Signal acquisition assembly and battery

Abstract

The invention relates to a signal acquisition assembly and a battery. The signal acquisition assembly comprises a signal acquisition board and a mounting structure. The signal acquisition board comprises a voltage acquisition part and a temperature acquisition part which are spaced in the thickness direction of the signal acquisition board to form an acquisition space. The collection space is used for containing the confluence piece. The installation structure comprises a first installation part and a second installation part which are matched so that the installation structure can be detachably assembled on the convergence part. And when the mounting structure is in a state of being capable of being assembled with the confluence piece, the first mounting piece and the second mounting piece are pressed on two opposite sides of the voltage acquisition part and the temperature acquisition part respectively, so that the voltage acquisition part and the temperature acquisition part are attached to the confluence piece when the mounting structure is assembled with the confluence piece. According to the technical scheme of the invention, the installation and replacement of the temperature acquisition part and the voltage acquisition part can be simplified, and the space utilization rate and the assembly efficiency are improved through voltage and temperature acquisition integration.

Description

Technical Field

[0001] This application relates to the field of battery technology, in particular to signal acquisition components and batteries. Background Art

[0002] Batteries typically consist of multiple battery cells and a busbar, which electrically connects the terminals of the multiple cells. The battery voltage signal is typically collected by welding the voltage acquisition unit to the busbar, while the battery temperature signal is typically collected by gluing the temperature acquisition unit to the top cover or busbar of the battery cells. If both the voltage and temperature acquisition units become damaged and need to be replaced, the welding or gluing method used to secure them makes it difficult to separate them from the busbar or top cover. Summary of the Invention

[0003] Based on this, it is necessary to provide a signal acquisition component and a battery to address the problem that the voltage acquisition unit and the temperature acquisition unit are difficult to replace.

[0004] In a first aspect, the present application provides a signal acquisition assembly for a battery, wherein the battery includes a busbar connected to a terminal thereof; the signal acquisition assembly includes: A signal acquisition board, comprising a voltage acquisition portion and a temperature acquisition portion, the two being spaced apart in the thickness direction of the signal acquisition board to form a collection space, the collection space being used to accommodate the current collector; The mounting structure includes a first mounting member and a second mounting member, which cooperate to enable the mounting structure to be detachably assembled on the manifold; When the mounting structure is in a state capable of being assembled with the busbar, the first mounting member and the second mounting member are respectively pressed on opposite sides of the voltage collecting portion and the temperature collecting portion, so that when assembled with the busbar, the voltage collecting portion and the temperature collecting portion are in contact with the busbar.

[0005] In some embodiments, the first mounting member is provided with a first clamping portion, the second mounting member is provided with a second clamping portion, and at least one of the first clamping portion and the second clamping portion passes through the collection space and is detachably clamped with the other; The voltage collecting portion is provided with a first avoidance position for avoiding the first clamping portion, and the temperature collecting portion is provided with a second avoidance position for avoiding the second clamping portion.

[0006] In some embodiments, one of the first clamping portion and the second clamping portion includes a buckle, and the other includes a through-set bayonet, the buckle is clamped in the bayonet, and passes through the first avoidance position, the collection space, and the second avoidance position.

[0007] In some embodiments, the buckle includes a connected extension portion and a hook portion bent and connected to one end of the extension portion. The extension portion is provided with a bayonet, the hook portion extends out of the bayonet, and is pressed against the end of the first mounting member or the second mounting member where the bayonet is located, facing away from the collection space.

[0008] In some embodiments, the hook portion is fixedly connected to the extension portion, the inner diameter of the bayonet is larger than the outer diameter of the extension portion. There are multiple buckles, the hook portions of each buckle are bent back to back, and the extension portion of each buckle is configured to elastically deform and close when squeezed by external force.

[0009] In some embodiments, the mounting structure includes an elastic pad, and the elastic pad is clamped between the first mounting member and the voltage collecting portion.

[0010] In some embodiments, an end of the first mounting member facing the voltage collecting portion is concavely formed with a mounting groove, and the elastic pad is partially embedded in the mounting groove.

[0011] In some embodiments, the voltage collection portion includes an electrical connection area exposed in the collection space, and the electrical connection area is used to be attached to a current collector located in the collection space; Along the thickness direction, the projection of the electrical connection area is located within the projection range of the elastic pad.

[0012] In some embodiments, a glue potting space is provided on the second mounting member, the temperature acquisition unit includes a temperature sensor located in the glue potting space, and the glue potting space is filled with thermally conductive glue that wraps the temperature sensor.

[0013] In some embodiments, the signal acquisition board includes a welding portion, a first buffer portion, and a second buffer portion; The first buffer portion is connected to the voltage collecting portion and the welding portion, and the second buffer portion is connected to the temperature collecting portion and the welding portion; At least one of the first buffer portion and the second buffer portion is bent relative to the welding portion along the thickness direction away from the other, so that the first buffer portion and the second buffer portion are spaced apart in the thickness direction; The signal acquisition component includes a main circuit board, and the welding portion is welded to the main circuit board.

[0014] In a second aspect, the present application provides a battery, comprising: A battery cell having a terminal; a busbar connected to the pole; In the signal acquisition component as described in any of the above embodiments, the busbar is inserted into the acquisition space, the voltage acquisition part is conductively connected to the busbar located in the acquisition space, and the temperature acquisition part is thermally connected to the busbar located in the acquisition space; the mounting structure is detachably assembled on the busbar via the cooperation of the first mounting part and the second mounting part.

[0015] In some embodiments, a through hole is provided on the conduit member and is located in the collection space. At least one of the first clamping portion of the first mounting member and the second clamping portion of the second mounting member passes through the through hole and is detachably clamped with the other.

[0016] In some embodiments, the current collector is recessed at at least one end in the thickness direction to form a positioning groove, and at least one of the voltage collecting portion and the temperature collecting portion is confined in the positioning groove.

[0017] Compared with the prior art, this application has the following beneficial effects: The aforementioned signal acquisition assembly and battery, with the help of the mounting structure, allows the voltage and temperature acquisition components to be pressed into contact with the busbar. When the temperature and voltage acquisition components need to be replaced, simply detaching the mounting structure from the busbar allows for easy separation of the voltage and temperature acquisition components from the busbar. This prevents weld or offset marks from being left on the busbar and damaging its surface structure, greatly simplifying the installation and replacement of the temperature and voltage acquisition components. Furthermore, the integrated design of the voltage and temperature acquisition components improves space utilization, saves space occupied by the voltage and temperature acquisition equipment, increases the battery's volumetric energy density and assembly efficiency, and reduces material and production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the drawings to represent the same components. In the drawings: Figure 1 FIG. 4 is a partial schematic diagram of a battery according to some embodiments.

[0019] Figure 2 Schematic diagram of the structure of the signal acquisition component of some embodiments.

[0020] Figure 3 sectional views of signal acquisition devices according to some embodiments.

[0021] Figure 4 for Figure 3 The diagram shows the coordination between the signal acquisition component and the busbar.

[0022] Figure 5 for Figure 4 Exploded schematic diagram of the structure shown.

[0023] Figure 6 Schematic diagram of the structure of the first mounting member in some embodiments.

[0024] Figure 7 Schematic diagram of the partial structure of the signal acquisition board in some embodiments.

[0025] Figure 8 is a perspective view of a signal acquisition assembly according to some embodiments.

[0026] The accompanying drawings in the specific implementation manner are as follows: 1000, battery; 100, signal acquisition component; 10, signal acquisition board; F, thickness direction; 10A, voltage acquisition part; A1, electrical connection area; A2, first avoidance position; 10B, temperature acquisition part; B1, temperature sensor; B2, second avoidance position; B3, temperature acquisition board; K, acquisition space; 10C, welding part; 10D, first buffer part; D1, arc-shaped sub-part; D2, deformation space; 10E, second buffer part; 11, insulating film layer; 11a, weak connection part; 12, conductive layer; 12a, fuse part; h1, voltage welding position; h2, temperature welding position; w 1. Hollow hole; w2, solder hole; L1, first conductive circuit; L2, second conductive circuit; L3, third conductive circuit; 20, mounting structure; 21, first mounting member; 21c, first clamping portion; c1, buckle; c11, extension portion; c12, hook; 21d, mounting groove; 22, second mounting member; 22e, second clamping portion; e1, bayonet; 22f, glue filling space; 22g, thermal conductive glue; 23, elastic pad; 23h, avoidance hole; 30, main circuit board; 200, busbar; 201, through hole; 202, positioning groove; 300, battery cell; 301, pole. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that, if any, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] Furthermore, if used, the terms "first" and "second," if present, are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connected," and "fixed" should be interpreted broadly. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0031] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0032] It should be noted that, if present, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0033] In order to solve the problem that the voltage acquisition unit and the temperature acquisition unit are difficult to replace, the embodiments of the present application provide a signal acquisition component and a battery.

[0034] For ease of understanding, the battery in the embodiment of the present application is first introduced.

[0035] Figure 1 This is a partial schematic diagram of a battery 1000 in some embodiments. Figure 1 The battery in the embodiment of the present application includes a battery cell 300, a busbar 200, and a signal acquisition assembly 100. The busbar 200 is electrically connected to the terminal 301 of the battery cell 300, and the signal acquisition assembly 100 is connected to the busbar 200. The signal acquisition assembly 100 collects signals such as voltage and temperature from the battery cell 300 through the busbar 200. The busbar 200 is conductive and is typically made of metal, such as aluminum or steel. The busbar 200 can be in the form of a thin plate.

[0036] The battery 1000 can be a battery pack or a battery module. When the battery 1000 is a battery pack, the battery pack also includes a battery management system (BMS) and multiple battery cells 300. The multiple battery cells 300 can be electrically connected in series, parallel, or a combination of series and parallel, and communicate with the battery management system through the signal acquisition component 100. The battery management system controls and monitors the operating status of each battery cell 300. In addition, the multiple battery cells 300 can also be first connected to the module management system through the signal acquisition component 100 to form a battery module. The multiple battery modules are then electrically connected in series, parallel, or a combination of series and parallel, and together with the battery management system, form a battery pack.

[0037] The battery cell 300 is the smallest unit in the battery 1000 that performs electrochemical reactions and can be either a secondary battery or a primary battery. The battery cell 300 can be, but is not limited to, a lithium-ion battery, a lithium-sulfur battery, a sodium-ion battery, or a magnesium-ion battery. The battery cell 300 can be cylindrical, flat, rectangular, or have other shapes.

[0038] In some embodiments, a battery cell 300 includes a housing, an end cap, and an electrode assembly. The housing and the end cap together form an interior space for accommodating the battery cell 300. Specifically, the housing may include a cavity with at least one end open. The end cap fits over the open end of the housing to seal the cavity, and the electrode assembly is loaded within the cavity. The housing may be, but is not limited to, a metal housing, such as aluminum or steel.

[0039] An electrode assembly typically includes a positive electrode sheet, a negative electrode sheet, and a separator separating the two. An electrolyte can be injected into the battery cell 300, which soaks into the electrode assembly, providing a pathway for ion migration for electrochemical reactions and acting as a conductor. Electrode assemblies can be wound or laminated, among other forms. One or more electrode assemblies can be housed within a battery cell 300.

[0040] The signal acquisition component 100 according to an embodiment of the present application is introduced below.

[0041] Figure 2 Schematic diagram of the structure of the signal acquisition component 100 in some embodiments. Figure 3 sectional views of signal acquisition devices according to some embodiments. Figure 4 for Figure 3 The diagram shows the cooperation between the signal acquisition component 100 and the busbar 200. Figure 5 for Figure 4 Exploded schematic diagram of the structure shown. Figure 6 Schematic diagram of the structure of the first mounting member 21 in some embodiments.

[0042] The signal acquisition assembly 100 in the embodiment of the present application is used for a battery 1000, and the battery 1000 includes a busbar 200 connected to its pole 301. Figure 2 and Figure 3The signal acquisition assembly 100 includes a signal acquisition board 10 and a mounting structure 20. The signal acquisition board 10 includes a voltage acquisition portion 10A and a temperature acquisition portion 10B, which are separated in the thickness direction F of the signal acquisition board 10 to form a collection space K. The collection space K is used to accommodate the busbar 200. The mounting structure 20 includes a first mounting member 21 and a second mounting member 22, which cooperate to enable the mounting structure 20 to be detachably assembled on the busbar 200. When the mounting structure 20 is in a state capable of being assembled with the busbar 200, the first mounting member 21 and the second mounting member 22 are respectively pressed onto opposite sides of the voltage acquisition portion 10A and the temperature acquisition portion 10B, so that when assembled with the busbar 200, the voltage acquisition portion 10A and the temperature acquisition portion 10B are in contact with the busbar 200. At the same time, integrating the voltage acquisition part 10A and the temperature acquisition part 10B through the mounting structure 20 can not only improve the assembly efficiency, but also improve the space utilization, save the space occupied by the temperature and voltage acquisition equipment, and thus improve the volume energy density of the battery 1000.

[0043] The busbar 200 is electrically connected (e.g., welded) to the terminal 301 of the battery cell 300. The voltage acquisition unit 10A is electrically connected to the busbar 200 of the battery 1000 to acquire the voltage signal of the battery cell 300. The temperature acquisition unit 10B is thermally connected to the busbar 200 to acquire the temperature signal of the battery cell 300.

[0044] The voltage acquisition part 10A and the temperature acquisition part 10B are arranged at intervals along the thickness direction F of the signal acquisition board 10 and form an acquisition space K, as shown in FIG. Figure 4 As shown, when the signal acquisition assembly 100 is matched with the current collector 200 , the current collector 200 passes through the acquisition space K. In a use state, the thickness direction F corresponds to the vertical direction.

[0045] The mounting structure 20 is removably mounted on the busbar 200 through the cooperation of a first mounting member 21 and a second mounting member 22. The first and second mounting members 21, 22 can be removably engaged in various ways, such as removable snap-fitting or removable threaded connection. When the mounting structure 20 is assembled with the busbar 200, the busbar 200 is located in the collection space K, with the first and second mounting members 21 and 22 engaged. The first mounting member 21 is located on the side of the voltage collection unit 10A facing away from the collection space K, and the second mounting member 22 is located on the side of the temperature collection unit 10B facing away from the collection space K. Together, the first mounting member 21 and the second mounting member 22 press the voltage and temperature collection units 10A and 10B against the busbar 200 in the collection space K, ensuring a tight fit between the voltage and temperature collection units 10A and 10B, thereby enabling the collection of voltage and temperature signals from the battery cells 300.

[0046] In actual application, when the temperature acquisition part 10B and / or the voltage acquisition part 10A are damaged and need to be replaced, the mounting structure 20 is disassembled from the busbar 200 by releasing the connection between the first mounting part 21 and the second mounting part 22. When the mounting structure 20 is detached, the pressure acting on the voltage acquisition part 10A and the temperature acquisition part 10B disappears, and the two can be easily detached from the busbar 200, and a new signal acquisition board 10 can be reinstalled subsequently.

[0047] In the signal acquisition assembly 100 of the present embodiment, the mounting structure 20 enables the voltage acquisition unit 10A and the temperature acquisition unit 10B to be in close contact with the busbar 200. Compared to the prior art, when the temperature acquisition unit 10B and the voltage acquisition unit 10A need to be replaced, the mounting structure 20 can be removed from the busbar 200 to easily separate the voltage acquisition unit 10A and the temperature acquisition unit 10B from the busbar 200. This does not leave weld or offset marks on the busbar 200 and damage the surface structure of the busbar 200, greatly simplifying the installation and replacement of the temperature acquisition unit 10B and the voltage acquisition unit 10A. Furthermore, the mounting structure 20 enables the voltage acquisition unit 10A and the temperature acquisition unit 10B to be installed or separated from the busbar 200 simultaneously, further improving assembly efficiency. In addition, the voltage collection part 10A and the temperature collection part 10B are arranged on both sides of the busbar 200. The voltage collection part 10A and the temperature collection part 10B can be set within a limited range of the busbar 200, avoiding the inability to set the voltage collection part 10A and the temperature collection part 10B at the same time due to insufficient length of the busbar 200, thereby improving space utilization. The length of the busbar 200 is the dimension along the extension direction of the main circuit board 30 of the signal acquisition component 100, or the stacking direction of multiple battery cells 300. See below for details.

[0048] There are various configuration options for the first mounting member 21 and the second mounting member 22. For example, each of the first mounting member 21 and the second mounting member 22 may include mounting plates, positioned on opposite sides of the voltage collection unit 10A and the temperature collection unit 10B, respectively. One mounting plate may have a threaded hole, and the other mounting plate may have bolts installed in the threaded holes, thereby clamping the two mounting plates to the busbar 200 and ensuring a tight fit between the voltage collection unit 10A and the temperature collection unit 10B. Of course, the mounting structure 20 may also be configured using the configurations described in the following embodiments.

[0049] In some embodiments, combined Figure 3 and Figure 4It is understood that the first mounting member 21 is provided with a first engaging portion 21c, and the second mounting member 22 is provided with a second engaging portion 22e. At least one of the first engaging portion 21c and the second engaging portion 22e extends through the collection space K and is removably engaged with the other. The voltage collection unit 10A is provided with a first avoidance position A2 that avoids the first engaging portion 21c, and the temperature collection unit 10B is provided with a second avoidance position B2 that avoids the second engaging portion 22e.

[0050] Understandably, when the first engaging portion 21c and / or the second engaging portion 22e penetrate the collection space K, they will not interfere with the current collector 200. For example, a hole or slot can be provided on the current collector 200 to allow for the first engaging portion 21c and / or the second engaging portion 22e to pass through. Alternatively, the current collector 200 can be smaller within the collection space K, thereby being offset from the first engaging portion 21c and / or the second engaging portion 22e.

[0051] The voltage acquisition unit 10A is provided with a first relief position A2 that provides clearance for the first engaging portion 21c, and the temperature acquisition unit 10B is provided with a second relief position B2 that provides clearance for the second engaging portion 22e. The first relief position A2 and the second relief position B2 can be relief structures such as holes or slots. It is understood that the first relief position A2 and the second relief position B2 are used to provide clearance for the first engaging portion 21c and the second engaging portion 22e so as not to interfere with their engagement. The term "relief" here encompasses both providing a passage for the object to be avoided and exposing the object to be avoided. In practice, the functions of the first relief position A2 and the second relief position B2 depend on the structures of the first engaging portion 21c and the second engaging portion 22e. For example, if the first engaging portion 21c is a post and the second engaging portion 22e is a hole for the post to be inserted, the first relief position A2 serves as a passage for the relief, while the second relief position B2 serves as an exposure for the object to be avoided. For another example, when the first clamping portion 21c and the second clamping portion 22e are both clamping columns, the first avoidance position A2 and the second avoidance position B2 both serve to allow the avoidance object to pass through.

[0052] In actual application, after the busbar 200 is inserted into the collection space K, the first clamping portion 21c and / or the second clamping portion 22e are circumvented by the first avoidance position A2 and the second avoidance position B2, and are connected through the collection space K, thereby realizing the assembly connection of the first mounting member 21 and the second mounting member 22 on the busbar 200, and pressing the voltage collection part 10A and the temperature collection part 10B on the busbar 200 in the collection space K.

[0053] At this point, the first and second mounting members 21 and 22 are removably connected via the first and second clamping portions 21c and 22e, simplifying operation. Furthermore, at least one of the first and second clamping portions 21c and 22e penetrates the collection space K and the avoidance areas provided on both the voltage and temperature collection units 10A and 10B. This allows the pressure exerted by the first and second mounting members 21 and 22 on the voltage and temperature collection units 10A and 10B to be concentrated in the area corresponding to the collection space K, ensuring a closer fit between the voltage and temperature collection units 10A and 10B and the busbar 200, improving electrical and thermal conductivity. Furthermore, the arrangement of the first and second clamping portions 21c and 22e within the collection space K makes the mounting structure 20 more compact.

[0054] In order to avoid electric leakage, the first mounting member 21 and the second mounting member 22 have insulating properties. Specifically, both can be made of insulating materials, and insulating coatings can be provided on the surfaces of both.

[0055] Specifically in the embodiment, refer to Figure 3 and Figure 4 At least one of the first clamping portion 21c and the second clamping portion 22e includes a buckle c1, and the other includes a through-set bayonet e1. The buckle c1 is clamped in the bayonet e1 and passes through the first avoidance position A2, the collection space K and the second avoidance position B2.

[0056] That is, a buckle c1 and / or a bayonet e1 may be provided on the first mounting member 21, and a buckle c1 and / or a bayonet e1 may be provided on the second mounting member 22. The buckle c1 of one of them passes through the first avoidance position A2, the collection device, and the second avoidance position B2, and is engaged with the bayonet e1 of the other.

[0057] At this time, the connection between the bayonet e1 and the buckle c1 can simplify the installation structure 20 and reduce the manufacturing cost.

[0058] In some embodiments, combined Figure 3 、 Figure 4 and Figure 6 It is understood that the buckle c1 includes a connected extension part c11 and a hook part c12 bent and connected to one end of the extension part c11. The extension part c11 passes through the bayonet e1, and the hook part c12 extends out of the bayonet e1 and is pressed against the end of the first mounting part 21 or the second mounting part 22 where the bayonet e1 is located, facing away from the collection space K.

[0059] For example, consider the buckle c1 on the first mounting member 21 and the bayonet e1 on the second mounting member 22. The extension c11 of the buckle c1 sequentially passes through the first clearance position A2, the collection space K, and the second clearance position B2 before extending into the bayonet e1. The hook c12 extends out of the bayonet e1 and presses against the end surface of the second mounting member 22 facing away from the collection space K. The second mounting member 22 and the first mounting member 21 now cooperate in the longitudinal direction, pressing the voltage collection unit 10A and the temperature collection unit 10B against the busbar 200. "Longitudinal" corresponds to the thickness direction F described above, and the extension c11 extends generally along this longitudinal direction.

[0060] At this time, the buckle c1 has a simple structure and the clamping is reliable and stable.

[0061] In some embodiments, combined Figure 3 and Figure 4 It is understood that the hook portion c12 is fixedly connected to the extension portion c11, and the inner diameter of the bayonet e1 is larger than the outer diameter of the extension portion c11. There are multiple buckles c1, and the hook portion c12 of each buckle c1 is bent away from each other. The extension portion c11 of each buckle c1 is constructed to elastically deform when squeezed by external force.

[0062] Since the hook portion c12 and the extension portion c11 are fixed, in order to facilitate the hook portion c12 to pass through the bayonet e1, the inner diameter of the buckle c1 should be larger than the outer diameter of the extension portion c11.

[0063] During the insertion and removal of the extensions c11 from the bayonet e1, the extensions c11 are squeezed together, allowing their hooks c12 to pass smoothly through the bayonet e1. When the buckle c1 is plugged into the bayonet e1, the extensions c11, under their own elastic force, press against the inner wall of the bayonet e1 toward the bent side of the hook c12 to which they are connected. The hooks c12 of different buckles c1 bend in opposite directions, meaning that different extensions c11 press against the inner wall of the bayonet e1 in different directions. This effectively limits the position of the first and second clamping portions 21c, 22e in a lateral direction perpendicular to the extension direction of the extensions c11, achieving a lateral position-limited connection between the first and second mounting members 21, 22, and preventing the hooks c12 from slipping out of the bayonet e1.

[0064] In other embodiments, the hook portion c12 is connected to the extension portion c11 via a rotating shaft, which is equipped with a torsion spring. The inner diameter of the bayonet e1 matches the outer diameter of the extension portion c11. When the extension portion c11 is inserted into the bayonet e1, the inner wall of the bayonet e1 pushes the hook portion c12 to a position where it can be inserted into the bayonet e1. When the hook portion c12 extends out of the bayonet e1, the torsion spring acts to return the hook portion c12 to a position where it abuts against the end of the first mounting member 21 or the second mounting member 22.

[0065] In some embodiments, see Figure 3 and Figure 4The mounting structure 20 includes an elastic pad 23 , which is clamped between the first mounting member 21 and the voltage collecting unit 10A.

[0066] The elastic pad 23 can be a silicone pad, a rubber pad, etc., and the specific structure is not limited.

[0067] When the first mounting member 21 and the second mounting member 22 press the voltage collection unit 10A and the temperature collection unit 10B against the busbar 200, the elastic pad 23 is compressed and exerts a reaction force on the voltage collection unit 10A, thereby increasing the pressing force between the voltage collection unit 10A and the temperature collection unit 10B and the busbar 200, reducing contact resistance and thermal resistance, and simultaneously strengthening the clamping degree between the above-mentioned buckle c1 and the bayonet e1, thereby preventing the voltage collection unit 10A and the temperature collection unit 10B from loosening relative to the busbar 200 due to vibration, impact, etc.

[0068] Specifically in the embodiment, combined with Figure 4 and Figure 5 It is understood that the elastic pad 23 surrounds the first engaging portion 21c protruding from the inner side of the first mounting member 21. The inner side of the first mounting member 21 faces the collection space K, and the first engaging portion 21c protrudes from the inner side of the first mounting member 21. The elastic pad 23 is also located on the inner side of the first mounting member 21 and surrounds the first engaging portion 21c. The elastic pad 23 is generally annular and has a clearance hole 23h formed therein to clear the first engaging portion 21c. This structure is simple and easy to manufacture.

[0069] In other embodiments, multiple elastic pads 23 may be provided and positioned around the periphery of the first clamping portion 21c, avoiding the first clamping portion 21c while being clamped between the first mounting member 21 and the voltage collection unit 10A. In the above embodiment, the first clamping portion 21c is positioned on the inner side of the elastic pad 23, so the elastic pad 23 needs to avoid the first clamping portion 21c. In other embodiments, the first clamping portion 21c may also be positioned around the periphery of the elastic pad 23.

[0070] In some embodiments, reference Figure 6 , and combined with Figure 3 and Figure 4 It is understood that a mounting groove 21 d is formed inwardly at one end of the first mounting member 21 facing the voltage collecting unit 10A, and the elastic pad 23 is partially embedded in the mounting groove 21 d.

[0071] It is understandable that the depth of the mounting groove 21 d is less than the thickness of the elastic pad 23 , so that a portion of the elastic pad 23 is located outside the mounting groove 21 d and effectively fits with the voltage collecting portion 10A.

[0072] At this time, the elastic pad 23 can be positioned by using the installation groove 21d to achieve reliable installation of the elastic pad 23, which can also help reduce the overall thickness and reduce the space occupied in the thickness direction.

[0073] Figure 7 Schematic diagram of the partial structure of the signal acquisition board 10 in some embodiments.

[0074] In some embodiments, reference Figure 7 The voltage collecting portion 10A includes an electrical connection area A1 exposed in the collecting space K. The electrical connection area A1 is adapted to be attached to the current bus 200 in the collecting space K. Along the thickness direction F, the projection of the electrical connection area A1 is within the projection range of the elastic pad 23 .

[0075] The electrical connection area A1 is located on one end surface of the voltage collecting portion 10A forming the collecting space K. Part or all of the surface forms the electrical connection area A1. The electrical connection area A1 is in contact with the busbar 200 located in the collecting space K and is electrically connected thereto.

[0076] The projection of the electrical connection area A1 in the thickness direction F is located within the projection range of the elastic pad 23 in the thickness direction F. The reaction force provided by the elastic pad 23 can act on the entire area of ​​the electrical connection area A1, which is conducive to the close fit between the electrical connection area A1 and the busbar 200, thereby reducing the contact resistance between the two.

[0077] Specifically, the elastic pad 23 and the electrical connection area A1 are both annular (such as a circular ring or a square ring, etc., not limited to the specific shape), and the first clamping portion 21c is arranged in the inner space of the elastic pad 23 and the inner space of the electrical connection area A1, and the inner space of the electrical connection area A1 serves as the above-mentioned first avoidance position A2.

[0078] In some embodiments, reference Figure 5 , and combined with Figure 3 and Figure 4 It is understood that a glue potting space 22f is provided on the second mounting member 22, and the temperature collecting part 10B includes a temperature sensor B1 located in the glue potting space 22f, and the glue potting space 22f is filled with thermal conductive glue 22g that wraps the temperature sensor B1.

[0079] The temperature sensor B1 can be a thermistor. Specifically, the temperature collection unit 10B includes a temperature collection board B3 and a temperature sensor B1. The temperature collection board B3 and the voltage collection unit 10A are separated in the thickness direction F to form a collection space K. The busbar 200 is sandwiched between the voltage collection unit 10A and the temperature collection board B3. The temperature sensor B1 is thermally connected to the side of the temperature collection board B3 facing away from the voltage collection board. The temperature of the temperature collection board B3 is sensed by the temperature sensor B1 and transmitted via the internal circuitry of the temperature collection board B3. It is understood that the second avoidance position B2 is provided on the temperature collection board B3.

[0080] The second mounting member 22 rests against the side of the temperature collection plate B3 facing away from the collection space K. The temperature sensor B1 is inserted into the glue filling space 22f on the second mounting member 22. Typically, the glue filling space 22f includes a glue filling hole extending through the second mounting member 22 along the thickness direction F. The temperature sensor B1 is inserted through the glue filling hole on the end closest to the collection space K, and thermal conductive glue 22g is injected into the glue filling hole on the other end, away from the collection space K.

[0081] At this time, the temperature sensor B1 is fixed in the glue-filling space 22f by the thermally conductive glue 22g, which protects the temperature sensor B1.

[0082] In some embodiments, the temperature collection plate B3 is fixed to the side of the second mounting member 22 facing the collection space K (e.g., by gluing), thereby improving the contact reliability between the temperature collection plate B3 and the second mounting member 22 while omitting the alignment process of the temperature collection plate B3 and the second mounting member 22, thereby improving assembly efficiency.

[0083] In order to improve the overall installation reliability, a buckle c1 is provided on the first mounting member 21, and a bayonet e1 is provided on the second mounting member 22, and the voltage collection part 10A is provided between the busbar 200 and the first mounting member 21, and the temperature collection part 10B is provided between the busbar 200 and the second mounting member 22, so that the extension part c11 of the buckle c1 passes through the elastic pad 23, the first avoidance position A2, the collection space K, and the second avoidance position B2 in sequence and then extends into the bayonet e1. Compared with the solution in which the temperature collection part 10B is provided between the busbar 200 and the first mounting member 21 and the voltage collection part 10A is provided between the busbar 200 and the second mounting member 22, the force uniformity on the two sides of the voltage collection part 10A is improved, the contact reliability between the voltage collection part 10A and the busbar 200 is improved, the electrical connection effect between the voltage collection part 10A and the busbar 200 is ensured, and the space in the overall thickness direction can be reduced, thereby improving space utilization.

[0084] Figure 8 is a perspective view of a signal acquisition assembly 100 according to some embodiments.

[0085] In some embodiments, reference Figure 2 and Figure 7 , and combined with Figure 8The signal acquisition board 10 includes a soldering portion 10C, a first buffer portion 10D, and a second buffer portion 10E. The first buffer portion 10D connects the voltage acquisition portion 10A and the soldering portion 10C, and the second buffer portion 10E connects the temperature acquisition portion 10B and the soldering portion 10C. At least one of the first buffer portion 10D and the second buffer portion 10E is bent away from the other along the thickness direction F relative to the soldering portion 10C, so that the first buffer portion 10D and the second buffer portion 10E are spaced apart in the thickness direction F. The signal acquisition assembly 100 includes a main circuit board 30, and the soldering portion 10C is soldered to the main circuit board 30.

[0086] To enable the signal acquisition assembly 100 to simultaneously collect operating data from multiple battery cells 300, the signal acquisition assembly 100 typically includes a main circuit board 30 and multiple signal acquisition boards 10. Each signal acquisition board 10 collects signal data from a battery cell 300 via a busbar 200. The signal data collected by each signal acquisition board 10 is then transmitted to a battery management system or module management system via the main circuit board 30. The multiple signal acquisition boards 10 are arranged sequentially on one or both sides of the main circuit board 30, generally along the extension direction of the main circuit board 30. The main circuit board 30 may be a flexible circuit board, a flat flexible cable, or the like.

[0087] Overall, the signal acquisition board 10 includes a soldering portion 10C, a first buffer portion 10D, a second buffer portion 10E, the voltage acquisition portion 10A, and the temperature acquisition portion 10B. The first buffer portion 10D is connected between the voltage acquisition portion 10A and the soldering portion 10C, and the second buffer portion 10E is connected between the temperature acquisition portion 10B and the soldering portion 10C. At least one of the first buffer portion 10D and the second buffer portion 10E is bent away from the other approximately along the thickness direction F relative to the soldering portion 10C. The first buffer portion 10D and the second buffer portion 10E are spaced apart in the thickness direction F, thereby spacing the voltage acquisition portion 10A and the temperature acquisition portion 10B apart in the thickness direction F, improving space utilization. The soldering portion 10C is used for soldering to the main circuit board 30.

[0088] The signal acquisition board 10 is formed by an insulating film layer 11 covering a conductive layer 12. The conductive layer 12 can be a metal foil layer, a metal wire layer, etc. Figure 8As shown, the conductive layer 12 of the signal acquisition board 10 forms three conductive lines. The first conductive line L1 passes through the welding portion 10C, the first buffer portion 10D, and the voltage acquisition portion 10A. The second conductive line L2 and the third conductive line L3 both pass through the welding portion 10C, the second buffer portion 10E, and the temperature acquisition portion 10B, and the portions of the two located in the temperature acquisition portion 10B are electrically connected to the positive terminal and negative terminal of the temperature sensor B1, respectively. The first conductive line L1 has a voltage welding position h1 at the welding portion 10C, and the second conductive line L2 and the third conductive line L3 have a temperature welding position h2 at the welding portion 10C. Each conductive line is welded to the main circuit board 30 via the corresponding welding position. The insulating film layer 11 covers the outside of each conductive line and insulates and isolates the three.

[0089] Furthermore, the insulating film layer 11 at the welding portion 10C may be provided with hollow holes w1, which expose each welding position to facilitate welding to the main circuit board 30. Furthermore, each welding position may be provided with a solder hole w2, through which solder flows into the welding area between the welding position and the main circuit board 30, facilitating the welding operation and enhancing the weld strength between the welding position and the main circuit board 30. Furthermore, the first conductive path L1 may include a fuse portion 12a, which is located within the welding portion 10C. The fuse portion 12a is generally in the shape of a curved, elongated filament. When excessive current flows through the first conductive path L1, it fuses, thereby protecting the battery cell 300.

[0090] The first buffer portion 10D is formed by an insulating film layer 11 covering a portion of the first conductive trace L1. The second buffer portion 10E is formed by an insulating film layer 11 covering a portion of the second conductive trace L2 and a portion of the third conductive trace L3. These two buffer portions are capable of expanding and contracting in the direction of extension of the signal acquisition board 10. To enable each buffer portion to expand and contract, it can extend in a curved shape, such as a C-shape, a U-shape, an S-shape, or a double S-shape. When the battery cell 300 expands, each buffer portion can expand and contract in the direction of extension of the main circuit board 30 and in a direction perpendicular to the extension of the main circuit board 30 to accommodate changes in the position of the busbar 200 and the main circuit board 30, thereby preventing the signal acquisition board 10 from separating from the busbar 200 and / or the main circuit board 30. This improves the stability of the connection between the signal acquisition board 10 and the busbar 200, ensuring the safe operation and service life of the battery 1000.

[0091] In a specific embodiment, if Figure 2 and Figure 7 As shown, the first buffer portion 10D is formed by two arc-shaped sub-portions D1, and the two arc-shaped sub-portions D1 are relatively open and enclosed to form a deformation space D2. Figure 2 and Figure 7As shown, the second buffer portion 10E extends in a substantially double S-shaped zigzag pattern, so as to have a buffer space in the extending direction of the main circuit board 30 and perpendicular to the extending direction of the main circuit board 30 .

[0092] Furthermore, a weak link 11a can be formed between the insulating film 11 of the first buffer portion 10D and the insulating film 11 of the soldering portion 10C, and / or between the insulating film 11 of the first buffer portion 10D and the insulating film 11 of the voltage collection portion 10A. The weak link 11a can break when the first buffer portion 10D is stretched by an external force. Before the first buffer portion 10D is stretched, the first buffer portion 10D and the soldering portion 10C, and / or the first buffer portion 10D and the weak link 11a, and / or the first buffer portion 10D and the voltage collection portion 10A are positioned. This prevents the soldering portion 10C from being displaced due to micro-movements of the first buffer portion 10D when soldering to the main circuit board 30, thereby reducing soldering quality. It also prevents the voltage collection portion 10A from being displaced due to micro-movements of the first buffer portion 10D when being installed on the busbar 200, thereby preventing accurate installation. Specifically, the weak link 11a has a small cross-sectional area and is easily broken. Furthermore, a breaking portion may be provided at the weak connection portion 11 a , and the minimum cross-sectional area of ​​the weak connection portion 11 a is located at the breaking portion, so as to provide a buffer deformation space.

[0093] Specifically, the first buffer portion 10D and the welding portion 10C are in the same plane, and the second buffer portion 10E is bent away from the first buffer portion 10D relative to the welding portion 10C in the above-mentioned thickness direction F and then extends roughly parallel to the first buffer portion 10D, so as to obtain the voltage collection portion 10A and the temperature collection portion 10B arranged at intervals, thereby avoiding mutual interference between the first buffer portion 10D and the second buffer portion 10E.

[0094] At this time, the first buffer portion 10D and the second buffer portion 10E are connected to the same welding portion 10C, and the signal acquisition board 10 is connected to the main circuit board 30 via different welding positions on the same welding portion 10C. While improving the welding efficiency, it can also improve the strength of the signal acquisition board 10 and reduce the risk of tearing of the signal acquisition board 10. In addition, the same signal acquisition board 10 can also simultaneously collect temperature data and voltage data of the battery cell 300, simplifying the structure of the signal acquisition component 100, simplifying the coordination between the signal acquisition board 10 and the busbar, improving space utilization and reducing costs.

[0095] It is worth noting that as long as the solutions in the above embodiments do not conflict, they can be arbitrarily combined to obtain more embodiments, which will not be described in detail here.

[0096] In addition, refer to Figure 1The battery 1000 provided in an embodiment of the present application includes a battery cell 300, a busbar 200, and a signal acquisition assembly 100 according to any of the above embodiments. The busbar 200 is inserted into a collection space K. The voltage collection unit 10A is electrically connected to the busbar 200 located in the collection space K, and the temperature collection unit 10B is thermally connected to the busbar 200 located in the collection space K. The mounting structure 20 is detachably mounted on the busbar 200 via a first mounting member 21 and a second mounting member 22.

[0097] It can be understood that the battery 1000 includes a plurality of battery cells 300 , which are stacked and arranged. The stacking direction of the battery cells 300 is the same as the extending direction of the main circuit board 30 of the busbar 200 .

[0098] It's worth noting that the second and third conductive traces L2 and L3 in the temperature collection portion 10B are electrically non-conductive with the busbar 200 due to the isolation provided by the insulating film layer 11, preventing a short circuit. The portion of the first conductive trace L1 in the voltage collection portion 10A not covered by the insulating film layer 11 (i.e., the electrical connection area A1) is electrically connected to the busbar 200.

[0099] The battery 1000 includes all the beneficial effects of the above embodiments, which will not be described in detail here.

[0100] In some embodiments, combined Figure 4 and Figure 5 It is understood that the conduit 200 is provided with a through hole 201 located in the collection space K, and at least one of the first clamping portion 21c of the first mounting member 21 and the second clamping portion 22e of the second mounting member 22 is folded through the through hole 201 and is detachably connected to the other.

[0101] That is, the portion of the current collector 200 located in the collection space K is provided with a through hole 201 , and the through hole 201 can avoid the first clamping portion 21 c and the second clamping portion 22 e .

[0102] In this way, the first clamping portion 21 c and / or the second clamping portion 22 e can limit the current collector 200 , thereby improving the stability of the installation position of the mounting structure 20 on the current collector 200 .

[0103] In some embodiments, at least one end of the current collector 200 in the thickness direction F is recessed to form a positioning groove 202 , and at least one of the voltage collecting portion 10A and the temperature collecting portion 10B is confined within the positioning groove 202 .

[0104] Specifically, if the voltage collection unit 10A is positioned within the positioning groove 202, the side of the busbar 200 facing the voltage collection unit 10A is provided with the positioning groove 202. If the temperature collection unit 10B (specifically, the temperature collection plate) is positioned within the positioning groove 202, the side of the busbar 200 facing the temperature collection unit 10B is provided with the positioning groove 202.

[0105] It can be understood that some edges of the positioning groove 202 perpendicular to the thickness direction F have notches, and the voltage collection part 10A and the temperature collection part 10B are inserted into the corresponding positioning groove 202 through the notches.

[0106] When the signal acquisition assembly 100 and the busbar 200 are actually assembled, the voltage acquisition unit 10A and / or the temperature acquisition unit 10B are first positioned on the busbar 200 using the positioning groove 202 , and then the first mounting member 21 and the second mounting member 22 are installed and connected.

[0107] At this time, the design of the positioning groove 202 makes the assembly process of the signal acquisition component 100 and the busbar 200 simpler and more efficient.

[0108] In a specific embodiment of the present application, Figures 3 to 5 The busbar 200 is inserted into the collection space K. The first mounting member 21 includes two latches c1, and the second mounting member 22 includes two latches e1. The voltage collection unit 10A is provided with a first clearance position A2 for the latches c1, and the temperature collection unit 10B is provided with two second clearance positions B2 for the latches e1. The busbar 200 is provided with two through-holes 201 for the latches e1. Each latch c1 passes through the first clearance position A2, the through-hole 201, and the second clearance position B2, and then extends into the corresponding latch e1 to engage with it. A positioning groove 202 is provided on the end of the busbar 200 facing the first positioning member. The voltage collection unit 10A is restrained in the positioning groove 202. An annular elastic pad 23 is provided on the inner side of the first mounting member 21, sandwiched between the first mounting member 21 and the voltage collection unit 10A.

[0109] When installed on a battery cell 300, the first and second mounting members 21 and 22 are stacked from top to bottom along the height of the battery cell 300. The voltage collection unit 10A is positioned between the busbar 200 and the first mounting member 21, and the temperature collection unit 10B is positioned between the busbar 200 and the second mounting member 2. This facilitates the insertion of the clip c1 into the clip e1 from top to bottom, improving installation convenience. Furthermore, after passing through the clip e1, the clip c1 can be positioned between the second mounting member 22 and the top cover of the battery cell 300, where the terminal 301 is located. This prevents the bottom surface of the second mounting member 22 from contacting the top cover, which could affect the accuracy of the temperature collection unit 10B.

[0110] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A signal acquisition assembly (100) for a battery (1000), wherein the battery (1000) comprises a busbar (200) connected to a terminal (301) thereof; wherein: The signal acquisition component (100) comprises: A signal acquisition board (10) comprises a voltage acquisition portion (10A) and a temperature acquisition portion (10B), the two being spaced apart in a thickness direction (F) of the signal acquisition board (10) to form a collection space (K), the collection space (K) being used to accommodate the current collector (200); A mounting structure (20) comprising a first mounting member (21) and a second mounting member (22), the two members cooperating to enable the mounting structure (20) to be detachably mounted on the current collector (200); When the mounting structure (20) is in a state capable of being assembled with the current collector (200), the first mounting member (21) and the second mounting member (22) are respectively pressed on opposite sides of the voltage collecting portion (10A) and the temperature collecting portion (10B), so that when assembled with the current collector (200), the voltage collecting portion (10A) and the temperature collecting portion (10B) are in contact with the current collector (200).

2. The signal acquisition component (100) according to claim 1, characterized in that The first mounting member (21) is provided with a first clamping portion (21c), and the second mounting member (22) is provided with a second clamping portion (22e); at least one of the first clamping portion (21c) and the second clamping portion (22e) passes through the collection space (K) and is detachably clamped with the other; The voltage collection part (10A) is provided with a first avoidance position (A2) for avoiding the first clamping part (21c), and the temperature collection part (10B) is provided with a second avoidance position (B2) for avoiding the second clamping part (22e).

3. The signal acquisition component (100) according to claim 2, characterized in that One of the first clamping portion (21c) and the second clamping portion (22e) includes a buckle (c1), and the other includes a through-set bayonet (e1); the buckle (c1) is engaged in the bayonet (e1) and passes through the first avoidance position (A2), the collection space (K) and the second avoidance position (B2).

4. The signal acquisition component (100) according to any one of claims 1 to 3, characterized in that: The mounting structure (20) comprises an elastic pad (23), and the elastic pad (23) is clamped between the first mounting member (21) and the voltage collecting portion (10A).

5. The signal acquisition component (100) according to claim 4, characterized in that: An end of the first mounting member (21) facing the voltage collecting portion (10A) is concavely formed with a mounting groove (21d), and the elastic pad (23) is partially embedded in the mounting groove (21d).

6. The signal acquisition component (100) according to claim 4, characterized in that The voltage collection portion (10A) comprises an electrical connection area (A1) exposed in the collection space (K), and the electrical connection area (A1) is used to fit with a current collector (200) located in the collection space (K); Along the thickness direction (F), the projection of the electrical connection area (A1) is located within the projection range of the elastic pad (23).

7. The signal acquisition component (100) according to any one of claims 1 to 3, characterized in that: A glue-filling space (22f) is provided on the second mounting member (22); the temperature collecting portion (10B) comprises a temperature sensor (B1) located in the glue-filling space (22f); and the glue-filling space (22f) is filled with thermally conductive glue (22g) that wraps the temperature sensor (B1).

8. The signal acquisition component (100) according to any one of claims 1 to 3, characterized in that: The signal acquisition board (10) comprises a welding portion (10C), a first buffer portion (10D) and a second buffer portion (10E); The first buffer portion (10D) is connected to the voltage collecting portion (10A) and the welding portion (10C), and the second buffer portion (10E) is connected to the temperature collecting portion (10B) and the welding portion (10C); At least one of the first buffer portion (10D) and the second buffer portion (10E) is bent away from the other relative to the welding portion (10C) along the thickness direction (F), so that the first buffer portion (10D) and the second buffer portion (10E) are spaced apart in the thickness direction (F); The signal acquisition component (100) comprises a main circuit board (30), and the welding portion (10C) is welded to the main circuit board (30).

9. A battery (1000), characterized in that: include: A battery cell (300) having a terminal (301); A current collector (200) connected to the pole (301); According to the signal acquisition component (100) according to any one of claims 1 to 8, the busbar (200) is inserted into the acquisition space (K), the voltage acquisition part (10A) is conductively connected to the busbar (200) located in the acquisition space (K), and the temperature acquisition part (10B) is thermally connected to the busbar (200) located in the acquisition space (K); and the mounting structure (20) is detachably assembled on the busbar (200) via the first mounting part (21) and the second mounting part (22).

10. The battery (1000) according to claim 9, characterized in that The confluence piece (200) is provided with a through hole (201) located in the collection space (K); at least one of the first clamping portion (21c) of the first mounting piece (21) and the second clamping portion (22e) of the second mounting piece (22) passes through the through hole (201) and is detachably clamped with the other; The current collector (200) is recessed at at least one end in the thickness direction (F) to form a positioning groove (202), and at least one of the voltage collection portion (10A) and the temperature collection portion (10B) is limited to the positioning groove (202).

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