Solder ball detection light source system

By integrating the central control module and multi-spectral irradiation technology, the existing solder ball detection methods are solved, and efficient and accurate solder ball detection is achieved, adapting to different specifications and environments, supporting remote operation and data transmission, and convenient for intelligent management.

CN120558968APending Publication Date: 2025-08-29DONGGUAN CO ROBOT INTELLIGENT EQUIP TECH CO LTD
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Patent Information

Application Number
CN202510774875.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-11
Publication Date
2025-08-29

AI Technical Summary

Technical Problem

The existing solder ball detection methods are inefficient and are easily affected by subjective factors. The detection accuracy of automation equipment in the light source system is insufficient and cannot adapt to the detection of different specifications of solder balls. The adaptability of complex environments and data transmission convenience are insufficient, and the defect identification is inaccurate.

Method used

A hot ball detection light source system is designed, integrating a central control module, intelligent dimming module, defect identification module, temperature and humidity adjustment module, wireless communication module and mechanical adjustment mechanism. It adopts multi-spectral illumination and deep learning algorithms to realize automatic light source adjustment and defect recognition, supports multi-protocol wireless transmission, and adapts to different environments and specifications of hot ball detection.

Benefits of technology

It improves detection efficiency and accuracy, reduces misjudgment and missed judgments, reduces maintenance costs, ensures stable and consistent detection results, supports remote operation and intelligent management, and enhances the adaptability of the equipment's complex environment and data transmission convenience.

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Abstract

The invention discloses a solder ball detection light source system, which comprises a central control module, an intelligent dimming module, a defect identification module, a temperature and humidity adjustment module, a wireless communication module, a mechanical adjustment mechanism and a man-machine interaction interface, and is characterized in that the central control module comprises a main control unit, a numerical control storage unit and a man-machine interaction unit; and the output end of the main control unit is unidirectionally and electrically connected with a numerical control storage unit and a man-machine interaction unit. Light source brightness and color temperature are automatically adjusted based on image feedback, different environments and solder ball materials are adapted, image quality is guaranteed, misjudgment and missed judgment are reduced, light source modules are detachable, replaceable and combined according to needs, detection of solder balls of different specifications is adapted, maintenance cost is reduced, the service life of equipment is prolonged, a deep learning algorithm is integrated, and detection efficiency is improved. Various defects are quickly and accurately identified and classified, the product quality is strictly controlled, the temperature and humidity adjusting module monitors and regulates the environment in real time, interference of environmental factors is avoided, and it is ensured that the detection result is stable and consistent.
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic component detection, and in particular to a solder ball detection light source system. Background Art

[0002] Tin balls are a type of spherical soldering material widely used in the field of electronic manufacturing. They are usually made of tin (Sn) as a base, with other metal elements added to form an alloy material, and are made into regular spheres through a specific process. They are mainly used to achieve electrical connection and mechanical fixation between electronic components and circuit boards. During the soldering process, the tin balls are melted by heat and filled between the component pins and the circuit board pads by capillary action. After cooling and solidification, they form a reliable connection, thereby ensuring the stability of signal transmission and the firmness of the structure of electronic products. Common tin balls include lead-containing tin balls (such as Sn-Pb alloy) and lead-free tin balls (such as Sn-Ag-Cu alloy). They come in various sizes and specifications, with diameters generally ranging from 0.25mm to 1.0mm to meet the assembly needs of different electronic products.

[0003] Traditional solder ball inspection methods, such as manual visual inspection, are inefficient and easily affected by subjective factors. Some existing automated inspection equipment has problems with its light source system, such as insufficient detection accuracy, unreasonable light source distribution, and inability to adapt to the inspection of solder balls of different specifications. These problems make it difficult to meet the demand for high-quality solder ball inspection in modern electronic manufacturing. At the same time, existing systems also have room for improvement in terms of adaptability to complex environments, convenient data transmission, and accurate defect identification. To this end, we propose a solder ball inspection light source system. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the purpose of the present invention is to provide a solder ball detection light source system with the advantage of high detection efficiency, which solves the problems of traditional solder ball detection methods, such as manual visual inspection, which are low in efficiency and easily affected by subjective factors; some existing automated detection equipment has problems in the light source system, such as insufficient detection accuracy, unreasonable light source distribution, and inability to adapt to the detection of solder balls of different specifications, which makes it difficult to meet the needs of modern electronic manufacturing for high-quality solder ball detection. At the same time, the existing system also has room for improvement in terms of adaptability to complex environments, convenient data transmission, and accurate defect identification.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: A solder ball detection light source system, comprising a central control module, an intelligent dimming module, a defect recognition module, a temperature and humidity adjustment module, a wireless communication module, a mechanical adjustment mechanism and a human-computer interaction interface, wherein the central control module comprises a main control unit, a numerical control storage unit and a human-computer interaction unit, wherein the output end of the main control unit is unidirectionally electrically connected to the numerical control storage unit and the human-computer interaction unit, the intelligent dimming module comprises an image analysis unit, the input end of the image analysis unit is unidirectionally electrically connected to the main control unit, and the output end of the image analysis unit is unidirectionally electrically connected to the dimming control unit, the defect recognition module comprises a data storage unit, and the data storage unit is bidirectionally electrically connected to the main control unit, the wireless communication module comprises a Bluetooth communication unit and a WIFI communication unit, and the Bluetooth communication unit and the WIFI communication unit are bidirectionally electrically connected to the main control unit, the mechanical adjustment mechanism comprises a rotating bracket and a telescopic bracket, the output ends of the rotating bracket and the telescopic bracket are unidirectionally electrically connected to the main control unit, and the output end of the mechanical adjustment mechanism is unidirectionally electrically connected to the image acquisition module and the light source module.

[0006] Preferably, the human-computer interaction interface includes a parameter input panel, an output end of the parameter input panel is unidirectionally electrically connected to a Bluetooth communication unit and a WIFI communication unit, and an output end of the parameter input panel is unidirectionally electrically connected to a test result display area.

[0007] Preferably, the temperature and humidity adjustment module includes a temperature sensor, and the output end of the temperature sensor is unidirectionally electrically connected to a heating device, a refrigeration device, a humidifying device and a dehumidifying device.

[0008] Preferably, the light source module includes a ring-shaped multi-angle LED light source module, a strip-shaped backlight source module and a dynamic focusing light source module, and the image acquisition module includes an industrial camera, and the shooting angle and position of the industrial camera are adjustable.

[0009] Preferably, the annular multi-angle LED light source module includes a plurality of LED light groups distributed in a ring shape, the illumination angle of each LED light group is adjustable, and each LED light group includes a plurality of LED lights of different wavelengths, thereby being able to realize multi-spectrum illumination.

[0010] Preferably, the strip-shaped backlight module uses an LED light strip with high brightness and good uniformity, and the length of the LED light strip can be adjusted according to detection requirements.

[0011] Preferably, the dynamic focusing light source module drives the optical lens group to move via a motor, thereby adjusting the light source focus point and the irradiation range.

[0012] Preferably, the mechanical adjustment mechanism includes a plurality of rotatable and retractable brackets, and position and angle adjustment is achieved by adjusting the brackets.

[0013] Compared with the prior art, the present invention provides a solder ball detection light source system with the following beneficial effects:

[0014] The present invention automatically adjusts the brightness and color temperature of the light source based on image feedback, adapts to different environments and solder ball materials, ensures image quality, and reduces misjudgments and missed judgments. Each light source module is detachable and replaceable and can be combined as needed to adapt to the detection of solder balls of different specifications, reduce maintenance costs, and extend equipment life. It integrates deep learning algorithms to quickly and accurately identify various defects and classify and grade them, strictly control product quality, and the temperature and humidity adjustment module monitors and controls the environment in real time to avoid interference from environmental factors and ensure stable and consistent detection results. It automatically focuses according to the size and position of the solder ball, concentrates the light on the detection area, enhances high-precision detection capabilities, supports multi-protocol wireless transmission and remote control, facilitates real-time data viewing, remote operation, and realizes intelligent management. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the principle diagram of the core control system of the present invention;

[0016] Figure 2 This is a schematic diagram of the light source acquisition system of the present invention;

[0017] Figure 3 This is a schematic diagram of the human-computer interaction system of the present invention;

[0018] Figure 4 This is a schematic diagram of the temperature and humidity control system of the present invention. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0021] See also Figures 1 to 4As shown, the present invention provides a solder ball detection light source system, including a central control module, an intelligent dimming module, a defect recognition module, a temperature and humidity adjustment module, a wireless communication module, a mechanical adjustment mechanism and a human-computer interaction interface. The central control module includes a main control unit, a numerical control storage unit and a human-computer interaction unit. The output end of the main control unit is unidirectionally electrically connected to the numerical control storage unit and the human-computer interaction unit. The intelligent dimming module includes an image analysis unit. The input end of the image analysis unit is unidirectionally electrically connected to the main control unit. The output end of the image analysis unit is unidirectionally electrically connected to the dimming control unit. The defect recognition module includes a data storage unit. The data storage unit is bidirectionally electrically connected to the main control unit. The wireless communication module includes a Bluetooth communication unit and a WIFI communication unit. The Bluetooth communication unit and the WIFI communication unit are bidirectionally electrically connected to the main control unit. The mechanical adjustment mechanism includes a rotating bracket and a telescopic bracket. The output ends of the rotating bracket and the telescopic bracket are unidirectionally electrically connected to the main control unit. The output end of the mechanical adjustment mechanism is unidirectionally electrically connected to the image acquisition module and the light source module.

[0022] The human-computer interaction interface includes a parameter input panel, an output end of which is unidirectionally electrically connected to a Bluetooth communication unit and a WIFI communication unit, and an output end of which is unidirectionally electrically connected to a test result display area.

[0023] The temperature and humidity adjustment module includes a temperature sensor, and the output end of the temperature sensor is unidirectionally electrically connected to a heating device, a refrigeration device, a humidifying device and a dehumidifying device.

[0024] The light source module includes a ring-shaped multi-angle LED light source module, a strip backlight module and a dynamic focusing light source module. The image acquisition module includes an industrial camera, and the shooting angle and position of the industrial camera are adjustable.

[0025] The annular multi-angle LED light source module includes multiple LED light groups distributed in a ring shape. The illumination angle of each LED light group is adjustable. Each LED light group includes multiple LED lights of different wavelengths, which can achieve multi-spectrum illumination.

[0026] The strip backlight module uses high-brightness and good uniformity LED light strips, and the length of the LED light strips can be adjusted according to detection requirements.

[0027] The dynamic focusing light source module drives the optical lens group to move through a motor to adjust the light source focus point and illumination range.

[0028] The mechanical adjustment mechanism includes a plurality of rotatable and retractable brackets, and position and angle adjustment can be achieved by adjusting the brackets.

[0029] Working Principle: The solder balls to be tested are placed on the testing platform. First, the temperature and humidity sensors of the temperature and humidity control module monitor the ambient temperature and humidity in real time. If the temperature and humidity do not meet the preset standards, the temperature and humidity control module automatically activates the corresponding device for adjustment. The mechanical adjustment mechanism adjusts the position and angle of the annular multi-angle LED light source module, the bar backlight module, the dynamic focus light source module, and the image acquisition module to achieve the optimal detection state. The intelligent dimming module first controls the emission of the annular multi-angle LED light source module, the bar backlight module, and the dynamic focus light source module using default parameters. The image acquisition module captures the solder ball image and transmits it to the central control module.

[0030] The central control module sends the image data to the image analysis unit and defect recognition module of the intelligent dimming module. The image analysis unit analyzes the image. If it finds problems such as uneven image brightness or unclear details, the dimming control unit generates corresponding dimming control signals to adjust the brightness, color temperature and other parameters of the ring multi-angle LED light source module, strip backlight module, and dynamic focus light source module to achieve optimal image quality. The defect recognition module uses a deep learning algorithm to analyze the image, identify various defects in the solder balls, and feed back the defect information to the central control module.

[0031] The central control module processes and analyzes the image, and based on the defect recognition results, determines whether the solder balls have defects and whether their dimensions meet the requirements, and stores the test results in the data storage unit. At the same time, users can view the test results and enter new test parameters through the human-computer interaction interface. In addition, the wireless communication module can transmit the test data to external devices in real time, and users can also remotely control the system through external devices, such as adjusting test parameters and starting or stopping testing.

[0032] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also equivalent structures. Other replacements, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0033] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (i.e., those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A solder ball inspection light source system, comprising a central control module, an intelligent dimming module, a defect recognition module, a temperature and humidity adjustment module, a wireless communication module, a mechanical adjustment mechanism, and a human-computer interaction interface, characterized in that: The central control module includes a main control unit, a numerical control storage unit and a human-computer interaction unit. The output end of the main control unit is unidirectionally electrically connected to the numerical control storage unit and the human-computer interaction unit. The intelligent dimming module includes an image analysis unit. The input end of the image analysis unit is unidirectionally electrically connected to the main control unit. The output end of the image analysis unit is unidirectionally electrically connected to the dimming control unit. The defect recognition module includes a data storage unit. The data storage unit is bidirectionally electrically connected to the main control unit. The wireless communication module includes a Bluetooth communication unit and a WIFI communication unit. The Bluetooth communication unit and the WIFI communication unit are bidirectionally electrically connected to the main control unit. The mechanical adjustment mechanism includes a rotating bracket and a telescopic bracket. The output ends of the rotating bracket and the telescopic bracket are unidirectionally electrically connected to the main control unit. The output end of the mechanical adjustment mechanism is unidirectionally electrically connected to the image acquisition module and the light source module.

2. The solder ball detection light source system according to claim 1, characterized in that: The human-computer interaction interface includes a parameter input panel, an output end of the parameter input panel is unidirectionally electrically connected to a Bluetooth communication unit and a WIFI communication unit, and an output end of the parameter input panel is unidirectionally electrically connected to a test result display area.

3. The solder ball detection light source system according to claim 1, characterized in that: The temperature and humidity adjustment module includes a temperature sensor, and an output end of the temperature sensor is unidirectionally electrically connected to a heating device, a refrigeration device, a humidifying device, and a dehumidifying device.

4. The solder ball detection light source system according to claim 1, characterized in that: The light source module includes a ring-shaped multi-angle LED light source module, a strip-shaped backlight source module and a dynamic focusing light source module. The image acquisition module includes an industrial camera, and the shooting angle and position of the industrial camera are adjustable.

5. The solder ball detection light source system according to claim 4, characterized in that: The annular multi-angle LED light source module includes multiple LED light groups distributed in a ring shape. The illumination angle of each LED light group is adjustable. Each LED light group includes multiple LED lights of different wavelengths, which can achieve multi-spectrum illumination.

6. The solder ball detection light source system according to claim 1, characterized in that: The strip-shaped backlight module adopts a high-brightness, good-uniformity LED light strip, and the length of the LED light strip can be adjusted according to detection requirements.

7. The solder ball detection light source system according to claim 1, characterized in that: The dynamic focusing light source module drives the optical lens group to move via a motor, thereby adjusting the light source focus point and the irradiation range.

8. The solder ball detection light source system according to claim 1, characterized in that: The mechanical adjustment mechanism includes a plurality of rotatable and telescopic brackets, and position and angle adjustment can be achieved through adjustment of the brackets.