Power supply system and server system

Abstract

The present application discloses a power supply system and a server system, relating to the field of power supply technology. The power supply system includes: a server motherboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board; a power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server motherboard; the server motherboard is connected to the front window backplane via the front window backplane connector, the server motherboard is connected to the heat dissipation device board via the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to multiple rear window backplanes; the power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and heat dissipation device board. Through this application, the technical problem of the excessively large area of ​​the server motherboard in the related art is solved, and the technical effect of reducing the area of ​​the server motherboard is achieved.

Description

Technical Field

[0001] The present application relates to the field of power supply technology, and in particular to a power supply system and a server system. Background Art

[0002] The server motherboard is a core component of the server, acting as the server's brain, connecting and transmitting data to key components like the CPU (Central Processing Unit). It determines the server's performance, stability, and scalability. Its quality and design directly impact the server's operational efficiency and data processing capabilities, and are the foundation for building efficient and reliable server systems. However, the increasing complexity of server motherboard functions has led to larger motherboard sizes. However, excessively large motherboards can increase wiring distances, leading to signal delays or attenuation, impacting data transmission efficiency and stability. Furthermore, large motherboards are more difficult to repair and upgrade. Summary of the Invention

[0003] The present application provides a power supply system and a server system to at least solve the problem of excessively large server mainboard area in the related art.

[0004] The present application provides a power supply system, including: a server mainboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board; a power connector, a front window backplane connector, and a heat dissipation device board connector are provided on the server mainboard; the server mainboard is connected to the front window backplane via the front window backplane connector, the server mainboard is connected to the heat dissipation device board via the heat dissipation device board connector, and the server mainboard is directly and / or indirectly connected to multiple rear window backplanes; the power connector is used to connect to a server power supply and obtain a target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and the heat dissipation device board.

[0005] The present application also provides a server system, including: multiple storage devices, a heat dissipation device, a server power supply and the aforementioned power supply system, wherein the multiple storage devices are connected to the front window backplane and multiple rear window backplanes in the power supply system, the heat dissipation device is connected to the heat dissipation device board in the power supply system, and the server power supply is connected to the power connector on the server mainboard in the power supply system.

[0006] The present application discloses a power supply system comprising a server motherboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board. The server motherboard is provided with a power connector, a front window backplane connector, and a heat dissipation device board connector. The server motherboard is connected to the front window backplane via the front window backplane connector, the server motherboard is connected to the heat dissipation device board via the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to multiple rear window backplanes. The power connector is used to connect to the server power supply and obtain a target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and heat dissipation device board. The power supply system of the present application is provided with a front window backplane, a rear window backplane, and a heat dissipation device board, and some components on the server motherboard are transferred to the front window backplane, the rear window backplane, and the heat dissipation device board, thereby reducing the area of ​​the server motherboard. Therefore, the technical problem of the excessively large area of ​​the server motherboard in the related art can be solved, achieving the technical effect of reducing the area of ​​the server motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0008] Figure 1 The architecture of the power supply system according to the embodiment of the present application Figure 1 ;

[0009] Figure 2 The architecture of the power supply system according to the embodiment of the present application Figure 2 ;

[0010] Figure 3 The architecture of the power supply system according to the embodiment of the present application Figure 3 ;

[0011] Figure 4 The architecture of the power supply system according to the embodiment of the present application Figure 4 ;

[0012] Figure 5 The architecture of the power supply system according to the embodiment of the present application Figure 5 ;

[0013] Figure 6 The architecture of the power supply system according to the embodiment of the present application Figure 6 ;

[0014] Figure 7 The architecture of the power supply system according to the embodiment of the present application Figure 7 ;

[0015] Figure 8The architecture of the power supply system according to the embodiment of the present application Figure 8 ;

[0016] Figure 9 The architecture of the power supply system according to the embodiment of the present application Figure 9 ;

[0017] Figure 10 The architecture of the power supply system according to the embodiment of the present application Figure 10 ;

[0018] Figure 11 The architecture of the power supply system according to the embodiment of the present application Figure 10 one;

[0019] Figure 12 This is a schematic diagram of a server system according to an embodiment of the present application. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0021] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0022] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0023] In this embodiment, a power supply system is provided. Figure 1 The architecture of the power supply system according to the embodiment of the present application Figure 1 ,like Figure 1As shown, the power supply system includes: a server motherboard, a front window backplane, multiple rear window backplanes and a heat dissipation device board; a power connector, a front window backplane connector and a heat dissipation device board connector are set on the server motherboard; the server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to multiple rear window backplanes; the power connector is used to connect to the server power supply and obtain the target voltage from the server power supply to power the front window backplane, multiple rear window backplanes and the heat dissipation device board.

[0024] The above power supply system includes a server motherboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board. The server motherboard is provided with a power connector, a front window backplane connector, and a heat dissipation device board connector. The server motherboard is connected to the front window backplane via the front window backplane connector. The server motherboard is connected to the heat dissipation device board via the heat dissipation device board connector. The server motherboard is directly and / or indirectly connected to multiple rear window backplanes. The power connector is used to connect the server power supply and obtain the target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and heat dissipation device board. The power supply system in this application is provided with a front window backplane, a rear window backplane, and a heat dissipation device board. Some components on the server motherboard are transferred to the front window backplane, the rear window backplane, and the heat dissipation device board, thereby reducing the area of ​​the server motherboard. Therefore, the technical problem of the excessively large area of ​​the server motherboard in the related art can be solved, and the technical effect of reducing the area of ​​the server motherboard can be achieved.

[0025] Optionally, in this embodiment, it is worth noting that Figure 1 The relative setting position of the heat dissipation device plate shown is only an example. The heat dissipation device plate in this application can be, but is not limited to, set on the same side of the front window back panel, or can also be, but is not limited to, set on the same side of the rear window back panel, or set at other positions. This application does not impose any restrictions on this.

[0026] Optionally, in this embodiment, the power supply system may include but is not limited to a server mainboard, a front window backplane, multiple rear window backplanes and a heat dissipation device board, and the power supply system may be used to supply power to various expansion boards and heat dissipation devices in the server but is not limited to.

[0027] Optionally, in this embodiment, the server motherboard may refer to, but is not limited to, the server system motherboard, which is typically located in the center of the server chassis and is the core and foundation of the server's internal hardware. The server motherboard is the connection point and communication center for all hardware components, including the processor (CPU), memory, hard drive, power management unit, network interface card, etc. These components connect and communicate through various slots and interfaces on the motherboard. The design and quality of the server motherboard directly affect the system's stability and data processing performance. It must support high-speed data transmission, efficient power management, and complex thermal design to ensure stable operation of the server even under high loads. Server motherboards are typically designed with redundancy and hot-swappable features, such as redundant power supplies, hot-swappable hard drives, and network interfaces, which are crucial for improving server availability and maintainability.

[0028] Optionally, in this embodiment, the server mainboard may include, but is not limited to, the following components:

[0029] Central Processing Unit: The server motherboard can support, but is not limited to, multi-core high-end processors to perform the core computing tasks of the server;

[0030] Memory slots: Server motherboards can be equipped with, but are not limited to, a large number of DDR (Double Data Rate) memory slots to support high-capacity and high-performance memory modules.

[0031] Network interface: The server motherboard may be, but is not limited to, integrated with a multi-port network controller that supports Gigabit or 10 Gigabit networks. The server motherboard may also be, but is not limited to, equipped with a fiber optic interface;

[0032] Power connector: used to receive external power, including but not limited to a main power connector and an auxiliary power connector, supporting redundant power input;

[0033] Expansion slots: A server motherboard may be provided with, but is not limited to, expansion slots. For example, a server motherboard may be provided with, but is not limited to, a PCIe (Peripheral Component Interconnect Express) slot for installing various expansion cards.

[0034] Monitoring and management devices: The server motherboard may be provided with, but is not limited to, monitoring and management devices. For example, the server motherboard may be provided with, but is not limited to, a Baseboard Management Controller (BMC) for monitoring server status and providing remote management functions.

[0035] Optionally, in this embodiment, the heat dissipation device board may refer to, but is not limited to, a board card on which a heat dissipation device is deployed.

[0036] Optionally, in this embodiment, the heat dissipation device board may include but is not limited to a fan board, and the fan board may be integrated with but is not limited to one or more fans to use air convection for heat dissipation. The fan may be powered by but is not limited to the mainboard, and the speed may be controlled by a PWM (Pulse Width Modulation) signal to adapt to different heat load requirements.

[0037] Optionally, in this embodiment, the heat sink plate may also include, but is not limited to, a water cooling plate. The water cooling plate may include, but is not limited to, a water pump and a series of water channels or heat exchangers. The water pump requires electricity to circulate the coolant. After absorbing heat, the coolant is transported to an external radiator (typically located outside or on top of the server) for cooling, and then circulated back to the heat sink plate.

[0038] Optionally, in this embodiment, the heat sink may also include, but is not limited to, a hybrid heat sink. This hybrid heat sink combines the advantages of air cooling and water cooling, utilizing both fans and coolant in a single system. The fan helps the coolant dissipate heat more quickly, while the coolant transfers heat away from critical components such as the CPU. The entire system, including the fans and coolant circulation system, requires electrical power.

[0039] Optionally, in this embodiment, compared to a traditional server mainboard in which a heat dissipation device is integrated on the server mainboard, the present application separates the heat dissipation device board from the server mainboard, thereby simplifying the complexity of the server mainboard.

[0040] Optionally, in this embodiment, the front panel backplane can be used for, but is not limited to, server front-end expansion and connectivity. In a server configuration, the front panel backplane can be located near the server's front panel and used to connect various front-panel devices, such as hard drives, optical drives, and USB (Universal Serial Bus) interfaces. The front panel backplane can be connected to the server motherboard via, but is not limited to, the front panel backplane connector on the server motherboard, receiving power and data signals from the motherboard. The front panel backplane can be, but is not limited to, serving as the first-layer interface between the server and external devices.

[0041] Optionally, in this embodiment, a rear window backplane may be, but is not limited to, located at the rear of the server, for connecting and expanding rear interfaces such as hard drives, network interfaces, additional power inputs, and rear storage devices. The number and configuration of rear window backplanes may be, but are not limited to, determined based on the specific needs of the server. The design of the rear window backplane may, but is not limited to, focus on the scalability and maintainability of the server's backend.

[0042] Optionally, in this embodiment, the front window backplane and the rear window backplane may be, but are not limited to, backplanes connected to storage devices. For example, the front window backplane and the rear window backplane may be, but are not limited to, hard disk backplanes.

[0043] Optionally, in this embodiment, the types and quantities of storage devices allowed to be connected to the front backplane and the types and quantities of storage devices allowed to be connected to the rear backplane can be the same or different. For example, the front and rear backplanes can both support, but are not limited to, SATA (Serial Advanced Technology Attachment) hard drives and NVMe (Non-Volatile Memory Express) hard drives, or the front backplane can support, but is not limited to, SATA and NVMe hard drives, while the rear backplane can support, but is not limited to, only NVMe hard drives. For example, the front backplane can support, but is not limited to, 24 simultaneous storage devices, while the rear backplane can support, but is not limited to, 12 simultaneous storage devices.

[0044] Optionally, in this embodiment, the types and quantities of storage devices allowed to be connected to the multiple rear window backplanes in this application can be the same or different. For example, there can be, but are not limited to, three rear window backplanes: rear window backplane 1, rear window backplane 2, and rear window backplane 3. Rear window backplane 1 can, but is not limited to, allow the connection of 12 storage devices, rear window backplane 2 can, but is not limited to, allow the connection of 4 storage devices, and rear window backplane 3 can, but is not limited to, allow the connection of 2 storage devices.

[0045] Optionally, in this embodiment, compared to the traditional server motherboard that integrates the storage device on the server motherboard, the present application separates the storage device backplane (including the front window backplane and the rear window backplane) from the server motherboard, thereby simplifying the complexity of the server motherboard.

[0046] Optionally, in this embodiment, a power connector may be provided on the server motherboard, but is not limited to being a key component that connects the server power supply to the server motherboard or other internal components. The power connector may be designed with, but is not limited to, specific pins and contacts for transmitting DC power of different voltage levels, and may also include the transmission of data and control signals. In addition to directly supplying power to the motherboard, the power connector provided on the server motherboard may also distribute power to other components, such as the front window backplane, rear window backplane, heat dissipation device board, etc. In addition, the power connector may also have, but is not limited to, a locking mechanism to prevent system instability caused by accidental disconnection, and may be designed with a foolproof function to ensure correct polarity and voltage matching to prevent damage caused by incorrect or reverse insertion.

[0047] Optionally, in this embodiment, the power connector can be, but is not limited to, used to connect a server power supply. The server power supply can be, but is not limited to, a PSU (Power Supply Unit) specially designed for a server system, which is used to convert AC power into a DC voltage suitable for use by the internal components of the server. The server power supply can be, but is not limited to, including multiple protection mechanisms, such as overvoltage, undervoltage, overcurrent, and short-circuit protection, to ensure safe operation even in harsh environments. The server power supply can be, but is not limited to, also supporting redundant configuration, that is, multiple power modules can be installed in the same server. When one of the power supplies fails, the other power modules can still ensure normal power supply to the server, thereby improving the availability of the system.

[0048] Optionally, in this embodiment, the power connector can be, but is not limited to, connected to a server power supply to obtain a target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and the heat dissipation device board.

[0049] Optionally, in this embodiment, the target voltage obtained by the power connector from the server power supply may be, but is not limited to, a voltage that meets the voltage requirements of components such as the server motherboard, front window backplane, multiple rear window backplanes, and heat sink board. The selection and setting of the target voltage may be, but is not limited to, based on the electrical specifications and operating conditions of each component in the system.

[0050] Optionally, in this embodiment, the power connector may, but is not limited to, obtain a target voltage from the server power supply via an inter-board connection. The power connector may, but is not limited to, provide the obtained target voltage to the front window backplane connector and the heat sink board connector via an intra-board connection. The front window backplane connector then provides the target voltage to the front window backplane via an inter-board connection, and the heat sink board connector then provides the target voltage to the heat sink board via an inter-board connection. Optionally, the inter-board connection may, but is not limited to, be implemented via a rigid or flexible cable. The intra-board connection may, but is not limited to, be implemented via a metal conductor path on the server motherboard, such as a copper foil trace on the server motherboard.

[0051] Optionally, in this embodiment, the server mainboard can be connected to the front window backplane through, but not limited to, the front window backplane connector. Optionally, the server mainboard can be connected to the front window backplane through, but not limited to, the front window backplane connector by connecting to the third connector on the front window backplane to achieve connection with the front window backplane.

[0052] Optionally, in this embodiment, the server mainboard can be connected to the heat dissipation device board through, but not limited to, a heat dissipation device board connector. Optionally, the server mainboard can be connected to the heat dissipation device board through, but not limited to, a heat dissipation device board connector to achieve connection with the heat dissipation device board.

[0053] Optionally, in this embodiment, the server mainboard may be, but is not limited to, directly and / or indirectly connected to multiple rear window backplanes. Specifically, the server mainboard may be, but is not limited to, directly connected to all of the multiple rear window backplanes, or the server mainboard may be, but is not limited to, indirectly connected to all of the multiple rear window backplanes, or may be, but is not limited to, directly connected to some of the multiple rear window backplanes and indirectly connected to the remaining rear window backplanes.

[0054] Optionally, in this embodiment, Figure 2 The architecture of the power supply system according to the embodiment of the present application Figure 2 ,like Figure 2 As shown, the server motherboard is connected to the front window backplane through the front window backplane connector, the server motherboard is connected to the heat dissipation device board through the heat dissipation device board connector, the server motherboard is connected to the server power supply through the power connector, and the server motherboard is directly connected to all rear window backplanes (i.e., rear window backplane 1 to rear window backplane N) in multiple rear window backplanes.

[0055] Optionally, in this embodiment, Figure 3 The architecture of the power supply system according to the embodiment of the present application Figure 3 ,like Figure 3 As shown, the heat dissipation device board is connected to the server mainboard by connecting to the heat dissipation device board connector on the server mainboard, the server power supply is connected to the server mainboard by connecting to the power connector on the server mainboard, the front window backplane is connected to the server mainboard by connecting to the front window backplane connector on the server mainboard, the rear window backplane 1-rear window backplane N-1 are directly connected to the server mainboard, and the rear window backplane N is indirectly connected to the server mainboard by connecting to the front window backplane.

[0056] Optionally, in this embodiment, Figure 4 The architecture of the power supply system according to the embodiment of the present application Figure 4 ,like Figure 4 As shown, the power connector on the server motherboard is connected to the server power supply, the heat dissipation device board connector on the server motherboard is connected to the heat dissipation device board, the front window backplane connector on the server motherboard is connected to the front window backplane, the rear window backplanes 1-rear window backplanes N are all connected to the front window backplane, and the rear window backplanes 1-rear window backplanes N are all indirectly connected to the server motherboard.

[0057] Optionally, in this embodiment, Figure 5 The architecture of the power supply system according to the embodiment of the present application Figure 5 ,like Figure 5As shown, the heat dissipation device board is connected to the heat dissipation device board connector, the server power supply is connected to the power connector, the front window backplane is connected to the front window backplane connector, the rear window backplane 1 is connected to the rear window backplane 2, the rear window backplane 2 is connected to the rear window backplane 3, and so on. The rear window backplane N-1 is connected to the rear window backplane N, and the rear window backplane N is connected to the front window backplane. The rear window backplanes 1-rear window backplanes N are connected to the server mainboard through indirect connection.

[0058] As an optional embodiment, multiple rear window backplanes include: a first backplane, and one or more second backplanes; a first connector is set on the front window backplane, and one or more second connectors are also set on the server mainboard; the first backplane is connected to the first connector, and one or more second backplanes are connected one-to-one with one or more second connectors.

[0059] Optionally, in this embodiment, the multiple rear window backplanes may include but are not limited to two types of backplanes, namely a first backplane and one or more second backplanes, wherein one type of backplane, namely the first backplane, is connected to the first connector set on the front window backplane and is indirectly connected to the server mainboard through the front window backplane, and the other type of backplane, namely one or more second backplanes, is connected one-to-one to one or more second connectors on the server mainboard.

[0060] Optionally, in this embodiment, the number of storage devices allowed to be connected to the first backplane and the number of storage devices allowed to be connected to the second backplane may be the same or different. For example, the first backplane may, but is not limited to, allow the connection of 12 storage devices, and the second backplane may, but is not limited to, also allow the connection of 12 storage devices; or the second backplane may, but is not limited to, allow the connection of 12 storage devices, and the second backplane may, but is not limited to, allow the connection of 4 storage devices.

[0061] Optionally, in this embodiment, the number of storage devices allowed to be connected to each second backplane in the multiple second backplanes may be the same or different. For example, the second backplane 1 in the multiple second backplanes allows the connection of 12 storage devices, and the second backplane 2 in the multiple second backplanes may also but is not limited to allowing the connection of 12 storage devices; or, the second backplane 1 in the multiple second backplanes allows the connection of 12 storage devices, and the second backplane 2 in the multiple second backplanes may but is not limited to allowing the connection of 4 storage devices.

[0062] Optionally, in this embodiment, Figure 6 The architecture of the power supply system according to the embodiment of the present application Figure 6 ,like Figure 6As shown, multiple rear window backplanes include a first backplane and three second backplanes (second backplane 1, second backplane 2, and second backplane 3), a first connector is provided on the front window backplane, and the first backplane is connected to the front window backplane through connection with the first connector, and three second connectors (second connector 1, second connector 2, and second connector 3) are provided on the server mainboard, the second backplane 1 is connected to the second connector 1, the second backplane 2 is connected to the second connector 2, and the second backplane 3 is connected to the second connector 3.

[0063] Through the above content, the rear window backplanes are divided into different types and connected through different connectors, so that the server can flexibly configure the number and type of backplanes according to the required expansion capabilities and device types, thereby enhancing the adaptability and expansion capabilities of the system.

[0064] As an optional implementation, a first number of storage device connectors is provided on the first backplane, and a second number of storage device connectors is provided on the second backplane; the first number is greater than the second number.

[0065] Optionally, in this embodiment, the rear window backplane with a greater number of storage device connectors may be, but is not limited to, determined as the first backplane connected to the front window backplane, while the rear window backplane with a smaller number of storage device connectors may be determined as the second backplane directly connected to the server mainboard. For example, for a power supply system including three rear window backplanes, if rear window backplane 1 has 12 storage device connectors, rear window backplane 2 has 4 storage device connectors, and rear window backplane 3 has 2 storage device connectors, rear window backplane 1 may be, but is not limited to, determined as the first backplane, rear window backplane 2 as the second backplane, and rear window backplane 3 as the second backplane as well.

[0066] Optionally, in this embodiment, the storage device connector may be, but is not limited to, used to connect a storage device. The storage device connector may be, but is not limited to, a key component for data transmission and power supply between the server motherboard and storage devices (such as hard disk drives, solid-state drives, etc.). The storage device connector may be, but is not limited to, not only connecting the storage device to the server motherboard but also performing signal transmission and power management, ensuring fast data transmission and the normal operation of the storage device. Storage device connectors can come in various types based on different interface standards and technologies. Storage device connectors may include, but are not limited to, SATA connectors (SATA is a widely used hard disk interface that provides high-speed data transmission rates and typically uses a 7-pin or 15-pin connector for data transmission and power supply), SAS (Serial Attached SCSI) connectors (SAS connectors are used to connect SCSI (Small Computer System Interface) hard drives, providing higher data transmission rates and more reliable performance than SATA), and NVMe connectors (NVMe connectors are primarily used for solid-state drives, particularly high-speed PCIe-based SSDs).

[0067] Optionally, in this embodiment, the first number of storage device connectors of the first backplane is greater than the second number of storage device connectors of the second backplane, and the connection resources required by the first backplane are greater than the connection resources required by the second backplane.

[0068] Through the above content, the rear window backplane that requires more connection resources is set as the first backplane that is indirectly connected to the server mainboard by directly connecting to the front window backplane, and the rear window backplane that requires fewer connection resources is set as the second backplane that is directly connected to the server mainboard. The server mainboard only needs to provide connection resources with smaller specifications (smaller pins or thinner connecting wires) to meet the needs of the second backplane being directly connected to the server mainboard, further saving space on the mainboard.

[0069] As an optional embodiment, the first backplane includes: a rear window backplane with 12 storage device connectors; one or more second backplanes include: a rear window backplane with 4 storage device connectors and / or a rear window backplane with 2 storage device connectors.

[0070] Optionally, in this embodiment, the first backplane may be provided with, but is not limited to, 12 storage device connectors.

[0071] Optionally, in this embodiment, the one or more second backplanes may include, but are not limited to, a second backplane provided with four storage device connectors.

[0072] Optionally, in this embodiment, the one or more second backplanes may include, but are not limited to, a second backplane provided with two storage device connectors.

[0073] Optionally, in this embodiment, the one or more second backplanes may include, but are not limited to, a second backplane provided with four storage device connectors and a second backplane provided with two storage device connectors.

[0074] Optionally, in this embodiment, Figure 7 The architecture of the power supply system according to the embodiment of the present application Figure 7 ,like Figure 7 As shown, the first backplane may include, but is not limited to, a rear window backplane with 12 storage device connectors, and one or more second backplanes include: a second backplane A with 4 storage device connectors and a second backplane B with 2 storage device connectors.

[0075] As an optional implementation, a third connector is further provided on the front window back panel, and the third connector is connected to the front window back panel connector.

[0076] Optionally, in this embodiment, if Figure 7 As shown, a third connector is also provided on the front window backplane, and the third connector is connected to the front window backplane connector on the server mainboard.

[0077] Optionally, in this embodiment, in the power supply system design, the front window backplane connector can be, but is not limited to, used to directly receive signals and power provided by the server motherboard, and further distribute them to various devices on the front window backplane, such as hard disk drives, solid-state drives, or other storage units. The third connector can be, but is not limited to, an additional interface provided on the front window backplane, and the third connector can be, but is not limited to, establishing a connection with the front window backplane connector on the server motherboard. The third connector can be, but is not limited to, serving as a secondary distribution point for signals and data, that is, the data signal received from the server motherboard through the front window backplane connector is redistributed to multiple storage devices or other components on the front window backplane through the third connector, thereby achieving effective expansion and distribution of the signal. Similarly, the third connector can also be, but is not limited to, used for secondary distribution of power to ensure that all devices on the front window backplane can receive a stable power supply.

[0078] As an optional embodiment, there is a first position difference between the setting position of the first connector on the front window back panel and the setting position of the third connector on the front window back panel, and the first position difference is used to distinguish the first connector and the third connector from the setting position when the first connector and the third connector are blind-plugged; or, the blind-plug interface of the first connector and the blind-plug interface of the third connector have a first interface difference, and the first interface difference is used to distinguish the first connector and the third connector from the blind-plug interface when the first connector and the third connector are blind-plugged.

[0079] Optionally, in this embodiment, in order to ensure the assembly efficiency during the assembly of the power supply system, position differences or interface differences can be set, but are not limited to setting them, to help assembly workers quickly identify the first connector and the third connector to avoid wiring errors.

[0080] Optionally, in this embodiment, the location of the first connector on the front window back panel and the location of the third connector on the front window back panel may have, but is not limited to, a first position difference. Specifically, the first position difference may be achieved by, but is not limited to, differentiating by physical spacing: by arranging the first connector and the third connector on the front window back panel to ensure sufficient physical spacing between them, such spacing can serve as a basis for differentiation during blind plugging to avoid inserting the wrong connector; or, by differentiating by structural layout: when designing the front window back panel, the first connector and the third connector may be arranged at different heights or angles, and blind plugging may be differentiated by utilizing spatial differences. For example, one connector may be designed as a straight-plug type, while the other may be a side-plug type.

[0081] Optionally, in this embodiment, if Figure 7 As shown, the first connector can be arranged on one side of the front window back panel, and the third connector can be arranged on the other side of the front window back panel, thereby achieving a first position difference between the setting position of the first connector and the setting position of the third connector.

[0082] Optionally, in this embodiment, the first position difference can be used, but is not limited to, to distinguish the first connector and the third connector from the setting position when blindly plugging the first connector and the third connector. Through the first position difference, the assembly worker can quickly identify the first connector and the third connector.

[0083] Optionally, in this embodiment, the blind-mate interface of the first connector and the blind-mate interface of the third connector may have, but is not limited to, a first interface difference, that is, there is a significant difference between the blind-mate interface of the first connector and the blind-mate interface of the third connector. Specifically, the first interface difference may be achieved by, but is not limited to, differentiating by interface size and shape: the first connector and the third connector are designed to have different sizes and shapes so that they can be distinguished by touch or shape even during a blind-mate operation; or differentiating by color coding: the first connector and the third connector or their blind-mate interface portions may be color-coded to assist the operator in identifying them in a poorly lit environment.

[0084] Optionally, in this embodiment, the first interface difference can be used, but is not limited to, to distinguish the first connector and the third connector from the blind plugging interface when the first connector and the third connector are blind plugged. Through the first interface difference, the assembly worker can quickly identify the first connector and the third connector.

[0085] Optionally, in this embodiment, the first connector and the third connector may be positioned at a first positional difference on the front window backplane, and two blind-mate interfaces with first interface differences may be provided for the first and third connectors. By adopting a differentiated strategy in position and interface design, a more secure, efficient, and user-friendly hardware system can be created, which not only reduces the difficulty of maintenance and upgrades but also improves the overall system stability and user experience of the server.

[0086] As an optional embodiment, the third connector is arranged on one short side of the front window back panel, and the third connector and the front window back panel connector are located on the same side of the power supply system; the first connector is arranged on the other short side of the front window back panel.

[0087] Optionally, in this embodiment, the front window back panel may include but is not limited to two short sides and two long sides, and the third connector may be set on one side of a short side of the front window back panel, and the first connector may be set on the other side of the short side of the front window back panel, so that the distance between the first connector and the third connector is approximately the distance of a long side, forming a first position difference.

[0088] Optionally, in this embodiment, the third connector can be, but is not limited to, arranged on the same side of the power supply system as the front window backplane connector. Figure 3 As shown, the third connector and the front window backplane connector can be, but are not limited to, arranged on the same side of the power supply system to avoid excessively long wiring and cross wiring.

[0089] As an optional embodiment, the distance between each second connector and the power connector falls within a target distance range, wherein the upper limit value of the target distance range is used to control the current generated between the second connector and the power connector to be less than or equal to the current threshold, and the lower limit value of the target distance range is used to control the interference generated by the second connector to the power connector to be less than the interference threshold.

[0090] Optionally, in this embodiment, the multiple second connectors on the server motherboard may, but are not limited to, be located neither too far nor too close to the power connector. If the second connectors are located too far from the power connector, a large through-current, i.e., intra-board current, will be generated between the second connectors and the power connector, resulting in excessive copper foil connections on the server motherboard. If the second connectors are located too close to the power connector, various interferences may easily occur between the second connectors and the power connector, such as interference in position and assembly operations. To reduce copper foil connections, reduce intra-board current, and to reduce interference and interference, the distance between the second connectors and the power connector needs to be limited to a certain range.

[0091] Optionally, in this embodiment, the distance between each second connector and the power connector can be limited to, but not limited to, a target distance range, wherein the upper limit value of the target distance range is used to control the flow generated between the second connector and the power connector to be less than or equal to a flow threshold, and the upper limit value can be, but not limited to, 100 mm (millimeter), and the lower limit value of the target distance range is used to control the interference generated by the second connector to the power connector to be less than an interference threshold, and the lower limit value can be, but not limited to, 2 mm.

[0092] Optionally, in this embodiment, the target distance range can be but not limited to 2mm-100mm, or the standard can be tightened, the target distance range can be but not limited to 3mm-100mm, the target distance range can also be but not limited to 2mm-50mm, or 2mm-70mm, or 3mm-50mm.

[0093] As an optional implementation manner, the distance between each second connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm.

[0094] Optionally, in this embodiment, the target distance range may be set to, but is not limited to, 2 mm to 100 mm.

[0095] As an optional implementation, in Figure 7In the power supply system shown, the power supply to the front window backplane can be implemented through, but not limited to, the following paths: the server power supply is connected to the server motherboard, the power connector is input into the front window backplane connector on the server motherboard, and the backplane connection cable is connected from the third connector to the front window backplane; the power supply to the first backplane can be implemented through, but not limited to, the following paths: after the server power supply is input, it passes through the copper foil of the PCB (Printed Circuit Board) inside the board, and passes through the E-FUSE (Electronic The front window backplane is powered by a fuse (electronic fuse). Another portion of the current then passes through the first connector and is output to the first backplane via a cable connecting the first connector and the first backplane, powering the first backplane. An E-FUSE is then placed on the first backplane to provide power to the first backplane. Powering the second backplane A and the second backplane B can be achieved through, but is not limited to, the following pathway: after the server power is input, the power passes through the PCB copper foil inside the board, through the E-FUSE, and then through the power connector on the second backplane A and the power connector on the second backplane B, respectively, to power the second backplane A and the second backplane B. Powering the heat sink board can be achieved through, but is not limited to, the following pathway: after the server power is input, the power passes through the PCB copper foil inside the board, through the E-FUSE, to the heat sink board connector, and then through the heat sink board's heat sink connector via the cable. The heat sink board can be, but is not limited to, a fan board, and the fan board can have, but is not limited to, a vertical fan connector so that the fan can be installed on the fan board from top to bottom. In this embodiment, the front window backplane connector and the heat sink board connector on the server motherboard can be, but are not limited to, identical models, providing enhanced current flow capacity. The two connectors are located on either side of the server motherboard, achieving a foolproof effect through cable positioning and length. Separating the heat sink board from the server motherboard reduces the size of the server motherboard, facilitating size reduction and lowering PCB board costs. The front window backplane connector's proximity to the power connector reduces current flow through the front window backplane within the server motherboard's PCB, alleviating issues such as high component density and high current flow pressure on the server motherboard.

[0096] As an optional embodiment, the multiple rear window backplanes include: a third backplane, and multiple fourth backplanes; a first connector is set on the front window backplane, and a fourth connector is also set on the server mainboard; the third backplane is connected to the first connector, and the multiple fourth backplanes are connected to the fourth connector; a first number of storage device connectors are set on the third backplane, and a second number of storage device connectors are set on the fourth backplane, and the sum of the second numbers of the multiple fourth backplanes is less than or equal to the first number.

[0097] Optionally, in this embodiment, Figure 8 The architecture of the power supply system according to the embodiment of the present application Figure 8 ,like Figure 8As shown, the power supply system's multiple rear window backplanes include a third backplane and multiple fourth backplanes (e.g., fourth backplane A and fourth backplane B). A first connector is provided on the front window backplane, and a fourth connector is provided on the server motherboard. The third backplane is connected to the front window backplane via the first connector, and the multiple fourth backplanes are connected to the fourth connector. For example, fourth backplane A and fourth backplane B are both connected to the fourth connector. By integrating multiple connectors corresponding to two or more backplanes into a single connector (i.e., the fourth connector), the server motherboard footprint can be further reduced, and the time it takes for assembly workers to locate connectors can be reduced.

[0098] Optionally, in this embodiment, the total number of storage device connectors set on the multiple fourth backplanes is less than the number of storage device connectors set on the third backplane. The rear window backplane that requires more connection resources is indirectly connected to the server mainboard, and the rear window backplane that requires fewer connection resources is directly connected to the server mainboard, which can further reduce the area required for the server mainboard.

[0099] As an optional embodiment, the third backplane includes: a rear window backplane provided with 12 storage device connectors; multiple fourth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

[0100] Optionally, in this embodiment, the third backplane may be provided with, but is not limited to, 12 storage device connectors.

[0101] Optionally, in this embodiment, the plurality of fourth backplanes may include, but are not limited to, a fourth backplane provided with four storage device connectors and a fourth backplane provided with two storage device connectors.

[0102] Optionally, in this embodiment, if Figure 8 As shown, the third backplane may include, but is not limited to, a rear window backplane with 12 storage device connectors, and the plurality of fourth backplanes include: a fourth backplane A with 4 storage device connectors and a fourth backplane B with 2 storage device connectors.

[0103] As an optional implementation, a plurality of fourth connectors are further provided on the server mainboard; and the plurality of rear window back panels are connected to the plurality of fourth connectors in a one-to-one correspondence.

[0104] Optionally, in this embodiment, the power supply system may include but is not limited to three rear window backplanes. Correspondingly, three fourth connectors may be provided on the server mainboard, but are not limited to, and the three rear window backplanes are connected to the three fourth connectors in a one-to-one correspondence.

[0105] Optionally, in this embodiment, Figure 9 The architecture of the power supply system according to the embodiment of the present application Figure 9,like Figure 9 As shown, three fourth connectors are set on the server motherboard: fourth connector A, fourth connector B and fourth connector C. The rear window backplane A is correspondingly connected to the fourth connector A, the rear window backplane B is correspondingly connected to the fourth connector B, and the rear window backplane C is correspondingly connected to the fourth connector C.

[0106] By setting all rear window backplanes to be directly connected to the server motherboard, mutual influence between backplanes can be avoided, and the situation where a backplane failure affects the normal operation of other backplanes can be avoided, thereby reducing the scope of the failure explosion.

[0107] As an optional implementation, Figure 10 The architecture of the power supply system according to the embodiment of the present application Figure 10 , in such Figure 10 In the power supply system shown, the power supply to the heat dissipation device board, the front window backplane, the rear window backplane, etc. can be, but is not limited to, all supplied by the PSU power input, and then directly reaches the heat dissipation device board, the front window backplane, and the rear window backplane through connectors and cables. Specifically, after the power connector is input, multiple groups of connectors (including the front window backplane connector, the heat dissipation device board connector, and multiple fourth connectors) are directly placed near the power connector. Alternatively, it is possible but not limited to add a connector interface to the power connector body, that is, directly divide the power supply part for the front window backplane, the rear window backplane, and the heat dissipation device board on the power connector, and the front window backplane, the rear window backplane, and the heat dissipation device board are directly connected to the corresponding parts on the power connector, further reducing the power flow in the motherboard. Through the above settings, the power flow of the daughter board power supply in the motherboard can be reduced, avoiding the power flow requirement of the power supply under the CPU part of the motherboard, which is beneficial to the motherboard copper foil planning and the reduction of the motherboard size.

[0108] As an optional implementation, a fifth connector is further provided on the server mainboard; and the plurality of rear window back panels are all connected to the fifth connector.

[0109] Optionally, in this embodiment, it is also possible but not limited to deploying only one fifth connector on the server mainboard, and multiple rear window backplanes are all connected to the one fifth connector.

[0110] By integrating multiple connectors corresponding to two or more backplanes into one connector (ie, the fifth connector), the area of ​​the server motherboard can be further reduced and the time for assembly workers to find the connector location can be reduced.

[0111] As an optional embodiment, multiple rear window backplanes include: a fifth backplane, and one or more sixth backplanes; a first connector is set on the front window backplane, and a sixth connector and one or more seventh connectors are set on the fifth backplane; the sixth connector is connected to the first connector, and one or more sixth backplanes are connected one-to-one with one or more seventh connectors.

[0112] Optionally, in this embodiment, multiple layers of series connection can be set up but are not limited to. After the fifth backplane is connected in series with the front window backplane, the seventh connector can be used to connect the sixth backplane in series. Multiple sixth backplanes can be connected in parallel but are not limited to being connected in parallel.

[0113] Optionally, in this embodiment, the power supply system may include, but is not limited to, two sixth backplanes, and correspondingly, the fifth backplane may be provided with, but is not limited to, two seventh connectors.

[0114] Optionally, in this embodiment, Figure 11 The architecture of the power supply system according to the embodiment of the present application Figure 10 One, such as Figure 11 As shown, the rear window backplane includes a fifth backplane and two sixth backplanes (sixth backplane A and sixth backplane B), the front window backplane is connected to the fifth backplane through the first connector and the sixth connector, the sixth backplane A is correspondingly connected to the seventh connector A on the fifth backplane, and the sixth backplane B is correspondingly connected to the seventh connector B on the fifth backplane.

[0115] As an optional embodiment, the fifth backplane includes: a rear window backplane provided with 12 storage device connectors; multiple sixth backplanes include: a rear window backplane provided with 4 storage device connectors and a rear window backplane provided with 2 storage device connectors.

[0116] Optionally, in this embodiment, the fifth backplane may be provided with, but is not limited to, 12 storage device connectors.

[0117] Optionally, in this embodiment, the plurality of sixth backplanes may include, but are not limited to, a sixth backplane provided with four storage device connectors and a sixth backplane provided with two storage device connectors.

[0118] Optionally, in this embodiment, if Figure 11 As shown, the fifth backplane may include but is not limited to a rear window backplane with 12 storage device connectors, and the plurality of sixth backplanes include: a sixth backplane A with 4 storage device connectors and a sixth backplane B with 2 storage device connectors.

[0119] As an optional embodiment, there is a second position difference between the setting position of the front window backplane connector on the server mainboard and the setting position of the heat dissipation device board connector on the server mainboard, and the second position difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the setting position when the front window backplane connector and the heat dissipation device board connector are blind plugged; or, the blind plug interface of the front window backplane connector and the blind plug interface of the heat dissipation device board connector have a second interface difference, and the second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interface when the front window backplane connector and the heat dissipation device board connector are blind plugged.

[0120] Optionally, in this embodiment, in order to ensure the assembly efficiency during the assembly of the power supply system, position differences or interface differences can be set, but are not limited to setting them, to help assembly workers quickly identify the front window backplane connector and the heat dissipation device board connector to avoid wiring errors.

[0121] Optionally, in this embodiment, the location of the front panel connector on the server motherboard and the location of the heat sink board connector on the server motherboard may have, but is not limited to, a second positional difference. Specifically, the second positional difference may be achieved by, but is not limited to, differentiating by physical spacing: by arranging the front panel connector and the heat sink board connector on the server motherboard, ensuring sufficient physical spacing between the two. This spacing can serve as a basis for differentiation during blind plugging, avoiding inserting the wrong connector; or differentiating by structural layout: when designing the server motherboard, consideration may be given to arranging the front panel connector and the heat sink board connector at different heights or angles, utilizing spatial differences to differentiate blind plugging. For example, one connector may be designed as a straight-plug type, while the other is a side-plug type.

[0122] Optionally, in this embodiment, if Figure 7 As shown, the front window backplane connector can be, but is not limited to, set on one side of the server motherboard and the heat dissipation device board connector can be set on the other side of the server motherboard, thereby achieving a second position difference between the setting position of the front window backplane connector and the setting position of the heat dissipation device board connector.

[0123] Optionally, in this embodiment, the second position difference can be used, but is not limited to, to distinguish the front window backplane connector and the heat dissipation device board connector from the setting position when blind plugging the front window backplane connector and the heat dissipation device board connector. Through the second position difference, the assembly staff can quickly identify the front window backplane connector and the heat dissipation device board connector.

[0124] Optionally, in this embodiment, the first position difference and the second position difference may be of the same type, but are not limited to being set. For example, the first position difference may be distinguished by physical distance, and the second position difference may be distinguished by physical distance. Different types of first position differences and second position differences may be set, but are not limited to being set. For example, the first position difference may be distinguished by physical distance, and the second position difference may be distinguished by structural layout.

[0125] Optionally, in this embodiment, the blind-mate interface of the front window backplane connector and the blind-mate interface of the heat sink board connector may have, but is not limited to, a second interface difference, i.e., there is a significant difference between the blind-mate interface of the front window backplane connector and the blind-mate interface of the heat sink board connector. Specifically, the second interface difference may be achieved by, but is not limited to, differentiating by interface size and shape, or by color coding.

[0126] Optionally, in this embodiment, the second interface difference can be used, but is not limited to, to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plugging interface when the front window backplane connector and the heat dissipation device board connector are blind plugged. Through the second interface difference, assembly workers can quickly identify the front window backplane connector and the heat dissipation device board connector.

[0127] Optionally, in this embodiment, first interface differences and second interface differences of the same type may be set, but are not limited to setting them. For example, first interface differences distinguished by interface size and shape and second interface differences distinguished by interface size and shape may be set, but are not limited to setting them. First interface differences and second interface differences of different types may be set, but are not limited to setting them. For example, first interface differences distinguished by interface size and shape and second interface differences distinguished by color coding may be set, but are not limited to setting them.

[0128] Optionally, in this embodiment, the front window backplane connector and the heat sink board connector may be positioned at a second differentiating position on the server motherboard, and two blind-mate interfaces with second interface differences may be provided for the front window backplane connector and the heat sink board connector. By adopting a differentiated position and interface design strategy, the difficulty of maintenance and upgrades can be reduced while improving overall server system stability and user experience.

[0129] As an optional implementation, the front window backplane connector and the power connector are located on the same side of the server mainboard; the heat sink board connector is located on the opposite side of the front window backplane connector on the server mainboard.

[0130] Optionally, in this embodiment, the front window backplane connector and the power connector may be arranged on the same side of the server mainboard, but is not limited to being arranged on the same side, so as to reduce copper foil connections and reduce the current within the board.

[0131] Optionally, in this embodiment, the heat dissipation device board connector and the front window backplane connector can be but are not limited to being set on different sides of the server, that is, the heat dissipation device board connector and the front window backplane connector are set on opposite sides of the server to achieve a second position difference.

[0132] As an optional embodiment, the distance between the front window backplane connector and the power connector falls within a target distance range, wherein the upper limit value of the target distance range is used to control the current generated between the front window backplane connector and the power connector to be less than or equal to the current threshold, and the lower limit value of the target distance range is used to control the interference generated by the front window backplane connector to the power connector to be less than the interference threshold.

[0133] Optionally, in this embodiment, the front window backplane connector on the server motherboard may be, but is not limited to, not too far from the power connector, nor too close to the power connector. If the front window backplane connector is too far from the power connector, a large through-current, i.e., intra-board current, will be generated between the front window backplane connector and the power connector, and there will be too many copper foil connections on the server motherboard. If the front window backplane connector is too close to the power connector, various interferences are likely to occur between the front window backplane connector and the power connector, such as interference in position and interference in assembly operations. In order to reduce copper foil connections, reduce intra-board current, and to reduce interference and interference, the distance between the front window backplane connector and the power connector needs to be limited to a certain range.

[0134] Optionally, in this embodiment, the distance between the front window backplane connector and the power connector can be limited to, but not limited to, a target distance range, wherein the upper limit value of the target distance range is used to control the flow generated between the front window backplane connector and the power connector to be less than or equal to a flow threshold, and the upper limit value can be, but not limited to, 100 mm, and the lower limit value of the target distance range is used to control the interference generated by the front window backplane connector to the power connector to be less than an interference threshold, and the lower limit value can be, but not limited to, 2 mm.

[0135] Optionally, in this embodiment, the target distance range can be but not limited to 2mm-100mm, or the standard can be tightened, the target distance range can be but not limited to 3mm-100mm, the target distance range can also be but not limited to 2mm-50mm, or 2mm-70mm, or 3mm-50mm.

[0136] Optionally, in this embodiment, the target distance range for limiting the distance between the front window backplane connector and the power connector and the target distance range for limiting the distance between each second connector and the power connector may be, but are not limited to, the same, or may be, but are not limited to, different. For example, the target distance range for limiting the distance between the front window backplane connector and the power connector may be, but are not limited to, set to be 2 mm to 50 mm, and the target distance range for limiting the distance between each second connector and the power connector may be, but are not limited to, set to be 2 mm to 70 mm.

[0137] As an optional embodiment, the distance between the front window backplane connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; the distance between the heat dissipation device board connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; the blind plug interface of the front window backplane connector and the blind plug interface of the heat dissipation device board connector have a second interface difference, and the second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plug interface when the front window backplane connector and the heat dissipation device board connector are blind plugged.

[0138] Optionally, in this embodiment, the target distance range for limiting the distance between the front window backplane connector and the power connector may be set to, but is not limited to, 2 mm to 100 mm.

[0139] Optionally, in this embodiment, the distance between the heat sink board connector and the power connector may be, but is not limited to, limited. The heat sink board connector on the server motherboard may, but is not limited to, be located neither too far nor too close to the power connector. If the heat sink board connector is too far from the power connector, a large through-current, i.e., intra-board current, will be generated between the heat sink board connector and the power connector, resulting in excessive copper connections on the server motherboard. If the heat sink board connector is too close to the power connector, various interferences may easily occur between the heat sink board connector and the power connector, such as interference in position and assembly operations.

[0140] Optionally, in this embodiment, the distance between the heat dissipation device board connector and the power connector can be limited to, but not limited to, a reference distance range, wherein the upper limit value of the reference distance range is used to control the flow generated between the heat dissipation device board connector and the power connector to be less than or equal to a flow threshold, and the upper limit value can be, but not limited to, 100 mm, and the lower limit value of the reference distance range is used to control the interference generated by the heat dissipation device board connector to the power connector to be less than an interference threshold, and the lower limit value can be, but not limited to, 2 mm.

[0141] Optionally, in this embodiment, the reference distance range may be but is not limited to 2mm-100mm, or the standard may be tightened and the reference distance range may be but is not limited to 3mm-100mm, or the reference distance range may also be but is not limited to 2mm-50mm, or 2mm-70mm, or 3mm-50mm.

[0142] The embodiment of the present application also provides a server system, Figure 12 is a schematic diagram of a server system according to an embodiment of the present application, such as Figure 12 As shown, the server system includes multiple storage devices, heat dissipation devices, a server power supply and the aforementioned power supply system, wherein the multiple storage devices are connected to the front window backplane and multiple rear window backplanes in the power supply system, the heat dissipation device is connected to the heat dissipation device board in the power supply system, and the server power supply is connected to the power connector on the server motherboard in the power supply system.

[0143] The server system of the present application comprises a power supply system including a server motherboard, a front window backplane, multiple rear window backplanes, and a heat dissipation device board. The server motherboard is provided with a power connector, a front window backplane connector, and a heat dissipation device board connector. The server motherboard is connected to the front window backplane via the front window backplane connector, the server motherboard is connected to the heat dissipation device board via the heat dissipation device board connector, and the server motherboard is directly and / or indirectly connected to multiple rear window backplanes. The power connector is used to connect to the server power supply and obtain the target voltage from the server power supply to power the front window backplane, multiple rear window backplanes, and heat dissipation device board. The power supply system of the present application is provided with a front window backplane, a rear window backplane, and a heat dissipation device board, and some components on the server motherboard are transferred to the front window backplane, the rear window backplane, and the heat dissipation device board, thereby reducing the area of ​​the server motherboard. Therefore, the technical problem of the excessively large area of ​​the server motherboard in the related art can be solved, and the technical effect of reducing the area of ​​the server motherboard can be achieved.

[0144] Optionally, in this embodiment, the multiple storage devices in the server system may be, but are not limited to, key components for data storage. The multiple storage devices may include, but are not limited to, multiple types of storage media to provide appropriate data storage solutions based on different application needs and performance requirements. For example, the multiple storage devices may include, but are not limited to, multiple SATA hard drives and multiple NVMe hard drives.

[0145] exist Figure 12In the server system shown, storage devices can be connected to, but are not limited to, the front backplane and multiple rear backplanes to achieve efficient data management and scalability. Storage devices in the server system can be designed with, but are not limited to, high-density storage to provide large amounts of storage capacity within a limited space. Storage devices in the server system can also be hot-swappable, meaning they can be safely inserted or removed while the server is running without affecting the normal operation of other devices.

[0146] Optionally, in this embodiment, the heat dissipation device can be, but is not limited to, responsible for processing the heat generated by hardware such as the CPU, storage device, and power module in the server system to ensure that the temperature of the server is stable when operating at high efficiency, and to avoid hardware performance degradation or damage caused by overheating.

[0147] Optionally, in this embodiment, the heat dissipation device may include but is not limited to a fan, a heat pipe, a liquid cooling system, etc., which may be used alone or in combination to achieve the best heat dissipation effect.

[0148] Optionally, in this embodiment, the heat dissipation device can be but is not limited to a fan, and the heat dissipation device board, namely the fan board, can be but is not limited to setting a vertical fan connector on the fan board. The vertical fan connector on the fan board allows the fan to be installed from top to bottom, thereby optimizing the airflow path and improving the heat dissipation efficiency.

[0149] The above is a detailed introduction to a power supply system and a server system provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A power supply system, characterized in that: include: Server motherboard, front window backplane, multiple rear window backplanes and heat dissipation equipment board; The server mainboard is provided with a power connector, a front window backplane connector and a heat dissipation device board connector; The server mainboard is connected to the front window backplane via the front window backplane connector, the server mainboard is connected to the heat dissipation device board via the heat dissipation device board connector, and the server mainboard is directly and / or indirectly connected to the plurality of rear window backplanes; The power connector is used to connect to a server power supply and obtain a target voltage from the server power supply to power the front window backplane, the plurality of rear window backplanes and the heat dissipation device board; In which, there is a second position difference between the setting position of the front window backplane connector on the server mainboard and the setting position of the heat dissipation device board connector on the server mainboard, and the second position difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the setting position when the front window backplane connector and the heat dissipation device board connector are blind plugged; or, the blind plugging interface of the front window backplane connector and the blind plugging interface of the heat dissipation device board connector have a second interface difference, and the second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind plugging interface when the front window backplane connector and the heat dissipation device board connector are blind plugged.

2. The power supply system according to claim 1, characterized in that: The plurality of rear window back panels include: a first back panel, and one or more second back panels; A first connector is provided on the front window back panel, and one or more second connectors are also provided on the server mainboard; The first backplane is connected to the first connector, and the one or more second backplanes are connected to the one or more second connectors in a one-to-one correspondence.

3. The power supply system according to claim 2, characterized in that: A first number of storage device connectors are provided on the first backplane, and a second number of storage device connectors are provided on the second backplane; The first number is greater than the second number.

4. The power supply system according to claim 2, characterized in that: The first backplane includes: a rear window backplane provided with 12 storage device connectors; The one or more second backplanes include: a rear window backplane provided with four storage device connectors and / or a rear window backplane provided with two storage device connectors.

5. The power supply system according to claim 2, characterized in that: A third connector is also provided on the front window back panel, and the third connector is connected to the front window back panel connector.

6. The power supply system according to claim 5, characterized in that: There is a first position difference between the setting position of the first connector on the front window back panel and the setting position of the third connector on the front window back panel, and the first position difference is used to distinguish the first connector and the third connector from the setting position when the first connector and the third connector are blindly plugged; or, The blind-mate interface of the first connector and the blind-mate interface of the third connector have a first interface difference, and the first interface difference is used to distinguish the first connector and the third connector from the blind-mate interface when the first connector and the third connector are blind-mated.

7. The power supply system according to claim 5, characterized in that: The third connector is arranged on one side of a short side of the front window backplane, and the third connector and the front window backplane connector are located on the same side of the power supply system; The first connector is arranged on one side of the other short side of the front window back panel.

8. The power supply system according to claim 2, wherein: The distance between each of the second connectors and the power connector falls within a target distance range, wherein the upper limit value of the target distance range is used to control the flow generated between the second connector and the power connector to be less than or equal to a flow threshold, and the lower limit value of the target distance range is used to control the interference generated by the second connector on the power connector to be less than an interference threshold.

9. The power supply system according to claim 8, characterized in that: The distance between each of the second connectors and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm.

10. The power supply system according to claim 1, wherein: The plurality of rear window back panels include: a third back panel, and a plurality of fourth back panels; A first connector is provided on the front window back panel, and a fourth connector is also provided on the server mainboard; The third backplane is connected to the first connector, and the plurality of fourth backplanes are connected to the fourth connector; A first number of storage device connectors is provided on the third backplane, a second number of storage device connectors is provided on the fourth backplane, and the sum of the second number of the plurality of fourth backplanes is less than or equal to the first number.

11. The power supply system according to claim 10, characterized in that: The third backplane includes: a rear window backplane provided with 12 storage device connectors; The plurality of fourth backplanes include: a rear window backplane provided with four storage device connectors and a rear window backplane provided with two storage device connectors.

12. The power supply system according to claim 1, wherein: A plurality of fourth connectors are also provided on the server mainboard; The plurality of rear window back panels are connected to the plurality of fourth connectors in a one-to-one correspondence.

13. The power supply system according to claim 1, wherein: A fifth connector is also provided on the server mainboard; The plurality of rear window back panels are all connected to the fifth connector.

14. The power supply system according to claim 1, wherein: The plurality of rear window back panels include: a fifth back panel, and one or more sixth back panels; A first connector is provided on the front window back panel, and a sixth connector and one or more seventh connectors are provided on the fifth back panel; The sixth connector is connected to the first connector, and the one or more sixth backplanes are connected to the one or more seventh connectors in a one-to-one correspondence.

15. The power supply system according to claim 14, characterized in that: The fifth backplane includes: a rear window backplane provided with 12 storage device connectors; The plurality of sixth backplanes include: a rear window backplane provided with four storage device connectors and a rear window backplane provided with two storage device connectors.

16. The power supply system according to claim 1, wherein: The front window backplane connector and the power connector are located on the same side of the server mainboard; The heat dissipation device board connector is located on the server mainboard at the opposite side of the front window backplane connector.

17. The power supply system according to claim 1, wherein: The distance between the front window backplane connector and the power connector falls within a target distance range, wherein the upper limit value of the target distance range is used to control the current generated between the front window backplane connector and the power connector to be less than or equal to a current threshold, and the lower limit value of the target distance range is used to control the interference generated by the front window backplane connector on the power connector to be less than an interference threshold.

18. The power supply system according to claim 17, wherein: The distance between the front window backplane connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; The distance between the heat dissipation device board connector and the power connector is greater than or equal to 2 mm and less than or equal to 100 mm; The blind-plug interface of the front window backplane connector and the blind-plug interface of the heat dissipation device board connector have a second interface difference, and the second interface difference is used to distinguish the front window backplane connector and the heat dissipation device board connector from the blind-plug interface when the front window backplane connector and the heat dissipation device board connector are blind-plugged.

19. A server system, characterized in that: include: A plurality of storage devices, a heat dissipation device, a server power supply and a power supply system as described in any one of claims 1 to 18, wherein the plurality of storage devices are connected to a front window backplane and a plurality of rear window backplanes in the power supply system, the heat dissipation device is connected to a heat dissipation device board in the power supply system, and the server power supply is connected to a power connector on a server mainboard in the power supply system.

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