Fault detection method, related device and storage medium
By collecting and comparing the acoustic signals of the robotic arm, combined with manual detection, the problem of robotic arm failure that cannot be detected by regular preventive maintenance is solved, improving the yield of wafer manufacturing and reducing costs.
Patent Information
- Application Number
- CN202411826005.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-07-29
AI Technical Summary
The prior art cannot effectively detect robotic arm failures that cannot be detected by regular preventive maintenance, resulting in defects on the wafer surface and economic losses.
By collecting the sound wave signals emitted by the robotic arm during the transmission of the wafer, comparing them with the standard sound wave signals, detecting abnormalities in real time, and obtaining the sound wave signals of the same batch of wafers, and issuing a detection prompt for manual detection.
Accurately detect robotic arm failures, improve wafer yields, and reduce manufacturing costs.
Smart Images
Figure CN120385749A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure belongs to the field of semiconductor technology, and particularly relates to a fault detection method, related device, and storage medium. Background Art
[0002] During the wafer manufacturing process, the wafer needs to be processed multiple times in different process chambers of the production machine. During this process, the transfer of the wafer needs to be achieved by means of a wafer transfer device. A robotic arm is provided in the wafer transfer device to transfer the wafer into the process chamber by means of the telescopic and lifting movements of the robotic arm. Although regular preventive maintenance (PM for short) is usually performed on the robotic arm, there are still some faults (such as aging anomalies) that cannot be detected. During the wafer transfer process, defects may be formed on the wafer surface due to these faults that cannot be detected by the regular preventive maintenance of the robotic arm. For example, due to metal fatigue, the robotic arm collides with the wafer to generate collision defects, and the robotic arm slides on the wafer surface to cause sliding defects. At present, the automation degree of the wafer production process is very high. Therefore, once a defect is found on a wafer, defects are often found on the surfaces of all wafers in this series, resulting in huge economic losses. Therefore, there is an urgent need for a fault detection method that can detect the faults of the robotic arm that cannot be detected by the regular preventive maintenance. Summary of the Invention
[0003] In view of the above problems, the present disclosure provides a fault detection method, related device, and storage medium, aiming to accurately and real-time detect the faults of the robotic arm that cannot be detected by the regular preventive maintenance, thereby improving the yield of the manufactured wafers and reducing the manufacturing cost of the wafers.
[0004] According to a first aspect of the present disclosure, there is provided a fault detection method, including: Collecting a first acoustic wave signal emitted by the robotic arm during the transfer of the current wafer; Comparing the first acoustic wave signal with a standard acoustic wave signal in real time, and determining whether the first acoustic wave signal is abnormal according to the comparison result; When it is determined that the first acoustic wave signal is abnormal, obtaining a second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer; Sending a detection prompt to notify a manual inspection of the robotic arm according to the second acoustic wave signal to determine whether the robotic arm has a fault.
[0005] Optionally, an acoustic detector is provided on the robotic arm, and the acoustic detector is used to detect the acoustic wave signal emitted by the robotic arm during the transfer of each wafer. The first acoustic wave signal emitted by the acquisition robotic arm during the transmission of the current wafer includes: Use the acoustic detector to collect the first acoustic wave signal emitted by the robotic arm during the transmission of the current wafer.
[0006] Optionally, before the first acoustic wave signal is compared with the standard acoustic wave signal in real time and it is determined whether the first acoustic wave signal is abnormal according to the comparison result, the fault detection method further includes: Collect a plurality of third acoustic wave signals emitted by the robotic arm during the continuous transmission of a plurality of wafers. If the difference between the plurality of third acoustic wave signals is within the error tolerance range, use the plurality of third acoustic wave signals as the standard acoustic wave signal.
[0007] Optionally, the real-time comparison of the first acoustic wave signal with the standard acoustic wave signal and determining whether the first acoustic wave signal is abnormal according to the comparison result includes: Compare the first acoustic wave signal with the plurality of third acoustic wave signals in real time. If there is a mutation in the first acoustic wave signal, it is determined that the first acoustic wave signal is abnormal.
[0008] Optionally, after the first acoustic wave signal is compared with the standard acoustic wave signal in real time and it is determined whether the first acoustic wave signal is abnormal according to the comparison result, the fault detection method further includes: In the case where it is determined that the first acoustic wave signal is not abnormal, collect the first acoustic wave signal emitted by the robotic arm during the transmission of the next wafer and determine whether the first acoustic wave signal is abnormal.
[0009] Optionally, after the detection prompt is issued to notify the robotic arm to be manually detected according to the second acoustic wave signal to determine whether the robotic arm is faulty, the fault detection method further includes: In the case where it is determined by manual detection that the robotic arm is faulty, stop using the robotic arm to transmit the next wafer; In the case where it is determined by manual detection that the robotic arm is not faulty, collect the first acoustic wave signal emitted by the robotic arm during the transmission of the next wafer.
[0010] According to a second aspect of the present disclosure, a fault detection device is provided, including: A first acoustic wave signal acquisition unit for collecting the first acoustic wave signal emitted by the robotic arm during the transmission of the current wafer; A signal abnormality real-time determination unit for comparing the first acoustic wave signal with the standard acoustic wave signal in real time and determining whether the first acoustic wave signal is abnormal according to the comparison result; A second acoustic wave signal acquisition unit, configured to acquire a second acoustic wave signal corresponding to a wafer belonging to the same batch as the current wafer when the first acoustic wave signal is abnormal; A manual detection prompt unit, configured to issue a detection prompt to notify that the robotic arm is manually detected according to the second acoustic wave signal to determine whether the robotic arm is faulty.
[0011] According to a third aspect of the present disclosure, there is provided a fault detection system, including: An acoustic detector, located on the robotic arm, configured to detect an acoustic wave signal emitted by the robotic arm during the transmission of each wafer; The above-mentioned fault detection device, configured to detect whether the robotic arm is faulty.
[0012] According to a fourth aspect of the present disclosure, there is provided an electronic device, including a memory, a processor, and a program, where when the program is executed by the processor, the fault detection method described in any one of the above can be implemented.
[0013] According to a fifth aspect of the present disclosure, there is provided a storage medium, on which a computer program or instruction is stored, and when the computer program or instruction is executed by a processor, the steps of the method described in any one of the above are implemented.
[0014] The present disclosure brings the following beneficial effects: In the fault detection method of the embodiment of the present disclosure, a first acoustic wave signal emitted by the robotic arm during the transmission of the current wafer is collected, the first acoustic wave signal is compared with a standard acoustic wave signal in real time, and according to the comparison result, it is determined whether the first acoustic wave signal is abnormal. When the first acoustic wave signal is abnormal, a second acoustic wave signal corresponding to a wafer belonging to the same batch as the current wafer is acquired, and a detection prompt is issued to notify that the robotic arm is manually detected according to the second acoustic wave signal to determine whether the robotic arm is faulty. In this way, through the two detection mechanisms of determining whether the first acoustic wave signal is abnormal according to the comparison result and manual detection, the faults of the robotic arm that cannot be detected by regular preventive maintenance can be accurately and real-time detected. When a robotic arm fault is detected, the use of the robotic arm to transfer the next wafer can be stopped, thereby improving the yield of the manufactured wafers and reducing the manufacturing cost of the wafers.
[0015] Other features and advantages of the present disclosure will be described in the subsequent specification, and some of them will become obvious from the specification, or be understood by implementing the present disclosure. The objectives and other advantages of the present disclosure are achieved and obtained by the structures specifically pointed out in the specification and the drawings.
[0016] To make the above objectives, features, and advantages of the present disclosure more obvious and understandable, the following specific preferred embodiments are given below in conjunction with the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, the above and other objects, features, and advantages of the present disclosure will become clearer. In the drawings:
[0018] Figure 1 is a schematic structural diagram of a wafer transfer device in the related art;
[0019] Figure 2 is a schematic structural diagram of a fault detection system provided according to an embodiment of the present disclosure;
[0020] Figure 3 is a schematic flowchart of a fault detection method provided according to an embodiment of the present disclosure;
[0021] Figure 4 is a schematic diagram of the second acoustic wave signal corresponding to the wafers of the same batch as the current wafer collected according to an embodiment of the present disclosure;
[0022] Figure 5 is a schematic diagram of a fault detection device provided according to an embodiment of the present disclosure; Figure 6 is a schematic structural diagram of an electronic device provided according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The various embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. In each of the drawings, the same or similar reference numerals are used to denote the same elements. For the sake of clarity, the various parts in the drawings are not drawn to scale.
[0024] Figure 1 is a schematic structural diagram of a wafer transfer device in the related art. Figure 1 The shown robotic arm 101 is the robotic arm provided in the wafer transfer device 100 in a production machine for wafer manufacturing. As Figure 1 shown, after the robotic arm 101 grabs the wafer 102, the wafer 102 can be transferred to different process chambers in the production machine through the movements such as the extension and lifting of the robotic arm 101 for multiple processes on the wafer 102. Although the robotic arm 101 is usually subject to regular preventive maintenance (abbreviated as PM), there are still some faults (such as aging anomalies) that cannot be detected. For example, Figure 1The crack caused by metal fatigue as shown in the rectangular frame 103. During the transfer of the wafer 102, defects may be formed on the wafer surface due to failures of the robotic arm 101 that cannot be detected by these regular preventive maintenances. For example, collision defects are generated when the robotic arm collides with the wafer due to metal fatigue, and scratch defects are caused when the robotic arm slides on the wafer surface. Currently, the degree of automation in the wafer production process is very high. Therefore, once a defect is found on a wafer, defects are often found on the surfaces of all wafers in this series. As a result, the economic losses caused are huge.
[0025] Based on this, the embodiments of the present disclosure provide a fault detection method, a related device, and a storage medium, which can accurately and real-time detect the faults of the robotic arm that cannot be detected by regular preventive maintenance, thereby improving the yield of the manufactured wafers and reducing the manufacturing cost of the wafers.
[0026] Figure 2 FIG. is a schematic structural diagram of a fault detection system provided according to an embodiment of the present disclosure. As Figure 2 shown, the fault detection system 200 includes a wafer transfer device 210 and a fault detection device 220 in a production machine for wafer manufacturing.
[0027] In some embodiments, as Figure 2 shown, the robotic arm 211 is the robotic arm provided in the wafer transfer device 210. The robotic arm 211 grabs the wafer 212 in an adsorption manner. In practical applications, the robotic arm 211 of the wafer transfer device 210 can also grab the wafer 212 in a clamping manner or a sliding manner. After the robotic arm 211 grabs the wafer 212, the wafer 212 can be transferred to different process chambers in the production machine through the telescopic, lifting, etc. movements of the robotic arm 211 to perform multiple processes on the wafer 212. An acoustic detector 213 is provided on the robotic arm 211. The acoustic detector 213 is used to detect the acoustic wave signals emitted by the robotic arm 211 during the process of transferring each wafer 212 (including the process of the robotic arm 211 grabbing the wafer 212 and transferring the wafer 212).
[0028] In some embodiments, the fault detection device 220 may be disposed in the production machine where the wafer transfer device 210 is located. The fault detection device 220 may be an error detection and classification system. For example, it may be an FDC (Fault Detection and Classification) system. The FDC system is mainly used in the semiconductor manufacturing process. By collecting and analyzing various data on the production line in real time, such as equipment parameters, production process parameters, etc., it can timely detect possible faults in the production process and classify the faults so as to take corresponding treatment measures. In some embodiments, the fault detection device 220 collects the first acoustic signal emitted by the robotic arm 211 during the transfer of the current wafer 212, and compares the first acoustic signal with the standard acoustic signal in real time. According to the comparison result, it determines whether the first acoustic signal is abnormal. When it is determined that the first acoustic signal is abnormal, it obtains the second acoustic signal corresponding to the wafers belonging to the same batch as the current wafer 212, issues a detection prompt, and notifies that the robotic arm 211 is to be manually detected according to the second acoustic signal to determine whether the robotic arm 211 has a fault.
[0029] Since the process of detecting the fault of the robotic arm using the fault detection method in the embodiments of the present disclosure will be described in detail below, it will not be elaborated here.
[0030] Figure 3 FIG. is a schematic flow chart of a fault detection method according to an embodiment of the present disclosure. The fault detection method of the embodiments of the present disclosure may be executed by the fault detection device 220. Refer to Figure 3 , the fault detection method includes steps S310 to S340.
[0031] In step S310, the first acoustic signal emitted by the robotic arm during the transfer of the current wafer is collected.
[0032] In some embodiments, the acoustic detector 213 provided on the robotic arm 211 is used to collect the first acoustic signal emitted by the robotic arm 211 during the transfer of the current wafer 212.
[0033] In step S320, the first acoustic signal is compared with the standard acoustic signal in real time, and according to the comparison result, it is determined whether the first acoustic signal is abnormal.
[0034] In some embodiments, before step S320, an acoustic detector 213 provided on the robotic arm 211 is used to collect a plurality of third acoustic wave signals emitted by the robotic arm 211 during the continuous transmission of a plurality of wafers 212. If the differences between the plurality of third acoustic wave signals are within the error tolerance range, the plurality of third acoustic wave signals are used as the standard acoustic wave signals. In some embodiments, the acoustic detector 213 collects one of the frequency, amplitude, and phase of the acoustic wave signal. In one example, when the acoustic detector 213 collects the frequency of the acoustic wave signal, the fact that the differences between the frequencies of the plurality of third acoustic wave signals are within the error tolerance range indicates that there is no mutation in the frequency values of the plurality of third acoustic wave signals, and the plurality of third acoustic wave signals can be used as the standard acoustic wave signals to characterize that the robotic arm 211 is in a normal working state. In one example, when the acoustic detector 213 collects the amplitude of the acoustic wave signal, the fact that the differences between the amplitudes of the plurality of third acoustic wave signals are within the error tolerance range indicates that there is no mutation in the amplitude values of the plurality of third acoustic wave signals, and the plurality of third acoustic wave signals can be used as the standard acoustic wave signals to characterize that the robotic arm 211 is in a normal working state. In one example, when the acoustic detector 213 collects the phase of the acoustic wave signal, the fact that the differences between the phases of the plurality of third acoustic wave signals are within the error tolerance range indicates that there is no mutation in the phase values of the plurality of third acoustic wave signals, and the plurality of third acoustic wave signals can be used as the standard acoustic wave signals to characterize that the robotic arm 211 is in a normal working state.
[0035] In some embodiments, after collecting the first acoustic wave signal emitted by the robotic arm 211 during the transmission of the current wafer 212, the first acoustic wave signal is compared with the plurality of third acoustic wave signals in real time. If there is a mutation in the first acoustic wave signal, it is determined that the first acoustic wave signal is abnormal. In one example, when the acoustic detector 213 collects the frequency of the acoustic wave signal, if the difference between the frequency of the first acoustic wave signal and the frequencies of the plurality of third acoustic wave signals is outside the error tolerance range, it indicates that there is a mutation in the frequency value of the first acoustic wave signal, and it can be determined that the first acoustic wave signal is abnormal. In one example, when the acoustic detector 213 collects the amplitude of the acoustic wave signal, if the difference between the amplitude of the first acoustic wave signal and the amplitudes of the plurality of third acoustic wave signals is outside the error tolerance range, it indicates that there is a mutation in the frequency value of the first acoustic wave signal, and it can be determined that the first acoustic wave signal is abnormal. In one example, when the acoustic detector 213 collects the phase of the acoustic wave signal, if the difference between the phase of the first acoustic wave signal and the phases of the plurality of third acoustic wave signals is outside the error tolerance range, it indicates that there is a mutation in the phase value of the first acoustic wave signal, and it can be determined that the first acoustic wave signal is abnormal.
[0036] In some embodiments, when it is determined that the first acoustic wave signal is normal, the acoustic detector 213 provided on the robotic arm 211 is used to collect the first acoustic wave signal emitted by the robotic arm 211 during the transmission of the next wafer 212, and step S320 is executed to determine whether the first acoustic wave signal is normal.
[0037] In step S330, when it is determined that the first acoustic wave signal is abnormal, a second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer is obtained.
[0038] In some embodiments, after the acoustic detector 213 provided on the robotic arm 211 collects the acoustic wave signal emitted by the robotic arm 211 during the transmission of the wafer 212, the acoustic wave signal will be stored in a preset memory. In some embodiments, when it is determined that the first acoustic wave signal is abnormal, the second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer 212 can be obtained from the preset memory. Figure 4 FIG. is a schematic diagram of the collected second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer according to an embodiment of the present disclosure. In some embodiments, the frequency of the acoustic wave signal collected by the acoustic detector 213 Figure 4 shows the second acoustic wave signals emitted by the robotic arm 211 during the continuous transmission of 10 wafers 212 (i.e., wafer #1 to wafer #10). As Figure 4 shown, there is a mutation between the second acoustic wave signal corresponding to wafer #6 and other second acoustic wave signals.
[0039] In step S340, a detection prompt is issued to notify that the robotic arm is manually detected according to the second acoustic wave signal to determine whether the robotic arm is faulty.
[0040] In some embodiments, when it is determined that the first acoustic wave signal is abnormal, a detection prompt is issued to notify that the robotic arm 211 is manually detected according to the second acoustic wave signal to determine whether the robotic arm 211 is faulty. For example, referring again to Figure 4 , a technician can use Figure 4 the chart shown to analyze whether the robotic arm 211 is faulty. As Figure 4 shown, since there is a mutation between the second acoustic wave signal corresponding to wafer #6 and other second acoustic wave signals. In this case, the technician can further observe and analyze on-site whether the robotic arm 211 is faulty.
[0041] In some embodiments, when manual inspection determines that the robotic arm 211 is faulty, the transfer of the next wafer 212 using the robotic arm 211 is stopped. When manual inspection determines that the robotic arm 211 is not faulty, a first acoustic wave signal emitted by the robotic arm 211 during the transfer of the next wafer 212 is collected.
[0042] It is easy to understand that in the embodiments of the present disclosure, through the dual detection mechanisms of determining whether the first acoustic wave signal is abnormal based on the comparison result between the first acoustic wave signal and the standard acoustic wave signal and manual inspection, faults of the robotic arm that cannot be detected by regular preventive maintenance can be accurately and real-time detected. When a robotic arm fault is detected, the transfer of the next wafer using the robotic arm can be stopped, thereby improving the yield of the manufactured wafers and reducing the manufacturing cost of the wafers.
[0043] Figure 5 The schematic diagram of a fault detection device provided according to an embodiment of the present disclosure is shown. As Figure 5 shown, the fault detection device of the embodiments of the present disclosure includes a first acoustic wave signal acquisition unit 510, a signal abnormality real-time determination unit 520, a second acoustic wave signal acquisition unit 530, and a manual inspection prompt unit 540.
[0044] The first acoustic wave signal acquisition unit 510 is configured to acquire a first acoustic wave signal emitted by the robotic arm during the transfer of the current wafer.
[0045] The signal abnormality real-time determination unit 520 is configured to compare the first acoustic wave signal with the standard acoustic wave signal in real time, and determine whether the first acoustic wave signal is abnormal according to the comparison result; The second acoustic wave signal acquisition unit 530 is configured to acquire a second acoustic wave signal corresponding to the wafer belonging to the same batch as the current wafer when the first acoustic wave signal is abnormal; The manual inspection prompt unit 540 is configured to issue a detection prompt to notify a manual inspection of the robotic arm according to the second acoustic wave signal to determine whether the robotic arm is faulty.
[0046] Since the process of detecting the robotic arm fault using the fault detection method of the embodiments of the present disclosure has been described in detail in the method embodiments above, it will not be repeated here.
[0047] The embodiments of the present disclosure further provide an electronic device, as Figure 6 shown, including a memory 620, a processor 610, and a program stored on the memory 620 and executable on the processor 610. When the program is executed by the processor 610, each process of the above-mentioned fault detection method embodiments can be implemented, and the same technical effects can be achieved. To avoid repetition, it will not be repeated here.
[0048] Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions or by controlling relevant hardware through instructions. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. Therefore, the embodiments of the present disclosure also provide a storage medium, on which a computer program or instructions are stored. When the computer program or instructions are executed by a processor, each process of the above fault detection methods in various embodiments can be implemented.
[0049] Since the instructions stored in this storage medium can execute the steps in the fault detection method provided by the embodiments of the present disclosure, the beneficial effects that can be achieved by the fault detection method provided by the embodiments of the present disclosure can be realized. For details, please refer to the previous embodiments and will not be repeated here. The specific implementation of each of the above operations can be referred to the previous embodiments and will not be repeated here.
[0050] In summary, for the fault detection method of the embodiments of the present disclosure, a first acoustic wave signal emitted by a robotic arm during the transmission of the current wafer is collected, and the first acoustic wave signal is compared with a standard acoustic wave signal in real time. According to the comparison result, it is determined whether the first acoustic wave signal is abnormal. When it is determined that the first acoustic wave signal is abnormal, a second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer is obtained, and a detection prompt is issued to notify a manual inspection of the robotic arm based on the second acoustic wave signal to determine whether the robotic arm has a fault. In this way, through the two detection mechanisms of determining whether the first acoustic wave signal is abnormal according to the comparison result and manual inspection, the faults of the robotic arm that cannot be detected by regular preventive maintenance can be accurately and real-time detected. When a fault of the robotic arm is detected, the use of the robotic arm to transfer the next wafer can be stopped, thereby improving the yield of the manufactured wafers and reducing the manufacturing cost of the wafers.
[0051] Finally, it should be noted that: Obviously, the above embodiments are merely examples for clearly illustrating the present disclosure and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present disclosure.
Claims
1. A fault detection method, comprising: Collecting a first acoustic wave signal emitted by a robotic arm during the transmission of the current wafer; Comparing the first acoustic wave signal with a standard acoustic wave signal in real time, and determining whether the first acoustic wave signal is abnormal according to the comparison result; When it is determined that the first acoustic wave signal is abnormal, obtaining a second acoustic wave signal corresponding to the wafers belonging to the same batch as the current wafer; Sending a detection prompt to notify a manual inspection of the robotic arm according to the second acoustic wave signal to determine whether the robotic arm has a fault.
2. The fault detection method according to claim 1, wherein, An acoustic detector is provided on the robotic arm, and the acoustic detector is used to detect the acoustic wave signal emitted by the robotic arm during the transmission of each wafer. The step of collecting the first acoustic wave signal emitted by the robotic arm during the transmission of the current wafer includes: Using the acoustic detector to collect the first acoustic wave signal emitted by the robotic arm during the transmission of the current wafer.
3. The fault detection method according to claim 2, wherein, Before the step of comparing the first acoustic wave signal with the standard acoustic wave signal in real time and determining whether the first acoustic wave signal is abnormal according to the comparison result, the fault detection method further includes: Collecting a plurality of third acoustic wave signals emitted by the robotic arm during the continuous transmission of a plurality of wafers, and if the difference between the plurality of third acoustic wave signals is within the error tolerance range, using the plurality of third acoustic wave signals as the standard acoustic wave signal.
4. The fault detection method according to claim 3, wherein, The step of comparing the first acoustic wave signal with the standard acoustic wave signal in real time and determining whether the first acoustic wave signal is abnormal according to the comparison result includes: Comparing the first acoustic wave signal with the plurality of third acoustic wave signals in real time, and if the first acoustic wave signal has a mutation, determining that the first acoustic wave signal is abnormal.
5. The fault detection method according to claim 1, wherein, After the step of comparing the first acoustic wave signal with the standard acoustic wave signal in real time and determining whether the first acoustic wave signal is abnormal according to the comparison result, the fault detection method further includes: When it is determined that the first acoustic wave signal is not abnormal, collecting the first acoustic wave signal emitted by the robotic arm during the transmission of the next wafer and determining whether the first acoustic wave signal is abnormal.
6. The fault detection method according to claim 1, wherein After the step of sending a detection prompt to notify a manual inspection of the robotic arm according to the second acoustic wave signal to determine whether the robotic arm has a fault, the fault detection method further includes: When it is determined by manual inspection that the robotic arm has a fault, stopping the transmission of the next wafer by the robotic arm; When it is determined by manual inspection that the robotic arm has no fault, collecting the first acoustic wave signal emitted by the robotic arm during the transmission of the next wafer.
7. A fault detection device, comprising: A first acoustic wave signal acquisition unit for collecting a first acoustic wave signal emitted by a robotic arm during the transmission of the current wafer; A signal abnormality real-time determination unit for comparing the first acoustic wave signal with a standard acoustic wave signal in real time and determining whether the first acoustic wave signal is abnormal according to the comparison result; A second acoustic wave signal acquisition unit, configured to acquire a second acoustic wave signal corresponding to a wafer belonging to the same batch as the current wafer when the first acoustic wave signal is abnormal; A manual detection prompt unit, configured to issue a detection prompt to notify a manual detection of the robotic arm according to the second acoustic wave signal to determine whether the robotic arm is faulty.
8. A fault detection system, comprising: An acoustic detector, located on the robotic arm, for detecting an acoustic wave signal emitted by the robotic arm during the transmission of each wafer ； The fault detection device according to claim 7, configured to detect whether the robotic arm is faulty.
9. An electronic device, comprising a memory, a processor, and a program, where the program, when executed by the processor, can implement the fault detection method according to any one of claims 1 to 6.
10. A storage medium, having a computer program or instruction stored thereon, where the computer program or instruction, when executed by a processor, implements the steps of the method according to any one of claims 1 to 6.