Adhesive for mica tape, preparation method thereof, and high-performance composite mica tape

Abstract

The present invention relates to the technical field of adhesives for mica tapes, and in particular to an adhesive for mica tapes, a preparation method thereof, and a high-performance composite mica tape. The raw materials of the adhesive for mica tapes include: epoxy resin, organosilanol, α,ω-dihydroxypolydimethylsiloxane, a crosslinking agent, silicon carbide whiskers, nano-graphene oxide, boron nitride nanosheets, and dicyclohexylmethane diisocyanate. The present invention also discloses a high-performance composite mica tape, comprising: mica paper, an adhesive layer made of the adhesive adhered to one side of the mica paper, and a polyimide film adhered to one side of the adhesive layer. The present invention uses mica paper as a base material and bonds a polyimide film to form an insulating material, which has excellent heat resistance, mechanical properties, and electrical properties. In addition, the preparation method is simple and has a wide range of applications in the field of high-temperature resistant motors.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives for mica tapes, and in particular to an adhesive for mica tapes, a preparation method thereof, and a high-performance composite mica tape. Background Art

[0002] Mica tape, a key fire-resistant insulating material, is made of mica paper and reinforcing materials bonded together with an adhesive. It is widely used in high-temperature and high-pressure environments, such as high-speed railway traction systems, ship propulsion equipment, new energy vehicle motors, and household appliance inverters. Its core function is to withstand extreme temperatures and electric field stresses, ensuring the long-term stable operation of electrical equipment. However, as modern industry's demand for lightweight equipment, high power density, and high-temperature resistance continues to increase, traditional mica tape has gradually exposed many technical limitations, particularly in terms of thermal conductivity, dielectric strength, and interfacial adhesion, which make it difficult to meet the demands of the new generation of high-end applications.

[0003] Currently, conventional mica tape adhesive systems commonly suffer from high interfacial thermal resistance. Due to the low thermal conductivity of conventional adhesives and the tendency of nanofillers to agglomerate within the matrix, it is difficult to form a continuous thermal network. This results in heat accumulation within the mica tape, leading to severe localized overheating. Under high-frequency and high-voltage operating conditions, this localized high temperature can trigger dielectric breakdown, dramatically degrading insulation performance and even causing equipment failure.

[0004] On the other hand, the interfacial bonding strength between traditional adhesives and mica paper and reinforcing materials (such as polyimide film) is insufficient, making them susceptible to delamination or peeling under prolonged exposure to high temperatures or mechanical vibration. This interfacial failure not only reduces the mechanical strength of the mica tape but also deteriorates its insulation properties, shortening the life of the equipment.

[0005] Existing modification technologies mostly rely on a single filler or simple blending methods, which makes it difficult to optimize thermal conductivity, temperature resistance and mechanical strength. Although simply increasing the filler content can enhance thermal conductivity, it will affect the permeability of the adhesive on the mica paper and reduce the bonding strength. Moreover, the thermal network construction ability of a single filler is limited and cannot form an efficient three-dimensional heat transfer path, which needs to be urgently addressed. Summary of the Invention

[0006] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an adhesive for mica tape, a preparation method thereof, and a high-performance composite mica tape.

[0007] Disclosed is an adhesive for mica tape. The raw materials thereof comprise, by mass, 20-40 parts of epoxy resin, 5-15 parts of organosilanol, 1-10 parts of α,ω-dihydroxypolydimethylsiloxane, 1-5 parts of a crosslinking agent, 1-3 parts of silicon carbide whiskers, 1-2 parts of nano-graphene oxide, 1-2 parts of boron nitride nanosheets, and 1-5 parts of dicyclohexylmethane diisocyanate.

[0008] Preferably, the epoxy resin is type E44.

[0009] Preferably, the viscosity average molecular weight of the α,ω-dihydroxypolydimethylsiloxane is 1500-2500.

[0010] Preferably, the cross-linking agent is aluminum acetylacetonate.

[0011] Preferably, the silicon carbide whisker has a diameter of 50-80 nm and an aspect ratio of 15-25:1.

[0012] A method for preparing the adhesive for mica tape comprises the following steps:

[0013] Add nano-graphene oxide and boron nitride nanosheets to toluene, reflux and dehydrate at 110-120°C for 1-2 hours, add dicyclohexylmethane diisocyanate under nitrogen protection, reflux and react at 120-140°C for 2-6 hours, cool, stand, and wash to obtain pretreated graphene; add pretreated graphene, epoxy resin, and organosilanol to toluene, stir at 120-140°C for 2-4 hours under nitrogen protection, cool to 40-50°C, add α,ω-dihydroxypolydimethylsiloxane, crosslinking agent, and silicon carbide whiskers, stir for 10-20 minutes, heat to 120-140°C, stir for 5-15 minutes, and cool to room temperature.

[0014] A high-performance composite mica tape comprises mica paper, an adhesive layer made of any of the above-mentioned adhesives attached to one side of the mica paper, and a polyimide film attached to one side of the adhesive layer.

[0015] Preferably, the mass per unit area of ​​mica paper is 145-165g / m 2 .

[0016] Preferably, the mica paper is non-calcined muscovite mica paper.

[0017] Preferably, the mass per unit area of ​​the polyimide film is 31-38 g / m 2 .

[0018] A method for preparing the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, then laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 150-160° C. for 4-6 hours.

[0019] The present invention utilizes the hydroxyl and carboxyl groups on the surface of graphene oxide to combine with dicyclohexylmethane diisocyanate, and then combines with boron nitride nanosheets to wrap and combine an organic film layer on the surface of the particles to form a large steric hindrance, which can effectively improve the agglomeration of nanoparticles. The graphene oxide and boron nitride nanosheets form a three-dimensional thermal conductive network, which greatly enhances the thermal conductivity.

[0020] The present invention also utilizes the epoxy ring-opening reaction of pretreated graphene with epoxy resin, allowing the silanol groups of organosilanol to participate in the condensation reaction, effectively enhancing the interaction between the organic and inorganic phases. This results in products with excellent high-temperature resistance and mechanical properties. The present invention also laminates mica paper and polyimide film via an adhesive layer, resulting in a high bond strength and effectively improving the stability of the mica tape during use.

[0021] The present invention adopts α,ω-dihydroxy polydimethylsiloxane to coordinate with aluminum acetylacetonate through terminal hydroxyl groups, and silicon carbide whiskers to bond with the resin matrix through surface silanol groups, and cooperates with pretreated graphene to form an anisotropic thermal conductive system, which significantly improves the thermal conductivity of the system.

[0022] The adhesive layer of the present invention has low viscosity at high temperatures, facilitating its penetration into mica paper and significantly increasing the bonding strength between the polyimide film and the mica paper. The present invention uses mica paper as a substrate and bonds the polyimide film to form an insulating material. The material exhibits excellent heat resistance, mechanical properties, and electrical properties. Furthermore, the preparation method is simple and has broad application in the field of high-temperature-resistant motors. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a photograph of the mica tape obtained in Example 5.

[0024] Figure 2 This is a photograph of the mica tape obtained in Example 5.

[0025] Figure 3 1-2 is a comparison chart of the thermal conductivity and bonding strength of the adhesive layers obtained in Example 5 and Comparative Examples 1-2.

[0026] Figure 4 1-2 is a comparison chart of the breakdown strength of the adhesive layers obtained in Example 5 and Comparative Examples 1-2.

[0027] Figure 5 This is a comparison chart of the tensile strength and thermal conductivity of the mica tapes obtained in Example 5 and Comparative Examples 1-2.

[0028] Figure 6 This is a comparison chart of the heat resistance index and breakdown voltage of the mica tapes obtained in Example 5 and Comparative Examples 1-2. DETAILED DESCRIPTION

[0029] The present invention will be further explained below with reference to specific embodiments.

[0030] The non-calcined muscovite paper used below was purchased from a muscovite technology company in Tongcheng County. The model number is 507, the thickness is 0.08 mm, and the unit area mass is 160 g / m 2The polyimide film used below was purchased from Suzhou Simeng Electronic Materials Co., Ltd., with a unit area mass of 35g / m 2 The silicon carbide whiskers used below have a diameter of 60 nm and an aspect ratio of 20:1. The viscosity-average molecular weight of the α,ω-dihydroxypolydimethylsiloxane used below is 2000. Example 1

[0031] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0032] The adhesive layer is made by coating the surface of non-calcined muscovite paper with an adhesive, and the coating amount is 30g / m 2 .

[0033] The raw materials of the adhesive include: 200g of E44 epoxy resin, 10g of terminal hydroxyl polydiphenylsiloxane, 10g of α,ω-dihydroxy polydimethylsiloxane, 10g of aluminum acetylacetonate, 10g of silicon carbide whiskers, 10g of nano-graphene oxide, 10g of boron nitride nanosheets, and 10g of dicyclohexylmethane diisocyanate.

[0034] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 300 g of toluene, refluxing at 110°C for 1 h, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 120°C for 2 h, cooling, standing, and washing the lower precipitate with toluene once to obtain pretreated graphene; adding pretreated graphene, E44 epoxy resin, and terminal hydroxyl polydiphenylsiloxane to 1000 g of toluene, stirring at 120°C for 2 h under nitrogen protection, cooling to 40°C, adding α,ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers, stirring for 10 min, heating to 120°C, stirring for 5 min, and cooling to room temperature.

[0035] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 150° C. for 4 hours. Example 2

[0036] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0037] The adhesive layer is made by coating the surface of non-calcined muscovite paper with an adhesive, and the coating amount is 40g / m 2 .

[0038] The raw materials of the adhesive include: 400g E44 epoxy resin, 60g terminal hydroxyl polydiphenylsiloxane, 100g α,ω-dihydroxy polydimethylsiloxane, 50g aluminum acetylacetonate, 30g silicon carbide whiskers, 20g nano-graphene oxide, 20g boron nitride nanosheets, and 50g dicyclohexylmethane diisocyanate.

[0039] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 600 g of toluene, refluxing at 120 ° C for 2 h, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 140 ° C for 6 h, cooling, standing, and washing the lower precipitate with toluene three times to obtain pretreated graphene; adding pretreated graphene, E44 epoxy resin, and end-hydroxy polydiphenylsiloxane to 2000 g of toluene, stirring at 140 ° C for 4 h under nitrogen protection, cooling to 50 ° C, adding α, ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers and stirring for 20 min, heating to 140 ° C and stirring for 15 min, and then cooling to room temperature.

[0040] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 160° C. for 6 hours. Example 3

[0041] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0042] The adhesive layer is coated on the surface of the non-calcined muscovite paper with an adhesive coating amount of 37 g / m 2 .

[0043] The raw materials of the adhesive include: 250g of E44 epoxy resin, 50g of terminal hydroxyl polydiphenylsiloxane, 30g of α,ω-dihydroxy polydimethylsiloxane, 40g of aluminum acetylacetonate, 15g of silicon carbide whiskers, 17g of nano-graphene oxide, 13g of boron nitride nanosheets, and 40g of dicyclohexylmethane diisocyanate.

[0044] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 400 g of toluene, refluxing at 118°C for 80 min, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 135°C for 3 h, cooling, standing, and washing the lower precipitate twice with toluene to obtain pretreated graphene; adding pretreated graphene, E44 epoxy resin, and terminal hydroxyl polydiphenylsiloxane to 1800 g of toluene, stirring at 125°C for 3.5 h under nitrogen protection, cooling to 42°C, adding α,ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers and stirring for 17 min, heating to 125°C and stirring for 12 min, and then cooling to room temperature.

[0045] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 152° C. for 5.5 hours. Example 4

[0046] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0047] The adhesive layer is made by coating the adhesive on the surface of non-calcined muscovite paper, with a coating amount of 37g / m 2 .

[0048] The raw materials of the adhesive include: 350g E44 epoxy resin, 20g terminal hydroxyl polydiphenylsiloxane, 70g α,ω-dihydroxy polydimethylsiloxane, 20g aluminum acetylacetonate, 25g silicon carbide whiskers, 13g nano-graphene oxide, 17g boron nitride nanosheets, and 20g dicyclohexylmethane diisocyanate.

[0049] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 500 g of toluene, refluxing at 112°C for 100 min, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 125°C for 5 h, cooling, standing, and washing the lower precipitate twice with toluene to obtain pretreated graphene; adding pretreated graphene, E44 epoxy resin, and terminal hydroxyl polydiphenylsiloxane to 1200 g of toluene, stirring at 135°C for 2.5 h under nitrogen protection, cooling to 48°C, adding α,ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers, stirring for 13 min, heating to 135°C, stirring for 8 min, and cooling to room temperature.

[0050] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 158° C. for 4.5 hours. Example 5

[0051] A high-performance composite mica tape comprises: a non-calcined muscovite mica paper, an adhesive layer attached to one side of the non-calcined muscovite mica paper, and a polyimide film attached to one side of the adhesive layer. Figure 1 and Figure 2 shown.

[0052] The adhesive layer is made by coating the surface of non-calcined muscovite paper with an adhesive, and the coating amount is 35g / m 2 .

[0053] The raw materials of the adhesive include: 300g E44 epoxy resin, 30g terminal hydroxyl polydiphenylsiloxane, 50g α,ω-dihydroxy polydimethylsiloxane, 30g aluminum acetylacetonate, 20g silicon carbide whiskers, 15g nano-graphene oxide, 15g boron nitride nanosheets, and 30g dicyclohexylmethane diisocyanate.

[0054] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 450 g of toluene, refluxing at 115 ° C for 90 min, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 130 ° C for 4 h, cooling, standing, and washing the lower precipitate twice with toluene to obtain pretreated graphene; adding pretreated graphene, E44 epoxy resin, and terminal hydroxyl polydiphenylsiloxane to 1500 g of toluene, stirring at 130 ° C for 3 h under nitrogen protection, cooling to 45 ° C, adding α, ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers and stirring for 15 min, heating to 130 ° C and stirring for 10 min, and then cooling to room temperature.

[0055] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 155° C. for 5 hours.

[0056] Comparative Example 1

[0057] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0058] The adhesive layer is made by coating the surface of non-calcined muscovite paper with an adhesive, and the coating amount is 35g / m 2 .

[0059] The raw materials of the adhesive include: 300g of E44 epoxy resin, 30g of terminal hydroxyl polydiphenylsiloxane, 50g of α,ω-dihydroxy polydimethylsiloxane, 30g of aluminum acetylacetonate, 20g of silicon carbide whiskers, 30g of nano-graphene oxide, and 30g of boron nitride nanosheets.

[0060] The adhesive was prepared by the following steps: adding nano-graphene oxide and boron nitride nanosheets to 450 g of toluene and mixing evenly, cooling, and standing, and washing the lower precipitate with toluene twice to obtain pretreated graphene; adding the pretreated graphene, E44 epoxy resin, and terminal hydroxyl polydiphenylsiloxane to 1500 g of toluene, stirring at 130°C for 3 h under nitrogen protection, cooling to 45°C, adding α,ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers and stirring for 15 min, heating to 130°C and stirring for 10 min, and then cooling to room temperature.

[0061] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 155° C. for 5 hours.

[0062] Comparative Example 2

[0063] A high-performance composite mica tape comprises: non-calcined muscovite paper, an adhesive layer adhered to one side of the non-calcined muscovite paper, and a polyimide film adhered to one side of the adhesive layer.

[0064] The adhesive layer is made by coating the surface of non-calcined muscovite paper with an adhesive, and the coating amount is 35g / m 2 .

[0065] The raw materials of the adhesive include: 300g E44 epoxy resin, 30g terminal hydroxyl polydiphenylsiloxane, 50g α,ω-dihydroxy polydimethylsiloxane, 30g aluminum acetylacetonate, 20g silicon carbide whiskers, 15g nano-graphene oxide, 15g boron nitride nanosheets, and 30g dicyclohexylmethane diisocyanate.

[0066] The adhesive was prepared by the following steps: adding nano-graphene oxide to 450 g of toluene, refluxing at 115 ° C for 90 min, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing at 130 ° C for 4 h, cooling, standing, and washing the lower precipitate with toluene twice to obtain pretreated graphene; adding pretreated graphene, boron nitride nanosheets, E44 epoxy resin, and end-hydroxy polydiphenylsiloxane to 1500 g of toluene, stirring at 130 ° C for 3 h under nitrogen protection, cooling to 45 ° C, adding α, ω-dihydroxy polydimethylsiloxane, aluminum acetylacetonate, and silicon carbide whiskers and stirring for 15 min, heating to 130 ° C and stirring for 10 min, and then cooling to room temperature.

[0067] The preparation method of the high-performance composite mica tape comprises the following steps: laminating an adhesive layer to one side of mica paper, laminating a polyimide film to one side of the adhesive layer, removing the solvent, and curing at 155° C. for 5 hours.

[0068] The adhesive layers obtained in Example 5 and Comparative Examples 1-2 were attached to one side of the mica paper and allowed to stand for 30 minutes. The peel strength of each group was measured according to Method 2 in GB / T2792-2014 "Test Method for Peel Strength of Adhesive Tapes".

[0069] like Figure 3 As shown, the peeling strength of the adhesive layer obtained in Example 5 is the highest, which is better than that of Comparative Examples 1-2 (P < 0.05).

[0070] The adhesive layers obtained in Example 5 and Comparative Examples 1-2 were applied to a glass plate, dried with hot air to remove toluene, cured at 155°C for 5 hours, and then peeled off. The thermal conductivity of each adhesive layer was measured using the heat flow method according to ASTM E1530-25. The breakdown strength of each adhesive layer was also measured according to IEC 60243-1:2013, "Electrical strength test methods for insulating materials - Part 1: Industrial frequency tests."

[0071] like Figure 4 As shown, the thermal conductivity and breakdown strength of the adhesive layer obtained in Example 5 are the highest, which are better than those of Comparative Examples 1-2 (P < 0.05).

[0072] The tensile strength of the mica tapes obtained in Example 5 and Comparative Examples 1-2 was measured with reference to GB / T 5019.2-2009, "Mica-based insulating materials - Part 2: Test methods." The thermal conductivity of the mica tapes obtained in Example 5 and Comparative Examples 1-2 was measured using the heat flow method with reference to ASTM E1530-25. The heat resistance index of the mica tapes obtained in Example 5 and Comparative Examples 1-2 was measured with reference to IEC 60085:2007. The breakdown voltage of the mica tapes obtained in Example 5 and Comparative Examples 1-2 was measured with reference to GB / T 1408.1-2016, "Electrical strength test methods for insulating materials - Part 1: Power frequency tests."

[0073] like Figure 5 and Figure 6 As shown, the tensile strength, thermal conductivity, heat resistance index and breakdown voltage of the mica tape obtained in Example 5 are the highest, which are better than those of Comparative Examples 1-2 (P < 0.05).

[0074] The reason for these results is that the present invention utilizes the surface hydroxyl and carboxyl groups of graphene oxide to combine with dicyclohexylmethane diisocyanate, which is then combined with boron nitride nanosheets to coat and bind an organic film layer on the particle surface, creating significant steric hindrance and effectively reducing nanoparticle agglomeration. The graphene oxide and boron nitride nanosheets form a three-dimensional thermally conductive network, significantly enhancing thermal conductivity. Furthermore, the present invention utilizes the epoxy ring-opening reaction of pretreated graphene with epoxy resin, allowing the silanols of organosilanols to participate in the condensation, effectively enhancing the interaction between the organic and inorganic phases. The product exhibits excellent high-temperature resistance and mechanical properties. The present invention combines mica paper with polyimide film through an adhesive layer, achieving high bond strength and effectively improving the stability of the mica tape during use. The present invention utilizes α,ω-dihydroxypolydimethylsiloxane coordinated with aluminum acetylacetonate via its terminal hydroxyl groups, while silicon carbide whiskers bond to the resin matrix via their surface silanol groups. Together with the pretreated graphene, this creates an anisotropic thermally conductive system, significantly improving the system's thermal conductivity.

[0075] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. An adhesive for mica tape, characterized in that: The raw materials include, by mass, 20-40 parts of epoxy resin, 5-15 parts of organosilanol, 1-10 parts of α,ω-dihydroxypolydimethylsiloxane, 1-5 parts of crosslinking agent, 1-3 parts of silicon carbide whiskers, 1-2 parts of nano-graphene oxide, 1-2 parts of boron nitride nanosheets, and 1-5 parts of dicyclohexylmethane diisocyanate; The preparation method of the adhesive for mica tape comprises the following steps: adding nano-graphene oxide and boron nitride nanosheets to toluene, refluxing and dehydrating at 110-120° C. for 1-2 hours, adding dicyclohexylmethane diisocyanate under nitrogen protection, refluxing and reacting at 120-140° C. for 2-6 hours, cooling, standing, and washing to obtain pretreated graphene; adding the pretreated graphene, epoxy resin, and organosilanol to toluene, stirring at 120-140° C. for 2-4 hours under nitrogen protection, cooling to 40-50° C., adding α,ω-dihydroxypolydimethylsiloxane, a crosslinking agent, and silicon carbide whiskers, stirring for 10-20 minutes, heating to 120-140° C., stirring for 5-15 minutes, and cooling to room temperature.

2. The adhesive for mica tape according to claim 1, characterized in that: The type of epoxy resin is E44.

3. The adhesive for mica tape according to claim 1, characterized in that: The viscosity average molecular weight of α,ω-dihydroxypolydimethylsiloxane is 1500-2500.

4. The adhesive for mica tape according to claim 1, characterized in that: The crosslinking agent is aluminum acetylacetonate.

5. The adhesive for mica tape according to claim 1, characterized in that: The diameter of silicon carbide whiskers is 50-80nm, and the aspect ratio is 15-25:

1.

6. A method for preparing the adhesive for mica tape according to any one of claims 1 to 5, characterized in that: The steps include: Add nano-graphene oxide and boron nitride nanosheets to toluene, reflux and dehydrate at 110-120°C for 1-2 hours, add dicyclohexylmethane diisocyanate under nitrogen protection, reflux and react at 120-140°C for 2-6 hours, cool, stand, and wash to obtain pretreated graphene; add pretreated graphene, epoxy resin, and organosilanol to toluene, stir at 120-140°C for 2-4 hours under nitrogen protection, cool to 40-50°C, add α,ω-dihydroxypolydimethylsiloxane, crosslinking agent, and silicon carbide whiskers, stir for 10-20 minutes, heat to 120-140°C, stir for 5-15 minutes, and cool to room temperature.

7. A high performance composite mica tape, characterized in that: include: Mica paper, an adhesive layer made of the adhesive according to any one of claims 1 to 5 attached to one side of the mica paper, and a polyimide film attached to one side of the adhesive layer.

8. The high-performance composite mica tape according to claim 7, characterized in that: The unit area mass of mica paper is 145-165g / m 2 .

9. The high-performance composite mica tape according to claim 7, characterized in that: The unit area mass of polyimide film is 31-38g / m 2 .

10. A method for preparing the high-performance composite mica tape according to any one of claims 7 to 9, characterized in that: The method comprises the following steps: laminating an adhesive layer on one side of mica paper, laminating a polyimide film on one side of the adhesive layer, removing the solvent, and curing at 150-160° C. for 4-6 hours.

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