Laser light source assembly and laser projection equipment

Abstract

A laser light source assembly (10) comprises a shell (101) with an opening (K), a laser (102) and a sealing ring (103). The laser (102) comprises a bottom plate (1021) and a light-emitting module (1022), and the light-emitting module (1022) is located on the plate surface of the bottom plate (1021); the bottom plate (1021) is located outside the opening (K) and fixed to the shell (101), and the light-emitting module (1022) is located in the opening (K); the sealing ring (103) surrounds the light-emitting module (1022) and is located between the bottom plate (1021) and the edge area of the opening (K) in the shell (101). A laser projection apparatus (1) is also provided.

Description

Laser light source assembly and laser projection equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on March 13, 2023, with application number 202310237688.4, entitled "Light Source Assembly and Projection Device," the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of optoelectronic technology, and in particular to a laser light source assembly and a laser projection device. Background Art

[0004] With the development of optoelectronic technology, the display effects of laser projection equipment are becoming increasingly better, and the requirements for the operating reliability of components in laser projection equipment (such as laser light source assemblies) are also becoming increasingly higher. In related technologies, laser light source assemblies generally include: a housing, and a laser and other optical components fixed to the housing. The laser and the housing can be locked with screws. However, the laser is more easily damaged when locked to the housing, which leads to lower reliability of the laser light source assembly.

[0005] Summary of the Invention

[0006] The present application provides a laser light source assembly, which includes: a housing with an opening, a laser, and a sealing ring;

[0007] The laser includes a base plate and a light-emitting module, wherein the light-emitting module is located on the surface of the base plate; the base plate is located outside the opening and is fixed to the housing, and the light-emitting module is located in the opening;

[0008] The sealing ring surrounds the light-emitting module and is located between the bottom plate and an edge area of ​​the opening in the housing.

[0009] On the other hand, the present application provides a laser projection device, which includes the above-mentioned laser light source assembly, a light valve and a lens;

[0010] The laser light source assembly emits laser light toward the light valve. The light valve is used to modulate the received laser light and then emit it toward the lens. The lens is used to project the received laser light to form a projection image. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] FIG1 is a schematic structural diagram of a laser light source assembly provided in an embodiment of the present application;

[0013] FIG2 is a schematic structural diagram of another laser light source assembly provided in an embodiment of the present application;

[0014] FIG3 is a schematic structural diagram of a laser provided in an embodiment of the present application;

[0015] FIG4 is a schematic structural diagram of a housing provided in an embodiment of the present application;

[0016] FIG5 is a schematic structural diagram of another laser light source assembly provided in an embodiment of the present application;

[0017] FIG6 is a schematic structural diagram of another laser light source assembly provided in an embodiment of the present application;

[0018] FIG7 is a schematic structural diagram of a sealing ring provided in an embodiment of the present application;

[0019] FIG8 is a schematic structural diagram of another sealing ring provided in an embodiment of the present application;

[0020] FIG9 is a schematic structural diagram of another sealing ring provided in an embodiment of the present application;

[0021] FIG10 is a schematic structural diagram of another sealing ring provided in an embodiment of the present application;

[0022] FIG11 is a schematic structural diagram of a sealing ring provided in another embodiment of the present application;

[0023] FIG12 is a schematic structural diagram of a laser light source assembly provided in another embodiment of the present application;

[0024] FIG13 is a schematic structural diagram of another laser light source assembly provided in another embodiment of the present application;

[0025] FIG14 is a schematic structural diagram of yet another laser light source assembly provided in another embodiment of the present application;

[0026] FIG15 is a schematic structural diagram of another sealing ring provided in another embodiment of the present application;

[0027] FIG16 is a schematic structural diagram of another sealing ring provided in another embodiment of the present application;

[0028] FIG17 is a schematic structural diagram of another laser light source assembly provided in another embodiment of the present application;

[0029] FIG18 is a schematic structural diagram of a laser light source assembly provided in yet another embodiment of the present application;

[0030] FIG19 is a schematic structural diagram of another laser light source assembly provided in yet another embodiment of the present application;

[0031] FIG20 is a schematic structural diagram of another housing provided in an embodiment of the present application;

[0032] FIG21 is a partial schematic diagram of the location of a screw hole structure in a laser light source assembly provided in an embodiment of the present application;

[0033] FIG22 is a partial schematic diagram of the location of a screw hole structure in another laser light source assembly provided in an embodiment of the present application;

[0034] FIG23 is a schematic structural diagram of yet another laser light source assembly provided in yet another embodiment of the present application;

[0035] FIG24 is a schematic structural diagram of another housing provided in an embodiment of the present application;

[0036] FIG25 is a schematic structural diagram of another laser light source assembly provided in yet another embodiment of the present application;

[0037] FIG26 is a schematic structural diagram of another housing provided in an embodiment of the present application;

[0038] FIG27 is a schematic structural diagram of a laser light source assembly provided in yet another embodiment of the present application;

[0039] FIG28 is a schematic structural diagram of another laser light source assembly provided in yet another embodiment of the present application;

[0040] FIG29 is a schematic structural diagram of another laser light source assembly provided in yet another embodiment of the present application;

[0041] FIG30 is a schematic structural diagram of a housing provided in another embodiment of the present application;

[0042] FIG31 is a schematic structural diagram of yet another laser light source assembly provided in yet another embodiment of the present application;

[0043] FIG32 is a schematic structural diagram of another laser light source assembly provided in yet another embodiment of the present application;

[0044] FIG33 is a schematic diagram of the internal structure of a laser projection device provided in an embodiment of the present application;

[0045] Figure 34 is a schematic diagram of the composition of a laser projection device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0047] Some embodiments of the present application provide laser light source assemblies for use in laser projection devices. A laser projection device provided in one embodiment of the present application is shown in FIG33 . The laser projection device 1 includes a housing 400 (only a portion of the housing is shown in FIG33 ), a light source 100 assembled within the housing 400, a light modulation component 200, and a lens 300. The light source 100 is configured to provide an illumination beam (e.g., a laser beam). The light modulation component 200 is configured to modulate the illumination beam provided by the light source 100 using an image signal to produce a projection beam. The lens 300 is configured to project the projection beam onto a projection screen 20 to form an image.

[0048] The light source 100, the light modulation component 200, and the lens 300 are connected in sequence along the propagation direction of the light beam. It should be noted that the above-mentioned names of the various parts of the laser projection device are only distinguished according to the main functions of each optical component. For example, the light source 100 is mainly used to provide a laser beam. The light modulation component 200 is mainly used to perform light modulation, and the lens 300 is mainly used to amplify the projected image beam. In some embodiments, the light source 100 and the light modulation component 200 do not need to be clearly distinguished. It can be considered that the light source 100 and the light modulation component 200 constitute an optical engine module, which provides a modulated image beam to the projection lens 300.

[0049] In some embodiments, one end of the light modulation component 200 is connected to the light source 100, and the other end of the light modulation component 200 is connected to the lens 300. The light source 100 and the light modulation component 200 are arranged along the outgoing direction of the illumination beam of the laser projection device 1 (refer to the M direction shown in FIG. 33 ), and the light modulation component 200 and the lens 300 are arranged along the outgoing direction of the projection beam of the laser projection device 1 (refer to the N direction shown in FIG. 33 ), with the M direction being approximately perpendicular to the N direction. In other words, the light source 100, the light modulation component 200, and the lens 300 are connected in an "L" shape. This connection structure not only accommodates the optical path characteristics of the reflective light valve in the light modulation component 200, but also helps shorten the optical path length in one dimension, facilitating the structural layout of the projection host. For example, when the light source 100, the light modulation component 200, and the lens 300 are arranged along one dimension (e.g., the M direction), the optical path length in that direction becomes very long, which is not conducive to the structural layout of the projection host.

[0050] In some embodiments, the light source 100 can sequentially provide three primary colors of light (or additional colors of light in addition to the three primary colors). Due to the persistence of vision of the human eye, the human eye perceives white light formed by the mixture of the three primary colors. The light source 100 can also output the three primary colors of light simultaneously, continuously emitting white light. The light source 100 includes a laser 102 (as shown in Figures 1 to 9), which can emit laser light of a single color, such as red, blue, or green.

[0051] The illumination beam emitted by the light source 100 enters the light modulation component 200. Within the light modulation component 200, the light valve, also known as the light modulator, is a core component. In some examples of the present application, the light modulator functions to modulate the illumination beam provided by the light source 100 using an image signal. That is, driven by a drive signal corresponding to the image signal of the image to be displayed, the light modulator modulates the illumination beam, primarily performing amplitude modulation. In some examples, the light modulator can also perform spatial phase modulation. The modulated light beam enters the projection lens to ultimately form an optical image. Depending on whether the light modulator (or light valve) transmits or reflects the illumination beam, the light modulator can be classified as a transmissive light modulator or a reflective light modulator. In one example of the present application, the light valve is a digital micromirror device (DMD), a reflective light valve. In some embodiments, the lens 300 includes a refractive lens system. In some embodiments, the lens 300 also includes a reflective mirror system. The lens 300 can be a telephoto lens or a short-focus lens. In some examples of the present application, the laser projection device is an ultra-short-throw laser projection device, and thus the lens 300 is an ultra-short-throw projection lens.

[0052] The laser light source assembly used in a laser projection device includes a housing. Other components of the laser light source assembly can be fixed to the housing to form a single unit. For example, the housing has an opening for arranging a laser, and the laser can be fixed to the opening.

[0053] The outer surface of a laser is typically coated with an insulating varnish to insulate it from surrounding components and ensure proper operation. In related technologies, friction between the laser and the housing can cause the insulating varnish to break and fall off, potentially short-circuiting the laser and the housing, affecting normal operation and reducing the reliability of the laser light source assembly.

[0054] Some embodiments of the present application provide a laser light source assembly for reducing the risk of damage to the insulating paint on the surface of the laser, reducing the risk of short circuit between the laser and the housing, and improving the working reliability of the laser light source assembly.

[0055] Figure 1 is a schematic diagram of the structure of a laser light source assembly provided in an embodiment of the present application, and Figure 2 is a schematic diagram of the structure of another laser light source assembly provided in an embodiment of the present application. Figure 1 is an exploded view of laser light source assembly 10, and Figure 2 is a schematic diagram of the cross section a-a' of laser light source assembly 10 shown in Figure 1. As shown in Figures 1 and 2, laser light source assembly 10 includes: a housing 101, a laser 102, and a sealing ring 103.

[0056] As shown in Figure 1, the housing 101 can be a hollow structure surrounded by multiple walls and having an opening. For example, the opening of the housing 101 can include an opening K for arranging the laser 102. The housing 101 may also have other openings for arranging other components or communicating with other components, but the openings described in the subsequent content of the embodiment of the present application all refer to openings for arranging the laser 102. In the embodiment of the present application, the laser light source assembly 10 includes two lasers 102, and the housing 101 has two openings K corresponding to the two lasers 102 for example. In a specific implementation, the number of lasers 102 can also be 1, 3 or other values, and the number of openings K can also be adjusted accordingly.

[0057] FIG3 is a schematic structural diagram of a laser provided in an embodiment of the present application. As shown in FIG3 , the laser 102 includes a base plate 1021 and a light-emitting module 1022. The base plate 1021 is a plate-like structure having two relatively large plate surfaces and a plurality of smaller side surfaces connecting the two plate surfaces. In a specific implementation, the material of the base plate 1021 can be a conductive material, such as the material of the base plate 1021 includes copper. The material of the base plate 1021 may also not be a conductive material, which is not limited in the embodiment of the present application. The base plate 1021 can be used to carry other components in the laser 102. The light-emitting module 1022 is located on a plate surface of the base plate 1021. The plate surfaces described below in the embodiment of the present application all refer to the plate surfaces of the base plate 1021 on which the light-emitting module 1022 is arranged.

[0058] Light-emitting module 1022 is configured to emit laser light. In some embodiments, light-emitting module 1022 includes independently packaged light-emitting units, each of which can emit laser light of a different color, thereby emitting three-color laser light. Furthermore, in some embodiments, when there are more than one laser, each laser can be configured to emit three-color laser light. Alternatively, one laser can emit laser light of at least one of the three primary colors, while the remaining lasers emit laser light of the remaining colors of the three primary colors, thereby combining the light from multiple lasers to form three-color laser light.

[0059] The light-emitting module 1022 may include an annular frame 10221, a light-emitting chip (not shown) located within the frame, and a collimating lens 10222 located on a side of the frame 10221 away from the base plate 1021. The light-emitting chip is used to emit laser light, and the collimating lens 10222 is used to collimate the laser light emitted by the light-emitting chip before emitting it, thereby achieving light emission from the light-emitting module 1022. Each laser 102 may include one or more light-emitting modules 1022. This embodiment of the present application uses an example in which the laser 102 includes two light-emitting modules 1022.

[0060] As shown in FIG2 , after the laser 102 in the laser light source assembly 10 is fixed to the housing 101, the base plate 1021 of the laser 102 is located outside the opening K of the housing 101 and is fixed to the housing 101; the light-emitting module 1022 is located in the opening K and emits laser light into the housing 101. Other components may be provided in or elsewhere on the housing 101, such as optical elements, to adjust the laser light emitted by the laser 102.

[0061] The sealing ring 103 is annular and can surround the light-emitting module 1022 in the laser 102. It is located between the base plate 1021 and the edge area of ​​the opening K in the housing 101. The edge area refers to an annular area. The sealing ring 103 is used to fill the gap between the base plate 1021 and the edge area to seal the opening K. This can play a dust-proof role for the components installed on the base plate 1021 in the laser 102, preventing dust from affecting the light-emitting effect of the laser 102. It can also play a dust-proof role for other components in the housing 101, ensuring a good transmission effect of the laser in the housing 101. This can also reduce the contact between the laser 102 and the housing 101, and prevent the sharp corners of the housing 101 from contacting the laser 102, reducing the risk of damage to the protective paint in the laser 102, thereby reducing the risk of short circuit in the laser 102, and correspondingly improving the operating reliability of the laser 102.

[0062] In one embodiment, the sealing ring 103 may be formed of an elastic and insulating material, such as rubber or foam.

[0063] When assembling the laser light source assembly 10, the sealing ring 103 can be first placed at the opening K of the housing 101, and then the laser 102 can be passed through the sealing ring 103 and fixed to the housing 101. During the fixing process, the laser 102 can be pressed against the sealing ring 103 so that the sealing ring 103 tightly fills the gap between the laser 102 and the opening K of the housing 101, thereby ensuring that the sealing ring 103 seals the opening K.

[0064] In summary, in the laser light source assembly provided in the embodiments of the present application, a sealing ring is provided between the laser and the housing. This sealing ring surrounds the light-emitting module in the laser and is located between the base plate of the laser and the edge of the opening in the housing. This can reduce friction damage between the base plate of the laser and the housing, reduce the risk of short circuits in the laser, and improve the reliability of the laser light source assembly.

[0065] 3 , the bottom plate 1021 may further be provided with a fixing hole G and an electrical connection element 1023. The fixing hole G is used to fix the position of the laser 102, and the electrical connection element 1023 is used to electrically connect to the light emitting chip to transmit a control signal to the light emitting chip.

[0066] For example, the number of fixing holes G can be multiple, and the multiple fixing holes G can be located on opposite sides of the light-emitting module 1022. If the base plate 1021 is roughly rectangular, the multiple fixing holes G can be located on both sides of the length direction of the base plate 1021. In a specific implementation, Figure 4 is a structural schematic diagram of a shell provided in an embodiment of the present application. As shown in Figure 4, the surrounding area of ​​the opening K on the shell 101 can have a screw hole structure L, and the screw hole structure L can correspond to the fixing hole G in the laser 102. The surrounding area is located outside the edge area B of the opening K. The screw hole structure L is used to form a screw hole, which can be a blind hole or a through hole. The screw hole structure L can be flush with the surface on which it is set in the shell 101, or the screw hole structure L can also protrude relative to the surface on which it is set in the shell 101. The laser light source assembly 10 can also include screws, which can be used to pass through the fixing hole G in the laser 102 and penetrate into the corresponding screw hole structure L. The screw is threadedly fixed to the screw hole structure L, and the screw squeezes the laser 102 to fix the laser 102.

[0067] In this embodiment, two fixing holes G are provided on each of two opposing sides of the light-emitting module 1022. For each of the two fixing holes G, two screw hole structures L can be provided in the area surrounding the opening K in the housing 102. In one specific implementation, as shown in FIG4 , the housing 102 can also be provided with a corresponding screw hole structure L for one fixing hole G, while providing a positioning post Z for the other fixing hole G. The positioning post Z can be inserted into the corresponding fixing hole G to position and secure the laser 102.

[0068] For example, the electrical connection element 1023 may be located on one side of the base plate 1021, outside the two opposite sides where the fixing holes G are located. The base plate 1021 is generally rectangular, and the electrical connection element 1023 may be located on one side in the width direction of the base plate 1021. In one specific implementation, the electrical connection element 1023 may include a plurality of pins 10231 and sockets 10232, and control signals may be transmitted to the light-emitting chip via the pins 10231 or the sockets 10232.

[0069] FIG5 is a schematic diagram of the structure of another laser light source assembly provided in an embodiment of the present application, and FIG6 is a schematic diagram of the structure of another laser light source assembly provided in an embodiment of the present application. FIG5 does not illustrate the housing 101 in the laser light source assembly 10. As shown in FIG5 and FIG6, the laser light source assembly 10 may further include a circuit board electrically connected to the laser 102. If the circuit board is a printed circuit board (PCB) 104, the PCB 104 is fixed to the housing 101. The PCB 104 is connected to the electrical connection element 1023 in the laser 102 to send a control signal to the light-emitting chip through the electrical connection element 1023. In the embodiment of the present application, the electrical connection between the PCB 104 and the pin 10231 is used as an example for illustration, or the PCB 104 may also be electrically connected to the socket 10232.

[0070] When assembling the laser light source assembly 10, the electrical connection element 1023 of the laser 102 is first soldered to the PCB board 104. The soldered assembly is then mounted on the housing 101. During installation, a sealing ring 103 is used to seal the laser 102. For example, the sealing ring 103 can be first positioned at the edge of the opening K in the housing 101. The assembly is then aligned with the opening K and positioned so that the positioning post Z on the housing 101 is inserted into the fixing hole in the laser 102. Screws are then inserted through the other fixing holes G in the laser 102 into the screw hole structure L on the housing 101, and the screws are then tightened to secure the laser 102.

[0071] In the embodiment of the present application, the laser light source assembly 10 may further include a power supply board for supplying power to the PCB board 104. For example, there may be a plug-in terminal on the PCB board 104, and the plug-in terminal can be used in conjunction with a cable to connect the PCB board 104 to the power supply board.

[0072] In the embodiment of the present application, the sealing ring 103 has multiple optional implementations. The areas of the sealing ring 103 vary in different implementations, and the coverage areas of the laser 102 also vary accordingly. Several optional implementations of the sealing ring 103 are introduced below in conjunction with the accompanying drawings.

[0073] In the first implementation, referring again to Figures 1, 2, and 5, the orthographic projection of the sealing ring 103 on the surface of the base plate 1021 in the laser 102 covers the area between the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023, but does not cover other areas of the base plate 1021. For ease of description, the orthographic projection of a component on the surface of the base plate 1021 is referred to as the orthographic projection of the component. The orthographic projection of the sealing ring 103 can cover all or part of the area between the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023.

[0074] In this embodiment of the present application, the fixing hole G and the electrical connection element 1023 can be located in a single area of ​​the base plate 1021. As shown in FIG3 , this area is a semi-enclosed area located on three adjacent sides of the base plate 1021. The aforementioned "between the light-emitting module 1022 and the fixing hole G and the electrical connection element 1023" can refer to the area between the light-emitting module 1022 and this semi-enclosed area. For example, if the sealing ring 103 surrounds the light-emitting module 1022 in the laser 102, the sealing ring 103 only includes a portion located between the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023.

[0075] In this way, the sealing ring 103 directly covers the area between the light-emitting module 1022 and the fixing hole G and the electrical connection element 1023. The sealing ring 103 described in the embodiment of the present application covers a certain area of ​​the base plate 1021, which means that the sealing ring 103 is in contact with the area. Figure 7 is a structural schematic diagram of a sealing ring provided in an embodiment of the present application, and Figure 8 is a structural schematic diagram of another sealing ring provided in an embodiment of the present application. As shown in Figures 7 and 8, the sealing ring 103 can be in a square ring shape, and the ring widths at various positions in the sealing ring 103 can be roughly the same. In this implementation method, the sealing ring 103 does not cover the electrical connection element 1023, which can avoid the sealing ring 103 from squeezing the electrical connection element 1023.

[0076] In the second implementation, the orthographic projection of the sealing ring 103 covers the area outside the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023. In this implementation, the area of ​​the sealing ring 103 is larger than that of the first implementation, which can ensure a better sealing effect on the laser 102; it can also further isolate the laser 102 from direct contact with the housing 101, reducing the risk of damage to the laser 102 and reducing the probability and cost of repairing the laser 102. In this implementation, a positioning hole is correspondingly provided in the sealing ring 103 at the position corresponding to the fixing hole G.

[0077] In a first example of this implementation, the sealing ring 103 covers all or part of the board surface outside the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023. For example, a through hole may be provided in the sealing ring 103 at a position corresponding to the electrical connection element 1023 to prevent squeezing of the electrical connection element 1023. For another example, the entire edge area of ​​the bottom plate 1021 on the side where the electrical connection element 1023 is located is not covered by the sealing ring 103.

[0078] In the second example of this implementation, the orthographic projection of the sealing ring 103 covers all areas outside the light-emitting module 1022 and the fixing hole G. In this second example, the orthographic projection of the target portion of the sealing ring 103 covers the electrical connection element 1023. The target portion, located on the side of the surface of the base plate 1021, has a groove for accommodating the electrical connection element 1023. This groove can also be called a clearance groove. The provision of this groove prevents the sealing ring 103 from squeezing the electrical connection element 1023, ensuring the operational reliability of the electrical connection element 1023.

[0079] The second example is illustrated below with reference to the accompanying drawings. Figure 9 is a schematic structural diagram of another sealing ring provided in an embodiment of the present application, Figure 10 is a schematic structural diagram of another sealing ring provided in an embodiment of the present application, and Figure 11 is a schematic structural diagram of a sealing ring provided in another embodiment of the present application. Figure 12 is a schematic structural diagram of a laser light source assembly provided in another embodiment of the present application, Figure 13 is a schematic structural diagram of another laser light source assembly provided in another embodiment of the present application, and Figure 14 is a schematic structural diagram of yet another laser light source assembly provided in another embodiment of the present application. Among them, Figures 10 and 11 can be bottom views of the sealing ring 103 shown in Figure 9, Figure 12 does not illustrate the housing 101, Figure 13 is an exploded view of the laser light source assembly 10, and Figure 14 can be a schematic diagram of the cross section a-a' of the laser light source assembly 10 shown in Figure 13.

[0080] As shown in Figures 9 to 14, the orthographic projection of the sealing ring 103 covers all areas outside the light-emitting module 1022 and the fixing hole G. The area of ​​the front of the sealing ring 103 can be substantially equal to the area of ​​other areas outside the light-emitting module 1022 in the base plate 1021 of the laser 102, which surround the light-emitting module 1022, and the shape of the sealing ring 103 is the same as the shape of the other areas. The front refers to the surface of the sealing ring 103 away from the base plate 1022. The sealing ring 103 has a positioning hole D corresponding to the fixing hole G in the laser 102. The positioning hole D is used to align with the fixing hole G in the laser 102 to position the sealing ring 103 and facilitate the fixation of the laser 102.

[0081] As shown in FIG10 , the sealing ring 103 has a first groove A1 on its side near the base plate 1021. The position of the first groove A1 can be the same as the position of the pin 10231 in the electrical connection element 1023 of the laser 102. The first groove A1 is used to accommodate the pin 10231. As shown in FIG11 , the sealing ring 103 has a second groove A2 on its side near the base plate 1021. The position of the second groove A2 is the same as the position of the socket 10232 in the electrical connection element 1023 of the laser 102. The second groove A2 is used to accommodate the socket 10232.

[0082] Since the laser 102 uses one of the pins 10231 and the socket 10232 to connect to the PCB 104, a groove can be provided in the sealing ring 103 for the component used, while no groove is provided for the other component. Accordingly, the structure of the sealing ring 103 can be one of the structures shown in Figures 10 or 11.

[0083] If the sealing ring 103 in the laser light source assembly 10 adopts the first or second implementation method mentioned above, when assembling the laser light source assembly 10, the sealing ring 103 can be first set in the edge area of ​​the opening K of the shell 101, and then the laser 102 and the shell 101 can be locked.

[0084] In a third implementation, the orthographic projection of the sealing ring 103 covers the area outside the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023, and the sealing ring 103 also covers at least one side of the base plate 1021. That is, the sealing ring 103, in addition to the second implementation, also covers at least one side of the base plate 1021. The sealing ring 103 can cover up to three sides of the base plate 1021. Since the side where the electrical connection element 1023 is located needs to be connected to the PCB board 104, the sealing ring 103 does not need to cover the side where the electrical connection element 1023 is located. In this implementation, the area of ​​the sealing ring 103 can be larger than that in the second implementation, which can further ensure a better sealing effect on the laser 102.

[0085] The third implementation method is illustrated below with reference to the accompanying drawings. Figure 15 is a schematic structural diagram of another sealing ring provided by another embodiment of the present application, and Figure 16 is a schematic structural diagram of yet another sealing ring provided by another embodiment of the present application. Figure 17 is a schematic structural diagram of yet another laser light source assembly provided by another embodiment of the present application, Figure 18 is a schematic structural diagram of a laser light source assembly provided by yet another embodiment of the present application, and Figure 19 is a schematic structural diagram of yet another laser light source assembly provided by yet another embodiment of the present application. Among them, Figure 16 may be the bottom view shown in Figure 15, Figure 17 does not illustrate the housing 101, Figure 18 is an exploded view of the laser light source assembly 10, and Figure 19 may be a schematic diagram of the cross section a-a' of the laser light source assembly 10 shown in Figure 18.

[0086] As shown in Figures 15 to 19, based on the second implementation method described above, the sealing ring 103 also includes an auxiliary portion Q covering three sides of the base plate 1021. This type of sealing ring 103 can wrap the laser 102 as a whole, reducing the risk of damage to the laser 102. Figures 15 to 19 are illustrated as an example based on the first example in the second implementation method described above. The sealing ring 103 covers a portion of the area outside the light-emitting module 1022, the fixing hole G, and the electrical connection element 1023. The sealing ring 103 does not include the target portion of the electrical connection element 1023 that is covered by the orthographic projection.

[0087] If the sealing ring 103 in the laser light source assembly 10 adopts the third implementation method described above, when assembling the laser light source assembly 10, the sealing ring 103 can be assembled with the laser 102 first. The assembled whole can then be placed at the edge of the opening K of the housing 101, and the laser 102 and the housing 101 are locked. During the locking process, the laser 102 and the housing 101 squeeze the sealing ring 103 to improve the sealing effect.

[0088] In a specific implementation, the housing 101 in the embodiment of the present application may further be provided with an auxiliary groove corresponding to the electrical connection element 1023 in the laser 102. After the laser 102 is fixed to the housing 101, the electrical connection element 1023 in the laser 102 may be located in the auxiliary groove to prevent the housing 101 from squeezing the electrical connection element 1023, thereby ensuring the reliability of the laser 102.

[0089] In the embodiment of the present application, the surface on which the laser 102 is mounted in the housing 101 can be a flat surface, and the edge area of ​​the opening K can be flush with other areas. In this way, the sealing ring 103 can be directly located on this flat surface. In the laser light source assembly using the sealing ring 103 in the first implementation described above, after the laser 102 is fixed to the housing 101, a gap can exist between the base plate 1021 of the laser 102 and the laser mounting surface of the housing 101.

[0090] In an optional implementation of the housing 101, referring to FIG4 , an edge region B of the opening K of the housing 101 may be recessed into the housing 101, and at least a portion of the sealing ring 103 may be located within the recessed edge region B. In this manner, the recessed edge region B can position the sealing ring 103, preventing displacement of the sealing ring 103 when the laser 102 is secured, thereby ensuring the sealing effect of the sealing ring 103 on the opening K.

[0091] Regarding the sealing ring 103 in the first implementation manner described above, the sealing ring 103 can be entirely located in the recessed edge region B. For example, the outer ring size of the sealing ring 103 can be substantially the same as that of the edge region B, or the outer ring size of the sealing ring 103 can be slightly smaller than that of the edge region B. In this way, the sealing ring 103 can be entirely located in the recessed edge region B.

[0092] Alternatively, the sealing ring 103 in the first implementation described above may also be partially located in the recessed edge region B. For example, the sealing ring 103 may include an annular protrusion and a recessed portion, wherein the annular protrusion protrudes relative to the recessed portion toward a side away from the bottom plate 1021. The annular protrusion may be the inner edge region of the sealing ring 103, and the recessed portion may be the inner edge region of the sealing ring 103. The outer ring size of the sealing ring 103 is larger than the outer ring size of the edge region B, the inner ring size of the sealing ring 103 is smaller than the outer ring size of the edge region B, and the outer ring size of the inner edge region of the sealing ring 103 is equal to or smaller than the outer ring size of the edge region B. In this way, the inner edge region of the sealing ring 103 may be located in the recessed edge region B in the housing 101, while the outer edge region is located on a flat surface outside the edge region B in the housing 101.

[0093] For the sealing ring 103 in the second and third implementations described above, please continue to refer to Figures 9 to 19. The sealing ring 103 may include an annular protrusion T and a recessed portion (not shown in the figures). The recessed portion is the portion outside the annular protrusion T in the sealing ring 103. The recessed portion is located outside the outer ring of the annular protrusion T. The annular protrusion T protrudes toward the side away from the base plate 1021 relative to the recessed portion. The annular protrusion T can surround the light-emitting module 1022 in the laser 102. The recessed portion is away from the light-emitting module 1022 relative to the annular protrusion T. The annular protrusion T is located in the recessed edge area B in the housing 101. The recessed portion is located on the flat surface outside the edge area B in the housing 101.

[0094] In the laser light source assembly 10 of the present embodiment, the laser 102 and the housing 101 can be supported in a variety of ways. Three of these optional support methods are described below. For the following description of the edge area B, screw hole structure L, and positioning column Z in the housing 101, the fixing hole G in the laser 102, and the positioning hole D in the sealing ring 103, please refer to Figures 3, 4, 9, 15, and 16.

[0095] In the first supporting mode, the laser 102 directly supports the housing 101. This supporting mode can also be called plane supporting.

[0096] For example, the sealing ring 103 does not cover the area surrounding the opening K of the housing 101. This surrounding area is also the area in the housing 101 where the screw hole structure L and the positioning column Z are provided. The sealing ring 103 may be the sealing ring 103 in the first implementation described above. As shown in FIG2 , the screw hole structure L in this surrounding area is not raised, and the bottom plate 1021 directly contacts this flat surrounding area. This surrounding area is also the supporting area for the laser 102 in the housing 101. A screw can pass through the fixing hole G in the laser 102 and be fixed to the screw hole structure L. The fixing of the screw to the screw hole structure L is to thread the screw into the screw hole formed by the screw hole structure L in the housing 101.

[0097] Continuing to refer to Figures 2 and 4, in this supporting method, the edge region B of the opening K in the housing 101 is recessed, and the sealing ring 103 is located within the recessed edge region B. The sealing ring 103 can avoid air gaps in the position where the laser 102 rests against the housing 101. This supporting method is beneficial for the positioning accuracy of the laser 102 during placement. Furthermore, due to the large contact area between the laser 102 and the housing 101, the laser 102 can be placed more stably, which is beneficial for sealing the gap between the laser 102 and the housing 101.

[0098] In the second supporting manner, the laser 102 supports the screw hole structure L in the housing 101. This supporting manner can be called screw hole structure support.

[0099] For example, the sealing ring 103 covers the surrounding area of ​​the opening K in the shell 101, and the sealing ring 103 has a positioning hole D. The sealing ring 103 can be the sealing ring 103 in the second and third implementation methods mentioned above. Figure 20 is a structural schematic diagram of another shell provided in an embodiment of the present application. As shown in Figure 20, the screw hole structure L in the surrounding area of ​​the opening K in the shell 101 is protruding, and the screw hole structure L has an annular surface away from the surrounding area. Figure 21 is a partial schematic diagram of the position of the screw hole structure in a laser light source assembly provided in an embodiment of the present application. This position can be the same as the position circled in Figures 2, 14 and 19. Figure 21 is illustrated as an example in which the sealing ring 103 is the sealing ring 103 in the third implementation method mentioned above. As shown in Figure 21, in this supporting method, the screw hole structure L passes through the positioning hole D in the sealing ring 103, and the bottom plate of the laser 102 contacts the annular surface of the screw hole structure L away from the surrounding area. The annular surface is the supporting area of ​​the laser 102 in the shell 101. The screw can pass through the fixing hole G in the laser 102 and then be fixed to the screw hole structure L.

[0100] In this supporting arrangement, the edge region B of the opening K in the housing 101 may be recessed, and the sealing ring 103 may have an annular protrusion T (as shown in Figures 9 to 16), which is located within the recessed edge region B. In one specific implementation, the edge region B of the opening K in the housing 101 may not be recessed, and the sealing ring 103 may not have the annular protrusion T, and the thickness of the sealing ring 103 may be less than or equal to the height of the screw hole structure L protruding from the surrounding area.

[0101] In the third supporting manner, the laser 102 and the sealing ring 103 are supported. This supporting manner can be called sealing ring support.

[0102] For example, the sealing ring 103 covers the surrounding area of ​​the opening K in the shell 101, and the sealing ring 103 has a positioning hole D. The sealing ring 103 can be the sealing ring 103 in the second and third implementation methods mentioned above. Figure 22 is a partial schematic diagram of the position of the screw hole structure in another laser light source assembly provided in an embodiment of the present application. This position can be the same as the position circled in Figures 2, 14 and 19. Figure 22 is used as an example to illustrate the sealing ring 103 in the third implementation method mentioned above. As shown in Figure 22, the screw hole structure L in the surrounding area of ​​the opening K in the shell 101 is protruding, and the sealing ring 103 can cover the annular surface of the screw hole structure L away from the surrounding area. In a specific implementation, the sealing ring 103 may not cover the annular surface, but the thickness is greater than the height of the protruding part of the screw hole structure L. In a specific implementation, the screw hole structure L in the surrounding area of ​​the opening K in the shell 101 may also be flush with the surrounding area. In this supporting mode, the bottom plate of the laser 102 contacts only the sealing ring 103, but not the components in the housing 101. The screw can pass through the fixing hole G in the laser 102 and the positioning hole D in the sealing ring 103, and then be fixed with the screw hole structure L.

[0103] In this supporting arrangement, the edge region B of the opening K in the housing 101 may be recessed, and the sealing ring 103 may have an annular protrusion T (as shown in Figures 9 to 16), which is located within the recessed edge region B. In one specific implementation, the edge region B of the opening K in the housing 101 may not be recessed, and the sealing ring 103 may not have the annular protrusion T, and the thickness of the sealing ring 103 may be greater than the height of the screw hole structure L protruding from the surrounding area.

[0104] In the embodiment of the present application, the laser 102 and the PCB 104 can have different relative positions on the housing 101, and accordingly, the shape of the housing 101 may also vary. The following describes the laser light source assembly 10 in three different positions with reference to the accompanying drawings.

[0105] In the first positional relationship, as shown in Figures 5, 12, and 17, the surface of the bottom plate 1021 in the laser 102 is flush with the surface of the PCB board 104. The surface of the PCB board 104 refers to the surface of the solder pads provided on the PCB board 104 for connection to the laser 102. Correspondingly, the area where the laser 102 is provided on the housing 101 is flush with the area where the PCB board 104 is provided. The area where the laser 102 is provided on the housing 101 described in the embodiment of the present application refers to the area where the bottom plate of the laser 102 is provided on the housing 101. Figure 23 is a schematic structural diagram of another laser light source assembly provided in another embodiment of the present application. Figure 23 shows the state after the laser 102 and the PCB board 104 are installed on the housing 101 in this positional relationship.

[0106] In one specific implementation, Figure 24 is a schematic diagram of the structure of another housing provided by an embodiment of the present application. As shown in Figure 24, a raised limiting wall Y can also be provided on the housing 101. The limiting wall can surround the opening K in the housing 101 and its surrounding area. The limiting wall Y can make the area where the laser 102 is set into a groove shape. In this way, the sealing ring 103 and the laser 102 can be set in the area surrounded by the limiting wall Y, avoiding displacement of the sealing ring 103 and the laser 102 during fixation.

[0107] In the second positional relationship, Figure 25 is a schematic diagram of the structure of another laser light source assembly provided by yet another embodiment of the present application. Figure 25 does not show the housing 101 and sealing ring 103. As shown in Figure 25, the surface of the base plate 1021 in the laser 102 is higher than the surface of the PCB board 104. Correspondingly, Figure 26 is a schematic diagram of the structure of another housing provided by an embodiment of the present application. As shown in Figure 26, the placement area Q1 of the laser 102 on the housing 101 is recessed toward the interior of the housing 101 relative to the placement area Q2 of the PCB board 104.

[0108] FIG27 is a schematic diagram of the structure of a laser light source assembly provided in another embodiment of the present application, and FIG28 is a schematic diagram of the structure of another laser light source assembly provided in another embodiment of the present application, and FIG28 is a schematic diagram of the cross section b-b' of the light source structure shown in FIG27. Among them, FIG27 and FIG28 show the state after the laser 102 and the PCB board 104 in this positional relationship are installed on the housing 101. In this positional relationship, the setting area of ​​the laser 102 in the housing 101 is concave, and the groove structure designed in this area for limiting the sealing ring 103 can be directly utilized. In this case, the design of the housing 101 can be simpler.

[0109] In the third positional relationship, Figure 29 is a schematic diagram of the structure of another laser light source assembly provided by another embodiment of the present application. Figure 29 does not show the housing 101 and sealing ring 103. As shown in Figure 29, the surface of the base plate 1021 in the laser 102 is lower than the surface of the PCB board 104. Correspondingly, Figure 30 is a schematic diagram of the structure of a housing provided by another embodiment of the present application. As shown in Figure 30, the area Q1 on the housing 101 where the laser 102 is located protrudes outward from the housing 101 relative to the area Q2 on the PCB board 104.

[0110] FIG31 is a schematic diagram of the structure of another laser light source assembly provided in another embodiment of the present application, and FIG32 is a schematic diagram of the structure of another laser light source assembly provided in another embodiment of the present application. FIG32 is a schematic diagram of the cross section b-b' of the light source structure shown in FIG31. Specifically, FIG31 and FIG32 illustrate the state after the laser 102 and the PCB board 104 are installed on the housing 101 in this positional relationship.

[0111] In summary, in the laser light source assemblies provided in various embodiments of this application, a sealing ring is provided between the laser and the housing. This sealing ring surrounds the light-emitting module in the laser and is located between the base plate of the laser and the edge of the opening in the housing. This can reduce friction damage between the base plate of the laser and the housing, reduce the risk of short circuits in the laser, and improve the reliability of the laser light source assembly.

[0112] Furthermore, an embodiment of the present application further provides a laser projection device. FIG34 is a schematic diagram of a laser projection device provided by an embodiment of the present application. The laser projection device 001 may include: a light source system, an optical mechanical lighting system, and an imaging system. The laser projection device may include a laser light source assembly according to at least one of the above-described embodiments. The laser projection device may further include a light valve and a lens. The laser light emitted by the laser light source assembly may be injected into the light valve. The light valve may modulate the received laser light based on the image to be projected, and then may emit the modulated laser light toward the lens. The projection lens is used to image the image beam and then emit it to the projection screen 002.

[0113] It should be pointed out that in the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined. "Including" is an open description and should be understood as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect. In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. Similar reference numerals throughout the text indicate similar elements.

[0114] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A laser light source assembly, It is characterized in that The laser light source assembly comprises: a housing with an opening, a laser and a sealing ring; The laser comprises a bottom plate and a light-emitting module, wherein the light-emitting module is located on the surface of the bottom plate; the bottom plate is located outside the opening and is fixed to the housing, and the light-emitting module is located in the opening; The sealing ring surrounds the light-emitting module and is located between the bottom plate and an edge area of ​​the opening in the housing.

2. The laser light source assembly according to claim 1, It is characterized in that The plate surface is also provided with fixing holes and electrical connection elements; The orthographic projection of the sealing ring on the board surface covers the area between the light-emitting module, the fixing hole and the electrical connection element in the board surface.

3. The laser light source assembly according to claim 1, It is characterized in that The plate surface is also provided with fixing holes and electrical connection elements; The orthographic projection of the sealing ring on the board surface covers the area of ​​the board surface outside the light-emitting module, the fixing hole and the electrical connection element.

4. The laser light source assembly according to claim 3, It is characterized in that The orthographic projection of the target portion in the sealing ring on the board surface covers the electrical connection element, and a side of the target portion close to the board surface has a groove for accommodating the electrical connection element.

5. The laser light source assembly according to claim 3 or 4, It is characterized in that The sealing ring also covers the side surfaces of the bottom plate.

6. The laser light source assembly according to any one of claims 1 to 4, It is characterized in that The edge region is recessed into the housing, and at least a portion of the sealing ring is located in the recessed edge region.

7. The laser light source assembly according to claim 6, It is characterized in that The sealing ring comprises: an annular protrusion and a recessed portion, wherein the recessed portion is located outside the outer ring of the annular protrusion, and the annular protrusion protrudes relative to the recessed portion toward a side away from the plate surface; The annular protrusion is located in the edge region of the recess.

8. The laser light source assembly according to any one of claims 1 to 4, It is characterized in that The laser light source assembly further includes a circuit board, which is fixed on the housing and electrically connected to the laser; The laser arrangement area on the housing is flush with the circuit board arrangement area; Alternatively, the laser arrangement area on the housing is recessed toward the housing relative to the circuit board arrangement area; Alternatively, the arrangement area of ​​the laser on the housing protrudes toward the outside of the housing relative to the arrangement area of ​​the circuit board.

9. The laser light source assembly according to any one of claims 1 to 4, It is characterized in that The surrounding area of ​​the opening in the housing has a screw hole structure, the bottom plate has a fixing hole, and the laser light source assembly also includes a screw; The sealing ring does not cover the surrounding area, the bottom plate is in contact with the surrounding area, and the screw passes through the fixing hole and is fixed to the screw hole structure; Alternatively, the sealing ring covers the surrounding area, and the sealing ring has a positioning hole; the screw hole structure protrudes in the surrounding area, the screw hole structure passes through the positioning hole, and the bottom plate contacts the screw hole structure; the screw passes through the fixing hole and is fixed to the screw hole structure; Alternatively, the sealing ring covers the surrounding area and has a positioning hole; the bottom plate is in contact with the sealing ring, and the screw passes through the fixing hole and the positioning hole to be fixed to the screw hole structure.

10. A laser projection device, It is characterized in that The laser projection device comprises the laser light source assembly according to any one of claims 1 to 9, as well as a light valve and a lens; The laser light source assembly emits laser light toward the light valve, and the light valve is used to modulate the received laser light and then emit it toward the lens, and the lens is used to project the received laser light to form a projection picture.

Images