Robot station coordinate calibration method and system and storage medium

Abstract

The invention provides a robot station coordinate calibration method and system and a storage medium, and the method comprises the steps: S1, enabling a robot to go to a wafer station to take out a wafer according to the initial polar coordinates of a wafer station and the polar coordinates of an aligner station, and conveying the wafer to an aligner; s2, the aligner detects the eccentricity of the wafer and rotates and resets the wafer, and the wafer is taken out by the robot and sent back to a wafer station; s3, the wafer eccentricity is converted into wafer eccentricity coordinates relative to a robot world coordinate system; s4, the initial polar coordinates of the wafer station are converted into Cartesian coordinates under a robot world coordinate system, the robot is corrected and reversely demonstrated through wafer eccentric coordinates, and therefore in the working environment, the robot is automatically demonstrated through a wafer aligner in the vacuum chamber, and the work efficiency of the robot is improved. Therefore, robot accumulative errors caused by manual and environmental factors in the prior art are solved.

Description

Technical Field

[0002] The present invention relates to the field of semiconductor manufacturing technology, and in particular, to a method and system for calibrating the coordinates of a robot workstation based on the feedback of a wafer aligner, and a storage medium. Background Art

[0004] In the field of semiconductor manufacturing, wafer handling is a core link in key processes such as lithography, etching, and ion implantation, and its positioning accuracy directly affects the chip yield. The process processing requirements for semiconductor wafers (especially 300mm wafers) require the workstation coordinate accuracy to reach within ±5um, and the traditional teaching method has been difficult to meet this requirement.

[0005] Currently, the workstation teaching of clean robots generally relies on manual operations. For example, an operator observes the coincidence degree between the scale line of the end effector of the robot (such as a vacuum chuck) and the edge of the wafer in the chamber through the naked eye, and manually inputs or adjusts the workstation coordinates. However, the resolution accuracy of the human naked eye is generally only about ±0.5mm, so it is far lower than the micron-level accuracy required by the process, which often leads to problems such as angular deviation or position deviation of the wafer during transmission.

[0006] Therefore, under the high-precision calibration requirements of core process equipment, there are generally insurmountable limitations in manual teaching through tooling. In addition, traditional tooling teaching must be carried out in a non-working environment with the vacuum chamber open. Once the chamber is opened, the internal temperature will drop suddenly from the high temperature during the process operation to normal temperature, and the pressure will also recover from the vacuum state to normal pressure. Such a drastic temperature and pressure change not only destroys the actual working conditions of high temperature and vacuum in the semiconductor production line, but more importantly, with the process upgrade, the temperature gradient of up to dozens of degrees Celsius between different chambers will cause a significant mechanical thermal expansion effect. When the equipment returns to the working state, the workstation coordinates determined by tooling teaching in the early stage will shift due to thermal expansion.

[0007] It can be seen that in advanced process equipment, this micron-level cumulative error caused by environmental differences simply cannot be corrected through tooling teaching after being observed by the human naked eye. Summary of the Invention

[0009] For this reason, the main object of the present invention is to provide a method and system for calibrating the coordinates of a robot workstation, and a storage medium, so as to automatically teach the robot by using a wafer aligner in the same vacuum chamber in the working environment, thereby solving the cumulative error of the robot caused by manual and environmental factors.

[0010] To achieve the above object, according to one aspect of the present invention, a method for calibrating the coordinates of a robot workstation is provided, and its steps include:

[0011] In step S1, according to the initial polar coordinates of the wafer station and the polar coordinates of the aligner station, the robot is commanded to go to the wafer station to pick up the wafer and send it to the aligner.

[0012] In step S2, the aligner detects the eccentricity of the wafer and rotates the wafer to reset it, and then the robot picks it up and sends it back to the wafer station.

[0013] In step S3, the wafer eccentricity is converted into the wafer eccentricity coordinates relative to the robot world coordinate system.

[0014] In step S4, the initial polar coordinates of the wafer station are converted into Cartesian coordinates in the robot world coordinate system, and the robot is reverse-taught by correcting with the wafer eccentricity coordinates.

[0015] In a possible preferred embodiment, the conversion step of the wafer eccentricity coordinates includes:

[0016] Read the polar coordinates of the aligner station ( , ), and convert the station angle parameter into radians :

[0017] Calculate the wafer eccentricity ( , ) relative to the wafer eccentricity angle in the aligner coordinate system, and according to convert to the robot world coordinate system to obtain the wafer eccentricity angle :

[0018] Calculate the offset of the wafer in the aligner coordinate system ; according to and calculate the wafer eccentricity coordinates ( , ) relative to the robot world coordinate system:

[0019] .

[0020] In a possible preferred embodiment, the step of converting the initial polar coordinates of the wafer station to Cartesian coordinates in the robot world coordinate system includes:

[0021] Read the initial polar coordinates of the wafer station ( ), and convert the station angle parameter into radians ;

[0022] Calculate

[0023] Get the initial Cartesian coordinates of the wafer station in the robot world coordinate system ( , ).

[0024] In a possible preferred embodiment, the step of correcting the initial polar coordinates of the wafer station by using the wafer eccentric coordinates includes:

[0025] According to the wafer eccentricity coordinates relative to the robot world coordinate system ( , ), correct the initial coordinates of the wafer station ( , ), to obtain the corrected wafer station coordinates ( , ):

[0026]

[0027] The corrected wafer station coordinates ( , ) to polar coordinates ( , ).

[0028] In a possible preferred embodiment, the robot workstation coordinate calibration method further comprises the following steps:

[0029] In step S5, the robot goes to the wafer station according to the corrected wafer station polar coordinates, takes out the wafer, and sends it to the aligner; after the aligner detects the eccentricity of the wafer, if it is judged that it exceeds the expected error value, the above steps S3 to S4 are repeated for iterative teaching correction.

[0030] In a possible preferred embodiment, the robot workstation coordinate calibration method further comprises the following steps:

[0031] After the teaching is completed in step S6, the current environmental parameters are recorded as the reference values;

[0032] When step S7 is working, the current environmental parameters are compared with the reference values. If they are within the threshold range, the polar coordinates of the wafer station are dynamically compensated based on the preset compensation model.

[0033] In a possible preferred embodiment, the threshold determination step includes:

[0034] Compare the current ambient temperature T, pressure P and the reference ambient temperature ,pressure Make comparisons;

[0035] If the temperature difference , and the pressure difference , it is considered to be within the threshold range.

[0036] In a possible preferred embodiment, the step of dynamically compensating the polar coordinates of the wafer station based on a preset compensation model includes:

[0037] Calculating the thermal expansion compensation value in the R-axis direction of the robot , and the pressure compensation value :

[0038]

[0039]

[0040] Where is the thermal expansion coefficient of the robot, is the robot deviation model, and k is the differential pressure deformation coefficient;

[0041] Calculating Dynamically compensating the polar radius parameter of the polar coordinates of the wafer station, where is the polar radius parameter of the polar coordinates of the wafer station before compensation.

[0042] In a possible preferred embodiment, the step of dynamically compensating the polar coordinates of the wafer station based on a preset compensation model further includes:

[0043] If step S8 exceeds the threshold range, the robot is commanded to follow a predetermined process action and steps S1 to S4 are executed in a timely manner.

[0044] To achieve the above object, corresponding to the above method, according to another aspect of the present invention, there is also provided a robot station coordinate calibration system, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, where when the processor executes the computer program, the system implements the steps of any one of the above robot station coordinate calibration methods.

[0045] To achieve the above object, corresponding to the above method, according to another aspect of the present invention, there is also provided a computer-readable storage medium, the computer-readable storage medium stores a computer program, where when the computer program is executed, the steps of any one of the above robot station coordinate calibration methods are implemented.

[0046] Through the robot working position coordinate calibration method, system and storage medium provided by the present invention, the offset detection data of the wafer aligner is ingeniously utilized and inversely mapped into the robot world coordinate system to construct a full closed-loop control process of "wafer picking - detection - back - inference - calibration", realizing the automatic correction of cross-system errors from "wafer working position calibration" to "robot working position calibration", effectively replacing manual operation, directly calibrating in the actual working environment of high temperature and vacuum, bypassing the transmission of environmental errors, thus being unaffected by the changes in chamber temperature and pressure during teaching and work, and overcoming the robot cumulative errors caused by existing manual and environmental factors. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0049] Figure 1 It is a schematic diagram of the steps of the robot working position coordinate calibration method of the present invention;

[0050] Figure 2 It is an example diagram of the layout structure of a traditional wafer handling and inspection unit;

[0051] Figure 3 It is a schematic diagram of the structure of the robot working position coordinate calibration system of the present invention.

[0052] DESCRIPTION OF THE REFERENCE NUMERALS

[0053] Transfer chamber 1, robot 2, aligner 3, wafer working position 4, vacuum gauge 6, temperature sensor 7. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0055] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will clearly and completely describe the specific technical solutions of the present invention in combination with embodiments to help those skilled in the art further understand the present invention. Obviously, the embodiments described in this case are only a part of the embodiments of the present invention, rather than all the embodiments. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention and without conflict with each other, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the scope of disclosure and protection of the present invention.

[0056] In addition, in the description, claims and drawings of the present invention, terms such as "first", "second", "S1", "S2", etc. are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the features used in this way can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those described herein. At the same time, the stages recorded in each step are not necessarily implemented in the same step. It should be understood that the implementation order of the content in each step stage can be adjusted and interchanged without violating the inventive concept so that the step embodiments of the present invention described herein can be implemented in an order other than those described herein. In addition, the terms "comprising" and "having" in the present invention and any variations thereof are intended to cover non-exclusive inclusion. Unless otherwise clearly specified and limited, the terms "set", "arranged", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this case can be understood according to specific circumstances and in combination with the prior art.

[0057] Considering that traditional tooling teaching needs to be carried out in a non-working environment after the vacuum chamber is opened, the sudden change in temperature and pressure will cause mechanical thermal expansion effects, resulting in the offset of the station coordinates during actual work. At the same time, traditional manual teaching relies on the naked eye to observe the coincidence degree between the end effector of the robot and the edge of the wafer, so the accuracy is relatively low, far lower than the ±5μm required by the semiconductor process.

[0058] Therefore, in order to solve the cumulative error of the robot caused by manual and environmental factors, such as Figures 1 to 2 As shown, the present invention provides a method for calibrating the robot station coordinates, and its exemplary steps include:

[0059] In step S1, according to the initial polar coordinates of the wafer station and the polar coordinates of the aligner station, the robot is commanded to go to the wafer station to pick up the wafer and send it to the aligner.

[0060] Among them, in order to better illustrate the implementation process of this example, as Figure 2 As shown, an exemplary layout structure of a traditional wafer handling and inspection unit is shown, where the robot is fixed in the transfer chamber, and the aligner and the wafer station are respectively arranged in the side chambers communicating with the transfer chamber. The end effector of the robot can move between the wafer station and the aligner, and the polar coordinates of the aligner and the initial polar coordinates of the wafer station are stored in the robot control parameters.

[0061] Taking this structure as an example, when starting the calibration work, first make the robot go to the wafer station to pick up the wafer according to the initial polar coordinates of the wafer station recorded, and then send it to the aligner for detection according to the polar coordinates of the aligner.

[0062] In step S2, the aligner detects the eccentricity of the wafer and rotates the wafer to reset it, then the robot picks it up and sends it back to the wafer station.

[0063] Specifically, in order to be able to carry out automatic calibration work in the working environment where the transfer chamber is closed, the concept of the present invention is to consider using the aligner in the vacuum chamber to reverse the calibration of the robot station by collecting the eccentric position of the wafer. However, for those skilled in the art, usually the aligner is mainly used to detect the offset of the wafer itself, rotate the mark port of the wafer to the specified direction, and give data for the robot to pick up the wafer correctly and send it to the next station. Therefore, under the existing conventional operations, the aligner cannot be used to correct the robot station coordinates, nor can it ensure that the corrected value can act correctly on the wafer station.

[0064] For this reason, in the present invention, through an unconventional control method, the aligner is made to rotate 360° when detecting the eccentricity of the wafer, so as to reset the wafer while obtaining the eccentricity of the wafer. At this time, the position of the wafer on the aligner is basically the same as that before placement. After that, in order to avoid the inability to align the station coordinates after the robot teaching for the current wafer, before the robot completes the teaching, the robot first picks it up and sends it back to the wafer station.

[0065] In step S3, the wafer eccentricity is converted into the wafer eccentric coordinates relative to the robot world coordinate system.

[0066] Specifically, at this time, the wafer eccentricity has been obtained through step S2, and the wafer has also returned to the wafer station. At this time, the teaching calculation can be started. The conversion steps of the wafer eccentric coordinates include, for example:

[0067] In step S31, read the polar coordinates of the aligner station ( , ), and convert the station angle parameter into radians . Taking the unit of as 0.001 degree as an example, then is calculated as:

[0068] .

[0069] In step S32, calculate the wafer eccentric angle , of the wafer eccentricity ( ) relative to the aligner coordinate system:

[0070] 。

[0071] Step S33, according to convert to the robot world coordinate system to obtain the wafer eccentricity angle :

[0072] 。

[0073] Step S34 converts the offset in the aligner local coordinates to the correction value in the robot world coordinates, that is, first calculates the offset of the wafer in the aligner coordinate system :

[0074] 。

[0075] According to and calculate the wafer eccentricity coordinates relative to the robot world coordinate system ( , ):

[0076] 。

[0077] Step S4 converts the initial polar coordinates of the wafer station to Cartesian coordinates in the robot world coordinate system and corrects them through the wafer eccentricity coordinates.

[0078] Specifically, after obtaining the correction value in the robot world coordinates through the above steps, the accurate correction of the station coordinates can be achieved through mathematical transformation, eliminating the deviation caused by manual teaching and environmental factors.

[0079] The example steps of converting the initial polar coordinates of the wafer station to Cartesian coordinates in the robot world coordinate system include:

[0080] Step S41 reads the initial polar coordinates of the wafer station ( ), and converts the station angle parameter to radians , where taking with the unit of 0.001 degree as an example:

[0081]

[0082] Step S42 performs Cartesian coordinate conversion calculation on the wafer station:

[0083]

[0084] In this way, the initial Cartesian coordinates of the wafer station in the robot world coordinate system ( , ) are obtained.

[0085] Examples of the steps for correcting the initial polar coordinates of the wafer station through the wafer eccentricity coordinates include:

[0086] Step S43 corrects the initial coordinates of the wafer station ( , ) according to the wafer eccentricity coordinates ( , ) relative to the robot world coordinate system to obtain the corrected wafer station coordinates ( , ):

[0087]

[0088] Step S44 finally converts the corrected wafer station coordinates ( , ) into polar coordinates ( , ):

[0089]

[0090]

[0091] Thus, through the above example steps, the local offset (X / Y) detected by the wafer on the aligner can be converted into the correction value of the station coordinates in the robot world coordinate system, thereby realizing the cross-system error correction from "wafer position calibration" to "robot station calibration". This overcomes the traditional calibration method of manually teaching the station coordinates and realizes calibration in the actual working environment, correcting the initial station coordinates when the robot picks up the wafer from the source, and avoiding the transmission of "human error → environmental motion error → process error".

[0092] In addition, through the above automatic calibration scheme, the single-station calibration time can be shortened from 5 - 10 minutes in the traditional method to within 10 seconds (fully automated process of wafer picking - detection - calculation - correction), avoiding repeated manual debugging, adapting to the 24-hour continuous production requirements of the semiconductor production line, and excluding the teaching error in different environments during the calibration process in the high-temperature and vacuum environment of actual work. More importantly, since the overall scheme utilizes the existing wafer aligner in the production line, there is no need to additionally install other laser or vision sensors, and the implementation threshold is extremely low, making it applicable to traditional wafer handling and inspection units.

[0093] Furthermore, considering that in actual applications, there may be deviations in the accuracy of single calibration, therefore, in order to implement the accuracy verification and correction functions, in an alternative implementation, the machine station coordinate calibration method, where the example steps further include:

[0094] In step S5, the robot goes to the wafer station according to the corrected polar coordinates of the wafer station to pick up the wafer and send it to the aligner. After the aligner detects the eccentricity of the wafer, when it is determined that the deviation exceeds the expected error value (for example, the error exceeds 5 μm), the aforementioned steps S3 to S4 are repeated for iterative (preferably up to 3 times) teaching correction. This ensures the accuracy after calibration.

[0095] Furthermore, considering that when the vacuum robot is running, the real-time change in the pressure difference between the vacuum side and the atmosphere side will also cause continuous small deformations of mechanical components. Coupled with the thermal expansion effect caused by the temperature fluctuation in the transfer chamber (the temperature difference between different process chambers can reach 30 degrees Celsius, and the opening and closing of the process chamber valves cause heat exchange), in such cases, real-time fluctuation deviations will also occur between the actual coordinates of the robot joints and end effectors and the theoretical values.

[0096] Therefore, in order to minimize the impact of the accuracy caused by this fluctuation deviation, it is necessary to automatically perform real-time compensation on the robot working position parameters for environmental fluctuations when the equipment is working normally according to the process requirements. Considering that vacuum gauges and temperature sensors are generally provided in traditional wafer handling inspection units (they can also be installed later), in an alternative embodiment, the method for calibrating the robot working position coordinates further includes the following steps:

[0097] In step S6, after the teaching is completed, the current environmental parameters, such as temperature and pressure are recorded as reference values.

[0098] During operation, such as during the wafer loading and unloading process, in step S7, temperature / pressure fluctuation judgment is performed, and the current environmental parameters are compared with the reference values. If it is within the threshold range, the polar coordinates of the wafer station are dynamically compensated based on a preset compensation model.

[0099] Specifically, the threshold judgment step includes the following steps:

[0100] In step S71, the current environmental temperature T and pressure P are compared with the environmental temperature and pressure of the reference value:

[0101]

[0102]

[0103] If the temperature difference , and the pressure difference , it is considered to be within the threshold range. At this time, the fluctuation amplitude within this range is small, and it is easy to reduce the deviation impact through compensation.

[0104] The step of dynamically compensating the polar coordinates of the wafer station based on a preset compensation model includes the following steps:

[0105] Step S72 Calculate the thermal expansion compensation value in the R-axis direction of the robot , and the pressure compensation value :

[0106]

[0107]

[0108] Wherein is the thermal expansion coefficient of the robot, is the deviation model of the robot, and k is the differential pressure deformation coefficient;

[0109] Step S73 Calculate Dynamically compensate the polar radius parameter of the polar coordinates of the wafer station, where is the polar radius parameter of the polar coordinates of the wafer station before compensation, and the subsequent robot performs the wafer picking and placing actions according to the new station coordinates.

[0110] So far, during the entire working process, the equipment can automatically compensate the station parameters of the robot according to the real-time collected temperature / pressure data to eliminate the systematic error caused by environmental changes in real time. Generally, the error after compensation can be ≤±4um.

[0111] Furthermore, if the temperature difference , the pressure difference exceeds the threshold range, it is considered at this time that the environmental fluctuation changes violently and the deviation impact cannot be solved through compensation. Therefore, in an alternative implementation, the step of dynamically compensating the polar coordinates of the wafer station based on the preset compensation model further includes:

[0112] Step S8 If it exceeds the threshold range, make the robot follow the predetermined process actions and timely execute Steps S1 to S4.

[0113] For example, when the robot picks up the wafer, after detecting that the temperature / pressure fluctuation exceeds the threshold, follow the predetermined process actions, intervene in a timely manner and execute Steps S1 to S4 to perform a new station calibration update without iterative operation. This step does not affect the process flow, can be inserted or follow the process steps, and has little impact on the production rhythm.

[0114] Furthermore, corresponding to the above method embodiments, the present invention also provides a robot station coordinate calibration system, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the system implements the steps of the robot station coordinate calibration method described in any one of the above examples.

[0115] Furthermore, corresponding to the above method embodiments, the present invention also provides a computer-readable storage medium storing a computer program, which when executed, implements the steps of the robot work position coordinate calibration method as described in any one of the above examples.

[0116] In summary, through the robot work position coordinate calibration method, system and storage medium provided by the present invention, the offset detection data of the wafer aligner is ingeniously utilized and inversely mapped into the robot world coordinate system to construct a full closed-loop control process of "wafer picking - detection - reverse deduction - calibration", realizing the automatic correction of cross-system errors from "wafer work position calibration" to "robot work position calibration", effectively replacing manual operations, directly calibrating in the actual working environment of high temperature and vacuum, bypassing the transmission of environmental errors, and thus being unaffected by the changes in chamber temperature and pressure during teaching and work, overcoming the cumulative errors of the robot caused by existing manual and environmental factors.

[0117] In addition, in the corresponding implementation manner, the present invention can also enable the robot to automatically compensate for work position parameters according to temperature / pressure fluctuations and generate continuous optimization when the device is working normally according to process requirements. Therefore, the number of downtime calibrations caused by temperature and pressure fluctuations can be reduced, the positioning accuracy can be automatically maintained without manual intervention, and the continuous production requirements of the semiconductor production line for 24 hours can be met.

[0118] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

[0119] Those skilled in the art can understand that, in addition to implementing the systems, devices, units, and their respective modules provided by the present invention in the form of pure computer-readable program codes, the method steps can be logically programmed to enable the systems, devices, units, and their respective modules provided by the present invention to be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, embedded microcontrollers, etc. Therefore, the systems, devices, and their respective modules provided by the present invention can be regarded as a kind of hardware component, and the modules included therein for implementing various programs can also be regarded as the structures within the hardware component; the modules for implementing various functions can also be regarded as either software programs for implementing the methods or the structures within the hardware component.

[0120] In addition, all or part of the steps in the methods of the above embodiments can be completed by a program instructing relevant hardware. The program is stored in a storage medium, including several instructions for enabling a single-chip microcomputer, a chip, or a processor to execute all or part of the steps of the methods described in various embodiments of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs.

[0121] In addition, any combination can be made among various different implementation manners of the embodiments of the present invention, as long as it does not violate the idea of the embodiments of the present invention, and it should also be regarded as the content disclosed by the embodiments of the present invention.

Claims

1. A method for calibrating robot workstation coordinates, comprising the steps of: Step S1: Based on the initial polar coordinates of the wafer station and the polar coordinates of the aligner station, the robot is instructed to go to the wafer station, take out the wafer, and send it to the aligner. Step S2: The aligner detects the eccentricity of the wafer and rotates the wafer to reset it. The robot then takes it out and returns it to the wafer station. Step S3 converts the wafer eccentricity into the wafer eccentricity coordinates relative to the robot world coordinate system; In step S4, the initial polar coordinates of the wafer station are converted into Cartesian coordinates in the robot's world coordinate system, and the robot is taught in reverse by correcting the wafer eccentric coordinates.

2. The robot workstation coordinate calibration method according to claim 1, wherein the step of converting the wafer eccentric coordinates comprises: Read the polar coordinates of the alignment station ( , ), and convert the station angle parameter to radians : Calculate the wafer eccentricity ( , ) with respect to the wafer eccentricity angle in the aligner coordinate system . According to , convert to the robot world coordinate system to obtain the wafer eccentricity angle : Calculate the offset of the wafer in the aligner coordinate system ; According to and calculate the wafer eccentricity coordinates relative to the robot world coordinate system ( , ): 。 3. The robot station coordinate calibration method according to claim 2, wherein the step of converting the initial polar coordinates of the wafer station into Cartesian coordinates in the robot world coordinate system comprises: Read the initial polar coordinates of the wafer station ( ), and convert the station angle parameter to radians ; Calculation ; Obtain the initial Cartesian coordinates of the wafer station in the robot world coordinate system ( , ).

4. The robot workstation coordinate calibration method according to claim 3, wherein the step of correcting the initial polar coordinates of the wafer workstation by using the wafer eccentric coordinates comprises: According to the wafer eccentricity coordinates in the robot world coordinate system ( , ), correct the initial coordinates of the wafer station ( , ) to obtain the corrected wafer station coordinates ( , ): ； Convert the corrected wafer station coordinates ( , ) to polar coordinates ( , ).

5. The robot workstation coordinate calibration method according to claim 1, wherein the steps further include: In step S5, the robot goes to the wafer station according to the corrected wafer station polar coordinates, takes out the wafer, and sends it to the aligner; after the aligner detects the eccentricity of the wafer, if it is judged that it exceeds the expected error value, the above steps S3 to S4 are repeated for iterative teaching correction.

6. The robot workstation coordinate calibration method according to any one of claims 1 to 5, further comprising: After the teaching is completed in step S6, the current environmental parameters are recorded as the reference values; When step S7 is working, the current environmental parameters are compared with the reference values. If they are within the threshold range, the polar coordinates of the wafer station are dynamically compensated based on the preset compensation model.

7. The robot workstation coordinate calibration method according to claim 6, wherein the threshold determination step comprises: Compare the current ambient temperature T and pressure P with the ambient temperature of the reference value and pressure respectively; If the temperature difference , and the pressure difference , it is considered to be within the threshold range.

8. The robot workstation coordinate calibration method according to claim 6, wherein the step of dynamically compensating the wafer workstation polar coordinates based on a preset compensation model comprises: Thermal expansion compensation value in the R-axis direction of the computer robot , and pressure compensation value : ； ； Among them is the thermal expansion coefficient of the robot is the robot deviation model, and k is the differential pressure deformation coefficient; Calculation Dynamically compensate the polar radius parameter of the wafer station in polar coordinates, where is the polar radius parameter of the wafer station in polar coordinates before compensation.

9. The robot workstation coordinate calibration method according to claim 6, wherein the step of dynamically compensating the wafer workstation polar coordinates based on a preset compensation model further comprises: If the value in step S8 exceeds the threshold value, the robot is instructed to follow the predetermined process action and execute steps S1 to S4 in a timely manner.

10. A robot workbench coordinate calibration system, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the system implements the steps of the robot workstation coordinate calibration method according to any one of claims 1 to 9.

11. A computer-readable storage medium storing a computer program, wherein when the computer program is executed, the steps of the robot workstation coordinate calibration method according to any one of claims 1 to 9 are implemented.

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