Purple light enhanced sunlight full-spectrum LED lamp bead and preparation method thereof

By using the LED lamp bead preparation method of a combination of purple light diodes and specific phosphors, the problem of poor luminescence effect caused by improper selection of phosphors is solved, and the full spectrum luminescence effect and high-finger display LED lamp beads are achieved.

CN120547993APending Publication Date: 2025-08-26GUANGBOSHI (LISHUI) MEDICAL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510662211.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-22
Publication Date
2025-08-26

AI Technical Summary

Technical Problem

In the existing LED lamp bead production process, the selection of phosphors has not been carefully considered, resulting in poor luminous effect.

Method used

It uses a purple light diode (LED chip) to emit ultraviolet wavelength light, combines ultraviolet phosphor or a combination of phosphors of multiple colors, and is packaged using epoxy resin or silicone, equipped with heat dissipation fins and driving circuits to conduct strict material inspection and assembly procedures.

Benefits of technology

The full spectrum of luminescence effect is achieved, and the indicator of the lamp bead is improved to above 97, the average indicator is 98, the wavelength range is 380-780nm, and the luminescence effect is stable.

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Abstract

The invention discloses a purple-light-enhanced sunlight full-spectrum LED lamp bead and a preparation method thereof, and belongs to the technical field of LED lamp bead production. The purple-light-enhanced sunlight full-spectrum LED lamp bead comprises a light-emitting assembly, a carrier assembly, a packaging assembly, a heat dissipation assembly and a driving circuit; according to the invention, the selection of the fluorescent powder is meticulously considered, the required spectral range and color are considered, the ultraviolet fluorescent powder or the combination of the fluorescent powder with multiple colors is used, and the fluorescent powder can emit visible light under the excitation of purple light, so that the full-spectrum light-emitting effect is realized, and the light-emitting effect of a finished product can be effectively improved; meanwhile, in the production process, each group of materials is well inspected, the quality of a finished product can be guaranteed, 2835 lamp beads are adopted, the color rendering index of the lamp beads is 97 or above, the average color rendering index of the lamp beads is 98, the wavelength of the lamp beads is 380-780 nm, the lamp beads emit light at the angle of 15 degrees, and the light emitting effect of the final finished product can be stably improved.
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Description

Technical Field

[0001] The present invention belongs to the technical field of LED lamp bead production, and in particular relates to a purple light enhanced sunlight full spectrum LED lamp bead and a preparation method thereof. Background Art

[0002] LED lamp beads are a kind of semiconductor components, chips with luminous effects, and are one of the most popular light sources in the field of modern lighting. LED lamp beads have been widely used in various fields due to their advantages of high efficiency, energy saving, long life, environmental protection and pollution-free. With the continuous development and innovation of technology, they will continue to play an important role. During production, production preparation methods need to be applied.

[0003] A Chinese patent discloses (CN102637803A) a process for manufacturing LED white light lamp beads, which includes the following steps: A: Apply insulating glue to the center of the bracket according to the shape of the grain, and then place the grain on the glue point to dry and fix it. B: Perform wire welding according to conventional processes. C: Mix phosphor and phosphor glue in a certain proportion, and then apply it to the surface of the grain. Bake it at 40℃ to 45℃ for more than 0.5 hours to allow the phosphor to precipitate on the surface and around the grain. D: Bake it at 150℃ to 160℃ for 1 to 4 hours to further solidify the phosphor. E: Perform glue injection and demolding according to conventional processes. The present invention is more conducive to light emission because the insulating glue point is consistent with the shape of the grain and the phosphor is precipitated on the surface and around the grain. Practice has shown that the light emission efficiency can be increased by more than 30%. Although the current LED lamp bead manufacturing process can complete the production and production of lamp beads, the selection of phosphors has not been carefully considered, resulting in the lamp beads not meeting expectations in terms of luminous effect after production, and poor actual application effects. In order to solve this problem, there is an urgent need for a purple light-enhanced sunlight full-spectrum LED lamp bead and a preparation method thereof. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that although the current LED lamp bead manufacturing process can complete the manufacture and production of the lamp beads, the selection of phosphors has not been carefully considered, resulting in the lamp beads not meeting the expected luminous effect after production and poor actual application effect. A purple light enhanced sunlight full spectrum LED lamp bead and a preparation method thereof are proposed.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following components: a light-emitting component, a carrier component, a packaging component, a heat dissipation component and a driving circuit.

[0006] As a further description of the above technical solution:

[0007] The light-emitting component is a violet diode (LED chip), which is a violet chip that can emit a wavelength of 380-410nm. It can emit ultraviolet wavelength light. The carrier component is silicone, the packaging component is epoxy resin and silicone, the heat dissipation component is a heat dissipation fin, and the driving circuit includes a power conversion circuit and a current limiting circuit.

[0008] This article also discloses a method for preparing a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following steps:

[0009] S1. Inspect the above materials;

[0010] S2, prepare colloid and mounting frame;

[0011] S3, installing the chip;

[0012] S4, applying phosphor;

[0013] S5, packaging;

[0014] S6. Assemble the heat dissipation structure;

[0015] S7, install the drive circuit;

[0016] S8. Conduct final testing;

[0017] S9. Pack the finished products and put them into storage.

[0018] As a further description of the above technical solution:

[0019] In S1, the above-mentioned various materials are inspected, and the inspection mainly includes checking whether there is mechanical damage, pitting or pitting on the surface of each group of materials, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete.

[0020] As a further description of the above technical solution:

[0021] In S2, prepare colloid and mounting frame, and coat the colloid on the LED back electrode using a glue preparation machine or manually, with the thickness of the coated colloid maintained at 3-5mm. Remove the mounting frame and inspect it. The colloid is one of silver glue or insulating glue.

[0022] As a further description of the above technical solution:

[0023] In S3, the chip is mounted. Specifically, the chip is fixed on the mounting frame through carrier silicone to ensure stable contact between the chip and the mounting frame.

[0024] As a further description of the above technical solution:

[0025] In the above S4, phosphor is coated on the outside of the purple LED chip, wherein the selection of phosphor should take into account the required spectral range and color. Ultraviolet phosphor or a combination of phosphors of multiple colors is used. The phosphor can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminous effect.

[0026] As a further description of the above technical solution:

[0027] In the above-mentioned S5, the LED chip is encapsulated inside the shell by using one of epoxy resin or silica gel. The shell is made of silicon dioxide.

[0028] As a further description of the above technical solution:

[0029] In S6, the heat dissipation structure is assembled, the power and heat generation of the LED lamp beads are calculated during the assembly of the heat dissipation structure, suitable heat sinks or heat dissipation fins are selected, and the heat dissipation structure is installed on the housing. One side of the heat dissipation structure needs to fit tightly with the carrier material to continuously ensure the heat dissipation effect.

[0030] As a further description of the above technical solution:

[0031] In the step S7 , the drive circuit is installed at a designated location and connected to the LED chip.

[0032] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0033] This method carefully considers the selection of phosphors, taking into account the required spectral range and color, and uses ultraviolet phosphors or a combination of multiple colors of phosphors. The phosphors can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminous effect, which can effectively improve the luminous effect of the finished product. At the same time, during the production process, each group of materials is carefully inspected to ensure the quality of the finished product. The use of 2835 lamp beads, which have a CRI of more than 97, an average CRI of 98, a wavelength of 380-780nm, and emit light at a 15-degree angle, can also stably improve the luminous effect of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The present invention is a flow chart of a method for preparing purple light enhanced sunlight full spectrum LED lamp beads. DETAILED DESCRIPTION

[0035] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] Example 1

[0037] See also Figure 1 The present invention provides a technical solution: a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following components: a light emitting component, a carrier component, a packaging component, a heat dissipation component and a driving circuit, wherein the light emitting component is a purple light diode (LED chip), which is a purple light chip capable of emitting a wavelength of 380-410nm and capable of emitting ultraviolet wavelength light, the carrier component is silicone, the packaging component is epoxy resin and silicone, the heat dissipation component is a heat dissipation fin, and the driving circuit includes a power conversion circuit and a current limiting circuit.

[0038] This article also discloses a method for preparing a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following steps:

[0039] S1. Inspect the above materials. The inspection mainly includes checking whether there is mechanical damage, pitting or pitting on the surface of each group of materials, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete;

[0040] S2. Prepare the colloid and mounting frame. Use a glue preparation machine or manually apply the colloid on the LED back electrode. Keep the thickness of the colloid at 4mm. Remove the mounting frame and inspect it. The colloid is insulating glue.

[0041] S3. Install the chip. Specifically, the chip is fixed on the mounting frame through the carrier silicone to ensure that the chip is in stable contact with the mounting frame.

[0042] S4. Coating phosphor on the outside of the purple LED chip. The selection of phosphor should take into account the required spectral range and color. Use ultraviolet phosphor or a combination of multiple colors of phosphor. The phosphor can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminescence effect.

[0043] S5. Use epoxy resin material to encapsulate the LED chip inside the shell, and the shell is made of silicon dioxide;

[0044] S6. Assemble the heat dissipation structure. Calculate the power and heat generation of the LED lamp beads before assembling the heat dissipation structure. Select appropriate heat sinks or fins. Install the heat dissipation structure on the housing. One side of the heat dissipation structure needs to fit tightly with the carrier material to ensure continuous heat dissipation.

[0045] S7, install the drive circuit, install the drive circuit in the designated position, and connect the drive circuit to the LED chip;

[0046] S8. Conduct final testing;

[0047] S9. Pack the finished products and put them into storage.

[0048] In this embodiment, the selection of phosphors is carefully considered, taking into account the required spectral range and color, and ultraviolet phosphors or a combination of phosphors of multiple colors are used. The phosphors can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminous effect, which can effectively improve the luminous effect of the finished product.

[0049] Example 2

[0050] See also Figure 1 The present invention provides a technical solution: a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following components: a light emitting component, a carrier component, a packaging component, a heat dissipation component and a driving circuit, wherein the light emitting component is a purple light diode (LED chip), which is a purple light chip capable of emitting a wavelength of 380-410nm and capable of emitting ultraviolet wavelength light, the carrier component is silicone, the packaging component is epoxy resin and silicone, the heat dissipation component is a heat dissipation fin, and the driving circuit includes a power conversion circuit and a current limiting circuit.

[0051] This article also discloses a method for preparing a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following steps:

[0052] S1. Inspect the above materials. The inspection mainly includes checking whether there is mechanical damage, pitting or pitting on the surface of each group of materials, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete;

[0053] S2. Prepare the colloid and mounting frame. Use a glue preparation machine or manually apply the colloid on the LED back electrode. Keep the thickness of the coated colloid at 3mm. Remove the mounting frame and inspect it. The colloid is silver glue.

[0054] S3. Install the chip. Specifically, the chip is fixed on the mounting frame through the carrier silicone to ensure that the chip is in stable contact with the mounting frame.

[0055] S4. Coating phosphor on the outside of the purple LED chip. The selection of phosphor should take into account the required spectral range and color. Use ultraviolet phosphor or a combination of multiple colors of phosphor. The phosphor can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminescence effect.

[0056] S5. Use silicone material to encapsulate the LED chip inside the shell, and the shell is made of silicon dioxide;

[0057] S6. Assemble the heat dissipation structure. Calculate the power and heat generation of the LED lamp beads before assembling the heat dissipation structure. Select appropriate heat sinks or fins. Install the heat dissipation structure on the housing. One side of the heat dissipation structure needs to fit tightly with the carrier material to ensure continuous heat dissipation.

[0058] S7, install the drive circuit, install the drive circuit in the designated position, and connect the drive circuit to the LED chip;

[0059] S8. Conduct final testing;

[0060] S9. Pack the finished products and put them into storage.

[0061] In this embodiment, during the production process, each group of materials is carefully inspected to ensure the quality of the finished product, and 2835 lamp beads are used, which have a CRI of more than 97, an average CRI of 98, a wavelength of 380-780nm, and emit light at an angle of 15 degrees, which can also stably improve the luminous effect of the final product.

[0062] Example 3

[0063] See also Figure 1 The present invention provides a technical solution: a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following components: a light emitting component, a carrier component, a packaging component, a heat dissipation component and a driving circuit, wherein the light emitting component is a purple light diode (LED chip), which is a purple light chip capable of emitting a wavelength of 380-410nm and capable of emitting ultraviolet wavelength light, the carrier component is silicone, the packaging component is epoxy resin and silicone, the heat dissipation component is a heat dissipation fin, and the driving circuit includes a power conversion circuit and a current limiting circuit.

[0064] This article also discloses a method for preparing a purple light enhanced sunlight full spectrum LED lamp bead, comprising the following steps:

[0065] S1. Inspect the above materials. The inspection mainly includes checking whether there is mechanical damage, pitting or pitting on the surface of each group of materials, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete;

[0066] S2. Prepare the colloid and mounting frame. Use a glue preparation machine or manually apply the colloid on the LED back electrode. Keep the thickness of the coated colloid at 4mm. Remove the mounting frame and inspect it. The colloid is silver glue.

[0067] S3. Install the chip. Specifically, the chip is fixed on the mounting frame through the carrier silicone to ensure that the chip is in stable contact with the mounting frame.

[0068] S4. Coating phosphor on the outside of the purple LED chip. The selection of phosphor should take into account the required spectral range and color. Use ultraviolet phosphor or a combination of multiple colors of phosphor. The phosphor can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminescence effect.

[0069] S5. Use epoxy resin material to encapsulate the LED chip inside the shell, and the shell is made of silicon dioxide;

[0070] S6. Assemble the heat dissipation structure. Calculate the power and heat generation of the LED lamp beads before assembling the heat dissipation structure. Select appropriate heat sinks or fins. Install the heat dissipation structure on the housing. One side of the heat dissipation structure needs to fit tightly with the carrier material to ensure continuous heat dissipation.

[0071] S7, install the drive circuit, install the drive circuit in the designated position, and connect the drive circuit to the LED chip;

[0072] S8. Conduct final testing;

[0073] S9. Pack the finished products and put them into storage.

[0074] In this embodiment, the selection of phosphors is carefully considered, taking into account the required spectral range and color, and using ultraviolet phosphors or a combination of phosphors of multiple colors. The phosphors can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminous effect, which can effectively improve the luminous effect of the finished product. At the same time, during the production process, each group of materials is carefully inspected to ensure the quality of the finished product. The use of 2835 lamp beads, which have a CRI of more than 97, an average CRI of 98, a wavelength of 380-780nm, and emit light at an angle of 15 degrees, can also stably improve the luminous effect of the final product.

[0075] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A purple light enhanced sunlight full spectrum LED lamp bead, characterized by: It includes the following components: a light-emitting component, a carrier component, a packaging component, a heat dissipation component and a driving circuit.

2. The violet-enhanced sunlight full-spectrum LED lamp bead according to claim 1, characterized in that: The light-emitting component is a violet diode (LED chip), which is a violet chip that can emit a wavelength of 380-410nm. It can emit ultraviolet wavelength light. The carrier component is silicone, the packaging component is epoxy resin and silicone, the heat dissipation component is a heat dissipation fin, and the driving circuit includes a power conversion circuit and a current limiting circuit.

3. A method for preparing a purple light enhanced sunlight full spectrum LED lamp bead, characterized by: The steps include: S1. Inspect the above materials; S2, prepare colloid and mounting frame; S3, installing the chip; S4, applying phosphor; S5, packaging; S6. Assemble the heat dissipation structure; S7, install the drive circuit; S8. Conduct final testing; S9. Pack the finished products and put them into storage.

4. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In S1, the above-mentioned various materials are inspected, and the inspection mainly includes checking whether there is mechanical damage, pitting or pitting on the surface of each group of materials, whether the chip size and electrode size meet the process requirements, and whether the electrode pattern is complete.

5. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In S2, prepare colloid and mounting frame, and coat the colloid on the LED back electrode using a glue preparation machine or manually, with the thickness of the coated colloid maintained at 3-5mm. Remove the mounting frame and inspect it. The colloid is one of silver glue or insulating glue.

6. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In S3, the chip is mounted. Specifically, the chip is fixed on the mounting frame through carrier silicone to ensure stable contact between the chip and the mounting frame.

7. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In the above S4, phosphor is coated on the outside of the purple LED chip, wherein the selection of phosphor should take into account the required spectral range and color. Ultraviolet phosphor or a combination of phosphors of multiple colors is used. The phosphor can emit visible light under the excitation of purple light, thereby achieving a full-spectrum luminous effect.

8. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In the above-mentioned S5, the LED chip is encapsulated inside the shell by using one of epoxy resin or silica gel. The shell is made of silicon dioxide.

9. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In S6, the heat dissipation structure is assembled, the power and heat generation of the LED lamp beads are calculated during the assembly of the heat dissipation structure, suitable heat sinks or heat dissipation fins are selected, and the heat dissipation structure is installed on the housing. One side of the heat dissipation structure needs to fit tightly with the carrier material to continuously ensure the heat dissipation effect.

10. The method for preparing a purple light enhanced sunlight full spectrum LED lamp bead according to claim 3, characterized in that: In the step S7 , the drive circuit is installed at a designated location and connected to the LED chip.

Citation Information

Patent Citations

  • Production process of LED (Light-Emitting Diode) white light bead

    CN102637803A