Method and system for constructing pump turbulent flow model based on flow intelligence control

Abstract

The present application relates to the construction method and system of pump turbulent flow model based on flow intelligent control, and belongs to the technical field of artificial intelligence control and fluid delivery fusion. The method comprises the following steps: according to the type of plating solution and the size of pump flow, selecting the type, model, configuration pipe diameter and flow range data of pump; according to the type and model of pump, configuring a frequency converter and a flowmeter to obtain a matched pump device module with a frequency converter and a flowmeter; constructing a pump turbulent flow model based on the Reynolds stress transport equation; monitoring the real-time flow of the pump turbulent flow conveying plating solution in real time, and calculating the change amount of the real-time flow. The present application can precisely adjust the pump to convey the plating solution in the turbulent flow mode, and the adjustable interval is the pump flow threshold range; the threshold range is used as a standard to strictly control the turbulent flow mode flow of the pump conveying the plating solution, so as to provide an excellent, precise and controllable pump turbulent flow mode and system for the high-end plating equipment module of the semiconductor lead frame.

Description

Technical Field

[0001] This invention relates to a method and system for constructing a pump turbulence model based on intelligent flow control, belonging to the field of artificial intelligence control and fluid transport integration technology. Background Technology

[0002] Pumps transporting electroplating solutions are highly sensitive devices in the metal plating process of semiconductor electronic components, particularly to the local electrochemical and physical environment of metal ions. They have extremely wide applications in high-end manufacturing fields such as the research and development of micro-precision electronic products, electrochemical research, and metal plating of semiconductor electronic components. During the semiconductor electronic component plating production process, numerous and complex factors influence the plating of metal ions on the semiconductor electronic component surface, including the type of pump, the diameter of its piping, and the pump flow rate. Therefore, interference from various factors leads to different variations in the actual plated metal layers. Mild variations may result in difficulty controlling the plating area, excessively rapid and rough plating, while severe variations may lead to insufficient plating density and uneven plating thickness distribution, making it difficult to meet the high-end performance requirements of semiconductor electronic components.

[0003] Currently, according to ISO 9906:2012 Rotary Power Pumps—Hydraulic Performance Acceptance Test Standard: for the highest level of pumps, Class 1 accuracy, the allowable flow rate deviation is ±3%. As mentioned above, in the plating process of micro-precision electronic products, a deviation of ±3% in the pump itself will result in a deviation of at least ±3% in the pump's delivery of the plating solution, which will have a serious impact on the precious metal plating of micro-precision electronic products. Therefore, exploring and creating a pump turbulence model with low allowable flow rate deviation and more stable delivery of the plating solution has become a very important issue. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a method and system for constructing a pump turbulence model based on intelligent flow control. This model aims to meet the optimal stability conditions for pumping electroplating solutions during the metal plating process of high-end semiconductor electronic components. It also aims to reduce the deviation of the pumped plating solution delivery, achieving both good flow accuracy and a shorter R&D cycle.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] In a first aspect, the present invention provides a method for constructing a pump turbulence model, the method comprising:

[0007] Step 1: Select the pump type, model, and configure the pipe diameter and flow range data according to the type of plating solution and pump flow rate;

[0008] Step 2: Configure the frequency converter and flow meter according to the pump type and model in Step 1 to obtain a matching pump device module with frequency converter and flow meter.

[0009] Step 3: Construct a pump turbulence model based on the Reynolds stress transport equation, including:

[0010] Calculate the flow rate during the turbulent transport of the plating solution by the pump. Q= P×η / 2.73 H In the formula: Q For traffic; P Shaft power; or 2.73 is the pump efficiency; 2.73 is a constant. H For Yangcheng;

[0011] Combining turbulent viscosity m t and correction factor c 1ε , c 2ε Optimize the Reynolds stress transport equation and generate the standard flow rate of pump turbulence. Q 标准流量 ;

[0012] Step 4: Real-time monitoring of the real-time flow rate of the plating solution delivered by the pump during turbulent transport. Q 实时流量 Calculate the change in real-time traffic. △Q = Q 实时流量 - Q 标准流量 ;

[0013] Step 5: When △Q Exceeding the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 At that time, the pump frequency is dynamically adjusted to make △Q Within the above threshold range, maintain stable flow; when △Q Not exceeding the threshold range [-1% × Q 标准流量， 1%× Q 标准流量 During this time, the plating solution is continuously pumped and turbulently transported.

[0014] In one embodiment of the present invention, the Reynolds stress transport equation includes:

[0015] Formula 2

[0016] Formula 3

[0017] in, r For fluid density,k For turbulent energy, e The turbulent dissipation rate; u It is pulsating energy. m t This is the turbulent viscosity value. s The fluid scattering coefficient, P For parameters, G The turbulent kinetic energy generated by the average velocity gradient. c μ , s k , s ε , c 1ε , c 2ε , c 3ε It is a constant;

[0018] In formula 2, express t The differential term of continuous turbulent energy at time t, express x i The differential terms of continuous turbulent energy and pulsating energy in the direction are represented by the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time t is divided by the sum of the turbulent kinetic energy fluid scattering coefficients and multiplied by . x j Turbulent energy differential in direction, middle P ij Indicates a specific parameter, G ij This represents the turbulent kinetic energy generated by a specific average velocity gradient. hey This represents the product of fluid density and turbulent dissipation rate.

[0019] In formula 3, express t The differential term of the turbulent dissipation rate at time t. express x The continuous dissipation rate and pulsating energy differential terms in the direction, with the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time twitch time is divided by the sum of the fluid scattering coefficients under turbulent energy conditions, multiplied by... x jDifferential of turbulent dissipation rate in the direction; middle P ij Indicates a specific parameter, G ij This represents the sum of turbulent kinetic energy generated by a specific average velocity gradient and a specific constant. C 1ε The product of Represents a specific constant C 2ε The product of the fluid density and the turbulent dissipation rate is multiplied by the square of the turbulent energy and then divided by the turbulent energy.

[0020] In one embodiment of the present invention, the turbulent viscosity m t for:

[0021] .

[0022] In one embodiment of the present invention, the metal ions in the plating solution include:

[0023] Monomer coatings: Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt;

[0024] Alloy coatings include Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru, and Pt-Rh or Au-W-Ni ternary or higher alloy metals.

[0025] In one embodiment of the present invention, the method is applicable to semiconductor electronic components to be processed, including: precision terminals, lead frames, wafer chips, and precision decorative items.

[0026] Secondly, the present invention provides a system for constructing a pump turbulence model, used to implement the method for constructing the pump turbulence model, the system comprising:

[0027] Pump operation module, used to transport plating solution;

[0028] The intelligent flow control module is used to control the pump operation module. It simulates the turbulence model of the pump conveying the plating solution in the plating equipment module through the Reynolds stress transport equation and calculates and obtains the pump turbulence modeling data.

[0029] The data training module is used to compare and train the pump turbulence real-time flow and frequency conversion data of the pump operation module with the modeling data;

[0030] Analog-to-digital converter is used to convert continuous analog signals into discrete digital signals during the operation of the pump operation module.

[0031] The processor is used to identify and process the digital signals output by the analog-to-digital converter.

[0032] An automatic regulator is used to continuously monitor and adjust the controlled parameters using the processor's negative feedback mechanism to keep them consistent with the set value.

[0033] A digital-to-analog converter is used to convert discrete digital signals output by an automatic regulator into continuously changing analog signals.

[0034] In one embodiment of the present invention, the pump operation module includes a pump, a frequency converter, a flow meter, and a plating solution.

[0035] Thirdly, the present invention provides a method for pump-driven turbulent transport of plating solution based on intelligent flow control, characterized in that the method for constructing the pump-driven turbulent model includes:

[0036] S1: Construct a database based on the conditions for transporting the plating solution under pump turbulence conditions, including: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database;

[0037] S2: Extract two different pump turbulence flow conditions from the database, and use the pump operation module to perform actual operation of pump turbulence delivery of the plating solution to the semiconductor lead frame, and record the real-time changes in pump turbulence flow rate. △Q Import measured data into the initial Reynolds stress transport equation;

[0038] S3: Based on the imported real-time pump turbulent flow rate variation. △Q The measured data were used to refine the initial Reynolds stress transport equation into an initial pump turbulence model.

[0039] S4: During the refinement of the initial Reynolds stress transport equation in S3, correction coefficients are obtained within the specified flow range for the turbulent pump transport of the coating solution through training and optimization. c 1ε and c 2ε To obtain accurate modeling standard flow Q 标准流量 ;

[0040] S5: Select the standard flow rate for simulation modeling within the initial pump turbulence model. Q 标准流量 The feedback is applied to the actual operation of pump turbulence delivery of the coating solution, and the subsequently obtained real-time pump turbulence flow rate is used. Q 实测流量 Change △QThe measured data were imported into the initial pump turbulence model to obtain the upgraded pump turbulence model;

[0041] S6: Real-time loop of S5 to obtain a continuously iteratively upgraded pump turbulence model;

[0042] S7: Select a certain generation of upgraded pump turbulence model in S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow rate change condition data, and realize the construction and optimization of the pump turbulence model based on the optimal flow rate change condition data.

[0043] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions which are executed by a processor to describe the method.

[0044] Fifthly, the present invention provides a computer program product, the computer program product storing computer instructions, the computer instructions being executed by a processor to describe the method.

[0045] The beneficial effects of this invention are:

[0046] This invention refines and constructs the Reynolds stress transport equation by using pump turbulence to transport the coating solution, and then trains the equation. The constructed Reynolds stress transport equation outputs the flow rate data processing results and modeling change standards obtained from the pump turbulence transport of the coating solution under the pump turbulence conditions that meet the threshold range. △Q When the value is "zero", the pump turbulence flow rate remains stable, while the real-time output of the pump turbulence flow rate change... △Q When the deviation from the standard value of "zero" is slight, the optimized Reynolds stress transport equation of this invention is activated instantaneously, responding to real-time slight changes in pump turbulent flow rate that are slightly higher or lower than normal. △Q Real-time adjustments are made to maintain its change. △Q Within the scope of the control standards, the high-end quality requirements for the turbulent pump delivery of the plating solution are strictly controlled in accordance with these standards.

[0047] Furthermore, using a model system for pump-turbulent delivery of the plating solution, the change in pump turbulent flow rate was analyzed. △Q The threshold range is a standard, and the flow rate of the coating solution transported by the pump turbulence is adjusted in real time to infinitely approach the set standard value, thereby maintaining the change in pump turbulence flow rate. △Q The wireless approach is close to "zero", thereby obtaining the preferred criteria for the optimized and improved Reynolds stress transport equation of the present invention, achieving accurate and rapid identification of the screening results of usable or unusable pump turbulence, and obtaining the preferred method for pump turbulence to transport the plating solution.

[0048] Based on the optimized Reynolds stress transport equation of this invention, the adjustable flow rate variation of the pumped turbulent transport of plating solutions for various monomeric metal salts, binary metal salts, and ternary or higher metal salts can be quickly established during actual production processes. △Q By defining the threshold range and then obtaining the optimal pump turbulence control method for semiconductor electronic components through the pump turbulence plating equipment module, it is possible to quickly and accurately predict the local plating thickness of semiconductor electronic components, significantly reduce the error between the plating thickness and the actual electroplated product, promote the improvement of plating thickness uniformity, and meet the high-quality requirements of high-end semiconductor lead frame products.

[0049] The intelligent control system for plating solution flow rate constructed in this invention can precisely adjust the pump to deliver the plating solution in a turbulent mode. The adjustable range is the pump flow rate threshold range. Using this threshold range as a standard, the turbulent flow rate of the pump delivering the plating solution is strictly controlled, providing an excellent, precise, and controllable pump turbulence mode and system for high-end plating equipment modules for semiconductor leadframes. By employing a continuous real-time optimization function for the simulated and actual flow rates of the pump frequency converter-flow control system during the operation of the plating solution delivery system, an optimal standard for the pump turbulence mode of delivering the plating solution is obtained, resulting in a method and system for constructing a pump turbulence mode that achieves accurate and rapid intelligent flow control. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the pump used in this invention to transport the electroplating solution.

[0052] Figure 2 This is a diagram showing the composition of the system for constructing the pump turbulence model based on intelligent flow control according to the present invention.

[0053] Figure 3 This is a flowchart of the method for constructing a pump turbulence model based on intelligent flow control according to the present invention.

[0054] Figure 4 This is a schematic diagram illustrating the change of turbulent flow rate of the intelligent control pump over time in Embodiment 3 of the present invention.

[0055] Figure 5 This is a schematic diagram illustrating the change in turbulent flow rate of the pump without intelligent control over time in Comparative Example 1 of this invention.

[0056] In the diagram: 100, Pump operation module; 200, Intelligent flow control module; 300, Data training module; 400, Analog-to-digital conversion mechanism; 500, Processor; 600, Automatic regulator; 700, Analog-to-digital conversion mechanism; 1000, Construction system. Detailed Implementation

[0057] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] Example 1:

[0059] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides a method for constructing a pump turbulence model based on intelligent flow control, which is based on the Reynolds Stress Model.

[0060] This embodiment applies the principles of Reynolds turbulence mechanics, rigorously and comprehensively integrating the effects of fluid streamline curvature, vortices, rotation, and rapid changes in strain rate through the Reynolds stress transport equation. This allows for accurate prediction of the flow of plating solutions in complex pumps. Therefore, this invention uses the Reynolds stress transport equation to simulate the turbulence model of the pump transporting plating solutions in a plating equipment module, calculates its turbulence model, and provides a method and system for quickly and accurately obtaining the pump turbulence model. The method for constructing the pump turbulence model includes:

[0061] Step 1: Select the type and model of pump, the diameter of the pipe to be configured, and the flow range of the pump according to the type of plating solution and the flow rate of the pump;

[0062] Step 2: Configure the frequency converter and flow meter according to the pump type and model in Step 1 to obtain a matching pump device module with frequency converter and flow meter.

[0063] Step 3: Construct a pump turbulence model based on the Reynolds stress transport equation. When the pump module is running, the change in the flow rate of the plating solution being transported by the pump turbulence is monitored in real time through an automatic detection system for pump turbulence transport of the plating solution.

[0064] During the process of pumping and turbulently conveying the plating solution, the flow rate is calculated according to the following formula;

[0065] Q= P×η / 2.73 H Formula 1

[0066] In the formula: Q For traffic; P Shaft power; or 2.73 is the pump efficiency; 2.73 is a constant. H For the journey.

[0067] For the pump turbulent transport of the plating solution of the present invention, it is necessary to further meet the requirements of "turbulent" flow. The Reynolds stress transport equation, which can integrate the effects of rapid changes in fluid streamline curvature, vortex, rotation and strain rate, is a method and system for simulating and calculating its turbulence model and for quickly and accurately obtaining the pump turbulence model.

[0068] The specific calculations for pumping turbulent flow to deliver the plating solution are shown in Formulas 2 and 3:

[0069] Formula 2

[0070] Formula 3

[0071] In formulas 2 and 3, r For fluid density, k For turbulent energy, e The turbulent dissipation rate; t For a moment, u It is pulsating energy. m t This is the turbulent viscosity value. s The fluid scattering coefficient, P For parameters, G This represents the turbulent kinetic energy generated by the average velocity gradient.

[0072] In formula 2, express t The differential term of continuous turbulent energy at time t, express x i The differential terms of continuous turbulent energy and pulsating energy in the direction are represented by the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time t is divided by the sum of the turbulent kinetic energy fluid scattering coefficients and multiplied by . x j Turbulent energy differential in direction, middle P ij Indicates a specific parameter, G ij This represents the turbulent kinetic energy generated by a specific average velocity gradient. hey It represents the product of fluid density and turbulent dissipation rate.

[0073] In formula 3, express t The differential term of the turbulent dissipation rate at time t. express x The continuous dissipation rate and pulsating energy differential terms in the direction, with the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time twitch time is divided by the sum of the fluid scattering coefficients under turbulent energy conditions, multiplied by... x j Differential of turbulent dissipation rate in the direction; middle P ij Indicates a specific parameter, G ij This represents the sum of turbulent kinetic energy generated by a specific average velocity gradient and a specific constant. C 1ε The product of Represents a specific constant C 2ε The product of the fluid density and the turbulent dissipation rate is multiplied by the square of the turbulent energy and then divided by the turbulent energy.

[0074] Furthermore, in formulas 2 and 3, c μ , s k , s ε , c 1ε , c 2ε , c 3ε It is a constant under certain conditions.

[0075] in c 1ε and c 2ε These are correction coefficients related to the pump-turbulent transport of the plating solution in this invention. Only by selecting the corresponding correction coefficients within the defined flow range of the pump-turbulent transport of the plating solution in this invention can an accurate modeling standard flow rate be obtained. Q 标准流量 .

[0076] In Formulas 2 and 3, t Turbulent viscosity at time m t Formula 4 is as follows:

[0077] Formula 4

[0078] Step 4: Real-time monitoring of the real-time flow rate of the plating solution delivered by the pump during turbulent transport. Q 实时流量 Calculate the change in real-time traffic. △Q .

[0079] By using the computational network of the Reynolds stress transport equation for pump-turbulent transport of plating solutions, simulation calculations are performed on the flow conditions within the pump-turbulent plating equipment module for the selected pump-turbulent transport of plating solutions. Accurate pump-turbulence simulation results are obtained and combined with the deposition potential of the plating metal in the plating solution. Under different simulation conditions of pump-turbulent transport of plating solutions, the modeling data, including the real-time flow rate change of the pump-turbulent transport of plating solutions, is accurately calculated. △Q The processing result, the change in the real-time traffic △Q Calculate using the following formula:

[0080] △Q = Q 实时流量 - Q 标准流量 Formula 5

[0081] Q 实时流量 To ensure the flow rate of the plating solution delivered by the pump turbulent flow, Q 标准流量 The simulated flow rate is obtained by calculation according to Formulas 1 to 4.

[0082] Step 5: Use the flow change threshold from Formula 6 below to determine the actual change in turbulent flow rate of the pump during operation. △Q When the value is "zero", the change in pump turbulence flow rate calculated by the intelligent control pump turbulence model network under the same pumping conditions is also "zero", thus maintaining stable operation of the pump turbulence delivery flow rate of the plating equipment module; however, when the change in the real-time output pump turbulence flow rate is... △Q When the deviation from the standard value of "zero" is slight, the optimized Reynolds stress transport network calculation model of this invention is instantly activated to handle the real-time slight changes in the pump turbulent flow rate, whether slightly higher or lower than normal. △Q Real-time control is performed to ensure that the flow rate of the coating solution transported by the pump in turbulent flow approaches the set standard value in real time, maintaining its variation. △Q It falls within the control standards.

[0083] -1% × Q 标准流量 ≤ △Q ≤ 1% × Q 标准流量 Formula 6

[0084] Optionally, the semiconductor electronic components to be processed include: precision terminals, lead frames, wafer chips, and precision decorative items.

[0085] Optionally, the metal ions in the plating solution include:

[0086] Monomer coatings: Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt;

[0087] Alloy coatings include Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru, and Pt-Rh or Au-W-Ni ternary or higher alloy metals.

[0088] Example 2:

[0089] like Figure 2 As shown, this embodiment provides a system for constructing a pump turbulence model based on intelligent flow control, used to implement the method for constructing a pump turbulence model based on intelligent flow control described in Embodiment 1. The construction system 1000 includes:

[0090] Pump operation module 100, used for conveying plating solution, includes pump, frequency converter, flow meter and plating solution;

[0091] The flow intelligent control module 200 is used to control the pump operation module 100. It simulates the turbulence model of the pump conveying the plating solution in the plating equipment module through the Reynolds stress transport equation and calculates and obtains the pump turbulence modeling data.

[0092] The data training module 300 is used to compare and train the real-time flow rate and frequency conversion data of pump turbulence of pump operation module 100 with the modeling data.

[0093] The analog-to-digital converter 400 is used to convert the analog signal of the continuous variable into a discrete digital signal during the operation of the pump operation module 100.

[0094] Processor 500 is used to identify and process the digital signals output by analog-to-digital converter 400;

[0095] Automatic regulator 600 is used to continuously monitor and adjust the controlled parameters using the negative feedback mechanism of processor 500 to keep them consistent with the set value;

[0096] The digital-to-analog converter 700 is used to convert the discrete digital signal output by the automatic regulator 600 into a continuously changing analog signal.

[0097] The aforementioned system 1000 achieves signal standardization and anti-interference processing through centralized control of the pump turbulence model; the delivered plating solution has a turbulence mode flow rate, forming an excellent, precise, and controllable pump turbulence mode and system for high-end plating equipment modules for semiconductor lead frames.

[0098] The aforementioned system 1000 is designed to detect changes in flow rate in real time during pump turbulence. △Q , compared with the set standard flow rate for pump turbulence simulation Q 标准流量 The two are compared, and when they satisfy Formula 6 above, the corresponding real-time pump turbulence flow rate is saved. Q 实测流量 This will be further used to improve and continuously optimize the simulated standard flow of the constructed system, with the aim of obtaining a more precise range of real-time flow variation data for pump turbulence detection. △Q To reduce errors, a method and system for constructing more micro-controlled pump turbulence modes were developed.

[0099] Example 3:

[0100] This embodiment, using a real-world example of transporting a plating solution under turbulent pumping conditions, describes in detail the construction process of the fast, accurate optimization and classification model data processing system of this invention. This embodiment employs, as shown in the example... Figure 1 The pump shown has a flow rate range of 100–300 liters / minute; the method for turbulently transporting the plating solution using the pump includes the following steps:

[0101] S1: Construct a database based on the conditions for transporting the plating solution under pump turbulence conditions, including: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database;

[0102] S2: Extract two different pump turbulence flow conditions from the database, and use the pump operation module 100 to perform actual operation of pump turbulence delivery of the plating solution to the semiconductor lead frame, and record the real-time changes in pump turbulence flow rate. △Q Import measured data into the initial Reynolds stress transport equation;

[0103] S3: Based on the imported real-time pump turbulent flow rate variation. △Q The measured data were used to refine the initial Reynolds stress transport equation into an initial pump turbulence model.

[0104] S4: In the process of refining the initial Reynolds stress transport equation in S3, the correction coefficients for Reynolds stress transport equations 2 and 3 are... c 1ε and c2ε These are specific parameters closely related to the pump-turbulent transport of the coating solution in this invention. Correction coefficients within a defined flow range for the pump-turbulent transport of the coating solution are obtained through training and optimization. c 1ε and c 2ε This allows for the acquisition of accurate modeling standard flow. Q 标准流量 ;

[0105] S5: Standard flow rate for simulation modeling within the initial pump turbulence model. Q 标准流量 The optimal flow rate is selected and fed back into the actual operation of pumping turbulent flow to deliver the coating solution, and the subsequently obtained real-time pump turbulent flow rate is then used. Q 实测流量 Change △Q The measured data were imported into the initial pump turbulence model to obtain the upgraded pump turbulence model;

[0106] S6: Real-time loop of S5 to obtain a continuously iteratively upgraded pump turbulence model and improve the accuracy of the pump turbulence model;

[0107] S7: Select a suitable upgraded pump turbulence model from S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow rate change condition data, and based on the optimal flow rate change condition data, realize the construction of the pump turbulence model and the optimization of its intelligent control system.

[0108] In this embodiment, the pump turbulent flow rate is set to 200 liters / minute, which is the modeling standard flow rate. Q 标准流量 With a pump flow rate of 200 liters per minute and a pump frequency set to 50 Hz, the pump turbulence model system of this invention, based on intelligent flow control, was used to conduct actual tests on a high-speed silver plating device for semiconductor lead frames with a specific plating solution. The operation time was 80 minutes, and the measured flow rate was... Q 实测流量 Data such as Figure 4 As shown:

[0109] from Figure 4 As can be seen, the measured results of the pump turbulence model system for intelligent flow control of the present invention are as follows:

[0110] 199.1 < Q 实测流量 <200.9

[0111] 199.1-200< Q 实测流量 - Q 标准流量 <200.9-200

[0112] Therefore, -0.9 < △Q ＜ 0.9

[0113] Right now △Q Satisfy Formula 7

[0114] -0.9%× Q 标准流量 ≤ △Q ≤0.9%× Q 标准流量 Formula 7

[0115] The above results clearly confirm that the allowable flow deviation of the pump turbulence model system for intelligent flow control of the present invention is <±0.9%; its characteristic is that, based on the requirements of intelligent control accuracy, the interval range of the calculation time of the Reynolds stress calculation equation of the present invention can be set to 1 second ≤ △T ≤60 seconds, in the formula △T The time interval is defined by the formula; it can be seen from this formula that the smaller the time interval of the calculation, the more accurate the calculation of the measured flow rate per unit time. Q 实测流量 The more training iterations, the closer the training results will be to the model's specifications. Q 标准流量 The standard value is 200 liters per minute; in other words, the flow rate during real-time testing. Q 实测流量 Even a slight deviation from the set modeling flow rate Q 标准流量 The tendency of the standard value can be used for instantaneous computational training for the initial stage of slight deviations, maintaining the flow rate of real-time pumped turbulence. Q 实测流量 Infinitely close to the model setting Q 标准流量 The standard value is 200 liters per minute, which is the change in real-time pump turbulent flow rate. △Q It can actually meet the threshold range of Formula 7.

[0116] Furthermore, Figure 4 The flow rate of the coating solution delivered by the pump turbulence at ten-minute intervals, and the change in the pump turbulence flow rate. △Q As shown in Table 1.

[0117] Table 1. Flow rate results of the coating solution transported by the pump turbulent flow and the change in pump turbulent flow rate ΔQ

[0118]

[0119] Comparative Example 1:

[0120] Comparative Example 1 uses the pump operation module 100 of Embodiment 3 of the present invention to transport the plating solution under pump turbulence conditions. All other pump turbulence models of the present invention with intelligent flow control are disabled. The pump turbulence flow rate is set to 200 liters / minute, the operating time is 80 minutes, and the actual flow rate is measured. Q 实测流量 Data such as Figure 5 As shown:

[0121] from Figure 5 It can be seen that the measured results of the pump operation module conveying the plating solution under the pump turbulence conditions in Comparative Example 1 are as follows:

[0122] 196.8 < Q 实测流量 <203.2,

[0123] 196.8-200< Q 实测流量 - Q 标准流量 <203.2-200

[0124] Therefore, -3.2 < △Q ＜ 3.2

[0125] Right now △Q Satisfying Formula 8:

[0126] -3.2%× Q 标准流量 ≤ △Q ≤3.2%× Q 标准流量 Formula 8

[0127] The results of Comparative Example 1 show that the allowable flow rate deviation of the pump operation module 100 for conveying the plating solution under turbulent pump conditions is <±3.2%.

[0128] Furthermore, the pump selected for the pump operation module 100 is of Class 1 accuracy. According to ISO 9906:2012 Rotary Power Pumps - Hydraulic Performance Acceptance Test Standard: the allowable flow deviation is ±3% for the highest accuracy level of Class 1; and ±5% for Class 2 accuracy. Therefore, under the conditions of the pump operation module 100 used in this comparative experiment, it is between Class 1 and Class 2 accuracy of the ISO 9906 standard.

[0129] It is evident from the existing ISO 9906:2012 standard and the experimental results of Comparative Example 1 that the current control technology for pump flow rate transport of plating solution has the following significant shortcomings compared to the pump turbulence model technology for intelligent flow control of the present invention:

[0130] 1. When using the highest level 1 accuracy of the existing ISO 9906:2012 standard for pumps, under the turbulent conditions of Comparative Example 1, the allowable deviation of the flow rate of the pump operating module 100 conveying the plating solution is ≤±3.2%;

[0131] 2. Compared with the flow rate allowable deviation ≤ ±0.9% of the pump turbulence model system for intelligent flow control of the present invention, the accuracy is significantly different;

[0132] 3. When using the highest level 1 precision of existing pumps, the plating process for high-end semiconductor lead frames with precious metals results in poor uniformity of the plating distribution, which cannot meet the requirements of high-performance semiconductor electronic products.

[0133] 4. Due to the lack of high-performance plating process conditions, the production efficiency of semiconductor lead frame products on the plating production line is very low, and the low yield rate leads to high production costs.

[0134] In summary, the method and system for constructing a pump turbulence model based on intelligent flow control provided by this invention, through an optimized and improved Reynolds stress transport equation, can quickly establish the adjustable flow rate variation of pump turbulence transport of plating solutions for various monomeric metal salts, binary metal salts, and ternary or higher-order metal salts in actual production processes. △Q By defining the threshold range and then obtaining the optimal pump turbulence control method for semiconductor electronic components through the pump turbulence plating equipment module, it is possible to quickly and accurately predict the local plating thickness of semiconductor electronic components, significantly reduce the error between the plating thickness and the actual electroplated product, improve the uniformity of the plating thickness, and meet the high-quality requirements of high-end semiconductor lead frame products.

[0135] Some steps in the embodiments of the present invention can be implemented using software, and the corresponding software program can be stored in a readable storage medium, such as an optical disc or a hard disk.

[0136] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for constructing a pump turbulence model, characterized in that, The method includes: Step 1: Select the pump type, model, and configure the pipe diameter and flow range data according to the type of plating solution and pump flow rate; Step 2: Configure the frequency converter and flow meter according to the pump type and model in Step 1 to obtain a matching pump device module with frequency converter and flow meter. Step 3: Construct a pump turbulence model based on the Reynolds stress transport equation, including: Calculate the flow rate during the turbulent transport of the plating solution by the pump. Q = P × η / 2.73 H In the formula: Q For traffic; P Shaft power; η 2.73 is the pump efficiency; 2.73 is a constant. H For Yangcheng; Combining turbulent viscosity μ t and correction factor , The Reynolds stress transport equation was optimized, and correction coefficients were obtained within a specified flow range for the turbulent pump transport of the coating solution through training optimization. and To obtain accurate modeling standard traffic Q 标准流量 ; Step 4: Real-time monitoring of the real-time flow rate of the plating solution delivered by the pump during turbulent transport. Q 实时流量 Calculate the change in real-time traffic. △ Q = Q 实时流量 - Q 标准流量 ; Step 5: When △Q Exceeding the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 At that time, the pump frequency is dynamically adjusted to make △Q Within the above threshold range, maintain stable flow; when △Q Not exceeding the threshold range [-1% × Q 标准流量， 1% × Q 标准流量 During this time, the plating solution is continuously pumped and turbulently transported.

2. The method for constructing a pump turbulence model according to claim 1, characterized in that, The Reynolds stress transport equation includes: Formula 2 Formula 3 in, ρ For fluid density, k For turbulent energy, ε The turbulent dissipation rate; It is pulsating energy. μ t This is the turbulent viscosity value. , , It is a constant; In formula 2, express t The differential term of continuous turbulent energy at time t, express x i The differential terms of continuous turbulent energy and pulsating energy in the direction are represented by the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time t is divided by the sum of the turbulent kinetic energy fluid scattering coefficients and multiplied by . x j Turbulent energy differential in direction, middle P ij Indicates a specific parameter, G ij This represents the turbulent kinetic energy generated by a specific average velocity gradient. ρε This represents the product of fluid density and turbulent dissipation rate. In formula 3, express t The differential term of the turbulent dissipation rate at time t, express x i The continuous dissipation rate and pulsating energy differential terms in the direction, with the specific expansion on the right side of the equation; express x j Direction The energy differential term shown is specifically the turbulent viscosity value and... t The turbulent viscosity at time twitch time is divided by the sum of the fluid scattering coefficients under turbulent energy conditions, multiplied by... x j Differential of turbulent dissipation rate in the direction; middle P ij Indicates a specific parameter, G ij This represents the turbulent kinetic energy generated by a specific average velocity gradient. Indicates the correction factor The product of the fluid density and the turbulent dissipation rate is multiplied by the square of the turbulent energy and then divided by the turbulent energy.

3. The method for constructing a pump turbulence model according to claim 2, characterized in that, The turbulent viscosity μ t for: in, It is a constant.

4. The method for constructing a pump turbulence model according to claim 1, characterized in that, The metal ions in the plating solution include: Monomer coatings: Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Alloy coatings include Au-Ni, Pd-Ni, Ni-P, W-Ni, Ag-Sn, Au-Sn, Rh-Ru, and Pt-Rh or Au-W-Ni ternary or higher alloy metals.

5. The method for constructing a pump turbulence model according to claim 1, characterized in that, The method is applicable to semiconductor electronic components to be processed, including: precision terminals, lead frames, wafer chips, and precision decorative items.

6. A system for constructing a pump turbulence model, characterized in that, The system for implementing the method of constructing a pump turbulence model as described in any one of claims 1-5 includes: Pump operation module (100) is used to transport plating solution; The flow intelligent control module (200) is used to control the pump operation module (100), and simulates the turbulence model of the pump conveying the plating solution in the plating equipment module through the Reynolds stress transport equation, and calculates and obtains the pump turbulence modeling data; The data training module (300) is used to compare and train the real-time flow rate and frequency conversion data of the pump turbulence of the pump operation module (100) with the modeling data; Analog-to-digital converter (400) is used to convert the analog signal of a continuous variable into a discrete digital signal during the operation of the pump operation module (100); The processor (500) is used to identify and process the digital signals output by the analog-to-digital converter (400); An automatic regulator (600) is used to continuously monitor and adjust the controlled parameters of the processor (500) through the negative feedback mechanism to keep them consistent with the set value; A digital-to-analog converter (700) is used to convert the discrete digital signal output by the automatic regulator (600) into a continuously changing analog signal.

7. The system for constructing a pump turbulence model according to claim 6, characterized in that, The pump operation module (100) includes a pump, a frequency converter, a flow meter, and a plating solution.

8. A method for pump-driven turbulent transport of plating solution based on intelligent flow control, characterized in that, The method for constructing the pump turbulence model according to any one of claims 1-5 includes: S1: Construct a database based on the conditions for transporting the plating solution under pump turbulence conditions, including: plating solution temperature, plating solution specific gravity, precision flow meter, pump frequency, and connecting pipe diameter; thereby constructing an initial pump turbulence model linked to the database; S2: Extract two different pump turbulence flow conditions from the database, and use the pump operation module (100) to perform actual operation of pump turbulence delivery of plating solution to the semiconductor lead frame, and record the changes in real-time pump turbulence flow rate. △Q Import measured data into the initial Reynolds stress transport equation; S3: Based on the imported real-time pump turbulent flow rate variation. △Q The measured data were used to refine the initial Reynolds stress transport equation into an initial pump turbulence model. S4: During the refinement of the initial Reynolds stress transport equation in S3, correction coefficients are obtained within the specified flow range for the turbulent pump transport of the coating solution through training and optimization. and To obtain accurate modeling standard flow Q 标准流量 ; S5: Select the standard flow rate for simulation modeling within the initial pump turbulence model. Q 标准流量 The feedback is applied to the actual operation of pump turbulence delivery of the coating solution, and the subsequently obtained real-time pump turbulence flow rate is used. Q 实测流量 Change △Q The measured data were imported into the initial pump turbulence model to obtain the upgraded pump turbulence model; S6: Real-time loop of S5 to obtain a continuously iteratively upgraded pump turbulence model; S7: Select a certain generation of upgraded pump turbulence model in S6 as the applied pump turbulence model, use the applied pump turbulence model to obtain the optimal real-time pump turbulence flow rate change condition data, and realize the construction and optimization of the pump turbulence model based on the optimal flow rate change condition data.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method as described in any one of claims 1 to 5.

10. A computer program product, characterized in that, The computer program product stores computer instructions that are executed by a processor using the method as described in any one of claims 1 to 5.

Images