Mainboard assembly, industrial camera and machine vision equipment

Abstract

The invention discloses a main board assembly, the main board assembly comprises multiple layers of main boards (310) and a main board connecting structure (320), the main board connecting structure (320) comprises at least one main board connecting flexible circuit board (321) and a plurality of connecting columns (322), the connecting columns (322) sequentially penetrate through the main boards (310) and fixedly connect the multiple layers of main boards (310), and the multiple layers of main boards (310) are connected through the connecting columns (322). A gap is formed between every two adjacent layers of main boards (310); the two adjacent layers of main boards (310) corresponding to at least one interval are electrically connected through the main board connecting flexible circuit board (321). The invention further provides an industrial camera and machine vision equipment.

Description

Technical Field

[0001] The present application relates to the field of machine vision devices, and specifically, to a main board assembly, an industrial camera including the main board assembly, and a machine vision device including the industrial camera. Background Art

[0002] An industrial camera is a common machine vision device, and an industrial camera can be used to detect workpieces to determine whether the workpieces are qualified.

[0003] With the increase in the functions of industrial cameras, various circuit boards inside industrial cameras have gradually increased. How to make the structure of industrial cameras more compact has been pursued in this field. Summary of the Invention

[0004] The present application aims to solve one of the technical problems in the related art to a certain extent. For this purpose, the present application provides a main board assembly, an industrial camera including the main board assembly, and a machine vision device including the industrial camera.

[0005] To achieve the above object, as the first aspect of the present application, there is provided a main board assembly, the main board assembly including a multi-layer main board and a main board connection structure. Among them, the main board connection structure includes at least one main board connection flexible circuit board and a plurality of connection columns. The connection columns sequentially penetrate through each layer of the main board and fixedly connect the main boards, so that there is a gap between adjacent two layers of the main boards;

[0006] Adjacent two layers of the main boards corresponding to at least one of the gaps are electrically connected through the main board connection flexible circuit board.

[0007] Optionally, the main board includes a first main board and a second main board attached to one side of the first main board, and the flexible circuit board is integrated with and electrically connected to the first main board.

[0008] Optionally, a first avoidance notch is formed on the first main board, a second avoidance notch is formed at the same position on the second main board attached to the first main board, the first avoidance notch is aligned with the second avoidance notch, and the corresponding main board connection flexible circuit board is disposed at the first avoidance notch.

[0009] Optionally, both ends of the main board connection flexible circuit board between the topmost main board and the main board adjacent to the topmost main board in the multi-layer main boards are respectively connected to opposite sides of adjacent two layers of the main boards.

[0010] Optionally, for the remaining main board connection flexible circuit boards except the main board connection flexible circuit board connected between the topmost main board and the main board adjacent to it, both ends are respectively connected to the same side of adjacent two layers of the main boards.

[0011] Optionally, except for the motherboard connecting flexible circuit boards connected to the mainboard on the top layer and the mainboards adjacent to the mainboard on the top layer, two adjacent mainboard flexible circuit boards among the remaining multiple mainboard flexible circuit boards are respectively located on different sides of the mainboard assembly.

[0012] Optionally, the motherboard assembly further includes a motherboard heat sink and at least one heat conductor, two adjacent layers of the motherboards are connected via the heat conductor, at least one layer of the motherboard is provided with the motherboard heat sink, and the motherboard heat sink is used to be connected to the camera housing of the industrial camera.

[0013] As a second aspect of the present application, an industrial camera is provided, which includes a camera housing, a sensor circuit board assembly and a mainboard assembly. A photosensitive through-hole is formed on the camera housing, and the sensor circuit board assembly and the mainboard assembly are both arranged in the camera housing. The photosensitive surface of the sensor circuit board assembly faces the photosensitive through-hole, and the mainboard assembly is located on the side of the sensor circuit board assembly away from the photosensitive through-hole, wherein the mainboard assembly is the mainboard assembly provided in the first aspect of the present application.

[0014] Optionally, a heat insulating member is provided between the sensor circuit board assembly and the main board assembly.

[0015] Optionally, the sensor circuit board assembly includes a sensor circuit board, an image sensor, a sensor heating film, and a sensor heat sink, wherein the image sensor is disposed on the sensor circuit board, and a photosensitive surface of the image sensor forms a photosensitive surface of the sensor circuit board assembly, the sensor heating film is disposed on a side of the sensor circuit board facing away from the sensor, and the sensor heat sink is disposed on a side of the sensor heating film facing away from the sensor circuit board;

[0016] The sensor circuit board and the sensor heating film are both electrically connected to the mainboard assembly.

[0017] Optionally, the sensor circuit board assembly also includes a temperature sensor, which is electrically connected to the sensor circuit board. The temperature sensor is used to detect the temperature of the image sensor. The mainboard assembly is also used to control the sensor heating film to heat the image sensor to a set temperature range according to the temperature detected by the temperature sensor.

[0018] As a third aspect of the present application, a machine vision device is provided, which includes an industrial camera and a lens module. The lens module is arranged at the front end of the camera housing, and the light outlet hole of the lens module is aligned with the photosensitive through hole. The industrial camera is the industrial camera described in the second aspect of the present application.

[0019] In the embodiments of the present application, a connecting column is used to maintain the interval between adjacent main boards, so as to facilitate the arrangement of various electronic components on the main board.

[0020] The main boards of adjacent layers are connected by using a flexible circuit board for main board connection, which can not only achieve electrical connection between adjacent main boards, but also allow the main boards of different layers to be stacked in the thickness direction, making the structure of the main board assembly more compact.

[0021] These features and advantages of the present application will be disclosed in detail in the following specific embodiments and the accompanying drawings. The best embodiments or means of the present application will be shown in detail in combination with the accompanying drawings, but it is not a limitation to the technical solutions of the present application. In addition, these features, elements and components that appear in each of the following texts and drawings are multiple, and different symbols or numbers are marked for convenience of representation, but they all represent components with the same or similar structures or functions. Description of the Drawings

[0022] The present application will be further described below in conjunction with the accompanying drawings:

[0023] Figure 1 It is a schematic structural diagram of an embodiment of the main board assembly provided by the present application;

[0024] Figure 2 It is an exploded structural diagram of another embodiment of the main board assembly provided by the present application;

[0025] Figure 3 It is a schematic diagram of an embodiment of the second main board;

[0026] Figure 4 It is an exploded structural diagram of the sensor circuit board assembly and the main board assembly;

[0027] Figure 5 It is an exploded schematic diagram of an embodiment of the industrial camera provided by the present application;

[0028] Figure 6 It is a schematic structural diagram of an embodiment of the machine vision device provided by the present application.

[0029] Among them, the reference numerals are as follows:

[0030] 100: Camera housing 110: Front cover of camera housing

[0031] 111: Front cover body 112: Lens mounting seat

[0032] 120: Middle frame of camera housing 130: Rear cover of camera housing

[0033] 200: Sensor circuit board assembly 210: Sensor circuit board

[0034] 220: Image sensor 230: Sensor heating film

[0035] 240: Sensor heat sink 300: Main board assembly

[0036] 320: Main board connection structure 321: Main board connection flexible circuit board

[0037] 400: Lens module 310: Main board

[0038] 322: Connection post Detailed implementation manners

[0039] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. Based on the embodiments in the embodiments, it is intended to explain the present application and should not be construed as a limitation to the present application.

[0040] As used in this specification, the phrase "in one embodiment" or "example" or "instance" means that a particular feature, structure, or characteristic described in connection with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearances of the phrase "in one embodiment" in various positions in the specification do not necessarily refer to the same embodiment.

[0041] For the convenience of description, in the embodiments of the present application, the "front" refers to the direction towards which the photosensitive surface of the sensor circuit board assembly faces, and the "rear" in the embodiments of the present application refers to the direction opposite to the above "front".

[0042] As a first aspect of the present application, a main board assembly 300 is provided, as Figure 1 shown. The main board assembly 300 includes a multi-layer main board 310 and a main board connection structure 320. Among them, the main board connection structure 320 includes at least one main board connection flexible circuit board 321 and a plurality of connection posts 322. The connection posts 322 sequentially penetrate through each layer of the main board 310 and fixedly connect the main boards 310, so that there is a gap between adjacent layers of the main boards 310; at least one of the adjacent layers of the main boards 310 corresponding to the gaps is electrically connected through the main board connection flexible circuit board 321.

[0043] It should be noted that the main board assembly 300 provided in the embodiments of the present application is used for an industrial camera and is disposed in the camera housing 100 of the industrial camera.

[0044] In the embodiments of the present application, the connection posts 322 are used to maintain the gap between adjacent layers of the main boards 310, thereby facilitating the arrangement of various electronic components on the main board 310.

[0045] The main board connection flexible circuit board 321 is used to connect adjacent two layers of main boards 310, which can not only achieve the electrical connection between adjacent two layers of main boards 310, but also allow different layers of main boards 310 to be stacked in the thickness direction, making the structure of the main board assembly 300 more compact.

[0046] In the embodiments of the present application, there is no special limitation on the connection between the main board 310 and the main board connection flexible circuit board 321. Optionally, as Figure 2 shown, the main board 310 includes a first main board 311 and a second main board 312 attached to one side of the first main board 311, and the main board connection flexible circuit board 321 is formed integrally with the first main board 311 and electrically connected.

[0047] In the above embodiment, the first main board 311 and the second main board 312 attached to one side of the first main board 311 can be electrically connected through metallized vias. The main board connection flexible circuit board 321 is formed integrally with the first main board 311, which can reduce the number of interfaces and is more conducive to the assembly of each layer of main boards.

[0048] In order to further reduce the overall volume of the main board assembly 300 and improve the compactness of the main board assembly 300, optionally, a first avoidance notch is formed on the first main board 311, and a second avoidance notch 312a is formed at the same position on the second main board 312 attached to the first main board 311 (as Figure 3 shown), the first avoidance notch is aligned with the second avoidance notch 312a, and the corresponding main board connection flexible circuit board 321 is disposed at the first avoidance notch.

[0049] By providing the first avoidance notch and the second avoidance notch 312a, the main board connection flexible circuit board 321 can be aligned with the side surfaces of other main boards, reducing the overall volume of the main board assembly 300.

[0050] In the embodiments of the present application, the shape of the main board 310 is mostly rectangular. In order to facilitate layout and the stacking of multiple layers of main boards 310, optionally, for the main board located at the top layer of the multiple main boards (i.e., Figure 1 and Figure 2 the leftmost main board in, that is, the main board adjacent to the sensor circuit board assembly in the industrial camera), and the main board connection flexible circuit board between the main board adjacent to the top-layer main board has its two ends respectively connected to the opposite sides of adjacent two layers of the main boards.

[0051] That is to say, as Figure 2As shown, the length of the main board connection flexible circuit board 321 connected between the first two layers of main boards is relatively long. When assembling the main board assembly 300 in the camera housing, the main boards 310 of each layer are folded in the order from back to front. There are relatively more components on the frontmost (i.e., the top layer) main board 310, and it also needs to be connected to the sensor circuit board assembly 200. In this embodiment, the sensor circuit board assembly 200 can be first assembled with the top layer main board 310, and then the corresponding main board connection flexible circuit board 321 is bent, and the top layer main board 310 assembled with the sensor circuit board assembly 200 is fixedly connected to the top end of the connection post 322.

[0052] As an alternative embodiment, the length of the main board connection flexible circuit board 321 connected to the top layer main board 310 can be the sum of the length of the long side of the main board 310 and the width of the interval between the two layers of main boards 310.

[0053] In the embodiments of the present application, there is no special limitation on how to set the positions of the remaining main board connection flexible circuit boards. Optionally, for the remaining main board connection flexible circuit boards except the main board connection flexible circuit board connected between the top layer main board and its adjacent main board, both ends are respectively connected to the same side of the adjacent two layers of the main boards.

[0054] As Figure 2 shown, the main board connection flexible circuit board 321 between the second main board from the left and the third main board from the left is connected between the short sides on the same side, the main board connection flexible circuit board 321 between the third main board from the left and the fourth main board from the left is connected between the long sides on the same side, and the main board connection flexible circuit board 321 between the first main board from the right and the second main board from the right is connected between the long sides on the same side.

[0055] As Figure 2 shown, for the sake of convenient layout, except for the main board connection flexible circuit board connected between the top layer main board and the main board adjacent to the top layer main board, among the remaining multiple main board flexible circuit boards, two adjacent main board flexible circuit boards are respectively located on different sides of the main board assembly.

[0056] As Figure 2 shown, the main board assembly 300 may further include a main board heat dissipation member 330 and at least one heat conduction member. The adjacent two layers of the main boards are connected by the heat conduction member, and the main board heat dissipation member 330 is provided on at least one layer of the main board 310, and the main board heat dissipation member 330 is used to be connected to the camera housing of the industrial camera.

[0057] By providing a motherboard heat sink 330, the heat generated by the motherboard assembly 300 can be transferred to the camera housing of the industrial camera. In the embodiment of the present application, the motherboard heat sink 330 can be directly connected to the inner surface of the side wall of the camera housing of the industrial camera. To facilitate assembly, a heat conductor (e.g., thermally conductive foam) can be optionally provided on the surface of the side wall of the motherboard heat sink 330 facing the camera housing of the industrial camera, and connected to the side wall of the camera housing via the heat conductor.

[0058] As a second aspect of the present invention, an industrial camera is provided. Figure 2 、 Figure 5 and Figure 6 As shown, the industrial camera includes a camera housing 100, a sensor circuit board assembly 200 and a mainboard assembly 300. A photosensitive through-hole is formed on the camera housing 100. The sensor circuit board assembly 200 and the mainboard assembly 300 are both arranged in the camera housing 100. The photosensitive surface of the sensor circuit board assembly 200 faces the photosensitive through-hole, and the mainboard assembly 300 is located on the side of the sensor circuit board assembly 200 away from the photosensitive through-hole, wherein the mainboard assembly 300 is the mainboard assembly provided in the first aspect of the present application.

[0059] As described above, the mainboard assembly has a compact structure, thus allowing a smaller camera housing 100 to be used in the industrial camera, thereby improving the compactness of the industrial camera.

[0060] The sensor circuit board assembly 200 needs to work within a set temperature range to obtain an ideal imaging effect. In order to avoid the working temperature of the sensor circuit board assembly 200 affecting the mainboard assembly 300, optionally, as Figure 4 As shown, a heat insulating member 200 a is provided between the sensor circuit board assembly 200 and the main board assembly 300 .

[0061] In the embodiment of the present application, there is no particular limitation on the specific structure of the sensor circuit board assembly 200, as long as it can realize the imaging function. Figure 4 As shown, the sensor circuit board assembly 200 may include a sensor circuit board 210, an image sensor 220, a sensor heating film 230, and a sensor heat sink 240. The image sensor 220 is arranged on the sensor circuit board 210, and the photosensitive surface of the image sensor 220 is formed as the photosensitive surface of the sensor circuit board assembly 200. The sensor heating film 230 is arranged on the side of the sensor circuit board 210 away from the image sensor 220, and the sensor heat sink 240 is arranged on the side of the sensor heating film 230 away from the sensor circuit board 210.

[0062] The sensor circuit board 210 and the sensor heating film 230 are both electrically connected to the main board assembly 300. In the embodiment of the present application, the main board assembly 300 can supply power to and drive the sensor circuit board 210 and the sensor heating film 230, and the image sensor 220 can be driven through the sensor circuit board 210.

[0063] As an alternative implementation, the sensor heating film 230 can be a flexible circuit board.

[0064] In the embodiment of the present application, the specific structure of the camera housing 100 is not particularly limited, as long as it can accommodate various components such as the sensor circuit board assembly 200 and the main board assembly 300 and cooperate with the lens module. For example, the camera housing 100 can include a camera housing front cover 110, a camera housing middle frame 120, and a camera housing rear cover 130, and the camera housing middle frame 120 is connected between the camera housing front cover 110 and the camera housing rear cover 130.

[0065] The photosensitive through hole is formed on the camera housing front cover 110.

[0066] The main board assembly 300 is fixedly connected to the camera housing rear cover 130.

[0067] The camera housing 100 is provided as a split structure including a camera housing front cover 110, a camera housing middle frame 120, and a camera housing rear cover 130, which is more convenient for assembling each component in the camera housing 100. Specifically, the main board assembly 300 can be first fixed on the camera housing rear cover 130, then the camera housing middle frame 120 is sleeved outside the main board assembly 300 and connected to the camera housing rear cover 130, and finally the sensor circuit board assembly 200 and the camera housing front cover 110 can be assembled.

[0068] As Figure 5 shown, the camera housing front cover 110 includes a front cover body 111 and a lens mounting seat 112. The photosensitive through hole is formed on the front cover body 111 and is connected to the camera housing middle frame 120. The lens mounting seat 112 is disposed around the photosensitive through hole, and the lens mounting seat 112 is located on the side of the front cover body 111 facing away from the camera housing middle frame 120.

[0069] The industrial camera provided by the embodiment of the present application can cooperate with the lens module, and the lens of the lens module can be mounted on the lens mounting seat 112.

[0070] It should be noted that the camera housing 100 has good sealing performance. Correspondingly, as Figure 5As shown, the camera housing 100 may further include a first housing sealing ring 140 and a second housing seal 150. The first housing sealing ring 140 is disposed between the middle frame 120 of the camera housing and the rear cover 130 of the camera housing. The second housing seal 150 is disposed between the middle frame 1220 of the camera housing and the front cover 110 of the camera housing.

[0071] As described above, the image sensor 220 needs to operate within a set temperature range. Optionally, the sensor circuit board assembly 200 may further include a temperature sensor electrically connected to the sensor circuit board 210. The temperature sensor is used to detect the temperature of the image sensor 220. The main board assembly 300 is further configured to control the sensor heating film 230 to heat the image sensor to the set temperature range according to the temperature detected by the temperature sensor.

[0072] Specifically, when the temperature sensor detects that the temperature of the image sensor 220 exceeds the set temperature range, the main board assembly 300 may reduce the heating power of the sensor heating film 230. When the temperature sensor detects that the temperature of the image sensor 220 is lower than the set temperature range, the main board assembly 300 may increase the heating power of the sensor heating film 230.

[0073] The following briefly introduces the assembly method of an implementation of the industrial camera.

[0074] The assembly of the industrial camera mainly includes the assembly of the rear cover of the camera housing and related components, the assembly of the middle frame of the camera housing, and the assembly of the front cover of the camera housing and related components.

[0075] The assembly sequence of the rear cover assembly is as follows: First, place the light guide column in the light guide column groove of the rear cover of the camera housing and apply glue into the light guide column groove inside the rear cover of the camera housing to achieve sealing. Then, fix the first main board with M8 and M12 connectors on the rear cover. Next, attach the POE thermal pad to the POE of the second main board, and then fold the second main board of the main board. The POE thermal pad conducts heat to the M12 connector and then to the rear cover. Then, fold the third main board, attach the PHY thermal pad to the PHY of the third main board, attach the FPGA thermal pad to the FPGA of the fourth main board, place the main board heat sink on the limit bayonet on the fourth main board and then fold the fourth main board. Paste thermal foam on both sides of the main board heat sink. Then, attach the heat insulation part to the inner side of the sensor heat sink, attach the sensor heating film to the outer side of the sensor heat sink, attach the thermal pad of the sensor heat sink to the sensor heating film. Then, place the sensor circuit board assembly on the limit bayonet of the fifth main board of the main board, and insert the sensor heating film into the corresponding socket, thereby completing the assembly of the rear cover of the camera housing and related components.

[0076] The assembly of the middle frame of the camera housing is to fit the middle frame of the camera housing onto the rear cover of the camera housing and related components.

[0077] The assembly sequence of the front end of the camera housing and related components is as follows: First, install the second sealing ring, then fix the sensor circuit board assembly on the front cover of the camera housing, and install the filter gasket, filter, and filter pressure plate to complete the front end of the camera housing and related components. Finally, fit the front end of the camera housing and related components onto the middle frame of the camera housing and plug it into the main board assembly to complete the assembly of the entire industrial camera.

[0078] As the third aspect of the present application, a machine vision device is provided, as Figure 6 shown. The machine vision device includes an industrial camera and a lens module 400. The lens module 400 is arranged at the front end of the camera housing 100, and the light outlet hole of the lens module 400 is aligned with the photosensitive through hole. Among them, the industrial camera is the industrial camera described in the second aspect of the present application.

[0079] As described above, since the structure of the industrial camera is more compact, the structure of the machine vision device is also more compact.

[0080] It should be noted that the sealing level of the industrial camera needs to meet the requirements of IP67 level.

[0081] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the content described in the drawings and the above specific implementation manner. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. A motherboard assembly, the motherboard assembly comprising a multi-layer motherboard (310) and a motherboard connection structure (320), characterized in that, The main board connection structure (320) includes at least one main board connection flexible circuit board (321) and a plurality of connection posts (322). The connection posts (322) sequentially penetrate through each layer of the main board (310) and fixedly connect the multiple layers of the main board (310), so that there is a gap between adjacent two layers of the main board (310). The adjacent two layers of the main board (310) corresponding to at least one of the gaps are electrically connected through the main board connection flexible circuit board (321).

2. The motherboard assembly according to claim 1, wherein, The main board (310) includes a first main board (311) and a second main board (312) attached to one side of the first main board (311). The main board connection flexible circuit board (321) is formed integrally with the first main board (311) and is electrically connected.

3. The motherboard assembly according to claim 2, wherein, A first avoidance notch is formed on the first main board (311), and a second avoidance notch (312a) is formed at the same position on the second main board (312) attached to the first main board (311). The first avoidance notch is aligned with the second avoidance notch, and the corresponding main board connection flexible circuit board (321) is disposed at the first avoidance notch.

4. The motherboard assembly according to any one of claims 1 to 3, characterized in that Both ends of the main board connection flexible circuit board (321) between the topmost main board in the multiple layers of the main board (310) and the main board adjacent to the topmost main board are respectively connected to opposite sides of the adjacent two layers of the main board.

5. The motherboard assembly according to claim 4, characterized in that, For the remaining main board connection flexible circuit boards except for the main board connection flexible circuit board (321) between the topmost main board and the main board adjacent to it, both ends are respectively connected to the same side of the adjacent two layers of the main board.

6. The motherboard assembly according to claim 5, wherein Except for the main board connection flexible circuit board between the topmost main board and the main board adjacent to it, among the remaining multiple main board flexible circuit boards, two adjacent main board flexible circuit boards are respectively located on different sides of the main board assembly.

7. The motherboard assembly according to any one of claims 1 to 3, characterized in that, The main board assembly further includes a main board heat sink (330) and at least one heat conducting member. Adjacent two layers of the main board are connected through the heat conducting member, and the main board heat sink (330) is disposed on at least one layer of the main board. The main board heat sink (330) is used to be connected to the camera housing of the industrial camera.

8. An industrial camera, comprising a camera housing (100), a sensor circuit board assembly (200) and a mainboard assembly (300), wherein a photosensitive through hole is formed on the camera housing (100), the sensor circuit board assembly (200) and the mainboard assembly (300) are both arranged in the camera housing (100), the photosensitive surface of the sensor circuit board assembly (200) faces the photosensitive through hole, and the mainboard assembly (300) is located on a side of the sensor circuit board assembly (200) away from the photosensitive through hole, characterized in that The main board assembly (300) is the main board assembly according to any one of claims 1 to 7.

9. The industrial camera according to claim 8, wherein An insulating member is disposed between the sensor circuit board assembly and the main board assembly (300).

10. The industrial camera according to claim 9, characterized in that, The sensor circuit board assembly (200) includes a sensor circuit board (210), an image sensor (220), a sensor heating film (230), and a sensor heat sink (240). The image sensor (220) is disposed on the sensor circuit board (210), and the light sensing surface of the image sensor forms the light sensing surface of the sensor circuit board assembly (200). The sensor heating film (230) is disposed on the side of the sensor circuit board (210) facing away from the image sensor, and the sensor heat sink (240) is disposed on the side of the sensor heating film (230) facing away from the sensor circuit board (210). The sensor circuit board (210) and the sensor heating film (230) are both electrically connected to the main board assembly (300).

11. The industrial camera according to claim 10, characterized in that, The sensor circuit board assembly (200) further includes a temperature sensor, the temperature sensor is electrically connected to the sensor circuit board (210), the temperature sensor is used to detect the temperature of the image sensor, and the main board assembly (300) is further used to control the sensor heating film (230) to heat the image sensor to a set temperature range according to the temperature detected by the temperature sensor.

12. A machine vision device, the machine vision device comprising an industrial camera and a lens module (400), the lens module (400) being disposed at the front end of the camera housing (100), and the light exit hole of the lens module being aligned with the photosensitive through hole, characterized in that, The industrial camera is the industrial camera according to any one of claims 8 to 11.

Images