Double-sided transmission microwave device and transmit-receive assembly

Abstract

The microwave device comprises an assembly structural member, a front microwave plate, a back microwave plate and an insulator, the assembly structural member is provided with an opening, the insulator is arranged at the opening of the assembly structural member, and the back microwave plate is arranged at the opening of the assembly structural member. The assembly structural member and the insulator form a front cavity on one side of the opening, and form a back cavity on the other side; the front cavity is used for placing the front microwave plate and transmitting front microwave signals; the back cavity is used for placing the back microwave plate and transmitting back microwave signals; the front microwave plate and the back microwave plate are both connected with the insulator in a bonding mode through gold wires, and the front microwave plate and the back microwave plate are used for achieving transmission of microwave signals between the front microwave plate and the back microwave plate.

Description

Technical Field

[0001] The present invention relates to the field of microwave technology, and more particularly to a double-sided transmission microwave device and a transceiver assembly. Background Art

[0002] As radar miniaturization and lightweighting become increasingly evident, microwave components are becoming increasingly integrated, leading to increasingly complex RF interconnects within these components. Cross-plane RF connections can reduce component footprint and are becoming increasingly common in practical engineering applications. However, these designs present significant design challenges, resulting in high electrical connection costs for front- and back-side microwave components, and can affect microwave signal transmission and lead to poor signal stability. Summary of the Invention

[0003] The present invention provides a double-sided transmission microwave device and a transceiver assembly to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides a double-sided transmission microwave device, comprising a component structure, a front microwave board, a back microwave board, and an insulator, wherein:

[0006] The assembly structure has an opening, the insulator is arranged at the opening of the assembly structure, the assembly structure and the insulator form a front cavity on one side of the opening and a reverse cavity on the other side;

[0007] The front cavity is used to place the front microwave board and transmit the front microwave signal;

[0008] The reverse cavity is used to place the reverse microwave board and transmit reverse microwave signals;

[0009] The front microwave board and the back microwave board are interconnected with the insulator through gold wire bonding, so as to realize the transmission of microwave signals between the front microwave board and the back microwave board.

[0010] Optionally, the insulator includes a front pin and a back pin.

[0011] Optionally, the front microwave board includes a front microstrip line gold wire bonding matching structure and a front microwave signal transmission line, and the front needle of the insulator is bonded to the front microstrip line gold wire bonding matching structure.

[0012] Optionally, the reverse microwave board includes a reverse microstrip line gold wire bonding matching structure and a reverse microwave signal transmission line, and the reverse needle of the insulator is bonded to the reverse microstrip line gold wire bonding matching structure.

[0013] Optionally, the surface of the front needle away from the insulator is flush with the surface of the front microwave board close to the insulator, and the surface of the back needle away from the insulator is flush with the surface of the back microwave board away from the insulator.

[0014] Optionally, the front microwave plate is brazed to the front side of the component structure.

[0015] Optionally, the reverse microwave plate is brazed to the reverse side of the component structure.

[0016] Optionally, the front microwave board and the back microwave board are symmetrically arranged on both sides of the insulator.

[0017] Optionally, both the front microwave board and the back microwave board are single-layer boards.

[0018] The second aspect of the present invention provides a transceiver assembly, characterized in that it includes a transmitting device, a receiving device, a control device, and the double-sided transmission microwave device as described in the first aspect of the present invention.

[0019] The transmitting device is used to generate a first microwave signal in the transmitting phase of the transceiver component;

[0020] The receiving device is configured to receive a second microwave signal sent by an antenna to the transceiver assembly, preprocess the second microwave signal, and output the preprocessed second microwave signal;

[0021] The microwave device is used to control the transmission of the first microwave signal and the pre-processed second microwave signal between the front and back sides of the transceiver component;

[0022] The control device is used to supply power to the transceiver component and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

[0023] The beneficial effects of the present invention are as follows:

[0024] The present invention separates the front cavity from the back cavity through component structural parts, thereby blocking signal interference between the front microwave board and the back microwave board; in the present invention, the front microwave board and the back microwave board are interconnected with the insulator through gold wire bonding, thereby realizing mutual transmission of the front microwave signal and the back microwave signal, which not only realizes good transmission of the microwave signal, but also reduces the contamination risk of the microstrip line. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] Figure 1 A schematic diagram showing a microwave device for double-sided transmission according to an embodiment of the present invention is shown;

[0027] Figure 2 A front schematic diagram showing a double-sided transmission microwave device according to an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the reverse side of a double-sided transmission microwave device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0029] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the following detailed description is illustrative rather than restrictive and should not be used to limit the scope of protection of the present invention.

[0030] One embodiment of the present invention provides a double-sided transmission microwave device, comprising a front microwave board, a back microwave board and an insulator as component structures, wherein:

[0031] The assembly structure has an opening, the insulator is arranged at the opening of the assembly structure, the assembly structure and the insulator form a front cavity on one side of the opening and a reverse cavity on the other side;

[0032] The front cavity is used to place the front microwave board and transmit the front microwave signal;

[0033] The reverse cavity is used to place the reverse microwave board and transmit reverse microwave signals;

[0034] The front microwave board and the back microwave board are interconnected with the insulator through gold wire bonding, so as to realize the transmission of microwave signals between the front microwave board and the back microwave board.

[0035] The double-sided transmission microwave device provided in this embodiment has insulators positioned at the openings of the component structure. The component structure and insulators divide the cavity into a front cavity and a rear cavity. The front microwave board is placed on the front cavity, forming a front microwave cavity for transmitting the front microwave signal; the rear microwave board is placed on the rear cavity, forming a rear microwave cavity for transmitting the rear microwave signal. The component structure and insulators isolate the front and rear cavities from signal interference. In this embodiment, both the front microwave board and the rear microwave board are connected to the insulators using gold wire bonding, which transmits the front microwave signal to the rear microwave board and then to the rear cavity, or vice versa. This connection between the front and rear microwave signals not only ensures good microwave signal transmission but also reduces the risk of contamination of microstrip lines. The double-sided transmission microwave device provided in this embodiment has a simple structure and is easy to design, making it widely applicable to double-sided microwave components.

[0036] In a specific example, for example Figure 1 The double-sided transmission microwave device includes a structural component assembly 101, a front cavity 102, a rear cavity 103, an insulator 104, a front microwave board 105 and a rear microwave board 106, wherein:

[0037] The component structure 101 is used to carry microwave functional components that can realize the microwave signal transmission function. The microwave functional components include but are not limited to the front cavity 102, the rear cavity 103, the insulator 104, the front microwave plate 105 and the rear microwave plate 106. In this example, other microwave functional components can be added according to specific needs. The component structure 101 is provided with an opening, and the insulator 104 is provided at the opening of the component structure 101. The component structure 101 and the insulator 104 form the front cavity 102 on one side of the opening and the rear cavity 103 on the other side. Figure 1 As shown, front cavity 102 is the upper portion of the assembly structure 101 and insulator 104, and rear cavity 103 is the lower portion of the assembly structure 101 and insulator 104. Microwave signals are vertically transmitted between front cavity 102 and rear cavity 103. Assembly structure 101 and insulator 104 separate front cavity 102 and rear cavity 103, isolating microwave signal interference between front microwave board 105 and rear microwave board 106 and improving the device's insulation performance. Providing insulators in the cavity of the assembly structure improves the reliability of the microwave assembly.

[0038] The front cavity 102 houses the front microwave board 105, forming a front microwave cavity that transmits the front microwave signal. The rear cavity 103 houses the rear microwave board 106, forming a rear microwave cavity that transmits the rear microwave signal. The assembly structure 101 and insulator 104 separate the front cavity 102 from the rear cavity 103, preventing signal interference between the front microwave board 105 and the rear microwave board 106. The insulator 104 is located at the opening of the assembly structure 101 and includes a front pin 1041 and a rear pin 1042. The front microwave board 105 and the rear microwave board 106 are symmetrically arranged on either side of the insulator 104. The insulator 104 isolates the front microwave board 105 from the rear microwave board 106, preventing interference between the front and rear microwave signals. Both the front microwave board 105 and the rear microwave board 106 are connected to the insulator 104 by gold wire bonding, so as to transmit the front microwave signal of the front microwave board 105 to the rear microwave board 106. The front microwave signal on the front microwave board 105 is transmitted to the insulator 104 through the gold wire bonding on the front side. The insulator 104 transmits the front microwave signal to the rear microwave board 106 through the gold wire bonding on the rear side, thereby realizing the front-to-rear microwave signal connection; or the rear microwave signal of the rear microwave board 106 is transmitted to the front microwave board 105 through the insulator 104. The rear microwave signal on the rear microwave board 106 is transmitted to the insulator 104 through the gold wire bonding on the rear side. The insulator 104 transmits the rear microwave signal to the front microwave board 105 through the gold wire bonding on the front side, thereby realizing the rear-to-front microwave signal connection.

[0039] In a possible implementation, the insulator includes a front pin and a back pin.

[0040] Continuing with the previous example, for example Figure 1 As shown, the insulator 104 includes a front pin 1041 and a back pin 1042 , and the front pin 1041 and the back pin 1042 are symmetrically arranged with respect to the insulator 104 .

[0041] In one possible implementation, the front microwave board includes a front microstrip line gold wire bonding matching structure and a front microwave signal transmission line, and the front needle of the insulator is bonded to the front microstrip line gold wire bonding matching structure.

[0042] In a specific example, for example Figure 2As shown, the front microwave board 105 includes a front microstrip line gold wire bonding matching structure 1051 and a front microwave signal transmission line 1052. The front microstrip line gold wire bonding matching structure 1051 and the front microwave signal transmission line 1052 are connected via a microstrip line 1053 and are fixedly mounted on the front cavity 102. The front needles of the insulator 104 are bonded to the front microstrip line gold wire bonding matching structure 1051, transmitting the front microwave signal to the insulator 104, thereby improving the reliability and stability of the device assembly. The front microwave signal on the front microwave board 105 is transmitted through the front cavity and the front microwave signal transmission line 1052 to the front microstrip line gold wire bonding matching structure 1051. The front microstrip line gold wire bonding matching structure 1051 transmits the front microwave signal to the insulator 104 via the front bonding gold wires. The front-side microstrip line gold wire bonding matching structure 1051 and the front-side microwave signal transmission line 1052 are also used to receive the reverse microwave signal in the insulator 104, and transmit the reverse microwave signal to the front-side microstrip line gold wire bonding matching structure 1051 through the front-side needle of the insulator 104, and transmit the reverse microwave signal from the front-side microwave signal transmission line 1052 to the front-side cavity through the front-side microstrip line gold wire bonding matching structure 1051, thereby realizing vertical electrical transmission of reverse-front microwave signals and improving the reliability and stability of the device's microwave components.

[0043] In a possible implementation, the reverse microwave board includes a reverse microstrip line gold wire bonding matching structure and a reverse microwave signal transmission line, and the reverse needle of the insulator is bonded to the reverse microstrip line gold wire bonding matching structure.

[0044] In a specific example, for example Figure 3 As shown, the reverse microwave board 106 includes a reverse microstrip line gold wire bonding matching structure 1061 and a reverse microwave signal transmission line 1062. The reverse microstrip line gold wire bonding matching structure 1061 and the reverse microwave signal transmission line 1062 are connected through a microstrip line 1063 and are fixedly arranged on the reverse cavity 103. The reverse needle of the insulator 104 is bonded to the reverse microstrip line gold wire bonding matching structure 1061, which is used to transmit the reverse microwave signal through the reverse microwave signal transmission line 1062 to the reverse microstrip line gold wire bonding matching structure 1061, and the reverse microstrip line gold wire bonding matching structure 1061 is transmitted to the insulator 104 via the reverse microwave signal. The reverse-side microstrip line gold wire bonding matching structure 1061 and the reverse-side microwave signal transmission line 1062 are also used to transmit the front microwave signal transmitted from the front cavity to the insulator 104 to the reverse-side microstrip line gold wire bonding matching structure 1061, and transmit the front microwave signal from the reverse-side microwave signal transmission line 1062 to the reverse-side cavity 103 through the reverse-side microstrip line gold wire bonding matching structure 1061, thereby realizing vertical electrical transmission of the front-to-reverse microwave signals and improving the reliability and stability of the microwave components.

[0045] In one possible implementation, the surface of the front needle away from the insulator is flush with the surface of the front microwave board close to the insulator, and the surface of the back needle away from the insulator is flush with the surface of the back microwave board away from the insulator.

[0046] Continuing with the previous example, for example Figure 1 As shown, insulator 104 includes front pins 1041 and rear pins 1042. Front pins 1041 and rear pins 1042 are symmetrically arranged about insulator 104. Front pin 1041 is lower than front microwave board 105, while rear pin 1041 is horizontally aligned with rear microwave board 106. Specifically, the surface of front pin 1041 facing away from insulator 104 is horizontally aligned with the surface of front microwave board 105 facing toward insulator 104. This reduces reflection and scattering of electromagnetic waves on the insulator surface, thereby lowering electromagnetic interference (EMI). It also increases the contact area between the insulator and front microwave board, enhancing stability. Rear pin 1042 is horizontally aligned with rear microwave board 106, i.e., the surface of rear pin 1042 facing away from insulator 104 is horizontally aligned with the surface of rear microwave board 106 facing away from insulator 104. This reduces reflection and interference during microwave signal transmission, improving signal integrity and transmission quality, and reducing electromagnetic wave leakage, electromagnetic interference, and enhancing the electromagnetic compatibility of the device.

[0047] In a possible implementation, the front microwave plate is brazed to the front side of the component structure, and the back microwave plate is brazed to the back side of the component structure.

[0048] Continuing with the previous example, for example Figure 1 As shown, front microwave plate 105 is located within front cavity 102 and brazed to the front surface of component structure 101 for transmitting front microwave signals. Reverse microwave plate 106 is located within reverse cavity 103 and brazed to the reverse surface of component structure 101 for receiving the front microwave signals transmitted by front microwave plate 105 and transmitting reverse microwave signals. This example uses brazing to respectively braze front microwave plate 105 and reverse microwave plate 106 to the front and reverse surfaces of component structure 101. The brazing temperature is lower than the melting point of the component structure, resulting in relatively small stress and deformation, and minimal impact on the component structure. Furthermore, the welding equipment is simple and production efficiency is high.

[0049] Continuing with the previous example, for example Figure 2As shown, the front microstrip line gold wire bonding matching structure 1051 and the front microwave signal transmission line 1052 are arranged on the front microwave board 105, and the front microwave signal is transmitted to the front microstrip line gold wire bonding matching structure 1051 through the front microwave signal transmission line 1052, and the front microwave signal is transmitted to the insulator 104 by the front microstrip line gold wire bonding matching structure 1051 through gold wire bonding. For example Figure 3 As shown, the reverse microstrip line gold wire bonding matching structure 1061 and the reverse microwave signal transmission line 1062 are arranged on the reverse microwave board 106, and the front microwave signal is received by the reverse microstrip gold wire bonding matching structure 1061, and the front microwave signal is transmitted to the reverse microwave signal transmission line 1062, and the reverse microwave signal transmission line 1062 transmits the front microwave signal to the reverse cavity 103, thereby realizing the vertical transmission of the front-to-reverse microwave signal.

[0050] For example Figure 3 As shown, the reverse microwave signal is transmitted to the reverse microstrip line gold wire bonding matching structure 1061 through the reverse microwave signal transmission line 1062, and the reverse microstrip line gold wire bonding matching structure 1061 transmits the reverse microwave signal to the insulator 104 through the gold wire bonding method. Figure 2 As shown, the insulator 104 transmits the reverse microwave signal to the matching structure 1051 bonded with gold wires of the front microstrip line by means of gold wire bonding, and the matching structure 1051 bonded with gold wires of the front microstrip line transmits the reverse microwave signal to the front microwave signal transmission line 1052, and the front microwave signal transmission line 1052 transmits the reverse microwave signal to the front cavity 102, thereby realizing vertical transmission of the reverse-front microwave signal.

[0051] In a possible implementation, the front microwave board and the back microwave board are symmetrically arranged on both sides of the insulator.

[0052] Continuing with the previous example, for example Figure 1As shown, component structure 101 divides the device into a front cavity 102 and a rear cavity 103. Front and rear microwave boards 105, 106 are mounted on front and rear cavities 102, 103, respectively. Front and rear microwave boards 105, 106 are symmetrically positioned on either side of insulator 104, separating them and facilitating vertical interconnection via gold wire bonding. The surface of front microwave board 105 near the insulator is flush with the surface of front pins 1041 away from the insulator, while the surface of rear microwave board 106 away from the insulator is flush with the surface of rear pins 1042 away from the insulator. Separating front and rear microwave boards 105, 106 via insulator 104 isolates interference between the front and rear microwave signals during transmission, improving signal transmission quality and stability and ensuring proper device operation.

[0053] In a possible implementation, both the front microwave board and the back microwave board are single-layer boards.

[0054] Continuing with the previous example, for example Figure 1 As shown, the front microwave board 105 and the back microwave board 106 are both single-layer boards. Compared with the microwave assembly in the form of a mixed-pressure board for the back microwave board, it is easy to manufacture, reduces costs, and reduces the impact of differences in board properties.

[0055] This embodiment separates the front cavity from the rear cavity through a component structure. A front microwave board is placed in the front cavity to form a front microwave cavity, transmitting the front microwave signal; a rear microwave board is placed in the rear cavity to form a rear microwave cavity, transmitting the rear microwave signal. The component structure is provided with a cavity, and an insulator is disposed in the cavity, isolating the front microwave board from the rear microwave board. Both the front microwave board and the rear microwave board are connected to the insulator via gold wire bonding to enable microwave signal transmission between the front microwave board and the rear microwave board. Through simulation optimization design, good impedance matching is ensured, achieving good transmission of front-to-rear microwave signals and rear-to-front microwave signals. In this embodiment, both the front microwave board and the rear microwave board are single-layer boards, which are easier to manufacture and reduce costs compared to microwave components using a mixed-pressure board for the rear microwave board. This embodiment can also be widely used in microwave components with a double-sided layout.

[0056] Another embodiment of the present invention provides a transceiver assembly, including a transmitting device, a receiving device, a control device, and the double-sided transmission microwave device as described above.

[0057] The transmitting device is used to generate a first microwave signal in the transmitting phase of the transceiver component;

[0058] The receiving device is configured to receive a second microwave signal sent by an antenna to the transceiver assembly, preprocess the second microwave signal, and output the preprocessed second microwave signal;

[0059] The microwave device is used to control the transmission of the first microwave signal and the second microwave signal between the front and back sides of the transceiver component to achieve double-sided vertical transmission of the first microwave signal and the pre-processed second microwave signal;

[0060] The control device is used to supply power to the transceiver component and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

[0061] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0062] It should also be noted that, in the description of the present invention, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0063] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A double-sided transmission microwave device, characterized in that: It includes component structural parts, front microwave board, back microwave board and insulator, among which, The assembly structure has an opening, the insulator is arranged at the opening of the assembly structure, the assembly structure and the insulator form a front cavity on one side of the opening and a reverse cavity on the other side; The front cavity is used to place the front microwave board and transmit the front microwave signal; The reverse cavity is used to place the reverse microwave board and transmit reverse microwave signals; The front microwave board and the back microwave board are interconnected with the insulator through gold wire bonding, so as to realize the transmission of microwave signals between the front microwave board and the back microwave board.

2. The device according to claim 1, characterized in that The insulator includes a front pin and a back pin.

3. The device according to claim 2, characterized in that The front microwave board includes a front microstrip line gold wire bonding matching structure and a front microwave signal transmission line, and the front needle of the insulator is bonded to the front microstrip line gold wire bonding matching structure.

4. The device according to claim 2, characterized in that The reverse microwave board comprises a reverse microstrip line gold wire bonding matching structure and a reverse microwave signal transmission line, and the reverse needle of the insulator is bonded to the reverse microstrip line gold wire bonding matching structure.

5. The device according to claim 2, characterized in that The surface of the front needle away from the insulator is flush with the surface of the front microwave board close to the insulator, and the surface of the back needle away from the insulator is flush with the surface of the back microwave board away from the insulator.

6. The device according to claim 1, characterized in that The front microwave plate is brazed to the front side of the component structure.

7. The device according to claim 1, characterized in that The reverse microwave plate is brazed to the reverse side of the component structure.

8. The device according to claim 1, characterized in that The front microwave board and the back microwave board are symmetrically arranged on both sides of the insulator.

9. The device according to claim 1, characterized in that The front microwave board and the back microwave board are both single-layer boards.

10. A transceiver component, characterized in that: The invention comprises a transmitting device, a receiving device, a control device and a double-sided transmission microwave device as claimed in any one of claims 1 to 9, The transmitting device is used to generate a first microwave signal in the transmitting phase of the transceiver component; The receiving device is configured to receive a second microwave signal sent by an antenna to the transceiver assembly, preprocess the second microwave signal, and output the preprocessed second microwave signal; The microwave device is used to control the transmission of the first microwave signal and the pre-processed second microwave signal between the front and back sides of the transceiver component; The control device is used to supply power to the transceiver component and to control and adjust the phase and amplitude of the first microwave signal and the preprocessed second microwave signal.

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