Welding post-processing method of thin-wall high-frequency cavity and thin-wall high-frequency cavity

Abstract

The invention discloses a welding post-processing method of a thin-wall high-frequency cavity and the thin-wall high-frequency cavity. The method comprises the step of removing the knife marks of the welded thin-wall high-frequency cavity. And then, carrying out surface fine grinding treatment on the thin-wall high-frequency cavity subjected to the knife mark removal treatment. And then, cleaning the thin-wall high-frequency cavity subjected to surface fine grinding treatment. And then carrying out vacuum annealing treatment on the cleaned thin-wall high-frequency cavity. And finally, the thin-wall high-frequency cavity subjected to vacuum annealing treatment is subjected to sealing storage treatment, so that welding post-treatment of the thin-wall high-frequency cavity is completed. Therefore, the surface conductivity of the thin-wall high-frequency cavity can be effectively improved, and the electromagnetic performance of the thin-wall high-frequency cavity is guaranteed. And moreover, structural deformation is reduced, frequency drift and cracking risks are avoided, the dimensional stability of the thin-wall high-frequency cavity is improved, and the fatigue life of the thin-wall high-frequency cavity is prolonged. In addition, the clean surface of the annealed thin-wall high-frequency cavity can be prevented from being oxidized again, and therefore long-term storage of the thin-wall high-frequency cavity is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of metal welding, and more specifically, to a post-welding processing method for a thin-walled high-frequency cavity and a thin-walled high-frequency cavity. Background Art

[0002] In related technologies, thin-walled high-frequency cavities made of materials such as oxygen-free copper are usually used in devices such as cyclotrons and linear accelerators to generate high-frequency electromagnetic fields and achieve particle acceleration. During the manufacturing process of thin-walled high-frequency cavities, there is often residual material to be processed in the thick plate processing area of the thin-walled high-frequency cavity after welding, so this residual material needs to be machined. However, the thin-walled high-frequency cavity after machining often has knife marks. In addition, there may be problems such as roughness, grain coarsening, dislocation accumulation and surface oxidation, which makes the thin-walled high-frequency cavity unable to meet the use requirements of generating high-frequency electromagnetic fields to achieve particle acceleration. Summary of the Invention

[0003] The present application provides a post-welding processing method for a thin-walled high-frequency cavity and a thin-walled high-frequency cavity.

[0004] The present application provides a method for post-welding treatment of a thin-walled high-frequency cavity, the method comprising: Performing a knife mark removal process on the welded thin-walled high-frequency cavity; Performing surface fine grinding on the thin-walled high-frequency cavity after the knife mark removal treatment; Cleaning the thin-walled high-frequency cavity after the surface fine grinding treatment; performing vacuum annealing on the cleaned thin-wall high-frequency cavity; The thin-walled high-frequency cavity after the vacuum annealing treatment is sealed and preserved to complete the post-welding treatment of the thin-walled high-frequency cavity.

[0005] In this manner, the welded thin-walled high-frequency cavity undergoes knife mark removal. Next, the surface of the cavity undergoes fine grinding. The fine-grinded cavity is then cleaned. Following this, the cleaned cavity undergoes vacuum annealing. Finally, the vacuum-annealed cavity is sealed and stored, completing the post-weld processing of the thin-walled high-frequency cavity. This process effectively improves the surface conductivity of the thin-walled high-frequency cavity by removing surface knife marks, oxide layers, and contaminants, while also promoting grain recovery and reducing dislocations during vacuum annealing, thereby ensuring its electromagnetic performance. Furthermore, vacuum annealing releases internal stresses caused by heat input during welding, thereby reducing structural deformation, avoiding frequency drift and cracking risks, and improving the dimensional stability and fatigue life of the cavity. Furthermore, the sealed storage process isolates the cavity from outside air and moisture, preventing re-oxidation of the clean surface of the annealed cavity. This maintains low surface resistance and electrical conductivity, enabling long-term storage of the cavity.

[0006] In certain embodiments, the step of removing knife marks from the welded thin-walled high-frequency cavity comprises: A cutting tool is provided to perform cutting processing on the inner surface of the thin-walled high-frequency cavity and the target area, wherein the cutting tool includes a single-crystal diamond cutting tool, the target area is the thick plate processing area of the thin-walled high-frequency cavity, and the surface roughness of the thin-walled high-frequency cavity after the cutting processing is less than or equal to 0.2 μm.

[0007] In this way, a cutting tool is provided to cut the inner surface and target area of the thin-walled high-frequency cavity, wherein the cutting tool includes a single-crystal diamond cutting tool, and the target area is the thick plate processing area of the thin-walled high-frequency cavity. After cutting, the surface roughness of the thin-walled high-frequency cavity is less than or equal to 0.2μm. In this way, ultra-precision cutting of the inner surface of the cavity and the thick plate processing area using a cutting tool such as a single-crystal diamond cutting tool can effectively remove residual tool marks from processing and improve the surface roughness of the thin-walled high-frequency cavity, thereby providing a high-precision foundation for subsequent grinding processes, ensuring that the high-frequency current flows evenly on the surface of the thin-walled high-frequency cavity and avoiding performance issues caused by surface roughness.

[0008] In certain embodiments, the cutting depth of the cutting process is less than 10 μm, and the feed rate of the cutting process is less than 5 μm / rev.

[0009] In this way, the cutting depth is less than 10μm, and the cutting feed rate is less than 5μm / rev. By controlling the appropriate cutting depth and feed rate, the amount of cutting can be precisely controlled, avoiding surface damage caused by excessive cutting. Furthermore, the appropriate cutting depth and feed rate can reduce mechanical stress during the cutting process, reducing deformation of thin-walled high-frequency cavity structures caused by cutting forces, while also preventing changes in the material microstructure caused by cutting heat accumulation, providing a stable structural foundation for subsequent annealing.

[0010] In certain embodiments, the surface fine grinding of the thin-walled high-frequency cavity after the knife mark removal process comprises: Abrasive paste and sandpaper of various mesh sizes are provided to grind the weld of the thin-walled high-frequency cavity and the preset area where the weld is located, wherein the surface roughness of the thin-walled high-frequency cavity after the grinding treatment is less than or equal to 0.1 μm.

[0011] Thus, abrasive paste and sandpaper of various mesh sizes are provided to grind the weld seam and the predetermined area where the weld seam is located in the thin-walled high-frequency cavity. After grinding, the surface roughness of the thin-walled high-frequency cavity is less than or equal to 0.1 μm. In this way, by combining abrasive paste with sandpaper of various mesh sizes to grind the weld seam and the surrounding area, the surface roughness of the thin-walled high-frequency cavity can be further improved, ensuring that the high-frequency current flows evenly across the surface of the thin-walled high-frequency cavity and avoiding performance issues caused by surface roughness.

[0012] In certain embodiments, the sandpaper includes 3000 grit sandpaper, 5000 grit sandpaper, and 8000 grit sandpaper.

[0013] Thus, the sandpaper includes sandpaper with a mesh number of 3000, sandpaper with a mesh number of 5000, and sandpaper with a mesh number of 8000. In this way, by grinding with sandpaper of multiple mesh numbers in sequence, the surface accuracy of the thin-walled high-frequency cavity is improved in a step-by-step manner.

[0014] In certain embodiments, the cleaning of the thin-walled high-frequency cavity after the surface fine grinding process comprises: Providing alkaline solution to ultrasonically clean the thin-walled high-frequency cavity within a first preset temperature range, wherein the first preset temperature range is 40-50° C.; Providing deionized water to rinse the thin-walled high-frequency cavity after ultrasonic cleaning within a second preset temperature range, wherein the second preset temperature range is 40-50° C.; Performing water control and liquid drainage treatment on the thin-walled high-frequency cavity that has undergone the rinsing treatment; providing ultrapure water to flush the thin-walled high-frequency cavity that has undergone the water control and drainage treatment; Providing deionized water and a clean container, and performing a secondary rinsing treatment on the thin-walled high-frequency cavity that has undergone the flushing treatment in the clean container; providing inert gas to dry the thin-walled high-frequency cavity that has undergone the secondary rinsing treatment; In a clean environment, the thin-walled high-frequency cavity that has undergone the blow-drying treatment is dried in the air.

[0015] In this manner, alkaline solution is provided to ultrasonically clean the thin-walled high-frequency cavity within a first preset temperature range, wherein the first preset temperature range is 40-50°C. Next, deionized water is provided to rinse the ultrasonically cleaned thin-walled high-frequency cavity within a second preset temperature range, wherein the second preset temperature range is 40-50°C. Subsequently, the rinsed thin-walled high-frequency cavity is drained with controlled water. Ultrapure water is then provided to rinse the drained thin-walled high-frequency cavity. Deionized water and a clean container are then provided to perform a secondary rinse within the clean container. Inert gas is then provided to dry the rinsed thin-walled high-frequency cavity. Finally, the dried thin-walled high-frequency cavity is air-dried in a clean environment. This effectively removes grease, particulate impurities, oxidation residues, and residual grinding paste from the grinding process from the cavity surface, ensuring surface cleanliness and preventing the impact of impurities on conductivity.

[0016] In certain embodiments, the vacuum annealing treatment is performed on the cleaned thin-walled high-frequency cavity to complete the post-welding treatment of the thin-walled high-frequency cavity, including: Provide a vacuum furnace, place the thin-walled high-frequency cavity in the cavity of the vacuum furnace, and the pressure of the vacuum furnace is less than 5× Pa; Based on the preset heating rate, the vacuum furnace is heated to a first preset temperature and kept warm for a preset time, wherein the preset heating rate is 5 , the first preset temperature is 450° C., and the preset time is 2 hours; When the holding time of the vacuum furnace reaches the preset time, cooling the temperature of the vacuum furnace to a second preset temperature, wherein the second preset temperature is 200° C.; An inert gas is provided to fill the vacuum furnace, and the vacuum furnace is cooled to room temperature.

[0017] Thus, a vacuum furnace is provided, and a thin-walled high-frequency cavity is placed in the cavity of the vacuum furnace. The pressure of the vacuum furnace is less than 5× Then, based on the preset heating rate, the vacuum furnace is heated to the first preset temperature and kept warm for a preset time, wherein the preset heating rate is 5 , the first preset temperature is 450°C, and the preset time is 2 hours. Subsequently, when the insulation time of the vacuum furnace reaches the preset time, the temperature of the vacuum furnace is cooled to the second preset temperature, and the second preset temperature is 200°C. Finally, an inert gas is provided to fill the vacuum furnace and cool the vacuum furnace to room temperature. In this way, the problem of grain coarsening caused by the heat input generated by welding can be eliminated, and the conductive performance of the thin-walled high-frequency cavity can be guaranteed. In addition, it can also effectively release the internal stress accumulated in the thin-walled high-frequency cavity during the welding process, reduce structural deformation, avoid the risk of frequency drift or cracking due to stress concentration, and improve the dimensional stability of the cavity.

[0018] In certain embodiments, the sealing and storage treatment of the thin-walled high-frequency cavity after the vacuum annealing treatment comprises: Providing a sealed container, and placing the thin-walled high-frequency cavity after the vacuum annealing treatment in the sealed container; Extracting air from the sealed container to place the sealed container in a vacuum state; The sealed container is filled with high-purity inert gas, and the thin-walled high-frequency cavity placed in the sealed container is sealed and preserved, wherein the concentration of the high-purity inert gas is greater than or equal to 99.999%.

[0019] In this manner, a sealed container is provided, and the vacuum-annealed thin-walled high-frequency cavity is placed within the sealed container. Next, air is extracted from the sealed container to place it in a vacuum state. Finally, the sealed container is filled with a high-purity inert gas, and the thin-walled high-frequency cavity within the sealed container is sealed and stored. The concentration of the high-purity inert gas is greater than or equal to 99.999%. This isolates the cavity from outside air and moisture, preventing re-oxidation of the clean surface of the annealed thin-walled high-frequency cavity, maintaining low surface resistance and electrical conductivity, and enabling long-term storage of the thin-walled high-frequency cavity.

[0020] An embodiment of the present application provides a thin-walled high-frequency cavity, which is obtained based on the above-mentioned post-welding processing method of the thin-walled high-frequency cavity.

[0021] In this way, by eliminating surface knife marks, oxide layers, and contaminants, and combining vacuum annealing treatment to promote grain recovery and dislocation reduction, the surface conductivity of the thin-walled high-frequency cavity can be effectively improved, ensuring the electromagnetic performance of the thin-walled high-frequency cavity. In addition, vacuum annealing can also release the internal stress caused by heat input during welding, thereby reducing structural deformation, avoiding frequency drift and cracking risks, and improving the dimensional stability and fatigue life of the thin-walled high-frequency cavity. In addition, the sealed storage treatment can isolate the outside air and water vapor, preventing the clean surface of the thin-walled high-frequency cavity from re-oxidation after annealing, thereby maintaining low surface resistance and conductive properties, and realizing long-term storage of the thin-walled high-frequency cavity.

[0022] In some embodiments, the thin-walled high-frequency cavity is made of oxygen-free copper material.

[0023] Thus, the thin-walled high-frequency cavity is made of oxygen-free copper. Oxygen-free copper has extremely high electrical and thermal conductivity, effectively reducing Joule heat loss during high-frequency current transmission. It also quickly dissipates heat generated during cavity operation, maintaining stable electromagnetic performance.

[0024] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 This is one of the flow charts of the post-welding treatment method of the thin-walled high-frequency cavity according to the embodiment of the present application; Figure 2 This is the second flow chart of the post-welding treatment method of the thin-walled high-frequency cavity according to the embodiment of the present application; Figure 3 This is the third flow chart of the post-welding treatment method of the thin-walled high-frequency cavity according to the embodiment of the present application; Figure 4 This is the fourth flow chart of the post-welding treatment method of the thin-walled high-frequency cavity according to the embodiment of the present application; Figure 5 This is the fifth flow chart of the post-welding treatment method of the thin-walled high-frequency cavity according to the embodiment of the present application; Figure 6 This is the sixth flow chart of the post-welding processing method of the thin-walled high-frequency cavity according to the embodiment of the present application. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and should not be understood as limiting the embodiments of the present application.

[0027] In related technical fields, thin-walled high-frequency cavities made of high-purity materials such as oxygen-free copper are widely used in particle accelerators such as cyclotrons and linear accelerators due to their excellent electrical and thermal conductivity and vacuum compatibility. These particle accelerators accelerate and manipulate particles through the high-frequency electromagnetic field generated by the thin-walled high-frequency cavity. The surface quality and structural stability of the thin-walled high-frequency cavity directly determine the uniformity of the electromagnetic field distribution and the acceleration efficiency.

[0028] However, in the manufacturing process of thin-walled high-frequency cavities, the thin-walled high-frequency cavity body after welding often faces a variety of performance degradation problems: 1. Since the thin-walled high-frequency cavity is welded by multiple pre-made small parts, rough marks will be formed on the surface during the welding process. In addition, in order to meet the strength requirements, connection requirements and assembly requirements of the parts, some structural areas use thick plate processing technology, which produces unprocessed margins in these structural areas. The unprocessed margins need to be removed by mechanical processing, which easily produces obvious knife marks and rough marks. These knife marks and rough marks not only destroy the surface flatness, but also cause electromagnetic wave dissipation when the high-frequency current is transmitted on the thin-walled high-frequency cavity, causing the electromagnetic field distribution to be distorted, thereby affecting the stability of particle acceleration. 2. Thin-walled high-frequency cavities typically use electron beam welding to weld multiple prefabricated small components into an integral structure. While electron beam welding can achieve high-quality welds, the heat input generated during welding can cause significant microstructural degradation in the weld area and surrounding areas, such as abnormal grain coarsening and a sharp increase in dislocation density. This leads to the formation of stress concentration areas, which in turn reduces the rigidity of the cavity structure and makes it prone to deformation or even cracking under high-frequency vibration. 3. When welding thin-walled high-frequency cavities, the surface of the cavity will be oxidized, forming a surface oxide layer, which will reduce the electrical conductivity of the cavity and affect its performance.

[0029] Thus, due to the above problems, a thin-walled high-frequency cavity formed by welding a plurality of prefabricated small parts may not be able to meet the use requirements of generating a high-frequency electromagnetic field to achieve particle acceleration.

[0030] Based on the above questions, please refer to Figure 1 The embodiment of the present application provides a post-welding treatment method for a thin-walled high-frequency cavity, the method comprising: 01: Remove the knife marks on the thin-walled high-frequency cavity after welding; 02: Perform fine surface grinding on the thin-walled high-frequency cavity after the knife marks are removed; 03: Clean the thin-walled high-frequency cavity after fine surface grinding; 04: Perform vacuum annealing on the cleaned thin-walled high-frequency cavity; 05: The thin-walled high-frequency cavity after vacuum annealing is sealed and preserved to complete the post-welding processing of the thin-walled high-frequency cavity.

[0031] Specifically, thin-walled high-frequency cavities are high-frequency vacuum devices constructed from materials such as high-purity oxygen-free copper and designed to be thin-walled (3–6 mm thick). These devices exhibit excellent electrical and thermal conductivity and vacuum compatibility and are widely used in devices such as cyclotrons and linear accelerators to generate high-frequency electromagnetic fields for particle acceleration. Some areas of these cavities require thick plate machining to meet strength requirements, and the overall structure is assembled using electron beam welding.

[0032] The post-weld treatment method for thin-walled high-frequency cavities provided in this embodiment is targeted at thin-walled high-frequency cavities that have undergone electron beam welding. Through a series of continuous processes, this systematic process repairs and enhances their surface quality, electromagnetic properties, structural stress, and vacuum adaptability. This method can repair defects caused by welding and machining, ensuring that the cavity meets the requirements for high-frequency electromagnetic field generation. Furthermore, through sealed storage, the thin-walled high-frequency cavity can be maintained for long-term storage.

[0033] Knife mark removal refers to the use of the provided tools to perform ultra-precision cutting on the inner surface of the welded thin-walled high-frequency cavity and the thick plate processing area to eliminate the knife marks remaining from the processing. It can be understood that during the welding process, it is usually necessary to retain a certain thickness of allowance in advance to meet the high-precision dimensional accuracy and surface quality requirements, thereby ensuring that some high-strength structures of the thin-walled high-frequency cavity meet the performance standards. After the welding process is completed, the allowance needs to be processed through a mechanical processing process. However, the thin-walled high-frequency cavity that has been processed with a mechanical processing process often has knife marks. In addition, rough marks are often produced during the welding and allowance removal process. The above-mentioned knife marks and rough marks all need to be processed through knife mark removal.

[0034] Surface fine grinding refers to grinding the weld and surrounding areas of the thin-walled high-frequency cavity after the knife marks are removed, so as to further reduce the surface roughness of the thin-walled high-frequency cavity and eliminate the stress layer and oxide film.

[0035] Cleaning treatment refers to the use of multi-stage ultrasonic and water washing processes to degrease, rinse, flush and dry the cavity of the ground thin-walled high-frequency cavity in a clean environment to remove various impurities such as surface contaminants and oxidation residues.

[0036] Vacuum annealing treatment refers to repairing welding damage (such as grain coarsening and dislocation accumulation) of thin-walled high-frequency cavities at the micro level through heat treatment, which can improve the electromagnetic performance and structural stability of thin-walled high-frequency cavities.

[0037] Sealed storage treatment refers to isolating air and water vapor in a certain way to prevent the clean surface of the thin-walled high-frequency cavity from being oxidized again after annealing, thereby achieving long-term storage of the thin-walled high-frequency cavity.

[0038] After the above-mentioned steps of knife mark removal, surface fine grinding, cleaning and vacuum annealing are completed, the electromagnetic performance and structural stability of the thin-walled high-frequency cavity can meet the requirements of generating a high-frequency electromagnetic field to achieve particle acceleration.

[0039] It should be noted that the above-mentioned knife mark removal treatment and surface fine grinding treatment are mainly used to improve the surface accuracy of the thin-walled high-frequency cavity and solve the visible surface defects caused by machining and welding. The cleaning treatment is mainly to provide a clean thin-walled high-frequency cavity for the subsequent vacuum annealing treatment to prevent impurities from affecting the annealing effect. The vacuum annealing treatment repairs the internal damage of the material through heat treatment, releases stress, and improves the performance of the thin-walled high-frequency cavity. In this way, through standardized and modular processes, the surface roughness of the thin-walled high-frequency cavity is reduced, and the electromagnetic performance of the thin-walled high-frequency cavity is improved, as well as the dimensional stability and fatigue life of the thin-walled high-frequency cavity body. It can be suitable for batch manufacturing of oxygen-free copper thin-walled high-frequency cavities of various models and sizes.

[0040] In summary, in the post-welding processing method of the thin-walled high-frequency cavity and the thin-walled high-frequency cavity provided in the embodiment of the present application, the thin-walled high-frequency cavity after welding is subjected to knife mark removal. Next, the thin-walled high-frequency cavity after the knife mark removal is subjected to surface fine grinding. Then, the thin-walled high-frequency cavity after the surface fine grinding is cleaned. Subsequently, the thin-walled high-frequency cavity after the cleaning is subjected to vacuum annealing. Finally, the thin-walled high-frequency cavity after the vacuum annealing is sealed and preserved to complete the post-welding processing of the thin-walled high-frequency cavity. In this way, by eliminating surface knife marks, oxide layers and contaminants, and combining vacuum annealing to promote grain recovery and dislocation reduction, the surface conductivity of the thin-walled high-frequency cavity can be effectively improved, and the electromagnetic performance of the thin-walled high-frequency cavity can be guaranteed. In addition, the vacuum annealing treatment can also release the internal stress caused by heat input during welding, thereby reducing structural deformation, avoiding frequency drift and cracking risks, and improving the dimensional stability and fatigue life of the thin-walled high-frequency cavity body. In addition, the sealed storage treatment can isolate the outside air and water vapor, preventing the clean surface of the thin-walled high-frequency cavity from being oxidized again after annealing, thereby maintaining low surface resistance and conductive properties, and realizing long-term storage of the thin-walled high-frequency cavity.

[0041] See also Figure 2 In some embodiments, step 01 (removing knife marks from the welded thin-walled high-frequency cavity) includes: 011: Provide cutting tools to cut the inner surface and target area of thin-walled high-frequency cavities.

[0042] Specifically, the tool is a single-crystal diamond tool used to remove knife marks from thin-walled high-frequency cavities after welding. Single-crystal diamond tools are made of single-crystal diamond and are extremely hard and wear-resistant, making them suitable for ultra-precision cutting.

[0043] The inner surface of a thin-walled high-frequency cavity refers to the internal space surface of the cavity, the key area for generating the high-frequency electromagnetic field and directly contacting the electromagnetic field generated during particle acceleration. The quality of the inner surface (such as roughness) directly affects the high-frequency current distribution and electromagnetic field uniformity, which in turn determines the particle acceleration effect. It should be noted that due to the influence of machining and welding processes, the inner surface of the thin-walled high-frequency cavity is prone to defects such as knife marks, which require cutting to improve.

[0044] The target area refers to the area in the thin-walled high-frequency cavity that is processed with thick plates due to strength or assembly requirements, such as the connection part and support part of the thin-walled high-frequency cavity. Compared with the thin-walled main body of the thin-walled high-frequency cavity, the material thickness of the target area is larger, and it is easy to produce obvious knife marks and rough marks due to the force during mechanical processing and welding. It should be noted that the target area and the inner surface of the cavity are both cutting processing objects, but the target area is for the local rough area formed by thick plate processing, and the inner surface of the cavity is for the overall inner surface of the thin-walled high-frequency cavity. The combination of the two covers the main defective parts of the thin-walled high-frequency cavity.

[0045] Cutting refers to the process of ultra-precision cutting the inner surface and target area of the welded thin-walled high-frequency cavity using single-crystal diamond cutting tools. By strictly controlling the cutting parameters (small cutting depth, low feed rate), the thin-walled high-frequency cavity is subjected to multiple ultra-precision cutting operations to remove defects while avoiding secondary damage to the cavity structure. This can prevent deformation of the thin-walled high-frequency cavity structure and ensure that the surface roughness of the thin-walled high-frequency cavity is less than or equal to 0.2μm.

[0046] In this way, a cutting tool is provided to cut the inner surface and target area of the thin-walled high-frequency cavity, wherein the cutting tool includes a single-crystal diamond cutting tool, and the target area is the thick plate processing area of the thin-walled high-frequency cavity. After cutting, the surface roughness of the thin-walled high-frequency cavity is less than or equal to 0.2μm. In this way, ultra-precision cutting of the inner surface of the cavity and the thick plate processing area using a cutting tool such as a single-crystal diamond cutting tool can effectively remove residual tool marks from processing and improve the surface roughness of the thin-walled high-frequency cavity, thereby providing a high-precision foundation for subsequent grinding processes, ensuring that the high-frequency current flows evenly on the surface of the thin-walled high-frequency cavity and avoiding performance issues caused by surface roughness.

[0047] In certain embodiments, the cutting depth of the cutting process is less than 10 μm, and the feed rate of the cutting process is less than 5 μm / rev.

[0048] Specifically, the cutting depth is the vertical depth that a single-crystal diamond cutting tool penetrates into the material surface during each cut when removing tool marks from a thin-walled high-frequency cavity, measured in micrometers (μm). In the embodiments of this application, the cutting depth is required to be less than 10 μm. This ensures that the tool only removes tool mark defects remaining in the thin-walled high-frequency cavity from machining and welding, avoiding excessive cutting that could cause deformation of the thin-walled cavity structure or degradation of material properties.

[0049] Feed rate refers to the axial feed rate of the tool relative to the workpiece during the cutting process. Specifically, it refers to the distance the tool moves in the feed direction per workpiece rotation (rev), and is measured in microns per revolution (μm / rev). In the embodiments of this application, the cutting feed rate is required to be less than 5μm / rev. This ensures a finer cutting track on the workpiece surface, reduces vibration during the cutting process, and prevents deformation of the thin-walled high-frequency cavity structure due to uneven force.

[0050] It should be noted that the feed rate and cutting depth jointly determine the amount of material removed in a single cut. Through a small cutting depth and low feed rate, it can be ensured that the cutting process can not only efficiently remove the knife marks, but also ensure the cavity surface accuracy and structural stability of the thin-walled high-frequency cavity.

[0051] In this way, the cutting depth is less than 10μm, and the cutting feed rate is less than 5μm / rev. By controlling the appropriate cutting depth and feed rate, the amount of cutting can be precisely controlled, avoiding surface damage caused by excessive cutting. Furthermore, the appropriate cutting depth and feed rate can reduce mechanical stress during the cutting process, reducing deformation of thin-walled high-frequency cavity structures caused by cutting forces, while also preventing changes in the material microstructure caused by cutting heat accumulation, providing a stable structural foundation for subsequent annealing.

[0052] See also Figure 3 In certain embodiments, step 02 (performing surface fine grinding on the thin-walled high-frequency cavity after the knife mark removal treatment) includes: 021: Provide abrasive paste and sandpaper of various mesh sizes to grind the welds of thin-walled high-frequency cavities and the preset areas where the welds are located.

[0053] Specifically, abrasive paste refers to a paste-like material used to assist sandpaper in grinding the surface of thin-walled high-frequency cavities. It is usually composed of a mixture of abrasives (such as aluminum oxide, silicon carbide, etc.) and lubricants. The abrasive paste contains fine abrasive particles, which, through the mechanical grinding action of the abrasive particles, can further refine the surface texture of the thin-walled high-frequency cavity, eliminate fine knife marks and oxide films left by cutting, enhance the efficiency of sandpaper in removing surface defects, and reduce frictional heat and surface scratches during the grinding process. It should be noted that the choice of abrasive paste must match the grit of the sandpaper and the material properties of the thin-walled high-frequency cavity.

[0054] Sandpaper refers to a series of sandpapers used for fine surface grinding, including various grits. The higher the grit, the finer the sandpaper particles. By using various grits and appropriate abrasive pastes, we can achieve a step-by-step grinding process, gradually reducing the surface roughness of thin-walled high-frequency cavities to Ra ≤ 0.1μm, achieving a balance between efficiency and precision.

[0055] The weld seam of a thin-walled high-frequency cavity refers to the joint area formed when the individual sections of the thin-walled high-frequency cavity are spliced together into a single structure through electron beam welding. Due to the heat generated during the welding process, the weld seam area of a thin-walled high-frequency cavity is prone to grain coarsening, oxide layer formation, and stress concentration, resulting in surface quality generally inferior to that of non-welded areas.

[0056] The preset area where the weld is located refers to a specific range area extending outward from the weld of the thin-walled high-frequency cavity as the center (that is, the area affected by the heat generated during the welding process). Although this preset area is not a direct weld, it is affected by the heat generated during the welding process, and there are microscopic defects such as surface oxidation, knife marks on the surface, grain coarsening and dislocation accumulation, which affect the electromagnetic performance and structural stability.

[0057] Grinding involves using abrasive paste and sandpaper of varying mesh sizes to frictionally grind the weld seam and surrounding areas of the thin-walled high-frequency cavity after the knife marks have been removed, reducing surface roughness and eliminating stress layers and oxide films. This fine surface grinding further improves the surface accuracy of the thin-walled high-frequency cavity (Ra ≤ 0.1 μm) beyond that achieved by cutting, providing a high-quality substrate for subsequent cleaning and vacuum annealing.

[0058] Thus, abrasive paste and sandpaper of various mesh sizes are provided to grind the weld seam and the predetermined area where the weld seam is located in the thin-walled high-frequency cavity. After grinding, the surface roughness of the thin-walled high-frequency cavity is less than or equal to 0.1 μm. In this way, by combining abrasive paste with sandpaper of various mesh sizes to grind the weld seam and the surrounding area, the surface roughness of the thin-walled high-frequency cavity can be further improved, ensuring that the high-frequency current flows evenly across the surface of the thin-walled high-frequency cavity and avoiding performance issues caused by surface roughness.

[0059] In certain embodiments, the sandpaper includes 3000 grit sandpaper, 5000 grit sandpaper, and 8000 grit sandpaper.

[0060] Specifically, the grit number of sandpaper represents the number of abrasive particles per unit area of sandpaper.

[0061] The thin-walled high-frequency cavity, which has undergone knife mark removal, is ground sequentially using sandpaper with increasing mesh sizes. Sandpaper with a mesh size of 3000 is used as the initial grinding tool to remove the fine knife marks, shallow stress layers, or oxide films remaining after the knife mark removal process, thereby quickly improving the surface roughness of the thin-walled high-frequency cavity. Sandpaper with a mesh size of 5000 is used as the secondary grinding tool to further refine the surface texture, eliminating the grinding marks left by the 3000-mesh sandpaper and the areas not treated in the initial grinding stage. Sandpaper with a mesh size of 8000 is used as the finishing tool, polishing the surface with extremely fine abrasive particles, ultimately controlling the roughness to Ra ≤ 0.1μm, meeting the requirements for uniform high-frequency current distribution.

[0062] Thus, the sandpaper includes sandpaper with a mesh number of 3000, sandpaper with a mesh number of 5000, and sandpaper with a mesh number of 8000. In this way, by grinding with sandpaper of multiple mesh numbers in sequence, the surface accuracy of the thin-walled high-frequency cavity is improved in a step-by-step manner.

[0063] See also Figure 4 In some embodiments, step 03 (cleaning the thin-walled high-frequency cavity after surface fine grinding) includes: 031: providing alkaline solution to ultrasonically clean the thin-walled high-frequency cavity within a first preset temperature range; 032: providing deionized water within a second preset temperature range to rinse the thin-walled high-frequency cavity after ultrasonic cleaning; 033: Control water and drain liquid on the rinsed thin-walled high-frequency cavity; 034: Provide ultrapure water to flush the thin-walled high-frequency cavity that has been treated with controlled water drainage; 035: Provide deionized water and a clean container, and perform a secondary rinse on the flushed thin-walled high-frequency cavity in the clean container; 036: Provide inert gas to dry the thin-walled high-frequency cavity after secondary rinsing; 037: In a clean environment, dry the thin-walled high-frequency cavity that has been blown dry.

[0064] Specifically, lye refers to an alkaline solution primarily composed of alkaline substances, used to remove organic contaminants such as grease and oil from the surface of thin-walled high-frequency cavities. During ultrasonic cleaning, lye acts as a degreasing agent, combining ultrasonic vibrations to remove surface organic contaminants. It should be noted that the choice of lye must balance degreasing efficiency with compatibility with the thin-walled high-frequency cavity material to avoid corrosion on the cavity surface.

[0065] The first preset temperature range refers to the solution temperature range during ultrasonic alkali cleaning, which is 40-50 degrees Celsius. By controlling the temperature during ultrasonic alkali cleaning, the viscosity of oils and fats can be reduced, the saponification reaction rate of the alkali solution can be enhanced, and the efficiency of ultrasonic cavitation can be improved, thereby enhancing the degreasing effect. Using alkali solution within the first preset temperature range for ultrasonic alkali cleaning ensures cleaning efficiency while preventing excessive evaporation of the alkali solution or damage to the cavity surface due to excessively high temperatures.

[0066] Ultrasonic cleaning utilizes the cavitation effect created by ultrasound waves in liquids to clean thin-walled, high-frequency cavities. Ultrasonic vibrations create countless tiny bubbles in the alkaline solution. The high-pressure impact created by the bubbles' collapse penetrates deep into the surface pores, removing even hard-to-reach contaminants.

[0067] Deionized water is high-purity water that has been free of ionic impurities through methods such as ion exchange. It has extremely low conductivity and contains virtually no metal ions like calcium, magnesium, and sodium, or anions like chloride. This prevents the introduction of new impurities onto the surface of the chamber during the rinsing process. Deionized water can be used for rinsing to remove residual alkali and soluble surface contaminants.

[0068] The second preset temperature range refers to the water temperature range for rinsing with deionized water, which is 40-50 degrees Celsius. Rinsing with deionized water in the second preset temperature range can increase the solubility of the alkali solution in water, accelerate the dissolution and removal of residual alkali solution, enhance the rinsing effect, and prevent damage to the thin-walled high-frequency cavity structure due to excessive temperatures.

[0069] Rinsing refers to the process of rinsing the cavity after ultrasonic alkaline cleaning with deionized water within a second preset temperature range to remove residual alkaline and dissolved contaminants on the surface. In certain embodiments, the rinsing process is performed by spraying, immersing, or circulating flushing to ensure that the deionized water fully contacts the cavity surface, dissolving and removing residual impurities.

[0070] Water control and drainage treatment refers to the process of tilting, vibrating or centrifuging the thin-walled high-frequency cavity after rinsing to drain most of the water inside and attached to the surface of the cavity. This can reduce the residual water on the surface of the cavity and improve the efficiency of subsequent steps.

[0071] Ultrapure water is water of extremely high purity, produced through distillation and deionization, containing virtually no dissolved ions, organic matter, or particulate impurities. The dissolving and flushing effects of ultrapure water can further improve the surface cleanliness of thin-walled high-frequency cavities.

[0072] Flushing treatment refers to the process of using ultrapure water to spray or soak the thin-walled high-frequency cavity after water control and drainage, so that the ultrapure water is in full contact with the cavity surface, and the mechanical flushing and dissolving effect of the water flow is used to remove fine impurities.

[0073] A clean container refers to a special container that has been strictly cleaned and disinfected, with a clean internal environment and no impurities. It is used to hold the thin-walled high-frequency cavity to be rinsed for the second time.

[0074] Secondary rinsing involves re-rinsing the cavity with deionized water in a clean container to thoroughly remove residual ultrapure water and trace soluble impurities. This secondary rinse further dilutes the concentration of residual surface contaminants, ensuring that the surface concentration of ions and particulate impurities on thin-walled high-frequency cavities is reduced to extremely low levels.

[0075] An inert gas refers to a gas that is chemically inactive and does not readily react with other substances. By using an inert gas to blow away moisture from the cavity surface, the surface moisture can be effectively removed, and the introduction of oxygen during the drying process, which may lead to oxidation of the cavity surface of the thin-walled high-frequency cavity, can be avoided. It should be noted that the selection of an inert gas needs to be based on actual needs and the material of the thin-walled high-frequency cavity. In the embodiment of the present application, nitrogen is used as the inert gas.

[0076] Blow-drying refers to the process of using high-purity inert gas (such as nitrogen) to purge the cavity after secondary rinsing, and using gas flow to quickly remove moisture attached to the surface.

[0077] A clean environment refers to a factory or operating space that meets specific cleanliness standards. Indicators such as the concentration of dust particles and the content of microorganisms in the air are strictly controlled, which can provide a pollution-free space for drying and prevent the cavity surface from absorbing dust, oil and other impurities in the air during the natural drying process.

[0078] Air-drying involves placing the blow-dried cavity in a clean environment and allowing natural ventilation to completely evaporate any remaining moisture on the surface. This ensures the cavity surface is completely dry, preventing any residual moisture from affecting subsequent vacuum annealing.

[0079] In this manner, alkaline solution is provided to ultrasonically clean the thin-walled high-frequency cavity within a first preset temperature range, wherein the first preset temperature range is 40-50°C. Next, deionized water is provided to rinse the ultrasonically cleaned thin-walled high-frequency cavity within a second preset temperature range, wherein the second preset temperature range is 40-50°C. Subsequently, the rinsed thin-walled high-frequency cavity is drained with controlled water. Ultrapure water is then provided to rinse the drained thin-walled high-frequency cavity. Deionized water and a clean container are then provided to perform a secondary rinse within the clean container. Inert gas is then provided to dry the rinsed thin-walled high-frequency cavity. Finally, the dried thin-walled high-frequency cavity is air-dried in a clean environment. This effectively removes grease, particulate impurities, oxidation residues, and residual grinding paste from the grinding process from the cavity surface, ensuring surface cleanliness and preventing the impact of impurities on conductivity.

[0080] See also Figure 5 In some embodiments, step 04 (performing a vacuum annealing treatment on the cleaned thin-walled high-frequency cavity to complete the post-welding treatment of the thin-walled high-frequency cavity) includes: 041: Provide a vacuum furnace and place the thin-walled high-frequency cavity in the cavity of the vacuum furnace; 042: Based on the preset heating rate, the vacuum furnace is heated to a first preset temperature and kept at the temperature for a preset time; 043: When the holding time of the vacuum furnace reaches the preset time, the temperature of the vacuum furnace is cooled to a second preset temperature; 044: Provide inert gas to fill the vacuum furnace and cool the vacuum furnace to room temperature.

[0081] Specifically, a vacuum furnace refers to an industrial furnace in which the pressure inside the furnace can be pumped down to below atmospheric pressure. It is generally composed of a furnace, an electric heating device, a sealed furnace shell, a vacuum system, a power supply system, and a temperature control system. In the vacuum annealing treatment of thin-walled high-frequency cavities, it provides the required vacuum environment for the vacuum annealing treatment, prevents the surface oxidation of the thin-walled high-frequency cavity during the heating process, and heats the cavity through the internal heating elements to meet the annealing temperature requirements. After the thin-walled high-frequency cavity is placed in the cavity of the vacuum furnace, the vacuum system needs to be used to control the pressure of the vacuum furnace to be less than 5× Pa.

[0082] The preset heating rate refers to the rate at which the vacuum furnace increases the temperature in the vacuum furnace during the vacuum annealing process of the thin-walled high-frequency cavity. In the embodiment of the present application, the preset heating rate is 5 It can not only avoid the deformation or damage of the thin-walled high-frequency cavity due to excessive thermal stress caused by rapid heating, but also ensure a certain processing efficiency, so that the thin-walled high-frequency cavity can gradually adapt to temperature changes and ensure the annealing effect.

[0083] The first preset temperature refers to the temperature to which the vacuum furnace is heated during the vacuum annealing process. It should be noted that the first preset temperature is determined based on the material properties and performance requirements of the thin-walled high-frequency cavity. In the embodiment of the present application, the first preset temperature is 450°C, which helps to restore grains in the weld and heat-affected zone, reduce dislocations, and release internal stress.

[0084] The preset holding time refers to the time the vacuum furnace maintains the first preset temperature (450°C) after heating to it. This holding time allows the thin-walled high-frequency cavity to fully release stress, allowing for more complete grain recovery and dislocation reduction, effectively improving cavity performance. In this embodiment, the preset holding time is two hours.

[0085] The second preset temperature refers to the temperature that the vacuum furnace is designed to reach during the cooling process after a preset holding period. Typically, a thin-walled high-frequency cavity is cooled to this second preset temperature before further cooling to room temperature. This staged cooling helps control the cooling rate and prevents the thin-walled high-frequency cavity from inducing new stresses due to excessive cooling, which could affect the cavity's dimensional stability and performance. In this embodiment of the present application, the second preset temperature is 200°C.

[0086] After the vacuum furnace cools to a second preset temperature, an inert gas is introduced into the vacuum furnace to further lower the temperature to room temperature. This inert gas injection allows the properties of the inert gas to be utilized, ensuring a cooling effect while preventing oxidation of the cavity surface during the cooling process, thereby ensuring low surface resistance and excellent vacuum performance of the thin-walled high-frequency cavity.

[0087] After the temperature of the vacuum furnace cools to room temperature, the entire vacuum annealing process is completed. At this time, the electromagnetic performance, dimensional stability and fatigue life of the thin-walled high-frequency cavity are improved to a certain extent, which can meet the use requirements of generating high-frequency electromagnetic fields to achieve particle acceleration.

[0088] Thus, a vacuum furnace is provided, and a thin-walled high-frequency cavity is placed in the cavity of the vacuum furnace. The pressure of the vacuum furnace is less than 5× Then, based on the preset heating rate, the vacuum furnace is heated to the first preset temperature and kept warm for a preset time, wherein the preset heating rate is 5 , the first preset temperature is 450°C, and the preset time is 2 hours. Subsequently, when the insulation time of the vacuum furnace reaches the preset time, the temperature of the vacuum furnace is cooled to the second preset temperature, and the second preset temperature is 200°C. Finally, an inert gas is provided to fill the vacuum furnace and cool the vacuum furnace to room temperature. In this way, the problem of grain coarsening caused by the heat input generated by welding can be eliminated, and the conductive performance of the thin-walled high-frequency cavity can be guaranteed. In addition, it can also effectively release the internal stress accumulated in the thin-walled high-frequency cavity during the welding process, reduce structural deformation, avoid the risk of frequency drift or cracking due to stress concentration, and improve the dimensional stability of the cavity.

[0089] See also Figure 6 In certain embodiments, step 05 (sealing and preserving the thin-walled high-frequency cavity after vacuum annealing) includes: 051: Provide a sealed container and place the vacuum annealed thin-walled high-frequency cavity in the sealed container; 052: Extract air from the sealed container to make it in a vacuum state; 053: A sealed container is filled with high-purity inert gas, and a thin-walled high-frequency cavity placed in the sealed container is sealed and stored.

[0090] Specifically, after the vacuum annealing process is completed, in order to prevent the thin-walled high-frequency cavity from being subjected to secondary oxidation, the thin-walled high-frequency cavity needs to be sealed and preserved.

[0091] Sealed containers are specialized containers used to store thin-walled high-frequency cavities after vacuum annealing. They offer excellent sealing properties, effectively isolating them from air, moisture, and impurities. They provide a stable, clean storage environment for thin-walled high-frequency cavities, preventing adverse effects such as oxidation and corrosion, thereby maintaining their performance.

[0092] High-purity inert gas refers to a gas with a concentration greater than or equal to 99.999%, which has stable chemical properties and is not prone to chemical reactions with other substances. It is usually high-purity nitrogen.

[0093] First, the thin-walled high-frequency cavity that has completed vacuum annealing and has optimized performance is carefully placed in a sealed container.

[0094] Next, a vacuum pump or other equipment is used to extract the air from the sealed container, creating a vacuum inside the container. This reduces the amount of oxygen, water vapor, and other components inside the container, preventing them from reacting with the thin-walled high-frequency cavity and affecting its conductivity and other properties.

[0095] Subsequently, high-purity inert gas is filled into the sealed container to protect the surface of the thin-walled high-frequency cavity, further preventing surface oxidation and corrosion, and maintaining the low surface resistance and excellent vacuum performance of the thin-walled high-frequency cavity.

[0096] Finally, after the air is extracted and filled with high-purity inert gas, the sealed container is sealed so that the thin-walled high-frequency cavity is stored in a stable inert gas environment.

[0097] In this manner, a sealed container is provided, and the vacuum-annealed thin-walled high-frequency cavity is placed within the sealed container. Next, air is extracted from the sealed container to place it in a vacuum state. Finally, the sealed container is filled with a high-purity inert gas, and the thin-walled high-frequency cavity within the sealed container is sealed and stored. The concentration of the high-purity inert gas is greater than or equal to 99.999%. This isolates the cavity from outside air and moisture, preventing re-oxidation of the clean surface of the annealed thin-walled high-frequency cavity, maintaining low surface resistance and electrical conductivity, and enabling long-term storage of the thin-walled high-frequency cavity.

[0098] An embodiment of the present application provides a thin-walled high-frequency cavity, which is obtained based on the above-mentioned post-welding processing method of the thin-walled high-frequency cavity.

[0099] Specifically, the surface quality, conductivity, vacuum adaptability and dimensional stability of the thin-walled high-frequency cavity obtained by sequentially undergoing the above-mentioned knife mark removal treatment, surface fine grinding treatment, cleaning treatment and vacuum annealing treatment, and then carefully sealed and preserved are effectively improved, ensuring that it can stably generate high-frequency electromagnetic fields in devices such as cyclotrons and linear accelerators to achieve particle acceleration.

[0100] In this way, by eliminating surface knife marks, oxide layers, and contaminants, and combining vacuum annealing treatment to promote grain recovery and dislocation reduction, the surface conductivity of the thin-walled high-frequency cavity can be effectively improved, ensuring the electromagnetic performance of the thin-walled high-frequency cavity. In addition, vacuum annealing can also release the internal stress caused by heat input during welding, thereby reducing structural deformation, avoiding frequency drift and cracking risks, and improving the dimensional stability and fatigue life of the thin-walled high-frequency cavity. In addition, the sealed storage treatment can isolate the outside air and water vapor, preventing the clean surface of the thin-walled high-frequency cavity from re-oxidation after annealing, thereby maintaining low surface resistance and conductive properties, and realizing long-term storage of the thin-walled high-frequency cavity.

[0101] In some embodiments, the thin-walled high-frequency cavity is made of oxygen-free copper material.

[0102] Specifically, oxygen-free copper refers to high-purity copper with extremely low oxygen content (usually <0.003%). It has excellent electrical and thermal conductivity, good vacuum compatibility and processing adaptability, and can meet the needs of thin-walled high-frequency cavities.

[0103] Thus, the thin-walled high-frequency cavity is made of oxygen-free copper. Oxygen-free copper has extremely high electrical and thermal conductivity, effectively reducing Joule heat loss during high-frequency current transmission. It also quickly dissipates heat generated during cavity operation, maintaining stable electromagnetic performance.

[0104] In the description of this specification, the descriptions with reference to the terms "particularly", "further", "particularly", "understandably", etc. are intended to mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms are not intended to refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0105] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present application belong.

[0106] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A post-weld processing method for a thin-walled high-frequency cavity, characterized in that: The method comprises: Performing a knife mark removal process on the welded thin-walled high-frequency cavity; Performing surface fine grinding on the thin-walled high-frequency cavity after the knife mark removal treatment; Cleaning the thin-walled high-frequency cavity after the surface fine grinding treatment; performing vacuum annealing on the cleaned thin-wall high-frequency cavity; The thin-walled high-frequency cavity after the vacuum annealing treatment is sealed and preserved to complete the post-welding treatment of the thin-walled high-frequency cavity.

2. The method according to claim 1, characterized in that The knife mark removal process of the welded thin-wall high-frequency cavity includes: A cutting tool is provided to perform cutting processing on the inner surface of the thin-walled high-frequency cavity and the target area, wherein the cutting tool includes a single-crystal diamond cutting tool, the target area is the thick plate processing area of the thin-walled high-frequency cavity, and the surface roughness of the thin-walled high-frequency cavity after the cutting processing is less than or equal to 0.2 μm.

3. The method according to claim 2, characterized in that The cutting depth of the cutting process is less than 10 μm, and the feed rate of the cutting process is less than 5 μm / rev.

4. The method according to claim 1, wherein The surface fine grinding treatment of the thin-walled high-frequency cavity after the knife mark removal treatment comprises: Abrasive paste and sandpaper of various mesh sizes are provided to grind the weld of the thin-walled high-frequency cavity and the preset area where the weld is located, wherein the surface roughness of the thin-walled high-frequency cavity after the grinding treatment is less than or equal to 0.1 μm.

5. The method according to claim 4, characterized in that The sandpaper includes sandpaper with a mesh number of 3000, sandpaper with a mesh number of 5000 and sandpaper with a mesh number of 8000.

6. The method according to claim 1, characterized in that The cleaning process of the thin-walled high-frequency cavity after the surface fine grinding process comprises: Providing alkaline solution to ultrasonically clean the thin-walled high-frequency cavity within a first preset temperature range, wherein the first preset temperature range is 40-50° C.; Providing deionized water to rinse the thin-walled high-frequency cavity after ultrasonic cleaning within a second preset temperature range, wherein the second preset temperature range is 40-50° C.; Performing water control and liquid drainage treatment on the thin-walled high-frequency cavity that has undergone the rinsing treatment; providing ultrapure water to flush the thin-walled high-frequency cavity that has undergone the water control and drainage treatment; Providing deionized water and a clean container, and performing a secondary rinsing treatment on the thin-walled high-frequency cavity that has undergone the flushing treatment in the clean container; providing inert gas to dry the thin-walled high-frequency cavity that has undergone the secondary rinsing treatment; In a clean environment, the thin-walled high-frequency cavity that has undergone the blow-drying treatment is dried in the air.

7. The method according to claim 1, characterized in that The vacuum annealing treatment is performed on the cleaned thin-walled high-frequency cavity to complete the post-welding treatment of the thin-walled high-frequency cavity, including: Provide a vacuum furnace, place the thin-walled high-frequency cavity in the cavity of the vacuum furnace, and the pressure of the vacuum furnace is less than 5× Pa; Based on the preset heating rate, the vacuum furnace is heated to a first preset temperature and kept warm for a preset time, wherein the preset heating rate is 5 , the first preset temperature is 450° C., and the preset time is 2 hours; When the holding time of the vacuum furnace reaches the preset time, cooling the temperature of the vacuum furnace to a second preset temperature, wherein the second preset temperature is 200° C.; An inert gas is provided to fill the vacuum furnace, and the vacuum furnace is cooled to room temperature.

8. The method according to claim 1, characterized in that The sealing and storage treatment of the thin-walled high-frequency cavity after the vacuum annealing treatment comprises: Providing a sealed container, and placing the thin-walled high-frequency cavity after the vacuum annealing treatment in the sealed container; Extracting air from the sealed container to place the sealed container in a vacuum state; The sealed container is filled with high-purity inert gas, and the thin-walled high-frequency cavity placed in the sealed container is sealed and preserved, wherein the concentration of the high-purity inert gas is greater than or equal to 99.999%.

9. A thin-walled high-frequency cavity, characterized in that: The thin-walled high-frequency cavity is obtained by processing based on the post-welding processing method of the thin-walled high-frequency cavity according to any one of claims 1 to 8.

10. The thin-walled high-frequency cavity according to claim 9, characterized in that: The thin-wall high-frequency cavity is made of oxygen-free copper material.

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