Glass cover plate disassembling equipment and glass cover plate disassembling method applying same

Abstract

The invention provides glass cover plate disassembling equipment which is used for disassembling a glass cover plate and a machine body of an electronic device, the electronic device further comprises a bonding layer, and the glass cover plate and the machine body are bonded through the bonding layer. The glass cover plate disassembling equipment comprises a cooling device and a separating device. The cooling device is used for cooling the bonding layer. And the separating device is used for separating the cooled glass cover plate from the machine body.

Description

Technical Field

[0001] The present invention relates to a glass cover plate disassembling device and a glass cover plate disassembling method using the same. Background Art

[0002] An electronic device includes a glass cover plate, a body, and an adhesive layer that bonds the glass cover plate to the body. The glass cover plate is an item that can be recycled. However, since the entire surface of the glass cover plate is coated with the adhesive layer and bonded to the body, it is difficult to disassemble the glass cover plate from the body. Therefore, it is one of the goals of those skilled in the art to propose a technology for disassembling the body and the glass cover plate to increase the recovery rate of the glass cover plate. Summary of the Invention

[0003] Therefore, the present invention proposes a glass cover plate disassembling device and a glass cover plate disassembling method using the same, which can solve the above problems.

[0004] An embodiment of the present invention provides a glass cover plate disassembling device. The glass cover plate disassembling device is used to disassemble the glass cover plate and the body of an electronic device. The electronic device further includes an adhesive layer that bonds the glass cover plate to the body. The glass cover plate disassembling device includes a cooling device and a separation device. The cooling device is used to cool the adhesive layer. The separation device is used to separate the cooled glass cover plate from the body.

[0005] Another embodiment of the present invention provides a glass cover plate disassembling method. The glass cover plate disassembling method includes the following steps: a cooling device cools the adhesive layer of the electronic device, where the adhesive layer bonds the body and the glass cover plate of the electronic device; and a separation device separates the cooled glass cover plate from the body. Brief Description of the Drawings

[0006] In order to better understand the above and other aspects of the present invention, the following specific embodiments are given, and are described in detail in conjunction with the accompanying drawings as follows:

[0007] Figure 1 A functional block diagram of a glass cover plate disassembling device 100 according to an embodiment of the present invention is shown.

[0008] Figure 2 A schematic diagram of an electronic device 10 according to an embodiment of the present invention is shown.

[0009] Figure 3 Shows Figure 1 a top view of the glass cover plate disassembling device 100.

[0010] Figure 4A Shows Figure 1 a schematic diagram of the conveying device 110 and the cooling device 120.

[0011] Figure 4B ShowsFigure 4A Top view of the carrier 114

[0012] Figure 4C Shows Figure 4B Cross-sectional view of the carrier 114 along the direction 4C - 4C’

[0013] Figure 5 Shows Figure 1 Schematic diagram of the cooling device 120

[0014] Figure 6 Shows Figure 1 Schematic diagram of the extraction device 130 and the separation device 140

[0015] Figures 7A - 7D Shows Figure 6 Operation process diagram of the impactor 141

[0016] Figure 8 Shows the distribution of the impact points on Figure 2 The electronic device 10

[0017] Figure 9 Shows Figure 1 Flowchart of the method for disassembling the glass cover of the glass cover disassembling device 100

[0018] Figures 10A - 10L Shows Figure 1 Process diagram of the glass cover disassembling device 100 disassembling the glass cover 11 and the body 12 of the electronic device 10

[0019]

Description of the main element symbols in the embodiments of the present disclosure in the drawings

[0020] 10: Electronic device

[0021] 11: Glass cover

[0022] 12: Body

[0023] 13: Adhesive layer

[0024] 100: Glass cover disassembling device

[0025] 110: Conveyor device

[0026] 111: Conveyor belt

[0027] 112: Roller

[0028] 113: Fixed belt

[0029] 114: Carrier

[0030] 114b: Bottom surface

[0031] 114r1: First recess

[0032] 114r2A, 114r2B, 114r2C and 114r2D: Second recesses

[0033] 1141: Protrusion

[0034] 1141e: Free end face

[0035] 115: Driver

[0036] 120: Cooling device

[0037] 120R: Cooling area

[0038] 121A, 121B, 121C and 121D: Injection pipes

[0039] 122: Cooling fluid source

[0040] 130: Extraction device

[0041] 130R: Area

[0042] 131: Robot arm

[0043] 1311: Gripper

[0044] 1312: Chuck

[0045] 1313: Connecting rod

[0046] 1314: Elastic member

[0047] 1315: Connecting plate

[0048] 132: First translation drive unit

[0049] 1321: First driver

[0050] 1322: First movable rod

[0051] 133: Second translation drive unit

[0052] 1331: Second driver[[ID=6E]]

[0053] 1332: Second movable rod

[0054] 134: Rotation unit

[0055] 140: Separation device

[0056] 141: Impactor

[0057] 1411: Striking pin

[0058] 1412: Impact unit

[0059] 1412r: Hollow

[0060] 1412A: Housing

[0061] 1412A1: Abutment

[0062] 1412b: Bottom surface

[0063] 1412B: First push block

[0064] 1412B1: Ontology

[0065] 1412B2: flange

[0066] 1412C: First elastic member

[0067] 1412D: Second push block

[0068] 1412D1: First end face

[0069] 1412D2: Second end face

[0070] 1412D3: Groove

[0071] 1412E: Second elastic member

[0072] 142: First limit plate

[0073] 143: Second limit plate

[0074] 144: The third limit plate

[0075] 150: Controller

[0076] 160: Glass collection area

[0077] 170: Body Collection Area

[0078] CL: Cooling fluid

[0079] H1: Distance

[0080] H1: Interval

[0081] S1: First central axis

[0082] S2: Second central axis

[0083] P: Impact point DETAILED DESCRIPTION

[0084] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. 1 shows a functional block diagram of a glass cover disassembling device 100 according to an embodiment of the present invention. Figure 2FIG. 0 shows a schematic diagram of an electronic device 10 according to an embodiment of the present invention. A glass cover plate disassembling device 100 is used to disassemble a glass cover plate 11 and a body 12 of the electronic device 10. The electronic device 10 further includes an adhesive layer 13 that bonds the glass cover plate 11 and the body 12. The glass cover plate disassembling device 100 includes a conveying device 110, a cooling device 120, an extraction device 130, a separation device 140, and a controller 150. The cooling device 120 is used to cool the adhesive layer 13. The separation device 140 is used to separate the glass cover plate 11 and the body 12. In an embodiment, after the adhesive layer 13 is cooled, it will become brittle (the viscosity decreases or the viscosity is lost), making it easier and / or faster for the separation device 140 to separate the glass cover plate 11 and the body 12. The separated glass cover plate 11 can be recycled and reused, increasing the recovery rate of the glass cover plate 11 of the electronic device 10.

[0085] The electronic device 10 is, for example, various electronic products including a glass cover plate such as a smart phone, a tablet computer, etc. The body 12 is, for example, a display panel, but the embodiments of the present invention are not limited thereto. The adhesive layer 13 is, for example, an optical clear adhesive (OCA). When the temperature of the optical adhesive drops below its glass transition temperature, its adhesive force will be significantly weakened, and the optical adhesive will also turn into a hard and brittle solid.

[0086] Please refer to Figure 3 and Figures 4A - 4C , Figure 3 shows Figure 1 a top view of the glass cover plate disassembling device 100 of Figure 4A shows Figure 1 a schematic diagram of the conveying device 110 and the cooling device 120 of Figure 4B shows Figure 4A a top view of the carrier plate 114 of Figure 4C and Figure 4B shows

[0087] As Figure 3 and Figure 4A shown, the conveying device 1 can convey the electronic device 10 to the cooling device 120 (at least partially disposed in the cooling zone 120R) for the cooling device 120 to cool.

[0088] As Figure 4AAs shown, the conveying device 110 includes a conveyor belt 111, at least one roller 112, at least one fixing belt 113, and a driver 115. At least one carrier 114 can be fixed on the conveyor belt 111 and is used for carrying the electronic device 10. In some embodiments, the carrier 114 may not belong to the glass cover disassembling device 100; alternatively, the carrier 114 may be a sub-component of the conveying device 110; or, the carrier 114 may be a sub-component of the glass cover disassembling device 100. The roller 112 is connected to the conveyor belt 111 and is used for driving the conveyor belt 111 to move. For example, the roller 112 rotates to drive the conveyor belt 111 to rotate, thereby driving the carrier 114 located thereon to move. The fixing belt 113 can be fixed on the conveyor belt 111 to move in conjunction with the roller 112. In some embodiments, the fixing belt 113 is, for example, a chain, but the embodiments of the present invention are not limited thereto. The carrier 114 is fixed on the conveyor belt 111 and is used for carrying the electronic device 10. In the present embodiment, the carrier 114 can be fixed on the conveyor belt 111 through the fixing belt 113. There is no relative movement between the conveyor belt 111, the fixing belt 113, and the carrier 114.

[0089] As Figure 4B shown, the carrier 114 has a first recess 114r1 communicating with at least one second recess (for example, second recesses 114r2A, 114r2B, 114r2C, and 114r2D). The first recess 114r1 is used for accommodating the electronic device 10. One or some of these second recesses are connected to one side of the first recess 114r1, and the other or other of these second recesses can be connected to the other side of the first recess 114r1. A cooling fluid (not shown) can enter the first recess 114r1 through the second recesses. These second recesses can be arranged adjacent to a plurality of corners of the first recess 114r1. In one embodiment, these second recesses can be symmetrically arranged relative to the first central axis S1 (for example, parallel to the X-axis) of the first recess 114r1, and / or these second recesses can be symmetrically arranged relative to the second central axis S2 (for example, parallel to the Y-axis) of the first recess 114r1. These symmetrically arranged second recesses can allow the cooling fluid entering the second recesses to more quickly and more evenly cover the first recess 114r1.

[0090] As Figure 4B and 4C shown, the carrier 114 further includes at least one protrusion 1141. The protrusion 1141 protrudes relative to the bottom surface 114b of the first recess 114r1 and has a free end surface 1141e, and the free end surface 1141e is used for abutting against the electronic device 10. For example, the free end surface 1141e is used for abutting against the glass cover 11 of the electronic device 10, where the glass cover 11 faces the bottom surface 114b. In some embodiments, there is a gap H1 between the bottom surface 114b and the free end surface 1141e to accommodate some cooling fluid (not shown in Figure 4C). In addition, one or some of these protrusions 1141 may be disposed adjacent to a plurality of corners of the bottom surface 114b, and another or other of these protrusions 1141 may be disposed adjacent to the middle region of the bottom surface 114b. Due to the position configuration of these protrusions 1141, the carrier 114 can carry a variety of different-sized electronic devices 10. In other words, regardless of the size of the electronic device 10, as long as the electronic device 10 is placed on the carrier 114, it can rest against at least one of the protrusions 1141. In addition, due to the position configuration of these protrusions 1141, the electronic device 10 can rest more stably against these protrusions 1141.

[0091] As Figure 4A shown, the driver 115 may be connected to the roller 112 to drive the roller 112 to rotate. In some embodiments, the driver 115 is, for example, a motor. The aforementioned controller 150 may be electrically connected to the driver 115 to control the operation of the driver 115.

[0092] Please refer to Figure 5 , which shows a schematic diagram of the cooling device 120 of Figure 1 . The cooling device 120 further includes at least one injection pipe (for example, injection pipes 121A, 121B, 121C, and 121D) and a cooling fluid source 122. The injection pipes are communicated with the cooling fluid source 122 and are used to supply the cooling fluid CL to the second recesses 114r2A, 114r2B, 114r2C, and 114r2D (the second recesses 114r2A, 114r2B, 114r2C, and 114r2D are shown in Figure 4B ). Under the transmission of the conveying device 110, when the carrier 114 and the cooling device 120 overlap along the Z axis (for example, the carrier 114 is directly below the injection pipes of the cooling device 120), the four injection pipes 121A, 121B, 121C, and 121D respectively correspond to the four second recesses 114r2A, 114r2B, 114r2C, and 114r2D. In some embodiments, the positions where the carrier 114 and the injection pipes of the cooling device 120 can overlap along the Z axis.

[0093] In some embodiments, when the carrier 114 and the cooling device 120 overlap along the Z-axis, two injection tubes can supply cooling fluid to two second recesses arranged diagonally. For example, at a certain moment, the injection tubes 121A and 121B respectively supply cooling fluid to two second recesses 114r2A and 114r2B arranged diagonally. At another moment, the injection tubes 121C and 121D respectively supply cooling fluid to two second recesses 114r2C and 114r2D arranged diagonally. In this way, the cooling fluid entering the second recesses can fill the first recess 114r1 more quickly. In some embodiments, the cooling fluid CL is, for example, liquid nitrogen. The low temperature of liquid nitrogen can embrittle the adhesive layer 13 of the electronic device 10 in a short time. However, the cooling fluid CL in the embodiments of the present invention is not limited to liquid nitrogen, and any fluid that can embrittle the adhesive layer 13 in a short time (for example, within 5 seconds or within 10 seconds) can be used as the cooling fluid of the present invention.

[0094] As Figure 5 shown, the aforementioned controller 150 can be electrically connected to the cooling fluid source 122 to control the cooling fluid source 122 to output or not output the cooling fluid CL to the injection tubes. The cooling fluid source 122 includes, for example, at least one valve (not shown), and each valve communicates with the corresponding injection tube. The controller 150 can control the valve to open or close to control whether the cooling fluid CL in the cooling fluid source 122 is supplied to the injection tubes.

[0095] Please refer to Figure 6 which shows a schematic diagram of the extraction device 130 and the separation device 140 of Figure 1 . The extraction device 130 includes a robotic arm 131, a first translation driving unit 132, a second translation driving unit 133, and a rotation unit 134.

[0096] As Figure 6As shown, the robotic arm 131 is used to grip the electronic device 10. For example, the robotic arm 131 includes at least two jaws 1311, a chuck 1312, a connecting rod 1313, an elastic member 1314, and a connecting plate 1315. The jaws 1311 can move along the + / -Y axis to grip or release the electronic device 10. The jaws 1311 can be disposed on the chuck 1312. The connecting rod 1313 connects the chuck 1312 and passes through the connecting plate 1315. The connecting rod 1313 can move relative to the connecting plate 1315 (e.g., along the + / -X axis). The elastic member 1314 surrounds the connecting rod 1313 and is located between the chuck 1312 and the connecting plate 1315, enabling the chuck 1312 to move relative to the connecting plate 1315. In some embodiments, when the jaws 1311 pick up (e.g., grip) the electronic device 10, the elastic member 1314 can provide a pressing force (due to deformation) to the chuck 1312 to grip the electronic device 10 between the chuck 1312 and the jaws 1311, thereby fixing the relative positions among the electronic device 10, the chuck 1312, and the jaws 1311. When an impact force is applied to the robotic arm 131, the elastic member 1314 can reciprocate along the X axis to generate vibration. The elastic member 1314 can increase the stiffness (K value) of the overall (or system) of the robotic arm 131 or the picking device 130 to increase the system oscillation period. The increase in the oscillation period allows the glass cover plate 11 of the electronic device 10 to withstand vibration for a longer time, which helps to separate the glass cover plate 11 from the body 12.

[0097] As Figure 6 shown, the first translation driving unit 132 is connected to the robotic arm 131 and is used for: driving the robotic arm 131 to approach the electronic device 10, and driving the robotic arm 131 to approach the separating device 140. The first translation driving unit 132 includes a first driver 1321 and at least one first movable rod 1322. The first movable rod 1322 connects the first driver 1321 and the connecting plate 1315 of the robotic arm 131. The first driver 1321 is used to drive the first movable rod 1322 to move along the + / -X axis (the first movable rod 1322 extends or contracts relative to the first driver 1321) to drive the robotic arm 131 to move along the + / -X axis. In some embodiments, the first driver 1321 is, for example, a pressing cylinder, such as a pneumatic cylinder or a hydraulic cylinder.

[0098] As Figure 6As shown, the second translation driving unit 133 is connected to the first translation driving unit 132 and is configured to: drive the first translation driving unit 132 to align with the separation device 140. In some embodiments, the second translation driving unit 133 includes a second driver 1331 and at least one second movable rod 1332. The second movable rod 1332 connects the second driver 1331 and the first translation driving unit 132. For example, the second movable rod 1332 connects the second driver 1331 and the first driver 1321 of the first translation driving unit 132. The second driver 1331 is configured to drive the second movable rod 1332 to move along the + / -Y axis (the second movable rod 1332 extends or contracts relative to the second driver 1331). In some embodiments, the second driver 1331 is, for example, a pressing cylinder, such as a pneumatic cylinder or a hydraulic cylinder.

[0099] As [[ID=...]]Figure 6 shown, the rotation unit 134 is connected to the second translation driving unit 133 and is configured to: rotate the second translation driving unit 133 to drive the robotic arm 131 to align with the separation device 120.

[0100] In summary, when the conveying device 110 conveys the electronic device 10 to the area 130R corresponding to the extraction device 130, the extraction device 130 can extract the electronic device 10 and move it to the alignment separation device 140, allowing the separation device 140 to separate the glass cover plate 11 from the body 12.

[0101] As Figure 6 shown, the separation device 140 includes at least one impactor 141, a first limiting plate 142, a second limiting plate 143, and a third limiting plate 144. The impactor 141 is configured to apply an impact force to the glass cover plate 11 of the electronic device 10. Each impactor 141 includes a punch 1411 and an impact unit 1412. A part of the punch 1411 is disposed within the impact unit 1412, and another part of the punch 1411 (e.g., the part with a tip) protrudes from the impact unit 1412. The impact unit 1412 can provide an impact force to the punch 1411, and the impact force is transmitted to the glass cover plate 11 of the electronic device 10 through the punch 1411 to shatter the glass cover plate 11.

[0102] Please refer to Figures 7A - 7D , which shows ​ the operation process diagram of the impactor 141.

[0103] As ​As shown, the impact unit 1412 of the impactor 141 includes a housing 1412A, a first push block 1412B, a first elastic member 1412C, a second push block 1412D, and a second elastic member 1412E. The first push block 1412B, the first elastic member 1412C, the second push block 1412D, and the second elastic member 1412E are disposed within the hollow portion 1412r of the housing 1412A. The housing 1412A includes an abutting portion 1412A1 that protrudes from its inner wall surface and defines a part of the hollow portion 1412r. The first elastic member 1412C is disposed between the first side of the abutting portion 1412A1 (e.g., the side of the abutting portion 1412A1 close to the firing pin 1411) and the first push block 1412B. The first push block 1412B includes a body 1412B1 and a flange 1412B2, where the flange 1412B2 is connected to the body 1412B1. The first elastic member 1412C is located between the first side of the abutting portion 1412A1 and the flange 1412B2 of the first push block 1412B. The second elastic member 1412E is disposed between the second side of the abutting portion 1412A1 (e.g., the side of the abutting portion 1412A1 away from the firing pin 1411) and the second push block 1412D. The second push block 1412D has opposite first and second end faces 1412D1 and 1412D2, and a groove 1412D3 that extends from the second end face 1412D2 towards the first end face 1412D1. The second elastic member 1412E is located between the end face 1412D1 of the second push block 1412D and the bottom surface 1412b of the hollow portion 1412r.

[0104] As ​ shown, the first elastic member 1412C and the second elastic member 1412E can be in a free state. In some embodiments, the first elastic member 1412C and the second elastic member 1412E are, for example, springs, such as compression springs.

[0105] As ​ shown, when the firing pin 1411 of the impactor 141 moves towards the bottom surface 1412b (e.g., the electronic device 10 pushes the firing pin 1411 towards the bottom surface 1412b), the firing pin 1411 pushes the first push block 1412B towards the bottom surface 1412b. At the same time, the first elastic member 1412C deforms and stores elastic potential energy. When the firing pin 1411 of the impactor 141 moves towards the bottom surface 1412b, the first push block 1412B presses against the second end face 1412D2 of the second push block 1412D to push the second push block 1412D towards the bottom surface 1412b. At the same time, the second elastic member 1412E deforms and stores elastic potential energy.

[0106] As ​As shown, when the second elastic member 1412E deforms to the limit position, the main body 1412B1 of the first push block 1412B slides into the groove 1412D3 through the second end face 1412D2 (for example, a curved surface, an arc surface or a chamfer). When the main body 1412B1 slides into the groove 1412D3, there is a distance H2 between the bottom surface of the groove 1412D3 and the end face of the main body 1412B1, and this distance H2 provides a stroke for the second push block 1412D to impact.

[0107] As ​ shown, since the main body 1412B1 slides into the groove 1412D3, the second elastic member 1412E releases elastic potential energy, driving the second push block 1412D to impact the first push block 1412B, so as to generate an impact force that is transmitted to the electronic device 10 through the first push block 1412B and the ejector pin 1411. Since there is a distance H2 between the bottom surface of the groove 1412D3 and the end face of the main body 1412B1, this distance H2 enables the second push block 1412D to impact the first push block 1412B at a certain speed (based on the elastic potential energy released by the second elastic member 1412E). When the impact force is transmitted to the electronic device 10, the glass cover plate 11 of the electronic device 10 can be broken.

[0108] During the process of applying an impact force to the electronic device 10, the first elastic member 1412C and the second elastic member 1412E perform reciprocating motions and generate vibrations. The elastic members can increase the stiffness (K value) of the overall (or system) impactor 141 to increase the system oscillation period. The increase in the oscillation period enables the glass cover plate 11 of the electronic device 10 to withstand vibrations for a longer time, which helps the separation and / or fragmentation of the glass cover plate 11 from the body 12. In some embodiments, the electronic device 10 can be pressed against the impactor 141 of the separation device 140 for a period of time. In this way, the impact force transmitted to the electronic device 10 can last for a period of time (for example, several seconds), enabling the vibrations to be transmitted to the entire glass cover plate 11 to break the entire glass cover plate 11 as much as possible, so that the glass cover plate fragments remaining on the body 12 are minimized or even none.

[0109] Please refer to ​ , which shows a schematic diagram of the electronic device 10 with impact points distributed on ​ . The impact point P represents the position where the impactor 141 impacts the electronic device 10. Multiple impact points P can be distributed approximately evenly. The distribution manner of the multiple impact points P is determined, for example, in the following manner (or effect): the glass cover plate 11 can be completely broken and the fragmented pieces still retain a certain size. The fragmented pieces with a certain size are beneficial for subsequent storage, transportation and / or processing. As long as the foregoing effects can be obtained, the embodiments of the present disclosure do not limit the number and / or position of the multiple impact points P.

[0110] Please refer to ​ and ​ ,​ Shown ​ Flowchart of a glass cover disassembly method of the glass cover disassembly device 100, and ​ Shown ​ FIG. 1 is a diagram showing a process of disassembling the glass cover 11 and the body 12 of the electronic device 10 using the glass cover disassembly apparatus 100 .

[0111] In step S110, ​ and 10B As shown, the cooling device 120 cools the adhesive layer 13 of the electronic device 10. For example, when the conveying device 110 conveys the carrier 114 to the cooling zone 120R, ​ The injection pipes 121A and 121B respectively provide the cooling fluid CL to the second recesses 114r2A and 114r2B for a first period of time. ​ Then, as ​ As shown, ​ Injection pipes 121C and 121D respectively supply cooling fluid CL to the second recesses 114r2C and 114r2D for a second period of time. After entering the second recesses, the cooling fluid CL flows toward the first recess 114r1. The first and second periods of time may be the same or different. For example, the first period of time may be several seconds (e.g., 1 to 10 seconds), while the second period of time may be several seconds (e.g., 1 to 10 seconds).

[0112] In this embodiment, during a cooling process, the first injection tube group (e.g., injection tubes 121A and 121B) and the second injection tube group (e.g., injection tubes 121C and 121D) each provide cooling fluid CL to the susceptor 114 once at two different times. However, in other embodiments, during a cooling process, the first injection tube group may provide cooling fluid CL to the susceptor 114 at least once, and / or the second injection tube group may provide cooling fluid CL to the susceptor 114 at least once. As long as the cooling fluid CL can fully distribute to the first recess 114r1 within a predetermined time, the embodiments of the present invention do not limit the number of times and / or duration that the injection tube group or the injection tubes provide cooling fluid CL to the susceptor 114.

[0113] After the cooling fluid CL fills the first recess 114r1, it can contact the electronic device 10 (shown in FIG. ​ ) of the glass cover 11 (shown in ​ ), to reduce the adhesive layer 13 of the electronic device 10 (shown in ​ When the temperature of the adhesive layer 13 drops below its glass transition temperature, its adhesion will be significantly weakened, and the adhesive layer 13 will also turn into a hard and brittle solid.

[0114] In step S120, ​As shown, after the cooling process is completed, the conveying device 110 continues to convey the electronic device 10 forward along the -X axis until it is positionally corresponding to the extraction device 130, for example, the electronic device 10 is located in the area 130R. Specifically, from the perspective of the 10C, the electronic device 10 and the extraction device 130 overlap along the Y axis.

[0115] In step S130, as ​ shown, the extraction device 130 extracts the electronic device 10 and approaches the separation device 140.

[0116] For example. As ​ shown, the second driver 1331 of the second translation driving unit 133 drives the second movable rod 1332 to move along the +Y axis, so as to drive the first translation driving unit 132 and the robotic arm 131 to move synchronously along the +Y axis until the robotic arm 131 overlaps with the electronic device 10 along the Z axis (for example, the robotic arm 131 is directly above the electronic device 10).

[0117] As ​ shown, the first driver 1321 of the first translation driving unit 132 drives the first movable rod 1322 to move along the -Z axis, so as to drive the robotic arm 131 to move synchronously along the -Z axis until the four jaws 1311 of the robotic arm 131 (due to the perspective, ​ only two can be seen) enter the four second recesses of the carrier 114 (i.e., 114r2A, 114r2B, 114r2C, and 114r2D). After the jaws 1311 enter the second recesses of the carrier 114, these jaws 1311 grip the electronic device 10.

[0118] Although not shown, the robotic arm 131 further includes a driving device (for example, a motor, a pneumatic cylinder, or a combination thereof), which is connected to the jaws 1311. The driving device can be arranged in the space between the connecting plate 1315 and the chuck 1312. Before gripping, the driving device can drive the jaws 1311 to move relative to the chuck 1312 along the -Z axis and / or the Y axis shown in the figure, so that during the process of the robotic arm 131 descending along the -Z axis, the jaws 1311 will not interfere with the electronic device 10 and can face the two sides and the lower surface of the electronic device 10. After the jaws 1311 enter the second recesses of the carrier 114, the driving device can drive the jaws 1311 to move relative to the chuck 1312 along the +Z axis and / or the Y axis shown in the figure until the electronic device 10 is gripped. In addition, when these jaws 1311 grip the electronic device 10, the elastic member 1314 can provide a pressing force to the chuck 1312 (due to the deformation of the elastic member 1314) to more firmly fix the relative positions among the electronic device 10, the chuck 1312, and the jaws 1311.

[0119] As ​As shown, after the electronic device 10 is clamped, the first driver 1321 of the first translation driving unit 132 drives the first movable rod 1322 to move along the +Z axis, so as to drive the robotic arm 131 to move along the +Z axis synchronously, and the electronic device 10 is separated from the carrier 114.

[0120] As ​ shown, the second driver 1331 of the second translation driving unit 133 drives the second movable rod 1332 to move along the -Y axis, so as to drive the first translation driving unit 132 and the robotic arm 131 ( ​ the robotic arm 131 is not visible) to move along the -Y axis synchronously until the second translation driving unit 133 and the separating device 140 overlap along the X axis.

[0121] As ​ shown, the rotating unit 134 drives the second translation driving unit 133 to rotate around the +Y axis, so as to drive the first translation driving unit 132 and the robotic arm 131 to rotate around the +Y axis synchronously until the electronic device 10 is aligned with the separating device 140.

[0122] As ​ and 10I2 shown, the first driver 1321 of the first translation driving unit 132 drives the first movable rod 1322 to move along the -X axis, so as to drive the robotic arm 131 to move along the +X axis synchronously until the electronic device 10 abuts against (or contacts) the striker 1411 of the striker 141 of the separating device 140. At this time, the state of the striker 141 is as ​ shown.

[0123] When the electronic device 10 presses against the striker 1411 of the striker 141 of the separating device 140, the first driver 1321 of the first translation driving unit 132 can continue to drive the first movable rod 1322 to move along the -X axis, so that the second elastic member 1412E of the striker 141 is deformed, as ​ shown. When the first driver 1321 of the first translation driving unit 132 continues to drive the first movable rod 1322 to move along the -X axis, the body 1412B1 of the first push block 1412B of the striker 141 slides into the groove 1412D3 through the second end face 1412D2, as ​ shown.

[0124] As ​ shown, ​The second elastic member 1412E shown releases elastic potential energy to drive the second pushing block 1412D to impact the first pushing block 1412B, so as to generate an impact force that is conducted to the electronic device 10 through the first pushing block 1412B and the firing pin 1411. When the impact force is conducted to the electronic device 10, the glass cover plate 12 of the electronic device 10 can be broken. The broken glass cover plate 11' falls downward to the glass collection area 160. Due to the first elastic member 1412C and the second elastic member 1412E of the impactor 141 (shown in FIG. 7A) and the elastic member 1314 of the robotic arm 131 (shown in ​ ), the stiffness (K value) of the system can be increased, thereby increasing the oscillation period of the system, so that the glass cover plate 11 of the electronic device 10 bears vibration for a longer time, which helps the separation and / or fragmentation of the glass cover plate 11 from the body 12. In some embodiments, when the glass cover plate 12 is detached from the body 12, the elastic member 1314 can continuously provide a pressing force to the chuck 1312, so that the body 12 is still clamped between the chuck 1312 and the jaw 1311.

[0125] In some embodiments, the glass collection area 160 is, for example, an opening or a recess in the base of the glass cover plate disassembling device 100. The broken glass cover plate 11' falling in the glass collection area 160 can be transported to the outside of the glass cover plate disassembling device 100 through a conveyor belt (not shown) for recycling.

[0126] As ​ shown, the rotation unit 134 drives the second translation driving unit 133 to rotate around the -Y axis, so as to synchronously drive the first translation driving unit 132 and the robotic arm 131 to rotate around the -Y axis until the electronic device 10 and the body collection area 170 overlap along the Z axis (for example, the electronic device 10 is directly above the body collection area 170).

[0127] As ​ shown, the jaw 1311 of the robotic arm 131 releases the electronic device 10, causing the electronic device 10 to fall. The falling electronic device 10 can land in the body collection area 170. The body collection area 170 is, for example, an opening or a recess in the base of the glass cover plate disassembling device 100. The body 12 falling in the body collection area 170 can be transported to the outside of the glass cover plate disassembling device 100 through a conveyor belt (not shown) for recycling or scrapping.

[0128] In addition, the robotic arm 131, the first translation driving unit 132, the second translation driving unit 133, and the rotation unit 134 of the aforementioned extraction device 130 can be controlled by the aforementioned controller 150 to execute the aforementioned program of extracting the electronic device 10.

[0129] In summary, the embodiments of the present invention provide a glass cover plate disassembling device and a glass cover plate disassembling method. After placing an electronic device in the glass cover plate disassembling device (for example, a carrier plate), the glass cover plate of the electronic device and the body are disassembled automatically throughout the process. In some embodiments, since the glass cover plate disassembling device and the glass cover plate disassembling method of the embodiments of the present invention use a robotic arm to clamp the electronic device, they can be applied to a curved electronic device or a flexible electronic device.

[0130] In conclusion, although the present invention is disclosed as above in embodiments, it is not intended to limit the present invention. Those of ordinary skill in the art to which the present invention pertains can make various modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the appended claims.

Claims

1. A glass cover plate disassembling device for disassembling the glass cover plate and the body of an electronic device, characterized in that, The electronic device further includes an adhesive layer for bonding the glass cover plate to the body, and the glass cover plate disassembling device includes: a cooling device for cooling the adhesive layer; and a separating device for separating the cooled glass cover plate from the body.

2. The glass cover plate disassembling device according to claim 1, wherein The cooling device is further configured to: supply a cooling fluid to the glass cover plate to cool the adhesive layer.

3. The glass cover plate disassembling device according to claim 1, further comprising: a conveying device for conveying the electronic device to a position corresponding to the cooling device.

4. The glass cover plate disassembling device according to claim 3, characterized in that, The conveying device includes: a conveyor belt; and rollers connected to the conveyor belt and configured to drive the conveyor belt to move; wherein a carrier plate is fixed on the conveyor belt and configured to carry the electronic device.

5. The glass cover plate disassembling device according to claim 3, wherein, The glass cover plate disassembling device further includes: a carrier plate having a first recess and at least one second recess communicating with each other, the first recess being configured to receive the electronic device, and the at least one second recess being connected to one side of the first recess.

6. The glass cover plate disassembling device according to claim 5, characterized in that, The carrier plate further includes: a protrusion protruding relative to the bottom surface of the first recess and having a free end surface for abutting against the electronic device.

7. The glass cover plate disassembling device according to claim 5, characterized in that, The cooling device further includes an injection pipe for supplying the cooling fluid to the at least one second recess.

8. The glass cover plate disassembling device according to claim 5, wherein, The glass cover plate disassembling device further includes: an extraction device for extracting the electronic device through the second recess.

9. The glass cover plate disassembling device according to claim 1, wherein, The glass cover plate disassembling device further includes: an extraction device for: extracting the electronic device; and driving the electronic device to approach the separating device; wherein the separating device is further configured to: impact the glass cover plate when the electronic device presses against the separating device.

10. The glass cover plate disassembling device according to claim 9, wherein, The extraction device is further configured to: press the electronic device against the separating device for a period of time when the separating device impacts the glass cover plate.

11. The glass cover plate disassembling device according to claim 9, wherein, The separating device further includes: an impactor for applying an impact force to the glass cover plate of the electronic device.

12. The glass cover plate disassembling device according to claim 11, wherein, The impactor further includes: an impact unit; and a firing pin, a part of the firing pin being disposed within the impact unit and another part of the firing pin protruding from within the impact unit; wherein the impact unit is configured to provide the impact force to the firing pin.

13. The glass cover plate disassembling device according to claim 9, characterized in that, The extraction device further includes: a robotic arm for: clamping the electronic device; a first translational drive unit connected to the robotic arm and configured to: drive the robotic arm to approach the electronic device; and drive the robotic arm to approach the separating device; a second translational drive unit connected to the first translational drive unit and configured to: drive the first translational drive unit to align with the separating device; a rotating unit connected to the second translational drive unit and configured to: rotate the second translational drive unit to align the robotic arm with the separating device.

14. The glass cover plate disassembling device according to claim 1, characterized in that, The glass cover plate disassembling device further includes: a glass collection area located directly below the separating device and configured to collect the separated glass cover plate.

15. A method for disassembling a glass cover plate, characterized in that, The glass cover plate disassembling method includes: cooling, by a cooling device, an adhesive layer of an electronic device, wherein the adhesive layer bonds a body of the electronic device to a glass cover plate; and separating, by a separating device, the cooled glass cover plate from the body.

16. The glass cover plate disassembly method according to claim 15, characterized in that, The glass cover plate disassembling method further includes: the cooling device supplying a cooling fluid to the glass cover plate to cool the adhesive layer.

17. The glass cover plate disassembly method according to claim 15, wherein The glass cover plate disassembling method further includes: a conveying device conveying the electronic device to a position corresponding to the cooling device.

18. The glass cover plate disassembly method according to claim 15, wherein The method for disassembling the glass cover plate further includes: The extraction device extracts the electronic device and drives the electronic device close to the separation device; and When the electronic device presses against the separation device, the separation device impacts the glass cover plate.

19. The glass cover plate disassembly method according to claim 18, wherein, The method for disassembling the glass cover plate further includes: When the separation device impacts the glass cover plate, the extraction device presses the electronic device against the separation device for a period of time.

20. The glass cover plate disassembly method according to claim 19, wherein, The extraction device includes a robotic arm, a first translation driving unit, a second translation driving unit, and a rotation unit; The method for disassembling the glass cover plate further includes: The first translation driving unit drives the robotic arm close to the electronic device; The robotic arm clamps the electronic device; The second translation driving unit drives the first translation driving unit to move and align with the separation device; and The rotation unit rotates the robotic arm to align with the separation device.

Images