External radiator suitable for notebook computer

Abstract

The invention relates to the field of notebook computer external radiators, and discloses an external radiator suitable for a notebook computer, the external radiator comprises a base and a mounting box mounted at the upper end of the base, the mounting box is connected with the base through an angle-adjustable support, and an air duct assembly is arranged in the mounting box; the air duct assembly is used for sucking air from the lower portion, the air passes through a cooling component in the air duct assembly and then enters the computer upwards, cold and hot air in the air duct assembly can be discharged forwards or backwards and blown to an external keyboard of the notebook computer, and cleaning assemblies are further arranged in the mounting box and at the upper end of the mounting box. The external radiator suitable for the notebook computer is provided with the air duct assembly, needed fan assemblies can be reduced, the device is small, light and low in cost, the heat dissipation requirements of the computer and the radiator can be met at the same time, the air outlet direction of cold air and hot air can be changed according to the environment temperature, and the heat dissipation efficiency is improved. Therefore, the comfort of the hand of the user is improved.

Description

Technical Field

[0001] The invention relates to the technical field of external radiators for notebook computers, in particular to an external radiator suitable for notebook computers. Background Art

[0002] In the patent application with application announcement number CN206892720U, it includes a base and an air extraction pump, a sealing rubber strip is provided on the base, the sealing rubber strip is arranged in a mouth shape, the sealing rubber strip and the base constitute a cooling groove, a mounting hole is provided in the cooling groove, a semiconductor cooling plate for cooling the cooling groove is provided in the mounting hole, the exhaust port of the air extraction pump is connected to an air pipe connected to the cooling groove, and the air pipe is arranged through the sealing rubber strip. The advantages are as follows: a sealing rubber strip is provided on the base to form a cooling groove, and a semiconductor refrigeration sheet is used for cooling. The laptop is placed on the sealing rubber strip so that the laptop covers the notch of the cooling groove to form a cooling space. Furthermore, an air pump is provided to transport air into the cooling space, so that the air pressure in the cooling space is increased, so that the cold air in the cooling space can be pressed into the laptop, thereby achieving an excellent heat dissipation effect, and effectively preventing the laptop from freezing or even burning due to excessive temperature. In addition, the sealing rubber strip is connected to the base by mortise and tenon, a tenon is provided on the base, and a mortise that matches the tenon is provided on the bottom surface of the sealing rubber strip. The sealing rubber strip and the base are connected by the mortise and tenon, and the structure is stable and the connection is reliable. The air pump is located on one side of the base, and the base and the air pump are fixedly connected. The base and the air pump are reliably connected, and the air pump is not easy to fall off. The semiconductor refrigeration chip includes a hot end face and a cold end face. The cold end face is located in the cooling tank, and the hot end face is located below the base. The hot end face is provided with an aluminum extruded heat sink. By providing the aluminum extruded heat sink on the hot end face, the heat on the hot end face can be quickly transferred away. The semiconductor refrigeration chip is bonded to the base, and the connection between the semiconductor refrigeration chip and the base is reliable and the structure is stable. The top and bottom of the base are affixed with thermal insulation film, which can provide the base with good thermal insulation effect, and can prevent heat from being transferred into the cooling tank.

[0003] In the prior art including the above-mentioned patents, common external radiators are divided into ordinary active radiators and forced air radiators. For existing equipment, ordinary radiators have low efficiency, and although the forced air radiators have good effects, they have large wind noise. For the prior art, most radiators cool the incoming air by increasing the air volume and adding liquid cooling. Others use semiconductor chips to cool the air and reduce humidity. However, if liquid cooling is used to cool the air in the prior art, the following problems will be faced. First, the installation space is limited, which will lead to a smaller liquid cooling system, thereby limiting the improvement effect and the risk of leakage. If semiconductor chips are used for heat dissipation, multiple fans are required to dissipate heat for the semiconductors and provide cool air for the computer. In this way, the overall size of the device is large and not lightweight enough. In addition, most of the air blown out by the existing radiators is blown out directly, which will result in the radiator having only one function and may affect the desktop near the heat dissipation port. Summary of the Invention

[0004] The problem to be solved by the present invention is that the existing device is too large and has relatively simple functions.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: an external radiator suitable for a laptop computer, comprising a base and a mounting box installed on its upper end, the mounting box being connected to the base through an angle-adjustable bracket, a duct assembly being provided inside the mounting box, the duct assembly being used to draw air from the bottom through the cooling components in the duct assembly and then upward into the computer, the hot and cold air in the duct assembly can also be discharged forward or backward and blown toward the external keyboard of the laptop, a cleaning assembly being further provided inside and at the upper end of the mounting box, the cleaning assembly being used to reduce moisture and dust in the cold air.

[0006] Preferably, the air duct assembly includes an air suction fan, which is arranged at the lower end of the installation box. There are two air suction fans in total. A semiconductor cold plate is arranged above the air suction fan. The semiconductor cold plate is fixedly connected to the installation box through a mounting frame, and the cold end of the semiconductor cold plate is located at the bottom.

[0007] Preferably, a fin 1 is provided at the lower end of the semiconductor cold plate, the fin 1 is fixedly connected to the mounting frame of the semiconductor cold plate, the fin 1 is parallel to the edge of the mounting box, and a fin 2 is slidingly provided at the upper end of the semiconductor cold plate, the fin 2 is inclined, and two groups of fins 2 and fin 1 are each provided, and the fins 2 and fin 1 are symmetrically arranged.

[0008] Preferably, a flow dividing plate is fixedly arranged at the upper end of the second fin, the second fin is fixedly connected with the flow dividing plate, a cover plate is fixedly arranged on one side of the flow dividing plate, the cover plate is located on one side of the installation box, the cover plate is slidably connected with the installation box, the cover plate is arranged in a "C" shape, and a guiding fan is arranged on the side of the cover plate close to the flow dividing plate.

[0009] Preferably, air outlet two is formed through the installation box above the front and rear sides of the semiconductor cold plate, the flow dividing plate and the second fin can pass through the air outlet two, the upper end of the cover plate can be inserted into the air outlet one, air outlet one is formed through the installation box below the air outlet two, and the air outlet one is located at the front side of the installation box.

[0010] Preferably, a baffle is slidably arranged at the lower end inside the air outlet one, a spring piece is slidably arranged at the lower end of the baffle, the lower end of the spring piece is fixedly connected with the installation box, the area of the air outlet one is smaller than that of the air outlet two, the lower end of the cover plate can be inserted into the air outlet one, and a ventilation port is formed in the cover plate located inside the air outlet one.

[0011] Preferably, the cleaning component includes a guiding block, the guiding blocks are arranged on both sides of the semiconductor cold plate, the guiding blocks are arranged in a semicircular shape, the guiding blocks are fixedly connected with the installation box, the center of the guiding block coincides with the midpoint of the semiconductor cold plate, and the flow dividing plate is located at the center point of the upper half of the guiding block.

[0012] Preferably, a mounting shaft is arranged at the center of the guiding block, a filter element is fixedly arranged on the outer surface of the mounting shaft, the filter element is arranged within the range of the guiding block, there are seven guiding blocks, a fixing piece is arranged inside the mounting shaft, and the fixing piece is composed of a bolt and a dust-proof plug.

[0013] Preferably, the mounting shaft is connected to the mounting bracket of the semiconductor cold plate through the bolt in the fixing piece, the dust-proof plug in the fixing piece is used to block the outlet for extraction on the installation box, and a collecting air duct is fixedly arranged at the upper end of the installation box, and the collecting air duct is arranged in a "C" shape.

[0014] Preferably, the collecting air duct is located on one side of the heat dissipation port of the laptop computer, a wind blocking cloth is fixedly arranged on the outer edge inside the collecting air duct, there are three wind blocking cloths in total, a fixing frame is fixedly arranged at the upper end of the wind blocking cloth, the fixing frame has the same shape as the collecting air duct, the fixing frame is fixedly connected with the collecting air duct through a magnet, and a guiding pipe is fixedly arranged at the rear end of the collecting air duct, and the other end of the guiding pipe is connected to the rear side of the filter element.

[0015] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) By setting up the air duct components, firstly, by changing the direction of gas flow and the order of cooling, the fan components required for the device can be reduced. Only one set of suction fans is needed to meet the operation of the entire device, which makes the device compact and lightweight, and the cost is not high. Secondly, by controlling the flow of air, the heat can be dissipated for the semiconductors in the device while meeting the heat dissipation of the notebook. This can further control the size and cost of the device. The air duct components can also control the exhaust direction of hot and cold air. In summer, cold air can be used to cool the hands and keyboard to ensure that the keyboard feels cool and reduce the secretion of hand sweat. In winter, the temperature of the hands can be increased to avoid stiffness of the hands due to low ambient temperature, thereby improving the user experience. Without adding too many components, the cost and the increase in the size of the device can be reduced while meeting the above benefits. (2) By setting up the cleaning component, first of all, the moisture and dust in the air can be filtered to reduce the amount of dust entering the notebook. Moreover, when the computer is in normal operation and no external radiator is needed, the hot air blown out by the computer itself can be used to blow away the dust on the surface of the filter element and keep it dry. This not only prolongs the service life of the filter element, but also simplifies the maintenance steps and does not require an additional drive source, which can effectively control costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a rear view schematic diagram of the installation box of the present invention; Figure 3 This is a schematic diagram of a partial cross-sectional structure of the installation box of the present invention; Figure 4 For the present invention Figure 3 A in the middle is an enlarged structural diagram; Figure 5 This is a schematic diagram of a partial cross-sectional structure of the installation box and the air outlet of the present invention; Figure 6 For the present invention Figure 5 The enlarged structural diagram at B in the middle; Figure 7 This is a schematic diagram of the cross-sectional structure of the top of the installation box of the present invention; Figure 8 This is a schematic diagram of the bottom structure of the installation box of the present invention; Figure 9 This is a bottom view of the structure of the diverter plate and fin 2 of the present invention; Figure 10 This is a bottom view of the structure of the fin of the present invention; Figure 11 It is a schematic diagram of the internal structure of the installation box of the present invention.

[0017] In the figure: 1. Base; 2. Mounting box; 3. Air duct assembly; 301. Suction fan; 302. Semiconductor cooling plate; 303. Fin 1; 304. Diverter plate; 305. Fin 2; 306. Cover plate; 307. Guide fan; 308. Air outlet 1; 309. Air outlet 2; 310. Baffle; 311. Shrapnel; 4. Cleaning assembly; 401. Guide block; 402. Mounting shaft; 403. Filter element; 404. Fixing part; 405. Air collecting pipe; 406. Wind shield cloth; 407. Fixing frame; 408. Guide pipe. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0019] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “including” or “comprising” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connected” or “connected” and the like are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0020] like Figures 1 to 11 As shown, the present invention provides an external radiator suitable for a laptop computer, comprising a base 1 and a mounting box 2 mounted on the upper end thereof, the mounting box 2 being connected to the base 1 via an angle-adjustable bracket, a duct assembly 3 being provided inside the mounting box 2, the duct assembly 3 being used to draw air from below through the cooling components inside the duct assembly 3 and then upwardly into the computer, the hot and cold air in the duct assembly 3 also being discharged forward or backward and blown toward the external keyboard of the laptop, a cleaning assembly 4 being further provided inside and at the upper end of the mounting box 2, the cleaning assembly 4 being used to reduce moisture and dust in the cold air.

[0021] The air duct assembly 3 includes an air suction fan 301. The air suction fan 301 is arranged at the lower end of the installation box 2. There are two air suction fans 301 in total. Above the air suction fan 301, there is a semiconductor cooling chip 302. The semiconductor cooling chip 302 is fixedly connected to the installation box 2 through a mounting bracket. The cold end of the semiconductor cooling chip 302 is located below.

[0022] At the lower end of the semiconductor cooling chip 302, there is a first fin 303. The first fin 303 is fixedly connected to the mounting bracket of the semiconductor cooling chip 302. The first fin 303 is parallel to the side of the installation box 2. At the upper end of the semiconductor cooling chip 302, a second fin 305 is slidably arranged. The second fin 305 is inclined. There are two sets of the second fin 305 and the first fin 303 respectively. The second fin 305 and the first fin 303 are both symmetrically arranged.

[0023] At the upper end of the second fin 305, there is a flow dividing plate 304 fixedly arranged. The second fin 305 is fixedly connected to the flow dividing plate 304. On one side of the flow dividing plate 304, there is a cover plate 306 fixedly arranged. The cover plate 306 is located on one side of the installation box 2. The cover plate 306 is slidably connected to the installation box 2. The cover plate 306 is arranged in a "C" shape. On the side of the cover plate 306 close to the flow dividing plate 304, there is a guiding fan 307.

[0024] Above the front and rear sides of the semiconductor cooling chip 302, there are second air outlets 309 opened through the installation box 2. The second air outlets 309 can allow the flow dividing plate 304 and the second fin 305 to pass through. The upper end of the cover plate 306 can be inserted into the first air outlet 308. Below the second air outlets 309, there is a first air outlet 308 opened through the installation box 2. The first air outlet 308 is located at the front side of the installation box 2. [[ID=IO]]

[0025] Inside the lower end of the first air outlet 308, there is a baffle 310 slidably arranged. At the lower end of the baffle 310, there is a spring piece 311 slidably arranged. The lower end of the spring piece 311 is fixedly connected to the installation box 2. The area of the first air outlet 308 is smaller than that of the second air outlet 309. The lower end of the cover plate 306 can be inserted into the first air outlet 308. The cover plate 306 located inside the first air outlet 308 is provided with ventilation openings.

[0026] The cleaning component 4 includes a guiding block 401. The guiding block 401 is arranged on both sides of the semiconductor cooling chip 302. The guiding block 401 is semi-circular in shape. The guiding block 401 is fixedly connected to the installation box 2. The center of the guiding block 401 coincides with the midpoint of the semiconductor cooling chip 302. The flow dividing plate 304 is located at the center point of the upper half of the guiding block 401.

[0027] At the center of the guiding block 401, there is an installation shaft 402. On the outer surface of the installation shaft 402, there is a filter element 403 fixedly arranged. The filter element 403 is arranged within the range of the guiding block 401. There are seven guiding blocks 401. Inside the installation shaft 402, there is a fixing part 404. The fixing part 404 consists of a bolt and a dust plug.

[0028] The mounting shaft 402 is connected to the mounting bracket of the semiconductor cooling sheet 302 through bolts in the fixing member 404. The dust plug in the fixing member 404 is used to block the outlet on the mounting box 2 for extraction. A collecting air duct 405 is fixedly arranged at the upper end of the mounting box 2, and the collecting air duct 405 is arranged in a "C" shape.

[0029] The collecting air duct 405 is located on one side of the laptop cooling outlet. A wind blocking cloth 406 is fixedly arranged on the inner outer edge of the collecting air duct 405. There are three wind blocking cloths 406 in total. A fixing frame 407 is fixedly arranged at the upper end of the wind blocking cloth 406. The fixing frame 407 has the same shape as the collecting air duct 405. The fixing frame 407 is fixed to the collecting air duct 405 through magnets. A diversion duct 408 is fixedly arranged at the rear end of the collecting air duct 405, and the other end of the diversion duct 408 is connected to the rear side of the filter element 403.

[0030] The working principle and usage process of the present invention: After the device starts, the suction fan 301 sucks the air below and directly blows it towards the cold end of the semiconductor cooling sheet 302 and the first fin 303. Under the action of the two, firstly, the temperature of the air can be reduced, and secondly, the cold air can be guided to both sides of the mounting box 2 and flipped upwards through the diversion block 401; The flipped cold air is divided into two parts, upper and lower, under the action of the diversion plate 304. The upper part of the cold air directly enters the laptop interior, and the lower part of the cold air can cool the hot end of the semiconductor cooling sheet 302 through the second fin 305, and then is discharged outwards under the diversion effect of the second fin 305; The discharged air can be discharged through the second air outlet 309. At this time, the user can change the discharge direction of the hot air according to the ambient temperature and usage habits. If it is necessary to blow hot air towards the keyboard, just make the cover plate 306 be located behind the mounting box 2. At this time, the hot air can be discharged from the front through the second air outlet 309. If it is necessary to blow cold air towards the keyboard, pull out the cover plate 306 located at the rear together with the diversion plate 304 and the second fin 305 and reinsert them from the front. At this time, the hot air above will be guided by the second fin 305 and discharged from the rear, and the lower end of the cover plate 306 can push the baffle 310 downwards to make the space at the lower end of the semiconductor cooling sheet 302 communicate with the front end of the mounting box 2, so that a small part of the cold air can be diverted to blow towards the keyboard to cool the hand; It is worth mentioning that the diversion fan 307 can be started when the amount of hot air is too much to be discharged passively, and guide the hot air towards the second air outlet 309; When air passes through the guide block 401, the moisture and dust in the air can be reduced through the filter element 403. When cleaning and maintaining the filter element 403, the windshield 406 can be lifted upwards to collect the hot air blown out by the notebook and blow it to the filter element 403 through the guide pipe 408. At this time, the sealing plug of the fixing part 404 can be removed to blow out the dust on the filter element 403, and the hot air can also blow out the moisture contained in the filter element 403. It is worth mentioning that in summer, the environment and humidity are high. If the user blows cold air from the front, the cold air can blow out the condensed water on the surface of the semiconductor cooling plate 302 at the same time.

[0031] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. An external radiator suitable for a notebook computer, comprising a base (1) and a mounting box (2) mounted on an upper end thereof, characterized in that: The installation box (2) is connected to the base (1) through an angle-adjustable bracket. An air duct assembly (3) is provided inside the installation box (2). The air duct assembly (3) is used to draw air from below, pass it through the cooling components inside the air duct assembly (3), and then enter the computer upward. The hot and cold air inside the air duct assembly (3) can also be discharged forward or backward and blown to the external keyboard of the notebook. A cleaning assembly (4) is also provided inside and at the upper end of the installation box (2). The cleaning assembly (4) is used to reduce the moisture and dust in the cold air.

2. The external radiator for notebook computers according to claim 1, characterized in that: The air duct assembly (3) includes an air suction fan (301). The air suction fan (301) is provided at the lower end of the installation box (2). There are two air suction fans (301) in total. Above the air suction fan (301), there is a semiconductor cooling chip (302). The semiconductor cooling chip (302) is fixedly connected to the installation box (2) through a mounting bracket. The cold end of the semiconductor cooling chip (302) is located below.

3. The external radiator for notebook computers according to claim 2, characterized in that: At the lower end of the semiconductor cooling chip (302), there is a first fin (303). The first fin (303) is fixedly connected to the mounting bracket of the semiconductor cooling chip (302). The first fin (303) is parallel to the side of the installation box (2). A second fin (305) is slidably provided at the upper end of the semiconductor cooling chip (302). The second fin (305) is inclined. There are two sets of the second fin (305) and the first fin (303) respectively. The second fin (305) and the first fin (3) are both symmetrically arranged.

4. The external radiator for notebook computers according to claim 3, characterized in that: At the upper end of the second fin (305), there is a flow dividing plate (304) fixedly provided. The second fin (305) is fixedly connected to the flow dividing plate (304). On one side of the flow dividing plate (304), there is a cover plate (306) fixedly provided. The cover plate (306) is located on one side of the installation box (2). The cover plate (306) is slidably connected to the installation box (2). The cover plate (306) is arranged in a "C" shape. On the side of the cover plate (306) close to the flow dividing plate (304), there is a guiding fan (307).

5. The external radiator for notebook computers according to claim 4, characterized in that: Above the front and back sides of the semiconductor cooling chip (302), there are second air outlets (309) opened through the installation box (2). The second air outlets (309) allow the flow dividing plate (304) and the second fin (305) to pass through. The upper end of the cover plate (306) can be inserted into the first air outlet (308). Below the second air outlet (309), there is a first air outlet (308) opened through the installation box (2). The first air outlet (308) is located at the front side of the installation box (2).

6. The external radiator for notebook computers according to claim 5, characterized in that: Inside the lower end of the first air outlet (308), there is a baffle (310) slidably provided. At the lower end of the baffle (310), there is a spring piece (311) slidably provided. The lower end of the spring piece (311) is fixedly connected to the installation box (2). The area of the first air outlet (308) is smaller than that of the second air outlet (309). The lower end of the cover plate (306) can be inserted into the first air outlet (308). The cover plate (306) located inside the first air outlet (308) is provided with ventilation openings.

7. The external radiator for notebook computers according to claim 1, characterized in that: The cleaning component (4) includes a diversion block (401). The diversion block (401) is arranged on both sides of the semiconductor cooling sheet (302). The diversion block (401) is semicircularly arranged. The diversion block (401) is fixedly connected to the mounting box (2). The center of the circle of the diversion block (401) coincides with the midpoint of the semiconductor cooling sheet (302). The flow dividing plate (304) is located at the center point of the upper half of the diversion block (401).

8. The external radiator for notebook computers according to claim 7, characterized in that: An installation shaft (402) is arranged at the center of the circle of the diversion block (401). A filter element (403) is fixedly arranged on the outer surface of the installation shaft (402). The filter element (403) is arranged within the range of the diversion block (401). There are seven diversion blocks (401). A fixing member (404) is arranged inside the installation shaft (402). The fixing member (404) consists of a bolt and a dust plug.

9. The external radiator for notebook computers according to claim 8, characterized in that: The installation shaft (402) is connected to the mounting bracket of the semiconductor cooling sheet (302) through the bolt in the fixing member (404). The dust plug in the fixing member (404) is used to block the outlet on the mounting box (2) for extraction. An air collecting pipe (405) is fixedly arranged at the upper end of the mounting box (2). The air collecting pipe (405) is arranged in a "C" shape.

10. The external radiator for notebook computers according to claim 9, characterized in that: The air collecting pipe (405) is located on one side of the heat dissipation outlet of the laptop. A wind blocking cloth (406) is fixedly arranged on the outer edge inside the air collecting pipe (405). There are three wind blocking cloths (406) in total. A fixing frame (407) is fixedly arranged at the upper end of the wind blocking cloth (406). The fixing frame (407) has the same shape as the air collecting pipe (405). The fixing frame (407) is fixed to the air collecting pipe (405) through a magnet. A diversion pipe (408) is fixedly arranged at the rear end of the air collecting pipe (405). The other end of the diversion pipe (408) is connected to the rear side of the filter element (403).

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