Electronic device

Abstract

The electronic device includes a sensor layer in which a sensing region and a peripheral region adjacent to the sensing region are defined, and a sensor driver, and includes: a first electrode group arranged in a first direction; a second electrode group crossing the first electrode group and arranged in a second direction crossing the first direction; a first trace electrically connected to the first electrode group; and a second trace electrically connected to the second electrode group, and the second trace includes: a (2-1) th trace electrically connected to one of the second electrode group and having a first length in the second direction; and a (2-2) th trace spaced apart from the (2-1) th trace in the first direction while extending in a second direction and having a second length in the second direction substantially equal to the first length, the sensor driver configured to drive the sensor layer, and is configured to selectively operate in a first mode for sensing a touch input or in a second mode for sensing a pen input.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0019406, filed on February 8, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The embodiments of the present disclosure described herein relate to an electronic device capable of sensing input made by a pen. Background Art

[0004] Multimedia electronic devices such as televisions (TVs), mobile phones, tablet computers, notebook computers, navigation devices, or game consoles include display devices that display images. In addition to general input methods such as buttons, keyboards, or mice, electronic devices may also include a sensor layer (or input sensor) that provides a touch-based input method so that a user can intuitively, conveniently, and easily input information or commands. The sensor layer can sense the user's touch or input. At the same time, for users who are familiar with inputting information by handwriting or for fine touch input of corresponding applications (e.g., applications for sketching or drawing), the demand for using a pen increases. Summary of the Invention

[0005] An embodiment of the present disclosure provides an electronic device capable of sensing an input made by a pen.

[0006] According to one or more embodiments, an electronic device may include a sensor layer and a sensor driver, wherein a sensing area and a peripheral area adjacent to the sensing area are defined in the sensor layer, and the sensor layer includes: a first electrode group arranged in a first direction; a second electrode group crossing the first electrode group and arranged in a second direction crossing the first direction; a first trace electrically connected to the first electrode group; and a second trace electrically connected to the second electrode group, and the second trace includes: a (2-1)th trace electrically connected to one of the second electrode groups and having a first length in the second direction; and a (2-2)th trace spaced apart from the (2-1)th trace in the first direction while extending in the second direction and having a second length substantially equal to the first length in the second direction, the sensor driver being configured to drive the sensor layer and being configured to selectively operate in a first mode for sensing touch input or in a second mode for sensing pen input.

[0007] Each of the second electrode groups may include a first separating electrode and a second separating electrode spaced apart from the first separating electrode in the first direction, wherein the (2-1)th trace is electrically connected to the first separating electrode and the (2-2)th trace is electrically connected to the second separating electrode.

[0008] At least a portion of the (2-1)th trace and at least a portion of the (2-2)th trace may overlap with the sensing area, wherein the portion of the (2-1)th trace having a first length overlaps with the sensing area, and wherein the portion of the (2-2)th trace having a second length overlaps with the sensing area.

[0009] The (2-1)th trace line may be connected to the first separation electrode adjacent to the second separation electrode, wherein the (2-2)th trace line is connected to the second separation electrode adjacent to the first separation electrode.

[0010] The (2-1)th trace and the (2-2)th trace may overlap the peripheral region and may be spaced apart from each other with the first and second partition electrodes between the (2-1)th trace and the (2-2)th trace.

[0011] The second electrode group may include a (2-1)th electrode group, a (2-2)th electrode group, and a (2-3)th electrode group sequentially arranged in the second direction, wherein the (2-1)th electrode group includes a (1-1)th separation electrode and a (2-1)th separation electrode spaced apart from the (1-1)th separation electrode in the first direction, wherein the (2-2)th electrode group includes a (1-2)th separation electrode and a (2-2)th separation electrode spaced apart from the (1-2) separation electrode in the first direction, wherein the (2-3)th electrode group includes a (1-3)th separation electrode and a (2-3)th separation electrode in the first direction a (2-3)th separation electrode spaced apart from the (1-3)th separation electrode, and wherein the second trace includes the (1-1)th separation trace electrically connected to the (1-1)th separation electrode, the (2-1)th separation trace electrically connected to the (2-1)th separation electrode, the (1-2)th separation trace electrically connected to the (1-2)th separation electrode, the (2-2)th separation trace electrically connected to the (2-2)th separation electrode, the (1-3)th separation trace electrically connected to the (1-3)th separation electrode, and the (2-3)th separation trace electrically connected to the (2-3) separation electrode.

[0012] A gap between the (1-1)th dividing trace and the (2-1)th dividing trace may be narrower than a gap between the (2-1)th dividing trace and the (1-2)th dividing trace.

[0013] The (1-1)th dividing trace, the (2-1)th dividing trace, the (1-2)th dividing trace, the (2-2)th dividing trace, the (1-3)th dividing trace, and the (2-3)th dividing trace may be sequentially arranged in the first direction.

[0014] The (1-3)th dividing trace, the (2-3)th dividing trace, the (1-1)th dividing trace, the (2-1)th dividing trace, the (1-2)th dividing trace, and the (2-2)th dividing trace may be sequentially arranged in the first direction.

[0015] The width of the (1-1)th separation electrode in the first direction may be narrower than the width of the (1-2)th separation electrode in the first direction, wherein the width of the (2-1)th separation electrode in the first direction is wider than the width of the (2-2)th separation electrode in the first direction.

[0016] The width of the (1-3)th separation electrode in the first direction may be wider than the width of the (1-2)th separation electrode in the first direction, wherein the width of the (2-3)th separation electrode in the first direction is narrower than the width of the (2-2)th separation electrode in the first direction.

[0017] The width of the (1-3)th separation electrode in the first direction may be narrower than the width of the (1-1)th separation electrode in the first direction, wherein the width of the (2-3)th separation electrode in the first direction is wider than the width of the (2-1)th separation electrode in the first direction.

[0018] When viewed from the second direction, a gap between the (1-3)th separation electrode and the (2-3)th separation electrode may overlap with the (2-1)th separation electrode and the (2-2)th separation electrode.

[0019] When viewed from the second direction, the gap between the (1-3)th separation electrode and the (2-3)th separation electrode may overlap with the (1-1)th separation electrode and the (1-2)th separation electrode.

[0020] The (2-1)th trace may include a first portion extending in the first direction and a second portion extending from the first portion in the second direction, wherein the (2-2)th trace faces the second portion.

[0021] The sensor driver may be configured to receive the first signal through the (2-1)th trace and the second signal through the (2-2)th trace, and to generate first data by performing a differential calculation operation on the first signal and the second signal.

[0022] The second trace may include a (2-3)th trace electrically connected to another second electrode group among the second electrode groups and a (2-4)th trace spaced apart from the (2-3)th trace in the first direction while extending in the second direction, wherein the sensor driver is configured to receive a third signal through the (2-3)th trace and a fourth signal through the (2-4)th trace, configured to generate second data by performing a differential calculation operation on the third signal and the fourth signal, and configured to generate third data by performing a differential calculation operation on the first data and the second data.

[0023] The sensor driver may be configured to generate the first data and the second data through at least one of analog differential processing and digital differential processing, wherein the sensor driver is configured to generate the third data through at least one of analog differential processing and digital differential processing.

[0024] According to one or more embodiments, an electronic device may include a sensor layer and a sensor driver, wherein the sensor layer is defined with a sensing area and a peripheral area adjacent to the sensing area, and the sensor layer includes: a first electrode group arranged in the sensing area and in a first direction; a second electrode group arranged in the sensing area and in a second direction intersecting the first direction while intersecting the first electrode group; a first line electrically connected to one of the second electrode groups; a second line having a length substantially equal to that of the first line in the second direction in the sensing area; a third line electrically connected to another one of the second electrode groups; and a fourth line in the sensing area and in the second direction. has a length substantially equal to that of the third line, the sensor driver is configured to drive the sensor layer, is configured to selectively operate in a first mode for sensing touch input or in a second mode for sensing pen input, is configured to receive a first signal through the first line and a second signal through the second line, is configured to generate first data by performing a differential calculation operation on the first signal and the second signal, is configured to receive a third signal through the third line and a fourth signal through the fourth line, is configured to generate second data by performing a differential calculation operation on the third signal and the fourth signal, and is configured to generate third data by performing a differential calculation operation on the first data and the second data.

[0025] One of the second electrode groups may include a first separator electrode and a second separator electrode spaced apart from the first separator electrode in the first direction, wherein the other of the second electrode groups includes a third separator electrode and a fourth separator electrode spaced apart from the third separator electrode in the first direction, wherein the first line is electrically connected to the first separator electrode and the second line is electrically connected to the second separator electrode, and wherein the third line is electrically connected to the third separator electrode and the fourth line is electrically connected to the fourth separator electrode.

[0026] The first line and the second line may be insulated from one of the third and fourth partition electrodes while crossing the one of the third and fourth partition electrodes.

[0027] The first line may include a first portion extending in a first direction and a second portion extending from the first portion in a second direction, wherein the second line faces the second portion of the first line.

[0028] The sensor driver may be connected to one end portion of the second line, and an opposite end portion of the second line opposite to the one end portion is floating.

[0029] According to one or more embodiments, the electronic device may include: a first electrode group in a sensing area and arranged in a first direction; a second electrode group in the sensing area intersecting the first electrode group and arranged in a second direction intersecting the first direction; a first line in the sensing area and electrically connected to one of the second electrode groups; a second line in the sensing area and adjacent to the first line in the first direction; and a third line in the sensing area and electrically connected to another of the second electrode groups, wherein a gap between the first line and the second line is narrower than a gap between the second line and the third line, and wherein a length of a portion of the first line in the sensing area is substantially equal to a length of a portion of the second line in the sensing area.

[0030] One of the second electrode groups may include a first separating electrode and a second separating electrode spaced apart from the first separating electrode in the first direction, wherein the first line is electrically connected to the first separating electrode and the second line is electrically connected to the second separating electrode.

[0031] The first line may include a first portion extending in a first direction and a second portion extending from the first portion in a second direction, wherein the second line faces the second portion of the first line while extending in the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0033] Figure 1A is a perspective view illustrating an electronic device according to one or more embodiments of the present disclosure.

[0034] Figure 1B is a bottom perspective view illustrating an electronic device according to one or more embodiments of the present disclosure.

[0035] Figure 2 is a perspective view illustrating an electronic device according to one or more embodiments of the present disclosure.

[0036] Figure 3is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0037] Figure 4 is a cross-sectional view schematically illustrating a display panel according to one or more embodiments of the present disclosure.

[0038] Figure 5 is a diagram illustrating operations of an electronic device according to one or more embodiments.

[0039] Figure 6A is a cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0040] Figure 6B is a cross-sectional view of a sensor layer according to one or more embodiments of the present disclosure.

[0041] Figure 7 is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0042] Figure 8 is an enlarged plan view illustrating one sensing unit according to one or more embodiments of the present disclosure.

[0043] Figure 9A is a plan view illustrating a first conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0044] Figure 9B is a plan view illustrating a second conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0045] Figure 9C are respectively along Figure 9A and Figure 9B 1 is a cross-sectional view of a sensor layer according to one or more embodiments of the present disclosure taken along line II′ shown in FIG.

[0046] Figure 10A is a plan view illustrating a first conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0047] Figure 10B is a plan view illustrating a second conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0048] Figure 10C According to one or more embodiments of the present disclosure Figure 10A and Figure 10B sectional view of the sensor layer taken along line II-II' shown in FIG.

[0049] Figure 11A yes Figure 9AAn enlarged plan view of the area AA' shown in FIG.

[0050] Figure 11B yes Figure 9B An enlarged plan view of the area BB' is shown in FIG.

[0051] Figure 12 is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0052] Figure 13A is a diagram illustrating the operation of the sensor driver according to one or more embodiments of the present disclosure.

[0053] Figure 13B is a diagram illustrating the operation of the sensor driver according to one or more embodiments of the present disclosure.

[0054] Figure 14 is a view showing a first mode according to one or more embodiments of the present disclosure.

[0055] Figure 15 is a view showing a second mode according to one or more embodiments of the present disclosure.

[0056] Figure 16A is a graph illustrating a waveform of a first signal according to one or more embodiments of the present disclosure.

[0057] Figure 16B is a graph illustrating a waveform of a second signal according to one or more embodiments of the present disclosure.

[0058] Figure 17A is a view showing a second mode according to one or more embodiments of the present disclosure.

[0059] Figure 17B is a view showing a second mode according to one or more embodiments of the present disclosure.

[0060] Figure 18A is a diagram illustrating some components of a sensor layer according to one or more embodiments of the present disclosure.

[0061] Figure 18B is an equivalent circuit diagram of an input device and a sensor layer according to one or more embodiments of the present disclosure.

[0062] Figure 19 is a diagram illustrating a sensor driver according to one or more embodiments of the present disclosure.

[0063] Figure 20 is a diagram illustrating a sensor driver according to one or more embodiments of the present disclosure.

[0064] Figure 21 is a diagram illustrating a sensor driver according to one or more embodiments of the present disclosure.

[0065] Figure 22A is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0066] Figure 22B is a diagram illustrating some components of a sensor layer according to one or more embodiments of the present disclosure.

[0067] Figure 23 is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0068] Figure 24A is a diagram illustrating some components of a sensor layer according to one or more embodiments of the present disclosure.

[0069] Figure 24B is a view showing a second mode according to one or more embodiments of the present disclosure.

[0070] Figure 25 is a plan view of a sensor layer according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0071] By referring to the detailed description and drawings of the embodiments, it is possible to more easily understand the aspects of some embodiments of the present disclosure and the methods for realizing them. The described embodiments are provided as examples so that the present disclosure will be thorough and complete and will fully convey the aspects of the present disclosure to those skilled in the art. Therefore, processes, elements and techniques that are redundant, irrelevant or unrelated to the description of the embodiments or are unnecessary for those of ordinary skill in the art to fully understand the aspects of the present disclosure may be omitted. Unless otherwise stated, similar reference numerals, characters or combinations thereof represent similar elements throughout the drawings and written descriptions, and therefore, their repeated descriptions may be omitted.

[0072] The described embodiments may have various modifications and may be implemented in different forms and should not be construed as limited to the embodiments shown herein. The use of "can," "may," or "may not" when describing an embodiment corresponds to one or more embodiments of the present disclosure.

[0073] In view of the overall content of the present disclosure, those skilled in the art will understand that each suitable feature of the various embodiments of the present disclosure may be combined in part or in whole or in combination with each other, and may be technically interlocked and operated in various suitable manners, and unless otherwise specified or implied, each embodiment may be implemented independently of each other or in combination with each other in any suitable manner.

[0074] In the accompanying drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity and / or descriptive purposes. In other words, because the sizes and thicknesses of the elements in the drawings are arbitrarily shown for ease of description, the present disclosure is not limited thereto. In addition, the use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the illustrated elements, and / or any other characteristics, attributes, properties, etc. of the elements.

[0075] Various embodiments are described herein with reference to cross-sectional views that are schematic diagrams of embodiments and / or intermediate structures. Therefore, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Furthermore, the specific structural or functional descriptions disclosed herein are merely exemplary for the purpose of describing embodiments according to the concepts of the present disclosure. Therefore, the embodiments disclosed herein should not be construed as being limited to the shapes of the elements, layers, or regions shown, but rather should include deviations in shapes due to, for example, manufacturing.

[0076] For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and / or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place.

[0077] For ease of explanation, spatial relative terms such as "below", "beneath", "down", "downside", "beneath", "above", "upper", "above", "higher", "upper side", "side" (e.g., as in "sidewall"), etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use or in operation. For example, if the device in the drawings is flipped, an element described as being "below", "below", or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "below" can encompass both above and below orientations. The device can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly. Similarly, when a first portion is described as being arranged "on" a second portion, this means that the first portion is arranged at the upper or lower side of the second portion, and is not limited to its upper side based on the direction of gravity.

[0078] In addition, the phrase "in a plan view" means when viewing an object portion from above, and the phrase "in a schematic cross-sectional view" means when viewing a schematic cross-section taken by vertically cutting an object portion from the side. The terms "overlap" or "overlapped" mean that a first object can be above or below a second object, or on one side of the second object, and vice versa. In addition, the term "overlap" can include stacking, facing, or facing, extending over, covering, or partially covering, or any other suitable term as will be understood and understood by those of ordinary skill in the art. The expression "non-overlapping" can include meanings such as "separated from," "separated from," or "offset from," as well as any other suitable equivalents as will be understood and understood by those of ordinary skill in the art. The terms "face" and "facing" can mean that a first object can be directly opposite or indirectly opposite to a second object. In the case where a third object is between the first and second objects, the first and second objects can be understood to be indirectly opposite to each other, but still facing each other.

[0079] It will be understood that when an element, layer, region, or component is referred to as being "formed on," "on," "connected to," or "(operably or communicatively) coupled to" another element, layer, region, or component, it may be directly formed on, directly on, directly connected to, or directly coupled to another element, layer, region, or component, or may be indirectly formed on, indirectly on, indirectly connected to, or indirectly coupled to another element, layer, region, or component, such that one or more intervening elements, layers, regions, or components may be present. Furthermore, this may collectively mean directly coupled or directly connected or indirectly coupled or indirectly coupled as well as integrally coupled or integrally connected or non-integrally coupled or non-integrally connected. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, it may be directly electrically connected or coupled to the other layer, region, and / or component, or one or more intervening layers, regions, or components may be present. The one or more intervening components may include switches, resistors, capacitors, etc. When describing embodiments, unless explicitly described as being directly connected, the statement of connection indicates an electrical connection, and "directly connected / directly coupled" or "directly on..." means that one component is directly connected or coupled to another component or is directly on another component without intervening components.

[0080] In addition, in this specification, when a part of a layer, film, region, plate, etc. is formed on another part, the formation direction is not limited to the upward direction, but includes forming the part on the side surface or in the downward direction. On the contrary, when a part of a layer, film, region, plate, etc. is formed "under" another part, this includes not only the case where the part is "directly under" the other part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components such as "between...", "directly between...", or "adjacent to..." and "directly adjacent to..." can be interpreted similarly. It will be understood that when an element or layer is referred to as "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intervening elements or layers.

[0081] For the purposes of this disclosure, expressions such as "at least one of" or "any one of" or "one or more of" when preceding a list of elements modify the entire list of elements and do not modify the individual elements in the list. For example, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, any combination of two or more of X, Y, and Z (such as, for example, XYZ, XY, YZ, and XZ), or any variation thereof. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or," and the term "and / or" includes any and all combinations of one or more of the relevant listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, expressions such as "at least one of," "a plurality of," "one of," and other prepositional phrases, when preceding / following a list of elements, modify the entire list of elements and do not modify the individual elements in the list. When "C to D" is stated, it means C or greater and D or less unless otherwise indicated.

[0082] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, areas, layers and / or sections, these elements, components, areas, layers and / or sections should not be limited by these terms. These terms do not correspond to a specific order, position or advantage, and are only used to distinguish one element, component, component, area, region, layer, section or part from another element, component, component, area, region, layer, section or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first area, first layer or first section described below may be referred to as the second element, second component, second area, second layer or second section. Describing an element as a "first" element may not require or imply the presence of a second element or other element. The terms "first", "second", etc. may also be used herein to distinguish elements of different categories or groups. For the sake of simplicity, the terms "first", "second", etc. may respectively represent "first category (or first group)", "second category (or second group)", etc.

[0083] In the examples, the x-axis, y-axis, and / or z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. The same applies to the first direction, the second direction, and / or the third direction.

[0084] The terms used herein are for the purpose of describing the embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are intended to include the plural forms as well, and the plural forms are intended to include the singular forms, unless the context clearly indicates otherwise. It will also be understood that the terms "comprises," "comprising," "have," "having," "includes," and "including," when used in this specification, specify the presence of stated features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0085] As used herein, the terms "substantially," "about," "approximately," and similar terms are used as approximate terms and not as terms of degree, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art. For example, "substantially" may include a range of + / - 5% of the corresponding value. In view of the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximately" as used herein include the value and mean within an acceptable deviation range for the particular value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure."

[0086] The terms "part" and "unit" refer to software components or hardware components for performing corresponding functions. The electronic or electrical devices and / or any other related devices or components according to the embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application specific integrated circuits), software, or a combination of software, firmware, and hardware to process data or digital signals. For example, the various components of these devices can be formed on an integrated circuit (IC) chip or on a separate IC chip. In addition, the various components of these devices can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. Circuit hardware may include, for example, an application specific integrated circuit (ASIC), a general or dedicated central processing unit (CPU) configured to execute instructions stored in a non-temporary storage medium, a digital signal processor (DSP), a graphics processing unit (GPU), and a programmable logic device such as a field programmable gate array (FPGA).

[0087] Software components can indicate the data used by executable code and / or the executable code in the storage medium that can be addressed. Therefore, software components can be, for example, object-oriented software components, class components and task components, and can include processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcodes, data, databases, data structures, tables, arrays or variables. In addition, the various components of these devices can be processes or threads that are run on one or more processors in one or more computing devices, execute computer program instructions and interact with other system components for performing the various functions described herein. Computer program instructions are stored in a memory (such as, for example, random access memory (RAM)) that can be implemented in a computing device using a standard memory device. Computer program instructions can also be stored in other non-temporary computer-readable media (such as, for example, CD-ROMs, flash drives, etc.). In addition, it will be appreciated by those skilled in the art that, without departing from the spirit and scope of the embodiments of the present disclosure, the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a specific computing device can be distributed on one or more other computing devices.

[0088] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0089] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0090] Figure 1A is a perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure. Figure 1B is a bottom perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0091] refer to Figure 1A and Figure 1B The electronic device 1000 may be a device activated in response to an electrical signal. For example, the electronic device 1000 may display an image and sense an input applied from the outside. The external input may be a user input. The user input may include any of various external inputs such as a part of the user's body, a pen, light, heat, or pressure.

[0092] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separated from each other. The first display panel DP1 may be referred to as a main display panel, and the second display panel DP2 may be an auxiliary display panel or an external display panel.

[0093] The first display panel DP1 may include first display cells DA1-F and a peripheral area NDA surrounding the first display cells DA1-F. The second display panel DP2 may include second display cells DA2-F. The area of the second display panel DP2 may be smaller than that of the first display panel DP1. The area of the first display cells DA1-F may be larger than that of the second display cells DA2-F to correspond to the sizes of the first display panel DP1 and the second display panel DP2.

[0094] When the electronic device 1000 is unfolded, the first display unit DA1-F may have a plane substantially parallel to a plane defined by the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and the rear surface (or bottom surface) of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0095] The first display panel DP1 or the first display unit DA1-F may include a folding area FA that folds and unfolds and a plurality of non-folding areas NFA1 and NFA2 that are spaced apart from each other, with the folding area FA interposed between the non-folding areas NFA1 and NFA2. The second display panel DP2 may overlap any one of the plurality of non-folding areas NFA1 and NFA2. For example, the second display panel DP2 may overlap the first non-folding area NFA1.

[0096] The display direction of the first image IM1a displayed in a portion of the first display panel DP1 (for example, displayed in the second non-folding area NFA2) and the display direction of the second image IM2a displayed on the second display panel DP2 may be opposite to each other. For example, the first image IM1a may be displayed in a third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 opposite to the third direction DR3.

[0097] According to one or more embodiments of the present disclosure, the folding area FA can be bent about a folding axis extending in a direction parallel to the longer sides of the electronic device 1000 (e.g., a direction parallel to the second direction DR2). When the electronic device 1000 is folded, the folding area FA has a corresponding curvature and a corresponding radius of curvature. The first non-folding area NFA1 and the second non-folding area NFA2 can face each other, and the electronic device 1000 can be in an inwardly folded state so that the first display unit DA1-F is not exposed to the outside.

[0098] According to one or more embodiments of the present disclosure, the electronic device 1000 may be in an outward folded state so that the first display unit DA1-F is exposed to the outside. According to one or more embodiments of the present disclosure, the electronic device 1000 may be in an inward folded state or an outward folded state from a state where the electronic device 1000 is unfolded, and the present disclosure is not limited thereto.

[0099] although Figure 1A Although one folding area FA is defined in the electronic device 1000, the present disclosure is not limited thereto. For example, a plurality of folding axes and a plurality of folding areas corresponding to the plurality of folding axes are defined in the electronic device 1000, and the electronic device 1000 can be in an inwardly folded state or an outwardly folded state in each of the plurality of folding areas from an unfolded state in each of the plurality of folding areas.

[0100] According to one or more embodiments of the present disclosure, at least one of the first display panel DP1 and the second display panel DP2 can sense input from a pen PN even without a digitizer. Therefore, by omitting a digitizer for sensing the pen PN, the electronic device 1000 can be thinner and lighter, and have improved flexibility. Therefore, in addition to the first display panel DP1, this design also enables sensing of the pen PN in the second display panel DP2.

[0101] Figure 2 is a perspective view of an electronic device 1000 - 1 according to one or more embodiments of the present disclosure. Figure 3 is a perspective view of an electronic device 1000 - 2 according to one or more embodiments of the present disclosure.

[0102] although Figure 2 The electronic device 1000-1 is shown to be a mobile phone, but the electronic device 1000-1 may include a display panel DP. Figure 3 The electronic device 1000-2 is shown to be a notebook computer, but the electronic device 1000-2 may include a display panel DP. Figure 3 It is a perspective view of the electronic device 1000-2, but includes Figure 3The coordinate axes in are displayed based on the display panel DP in the electronic device 1000 - 2 .

[0103] According to one or more embodiments of the present disclosure, the display panel DP may sense an input applied from the outside. The external input may be a user input. The user's input may include a part of the user's body, a pen PN (see Figure 1A ), any of a variety of external inputs such as light, heat, or pressure.

[0104] According to one or more embodiments of the present disclosure, the display panel DP can sense input made by the pen PN even without a digitizer. Therefore, since the digitizer for sensing the pen PN is omitted, the electronic devices 1000-1 and 1000-2 can be thinner and lighter.

[0105] although Figure 1A A foldable electronic device 1000 is shown, and Figure 2 A bar-type electronic device 1000 - 1 is shown, but the present disclosure is not limited thereto. For example, the following description may be applied to various electronic devices such as a rollable electronic device, a slidable electronic device, or a stretchable electronic device.

[0106] Figure 4 is a cross-sectional view schematically illustrating a display panel DP according to one or more embodiments of the present disclosure.

[0107] refer to Figure 4 , the display panel DP may include a display layer 100 and a sensor layer 200 .

[0108] The display layer 100 may be a component that generally generates an image. The display layer 100 may include a display area 100A and a non-display area 100NA adjacent to the display area 100A. An image may be displayed in the display area 100A.

[0109] The display layer 100 may be a light-emitting display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0110] The base layer 110 may be a member providing a base surface for disposing the circuit layer 120. The base layer 110 may have a multi-layer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, and the present disclosure is not limited thereto.

[0111] The circuit layer 120 may be located on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 through a coating or deposition process. Thereafter, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through multiple photolithography processes.

[0112] The light emitting element layer 130 may be located on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0113] The encapsulation layer 140 may be positioned on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0114] The sensor layer 200 may be located on the display layer 100. The sensor layer 200 may include a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A. The sensing region 200A may overlap with the display region 100A, and the peripheral region 200NA may overlap with the non-display region 100NA.

[0115] The sensor layer 200 can sense external input applied from the outside. The sensor layer 200 can be an integrated sensor continuously formed during the manufacturing process of the display layer 100, or an external sensor attached to the display layer 100. The sensor layer 200 can be referred to as a sensor, an input sensor layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0116] According to one or more embodiments of the present disclosure, the sensor layer 200 can sense inputs made by a passive input unit such as a user's body and inputs to an input device for generating a magnetic field having a corresponding resonant frequency. The input device can be referred to as a pen, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance (EMR) pen.

[0117] Figure 5 is a view illustrating the operation of the electronic device 1000 according to one or more embodiments of the present disclosure.

[0118] refer to Figure 5 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power supply circuit 1000P.

[0119] The sensor layer 200 can sense a first input 2000 or a second input 3000 applied thereto from the outside. Each of the first input 2000 and the second input 3000 can change the capacitance of the sensor layer 200 or induce a current in the sensor layer 200. For example, the first input 2000 can be made by a passive input unit such as the user's body. The second input 3000 can be made by a pen PN or a radio frequency integrated circuit (RFIC) tag. For example, the pen PN can be a passive pen or an active pen.

[0120] According to one or more embodiments of the present disclosure, the pen PN may be a device for generating a magnetic field having a corresponding resonant frequency. The pen PN may be configured to transmit an output signal via an EMR scheme. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an EMR pen.

[0121] The pen PN may include an RLC resonant circuit. The RLC resonant circuit may include an inductor L and a capacitor C. According to one or more embodiments of the present disclosure, the RLC resonant circuit may be a variable resonant circuit that varies the resonant frequency. In this case, the inductor L may be a variable inductor, and / or the capacitor C may be a variable capacitor, but the present disclosure is not particularly limited thereto.

[0122] The inductor L generates a current through a magnetic field formed in the electronic device 1000 (e.g., the sensor layer 200). However, the present disclosure is not particularly limited thereto. For example, when the pen PN operates in an active type, the pen PN can generate a current even when no magnetic field is provided from the outside. The generated current is transmitted to the capacitor C. The capacitor C charges the current received from the inductor L and discharges the charged current to the inductor L. Thereafter, the inductor L can discharge the magnetic field having a resonant frequency. The induced current can flow through the sensor layer 200 by the magnetic field discharged from the pen PN, and the induced current can be transmitted to the sensor driver 200C while being used as a received signal (or sensing signal, signal).

[0123] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0124] The display driver 100C can control the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals may include various signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, and a data enable signal.

[0125] The sensor driver 200C can control the sensor layer 200. The sensor driver 200C can receive a control signal from the main driver 1000C. The control signal may include a clock signal of the sensor driver 200C. In addition, the control signal may also include a mode determination signal for determining a driving mode of the sensor driver 200C and the sensor layer 200.

[0126] The sensor driver 200C may be integrated in the form of an integrated circuit (IC) and may be electrically connected to the sensor layer 200. For example, the sensor driver 200C may be directly mounted in a corresponding area of the display panel, or may be mounted on a separate printed circuit board through a chip on film (COF) scheme so that the sensor driver 200C may be electrically connected to the sensor layer 200.

[0127] The sensor driver 200C and the sensor layer 200 can optionally operate in a first mode or a second mode. For example, the first mode can be a mode for sensing a touch input such as the first input 2000. The second mode can be a mode for sensing a pen input such as the second input 3000. The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0128] The switching between the first mode and the second mode can be performed in various switching manners. For example, the sensor driver 200C and the sensor layer 200 can operate in the first mode and the second mode in a time-division scheme to sense the first input 2000 and the second input 3000. Optionally, the switching between the first mode and the second mode can be performed by the user's selection or the user's corresponding behavior (or input). Optionally, by activating or deactivating the specification application, any one of the first mode and the second mode can be activated or disabled or switched to the remaining mode among the first mode and the second mode. Optionally, while operating alternately in the first mode and the second mode, when the first input 2000 is sensed, the sensor driver 200C and the sensor layer 200 can remain in the first mode, or when the second input 3000 is sensed, the sensor driver 200C and the sensor layer 200 can remain in the second mode.

[0129] The sensor driver 200C can calculate information about the coordinates of the input based on the signal received from the sensor layer 200 and can provide a coordinate signal containing the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input in response to the coordinate signal. For example, the main driver 1000C can operate the display driver 100C to display a new application image on the display layer 100.

[0130] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., a voltage of ELVSS), a second driving voltage (e.g., a voltage of ELVDD), or an initialization voltage.

[0131] Figure 6A is a cross-sectional view of a display panel DP according to one or more embodiments of the present disclosure.

[0132] refer to Figure 6A , at least one buffer layer BFL is formed on the top surface of the base layer 110 (as used herein, "formed on" or "located on" may mean "above"). The buffer layer BFL may improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL may be formed in multiple layers. Optionally, the display layer 100 may further include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0133] The semiconductor patterns SC, AL, DR, and SCL may be located on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL may include polysilicon. However, the present disclosure is not limited thereto, and the semiconductor patterns SC, AL, DR, and SCL may include amorphous silicon, low-temperature polysilicon, or oxide semiconductor.

[0134] Figure 6A The semiconductor patterns SC, AL, DR, and SCL are only partially shown, and the semiconductor patterns SC, AL, DR, and SCL are also located in another region. The semiconductor patterns SC, AL, DR, and SCL can be arranged across pixels in a corresponding pattern. Depending on the doping state, the semiconductor patterns SC, AL, DR, and SCL can have different electrical properties. The semiconductor patterns SC, AL, DR, and SCL may include a first region SC, DR, and SCL having higher conductivity and a second region AL having lower conductivity. The first region SC, DR, and SCL may be doped with N-type dopants or P-type dopants. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region AL may be an undoped region or a region doped at a lower concentration than the first regions SC, DR, and SCL.

[0135] The first regions SC, DR, and SCL may have a higher conductivity than the second region AL and may be substantially used as electrodes or signal lines. The second region AL may substantially correspond to the active region AL (or channel) of the transistor 100PC. In other words, the first portion (see reference numeral AL) of the semiconductor patterns SC, AL, DR, and SCL may be the active region AL of the transistor 100PC, and the second portion (see reference numeral SCL) of the semiconductor patterns SC, AL, DR, and SCL may be the source region SC or the drain region DR of the transistor 100PC. The third portion (see reference numeral SCL) of the semiconductor patterns SC, AL, DR, and SCL may be a connection electrode or a connection signal line SCL.

[0136] Each of the pixels may have an equivalent circuit including a plurality of transistors, at least one capacitor, and at least one light emitting element, and the equivalent circuit of the pixel may be modified in various forms. Figure 6A By way of example, it is shown that the pixel includes one transistor 100PC and one light emitting element 100PE.

[0137] The source region SC, active region AL, and drain region DR of the transistor 100PC may be formed of semiconductor patterns SC, AL, DR, and SCL. When viewed in a cross-sectional view, the source region SC and the drain region DR may extend from the active region AL in opposite directions to each other. Figure 6A A portion of a connection signal line SCL formed of the semiconductor patterns SC, AL, DR, and SCL is shown. In one or more embodiments, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC when viewed in a plan view.

[0138] The first insulating layer 10 may be located on the buffer layer BFL. The first insulating layer 10 may be a common layer and may overlap with a plurality of pixels to cover the semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layer of the circuit layer 120 to be described below may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The inorganic layer may include, but is not limited to, at least one of the above materials.

[0139] The gate GT of the transistor 100PC is located on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT overlaps with the active area AL. The gate GT may be used as a mask in a process for doping or reducing the semiconductor patterns SC, AL, DR, and SCL.

[0140] The second insulating layer 20 may be located on the first insulating layer 10 to cover the gate electrode GT. The second insulating layer 20 may overlap with the pixel in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single layer or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. The second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0141] The third insulating layer 30 may be located on the second insulating layer 20. The third insulating layer 30 may have a single layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0142] The first connection electrode CNE1 may be located on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 formed through the first, second, and third insulating layers 10, 20, and 30.

[0143] The fourth insulating layer 40 may be located on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be located on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0144] The second connection electrode CNE2 may be located on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 formed through the fourth insulating layer 40 and the fifth insulating layer 50.

[0145] The sixth insulating layer 60 may be located on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0146] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. The following description will describe the light-emitting element 100PE as an organic light-emitting element by way of example, but the present disclosure is not particularly limited thereto.

[0147] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE.

[0148] The first electrode AE may be positioned on the sixth insulating layer 60. The first electrode AE may be connected to the second connection electrode CNE2 through a contact hole CNT-3 formed through the sixth insulating layer 60.

[0149] The pixel defining layer 70 may be located on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0150] The first display unit DA1-F (see Figure 1A ) may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. According to one or more embodiments, the light emitting region PXA is defined to correspond to a portion of the first electrode AE exposed by the opening 70-OP.

[0151] The light emitting layer EL may be located on the first electrode AE. The light emitting layer EL may be located in a region defined by the opening 70-OP. Figure 6A The light emitting layer EL is shown to be located in the opening 70 -OP, but the present disclosure is not limited thereto. For example, the light emitting layer EL may extend to cover a portion of the top surface of the pixel defining layer 70 defining the opening 70 -OP and the side surfaces of the pixel defining layer 70 .

[0152] According to one or more embodiments of the present disclosure, the light-emitting layer EL may be formed separately from the pixels. When the light-emitting layer EL is formed separately from the pixels, each of the light-emitting layers EL may emit light of at least one of blue, red, and green. However, the present disclosure is not limited thereto. The light-emitting layer EL may be integral and may be included in multiple pixels. In this case, the light-emitting layer EL may provide blue light or white light.

[0153] The second electrode CE may be located on the light emitting layer EL. The second electrode CE may have an integral form and may be commonly located in a plurality of pixels.

[0154] According to one or more embodiments of the present disclosure, a hole control layer may be located in the first electrode AE and the light-emitting layer EL. The hole control layer may be located in both the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may further include a hole transfer layer and a hole injection layer. An electron control layer may be interposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transfer layer and an electron injection layer. The hole control layer and the electron control layer may be formed together in multiple pixels using an open mask or an inkjet process.

[0155] The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, and the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but the present disclosure is not limited thereto.

[0156] The sensor layer 200 may include a base layer 201 , a first conductive layer 202 , an intermediate insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0157] The base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide-based resin. The base layer 201 may have a single-layer structure or a multi-layer structure including layers stacked in the third direction DR3. According to one or more embodiments of the present disclosure, the sensor layer 200 may not include the base layer 201.

[0158] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure including layers stacked in the third direction DR3 .

[0159] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0160] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of, for example, titanium / aluminum / titanium. The multi-layer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0161] According to one or more embodiments of the present disclosure, the thickness of the first conductive layer 202 may be greater than or equal to the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of the components (e.g., electrodes, sensing patterns, or bridge patterns) included in the first conductive layer 202 may be reduced. In addition, because the first conductive layer 202 is located below the second conductive layer 204, even if the thickness of the first conductive layer 202 increases, the probability that the components included in the first conductive layer 202 are observed by external light reflection may be lower than the probability that the components included in the second conductive layer 204 are observed by external light reflection.

[0162] At least one of the intermediate insulating layer 203 and the capping insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0163] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0164] Although the above description has been made of providing a total of two conductive layers of the first conductive layer 202 and the second conductive layer 204, the present disclosure is not limited thereto. For example, the sensor layer 200 may include at least three conductive layers.

[0165] Figure 6B is a cross-sectional view illustrating a sensor layer 200 according to one or more embodiments of the present disclosure.

[0166] refer to Figure 6A and Figure 6B , a second width 204wt of the second mesh line MS2 included in the second conductive layer 204 may be equal to or greater than a first width 202wt of the first mesh line MS1 included in the first conductive layer 202. When the user USR observes the first mesh line MS1 and the second mesh line MS2 from the side, because the first mesh line MS1 has a smaller width than the second mesh line MS2, the probability of the first mesh line MS1 being observed by the user USR may be reduced.

[0167] Each of the first and second mesh lines MS1 and MS2 may include a first metal layer M1 and a second metal layer M2 interposed between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, the present disclosure is not particularly limited thereto.

[0168] According to one or more embodiments of the present disclosure, the first thickness TK1 of the second metal layer M2 of the first grid line MS1 may be substantially equal to the second thickness TK2 of the second metal layer M2 of the second grid line MS2, but the present disclosure is not particularly limited thereto. For example, the first thickness TK1 may be thicker than the second thickness TK2. Alternatively, the second thickness TK2 may be thicker than the first thickness TK1. According to one or more embodiments of the present disclosure, each of the first thickness TK1 and the second thickness TK2 may be 1000 angstroms or greater, for example, 6000 angstroms.

[0169] Figure 7 is a plan view illustrating a sensor layer 200 according to one or more embodiments of the present disclosure. Figure 8 is an enlarged plan view illustrating a sensing unit SU according to one or more embodiments of the present disclosure. Figure 9A is a plan view illustrating a first conductive layer 202SU of a sensing unit SU according to one or more embodiments of the present disclosure. Figure 9B is a plan view illustrating a second conductive layer 204SU of a sensing unit SU according to one or more embodiments of the present disclosure. Figure 9C are respectively along Figure 9A and Figure 9B FIG. 2 is a cross-sectional view of the sensor layer 200 according to one or more embodiments of the present disclosure, taken along line II′.

[0170] refer to Figure 7 , the sensor layer 200 may include a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A.

[0171] The sensor layer 200 may include a plurality of first electrode groups 210G, a plurality of second electrode groups 220G, a plurality of third electrode groups 230G, and a fourth electrode group 240G located in the sensing region 200A.

[0172] The first electrode groups 210G may intersect the second electrode groups 220G, respectively. The first electrode groups 210G may extend in the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1. The second electrode groups 220G may extend in the first direction DR1 and may be arranged to be spaced apart from each other in the second direction DR2. The sensing unit SU of the sensor layer 200 may be an area where one first electrode group 210G intersects one second electrode group 220G.

[0173] like Figure 7 As shown in FIG, ten first electrode groups 210G and five second electrode groups 220G are provided, and 50 sensing units SU are provided, but the number of the first electrode groups 210G and the number of the second electrode groups 220G are not limited thereto.

[0174] According to one or more embodiments of the present disclosure, each of the second electrode groups 220G may include a first separator electrode 220-D1 and a second separator electrode 220-D2. The first separator electrode 220-D1 and the second separator electrode 220-D2 may be spaced apart from each other in a first direction DR1. Each of the first separator electrode 220-D1 and the second separator electrode 220-D2 may extend in the first direction DR1. The first separator electrode 220-D1 and the second separator electrode 220-D2 included in one second electrode group 220G may sense along the same axis (e.g., an axis extending in the first direction DR1).

[0175] refer to Figure 7 and Figure 8 Each of the first electrode groups 210G may include first separation electrodes 210dv1 and 210dv2. The first separation electrodes 210dv1 and 210dv2 may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1. The first separation electrodes 210dv1 and 210dv2 may have a symmetrical shape about a line extending in the second direction DR2.

[0176] Each of the first and second separation electrodes 220-D1 and 220-D2 may include second unit separation electrodes 220dv1 and 220dv2. The second unit separation electrodes 220dv1 and 220dv2 extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. The second unit separation electrodes 220dv1 and 220dv2 may have linearly symmetrical shapes about a line extending in the first direction DR1.

[0177] refer to Figure 8 、 Figure 9A 、 Figure 9B and Figure 9C , each of the second unit separation electrodes 220dv1 and 220dv2 may include a sensing pattern 221 and a bridge pattern 222. The sensing pattern 221 and the bridge pattern 222 are located in different layers, and the sensing pattern 221 and the bridge pattern 222 may be electrically connected to each other through the first contact portion CNa. For example, the bridge pattern 222 may be included in the first conductive layer 202SU, and the sensing pattern 221 and the first separation electrodes 210dv1 and 210dv2 may be included in the second conductive layer 204SU. The first conductive layer 202SU may be included in Figure 6A The first conductive layer 202, and the second conductive layer 204SU may include Figure 6A in the second conductive layer 204 .

[0178] refer to Figure 7, the third electrode group 230G can be arranged to be spaced apart from each other in the first direction DR1. According to one or more embodiments of the present disclosure, the third electrode group 230G may include a plurality of first auxiliary electrodes 230S electrically connected to each other. The number of first auxiliary electrodes 230S included in each of the third electrode groups 230G can be modified in various ways. For example, as the number of first auxiliary electrodes 230S included in each of the third electrode groups 230G increases, the resistance of each of the third electrode groups 230G decreases, power efficiency can be improved, and sensing sensitivity can be improved. Conversely, as the number of first auxiliary electrodes 230S included in each of the third electrode groups 230G decreases, the loop coil pattern formed by using the third electrode group 230G can be implemented in more forms.

[0179] although Figure 7 Although one third electrode group 230G is shown to include two first auxiliary electrodes 230S, the present disclosure is not limited thereto. The first auxiliary electrodes 230S may be positioned one-to-one with the first electrode group 210G. Therefore, one sensing unit SU may include a portion of one first auxiliary electrode 230S.

[0180] A coupling capacitor may be defined between a first electrode group 210G and a first auxiliary electrode 230S. In this case, the induced current generated during pen sensing can be transferred from the first auxiliary electrode 230S to the first electrode group 210G via the coupling capacitor. In other words, the first auxiliary electrode 230S can be used to supplement the signal transmitted from the first electrode group 210G to the sensor driver 200C. Therefore, an improved or maximum effect can be achieved when the signal sensed to the first auxiliary electrode 230S is in phase with the signal sensed to the first electrode group 210G. Therefore, the center of each of the first electrode groups 210G in the second direction DR2 can be aligned with the center of each of the first auxiliary electrodes 230S in the second direction DR2. Furthermore, the center of each of the first electrode groups 210G in the first direction DR1 can be aligned with the center of each of the first auxiliary electrodes 230S in the first direction DR1.

[0181] According to one or more embodiments of the present disclosure, since one third electrode group 230G includes two first auxiliary electrodes 230S, one third electrode group 230G may correspond to (or overlap) two first electrode groups 210G. Therefore, the number of first electrode groups 210G included in the sensor layer 200 may be greater than the number of third electrode groups 230G. For example, the number of first electrode groups 210G may be equal to the product of the number of third electrode groups 230G included in the sensor layer 200 and the number of first auxiliary electrodes 230S included in each of the third electrode groups 230G. Figure 7, the number of the first electrode groups 210G is “10”, the number of the third electrode groups 230G is “5”, and the number of the first auxiliary electrodes 230S included in each of the third electrode groups 230G may be “2”.

[0182] The fourth electrode group 240G may include a plurality of second auxiliary electrodes 240S arranged in the second direction DR2. Each of the second auxiliary electrodes 240S may extend in the first direction DR1. According to one or more embodiments of the present disclosure, the second auxiliary electrodes 240S may be electrically connected to each other.

[0183] A coupling capacitor may be defined between one second electrode group 220G and one second auxiliary electrode 240S. In this case, the induced current generated during pen sensing can be transmitted from the second auxiliary electrode 240S to the second electrode group 220G via the coupling capacitor. In other words, the second auxiliary electrode 240S can be used to supplement the signal transmitted from the second electrode group 220G to the sensor driver 200C. Therefore, when the signal sensed by the second auxiliary electrode 240S is in phase with the signal sensed by the second electrode group 220G, an improved or maximum effect can be achieved. Therefore, the center of each of the second electrode groups 220G in the first direction DR1 can be aligned with the center of each of the second auxiliary electrodes 240S in the first direction DR1. Furthermore, the center of each of the second electrode groups 220G in the second direction DR2 can be aligned with the center of each of the second auxiliary electrodes 240S in the second direction DR2.

[0184] refer to Figure 7 、 Figure 9A and Figure 9B Each of the first auxiliary electrodes 230S included in the third electrode group 230G may include a (3-1)th pattern 231 and a (3-2)th pattern 232. The (3-1)th pattern 231 and the (3-2)th pattern 232 are located in different layers and may be electrically connected to each other through the second contact portion CNb. The (3-1)th pattern 231 may be included in the first conductive layer 202SU, and the (3-2)th pattern 232 may be included in the second conductive layer 204SU.

[0185] According to one or more embodiments of the present disclosure, a portion of the (3-1)th pattern 231 may overlap a portion of each of the first separation electrodes 210dv1 and 210dv2. Thus, a coupling capacitor may be provided (or formed) between the first electrode group 210G and the third electrode group 230G.

[0186] refer to Figure 7 、 Figure 9A and Figure 9BEach of the second auxiliary electrodes 240S included in the fourth electrode group 240G may include a (4-1)th pattern 241, a (4-2)th pattern 242, and a (4-3)th pattern 243. The (4-2)th pattern 242 and the (4-3)th pattern 243 may be located in the same layer, and the (4-1)th pattern 241 may be located in a different layer from the (4-2)th pattern 242 and the (4-3)th pattern 243. The (4-1)th pattern 241 and the (4-2)th pattern 242 may be electrically connected to each other through a third contact portion CNc, and the (4-1)th pattern 241 and the (4-3)th pattern 243 may be electrically connected to each other through a fourth contact portion CNd. The (4-2)th pattern 242 and the (4-3)th pattern 243 may be included in the first conductive layer 202SU, and the (4-1)th pattern 241 may be included in the second conductive layer 204SU.

[0187] According to one or more embodiments of the present disclosure, a portion of the (4-2) pattern 242 may overlap with the sensing pattern 221 of each of the second unit separation electrodes 220dv1 and 220dv2. Thus, a coupling capacitor may be defined (or provided or formed) between the second electrode group 220G and the fourth electrode group 240G.

[0188] According to one or more embodiments of the present disclosure, the first conductive layer 202SU may further include dummy patterns DMP. Each of the dummy patterns DMP may be electrically floating or electrically grounded. According to one or more embodiments of the present disclosure, the dummy patterns DMP may be omitted. Because the dummy patterns DMP are located in an empty space, the probability of the pattern being observed by external light reflection can be reduced.

[0189] The sensor layer 200 may further include a plurality of first pads PD1 connected one-to-one to a plurality of first traces 210t located in the peripheral area 200NA. The first traces 210t may be electrically connected to the first electrode groups 210G in a one-to-one correspondence. In other words, one first trace 210t may be connected to one first electrode group 210G.

[0190] The sensor layer 200 may further include a plurality of second traces 220t at least partially overlapping the sensing area 200A and a plurality of second pads PD2 connected to the plurality of second traces 220t in a one-to-one correspondence. The second traces 220t may overlap with the first electrode group 210G and the second electrode group 220G, or may be insulated from the first electrode group 210G and the second electrode group 220G while crossing the first electrode group 210G and the second electrode group 220G. Therefore, the area of the peripheral area 200NA can be reduced. Therefore, the size of the electronic device 1000 (see Figure 1A) on the front surface of the area occupied by the peripheral area 200NA, and a narrower frame can be achieved.

[0191] The first traces 210t can be electrically connected to the first electrode groups 210G in a one-to-one correspondence. The two first separator electrodes 210dv1 and 210dv2 included in one first electrode group 210G can be connected to one of the first traces 210t. Each of the first traces 210t can include a plurality of branches to connect to the two first separator electrodes 210dv1 and 210dv2. According to one or more embodiments of the present disclosure, the two first separator electrodes 210dv1 and 210dv2 can be connected to each other in the sensing area 200A.

[0192] The second traces 220t can be electrically connected to the second electrode group 220G in a 2:1 correspondence. Since the second traces 220t are electrically connected to the second electrode group 220G in a 2:1 correspondence, the number of second traces 220t can be twice the number of second electrode groups 220G. In other words, two second traces 220t1 and 220t2 can be electrically connected to one second electrode group 220G.

[0193] One of the second traces 220t1 and 220t2 may be referred to as a (2-1)th trace 220t1, and the remaining one of the second traces 220t1 and 220t2 may be referred to as a (2-2)th trace 220t2. The (2-1)th trace 220t1 may be electrically connected to the first partition electrode 220-D1, and the (2-2)th trace 220t2 may be electrically connected to the second partition electrode 220-D2.

[0194] At least a portion of each of the (2-1)th trace 220t1 and the (2-2)th trace 220t2 may be aligned with the display area 100A (see Figure 4 For example, when viewed in a plan view, the shape or area of the display region 100A may be similar to the shape or area of the sensing region 200A.

[0195] According to one or more embodiments of the present disclosure, the (2-1)th trace 220t1 and the (2-2)th trace 220t2 electrically connected to one second electrode group 220G may have substantially the same length in the second direction DR2. For example, a portion of the (2-1)th trace 220t1 overlapping the sensing region 200A may have a length substantially equal to a portion of the (2-2)th trace 220t2 overlapping the sensing region 200A.

[0196] According to one or more embodiments of the present disclosure, since the second trace 220t overlaps the sensing area 200A, the second trace 220t may be more widely distributed in the sensing area 200A than in the peripheral area 200NA. Figure 5 ) and the second trace 220t may vary according to the position of the pen PN.

[0197] According to one or more embodiments of the present disclosure, the sensor driver 200C (refer to Figure 5 ) Before differentially sensing signals received from two different electrode groups, a primary differential sensing operation can be performed on the signal provided from the (2-1)th trace 220t1 and the signal provided from the (2-2)th trace 220t2. The mutual inductance of the (2-1)th trace 220t1 and the (2-2)th trace 220t2, which affects coordinate distortion, can be eliminated by the primary differential sensing operation. Therefore, the accuracy of the coordinates sensed by the sensor layer 200 and the sensor driver 200C can be improved.

[0198] The (2-1)th trace 220t1 may be connected to a region of the first partition electrode 220-D1 adjacent to the second partition electrode 220-D2, and the (2-2)th trace 220t2 may be connected to a region of the second partition electrode 220-D2 adjacent to the first partition electrode 220-D1. For example, each of the (2-1)th trace 220t1 and the (2-2)th trace 220t2 may extend from a region adjacent to the gap between the first partition electrode 220-D1 and the second partition electrode 220-D2.

[0199] The sensor layer 200 may further include a third trace 230rt1 located in the peripheral area 200NA, a third pad PD3 connected to the third trace 230rt1 in a one-to-one correspondence, a fourth trace 240t, a fourth pad PD4 connected to the fourth trace 240t, a fifth trace 230rt2, and a fifth pad PD5 connected to one end portion and an opposite end portion opposite to the one end portion of the fifth trace 230rt2.

[0200] The third traces 230rt1 may be connected to the third electrode groups 230G in a one-to-one correspondence. In other words, the number of the third traces 230rt1 may correspond to the number of the third electrode groups 230G. Figure 7 , five third traces 230rt1 are shown.

[0201] According to one or more embodiments of the present disclosure, the third trace 230rt1 and the third pad PD3 may be omitted, or the charging driving mode for charging the pen may be omitted. In this case, the sensor layer 200 can sense input made by an active pen that can emit a magnetic field even if a magnetic field is not provided from the sensor layer 200.

[0202] The fourth trace 240t may be electrically connected to the second auxiliary electrode 240S.

[0203] The fifth trace 230rt2 may be electrically connected to at least one of the first auxiliary electrodes 230S. According to one or more embodiments of the present disclosure, the fifth trace 230rt2 may be electrically connected to all of the first auxiliary electrodes 230S. In other words, the fifth trace 230rt2 may be electrically connected to all of the third electrode group 230G. The fifth trace 230rt2 may include a first line portion 231t extending in the first direction DR1 and electrically connected to the third electrode group 230G, a second line portion 232t extending from a first end portion of the first line portion 231t in the second direction DR2, and a third line portion 233t extending from a second end portion of the first line portion 231t in the second direction DR2.

[0204] According to one or more embodiments of the present disclosure, each of the resistance of the second wire portion 232t and the resistance of the third wire portion 233t can be substantially equal to the resistance of one of the third electrode groups 230G in the third electrode group 230G. Therefore, the second wire portion 232t and the third wire portion 233t can function as the third electrode group 230G, thereby producing the same effect as when the third electrode group 230G is located in the peripheral area 200NA. For example, any one of the second wire portion 232t and the third wire portion 233t and any one of the third electrode groups 230G can form a coil. Therefore, even a pen located in an area adjacent to the peripheral area 200NA can be fully charged through a loop including the second wire portion 232t or the third wire portion 233t.

[0205] According to one or more embodiments of the present disclosure, in order to adjust the resistance of the second line portion 232t and the resistance of the third line portion 233t, the width of each of the second line portion 232t and the third line portion 233t in the first direction DR1 can be adjusted. However, this is provided for exemplary purposes only. For example, the first line portion 231t, the second line portion 232t, and the third line portion 233t can have substantially the same width.

[0206] refer to Figure 9A and Figure 9B, the area occupied by the components included in the first electrode group 210G and the second electrode group 220G in the second conductive layer 204SU in one sensing unit SU may be wider than the area occupied by the components included in the third electrode group 230G and the fourth electrode group 240G. Figure 5 ) can increase as the distance of the first input 2000 decreases. Therefore, the capacitance of the first input 2000 (see Figure 5 ) components can occupy the same space as the electronic device 1000 (see Figure 1A ) simultaneously positioning a larger area in a layer adjacent to the surface of the ). Therefore, the touch performance can be improved.

[0207] Figures 7 to 9C The structure in which each of the first electrode group 210G, the second electrode group 220G, the third electrode group 230G, and the fourth electrode group 240G is separated and respectively located in two conductive layers 202SU and 204SU is shown, but the present disclosure is not particularly limited thereto. For example, the first electrode group 210G, the second electrode group 220G, the third electrode group 230G, and the fourth electrode group 240G may be separated and arranged in three conductive layers or in four conductive layers.

[0208] According to one or more embodiments of the present disclosure, the third electrode group 230G that receives a signal in the charging driving mode may be included in a third conductive layer located below the first conductive layer 202SU and the second conductive layer 204SU. For example, the third conductive layer may be provided below the base layer 201. The third conductive layer may be located between the base layer 201 and the display layer 100 (see FIG. Figure 6A ), may be located below the display layer 100, or may be included in the display layer 100.

[0209] The first electrode group 210G, the second electrode group 220G, and the fourth electrode group 240G may be included in the first conductive layer 202SU and the second conductive layer 204SU. For example, when the third electrode group 230G is implemented in the form of a separate conductive layer (such as the third conductive layer), the shape of the third electrode group 230G can be designed more freely. For example, the third electrode group 230G can be arranged in a form including a plurality of coils. In addition, the third electrode group 230G can be arranged more densely using the third conductive layer. In this case, the pen sensing sensitivity can be improved. According to one or more embodiments of the present disclosure, the third conductive layer may include the fourth electrode group 240G instead of the third electrode group 230G.

[0210] Figure 10A is a plan view illustrating a first conductive layer 202SUa of a sensing unit according to one or more embodiments of the present disclosure. Figure 10Bis a plan view illustrating a second conductive layer 204SUa of a sensing unit according to one or more embodiments of the present disclosure. Figure 10C are respectively along Figure 10A and Figure 10B FIG. 2 is a cross-sectional view of the sensor layer 200 taken along line II-II′.

[0211] refer to Figure 8 、 Figure 10A 、 Figure 10B and Figure 10C , each of the first electrode groups 210G may include a plurality of first sensing patterns 211 and a plurality of first bridge patterns 212. The first sensing patterns 211 are spaced apart from each other in the second direction DR2, and the first bridge patterns 212 may extend in the second direction DR2 and may be electrically connected to the first sensing patterns 211 through the first contact portions CNa1. Figure 10A and Figure 10B Two adjacent first sensing patterns 211 are shown to be electrically connected to each other through two first bridge patterns 212, but the present disclosure is not limited thereto. For example, two adjacent first sensing patterns 211 may be electrically connected to each other through one first bridge pattern 212, or may be electrically connected to each other through three or more first bridge patterns 212.

[0212] Figure 10B The first separating electrode 220-D1 is shown among the first separating electrodes 220-D1 and the second separating electrodes 220-D2. First sensing patterns 211 adjacent to each other in the second direction DR2 may be spaced apart from each other, with the first separating electrode 220-D1 interposed between the first sensing patterns 211. According to one or more embodiments of the present disclosure, the first sensing patterns 211, the first separating electrode 220-D1, and the second separating electrode 220-D2 may be included in the second conductive layer 204SUa, and the first bridge pattern 212 may be included in the first conductive layer 202SUa. The first bridge pattern 212 may be insulated from and cross the first separating electrode 220-D1 or the second separating electrode 220-D2 while overlapping the first separating electrode 220-D1 or the second separating electrode 220-D2.

[0213] Each of the first auxiliary electrodes 230S included in the third electrode group 230G may extend in the second direction DR2. The first auxiliary electrodes 230S may be included in the first conductive layer 202SUa. One or more holes may be defined in each of the first auxiliary electrodes 230S. One first bridge pattern 212 may be located in one hole. Therefore, the first bridge pattern 212 may be electrically insulated from the first auxiliary electrodes 230S.

[0214] Each of the second auxiliary electrodes 240S included in the fourth electrode group 240G may include a plurality of second sensing patterns 241a and a plurality of second bridge patterns 242a. The second sensing patterns 241a are spaced apart in the first direction DR1, and the second bridge patterns 242a may extend in the first direction DR1 to be electrically connected to the second sensing patterns 241a through the second contact portions CNb1.

[0215] although Figure 10A and Figure 10B The two adjacent second sensing patterns 241a are shown to be electrically connected to each other through two second bridge patterns 242a, but the present disclosure is not limited thereto. For example, in one or more other embodiments, the two adjacent second sensing patterns 241a may be electrically connected to each other through one second bridge pattern 242a, or may be electrically connected to each other through three or more second bridge patterns 242a.

[0216] According to one or more embodiments of the present disclosure, the second sensing pattern 241a and the first auxiliary electrode 230S may be included in the first conductive layer 202SUa, and the second bridge pattern 242a may be included in the second conductive layer 204SUa. The second bridge pattern 242a may be insulated from the first auxiliary electrode 230S overlapping with the second bridge pattern 242a, while crossing the first auxiliary electrode 230S overlapping with the second bridge pattern 242a.

[0217] refer to Figure 10A and Figure 10B , in the second conductive layer 204SUa in one sensing unit SU, the area occupied by the components included in the first electrode group 210G and the second electrode group 220G may be larger than the area occupied by the components included in the third electrode group 230G and the fourth electrode group 240G. Figure 5 ) is close, the change in capacitance due to the first input 2000 can be greater. Therefore, for sensing the first input 2000 (see Figure 5 ) can be located in a relatively large area with the electronic device 1000 (see Figure 1A ). Therefore, the touch performance can be improved.

[0218] According to one or more embodiments of the present disclosure, the first conductive layer 202SUa may further include a first dummy pattern DMP1, and the second conductive layer 204SUa may further include a second dummy pattern DMP2. Each of the first dummy pattern DMP1 and the second dummy pattern DMP2 may be floating or electrically floating. Each of the first dummy pattern DMP1 and the second dummy pattern DMP2 may be separated into a plurality of conductive patterns. For example, one first dummy pattern DMP1 may include a plurality of floating dummy patterns that are separated or electrically isolated from each other.

[0219] refer to Figure 10C , the area of the first auxiliary electrode 230S and the area of the first sensing pattern 211 can be adjusted. For example, the position of the boundary between the first auxiliary electrode 230S and the first dummy pattern DMP1 and the position of the boundary between the first sensing pattern 211 and the second dummy pattern DMP2 can be adjusted. In this case, the area of the overlapping region between the first auxiliary electrode 230S and the first sensing pattern 211 can be adjusted to adjust the capacitance of the coupling capacitor C-CP between the first auxiliary electrode 230S and the first sensing pattern 211.

[0220] Figure 11A yes Figure 9A An enlarged plan view of the area AA' shown in FIG. Figure 11B yes Figure 9B An enlarged plan view of the area BB' is shown in FIG.

[0221] refer to Figure 9A 、 Figure 9B 、 Figure 11A and Figure 11B , each of the first electrode group 210G, the second electrode group 220G, the third electrode group 230G, the fourth electrode group 240G and the dummy pattern DMP may have a grid structure. Each of the grid structures may include a plurality of grid lines. Each of the plurality of grid lines has a form extending in a corresponding direction and may be connected to each other. The form may have various forms, such as a straight line, a line with a protrusion or an uneven line. An opening in which the grid structure is not located may be defined (set or formed) in each of the first electrode group 210G, the second electrode group 220G, the third electrode group 230G, the fourth electrode group 240G and the dummy pattern DMP.

[0222] Figure 11A and Figure 11B The grid structure includes grid lines extending in a first crossing direction CDR1 crossing the first direction DR1 and the second direction DR2 and grid lines extending in a second crossing direction CDR2 crossing the first crossing direction CDR1. However, the extending directions of the grid lines constituting the grid structure are not particularly limited to Figure 11A and Figure 11B For example, the grid structure may include only grid lines extending in the first direction DR1 and the second direction DR2, or may include grid lines extending in the first direction DR1, the second direction DR2, the first cross direction CDR1, and the second cross direction CDR2. In other words, the grid structure may be changed in various forms.

[0223] Figure 12 is a plan view of a sensor layer 200-1 according to one or more embodiments of the present disclosure. Figure 12 In the description, with reference Figure 7 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0224] refer to Figure 12 , the sensor layer 200 - 1 may include a plurality of first electrode groups 210G, a plurality of second electrode groups 220G, a plurality of third electrode groups 230G, and a plurality of fourth electrode groups 240G- 1 located in the sensing region 200A.

[0225] Figure 12 The fourth electrode group 240G-1 is shown to include two electrode groups facing each other in the first direction DR1. The fourth electrode group 240G-1 may include a (4-1)th electrode group 240G-1a overlapping the first separator electrode 220-D1 of the second electrode group 220G and a (4-2)th electrode group 240G-1b overlapping the second separator electrode 220-D2 of the second electrode group 220G. The (4-1)th electrode group 240G-1a includes a plurality of (2-1)th auxiliary electrodes 240S1 arranged in the second direction DR2, and the (4-2)th electrode group 240G-1b may include a plurality of (2-2)th auxiliary electrodes 240S2 arranged in the second direction DR2.

[0226] The sensor layer 200-1 may further include fourth traces 240t-1 and 240t-2 located in the peripheral area 200NA. All of the (2-1)th auxiliary electrodes 240S1 included in the (4-1)th electrode group 240G-1a are electrically connected to the (4-1)th trace 240t-1, and all of the (2-2)th auxiliary electrodes 240S2 included in the (4-2)th electrode group 240G-1b may be electrically connected to the (4-2)th trace 240t-2.

[0227] According to one or more embodiments of the present disclosure, the wiring directions of the first separator electrode 220-D1 and the (2-1)th auxiliary electrode 240S1 that overlap each other may be different from each other. In addition, the wiring directions of the second separator electrode 220-D2 and the (2-2)th auxiliary electrode 240S2 that overlap each other may be different from each other. Different wiring directions mean that the connection positions of the electrodes and the traces are different from each other.

[0228] Figure 13A FIG. 2 is a diagram showing a sensor driver 200C (see FIG. 200C ) according to one or more embodiments of the present disclosure. Figure 5 )'s view. Figure 13B FIG. 2 is a diagram showing a sensor driver 200C (see FIG. 200C ) according to one or more embodiments of the present disclosure. Figure 5 )'s view.

[0229] refer to Figure 5 and Figure 13A , the sensor driver 200C may be selectively driven in any one of the first operation mode DMD1 , the second operation mode DMD2 , and the third operation mode DMD3 .

[0230] The first operating mode DMD1 may be referred to as a touch and pen standby mode, the second operating mode DMD2 may be referred to as a touch active and pen standby mode, and the third operating mode DMD3 may be referred to as a pen active mode. The first operating mode DMD1 may be a mode for waiting for a first input 2000 and a second input 3000. The second operating mode DMD2 may be a mode for sensing the first input 2000 and waiting for the second input 3000. The third operating mode DMD3 may be a mode for sensing the second input 3000.

[0231] According to one or more embodiments of the present disclosure, the sensor driver 200C may be initially driven in the first operating mode DMD1. When a first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (or changed) to the second operating mode DMD2. Alternatively, when a second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (or changed) to the third operating mode DMD3.

[0232] According to one or more embodiments of the present disclosure, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C may switch to the third operating mode DMD3. When the first input 2000 is released (or not sensed) in the second operating mode DMD2, the sensor driver 200C may switch to the first operating mode DMD1. When the second input 3000 is released (or not sensed) in the third operating mode DMD3, the sensor driver 200C may switch to the first operating mode DMD1.

[0233] refer to Figure 5 、 Figure 13A and Figure 13B , operations in the first operation mode DMD1 , the second operation mode DMD2 , and the third operation mode DMD3 are shown in order of time (t).

[0234] In the first operation mode DMD1, the sensor driver 200C can be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned and driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned and driven to detect the first input 2000. Although Figure 13B It is shown that the sensor driver 200C operates in the first mode MD1 - d after the second mode MD2 - d , but the operation order of the sensor driver 200C is not limited thereto.

[0235] In the second operating mode DMD2, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 may be scanned and driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 may be scanned and driven to detect the coordinates formed by the first input 2000.

[0236] In the third operating mode DMD3, the sensor driver 200C may be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 may be scanned and driven to detect coordinates formed by the second input 3000. In the third operating mode DMD3, the sensor driver 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not detected).

[0237] Also refer to Figure 7During the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2, the third electrode group 230G and the fourth electrode group 240G may be grounded or may receive a constant voltage. Alternatively, during the first mode MD1-d and the first mode MD1, the third electrode group 230G and the fourth electrode group 240G may be floating. Alternatively, during the first mode MD1-d and the first mode MD1, the third electrode group 230G and the fourth electrode group 240G may receive a signal in phase with the signal applied to the first electrode group 210G. In this case, the introduction of touch noise can be reduced or prevented by the third electrode group 230G and the fourth electrode group 240G.

[0238] In the first operating mode DMD1 or the second mode MD2-d of the second operating mode DMD2, and the second mode MD2 of the third operating mode DMD3, one end of each of the third electrode group 230G and the fourth electrode group 240G can be floating. In addition, in the second mode MD2-d and the second mode MD2, the opposite end of each of the third electrode group 230G and the fourth electrode group 240G, which is opposite to the one end, can be grounded or floating. Therefore, due to the coupling between the first electrode group 210G and the third electrode group 230G, and due to the coupling between the second electrode group 220G and the fourth electrode group 240G, compensation of the sensing signal can be maximized.

[0239] Figure 14 is a view showing a first mode according to one or more embodiments of the present disclosure.

[0240] refer to Figure 5 、 Figure 13B and Figure 14 , the first mode MD1 - d in the first operation mode DMD1 and the first mode MD1 in the second operation mode DMD2 may include a mutual capacitance detection mode. Figure 14 1 is a diagram illustrating a mutual capacitance detection mode in the first mode MD1 - d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 .

[0241] In the mutual capacitance detection mode, the sensor driver 200C may sequentially apply a transmission signal TX to the first electrode group 210G, and may use a reception signal RX detected by the second electrode group 220G to detect the coordinates of the first input 2000. For example, the sensor driver 200C may be configured to calculate the input coordinates by sensing a change in mutual capacitance between the first electrode group 210G and the second electrode group 220G.

[0242] Figure 14FIG. 2 shows that a transmission signal TX is applied to a first electrode group 210G, and a reception signal RX is output from a second electrode group 220G. Figure 14 One first electrode group 210G to which the transmission signal TX is applied is shown in bold in The sensor driver 200C may detect the input coordinates of the first input 2000 by sensing a change in capacitance between the first electrode group 210G and the second electrode group 220G.

[0243] According to one or more embodiments of the present disclosure, at least one of the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may further include a mode for detecting self-capacitance (self-capacitance detection mode). The sensor driver 200C may be configured to output a drive signal to the first electrode group 210G and the second electrode group 220G in the self-capacitance detection mode, and to calculate the input coordinates by sensing a change in capacitance of each of the first electrode group 210G and the second electrode group 220G. The operations for outputting drive signals to the first electrode group 210G and the second electrode group 220G may be respectively operated in different timings from each other, or may overlap with each other in time.

[0244] Figure 15 is a view showing a second mode according to one or more embodiments of the present disclosure. Figure 15 is a diagram illustrating a second mode (eg, a charging driving mode) according to one or more embodiments of the present disclosure. Figure 16A is a graph illustrating a waveform of a first signal according to one or more embodiments of the present disclosure. Figure 16B is a graph illustrating a waveform of a second signal according to one or more embodiments of the present disclosure.

[0245] refer to Figure 5 、 Figure 15 、 Figure 16A and Figure 16B The second mode may include a charging driving mode. The charging driving mode may include a search-charging driving mode and a tracking-charging driving mode.

[0246] The search-charge drive mode may be a drive mode before the position of the pen is sensed. Therefore, the first signal SG1 or the second signal SG2 may be provided to all channels included in the sensor layer 200. In other words, in the search-charge drive mode, the entire area of the sensor layer 200 may be scanned. When the pen PN is sensed in the search-charge drive mode, the sensor layer 200 may be driven in the tracking-charge drive mode. For example, in the tracking-charge drive mode, the sensor driver 200C may sequentially output the first signal SG1 and the second signal SG2 to an area overlapping with the point where the pen PN is sensed (rather than the entire portion of the sensor layer 200).

[0247] In the charging drive mode, the sensor driver 200C may apply a first signal SG1 to a first pad of the third pad PD3 and the fifth pad PD5, and may apply a second signal SG2 to a second pad of the third pad PD3 and the fifth pad PD5 that is different from the first pad. The second signal SG2 may have a phase opposite to that of the first signal SG1. For example, the first signal SG1 may be a sinusoidal signal.

[0248] Because the first signal SG1 and the second signal SG2 are applied to at least two pads, the current RFS can have a current path formed from the first pad to the second pad. In addition, because the first signal SG1 and the second signal SG2 are sinusoidal signals with an anti-phase relationship, the direction of the current RFS can change periodically. According to one or more embodiments of the present disclosure, the first signal SG1 and the second signal SG2 can be square wave signals with anti-phases to each other.

[0249] When the first signal SG1 and the second signal SG2 have phases opposite to each other, the display layer 100 (see FIG. 1 ) is affected by the first signal SG1. Figure 4 ) can be offset by the noise caused by the second signal SG2. Therefore, a flicker phenomenon may not occur in the display layer 100, and the display quality of the display layer 100 may be improved.

[0250] According to one or more embodiments of the present disclosure, the first signal SG1 may be a sinusoidal signal. However, the present disclosure is not limited thereto, and the first signal SG1 may be a square wave signal. In addition, the second signal SG2 may have a corresponding constant voltage. For example, the second signal SG2 may be a ground voltage. In other words, the pad for receiving the second signal SG2 may be considered to be grounded. Even in this case, the current RFS may flow from the first pad to the second pad. In addition, even if the second pad is grounded, the direction of the current RFS may change periodically because the first signal SG1 is a sinusoidal or square wave signal.

[0251] Figure 15The diagram shows a first signal SG1 being applied to a third pad PD3 connected to a third trace 230rt1, and a second signal SG2 being applied to a fifth pad PD5 connected to a fifth trace 230rt2. A current RFS can flow through a current path defined by the fifth pad PD5, the fifth trace 230rt2 connected to the fifth pad PD5, the third electrode group 230G, a portion of the third trace 230rt1 connected to the third pad PD3, and the third pad PD3. The current path can have a coil shape. Therefore, in the second charging drive mode, the resonant circuit of the pen PN can be charged through the current path.

[0252] According to the present disclosure, the current path in the loop coil pattern can be implemented by the components included in the sensor layer 200. Therefore, the electronic device 1000 (see Figure 1A ) The pen PN can be charged by using the sensor layer 200. Therefore, since there is no need to separately add a component having a coil for charging the pen PN, an increase in thickness of the electronic device 1000, an increase in weight of the electronic device 1000, and a decrease in flexibility of the electronic device 1000 may not be caused.

[0253] In the charge drive mode, the first electrode group 210G, the second electrode group 220G, and the fourth electrode group 240G may be grounded, may receive a constant voltage, or may be electrically floating. For example, the first electrode group 210G, the second electrode group 220G, and the fourth electrode group 240G may be floating. In this case, the current RFS may not flow to the first electrode group 210G, the second electrode group 220G, and the fourth electrode group 240G.

[0254] Figure 17A is a view showing a second mode according to one or more embodiments of the present disclosure. Figure 17B is a view showing a second mode according to one or more embodiments of the present disclosure.

[0255] refer to Figure 5 、 Figure 17A and Figure 17B , the second mode may include a charging driving mode and a pen sensing driving mode. Figure 17A and Figure 17B is a view showing a pen sensing driving mode. Figure 17B An equivalent circuit diagram of some components of a single sensor layer 200 is shown, through which a first sensing current Ia, a second sensing current Ib, a third sensing current Ic, and a fourth sensing current Id generated by a pen PN flow.

[0256] The RLC resonant circuit of the pen PN can release a magnetic field having a resonant frequency while releasing charge. The magnetic field provided by the pen PN can generate a first induced current Ia from the first electrode group 210G, and second induced currents Ib and Ib1 from the second electrode group 220G. In addition, a third induced current Ic can be generated from the third electrode group 230G, and a fourth induced current Id can be generated from the fourth electrode group 240G.

[0257] According to one or more embodiments of the present disclosure, the second electrode group 220G includes a first separator electrode 220-D1 and a second separator electrode 220-D2, and the first separator electrode 220-D1 and the second separator electrode 220-D2 are connected to the (2-1)th trace 220t1 and the (2-2)th trace 220t2, respectively. Therefore, the first separator electrode 220-D1 and the second separator electrode 220-D2 sensed along the same axis in one second electrode group 220G are connected to the (2-1)th trace 220t1 and the (2-2)th trace 220t2, respectively, thereby reducing or preventing the possibility of the second induced currents Ib and Ib1 being offset.

[0258] A first coupling capacitor Ccp1 may be formed between the third electrode group 230G and the first electrode group 210G, and a second coupling capacitor Ccp2 may be formed between the fourth electrode group 240G and the first separator electrode 220-D1 of the second electrode group 220G. The third sense current Ic may be applied to the first electrode group 210G through the first coupling capacitor Ccp1, and the fourth sense current Id may be applied to the first separator electrode 220-D1 through the second coupling capacitor Ccp2.

[0259] The sensor driver 200C can receive a first received signal PRX1a based on the first sense current Ia and the third sense current Ic from the first electrode group 210G, and can receive a second received signal PRX2a based on the second sense current Ib and the fourth sense current Id from the first separated electrode 220-D1 of the second electrode group 220G. Furthermore, the sensor driver 200C can receive a third received signal PRX2a-ad based on the second sense current Ib1 from the second separated electrode 220-D2 of the second electrode group 220G. The sensor driver 200C can detect the input coordinates of the pen PN based on the first received signal PRX1a, the second received signal PRX2a, and the third received signal PRX2a-ad.

[0260] According to one or more embodiments of the present disclosure, one end of each of the third electrode group 230G and the fourth electrode group 240G may be floating. Therefore, due to the coupling between the first electrode group 210G and the third electrode group 230G and due to the coupling between the first separator electrode 220-D1 and the fourth electrode group 240G, compensation of the sensing signal can be maximized.

[0261] In addition, the opposite end of each of the third electrode group 230G and the fourth electrode group 240G, which is opposite to one end, may be grounded or floating. Therefore, due to the coupling between the first electrode group 210G and the third electrode group 230G and the coupling between the first separator electrode 220-D1 and the fourth electrode group 240G, the third induced current Ic and the fourth induced current Id can be sufficiently applied to the first electrode group 210G and the first separator electrode 220-D1.

[0262] Figure 18A is a diagram illustrating some components of a sensor layer according to one or more embodiments of the present disclosure. Figure 18B is an equivalent circuit diagram of an input device and a sensor layer according to one or more embodiments of the present disclosure.

[0263] refer to Figure 7 、 Figure 18A and Figure 18B The second electrode group 220G may include a (2-1)th electrode group 220G1, a (2-2)th electrode group 220G2, a (2-3)th electrode group 220G3, a (2-4)th electrode group 220G4 and a (2-5)th electrode group 220G5 arranged sequentially in the second direction DR2.

[0264] The (2-1)th electrode group 220G1 may include a (1-1)th partition electrode 220-D11 and a (2-1)th partition electrode 220-D21 spaced apart from the (1-1)th partition electrode 220-D11 in the first direction DR1. The (2-2)th electrode group 220G2 may include a (1-2)th partition electrode 220-D12 and a (2-2)th partition electrode 220-D22 spaced apart from the (1-2)th partition electrode 220-D12 in the first direction DR1. The (2-3)th electrode group 220G3 may include a (1-3)th partition electrode 220-D13 and a (2-3)th partition electrode 220-D23 spaced apart from the (1-3)th partition electrode 220-D13 in the first direction DR1. The (2-4)th electrode group 220G4 may include a (1-4)th partition electrode 220-D14 and a (2-4)th partition electrode 220-D24 spaced apart from the (1-4)th partition electrode 220-D14 in the first direction DR1. The (2-5)th electrode group 220G5 may include a (1-5)th partition electrode 220-D15 and a (2-5)th partition electrode 220-D25 spaced apart from the (1-5)th partition electrode 220-D15 in the first direction DR1.

[0265] The second traces 220t include a (1-1)th dividing trace 220t11 electrically connected to the (1-1)th dividing electrode 220-D11, a (2-1)th dividing trace 220t21 electrically connected to the (2-1)th dividing electrode 220-D21, a (1-2)th dividing trace 220t12 electrically connected to the (1-2)th dividing electrode 220-D12, a (2-2)th dividing trace 220t22 electrically connected to the (2-2)th dividing electrode 220-D22, a (1-3)th dividing trace 220t21 electrically connected to the (1-3)th dividing electrode 220-D13. 0t13, the (2-3)th separation trace 220t23 electrically connected to the (2-3)th separation electrode 220-D23, the (1-4)th separation trace 220t14 electrically connected to the (1-4)th separation electrode 220-D14, the (2-4)th separation trace 220t24 electrically connected to the (2-4)th separation electrode 220-D24, the (1-5)th separation trace 220t15 electrically connected to the (1-5)th separation electrode 220-D15, and the (2-5)th separation trace 220t25 electrically connected to the (2-5)th separation electrode 220-D25.

[0266] The (1-1)th partition electrode 220-D11 may be referred to as a first partition electrode, the (2-1)th partition electrode 220-D21 may be referred to as a second partition electrode, the (1-2)th partition electrode 220-D12 may be referred to as a third partition electrode, and the (2-2)th partition electrode 220-D22 may be referred to as a fourth partition electrode. The (1-1)th partition trace 220t11 may be referred to as a first line or a (2-1)th trace, the (2-1)th partition trace 220t21 may be referred to as a second line or a (2-2)th trace, the (1-2)th partition trace 220t12 may be referred to as a third line or a (2-3)th trace, and the (2-2)th partition trace 220t22 may be referred to as a fourth line or a (2-4)th trace.

[0267] According to one or more embodiments of the present disclosure, the (1-1)th dividing trace 220t11, the (2-1)th dividing trace 220t21, the (1-2)th dividing trace 220t12, the (2-2)th dividing trace 220t22, the (1-3)th dividing trace 220t13 and the (2-3)th dividing trace 220t23 may be sequentially arranged in the first direction DR1.

[0268] According to one or more embodiments of the present disclosure, a gap TS1 between the (1-1)th dividing trace 220t11 and the (2-1)th dividing trace 220t21 connected to the (1-1)th dividing electrode 220-D11 and the (2-1)th dividing electrode 220-D21, respectively, may be smaller than a gap TS2 between the (1-2)th dividing trace 220t12 and the (2-1)th dividing trace 220t21, and the (1-1)th dividing electrode 220-D11 and the (2-1)th dividing electrode 220-D21 sense the same axis and belong to one (2-1)th electrode group 220G1. The (2-1)th dividing trace 220t21 may be connected to the (2-1)th dividing electrode 220-D21. The (1-2)th separation trace 220t12 may be connected to the (1-2)th separation electrode 220-D12 belonging to the (2-2)th electrode group 220G2 to sense an axis different from that of the (2-1)th electrode group 220G1.

[0269] According to one or more embodiments of the present disclosure, the signals provided from the (1-1)th separation trace 220t11 and the (2-1)th separation trace 220t21 can be differentially sensed. In this case, the mutual inductance of the traces that affects coordinate distortion can be eliminated. As the gap TS1 between the (1-1)th separation trace 220t11 and the (2-1)th separation trace 220t21 decreases, the first coupling constant K0 of the (1-1)th separation trace 220t11 and the second coupling constant K1 of the (2-1)th separation trace 220t21 can be substantially equal to each other. Therefore, as the (1-1)th separation trace 220t11 and the (2-1)th separation trace 220t21 are closer to each other, the mutual inductance can be more effectively eliminated.

[0270] According to one or more embodiments of the present disclosure, the width of the (1-1)th partition electrode 220-D11 in the first direction DR1 may be narrower than the width of the (1-2)th partition electrode 220-D12 in the first direction DR1, and the width of the (2-1)th partition electrode 220-D21 in the first direction DR1 may be wider than the width of the (2-2)th partition electrode 220-D22 in the first direction DR1. The (1-1)th partition trace 220t11 and the (2-1)th partition trace 220t21 may overlap with any one of the (1-2)th partition electrode 220-D12 and the (2-2)th partition electrode 220-D22. For example, the (1-1)th partition trace 220t11 and the (2-1)th partition trace 220t21 may overlap with the (1-2)th partition electrode 220-D12.

[0271] The width of the (1-3)th partition electrode 220-D13 in the first direction DR1 may be wider than the width of the (1-2)th partition electrode 220-D12 in the first direction DR1, and the width of the (2-3)th partition electrode 220-D23 in the first direction DR1 may be narrower than the width of the (2-2)th partition electrode 220-D22 in the first direction DR1. Therefore, when viewed from the second direction DR2, the gap GP between the (1-3)th partition electrode 220-D13 and the (2-3)th partition electrode 220-D23 may overlap with the (2-1)th partition electrode 220-D21 and the (2-2)th partition electrode 220-D22 (for example, along the second direction DR2).

[0272] Figure 19 FIG is a diagram showing a sensor driver 200C according to one or more embodiments of the present disclosure. Figure 19 , the operation of the sensor driver 200C in the pen sensing driving mode will be described.

[0273] refer to Figure 17A 、 Figure 18A and Figure 19 The sensor driver 200C can differentially sense signals received from two different electrode groups. For example, the sensor driver 200C can differentially sense a signal received from the (2-1)th electrode group 220G1 and a signal received from the (2-2)th electrode group 220G2.

[0274] According to one or more embodiments of the present disclosure, the second trace 220t overlaps the sensing area 200A. In other words, compared to the case where the second trace is located in the peripheral area 200NA, the second trace 220t is widely distributed in the sensing area 200A, and the mutual inductance between the pen PN and the second trace 220t can be different from each other. Therefore, unlike one or more embodiments of the present disclosure, when the (2-1)th electrode group 220G1 and the (2-2)th electrode group 220G2 are directly differentially sensed, the influence of the second trace 220t is not eliminated, which may cause coordinate distortion.

[0275] According to one or more embodiments of the present disclosure, before differentially sensing signals received from two different electrode groups, a preliminary differential sensing operation can be performed to eliminate the influence of the second trace 220t. The mutual inductance of the second trace 220t, which affects coordinate distortion, can be eliminated by the preliminary differential sensing operation. Therefore, the accuracy of the coordinates sensed by the sensor layer 200 and the sensor driver 200C can be improved. The operation of the sensor driver 200C will be described in detail below.

[0276] The sensor driver 200C may include a first differential processing circuit 210C, a second differential processing circuit 220C, and a third differential processing circuit 230C. The first differential processing circuit 210C and the second differential processing circuit 220C may be circuits that perform a primary differential sensing operation to eliminate the mutual inductance of the second trace 220t. The third differential processing circuit 230C may be a circuit that performs a secondary differential sensing operation on signals received from two different electrode groups.

[0277] The first differential processing circuit 210C can be configured to receive a first signal PSG1 from the (1-1)th separation trace 220t11 connected to the (2-1)th electrode group 220G1 and a second signal PSG2 from the (2-1)th separation trace 220t21 to perform a differential calculation operation on the first signal PSG1 and the second signal PSG2, thereby generating first data AD1.

[0278] The second differential processing circuit 220C can be configured to receive a third signal PSG3 from the (1-2)th separation trace 220t12 connected to another second electrode group (e.g., the (2-2)th electrode group 220G2) and a fourth signal PSG4 from the (2-2)th separation trace 220t22, and perform a differential calculation operation on the third signal PSG3 and the fourth signal PSG4, thereby generating second data AD2.

[0279] The third differential processing circuit 230C may be configured to perform a differential calculation operation on the first data AD1 and the second data AD2 to generate third data CHD.

[0280] The sensor driver 200C may be configured to generate the first data AD1 and the second data AD2 through at least one of analog differential processing and digital differential processing, and may be configured to generate the third data CHD using at least one of analog differential processing and digital differential processing. According to one or more embodiments of the present disclosure, the sensor driver 200C may generate the first data AD1 and the second data AD2 through analog differential processing, and may generate the third data CHD through digital differential processing.

[0281] The first differential processing circuit 210C may include a first charging voltage amplifier AP1 and a first current conveyor CC1. The second differential processing circuit 220C may include a second charging voltage amplifier AP2 and a second current conveyor CC2. The third differential processing circuit 230C may include an analog-to-digital converter ADC and a differential calculation unit DCC. The components included in each of the first differential processing circuit 210C, the second differential processing circuit 220C, and the third differential processing circuit 230C are not limited to those described above. At least some of the components described above may be omitted, or other components may be added. Furthermore, the order of connection of the components included in each of the first differential processing circuit 210C, the second differential processing circuit 220C, and the third differential processing circuit 230C may be changed.

[0282] The first differential processing circuit 210C can receive the first signal PSG1 and the second signal PSG2 and perform a differential calculation operation on the first signal PSG1 and the second signal PSG2 to generate first data AD1. The second differential processing circuit 220C can receive the third signal PSG3 and the fourth signal PSG4 and perform a differential calculation operation on the third signal PSG3 and the fourth signal PSG4 to generate second data AD2. The step of generating the first data AD1 and the second data AD2 can be referred to as a primary differential processing operation or a primary differential sensing operation. Mutual inductance that affects coordinate distortion can be eliminated through the primary differential processing operation.

[0283] The analog-to-digital converter ADC of the third differential processing circuit 230C can convert the first data AD1 and the second data AD2 to output first digital data DID1 and second digital data DID2, respectively. A first weight GA1 can be applied to the first digital data DID1, and a second weight GA2 can be applied to the second digital data DID2. The first weight GA1 and the second weight GA2 can be the same as or different from each other.

[0284] The first weighted data obtained by applying the first weight GA1 to the first digital data DID1 and the second weighted data obtained by applying the second weight GA2 to the second digital data DID2 may be provided to the differential calculation unit DCC. The differential calculation unit DCC may perform a calculation operation on the first weighted data and the second weighted data to output third data CHD.

[0285] Figure 20 FIG is a diagram showing a sensor driver 200C-1 according to one or more embodiments of the present disclosure. Figure 20 In the description, with reference Figure 19 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0286] refer to Figure 20 , the sensor driver 200C- 1 may include a first differential processing circuit 210C1 , a second differential processing circuit 220C1 , and a third differential processing circuit 230C1 .

[0287] The sensor driver 200C-1 may be configured to generate the first data DID1a and the second data DID2a through at least one of analog differential processing and digital differential processing, and may be configured to generate the third data CHDa through at least one of analog differential processing and digital differential processing. According to one or more embodiments of the present disclosure, the sensor driver 200C-1 may generate the first data DID1a and the second data DID2a through digital differential processing, and may generate the third data CHDa through digital differential processing.

[0288] The first differential processing circuit 210C1 may include an analog-to-digital converter (ADC) and a first differential calculation unit (DCC1). The second differential processing circuit 220C1 may include an analog-to-digital converter (ADC) and a second differential calculation unit (DCC2). The third differential processing circuit 230C1 may include a third differential calculation unit (DCC3). The components included in each of the first differential processing circuit 210C1, the second differential processing circuit 220C1, and the third differential processing circuit 230C1 are not limited to those described above. At least some of the components described above may be omitted, or other components may be added.

[0289] The first differential processing circuit 210C1 can receive the first and second signals PSG1 and PSG2 and perform analog-to-digital conversion on the first and second signals PSG1 and PSG2 to generate first and second digital data DI1 and DI2. A first weight GA1a can be applied to the first digital data DI1, and a second weight GA2a can be applied to the second digital data DI2. The first and second weights GA1a and GA2a can be the same or different. The first differential calculation unit DCC1 can perform a calculation operation on the first and second digital data DI1 and DI2 to which the first and second weights GA1a and GA2a are applied, respectively, to output first data DID1a.

[0290] The second differential processing circuit 220C1 can receive the third signal PSG3 and the fourth signal PSG4 and perform analog-to-digital conversion on the third signal PSG3 and the fourth signal PSG4 to generate third digital data DI3 and fourth digital data DI4. A first weight GA1b can be applied to the third digital data DI3, and a second weight GA2b can be applied to the fourth digital data DI4. The first weight GA1b and the second weight GA2b can be the same or different. The second differential calculation unit DCC2 can output second data DID2a by performing a calculation operation on the third digital data DI3 and the fourth digital data DI4 to which the first weight GA1b and the second weight GA2b are applied, respectively.

[0291] The third differential processing circuit 230C1 may receive first data DID1a and second data DID2a. A third weight GA3 may be applied to the first data DID1a, and a fourth weight GA4 may be applied to the second data DID2a. The third weight GA3 and the fourth weight GA4 may be the same or different. The third differential calculation unit DCC3 may output third data CHDa by performing a calculation operation on the first data DID1a and the second data DID2a to which the third weight GA3 and the fourth weight GA4 are applied, respectively.

[0292] Figure 21 FIG is a diagram showing a sensor driver 200C-2 according to one or more embodiments of the present disclosure. Figure 21 In the description, with reference Figure 19 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0293] refer to Figure 21 , the sensor driver 200C- 2 may include a first differential processing circuit 210C, a second differential processing circuit 220C, and a third differential processing circuit 230C2.

[0294] The sensor driver 200C-2 may be configured to generate the first data AD1 and the second data AD2 through at least one of analog differential processing and digital differential processing, and may be configured to generate the third data CHDb through at least one of analog differential processing and digital differential processing. According to one or more embodiments of the present disclosure, the sensor driver 200C-2 may generate the first data AD1 and the second data AD2 through analog differential processing, and may generate the third data CHDb through analog differential processing.

[0295] The third differential processing circuit 230C2 may include a third charge voltage amplifier AP3, a third current conveyor CC3, and an analog-to-digital converter ADC. The components included in the third differential processing circuit 230C2 are not limited to the components described above. At least some of the components described above may be omitted, and other components may be added. Furthermore, the order in which the components included in the third differential processing circuit 230C2 are connected may be changed.

[0296] The third charge voltage amplifier AP3 of the third differential processing circuit 230C2 may receive the first data AD1 and the second data AD2 and perform a differential calculation operation on the first data AD1 and the second data AD2 to generate third intermediate data AD3. The analog-to-digital converter ADC may convert the third intermediate data AD3 to output third data CHDb.

[0297] Figure 22A is a plan view of a sensor layer 200 - 2 according to one or more embodiments of the present disclosure. Figure 22B is a diagram showing some components of a sensor layer according to one or more embodiments of the present disclosure. Figure 22A In the description, with reference Figure 7 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0298] refer to Figure 22A and Figure 22B The sensor layer 200-2 may include a plurality of first electrode groups 210G, a plurality of second electrode groups 220Ga, a plurality of third electrode groups 230G and a fourth electrode group 240G. Figure 5 ) provides a magnetic field, which can generate second induced currents Iba and Ib1a from the second electrode group 220Ga.

[0299] Each of the second electrode groups 220Ga may include a first separator electrode 220-D1a and a second separator electrode 220-D2a. The first separator electrode 220-D1a and the second separator electrode 220-D2a may be spaced apart from each other in the first direction DR1. Each of the first separator electrode 220-D1a and the second separator electrode 220-D2a may extend in the first direction DR1.

[0300] The second electrode group 220Ga may include a (2-1)th electrode group 220G1a, a (2-2)th electrode group 220G2a, a (2-3)th electrode group 220G3a, a (2-4)th electrode group 220G4a, and a (2-5)th electrode group 220G5a sequentially arranged in the second direction DR2.

[0301] The (2-1)th electrode group 220G1a may include a (1-1)th partition electrode 220-D11a and a (2-1)th partition electrode 220-D21a spaced apart from the (1-1)th partition electrode 220-D11a in the first direction DR1. The (2-2)th electrode group 220G2a may include a (1-2)th partition electrode 220-D12a and a (2-2)th partition electrode 220-D22a spaced apart from the (1-2)th partition electrode 220-D12a in the first direction DR1. The (2-3)th electrode group 220G3a may include a (1-3)th partition electrode 220-D13a and a (2-3)th partition electrode 220-D23a spaced apart from the (1-3)th partition electrode 220-D13a in the first direction DR1. The (2-4)th electrode group 220G4a may include a (1-4)th partition electrode 220-D14a and a (2-4)th partition electrode 220-D24a spaced apart from the (1-4)th partition electrode 220-D14a in the first direction DR1. The (2-5)th electrode group 220G5a may include a (1-5)th partition electrode 220-D15a and a (2-5)th partition electrode 220-D25a spaced apart from the (1-5)th partition electrode 220-D15a in the first direction DR1.

[0302] The second traces 220t include a (1-1)th dividing trace 220t11a electrically connected to the (1-1)th dividing electrode 220-D11a, a (2-1)th dividing trace 220t21a electrically connected to the (2-1)th dividing electrode 220-D21a, a (1-2)th dividing trace 220t12a electrically connected to the (1-2)th dividing electrode 220-D12a, a (2-2)th dividing trace 220t22a electrically connected to the (2-2)th dividing electrode 220-D22a, a (1-3)th dividing trace 220t11a electrically connected to the (1-3)th dividing electrode 220-D13a. t13a, the (2-3)th separation trace 220t23a electrically connected to the (2-3)th separation electrode 220-D23a, the (1-4)th separation trace 220t14a electrically connected to the (1-4)th separation electrode 220-D14a, the (2-4)th separation trace 220t24a electrically connected to the (2-4)th separation electrode 220-D24a, the (1-5)th separation trace 220t15a electrically connected to the (1-5)th separation electrode 220-D15a, and the (2-5)th separation trace 220t25a electrically connected to the (2-5)th separation electrode 220-D25a.

[0303] According to one or more embodiments of the present disclosure, the (1-5)th dividing trace 220t15a, the (2-5)th dividing trace 220t25a, the (1-3)th dividing trace 220t13a, the (2-3)th dividing trace 220t23a, the (1-1)th dividing trace 220t11a, the (2-1)th dividing trace 220t21a, the (1-2)th dividing trace 220t12a, the (2-2)th dividing trace 220t22a, the (1-4)th dividing trace 220t14a and the (2-4)th dividing trace 220t24a can be arranged sequentially in the first direction DR1.

[0304] According to one or more embodiments of the present disclosure, the width of the (1-1)th separating electrode 220-D11a in the first direction DR1 may be narrower than the width of the (1-2)th separating electrode 220-D12a in the first direction DR1, and the width of the (2-1)th separating electrode 220-D21a in the first direction DR1 may be wider than the width of the (2-2)th separating electrode 220-D22a in the first direction DR1.

[0305] The width of the (1-3)th partition electrode 220-D13a in the first direction DR1 may be narrower than the width of the (1-1)th partition electrode 220-D11a in the first direction DR1, and the width of the (2-3)th partition electrode 220-D23a in the first direction DR1 may be wider than the width of the (2-1)th partition electrode 220-D21a in the first direction DR1. Therefore, when viewed from the second direction DR2, the gap GPa between the (1-3)th partition electrode 220-D13a and the (2-3)th partition electrode 220-D23a may overlap with the (1-1)th partition electrode 220-D11a and the (1-2)th partition electrode 220-D12a.

[0306] Figure 23 is a plan view of a sensor layer 200 - 3 according to one or more embodiments of the present disclosure. Figure 24A is a diagram illustrating some components of the sensor layer 200 - 3 according to one or more embodiments of the present disclosure. Figure 24B It is a view for describing the second mode according to one or more embodiments of the present disclosure. Figure 23 In the description, with reference Figure 7 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0307] refer to Figure 23 , the sensor layer 200 - 3 may include a plurality of first electrode groups 210G, a plurality of second electrode groups 220Gb, a plurality of third electrode groups 230G, and a fourth electrode group 240G located in the sensing region 200A.

[0308] Each of the second electrode groups 220Gb may include a first separation electrode 220-D1b and a second separation electrode 220-D2b. The first separation electrode 220-D1b and the second separation electrode 220-D2b may be spaced apart from each other in the first direction DR1. Each of the first separation electrode 220-D1b and the second separation electrode 220-D2b may extend in the first direction DR1.

[0309] The first separating electrodes 220-D1b may be arranged to be spaced apart from each other in the second direction DR2, and the second separating electrodes 220-D2b may be arranged to be spaced apart from each other in the second direction DR2. According to one or more embodiments of the present disclosure, the lengths or widths of the first separating electrodes 220-D1b in the first direction DR1 may be equal to each other, and the lengths or widths of the second separating electrodes 220-D2b in the first direction DR1 may be equal to each other.

[0310] The sensor layer 200-3 may further include second traces 220tb and 220tc. The second traces 220tb and 220tc may include first separation traces 220tb and second separation traces 220tc. At least some of the first separation traces 220tb may be electrically connected to the first separation electrode 220-D1b, and the second separation traces 220tc may be electrically connected to the second separation electrode 220-D2b.

[0311] According to one or more embodiments of the present disclosure, the first dividing trace 220tb may overlap the sensing region 200A and may be insulated from at least some of the second dividing electrodes 220-D2b while crossing the first dividing trace 220tc. The second dividing trace 220tc may be located in the peripheral region 200NA. However, this is provided for exemplary purposes only, and at least some of the second dividing trace 220tc may overlap the sensing region 200A.

[0312] Figure 24A The first separation electrode 220-D1b and the first separation trace 220tb are shown. Each of the first separation traces 220tb may include a (2-1)th trace 220t1b electrically connected to the associated first separation electrode 220-D1b and a (2-2)th trace 220t2b spaced apart from the (2-1)th trace 220t1b in the first direction DR1 while extending in the second direction DR2. The (2-1)th trace 220t1b may be referred to as a first line, and the (2-2)th trace 220t2b may be referred to as a second line.

[0313] The (2-2)th trace 220t2b may face the (2-1)th trace 220t1b. For example, the (2-1)th trace 220t1b may include a first portion 220th extending in the first direction DR1 and a second portion 220tv extending from the first portion 220th in the second direction DR2, and the (2-2)th trace 220t2b may face the second portion 220tv.

[0314] One end of the (2-1)th trace 220t1b may be connected to the first dividing electrode 220-D1b, and the opposite end of the (2-1)th trace 220t1b opposite to the one end may be electrically connected to the sensor driver 200C through the second pad PD2a. One end of the (2-2)th trace 220t2b may be floating, and the opposite end of the (2-2)th trace 220t2b opposite to the one end may be electrically connected to the sensor driver 200C through the pad PDa. One end of the second dividing trace 220tc may be connected to the second dividing electrode 220-D2b, and the opposite end of the second dividing trace 220tc opposite to the one end may be electrically connected to the sensor driver 200C through the second pad PD2b.

[0315] refer to Figure 5 、 Figure 24A and Figure 24B The RLC resonant circuit of the pen PN can emit a magnetic field having a resonant frequency while releasing charge. Due to the magnetic field provided by the pen PN, a first induced current Ia can be generated from the first electrode group 210G, and a second induced current Ib can be generated from the first separator electrode 220-D1b. In addition, a third induced current Ic can be generated from the third electrode group 230G, and a fourth induced current Id can be generated from the fourth electrode group 240G.

[0316] A first coupling capacitor Ccp1 may be formed between the third electrode group 230G and the first electrode group 210G, and a second coupling capacitor Ccp2 may be formed between the fourth electrode group 240G and the first separator electrode 220-D1b. The third sense current Ic may be transmitted to the first electrode group 210G through the first coupling capacitor Ccp1, and the fourth sense current Id may be transmitted to the first separator electrode 220-D1b through the second coupling capacitor Ccp2.

[0317] The sensor driver 200C can receive a first reception signal PRX1a based on the first sensing current Ia and the third sensing current Ic from the first electrode group 210G, and can receive a second reception signal PRX2a based on the second sensing current Ib and the fourth sensing current Id from the first separation electrode 220-D1b. Furthermore, the sensor driver 200C can receive a third reception signal PRX2a-ada from the (2-2)th trace 220t2b. The sensor driver 200C can detect the coordinates of the input made by the pen PN based on the first reception signal PRX1a, the second reception signal PRX2a, and the third reception signal PRX2a-ada.

[0318] According to one or more embodiments of the present disclosure, in the sensing region 200A, the length LT1 of the (2-1)th trace 220t1b in the second direction DR2 may be substantially equal to the length LT2 of the (2-2)th trace 220t2b in the second direction DR2. The sensor driver 200C may differentially sense the second reception signal PRX2a provided by the (2-1)th trace 220t1b and the third reception signal PRX2a-ada provided by the (2-2)th trace 220t2b. In this case, mutual inductance that may cause coordinate distortion may be eliminated.

[0319] Figure 25 is a plan view of a sensor layer 200-4 according to one or more embodiments of the present disclosure. Figure 25 In the description, with reference Figure 7 The same components as those described are given the same reference numerals, and details thereof will be omitted.

[0320] refer to Figure 25 , the sensor layer 200 - 4 may include a plurality of first electrode groups 210G, a plurality of second electrode groups 220Gb, a plurality of third electrode groups 230G, and a plurality of fourth electrode groups 240G- 2 .

[0321] The second electrode group 220Gb may include a first separation electrode 220-D1b and a second separation electrode 220-D2b. The first separation electrode 220-D1b and the second separation electrode 220-D2b may be spaced apart from each other in the first direction DR1. Each of the first separation electrode 220-D1b and the second separation electrode 220-D2b may extend in the first direction DR1.

[0322] The first separating electrodes 220-D1b may be arranged to be spaced apart from each other in the second direction DR2, and the second separating electrodes 220-D2b may be arranged to be spaced apart from each other in the second direction DR2. According to one or more embodiments of the present disclosure, the lengths or widths of the first separating electrodes 220-D1b in the first direction DR1 may be equal to each other, and the lengths or widths of the second separating electrodes 220-D2b in the first direction DR1 may be equal to each other.

[0323] The sensor layer 200-4 may also include second traces 220tb-1 and 220tc-1. The second traces 220tb-1 and 220tc-1 may include a first separation trace 220tb-1 and a second separation trace 220tc-1. The first separation trace 220tb-1 is electrically connected to the first separation electrode 220-D1b in a one-to-one correspondence, and the second separation trace 220tc-1 may be electrically connected to the second separation electrode 220-D2b in a one-to-one correspondence. The first separation trace 220tb-1 may be referred to as a (2-1)th trace or first line, and the second separation trace 220tc-1 may be referred to as a (2-2)th trace or second line.

[0324] According to one or more embodiments of the present disclosure, the first and second dividing traces 220tb-1 and 220tc-1 may be aligned with the non-display area 100NA (see FIG. Figure 4 The first and second separation traces 220tb-1 and 220tc-1 may be spaced apart from each other with the first and second separation electrodes 220-D1b and 220-D2b interposed therebetween.

[0325] The sensor layer 200-4 may include two fourth electrode groups 240G-2 facing each other in the first direction DR1. The fourth electrode group 240G-2 may include a (4-1)th electrode group 240G-2a overlapping the first separator electrode 220-D1b and a (4-2)th electrode group 240G-2b overlapping the second separator electrode 220-D2b. The (4-1)th electrode group 240G-2a includes a plurality of (2-1)th auxiliary electrodes 240S1a arranged in the second direction DR2, and the (4-2)th electrode group 240G-2b may include a plurality of (2-2)th auxiliary electrodes 240S2a arranged in the second direction DR2.

[0326] The sensor layer 200-4 may further include a fourth trace 240ta overlapping the sensing region 200A. The fourth trace 240ta may be located between the (2-1)th auxiliary electrode 240S1a and the (2-2)th auxiliary electrode 240S2a. All of the (2-1)th auxiliary electrode 240S1a and all of the (2-2)th auxiliary electrode 240S2 may be connected to the fourth trace 240ta.

[0327] As described above, inputs made by the pen as well as touch inputs can be sensed by the sensor layer. Therefore, the electronic device does not need to further include additional components (e.g., digitizers) for pen sensing. Therefore, since a digitizer is not added, the electronic device can be thinner, lighter, and more flexible. In addition, at least a portion of the traces of the sensor layer can overlap with the sensing area or the display area. Therefore, the area of the peripheral area of the sensor layer can be reduced. Therefore, the area occupied by the peripheral area on the front surface of the electronic device can be reduced, and a narrower frame can be achieved. In addition, the sensor driver can be configured to perform a primary differential sensing operation for eliminating the influence of the traces before performing differential sensing on signals received from two different electrode groups. The mutual inductance of the traces that affects the distortion of the coordinates can be eliminated by the primary differential sensing operation. Therefore, the accuracy of the coordinates sensed by the sensor layer and the sensor driver can be improved.

[0328] Although one or more embodiments of the present disclosure have been described for illustrative purposes, it will be understood by those skilled in the art that various modifications and substitutions are possible without departing from the scope and spirit of the present invention as disclosed in the appended claims. Therefore, the technical scope of the present disclosure is not limited to the detailed description of this specification, but should be defined by the claims.

[0329] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made thereto without departing from the spirit and scope of the disclosure as set forth in the appended claims and their functional equivalents which are to be included therein.

Claims

1. An electronic device comprising: A sensor layer having a sensing region and a peripheral region adjacent to the sensing region defined therein, and comprising: a first electrode group arranged in a first direction; a second electrode group crossing the first electrode group and arranged in a second direction crossing the first direction; a first trace electrically connected to the first electrode set; and A second trace electrically connected to the second electrode set and comprising: The (2-1)th trace is electrically connected to one of the second electrode groups, and having a first length in the second direction; and a (2-2)th trace that is spaced apart from the (2-1)th trace in the first direction while extending in the second direction and having a second length in the second direction that is equal to the first length; and A sensor driver is configured to drive the sensor layer and is configured to selectively operate in a first mode for sensing a touch input or in a second mode for sensing a pen input.

2. The electronic device according to claim 1, wherein Each of the second electrode groups includes a first separator electrode and a second separator electrode spaced apart from the first separator electrode in the first direction, and wherein the (2-1)th trace is electrically connected to the first separation electrode, and the (2-2)th trace is electrically connected to the second separation electrode.

3. The electronic device according to claim 2, wherein: at least a portion of the (2-1)th trace and at least a portion of the (2-2)th trace overlap with the sensing area, wherein the portion of the (2-1)th trace having the first length overlaps the sensing area, and The portion of the (2-2)th trace having the second length overlaps with the sensing area.

4. The electronic device according to claim 2, wherein: The (2-1)th trace is connected to the first separator electrode adjacent to the second separator electrode, and The (2-2)th trace is connected to the second separation electrode adjacent to the first separation electrode.

5. The electronic device according to claim 2, wherein: The (2-1)th trace and the (2-2)th trace overlap the peripheral area, and the (2-1)th trace and the (2-2)th trace are spaced apart from each other, with the first partition electrode and the second partition electrode between the (2-1)th trace and the (2-2)th trace. The electronic device according to claim 1 , wherein: The second electrode group includes: The (2-1)th electrode group, the (2-2)th electrode group, and the (2-3)th electrode group are arranged in sequence in the second direction, wherein the (2-1)th electrode group includes a (1-1)th separation electrode and a (2-1)th separation electrode spaced apart from the (1-1)th separation electrode in the first direction; wherein the (2-2)th electrode group includes a (1-2)th separation electrode and a (2-2)th separation electrode spaced apart from the (1-2)th separation electrode in the first direction; wherein the (2-3)th electrode group includes a (1-3)th separation electrode and a (2-3)th separation electrode spaced apart from the (1-3)th separation electrode in the first direction, and Wherein, the second trace includes the (1-1)th separation trace electrically connected to the (1-1)th separation electrode, the (2-1)th separation trace electrically connected to the (2-1)th separation electrode, the (1-2)th separation trace electrically connected to the (1-2)th separation electrode, the (2-2)th separation trace electrically connected to the (2-2)th separation electrode, the (1-3)th separation trace electrically connected to the (1-3)th separation electrode, and the (2-3)th separation trace electrically connected to the (2-3)th separation electrode.

7. The electronic device according to claim 6, wherein: A gap between the (1-1)th dividing trace and the (2-1)th dividing trace is narrower than a gap between the (2-1)th dividing trace and the (1-2)th dividing trace.

8. The electronic device according to claim 6, wherein: The (1-1)th dividing trace, the (2-1)th dividing trace, the (1-2)th dividing trace, the (2-2)th dividing trace, the (1-3)th dividing trace and the (2-3)th dividing trace are arranged sequentially in the first direction.

9. The electronic device according to claim 6, wherein: The (1-3)th dividing trace, the (2-3)th dividing trace, the (1-1)th dividing trace, the (2-1)th dividing trace, the (1-2)th dividing trace and the (2-2)th dividing trace are arranged sequentially in the first direction.

10. The electronic device according to claim 6, wherein: The width of the (1-1)th separation electrode in the first direction is narrower than the width of the (1-2)th separation electrode in the first direction, and The width of the (2-1)th partition electrode in the first direction is wider than the width of the (2-2)th partition electrode in the first direction. The electronic device according to claim 10 , wherein: The width of the (1-3)th separation electrode in the first direction is wider than the width of the (1-2)th separation electrode in the first direction, and The width of the (2-3)th separating electrode in the first direction is narrower than the width of the (2-2)th separating electrode in the first direction.

12. The electronic device according to claim 10, wherein: The width of the (1-3)th separation electrode in the first direction is narrower than the width of the (1-1)th separation electrode in the first direction, and The width of the (2-3)th separating electrode in the first direction is wider than the width of the (2-1)th separating electrode in the first direction.

13. The electronic device according to claim 6, wherein: When viewed from the second direction, a gap between the (1-3)th partition electrode and the (2-3)th partition electrode overlaps with the (2-1)th partition electrode and the (2-2)th partition electrode.

14. The electronic device according to claim 6, wherein: When viewed from the second direction, a gap between the (1-3)th partition electrode and the (2-3)th partition electrode overlaps with the (1-1)th partition electrode and the (1-2)th partition electrode.

15. The electronic device according to claim 1, wherein The (2-1)th trace includes a first portion extending in the first direction and a second portion extending from the first portion in the second direction, and Wherein, the (2-2)th trace faces the second portion.

16. The electronic device according to claim 1, wherein The sensor driver is configured to receive a first signal through the (2-1)th trace and a second signal through the (2-2)th trace, and is configured to generate first data by performing a differential calculation operation on the first signal and the second signal.

17. The electronic device according to claim 16, wherein: The second traces include a (2-3)th trace electrically connected to another second electrode group among the second electrode groups and a (2-4)th trace spaced apart from the (2-3)th trace in the first direction while extending in the second direction, and Wherein, the sensor driver is configured to receive a third signal through the (2-3)th trace and a fourth signal through the (2-4)th trace, configured to generate second data by performing a differential calculation operation on the third signal and the fourth signal, and configured to generate third data by performing a differential calculation operation on the first data and the second data.

18. The electronic device according to claim 17, wherein: The sensor driver is configured to generate the first data and the second data by at least one of analog differential processing and digital differential processing, and The sensor driver is configured to generate the third data through at least one of the analog differential processing and the digital differential processing.

19. An electronic device comprising: A sensor layer having a sensing region and a peripheral region adjacent to the sensing region defined therein, and comprising: a first electrode group arranged in the sensing region and in a first direction; a second electrode group, in the sensing area, arranged in a second direction intersecting the first direction and intersecting the first electrode group; a first line electrically connected to one of the second electrode groups; a second line having a length in the second direction equal to that of the first line in the sensing area; a third line electrically connected to another one of the second electrode groups; and a fourth line having a length in the second direction equal to that of the third line in the sensing area; and A sensor driver configured to drive the sensor layer, configured to selectively operate in a first mode for sensing touch input or in a second mode for sensing pen input, configured to receive a first signal through the first line and a second signal through the second line, configured to generate first data by performing a differential calculation operation on the first signal and the second signal, configured to receive a third signal through the third line and a fourth signal through the fourth line, configured to generate second data by performing a differential calculation operation on the third signal and the fourth signal, and configured to generate third data by performing a differential calculation operation on the first data and the second data.

20. The electronic device according to claim 19, wherein the one of the second electrode groups includes a first separator electrode and a second separator electrode spaced apart from the first separator electrode in the first direction, wherein the other one of the second electrode groups includes a third separator electrode and a fourth separator electrode spaced apart from the third separator electrode in the first direction, wherein the first line is electrically connected to the first separating electrode, and the second line is electrically connected to the second separating electrode, and The third line is electrically connected to the third separating electrode, and the fourth line is electrically connected to the fourth separating electrode.

21. The electronic device according to claim 20, wherein: The first line and the second line are insulated from one of the third dividing electrode and the fourth dividing electrode while crossing the one of the third dividing electrode and the fourth dividing electrode.

22. The electronic device according to claim 19, wherein The first line includes a first portion extending in the first direction and a second portion extending from the first portion in the second direction, and The second line faces the second portion of the first line.

23. The electronic device according to claim 19, wherein The sensor driver is connected to one end portion of the second line, and an opposite end portion of the second line opposite to the one end portion is floating.

24. An electronic device comprising: a first electrode group arranged in the sensing region and in a first direction; a second electrode group crossing the first electrode group in the sensing area and arranged in a second direction crossing the first direction; a first line in the sensing region and electrically connected to one of the second electrode groups; a second line in the sensing area and adjacent to the first line in the first direction; as well as a third line, in the sensing region and electrically connected to another one of the second electrode groups, wherein a gap between the first line and the second line is narrower than a gap between the second line and the third line, and The length of the portion of the first line in the sensing area is equal to the length of the portion of the second line in the sensing area.

25. The electronic device according to claim 24, wherein: The one of the second electrode groups includes a first separator electrode and a second separator electrode spaced apart from the first separator electrode in the first direction, and The first line is electrically connected to the first separating electrode, and the second line is electrically connected to the second separating electrode.

26. The electronic device according to claim 24, wherein The first line includes a first portion extending in the first direction and a second portion extending from the first portion in the second direction, and The second line faces the second portion of the first line and extends in the second direction.

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