Chip damage prevention packaging equipment

Abstract

The present invention relates to the field of chip packaging, and specifically to a chip damage prevention packaging device. It is applied to chips connected to a substrate through a number of bonding wires, including a conveying mechanism and a glue injection mechanism, the glue injection mechanism including a cofferdam assembly, the glue injection mechanism also including a filling assembly, the filling assembly including a movable frame and a glue injection bin and a drainage plate arranged around the glue injection bin, the glue injection bin is provided with a glue outlet corresponding to the position of each drainage plate, each drainage plate can swing downward, and when the drainage plate is swung down, the glue outlet is in an open state, and a drainage path is formed at the same time. The present invention forms a drainage path through the drainage plate and the bump, so that the glue flows evenly and dispersedly, avoiding direct impact on the bonding wire, and combined with the limit of the bonding wire by the card slot, the stability of the bonding wire during the glue injection process is improved, and the bonding wires are avoided from being entangled with each other, thereby improving the quality of chip packaging.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a chip damage-proof packaging device. Background Art

[0002] Chip packaging technology is a critical step in the semiconductor manufacturing process, directly impacting the chip's mechanical strength, electrical performance, and reliability. In existing chip packaging processes, the chip and its internal lead structures are often protected through methods such as glue injection and potting. However, during the glue injection process, due to the uncontrolled glue flow path, localized accumulation, impact, or erosion are prone to occur. This is particularly true for the bonding wire structure within the chip, which can easily cause breakage, deflection, or entanglement, leading to increased product defect rates.

[0003] Bonding wires, a crucial structure connecting chip pads to the lead frame, have a tiny diameter and a tightly packed layout, making their stability crucial during the glue injection process. If glue directly impacts the bonding wires, it can disrupt their spatial layout and cause stress concentration on the solder joints, impacting electrical performance and reliability. Traditional packaging equipment lacks effective guidance for the glue flow path and precise limiters or buffer structures for the bonding wires. Consequently, low chip yields and frequent structural damage persist in actual production.

[0004] Therefore, there is an urgent need for an improved chip packaging equipment that can effectively guide the flow of glue through reasonably designed structural elements, so that it can diffuse evenly in the packaging cavity and reduce direct impact on sensitive structures; at the same time, combined with a limiting mechanism to constrain and protect the position of the bonding wire, improve the overall stability of the glue injection process, thereby effectively preventing the bonding wire from being entangled or damaged, and improving the chip packaging quality and process reliability. Summary of the Invention

[0005] In response to the problems existing in the existing technology, a chip damage-proof packaging device is provided. The drainage path formed by the drainage plate and the bump allows the glue to flow evenly and dispersedly, avoiding direct impact on the bonding wire. Combined with the limiting effect of the card slot on the bonding wire, the stability of the bonding wire during the glue injection process is improved, the bonding wires are prevented from being entangled with each other, and the quality of chip packaging is improved.

[0006] In order to solve the problems of the prior art, the present invention provides a chip damage prevention packaging device, which is applied to a chip connected to a substrate through a plurality of bonding wires, and includes a conveying mechanism and a glue injection mechanism. The glue injection mechanism includes a cofferdam component for injecting glue around the chip on the substrate to form a cofferdam structure, and the glue injection mechanism also includes a filling component for filling glue into the cofferdam structure. The filling component includes a movable frame and a glue injection bin arranged thereon and a drainage plate arranged around the glue injection bin. The glue injection bin is provided with a glue outlet at a position corresponding to each drainage plate, and each drain plate is provided with a glue outlet. Each guide plate can swing downward. When the guide plate is swung downward, the glue outlet is in an open state, and at the same time, a drainage path is formed for the glue to flow between adjacent bonding wires without directly exerting pressure on the bonding wires. The glue injection chamber can slide relatively on the movable frame. A pressure-applying part is provided at the position corresponding to each guide plate on the movable frame, and a pressure-receiving part cooperating with the corresponding pressure-applying part is provided on each guide plate. When the movable frame drives the glue injection chamber to contact the chip and continuously presses down, the pressure-applying part gradually exerts pressure on the pressure-receiving part, so that the guide plate gradually swings downward and opens the glue outlet.

[0007] Preferably, the lower half of the guide plate has a protrusion at the position corresponding to each bonding wire, and a drainage path is formed between every two adjacent protrusions. When the glue slides down along the upper half of the guide plate and passes through the drainage path, the glue is in a dispersed state due to the separation of the protrusions, so that the area between every two adjacent bonding wires is pre-filled.

[0008] Preferably, the end of each protrusion that receives the glue is a pointed structure for spreading the glue evenly.

[0009] Preferably, each protrusion has an end facing the bonding wire with a slot in which the corresponding bonding wire can be clamped. When the bonding wire is clamped in the slot, the bonding wire is in a horizontally limited state, so that no contact occurs between any two adjacent bonding wires.

[0010] Preferably, the edges of the slot openings of each protrusion are chamfered structures for guiding the bonding wire into the slot.

[0011] Preferably, an axle seat for rotatably connecting the guide plate is provided at the position corresponding to each guide plate on the glue injection bin, and the axle seat has a drainage channel connected to the glue outlet and capable of guiding the glue toward the upper half of the guide plate. Before the guide plate swings down, the drainage channel is in a closed state, and after the guide plate swings down, the drainage channel is in an open state.

[0012] Preferably, each shaft seat is provided with a limiting shaft for limiting the downward swing amplitude of the corresponding guide plate. When the back side of the guide plate contacts the limiting shaft, the guide plate is in a non-pressure state on the bonding wire.

[0013] Preferably, a torsion structure is provided between each guide plate and the axial connection point of the corresponding shaft seat, which can produce elastic deformation when the guide plate is subjected to a downward swing driving force. When the pressure-applying part applies pressure to the pressure-receiving part, the downward swing of the guide plate drives the torsion structure to be in a deformed state, and when the pressure-applying part releases the pressure on the pressure-receiving part, the torsion structure drives the guide plate to be in a gradually reset state.

[0014] Preferably, a glue injection tube extending vertically upward through a movable frame is provided on the top of the glue injection bin, a guide port for the glue injection tube to pass through is opened on the movable frame, a resistance portion capable of contacting the chip is provided at the bottom of the glue injection bin, and a first buffer spring capable of buffering the pressure on the chip is provided between the glue injection bin and the movable frame.

[0015] Preferably, the movable frame is provided with a protective cover for placing the cofferdam structure cover therein to prevent dust from entering, and a second buffer spring capable of buffering the pressure on the substrate is provided between the protective cover and the movable frame.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. The present invention uses a drainage path formed by a drainage plate in conjunction with the bumps to ensure that the glue flows evenly and dispersedly along the drainage path during the filling process, avoiding direct impact on the bonding wires and effectively preventing the bonding wires from breaking, shifting, or tangling. The drainage path between the bumps preferentially fills the narrow gaps between adjacent bonding wires, ensuring that the gap between the bonding wires and the chip is pre-filled. This significantly improves the uniformity and integrity of the glue filling, reduces the generation of bubbles and filling dead corners, and thus achieves efficient and stable packaging of the bonding wire area, improving the quality and reliability of chip packaging.

[0018] 2. The present invention achieves smooth dispersion and directional guidance of the glue flow by providing a pointed structure at the front end of the bump, effectively avoiding glue impact, rebound, and bubble generation, so that the glue can be quickly and smoothly dispersed when it contacts the bump, improving filling uniformity. The bonding wire is horizontally limited by the slot on the bump to prevent the bonding wires from offsetting and entangled during the glue injection process. When the bonding wire enters the slot, the chamfered structure at the slot entrance increases the tolerance range and alignment success rate of the bonding wire, avoids damage to the bonding wire, and ensures the stability of the bonding wire during the glue injection process.

[0019] 3. This invention uses drainage channels on the shaft seat to guide the glue to flow evenly toward the upper surface of the drain plate after it swings into place. This ensures that the glue flows smoothly through the drainage path and avoids direct impact on the bonding wires. The limiter shaft restricts the downward swing angle of the drain plate, preventing excessive swing and pressure on the bonding wires. This ensures the safety and structural integrity of the bonding wire area, thereby achieving precise control of the glue injection action and improving packaging reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of a chip damage-proof packaging device of the present invention.

[0021] Figure 2 It is a partial three-dimensional structural cross-sectional view of a chip damage prevention packaging device of the present invention.

[0022] Figure 3 It is a schematic diagram of the three-dimensional structure of a filling component of a chip damage-proof packaging device of the present invention.

[0023] Figure 4 This is a schematic diagram of the three-dimensional structure of a filling component of a chip damage prevention packaging device of the present invention. Figure 1 .

[0024] Figure 5 This is a schematic diagram of the three-dimensional structure of a filling component of a chip damage prevention packaging device of the present invention. Figure 2 .

[0025] Figure 6 It is a partial three-dimensional structural cross-sectional view of a filling component of a chip damage-proof packaging device of the present invention.

[0026] Figure 7 It is a planar cross-sectional view of a filling component of a chip damage prevention packaging device of the present invention.

[0027] Figure 8 The present invention is a schematic diagram of a local three-dimensional structure of a drain plate, bonding wires and a chip of a chip damage prevention packaging device.

[0028] Figure 9 This is a schematic diagram of a state where a drainage channel of a chip damage prevention packaging device of the present invention changes from closed to open.

[0029] Figure 10 It is a schematic diagram of the three-dimensional structure of a chip damage prevention packaging device of the present invention, in which a guide plate is brought into contact with a limiting shaft after being lowered.

[0030] Figure 11 The present invention Figure 7 Enlarged schematic diagram of point A in the middle.

[0031] The numbers in the figure are: 1. substrate; 11. chip; 111. bonding wire; 12. shell; 2. conveying mechanism; 21. base; 3. cofferdam structure; 4. filling assembly; 41. movable frame; 411. pressure-applying part; 412. pressure-receiving part; 413. first buffer spring; 414. second buffer spring; 42. glue injection chamber; 421. glue outlet; 422. shaft seat; 4221. drainage channel; 4222. limiting shaft; 423. glue injection tube; 424. interference part; 43. drainage plate; 431. drainage path; 432. bump; 4321. pointed structure; 4322. slot; 4323. chamfer structure; 433. torsion structure; 44. protective cover. DETAILED DESCRIPTION

[0032] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] See also Figure 1-Figure 7 As shown, a chip damage prevention packaging device is applied to a chip 11 connected to a substrate 1 through a plurality of bonding wires 111, including a conveying mechanism 2 and a glue injection mechanism, the glue injection mechanism including a cofferdam assembly for injecting glue around the chip 11 on the substrate 1 to form a cofferdam structure 3, the glue injection mechanism also includes a filling assembly 4 for filling glue into the cofferdam structure 3, the filling assembly 4 includes a movable frame 41 and a glue injection bin 42 arranged thereon and a guide plate 43 arranged around the glue injection bin 42, and the glue injection bin 42 is provided with a glue outlet 421 at a position corresponding to each guide plate 43.

[0034] Each of the guide plates 43 can swing downward. When the guide plate 43 is in the downward swing state, the glue outlet 421 is in an open state, and at the same time, a drainage path 431 is formed for the glue to flow between adjacent bonding wires 111 without directly applying pressure on the bonding wires 111. The glue injection chamber 42 can slide relatively on the movable frame 41. A pressure-applying portion 411 is provided at a position corresponding to each guide plate 43 on the movable frame 41. A pressure-receiving portion 412 that cooperates with the corresponding pressure-applying portion 411 is provided on each guide plate 43. When the movable frame 41 drives the glue injection chamber 42 to contact the chip 11 and continuously press down, the pressure-applying portion 411 gradually applies pressure on the pressure-receiving portion 412, so that the guide plate 43 gradually swings downward and opens the glue outlet 421.

[0035] The substrate 1 is provided with a housing 12 for further encapsulating the chip 11 therein, and a packaging mechanism is provided behind the glue injection mechanism for fixing the housing 12 on the substrate 1 and injecting glue into the housing again. The packaging mechanism is not shown in the figure.

[0036] The cofferdam assembly and the lifting drive for driving the movable frame 41 to move are not shown in the figure.

[0037] The conveying mechanism 2 has a base 21 for placing the substrate 1 .

[0038] The pressure-applying portion 411 is a rod-shaped structure extending vertically downward, and the pressure-receiving portion 412 is a block-shaped structure in contact with the corresponding pressure-applying portion 411. When the pressure-applying portion 411 acts on the pressure-receiving portion 412, the guide plate 43 receives the pressure from the pressure-applying portion 411 and gradually converts it into a rotational motion.

[0039] During chip 11 packaging, the substrate 1 to be packaged is first placed on the base 21 of the conveyor mechanism 2, after the bonding wires 111 between the chip 11 and the substrate 1 have been connected. The substrate 1 is then smoothly transported by the conveyor mechanism 2 to the working area of ​​the glue injection mechanism. At this point, the glue injection mechanism's cofferdam assembly begins to operate, precisely injecting glue around the periphery of the chip 11, forming a ring-shaped cofferdam structure 3. This cofferdam serves to provide boundary constraints and spatial support for the subsequent glue filling.

[0040] After the cofferdam is filled, the filling assembly 4 begins the filling operation. The movable frame 41 in the filling assembly 4 drives the glue injection chamber 42 downward until the glue injection chamber 42 contacts the surface of the chip 11. As the movable frame 41 continues to press downward, the pressure-applying portion 411 on the movable frame 41 gradually contacts the pressure-receiving portion 412 on the guide plate 43 and applies pressure.

[0041] Since the pressure-applying portion 411 is a rod-shaped structure extending vertically downward, and the pressure-receiving portion 412 is a block-shaped structure, when the two interact with each other, the pressure of the pressure-applying portion 411 causes the guide plate 43 to rotate around its rotation point, that is, to swing downward.

[0042] As the guide plates 43 swing downward, the glue outlets 421 around the glue injection chamber 42 corresponding to each guide plate 43 are gradually opened. At this time, the packaging glue stored in the glue injection chamber 42 flows out through the glue outlets 421 and spreads evenly into the cofferdam structure 3 along the drainage path 431 formed by the guide plates 43.

[0043] Drainage paths 431 ensure that the glue flows smoothly between the bonding wires 111 around the chip 11 without directly applying high voltage shock to the bonding wires 111, thereby avoiding the risk of the bonding wires 111 breaking or deforming due to external forces. This ensures sufficient coverage and protection of the bonding wires 111 between the chip 11 and the substrate 1, while ensuring the stability of the packaging quality.

[0044] During the glue filling process, the movable frame 41 continuously presses down to maintain the appropriate pressure, ensuring that the guide plate 43 is always open and the glue can fully fill the entire cofferdam area. When the glue filling is completed, the movable frame 41 retreats, the glue injection chamber 42 returns to its original position, and the guide plate 43 returns to its original position, ready for the next cycle.

[0045] After the filling is completed, the substrate 1 is transported forward and enters the working area of ​​the packaging mechanism. The main task of the packaging mechanism is to fix the housing 12 on the substrate 1 and further complete the overall packaging of the chip 11.

[0046] First, the packaging mechanism precisely mounts the pre-prepared housing 12 onto the substrate 1, completely covering the chip 11 and the bonding wires 111. Subsequently, the packaging mechanism injects encapsulating glue through the housing 12, filling the interior of the housing 12 with glue, thereby achieving a more comprehensive sealing protection for the chip 11. This not only enhances the overall mechanical strength of the chip 11, but also improves its resistance to moisture, dust, and corrosion, significantly increasing its reliability and service life.

[0047] See also Figures 6-11 As shown, the lower half of the guide plate 43 has a protrusion 432 at the position corresponding to each bonding wire 111, and the drainage path 431 is formed between every two adjacent protrusions 432. When the glue slides down along the upper half of the guide plate 43 and passes through the drainage path 431, the glue is in a dispersed state under the separation of the protrusions 432, so that the area between every two adjacent bonding wires 111 is pre-filled.

[0048] During the glue filling process, as the glue in the glue injection chamber 42 flows out through the glue outlet 421 and slides downward along the upper half of the guide plate 43, the glue gradually flows toward the bumps 432 in the lower half of the guide plate 43. Since a drainage path 431 is formed between each two adjacent bumps 432, the glue is evenly dispersed into multiple small flow branches under the guidance and separation of the bumps 432 as it flows through, preventing the glue from concentrating into streams and causing impact on the bonding wire 111 or uneven filling.

[0049] As the glue flows through drainage path 431 in a dispersed state, its flow is further directed to the area between the bonding wires 111 on substrate 1 surrounding chip 11. Due to the presence of drainage plate 43, the glue cannot fall directly vertically, but is forced to flow in a diverted manner, resulting in a more uniform and stable distribution of the glue throughout the packaging area. This effectively reduces the glue flow rate and impact force, preventing the bonding wires 111 from breaking, shifting, or tangling due to the impact of the high-speed glue flow.

[0050] At the same time, because the space between each two adjacent bonding wires 111 is usually narrow and the wiring is dense, traditional glue injection methods are prone to filling dead corners or residual bubbles, affecting the packaging quality. However, the drainage path 431 formed by the bump 432 can ensure that the glue is pre-dispersed before entering the bonding wire 111 area, and preferentially fills the gap between each two bonding wires 111, thereby ensuring that the glue in this area is fully and evenly filled without leaving any gaps, thereby improving the reliability and sealing of the package.

[0051] See also Figures 6-11 As shown, the end of each protrusion 432 that receives the glue is a pointed structure 4321 for spreading the glue evenly.

[0052] When the glue flows downward along the guide plate 43 , the pointed structure 4321 of each protrusion 432 faces the flow direction of the glue, so that the glue can be quickly and smoothly dispersed when it contacts the protrusion 432 .

[0053] As glue flows from the glue outlet 421 of the glue injection chamber 42 and slides down the upper half of the guide plate 43 to the area of ​​the protrusion 432, it first contacts the pointed structure 4321 at the front end of the protrusion 432, effectively guiding the glue flow to smoothly bifurcate along its surface and spread evenly to both sides. This avoids the problems of concentrated glue impact, rebound, or stagnation that can occur with traditional right-angle or flat structures.

[0054] As the glue flows along the pointed structure 4321 , its flow direction is precisely guided to the drainage path 431 between adjacent bumps 432 , further achieving directional filling of the gaps between the bonding wires 111 .

[0055] At the same time, the pointed structure 4321 reduces the resistance and turbulent disturbance during the flow of glue, reduces the probability of bubble generation, and ensures that the glue enters the packaging area in a continuous and uniform state.

[0056] See also Figures 6-11 As shown, each protrusion 432 has a slot 4322 at one end facing the bonding wire 111, in which the corresponding bonding wire 111 can be clamped. When the bonding wire 111 is clamped in the slot 4322, the bonding wire 111 is in a horizontally limited state, so that no contact occurs between each two adjacent bonding wires 111.

[0057] When the filling assembly 4 descends to the surface of the chip 11 and is ready to fill with glue, the guide plate 43 swings synchronously under the downward pressure of the movable frame 41, so that the bumps 432 gradually approach the area of ​​the bonding wires 111. Until the bonding wires 111 are guided one by one into the corresponding grooves 4322 of the bumps 432, forming a stable limiting contact.

[0058] Once the bonding wire 111 is inserted into the slot 4322, it is horizontally restrained and cannot move or deflect freely, effectively preventing the bonding wire 111 from shifting, tilting, or even becoming entangled due to glue flow during the subsequent glue injection process.

[0059] At the same time, since every two adjacent bonding wires 111 are independently fixed by their respective corresponding slots 4322, a set minimum safety distance is maintained between each other, thereby avoiding direct contact or cross interference between the bonding wires 111, and significantly reducing the probability of electrical faults such as short circuits and open circuits.

[0060] See also Figures 6-11 As shown, the edges of the slot 4322 of each protrusion 432 are chamfered structures 4323 for guiding the bonding wire 111 into the slot 4322 .

[0061] When the guide plate 43 approaches the chip 11, since the bonding wire 111 itself has a certain flexibility and a small degree of swing freedom in the suspended state, if the entrance of the slot 4322 is a right angle, it is easy for the bonding wire 111 to hit the edge of the slot and be offset and unable to be accurately embedded.

[0062] To address the issue of bonding wire 111 not being able to accurately fit into slot 4322, chamfered structure 4323 is provided. When bonding wire 111 contacts the edge of slot 4322, it is not directly blocked but instead gradually slides along the surface of chamfered structure 4323 into slot 4322. This effectively expands the effective tolerance range for bonding wire 111 to fit into slot 4322 and improves the success rate of alignment.

[0063] In addition, the chamfered structure 4323 can also reduce the mechanical stress on the bonding wire 111 during the sliding process, avoiding surface damage or local deformation of the bonding wire 111 due to sharp-angle contact, thereby ensuring that the integrity and conductive performance of the bonding wire 111 are not affected.

[0064] See also Figures 6-11 As shown, a shaft seat 422 for rotatably connecting the guide plate 43 is provided at the position corresponding to each guide plate 43 on the glue injection bin 42, and the shaft seat 422 has a drainage channel 4221 connected to the glue outlet 421 and capable of guiding the glue toward the upper half of the guide plate 43. Before the guide plate 43 swings down, the drainage channel 4221 is in a closed state, and after the guide plate 43 swings down, the drainage channel 4221 is in an open state.

[0065] When the movable frame 41 drives the glue injection chamber 42 to press downward and the pressure-applying portion 411 starts to act on the pressure-receiving portion 412 of the guide plate 43 , the guide plate 43 rotates around the rotation axis of the shaft seat 422 and swings downward.

[0066] As the swing angle gradually increases, the relative position between the guide plate 43 and the shaft seat 422 changes, and the originally blocked drainage channel 4221 opens, allowing the glue in the glue injection chamber 42 to enter the drainage channel 4221 through the glue outlet 421 and be guided along the drainage channel 4221 to the upper surface of the guide plate 43.

[0067] At the same time, the outlet direction of the drainage channel 4221 allows the glue to flow along the upper surface of the drainage plate 43, providing a good flow foundation for the glue to subsequently enter the gaps between the bonding wires 111 through the drainage path 431. This improves the controllability and accuracy of the glue injection process, ensuring that each glue injection is completed under optimal conditions.

[0068] See also Figures 6-11 As shown, each shaft seat 422 is provided with a limiting shaft 4222 for limiting the downward swing of the corresponding guide plate 43. When the back side of the guide plate 43 contacts the limiting shaft 4222, the guide plate 43 is in a non-pressurized state on the bonding wire 111.

[0069] When the movable frame 41 drives the glue injection chamber 42 to move downward and causes the guide plate 43 to rotate downward around the shaft seat 422, the back side of the guide plate 43, that is, the side away from the glue flow, will gradually approach the limiting shaft 4222.

[0070] As the downward pressure continues, when the guide plate 43 rotates to the set angle, its back side eventually contacts the limit shaft 4222, at which point the guide plate 43 stops swinging downward, and the swing angle is precisely limited. This ensures that the guide plate 43 always remains within a safe operating range, effectively opening the glue outlet 421 and forming the drainage path 431, while preventing the guide plate 43 from pressing on the bonding wire 111 below due to excessive downward pressure.

[0071] See also Figures 6-11 As shown, a torsion structure 433 is provided between each guide plate 43 and the axial connection point of the corresponding shaft seat 422, which can generate elastic deformation when the guide plate 43 is subjected to a downward swing driving force. When the pressure-applying part 411 applies pressure to the pressure-receiving part 412, the guide plate 43 swings downward to drive the torsion structure 433 to be in a deformed state, and when the pressure-applying part 411 releases the pressure on the pressure-receiving part 412, the torsion structure 433 drives the guide plate 43 to be in a gradually reset state.

[0072] When the movable frame 41 moves downward and the pressure-applying portion 411 acts on the pressure-receiving portion 412 on the guide plate 43, the guide plate 43 begins to swing downward. At this time, the torsion structure 433 is elastically deformed by the torque brought by the rotation of the guide plate 43, storing a certain amount of restoring potential energy.

[0073] As the pressure-applying portion 411 continues to apply pressure, the guide plate 43 remains in a swinging state, the glue outlet 421 opens, and the glue flows through the drainage channel 4221 to the upper half of the guide plate 43, and further disperses along the drainage path 431 between the bonding wires 111. During this process, the torsion structure 433 is always in a twisted deformation state, providing a restoring force for the subsequent reset of the guide plate 43.

[0074] When the glue injection is completed, the movable frame 41 rises, the pressure-applying part 411 gradually separates from the pressure-receiving part 412, and the external driving force is released. At this time, the torsion structure 433 releases the elastic potential energy stored previously, pushing the guide plate 43 to rotate in the opposite direction, causing it to slowly return to its initial non-swinging position until the glue outlet 421 is closed.

[0075] See also Figures 6-11 As shown, a glue injection tube 423 is provided on the top of the glue injection chamber 42 and extends vertically upward through the movable frame 41. A guide port is provided on the movable frame 41 for the glue injection tube 423 to pass through. A resistance portion 424 capable of contacting the chip 11 is provided at the bottom of the glue injection chamber 42. A first buffer spring 413 capable of buffering the pressure on the chip 11 is provided between the glue injection chamber 42 and the movable frame 41.

[0076] When the movable frame 41 drives the glue injection chamber 42 to move downward, the resistance portion 424 at the bottom of the glue injection chamber 42 first contacts the surface of the chip 11 and applies a certain bonding pressure as the movable frame 41 continues to press downward.

[0077] In order to avoid damage to the chip 11 due to rigid contact, the first buffer spring 413 arranged between the glue injection chamber 42 and the movable frame 41 can be elastically compressed when the glue injection chamber 42 is subjected to downward pressure, thereby effectively absorbing and buffering the pressure acting on the chip 11, preventing overpressure from causing the chip 11 to break or damage the internal structure.

[0078] See also Figures 6-11 As shown, a protective cover 44 is provided on the movable frame 41 for covering the cofferdam structure 3 to prevent dust from entering therein, and a second buffer spring 414 is provided between the protective cover 44 and the movable frame 41 to buffer the pressure on the substrate 1.

[0079] After the dam assembly completes the glue injection around the chip 11 and forms the dam structure 3, a dedicated protective cover 44 is installed on the movable frame 41 to prevent dust or impurities from falling into the dam area and affecting the packaging quality during subsequent operations. This creates a physical isolation barrier, ensuring that it effectively blocks external contaminants from entering while not affecting the subsequent filling of the assembly 4.

[0080] The second buffer spring 414 between the protective cover 44 and the movable frame 41 is compressed and elastically deformed when the protective cover 44 contacts the surface of the substrate 1, thereby playing a buffering and shock-absorbing role, thereby preventing damage to the substrate 1 caused by rigid contact.

[0081] The present invention realizes uniform dispersion flow of glue through the drainage path 431 formed by the drainage plate 43 and the protrusion 432, avoids direct impact on the bonding wire 111, effectively prevents its breakage, displacement or entanglement, and preferentially fills the narrow gaps between the bonding wires 111, thereby improving the filling uniformity and integrity.

[0082] As the glue passes through the pointed structure 4321 at the front end of the bump 432, it is evenly and smoothly dispersed into the drainage path 431. Combined with the positioning of the bonding wire 111 by the slot 4322, this further improves the stability of the bonding wire 111 during the glue injection process. At the same time, the drainage channel 4221 on the shaft seat 422 cooperates with the limiting shaft 4222 to ensure orderly glue flow and limit the swing amplitude of the drainage plate 43, thereby achieving precise control of the glue injection process and significantly improving the quality and reliability of chip 11 packaging.

[0083] The above embodiments merely represent one or more embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, and such modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the appended claims.

Claims

1. A chip damage prevention packaging device, used for chips connected to a substrate via multiple bonding wires, comprising a conveying mechanism and a glue injection mechanism. The glue injection mechanism includes a dam assembly for injecting glue around the chip on the substrate to form a dam structure. It is characterized by: The glue injection mechanism also includes a filling assembly for filling glue into the cofferdam structure, the filling assembly including a movable frame and a glue injection bin arranged thereon and guide plates arranged around the glue injection bin, and the glue injection bin is provided with a glue outlet at a position corresponding to each guide plate; Each guide plate can swing downward. When the guide plate is in the downward swing state, the glue outlet is in an open state, forming a drainage path for the glue to flow between adjacent bonding wires without directly exerting pressure on the bonding wires. The glue injection chamber can slide relatively on the movable frame. A pressure-applying part is provided at the position corresponding to each guide plate on the movable frame. Each guide plate is provided with a pressure-receiving part that cooperates with the corresponding pressure-applying part. When the movable frame drives the glue injection chamber to contact the chip and continuously presses down, the pressure-applying part gradually applies pressure to the pressure-receiving part, causing the guide plate to gradually swing downward and open the glue outlet. The lower half of the guide plate has a bump at the position corresponding to each bonding wire, and a drainage path is formed between every two adjacent bumps. When the glue slides down the upper half of the guide plate and passes through the drainage path, the glue is in a dispersed state separated by the bumps, so that the area between every two adjacent bonding wires is pre-filled; The end of each bump that meets the glue is a pointed structure used to spread the glue evenly; Each protrusion has a slot on one end facing the bonding wire, in which the corresponding bonding wire can be clamped. When the bonding wire is clamped in the slot, the bonding wire is in a horizontally limited state, so that no two adjacent bonding wires contact each other. An axle seat for rotational connection of the guide plate is provided at the position corresponding to each guide plate on the glue injection bin. The axle seat has a drainage channel connected to the glue outlet and capable of guiding the glue toward the upper half of the guide plate. Before the guide plate swings down, the drainage channel is in a closed state. After the guide plate swings down, the drainage channel is in an open state.

2. The chip damage prevention packaging device according to claim 1, characterized in that: The edges of the slot openings of each protrusion are chamfered structures for guiding the bonding wire into the slot.

3. The chip damage prevention packaging device according to claim 2, characterized in that: Each shaft seat is provided with a limiting shaft for limiting the downward swing range of the corresponding guide plate. When the back side of the guide plate contacts the limiting shaft, the guide plate is in a non-pressure state on the bonding wire.

4. The chip damage prevention packaging device according to claim 3, characterized in that: A torsion structure is provided between each guide plate and the axial connection point of the corresponding shaft seat, which can produce elastic deformation when the guide plate is subjected to a downward swing driving force. When the pressure-applying part applies pressure to the pressure-receiving part, the downward swing of the guide plate drives the torsion structure to be in a deformation state, and when the pressure-applying part releases the pressure on the pressure-receiving part, the torsion structure drives the guide plate to be in a gradual reset state.

5. The chip damage prevention packaging device according to claim 1, characterized in that: A glue injection tube extending vertically upward through a movable frame is provided at the top of the glue injection bin; a guide port for the glue injection tube to pass through is provided on the movable frame; a resistance portion capable of contacting the chip is provided at the bottom of the glue injection bin; a first buffer spring capable of buffering the pressure exerted on the chip is provided between the glue injection bin and the movable frame.

6. The chip damage prevention packaging equipment according to claim 1, characterized in that: The movable frame is provided with a protective cover for arranging the cofferdam structure cover therein to prevent dust from entering, and a second buffer spring capable of buffering the pressure on the substrate is provided between the protective cover and the movable frame.

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