Phase change metal / polymer composite heat dissipation material with three-dimensional network structure and preparation method of phase change metal / polymer composite heat dissipation material

Abstract

The invention discloses a phase-change metal / polymer composite heat dissipation material with a three-dimensional network structure and a preparation method of the phase-change metal / polymer composite heat dissipation material. The material is prepared from the following components in percentage by weight: 50-90% of phase-change metal, 10-50% of polymer and 0-20% of heat-conducting filler, the phase change metal / polymer composite heat dissipation material provided by the invention has the advantages of high heat conductivity, high latent heat, low density, easy processing and the like, and can effectively solve the heat dissipation problem of electronic devices.

Description

Technical Field

[0001] The present invention belongs to the field of material technology, and in particular relates to a phase-change metal / polymer composite heat dissipation material with a three-dimensional network structure and a preparation method thereof. Background Art

[0002] As electronic devices develop towards miniaturization, integration, and high performance, their power density continues to increase, leading to a sharp increase in heat generation. Traditional heat dissipation materials are no longer able to meet the growing heat dissipation needs. Therefore, the development of new and efficient heat dissipation materials has become a current research hotspot.

[0003] Phase change materials (PCMs) are specialized substances that undergo phase change properties within a specific temperature range. Common PCMs include wax, brine, and metal alloys. When a PCM reaches its phase transition temperature, it undergoes a physical change, absorbing and storing latent heat, thereby maintaining a stable surface temperature. When the ambient temperature drops, the PCM releases this stored heat, dissipating the heat.

[0004] Phase change materials (PCMs) have attracted considerable attention due to their ability to absorb or release large amounts of latent heat during phase transitions. Their application in heat dissipation can effectively reduce device temperature fluctuations and improve device stability and reliability. However, traditional PCMs suffer from drawbacks such as low thermal conductivity and high leakage, which limit their practical application.

[0005] Metals offer excellent thermal conductivity, but they are also dense and difficult to process. Polymers, on the other hand, offer advantages such as light weight, ease of processing, and low cost, but they exhibit poor thermal conductivity. Combining metals and polymers can fully leverage the advantages of both, creating composite materials with superior overall performance. Summary of the Invention

[0006] The present invention aims to overcome the shortcomings of existing technologies by providing a phase-change metal / polymer composite heat dissipation material with a three-dimensional network structure and a method for preparing the same. This material offers advantages such as high thermal conductivity, high latent heat, low density, and ease of processing, effectively solving heat dissipation issues in electronic devices.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is as follows: The first object of the present invention is to provide a phase change metal / polymer composite heat dissipation material with a three-dimensional network structure, wherein the material is composed of the following components in weight percentage: 50-90% phase change metal, 10-50% polymer and 0-20% thermal conductive filler.

[0008] Furthermore, the phase change metal is a low melting point metal or alloy, including one or more of gallium, indium, tin, bismuth, lead, zinc, aluminum, magnesium, copper, silver, and gold.

[0009] Furthermore, the polymer is a thermoplastic polymer or a thermosetting polymer, including one or more of epoxy resin, silicone rubber, polyurethane, polyethylene, polypropylene, polystyrene, polyamide, and polyimide.

[0010] Furthermore, the thermally conductive filler is a high thermally conductive inorganic filler, including one or more of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes.

[0011] The second object of the present invention is to provide a method for preparing a phase change metal / polymer composite heat dissipation material, comprising the following steps: Step 1: heating the phase change metal to above its melting point to melt it into a liquid state; Step 2: uniformly mixing the polymer and the thermally conductive filler to obtain a mixture; Step 3: mixing the liquid phase-change metal obtained in step 1 with the mixture obtained in step 2, and stirring the mixture to form a three-dimensional network structure of the liquid phase-change metal in the mixture; Step 4: The mixture obtained in step 3 is molded to obtain a phase change metal / polymer composite heat dissipation material with a three-dimensional network structure.

[0012] Furthermore, in step 3, the stirring speed is 100-1000 rpm, and the stirring time is 1-60 minutes.

[0013] Furthermore, in step 4, the molding method includes one of injection molding, compression molding, extrusion molding, and casting molding.

[0014] The above technical solution can achieve the following beneficial effects: The phase-change metal / polymer composite heat dissipation material provided by the present invention has the advantages of high thermal conductivity, high latent heat, low density, and easy processing, and can effectively solve the heat dissipation problem of electronic devices.

[0015] The present invention stirs a liquid phase-change metal and a polymer mixture to form a three-dimensional network structure within the mixture, significantly improving the thermal conductivity and mechanical strength of the material. The preparation method provided by the present invention is simple and easy to implement, making it easy to industrialize. DETAILED DESCRIPTION

[0016] The present invention will be further described below by way of examples: A phase-change metal / polymer composite heat dissipation material with a three-dimensional network structure is composed of the following components in weight percentage: 50-90% phase-change metal, 10-50% polymer and 0-20% thermal conductive filler.

[0017] The phase change metal is a low melting point metal or alloy, including one or more of gallium, indium, tin, bismuth, lead, zinc, aluminum, magnesium, copper, silver, and gold.

[0018] The polymer is a thermoplastic polymer or a thermosetting polymer, including one or more of epoxy resin, silicone rubber, polyurethane, polyethylene, polypropylene, polystyrene, polyamide, and polyimide.

[0019] The thermally conductive filler is a high thermally conductive inorganic filler, including one or more of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes.

[0020] A method for preparing a phase-change metal / polymer composite heat dissipation material comprises the following steps: Step 1: Heat the phase change metal to above its melting point to melt it into a liquid state; Step 2: Evenly mix the polymer and the thermal conductive filler to obtain a mixture; Step 3: Mix the liquid phase change metal obtained in step 1 with the mixture obtained in step 2, and stir to form a three-dimensional network structure of the liquid phase change metal in the mixture; the stirring speed is 100-1000 rpm, and the stirring time is 1-60 minutes.

[0021] Step 4: The mixture obtained in step 3 is molded to obtain a phase change metal / polymer composite heat dissipation material with a three-dimensional network structure; the molding method includes one of injection molding, compression molding, extrusion molding, and casting molding. Example 1

[0022] 50 parts by weight of gallium indium tin alloy are heated to 50° C. to melt it into a liquid state; 40 parts by weight of epoxy resin and 10 parts by weight of aluminum nitride powder are evenly mixed to obtain a mixture; the liquid gallium indium tin alloy obtained in step 1 is mixed with the mixture obtained in step 2, and the mixture is stirred at a speed of 500 rpm for 10 minutes to form a three-dimensional network structure of the liquid gallium indium tin alloy in the mixture; the mixture obtained in step 3 is injected into a mold and cured at 80° C. for 2 hours to obtain a phase change metal / polymer composite heat dissipation material with a three-dimensional network structure. Example 2

[0023] 70 parts by weight of a bismuth-tin alloy is heated to 150° C. to melt it into a liquid state; 20 parts by weight of silicone rubber and 10 parts by weight of silicon carbide powder are uniformly mixed to obtain a mixture; the liquid bismuth-tin alloy obtained in step 1 is mixed with the mixture obtained in step 2, and the mixture is stirred at 800 rpm for 30 minutes to form a three-dimensional network structure of the liquid bismuth-tin alloy in the mixture; and the mixture obtained in step 3 is pressed and molded to obtain a phase change metal / polymer composite heat dissipation material having a three-dimensional network structure. Example 3

[0024] 90 parts by weight of an aluminum-silicon alloy is heated to 600° C. to melt it into a liquid state; 10 parts by weight of a polyimide and 5 parts by weight of an aluminum oxide powder are uniformly mixed to obtain a mixture; the liquid aluminum-silicon alloy obtained in step 1 is mixed with the mixture obtained in step 2, and the mixture is stirred at a speed of 1000 rpm for 60 minutes to form a three-dimensional network structure of the liquid aluminum-silicon alloy in the mixture; and the mixture obtained in step 3 is extruded to obtain a phase change metal / polymer composite heat dissipation material having a three-dimensional network structure.

[0025] Comparative Example 1: 50 parts by weight of gallium indium tin alloy are heated to 50° C. to melt it into a liquid state; 50 parts by weight of epoxy resin are mixed evenly to obtain a mixture; the liquid gallium indium tin alloy obtained in step 1 is mixed with the mixture obtained in step 2, and stirred at a speed of 500 rpm for 10 minutes; the mixture obtained in step 3 is injected into a mold and cured at 80° C. for 2 hours to obtain a phase change metal / polymer composite heat dissipation material.

[0026] Performance test: The phase change metal / polymer composite heat dissipation materials prepared in Examples 1-3 and Comparative Example 1 were tested for thermal conductivity, latent heat value and density.

[0027] The phase-change metal / polymer composite heat dissipation materials prepared in Examples 1-3 of the present invention exhibit high thermal conductivity and latent heat values while maintaining a low density. The material prepared in Comparative Example 1, however, lacks a three-dimensional network structure, resulting in a significantly lower thermal conductivity than that of Examples 1-3. This material offers advantages such as high thermal conductivity, high latent heat, low density, and ease of processing, effectively addressing heat dissipation issues in electronic devices.

[0028] The above are all preferred embodiments of the present invention. For ordinary technicians in this technical field, without departing from the principle of the present invention, various equivalent modifications to the present invention are within the scope of protection of the claims attached to this application.

Claims

1. A phase change metal / polymer composite heat dissipation material with a three-dimensional network structure, characterized by: The material is composed of the following components by weight: 50-90% phase change metal, 10-50% polymer and 0-20% thermal conductive filler.

2. The phase change metal / polymer composite heat dissipation material with a three-dimensional network structure according to claim 1, characterized in that: The phase change metal is a low melting point metal or alloy, including one or more of gallium, indium, tin, bismuth, lead, zinc, aluminum, magnesium, copper, silver, and gold.

3. The phase change metal / polymer composite heat dissipation material with a three-dimensional network structure according to claim 1, characterized in that: The polymer is a thermoplastic polymer or a thermosetting polymer, including one or more of epoxy resin, silicone rubber, polyurethane, polyethylene, polypropylene, polystyrene, polyamide, and polyimide.

4. The phase change metal / polymer composite heat dissipation material with a three-dimensional network structure according to claim 1, characterized in that: The thermally conductive filler is a high thermally conductive inorganic filler, including one or more of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes.

5. A method for preparing the phase change metal / polymer composite heat dissipation material according to any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1: heating the phase change metal to above its melting point to melt it into a liquid state; Step 2: uniformly mixing the polymer and the thermally conductive filler to obtain a mixture; Step 3: mixing the liquid phase-change metal obtained in step 1 with the mixture obtained in step 2, and stirring the mixture to form a three-dimensional network structure of the liquid phase-change metal in the mixture; Step 4: The mixture obtained in step 3 is molded to obtain a phase change metal / polymer composite heat dissipation material with a three-dimensional network structure.

6. The method for preparing a phase change metal / polymer composite heat dissipation material having a three-dimensional network structure according to claim 1, characterized in that: In step 3, the stirring speed is 100-1000 rpm, and the stirring time is 1-60 minutes.

7. The method for preparing a phase change metal / polymer composite heat dissipation material having a three-dimensional network structure according to claim 1, characterized in that: In step 4, the molding method includes one of injection molding, compression molding, extrusion molding, and casting molding.