Plastic uptake process and equipment for producing and forming mobile phone film fixing frame

Abstract

The invention belongs to the technical field of blister equipment, and discloses a blister process for producing and forming a mobile phone film fixing frame, which comprises a frame as a bracket of the whole blister equipment for producing and forming the mobile phone film fixing frame; the first lifting structure is connected to the top end of the inner wall of the frame; the heating plate is connected to the first lifting structure, and the first lifting structure drives the heating plate to vertically move; the second lifting structure is connected to the bottom end of the inner wall of the frame; by means of the overturning structure and the sliding structure, when it is detected that the temperature of the edge is low, the heating wire can be actively close to the edge, the distance between the heating wire and the edge is shortened, heat supply of the edge is increased, the temperature difference between different areas of the heating plate can be effectively reduced, all parts of a machined material are evenly heated, and the machining efficiency is improved. Therefore, the defects of deformation, wrinkles and the like caused by local overheating or supercooling are avoided, and the forming precision of the mobile phone film fixing frame is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thermoforming equipment, and particularly relates to a thermoforming process and equipment for the production and molding of a mobile phone film fixing frame. Background Art

[0002] With the development of the mobile phone market, the demand for personalization is increasing day by day. As an important accessory, the production efficiency and quality of the mobile phone film fixing frame have also become key issues. Therefore, thermoforming equipment is needed. The thermoforming equipment is mainly used to heat plastic sheets and deform and cool them according to the shape of the mold, so as to form various parts with complex structures.

[0003] In the thermoforming equipment, the temperature in the middle of the heating plate is usually higher than that at the edge. This is caused by factors such as the heat transfer method of the heating plate and edge heat dissipation. Relatively speaking, the middle area has fewer heat dissipation paths and more concentrated heat, resulting in a higher temperature, which further causes uneven temperature at the bottom of the heating plate and further affects the production accuracy of the mobile phone film fixing frame. Summary of the Invention

[0004] In view of the problem in the prior art that due to factors such as the heat transfer method of the heating plate and edge heat dissipation, the middle area has fewer heat dissipation paths and more concentrated heat, resulting in a higher temperature, which further causes uneven temperature at the bottom of the heating plate and further affects the production accuracy of the mobile phone film fixing frame, the present invention proposes the following technical solutions:

[0005] A thermoforming equipment for the production and molding of a mobile phone film fixing frame, comprising: a frame, which is a support for the whole thermoforming equipment for the production and molding of the mobile phone film fixing frame;

[0006] A first lifting structure, connected to the top end of the inner wall of the frame;

[0007] A heating plate, connected to the first lifting structure, and the first lifting structure drives the heating plate to move vertically;

[0008] A second lifting structure, connected to the bottom end of the inner wall of the frame;

[0009] A mold, connected to the second lifting structure, and the second lifting structure drives the mold to move vertically;

[0010] An adsorption tube, connected to the mold, for extracting the gas inside the mold;

[0011] The heating assembly includes: a turning plate, heating wires, a turning structure and a sliding structure;

[0012] The flipping plate is connected inside the heating plate. The bottom end of the flipping plate is connected to the heating wire through the sliding structure. The heating wire moves horizontally at the bottom end of the flipping plate through the sliding structure. The flipping plate and the heating plate are connected through the flipping structure, and the flipping structure drives the flipping plate to deflect.

[0013] As a preference of the above technical solution, the flipping structure includes:

[0014] A mounting strip, connected to the heating plate;

[0015] A heat-conducting sleeve, connected to the mounting strip;

[0016] A first telescopic member, connected to the heat-conducting sleeve;

[0017] A convex column, connected to the first telescopic member, and the convex column moves vertically inside the heat-conducting sleeve through the first telescopic member;

[0018] A connecting bar, connected to the convex column;

[0019] A round rod, connected to the connecting bar;

[0020] A placement rack, sleeved on the round rod, and the convex column drives the round rod to move inside the placement rack through the connecting bar.

[0021] As a preference of the above technical solution, a limiting groove that fits the outer diameter of the round rod is provided inside the placement rack. The outer side of the round rod and the inner side of the limiting groove are in mutual contact, and the quantity ratio of the connecting bar to the round rod is two to one.

[0022] As a preference of the above technical solution, the sliding structure includes:

[0023] A slider, connected to the flipping plate;

[0024] A snap ring, connected to the slider;

[0025] A first magnetic block, connected to both ends of the slider;

[0026] A second magnetic block, connected to both sides of the inner wall of the flipping plate. The slider drives the snap ring to move, and the slider drives the first magnetic block to approach the second magnetic block.

[0027] As a preference of the above technical solution, the sliding structure further includes:

[0028] A groove, provided on the slider, and a fixing structure is installed inside the groove, and the fixing structure is used to squeeze the sliding structure.

[0029] As a preference of the above technical solution, the fixing structure includes:

[0030] The heat absorption sleeve is connected to the flipping plate;

[0031] The second telescopic member is connected to the heat absorption sleeve;

[0032] The extrusion column is connected to the second telescopic member;

[0033] The limiting disk is connected to the extrusion column;

[0034] The anti-slip pad is connected to the limiting disk. The second telescopic member drives the extrusion column to move, and the extrusion column drives the anti-slip pad to fit inside the slider through the limiting disk.

[0035] As a preference of the above technical solution, the fixing structure further includes:

[0036] The sleeve disk is connected to the lower part of the extrusion column;

[0037] The ball is connected to the sleeve disk, and the sleeve disk drives the ball to fit inside the slider.

[0038] As a preference of the above technical solution, a through groove is formed at the top end of the flipping plate, and the extrusion column is slidably connected to the inside of the through groove.

[0039] A thermoforming process for a thermoforming device used for the production and molding of a mobile phone film fixing frame includes the following steps:

[0040] Step 1. Equipment preparation: Place the material to be processed on the upper surface of the mold, start the first lifting structure and the second lifting structure, and drive the heating plate and the mold to move towards each other respectively, so that the processing material is located between the heating plate and the mold;

[0041] Step 2. Heating of the processing material: Turn on the heating wire to heat the processing material;

[0042] Step 3. Temperature zone adjustment: Start the flipping structure. The first telescopic member drives the convex column to move vertically in the heat conduction sleeve, drives the placement rack to deflect through the connecting bar and the round stick, so that the flipping plate is inclined; meanwhile, under the action of the inclination of the flipping plate, the slider in the sliding structure drives the snap ring and the heating wire to slide horizontally, and the first magnet moves close to the second magnet along with the slider;

[0043] Step 4. Vacuum forming: Start the adsorption pipe to extract the gas inside the mold to form a negative pressure environment. Under the action of the atmospheric pressure, the heated and softened processing material fits the surface of the mold cavity to complete the preliminary forming of the mobile phone film fixing frame;

[0044] Step 5. Cooling and demolding: Turn off the heating wire, cool the mold. After the processing material is cooled and solidified, turn off the adsorption pipe to release the negative pressure, start the second lifting structure to lower the mold, and take out the formed mobile phone film fixing frame;

[0045] Step 6. Equipment reset: Reset components such as the flipping plate and heating wire to their initial states, clean the equipment, and get it ready for the next production run.

[0046] The beneficial effects of the present invention are as follows:

[0047] (1) Through the flipping structure and the sliding structure, when the temperature at the edge is detected to be low, the heating wire can be actively moved closer to the edge, shortening the distance between the heating wire and the edge, increasing the heat supply to the edge, effectively reducing the temperature difference between different regions of the heating plate, enabling the various parts of the processed material to be evenly heated, thereby avoiding defects such as deformation and wrinkles caused by local overheating or overcooling, and improving the forming accuracy of the mobile phone film fixing frame;

[0048] (2) The heating component avoids the ineffective dissipation and excessive concentration of heat by precisely adjusting the heat distribution. When the heating wire moves closer to the lower-temperature edge as needed, it only targets the area that requires heat supplementation for heating, rather than heating the entire heating plate in a large area and without discrimination like the traditional method, reducing energy waste. During long-term production, it can effectively reduce the enterprise's energy consumption cost;

[0049] (3) Uniform heating can ensure the dimensional accuracy and shape consistency of the mobile phone film fixing frame, reducing the rejection rate. Description of the Drawings

[0050] Figure 1 Shows a schematic structural diagram of a thermoforming device for the production and forming of a mobile phone film fixing frame in Embodiment 1;

[0051] Figure 2 Shows a schematic structural diagram of a thermoforming device for the production and forming of a mobile phone film fixing frame in Embodiment 1;

[0052] Figure 3 Shows a cross-sectional view of the heating plate in Embodiment 1;

[0053] Figure 4 Shows a schematic structural diagram of the installation of the heating wire in Embodiment 1;

[0054] Figure 5 Shows Figure 4 a schematic structural diagram of Area A in

[0055] Figure 6 Shows a schematic structural diagram of the installation of the convex post in Embodiment 1;

[0056] Figure 7 Shows a schematic structural diagram of the installation of the snap ring in Embodiment 1;

[0057] Figure 8 Shows Figure 7 a schematic structural diagram of Area B in

[0058] Figure 9 The cross-sectional view of the heat absorption sleeve in Embodiment 1 is shown;

[0059] Figure 10 Shown is Figure 9 The schematic structural diagram of Region C in

[0060] In the figure: 1, frame; 2, first lifting structure; 3, heating plate; 4, second lifting structure; 5, mold; 6, adsorption tube; 7, limiting frame; 8, flipping plate; 9, heating wire; 101, mounting strip; 102, heat conduction sleeve; 103, first telescopic member; 104, convex column; 105, connecting strip; 106, round rod; 107, placing rack; 111, snap ring; 112, slider; 113, first magnetic block; 114, second magnetic block; 115, groove; 121, heat absorption sleeve; 122, second telescopic member; 123, extrusion column; 124, sleeve disc; 125, ball; 126, limiting disc; 127, anti-slip pad; 13, partition board; 14, positioning column. Specific Embodiment

[0061] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0062] Embodiment 1

[0063] The present invention provides a thermoforming process and equipment for the production and molding of a mobile phone film fixing frame. As Figures 1 to 10 shown, it includes: a frame 1, a first lifting structure 2, a heating plate 3, a second lifting structure 4, a mold 5, an adsorption tube 6, and a heating assembly. The frame 1 serves as the overall support for the thermoforming equipment for the production and molding of the mobile phone film fixing frame; the first lifting structure 2 is connected to the top end of the inner wall of the frame 1; the heating plate 3 is connected to the first lifting structure 2, and the first lifting structure 2 drives the heating plate 3 to move vertically; the second lifting structure 4 is connected to the bottom end of the inner wall of the frame 1; the mold 5 is connected to the second lifting structure 4, and the second lifting structure 4 drives the mold 5 to move vertically; the adsorption tube 6 is connected to the mold 5 and is used to extract the gas inside the mold 5; the heating assembly includes: a flipping plate 8, a heating wire 9, a flipping structure, and a sliding structure; the flipping plate 8 is connected to the inside of the heating plate 3, the bottom end of the flipping plate 8 is connected to the heating wire 9 through the sliding structure, the heating wire 9 horizontally moves at the bottom end of the flipping plate 8 through the sliding structure, and the flipping plate 8 and the heating plate 3 are connected through the flipping structure, and the flipping structure drives the flipping plate 8 to deflect.

[0064] In the plastic suction forming equipment, the temperature in the middle of the heating plate 3 is usually higher than that at the edges. This is caused by factors such as the heat transfer method of the heating plate 3 and edge heat dissipation. Relatively speaking, the middle area has fewer heat dissipation paths compared to the edges, and the heat is concentrated, resulting in a relatively high temperature, which causes the phenomenon of uneven temperature at the bottom end of the heating plate 3. This further affects the production accuracy of the mobile phone film fixing frame. Therefore, a heating component is set. Under the action of the heating component, when the temperature at the edge inside the heating plate 3 is lower than that in the middle, the cooperation of the flipping structure and the sliding structure makes the heating wire 9 approach the edge of the heating plate 3, thereby increasing the distance between the heating source and the heating plate 3, increasing the heat supply to the edge, effectively reducing the temperature difference between different regions of the heating plate 3, making each part of the plastic part evenly heated, and thus avoiding defects such as deformation and wrinkles caused by local overheating or overcooling, and improving the forming accuracy of the mobile phone film fixing frame.

[0065] During use, the raw material moves along the inside of the frame 1. At this time, the raw material enters the bottom end of the heating plate 3. Then the material to be processed enters the upper surface of the mold 5. Start the lifting structure one 2 and the lifting structure two 4, which respectively drive the heating plate 3 and the mold 5 to move towards each other, so that the processing material is located between the heating plate 3 and the mold 5. Continue to operate, so that the heating plate 3 and the mold 5 clamp the processing material. Then start the heating wire 9. When the heating wire 9 operates, heat is generated on the surface of the heating plate 3. Since the heat dissipation efficiency at the edge of the heating plate 3 is greater than that inside, the flipping structure and the sliding structure operate synchronously. When the flipping structure and the sliding structure operate synchronously, they drive the flipping plate 8 to rotate. When the flipping plate 8 rotates, it drives the distance between the heating wire 9 and the bottom end of the inner wall of the heating plate 3 to change, and at the same time changes the position of the heating wire 9.

[0066] Specifically, the lifting structure one 2 is installed at the top end of the inner wall of the frame 1 by screws, and the output end of the lifting structure one 2 is installed with the heating plate 3 by screws. The lifting structure two 4 is installed at the bottom end of the inner wall of the frame 1 by screws, and the output end of the lifting structure two 4 is installed with the mold 5 by screws. The top end of the mold 5 corresponds to the bottom end of the heating plate 3. An adsorption tube 6 is embedded in the middle of the bottom end of the mold 5. One end of the adsorption tube 6 is connected to the intake end of the vacuum adsorption pump. A positioning column 14 is embedded in the middle of the heating plate 3. A flipping plate 8 is rotatably connected to the outside of the positioning column 14. A flipping structure is installed between the top end of the flipping plate 8 and the inner wall of the heating plate 3. The number of the flipping structures is set to four in total. A sliding structure is installed between the heating plate 3 and the heating wire 9. A partition plate 13 is integrally formed in the middle of the heating plate 3. A rounded corner is opened at the bottom end of the partition plate 13. The bottom end of the partition plate 13 and the middle of the top end of the flipping plate 8 are mutually attached. Limit frames 7 are fixedly installed at both positions on both sides of the outlet at one end of the frame 1. The limit frames 7 block the raw material.

[0067] In the present invention, the lifting structure 1 2 and the lifting structure 2 4 belong to linear motion structures, and specifically, the lifting structure 1 2 and the lifting structure 2 4 in the present invention belong to hydraulic lifting structures.

[0068] As Figures 7 to 10 shown, the fixing structure includes: a heat absorption sleeve 121, a second telescopic member 122, an extrusion column 123, a sleeve plate 124, a ball 125, a limit plate 126, and an anti-slip pad 127; the heat absorption sleeve 121 is connected to the flip plate 8; the second telescopic member 122 is connected to the heat absorption sleeve 121; the extrusion column 123 is connected to the second telescopic member 122; the limit plate 126 is connected to the extrusion column 123; the anti-slip pad 127 is connected to the limit plate 126, and the second telescopic member 122 drives the extrusion column 123 to move, and the extrusion column 123 drives the anti-slip pad 127 to fit inside the slider 112 through the limit plate 126; the sleeve plate 124 is connected to the lower part of the extrusion column 123; the ball 125 is connected to the sleeve plate 124, and the sleeve plate 124 drives the ball 125 to fit inside the slider 112.

[0069] Since the position of the heating wire 9 can produce a left-right displacement during the temperature change process, when the device is not in use, it is necessary to fix the heating wire 9 to prevent the position of the heating wire 9 from shaking due to the movement of the device. Therefore, the fixing structure is used to keep the heating wire 9 stable when it is not in use, and to prevent the problem that the heating wire 9 shakes due to mechanical vibration when it is not in use.

[0070] During use, since heat drives the second telescopic member 122 to operate, the second telescopic member 122 expands. When the second telescopic member 122 expands, it moves along the inside of the heat absorption sleeve 121. Since the second telescopic member 122 drives the extrusion column 123 to move when it operates, the extrusion column 123 moves along the inside of the sleeve plate 124 when it moves. At this time, due to the action of gravity, the ball 125 at the bottom end of the sleeve plate 124 fits with the slider 112, and at the same time drives the limit plate 126 to move. When the limit plate 126 moves, it drives the anti-slip pad 127 to separate from the slider 112. Then, when the device is no longer in use, since the heat dissipates, at this time the second telescopic member 122 resets. When the second telescopic member 122 resets, it drives the extrusion column 123 to move. When the extrusion column 123 moves, it drives the anti-slip pad 127 to fit with the slider 112 through the limit plate 126, thereby fixing the slider 112.

[0071] Specifically, the heat absorption sleeve 121 is fixedly installed at the top end of the flip plate 8. The second telescopic member 122 is embedded and installed inside the heat absorption sleeve 121. The top end of the second telescopic member 122 is bonded with the extrusion column 123. The bottom end of the extrusion column 123 is sleeved with the sleeve plate 124. A plurality of balls 125 are embedded and installed at the bottom end of the sleeve plate 124. The outer surface of the extrusion column 123 is fixedly installed with the limit plate 126. The top end of the limit plate 126 is bonded with the anti-slip pad 127. A through groove is opened at the top end of the flip plate 8, and the extrusion column 123 is slidably connected inside the through groove.

[0072] As shown Figures 3 to 5 in the figure, the sliding structure includes: a snap ring 111, a slider 112, a first magnetic block 113, a second magnetic block 114, and a groove 115; the slider 112 is connected to the flip plate 8; the snap ring 111 is connected to the slider 112; the first magnetic block 113 is connected to both ends of the slider 112; the second magnetic block 114 is connected to both sides of the inner wall of the flip plate 8, and the slider 112 drives the snap ring 111 to move, and the slider 112 drives the first synchronous magnetic block 113 to approach the second magnetic block 114: the groove 115 is provided in the slider 112, and a fixing structure is installed inside the groove 115, and the fixing structure is used to squeeze the sliding structure.

[0073] In order to facilitate the change of the internal heating area of the heating plate 3, so that the internal area heating source is adjusted outward, so that the temperature inside the heating plate 3 is kept consistent. At this time, under the action of the sliding structure, the heating wire 9 and the edge area of the heating plate 3 are changed, so as to heat the edge of the heating plate 3 while the internal heating speed decreases, and then the temperature inside the heating plate 3 is kept consistent.

[0074] During use, since the flip plate 8 is tilted, the flip plate 8 drives the slider 112 to move under the action of gravity after tilting. When the slider 112 moves, it drives the snap ring 111 to move, and when the snap ring 111 moves, it drives the position of the heating wire 9 to be adjusted, so as to change the distance between the first magnetic block 113 and the second magnetic block 114.

[0075] Specifically, the slider 112 is slidably connected to the inside of the flip plate 8. A chute is opened at a position corresponding to one end of the slider 112 inside the flip plate 8. The second magnetic blocks 114 are embedded and installed at both ends of the chute inside the flip plate 8. The first magnetic blocks 113 are embedded and installed at both ends of the slider 112. The opposite faces of the first magnetic block 113 and the second magnetic block 114 have the same magnetic poles. The snap rings 111 are formed at equal intervals at the bottom end of the slider 112. The heating wire 9 is located inside the snap ring 111. A groove 115 is opened at the top end of the slider 112. The sleeve plate 124, the ball 125, the limiting plate 126, and the anti-slip pad 127 are all located inside the placement groove.

[0076] As shown Figure 3 and Figure 6 in the figure, the flipping structure includes: a mounting strip 101, a heat conducting sleeve 102, a first telescopic member 103, a convex column 104, a connecting strip 105, a round rod 106, and a placement rack 107; the mounting strip 101 is connected to the heating plate 3; the heat conducting sleeve 102 is connected to the mounting strip 101; the first telescopic member 103 is connected to the heat conducting sleeve 102; the convex column 104 is connected to the first telescopic member 103; the convex column 104 moves vertically inside the heat conducting sleeve 102 through the first telescopic member 103; the connecting strip 105 is connected to the convex column 104; the round rod 106 is connected to the connecting strip 105; the placement rack 107 is sleeved on the round rod 106, and the convex column 104 drives the round rod 106 to move inside the placement rack 107 through the connecting strip 105.

[0077] The flipping structure requires a driving member during operation. Under the action of the driving member, the flipping plate 8 deflects, causing the distance between the two ends of the heating wire 9 and the bottom end of the inner wall of the heating plate 3 to change, thereby changing the distance between the heating sources on both sides of the bottom end of the inner wall of the heating plate 3 and the material to be processed, so that the surface of the material to be processed is evenly heated.

[0078] During use, since the first telescopic member 103 deforms after being heated and expands, when the first telescopic member 103 expands, it drives the convex post 104 to move inside the heat conducting sleeve 102. Since the convex post 104 drives the round rod 106 to move through the connecting bar 105 when moving, and the round rod 106 drives the flipping plate 8 to deflect along the outside of the positioning post 14 through the placing rack 107 when moving, at this time, the distance between both sides of the heating wire 9 at the bottom end of the flipping plate 8 and the inner wall of the heating plate 3 changes.

[0079] Specifically, the mounting strip 101 is integrally formed at the top end of the inner wall of the heating plate 3. The number of the mounting strips 101 is set to four in total. The four mounting strips 101 are respectively located at the four corners of the inner wall of the heating plate 3. Two mounting strips 101 are in a group. Heat conducting sleeves 102 are clamped and installed inside all four mounting strips 101. The first telescopic member 103 is fixedly installed at the bottom end of the inner wall of the heat conducting sleeve 102. The convex post 104 is bonded to the top end of the first telescopic member 103. The convex post 104 is slidably connected inside the heat conducting sleeve 102. A connecting bar 105 is integrally formed on one end face of the convex post 104. A round rod 106 is welded between the bottom ends of the two connecting bars 105. A placing rack 107 is sleeved outside the round rod 106. A limiting groove that fits the outer diameter of the round rod 106 is formed inside the placing rack 107 for limiting the round rod 106 to prevent the problem of the round rod 106 shaking. The outside of the round rod 106 and the inside of the limiting groove are mutually fitted. The ratio of the number of the connecting bars 105 to the round rod 106 is two to one.

[0080] In the present invention, the first telescopic member 103 and the second telescopic member 122 are made of materials with thermal expansion and contraction properties, specifically belonging to Invar alloy.

[0081] A thermoforming process for a thermoforming device used for the production and molding of a mobile phone film fixing frame includes the following steps:

[0082] Step 1. Equipment preparation: Place the material to be processed on the upper surface of the mold 5, start the first lifting structure 2 and the second lifting structure 4, and drive the heating plate 3 and the mold 5 to move towards each other respectively, so that the processing material is in the position between the heating plate 3 and the mold 5;

[0083] Step 2. Heating of the processing material: Turn on the heating wire 9 to heat the processing material;

[0084] Step 3. Temperature zone adjustment: Activate the flipping structure. The first telescopic member 103 drives the convex column 104 to move vertically within the heat conduction sleeve 102. Through the connecting bar 105 and the round rod 106, the placement rack 107 is driven to deflect, thereby causing the flipping plate 8 to tilt. At the same time, under the tilting action of the flipping plate 8, the slider 112 in the sliding structure drives the snap ring 111 and the heating wire 9 to slide horizontally. The first magnetic block 113 moves with the slider 112 and approaches the second magnetic block 114, using magnetic force to assist in fixing the position of the slider 112 and adjusting the position of the heating wire 9 to make the temperature distribution on the heating plate 3 uniform.

[0085] Step 4. Air extraction and molding: Activate the adsorption tube 6 to extract the gas inside the mold 5, forming a negative pressure environment. Under the action of atmospheric pressure, the heated and softened processing material adheres to the surface of the cavity of the mold 5, completing the preliminary molding of the mobile phone film fixing frame.

[0086] Step 5. Cooling and demolding: Turn off the heating wire 9 and perform a cooling treatment on the mold 5. After the processing material cools and solidifies, turn off the adsorption tube 6 to relieve the negative pressure. Activate the second lifting structure 4 to lower the mold 5 and take out the formed mobile phone film fixing frame.

[0087] Step 6. Equipment reset: Reset components such as the flipping plate 8 and the heating wire 9 to their initial states, clean the equipment, and prepare for the next production.

[0088] Working principle: In actual operation, the raw material is conveyed along the inner track of the frame 1 and successively enters the area below the heating plate 3 and covers the upper surface of the mold 5. Activate the first lifting structure 2 and the second lifting structure 4 to drive the heating plate 3 and the mold 5 to move towards each other to a preset distance respectively, precisely clamping the processing material to be processed. This operation ensures the stability of the processing material during the subsequent heating and forming process, avoiding forming errors caused by position deviation. Then activate the heating wire 9, and the heat generated by it is conducted to the surface of the processing material through the heating plate 3. Since the heat dissipation area at the edge of the heating plate 3 is large and the speed is fast, while the heat accumulates in the middle, a temperature gradient of "high in the middle and low at the edges" is formed on the plate surface. The uneven temperature distribution will cause the processing material to be unevenly heated, affecting the accuracy and quality of the final product.

[0089] At this time, the first telescopic member 103 triggers the thermal expansion effect due to temperature change, expands and elongates along the axial direction of the heat conducting sleeve 102, pushes the convex column 104 to move synchronously, and drives the placement rack 107 to drive the turning plate 8 to rotate and deflect around the positioning column 14 through the transmission of the connecting bar 105 and the round rod 106. Due to the different expansion amounts of the first telescopic member 103 caused by the temperature difference on both sides of the turning plate 8, an asymmetric driving force is formed, prompting the turning plate 8 to further adjust the inclination angle, thereby changing the distance distribution between the heating wire 9 and the inner wall of the heating plate 3. This process realizes the dynamic adjustment of the position of the heating wire 9, can automatically compensate for the insufficient heat in the edge area according to the temperature gradient, effectively improves the uneven temperature condition of the heating plate 3, and provides guarantee for the uniform heating of the materials to be processed;

[0090] As the turning plate 8 inclines, the slider 112 slides along the chute under the action of gravity, driving the snap ring 111 and the heating wire 9 to move synchronously. During this process, the distance between the first magnetic block 113 and the second magnetic block 114 changes dynamically. While using magnetic force for auxiliary positioning, the precise adjustment of the distance between the heating wire 9 and the edge of the heating plate 3 is realized. Through the synergistic action of magnetic force and gravity, not only the stability and accuracy of the movement of the heating wire 9 are improved, but also it can quickly respond according to the actual temperature requirement to ensure that the edge area of the heating plate 3 obtains sufficient heat, further improving the temperature uniformity;

[0091] The temperature distribution difference will also trigger the thermal response of the second telescopic member 122. After it expands due to heat, it slides along the heat absorption sleeve 121, pushes the extrusion column 123 to move downward, and the ball 125 at the bottom of the sleeve plate 124 is in close contact with the surface of the slider 112, reducing the sliding resistance; the limit disk 126 synchronously drives the anti-slip pad 127 to disengage from the slider 112, releasing the fixed constraint to ensure the free movement of the slider 112. When the device stops for heat dissipation, the second telescopic member 122 contracts and resets, driving the anti-slip pad 127 to press the slider 112 again to realize mechanism locking. This intelligent adjustment mechanism reduces the movement resistance of the slider 112 during the operation of the device to ensure that the heating wire 9 can flexibly adjust its position; it locks in time after the device stops running to prevent the components from being displaced due to external force, which not only improves the operation efficiency of the device but also ensures the stability and reliability of the device.

[0092] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it.

Claims

1. A thermoforming device for the production and molding of mobile phone film fixing frames, characterized in that, Comprising: A frame (1), serving as a support for the overall production and forming of a plastic suction device for a mobile phone film fixing frame; A first lifting structure (2), connected to the top end of the inner wall of the frame (1); A heating plate (3), connected to the first lifting structure (2), and the first lifting structure (2) drives the heating plate (3) to move vertically; A second lifting structure (4), connected to the bottom end of the inner wall of the frame (1); A mold (5), connected to the second lifting structure (4), and the second lifting structure (4) drives the mold (5) to move vertically; An adsorption tube (6), connected to the mold (5), for extracting the gas inside the mold (5); The heating component includes: a flipping plate (8), a heating wire (9), a flipping structure, and a sliding structure; The flipping plate (8) is connected to the inside of the heating plate (3), the bottom end of the flipping plate (8) is connected to the heating wire (9) through the sliding structure, the heating wire (9) moves horizontally at the bottom end of the flipping plate (8) through the sliding structure, and the flipping plate (8) and the heating plate (3) are connected through the flipping structure, and the flipping structure drives the flipping plate (8) to deflect.

2. The blister packaging device for the production and molding of a mobile phone film fixing frame according to claim 1, characterized in that, The flipping structure includes: A mounting strip (101), connected to the heating plate (3); A heat-conducting sleeve (102), connected to the mounting strip (101); A first telescopic member (103), connected to the heat-conducting sleeve (102); A convex column (104), connected to the first telescopic member (10, and the convex column (104) moves vertically inside the heat-conducting sleeve (102) through the first telescopic member (103); A connecting strip (105), connected to the convex column (104); A round rod (106), connected to the connecting strip (105); A placement rack (107), sleeved on the round rod (106), and the convex column (104) drives the round rod (106) to move inside the placement rack (107) through the connecting strip (105).

3. The plastic suction device for the production and molding of a mobile phone film fixing frame according to claim 2, characterized in that, A limiting groove conforming to the outer diameter of the round rod (106) is formed inside the placement rack (107), the outer side of the round rod (106) and the inner side of the limiting groove are mutually attached, and the quantity ratio of the connecting strip (105) to the round rod (106) is two to one.

4. The plastic suction device for the production and molding of a mobile phone film fixing frame according to claim 3, characterized in that, The sliding structure includes: A slider (112), connected to the flipping plate (8); A snap ring (111), connected to the slider (112); A first magnetic block (113), connected to both ends of the slider (112); A second magnetic block (114), connected to both sides of the inner wall of the flipping plate (8), and the slider (112) drives the snap ring (111) to move, and the slider (112) drives the first magnetic block (113) to approach the second magnetic block (114).

5. The plastic suction device for the production and molding of a mobile phone film fixing frame according to claim 4, characterized in that, The sliding structure further includes: A groove (115), provided on the slider (112), and a fixing structure is installed inside the groove (115), and the fixing structure is used to extrude the sliding structure.

6. The blister packaging device for the production and molding of a mobile phone film fixing frame according to claim 5, characterized in that, The fixing structure includes: An endothermic sleeve (121), connected to the flipping plate (8); A second telescopic member (122), connected to the endothermic sleeve (121); An extrusion column (123), connected to the second telescopic member (122); The limiting disk (126) is connected to the extrusion column (123); The anti-slip pad (127) is connected to the limiting disk (126). The second telescopic member (122) drives the extrusion column (123) to move, and the extrusion column (123) drives the anti-slip pad (127) to fit inside the slider (112) through the limiting disk (126).

7. The plastic suction device for the production and molding of a mobile phone film fixing frame according to claim 6, characterized in that The fixing structure further includes: The sleeve disk (124) is connected below the extrusion column (123); The ball (125) is connected to the sleeve disk (124), and the sleeve disk (124) drives the ball (125) to fit inside the slider (112).

8. The blister packaging equipment for the production and molding of a mobile phone film fixing frame according to claim 7, characterized in that, A through groove is formed at the top end of the turning plate (8), and the extrusion column (123) is slidably connected inside the through groove.

9. A thermoforming process for a thermoforming device used in the production and molding of the mobile phone film fixing frame described in claim 8, characterized in that, It includes the following steps: Step 1, Equipment preparation: Place the material to be processed on the upper surface of the mold (5), start the first lifting structure (2) and the second lifting structure (4), and drive the heating plate (3) and the mold (5) to move towards each other respectively, so that the processing material is located between the heating plate (3) and the mold (5); Step 2, Heating the processing material: Turn on the heating wire (9) to heat the processing material; Step 3, Temperature zone adjustment: Start the turning structure, the first telescopic member (103) drives the convex column (104) to move vertically inside the heat conduction sleeve (102), and drives the placement rack (107) to deflect through the connecting bar (105) and the round stick (106), so that the turning plate (8) is inclined; at the same time, under the action of the inclination of the turning plate (8), the slider (112) in the sliding structure drives the snap ring (111) and the heating wire (9) to slide horizontally, and the first magnetic block (113) moves close to the second magnetic block (114) along with the slider (112); Step 4, Vacuum forming: Start the adsorption pipe (6) to extract the gas inside the mold (5) to form a negative pressure environment. Under the action of atmospheric pressure, the heated and softened processing material fits the surface of the mold cavity (5) to complete the preliminary forming of the mobile phone film fixing frame; Step 5, Cooling and demolding: Turn off the heating wire (9), cool the mold (5). After the processing material is cooled and solidified, turn off the adsorption pipe (6) to release the negative pressure, start the second lifting structure (4) to lower the mold (5), and take out the formed mobile phone film fixing frame; Step 6, Equipment reset: Reset components such as the turning plate (8) and the heating wire (9) to the initial state, clean the equipment, and prepare for the next production.

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