A diode processing glue coating device
By introducing vacuum treatment and electric stirring rack in the diode processing device to eliminate glue bubbles, the defect problem of bubble formation during the glue coating process was solved, and high-quality vacuum coating and efficient diode processing were achieved.
Patent Information
- Application Number
- CN202510959046.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-11
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2045-07-11
AI Technical Summary
The existing diode processing equipment is not operated in a vacuum environment during the glue coating process, resulting in the inability to effectively remove tiny bubbles in the glue. The bubbles expand or burst to form surface defects, affecting the glue coating quality.
A vacuum gluing device is designed. The shell is evacuated by a vacuum pump, and the storage barrel is evacuated by an air guide pipe and an exhaust pipe. An electric stirring rack is used to eliminate bubbles in the glue, and then the diode is coated in a vacuum environment.
It effectively prevents bubbles from being generated, improves the quality of gluing, and improves work efficiency through clamping components and loading and unloading components to prevent nozzle blockage.
Smart Images

Figure CN120460184B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of diode processing, and in particular to a diode processing glue coating device. Background Art
[0002] During the processing of diodes, the gluing step is intended to evenly coat the surface of the tube core after pickling and high-temperature drying with a layer of silicone rubber. This layer of silicone rubber can isolate the PN junction of the tube core from the external environment, preventing the influence of surrounding impurities on device performance, thereby protecting the tube core and stabilizing its surface.
[0003] The Chinese patent with announcement number CN114985199B discloses a gluing device for the production of high-voltage ultra-fast recovery diodes. The machine is slidably connected to the diode mounting part through guide cavities on both sides. The diode mounting part is provided with a plurality of synchronously rotating clamping parts, and the clamping parts are used to clamp the diode. Among them, a gluing part for gluing the diode is set at one end of the table of the machine, and a drying part for drying the diode after gluing is set at the other end of the table of the machine. The diode mounting part can slide and switch between the gluing part and the drying part. Although the above patent can apply glue to the surface of the diode, the gluing process is not carried out in a vacuum environment, resulting in the inability to effectively remove the fine bubbles in the glue. When the glue containing bubbles is applied to the surface of the diode, the bubbles expand or burst during the curing process, which is likely to form surface defects, reduce the aesthetics of the product, and affect the quality of the gluing. In addition, due to the lack of vacuum processing capacity for the glue storage container, the glue is prone to secondary bubbling when it is left standing for a long time or under temperature changes, further aggravating the gluing quality problem.
[0004] The present invention aims to solve the problems existing in the above patents. To this end, a diode processing and gluing device is proposed, which can vacuum-coat the diode after the glue is vacuum-treated, prevent the generation of bubbles, and improve the gluing quality. Summary of the Invention
[0005] In order to overcome the disadvantage that the glue coating process is not carried out in a vacuum environment, resulting in the inability to effectively eliminate the tiny bubbles in the glue. When the glue containing bubbles is coated on the surface of the diode, the bubbles expand or burst during the curing process, which easily forms surface defects, reduces the aesthetics of the product, and affects the glue coating quality. The present invention provides a diode processing glue coating device that can vacuum-coat the diode after the glue is vacuum-treated, prevents the generation of bubbles, and improves the glue coating quality.
[0006] The present invention is achieved through the following technical solutions:
[0007] A diode processing glue coating device includes a workbench and a guide frame fixed to the inner side of the workbench, a collecting frame is slidably connected to the guide frame, a shell is fixed to the workbench, electric doors are rotatably installed on both sides of the shell, a double-axis moving machine is installed on the inner side of the shell, a nozzle is installed on the moving part of the double-axis moving machine, a storage barrel is installed on the moving part of the double-axis moving machine, an electric control valve is installed between the discharge end of the storage barrel and the nozzle, a feed pipe is connected to the top of the storage barrel, and the tail end of the feed pipe passes through the shell, and also includes a clamping assembly arranged on the workbench, the clamping assembly Located inside the shell, it is used to clamp and fix the diode. An exhaust pipe is connected between the shell and the storage barrel. An electric stirring rack is installed on the top of the storage barrel to stir the glue. An air guide pipe is connected between the shell and the tail end of the exhaust pipe. A control valve I is installed on the air guide pipe. A vacuum pump is installed on the shell. The vacuum pump is used to vacuum the shell and the storage barrel through the air guide pipe and the exhaust pipe. After the glue is vacuum treated, the diode is vacuum-coated. A loading and unloading component is provided on the workbench for loading and unloading the diode.
[0008] Further description includes a fixing frame fixed to the inner side of the shell, a hook is slidably connected to the fixing frame, the inner side of the hook is in contact with the exhaust pipe and the feed pipe, and is used to support the exhaust pipe and the feed pipe.
[0009] To further illustrate, the clamping assembly includes a vertical plate symmetrically fixed to the workbench, an electric rotating seat is installed on the vertical plate, and a spring is symmetrically fixed to the inner side of the electric rotating seat for clamping and fixing the pins of the diode.
[0010] Further explanation, the loading and unloading components include horizontal plates fixed on both sides of the workbench, guide rails I are symmetrically fixed on the top of the horizontal plates, and electric slides are slidably connected to the inner side of guide rails I. A unloading rack is placed on one of the electric slides, which is used to remove the diodes that have been coated with glue to complete unloading, and a loading rack is placed on the other electric slide, which is used to place the diodes into the electric rotating seat to complete loading. A lifting component is provided on the electric slide to drive the unloading rack and the loading rack to move up and down, and guide rails III are symmetrically fixed on the electric door, which correspond to guide rails I, and guide rails II are symmetrically fixed between the vertical plates on the workbench, and guide rails II correspond to guide rails III.
[0011] Further explanation, the lifting assembly includes a slotted hole symmetrically opened on the unloading rack and the loading rack, a driving rod is symmetrically connected to the top of the electric slide, the end of the driving rod is slidingly connected to the slotted hole, and is used to drive the slotted hole to swing, and a driving motor is symmetrically installed on the electric slide, and the output shaft end of the driving motor is fixedly connected to the end of the driving rod.
[0012] Further explanation, the diode processing glue coating device also includes an electric robotic arm symmetrically installed on the inner side of the shell, a frame is installed between the tail ends of the electric robotic arm, which is used to collect the removed residual glue, and an electric heating wire is installed on the outer side of the frame to heat the nozzle. A discharge pipe is connected between the frame and the shell, and a control valve II is installed on the discharge pipe. A water supply assembly is provided between the shell and the nozzle to discharge water into the nozzle.
[0013] Further explanation, the water supply assembly includes a hose fixedly connected to the shell, the water outlet end of the hose is connected to the nozzle, and is used to discharge water into the nozzle. A control valve III is installed on the hose, and a cross frame is fixed to the inside of the shell. A guide frame is slidably connected to the bottom of the cross frame. The inner side of the guide frame is in contact with the hose to support and limit the hose.
[0014] To further illustrate, the diode processing and gluing device also includes a transparent window fixedly connected to the shell, which allows an operator to check the gluing status of the diode.
[0015] The beneficial effects of the present invention are:
[0016] 1. Use a vacuum pump to evacuate the shell to create a vacuum environment. At the same time, the vacuum pump also evacuates the storage barrel through the air guide pipe and the exhaust pipe to make the glue in the storage barrel in a vacuum state. Start the electric stirring rack to stir the glue in the storage barrel to eliminate the bubbles in the glue. Then, the glue with bubbles eliminated is sprayed out through the nozzle to vacuum coat the diode. In this way, the glue can be vacuum-coated on the diode after being vacuum-treated to prevent the generation of bubbles, thereby improving the quality of glue coating.
[0017] 2. Under the action of the unloading rack and the loading rack, the diodes can be transported to the electric rotating seat to complete loading, and the unloading rack can remove the glued diodes to complete unloading. In this way, the loading and unloading of the diodes can be completed, thereby improving the overall work efficiency.
[0018] 3. Under the action of the cleaning component, the residual glue in the nozzle can be removed, which can prevent a large amount of residual glue in the nozzle from solidifying and causing blockage, so that the nozzle can be used normally in the future. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.
[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of the dual-axis moving machine, nozzle and storage barrel of the present invention.
[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of the electric control valve of the present invention.
[0022] Figure 4 It is a schematic diagram of the three-dimensional structure of the clamping assembly of the present invention.
[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the vacuum pump, air guide pipe and air extraction pipe of the present invention.
[0024] Figure 6 It is a schematic diagram of the three-dimensional structure of the electric stirring frame of the present invention.
[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the assembly and disassembly component of the present invention.
[0026] Figure 8 It is a schematic diagram of the three-dimensional structure of the driving rod, the straight hole and the driving motor of the present invention.
[0027] Figure 9 This is a schematic diagram of the three-dimensional structure of guide rails I, II and III after they are docked.
[0028] Figure 10 It is a schematic diagram of the three-dimensional structure of the cleaning component of the present invention.
[0029] Figure 11 It is a schematic diagram of the three-dimensional structure of the hose and control valve III of the present invention.
[0030] In the figure: 1, workbench, 2, guide frame, 21, collection frame, 3, shell, 4, electric door, 5, double-axis moving machine, 6, nozzle, 61, storage barrel, 7, feed pipe, 71, electric control valve, 8, vertical plate, 81, electric rotating seat, 82, reed, 9, vacuum pump, 10, air guide pipe, 101, control valve I, 11, exhaust pipe, 12, fixed frame, 13, hook, 131, electric stirring frame, 14, horizontal plate, 141, Guide rail I, 142. Guide rail II, 143. Guide rail III, 144. Electric slide, 145. Unloading rack, 146. Loading rack, 147. Driving rod, 148. Slotted hole, 149. Driving motor, 15. Electric robotic arm, 151. Frame, 152. Heating wire, 153. Discharge pipe, 154. Control valve II, 155. Hose, 1551. Control valve III, 156. Cross frame, 157. Guide frame, 16. Transparent window. DETAILED DESCRIPTION
[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0032] Example: A diode processing glue coating device, please refer to Figures 1-9 As shown, it includes a workbench 1 and a guide frame 2 fixed to the top of the workbench 1. An opening corresponding to the guide frame 2 is opened in the middle of the top of the workbench 1. A collection frame 21 is slidably connected to the left side of the guide frame 2. The collection frame 21 can collect the fallen glue. A shell 3 is fixed to the top of the workbench 1. Electric doors 4 are rotatably installed on the lower parts of the left and right sides of the shell 3. A double-axis moving machine 5 is installed on the upper inner part of the shell 3. A nozzle 6 is installed on the moving part of the double-axis moving machine 5. The moving part of the double-axis moving machine 5 A storage barrel 61 is installed on the component, and an electric control valve 71 is installed between the discharge end of the storage barrel 61 and the upper part of the nozzle 6. The front side of the top of the storage barrel 61 is connected to the feed pipe 7, and the tail end of the feed pipe 7 passes through the upper right side of the shell 3. It also includes a clamping assembly, a vacuum pump 9, an air guide pipe 10, a control valve I101, an exhaust pipe 11, a fixing frame 12, a hook 13, an electric stirring frame 131 and a loading and unloading assembly. A clamping assembly is provided on the top of the workbench 1. The clamping assembly is located in the shell 3. When the clamping assembly is in operation, The clamping assembly can realize the clamping and fixing of the diode. An exhaust pipe 11 is connected between the right side of the shell 3 and the front side of the top of the storage barrel 61. An electric stirring frame 131 is installed in the middle of the top of the storage barrel 61. The electric stirring frame 131 can stir the glue. An air guide pipe 10 is connected between the right side of the top of the shell 3 and the tail end of the exhaust pipe 11. A control valve I 101 is installed on the air guide pipe 10. A vacuum pump 9 is installed in the middle of the top of the shell 3. The vacuum pump 9 is used to evacuate the inside of the shell 3 and at the same time, the air is pumped out through the guide pipe. The air pipe 10 and the exhaust pipe 11 evacuate the storage barrel 61 so that the diode is vacuum-coated after the glue is vacuum-treated. A loading and unloading assembly is provided on the workbench 1. When the loading and unloading assembly is in operation, the loading and unloading assembly can realize the loading and unloading of the diode. A fixing frame 12 is fixedly connected to the top front side of the shell 3, and four hooks 13 are slidably connected to the bottom of the fixing frame 12. The inner side of the hook 13 is in contact with the exhaust pipe 11 and the feed pipe 7. The hook 13 can support the exhaust pipe 11 and the feed pipe 7.
[0033] See also Figure 4 As shown, the clamping assembly includes a vertical plate 8, an electric rotating seat 81 and a spring 82. Four vertical plates 8 are symmetrically fixed to the front and back of the top of the workbench 1. The electric rotating seat 81 is installed on the upper part of the vertical plate 8. The spring 82 is symmetrically fixed to the left and right sides of the inner side of the electric rotating seat 81. When the diode is placed in the electric rotating seat 81, the spring 82 can clamp and fix the pins of the diode.
[0034] See also Figure 7-Figure 9As shown, the loading and unloading components include a transverse plate 14, a guide rail I 141, a guide rail II 142, a guide rail III 143, an electric slide 144, a discharge rack 145, a loading rack 146 and a lifting component. The upper parts of the left and right sides of the workbench 1 are fixed with transverse plates 14, and the tops of the left and right transverse plates 14 are symmetrically fixed with guide rails I 141 on the front and back. The inner sides of the left and right guide rails I 141 are slidably connected with electric slides 144. A discharge rack 145 is placed on the left electric slide 144. When the discharge rack 145 moves upward, the discharge rack 145 can remove the glue-coated diode to complete the unloading. A loading rack 146 is placed on the right electric slide 144. When the loading rack 146 is operating, the loading rack 146 can place the diode into the electric rotating seat 81 to complete the loading. Lifting components are provided on the left and right electric slides 144. When the lifting components are operating, the lifting components can drive the discharge rack 145 and the loading rack 146 to complete the loading. The material rack 146 moves up and down, and the guide rail III 143 is fixedly connected symmetrically on the front and back sides of the electric doors 4 on the left and right sides where they are close to each other. The guide rail III 143 corresponds to the guide rail I 141, and the guide rail II 142 is fixedly connected to the top of the workbench 1 symmetrically. The guide rail II 142 is located between the vertical plates 8 on the front and rear sides, and the guide rail II 142 corresponds to the guide rail III 143; the lifting assembly includes a driving rod 147 and a driving motor 149, and the unloading rack 145 and the loading rack 146 are both symmetrically opened with a straight hole 148. The top of the electric slide 144 is symmetrically connected to the driving rod 147 for rotation, and the end of the driving rod 147 is slidingly connected to the straight hole 148. When the driving rod 147 swings, the driving rod 147 can drive the straight hole 148 to swing. The front and rear electric slides 144 are symmetrically installed on the side close to each other with a driving motor 149, and the output shaft end of the driving motor 149 is fixedly connected to the inner end of the driving rod 147.
[0035] Initially, the feed pipe 7 is connected to a container filled with glue, and the glue is first discharged into the feed pipe 7, and the glue in the feed pipe 7 is discharged into the storage barrel 61, and the glue contacts the electric stirring frame 131. The electric control valve 71 blocks the glue in the storage barrel 61. When the storage barrel 61 is filled with an appropriate amount of glue, the glue is stopped from being discharged into the hose 155, and an appropriate amount of diodes are placed on the loading rack 146. Then, the left and right electric doors 4 are started to swing downward and open, and the electric doors 4 swing downward to drive the guide rail III 143 to swing downward to a horizontal state, and then the right drive motor 149 is started, and the right drive motor 149 drives the right drive rod 147 to swing upward, and the right drive rod 147 swings upward through the straight hole 148 to drive the loading rack 146 to move upward, and the loading rack 14 6 drives the diode to move upward. When the loading rack 146 moves upward to the maximum stroke, the right drive motor 149 is turned off, and the right electric slide 144 is started to move to the left. The right electric slide 144 moves to the left and drives the loading rack 146 to move to the left through the drive rod 147. The loading rack 146 drives the diode to move to the left. The right electric slide 144 continuously moves to the left and slides on the guide rails III 143 and II 142, thereby causing the loading rack 146 to drive the diode to move to the left and be in the housing 3. When the diode moves to the left and is located just above the electric rotating seat 81, the right electric slide 144 is turned off. At this time, the right electric slide 144 is on the guide rail II 142, and then the right drive motor 149 is started to rotate in the opposite direction. The right drive motor 14 9 reverse rotation drives the right driving rod 147 to swing downward, and the right driving rod 147 drives the right loading rack 146 to move downward through the slotted hole 148. The right loading rack 146 moves downward to drive the diode to move downward. The diode moves downward to the electric rotating seat 81 and contacts the reed 82. The diode stops moving downward. The loading rack 146 continues to move downward so that the inner top contacts the diode. The loading rack 146 moves downward to push the diode to move downward and squeeze the reed 82. When the diode moves downward to the inner center position of the electric rotating seat 81, the right driving motor 149 is turned off, the loading rack 146 stops moving downward, and the reed 82 clamps the diode. The right electric slide 144 can be started to pass through the guide rail II 142 and the guide rail III 14 3 moves to the right to reset, the right electric slide 144 moves to the right and drives the loading rack 146 to move to the right to reset through the driving rod 147, the loading rack 146 moves to the right to reset and disengages from the diode, the right electric slide 144 is closed, the left and right electric doors 4 are started to swing upward to reset and close the shell 3, the electric doors 4 drive the left and right guide rails III 143 to swing upward to reset, now the nozzle 6 is just above the rightmost diode, first start the vacuum pump 9, the vacuum pump 9 vacuums the shell 3, and at the same time starts the control valve I 101, the control valve I 101 stops closing the inside of the air guide pipe 10, the vacuum pump 9 vacuums the exhaust pipe 11 through the air guide pipe 10, the exhaust pipe 11 vacuums the storage barrel 61, and now start the electric stirring rack 131,The electric stirring frame 131 stirs the glue, and the bubbles in the glue after stirring are eliminated in the vacuum environment of the storage barrel 61. When the bubbles in the glue in the storage barrel 61 are completely eliminated, the electric stirring frame 131 and the control valve I101 are closed, and the vacuum pump 9 is closed at the same time, and the electric control valve 71 can be started. The glue in the storage barrel 61 is discharged into the nozzle 6 through the electric control valve 71, and then the biaxial moving machine 5 is started to drive the nozzle 6 to move downward. The nozzle 6 moves downward and is close to the rightmost diode in the coating area. The biaxial moving machine 5 is closed, and the nozzle 6 is started to spray the glue on the diode in a vacuum environment to complete the vacuum coating. At the same time, the electric rotating seat 81 is started to rotate. The rotation of the electric rotating seat 81 drives the reed 82 to rotate, and the rotation of the reed 82 drives the diode to rotate. The glue is fully coated on the rotation, and the glue forms a layer of silicone rubber on the surface of the diode. In this way, the diode can be vacuum coated after the glue is vacuum treated to prevent the generation of bubbles, thereby improving the quality of glue coating. When the rightmost diode is coated with glue, the nozzle 6 and the electric control valve 71 are closed, the nozzle 6 stops spraying glue, and the storage barrel 61 stops discharging glue into the nozzle 6. The electric rotating seat 81 is closed, and the electric rotating seat 81 stops driving the rightmost diode to rotate through the reed 82. Then the dual-axis moving machine 5 is started to drive the nozzle 6 to move upward and reset. The dual-axis moving machine 5 is controlled to drive the nozzle 6 to move to the left to correspond to the next diode. The nozzle 6 moves to the left, driving the storage barrel 61 to move to the left, and the storage barrel 61 moves to the left to drive the exhaust pipe 11 And the feed pipe 7 moves to the left, the hook 13 supports and guides the exhaust pipe 11 and the feed pipe 7 moving to the left, so as to prevent the exhaust pipe 11 and the feed pipe 7 from being scattered and knotted, affecting their use. Then, the glue can be vacuum-coated on the diode according to the above operation. During the coating process, excess glue falls downward through the opening of the workbench 1 and falls into the guide frame 2. The glue in the guide frame 2 flows into the collecting frame 21 for collection. At the same time, while the diodes are being coated with glue, the operator can continue to place an appropriate amount of diodes on the loading rack 146. After the diodes on the electric rotating seat 81 are coated with glue, the nozzle 6 is driven to move upward and reset by the dual-axis moving machine 5, and the nozzle 6 is driven to move right and reset. The nozzle 6 passes through the storage The cylinder 61 drives the feeding pipe 7 and the exhaust pipe 11 to move to the right and reset, and the hook 13 continues to support and guide the feeding pipe 7 and the exhaust pipe 11 during the reset process, and then the left and right electric doors 4 are started to swing downward, driving the left and right guide rails III 143 to swing downward to a horizontal state, and then the left electric slide 144 is started to move to the right, and the left electric slide 144 moves to the right and drives the unloading rack 145 to move to the right through the left driving rod 147, and the left electric slide 144 moves to the right and slides onto the guide rail III 143 onto the guide rail II 142, and then the unloading rack 145 moves to the right into the shell 3 and is directly under the diode coated with glue, and then the left electric slide 144 is closed, and the left driving motor 149 is started to drive the left driving rod 147 to swing upward,The left driving rod 147 swings upward to drive the unloading rack 145 to move upward, and the unloading rack 145 moves upward to contact the diode, and the unloading rack 145 moves upward to drive the diode to move upward, and the diode moves upward to break contact with the reed 82 to complete the unloading, and the left driving motor 149 is turned off. The left driving rod 147 stops driving the diode to move upward, and the left electric slide 144 is started to move to the left and reset. The unloading rack 145 is driven to move to the left and reset by the left driving rod 147. The unloading rack 145 resets and drives the diode to move to the left to the outside of the shell 3, and the left electric slide is turned off. The unloading rack 145 and the loading rack 146 can complete the loading and unloading of the diodes, thereby improving the overall work efficiency. At this time, the right electric slide 144 is started to move to the left, so that the next batch of diodes moves to the left to the shell 3 to complete the subsequent loading. After the next diode is loaded, the electric door 4 is started to swing upward and closed, and the vacuum pump 9 can be started again to make the shell 3 vacuum state. According to the above operation, the diodes can continue to be coated with glue. At the same time, the operator can remove the glue-coated diodes from the unloading rack 145. When the collection frame 21 is filled with an appropriate amount of glue, pull the collection frame 21 to the left to disengage it from the guide frame 2, and perform subsequent processing on the glue in the collection frame 21. When all the glue in the collection frame 21 is poured out, the collection frame 21 is returned to the guide frame 2.
[0036] See also Figure 10 and Figure 11 As shown, the diode processing glue coating device also includes an electric manipulator 15, a frame 151, a heating wire 152, a discharge pipe 153, a control valve II 154 and a water supply component. The electric manipulator 15 is symmetrically installed on the front and rear sides of the right side of the shell 3. A frame 151 is installed between the tail ends of the front and rear electric manipulators 15. The frame 151 can collect the removed residual glue. The upper part of the outer surface of the frame 151 is installed with a heating wire 152. When the heating wire 152 is started, the heating wire 152 can heat the nozzle 6 to melt and remove the residual glue attached to the nozzle 6. A discharge pipe 153 is connected between the front side of the frame 151 and the right side of the front side of the shell 3. The front side of the discharge pipe 153 is installed with a control valve II 154. The shell 3 A water supply assembly is provided between the shell 3 and the nozzle 6. When the water supply assembly is in operation, the water supply assembly can discharge water into the nozzle 6 to clean the nozzle 6. The water supply assembly includes a hose 155, a control valve III 1551, a cross frame 156 and a guide frame 157. The hose 155 is fixedly connected to the upper rear side of the right side of the shell 3. The water outlet end of the hose 155 is connected to the lower rear side of the nozzle 6. The hose 155 can discharge water into the nozzle 6. The control valve III 1551 is installed at the lower part of the hose 155. A cross frame 156 is fixed to the top rear side of the shell 3. Four guide frames 157 are slidably connected to the bottom of the cross frame 156. The inner side of the guide frame 157 is in contact with the hose 155. The guide frame 157 can support and limit the hose 155.
[0037] Initially, the hose 155 is connected to an external water source. When water is first discharged into the hose 155, the water in the hose 155 is blocked by the control valve III 1551. When the nozzle 6 moves to the left, the nozzle 6 drives the hose 155 to move to the left, and the hose 155 drives the guide frame 157 to move to the left. The guide frame 157 supports and guides the hose 155 moving to the left. After all the diodes are coated with glue, the electric manipulator 15 is started to drive the frame 151 to move, and the frame 151 drives the heating wire 152 to move. Then, when the frame 151 moves and covers the lower part of the nozzle 6, the electric manipulator 15 is closed and the heating wire 152 is started. The heating wire 152 contacts the nozzle through the frame 151. 6 is heated, and the residual glue attached to the nozzle 6 melts under the high temperature environment. The melted residual glue falls from the nozzle 6 into the frame 151, and the control valve III 1551 is started at the same time. The control valve III 1551 stops blocking the water in the hose 155, and the water in the hose 155 is discharged into the nozzle 6. The water flushes the melted residual glue in the hose 155, and the water and the residual glue fall into the frame 151 together. The water in the frame 151 is discharged into the discharge pipe 153 together with the residual glue and is blocked by the control valve II 154. The control valve II 154 is started, and the control valve II 154 stops blocking the water and residual glue in the discharge pipe 153. The discharge pipe 153 discharges the water and the residual glue for collection and treatment. When all the residual glue inside the nozzle 6 is removed, the heating wire 152 and the control valve III 1551 are closed, the water in the hose 155 stops flowing into the nozzle 6, and the control valve II 154 is closed at the same time. Then, the electric mechanical arm 15 is activated to drive the frame 151 to move to its original position. The frame 151 stops covering the lower part of the nozzle 6. Then, when the nozzle 6 moves to the right and resets, the nozzle 6 drives the hose 155 to move to the right and resets, and the guide frame 157 continues to support and guide the hose 155. This prevents the large amount of glue remaining in the nozzle 6 from solidifying and causing blockage, so that the nozzle 6 can be used normally in the future.
[0038] See also Figure 1 As shown, the diode processing and gluing device further includes a transparent window 16 , which is fixedly connected to the upper left side of the housing 3 , and the transparent window 16 allows an operator to check the gluing status of the diode.
[0039] When the diode is being coated with glue, the operator can check the gluing situation of the diode through the transparent window 16. Like this, can make corresponding processing according to the gluing situation of the diode in time, thereby guarantee the smooth gluing of the diode.
[0040] The above description is merely an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention are intended to be included within the scope of protection of the present invention. Any content not elaborated in detail herein is already known to those skilled in the art.
Claims
1. A diode processing glue coating device, comprising a workbench (1) and a guide frame (2) fixed to the inner side of the workbench (1), a collecting frame (21) being slidably connected to the guide frame (2), a shell (3) being fixed to the workbench (1), electric doors (4) being rotatably installed on both sides of the shell (3), a double-axis moving machine (5) being installed on the inner side of the shell (3), a nozzle (6) being installed on the moving part of the double-axis moving machine (5), a storage barrel (61) being installed on the moving part of the double-axis moving machine (5), an electric control valve (71) being installed between the discharge end of the storage barrel (61) and the nozzle (6), a feed pipe (7) being connected to the top of the storage barrel (61), and a tail end of the feed pipe (7) passing through the shell (3), characterized in that The workbench (1) further comprises a clamping assembly disposed on the workbench (1), the clamping assembly being located in the shell (3) and being used to clamp and fix the diode; an exhaust pipe (11) being connected between the shell (3) and the storage barrel (61); an electric stirring frame (131) being installed on the top of the storage barrel (61) to stir the glue; an air guide pipe (10) being connected between the shell (3) and the tail end of the exhaust pipe (11); a control valve I (101) being installed on the air guide pipe (10); a vacuum pump (9) being installed on the shell (3); the vacuum pump (9) being used to evacuate the inside of the shell (3); and at the same time, evacuate the inside of the storage barrel (61) through the air guide pipe (10) and the exhaust pipe (11), so that the glue is vacuum-treated and then the diode is vacuum-coated; a loading and unloading assembly is provided on the workbench (1) for loading and unloading the diode; It also includes a fixing frame (12) fixed to the inner side of the shell (3), a hook (13) is slidably connected to the fixing frame (12), and the inner side of the hook (13) is in contact with the exhaust pipe (11) and the feed pipe (7), and is used to support the exhaust pipe (11) and the feed pipe (7); The clamping assembly includes a vertical plate (8) symmetrically fixed to the workbench (1), an electric rotating seat (81) is installed on the vertical plate (8), and a spring (82) is symmetrically fixed to the inner side of the electric rotating seat (81) for clamping and fixing the pins of the diode; The loading and unloading assembly includes a horizontal plate (14) fixed to both sides of the workbench (1), a guide rail I (141) symmetrically fixed to the top of the horizontal plate (14), and an electric slide (144) slidably connected to the inner side of the guide rail I (141), wherein a discharge rack (145) is placed on one of the electric slides (144) for removing the diodes coated with glue to complete the unloading, and a loading rack (146) is placed on the other electric slide (144) for placing the diodes into the electric rotating seat (81) to complete the loading, and a lifting assembly is provided on the electric slide (144) for driving the discharge rack (145) and the loading rack (146) to move up and down, and a guide rail III (143) corresponding to the guide rail I (141) is symmetrically fixed on the electric door (4), and a guide rail II (142) located between the vertical plates (8) is symmetrically fixed on the workbench (1), and the guide rail II (142) corresponds to the guide rail III (143).
2. A diode processing glue coating device as claimed in claim 1, characterized in that: The lifting assembly includes a slotted hole (148) symmetrically opened on the unloading rack (145) and the loading rack (146), a driving rod (147) is symmetrically connected to the top of the electric slide (144), and the end of the driving rod (147) is slidably connected to the slotted hole (148) for driving the slotted hole (148) to swing. A driving motor (149) is symmetrically installed on the electric slide (144), and the end of the output shaft of the driving motor (149) is fixedly connected to the end of the driving rod (147).
3. A diode processing glue coating device as claimed in claim 2, characterized in that: The diode processing glue coating device also includes an electric mechanical arm (15) symmetrically installed on the inner side of the shell (3), a frame (151) is installed between the tail ends of the electric mechanical arm (15) for collecting the removed residual glue, an electric heating wire (152) is installed on the outer side of the frame (151) for heating the nozzle (6), a discharge pipe (153) is connected between the frame (151) and the shell (3), a control valve II (154) is installed on the discharge pipe (153), and a water supply component is provided between the shell (3) and the nozzle (6) for discharging water into the nozzle (6).
4. A diode processing glue coating device as claimed in claim 3, characterized in that: The water supply assembly includes a hose (155) fixedly connected to the housing (3), the water outlet end of the hose (155) is connected to the nozzle (6) for discharging water into the nozzle (6), a control valve III (1551) is installed on the hose (155), a cross frame (156) is fixedly connected to the inner side of the housing (3), and a guide frame (157) is slidably connected to the bottom of the cross frame (156), and the inner side of the guide frame (157) contacts the hose (155) to support and limit the hose (155).
5. The diode processing glue coating device according to claim 4, characterized in that: The diode processing and gluing device further comprises a transparent window (16) fixedly connected to the housing (3) and allowing an operator to check the gluing condition of the diode.
Citation Information
Patent Citations
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CN114985199B
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CN116475014A
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CN217797085U