Method and device for dual polarization base station and user equipment antenna in upper and middle frequency band X-MIMO (multiple input multiple output) system

Abstract

The present disclosure relates to a 5G communication system or a 6G communication system for supporting a higher data rate than a 4G communication system such as Long Term Evolution (LTE). An apparatus includes a substrate and a plurality of antenna elements arranged according to an antenna configuration on the substrate. The antenna configuration includes a rectangular antenna patch and first and second pairs of circular antenna patches. The first pair of circular antenna patches supports a first angular polarization, where circular antenna patches of the first pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch. The second pair of circular antenna patches supports a second angular polarization orthogonal to the first angular polarization, where the antenna patches of the second pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch, each antenna patch of the first pair of circular antenna patches is positioned on a corner adjacent to two antenna patches of the second pair of circular antenna patches.

Description

Technical Field

[0001] The present disclosure generally relates to multiple-input multiple-output (MIMO) antenna array devices and processes. More specifically, the present disclosure relates to dual-polarized base station and user equipment (UE) antennas for 6G upper mid-band cross-division duplex (XDD) MIMO (X-MIMO) applications. Background Art

[0002] As wireless communications have evolved from one generation to the next, technologies have been developed primarily for human-targeted services, such as voice calls, multimedia services, and data services. With the commercialization of 5G (fifth-generation) communication systems, the number of connected devices is expected to grow exponentially. An increasing number of these devices will be connected to communication networks. Examples of connected things include vehicles, robots, drones, home appliances, displays, smart sensors connected to various infrastructure, construction machinery, and factory equipment. Mobile devices are expected to evolve in various form factors, such as augmented reality glasses, virtual reality headsets, and holographic devices. To provide a variety of services by connecting hundreds of billions of devices and things in the 6G (sixth generation) era, efforts are underway to develop improved 6G communication systems. For these reasons, 6G communication systems are referred to as beyond 5G systems.

[0003] The 6G communication system, which is expected to be commercialized around 2030, will have a peak data rate of terabit (1,000 gigabit) bps and a radio latency of less than 100 μsec, and will therefore be fifty times faster than the 5G communication system and have a radio latency that is one-tenth of that of the 5G communication system.

[0004] To achieve these high data rates and ultra-low latency, 6G communication systems are being considered in the terahertz band (e.g., the 95 GHz to 3 THz band). Since the terahertz band suffers from more severe path loss and atmospheric absorption than the millimeter waves introduced in 5G, technologies that ensure signal transmission distance (i.e., coverage) will become even more critical. Key technologies for ensuring coverage include the development of radio frequency (RF) components, antennas, new waveforms with improved coverage compared to orthogonal frequency division multiplexing (OFDM), beamforming with massive multiple-input, multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, and multi-antenna transmission technologies such as massive antennas. Furthermore, new technologies to improve terahertz band signal coverage are under discussion, such as metamaterial-based lenses and antennas, orbital angular momentum (OAM), and reconfigurable smart surfaces (RIS).

[0005] Furthermore, to improve spectrum efficiency and overall network performance, the following technologies are being developed for 6G communication systems: full-duplex technology for enabling uplink and downlink transmissions to simultaneously use the same frequency resources; network technologies for the integrated utilization of satellites, high-altitude platform stations (HAPS), and other systems; an improved network architecture for supporting mobile base stations and enabling network operation optimization and automation; dynamic spectrum sharing technology for conflict avoidance based on spectrum usage prediction; the use of artificial intelligence (AI) in wireless communications to improve overall network operations by leveraging AI from the design phase of 6G development and internalizing end-to-end AI support functions; and next-generation distributed computing technologies to overcome the limitations of UE computing capabilities through the ultra-high-performance communication and computing resources available on the network (such as mobile edge computing (MEC) and the cloud). Furthermore, efforts are underway to strengthen connectivity between devices, optimize networks, promote the softwareization of network entities, and increase the openness of wireless communications by designing new protocols for use in 6G communication systems, developing mechanisms for implementing hardware-based security environments and secure data usage, and developing technologies for maintaining privacy.

[0006] Research and development of 6G communication systems in hyperconnectivity, including both human-to-machine (P2M) and machine-to-machine (M2M), are expected to enable entirely new hyperconnectivity experiences. Specifically, 6G communication systems are expected to provide services such as truly immersive extended reality (XR), high-fidelity mobile holograms, and digital replicas. Furthermore, 6G communication systems will enable services such as remote surgery for enhanced safety and reliability, industrial automation, and emergency response, enabling these technologies to be applied in a variety of fields, including industry, healthcare, automotive, and home appliances. Summary of the Invention

[0007] [Technical Issues]

[0008] The present disclosure provides dual-polarization base station and UE antennas for 6G upper mid-band X-MIMO applications.

[0009] [Solution to the problem]

[0010] In a first embodiment, a device includes a substrate and a plurality of antenna elements arranged on the substrate according to an antenna configuration. The antenna configuration includes a rectangular antenna patch and a first pair of circular antenna patches and a second pair of circular antenna patches. The first pair of circular antenna patches supports a first angular polarization, wherein the circular antenna patches of the first pair of circular antenna patches are coupled to opposing corners of the rectangular antenna patch. The second pair of circular antenna patches supports a second angular polarization orthogonal to the first angular polarization, wherein the antenna patches of the second pair of circular antenna patches are coupled to opposing corners of the rectangular antenna patch, and wherein each antenna patch of the first pair of circular antenna patches is positioned at a corner adjacent to two antenna patches of the second pair of circular antenna patches.

[0011] In a second embodiment, an electronic device includes a multiple-input, multiple-output (MIMO) antenna, transmit (TX) processing circuitry, and receive (RX) processing circuitry. The MIMO antenna includes a substrate and a plurality of antenna elements arranged on the substrate according to an antenna configuration. The antenna configuration includes a rectangular antenna patch and a first pair of circular antenna patches and a second pair of circular antenna patches. The first pair of circular antenna patches supports a first angular polarization, wherein the first pair of circular antenna patches couple to opposing corners of the rectangular antenna patch. The second pair of circular antenna patches supports a second angular polarization orthogonal to the first angular polarization, wherein the antenna patches of the second pair of circular antenna patches couple to opposing corners of the rectangular antenna patch, wherein each antenna patch of the first pair of circular antenna patches is positioned at a corner adjacent to two antenna patches of the second pair of circular antenna patches. The TX processing circuitry is connected to the plurality of antenna elements and configured to provide signals to the plurality of antenna elements. The RX processing circuitry is connected to the plurality of antenna elements and configured to receive signals from the plurality of antenna elements, wherein each antenna patch of the first pair of circular antenna patches is positioned at a corner adjacent to two antenna patches of the second pair of circular antenna patches.

[0012] In a third embodiment, a method includes providing signals to a plurality of antenna elements, the plurality of antenna elements including a rectangular antenna patch, a first pair of circular antenna patches supporting a first angular polarization, and a second pair of circular antenna patches supporting a second angular polarization orthogonal to the first angular polarization. The method also includes receiving signals from the plurality of antenna elements. The method also includes increasing port-to-port isolation of antennas in the plurality of antennas using an antenna configuration including circular antenna patches of a first pair of circular antenna patches coupled to opposing corners of the rectangular antenna patch and antenna patches of a second pair of circular antenna patches coupled to opposing corners of the rectangular antenna patch, wherein each antenna patch of the first pair of circular antenna patches is positioned at a corner adjacent to two antenna patches of the second pair of circular antenna patches.

[0013] Other technical features may be apparent to those skilled in the art from the following drawings, description and claims.

[0014] Before proceeding with the following detailed description, it may be helpful to set forth the definitions of specific words and phrases used throughout this patent document. The term "connect" and its derivatives refer to any direct or indirect communication between two or more elements, regardless of whether those elements are in physical contact with one another. The terms "send," "receive," and "communicate," and their derivatives, encompass both direct and indirect communication. The terms "include," "comprise," and their derivatives, are intended to encompass, without limitation. The term "or" is inclusive, meaning and / or. The phrase "associated with" and its derivatives mean to include, be included within, be interconnected with, contain, be contained within, be connected to or connected with, be connected to or connected with, be communicable with, collaborate with, be interleaved, juxtaposed, adjacent, be bound to or bound with, have, have the property of, be related to, or have a relationship with, etc. The term "controller" refers to any device, system, or portion thereof that controls at least one operation. Such a controller may be implemented using hardware or a combination of hardware and software and / or firmware. The functionality associated with any particular controller may be centralized or distributed, whether local or remote. The phrase "at least one of," when used with a list of items, means that different combinations of one or more of the listed items may be used, and only one item in the list may be required. For example, "at least one of: A, B, and C" includes any of the following combinations: A; B; C; A and B; A and C; B and C; and A, B, and C.

[0015] In addition, the various functions described below may be implemented or supported by one or more computer programs, each of which is formed from computer-readable program code and embodied in a computer-readable medium. The terms "application" and "program" refer to one or more computer programs, software components, instruction sets, processes, functions, objects, classes, instances, related data, or portions thereof suitable for implementation in suitable computer-readable program code. The phrase "computer-readable program code" includes any type of computer code, including source code, object code, and executable code. The phrase "computer-readable medium" includes any type of medium that can be accessed by a computer, such as read-only memory (ROM), random-access memory (RAM), hard drives, compact disks (CDs), digital video disks (DVDs), or any other type of memory. "Non-transitory" computer-readable media does not include wired, wireless, optical, or other communication links that transmit transient electrical or other signals. Non-transitory computer-readable media includes media in which data can be permanently stored, as well as media in which data can be stored and subsequently overwritten, such as rewritable optical disks or erasable storage devices.

[0016] Definitions for certain words and phrases are provided throughout this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.

[0017] [Beneficial Effects of the Invention]

[0018] According to the embodiments of the present disclosure, wireless communication can be performed efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts: Figure 1 An example communication system according to an embodiment of the present disclosure is shown; Figure 2 An example electronic device according to an embodiment of the present disclosure is shown; Figure 3 An example electronic device according to an embodiment of the present disclosure is shown; Figure 4 shows a top view of an example antenna array according to the present disclosure; Figure 5 shows a bottom view of an example antenna array according to the present disclosure; Figure 6 An example antenna architecture having a 45° polarized element and a 135° polarized element according to the present disclosure is shown; Figure 7 An example antenna module according to the present disclosure is shown; Figure 8 An example antenna module stack according to the present disclosure is shown; Figure 9 An example antenna element according to the present disclosure is shown; Figure 10 An example second layer of an antenna element according to the present disclosure is shown; Figure 11 shows an example differential feed and power divider for a 4×1 subarray on layer 4 of an antenna module according to the present disclosure; Figure 12 shows an example differential feed and power divider for a 4×1 subarray on layer 7 of an antenna module according to the present disclosure; Figure 13 An example through-hole stub match for an antenna module according to the present disclosure is shown; Figure 14 shows an example wiring from the RF port to the power splitter on layer 10 for an antenna module according to the present disclosure; Figure 15shows example parameter results for the reflection coefficient of an antenna module according to the present disclosure; Figure 16 shows example parameter results for transmission coefficients of antenna modules according to the present disclosure; Figure 17A An example antenna module according to the present disclosure is shown; Figure 17B An example antenna module according to the present disclosure is shown; Figure 17C An example antenna module according to the present disclosure is shown; Figure 17D An example antenna module according to the present disclosure is shown; Figure 18A An example antenna module according to the present disclosure is shown; Figure 18B An example antenna module according to the present disclosure is shown; Figure 18C An example antenna module according to the present disclosure is shown; Figure 18D An example antenna module according to the present disclosure is shown; Figure 19A An example antenna module according to the present disclosure is shown; Figure 19B An example antenna module according to the present disclosure is shown; Figure 19C An example antenna module according to the present disclosure is shown; Figure 19D An example antenna module according to the present disclosure is shown; Figure 20A An example antenna module according to the present disclosure is shown; Figure 20B An example antenna module according to the present disclosure is shown; Figure 20C An example antenna module according to the present disclosure is shown; Figure 20D An example antenna module according to the present disclosure is shown; Figure 21 An example antenna module according to the present disclosure is shown; Figure 22 shows an example antenna element according to the present disclosure; and Figure 23 An example method for dual-polarized base station and UE antennas for mid-band X-MIMO applications on 6G according to the present disclosure is shown. DETAILED DESCRIPTION

[0020] MIMO is a technology that helps increase reliability and throughput. X-MIMO combines multi-user MIMO and massive MIMO to achieve greater coverage and increased capacity for multiple users simultaneously.

[0021] Described below Figures 1 to 23 The various embodiments used to describe the principles of the present disclosure are merely examples and should not be interpreted in any way as limiting the scope of the present disclosure. Those skilled in the art will understand that the principles of the present disclosure can be implemented in any type of suitably arranged device or system.

[0022] Analysis of current 5G network deployments has shown that while sub-6 GHz bands offer lower bandwidth and throughput than millimeter wave bands, they offer better overall performance. Taking these factors into account, the upper mid-band spectrum from 7 GHz to 24 GHz has been proposed for 6G to provide good capacity with reasonable coverage.

[0023] An X-MIMO system can use cross-division duplexing (XDD) with 1024 antennas in 45° / 135° dual polarization to generate 16 simultaneous beams with a 120° sweep angle for each beam. This means that 64 of the 1024 antennas and their associated radio frequency integrated circuits (RFICs) control the generation and steering of one beam.

[0024] When the full system is developed beyond the current scope, an 8×8 antenna array operating at 13 GHz can be tested with commercially available evaluation boards. The development of new antenna elements and arrays is driven by three performance factors: (1) less than -20 dB mutual coupling, (2) greater than 20 dB cross-polarization isolation in practical gain, and (3) low-cost printed circuit board (PCB) manufacturing. The first two conditions are necessary for optimal X-MIMO performance. Low manufacturing cost is essential for commercialization.

[0025] For future 6G applications, there are specific specifications related to general MIMO applications, and this X-MIMO application operates in the upper mid-band of 13 GHz. For optimal performance and easy commercialization, the following conditions should be met. (1) Dual-polarized antenna elements with 45° / 135° polarization operating at 13 GHz in the upper mid-band. (2) Wideband antennas covering a frequency band of 500 MHz or more around the center design frequency. (3) For more than 1000 antennas, antenna subarrays of various sizes are used to reduce the number of power amplifiers and RFICs. (4) Antennas are manufactured in a manner that minimizes cost, making the product easy to commercialize. (5) The two polarizations in the antenna element or subarray have low mutual coupling of less than -20 dB. (6) There is greater than 20 dB of isolation between the two polarizations when they radiate in the far field away from the antenna.

[0026] To address the above challenges, the X-MIMO antenna board targets an 8% S11 bandwidth around 13 GHz, wide gain bandwidth, wide sweep range, low PCB manufacturing cost, low mutual coupling, and high cross-polarization isolation.

[0027] The following Figure 1-Figure 3 Various embodiments are described for implementing and using Orthogonal Frequency Division Multiplexing (OFDM) or Orthogonal Frequency Division Multiple Access (OFDMA) communication techniques in wireless communication systems. Figure 1-Figure 3 The description is not meant to imply physical or architectural limitations to the manner in which different embodiments may be implemented. Different embodiments of the disclosure may be implemented in any suitably arranged communications system.

[0028] Figure 1 An example wireless network according to an embodiment of the present disclosure is shown. Figure 1 The embodiment of the wireless network shown is for illustration only. Other embodiments of the wireless network 100 may be used without departing from the scope of the present disclosure.

[0029] like Figure 1 As shown, the wireless network includes gNB 101 (e.g., base station BS), gNB 102, and gNB 103. gNB 101 communicates with gNB 102 and gNB 103. gNB 101 also communicates with at least one network 130, such as the Internet, a proprietary Internet Protocol (IP) network, or other data network.

[0030] gNB 102 provides wireless broadband access to network 130 for a plurality of first user equipment (UEs) within gNB 102's coverage area 120. The plurality of first UEs include UE 111, which may be located in a small business; UE 112, which may be located in an enterprise; UE 113, which may be a WiFi hotspot; UE 114, which may be located in a first residence; UE 115, which may be located in a second residence; and UE 116, which may be a mobile device such as a cell phone, a wireless laptop, a wireless PDA, etc. gNB 103 provides wireless broadband access to network 130 for a plurality of second UEs within gNB 103's coverage area 125. The plurality of second UEs include UE 115 and UE 116. In some embodiments, one or more of gNBs 101-103 may communicate with each other and with UEs 111-116 using 5G / NR, Long Term Evolution (LTE), Long Term Evolution Advanced (LTE-A), WiMAX, WiFi, or other wireless communication technologies.

[0031] Depending on the network type, the term "base station" or "BS" can refer to any component (or collection of components) configured to provide wireless access to a network, such as a transmission point (TP), a transmission-reception point (TRP), an enhanced base station (eNodeB or eNB), a 5G / NR base station (gNB), a macrocell, a femtocell, a WiFi access point (AP), or other wireless-enabled device. A base station can provide wireless access according to one or more wireless communication protocols, such as 5G / NR Third Generation Partnership Project (3GPP) NR, Long Term Evolution (LTE), LTE-Advanced (LTE-A), High-Speed Packet Access (HSPA), Wi-Fi 802.11a / b / g / n / ac, and others. For convenience, the terms "BS" and "TRP" are used interchangeably in this patent document to refer to a network infrastructure component that provides wireless access to remote terminals. Additionally, depending on the network type, the term "user equipment" or "UE" can refer to any component, such as a "mobile station," "subscriber station," "remote terminal," "wireless terminal," "reception point," or "user device." For convenience, the terms "user equipment" and "UE" are used in this patent document to refer to a remote wireless device that wirelessly accesses a BS, whether the UE is a mobile device (e.g., a mobile phone or smartphone) or a device generally considered to be stationary (e.g., a desktop computer or vending machine).

[0032] The dashed lines illustrate the approximate extents of coverage areas 120 and 125, which are shown as approximately circular for purposes of illustration and explanation only. It should be clearly understood that coverage areas associated with gNBs, such as coverage areas 120 and 125, may have other shapes, including irregular shapes, depending on the configuration of the gNB and variations in the radio environment associated with natural and man-made obstacles.

[0033] although Figure 1 An example of a wireless network is shown, but Figure 1 Various changes may be made. For example, the wireless network may include any number of gNBs and any number of UEs. Furthermore, gNB 101 may communicate directly with any number of UEs and provide those UEs with wireless broadband access to network 130. Similarly, each of gNBs 102-103 may communicate directly with network 130 and provide UEs with direct wireless broadband access to network 130. Furthermore, gNB 101, gNB 102, and / or gNB 103 may provide access to other or additional external networks, such as an external telephone network or other types of data networks.

[0034] Figure 2 An example gNB 102 is shown in accordance with an embodiment of the present disclosure. Figure 2 The embodiment of gNB 102 shown is for illustration only. Figure 1 gNB 101 and gNB 103 may have the same or similar configurations. However, gNBs have various configurations, and Figure 2 The scope of this disclosure is not limited to any particular implementation of a gNB.

[0035] like Figure 2 As shown, gNB 102 includes multiple antennas 205a-205n, multiple transceivers 210a-210n, a controller / processor 225, memory 230, and a backhaul or network interface 235.

[0036] Transceivers 210a-210n receive incoming RF signals from antennas 205a-205n, such as signals transmitted by UEs in network 100. Transceivers 210a-210n downconvert the incoming RF signals to generate IF or baseband signals. The IF or baseband signals are processed by receive (RX) processing circuitry within transceivers 210a-210n and / or controller / processor 225, which filters, decodes, and / or digitizes the baseband or IF signals to generate processed baseband signals. Controller / processor 225 may further process the baseband signals.

[0037] Transmit (TX) processing circuitry within transceivers 210a-210n and / or controller / processor 225 receives analog or digital data (e.g., voice data, web page data, email, or interactive video game data) from controller / processor 225. The TX processing circuitry encodes, multiplexes, and / or digitizes the outgoing baseband data to produce processed baseband or IF signals. Transceivers 210a-210n upconvert the baseband or IF signals into RF signals that are transmitted via antennas 205a-205n.

[0038] The controller / processor 225 may include one or more processors or other processing devices that control the overall operation of the gNB 102. For example, the controller / processor 225 may control the reception of uplink (UL) channel signals and the transmission of downlink (DL) channel signals by the transceivers 210a-210n according to well-known principles. The controller / processor 225 may also support additional functionality, such as more advanced wireless communication functionality. For example, the controller / processor 225 may support beamforming or directional routing operations, in which outgoing / incoming signals to / from the multiple antennas 205a-205n are weighted differently to efficiently direct the outgoing signals in a desired direction. The controller / processor 225 may also support any of a variety of other functions within the gNB 102.

[0039] The controller / processor 225 is also capable of executing programs and other processes, such as the OS, that reside in the memory 230. The controller / processor 225 can move data into or out of the memory 230 as required by the executing process.

[0040] The controller / processor 225 is also connected to a backhaul or network interface 235. The backhaul or network interface 235 allows the gNB 102 to communicate with other devices or systems via a backhaul connection or over a network. The interface 235 can support communication over any suitable wired or wireless connection. For example, when the gNB 102 is implemented as part of a cellular communication system (e.g., a system supporting 5G / NR, LTE, or LTE-A), the interface 235 can allow the gNB 102 to communicate with other gNBs via a wired or wireless backhaul connection. When the gNB 102 is implemented as an access point, the interface 235 can allow the gNB 102 to communicate over a wired or wireless local area network (LAN) or with a larger network (e.g., the Internet) via a wired or wireless connection. The interface 235 includes any suitable structure that supports communication over a wired or wireless connection (e.g., Ethernet or a transceiver).

[0041] Memory 230 is connected to controller / processor 225. A portion of memory 230 may include RAM, while another portion of memory 230 may include flash memory or other ROM.

[0042] although Figure 2 An example of a gNB 102 is shown, but the Figure 2 For example, gNB 102 may include Figure 2 Any quantity of each component shown. In addition, Figure 2 The various components in may be combined, further subdivided, or omitted, and additional components may be added according to specific needs.

[0043] Figure 3 An example UE 116 is shown in accordance with an embodiment of the present disclosure. Figure 3 The embodiment of UE 116 shown is for illustration only. Figure 1 UE 111-UE 115 may have the same or similar configuration. However, UE has a variety of configurations, and Figure 3 The scope of this disclosure is not limited to any particular implementation of a UE.

[0044] like Figure 3As shown, UE 116 includes antenna 305, transceiver 310, and microphone 320. UE 116 also includes speaker 330, processor 340, input / output (I / O) interface (IF) 345, input 350, display 355, and memory 360. Memory 360 includes operating system (OS) 361 and one or more applications 362.

[0045] Transceiver 310 receives an incoming RF signal from antenna 305, transmitted by a gNB in network 100. Transceiver 310 downconverts the incoming RF signal to produce an intermediate frequency (IF) or baseband signal. The IF or baseband signal is processed by RX processing circuitry within transceiver 310 and / or processor 340, which filters, decodes, and / or digitizes the baseband or IF signal to produce a processed baseband signal. The RX processing circuitry then transmits the processed baseband signal to speaker 330 (e.g., for voice data) or to processor 340 (e.g., for web browsing data) for processing.

[0046] The TX processing circuitry in transceiver 310 and / or processor 340 receives analog or digital voice data from microphone 320 or other outgoing baseband data (e.g., web page data, email, or interactive video game data) from processor 340. The TX processing circuitry encodes, multiplexes, and / or digitizes the outgoing baseband data to generate a processed baseband or IF signal. Transceiver 310 up-converts the baseband or IF signal into an RF signal that is transmitted via antenna 305.

[0047] The processor 340 may include one or more processors or other processing devices and executes the OS 361 stored in the memory 360 to control the overall operation of the UE 116. For example, the processor 340 may control the transceiver 310 to receive downlink channel signals and transmit uplink channel signals according to well-known principles. In some embodiments, the processor 340 includes at least one microprocessor or microcontroller.

[0048] Processor 340 is also capable of executing other processes and programs residing in memory 360. Processor 340 can move data into or out of memory 360 as needed by the executing process. In some embodiments, processor 340 is configured to execute application 362 based on OS 361 or in response to signals received from the gNB or operator. Processor 340 is also connected to I / O interface 345, which provides UE 116 with the ability to connect to other devices such as laptops and handheld computers. I / O interface 345 is the communication path between these accessories and processor 340.

[0049] The processor 340 is also connected to an input 350, which may include, for example, a touch screen, a keypad, etc., and a display 355. An operator of the UE 116 may use the input 350 to enter data into the UE 116. The display 355 may be a liquid crystal display, a light emitting diode display, or other display capable of presenting text and / or at least limited graphics, such as from a website.

[0050] The memory 360 is connected to the processor 340. A portion of the memory 360 may include random access memory (RAM), and another portion of the memory 360 may include flash memory or other read-only memory (ROM).

[0051] although Figure 3 An example of a UE 116 is shown, but the Figure 3 Make various changes. For example, Figure 3 Various components in the can be combined, further subdivided, or omitted, and additional components can be added as needed. As a specific example, processor 340 can be divided into multiple processors, such as one or more central processing units (CPUs) and one or more graphics processing units (GPUs). In another example, transceiver 310 can include any number of transceivers and signal processing chains and can be connected to any number of antennas. In addition, although Figure 3 The UE 116 is shown configured as a mobile phone or smartphone, but the UE may be configured to operate as other types of mobile or stationary devices.

[0052] Figure 4-Figure 8 An example antenna array according to the present disclosure is shown. Specifically, Figure 4 A top view 400 of an example antenna array 402 is shown; Figure 5 A bottom view 500 of an example antenna array 402 is shown; Figure 6 An example antenna module 600 is shown having a 45° polarized element and a 135° polarized element; Figure 7 An example evaluation board 700 is shown; Figure 8 An example antenna module stack 800 is shown. Figure 4-Figure 8 The illustrated embodiment of the example antenna array 402 is for illustration only. Figure 4-Figure 8 The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0053] like Figure 4 and Figure 5As shown, the example antenna array 402 includes 64 dual-polarized antenna elements 404 in the top view 400 and 32 RF ports 502 in the bottom view 500 . Sixteen of the 32 RF ports are used to excite the 45° polarization element 406 , while the other 16 RF ports are used to excite the 135° polarization element 408 .

[0054] By maintaining low loss and low mutual coupling between polarizations, the example antenna module stack 800 can be designed to accommodate the transition between the evaluation board and the antenna PCB, and to accommodate a dual-polarized antenna with associated subarrays and differential feeds.

[0055] The example antenna array 402 can be designed to include a differentially fed dual-polarized 45° polarization element 406 and a 135° polarization element 408. This design of the example antenna array 402 results in increased gain, a 3dB gain bandwidth greater than 11%, and an S11 matching bandwidth greater than 8%.

[0056] The feed mechanism provides high cross-polarization isolation. Using through-holes reduces PCB manufacturing costs. Using impedance-controlled vias maintains good S11 bandwidth. Carefully designed short-line networks help minimize via losses and bandwidth by compensating for the additional via impedance.

[0057] like Figure 6 and Figure 7 As shown, antenna module 600 can be placed on an evaluation board 700. For example, an 8×8 antenna module can be tested using a commercial evaluation board 700, such as the ADAR1000EVAL1Z (Stingray) from Analog Devices. Evaluation board 700 has eight radio frequency integrated circuits (RFICs) A, H. The top four RFICs—A, C, E, and G—are used for the 135° polarization element 408. The bottom four RFICs—B, D, F, and H—are used for the 45° polarization element 406. Each RFIC has four channels, meaning there are 16 available RF ports for each polarization. To use these sixteen ports to feed 64 antenna elements, a 4×1 antenna subarray is required, as shown in the antenna architecture. Each element of this 4×1 subarray has two feed positions and can support dual 45° and 135° polarizations.

[0058] like Figure 8As shown, antenna module stack 800 may include 10 metal layers and 9 dielectric layers. The multilayer substrate may have an approximate thickness within the range of 0.01-0.02 of the free-space wavelength (λ0). Antenna module stack 800 may include at least one of a transition layer, a 1×4 power divider layer with 135° polarization, a 1×4 power divider layer with 45° polarization, and an antenna layer. Antenna module stack 800 may consist of antenna elements, differential feed lines for two polarizations, a power divider for a 4×1 subarray, and routing from the power divider common port to the RF port of the stingray board. This architecture requires a multilayer, symmetrical PCB design. From a thermal perspective, symmetry can be utilized to prevent PCB warping after prolonged heat exposure. Isola Tachyon 100G dielectric with a Dk of 3.1 to 3.24 and a DF of 1.8e-3 to 2.2e-3 was selected. Dk and Df vary due to the different fill factors of the core and prepreg substrate.

[0059] In some embodiments, antenna module stack 800 may include ten metal layers and nine dielectric layers separating the ten metal layers. Each metal layer may be approximately 1.4 mils thick and made of 1 oz copper. First metal layer 802 may serve as the antenna layer. First dielectric layer 803 may separate first metal layer 802 from second metal layer 804. First dielectric layer 803 may have a thickness of approximately 10 mils, a relative permittivity of approximately 3.1, and a dissipation factor of approximately 0.0018.

[0060] The second metal layer 804 may serve as a frame. The second dielectric layer 805 may separate the second metal layer 804 from the third metal layer 806. The second dielectric layer 805 may have a thickness of approximately 18.1 mil, a relative dielectric constant of approximately 3.1, and a dissipation factor of approximately 0.0018.

[0061] The third metal layer 806 may serve as a ground. A third dielectric layer 807 may separate the third metal layer 806 from the fourth metal layer 808. The third dielectric layer 807 may have a thickness of approximately 8 mils, a relative dielectric constant of approximately 3.24, and a dissipation factor of approximately 0.0022.

[0062] The fourth metal layer 808 may function as a 135° power divider. The fourth dielectric layer 809 may separate the fourth metal layer 808 from the fifth metal layer 810. The fourth dielectric layer 809 may have a thickness of approximately 8 mils, a relative dielectric constant of approximately 3.11, and a dissipation factor of approximately 0.0018.

[0063] The fifth metal layer 810 may serve as a ground. The fifth dielectric layer 811 may separate the fifth metal layer 810 from the sixth metal layer 812. The fifth dielectric layer 811 may have a thickness of approximately 8 mil, a relative dielectric constant of approximately 3.24, and a dissipation factor of approximately 0.0022.

[0064] The sixth metal layer 812 may serve as a ground. The sixth dielectric layer 813 may separate the sixth metal layer 812 from the seventh metal layer 814. The sixth dielectric layer 813 may have a thickness of approximately 8 mils, a relative dielectric constant of approximately 3.11, and a dissipation factor of approximately 0.0018.

[0065] The seventh metal layer 814 may function as a 45° polarization power divider. The seventh dielectric layer 815 may separate the seventh metal layer 814 from the eighth metal layer 816. The seventh dielectric layer 815 may have a thickness of approximately 8 mils, a relative dielectric constant of approximately 3.24, and a dissipation factor of approximately 0.0022.

[0066] The eighth metal layer 816 may serve as a ground. An eighth dielectric layer 817 may separate the eighth metal layer 816 from the ninth metal layer 818. The eighth dielectric layer 817 may have a thickness of approximately 18.1 mil, a relative dielectric constant of approximately 3.1, and a dissipation factor of approximately 0.0018.

[0067] Ninth metal layer 818 may serve as a ground. Ninth dielectric layer 819 may separate ninth metal layer 818 from tenth metal layer 820. Ninth dielectric layer 819 may have a thickness of approximately 10 mils, a relative dielectric constant of approximately 3.1, and a dissipation factor of approximately 0.0018. Tenth metal layer 820 may serve as a common port for the RF ports.

[0068] although Figure 4-Figure 8 An example antenna array 402 is shown, but Figure 4-Figure 8 Various changes may be made. For example, the size, shape, and specifications of the example antenna array 402 and its individual components may be varied as needed or desired. Furthermore, the number and location of the various components of the example antenna array 402 may be varied as needed or desired. Furthermore, the example antenna array 402 may be used in any other suitable communication process and is not limited to the specific process described above.

[0069] Figures 9-14 An example antenna element according to the present disclosure is shown. Specifically, Figure 9 An example antenna element 900 is shown; Figure 10 An example antenna element second layer 1000 is shown; Figure 11 An example differential feed and power divider 1100 is shown for a 4×1 subarray on layer 4 of an antenna module; Figure 12An example differential feed and power divider 1200 is shown for a 4×1 subarray on layer 7 of an antenna module; Figure 13 An example through-hole stub match 1300 of an antenna module according to the present disclosure is shown; Figure 14 An example routing 1400 from a radio frequency port to a power splitter on metal layer 10 for an antenna module according to the present disclosure is shown. Figures 9-14 The example antenna element implementations shown are for illustration only. Figures 9-14 The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0070] Figure 9 A design for an example antenna element 900 is shown. The example antenna element 900 may include four circular feed patches 902 surrounding a center patch 904. The center patch 904 may be shaped as a rectangle. The center patch 904 may have a width and length of approximately 6.8 mm.

[0071] The center patch 904 may include a diamond-shaped slot 906. The diamond-shaped slot 906 may be located in the center of the center patch 904 and may support 45° polarization and 135° polarization, thereby enhancing bandwidth by introducing additional resonances. The center patch 904 may have a width and length of approximately 1.6 mm and a thickness of approximately 6 mils.

[0072] Circular feed patches 902 can be arranged around the center patch 904 to support 45° polarization and 135° polarization. In some embodiments, a circular feed patch 902 can be arranged at each corner of the square center patch 904. The circular feed patches 902 can have a diameter of approximately 4.4 mm. In some embodiments, the first pair of circular feed patches can be associated with a range of 0.15 to 0.2 of the free space wavelength, inclusive. The circular feed patches 902 can be coupled to the center patch 904 within a range of 0.25 to 0.3 of the free space wavelength, inclusive, with a gap within a range of 0.01 to 0.02 of the free space wavelength, inclusive.

[0073] The circular feed patch 902 can be isolated from the center patch 904 to achieve a desired mutual coupling, for example, less than -20 dB. A gap can be provided between the circular feed patch 902 and the center patch 904. The gap can be approximately 6 mils. Signal vias can be located inside different circular feed patches.

[0074] like Figure 10 As shown, the metal frame 1002 can be located Figure 8Metal layer 2 does not affect antenna performance and serves only to balance the grounding on metal layer 9 and maintain symmetry. Metal frame 1002 may have a width and length of approximately 15 mm. The top and bottom thicknesses of metal frame 1002 may be approximately 1 mm. The side thicknesses of metal frame 1002 may be approximately 0.3 mm.

[0075] like Figure 11 and Figure 12 As shown, metal layer 4 may include a feed line for 135° polarization, and metal layer 7 may include a feed line for 45° polarization. The feed lines for the 4×1 subarray may be implemented in a stripline configuration. For simplicity, only the impedance of each segment is mentioned.

[0076] Through-holes are used in the antenna module stack 800, which avoids the high manufacturing costs associated with blind vias. Figure 8 Figure 1 shows a circuit for grounding a subminiature push-on micro (SMPM) connector from metal layer 9 to metal layer 10. The novel approach implemented here is to short the signal in the via to an adjacent ground via at the top or bottom metal layer to avoid radiation losses from the via. This approach results in inductive reactance from the additional length of vias extending above and below the feedline on metal layers 4 and 7. Therefore, an open-circuited capacitive stub is used to match the feedline.

[0077] The 4×1 subarray from metal layers 1 to 9 with power dividers can be replicated twice to form an 8×1 subarray. For each element of the 8×1 subarray, the routing from the power divider common port to the stingray RF port on metal layer 10 is done due to the stingray board RFIC port layout ( Figure 1 The routing and associated line lengths for each RF to the power divider port of the 8×1 subarray are different. The 8×1 subarray can be replicated eight times to form an 8×8 antenna module.

[0078] although Figures 9-14 An example antenna element 900 is shown, but Figures 9-14 Various changes may be made. For example, the size, shape, and specifications of the example antenna element 900 and its individual components may be varied as needed or desired. Furthermore, the example antenna element 900 may be used in any other suitable communication process and is not limited to the specific process described above.

[0079] Figure 15 and Figure 16 Example operating parameters of an antenna array according to the present disclosure are shown. In particular, Figure 15 Example parameter results 1500 for reflection coefficient of an antenna module are shown; Figure 16Example parameter results 1600 for the transmission coefficient of an antenna module are shown. Figure 15 and Figure 16 The example operating parameter implementations shown in are for illustration only. Figure 15 and Figure 16 The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0080] like Figure 15 and Figure 16 As shown in the figure, the parameter results 1500 and 1600 are determined for the via design stub matching based on the port number. Port 1 is located on layer 10, which is the same layer as the RF port, and port 2 is the power divider port on layer 4 or layer 7. Both ports 1 and 2 can be implemented as lumped ports, and the feed line can be kept very short, so that only the via transition loss can be considered.

[0081] Figure 15 The reflection coefficient (S11) parameter results 1500 are shown. The solid line represents the results for port 1, and the dashed line represents the results for port 2. The line starting at -7.00 represents the results for 135° polarization. The line starting at -12.00 represents the results for 45° polarization. These results show that all ports are well matched with high bandwidth.

[0082] Figure 16 The transmission coefficient (S21) parameter results 1600 are shown. The line starting at -1.20 shows the results for 135° polarization. The line starting at -0.40 shows the results for 45° polarization. These results show that at a frequency of 13 GHz, for vias of these lengths spanning multiple layers, the insertion loss is as low as 0.17 dB, which has not been reported before.

[0083] Figures 17A-17D An example antenna module 1700 according to the present disclosure is shown. Figure 17A shows an isometric view of an example antenna module 1700, Figure 17B A side view 1700a of an example antenna module 1700 is shown, Figure 17C A top view 1700b of an example antenna module 1700 is shown, and Figure 17D A bottom view 1700c of an example antenna module 1700 is shown. Figures 17A-17D The embodiment of the example antenna module 1700 shown in FIGURE 1 is for illustration only. Figures 17A-17D The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0084] like Figures 17A-17D As shown, an example antenna module 1700 may include two connectors 1702 placed at the bottom of the first layer. One connector 1702 may feed a 135° polarization, while the other connector 1702 may feed a 45° polarization.

[0085] although Figures 17A-17D An example antenna module 1700 is shown, but may be Figures 17A-17D Various changes may be made. For example, the size, shape, and specifications of the example antenna module 1700 and its individual components may be varied as needed or desired. Furthermore, the example antenna module 1700 may be used in any other suitable communication process and is not limited to the specific process described above.

[0086] Figures 18A-18D An example antenna module 1800 according to the present disclosure is shown. Figure 18A shows an isometric view of an example antenna module 1800, Figure 18B A side view 1800a of an example antenna module 1800 is shown, Figure 18C A top view 1800b of an example antenna module 1800 is shown, and Figure 18D A bottom view 1800c of an example antenna module 1800 is shown. Figures 18A-18D The illustrated embodiment of example antenna module 1800 is for illustration only. Figures 18A-18D The scope of this disclosure is not limited to any certain implementations of electronic devices.

[0087] like Figures 18A-18D As shown, you can use Figure 8 The same stack as shown is used to make a 4×1 subarray. The example antenna module 1800 has a circular center patch with a square slot. The circular patches can be evenly arranged around the circular center patch. In some embodiments, the circular patches are arranged at the edge of the circular center patch, aligned with one of the edges of the square slot. The connector position allows them to be easily connected to the Figure 7 The evaluation board RF port interface in.

[0088] although Figures 18A-18D An example antenna module 1800 is shown, but Figures 18A-18D Various changes may be made. For example, the size, shape, and specifications of the example antenna module 1800 and its individual components may be varied as needed or desired. Furthermore, the example antenna module 1800 may be used in any other suitable communication process and is not limited to the specific process described above.

[0089] Figures 19A-19D An example antenna module 1900 according to the present disclosure is shown. Figure 19A shows an isometric view of an example antenna module 1900, Figure 19B A side view 1900a of an example antenna module 1900 is shown, Figure 19C A top view 1900b of an example antenna module 1900 is shown. Figure 19DA bottom view 1900c of an example antenna module 1900 is shown. Figures 19A-19D The embodiment of the example antenna module 1900 shown in FIGURE 1 is for illustration only. Figures 19A-19D The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0090] like Figures 19A-19D As shown, example antenna module 1900 is arranged in an 8×1 subarray. The 4×1 subarrays from layers 1–9 are replicated to form the 8×1 subarray. The routing on layer 10 is different for the second port of the second 4×1 subarray because the RF port placement on the top half of the evaluation board is asymmetrical. For an 8×8 antenna module, the 8×1 subarray is the smallest overall building block. The 8×1 subarray block can be replicated eight times to form an 8×8 module.

[0091] although Figures 19A-19D An example antenna module 1900 is shown, but Figures 19A-19D Various changes may be made. For example, the size, shape, and specifications of the example antenna module 1900 and its individual components may be varied as needed or desired. Furthermore, the example antenna module 1900 may be used in any other suitable communication process and is not limited to the specific process described above.

[0092] Figures 20A-20D An example antenna module 2000 according to the present disclosure is shown. Figure 20A shows an isometric view of an example antenna module 2000, Figure 20B 2000a shows a side view of an example antenna module 2000. Figure 20C A top view 2000b of an example antenna module 2000 is shown, and Figure 20D A bottom view 2000c of an example antenna module 2000 is shown. Figures 20A-20D The illustrated embodiment of example antenna module 2000 is for illustration only. Figures 20A-20D The scope of this disclosure is not limited to any certain implementations of electronic devices.

[0093] like Figures 20A-20D As shown, the example antenna module 2000 includes wiring on the bottom layer, which can be changed from microstrip to coplanar waveguide (CPW). Including CPW can help in the bottom layer (e.g., Figure 8 The ground plane is established on layer 10 as shown in FIG, and the need for blind vias is eliminated. The absence of blind vias can further reduce production costs.

[0094] although Figures 20A-20D An example antenna module 2000 is shown, but Figures 20A-20DVarious changes may be made. For example, the size, shape, and specifications of the example antenna module 2000 and its individual components may be varied as needed or desired. Furthermore, the example antenna module 2000 may be used in any other suitable communication process and is not limited to the specific process described above.

[0095] Figure 21 An example antenna module 2100 according to the present disclosure is shown. Figure 21 The illustrated embodiment of example antenna module 2100 is for illustration only. Figure 21 The scope of this disclosure is not limited to any certain implementations of electronic devices.

[0096] like Figure 21 As shown, the example antenna module 2100 may include a feed line implemented in a stripline configuration on the metal layer 9, rather than using a microstrip or CPW line on the bottom layer. Figure 21 The stack is shown in FIG. Figure 21 As shown, the SMPM connector can be modified to include vertical pins that can interface with metal layer 9.

[0097] In certain embodiments, the example antenna module 2100 may include ten metal layers and nine dielectric layers separating the ten metal layers. Each metal layer may have a thickness of approximately 1.4 mils and be made of 1 oz copper. A first metal layer 2102 may serve as an antenna layer. A first dielectric layer 2103 may separate the first metal layer 2102 from the second metal layer 2104. The first dielectric layer 2103 may have a thickness of approximately 15 mils and a relative permittivity of approximately 3.

[0098] The second metal layer 2104 may serve as a frame. The second dielectric layer 2105 may separate the second metal layer 2104 from the third metal layer 2106. The second dielectric layer 2105 may have a thickness of approximately 15 mil and a relative dielectric constant of approximately 3.

[0099] The third metal layer 2106 may serve as a ground. A third dielectric layer 2107 may separate the third metal layer 2106 from the fourth metal layer 2108. The third dielectric layer 2107 may have a thickness of approximately 8 mils and a relative dielectric constant of approximately 3.45.

[0100] The fourth metal layer 2108 may function as a 135° power divider. The fourth dielectric layer 2109 may separate the fourth metal layer 2108 from the fifth metal layer 2110. The fourth dielectric layer 2109 may have a thickness of approximately 8 mils and a relative dielectric constant of approximately 3.45.

[0101] The fifth metal layer 2110 may be used as a ground. The fifth dielectric layer 2111 may separate the fifth metal layer 2110 from the sixth metal layer 2112. The fifth dielectric layer 2111 may have a thickness of about 8 mil and a relative dielectric constant of about 3.45.

[0102] The sixth metal layer 2112 may be used as a ground. The sixth dielectric layer 2113 may separate the sixth metal layer 2112 from the seventh metal layer 2114. The sixth dielectric layer 2113 may have a thickness of approximately 8 mil and a relative dielectric constant of approximately 3.45.

[0103] The seventh metal layer 2114 may function as a 45° polarization power divider. The seventh dielectric layer 2115 may separate the seventh metal layer 2114 from the eighth metal layer 2116. The seventh dielectric layer 2115 may have a thickness of approximately 8 mils and a relative dielectric constant of approximately 3.45.

[0104] The eighth metal layer 2116 may be used as a ground. The eighth dielectric layer 2117 may separate the eighth metal layer 2116 from the ninth metal layer 2118. The eighth dielectric layer 2117 may have a thickness of about 15 mil and a relative dielectric constant of about 3.

[0105] Ninth metal layer 2118 may serve as a common port for the RF port. Ninth dielectric layer 2119 may separate ninth metal layer 2118 from tenth metal layer 2120. Ninth dielectric layer 2119 may have a thickness of approximately 15 mil and a relative dielectric constant of approximately 3. Tenth metal layer 2120 may serve as a ground.

[0106] although Figure 21 An example antenna module 2100 is shown, but Figure 21 Various changes may be made. For example, the size, shape, and specifications of the example antenna module 2100 and its individual components may be varied as needed or desired. Furthermore, the example antenna module 2100 may be used in any other suitable communication process and is not limited to the specific process described above.

[0107] Figure 22 An example antenna element 2200 according to the present disclosure is shown. Figure 22 The illustrated embodiment of the example antenna element 2200 is for illustration only. Figure 22 The scope of the present disclosure is not limited to any particular implementation of an electronic device.

[0108] like Figure 22As shown, an example antenna element 2200 can include a diamond-shaped patch that can be used to replace a circular feed patch on metal layer 1 of an antenna element or subarray. The diamond-shaped patch can be oriented at the edge of a square center patch. The square center patch can include a square slot that includes an edge oriented with the edge of the square center patch.

[0109] although Figure 22 An example antenna element 2200 is shown, but Figure 22 Various changes may be made. For example, the size, shape, and specifications of the example antenna element 2200 and its individual components may be varied as needed or desired. Furthermore, the example antenna element 2200 may be used in any other suitable communication process and is not limited to the specific process described above.

[0110] Figure 23 An example method 2300 for dual-polarized base station and UE antennas for mid-band X-MIMO applications on 6G is shown in accordance with the present disclosure. For ease of explanation, Figure 23 The example method 2300 is described as using Figure 1 and Figure 3 UE 116 and Figure 4 The example method 2300 may be performed with the antenna array 402. However, the example method 2300 may be used with any other suitable system and any other suitable antenna array.

[0111] like Figure 23 As shown, at step 2302, a UE 116 including an example antenna array 402 may provide signals to a plurality of antenna elements. The plurality of antenna elements may include a rectangular antenna patch, a first pair of circular antenna patches supporting a first angular polarization, and a second pair of circular antenna patches supporting a second angular polarization orthogonal to the first angular polarization. The first pair of circular patches may be associated with a range of 0.15 to 0.2 of the free-space wavelength, inclusive. The first pair of circular patches and the second pair of circular patches may be coupled to the rectangular antenna patch within a range of 0.25 to 0.3 of the free-space wavelength, inclusive, and have a gap within a range of 0.01 to 0.02 of the free-space wavelength, inclusive. The substrate may be a multilayer substrate having a thickness within a range of 0.01 to 0.2 of the free-space wavelength, inclusive. The substrate may include at least one of a transition layer, a ground layer, a 1×4 power splitter layer with 135° polarization, a 1×4 power splitter layer with 45° polarization, and an antenna layer. The rectangular frame associated with the second layer is within the range of 0.02 to 0.15 of the free space wavelength, inclusive. Based on the patch antenna feed mechanism and the rectangular frame, a port-to-port isolation greater than 20 dB can be achieved.

[0112] Port-to-port isolation of the antenna may be increased using an antenna configuration including a first pair of circular antenna patches coupled to opposing corners of a rectangular antenna patch and a second pair of antenna patches coupled to opposing corners of the rectangular antenna patch, wherein each antenna patch in the first pair of antenna patches is positioned at a corner adjacent to two antenna patches in the second pair of antenna patches in step 2304. The first angular polarization may be substantially 45° polarization, and the second angular polarization may be substantially 135° polarization.

[0113] At step 2306, the UE 116 may receive signals from the plurality of antenna elements. The signals may be received from an external device separate from the transmitted signals or from an external device associated with the transmitted signals.

[0114] although Figure 23 An example of a method 2300 for dual-polarized base station and UE antennas for mid-band X-MIMO applications on 6G is shown, but may be used for Figure 23 For example, although shown as a series of steps, Figure 23 The steps in a process can overlap, occur in parallel, or occur any number of times.

[0115] Although the present disclosure has been described using exemplary embodiments, various changes and modifications may be devised by those skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims. Nothing in this application should be construed as implying that any particular element, step, or function is essential to the scope of the claims. The scope of the patented subject matter is defined by the claims.

Claims

1. A device comprising: substrate; as well as a plurality of antenna elements arranged on the substrate according to an antenna configuration comprising: Rectangular antenna patch; a first pair of circular antenna patches supporting a first angular polarization, wherein circular antenna patches in the first pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch; and a second pair of circular antenna patches supporting a second angular polarization orthogonal to the first angular polarization, wherein the circular antenna patches in the second pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch, and wherein each circular antenna patch in the first pair of circular antenna patches is located at a corner adjacent to two circular antenna patches in the second pair of circular antenna patches.

2. The device according to claim 1, in, The first angular polarization is a polarization of substantially 45 degrees, wherein the second angular polarization is a polarization of substantially 135 degrees, wherein the first pair of circular patches is associated with a range of 0.15 to 0.2 of the free space wavelength, inclusive, and The first pair of circular patches and the second pair of circular patches are coupled to the rectangular antenna patch within the range of 0.25 to 0.3 of the free space wavelength, inclusive, while having a gap within the range of 0.01 to 0.02 of the free space wavelength, inclusive.

3. The device according to claim 1, in, The substrate is a multilayer substrate having a thickness in the range of 0.01 to 0.2 of the free space wavelength, inclusive, and The substrate includes at least one of a transition layer, a ground layer, a 135-degree polarized 1×4 power divider layer, a 45-degree polarized 1×4 power divider layer, and an antenna layer.

4. The device according to claim 3, in, a rectangular frame associated with the second layer of the multilayer substrate within the range of 0.02 to 0.15 of the free space wavelength, inclusive, and Achieving greater than 20 dB port-to-port isolation is based on the patch antenna feeding mechanism and the rectangular frame.

5. An electronic device comprising: Multiple-input, multiple-output (MIMO) antennas, including: substrate; a plurality of antenna elements arranged on the substrate according to an antenna configuration comprising: Rectangular antenna patch, a first pair of circular antenna patches supporting a first angular polarization, wherein circular antenna patches in the first pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch, and a second pair of circular antenna patches supporting a second angular polarization orthogonal to the first angular polarization, wherein circular antenna patches in the second pair of circular antenna patches are coupled to opposite corners of the rectangular antenna patch; transmit TX processing circuitry coupled to the plurality of antenna elements and configured to provide signals to the plurality of antenna elements; and A receive RX processing circuit is coupled to the plurality of antenna elements and configured to receive signals from the plurality of antenna elements, wherein each circular antenna patch of the first pair of circular antenna patches is located at a corner adjacent to two circular antenna patches of the second pair of circular antenna patches.

6. The electronic device according to claim 5, in, The first angular polarization is a polarization of substantially 45 degrees, wherein the second angular polarization is a polarization of substantially 135 degrees, wherein the first pair of circular patches is associated with a range of 0.15 to 0.2 of the free space wavelength, inclusive, and The first pair of circular patches and the second pair of circular patches are coupled to the rectangular antenna patch within the range of 0.25 to 0.3 of the free space wavelength, inclusive, while having a gap within the range of 0.01 to 0.02 of the free space wavelength, inclusive.

7. The electronic device according to claim 5, wherein: The substrate is a multilayer substrate having a thickness in the range of 0.01 to 0.2 of the free space wavelength, inclusive, and The substrate includes at least one of a transition layer, a ground layer, a 135-degree polarized 1×4 power divider layer, a 45-degree polarized 1×4 power divider layer, and an antenna layer.

8. The electronic device according to claim 7, in, a rectangular frame associated with the second layer of the multilayer substrate within the range of 0.02 to 0.15 of the free space wavelength, inclusive, and The realization of port-to-port isolation greater than 20 dB is based on the patch antenna feeding mechanism and the rectangular frame.

9. A method of using a massive MIMO antenna, comprising: providing signals to a plurality of antenna elements on a substrate, the plurality of antenna elements comprising a rectangular antenna patch, a first pair of circular antenna patches supporting a first angular polarization, and a second pair of circular antenna patches supporting a second angular polarization orthogonal to the first angular polarization; increasing port-to-port isolation of antenna elements in the plurality of antenna elements using an antenna configuration comprising circular antenna patches of the first pair of circular antenna patches coupled to opposing corners of the rectangular antenna patch and circular antenna patches of the second pair of circular antenna patches coupled to opposing corners of the rectangular antenna patch, wherein each circular antenna patch of the first pair of circular antenna patches is positioned at a corner adjacent to two circular antenna patches of the second pair of circular antenna patches; as well as Signals are received from the plurality of antenna elements.

10. The method according to claim 9, in, The first angular polarization is a substantially 45 degree polarization, and The second angular polarization is a polarization of substantially 135 degrees.

11. The method according to claim 9, in, The first pair of circular patches is associated with a range of 0.15 to 0.2 of the free space wavelength, inclusive.

12. The method according to claim 9, in, The first and second pairs of circular patches are coupled to the rectangular antenna patch within a range of 0.25 to 0.3 of a free space wavelength, inclusive, while having a gap within a range of 0.01 to 0.02 of a free space wavelength, inclusive.

13. The method according to claim 9, in, The substrate is a multi-layer substrate having a thickness within the range of 0.01 to 0.2 of the free space wavelength, inclusive.

14. The method of claim 13, in, The substrate includes at least one of a transition layer, a ground layer, a 1×4 power divider layer with 135-degree polarization, a 1×4 power divider layer with 45-degree polarization, and an antenna layer.

15. The method of claim 13, in, a rectangular frame associated with the second layer of the multilayer substrate within the range of 0.02 to 0.15 of the free space wavelength, inclusive, and Achieving greater than 20 dB port-to-port isolation is based on the patch antenna feeding mechanism and the rectangular frame.

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