A chip on feeding channel control device for unloading

Abstract

The application relates to the technical field of chip feeding channel control, in particular to a feeding channel control device for chip feeding and discharging, which comprises a side clamping mechanism, a positioning side shifting mechanism and an elastic buffer seat, and the side clamping mechanism is located between a conveying track and a side guide plate. The feeding channel control device for chip feeding and discharging is pushed upward by a jacking mechanism, so that the side clamping mechanism clamps the chip; after clamping is completed, the jacking mechanism is continuously pushed, the chip clamped in the middle position can be pulled back into the conveying track, meanwhile, the chip can be horizontally limited and blocked, so that the chip is prevented from being pushed out of the conveying track again. The side clamping mechanism is moved upward and to the right by being pushed upward by the jacking mechanism, the waiting time of the controller is not needed, the whole process is completed at one time, the friction time of the chip is shortened, and the chip is better protected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip feeding channel control, in particular to a feeding channel control device for chip feeding and discharging. BACKGROUND

[0002] In the field of lighting, the application of LED light-emitting products is attracting the attention of the world. As a new type of green light source product, LED is bound to be the development trend of lighting technology. The 21st century will be an era of new lighting light sources represented by LED. LED is called the fourth generation of lighting light source or green light source, which has the characteristics of energy saving, environmental protection, long service life, small size, etc. and can be widely used in various fields such as indication, display, decoration, backlight, general lighting and urban night scene.

[0003] The existing lamp bead panel needs to be bonded and fixed by using glue after installing the chip, and the LED lamp bead is also the chip of the LED lamp. Hereinafter, the chip is explained as the LED lamp bead. When the chip is fed, a vibrating disc is generally used in combination with a conveying track and a vibrating disc direct vibrator for driving the conveying track to vibrate up and down. However, the chip conveying device needs to detect the orientation of the chip terminal during conveying, and the entire detection time needs to take several seconds. During the several seconds, a chip is stuck at the joint of the conveying track and the bottom plate, and the high-frequency up-and-down vibration of the track plus the linear thrust applied by the vibrating disc all the time will cause the stuck chip to rub against the chips on both sides for several seconds. The rubbing process has a probability of damaging the chip, which leads to failure when the chip is subsequently installed on the lamp.

[0004] Therefore, it is necessary to design a feeding channel control device for chip feeding and discharging, which can pull the chip stuck in the middle position back into the conveying track during detection, and can also horizontally limit and block the chip to avoid pushing it out of the conveying track again. SUMMARY

[0005] In view of the above technical deficiencies, the purpose of the present application is to provide a feeding channel control device for chip feeding and discharging, which can pull the chip stuck in the middle position back into the conveying track during detection, and can also horizontally limit and block the chip to avoid pushing it out of the conveying track again.

[0006] In order to achieve the above object, the present application adopts the following technical scheme: the present application provides a feeding channel control device for chip feeding and discharging, which comprises a side clamping mechanism, a positioning side displacement mechanism and an elastic buffer seat, the side clamping mechanism is located between a conveying track and a side guide plate, the side clamping mechanism is used for clamping the side of the chip when being lifted upward, the side clamping mechanism is fixedly installed on a displacement seat of the elastic buffer seat, the elastic buffer seat is used for giving an activity allowance of downward vibration when the top of the side clamping mechanism is in contact with the top of a material guiding hole, the elastic buffer seat is fixedly installed on a horizontal moving seat of the positioning side displacement mechanism, the positioning side displacement mechanism is used for horizontally pushing the chip to the right when the top of the side clamping mechanism is in contact with the top of the material guiding hole, a lifting mechanism is fixedly installed on a support plate through a mounting frame, the positioning side displacement mechanism is fixedly installed on a lifting end of the lifting mechanism, and the lifting mechanism is used for vertically pushing the positioning side displacement mechanism upward.

[0007] Preferably, the positioning side displacement mechanism comprises a right triangular block, an inverted triangular block, a limiting guide plate one and a guide block one, the limiting guide plate one is fixedly installed on the mounting frame connected with the lifting mechanism, a shaped guide groove one is formed in the limiting guide plate one, the right triangular block is fixedly installed on the lifting end of the lifting mechanism, the inverted triangular block is fixedly connected with the side of the elastic buffer seat, the inclined surface of the inverted triangular block is in contact with the inclined surface of the right triangular block, and the guide block one is fixedly installed on the side of the inverted triangular block; when the top of the chip is completely in contact with the top of the material guiding hole of the conveying track and the side clamping mechanism is in contact with the conveying track, the top of the guide block one is in contact with the groove top of the shaped guide groove one; after the chip is pushed by the side clamping mechanism and slides into the conveying track, the right side of the guide block one is in contact with the right side of the shaped guide groove one.

[0008] Preferably, the side clamping mechanism comprises a clamping plate and two elastic clamping arms, the clamping plate is fixedly installed on the elastic buffer seat, a recess for clamping into the two sides of the chip is formed in the middle of the clamping plate, each elastic clamping arm comprises a clamping plate, a guide column, a side pushing spring and a limiting circular plate, the clamping plate is inserted into the clamping plate in a horizontally sliding manner, a square insertion hole for inserting the clamping plate is formed in the clamping plate, the guide column is installed on the elastic buffer seat in a horizontally sliding manner through a guide plate, one end of the guide column is fixedly connected with the clamping plate, the other end of the guide column is fixedly connected with the limiting circular plate, the side pushing spring is used for providing an elastic force for the clamping plate to approach the middle of the clamping plate, and the inner side of the top of the two clamping plates is provided with an inclined surface.

[0009] Preferably, when the lifting mechanism is not lifted upward, the two sides of the chip are in contact with the inclined surfaces of the two clamping plates.

[0010] Preferably, the side clamping mechanism further comprises guide block two and limiting guide plate two, the guide block two is fixedly installed on the conveying track, the limiting guide plate two is fixedly installed on the elastic buffer seat, the limiting guide plate two is provided with a shaped guide groove two, the guide block two is clamped in the shaped guide groove two, when the jacking mechanism is not pushed upward, the top of the guide block two is in contact with the top of the shaped guide groove two, when the top of the chip is completely in contact with the top of the material guiding hole of the conveying track, and the side clamping mechanism is in contact with the conveying track, the bottom of the guide block two is in contact with the bottom of the shaped guide groove two.

[0011] Preferably, the top plate is arranged between the two limiting guide plates two, the top plate is fixedly installed on the elastic buffer seat, the bottom of the conveying track is provided with a avoiding gap for the top plate to pass through, when the top of the chip is completely in contact with the top of the material guiding hole of the conveying track, and the side clamping mechanism is in contact with the conveying track, the top plate pushes the chip on the top to contact with the top of the material guiding hole of the conveying track.

[0012] Preferably, the elastic buffer seat comprises a guide seat, a square guide column, a jacking spring, a mounting plate and a limiting plate, the clamping plate and the limiting guide plate two are fixedly installed on the mounting plate, the top of the square guide column is fixedly connected with the mounting plate, the limiting plate is fixedly installed on the bottom of the square guide column, the square guide column is slidably connected with the guide seat, the guide seat is provided with a square guide hole for the vertical sliding of the square guide column, and the jacking spring is used to apply a vertical upward elastic force to the mounting plate.

[0013] Preferably, the jacking mechanism adopts an electric push rod, and the top of the jacking mechanism is fixedly connected with the equilateral triangle block through the mounting seat.

[0014] The chip feeding and discharging upper feeding channel control device has the advantages that the jacking mechanism is pushed upward to enable the side clamping mechanism to clamp the chip, after the clamping is completed, the jacking mechanism is continuously pushed to pull the chip clamped at the middle position back to the conveying track, the chip can be horizontally limited and blocked, and the chip is prevented from being pushed out of the conveying track again. The jacking mechanism is pushed upward to enable the side clamping mechanism to move upward and to the right, the waiting time of the controller is not required, the whole process is completed at one time, the friction time of the chip is shortened, and the chip is better protected.

[0015] The jacking mechanism is pushed upward to enable the side clamping mechanism to move upward and to the right, the waiting time of the controller is not required, the whole process is completed at one time, the friction time of the chip is shortened, and the chip is better protected.

[0016] The bottom of the L-shaped guide groove two is the contact position of the side clamping mechanism and the conveying track, after the position is contacted, the positioning side shifting mechanism can push the side shifting. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0018] Figure 1 A schematic view of a three-dimensional structure of a chip automatic feeding device.

[0019] Figure 2 A schematic view of a three-dimensional structure of a chip automatic feeding device.

[0020] Figure 3 A schematic view of a three-dimensional structure of a side guide plate and a bottom plate.

[0021] Figure 4 A schematic view of a structure position of a chip.

[0022] Figure 5 A top view of a chip located on a ring-shaped pressing plate and a conveying track.

[0023] Figure 6 A top view of a chip located on a side guide plate and a conveying track.

[0024] Figure 7 A schematic view of a three-dimensional structure of the present application.

[0025] Figure 8 A top view of the present application.

[0026] Figure 9 A schematic view of a three-dimensional structure of a side clamping mechanism.

[0027] Figure 10 A schematic view of a three-dimensional structure of a side clamping mechanism.

[0028] Figure 11 A schematic view of an end of a conveying track.

[0029] Explanation of reference signs: 1, support plate; 2, rotating disc; 3, jacking mechanism; 5, side clamping mechanism; 5a, clamping plate; 5b, clamping plate; 5c, guide column; 5d, side pushing spring; 5e, limiting round plate; 5f, guide block two; 5g, limiting guide plate two; 5g, L-shaped guide groove two; 5h, top plate; 6, positioning side displacement mechanism; 6a, equilateral triangular block; 6b, inverted triangular block; 6c, limiting guide plate one; 6c1, L-shaped guide groove one; 6d, guide block one; 7, elastic buffer seat; 7a, guide seat; 7b, square guide column; 7c, jacking spring; 7d, mounting plate; 7e, limiting plate; 10, conveying track; 10a, material guiding hole; 10b, avoiding gap; 11, vibrating disc direct vibrator; 12, vibrating disc; 13, annular pressing plate; 13a, material passing gap; 14, side guide plate; 15, chip; 16, bottom plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0031] The embodiment of the application discloses a chip automatic feeding device which comprises a gas-driven chip recycling device and a bulk feeding mechanism for feeding chips to the gas-driven chip recycling device. Workers pour a large number of chips 15 into the bulk feeding mechanism, and the chips are fed into the gas-driven chip recycling device through the bulk feeding mechanism. The bulk feeding mechanism comprises a conveying track 10, a vibrating disc direct vibrator 11 and a vibrating disc 12. The chips 15 are put into the vibrating disc 12, and then are conveyed along the vibrating disc 12 and enter the conveying track 10 through a discharge opening of the vibrating disc 12. The conveying track 10 is provided with a guide hole 10a for horizontal sliding of the chips. The vibrating disc direct vibrator 11 drives the conveying track 10 to vibrate up and down, so that the conveying track 10 is pushed by the chips 15 conveyed by the vibrating disc 12. When the chips 15 are clamped into the guide hole 10a, a gap is left between the top of the chip 15 and the top of the guide hole 10a, so that the chip 15 can vibrate up and down. The gas-driven chip recycling device comprises a rotating disc 2 capable of rotating horizontally and a support plate 1 for supporting the rotating disc 2. The rotating disc 2 is provided with a rotating driver for driving the rotating disc 2 to rotate. A plurality of clamping notches for clamping the conveying track 10 are formed in the outer edge of the rotating disc 2. A guide track is arranged opposite to one clamping notch. The guide track is fixedly installed on the support plate 1 and comprises two side guide plates 14 and a bottom plate 16 fixedly installed at the bottom of the two side guide plates 14. An annular pressing plate 13 is arranged at the top of the rotating disc 2 and is arranged on the top of the chip 15. The annular pressing plate 13 is fixedly connected with the support plate 1, so that the chip 15 is surrounded by the annular pressing plate 13 and the support plate 1, thereby ensuring that the chip 15 can be better clamped into the clamping notch. A lens is fixedly arranged on the top of each of the plurality of chips 15. A laser sensor is arranged on the top of the lens opposite to the conveying track 10, and is used for detecting whether the chip 15 is clamped into the clamping notch. A material passing notch 13a is arranged at the bottom of the annular pressing plate 13 and close to one side of the conveying track 10. The material passing notch 13a is used for better inserting the end of the chip 15 into the upper side of the bottom plate 16 when the chip 15 vibrates up and down. The top end of the bottom plate 16 is flush with the lowest movement amplitude of the guide hole 10a in the conveying track 10 during vibration. The application provides a chip feeding channel control device for chip feeding and discharging, as shown in Figures 1-8As shown, including side clamping mechanism 5, positioning side displacement mechanism 6 and elastic buffer seat 7, side clamping mechanism 5 is located between conveying track 10 and side guide plate 14, side clamping mechanism 5 is used for clamping the side of chip 15 when being lifted up, side clamping mechanism 5 is fixedly installed on the displacement seat of elastic buffer seat 7, elastic buffer seat 7 is used for giving the activity allowance of downward vibration when the top of side clamping mechanism 5 is in contact with the top of material guiding hole 10a, elastic buffer seat 7 is fixedly installed on the horizontal moving seat of positioning side displacement mechanism 6, positioning side displacement mechanism 6 is used for horizontally pushing chip 15 to the right when the top of side clamping mechanism 5 is in contact with the top of material guiding hole 10a, lifting mechanism 3 is fixedly installed on support plate 1 through mounting frame, positioning side displacement mechanism 6 is fixedly installed on the lifting end of lifting mechanism 3, lifting mechanism 3 is used for vertically pushing positioning side displacement mechanism 6 upwards. When the equipment detects chip 15, the working end of lifting mechanism 3 pushes upwards, so that side clamping mechanism 5 pushes upwards and clamps into both sides of chip 15. When the top of chip 15 is in full contact with the top of material guiding hole 10a of conveying track 10, and side clamping mechanism 5 is in contact with conveying track 10, side clamping mechanism 5 will move to the topmost position. Because lifting mechanism 3 continues to push upwards, the horizontal moving seat of positioning side displacement mechanism 6 will be horizontally moved by the power of lifting mechanism 3, so that side clamping mechanism 5 is horizontally moved towards conveying track 10, that is, chip 15 clamped between two side guide plates 14 is pulled into conveying track 10. That is, when detecting chip, chip 15 clamped in the middle position can be pulled back into conveying track, and through the clamping action of side clamping mechanism 5 on chip 15, chip 15 can be horizontally limited and blocked, avoiding pushing chip 15 out of conveying track 10 again.

[0032] When lifting mechanism 3 moves to the final position, elastic buffer seat 7 is in a compressed state, when conveying track 10 is shaken upwards, chip 15 can be pushed upwards to be in contact with the top of material guiding hole 10a by the elasticity of elastic buffer seat 7, and when conveying track 10 is shaken downwards, chip 15 can be pushed downwards.

[0033] In order to shorten the time of pushing chip 15 to the right after moving upwards, and to shorten the friction time of chip 15 between conveying track 10 and side guide plate 14 and the two sides of chip 15, for this purpose, as shown in FIG. 6, the horizontal moving seat of positioning side displacement mechanism 6 is provided with a horizontal moving mechanism 8, horizontal moving mechanism 8 is used for horizontally pushing the horizontal moving seat of positioning side displacement mechanism 6 to the right when the top of side clamping mechanism 5 is in contact with the top of material guiding hole 10a, and horizontal moving mechanism 8 is fixedly installed on the horizontal moving seat of positioning side displacement mechanism 6. Figure 7As shown, the positioning side shift mechanism 6 includes an equilateral triangular block 6a, an inverted triangular block 6b, a limiting guide plate one 6c, and a guide block one 6d. The limiting guide plate one 6c is fixedly installed on a mounting frame connected with the jacking mechanism 3, and an L-shaped guide groove one 6c1 is formed on the limiting guide plate one 6c. The equilateral triangular block 6a is fixedly installed on a jacking end of the jacking mechanism 3. The inverted triangular block 6b is fixedly connected with a side surface of the elastic buffer seat 7, and a slope surface of the inverted triangular block 6b is in contact with a slope surface of the equilateral triangular block 6a. The guide block one 6d is fixedly installed on a side surface of the inverted triangular block 6b. When the jacking mechanism 3 is pushed upward, the equilateral triangular block 6a pushes the inverted triangular block 6b to move vertically, and the vertical movement of the inverted triangular block 6b is guided by the guide block one 6d and the L-shaped guide groove one 6c1. When the top of the chip 15 is completely in contact with the top of the material guide hole 10a of the conveying track 10, and the side surface clamping mechanism 5 is in contact with the conveying track 10, the top of the guide block one 6d is in contact with the top of the L-shaped guide groove one 6c1. With the continuous pushing of the jacking mechanism 3, the slope surface of the equilateral triangular block 6a pushes the slope surface of the inverted triangular block 6b to slide to the right. After the side surface clamping mechanism 5 pushes the chip 15 to slide into the conveying track 10, the right side of the guide block one 6d is in contact with the right side of the L-shaped guide groove one 6c1. That is, the side surface clamping mechanism 5 can be moved upward and to the right by pushing upward by the jacking mechanism 3, without leaving a waiting time for the reaction of the controller. The whole process is completed at one time, the friction time of the chip 15 is shortened, and the chip 15 is better protected.

[0034] In order to automatically clamp the chip 15 by the side surface clamping mechanism 5 during the upward pushing of the jacking mechanism 3, the equilateral triangular block 6a is provided with a limiting guide plate two 6e, and the limiting guide plate two 6e is fixedly installed on the jacking end of the jacking mechanism 3. Figure 8 and Figure 9As shown, the side clamping mechanism 5 includes a clamping plate 5b and two elastic clamping arms, the clamping plate 5b is fixedly installed on the elastic buffer seat 7, the middle part of the clamping plate 5b is provided with a groove for clamping into both sides of the chip 15, each elastic clamping arm includes a clamping plate 5a, a guide column 5c, a side push spring 5d and a limiting round plate 5e, the clamping plate 5a is horizontally slidably inserted into the clamping plate 5b, the clamping plate 5b is provided with a square insertion hole for the clamping plate 5a, the guide column 5c is horizontally slidably installed on the elastic buffer seat 7 through a guide plate, one end of the guide column 5c is fixedly connected with the clamping plate 5a, the other end of the guide column 5c is fixedly connected with the limiting round plate 5e, the side push spring 5d is used for providing an elastic force to the clamping plate 5a to approach the middle part of the clamping plate 5b, the side push spring 5d is sleeved on the guide column 5c, the guide plate at one end of the side push spring 5d abuts against, the other end of the side push spring 5d abuts against the clamping plate 5a, and the top inner side of each clamping plate 5a is provided with an inclined surface. When the elastic buffer seat 7 is pushed upward, the clamping plate 5a and the clamping plate 5b will be driven to move upward together, the bottom of the chip 15 will be in contact with the inclined surface of the clamping plate 5a, and the chip 15 will be driven to move upward and completely contact the top of the guide hole 10a, when the chip 15 cannot move, the chip 15 will then drive the two clamping plates 5a to move to both sides, and the two clamping plates 5a are clamped on both sides of the chip 15. When the positioning side shifting mechanism 6 moves horizontally, the clamping plate 5a will be pulled to move horizontally, so that the chip 15 is pushed into the conveying track 10.

[0035] Since there is a gap between the conveying track 10 and the side guide plate 14, in order to provide better support at the gap, as shown, Figure 8 When the jacking mechanism 3 is not jacked upward, the two sides of the chip 15 are in contact with the inclined surfaces of the two clamping plates 5a. When the conveying track 10 is shaken upward, the conveying track 10 will pull the clamping plate 5a to move upward together, which can keep the support of the chip 15 through the clamping plate 5a. When the conveying track 10 is shaken downward, the side clamping mechanism 5 still keeps the support of the chip 15, avoiding the chip 15 from descending together, in this way, the bottom of the chip 15 is always above the bottom plate 16, so that the chip 15 can be more easily inserted between the two side guide plates 14. When the side clamping mechanism 5 is driven upward, the elastic buffer seat 7 will pull the inverted triangular block 6b to slide vertically upward.

[0036] In order to enable the conveying track 10 to move upward and drive the side clamping mechanism 5 to move upward together, for this purpose, as shown, Figure 10As shown, the side clamping mechanism 5 further comprises a guide block two 5f and a limiting guide plate two 5g. The guide block two 5f is fixedly installed on the conveying track 10, and the limiting guide plate two 5g is fixedly installed on the elastic buffer seat 7. An L-shaped guide groove two 5g1 is formed in the limiting guide plate two 5g. When the jacking mechanism 3 is not pushed upward, the top of the guide block two 5f is in contact with the top of the L-shaped guide groove two 5g1. When the top of the chip 15 is completely in contact with the top of the material guiding hole 10a of the conveying track 10, and the side clamping mechanism 5 is in contact with the conveying track 10, the bottom of the guide block two 5f is in contact with the bottom of the L-shaped guide groove two 5g1. The bottom of the L-shaped guide groove two 5g1 is the contact position of the side clamping mechanism 5 and the conveying track 10. After the position is contacted, the positioning side shifting mechanism 6 can push the side shifting. When the conveying track 10 moves upward, the guide block two 5f moves vertically upward, and the movement of the guide block two 5f drives the limiting guide plate two 5g to move upward. When the conveying track 10 moves upward, the limiting guide plate two 5g will not move downward, that is, the clamping plate 5a will not move downward.

[0037] In order to horizontally push the chip 15 in the conveying track 10 and clamp and fix it, and to reduce the pushing force of the chip 15 clamped by the side clamping mechanism 5, for this purpose, as shown in Figure 9 Two limiting guide plates two 5g are provided between the top plate 5h, which is fixedly installed on the elastic buffer seat 7. The bottom of the conveying track 10 is provided with a avoiding gap 10b for the top plate 5h to pass through. As shown in Figure 11 When the top of the chip 15 is completely in contact with the top of the material guiding hole 10a of the conveying track 10, and the side clamping mechanism 5 is in contact with the conveying track 10, the top plate 5h pushes the chip 15 at the top to contact the top of the material guiding hole 10a of the conveying track 10, so as to further activate the fixing effect of the chip 15. When the elastic buffer seat 7 slides horizontally, the top plate 5h will move horizontally together, and the top plate 5h will drive the conveying track 10 to move together. The top of the top plate 5h can also be provided with a rubber non-slip pad, so that the top plate 5h can move more smoothly when driving the conveying track 10 to move. Through the action of the top plate 5h, the chip 15 can be completely in contact with the top of the material guiding hole 10a.

[0038] As shown in Figure 8As shown, the elastic buffer seat 7 includes a guide seat 7a, a square guide column 7b, a jacking spring 7c, a mounting plate 7d and a limiting plate 7e, the clamping plate 5b and the limiting guide plate two 5g are fixedly installed on the mounting plate 7d, the top of the square guide column 7b is fixedly connected with the mounting plate 7d, the limiting plate 7e is fixedly installed on the bottom of the square guide column 7b, the square guide column 7b is slidably connected with the guide seat 7a, a square guide hole for vertical sliding of the square guide column 7b is formed in the guide seat 7a, and the jacking spring 7c is used to apply an elastic force vertically upward to the mounting plate 7d. By the downward thrust of the clamping plate 5b and the limiting guide plate two 5g on the mounting plate 7d, the mounting plate 7d pushes the jacking spring 7c to be compressed, so as to relieve the rigid collision suffered by the mounting plate 7d.

[0039] The jacking mechanism 3 adopts an electric push rod, and the top of the jacking mechanism 3 is fixedly connected with the equilateral triangular block 6a through a mounting seat. In this way, the short-distance moving mode is pushed by the electric push rod, and the whole pushing process is more stable and reduces the shaking of the chip 15 when the clamping plate 5a lifts up the chip 15.

[0040] In use, the vibration disc direct vibrator 11 vibrates the conveying track 10, so that the chip 15 in the conveying track 10 is horizontally conveyed. When the device detects the chip 15, the working end of the jacking mechanism 3 pushes upward, which drives the clamping plate 5a and the clamping plate 5b to move upward together, the bottom of the chip 15 contacts the inclined surface of the clamping plate 5a, and the chip 15 is driven upward to completely contact the top of the guide hole 10a. When the chip 15 cannot move, the chip 15 pushes the two clamping plates 5a to move to both sides, and the two clamping plates 5a are clamped on both sides of the chip 15. When the top of the chip 15 completely contacts the top of the guide hole 10a of the conveying track 10, and the side clamping mechanism 5 contacts the conveying track 10, the side clamping mechanism 5 moves to the topmost position. Since the jacking mechanism 3 continues to push upward, the horizontal moving seat of the positioning side shifting mechanism 6 is driven to move horizontally by the power of the jacking mechanism 3, so that the side clamping mechanism 5 drives the chip 15 to move horizontally towards the conveying track 10, that is, the chip 15 clamped between the two side guide plates 14 is pulled into the conveying track 10.

[0041] During the upward pushing process, the top plate 5h pushes the chip 15 at the top thereof to contact the top of the guide hole 10a of the conveying track 10, and the top plate 5h drives the conveying track 10 clamped thereby to move horizontally when the elastic buffer seat 7 moves horizontally.

[0042] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technologies thereof, the present application also intends to include these modifications and variations.

Claims

1. A chip on feedway control device for feeding, characterized by, The device comprises a side clamping mechanism (5), a positioning side displacement mechanism (6) and an elastic buffer seat (7), the side clamping mechanism (5) is located between a conveying track (10) and a side guide plate (14), the side clamping mechanism (5) is used for clamping the side of a chip (15) when being lifted upward, the side clamping mechanism (5) is fixedly installed on a displacement seat of the elastic buffer seat (7), the elastic buffer seat (7) is used for giving an activity allowance of downward vibration when the top of the side clamping mechanism (5) is in contact with the top of the material guiding hole (10a), the elastic buffer seat (7) is fixedly installed on a horizontal moving seat of the positioning side displacement mechanism (6), the positioning side displacement mechanism (6) is used for horizontally pushing the chip (15) to the right when the top of the side clamping mechanism (5) is in contact with the top of the material guiding hole (10a), the lifting mechanism (3) is fixedly installed on the support plate (1) through a mounting frame, the positioning side displacement mechanism (6) is fixedly installed on the lifting end of the lifting mechanism (3), and the lifting mechanism (3) is used for vertically pushing the positioning side displacement mechanism (6) upward.

2. The on-chip material loading and unloading material loading passage control device according to claim 1, characterized by, The positioning side displacement mechanism (6) comprises a right triangular block (6a), an inverted triangular block (6b), a limiting guide plate one (6c) and a guide block one (6d), the limiting guide plate one (6c) is fixedly installed on the mounting frame connected with the lifting mechanism (3), an L-shaped guide groove one (6c1) is formed in the limiting guide plate one (6c), the right triangular block (6a) is fixedly installed on the lifting end of the lifting mechanism (3), the inverted triangular block (6b) is fixedly connected with the side of the elastic buffer seat (7), the inclined surface of the inverted triangular block (6b) is in contact with the inclined surface of the right triangular block (6a), and the guide block one (6d) is fixedly installed on the side of the inverted triangular block (6b). When the top of the chip (15) is completely in contact with the top of the material guiding hole (10a) of the conveying track (10) and the side clamping mechanism (5) is in contact with the conveying track (10), the top of the guide block one (6d) is in contact with the groove top of the L-shaped guide groove one (6c1), and when the chip (15) is pushed into the conveying track (10) by the side clamping mechanism (5), the right side of the guide block one (6d) is in contact with the right side of the L-shaped guide groove one (6c1).

3. The on-chip material loading and unloading material loading passage control device according to claim 2, characterized by, The side clamping mechanism (5) comprises a clamping plate (5b) and two elastic clamping arms, the clamping plate (5b) is fixedly installed on the elastic buffer seat (7), a recess for clamping into the two sides of the chip (15) is formed in the middle of the clamping plate (5b), each elastic clamping arm comprises a clamping plate (5a), a guide column (5c), a side pushing spring (5d) and a limiting circular plate (5e), the clamping plate (5a) is inserted into the clamping plate (5b) and can slide horizontally, a square insertion hole is formed in the clamping plate (5b) for inserting the clamping plate (5a), the guide column (5c) is installed on the elastic buffer seat (7) and can slide horizontally through a guide plate, one end of the guide column (5c) is fixedly connected with the clamping plate (5a), the other end of the guide column (5c) is fixedly connected with the limiting circular plate (5e), the side pushing spring (5d) is used for providing an elastic force to the clamping plate (5a) to approach the middle of the clamping plate (5b), and the top inner side of the two clamping plates (5a) is provided with an inclined surface.

4. The on-chip material loading and unloading material loading passage control device according to claim 3, characterized by, When the jacking mechanism (3) is not jacked upward, the two sides of the chip (15) are in contact with the inclined surfaces of the two side clamping mechanisms (5a).

5. The on-chip material loading and unloading material loading passage control device according to claim 4, characterized by, The side clamping mechanism (5) further comprises a guide block two (5f) and a limiting guide plate two (5g), the guide block two (5f) is fixedly installed on the conveying track (10), the limiting guide plate two (5g) is fixedly installed on the elastic buffer seat (7), an L-shaped guide groove two (5g1) is formed in the limiting guide plate two (5g), the guide block two (5f) is clamped in the L-shaped guide groove two (5g1), when the jacking mechanism (3) is not pushed upward, the top of the guide block two (5f) is in contact with the top of the L-shaped guide groove two (5g1), when the top of the chip (15) is completely in contact with the top of the material guiding hole (10a) of the conveying track (10) and the side clamping mechanism (5) is in contact with the conveying track (10), the bottom of the guide block two (5f) is in contact with the bottom of the L-shaped guide groove two (5g1).

6. The on-chip material loading and unloading material loading passage control device according to claim 5, characterized by, Two limiting guide plates two (5g) are provided between the two limiting guide plates two (5g), the top plate (5h) is fixedly installed on the elastic buffer seat (7), the bottom of the conveying track (10) is provided with an avoiding gap (10b) for the top plate (5h), when the top of the chip (15) is completely in contact with the top of the material guiding hole (10a) of the conveying track (10) and the side clamping mechanism (5) is in contact with the conveying track (10), the top plate (5h) pushes the chip (15) at the top thereof to be in contact with the top of the material guiding hole (10a) of the conveying track (10).

7. The on-chip material loading and unloading material loading passage control device according to claim 6, characterized by, The elastic buffer seat (7) comprises a guide seat (7a), a square guide column (7b), a jacking spring (7c), a mounting plate (7d) and a limiting plate (7e), the clamping plate (5b) and the limiting guide plate two (5g) are fixedly installed on the mounting plate (7d), the top of the square guide column (7b) is fixedly connected with the mounting plate (7d), the limiting plate (7e) is fixedly installed on the bottom of the square guide column (7b), the square guide column (7b) is slidably connected with the guide seat (7a), a square guide hole is formed in the guide seat (7a) for vertical sliding of the square guide column (7b), and the jacking spring (7c) is used for applying an elastic force vertically upward to the mounting plate (7d).

8. The on-chip material loading and unloading material loading passage control device according to claim 1, characterized by, The jacking mechanism (3) adopts an electric push rod, and the top of the jacking mechanism (3) is fixedly connected with the equilateral triangular block (6a) through a mounting seat.

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