a cold plate seat 101, a cold plate module 103, a phase change cooling module 104, an input port 105, an output port 106 and an assembly mechanism. A support groove 102 is opened inside the cold plate seat 101, the phase change cooling module 104 is embedded and installed at the lower end of the cold plate module 103, the input port 105 and the output port 106 are respectively installed on the upper end surface of the cold plate module 103, the lower end surface of the cold plate module 103 is movably connected to the upper end surface of the support groove 102, and the cold plate module 103 is sleeved with the inner cavity of the cold plate seat 101;

[0035] The cold plate module 103 has a size of 200 mm × 150 mm × 15 mm, a coolant flow rate of 1 L / min-5 L / min, and a coolant temperature of 20°C-25°C at the inlet and 30°C-35°C at the outlet;

[0036] The phase change material of the phase change cooling module 104 is paraffin wax or a gallium-based alloy, with a phase change temperature of 30°C-40°C. The dimensions of the phase change cooling module 104 are 50mm×50mm×10mm. The paraffin wax uses an expanded graphite / carbon nanotube composite matrix (thermal conductivity ≥8W / (m·K)) and a phase change latent heat of 180-220kJ / kg. The gallium-based alloy is a Ga-In-Sn eutectic alloy (melting point 13°C) with a thermal conductivity ≥40W / (m·K).

[0037] The preset position of the phase change cooling module 104 matches the CPU or GPU of the server so that the phase change cooling module 104 can fit the CPU or GPU when installed;

[0038] The number of composite board assemblies 1 can be set to different numbers according to the number of components of the server. It is only necessary to connect the input ports 105 and the output ports 106 between multiple composite board assemblies 1 through connecting pipes;

[0039] A circulating pump 2 is provided with a first connecting pipe 5 between the circulating pump 2 and the output port 106 for circulating the coolant in the pipe;

[0040] The pump power of the circulation pump 2 is 10W-50W, and the circulating coolant is deionized water or fluorinated liquid;

[0041] The cold storage assembly 3 includes a liquid storage box 301, a cover plate 302, a heat dissipation fin 303, and a heat dissipation fan 306. The cover plate 302 is movably connected to the upper end surface of the liquid storage box 301. The heat dissipation fin 303 is fixedly engaged with the inside of the cover plate 302. The heat dissipation fan 306 is assembled and connected to the upper end surface of the heat dissipation fin 303 by bolts. A second connecting pipe 6 is installed between the liquid storage box 301 and the output end of the circulating pump 2.

[0042] The liquid reservoir 301 is used to store deionized water or fluorinated liquid as a coolant. When the coolant circulates through the liquid reservoir 301 in the system, the coolant can be cooled by the heat dissipation fins 303. At the same time, the cooling fan 306 provided on the upper end surface of the heat dissipation fins 303 can improve the heat dissipation effect of the heat dissipation fins 303 and ensure the heat exchange and cooling effect of the coolant.

[0043] The fin surface is micro-milled to form a V-shaped vortex generator (depth 0.3mm / included angle 60°). The guide hole 304 has a Venturi contraction structure (inlet Φ8mm / throat Φ5mm). At a flow rate of 2m / s, it can induce a Karman vortex street, making the convective heat transfer coefficient reach 3800W / (m²·K), which is 45% higher than that of flat fins.

[0044] Liquid delivery assembly 4, which includes a heat exchange plate 401, a storage bin 403, and a sealing plate 405. A guide groove 402 is provided in the inner cavity of the heat exchange plate 401. The storage bin 403 is fixedly mounted on the upper end surface of the heat exchange plate 401. A mounting groove 404 is provided on the upper end surface of the storage bin 403. The sealing plate 405 is respectively sleeved with mounting bolts 406. A third connecting pipe 7 is installed between one end of the guide groove 402 and the liquid storage box 301, and a fourth connecting pipe 8 is installed between the other end of the guide groove 402 and the input port 105.

[0045] The guide groove 402 is designed as a double-helix flow channel with a pitch of 12mm and a groove depth of 4mm. It forms a micro-gap of 3mm with the bottom plate of the storage bin 403. When the coolant flows through it, countercurrent heat exchange is generated. The advancement rate of the phase change material melting front reaches 0.8mm / s. At a flow rate of 5L / min, the coolant can be cooled by an additional 4-6°C after passing through this stage, and the system COP is improved by 22%.

[0046] The coolant after heat exchange and cooling can be cooled down for the second time through the guide groove 402 in the heat exchange plate 401 before entering the cold plate module 103. During long-term operation, the system can reduce the temperature of the coolant during circulation, and the storage bin 403 on the upper end surface of the heat exchange plate 401 is filled with phase change material to improve the heat exchange effect of the heat exchange plate 401, so that the temperature of the coolant before entering the composite plate assembly 1 is guaranteed to meet the heat exchange and cooling effect during long-term operation.

[0047] The diameters of the first connecting pipe 5, the second connecting pipe 6, the third connecting pipe 7 and the fourth connecting pipe 8 are 6mm-10mm. At the same time, the structure of the device for assembling the connecting pipes is a quick-release joint, which is suitable for pipes with a diameter of Φ6-10mm.

[0048] In this embodiment, the assembly mechanism includes a threaded barrel 107, an assembly bracket 108 and a mounting bolt 109. The threaded barrel 107 is fixedly mounted around the upper end surface of the cold plate seat 101. The assembly bracket 108 is provided above the cold plate seat 101 and is movably connected to the upper end surface of the cold plate module 103. The mounting bolt 109 passes through the assembly bracket 108 and is threadedly connected to the threaded barrel 107.

[0049] The cold plate base 101 and the cold plate module 103 can be conveniently assembled by installing bolts 109. A 0.1mm beryllium copper alloy spring (elastic modulus 128GPa) is installed between the assembly frame 108 and the cold plate module 103. When the cold plate expands by 0.15mm due to heat, the spring can provide an adaptive clamping force of 0.8-1.2kN, avoiding interface delamination caused by failure of the bolt preload. This design ensures that the contact thermal resistance fluctuation is less than 10% under thermal cycling conditions.

[0050] In this embodiment, the assembly frame 108 forms a fixable structure with the installation bolt 109 and the threaded barrel 107 , and is used to assemble and fix the cold plate module 103 in the cold plate seat 101 .

[0051] In this embodiment, a plurality of guide holes 304 are formed at the lower end of the heat dissipation fins 303 for circulating the coolant in the liquid reservoir box 301 so that the coolant can flow smoothly in the liquid reservoir box 301 .

[0052] In this embodiment, the cover plate 302 is respectively sleeved with mounting bolts 2 305, and the mounting bolts 2 305 are threadedly connected to the upper end surface of the liquid storage box 301. The cover plate 302 forms an assemblable structure with the liquid storage box 301 through the mounting bolts 2 305, so that the coolant in the liquid storage box 301 can be replaced later.

[0053] In this embodiment, the lower end of the heat dissipation fin 303 is arranged in the inner cavity of the liquid storage box 301, and the upper end of the heat dissipation fin 303 is arranged outside the liquid storage box 301, which is used to exchange heat and cool the coolant in the liquid storage box 301.

[0054] In this embodiment, the lower end of the inner cavity of the storage bin 403 is connected to the upper end surface of the heat exchange plate 401 , and the phase change material is stored in the storage bin 403 .

[0055] In this embodiment, the lower end surface of the sealing plate 405 is movably connected to the upper end surface of the installation groove 404, and the sealing plate 405 is sleeved with the inner cavity of the storage bin 403.

[0056] In this embodiment, the third mounting bolt 406 is threadedly connected to the upper end surface of the storage bin 403 , and the sealing plate 405 forms an assemblable structure with the storage bin 403 via the third mounting bolt 406 .

[0057] This device dynamically couples cold plate liquid cooling with phase change thermal storage to create a multi-level thermal buffering mechanism. The cold plate module 103 directly and efficiently absorbs the chip's base heat, while the embedded phase change material (PCM) actively melts and dissipates heat during transient power spikes (such as sudden CPU / GPU loads), significantly suppressing temperature fluctuations. When the external cooling system experiences a response delay or a short-term failure, the PCM's phase change latent heat acts as a "thermal inertia," providing a critical time window for system maintenance or backup power startup, preventing server downtime due to overheating. This active thermal buffering design fundamentally addresses the pain point of traditional liquid cooling systems' lack of adaptability to sudden thermal loads.

[0058] The phase change module's directional mounting design (precisely matching CPU / GPU hotspots) and multi-level hot backup architecture significantly enhance fault tolerance. The front-end PCM module mitigates chip-level thermal shock, while the back-end cold storage component 3 enhances heat exchange through phase change materials, creating a double insurance mechanism. Even if the circulation pump 2 or external heat sink fails, the PCM's continuous heat absorption maintains critical components within a safe temperature range. The adaptive clamping design of the cold plate assembly (such as beryllium copper alloy springs) compensates for thermal expansion deformation, ensuring interface contact stability during long-term operation and preventing sudden increases in thermal resistance due to mechanical loosening, thus ensuring continuous heat dissipation from a hardware perspective.

[0059] The system exploits energy-saving potential through intelligent scheduling of phase change latent heat and innovative flow channel design. The V-shaped vortex generator and Venturi orifice 304 in the cold storage component 3 combine to induce efficient turbulence and enhance heat transfer. The double-helix flow channel and micro-gap countercurrent heat exchange structure of the liquid delivery component 4 maximize the recovery of excess coolant. The PCM stores cold energy during low-load or low-temperature periods and releases it during high-load periods to reduce the burden of active cooling. This "dynamic cold storage and on-demand cold release" mechanism reduces reliance on external cooling systems and is particularly suitable for scenarios utilizing natural cooling sources or valley power storage, systematically reducing the data center's PUE (Power Usage Effectiveness).

[0060] The modular architecture (composite plate assembly + quick-release connectors) provides the system with flexible scalability. A single cold plate assembly can independently serve a specific chip, while multiple assemblies can flexibly accommodate server components of varying numbers and power levels through parallel piping. The compact phase change module (50mm x 50mm) fits precisely into the gaps between high-density electronic devices, eliminating the space encroachment challenge of traditional heat sinks. The quick-release connectors support rapid routing and maintenance of pipes with diameters of 6-10mm, significantly simplifying cluster deployment. This design provides a scalable cooling foundation for the future large-scale integration of ultra-high-power chips (such as AI accelerator cards).

[0061] The device innovatively constructs a four-level collaborative heat dissipation chain of "chip-cold plate-cold storage-heat exchange":

[0062] Primary cooling: Microchannel liquid cooling in the cold plate directly and efficiently removes heat from the chip;

[0063] Secondary buffer: PCM module melts and absorbs instantaneous thermal shock;

[0064] Three-stage recovery: The cold storage component achieves efficient waste heat discharge through vortex generators and forced air cooling;

[0065] Level 4 enhancement: The double helix flow channel of the liquid delivery component uses phase change materials to pre-cool the return coolant.

[0066] This hierarchical thermal management ensures that the coolant is always in the optimal temperature zone during circulation, avoiding the overall performance degradation caused by the single-point heat dissipation bottleneck of traditional liquid cooling. It is especially suitable for data that operates continuously 24 hours a day, 7 days a week.

[0067] In this embodiment, when in use, first, according to the number of components in the server, an equal number of cold plate seats 101 are installed. The cold plate seats 101 are assembled on the server component board by bolts. The cold plate module 103 is placed in the support groove 102. The assembly rack 108 is placed on the surface of the cold plate module 103. The assembly rack 108 is fastened by installing bolts 109, thereby installing the cold plate module 103 between the cold plate seat 101, and the phase change cooling module 104 embedded at the bottom end of the cold plate module 103 is in contact with the heat-generating CPU or GPU of the component board.

[0068] Put phase change material into the storage bin 403, and then install the sealing plate 405 on the upper end of the storage bin 403 using the mounting bolts 406;

[0069] The circulation pump 2 is started by the control device, so that the coolant is sent into the cold plate module 103 from the input port 105. The cold plate module 103 and the coolant absorb the heat of the server's heating components. The phase change cooling module 104 absorbs heat near the component with the largest heat generation. The temperature of the coolant increases after flowing through the composite plate assembly 1. It is sent into the liquid storage box 301 through the circulation pump 2. The coolant contacts the multiple heat dissipation fins 303 arranged in an array in the liquid storage box 301 for heat exchange and cooling. It is then sent into the heat exchange plate 401 through the third connecting pipe 7 and cooled for a second time through the guide groove 402 in the heat exchange plate 401. The storage bin 403 on the upper end surface of the heat exchange plate 401 is filled with phase change material to improve the heat exchange effect of the heat exchange plate 401. The cooled coolant is circulated again and sent into the composite plate assembly 1.

[0070] The above is a detailed introduction to the liquid-cooled server heat dissipation device coupled with a composite cold plate and phase change cold storage provided by the present invention. Specific embodiments are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A liquid cooling server heat dissipation device coupled with a composite cold plate and phase change cold storage, characterized in that: include: A composite plate assembly (1), the composite plate assembly (1) comprising a cold plate seat (101), a cold plate module (103), a phase change cooling module (104), an input port (105), an output port (106) and an assembly mechanism, the cold plate seat (101) is provided with a supporting groove (102) therein, the phase change cooling module (104) is mounted on the lower end of the cold plate module (103), the input port (105) and the output port (106) are respectively mounted on the upper end surface of the cold plate module (103), the lower end surface of the cold plate module (103) is movably connected to the upper end surface of the supporting groove (102), and the cold plate module (103) is sleeved with the inner cavity of the cold plate seat (101); A circulating pump (2), wherein a first connecting pipe (5) is installed between the circulating pump (2) and the output port (106) for circulating the coolant in the pipe; A cold storage component (3), the cold storage component (3) comprising a liquid storage box (301), a cover plate (302), heat dissipation fins (303) and a heat dissipation fan (306), the cover plate (302) being movably connected to the upper end surface of the liquid storage box (301), the heat dissipation fins (303) being embedded and fixed inside the cover plate (302), the heat dissipation fan (306) being assembled and connected to the upper end surface of the heat dissipation fins (303) by bolts, and a second connecting pipe (6) being installed between the liquid storage box (301) and the output end of the circulation pump (2); A liquid delivery component (4), the liquid delivery component (4) includes a heat exchange plate (401), a material storage bin (403) and a sealing plate (405), the inner cavity of the heat exchange plate (401) is provided with a guide groove (402), the material storage bin (403) is fixedly mounted on the upper end surface of the heat exchange plate (401), the upper end surface of the material storage bin (403) is provided with a mounting groove (404), the sealing plate (405) is respectively sleeved with three mounting bolts (406), a third connecting pipe (7) is installed between one end of the guide groove (402) and the liquid storage box (301), and a fourth connecting pipe (8) is installed between the other end of the guide groove (402) and the input port (105).

2. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The assembly mechanism includes a threaded barrel (107), an assembly frame (108) and a mounting bolt (109), wherein the threaded barrel (107) is fixedly mounted around the upper end surface of the cold plate seat (101), the assembly frame (108) is arranged above the cold plate seat (101), and the assembly frame (108) is movably connected to the upper end surface of the cold plate module (103), and the mounting bolt (109) passes through the assembly frame (108) and is threadedly connected to the threaded barrel (107).

3. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 2 is characterized in that: The assembly frame (108) forms a fixable structure between the mounting bolt 1 (109) and the threaded barrel (107), and is used for assembling and fixing the cold plate module (103) in the cold plate seat (101).

4. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: A plurality of guide holes (304) are provided at the lower end of the heat dissipation fin (303) for circulating the cooling liquid in the liquid storage box (301).

5. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The cover plate (302) is respectively sleeved with mounting bolts 2 (305) around its periphery, and the mounting bolts 2 (305) are threadedly connected to the upper end surface of the liquid storage box (301), and the cover plate (302) forms an assembleable structure with the liquid storage box (301) through the mounting bolts 2 (305).

6. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The lower end of the heat dissipation fin (303) is arranged in the inner cavity of the liquid storage box (301), and the upper end of the heat dissipation fin (303) is arranged at the outer end of the liquid storage box (301), and is used for heat exchange and cooling of the coolant in the liquid storage box (301).

7. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The lower end of the inner cavity of the storage bin (403) is connected to the upper end surface of the heat exchange plate (401), and phase change material is stored in the storage bin (403).

8. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The lower end surface of the sealing plate (405) is movably connected to the upper end surface of the mounting groove (404), and the sealing plate (405) is sleeved with the inner cavity of the storage bin (403).

9. The liquid cooling server heat dissipation device of the composite cold plate-phase change cold storage coupling according to claim 1 is characterized in that: The third mounting bolt (406) is threadedly connected to the upper end surface of the storage bin (403), and the sealing plate (405) forms an assembleable structure between the third mounting bolt (406) and the storage bin (403).

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