Heat dissipation structure of electronic equipment and electronic equipment

Abstract

The invention relates to the technical field of thermal management of electronic equipment, in particular to a heat dissipation structure of electronic equipment and the electronic equipment. The piezoelectric fan is provided with a piezoelectric actuator, an outer frame and a diaphragm, one end of the outer frame is connected with the piezoelectric actuator, the other end of the outer frame is connected with the diaphragm, a cavity is formed among the piezoelectric actuator, the outer frame and the diaphragm, and an air outlet communicated with the cavity is formed in the diaphragm. The piezoelectric fan is arranged on the side wall, protruding out of the surface of the shell of the electronic equipment, of the functional module, the air outlet of the piezoelectric fan faces the side deviating from the side wall of the functional module, so that air flow generated by the piezoelectric fan can sweep over, the piezoelectric fan is arranged on the side wall, protruding out of the surface of the shell of the electronic equipment, of the functional module, and the air flow generated by the micro piezoelectric fan directly sweep over the surface of the shell without hindrance to take away heat; heat transferred to the surface of the shell can be efficiently and timely blown away to the environment, heat conduction between electronic components in the electronic equipment and the shell can be promoted, and then the purpose of efficient heat dissipation is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management of electronic devices, and particularly to a heat dissipation structure for an electronic device and an electronic device. Background Art

[0002] The heat dissipation problem has always been a key issue that terminal manufacturers of electronic devices pay attention to. Domestically, terminal manufacturers such as Huawei, OPPO, and Xiaomi have never stopped exploring efficient heat dissipation concepts and technologies. It is not difficult to understand that the realization of efficient heat dissipation of electronic devices can further promote the intelligence level of products and lead the iteration and upgrade of products.

[0003] The gradual increase in the miniaturization level of heat dissipation devices themselves, combined with high heat gains, has created conditions for those skilled in the art to break through the mental barriers and conceive new efficient heat dissipation concepts and technologies.

[0004] Electronic devices are constantly moving towards being thinner, lighter, and more intelligent, and the number and power consumption of electronic components are increasing continuously, resulting in an increasingly prominent heat generation problem in a narrow space. The heat generated by electronic components inside the electronic device needs to be conducted to the outer surface of the housing before effective heat dissipation can be achieved through the heat convection formed between the outer surface of the housing and the surrounding air. In order to accelerate the speed of heat conduction to the outer surface of the housing, heat-conducting components with high thermal conductivity characteristics, such as common heat pipes and graphene heat-conducting sheets, are also arranged between the heat-generating components and the housing. However, no matter how high the heat conduction efficiency of the heat-conducting component is, if the heat that has been transferred to the outer surface of the housing cannot be dissipated in time, the heat accumulated on the outer surface of the housing will cause the temperature of the housing to continue to rise, which will inversely inhibit the heat conduction process, that is, the heat conduction efficiency and the heat dissipation efficiency do not match, and the purpose of efficient heat dissipation cannot be achieved. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, there is provided a heat dissipation structure for an electronic device, and an electronic device including the heat dissipation structure of the above-mentioned electronic device.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a heat dissipation structure for an electronic device, the electronic device having a housing and a functional module protruding from the outer surface of the housing, including at least one piezoelectric fan;

[0007] The piezoelectric fan has a piezoelectric actuator, an outer frame, and a diaphragm. One end of the outer frame is joined to the piezoelectric actuator, and the other end is joined to the diaphragm. A chamber is formed between the piezoelectric actuator, the outer frame, and the diaphragm, and an air outlet communicating with the chamber is provided on the diaphragm;

[0008] The piezoelectric fan is fixedly installed on the side wall of the functional module through an adapter;

[0009] The adapter is connected to the area on the diaphragm that is opposite to the outer frame, the piezoelectric actuator or the outer frame elastic support; or, the adapter is fixedly connected to the node position of the vibration of the piezoelectric actuator;

[0010] The air outlet of the piezoelectric fan faces the side away from the side wall of the functional module, so that the airflow generated by the piezoelectric fan can pass through.

[0011] Furthermore, a recessed portion is formed in an area adjacent to the functional module on the outer surface of the housing, and the piezoelectric fan is mounted on a side wall of the functional module and has a portion accommodated in the recessed portion.

[0012] Furthermore, at least one first magnetic contact point is provided on the side wall of the functional module;

[0013] The adapter is provided with a second magnetic contact, and the first magnetic contact and the second magnetic contact are magnetically attracted to each other so that the piezoelectric fan is installed on the side wall of the functional module.

[0014] Furthermore, it also includes a mounting holder, and the adapter is fixedly connected to the mounting holder;

[0015] At least one first magnetic contact is provided on the side wall of the functional module;

[0016] The mounting retainer is provided with a third magnetic contact, and the first magnetic contact is attracted to the third magnetic contact so that the piezoelectric fan is mounted on the side wall of the functional module.

[0017] Furthermore, the functional module is a camera module.

[0018] The first solution of the adapter: the adapter includes a frame portion fixedly connected to the side wall of the functional module:

[0019] The frame portion is provided with a plurality of elastic arms, and one end of the elastic arm away from the frame portion is fixedly connected to the area on the diaphragm opposite to the outer frame, the piezoelectric actuator or the outer frame;

[0020] A central opening portion passes through the middle position of the frame; the piezoelectric actuator is at least partially located in the central opening portion, one end of the elastic arm is connected to the inner peripheral wall of the central opening portion, and the other end is fixedly connected to the outer peripheral wall of the piezoelectric actuator or the outer peripheral wall of the outer frame; or, a central opening portion passes through the middle position of the frame portion, and all air outlets are arranged opposite to the central opening portion; the piezoelectric actuator is located above the central opening portion, one end of the elastic arm is fixedly connected to the frame portion, and the other end is connected to an end of the piezoelectric actuator close to the frame portion.

[0021] The second solution for the adapter: The adapter includes a holding part fixedly connected to the side wall of the functional module. The holding part is engaged at the nodal position where the piezoelectric actuator vibrates, and the holding part is engaged on the side of the piezoelectric actuator facing away from the diaphragm.

[0022] Or the adapter includes a diaphragm extension part. The diaphragm extension part includes a fixing part and an elastic suspension part. The fixing part is fixedly connected to the side wall of the functional module, and the fixing part surrounds the outer periphery of the diaphragm. One end of the suspension part is connected to the inner peripheral wall of the fixing part, and the other end is connected to the outer peripheral wall of the diaphragm, so that the diaphragm is elastically supported on the fixing part along a plane through the cantilever part.

[0023] The third solution for the adapter: The adapter includes a diaphragm support part. The diaphragm support part is arranged on the side of the diaphragm facing away from the piezoelectric actuator. The diaphragm support part includes a fixed support part and a plurality of spaced cantilever parts. The fixed support part is fixedly connected to the side wall of the functional module and is located outside the outer peripheral wall of the outer frame. One end of the cantilever part is connected to the fixed support part, and the other end is connected to the area of the diaphragm facing away from the piezoelectric actuator and opposite to the outer frame, so that the diaphragm is elastically supported on the fixed part along a plane through the cantilever part.

[0024] The present invention also provides an electronic device, including the heat dissipation structure of the above-mentioned electronic device.

[0025] Further, the electronic device is a smart phone, a tablet computer, a smart screen, a smart display or a driving recorder.

[0026] The beneficial effects of the present invention are as follows: The heat dissipation structure of the electronic device of the present invention arranges the piezoelectric fan on the side wall of the functional module protruding from the surface of the electronic device housing. The airflow generated by the micro piezoelectric fan directly and unobstructedly passes over the housing surface to take away the heat, which can not only efficiently and timely blow the heat transferred to the housing surface into the environment, but also promote the heat conduction between the electronic components inside the electronic device and the housing, thereby achieving the purpose of efficient heat dissipation.

[0027] Through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings, other features and advantages of the present application will become clear. Description of the Drawings

[0028] The present invention will be further described below in conjunction with the drawings and embodiments.

[0029] Figure 1 is a three-dimensional schematic diagram of the electronic device;

[0030] Figure 2 is a side view schematic diagram of the electronic device;

[0031] Figure 3It is a three-dimensional schematic diagram of the heat dissipation structure of the electronic device of the present invention;

[0032] Figure 4 It is a physical diagram of the piezoelectric fan of the present invention;

[0033] Figure 5 It is an exploded three-dimensional schematic diagram of the functional module, the first magnetic contact, the second magnetic contact and the piezoelectric fan in the present invention;

[0034] Figure 6 It is an exploded three-dimensional schematic diagram of the functional module, the first magnetic contact, the third magnetic contact and the piezoelectric fan in the present invention;

[0035] Figure 7 It is a structural schematic diagram of a piezoelectric fan with a planar support method having a frame portion;

[0036] Figure 8 It is a structural schematic diagram of a piezoelectric fan with a vertical support method having a frame portion;

[0037] Figure 9 It is a structural schematic diagram of a piezoelectric fan having a holding portion;

[0038] Figure 10 It is a structural schematic diagram of a piezoelectric fan having a diaphragm extension portion;

[0039] Figure 11 It is a structural schematic diagram in which a plurality of openings are formed at intervals in the circumferential direction of the diaphragm in the suspension portion;

[0040] Figure 12 It is a structural schematic diagram of a piezoelectric fan having a diaphragm support portion;

[0041] Figure 13 It is a structural schematic diagram of the diaphragm support portion;

[0042] Figure 14 It is a schematic diagram when the piezoelectric fan is embedded in the recessed portion.

[0043] In the figure: 1. Housing, 11. Functional module, 11a. First mounting hole, 111. First magnetic contact, 1-1. Recessed portion;

[0044] 2. Piezoelectric fan, 21. Second magnetic contact, 2-1. Mounting holder, 2-11. Third magnetic contact;

[0045] 3. Piezoelectric actuator;

[0046] 4. Outer frame;

[0047] 5. Diaphragm, 51. Air outlet;

[0048] 6. Frame portion, 61. Elastic arm, 62. Central opening;

[0049] 7. Holding part;

[0050] 8. Diaphragm extension part, 81. Fixing part, 82. Suspension part, 83. Opening part;

[0051] 9. Diaphragm support part, 91. Fixed support part, 92. Cantilever part;

[0052] 10. Chamber. Detailed implementation mode

[0053] Now, the present invention will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner. Therefore, they only show the components related to the present invention. Directions and references (such as up, down, left, right, etc.) can only be used to assist in the description of the features in the drawings. Therefore, the following detailed implementation mode is not adopted in a restrictive sense, and the scope of the claimed subject matter is only defined by the appended claims and their equivalent forms.

[0054] Embodiment 1

[0055] As Figures 1 - 6 shown, a heat dissipation structure of an electronic device provides a new concept for the thermal management of intelligent terminal products. The electronic device has a housing 1 and also has a functional module 11 that penetrates the housing 1 and protrudes from the outer surface of the housing 1. As Figures 1 - 2 shown, the electronic device can be, for example, a smart phone, a tablet computer, a smart screen, a smart display, a dash cam, or others, which is not limited herein.

[0056] The heat dissipation structure includes at least one piezoelectric fan 2. The piezoelectric fan 2 has a piezoelectric actuator 3, an outer frame 4, and a diaphragm 5. One end of the outer frame 4 is joined to the piezoelectric actuator 3, and the other end is joined to the diaphragm 5. A chamber 10 is formed between the piezoelectric actuator 3, the outer frame 4, and the diaphragm 5. An air outlet 51 communicating with the chamber 10 is provided on the diaphragm 5;

[0057] The piezoelectric fan 2 is fixedly installed on the side wall of the functional module 11 through an adapter;

[0058] The adapter is elastically supported and connected to the area of the diaphragm 5 opposite to the outer frame 4, the piezoelectric actuator 3, or the outer frame 4; or the adapter is fixedly connected to the nodal position of the vibration of the piezoelectric actuator 3;

[0059] The air outlet 51 of the piezoelectric fan 2 faces away from the side wall of the functional module 11, so that the airflow generated by the piezoelectric fan 2 can pass over, as Figure 3 shown.

[0060] The heat generated by the electronic components housed inside the electronic device is transferred to the surface of the housing 1, and the airflow generated by the piezoelectric fan 2 sweeps over the outer surface of the housing 1 to take away the heat, forming efficient heat dissipation.

[0061] The piezoelectric fan 2 in this embodiment can be, but is not limited to, the fluid generating device disclosed in the Chinese patent with the publication number CN119084287A. In this patent, the actuator corresponds to the piezoelectric actuator 3 in this embodiment, the spacer corresponds to the outer frame 4 in this embodiment, the diaphragm corresponds to the diaphragm 5 in this embodiment, and the hole portion corresponds to the air outlet 51 in this embodiment; the piezoelectric fan 2 in this embodiment can also adopt the fluid generating device with high-order resonance disclosed in the Chinese patent with the publication number CN118979867A. In this patent, the actuator 3 corresponds to the piezoelectric actuator 3 in this embodiment, the spacer corresponds to the outer frame 4 in this embodiment, the diaphragm corresponds to the diaphragm 5 in this embodiment, and the hole portion corresponds to the air outlet 51 in this embodiment. The fluid generating device or / and the fluid generating device with high-order resonance in the above prior art adopt an actuator composed of a piezoelectric ceramic sheet and an elastic plate as the actuating unit for exciting the fluid. At the same time, the overall structure is a stacked structure, which provides great convenience for the miniaturization of the piezoelectric fan 2 itself and creates the possibility of installing it on the side wall of the above functional module 11. And it can maintain a high flow output in a very small size, as Figure 4 shown.

[0062] Preferably, at one end of the functional module 11 protruding from the outer surface of the housing 1, the piezoelectric fan 2 is installed on the side wall of the functional module 11 and has an air outlet 51 facing away from the functional module 11 and towards the other end of the outer surface of the housing 1, so that the airflow generated by the piezoelectric fan 2 can sweep over the outer surface of the housing 1, as Figure 3 shown.

[0063] The piezoelectric fan 2 can be installed on the side wall of the functional module 11 in the following several ways, but not limited to this:

[0064] First, at least one first magnetic attraction contact 111 is provided on the side wall of the functional module 11. A first installation hole 11a can be opened on the side wall of the functional module 11, and the first magnetic attraction contact 111 can be embedded into the first installation hole 11a. The first magnetic attraction contact 111 can protrude or not protrude from the first installation hole 11a. Relatively, a second magnetic attraction contact 21 with a polarity opposite to that of the first magnetic attraction contact 111 is provided on the adapter. A second installation hole can be opened on the side wall of the adapter, and the second magnetic attraction contact 21 can be embedded into the second installation hole. The second magnetic attraction contact 21 can protrude or not protrude from the second installation hole. The first magnetic attraction contact 111 and the second magnetic attraction contact 21 are attracted to each other so that the piezoelectric fan 2 is installed on the side wall of the functional module 11, as Figure 5As shown; the first magnetic contact 111 and the second magnetic contact 21 can be, but are not limited to, cylindrical, rectangular or prismatic in shape.

[0065] Secondly, it also includes a mounting bracket 2-1, the adapter and the mounting bracket 2-1 are fixedly connected, the piezoelectric fan 2 is fixedly connected to the side wall of the functional module 11 through the mounting bracket 2-1, and the piezoelectric fan 2 can be fixed to the mounting bracket 2-1, and at least one first magnetic contact 111 is provided on the side wall of the functional module 11, and correspondingly, the mounting bracket 2-1 is provided with a third magnetic contact 2-11 with a polarity opposite to the first magnetic contact 111, and a third mounting hole can be opened on the side wall of the mounting bracket 2-1, and the third magnetic contact 2-11 can be embedded in the third mounting hole, and the third magnetic contact 2-11 can protrude from the third mounting hole or not, and the first magnetic contact 111 and the third magnetic contact 2-11 are attracted to each other so that the piezoelectric fan 2 is installed on the side wall of the functional module 11, such as Figure 6 As shown; the first magnetic contact 111 and the second magnetic contact 21 can be, but are not limited to, cylindrical, rectangular or prismatic in shape.

[0066] The above installation method provides great convenience for the installation, disassembly, maintenance or disassembly and replacement of the piezoelectric fan 2.

[0067] The piezoelectric fan 2 is fixedly mounted on the side wall of the functional module 11 through an adapter, which may be, but is not limited to, the following solutions:

[0068] Solution 1: Figure 7 and 8 As shown, the adapter is connected to the area on the diaphragm 5 opposite to the outer frame 4, the piezoelectric actuator 3 or the outer frame 4 or elastically;

[0069] The adapter includes a frame portion 6 fixedly connected to the functional module 11: when the second magnetic contact 21 is provided on the adapter, the second magnetic contact 21 is fixed on the frame portion 6;

[0070] The frame portion 6 is provided with a plurality of elastic arms 61, and one end of the elastic arm 61 facing away from the frame portion 6 is fixedly connected to the piezoelectric actuator 3, the outer frame 4 or the area on the diaphragm 5 relative to the outer frame 4; thereby, the functional components consisting of the piezoelectric actuator 3, the outer frame 4 and the diaphragm 5 are elastically supported on the frame portion 6 in a substantially unconstrained manner, and the elastic support does not hinder the vibration of the various components constituting the functional components.

[0071] like Figure 7As shown, the piezoelectric actuator 3 can be supported on the frame portion 6 in a planar support manner. A central opening 62 penetrates through the middle position of the frame portion 6. At least a part of the piezoelectric actuator 3 is located in the central opening 62, which can reduce the overall thickness. One end of the elastic arm 61 is connected to the inner peripheral wall of the central opening 62, and the other end is fixedly connected to the outer peripheral wall of the piezoelectric actuator 3, or the outer peripheral wall of the outer frame 4, or the outer peripheral wall of the diaphragm 5.

[0072] As Figure 8 shown, the piezoelectric actuator 3 can also be supported on the frame portion 6 in a vertical support manner. A central opening 62 penetrates through the middle position of the frame portion 6. At least the air outlet 51 of the diaphragm 5 is exposed at the central opening 62, and the central opening 62 is arranged opposite to the air outlet 51; the piezoelectric actuator 3 is located above the central opening 62. One end of the elastic arm 61 is connected to the frame portion 6, and the other end is connected to one end of the piezoelectric actuator 3 close to the frame portion 6.

[0073] Solution Two: As Figure 9 shown, the adapter is fixedly connected to the node position of the vibration of the piezoelectric actuator 3;

[0074] The adapter includes a holding portion 7 fixedly connected to the functional module 11; when a second magnetic contact 21 is provided on the adapter, the second magnetic contact 21 is fixed on the holding portion 7;

[0075] The holding portion 7 is joined to the node position of the vibration of the piezoelectric actuator 3, and the holding portion 7 is joined to the side of the piezoelectric actuator 3 facing away from the diaphragm 5.

[0076] Solution Three: As Figures 9 - 10 shown, the adapter includes a diaphragm extension portion 8. The diaphragm extension portion 8 includes a fixing portion 81 and an elastic suspension portion 82. The fixing portion 81 is fixedly connected to the functional module 11, and the fixing portion 81 surrounds the outer periphery of the diaphragm 5. When a second magnetic contact 21 is provided on the adapter, the second magnetic contact 21 is fixed on the fixing portion 81. One end of the suspension portion 82 is connected to the inner peripheral wall of the fixing portion 81, and the other end is connected to the outer peripheral wall of the diaphragm 5, so that the diaphragm 5 is elastically supported on the fixing portion 81 along a plane through the cantilever portion 92; there are multiple suspension portions 82, and an opening 83 is formed between two adjacent suspension portions 82. The diaphragm extension portion 8 can be integrally formed with the diaphragm 5.

[0077] Solution Four: As Figures 12 - 13As shown, the adapter includes a diaphragm support portion 9, which is arranged on the side of the diaphragm 5 away from the piezoelectric actuator 3. The diaphragm support portion 9 includes a fixed support portion 91 and a plurality of cantilever portions 92 arranged at intervals. The cantilever portions 92 can be distributed at intervals along the circumference of the chamber 10. The fixed support portion 91 is fixedly connected to the side wall of the functional module 11 and is located on the outside of the outer wall of the outer frame 4. When the second magnetic contact 21 is provided on the adapter, the second magnetic contact 21 is fixed on the fixed support portion 91, one end of the cantilever portion 92 is connected to the fixed support portion 91, and the other end is connected to the area of the diaphragm 5 opposite to the outer frame 4 on the side away from the piezoelectric actuator 3, so that the diaphragm 5 is elastically supported on the fixed support portion 91 in the vertical direction through the cantilever portion 92.

[0078] It is more ideal that the heat generated by the electronic components inside the electronic device is transferred to the area on the surface of the housing 1 along the outflow direction of the micro piezoelectric fan 2 through the heat conduction component. The heat conduction component here can be a temperature equalizing plate, a graphene heat conducting plate, or a liquid cooling heat dissipation module disclosed in the Chinese patent publication number CN212910536U, which is not limited here.

[0079] The functional module 11 that passes through the shell 1 and protrudes from the outer surface of the shell 1 can be a camera module. Taking a smart phone as an example, the smart phone has a shell 1 and a display module that is connected to the shell 1 to enclose an internal space, and also has a camera module that passes through the shell 1 and protrudes from the surface of the shell 1.

[0080] Example 2

[0081] like Figure 14 As shown, the structural principle of Example 2 is basically the same as that of Example 1, with the difference being that a recessed portion 1-1 is recessed in the area adjacent to the functional module 11 on the outer surface of the housing 1, and the piezoelectric fan 2 is mounted on the side wall of the functional module 11 and has a portion accommodated in the recessed portion 1-1. The advantage is that a larger installation and adjustment space is provided for the piezoelectric fan 2, which facilitates the selection of the piezoelectric fan 2 and can also reduce the restriction on the protruding height of the functional module 11, which is beneficial to the overall thinning of the electronic device.

[0082] Example 3

[0083] An electronic device comprises the heat dissipation structure of the electronic device of the above-mentioned embodiment 1 or 2, wherein the electronic device is a smart phone, a tablet computer, a smart screen, a smart screen or a driving recorder.

[0084] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A heat dissipation structure of an electronic device, the electronic device having a housing (1) and a functional module (11) protruding from an outer surface of the housing (1), characterized in that: comprising at least one piezoelectric fan (2); The piezoelectric fan (2) comprises a piezoelectric actuator (3), an outer frame (4) and a diaphragm (5); one end of the outer frame (4) is connected to the piezoelectric actuator (3), and the other end is connected to the diaphragm (5); a chamber (10) is formed between the piezoelectric actuator (3), the outer frame (4) and the diaphragm (5); an air outlet (51) communicating with the chamber (10) is provided on the diaphragm (5); The piezoelectric fan (2) is fixedly mounted on the side wall of the functional module (11) via an adapter; The adapter is elastically supported and connected to a region on the diaphragm (5) that is opposite to the outer frame (4), the piezoelectric actuator (3) or the outer frame (4); or, the adapter is fixedly connected to a vibration node position of the piezoelectric actuator (3); The air outlet (51) of the piezoelectric fan (2) faces the side away from the side wall of the functional module (11), so that the airflow generated by the piezoelectric fan (2) can pass through.

2. The heat dissipation structure of the electronic device according to claim 1, wherein: A recessed portion (1-1) is formed in an area adjacent to the functional module (11) and on the outer surface of the housing (1). The piezoelectric fan (2) is mounted on a side wall of the functional module (11) and has a portion accommodated in the recessed portion (1-1).

3. The heat dissipation structure of the electronic device according to claim 1 or 2, characterized in that: At least one first magnetic attraction contact point (111) is provided on the side wall of the functional module (11); The adapter is provided with a second magnetic contact (21), and the first magnetic contact (111) and the second magnetic contact (21) are magnetically attracted to each other so that the piezoelectric fan (2) is installed on the side wall of the functional module (11).

4. The heat dissipation structure of the electronic device according to claim 1 or 2, characterized in that: It also includes a mounting retaining frame (2-1), wherein the adapter and the mounting retaining frame (2-1) are fixedly connected; At least one first magnetic attraction contact point (111) is provided on the side wall of the functional module (11); A third magnetic contact (2-11) is provided on the mounting retaining frame (2-1), and the first magnetic contact (111) and the third magnetic contact (2-11) are attracted to each other so that the piezoelectric fan (2) is mounted on the side wall of the functional module (11).

5. The heat dissipation structure of the electronic device according to claim 1, wherein: The functional module (11) is a camera module.

6. The heat dissipation structure of the electronic device according to claim 1, wherein: The adapter comprises a frame portion (6) fixedly connected to the side wall of the functional module (11): The frame portion (6) is provided with a plurality of elastic arms (61) having elasticity, and one end of the elastic arm (61) facing away from the frame portion (6) is fixedly connected to a region on the diaphragm (5) opposite to the outer frame (4), the piezoelectric actuator (3) or the outer frame (4); A central opening (62) penetrates through the middle position of the frame portion (6); at least a part of the piezoelectric actuator (3) is located within the central opening (62), one end of the elastic arm (61) is connected to the inner peripheral wall of the central opening (62), and the other end is fixedly connected to the outer peripheral wall of the piezoelectric actuator (3) or the outer peripheral wall of the outer frame (4); alternatively, a central opening (62) penetrates through the middle position of the frame portion (6), and all the air outlets (51) are disposed opposite to the central opening (62); the piezoelectric actuator (3) is located above the central opening (62), one end of the elastic arm (61) is fixedly connected to the frame portion (6), and the other end is connected to one end of the piezoelectric actuator (3) close to the frame portion (6).

7. The heat dissipation structure of the electronic device according to claim 1, wherein: The adapter includes a holding portion (7) fixedly connected to the side wall of the functional module (11), the holding portion (7) is joined at the nodal position of the vibration of the piezoelectric actuator (3), and the holding portion (7) is joined on the side of the piezoelectric actuator (3) facing away from the diaphragm (5); Alternatively, the adapter includes a diaphragm extension portion (8), the diaphragm extension portion (8) includes a fixing portion (81) and an elastic suspension portion (82), the fixing portion (81) is fixedly connected to the side wall of the functional module (11), and the fixing portion (81) surrounds the outer periphery of the diaphragm (5), one end of the suspension portion (82) is connected to the inner peripheral wall of the fixing portion (81), and the other end is connected to the outer peripheral wall of the diaphragm (5), so that the diaphragm (5) is elastically supported on the fixing portion (81) along a plane through the cantilever portion (92).

8. The heat dissipation structure of the electronic device according to claim 1, characterized in that: The adapter includes a diaphragm support portion (9), the diaphragm support portion (9) is disposed on the side of the diaphragm (5) facing away from the piezoelectric actuator (3), the diaphragm support portion (9) includes a fixed support portion (91) and a plurality of spaced-apart cantilever portions (92), the fixed support portion (91) is fixedly connected to the side wall of the functional module (11) and is located outside the outer peripheral wall of the outer frame (4), one end of the cantilever portion (92) is connected to the fixed support portion (91), and the other end is connected to the region of the diaphragm (5) on the side facing away from the piezoelectric actuator (3) and opposite to the outer frame (4), so that the diaphragm (5) is elastically supported on the fixing portion (81) along a plane through the cantilever portion (92).

9. An electronic device, characterized in that: A heat dissipation structure of an electronic device according to any one of claims 1-8 is included.

10. The electronic device according to claim 9, wherein: The electronic device is a smart phone, a tablet computer, a smart screen, a smart display, or a dash cam.

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