Battery management system and battery pack

Abstract

The invention relates to the technical field of batteries, and provides a battery management system and a battery pack. The battery management system includes a circuit board and a busbar. The circuit board is provided with a connecting hole. The busbar is provided with a connecting part. The connecting part passes through the connecting hole from the first side of the circuit board and is welded with the circuit board at the second side of the circuit board. Therefore, the welding difficulty can be reduced, and the welding strength is improved.

Description

Technical Field

[0001] The present invention relates to the field of battery technology, and in particular to a battery management system and a battery pack. Background Art

[0002] In related technologies, battery management systems usually include a circuit board and a bus. The circuit board is mainly used for signal processing, logic control, and communication, and can realize functions such as battery status monitoring, battery protection, and communication interaction. The bus is mainly used to transmit electrical energy, and can realize functions such as current collection and distribution, and low-impedance conduction. The pins of the bus are usually connected to the circuit board by soldering. The traditional method is to open a hole in the circuit board, pass the pins through the hole from the front, and solder on the same side. However, this welding method is not only difficult to operate, but also easily leads to insufficient welding strength. Summary of the Invention

[0003] Embodiments of the present invention provide a battery management system and a battery pack, which can facilitate welding operations and improve welding strength.

[0004] In a first aspect, an embodiment of the present invention provides a battery management system, comprising:

[0005] A circuit board having a connection hole;

[0006] The busbar is provided with a connecting portion, wherein the connecting portion passes through the connecting hole from the first side of the circuit board and is welded to the circuit board at the second side of the circuit board.

[0007] In one embodiment, the connecting portion includes a protruding section passing through the connecting hole, the connecting portion is welded to the circuit board to form a welding portion, and the welding portion includes a first welding layer connected to the protruding section, and the height of the first welding layer is H2, satisfying: 1 mm ≤ H2 ≤ 2 mm.

[0008] In one embodiment, the first welding layer is tapered along a direction from the first side to the second side.

[0009] In one embodiment, the connecting portion further includes a connecting segment located in the connecting hole, the connecting segment being connected to the passing segment, wherein the connecting segment is spaced apart from a wall surface of the connecting hole.

[0010] In one embodiment, the welding portion further comprises:

[0011] The second welding layer is connected between the connecting section and the wall surface of the connecting hole, and the second welding layer is connected to the first welding layer.

[0012] In one embodiment, a distance D1 between the connecting section and the wall surface of the connecting hole satisfies the following relationship: 0<D1≤0.4 mm.

[0013] In one embodiment, the distance between the connecting section and the wall of the connecting hole is D1;

[0014] The width of the connecting segment is D2, which satisfies the following conditions: D1 is positively correlated with D2;

[0015] And / or, the cross-sectional area of the connecting section parallel to the plane where the circuit board is located is S, satisfying: D1 is positively correlated with S.

[0016] In one embodiment, the distance between the connecting section and the wall of the connecting hole is D1, the number of the connecting parts is set to N, and the connecting parts correspond to the connecting holes one by one, where N≥1, and N is an integer, satisfying: D1 is positively correlated with N.

[0017] In one embodiment, the distance between the connecting section and the wall surface of the connecting hole is D1, the connecting parts are set to be at least two, and the connecting parts correspond to the connecting holes one by one, wherein the distance between two adjacent connecting parts is D3, satisfying: D1 is positively correlated with D3.

[0018] In one embodiment, the busbar is spaced apart from the circuit board, and the welding portion further includes a third welding layer located between the facing surfaces of the busbar and the circuit board, and the third welding layer is connected to an end of the second welding layer away from the first welding layer.

[0019] In one embodiment, a solder pad is provided on the circuit board, and the solder pad is arranged around the connection hole, wherein the connection portion is soldered to the circuit board to form a soldering portion, and the soldering portion is connected to the solder pad.

[0020] In one embodiment, the connection holes are spaced at least two apart, and one connection hole is correspondingly connected to one solder pad, wherein the distance between each two adjacent solder pads is D4, satisfying: D4 ≥ 0.5 mm.

[0021] In one embodiment, the pad includes:

[0022] a first main body portion, disposed on a first side of the circuit board;

[0023] a second main body portion, annularly arranged on the wall surface of the connecting hole, the second main body portion being connected to the first main body portion;

[0024] The third main body is provided on the second side of the circuit board, and is connected to an end of the second main body away from the first main body.

[0025] In one embodiment, the connecting portion includes a passing section passing through the connecting hole and a connecting section located in the connecting hole, and the welding portion includes:

[0026] a first welding layer connected to the protruding section and the third main body;

[0027] a second welding layer, located between the connecting section and the second main body portion, the second welding layer being connected to the first welding layer;

[0028] The third welding layer is located between the bus bar and the third main body portion, and is connected to an end of the second welding layer away from the first welding layer.

[0029] In one embodiment, the outer edge of the first welding layer does not exceed the outer edge of the third main body portion;

[0030] And / or, the outer edge of the third welding layer does not exceed the outer edge of the first main body portion.

[0031] In one embodiment, the width of the first main body portion is D5, which satisfies: D5 ≥ 1 mm;

[0032] And / or, the width of the third main body portion is D6, satisfying: D6 ≥ 1 mm.

[0033] In one embodiment, a connection surface between the connection portion and the bus bar is configured as an arc surface.

[0034] In one embodiment, the busbar includes a positive input busbar and a positive output busbar, the positive input busbar and the positive output busbar are arranged at intervals on the circuit board, a MOS transistor is provided on the circuit board, the MOS transistor is located between the positive input busbar and the positive output busbar, and opposite ends of the MOS transistor are electrically connected to the positive input busbar and the positive output busbar respectively;

[0035] And / or, the busbar includes a negative input busbar and a negative output busbar, the negative input busbar and the negative output busbar are arranged at intervals on the circuit board, a shunt is provided on the circuit board, the shunt is located between the negative input busbar and the negative output busbar, and the opposite ends of the shunt are electrically connected to the negative input busbar and the negative output busbar respectively.

[0036] In one embodiment, a mounting hole is formed on the busbar, and the mounting hole is configured to connect to the battery module or the upper cover.

[0037] In a second aspect, an embodiment of the present invention provides a battery pack including the aforementioned battery management system.

[0038] Beneficial effects of the embodiments of the present invention:

[0039] In an embodiment of the present invention, a connection hole is formed in the circuit board, allowing the connecting portion of the busbar to pass through the hole from a first side of the circuit board and be soldered to the circuit board on a second side. As a result, when a welding gun is used to solder the connecting portion, the busbar will not interfere with the operation of the welding gun, thereby reducing welding difficulty. Furthermore, the welding gun can ensure that the molten tin ejected from the welding nozzle completely covers the connecting portion, thereby improving welding strength and current handling capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 is a schematic structural diagram of a battery management system provided by an embodiment of the present invention;

[0042] Figure 2 is a top view of a battery management system provided by an embodiment of the present invention;

[0043] Figure 3 is a top view of a circuit board provided by an embodiment of the present invention;

[0044] Figure 4 is a schematic structural diagram of a bus provided by an embodiment of the present invention;

[0045] Figure 5 This is a schematic diagram of the partial connection structure between the busbar and the circuit board before welding provided by an embodiment of the present invention;

[0046] Figure 6 This is one of the schematic diagrams of the partial connection structure between the busbar and the circuit board after welding provided by an embodiment of the present invention;

[0047] Figure 7 This is the second schematic diagram of the partial connection structure between the busbar and the circuit board after welding provided by an embodiment of the present invention.

[0048] Description of reference numerals:

[0049] 1. Circuit board; 11. Connection hole;

[0050] 2. Busbar; 21. Connecting portion; 211. Exit section; 212. Connecting section; 22. Mounting hole;

[0051] 3. Welding part; 31. First welding layer; 32. Second welding layer; 33. Third welding layer;

[0052] 4. solder pad; 41. first main body; 42. second main body; 43. third main body;

[0053] 51. Positive input busbar; 52. Positive output busbar; 53. Negative input busbar; 54. Negative output busbar; 55. MOS tube; 56. Shunt. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0055] like Figures 1 to 7 As shown, an embodiment of the present application provides a battery management system. The battery management system includes a circuit board 1 and a busbar 2. The circuit board 1 has a connection hole 11. The busbar 2 has a connecting portion 21. The connecting portion 21 passes through the connection hole 11 from a first side of the circuit board 1 and is soldered to the circuit board 1 on a second side of the circuit board 1.

[0056] In the embodiment of the present application, by forming a connection hole 11 in the circuit board 1, the connection portion 21 of the busbar 2 is passed through the connection hole 11 from the first side of the circuit board 1 and is welded to the circuit board 1 on the second side of the circuit board 1. As a result, when the welding gun is welding the connection portion 21, the busbar 2 will not interfere with the operation of the welding gun, thereby reducing the difficulty of welding. In addition, the welding gun can also ensure that the molten tin ejected from the welding nozzle can completely cover the connection portion 21, thereby improving the welding strength and current flow capacity.

[0057] In some embodiments, to facilitate the insertion of the connection portion 21, the end of the connection portion 21 away from the busbar 2 can be configured to be tapered. For example, the end of the connection portion 21 away from the busbar 2 can be configured to be pyramidal, truncated pyramidal, etc.

[0058] In some embodiments, the connecting portion 21 is a component formed by bending or stamping the busbar 2 as a whole. The connecting portion 21 is arranged at an angle to the busbar 2. For example, the connecting portion 21 is perpendicular to the busbar 2.

[0059] In some embodiments, the connection portion 21 and the circuit board 1 are soldered using wave soldering. Compared to reflow soldering, the wave soldering method allows the resulting soldering portion 3 to fill the gap between the connection portion 21 and the circuit board 1. Furthermore, molten tin can flow through the gap from the second side to the first side, allowing the soldering portion 3 on opposite sides of the circuit board 1 to connect the busbar 2 and the circuit board 1. This significantly improves the soldering strength and current handling capacity of the two components.

[0060] like Figure 5 As shown, in some embodiments, the connecting portion 21 includes a protruding section 211 that passes through the connecting hole 11. The protruding section 211 has a height H1 that satisfies: 1 mm ≤ H1 ≤ 2 mm.

[0061] It will be appreciated that during soldering, the tip of the welding gun is inserted into the protruding section 211 and then extends outward to apply tin. The molten tin adheres to the protruding section 211 and the circuit board 1 and solidifies, completing the soldering process between the connecting portion 21 and the circuit board 1. Setting the height H1 of the protruding section 211 between 1 mm and 2 mm ensures soldering strength while preventing insufficient tinning.

[0062] When the height H1 of the protrusion section 211 is less than 1 mm, the height of the protrusion section 211 is too small, resulting in a small welding area and insufficient welding strength. At the same time, it will also cause the height of the welding layer located on the side of the protrusion section 211 away from the circuit board 1 to be too large, making it easier for bubbles to be generated inside the welding layer, affecting the overcurrent effect of the bus 2, and also making the welding layer more prone to tin tip phenomenon. When tin tip appears in the welding layer, the tin tip is easy to fall off and form a tin ball that can roll around on the surface of the circuit board 1. If the tin ball rolls between two adjacent components and forms an electrical connection between the two, it will cause a short circuit between the two adjacent components. Alternatively, if the tin ball rolls between the two pins of a component, it will cause a short circuit in a single component.

[0063] When the height H1 of the protrusion section 211 is greater than 2 mm, the protrusion section 211 is too high. Since the height of the soldering tip is usually fixed for the same product, the solder layer covering the protrusion section 211 will be thinner, resulting in insufficient soldering of the protrusion section 211, which will affect the soldering effect. It will also cause the distance between the protrusion section 211 and the metal parts below the circuit board 1 to be smaller, resulting in insufficient electrical clearance between the protrusion section 211 and the metal parts below the circuit board 1. Due to vibration, processing errors, cumulative assembly errors, etc., the protrusion section 211 may contact the circuit board 1 and cause a short circuit.

[0064] In some embodiments, the height H1 of the protruding section 211 is set to 1 mm, 1.5 mm, 2 mm, or any value therebetween.

[0065] like Figure 6 and Figure 7 As shown, in some embodiments, the connecting portion 21 is welded to the circuit board 1 to form a welding portion 3. The welding portion 3 includes a first welding layer 31 connected to the protruding section 211. The height of the first welding layer 31 is H2, which satisfies: 1 mm ≤ H2 ≤ 2 mm.

[0066] It can be understood that the first welding layer 31 of the welding portion 3 formed by welding the connecting portion 21 to the circuit board 1 will completely cover the through-section 211 in the height direction, so the first welding layer 31 can be completely covered on the peripheral side of the through-section 211 to ensure a good welding effect.

[0067] When the height H2 of the first solder layer 31 is less than 1 mm, the height of the first solder layer 31 is too small, resulting in a small soldering area and insufficient soldering strength. When the height H2 of the first solder layer 31 is greater than 2 mm, the height of the first solder layer 31 is too large, resulting in a small gap between the first solder layer 31 and the metal parts below the circuit board 1. This leads to insufficient electrical clearance between the first solder layer 31 and the metal parts below the circuit board 1. Due to vibration, processing errors, cumulative assembly errors, etc., the first solder layer 31 may contact the circuit board 1 and cause a short circuit.

[0068] In some embodiments, the height H2 of the first welding layer 31 is set to 1 mm, 1.5 mm, 2 mm, or any value therebetween.

[0069] In some embodiments, the height H2 of the first welding layer 31 is greater than or equal to the height H1 of the protrusion section 211. When the height H2 of the first welding layer 31 is equal to the height H1 of the protrusion section 211, the first welding layer 31 just completely covers the outer surface of the protrusion section 211. On the side away from the circuit board 1, the first welding layer 31 is flush with the protrusion section 211. In this way, the welding effect between the protrusion section 211 and the circuit board 1 is ensured, and the problem of poor welding such as voids in the first welding layer 31, which leads to a decrease in the flow capacity, is reduced. When the height H2 of the first welding layer 31 is greater than the height H1 of the protrusion section 211, the first welding layer 31 will also cover the surface of the protrusion section 211 away from the circuit board 1. In this way, the welding strength between the protrusion section 211 and the circuit board 1 can be improved, ensuring reliable welding of the protrusion section 211 by the welding nozzle.

[0070] In some embodiments, H2-H1≤0.2 mm.

[0071] It is understandable that when the difference between the height H2 of the first soldering layer 31 and the height H1 of the protrusion section 211 exceeds 0.2 mm, the height of the first soldering layer 31 located on the side of the protrusion section 211 away from the circuit board 1 will be too large. At this time, bubbles are more likely to be generated inside the first soldering layer 31, affecting the flow effect of the bus 2. In addition, if the first soldering layer 31 is too thick, tin tip phenomenon is more likely to occur. When tin tip appears in the first soldering layer 31, the tin tip is easy to fall off and form a tin ball that can roll around on the surface of the circuit board 1. If the tin ball rolls between two adjacent components and forms an electrical connection between the two, it will cause a short circuit between the two adjacent components, or if the tin ball rolls between the two pins of a component, it will cause a short circuit in a single component.

[0072] In some embodiments, the height H2 of the first welding layer 31 is equal to the height H1 of the penetrating segment 211 .

[0073] In some embodiments, the height H2 of the first welding layer 31 is higher than the height H1 of the penetration section 211 by 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, or any value therebetween.

[0074] Please continue reading Figure 6 and Figure 7 In some embodiments, the first welding layer 31 is tapered along the direction from the first side to the second side.

[0075] It can be understood that the direction from the first side to the second side is the extension direction of the through-section 211, and the extension direction perpendicular to the through-section 211 is the thickness direction of the first soldering layer 31. Along the direction from the bus 2 to the circuit board 1, the first soldering layer 31 is tapered. Since the through-section 211 is not gradual, the thickness of the first soldering layer 31 decreases. As a result, the thickness of the first soldering layer 31 is the largest at the position close to the circuit board 1, so that the circuit board 1 and the through-section 211 have good soldering strength and flow-through effect; the thickness of the first soldering layer 31 is the smallest at the position away from the circuit board 1, so as to reduce the possibility of bubbles forming inside the first soldering layer 31 and prevent the first soldering layer 31 from having tin tips.

[0076] It should be noted that the first soldering layer 31 may be tapered based on the design of the soldering nozzle or based on the combined effects of gravity and surface tension between the molten tin, the connecting section 212 and the soldering pad 4 .

[0077] It should be noted that the first side and the second side are two opposite sides of the circuit board 1. For example, the first side is the front side of the circuit board 1, and the second side is the back side of the circuit board 1.

[0078] In some embodiments, the cross-section of the exit section 211 is square along a direction perpendicular to the extension of the exit section 211. In this case, the first welding layer 31 is square and annular along the direction perpendicular to the extension of the exit section 211. Alternatively, the cross-section of the exit section 211 is circular along a direction perpendicular to the extension of the exit section 211. In this case, the first welding layer 31 is circular and annular along the direction perpendicular to the extension of the exit section 211.

[0079] Please continue reading Figures 5 to 7 In some embodiments, the connecting portion 21 further includes a connecting segment 212 located in the connecting hole 11. The connecting segment 212 is connected to the passing segment 211. The connecting segment 212 is spaced apart from the wall of the connecting hole 11.

[0080] Based on the spacing between the connecting section 212 and the wall of the connecting hole 11, when the soldering tip is sleeved on the through-section 211 and tin is discharged, part of the molten tin will adhere to the surface of the through-section 211, and part of the molten tin will overflow into the gap between the connecting section 212 and the wall of the connecting hole 11, thereby improving the welding strength between the connecting portion 21 and the circuit board 1.

[0081] In some embodiments, the welding portion 3 further includes a second welding layer 32 connected between the connecting section 212 and the wall surface of the connecting hole 11. The second welding layer 32 is connected to the first welding layer 31.

[0082] It can be understood that based on the spacing between the connecting section 212 and the wall surface of the connecting hole 11, when the soldering nozzle is sleeved on the through-out section 211 and tin is discharged, a portion of the molten tin will adhere to the surface of the through-out section 211, and a portion of the molten tin will overflow into the gap between the connecting section 212 and the wall surface of the connecting hole 11, and form a second soldering layer 32 between the connecting section 212 and the wall surface of the connecting hole 11, so that the second soldering layer 32 connects the connecting section 212 and the connecting hole 11, thereby increasing the connection area between the connecting portion 21 and the circuit board 1 and improving the reliability of soldering.

[0083] It should be noted that the second welding layer 32 can also directly connect the connecting section 212 to the copper layer between the layers of the circuit board 1 to form an electrical connection. As a result, the busbar 2 can conduct current to the circuit board 1 through the connecting portion 21, eliminating the need for current to be conducted between the layers of the circuit board 1. Because the impedance of the circuit board 1 conducting current across the functional layers along its thickness to the copper layer is significantly greater than the impedance of the path through which the connecting section 212 conducts current directly to the copper layer of the circuit board 1, the current carrying capacity is improved. As a result, the current carrying capacity can be improved while improving the welding strength.

[0084] In some embodiments, the cross-section of the connecting section 212 is square. In this case, the connecting hole 11 is configured as a square hole, and the second welding layer 32 is configured as a square ring. Alternatively, the cross-section of the connecting section 212 is circular. In this case, the connecting hole 11 is configured as a circular hole, and the second welding layer 32 is configured as a circular ring.

[0085] It should be noted that the cross-sectional dimensions of the connecting section 212 and the exit section 211 are the same. The spacing between the connecting section 212 and the wall of the connecting hole 11 facilitates the insertion of the exit section 211 and the connecting section 212 through the connecting hole 11, thereby preventing the connection hole 11 from being insufficiently sized and causing the exit section 211 to be unable to pass through the connecting hole 11. In the embodiment of the present application, the gap between the connecting section 212 and the wall of the connecting hole 11 is filled with a second solder layer 32, thereby preventing insufficient solder filling between the two, which can lead to excessive impedance in the connection area. Excessive impedance at this location can cause severe heat generation, resulting in product functional degradation or even damage.

[0086] Since the first welding layer 31 and the second welding layer 32 are both formed by solidifying molten tin, the first welding layer 31 and the second welding layer 32 are integrally formed.

[0087] Please continue reading Figure 5 In some embodiments, the distance between the connecting section 212 and the wall of the connecting hole 11 is D1, which satisfies: 0<D1≤0.4 mm.

[0088] It will be appreciated that the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is greater than 0 mm to ensure a gap between them. This not only facilitates the passage of the exit section 211 and the connecting section 212 through the connecting hole 11, but also allows molten tin to penetrate the gap, thereby forming the second solder layer 32. The distance D1 between the connecting section 212 and the wall of the connecting hole 11 is less than or equal to 0.4 mm to prevent the second solder layer 32 from being too thick and forming bubbles within it, which would affect the flow rate, impedance, and soldering strength.

[0089] It is understood that the distance D1 between the connecting section 212 and the wall of the connecting hole 11 corresponds to the difference between the inner and outer diameters of the second welding layer 32, that is, the thickness of the second welding layer 32. If the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is greater than 0.4 mm, the thickness of the second welding layer 32 will be too large, causing bubbles to form within it, affecting the flow rate, impedance, and welding strength. It will also make it more difficult to align the connecting portion 21 with the connecting hole 11, making it difficult to install the busbar 2 in the predetermined position on the circuit board 1, resulting in a large installation error of the busbar 2 and affecting the subsequent installation of the battery management system.

[0090] In some embodiments, the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or any value therebetween.

[0091] In some embodiments, the distance between the connecting section 212 and the wall of the connecting hole 11 is D1. The width of the connecting section 212 is D2, which satisfies the following: D1 is positively correlated with D2.

[0092] It is understood that the larger the width of the connecting section 212, the larger the size of the connecting hole 11, and the greater the manufacturing tolerances between the two during manufacturing. In this case, increasing the distance between the connecting section 212 and the wall of the connecting hole 11 ensures that the passage section 211 and the connecting section 212 can be inserted into the connecting hole 11. For example, the width D2 of the connecting section 212 is set to 7 mm, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.2 mm. The width D2 of the connecting section 212 is set to 10 mm, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.3 mm.

[0093] It should be noted that the width direction of the connecting section 212 may be the width direction of the circuit board 1 . Alternatively, the width direction of the connecting section 212 may be the length direction of the circuit board 1 .

[0094] In some embodiments, the distance between the connecting section 212 and the wall of the connecting hole 11 is D1. The cross-sectional area of the connecting section 212 parallel to the plane of the circuit board 1 is S, and D1 and S are positively correlated.

[0095] It is understood that, in a direction parallel to the plane of the circuit board 1, the larger the cross-sectional area of the connecting section 212, the larger the size of the connecting hole 11, and the greater the manufacturing tolerances between the two during manufacturing. In this case, increasing the distance between the connecting section 212 and the wall of the connecting hole 11 ensures that the protruding section 211 and the connecting section 212 can be inserted into the connecting hole 11. For example, the cross-sectional area S of the connecting section 212 is set to 80 square millimeters, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.2 millimeters. The cross-sectional area S of the connecting section 212 is set to 100 square millimeters, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.3 millimeters.

[0096] It should be noted that the connecting section 212 can be square or circular. When the connecting section 212 is square, the width of the connecting section 212 is positively correlated with the aforementioned embodiment. When the connecting section 212 is circular, the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is positively correlated with the diameter of the connecting section 212.

[0097] In some embodiments, the distance between the connecting section 212 and the wall of the connecting hole 11 is D1. The number of connecting portions 21 is set to N. The connecting portions 21 correspond one-to-one to the connecting holes 11. Where N ≥ 1, and N is an integer, satisfying: D1 is positively correlated with N.

[0098] It is understandable that the number of connecting parts 21 and connecting holes 11 corresponds one to one. The more connecting parts 21 there are, the more connecting holes 11 there are. During production and manufacturing, there is a cumulative tolerance between multiple connecting parts 21 and multiple connecting holes 11, and the larger the number, the greater the cumulative tolerance. At this time, the larger the distance between the connecting section 212 and the wall of the connecting hole 11, the greater the distance can be ensured to ensure that the passing section 211 and the connecting section 212 can be passed through the connecting hole 11. For example, the number of connecting parts 21 is set to 5, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.1 mm. The number of connecting parts 21 is set to 8, and the distance D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.2 mm.

[0099] like Figure 3 As shown, in some embodiments, the distance between the connecting segment 212 and the wall of the connecting hole 11 is D1. At least two connecting portions 21 are provided at intervals. The connecting portions 21 correspond one-to-one with the connecting holes 11. The distance between two adjacent connecting portions 21 is D3, satisfying the following: D1 and D3 are positively correlated.

[0100] It can be understood that the number of connecting parts 21 and connecting holes 11 corresponds one to one, and the larger the spacing D3 between two adjacent connecting parts 21, the larger the spacing between two adjacent connecting holes 11. During production, the tolerance of large spacing will be larger than the tolerance of small spacing. At this time, the larger the spacing between the connecting section 212 and the wall of the connecting hole 11, the more it can ensure that the passing section 211 and the connecting section 212 can be passed through the connecting hole 11. For example, the spacing D3 between two adjacent connecting parts 21 is set to 2 mm, and the spacing D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.1 mm. The spacing D3 between two adjacent connecting parts 21 is set to 4 mm, and the spacing D1 between the connecting section 212 and the wall of the connecting hole 11 is set to 0.2 mm.

[0101] Please continue reading Figure 6 and Figure 7 In some embodiments, the busbar 2 is spaced apart from the circuit board 1. The soldering portion 3 further includes a third soldering layer 33 located between the facing surfaces of the busbar 2 and the circuit board 1. The third soldering layer 33 is connected to an end of the second soldering layer 32 away from the first soldering layer 31.

[0102] It can be understood that, based on the spacing between the connecting section 212 and the wall surface of the connecting hole 11, and the spacing between the bus 2 and the circuit board 1. At this time, the gap between the connecting section 212 and the wall surface of the connecting hole 11 can be connected to the gap between the bus 2 and the circuit board 1. When the soldering nozzle is sleeved on the outlet section 211 and tin is discharged, a portion of the molten tin will adhere to the surface of the outlet section 211, a portion of the molten tin will overflow into the gap between the connecting section 212 and the wall surface of the connecting hole 11, and form a second soldering layer 32 between the connecting section 212 and the wall surface of the connecting hole 11, and a portion of the molten tin will overflow into the gap between the bus 2 and the circuit board 1, and form a third soldering layer 33 between the bus 2 and the circuit board 1. As a result, the third soldering layer 33 can also connect the bus 2 and the circuit board 1, increase the connection area between the connecting portion 21 and the circuit board 1, and improve the reliability of soldering.

[0103] Since the first welding layer 31 , the second welding layer 32 and the third welding layer 33 are all formed by solidifying molten tin, the first welding layer 31 , the second welding layer 32 and the third welding layer 33 are integrally formed.

[0104] The third welding layer 33 is located between the busbar 2 and the circuit board 1 , and the thickness of the third welding layer 33 is the same as the height of the gap between the busbar 2 and the circuit board 1 .

[0105] The third welding layer 33 is provided in a ring shape and is provided around the connection hole 11 and the connection portion 21. Thus, the connection area between the busbar 2 and the circuit board 1 and the connection portion 21 and the circuit board 1 is further increased, thereby improving the reliability of welding.

[0106] like Figure 2 and Figure 6 As shown, in some embodiments, a soldering pad 4 is provided on the circuit board 1. The soldering pad 4 is arranged around the connection hole 11. The connecting portion 21 is soldered to the circuit board 1 to form a soldering portion 3. The soldering portion 3 is connected to the soldering pad 4.

[0107] It is understood that soldering portion 3 is disposed between pad 4 and busbar 2, and between pad 4 and connecting portion 21, to achieve electrical connection between busbar 2 and circuit board 1. Forming soldering portion 3 on pad 4 ensures soldering strength, ensuring a secure solder joint and good electrical conductivity. If soldering portion 3 were formed directly on circuit board 1, molten tin could diffuse across circuit board 1. If molten tin diffuses between other components, it could cause a short circuit or bridge between the components, leading to electrical failure.

[0108] In some embodiments, the connection hole 11 is a square hole, and the pad 4 is a square ring pad 4. Alternatively, the connection hole 11 is a circular hole, and the pad 4 is a circular ring pad 4.

[0109] In some embodiments, the pad 4 may further have an isolation portion at a peripheral side away from the connection hole 11 . The isolation portion may prevent the molten tin from flowing out of the pad 4 , thereby further avoiding short circuits or bridges between components.

[0110] In some embodiments, the pad 4 can be made of copper, tin, tin-plated copper, tin-lead alloy, lead-free solder, nickel, or the like.

[0111] Please continue reading Figure 3 In some embodiments, the connection holes 11 are spaced at least two apart. One connection hole 11 is connected to one solder pad 4. The distance between each two adjacent solder pads 4 is D4, which satisfies: D4 ≥ 0.5 mm.

[0112] It is understood that a busbar 2 has multiple connecting portions 21, each of which is correspondingly inserted into a connecting hole 11. To achieve soldering between the connecting portion 21 and the circuit board 1, a soldering pad 4 is provided at each connecting hole 11. The spacing D4 between two adjacent soldering pads 4 is greater than or equal to 0.5 mm to prevent adhesion between adjacent soldering portions 3. Adhesion between adjacent soldering portions 3 may result in electrical connection between components located around the soldering portions 3. Furthermore, tin accumulation may lead to solder waste, affecting the aesthetics of the circuit board 1.

[0113] In some embodiments, the distance D4 between every two adjacent pads 4 is the same. For example, D4 can be set to 0.5 mm, 1 mm, 2 mm, etc.

[0114] In some embodiments, the distance D4 between each two adjacent pads 4 is different. For example, D4 can be set to 0.5 mm, 1 mm, 2 mm, etc.

[0115] like Figure 5 As shown, in some embodiments, the solder pad 4 includes a first main portion 41, a second main portion 42, and a third main portion 43. The first main portion 41 is disposed on a first side of the circuit board 1. The second main portion 42 is disposed around the wall of the connection hole 11. The second main portion 42 is connected to the first main portion 41. The third main portion 43 is disposed on a second side of the circuit board 1. The third main portion 43 is connected to an end of the second main portion 42 away from the first main portion 41.

[0116] It is understood that the first side of the circuit board 1 is the top surface of the circuit board 1 (the front surface of the circuit board 1), and the second side of the circuit board 1 is the bottom surface of the circuit board 1 (the back surface of the circuit board 1). The first main portion 41 is disposed on the front surface of the circuit board 1 and is used to connect the busbar 2 to the soldering portion 3 between the front surface of the circuit board 1. The second main portion 42 is disposed on the wall surface of the connecting hole 11 and is used to connect the soldering portion 3 between the connecting section 212 and the wall surface of the connecting hole 11. The third main portion 43 is disposed on the back surface of the circuit board 1 and is used to connect the pass-through section 211 to the soldering portion 3 on the back surface of the circuit board 1.

[0117] In some embodiments, the first body portion 41 , the second body portion 42 and the third body portion 43 are integrally formed.

[0118] In some embodiments, the first main body portion 41 and the third main body portion 43 are both configured in a U-shape. The inner edges of the first main body portion 41 and the third main body portion 43 have the same size. The outer edges of the first main body portion 41 and the third main body portion 43 have the same or different sizes.

[0119] like Figure 6 and Figure 7 As shown, in some embodiments, the connecting portion 21 includes an exit section 211 extending through the connecting hole 11 and a connecting section 212 located within the connecting hole 11. The welding portion 3 includes a first welding layer 31, a second welding layer 32, and a third welding layer 33. The first welding layer 31 is connected to the exit section 211 and the third main body 43. The second welding layer 32 is located between the connecting section 212 and the second main body 42. The second welding layer 32 is connected to the first welding layer 31. The third welding layer 33 is located between the busbar 2 and the third main body 43. The third welding layer 33 is connected to the end of the second welding layer 32 away from the first welding layer 31.

[0120] It can be understood that the first welding layer 31 is coated on the peripheral side of the through-section 211, and the first welding layer 31 is connected to the third main body 43 located on the back side of the circuit board 1, the second welding layer 32 is used to connect the second main body 42 and the connecting section 212, and the third welding layer 33 is used to connect the first main body 41 and the bus 2 located on the front side of the circuit board 1. As a result, the top surface, back surface and wall surface of the connecting hole 11 of the circuit board 1 can be welded to the bus 2 and the connecting portion 21, ensuring that the circuit board 1 and the bus 2 have a sufficiently large welding area, improving the welding strength, and ensuring the reliability and stability of the welding.

[0121] In some embodiments, the shape of the first welding layer 31 matches the shape of the third main body portion 43 , the shape of the second welding layer 32 matches the shape of the second main body portion 42 , and the shape of the third welding layer 33 matches the shape of the first main body portion 41 .

[0122] Please continue reading Figure 6 and Figure 7 In some embodiments, the outer edge of the first welding layer 31 does not exceed the outer edge of the third main body portion 43 .

[0123] It can be understood that by ensuring that the outer edge of the first welding layer 31 does not exceed the outer edge of the third main body 43, tin can be prevented from overflowing from the third main body 43 and directly adhering to the surface of the circuit board 1. On the one hand, this can avoid solder waste and improve the aesthetics of the product. On the other hand, it can prevent the overflowed tin from forming tin balls and tin beads that roll on the circuit board 1 and cause short circuits in other components on the circuit board 1.

[0124] In some embodiments, an outer edge of the first welding layer 31 is flush with an outer edge of the third body portion 43 .

[0125] In some embodiments, an outer edge of the first welding layer 31 is spaced apart from an outer edge of the third main body portion 43 .

[0126] Please continue reading Figure 6 and Figure 7 In some embodiments, the outer edge of the third welding layer 33 does not exceed the outer edge of the first main body portion 41 .

[0127] It can be understood that by ensuring that the outer edge of the third welding layer 33 does not exceed the outer edge of the first main body 41, tin can be prevented from overflowing from the first main body 41 and directly adhering to the surface of the circuit board 1. On the one hand, this can avoid solder waste and improve the aesthetics of the product. On the other hand, it can prevent the overflowed tin from forming tin balls and tin beads that roll on the circuit board 1 and cause short circuits in other components on the circuit board 1.

[0128] In some embodiments, an outer edge of the third welding layer 33 is flush with an outer edge of the first body portion 41 .

[0129] In some embodiments, an outer edge of the third welding layer 33 is spaced apart from an outer edge of the first main body portion 41 .

[0130] Please continue reading Figure 6 and Figure 7 In some embodiments, the width of the first main body portion 41 is D5, satisfying: D5 ≥ 1 mm.

[0131] It is understandable that if the width D5 of the first main body portion 41 is less than 1 mm, the molten tin will easily leak out from the outer edge of the first main body portion 41 during the welding process. The leaked tin may cause a short circuit in the surrounding components, or the leaked tin may form tin balls or tin beads and roll on the circuit board 1, causing other components on the circuit board 1 to short circuit. The width D5 of the first main body portion 41 being less than 1 mm may also result in insufficient tin filling between the bus 2 and the back of the circuit board 1, affecting the welding strength and reducing the reliability of the welding. Therefore, in the embodiment of the present application, the width D5 of the first main body portion 41 is made greater than or equal to 1 mm to prevent the molten tin from leaking out from the outer edge of the first main body portion 41, and to ensure that there is sufficient tin filling between the bus 2 and the back of the circuit board 1 to ensure welding strength.

[0132] In some embodiments, the width D5 of the first body portion 41 is set to 1 mm, 1.5 mm, 2 mm, etc.

[0133] Please continue reading Figure 6 and Figure 7 In some embodiments, the width of the third main body portion 43 is D6, satisfying: D6 ≥ 1 mm.

[0134] It is understandable that if the width D6 of the third main body 43 is less than 1 mm, during the welding process, the molten tin overflows to the third main body 43 and is easy to leak out from the outer edge of the third main body 43. The leaked tin may cause a short circuit in the surrounding components, or the leaked tin forms tin balls and rolls on the circuit board 1, causing other components on the circuit board 1 to short circuit. The width D6 of the third main body 43 being less than 1 mm will also lead to insufficient tin filling between the bus 2 and the front of the circuit board 1, affecting the welding strength and reducing the reliability of the welding. Therefore, in the embodiment of the present application, the width D6 of the third main body 43 is made greater than or equal to 1 mm to prevent the molten tin from leaking from the outer edge of the third main body 43, and to ensure that there is sufficient tin filling between the bus 2 and the front of the circuit board 1 to ensure welding strength.

[0135] In some embodiments, the width D6 of the third body portion 43 is set to 1 mm, 1.5 mm, 2 mm, etc.

[0136] like Figure 4 As shown, in some embodiments, the connection surface between the connection portion 21 and the busbar 2 is configured as an arc surface.

[0137] It is understood that the connecting portion 21 is a component formed by integral bending or stamping on the busbar 2. The connecting portion 21 is arranged at an angle to the busbar 2. For example, the connecting portion 21 is perpendicular to the busbar 2. By configuring the connecting surface between the connecting portion 21 and the busbar 2 as a circular arc surface, and in accordance with the limitations of the actual processing technology, a gap can be formed between the busbar 2 and the circuit board 1 after the connecting portion 21 is inserted into the connecting hole 11. In this way, the gap can be used to accommodate the third welding layer 33, thereby ensuring reliable welding between the busbar 2 and the circuit board 1.

[0138] It should be noted that the radian and arc length of the arc surface are positively correlated with the size of the connecting portion 21. The larger the cross-sectional area of the connecting portion 21, the larger the radian and arc length of the arc surface can be.

[0139] like Figure 2 As shown, in some embodiments, busbar 2 includes a positive input busbar 51 and a positive output busbar 52. Positive input busbar 51 and positive output busbar 52 are spaced apart and arranged on circuit board 1. A MOS transistor 55 is provided on circuit board 1. MOS transistor 55 is located between positive input busbar 51 and positive output busbar 52, and opposite ends of MOS transistor 55 are electrically connected to positive input busbar 51 and positive output busbar 52, respectively.

[0140] It is understood that the two ends of the MOS transistor 55 are electrically connected to the positive input busbar 51 and the positive output busbar 52, respectively, thereby carrying the high current conduction of the positive input and positive output of the battery management system. The MOS transistor 55 can be soldered to the circuit board 1 by reflow soldering.

[0141] Please continue reading Figure 2 In some embodiments, the busbar 2 includes a negative input busbar 53 and a negative output busbar 54. The negative input busbar 53 and the negative output busbar 54 are spaced apart and arranged on the circuit board 1. A shunt 56 is provided on the circuit board 1. The shunt 56 is located between the negative input busbar 53 and the negative output busbar 54, and the opposite ends of the shunt 56 are electrically connected to the negative input busbar 53 and the negative output busbar 54, respectively.

[0142] It is understood that the two ends of the shunt 56 are electrically connected to the negative input busbar 53 and the negative output busbar 54, respectively, thereby carrying the high current conduction of the negative input and negative output of the battery management system. The shunt 56 can be soldered to the circuit board 1 by reflow soldering.

[0143] In some embodiments, the positive input busbar 51, positive output busbar 52, negative input busbar 53, and negative output busbar 54 are all formed by stamping and bending metal sheets, and can be made of high-conductivity metals such as copper and aluminum. The number and cross-sectional dimensions of the connecting portions 21 on each busbar can be selected based on the product's current output requirements and the number and distribution of MOS transistors 55.

[0144] Please continue reading Figure 4 In some embodiments, the busbar 2 is provided with a mounting hole 22. The mounting hole 22 is configured to connect to the battery module or the upper cover.

[0145] It is understood that by providing mounting holes 22 on busbar 2 and connecting busbar 2 to the battery module or upper cover with fasteners passing through mounting holes 22, there is no need to use fasteners to secure circuit board 1. This eliminates the need for drilling holes in circuit board 1 and improves the efficiency of circuit board 1 installation.

[0146] In some embodiments, the busbar 2 may be configured with at least two mounting holes 22. The at least two mounting holes 22 are spaced apart. Each mounting hole 22 is secured to the battery module or the upper cover via a fastener, thereby serving as a mechanical connection point between the circuit board 1 and the busbar 2, ensuring reliable fixation of the battery management system.

[0147] Specifically, the positive input busbar 51 , the positive output busbar 52 , the negative input busbar 53 , and the negative output busbar 54 are all provided with mounting holes 22 .

[0148] The positive input busbar 51 and the negative input busbar 53 are connected to the positive and negative electrodes of the battery module, respectively, through their respective mounting holes 22. This achieves electrical connection and mechanical fixation between the positive input busbar 51 and the positive electrode of the battery module, and between the negative input busbar 53 and the negative electrode of the battery module.

[0149] The upper cover is provided with positive and negative output poles. Positive output busbar 52 and negative output busbar 54 are connected to the positive and negative output poles, respectively, through their respective mounting holes 22. This achieves electrical and mechanical connection between the positive output busbar 52 and the positive output pole, and between the negative output busbar 54 and the negative output pole.

[0150] The positive input busbar 51, the positive output busbar 52, the negative input busbar 53 and the negative output busbar 54 are electrically connected and mechanically fixed based on the above method to realize the charging and external discharge of the battery module, and can fix the circuit board 1 to the battery module and the upper cover of the battery pack during the process of electrical connection of the busbar, without the need to fix the circuit board 1 with screws.

[0151] The battery management system in the embodiment of the present application, based on the selection of the soldering position, the shape of the soldering portion 3, and various dimensions, can effectively reduce the risks of solder joints, solder spikes, and insufficient solder fillets after soldering the circuit board 1, thereby improving the yield rate and reducing production costs. It can also effectively improve soldering strength and enhance mechanical properties such as tensile strength and vibration resistance.

[0152] The present application also provides a battery pack, which includes the battery management system described in the aforementioned embodiment.

[0153] By forming a connection hole 11 in the circuit board 1, the connection portion 21 of the busbar 2 is passed through the connection hole 11 from the first side of the circuit board 1 and soldered to the circuit board 1 on the second side. As a result, when the welding gun is soldering the connection portion 21, the busbar 2 will not interfere with the operation of the welding gun, thereby reducing the difficulty of welding. Furthermore, the welding gun can completely fit the welding tip over the connection portion 21, allowing the molten tin to completely cover the connection portion 21, thereby improving the welding strength.

[0154] The embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core ideas. At the same time, for those skilled in the art, according to the ideas of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present invention.

Claims

1. A battery management system, characterized in that: include: A circuit board having a connection hole; The busbar is provided with a connecting portion, wherein the connecting portion passes through the connecting hole from the first side of the circuit board and is welded to the circuit board at the second side of the circuit board.

2. The battery management system according to claim 1, characterized in that: The connecting portion includes a protruding section passing through the connecting hole, and the connecting portion is welded to the circuit board to form a welding portion, wherein the welding portion includes a first welding layer connected to the protruding section, and the height of the first welding layer is H2, satisfying: 1 mm ≤ H2 ≤ 2 mm.

3. The battery management system according to claim 2, characterized in that: The first welding layer is tapered along a direction from the first side to the second side.

4. The battery management system according to claim 2, characterized in that: The connecting portion further includes a connecting segment located in the connecting hole, the connecting segment being connected to the passing segment, wherein the connecting segment is spaced apart from a hole wall surface of the connecting hole.

5. The battery management system according to claim 4, characterized in that: The welding portion further comprises: The second welding layer is connected between the connecting section and the wall surface of the connecting hole, and the second welding layer is connected to the first welding layer.

6. The battery management system according to claim 4, characterized in that: The distance between the connecting section and the wall surface of the connecting hole is D1, which satisfies the following: 0<D1≤0.4 mm.

7. The battery management system according to claim 4, characterized in that: The distance between the connecting section and the wall of the connecting hole is D1; The width of the connecting segment is D2, which satisfies the following conditions: D1 is positively correlated with D2; And / or, the cross-sectional area of the connecting section parallel to the plane where the circuit board is located is S, satisfying: D1 is positively correlated with S.

8. The battery management system according to claim 4, characterized in that: The distance between the connecting section and the wall of the connecting hole is D1, the number of the connecting parts is set to N, and the connecting parts correspond to the connecting holes one by one, wherein N≥1, and N is an integer, satisfying: D1 is positively correlated with N.

9. The battery management system according to claim 4, characterized in that: The distance between the connecting section and the wall of the connecting hole is D1, the connecting parts are set to be at least two at intervals, and the connecting parts correspond to the connecting holes one by one, wherein the distance between two adjacent connecting parts is D3, satisfying: D1 is positively correlated with D3.

10. The battery management system according to claim 5, characterized in that: The busbar is spaced apart from the circuit board, and the welding portion further includes a third welding layer located between the facing surfaces of the busbar and the circuit board, and the third welding layer is connected to an end of the second welding layer away from the first welding layer.

11. The battery management system according to any one of claims 1 to 10, characterized in that: A soldering pad is provided on the circuit board, and the soldering pad is arranged around the connecting hole, wherein the connecting portion is soldered to the circuit board to form a soldering portion, and the soldering portion is connected to the soldering pad.

12. The battery management system according to claim 11, characterized in that: The connection holes are arranged at intervals of at least two, and one connection hole is correspondingly connected to one soldering pad, wherein the distance between each two adjacent soldering pads is D4, satisfying: D4 ≥ 0.5 mm.

13. The battery management system according to claim 11, characterized in that: The pad includes: a first main body portion, disposed on a first side of the circuit board; a second main body portion, annularly arranged on the wall surface of the connecting hole, the second main body portion being connected to the first main body portion; The third main body is provided on the second side of the circuit board, and is connected to an end of the second main body away from the first main body.

14. The battery management system according to claim 13, characterized in that: The connecting portion includes a passing section passing through the connecting hole and a connecting section located in the connecting hole, and the welding portion includes: a first welding layer connected to the protruding section and the third main body; a second welding layer, located between the connecting section and the second main body portion, the second welding layer being connected to the first welding layer; The third welding layer is located between the bus bar and the third main body portion, and is connected to an end of the second welding layer away from the first welding layer.

15. The battery management system according to claim 14, characterized in that: The outer edge of the first welding layer does not exceed the outer edge of the third main body; And / or, the outer edge of the third welding layer does not exceed the outer edge of the first main body portion.

16. The battery management system according to claim 13, characterized in that: The width of the first main body is D5, which satisfies: D5 ≥ 1 mm; And / or, the width of the third main body portion is D6, satisfying: D6 ≥ 1 mm.

17. The battery management system according to any one of claims 1 to 10, characterized in that: The connection surface between the connection portion and the busbar is configured as an arc surface.

18. The battery management system according to any one of claims 1 to 10, characterized in that: The busbar includes a positive input busbar and a positive output busbar, the positive input busbar and the positive output busbar are arranged at intervals on the circuit board, and a MOS transistor is provided on the circuit board, the MOS transistor is located between the positive input busbar and the positive output busbar, and opposite ends of the MOS transistor are electrically connected to the positive input busbar and the positive output busbar respectively; And / or, the busbar includes a negative input busbar and a negative output busbar, the negative input busbar and the negative output busbar are arranged at intervals on the circuit board, a shunt is provided on the circuit board, the shunt is located between the negative input busbar and the negative output busbar, and the opposite ends of the shunt are electrically connected to the negative input busbar and the negative output busbar respectively.

19. The battery management system according to any one of claims 1 to 10, characterized in that: The busbar is provided with a mounting hole, and the mounting hole is configured to connect to a battery module or an upper cover.

20. A battery pack, characterized in that: The battery management system comprises the battery management system according to any one of claims 1 to 19.

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