Chip testing method and device, electronic equipment and medium
By using the exposure collector to obtain the brightness difference sequence and identifying abnormal rules in wafer-level chip low-temperature test, the problem of inaccurate dew condensation in the prior art is solved, and the accurate judgment of the condensation phenomenon and the accurate acquisition of process parameters are achieved to prevent equipment damage.
Patent Information
- Application Number
- CN202510579000.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2025-08-12
AI Technical Summary
The prior art cannot accurately judge the condensation phenomenon in wafer-level chip low-temperature testing and provide corresponding drying and compression process parameters, resulting in short circuit failures and equipment damage during the test.
By setting up an exterior collector on the surface of the chip chuck, the brightness difference sequence of the transparent glass area and the frosted glass area is obtained, the continuous brightness difference abnormal rules are identified, the dew condensation phenomenon is determined, and the dew condensation process parameters are recorded.
It realizes accurate judgment of chip condensation phenomenon, and can accurately obtain process parameters when condensation occurs, preventing equipment damage during the test.
Smart Images
Figure CN120468622A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip testing technology, and more specifically, to a chip testing method, device, electronic equipment, and medium. Background Art
[0002] When wafer-level chips undergo low-temperature testing, the surface temperature of the wafer chuck in the test chamber will drop. Once the chuck temperature is too low, the water vapor partial pressure in the surrounding air will rise to the saturated vapor pressure level, which is very likely to cause condensation. The occurrence of this phenomenon will cause many serious problems, such as causing short circuit failures during the test process, affecting the microscope imaging effect, and even causing irreversible damage to the test equipment.
[0003] However, current technical means can only monitor the air dew point in the test chamber, but cannot provide accurate process parameters for the drying and compression process for wafer-level chips under different low-temperature testing scenarios. It is also difficult to accurately determine whether condensation has actually occurred in the chamber. Summary of the Invention
[0004] In view of this, the purpose of this application is to provide a chip testing method, device, electronic equipment and medium, aiming to achieve accurate judgment of chip condensation phenomenon and accurately obtain the process parameters when condensation occurs.
[0005] In a first aspect, the present application provides a chip testing method, the method comprising: obtaining a difference sequence for characterizing changes in surface phenomena of a dew collector, the difference sequence comprising brightness difference values at a plurality of consecutive collection moments, the dew collector being arranged on the surface of a chip chuck, the dew collector comprising a transparent glass area and a frosted glass area, each brightness difference value indicating the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area at a corresponding collection moment; identifying a plurality of brightness difference values in the difference sequence to determine whether a continuous brightness difference abnormality rule is triggered; if the continuous brightness difference abnormality rule is triggered, it is determined that condensation has occurred, and the condensation process parameters corresponding to the condensation moment are recorded.
[0006] In one possible embodiment, the chip chuck is covered with an isolation cover to form a closed test chamber, and a collection device is provided at a first through hole formed in the isolation cover opposite to the top wall of the dew collector, and the collection device is used to collect image data of the transparent glass area and the frosted glass area of the dew collector, wherein the difference sequence is obtained in the following manner: obtaining image data collected by the collection device at each collection moment; for each image data, calculating the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area in the image data to obtain the brightness difference corresponding to the image data; and generating the difference sequence by using the brightness difference values corresponding to all the image data.
[0007] In a possible embodiment, the isolation cover is arranged in a first test environment, a second through hole is formed on the side wall of the isolation cover, a dry compressed air source is provided in the first test environment, an air outlet of the dry compressed air source is connected to the second through hole via a delivery pipeline, and a flow regulating valve is provided on the delivery pipeline, wherein, before the step of obtaining a difference sequence for characterizing the surface phenomenon change of the dew collector, it also includes: controlling the flow regulating valve to open so that the dry compressed air in the dry compressed air source is delivered to the test chamber via the delivery pipeline at a preset volume flow rate, so that the test chamber is in a low-temperature test environment; controlling the acquisition equipment to acquire image data of the transparent glass area and the frosted glass area of the dew collector under the low-temperature test environment.
[0008] In one possible implementation, it is determined that the continuous brightness difference abnormality rule is triggered in the following manner: (A) obtaining a first brightness difference value at the t-th collection moment, and determining whether a first difference between the first brightness difference value and a second brightness difference value at the t-1-th collection moment exceeds a first preset threshold; (B) if the first difference value exceeds the first preset threshold, determining that the continuous brightness difference abnormality rule is triggered, and determining the t-th collection moment as the condensation moment; (C) if the first difference value does not exceed the first preset threshold, determining whether the second difference between the first brightness difference value and the second brightness difference value exceeds exceeds the second preset threshold; (D) if the second difference does not exceed the second preset threshold, set t=t+1 and return to step (A); (D) if the second difference exceeds the second preset threshold, determine whether the third difference between the second brightness difference and the third brightness difference at the t-2th collection moment exceeds the second preset threshold; (E) if the third difference does not exceed the second preset threshold, set t=t+1 and return to step (A); (F) if the third difference exceeds the second preset threshold, determine that the continuous brightness difference anomaly rule is triggered, and determine the tth collection moment as the condensation moment.
[0009] In a possible implementation, the brightness difference value at each acquisition moment is calculated using the following formula:
[0010]
[0011] Among them, R t is the brightness difference at the tth acquisition moment, R t1 is the brightness value of the frosted glass area at the tth acquisition moment, R t2 is the brightness value of the transparent glass area at the tth acquisition moment.
[0012] In a possible embodiment, a temperature sensor is provided on the chip chuck for collecting the temperature value of the chip chuck, and a chamber dew point sensor is further provided in the first test environment for collecting the air dew point in the test chamber, wherein the condensation process parameters include condensation flow rate, condensation duration, condensation chuck temperature value and condensation air dew point, the condensation flow rate indicates the volume flow rate of air delivered to the test chamber at the condensation moment, the condensation duration indicates the cumulative time from the start of collection of the collection device to the condensation moment, the condensation chuck temperature value indicates the temperature value of the chip chuck collected by the temperature sensor at the condensation moment, and the condensation air dew point indicates the air dew point collected by the chamber dew point sensor at the condensation moment.
[0013] In one possible embodiment, a test environment dew point sensor is further provided in the first test environment, and the test environment dew point sensor is used to collect the air dew point in the first test environment. An isolation door is provided on the isolation cover, and the isolation door is used to control the connection or isolation between the test chamber and the first test environment. The method further includes: when it is determined that condensation occurs, controlling the flow regulating valve to close, controlling the collection device to stop collection, and controlling the isolation door to open to connect the test chamber with the first test environment; when the difference between the air dew point of the test chamber and the air dew point of the first test environment is less than a safety threshold, controlling the isolation door to close to end the test.
[0014] In a second aspect, the present application provides a chip testing device, which includes: an acquisition module for acquiring a difference sequence for characterizing changes in surface phenomena of a dew collector, the difference sequence including brightness difference values at multiple consecutive acquisition moments, the dew collector being arranged on the surface of a chip chuck, the dew collector including a transparent glass area and a frosted glass area, each brightness difference value indicating the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area at a corresponding acquisition moment; an identification module for identifying multiple brightness difference values in the difference sequence to determine whether a continuous brightness difference abnormality rule is triggered; a recording module for determining that condensation has occurred if the continuous brightness difference abnormality rule is triggered, and recording the condensation process parameters corresponding to the condensation moment.
[0015] In a third aspect, the present application also provides an electronic device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the above method are performed.
[0016] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above method are executed.
[0017] The present application provides a chip testing method, apparatus, electronic device, and medium, wherein the method includes: obtaining a difference sequence for characterizing changes in surface phenomena of a dew collector, the difference sequence including brightness differences at multiple consecutive collection moments, the dew collector being disposed on the surface of a chip chuck, the dew collector including a transparent glass area and a frosted glass area, each brightness difference indicating the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area at a corresponding collection moment; identifying multiple brightness differences in the difference sequence to determine whether a continuous brightness difference anomaly rule is triggered; if the continuous brightness difference anomaly rule is triggered, determining that condensation has occurred, and recording the condensation process parameters corresponding to the condensation moment. Through the present application, accurate judgment of chip condensation is achieved, and accurate acquisition of process parameters when condensation occurs can be achieved.
[0018] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 A schematic diagram of the structure of the test environment provided in the embodiment of the present application;
[0021] Figure 2 A flowchart of a chip testing method provided in an embodiment of the present application;
[0022] Figure 3 A flowchart for determining whether a continuous brightness difference abnormality rule is triggered provided in an embodiment of the present application;
[0023] Figure 4 A flowchart of ending the test provided in an embodiment of the present application;
[0024] Figure 5 A schematic structural diagram of a chip testing device provided in an embodiment of the present application;
[0025] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for which protection is claimed, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work falls within the scope of protection of the present application.
[0027] First, the application scenarios to which this application is applicable are introduced. This application can be applied to chip testing.
[0028] During the low-temperature testing of wafer-level chips, the surface temperature of the wafer chuck in the test chamber will drop. When the chuck temperature drops to a certain level, the water vapor partial pressure in the surrounding air will reach the saturated vapor pressure, thereby causing condensation. This phenomenon may cause test short circuits, abnormal microscope imaging, and even damage to the test equipment. To prevent condensation, during the low-temperature testing of wafer-level chips, dry compressed air needs to be introduced into the test chamber to lower the dew point of the air in the chamber. When the initial air humidity, humidity and temperature of the dry compressed air in the chamber are kept constant, after the dry compressed air is introduced, the dew point of the air in the test chamber mainly depends on the ventilation time and volume flow rate of the dry compressed air. However, the existing technology can only monitor the dew point of the air in the chamber, and cannot provide process parameters such as the ventilation time and volume flow rate of the dry compressed air required to ensure that no condensation occurs under different low-temperature test conditions for wafer-level chips, nor can it accurately determine whether condensation has occurred in the chamber.
[0029] Based on this, the embodiments of the present application provide a chip testing method, device, electronic device and medium, which aim to achieve accurate judgment of chip condensation phenomenon and accurately obtain the process parameters when condensation occurs.
[0030] See also Figure 1 , Figure 1 This is a schematic diagram of the test environment provided in an embodiment of the present application. The test environment includes: a dry compressed air source 1, a flow control valve 2, a flow meter 3, a test chamber 4, a dew collector 5, a chip chuck 6, a temperature sensor 7, a thermometer 8, an in-chamber dew point sensor 9, a collection device 10, a test environment dew point sensor 11, and a first test environment 12.
[0031] In the first test environment 12, the chip chuck 6 is covered with an isolation cover to form a closed test chamber 4. The isolation cover is provided with an isolation door, which is used to control the communication or isolation between the test chamber 4 and the first test environment 12, so that the test chamber 4 provides an openable relatively sealed environment for the wafer low-temperature test. The chip chuck 6 is located in the test chamber 4 and is used to adsorb the wafer and provide a low-temperature environment for the wafer low-temperature test. The dew collector 5 is located on the surface of the chip chuck 6 and is used to obtain the condensation phenomenon near the chuck. A second through hole is formed on the side wall of the isolation cover. A dry compressed air source 1 is provided in the first test environment 12. The air outlet of the dry compressed air source 1 is connected to the second through hole via a delivery pipeline. The dry compressed air source 1 provides dry compressed air with constant pressure and dew point for the test. The flow regulating valve 2 and The flowmeter 3 is used to control the flow rate of dry compressed air and collect volume flow rate data. The temperature sensor 7 is located on the surface of the chip chuck 6 and is used to collect the temperature of the surface of the chip chuck 6 and transmit the collected temperature signal to the thermometer 8. The thermometer 8 is used to process the temperature signal collected by the temperature sensor 7 and transmit the processing result to the industrial computer 13. The dew point sensor 9 in the chamber is used to collect the dew point of the air in the test chamber 4 and transmit the dew point signal to the industrial computer 13. A collection device 10 is provided at the first through hole formed on the top wall of the isolation cover opposite to the dew collector 5. The collection device 10 is used to collect image data of the transparent glass area and the frosted glass area of the dew collector 5 and transmit it to the industrial computer 13. The collection device 10 is preferably a CCD camera. The test environment dew point sensor 11 is used to collect the dew point of the air in the first test environment 12. The collection device 10 captures image data from the dew collector 05. In the absence of condensation, the image data shows a clear boundary between the transparent and frosted glass areas of the dew collector 05, with a noticeable difference in brightness. However, once condensation occurs, the boundary between the transparent and frosted glass areas of the dew collector 05 blurs, and the brightness in the image data changes significantly. When relative humidity rises to a certain level, condensation occurs, and the brightness of the transparent glass area changes significantly, indicating that the dew collector 05 has effectively captured condensation information. The collection device 10 captures the image of the dew collector and transmits it to the industrial computer 13. The industrial computer 13 calculates the normalized difference in brightness between the frosted and transparent areas of the dew collector, as well as the change in brightness, to identify whether condensation has occurred.
[0032] like Figure 2 As shown, Figure 2 A flowchart of a chip testing method provided in an embodiment of the present application includes:
[0033] S101 : Obtain a difference sequence for characterizing changes in surface phenomena of the dew collector 5 .
[0034] Here, the difference sequence includes brightness differences at multiple consecutive acquisition moments. The dew collector 5 is set on the surface of the chip chuck 6. The dew collector 5 includes a transparent glass area and a frosted glass area. Each brightness difference value indicates the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area at a corresponding acquisition moment. The brightness difference value is preferably a normalized brightness difference value.
[0035] Before the step of obtaining the difference sequence for characterizing the surface phenomenon change of the dew collector 5, the method further includes:
[0036] The flow regulating valve 2 is controlled to open so that the dry compressed air in the dry compressed air source 1 is delivered to the test chamber 4 through the delivery pipeline at a preset volume flow rate, so that the test chamber 4 is in a low-temperature test environment; the acquisition device 10 is controlled to collect image data of the transparent glass area and the frosted glass area of the dew collector 5 under the low-temperature test environment.
[0037] Specifically, the difference sequence can be obtained in the following ways:
[0038] Obtain image data captured by the acquisition device 10 at each acquisition moment; for each image data, calculate the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area in the image data to obtain the brightness difference value corresponding to the image data; and generate a difference sequence by combining the brightness difference values corresponding to all image data.
[0039] In a preferred example of the present application, the normalized brightness difference value at each acquisition moment can be calculated by the following formula:
[0040]
[0041] Among them, R t is the normalized brightness difference at the tth acquisition moment, R t1 is the brightness value of the frosted glass area at the tth acquisition moment, R t2 is the brightness value of the transparent glass area at the tth acquisition moment.
[0042] S102: Identify multiple brightness difference values in the difference sequence to determine whether a continuous brightness difference exception rule is triggered.
[0043] S103: If the continuous brightness difference abnormality rule is triggered, it is determined that condensation occurs, and the condensation process parameters corresponding to the condensation moment are recorded.
[0044] Below through Figure 3 This section describes the specific process of determining whether the continuous brightness difference anomaly rule is triggered.
[0045] S201: Acquire a first brightness difference value at the t-th acquisition moment, and determine whether a first difference between the first brightness difference value and a second brightness difference value at the t-1-th acquisition moment exceeds a first preset threshold.
[0046] Here, the first threshold may preferably be 25.
[0047] S202: If the first difference exceeds a first preset threshold, it is determined that the continuous brightness difference abnormality rule is triggered, and the tth collection moment is determined as the condensation moment.
[0048] S203: If the first difference does not exceed the first preset threshold, determine whether a second difference between the first brightness difference and the second brightness difference exceeds a second preset threshold.
[0049] Here, the first threshold may preferably be 15.
[0050] S204: If the second difference does not exceed the second preset threshold, set t=t+1 and return to step S201.
[0051] S205: If the second difference exceeds the second preset threshold, determine whether a third difference between the second brightness difference and the third brightness difference at the t-2th acquisition moment exceeds the second preset threshold.
[0052] S206: If the third difference does not exceed the second preset threshold, set t=t+1 and return to step S201.
[0053] S207: If the third difference exceeds the second preset threshold, it is determined that the continuous brightness difference abnormality rule is triggered, and the tth collection moment is determined as the condensation moment.
[0054] In a preferred example of the present application, the condensation process parameters include the condensation flow rate, the condensation time, the condensation chuck temperature value and the condensation air dew point. The condensation flow rate indicates the volume flow rate of air delivered to the test chamber 4 at the condensation moment. The condensation time indicates the cumulative time from the start of collection of the collection device 10 to the condensation moment. The condensation chuck temperature value indicates the temperature value of the chip chuck 6 collected by the temperature sensor 7 at the condensation moment. The condensation air dew point indicates the air dew point collected by the dew point sensor 9 in the chamber at the condensation moment.
[0055] like Figure 4 As shown, Figure 4 A flowchart for ending a test provided in an embodiment of the present application.
[0056] S301 , when it is determined that condensation occurs, the flow regulating valve 2 is controlled to be closed, the collection device 10 is controlled to stop collecting, and the isolation door is controlled to be opened to connect the test chamber 4 with the first test environment 12 .
[0057] S302 : When the difference between the air dew point of the test chamber 4 and the air dew point of the first test environment 12 is less than a safety threshold, the isolation door is controlled to close to end the test.
[0058] As an example, the air flow rate delivered to the test chamber 4 may be changed, and the test may be performed again to obtain the condensation process parameters corresponding to the condensation phenomenon under different air flow rates.
[0059] Based on the same inventive concept, a chip testing device corresponding to the chip testing method is also provided in the embodiment of the present application. Since the principle of solving the problem by the device in the embodiment of the present application is similar to the above-mentioned chip testing method in the embodiment of the present application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.
[0060] See also Figure 5 , Figure 5 This is a schematic diagram of the structure of a chip testing device provided in an embodiment of the present application. The chip testing device 400 includes:
[0061] Acquisition module 401 is used to obtain a difference sequence for characterizing changes in surface phenomena of a dew collector, where the difference sequence includes brightness differences at multiple consecutive acquisition moments. The dew collector is arranged on the surface of a chip chuck, and the dew collector includes a transparent glass area and a frosted glass area. Each brightness difference value indicates the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area at a corresponding acquisition moment.
[0062] The identification module 402 is configured to identify multiple brightness difference values in the difference sequence to determine whether a continuous brightness difference anomaly rule is triggered.
[0063] The recording module 403 is configured to determine that condensation has occurred if the continuous brightness difference abnormality rule is triggered, and record the condensation process parameters corresponding to the condensation moment.
[0064] See also Figure 6 , Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 6 As shown in FIG, the electronic device 500 includes a processor 510, a memory 520 and a bus 530.
[0065] The memory 520 stores machine-readable instructions executable by the processor 510. When the electronic device 500 is running, the processor 510 communicates with the memory 520 through the bus 530. When the machine-readable instructions are executed by the processor 510, the steps of the chip testing method in the above-mentioned method embodiment can be executed. The specific implementation method can be found in the method embodiment and will not be repeated here.
[0066] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is run by a processor, it can execute the steps of the above-mentioned chip testing method. The specific implementation method can be found in the method embodiment and will not be repeated here.
[0067] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.
[0068] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. There may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interface, indirect coupling or communication connection of devices or units, which may be electrical, mechanical or other forms.
[0069] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.
[0070] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0071] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.
[0072] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The scope of protection of the present application is not limited thereto. Although the present application has been described in detail with reference to the above-mentioned embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-mentioned embodiments within the technical scope disclosed in the present application, or perform equivalent replacements for some of the technical features thereof. These modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.
Claims
1. A chip testing method, characterized in that: The method comprises: Acquiring a difference value sequence for characterizing changes in a surface phenomenon of a dew collector, the difference sequence comprising brightness difference values at a plurality of consecutive acquisition moments, wherein the dew collector is disposed on a surface of a chip chuck and includes a transparent glass area and a frosted glass area, and each brightness difference value indicates a difference between a brightness value of the transparent glass area and a brightness value of the frosted glass area at a corresponding acquisition moment; Identifying multiple brightness difference values in the difference sequence to determine whether a continuous brightness difference anomaly rule is triggered; If the continuous brightness difference abnormality rule is triggered, it is determined that condensation occurs, and the condensation process parameters corresponding to the condensation moment are recorded.
2. The method according to claim 1, characterized in that The chip chuck is covered with an isolation cover to form a sealed test chamber. A collection device is provided at a first through hole formed in the isolation cover opposite to the top wall of the dew collector. The collection device is used to collect image data of the transparent glass area and the frosted glass area of the dew collector. The difference sequence is obtained in the following manner: Acquire image data collected by the acquisition device at each acquisition moment; For each image data, calculating the difference between the brightness value of the transparent glass area and the brightness value of the frosted glass area in the image data to obtain a brightness difference value corresponding to the image data; The brightness difference values corresponding to all the image data are used to generate the difference value sequence.
3. The method according to claim 2, characterized in that The isolation cover is arranged in a first test environment, a second through hole is formed on a side wall of the isolation cover, a dry compressed air source is arranged in the first test environment, an air outlet of the dry compressed air source is connected to the second through hole via a delivery pipeline, and a flow regulating valve is arranged on the delivery pipeline. Before the step of obtaining a difference sequence for characterizing changes in surface phenomena of the dew collector, the method further includes: Controlling the flow regulating valve to open, so that the dry compressed air in the dry compressed air source is delivered to the test chamber via the delivery pipeline at a preset volume flow rate, so that the test chamber is in a low-temperature test environment; The collecting device is controlled to collect image data of the transparent glass area and the frosted glass area of the dew collector under the low temperature test environment.
4. The method according to claim 1, wherein The triggering of the continuous brightness difference anomaly rule is determined by: (A) obtaining a first brightness difference value at the t-th acquisition moment, and determining whether a first difference between the first brightness difference value and a second brightness difference value at the t-1-th acquisition moment exceeds a first preset threshold; (B) if the first difference exceeds the first preset threshold, determining that the continuous brightness difference abnormality rule is triggered, and determining the tth collection moment as the condensation moment; (C) if the first difference does not exceed the first preset threshold, determining whether a second difference between the first brightness difference and the second brightness difference exceeds a second preset threshold; (D) If the second difference does not exceed the second preset threshold, set t=t+1 and return to step (A); (D) if the second difference exceeds the second preset threshold, determining whether a third difference between the second brightness difference and the third brightness difference at the t-2th acquisition moment exceeds a second preset threshold; (E) If the third difference does not exceed the second preset threshold, set t=t+1 and return to step (A); (F) If the third difference exceeds the second preset threshold, it is determined that the continuous brightness difference abnormality rule is triggered, and the tth collection moment is determined as the condensation moment.
5. The method according to claim 4, characterized in that The brightness difference at each acquisition moment is calculated using the following formula: Among them, R t is the brightness difference at the tth acquisition moment, R t1 is the brightness value of the frosted glass area at the tth acquisition moment, R t2 is the brightness value of the transparent glass area at the tth acquisition moment.
6. The method according to claim 3, characterized in that The chip chuck is provided with a temperature sensor for collecting the temperature value of the chip chuck. The first test environment is also provided with a chamber dew point sensor for collecting the air dew point in the test chamber. The condensation process parameters include condensation flow rate, condensation duration, condensation chuck temperature value and condensation air dew point. The condensation flow rate indicates the volume flow rate of air delivered to the test chamber at the condensation moment. The condensation duration indicates the cumulative time from the start of collection of the collection device to the condensation moment. The condensation chuck temperature value indicates the temperature value of the chip chuck collected by the temperature sensor at the condensation moment. The condensation air dew point indicates the air dew point collected by the dew point sensor in the chamber at the condensation moment.
7. The method according to claim 3, characterized in that A test environment dew point sensor is further provided in the first test environment, and is used to collect the dew point of the air in the first test environment. An isolation door is provided on the isolation cover, and is used to control the connection or isolation between the test chamber and the first test environment. The method further comprises: When it is determined that condensation occurs, controlling the flow regulating valve to close, controlling the collection device to stop collecting, and controlling the isolation door to open, so that the test chamber is connected to the first test environment; When the difference between the air dew point of the test chamber and the air dew point of the first test environment is less than a safety threshold, the isolation door is controlled to close to end the test.
8. A chip testing device, characterized in that: The device comprises: an acquisition module, configured to acquire a difference value sequence for characterizing changes in a surface phenomenon of a dew collector, the difference sequence comprising brightness difference values at a plurality of consecutive acquisition moments, the dew collector being disposed on a surface of a chip chuck, the dew collector comprising a transparent glass area and a frosted glass area, each brightness difference value indicating a difference between a brightness value of the transparent glass area and a brightness value of the frosted glass area at a corresponding acquisition moment; an identification module, configured to identify a plurality of brightness difference values in the difference value sequence to determine whether a continuous brightness difference abnormality rule is triggered; The recording module is used to determine that condensation occurs if the continuous brightness difference abnormality rule is triggered, and record the condensation process parameters corresponding to the condensation moment.
9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and the processor executes the machine-readable instructions to perform the steps of any one of the methods described in claims 1 to 7.
10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are executed.