A heat dissipation device and method for a DC tank

Abstract

This invention belongs to the technical field of data center heat dissipation equipment, specifically relating to a heat dissipation device and method for a data center (DC) compartment. It includes a cylindrical chassis divided into three layers, each with an installation port. A sealing mechanism is fitted onto the outer side of the chassis, sealing the installation ports. A heat dissipation mechanism is rotatably mounted outside the sealing mechanism. Multiple electrically operated telescopic rods are symmetrically installed at the bottom of the sealing mechanism. This invention achieves sealed heat dissipation, isolating dust, while also enabling rapid installation, removal, and maintenance of data equipment. It avoids the problem of residual dust accumulation on data equipment caused by heat dissipation gases and significantly improves heat dissipation uniformity, achieving all-around heat dissipation. Furthermore, this invention provides sealed heat dissipation and rapid heat dissipation for specific spaces within the multi-layered compartment, requiring only a single air pump mechanism to meet all heat dissipation needs with excellent cooling performance.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of data center heat dissipation equipment, and particularly relates to a heat dissipation equipment and method for a DC cabin. BACKGROUND

[0002] A data center DC cabin is an integrated, prefabricated modular data center solution, usually composed of multiple standardized cabin bodies, containing servers, storage devices, network facilities, and power supply systems, etc. It has high scalability and flexibility, can be quickly deployed, and adapts to different scale computing requirements. The DC cabin needs to be cooled. In the data center, servers and other hardware devices generate a large amount of heat during operation. If this heat cannot be effectively dissipated and managed, the device temperature will be too high, which may cause performance degradation, hardware failure, or even system downtime.

[0003] A data center cabinet heat dissipation and dust removal system and control method are disclosed in Chinese Patent No. 202410593130.4, which includes a data center cabinet, a fan blade assembly installed inside the exhaust pipe, and a motor box fixed to the right end of the exhaust pipe. When the double-shaft motor starts, the two output shafts rotate simultaneously. The left output shaft drives the fan blades to rotate through the cooperation of bevel gears. At this time, the fan blades rotate to generate negative pressure, which expels the heat in the data center cabinet upward from the exhaust pipe. At the same time, external air enters the data center cabinet through the dust screen. The right output shaft drives the horizontal shaft to rotate through the cooperation of gears. The horizontal shaft drives the vertical shaft to rotate through the cooperation of bevel gears. The vertical shaft drives the reciprocating screw to rotate. The reciprocating screw cooperates with the guide block to make the guide block move up and down, thereby driving the brush plate to move up and down to clean the dust screen surface, thereby improving the practicability.

[0004] When the data center DC cabin is cooled, the heat dissipation is usually not uniform due to the large number of data devices in the case, the cooling effect is not good, and the external dust cannot be effectively isolated, which may cause subsequent equipment abnormalities. In addition, not all devices in the case need to be cooled quickly, so if the cooling is uniformly performed, the cooling needs of some devices may not be met, and frequent switching of cooling is complex and troublesome. SUMMARY

[0005] To address the shortcomings of existing technologies, this invention provides a heat dissipation device and method for a data center (DC) compartment. Through the cooperation of a chassis and a sealing mechanism, this invention achieves both sealed heat dissipation and dust isolation, while also enabling rapid loading, unloading, and maintenance of data equipment. This invention not only avoids the problem of residual dust accumulation on data equipment caused by heat dissipation gases but also significantly improves heat dissipation uniformity, achieving all-around heat dissipation. Through the cooperation of the heat dissipation mechanism, sealing mechanism, and chassis, this invention achieves both sealed heat dissipation and rapid heat dissipation during specific space switching across multiple layers. Only one air pump mechanism is needed to meet all heat dissipation requirements with excellent heat dissipation effect, requiring only rotation and no complex operation.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation device for a DC compartment includes a cylindrical chassis, which is divided into three layers, each with an installation port. A sealing mechanism is fitted on the outside of the chassis to close the installation port. A heat dissipation mechanism is rotatably mounted on the outside of the sealing mechanism. Multiple electrically operated telescopic rods are symmetrically mounted on the bottom of the sealing mechanism.

[0008] Furthermore, the chassis comprises, from top to bottom, a top block, an upper heat insulation block, a middle heat insulation block, and a lower heat insulation block; the top block and the upper heat insulation block are fixed together by an upper ring block to form an upper space; the middle heat insulation block and the lower heat insulation block are connected together by a middle ring block to form a middle space; the middle heat insulation block and the lower heat insulation block are connected together by a lower ring block to form a lower space; the upper ring block, the middle ring block, and the lower ring block are respectively provided with an upper connecting groove, a middle connecting groove, and a lower connecting groove.

[0009] Furthermore, the middle ring block and the lower ring block are located on the same side of the chassis, and the upper ring block is located on the opposite side of the middle ring block and the lower ring block.

[0010] Furthermore, the sealing mechanism includes an upper sealing ring, a middle sealing ring, and a lower sealing ring, with the three sealing rings sleeved above the corresponding heat insulation blocks; the heat dissipation mechanism includes a first C-shaped heat dissipation pipe and a second C-shaped heat dissipation pipe, the first C-shaped heat dissipation pipe connecting the side walls of the upper sealing ring and the middle sealing ring; the second C-shaped heat dissipation pipe connecting the side walls of the middle sealing ring and the lower sealing ring; an air pump mechanism is fixedly connected to the lower side of both the first C-shaped heat dissipation pipe and the second C-shaped heat dissipation pipe; a first air outlet pipe is fixedly connected to the sealing ring directly above the second C-shaped heat dissipation pipe, and a second air outlet pipe is fixedly connected to the lower sealing ring directly below the first C-shaped heat dissipation pipe.

[0011] Furthermore, the first C-shaped heat dissipation pipe and the second C-shaped heat dissipation pipe are located on the same side of the sealing mechanism, and the connection between the heat dissipation pipe and the sealing ring is close to the inner wall of the sealing ring on the same side.

[0012] Furthermore, the bottom of the lower sealing ring is provided with a rotating mechanism, which includes a limiting ring fixed to the periphery of the bottom of the lower sealing ring. The limiting ring is fitted with a limiting ring groove, which is fixedly connected to the lifting end of the electric telescopic rod.

[0013] Furthermore, the bottom side of the limiting ring groove is in close contact with the chassis, the top side width of the limiting ring groove is smaller than the bottom side width, and a toothed ring is fixedly provided on the top of the limiting ring. The toothed ring passes through the top side of the limiting ring groove and faces outward. Multiple drive motors are uniformly fixedly installed on the top side of the limiting ring groove, and the gears at the output end of the drive motors mesh with the toothed rings.

[0014] Furthermore, the air pump mechanism includes an air pump body, the air outlet of which is fixedly connected to a corresponding C-shaped heat dissipation pipe through a filter groove; a filter block is installed in the filter groove, and a cover plate is fixedly inserted into the top of the filter groove.

[0015] The first and second air outlets are respectively fixedly installed with a first filter head and a second filter head at their openings.

[0016] Furthermore, each of the upper, middle, and lower heat insulation blocks has a through-hole in its middle section, and an electrical conduit is fixedly installed in the through-hole. The side wall of the electrical conduit has an electrical hole. The top of the electrical conduit passes through the top block and faces outward. The bottom of the electrical conduit is fixedly connected to a base, and the electric telescopic rod is fixedly installed on the base.

[0017] A method for heat dissipation using the aforementioned heat dissipation device for a DC compartment includes the following steps:

[0018] S1. When only normal heat dissipation is required, the first C-type heat pipe, the second C-type heat pipe, the first exhaust pipe, and the second exhaust pipe are all connected to the corresponding space of the chassis. At this time, one of the air pump mechanisms is activated, and the gas drawn in will pass through all the spaces and be discharged from the exhaust pipe for heat dissipation.

[0019] S2. When the middle layer space needs to dissipate heat quickly, the upper ring block is closed by rotating the sealing mechanism, and the air pump mechanism on the first C-shaped heat dissipation pipe is started. The gas first passes through the middle layer space and then enters the lower layer space.

[0020] S3. When the upper space needs to dissipate heat quickly, the middle ring block is sealed by the rotating sealing mechanism. At this time, the middle space cannot vent air, and the gas enters the upper space first through the first C-shaped heat dissipation pipe.

[0021] S4. When the lower space needs to dissipate heat quickly, the upper ring block is closed by rotating the sealing mechanism, and only the air pump mechanism on the second C-shaped heat dissipation pipe is activated. At this time, the middle space cannot vent air, and the gas enters the lower space first through the second C-shaped heat dissipation pipe.

[0022] S5. When only two-layer space heat dissipation is required, the middle ring block can be closed by rotating the sealing mechanism, or the upper ring block can be closed by closing the first C-type heat dissipation pipe. At this time, the air pump mechanism on the first C-type heat dissipation pipe will be activated to achieve heat dissipation in two-layer space.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] (1) The present invention, through the cooperation of the chassis and the sealing mechanism, can not only achieve sealed heat dissipation and isolate dust, but also quickly carry out the loading, unloading and maintenance of data equipment. Specifically, when heat dissipation is required, the upper sealing ring, middle sealing ring and lower sealing ring are respectively fitted outside the corresponding three-layer space by the electric telescopic rod to achieve isolation from the outside. At the same time, the air pump mechanism is started to realize the internal circulation of gas for heat dissipation and effectively isolate dust. At the same time, when the data equipment needs to be loaded, unloaded and maintained, the sealing ring is misaligned with the corresponding space by starting the electric telescopic rod, thereby quickly opening the space and enabling the loading, unloading and maintenance of data equipment to be carried out quickly.

[0025] (2) The present invention can meet the heat dissipation requirements by cooperating with the heat dissipation mechanism and the chassis. Furthermore, by using the exhaust method of the first C-shaped heat dissipation pipe and the second C-shaped heat dissipation pipe, the heat dissipation gas does not directly act on the data devices of all layers. Instead, it is guided by the cylindrical chassis and indirectly dissipated in a circumferential manner through side airflow. This not only avoids the problem of residual dust accumulation on the data devices caused by the heat dissipation gas, but also greatly improves the heat dissipation uniformity and achieves all-round heat dissipation.

[0026] (3) This invention, through the cooperation of the heat dissipation mechanism, the sealing mechanism, and the chassis, can not only seal and dissipate heat, but also quickly dissipate heat when switching between specific spaces in multiple layers. Only one air pump mechanism is needed to meet all heat dissipation needs and the heat dissipation effect is good. No complicated operation is required, only rotation is needed. Specifically, when the data devices are all normal and only need regular heat dissipation, the first C-shaped heat dissipation pipe, the second C-shaped heat dissipation pipe, the first air outlet pipe, and the second air outlet pipe are all connected to the corresponding space of the chassis. At this time, one of the air pump mechanisms is started, and the gas drawn in will pass through all spaces and be discharged from the air outlet pipe for heat dissipation. At this time, the data devices in all layers can be dissipated, which is suitable for regular heat dissipation and helps to reduce heat dissipation energy consumption. When one layer is seriously overheating and needs to dissipate heat quickly, specifically, when the middle layer space needs to dissipate heat quickly, by rotating the sealing mechanism, the upper ring block is closed to the first air outlet pipe, and the air pump mechanism on the first C-shaped heat dissipation pipe is started. The gas first passes through the middle layer space and then enters the lower layer space. At this time, the heat dissipation gas is not too dispersed, thereby improving the heat dissipation effect. Thermal effect: When the upper space requires rapid heat dissipation, the rotating sealing mechanism seals the second C-shaped heat dissipation pipe with the middle ring block, preventing air from escaping from the middle space. Gas then enters the upper space primarily through the first C-shaped heat dissipation pipe, thus achieving rapid heat dissipation. When the lower space requires rapid heat dissipation, the rotating sealing mechanism seals the first C-shaped heat dissipation pipe with the upper ring block, and only the air pump mechanism on the second C-shaped heat dissipation pipe is activated. Again, the middle space cannot escape air, and gas enters the lower space primarily through the second C-shaped heat dissipation pipe, thus achieving rapid heat dissipation. When only heat dissipation is needed for both spaces, the rotating sealing mechanism seals either the second C-shaped heat dissipation pipe with the middle ring block or the first C-shaped heat dissipation pipe with the upper ring block, activating the air pump mechanism on the first C-shaped heat dissipation pipe in both cases, achieving heat dissipation for both spaces. This allows for rapid heat dissipation by switching between specific spaces within multiple layers. Only one air pump mechanism is needed to meet all heat dissipation requirements with excellent cooling performance, requiring only rotation and no complex operation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device for a DC compartment according to the present invention;

[0028] Figure 2 This is a schematic diagram of the distributed structure of a heat dissipation device for a DC compartment according to the present invention;

[0029] Figure 3 This is a schematic diagram of the chassis structure of a heat dissipation device for a DC compartment according to the present invention;

[0030] Figure 4 This is a partial structural diagram of a heat dissipation device for a DC compartment according to the present invention. Figure 1 ;

[0031] Figure 5 This is a partial structural diagram of a heat dissipation device for a DC compartment according to the present invention. Figure 2 ;

[0032] Figure 6 This is a schematic diagram of a partially dispersed structure of an air pump mechanism for a heat dissipation device for a DC compartment according to the present invention.

[0033] Figure 7 This is a schematic diagram of the airflow structure of a heat dissipation device for a DC compartment according to the present invention;

[0034] Figure 8 This is a schematic diagram of the heat dissipation state of a heat dissipation device for a DC compartment according to the present invention. Figure 1 ;

[0035] Figure 9 This is a schematic diagram of the heat dissipation state of a heat dissipation device for a DC compartment according to the present invention. Figure 2 .

[0036] The attached figures are labeled as follows:

[0037] 100 - Chassis; 110 - Upper heat insulation block; 120 - Middle heat insulation block; 130 - Lower heat insulation block; 140 - Top block; 150 - Upper ring block; 151 - Upper connecting groove; 160 - Middle ring block; 161 - Middle connecting groove; 170 - Lower ring block; 171 - Lower connecting groove; 180 - Mounting hole; 200 - Sealing mechanism; 210 - Upper sealing ring; 220 - Middle sealing ring; 230 - Lower sealing ring; 300 - Air pump mechanism; 310 - Air pump body; 320-Filter tank; 321-Cover plate; 330-Filter block; 410-First C-shaped heat dissipation pipe; 420-First air outlet pipe; 421-First filter head; 430-Second C-shaped heat dissipation pipe; 440-Second air outlet pipe; 441-Second filter head; 500-Electric conduit; 510-Base; 600-Electric telescopic rod; 700-Drive motor; 800-Rotating mechanism; 810-Limiting ring; 811-Gear ring; 820-Limiting ring groove. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. Of course, the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0039] Although the steps in this invention are arranged by reference numerals, this is not intended to limit the order of the steps. Unless the order of the steps is explicitly stated or the execution of a step requires other steps as a basis, the relative order of the steps can be adjusted. It is understood that the term "and / or" as used herein refers to and covers any and all possible combinations of one or more of the associated listed items.

[0040] Example

[0041] like Figures 1-9 As shown, a heat dissipation device for a DC compartment includes a cylindrical chassis 100, which is divided into three layers, each with an installation port. A sealing mechanism 200 is fitted on the outside of the chassis 100 to close the installation port. A heat dissipation mechanism is rotatably mounted on the outside of the sealing mechanism 200. Multiple electric telescopic rods 600 are symmetrically mounted on the bottom of the sealing mechanism 200.

[0042] This invention, through the cooperation of the chassis 100 and the sealing mechanism 200, can achieve both sealed heat dissipation and dust isolation, while also enabling rapid loading, unloading, and maintenance of data equipment; a detailed description will follow.

[0043] It is worth noting that the electric telescopic pole 600 and other electrical equipment of the present invention are all controlled by an external power source, and will not be described in detail here.

[0044] Furthermore, the chassis 100 includes, from top to bottom, a top block 140, an upper heat insulation block 110, a middle heat insulation block 120, and a lower heat insulation block 130; the top block 140 and the upper heat insulation block 110 are fixed together by an upper ring block 150 to form an upper space; the middle heat insulation block 120 and the lower heat insulation block 130 are connected together by a middle ring block 160 to form a middle space; the middle heat insulation block 120 and the lower heat insulation block 130 are connected together by a lower ring block 170 to form a lower space; the upper ring block 150, the middle ring block 160, and the lower ring block 170 are respectively provided with an upper connecting groove 151, a middle connecting groove 161, and a lower connecting groove 171.

[0045] When heat dissipation is required, the present invention uses an electric telescopic rod 600 to fit the upper sealing ring 210, middle sealing ring 220, and lower sealing ring 230 onto the corresponding three-layer space to isolate them from the outside. At the same time, the air pump mechanism 300 is activated, thereby realizing the internal circulation of gas for heat dissipation and effectively isolating dust. Meanwhile, when data equipment needs to be installed, removed, or repaired, the electric telescopic rod 600 is activated to misalign the sealing rings with the corresponding space, thereby quickly opening the space and enabling rapid installation, removal, and repair of data equipment.

[0046] It should be noted that the accompanying drawings in this specification are only schematic diagrams and do not further limit the specific structural dimensions. They can be conventionally adjusted according to the size of the data device and will not be described in detail here.

[0047] Furthermore, the middle ring block 160 and the lower ring block 170 are located on the same side of the chassis 100, and the upper ring block 150 is located on the opposite side of the middle ring block 160 and the lower ring block 170.

[0048] Furthermore, the sealing mechanism 200 includes an upper sealing ring 210, a middle sealing ring 220, and a lower sealing ring 230, with the three sealing rings sleeved above the corresponding heat insulation blocks; the heat dissipation mechanism includes a first C-shaped heat dissipation pipe 410 and a second C-shaped heat dissipation pipe 430, the first C-shaped heat dissipation pipe 410 connecting the side walls of the upper sealing ring 210 and the middle sealing ring 220; the second C-shaped heat dissipation pipe 430 connecting the side walls of the middle sealing ring 220 and the lower sealing ring 230; an air pump mechanism 300 is fixedly connected to the lower side of both the first C-shaped heat dissipation pipe 410 and the second C-shaped heat dissipation pipe 430; a first air outlet pipe 420 is fixedly connected to the sealing ring 210 located directly above the second C-shaped heat dissipation pipe 430, and a second air outlet pipe 440 is fixedly connected to the lower sealing ring 230 located directly below the first C-shaped heat dissipation pipe 410.

[0049] The invention, through the cooperation of the heat dissipation mechanism, the sealing mechanism 200, and the chassis 100, can achieve both sealed heat dissipation and rapid heat dissipation when switching between specific spaces in a multi-layered space. Only one air pump mechanism 300 is needed to meet all heat dissipation requirements with good cooling effect; no complex operation is required, only rotation is needed. Specifically, when the data equipment is functioning normally and only requires regular cooling, the first C-shaped heat pipe 410, the second C-shaped heat pipe 430, the first exhaust pipe 420, and the second exhaust pipe 440 are all connected to the corresponding spaces in the chassis 100. At this time, activating one of the air pump mechanisms 300... The drawn-in gas passes through all spaces and is discharged from the exhaust pipe for heat dissipation. At this time, data devices in all layers can be cooled, suitable for conventional heat dissipation, which helps reduce energy consumption. When one layer overheats and requires rapid heat dissipation, specifically, when the middle layer requires rapid heat dissipation, the rotating sealing mechanism 200 causes the upper ring block 150 to close the first exhaust pipe 420, activating the air pump mechanism 300 on the first C-shaped heat dissipation pipe 410. The gas first passes through the middle layer and then enters the lower layer. At this time, the heat dissipation gas is not excessively dispersed, thus improving the heat dissipation effect. When the upper layer… When rapid heat dissipation is needed in the middle layer, the rotating sealing mechanism 200 causes the middle ring block 160 to seal the second C-shaped heat dissipation pipe 430. At this time, air cannot escape from the middle layer space, and the gas first enters the upper layer space through the first C-shaped heat dissipation pipe 410, thus achieving rapid heat dissipation. When rapid heat dissipation is needed in the lower layer space, the rotating sealing mechanism 200 causes the upper ring block 150 to seal the first C-shaped heat dissipation pipe 410, and only the air pump mechanism 300 on the second C-shaped heat dissipation pipe 430 is activated. At this time, air cannot escape from the middle layer space, and the gas first enters the upper layer space through the second C-shaped heat dissipation pipe 430. When the gas enters the lower space, it mainly enters the lower space for rapid heat dissipation. When only two spaces need heat dissipation, the middle ring block 160 closes the second C-shaped heat dissipation pipe 430, or the upper ring block 150 closes the first C-shaped heat dissipation pipe 410, by rotating the sealing mechanism 200. In both cases, the air pump mechanism 300 on the first C-shaped heat dissipation pipe 410 is activated to achieve heat dissipation in both spaces. This enables rapid heat dissipation by switching between specific spaces in multiple layers. The operation of only one air pump mechanism 300 can meet all heat dissipation needs and has a good heat dissipation effect. No complicated operation is required; only rotation is needed.

[0050] Furthermore, the first C-shaped heat dissipation pipe 410 and the second C-shaped heat dissipation pipe 430 are located on the same side of the sealing mechanism 200, and the connection between the heat dissipation pipe and the sealing ring is close to the inner wall of the sealing ring on the same side.

[0051] This invention, through the cooperation of the heat dissipation mechanism and the chassis 100, can not only meet the heat dissipation requirements, but also, through the air outlet of the first C-shaped heat pipe 410 and the second C-shaped heat pipe 430, prevent the heat dissipation gas from directly acting on the data devices on all layers. Instead, it is guided by the cylindrical chassis 100 and indirectly dissipated in a circumferential manner through side airflow. This not only avoids the problem of residual dust accumulation on the data devices caused by the heat dissipation gas, but also greatly improves the uniformity of heat dissipation and achieves all-round heat dissipation.

[0052] Furthermore, the bottom of the lower sealing ring 230 is provided with a rotating mechanism 800. The rotating mechanism 800 includes a limiting ring 810 fixed to the periphery of the bottom of the lower sealing ring 230. A limiting ring groove 820 is sleeved on the limiting ring 810. The limiting ring groove 820 is fixedly connected to the lifting end of the electric telescopic rod 600.

[0053] The present invention achieves the lifting and lowering of the sealing mechanism 200 without affecting the rotation of the sealing mechanism 200 through the structural design of the rotating mechanism 800, and at the same time improves the stability during rotation.

[0054] Furthermore, the bottom side of the limiting ring groove 820 is in close contact with the housing 100, the top width of the limiting ring groove 820 is smaller than the bottom width, and a toothed ring 811 is fixedly provided on the top of the limiting ring 810, with the toothed ring 811 passing through the top side of the limiting ring groove 820 and facing outward; multiple drive motors 700 are evenly fixedly installed on the top side of the limiting ring groove 820, and the gears at the output ends of the drive motors 700 mesh with the toothed ring 811. The limiting ring 810 is driven to rotate by the drive motors 700, thereby realizing the rotation of the sealing mechanism 200.

[0055] It is worth noting that the drive motor 700 of this invention can be a stepper motor, which can rotate at a fixed angle. This is existing technology and will not be described in detail here.

[0056] Furthermore, the air pump mechanism 300 includes an air pump body 310, the air outlet of the air pump body 310 being fixedly connected to a corresponding C-shaped heat dissipation pipe through a filter groove 320; a filter block 330 is installed in the filter groove 320, and a cover plate 321 is fixedly inserted into the top of the filter groove 320; the filter block 330 can filter dust and impurities.

[0057] The first air outlet pipe 420 and the second air outlet pipe 440 are respectively fixedly installed with a first filter head 421 and a second filter head 441. Through the structural design of the first filter head 421, the second filter head 441 and the filter tank 320, the multi-layer space of the chassis 100 is isolated from the outside, further preventing dust from affecting the internal equipment.

[0058] It is worth noting that the air pump body 310 of the present invention is in a closed state when not in operation, which is a conventional technology and will not be described in detail here.

[0059] Furthermore, each of the upper heat insulation block 110, the middle heat insulation block 120, and the lower heat insulation block 130 has a through-hole 180, on which an electrical conduit 500 is fixedly installed. The side wall of the electrical conduit 500 has an electrical wire hole. The top end of the electrical conduit 500 passes through the top block 140 and faces outward. The bottom end of the electrical conduit 500 is fixedly connected to a base 510, and the electric telescopic rod 600 is fixedly installed on the base 510.

[0060] The wiring of the equipment is installed through conduit 500, and sealant can be used for sealing if necessary; at the same time, heat insulation block 110, middle heat insulation block 120 and lower heat insulation block 130 help to further improve the heat insulation performance and prevent the adjacent data equipment from being affected.

[0061] A method for heat dissipation using the aforementioned heat dissipation device for a DC compartment includes the following steps:

[0062] S1. When only normal heat dissipation is required, the first C-type heat pipe 410, the second C-type heat pipe 430, the first exhaust pipe 420 and the second exhaust pipe 440 are all connected to the corresponding space of the chassis 100. At this time, one of the air pump mechanisms 300 is activated, and the gas drawn in will pass through all the spaces and be discharged from the exhaust pipe for heat dissipation.

[0063] S2. When the middle space needs to dissipate heat quickly, the upper ring block 150 closes the first air outlet pipe 420 by rotating the sealing mechanism 200, and the air pump mechanism 300 on the first C-shaped heat dissipation pipe 410 is started. The gas first passes through the middle space and then enters the lower space.

[0064] S3. When the upper space needs to dissipate heat quickly, the middle ring block 160 seals the second C-shaped heat pipe 430 by rotating the sealing mechanism 200. At this time, the middle space cannot vent air, and the gas enters the upper space first through the first C-shaped heat pipe 410.

[0065] S4. When the lower space needs to dissipate heat quickly, the upper ring block 150 closes the first C-shaped heat pipe 410 by rotating the sealing mechanism 200, and only the air pump mechanism 300 on the second C-shaped heat pipe 430 is activated. At this time, the middle space cannot vent air, and the gas enters the lower space first through the second C-shaped heat pipe 430.

[0066] S5. When only two-layer space heat dissipation is required, the middle ring block 160 closes the second C-shaped heat dissipation pipe 430 by rotating the sealing mechanism 200, or the upper ring block 150 closes the first C-shaped heat dissipation pipe 410. At this time, the air pump mechanism 300 on the first C-shaped heat dissipation pipe 410 is activated to achieve heat dissipation in two-layer space.

[0067] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A heat dissipating device for a DC compartment, characterized in that, The application relates to a cylindrical case (100) which is divided into three layers of space, each layer being provided with an installation opening; a sealing mechanism (200) is arranged on the outer side of the case (100) and seals the installation opening; a heat dissipation mechanism is arranged on the outer side of the sealing mechanism (200); a plurality of electric telescopic rods (600) are symmetrically arranged on the bottom of the sealing mechanism (200). The case (100) comprises a top block (140), an upper heat insulation block (110), a middle heat insulation block (120) and a lower heat insulation block (130) from top to bottom; the top block (140) and the upper heat insulation block (110) are fixed by an upper ring block (150) to form an upper layer of space; the middle heat insulation block (120) and the lower heat insulation block (130) are fixed by a middle ring block (160) to form a middle layer of space; the middle heat insulation block (120) and the lower heat insulation block (130) are fixed by a lower ring block (170) to form a lower layer of space; an upper communication groove (151), a middle communication groove (161) and a lower communication groove (171) are formed in the upper ring block (150), the middle ring block (160) and the lower ring block (170) respectively. The middle ring block (160) and the lower ring block (170) are located on the same side of the case (100), and the upper ring block (150) is located on the opposite side of the middle ring block (160) and the lower ring block (170). The sealing mechanism (200) comprises an upper sealing ring (210), a middle sealing ring (220) and a lower sealing ring (230), and the three sealing rings are arranged above the corresponding heat insulation blocks; the heat dissipation mechanism comprises a first C-shaped heat dissipation pipe (410) and a second C-shaped heat dissipation pipe (430); the first C-shaped heat dissipation pipe (410) connects the side walls of the upper sealing ring (210) and the middle sealing ring (220); the second C-shaped heat dissipation pipe (430) connects the side walls of the middle sealing ring (220) and the lower sealing ring (230); the lower sides of the first C-shaped heat dissipation pipe (410) and the second C-shaped heat dissipation pipe (430) are fixedly connected with a gas pump mechanism (300); a first gas outlet pipe (420) is fixedly connected with the upper sealing ring (210) above the second C-shaped heat dissipation pipe (430); and a second gas outlet pipe (440) is fixedly connected with the lower sealing ring (230) below the first C-shaped heat dissipation pipe (410).

2. The heat dissipating device for a DC compartment according to claim 1, wherein The first C-shaped heat dissipation pipe (410) and the second C-shaped heat dissipation pipe (430) are located on the same side of the sealing mechanism (200), and the connecting positions of the heat dissipation pipes and the sealing rings are close to the inner side walls of the sealing rings on the same side.

3. The heat dissipating device for a DC compartment according to claim 1, wherein A rotating mechanism (800) is arranged on the bottom of the lower sealing ring (230), and the rotating mechanism (800) comprises a limiting ring (810) fixed on the outer periphery of the bottom of the lower sealing ring (230); a limiting ring groove (820) is arranged on the limiting ring (810); and the limiting ring groove (820) is fixedly connected with the lifting end of the electric telescopic rod (600).

4. The heat dissipating device for a DC compartment according to claim 3, wherein The bottom side of the limiting ring groove (820) is close to the case (100), the top side of the limiting ring groove (820) is smaller than the bottom side in width, and the top of the limiting ring (810) is fixedly provided with a tooth ring (811) which is outwardly arranged through one side of the top side of the limiting ring groove (820); a plurality of driving motors (700) are uniformly and fixedly installed on the top side of the limiting ring groove (820), and the gear on the output end of the driving motor (700) is engaged with the tooth ring (811).

5. The heat dissipating device for a DC compartment according to claim 3, wherein The air pump mechanism (300) comprises an air pump body (310), and the air outlet end of the air pump body (310) is fixedly communicated with the corresponding C-shaped heat dissipation pipe through a filter groove (320); a filter block (330) is installed in the filter groove (320), and a cover plate (321) is fixedly inserted into the top of the filter groove (320); The pipe orifice of the first air outlet pipe (420) and the second air outlet pipe (440) is fixedly installed with a first filter head (421) and a second filter head (441) respectively.

6. The heat dissipating apparatus for a DC compartment according to claim 1, wherein The middle part of the upper heat insulation block (110), the middle heat insulation block (120) and the lower heat insulation block (130) is provided with an installation hole (180), and the electric wire pipe (500) is fixedly installed on the installation hole (180), and the sidewall of the electric wire pipe (500) is provided with an electric wire hole; the top end of the electric wire pipe (500) is outwardly arranged through the top block (140); the bottom end of the electric wire pipe (500) is fixedly connected with the base (510), and the electric telescopic rod (600) is fixedly installed on the base (510).

7. A method for dissipating heat using the heat dissipating device for a DC tank according to any one of claims 1 to 6, characterized by, The method comprises the following steps: S1, when only conventional heat dissipation is required, the first C-shaped heat dissipation pipe (410), the second C-shaped heat dissipation pipe (430), the first air outlet pipe (420) and the second air outlet pipe (440) are communicated with the corresponding space of the case (100), at this time, one of the air pump mechanisms (300) is started, the air drawn in will pass through all the spaces and be discharged from the air outlet pipe for heat dissipation; S2, when the middle layer space needs to be quickly cooled, the upper ring block (150) is closed by rotating the sealing mechanism (200), the air pump mechanism (300) on the first C-shaped heat dissipation pipe (410) is started, and the gas first passes through the middle layer space and then enters the lower layer space; S3, when the upper layer space needs to be quickly cooled, the middle ring block (160) is closed by rotating the sealing mechanism (200), at this time, the middle layer space cannot exhaust, and the gas first enters the upper layer space through the first C-shaped heat dissipation pipe (410); S4, when the lower layer space needs to be quickly cooled, the first C-shaped heat dissipation pipe (410) is closed by rotating the sealing mechanism (200), and only the air pump mechanism (300) on the second C-shaped heat dissipation pipe (430) is started, at this time, the middle layer space cannot exhaust, and the gas first enters the lower layer space through the second C-shaped heat dissipation pipe (430); S5, when only two layers of space heat dissipation is needed, by rotating the sealing mechanism (200), the middle ring block (160) will be closed to the second C-type heat pipe (430), or the upper ring block (150) will be closed to the first C-type heat pipe (410), at this time, the air pump mechanism (300) on the first C-type heat pipe (410) is started, and two layers of space heat dissipation is realized.

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