Air intake amount monitoring system

By arranging thermistors and force sensors alternately in the air intake duct, and combining constant current drive and data acquisition and processing, the problem of inaccurate monitoring caused by blockage of the air intake system is solved, and high-sensitivity and high-precision air intake monitoring is achieved.

CN120403796BActive Publication Date: 2025-10-21SHANGHAI XINLONG SEMICON TECH CO LTD
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Patent Information

Application Number
CN202510919357.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-07-04
Publication Date
2025-10-21
Estimated Expiration
2045-07-04

AI Technical Summary

Technical Problem

Existing technologies cannot effectively monitor and improve the sensitivity and accuracy of air intake. Especially in precision instruments and server computer systems, the air intake system is easily affected by dust and humidity, which can lead to blockage, affect heat dissipation, and potentially damage the equipment.

Method used

An airflow sensor employing multiple temperature and pressure sensing elements arranged alternately, including multiple thermistors and force sensors, is driven by constant current to avoid voltage-driven interference. Combined with data acquisition and processing devices, it enables multi-location monitoring.

Benefits of technology

It improves the sensitivity and accuracy of the air intake monitoring system, reduces interference, expands the application scenarios, is suitable for multi-directional air intake monitoring, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides an air intake amount monitoring system applied to the technical field of sensors.The air intake amount monitoring system comprises a data acquisition device located on the side wall of an air intake pipe, and the data acquisition device comprises an air intake amount sensor, wherein the air intake amount sensor comprises a plurality of temperature detection elements (including a plurality of thermistors), a plurality of pressure detection elements (including a plurality of force-sensitive resistors) and a plurality of connecting wires; thus, the utilization of the substrate area can be maximized by the alternate and interval arrangement of the plurality of thermistors with special shapes and the plurality of force-sensitive resistors with special shapes, and the monitoring precision can be improved at the same time; in addition, the temperature detection elements containing only thermistors can also be driven by constant current, thereby avoiding the interference problem caused by voltage driving of the voltage dividing resistor in the traditional temperature detection element, that is, the monitoring sensitivity and precision of the air intake amount monitoring system are further improved.
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Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to an air intake volume monitoring system. Background Art

[0002] In areas such as precision instruments, air conditioners, and server-type computer systems, to ensure safe system operation, it is necessary to monitor the proper functioning of the system's cooling subsystem (e.g., fan function, air flow rate, etc.) within a relatively sealed, small space (such as a computer chassis). Failure or performance degradation of the cooling subsystem can cause the host system to shut down or even be severely damaged. Furthermore, in air quality monitoring applications operating within enclosed spaces, it is necessary to ensure that a certain air flow rate and velocity can flow through the sensor module (with a small chassis) for effective monitoring and measurement. Environmental factors such as dust and humidity can cause the air inlet filter to become clogged or degrade, potentially reducing or even completely eliminating airflow. This can prevent the equipment from dissipating heat in a timely manner, leading to failure or damage. Therefore, it is necessary to monitor and ensure that the air flow entering the chassis is normal. Summary of the Invention

[0003] The object of the present invention is to provide an air intake monitoring system to improve the monitoring sensitivity and accuracy of the air intake monitoring system and reduce the production cost.

[0004] To achieve the above objectives, the present invention provides an air intake volume monitoring system applicable to an air intake duct having an air inlet. The air intake volume monitoring system comprises: a data acquisition device located on a duct sidewall of the air intake duct near the air inlet, comprising an air intake volume sensor arranged parallel to the duct sidewall. The air intake volume sensor comprises: a substrate.

[0005] A plurality of temperature detection elements are located on the substrate, the temperature detection elements including a plurality of first thermistors and a plurality of second thermistors, the plurality of first thermistors extending along a first direction and arranged at intervals from each other along a second direction, the plurality of second thermistors extending along the second direction and arranged at intervals from each other along the first direction, the first direction and the second direction being perpendicular to each other.

[0006] Multiple pressure detection elements are located on the substrate, and the pressure detection elements include multiple first force-sensitive resistors and multiple second force-sensitive resistors. The first force-sensitive resistors extend along the first direction and are arranged between two adjacent first thermistors at intervals along the second direction. The second force-sensitive resistors extend along the second direction and are arranged between two adjacent second thermistors at intervals along the first direction.

[0007] Wherein, the temperature detection element and the pressure detection element constitute a sensor substructure.

[0008] Optionally, the air intake sensor may further include: multiple connecting wires; the multiple connecting wires include: multiple first connecting wires, located between adjacent first thermistors and between adjacent second thermistors, so as to connect the multiple first thermistors and the multiple second thermistors in the sensor substructure in series and / or in parallel.

[0009] A plurality of second connecting wires are located between adjacent first force-sensitive resistors and between adjacent second force-sensitive resistors to connect the plurality of first force-sensitive resistors and the plurality of second force-sensitive resistors in the sensor substructure in series and / or in parallel.

[0010] Optionally, the projection shapes of the first thermistor and the first force-sensitive resistor on the substrate are the same, and the projection shape of the first thermistor on the substrate includes a serpentine line shape, a wavy shape, or a long strip shape.

[0011] Optionally, the second thermistor and the second force-sensitive resistor have the same projected shape on the substrate, and the projected shape of the second thermistor on the substrate includes a long strip.

[0012] Optionally, in the same temperature detection element, some of the first thermistors have different extension lengths in the first direction, and some of the second thermistors have different extension lengths in the second direction.

[0013] Optionally, in the same pressure detection element, some of the first force-sensitive resistors have different extension lengths in the first direction, and some of the second force-sensitive resistors have different extension lengths in the second direction.

[0014] Optionally, the width of the first thermistor in the second direction is the same as the width of the first force-sensitive resistor in the second direction.

[0015] Optionally, the width of the second thermistor in the first direction is the same as the width of the second force-sensitive resistor in the first direction.

[0016] Optionally, the spacing between adjacent first thermistors and first force-sensitive resistors in the second direction is a first spacing, the spacing between adjacent second thermistors and second force-sensitive resistors in the first direction is a second spacing, and the first spacing is equal to the second spacing.

[0017] Optionally, the sensitivity of the air intake sensor is determined by an algorithm optimization model, wherein the algorithm optimization model is: S total=f(W,L,ρ,P,T,X,Y); the constraints in the algorithm optimization model are:

[0018] W min ≤W≤W max ;

[0019] L min ≤L≤L max ;

[0020] T low ≤T≤T high ;

[0021] P min ≤P≤W max ;

[0022] X min ≤X≤X max ;

[0023] Y min ≤Y≤Y max ;

[0024] S N ≤S Nmax ;

[0025] Among them, S total is the sensitivity of the air intake sensor, W is the equivalent length of the first force-sensitive resistor or the second force-sensitive resistor, L is the equivalent width of the first force-sensitive resistor or the second force-sensitive resistor, ρ is the resistivity of the first force-sensitive resistor and the second force-sensitive resistor, T is the absolute temperature of the gas in the environment, P is the pressure in the environment, X is the spacing between adjacent pressure detection elements or the spacing between adjacent temperature detection elements, Y is the first spacing between adjacent first thermistors and first force-sensitive resistors or the second spacing between adjacent second thermistors and second force-sensitive resistors, P min and P max are the lowest and highest pressures given by the pressure in the environment, T low and T high are the lowest and highest temperatures given by the environment, X min and X max The minimum width and maximum width given for the spacing between adjacent pressure detection elements or the spacing between adjacent temperature detection elements, Y min and Y max The minimum width and maximum width are given for the first spacing between adjacent first thermistors and first force-sensitive resistors or the second spacing between adjacent second thermistors and second force-sensitive resistors, respectively. N is the power spectral density, S Nmax is the maximum thermal noise power spectral density given by the design.

[0026] Optionally, the data acquisition device further includes: a power drive module, configured to provide a constant current power supply to the temperature detection element and the pressure detection element.

[0027] Optionally, the data acquisition device also includes: an auxiliary acquisition device, located on the substrate, cooperating with the data acquisition device, for receiving the air intake volume data output by different sensor substructures for the same time period, and outputting the air intake volume data to other functional modules of the air intake volume monitoring system.

[0028] Optionally, the air intake monitoring system may further include:

[0029] The data processing device is connected to the auxiliary acquisition device and is used to receive the air intake volume data of different sensor substructures and integrate the different air intake volume data to obtain target air intake volume data.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] In the present invention, on the one hand, the air intake volume monitoring system can be set in a position parallel to the air volume direction in the air intake duct, that is, on the side wall of the air intake duct, and the data acquisition device may include an air intake volume sensor, and the air intake volume sensor may include multiple temperature detection elements and multiple pressure detection elements. Therefore, a sensor substructure composed of different temperature detection elements and a pressure detection element located outside the temperature detection element can be used to obtain multiple air intake volume data in the same time period, and then based on the multiple air intake volume data, the target air intake volume data can be integrated. That is, through multi-position or multi-directional air intake volume monitoring and data acquisition, the influence of the setting position of the data acquisition device on the air intake data acquisition is avoided, and the application scenario is expanded. On the other hand, the alternating and staggered arrangement of the specially shaped multiple thermistors (the first thermistor and the second thermistor) in the temperature detection element in each sensor substructure and the specially shaped multiple force-sensitive resistors (the first force-sensitive resistor and the second force-sensitive resistor) in the pressure detection element maximizes the utilization of the substrate area and improves the monitoring accuracy at the same time; moreover, the temperature detection element containing only thermistors can also be driven by a constant current, thereby avoiding the interference problem caused by the voltage drive caused by the voltage divider resistor in the traditional temperature detection element, thereby further improving the monitoring sensitivity and accuracy of the air intake monitoring system. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the following detailed description, they are used to explain the present application but do not constitute a limitation of the present application. In the accompanying drawings:

[0033] Figure 1A schematic structural diagram of an air intake volume monitoring system provided in one embodiment of the present invention.

[0034] Figure 2 A partial top view of an exemplary data acquisition device provided in one embodiment of the present invention.

[0035] Figure 3 for Figure 2 A schematic diagram of a partial structure of a sensor substructure in the data acquisition device shown;

[0036] Figure 4 for Figure 1 The diagram shows the position of the air intake volume monitoring system arranged in the air intake duct.

[0037] Figure 5 A schematic diagram of the working principle of an air intake volume monitoring system provided by one embodiment of the present invention.

[0038] Wherein, the accompanying drawings are marked as follows:

[0039] 1-air intake monitoring system; 10-data acquisition device; 20-auxiliary acquisition device; 30-data processing device, 101-air intake sensor; 101.1-sensor substructure; 100-substrate; 200-temperature detection element; 201-first thermistor; 202-second thermistor; 300-pressure detection element; 301-first force-sensitive resistor; 302-second force-sensitive resistor; 410-first soldering pad; 420-second soldering pad; 430-third soldering pad; 440-fourth soldering pad; 450-fifth soldering pad; 460-sixth soldering pad; 470-seventh soldering pad; 480-eighth soldering pad; 500-contact hole; 610-first connecting wire; 620-second connecting wire, X-spacing between adjacent pressure detection elements or spacing between two adjacent temperature detection elements, Y-first spacing or second spacing.

[0040] In the drawings, like components are given like reference numerals, and the drawings are not drawn to scale. DETAILED DESCRIPTION

[0041] To make the objects, advantages, and features of the present invention more clearly apparent, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale. They are only used to conveniently and clearly assist in illustrating the purposes of the embodiments of the present invention. In addition, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may need to illustrate different focuses and sometimes use different scales.

[0042] As used in the present invention, the singular forms "a", "an", and "the" include plural referents, the term "or" is generally used to include "and / or", the term "several" is generally used to include "at least one", and the term "at least two" is generally used to include "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "proximal end" and "distal end" generally refer to two corresponding parts, which not only include endpoints, and the terms "mounted", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be a communication between two elements or an interaction relationship between two elements. In addition, as used in the present invention, "one element is disposed on another element" generally only indicates that there is a connection, coupling, cooperation, or transmission relationship between the two elements, and the connection, coupling, cooperation, or transmission between the two elements may be direct or indirect through an intermediate element. It should not be understood as indicating or implying a spatial positional relationship between the two elements. That is, one element can be in any orientation, such as inside, outside, above, below, or to one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] Currently, in applications such as precision instruments, air conditioners, and server-type computer systems, prolonged ventilation of the air intake system can lead to clogging or degradation of the air inlet filters due to environmental factors such as dust and humidity. This can reduce or even completely prevent airflow, ultimately leading to failure or damage due to the inability to dissipate heat within the air intake system. Therefore, monitoring the normal flow of air into the air intake system, specifically into the air intake duct, is crucial. Previous solutions typically required regular manual inspection and cleaning, which limited operational autonomy and lacked real-time performance. Alternatively, these solutions relied on monitoring methods tailored to specific environments. For example, these required the pressure-sensitive surface of the air intake sensor to face the windward direction of the air intake channel (or simply, the air intake duct). This meant that the air intake sensor was required to be perpendicular to the airflow direction in the air intake duct. This could potentially hinder airflow in the duct, making it unsuitable for applications sensitive to incoming airflow and unable to meet the requirements of most scenarios with high sensitivity.

[0044] In order to solve the above problems, the present invention provides an air intake volume monitoring system, and proposes a new structure of the air intake volume monitoring system. Since the temperature detection element includes multiple thermistors and the pressure detection element includes multiple force-sensitive resistors, the multiple thermistors of special shapes and the multiple force-sensitive resistors of special shapes in the pressure detection element can be arranged alternately and at intervals to maximize the utilization of the substrate occupied area and at the same time achieve improved monitoring accuracy; and the temperature detection element that only includes thermistors can also be driven by constant current, thereby avoiding the interference problem caused by the voltage drive caused by the voltage divider resistor in the traditional temperature detection element, that is, further improving the monitoring sensitivity and accuracy of the air intake volume monitoring system.

[0045] For ease of description, a first direction and a second direction are defined below, where the first direction is parallel to the surface direction of the substrate and corresponds to D1 in the accompanying drawings, and is therefore referred to as the first direction D1 hereinafter; the second direction is perpendicular to the first direction and is also parallel to the surface direction of the substrate, and is therefore referred to as the second direction D2 hereinafter.

[0046] Please refer to Figures 1 to 4 ,in Figure 1 The figure shows a schematic diagram of the structure of an air intake monitoring system provided by an embodiment of the present invention. Figure 2 The figure shows a partial top view of an example of an air intake sensor in a data acquisition device provided by an embodiment of the present invention. Figure 3 The one shown is Figure 2 The schematic diagram of the local structure of a sensor substructure in the data acquisition device shown in FIG. Figure 4 The one shown is Figure 1 The diagram of the location of the air intake monitoring system is shown in FIG. Figure 1 As shown, the air intake monitoring system 1 may include: a data acquisition device 10, an auxiliary acquisition device 20, a data processing device 30, a network transmission device (not shown) and a database (not shown); wherein the data acquisition device 10, the auxiliary acquisition device 20, the data processing device 30, the network transmission device and the database may be integrated on a rigid PCB board or a flexible polyimide board, and the data acquisition device 10 is specifically used to collect real-time or periodic data from the air intake system, such as Figure 4The air volume data flowing into the air inlet of the air inlet duct shown in the figure is collected, and corresponding air volume data are respectively formed for different sensor substructures 101.1 in the air volume sensor 101; the air volume data can be, for example, wind pressure, temperature of the air inlet duct after the air volume flows into the air inlet, etc., and is not limited thereto; the auxiliary acquisition device 20 cooperates (is connected) with the data acquisition device 10, and is specifically used to receive the air volume data output by different sensor substructures 101.1 in the air volume sensor 101 within the same time period or periodic time period, and output the air volume data to other functional modules of the air volume monitoring system 1 so as to execute subsequent processes; the data processing device 30 is connected to the auxiliary acquisition device 2 ... The air intake volume data output by different sensor substructures 101.1 in the air intake volume sensor 101 are collected, and the different air intake volume data are integrated to obtain the target air intake volume data corresponding to the air intake volume in the air intake duct within the same time period or periodic time period; the network transmission device can cooperate with the data acquisition device 10, the auxiliary acquisition device 20, the data processing device 30 and the database respectively to realize the communication connection between different functional modules in the air intake volume monitoring system; the database is specifically used to store the output data of the data acquisition device 10 and the data processing device 30, such as the air intake volume data output by different sensor substructures 101.1 in the air intake volume sensor 101, and the target air intake volume data.

[0047] like Figure 2 As shown, the data acquisition device 10 of the air intake volume monitoring system 1 in the embodiment of the present invention may specifically include an air intake volume sensor 101, and the air intake volume sensor 101 may specifically include multiple sensor substructures 101.1 (including a temperature detection element 200 and a pressure detection element 300); specifically, the multiple sensor substructures 101.1 in the air intake volume sensor 101 may be arranged at intervals along the extension direction of the duct side wall parallel to the air intake duct, that is, the sensitive surface of any of the sensor substructures 101.1 (or understood as the surface of the corresponding element in the sensor substructure 101.1 for detecting the air intake volume data) is parallel to the overall flow direction of the air intake or wind entering the air intake duct from the air inlet (hereinafter referred to as the parallel wind direction). In addition, since the multiple sensor substructures 101.1 in the air intake volume sensor 101 are arranged at intervals, the multiple sensor substructures 101.1 can be arranged in an array, for example Figure 2 As shown, when the air intake sensor 101 has two sensor substructures 101 . 1 , the two sensor substructures 101 . 1 may be arranged in a row along the first direction D1 (or in a column along the second direction D2 ), but this is not limited thereto.

[0048] Specifically, each sensor substructure 101.1 of the air intake sensor 101 may include: a substrate 100, a temperature sensing element 200, a pressure sensing element 300, multiple solder pads (including first to eighth solder pads 410 to 480), multiple contact holes 500, and multiple connecting wires (including first and second connecting wires 610 and 620). The substrate 100 supports the various elements and / or components of the air intake sensor 101. Thus, the temperature sensing element 200, pressure sensing element 300, multiple solder pads, multiple contact holes 500, and multiple connecting wires are all located on the substrate 100.

[0049] like Figure 3 As shown, for each of the sensor substructures 101.1, the temperature detection element 200 contained therein may include a plurality of first thermistors 201 and a plurality of second thermistors 202, wherein the plurality of first thermistors 201 extend along the first direction D1 and are arranged at intervals from each other along the second direction D2, and the plurality of second thermistors 202 extend along the second direction D2 and are arranged at intervals from each other along the first direction D1. In one embodiment, the first thermistors 201 may be serpentine, wavy, or elongated (as viewed from a projection on the substrate 100), and one end, such as the left end, of the plurality of first thermistors 201 may be located in the same vertical direction, while the other end, such as the right end, may be uneven. That is, some of the first thermistors 201 may have different extension lengths in the first direction D1. The second thermistors 202 may be elongated, and one end, such as the upper end, of the plurality of second thermistors 202 may be located in the same horizontal direction, while the other end, such as the lower end, may be uneven. That is, some of the second thermistors 202 may have different extension lengths in the second direction D2. Furthermore, the plurality of first thermistors 201 and the plurality of second thermistors 202 may be connected in series and / or in parallel via a plurality of first connecting wires 610. For example, the plurality of first thermistors 201 may be sequentially connected in series via the plurality of first connecting wires 610, and the second thermistors 202 may be sequentially connected in series via the plurality of first connecting wires 610. Alternatively, the plurality of first thermistors 201 and the plurality of second thermistors 202 may both be sequentially connected in series (or in parallel) via the plurality of first connecting wires 610, but the present invention is not limited thereto.

[0050] It should be understood that a contact hole 500 may be respectively defined at both ends of the plurality of first thermistors 201 and the plurality of second thermistors 202. The plurality of first connecting wires 610 may be connected in series and / or in parallel via the contact holes 500 on the plurality of first thermistors 201 or the plurality of second thermistors 202.

[0051] For each of the sensor substructures 101.1, the pressure detection element 300 contained therein includes a plurality of first force-sensitive resistors 301 and a plurality of second force-sensitive resistors 302, wherein the plurality of first force-sensitive resistors 301 extend along the first direction D1 and are arranged at intervals with respect to each other along the second direction D2, and the plurality of second force-sensitive resistors 302 extend along the second direction D2 and are arranged at intervals with respect to each other along the first direction D1. In one embodiment, the first force-sensitive resistor 301 may have the same shape as the multiple first thermistors 201, for example, both may be serpentine, wavy or long strip-shaped (as viewed from the projection on the substrate 100), and the multiple first force-sensitive resistors 301 may be alternately and spaced apart with the multiple first thermistors 201 along the second direction D2, that is, first force-sensitive resistors 301 spaced apart are provided between adjacent first thermistors 201, so that in the second direction D2, first force-sensitive resistors 301 are provided on both sides of different first thermistors 201. In this way, more thermistors and force-sensitive resistors can be provided per unit area of ​​the substrate 100, thereby improving the response rate of the air intake sensor 101 and improving the sensitivity of the air intake sensor 101 to external pressure. Moreover, the two ends of the multiple first force-sensitive resistors 301 in the first direction D1, such as the left end and the right end, are also the same as the multiple first thermistors 201. The left ends are located in the same vertical direction, while the right ends are uneven, that is, the extension lengths of some of the first force-sensitive resistors 301 in the first direction D1 are different.

[0052] Furthermore, the shapes of the multiple second force-sensing resistors 302 may also be the same as the shapes of the multiple second thermistors 202, for example, they may be elongated strips, and the two ends of the multiple second force-sensing resistors 302 in the second direction D2, such as the upper and lower ends, may also be the same as the multiple second thermistors 202, that is, the upper ends may be located in the same horizontal direction, while the lower ends may be uneven, that is, some of the second force-sensing resistors 302 may have different extension lengths in the second direction D2. In addition, the multiple first force-sensing resistors 301 and the multiple second force-sensing resistors 302 may be connected in series and / or in parallel via the multiple second connecting wires 620. For example, the multiple first force-sensing resistors 301 may be connected in series sequentially via the multiple second connecting wires 620, and the second force-sensing resistors 302 may be connected in series sequentially via the multiple second connecting wires 620. Alternatively, the multiple first force-sensing resistors 301 and the multiple second force-sensing resistors 302 may both be connected in series (or in parallel) sequentially via the multiple second connecting wires 620, but the present invention is not limited thereto.

[0053] It should be understood that a contact hole 500 may also be respectively opened on both ends of the multiple first force-sensitive resistors 301 and the multiple second force-sensitive resistors 302, and the multiple second connecting wires 620 can realize the series and / or parallel connection of different adjacent first force-sensitive resistors 301 / different adjacent second force-sensitive resistors 302 through the contact holes 500 on the multiple first force-sensitive resistors 301 or the multiple second force-sensitive resistors 302.

[0054] In addition, the air intake sensor 101 in the embodiment of the present invention may also include multiple pads. Based on the functions and locations of different pads, the pads are specifically divided into: a first pad 410, a second pad 420, a third pad 430, a fourth pad 440, a fifth pad 450, a sixth pad 460, a seventh pad 470, and an eighth pad 480. The first pad 410 is a power pad, and the second pad 420 is a ground pad. The two pads can be arranged on the same side of a sensor substructure 101.1, for example. Figure 2 or Figure 3 The upper left and lower left corners of the sensor substructure 101.1 on the left are shown, and are electrically connected to the first force-sensitive resistors 301 at the upper and lower ends of the pressure detection element 300 in the sensor substructure 101.1 in the second direction D2 via second connecting wires 620. The first solder pad 410 is used to connect to a power drive module in the data acquisition device 10, such as a constant current power supply, to provide a constant current power supply to the pressure detection element 300. The third solder pad 430 is a power solder pad, and the fourth solder pad 440 is a ground solder pad. The third solder pad 430 and the fourth solder pad 440 can be arranged on the other side of the sensor substructure 101.1 (the side opposite to the side where the first solder pad 410 and the second solder pad 420 are arranged) along the first direction D1, for example Figure 2 or Figure 3 The upper right and lower right corners of the sensor substructure 101.1 on the left are shown, and are electrically connected to the second thermistor 202 at the leftmost end in the first direction D1 and the first thermistor 201 at the bottommost end in the second direction D2 of the temperature detection element 200 in the sensor substructure 101.1 via second connecting wires 620. The third solder pad 430 is used to connect to a power driver module in the data acquisition device 10, such as a constant current power supply, to provide a constant current power supply to the temperature detection element 200. Similarly, the other sensor substructure 101.1 in this embodiment of the present invention also corresponds to four solder pads, namely the fifth solder pad 450, the sixth solder pad 460, the seventh solder pad 470, and the eighth solder pad 480.

[0055] Obviously, compared with traditional temperature detection elements, the temperature detection element in the embodiment of the present invention does not have a voltage divider resistor, and the temperature detection element 200 and the pressure detection element 300 in the embodiment of the present invention are both driven by a constant current source. Therefore, when the external pressure or temperature changes, the temperature detection element 200 in the embodiment of the present invention is not affected by RC (voltage is usually more susceptible to interference) because it is not provided with a pressure resistor, and thus has stronger anti-interference ability, and is provided with more first thermistors and second thermistors, so the monitoring accuracy can also be improved.

[0056] In addition, the first pad 410 and the second pad 420 in the embodiment of the present invention can also serve as voltage divider pads to serve as current output pins.

[0057] It should be noted that, in the embodiment of the present invention, multiple connecting wires are located in the air intake sensor, that is, from the cross-sectional view of the semiconductor structure of the air intake sensor, the first connecting wire 610 and the second connecting wire 620 are both located in the corresponding resistance material layer in the insulating isolation layer between the corresponding resistance materials in the air intake sensor 101. For example, the first connecting wire 610 is specifically located in the insulating isolation layer between different thermistor material layers (the material is, for example, silicon dioxide), and the second connecting wire 620 is specifically located between the insulating isolation layers between different force-sensitive resistance material layers. That is, the connecting wires used to electrically connect different pads in the embodiment of the present invention are not led out by binding leads or other external wiring methods, thereby avoiding the interference of the connecting wires on the internal signal of the air intake sensor by the external wiring method, thereby improving the anti-interference ability, monitoring sensitivity and accuracy of the air intake sensor.

[0058] It should be understood that the pressure detection element 300 is specifically configured to collect the pressure point, pressure direction, and pressure magnitude of the air entering the air inlet of the air inlet pipe. This pressure detection element 300 can capture the corresponding data and output a digital or analog sensor signal. Therefore, it can be configured to periodically sense the air entering the air inlet pipe and output the corresponding data, or it can be configured in an event-triggered working mode, performing sensing and monitoring operations and outputting pressure data only when an event of interest occurs. In other embodiments, the pressure detection element 300 has no fixed parameter restrictions, but needs to be selected according to the specific application scenario, such as the measurement pressure range, device size, and power supply method, but is not limited to this. The temperature detection element 200 is configured to collect the temperature at the air inlet of the air inlet pipe. This temperature detection element 200 can capture the corresponding data and output a digital or analog sensor signal; similarly, the temperature detection element 200 can also be configured to periodically sense the air volume entering the air inlet pipe and output the corresponding data, or it can be configured in an event-triggered working mode, performing sensing and monitoring operations and outputting temperature data only when an event of interest occurs. In other embodiments, the temperature detection element 200 has no fixed parameter restrictions, but needs to be selected according to the specific application scenario, such as the measurement temperature range, device size, and power supply method, but is not limited thereto.

[0059] Specifically, when the air intake volume monitoring system described in the embodiment of the present invention is used to monitor the air intake volume at the air inlet of the air intake duct, the following air intake volume calculation formula can be used to first calculate the air intake volume data of the sensor substructures 101.1 in the air intake volume sensor 101, and then the air intake volume data of all the sensor substructures 101.1 are integrated, and the integrated data is used as the target air intake volume data; wherein, the air intake volume calculation formula is:

[0060] ;

[0061] Among them, the air volume at the air inlet of the air inlet pipe, C V is the air flow coefficient (related to the air flow sensor and the air inlet characteristics), A is the cross-sectional area of ​​the air inlet pipe, ΔP is the pressure difference in the environment, ρ G is the gas density.

[0062] In one embodiment, the gas density ρ G Available PV = nR G T formula; therefore, the gas density ρ can be calculated by the pressure data and temperature data measured by any sensor substructure 101.1 G The calculation formula is ρ G =PM / R G T, where P is pressure, V is volume, n is the amount of substance, and R Gis the gas constant, T is the absolute temperature of the gas in the environment, and M is the molar mass of the gas; the ΔP can be solved by the Darcy-Weisbach equation, so ΔP=f*(L / D)*(ρv 2 / 2), f is the friction coefficient (related to the Reynolds number and pipe roughness), L is the gas flow distance, D is the pipe diameter of the air inlet pipe, ρ is the fluid density, and v is the flow velocity.

[0063] Based on the above formula, the sensitivity calculation formula of the pressure detection element can be determined:

[0064] ;

[0065] Wherein, P is the pressure in the environment, Q is the air volume at the air inlet in the air inlet pipe, and ΔP is the pressure difference in the environment.

[0066] Similarly, the sensitivity calculation formula of the temperature detection element can be determined:

[0067] ;

[0068] Where T is the absolute temperature of the gas in the environment, Q is the air volume at the air inlet of the air inlet pipe, ρ G is the gas density. Combining the calculation formula of the sensitivity of the pressure detection element and the sensitivity of the temperature detection element, the total sensitivity S of the air flow sensor can be determined. total The calculation formula is as follows:

[0069] ;

[0070] Among them, S P is the sensitivity of the pressure detection element, S T is the sensitivity of the temperature detection element.

[0071] The total sensitivity S of the air intake sensor total The calculation formula is determined by the sensitivity of the air intake sensor through the algorithm optimization model, and the algorithm optimization model can be:

[0072] S total =f(W,L,ρ,P,T,X,Y);

[0073] The constraints in the algorithm optimization model are:

[0074] W min ≤W≤W max ;

[0075] L min ≤L≤L max ;

[0076] T low ≤T≤Thigh ;

[0077] P min ≤P≤W max ;

[0078] X min ≤X≤X max ;

[0079] Y min ≤Y≤Y max ;

[0080] S N ≤S Nmax ;

[0081] Among them, S total is the sensitivity of the air intake sensor, W is the equivalent length of the first force-sensitive resistor or the second force-sensitive resistor, L is the equivalent width of the first force-sensitive resistor or the second force-sensitive resistor, ρ is the resistivity of the first force-sensitive resistor and the second force-sensitive resistor, T is the absolute temperature of the gas in the environment, P is the pressure in the environment, X is the spacing between adjacent pressure detection elements or the spacing between adjacent temperature detection elements, and Y is the first spacing between adjacent first thermistors and first force-sensitive resistors (such as Figure 3 The position indicated by the reference numeral Y in the figure) or the second spacing between the adjacent second thermistors and the second force-sensitive resistors (such as Figure 3 The position indicated by the reference numeral Y in FIG), P min and P max are the minimum width and maximum width given by pressure, T low and T high are the lowest and highest temperatures given by the environment, X min and X max are the minimum and maximum widths given for the intervals between two adjacent sensor substructures, Y min and Y max The minimum width and maximum width are given for the first spacing between adjacent first thermistors and first force-sensitive resistors or the second spacing between adjacent second thermistors and second force-sensitive resistors, respectively. N is the power spectral density, S Nmax The maximum thermal noise power spectral density is the design value. Thus, by solving this model, the optimal critical design dimensions of the air flow sensor under given conditions can be determined. In other embodiments, in addition to the model described here, other design constraints can be considered based on specific application scenarios to further refine and optimize the design and target performance of the air flow sensor.

[0082] In this embodiment, carbon nanotubes are used as the core sensitive material to prepare the first thermistor 201, the second thermistor 202, the first force-sensitive resistor 301 and the second force-sensitive resistor 302, and are combined with specific auxiliary materials to realize the perception of temperature and micro-pressure. The auxiliary materials may include one or more of high-density polyethylene (HDPE), antioxidants, conductive particles, non-conductive fillers, zinc oxide and calcium stearate, but are not limited to the above-mentioned auxiliary materials; wherein high-density polyethylene and carbon nanotubes are compounded to form a thermistor material with a PTC (positive temperature coefficient) effect; antioxidants are used to improve the antioxidant properties of the material to prevent the material from degrading due to oxidation during use; conductive particles are used to optimize the conductive network or improve the conductive properties of the material, and a small amount of conductive particles are generally added; non-conductive fillers are used to adjust the overall properties of the material, such as hardness, strength, etc.; zinc oxide and calcium stearate are used to improve the processing performance, stability or compatibility of the material with other components. Carbon nanotubes have excellent thermal, mechanical and electrical properties. Their thermal properties show good thermal conductivity, and their mechanical properties show good flexibility. Using carbon nanotubes to prepare thermistors with thermal properties can realize high-sensitivity and high-precision temperature detection elements 200. At different temperatures, the first thermistor 201 and the second thermistor 202 with thermal properties have different resistivities. Measuring the resistance characteristics of the temperature detection element 200 can sense the temperature; and using carbon nanotubes to prepare the first force-sensitive resistor 301 and the second force-sensitive resistor 302 with mechanical properties can realize high-sensitivity and high-precision pressure detection elements 300. Under different pressures, the first force-sensitive resistor 301 and the second force-sensitive resistor 302 with mechanical properties will produce different degrees of deformation, and thus present different resistance characteristics. Measuring the resistance characteristics of the pressure detection element 300 can sense the pressure.

[0083] Of course, other semiconductor materials can also be used. These materials should also have effect properties that are sensitive to specific physical quantities. These effect properties can be used to convert various non-electrical physical quantities such as mechanical quantities, optical quantities, thermal quantities, magnetic quantities, and biological quantities into electrical signals. For example, thermosensitive semiconductor materials have a strong thermoelectric effect, which can convert thermal quantities (temperature) into electrical signals. They are divided into positive temperature coefficients (when the temperature increases, the resistivity decreases) and negative temperature coefficients (when the temperature increases, the resistivity decreases). That is, the resistance value changes with the temperature. Therefore, using thermosensitive semiconductor materials to prepare resistor structures with thermal properties can realize highly sensitive and high-precision temperature detection elements. Force-sensitive semiconductor materials have a strong piezoresistive effect, which can convert various mechanical quantities such as force, acceleration, and flow into electrical signals. The piezoresistive effect refers to the physical phenomenon that when a semiconductor crystal is subjected to pressure, the symmetry of the crystal changes, and the conductive mechanism also changes accordingly, causing the resistance value to change. That is, the resistance value changes with the pressure. Therefore, using force-sensitive semiconductor materials to prepare resistor structures with mechanical properties can realize highly sensitive and high-precision pressure detection elements.

[0084] Please refer to Figure 5 , Figure 5 The figure shows the working principle of the air intake monitoring system provided by this embodiment. Figure 5 As shown, when the air intake monitoring system is used to monitor the air intake, for the same time period or the same moment (which can also be understood as the moment to be monitored), the pressure detection element of each sensor substructure in the air intake sensor in the air intake monitoring system collects the pressure value of the air intake at the air inlet, and the resistance change of the first force-sensitive resistor and the second force-sensitive resistor is obtained to obtain the resistance change amount 1, and then the output current of the circuit is changed to obtain the current data 1; and the temperature detection element collects the temperature value of the air inlet, and the resistance change of the first thermistor and the second thermistor is obtained to obtain the resistance change amount 2, and then the output current of the circuit is changed to obtain the current data 1. The output current changes to obtain current data 2; current data 1 and current data 2 are integrated, such as through convolution operation, to obtain target air intake volume data 1; therefore, for each sensor substructure in the air intake volume sensor, target air intake volume data 1, target air intake volume data 2, target air intake volume data 3, ..., target air intake volume data N can be obtained in sequence, where N is the number of air intake volume sensors in the air intake volume monitoring system, and N ≥ 2, but preferably N = 2; then, target air intake volume data 1 to target air intake volume data N are stored through the data storage unit, and finally the data output unit outputs the monitoring results. In order to simplify the drawings, the embodiment of the present invention provides Figure 5 Only the schematic diagram of the working principle corresponding to the case where the air intake volume sensor has two sensor substructures is depicted, but the present invention is not limited thereto.

[0085] In summary, in the present invention, on the one hand, the air intake volume monitoring system can be set at a position parallel to the air volume direction in the air intake duct, that is, on the side wall of the air intake duct, and the data acquisition device may include an air intake volume sensor, and the air intake volume sensor may include multiple temperature detection elements and multiple pressure detection elements. Therefore, a sensor substructure composed of a different temperature detection element and a pressure detection element located outside the temperature detection element can be used to obtain multiple air intake volume data in the same time period, and then based on the multiple air intake volume data, the target air intake volume data can be integrated. That is, through multi-position or multi-directional air intake volume monitoring and data acquisition, the influence of the setting position of the data acquisition device on the air intake data acquisition can be avoided, and the application scenarios can be expanded. purpose, while improving the monitoring sensitivity and accuracy of the air intake monitoring system; on the other hand, the alternating and staggered arrangement of multiple thermistors (first thermistor and second thermistor) of special shapes in the temperature detection element in each sensor substructure, and multiple force-sensitive resistors (first force-sensitive resistor and second force-sensitive resistor) of special shapes in the pressure detection element, maximizes the utilization of the substrate occupied area, and at the same time improves the monitoring accuracy; moreover, the temperature detection element that only includes thermistors can also be driven by constant current, thereby avoiding the interference problem caused by the voltage drive caused by the voltage divider resistor in the traditional temperature detection element, that is, further improving the monitoring sensitivity and accuracy of the air intake monitoring system.

[0086] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other changes to the technical solution and technical content disclosed in the present invention shall be deemed to be within the scope of the present invention and still fall within the scope of protection of the present invention.

Claims

1. An air intake volume monitoring system, applied to an air intake pipe having an air inlet, characterized in that: The air intake monitoring system includes: The data acquisition device is located on the side wall of the air inlet duct near the air inlet, and includes an air flow sensor arranged along an extension direction parallel to the side wall of the duct. The air flow sensor includes: substrate; a plurality of temperature detection elements, located on the substrate, the temperature detection elements including a plurality of first thermistors and a plurality of second thermistors, the plurality of first thermistors extending along a first direction and spaced apart from each other along a second direction, the plurality of second thermistors extending along the second direction and spaced apart from each other along the first direction, the first direction and the second direction being perpendicular to each other; a plurality of pressure sensing elements located on the substrate, the pressure sensing elements comprising a plurality of first force-sensitive resistors and a plurality of second force-sensitive resistors, the first force-sensitive resistors extending along the first direction and being alternately spaced along the second direction and being disposed between two adjacent first thermistors, and the second force-sensitive resistors extending along the second direction and being alternately spaced along the first direction and being disposed between two adjacent second thermistors; and A power drive module, used to provide a constant current power supply to the temperature detection element and the pressure detection element; Wherein, the temperature detection element and the pressure detection element constitute a sensor substructure.

2. The air intake monitoring system according to claim 1, wherein: The air intake sensor further includes: Multiple connecting wires, including: A plurality of first connecting wires are located between adjacent first thermistors and between adjacent second thermistors, to connect the plurality of first thermistors and the plurality of second thermistors in the sensor substructure in series and / or in parallel; A plurality of second connecting wires are located between adjacent first force-sensitive resistors and between adjacent second force-sensitive resistors to connect the plurality of first force-sensitive resistors and the plurality of second force-sensitive resistors in the sensor substructure in series and / or in parallel.

3. The air intake monitoring system according to claim 1, wherein: The projection shapes of the first thermistor and the first force-sensitive resistor on the substrate are the same, and the projection shape of the first thermistor on the substrate includes a serpentine line shape, a wavy shape, or a long strip shape.

4. The air intake monitoring system according to claim 1, wherein: The second thermistor and the second force-sensitive resistor have the same projected shape on the substrate, and the projected shape of the second thermistor on the substrate includes a strip shape.

5. The air intake monitoring system according to claim 1, wherein: In the same temperature detection element, some of the first thermistors have different extension lengths in the first direction, and some of the second thermistors have different extension lengths in the second direction.

6. The air intake monitoring system according to claim 5, wherein: In the same pressure detection element, some of the first force-sensitive resistors have different extension lengths in the first direction, and some of the second force-sensitive resistors have different extension lengths in the second direction.

7. The air intake monitoring system according to claim 6, wherein: The width of the first thermistor in the second direction is the same as the width of the first force-sensitive resistor in the second direction.

8. The air intake monitoring system according to claim 6, wherein: The width of the second thermistor in the first direction is the same as the width of the second force-sensitive resistor in the first direction.

9. The air intake monitoring system according to claim 6, wherein: The spacing between adjacent first thermistors and first force-sensitive resistors in the second direction is a first spacing, the spacing between adjacent second thermistors and second force-sensitive resistors in the first direction is a second spacing, and the first spacing is equal to the second spacing.

10. The air intake monitoring system according to claim 1, wherein: The air intake volume monitoring system according to claim 1, wherein the sensitivity of the air intake volume sensor is determined by an algorithm optimization model, wherein the algorithm optimization model is: S total =f(W,L,ρ,P,T,X,Y); The constraints in the algorithm optimization model are: IN min ≤W≤W max ; L min ≤L≤L max ; T low ≤T≤T high ; P min ≤P≤W max ; X min ≤X≤X max ; AND min ≤Y≤Y max ; S N ≤S Nmax ; Wherein, Stotal is the sensitivity of the air intake sensor, W is the equivalent length of the first force-sensitive resistor or the second force-sensitive resistor, L is the equivalent width of the first force-sensitive resistor or the second force-sensitive resistor, ρ is the resistivity of the first force-sensitive resistor and the second force-sensitive resistor, T is the absolute temperature of the gas in the environment, P is the pressure in the environment, X is the spacing between adjacent pressure detection elements or the spacing between adjacent temperature detection elements, Y is the first spacing between adjacent first thermistors and first force-sensitive resistors or the second spacing between adjacent second thermistors and second force-sensitive resistors, P min and P max are the lowest and highest pressures given by the pressure in the environment, T low and T high are the lowest and highest temperatures given by the environment, X min and X max The minimum width and maximum width given for the spacing between adjacent pressure detection elements or the spacing between adjacent temperature detection elements, Y min and Y max The minimum width and maximum width are given for the first spacing between adjacent first thermistors and first force-sensitive resistors or the second spacing between adjacent second thermistors and second force-sensitive resistors, respectively. N is the power spectral density, S Nmax is the maximum thermal noise power spectral density given by the design.

11. The air intake monitoring system according to claim 1, wherein: The data acquisition device also includes: An auxiliary acquisition device is located on the substrate and cooperates with the data acquisition device to receive the air intake volume data output by different sensor substructures in the same time period, and output the air intake volume data to other functional modules of the air intake volume monitoring system.

12. The air intake monitoring system according to claim 11, wherein: Also includes: The data processing device is connected to the auxiliary acquisition device and is used to receive the air intake volume data of different sensor substructures and integrate the different air intake volume data to obtain target air intake volume data.

Citation Information

Patent Citations

  • Flexible Temperature and Strain Sensors

    US20150016487A1