Camera module

Abstract

The invention discloses a camera module. The camera module comprises an optical lens; light rays emitted by the optical lens are reflected for multiple times on a plurality of reflecting surfaces of the light turning element; the light rays are emitted by the light turning element and then reach the light sensing component; the driving device, the light turning element and the optical lens are arranged on a movable part of the driving device, the photosensitive component is arranged on a fixed part of the driving device, and the movable part is movably arranged in the fixed part so as to drive the light turning element and the optical lens to move relative to the photosensitive component. The invention also discloses a camera module which comprises a lens driving assembly which is configured to drive the optical lens to move relative to the light turning element along the optical axis direction; the chip driving assembly is configured to drive the photosensitive assembly to move relative to the light turning element in the direction perpendicular to the optical axis; a chip driving part of the chip driving assembly comprises at least one anti-shake magnet and at least one anti-shake coil which are oppositely arranged, the at least one anti-shake coil drives the at least one anti-shake magnet to be close to or away from each other so that the vertical distance between the anti-shake coil and the anti-shake magnet can be changed, and then the chip anti-shake function is achieved.

Description

A camera module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and benefits of Chinese patent applications No. 202310120180.6, No. 202310159380.2 filed with the State Intellectual Property Office of China on February 9, 2023, and No. 202310417443.X, No. 202310416062.X filed with the State Intellectual Property Office of China on April 14, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of camera modules, and in particular to a telephoto camera module with a driving device. Background Art

[0004] As living standards improve, consumers' demand for long-distance photography is increasing.

[0005] Telephoto camera modules typically have a long focal length, enabling clear images of distant subjects. However, small mobile devices like phones and tablets have limited space, making oversized telephoto camera modules difficult to fit into such devices. Furthermore, to enhance the shooting quality of telephoto camera modules, motors are required to drive the lens, further increasing their size.

[0006] Therefore, it is hoped to propose a new camera module design so that the telephoto shooting function can be improved while the size of the camera module can be designed to be smaller.

[0007] Summary of the Invention

[0008] According to the first design scheme of the present application, a camera module is proposed.

[0009] One purpose of the present application is to provide a camera module with a driving device, which overcomes the shortcomings of the prior art and achieves miniaturization of the module.

[0010] According to one aspect of the present application, a camera module is provided, comprising:

[0011] An optical lens having an optical axis;

[0012] A light deflection element, the light deflection element comprising a plurality of reflective surfaces, and the light emitted by the optical lens is reflected multiple times on the plurality of reflective surfaces of the light deflection element;

[0013] a photosensitive component, wherein light is emitted from the light deflecting element and reaches the photosensitive component, and the optical lens and the photosensitive component are arranged on the same side of the light deflecting element;

[0014] a lens driving assembly configured to drive the optical lens to move relative to the light deflecting element along an optical axis; and

[0015] A chip driving component is configured to drive the photosensitive component to move relative to the light turning element along a direction perpendicular to the optical axis.

[0016] In some embodiments, the lens driving assembly includes a fixed base, a lens carrier and a lens driving unit, the light deflection element is fixed to the fixed base, the optical lens is fixed to the lens carrier, the lens carrier is movably arranged on the fixed base, and the lens driving unit is configured to drive the lens carrier to move along the optical axis relative to the fixed base.

[0017] In some embodiments, the lens driving unit includes a focusing coil and a focusing magnet, and the focusing coil and the focusing magnet are arranged relative to each other in a horizontal direction. The focusing coil is arranged on one of the fixed base and the lens carrier, and the focusing magnet is arranged on the other of the fixed base and the lens carrier.

[0018] In some embodiments, the chip driving component includes a shell, a chip carrier and a chip driving part, the shell and the fixed base are interlocked, the photosensitive component is fixed to the chip carrier, the chip carrier is movably arranged in the shell, and the chip driving part is configured to drive the chip carrier to move in a horizontal direction relative to the shell and the fixed base.

[0019] In some embodiments, the chip driving unit includes at least one anti-shake magnet and at least one anti-shake coil, and the at least one anti-shake magnet and the at least one anti-shake coil are arranged relative to each other in a horizontal direction. The at least one anti-shake magnet is arranged in one of the chip carrier and the shell, and the at least one anti-shake coil is arranged in the other of the chip carrier and the shell.

[0020] In some embodiments, the lens driving unit is located on the peripheral side of the light deflecting element and is arranged close to the optical lens, and the chip driving unit is located on the peripheral side of the light deflecting element and is arranged close to the photosensitive component.

[0021] In some embodiments, the light deflecting element includes two opposite short sides and two opposite long sides, the lens driving unit is arranged on a short side of the light deflecting element close to the optical lens, and the chip driving unit is arranged on the other short side and two long sides of the light deflecting element close to the photosensitive component.

[0022] In some embodiments, the focusing magnet and the at least one anti-shake magnet extend along a height direction around the light deflection element, and a bottom surface of the focusing magnet is lower than a bottom surface of the at least one anti-shake magnet.

[0023] In some embodiments, the focusing coil and the at least one anti-shake coil extend in a height direction around the light deflection element, and a bottom surface of the focusing coil is lower than a bottom surface of the at least one anti-shake coil.

[0024] In some embodiments, the photosensitive component also includes a photosensitive chip, a chip circuit board and a connecting circuit board. The photosensitive chip is arranged on the chip circuit board and electrically connected to the chip circuit board. The connecting circuit board is bent from the top of the chip circuit board to the bottom of the fixed base in the shell and extends to the outside of the camera module to achieve circuit conduction between the chip circuit board and the external electronic device.

[0025] In some embodiments, the connecting circuit board extends from one side of the chip driving component to one side of the lens driving component, the lens driving component also includes a focusing circuit board, and the chip driving component also includes an anti-shake circuit board. The focusing circuit board and the anti-shake circuit board are respectively electrically connected to the connecting circuit board to achieve circuit conduction between the chip driving component and the lens driving component.

[0026] The fixed base includes a base body, a mounting portion and a base side fixing portion. The fixed base extends in the horizontal direction. The mounting portion is arranged in the middle of the base body and extends in the height direction. The base side fixing portion is arranged on the short side of the base body close to the optical lens and extends in the height direction. The light turning element is fixed to the mounting portion.

[0027] In some embodiments, the lens carrier includes a lens fixing body and a lens carrier side, the lens fixing body has a "C"-shaped groove, the optical lens is fixed in the "C"-shaped groove, and the opening of the "C"-shaped groove faces the photosensitive component; the lens carrier side is located on the side of the lens fixing body and is opposite to the base side fixing part.

[0028] In some embodiments, the at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the first anti-shake magnet and the third anti-shake magnet are respectively arranged on two adjacent sides of the second anti-shake magnet; the at least one anti-shake coil includes a first anti-shake coil, a second anti-shake coil, a third anti-shake coil and a fourth anti-shake coil, the second anti-shake coil and the third anti-shake coil are arranged on the same side, the first anti-shake coil and the fourth anti-shake coil are respectively arranged on two adjacent sides of the second anti-shake coil and the third anti-shake coil, the first anti-shake magnet and the first anti-shake coil are arranged relative to each other in a horizontal direction, the second anti-shake magnet and the second anti-shake coil and the third anti-shake coil are arranged relative to each other in a horizontal direction, the third anti-shake magnet and the fourth anti-shake coil are arranged relative to each other in a horizontal direction, and the first anti-shake magnet, the second anti-shake magnet and the third anti-shake magnet are respectively arranged on three sides close to the photosensitive component.

[0029] In some embodiments, the second anti-shake coil and the third anti-shake coil can be controlled separately, and the magnetic force between the second anti-shake coil and the second anti-shake magnet is different in magnitude or direction from the magnetic force between the third anti-shake coil and the second anti-shake magnet, thereby driving the chip carrier to rotate around the Z axis to realize the chip rotation anti-shake function.

[0030] In some embodiments, the chip driving component further includes a frame, which is disposed between the housing and the chip carrier along a height direction, the frame is fixed to the housing, and the frame and the chip carrier are supported by an anti-shake support portion.

[0031] According to the second design scheme of the present application, a chip driving component and a camera module are proposed.

[0032] Another object of the present application is to provide a chip driving component and a camera module, which overcome the shortcomings of the existing technology, realize a new chip anti-shake method, and have a smaller size.

[0033] According to another aspect of the present application, a chip driver component is provided, comprising:

[0034] case;

[0035] a chip carrier, the chip carrier being movably disposed in the housing and being used to fix the photosensitive component; and

[0036] A chip driving unit includes at least one anti-shake magnet and at least one anti-shake coil arranged opposite to each other in a horizontal direction, the at least one anti-shake magnet is fixed to the chip carrier, and the at least one anti-shake coil is fixed to the shell. The at least one anti-shake coil drives the at least one anti-shake magnet to approach or move away from the at least one anti-shake coil so that the vertical distance between the at least one anti-shake coil and the at least one anti-shake magnet is changed, thereby realizing the chip anti-shake function.

[0037] In some embodiments, a magnetic pole direction of the at least one anti-shake magnet is perpendicular to a winding plane of the at least one anti-shake coil.

[0038] In some embodiments, the at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the at least one anti-shake coil includes a first anti-shake coil arranged opposite to the first anti-shake magnet, a second anti-shake coil and a third anti-shake coil arranged opposite to the second anti-shake magnet, and a fourth anti-shake coil arranged opposite to the third anti-shake magnet.

[0039] In some embodiments, the at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the at least one anti-shake coil includes a first anti-shake coil arranged opposite to the first anti-shake magnet, a second anti-shake coil arranged opposite to the second anti-shake magnet, and a fourth anti-shake coil arranged opposite to the third anti-shake magnet.

[0040] In some embodiments, the first anti-shake magnet and the third anti-shake magnet are adjacently arranged on both sides of the second anti-shake magnet, and the first anti-shake magnet and the third anti-shake magnet are parallel to each other, and the second anti-shake magnet is perpendicular to the first anti-shake magnet and the third anti-shake magnet, respectively.

[0041] In some embodiments, the shell includes a cover body and at least one shell side portion arranged on the peripheral side of the cover body, the at least one anti-shake coil is fixed to the at least one shell side portion of the shell, and the chip carrier includes a chip carrier body and at least one chip carrier side portion extending integrally from at least one side of the chip carrier body along the height direction.

[0042] In some embodiments, the chip driving assembly further includes a frame fixed to a side facing the chip carrier.

[0043] In some embodiments, the chip driving component also includes an anti-shake support part and an anti-shake magnetic part. The anti-shake support part is arranged between the frame and the chip carrier, and the anti-shake magnetic part is fixed to the frame. The anti-shake magnetic part and the at least one anti-shake magnet are magnetically attracted to each other so that the anti-shake support part is clamped between the frame and the chip carrier.

[0044] In some embodiments, the anti-shake support part includes three balls of the same size, three frame ball grooves are formed on the bottom surface of the frame, and three carrier ball grooves corresponding to the three frame ball grooves are formed on the top surface of the chip carrier body. The three balls are respectively arranged in three ball accommodating cavities formed by the three frame ball grooves and the three carrier ball grooves.

[0045] In some embodiments, at least one frame opening is formed on the cover body, and the portion of the frame used to form the three frame ball grooves extends toward the cover body and is respectively arranged in the at least one frame opening, and part of the structure of the frame is formed in the frame opening.

[0046] In some embodiments, the anti-shake magnetic part includes a first anti-shake magnetic component and a second anti-shake magnetic component, and the first anti-shake magnetic component and the second anti-shake magnetic component are symmetrically arranged on both sides of the anti-shake support part, wherein the first anti-shake magnetic component is arranged above the first anti-shake magnet, and the second anti-shake magnetic component is arranged above the third anti-shake magnet.

[0047] In some embodiments, the length of the first anti-shake magnetic component is less than the length of the first anti-shake magnet, the length of the second anti-shake magnetic component is less than the length of the third anti-shake magnet, the width of the first anti-shake magnetic component is greater than the width of the first anti-shake magnet, and the width of the second anti-shake magnetic component is greater than the width of the third anti-shake magnet.

[0048] In some embodiments, the first anti-shake magnetic component includes a first inner magnetic component and a first outer magnetic component, and the second anti-shake magnetic component includes a second inner magnetic component and a second outer magnetic component. The first inner magnetic component is arranged above the first anti-shake magnet and close to the anti-shake support part, the first outer magnetic component is arranged above the first anti-shake magnet and away from the anti-shake support part, the second inner magnetic component is arranged above the third anti-shake magnet and close to the anti-shake support part, and the second outer magnetic component is arranged above the third anti-shake magnet and away from the anti-shake support part.

[0049] In some embodiments, the chip driving unit also includes an anti-shake circuit board, the at least one anti-shake coil is fixed and electrically connected to the anti-shake circuit board, and the anti-shake circuit board is fixed to the at least one side of the shell, so that the at least one anti-shake coil is fixed to the at least one side of the shell through the anti-shake circuit board.

[0050] According to another aspect of the present application, a camera module is provided, comprising:

[0051] Optical lens;

[0052] a photosensitive component, the photosensitive component receiving the light emitted from the optical lens to form an image; and

[0053] The aforementioned chip driving component, the photosensitive component is fixed to the chip carrier of the chip driving component.

[0054] According to the third design scheme of the present application, a camera module is proposed.

[0055] Another object of the present application is to provide a camera module that overcomes the shortcomings of the prior art and improves the telephoto shooting function while the size of the camera module can be designed to be smaller.

[0056] According to another aspect of the present application, a camera module is provided, comprising:

[0057] Optical lens;

[0058] A light deflecting element, wherein the relative positions of the optical lens and the light deflecting element are fixed, and the light deflecting element comprises a plurality of reflective surfaces, and the light emitted by the optical lens is reflected multiple times on the plurality of reflective surfaces of the light deflecting element;

[0059] a photosensitive component, wherein light is emitted from the light deflecting element and reaches the photosensitive component, and the optical lens and the photosensitive component are arranged on the same side of the light deflecting element; and

[0060] A driving device, the driving device includes a fixed part, a movable part and a driving part, the light deflecting element and the optical lens are arranged in the movable part, the photosensitive component is arranged in the fixed part, the movable part is movably arranged in the fixed part, the driving part is connected to the movable part and the fixed part, and the driving part is arranged on the peripheral side of the light deflecting element to drive the light deflecting element and the optical lens to move relative to the photosensitive component.

[0061] In some embodiments, the driving device includes a frame, a movable carrier and an anti-shake driving unit, the light deflection element is fixed to the movable carrier, the movable carrier is movably arranged in the frame, the anti-shake driving unit connects the frame and the movable carrier to drive the movable carrier to move horizontally relative to the frame, and the anti-shake driving unit extends downward from the movable carrier to the peripheral side of the light deflection element.

[0062] In some embodiments, the anti-shake driving unit extends in a horizontal direction, a top surface of the anti-shake driving unit is lower than a top surface of the light deflection element, and a bottom surface of the anti-shake driving unit is higher than a bottom surface of the light deflection element.

[0063] In some embodiments, the frame includes an anti-shake frame extending in a horizontal direction, and a focus frame extending in a height direction integrally from the anti-shake frame, and the focus frame is arranged on the side of the anti-shake frame; the movable carrier includes a carrier body and a bearing part, and the carrier body extends in a horizontal direction integrally from the bearing part; wherein, the anti-shake frame is arranged below the carrier body.

[0064] In some embodiments, the anti-shake drive unit includes at least one anti-shake magnet and at least one anti-shake coil, the at least one anti-shake magnet is directly or indirectly fixed to one of the movable carrier and the frame, the at least one anti-shake coil is directly or indirectly fixed to the other of the movable carrier and the frame, and the at least one anti-shake magnet and the at least one anti-shake coil are arranged relative to each other in the height direction.

[0065] In some embodiments, the at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the first anti-shake magnet, the second anti-shake magnet and the third anti-shake magnet are arranged on three adjacent sides of the bottom surface of the carrier body; the at least one anti-shake coil includes a first anti-shake coil, a second anti-shake coil and a third anti-shake coil, and the first anti-shake coil, the second anti-shake coil and the third anti-shake coil are arranged on three adjacent sides of the top surface of the anti-shake frame.

[0066] In some embodiments, the driving device also includes a fixed base and a focusing driving unit, the photosensitive component is fixed to the fixed base, the frame is movably arranged in the fixed base, and the focusing driving unit connects the fixed base and the frame to drive the frame to move in the height direction relative to the fixed base.

[0067] In some embodiments, the focus driving portion extends in a height direction, a top surface of the focus driving portion is higher than a top surface of the light turning element, and a bottom surface of the focus driving portion is lower than a top surface of the light turning element.

[0068] In some embodiments, the fixed base includes a base body extending in a horizontal direction, and a focus fixing portion extending from the base body in a height direction, the focus fixing portion is arranged on the side of the base body, and the focus driving portion is arranged between the focus fixing portion and the focus frame.

[0069] In some embodiments, the focus drive unit includes a focus magnet and a focus coil, the focus magnet is fixed to one of the focus frame and the focus fixing unit, and the focus coil is fixed to the other of the focus frame and the focus fixing unit, and the focus magnet and the focus coil are arranged relative to each other in the horizontal direction.

[0070] In some embodiments, a bottom surface of the focusing magnet is lower than a bottom surface of the at least one anti-shake magnet.

[0071] In some embodiments, the focusing magnet and the at least one anti-shake magnet are arranged on opposite sides.

[0072] In some embodiments, the focus drive unit also includes a focus circuit board, which is arranged on the focus fixing unit, and the focus coil is fixed and electrically connected to the focus circuit board; the anti-shake drive unit also includes an anti-shake circuit board, which extends from the anti-shake frame along the height direction to the photosensitive component, and the at least one anti-shake coil is electrically connected to the anti-shake circuit board; wherein, the focus circuit board and the anti-shake circuit board are arranged on opposite sides and electrically connected to the photosensitive component.

[0073] According to the fourth design scheme of the present application, a camera module is proposed.

[0074] Another object of the present application is to provide a camera module that overcomes the shortcomings of the prior art and improves the telephoto shooting function while the size of the camera module can be designed to be smaller.

[0075] According to another aspect of the present application, a camera module is provided, comprising:

[0076] Optical lens;

[0077] A light deflecting element, wherein the optical lens is disposed above an incident surface of the light deflecting element, and the relative positions of the optical lens and the light deflecting element are fixed;

[0078] A photosensitive component, wherein the optical lens and the photosensitive component are arranged on the same side of the light deflection element, and the photosensitive component includes a circuit board assembly and a photosensitive chip electrically connected to the circuit board assembly; and

[0079] The driving device includes an anti-shake driving unit and an anti-shake circuit board. The anti-shake driving unit is configured to drive the light deflection element and the optical lens to move relative to the photosensitive component. The anti-shake circuit board extends in the height direction on the plane side perpendicular to the incident surface of the light deflection element to electrically connect the anti-shake driving unit with the circuit board assembly.

[0080] In some embodiments, the light turning element includes a top side, a bottom side, and a peripheral side connected to the top side and the bottom side, and the anti-shake circuit board extends along the height direction of the light turning element on one side of the peripheral side of the light turning element.

[0081] In some embodiments, the driving device includes a fixed base, a movable carrier and a frame arranged in sequence along the height direction, the light deflection element is fixed to the movable carrier, the photosensitive component is fixed to the fixed base, the movable carrier is movably arranged in the frame, and the frame is movably arranged in the fixed base; wherein, the anti-shake circuit board is arranged between the fixed base and the frame along the height direction.

[0082] In some embodiments, the anti-shake circuit board includes a first fixed end, a second fixed end and a bending portion, the first fixed end is connected to the frame, the second fixed end is connected to the fixed base, and the bending portion is connected to the second fixed end.

[0083] In some embodiments, the bending portion of the anti-shake circuit board bends and extends along a direction perpendicular to the long side direction of the light deflecting element.

[0084] In some embodiments, the second fixing end is higher or lower than the incident parallel surface group of the light deflecting element in the height direction, and at least a portion of the bent portion overlaps with the light deflecting element in the height direction.

[0085] In some embodiments, the anti-shake circuit board further includes an extension portion, the extension portion bends upward from the first fixed end and extends along the height direction, and the bending portion bends from the extension portion toward the light turning element and extends along the height direction.

[0086] In some embodiments, the driving device also includes a focus driving unit and a focus circuit board. The focus driving unit is configured to drive the light deflection element and the optical lens to move in the height direction relative to the photosensitive component. The focus circuit board is arranged on the opposite side of the light deflection element where the anti-shake circuit board is arranged and extends in the height direction to electrically connect the focus driving unit with the circuit board assembly.

[0087] In some embodiments, the circuit board assembly includes a chip circuit board, a first connecting tape and a second connecting tape, wherein the first connecting tape and the second connecting tape are respectively arranged on opposite sides of the chip circuit board, and the chip circuit board, the first connecting tape and the second connecting tape are connected as one.

[0088] In some embodiments, the anti-shake circuit board is connected to one of the first connecting strip and the second connecting strip, and the focusing circuit board is connected to the other of the first connecting strip and the second connecting strip to concentrate the circuit on the circuit board assembly.

[0089] In some embodiments, the anti-shake drive unit includes at least one anti-shake magnet and at least one anti-shake coil, the at least one anti-shake magnet is directly or indirectly fixed to one of the movable carrier and the frame, the at least one anti-shake coil is directly or indirectly fixed to the other of the movable carrier and the frame, the at least one anti-shake magnet and the at least one anti-shake coil are arranged relative to each other in the height direction, and the anti-shake circuit board is electrically connected to the at least one anti-shake coil and the circuit board assembly.

[0090] In some embodiments, the focus drive unit includes a focus magnet and a focus coil, the focus magnet is fixed to one of the frame and the fixed unit, and the focus coil is fixed to the other of the frame and the fixed unit, the focus magnet and the focus coil are arranged relative to each other in the horizontal direction, and the focus circuit board is electrically connected to the focus and the circuit board assembly.

[0091] In the following description, some additional embodiments and features are set forth, and those skilled in the art will understand after reviewing the specification or learn these embodiments and features through practice of the disclosed subject matter. A further understanding of the features and advantages of the present disclosure may be achieved by reference to the remainder of the specification and drawings, which constitute a part of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0092] FIG1 is a perspective schematic diagram of a camera module according to the present application;

[0093] FIG2 is a cross-sectional schematic diagram of a camera module according to the present application;

[0094] 3 and 4 are exploded schematic diagrams of the unfolded lens drive assembly of the camera module according to the present application;

[0095] 5 and 6 are exploded schematic diagrams of the chip drive assembly of the camera module according to the present application;

[0096] FIG7 is a schematic top view of a chip driving unit and an anti-shake magnetic attraction unit according to the present application;

[0097] FIG8 is a perspective schematic diagram of a frame according to the present application;

[0098] FIG9 is a perspective schematic diagram of a camera module according to the present application with some components removed;

[0099] FIG10 is a perspective schematic diagram of an independent chip driver assembly according to the present application;

[0100] FIG11 is an exploded schematic diagram of a camera module according to the present application;

[0101] FIG12A is a schematic diagram of a first embodiment of an optical system according to the present application;

[0102] FIG12B is a schematic diagram of a second embodiment of an optical system according to the present application;

[0103] FIG12C is a schematic diagram of a third embodiment of an optical system according to the present application;

[0104] FIG13A is a perspective schematic diagram of a first embodiment of a split prism according to the present application;

[0105] FIG13B is a perspective schematic diagram of a second embodiment of a split prism according to the present application;

[0106] FIG14A is a schematic cross-sectional view of a camera module according to the present application along the longitudinal direction;

[0107] FIG14B is a schematic cross-sectional view of the camera module according to the present application along the width direction;

[0108] FIG14C is another cross-sectional schematic diagram of the camera module according to the present application along the width direction;

[0109] FIG15A is an exploded schematic diagram from a top view of the anti-shake function of the driving device according to the present application;

[0110] FIG15B is another exploded schematic diagram of the anti-shake function of the driving device according to the present application from a bottom-up perspective;

[0111] FIG16A is an exploded schematic diagram of a top view of the focus function of the driving device according to the present application;

[0112] FIG16B is another exploded schematic diagram of the focus function of the driving device according to the present application from an upward perspective;

[0113] FIG17 is a cross-sectional schematic diagram of an anti-shake circuit board and a focus circuit board of a driving device according to the present application. DETAILED DESCRIPTION

[0114] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0115] The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

[0116] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, the directions and positional relationships indicated are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of this application.

[0117] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0118] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0119] It should be noted that, as used in this application, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0120] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections, contact connections, or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0121] Various units, circuits, or other components may be described or stated as being "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply a structure (e.g., a circuit) that performs the one or more tasks during operation by indicating that the unit / circuit / component includes that structure. Additionally, "configured to" may include general structures (e.g., general circuits) manipulated by software and / or firmware to operate in a manner capable of performing the one or more tasks to be addressed. "Configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for implementing or performing the one or more tasks.

[0122] The terms used in this description are only for the purpose of describing specific embodiments and are not intended to be limiting. As used in the specification and the appended claims, the singular forms "a", "an" and "the" are intended to also encompass the plural form, unless the context clearly indicates otherwise. It will also be understood that the terms "and / or" used herein refer to and encompass any and all possible combinations of one or more items in the items listed in association. It will also be understood that the terms "comprises" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their groupings.

[0123] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined that" or "if [stated condition or event] is detected" may be interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0124] A telephoto camera module refers to a camera module with a long focal length (e.g., 60 mm or longer), which can clearly capture subjects at a longer distance. However, due to its relatively long focal length, the telephoto camera module requires a long total optical lens length (TTL), making the size of the telephoto camera module relatively large. Moreover, the camera module usually needs to perform optical focus and / or optical image stabilization functions, which requires the size of the telephoto camera module to be larger, making it unsuitable for assembly in small mobile devices.

[0125] The present application provides a solution to the above-mentioned problem, which miniaturizes the camera module and makes it suitable for being installed in a small mobile device.

[0126] Figures 1 to 9 illustrate a camera module 1 according to some embodiments of the present application. The camera module 1 includes an optical lens 10, a light deflecting element 30, and a photosensitive component 40. The light deflecting element 30 is disposed between the optical lens 10 and the photosensitive component 40, so that light incident on the optical lens 10 reflects at least once within the light deflecting element 30 before reaching the photosensitive component 40. The light deflecting element 30 folds the light emitted from the optical lens 10 and guides it to the photosensitive component 40, thereby forming an image through the photosensitive component 40 to obtain image information. In other words, the photosensitive component receives light emitted from the optical lens to form an image.

[0127] It is worth noting that the light deflecting element 30 is elongated, allowing light to be reflected multiple times within the light deflecting element 30, thereby folding the optical path multiple times. In the present application, the position of one or more components of the optical lens 10, the light deflecting element 30, or the photosensitive component 40 in the camera module 1 can be adjusted to achieve optical focus and / or optical image stabilization functions of the camera module 1.

[0128] In one embodiment of the present application, the optical lens 10 has an optical axis, and the light incident along the optical axis direction is reflected at least once in the light deflection element 30, that is, the light is deflected from propagating along the optical axis direction to propagating in another direction approximately orthogonal to the optical axis, and finally emitted along the optical axis direction to reach the photosensitive component 40. For the convenience of description, a rectangular coordinate system is established, the Z axis approaches the optical axis direction of the optical lens 10 or the direction parallel to the optical axis of the optical lens 10, the Z axis direction is perpendicular to the plane where the X axis direction and the Y axis direction are located, the X axis direction and the Y axis direction are perpendicular to each other, the XOY plane where the X axis direction and the Y axis direction are located is also called the plane where the horizontal direction is located, the X axis direction is the length direction of the camera module 1, the Y axis direction is the width direction of the camera module 1, and the Z axis direction is the height direction of the camera module 1. It should be understood that in the embodiment of the present application, the optical axis of the optical lens 10 is also used as the optical axis of the camera module 1.

[0129] As shown in Figure 2, the light deflecting element 30 includes multiple reflective surfaces. The light emitted by the optical lens 10 is reflected multiple times on the multiple reflective surfaces of the light deflecting element 30. After being emitted by the light deflecting element 30, the light reaches the photosensitive component 40. The photosensitive component 40 and the optical lens 10 are arranged on the same side of the light deflecting element 30. Therefore, the height dimension of the camera module 1 only needs to consider the sum of the height dimension of one of the photosensitive component 40 and the optical lens 10 and the height dimension of the light deflecting element 30, without having to simultaneously superimpose the heights of the optical lens 10, the light deflecting element 30 and the photosensitive component 40. In this way, the height dimension of the camera module 1 can be reduced. In a specific example, the optical lens 10 and the light deflecting element 30 form an "L"-shaped structure, and the photosensitive component 40 is arranged in the corner space formed by the optical lens 10 and the light deflecting element 30. The height dimension of the optical lens 10 is greater than the height dimension of the photosensitive component 40, and the top surface of the optical lens 10 is higher than the top surface of the photosensitive component 40. In this way, the photosensitive component 40 does not affect the height of the camera module 1, wherein the top surface of the optical lens 10 and the top surface of the photosensitive component 40 respectively refer to the side thereof away from the light deflecting element 30.

[0130] The optical lens system 10 includes a lens barrel 12 and at least one optical lens 11 housed therein. The optical lens system 10 collects light from a subject and transmits it to a light deflecting element 30. The optical lens system 10 has an optical axis that is perpendicular to the light deflecting element 30. In one specific example, the optical lens system 10 includes four optical lenses: a first lens, a second lens, a third lens, and a fourth lens, arranged sequentially along the incident direction of the light. The first, second, third, and fourth lenses are fixed within the lens barrel 12.

[0131] In one embodiment of the present application, the camera module 1 further includes a compensating lens group, which can be disposed between the optical lens 10 and the light deflecting element 30. This compensating lens group can further modulate the light emitted from the light deflecting element 30. For example, the compensating lens can further converge the light emitted from the optical lens 10 to reduce the back focus, thereby reducing the size of the camera module 1. It should be understood that since the compensating lens is not fixed in the lens barrel 12, the diameter of the compensating lens can be larger than any of the at least one optical lens 11 of the optical lens 10. Therefore, the compensating lens has greater design freedom.

[0132] Continuing with reference to FIG2 , the photosensitive assembly 40 includes a chip circuit board 42, a photosensitive chip 41 electrically connected to the chip circuit board 42, and at least one electronic component. The photosensitive surface of the photosensitive chip 41 faces the light deflection element 30 to receive light emitted from the light deflection element 30. In a specific example, the photosensitive chip 41 is fixed to the side of the chip circuit board 42 facing the light deflection element 30. The at least one electronic component can be implemented as a passive electronic device such as a capacitor or a resistor, or an active electronic device such as a diode or a memory chip. The at least one electronic component can be disposed on the side of the chip circuit board 42 facing the light deflection element 30 or on the other side away from the light deflection element 30.

[0133] Furthermore, in some embodiments of the present application, the camera module 1 further includes a filter assembly 50, which is disposed on the optical path of the light, and the camera module 1 can filter out unnecessary stray light (such as infrared light) through the filter assembly 50. In one embodiment of the present application, the filter assembly 50 is disposed between the light deflection element 30 and the photosensitive component 40. For example, in a specific example, the filter assembly 50 includes a filter element 51 and a filter bracket 52 for supporting the filter element 51. The filter element 51 is supported on the filter bracket 52 by, for example, gluing. Both sides of the filter bracket 52 are respectively fixed to the chip circuit board 42, so that the filter assembly 50 is disposed between the light deflection element 30 and the photosensitive chip 41. In other embodiments of the present application, the filter component 50 can be arranged in the light deflecting element 30 and / or the optical lens 10. For example, the filter component 50 can be implemented as a layer of filter film, which is attached to a surface of the light deflecting element 30, or the filter film is attached to the surface of at least one optical lens of the optical lens 10, thereby achieving the function of filtering out infrared light.

[0134] In the present application, as shown in FIG2 , the light deflecting element 30 has multiple reflective surfaces, allowing light entering the light deflecting element 30 to undergo multiple reflections. This effectively increases the optical TTL, making the camera module 1 suitable for capturing distant objects and providing high-quality images of such distant objects. TTL refers to the distance along the optical axis between the front vertex of the light-entering side (facing the subject) of the optical lens 10 of the camera module 1 and the image plane at the photosensitive component 40.

[0135] Typically, increasing the TTL increases the size of the camera module 1, making it unsuitable for integration into small mobile devices. In one embodiment of the present application, the light deflecting element 30 extends horizontally, meaning its horizontal length is greater than its height or thickness. This allows the light deflecting element 30 to maintain a low height or thickness when light is reflected multiple times within the light deflecting element 30, thereby preventing an increase in the height of the camera module 1. In other words, the horizontal length of the light deflecting element 30 is greater than its height, allowing the height of the camera module 1 to be reduced while maintaining effectiveness, thereby meeting the need for miniaturization of the camera module 1.

[0136] In one embodiment of the present application, the number of times light is reflected in the light deflecting element 30 is an odd number, and the photosensitive component 40 and the optical lens 10 are centrally arranged on the same side of the light deflecting element 30. Light passing through the optical lens 10 is reflected an odd number of times in the light deflecting element 30 before being emitted to the photosensitive component 40. In another embodiment of the present application, the number of times light is reflected in the light deflecting element 30 is an even number, and the photosensitive component 40 and the optical lens 10 are respectively arranged on opposite sides of the light deflecting element 30. Light passing through the optical lens 10 is reflected an even number of times in the light deflecting element 30 before being emitted to the photosensitive component 40.

[0137] Specifically, in one embodiment of the present application, the light deflecting element 30 includes at least four surfaces, at least three of the at least four surfaces are reflective surfaces, and the light is reflected on the at least three reflective surfaces in the light deflecting element 30. For example, the light deflecting element 30 includes a trapezoidal prism, and the cross-section of the light deflecting element 30 is a trapezoid. When the light deflecting element 30 includes three reflective surfaces, the light is reflected three times in the light deflecting element 30; when the light deflecting element 30 includes four reflective surfaces, the light is reflected five times or four times in the light deflecting element 30, which will be described in detail later in this application. Of course, in other embodiments of the present application, the light deflecting element 30 may include prisms of other shapes, such as triangular prisms, pentagonal prisms, hexagonal prisms, etc., and still provide the above-mentioned light deflection function and design benefits, and this application does not limit this.

[0138] Continuing with FIG. 2 , in one embodiment of the present application, the light deflecting element 30 is implemented as a trapezoidal prism. The light deflecting element 30 includes four surfaces, for example, a first surface 31, a second surface 32, a third surface 33, and a fourth surface 34. The plane where the first surface 31 is located is parallel to the plane where the third surface 33 is located. The length of the third surface 33 is less than the length of the first surface 31. The plane where the second surface 32 is located intersects with the plane where the fourth surface 34 is located. Among the four surfaces of the light deflecting element 30, at least three surfaces have a reflective function. For example, the first surface 31, the second surface 32, and the fourth surface 34 are reflective surfaces that have a reflective function and can reflect light. Alternatively, the first surface 31, the second surface 32, the third surface 33, and the fourth surface 34 are reflective surfaces that have a reflective function and can reflect light.

[0139] In a specific example, the angle between the second surface 32 and the first surface 31 is an acute angle, the angle between the fourth surface 34 and the first surface 31 is an acute angle, the angle between the second surface 32 and the third surface 33 is an obtuse angle, and the angle between the fourth surface 34 and the third surface 33 is an obtuse angle. The angle between the second surface 32 and the first surface 31 may be in the range of 25° and 35°, and the angle between the fourth surface 34 and the first surface 31 may be in the range of 25° and 35°. It should be understood that the angles between the various surfaces of the light deflecting element 30 can control the reflection angle of light when it is reflected within the light deflecting element 30, thereby realizing the function of the light deflecting element 30 to perform multiple reflections on light.

[0140] Furthermore, the light deflection element 30 is an isosceles trapezoidal prism. As shown in the cross-section of the trapezoidal prism in FIG2 , the second surface 32 and the fourth surface 34 are of equal length, and the second surface 32 and the fourth surface 34 are axially symmetrical. The angle between the second surface 32 and the first surface 31 is equal to the angle between the fourth surface 34 and the first surface 31, and the angle between the second surface 32 and the third surface 33 is equal to the angle between the fourth surface 34 and the third surface 33. It should be understood that because light undergoes multiple reflections within the light deflection element 30, even a slight change in the angle between the second surface 32 and the fourth surface 34 will affect the light reflection. When the second surface 32 and the fourth surface 34 are symmetrically arranged, as much incident light as possible, after multiple reflections, exits the light deflection element 30 and reaches the photosensitive component 40, minimizing light loss. In one specific example, the optical axis of the incident light is axially symmetrical along its optical path within the light deflection element 30.

[0141] In one embodiment of the present application, the second surface 32, the fourth surface 34, and / or the third surface 33 of the light deflecting element 30 may be provided with a reflective coating, or a reflector may be provided, so that light can be reflected on the second surface 32, the fourth surface 34, and / or the third surface 33. For example, in a specific example of the present application, the reflective coating may include a mirror coating based on a thin metal layer, a film with a white inner surface, etc. Further, at least a portion of the first surface 31 of the light deflecting element 30 is provided with the reflective coating, and at least a portion of the first surface 31 is not provided with the reflective coating, so that the first surface 31 can transmit light or allow light to pass through the first surface 31. Furthermore, the first surface 31 can also reflect light under the phenomenon of total internal reflection.

[0142] It should be understood that total internal reflection can occur when the incident angle of light approaches or exceeds a certain limiting angle (called the critical angle). The incident angle refers to the angle between the light incident on a surface and a line perpendicular to the surface at the point of incidence (called the normal). Therefore, when the incident angle of light is less than the critical angle, the first surface 31 of the light deflecting element 30 allows the light to pass through. When the incident angle of light approaches or exceeds the critical angle, the first surface 31 of the light deflecting element 30 reflects the light at the corresponding surface.

[0143] Specifically, in one embodiment of the present application, the first surface 31 includes a light entrance area 311, a light exit area 312, and a reflective area 313 disposed between the light entrance area 311 and the light exit area 312. The light entrance area 311 and the light exit area 312 are not provided with a reflective coating, so that light can enter the light deflecting element 30 from the light entrance area 311 and exit the light deflecting element 30 from the light exit area 312. The reflective area 313 is provided with a reflective coating so that light is reflected when passing through the reflective area 313.

[0144] Furthermore, both the light entrance area 311 and the light exit area 312 are located on the first surface 31. That is, the light entering and exiting the camera module 1 are located on the same side of the light deflection element 30. Thus, the optical lens 10 and the photosensitive component 40 are concentrated on the same side of the light deflection element 30. As a result, the height of the camera module 1 is determined solely by the sum of the height of the optical lens 10 or the photosensitive component 40 and the height of the light deflection element 30, which helps to reduce the height of the camera module 1.

[0145] In one embodiment of the present application, the light deflecting element 30 can reflect the light within the light deflecting element 30 an odd number of times to guide the light from the optical lens 10 to pass through the light deflecting element 30 to reach the photosensitive component 40, which can effectively increase the focal length between the optical lens 10 and the photosensitive component 40, that is, it can effectively increase the optical TTL of the camera module 1, so that the camera module 1 is suitable for capturing objects at a long distance and providing high-quality images of the distant objects.

[0146] In one embodiment of the present application, when light is reflected three times within the light deflecting element 30, the light passes through the light entrance area 311 of the first surface 31 and enters the light deflecting element 30; at least some of the light passing through the light entrance area 311 of the first surface 31 is reflected at the second surface 32; at least some of the light reflected from the second surface 32 is reflected at the reflection area 313 of the first surface 31; and at least some of the light reflected from the reflection area 313 of the first surface 31 is reflected at the fourth surface 34, so that the light passes through the light exit area 312 of the first surface 31 and reaches the photosensitive component 40.

[0147] In another embodiment of the present application, when light is reflected five times in the light deflecting element 30, the light passes through the light entrance area 311 of the first surface 31 and enters the light deflecting element 30; at least some of the light passing through the light entrance area 311 of the first surface 31 is reflected at the second surface 32; at least some of the light reflected from the second surface 32 is reflected at the reflection area 313 of the first surface 31; at least some of the light reflected from the reflection area 313 of the first surface 31 is reflected at the third surface 33; at least some of the light reflected from the third surface 33 can reach the light exit area 312 of the first surface 31, and when the incident angle of the light is close to or greater than the critical angle of the light deflecting element 30, the light can be reflected at the light exit area 312 of the first surface 31 under total internal reflection, and at least some of the light reflected from the light exit area 312 of the first surface 31 can reach the fourth surface 34, and finally be reflected at the fourth surface 34, leaving the light deflecting element 30 to reach the photosensitive component 40.

[0148] In one embodiment of the present application, the light deflecting element 30 can be implemented as a single-piece prism. Of course, in other embodiments of the present application, the light deflecting element 30 can also be implemented as a split prism, that is, the light deflecting element 30 can be formed by combining at least two prisms. For example, the split prism can be formed by joining a parallelogram prism and a triangular prism together through adhesive bonding or snap fastening. Of course, the split prism can also be formed by joining two triangular prisms and a parallelogram prism together through adhesive bonding or snap fastening, and this application does not limit this.

[0149] Furthermore, the light deflection element 30 may also include a light shielding film disposed within the integrated prism or between the split prisms. The light shielding film can reduce the effect of stray light on imaging and alleviate glare. In a specific example of the present application, the light shielding film may be a U-shaped structure.

[0150] As shown in Figures 2 to 4, in one embodiment of the present application, the camera module 1 further includes a lens drive assembly 20. The lens drive assembly 20 is configured to drive the optical lens 10 to move along the optical axis relative to the light deflecting element 30 and the photosensitive element 40 to achieve an optical focus function. It is worth noting that the light deflecting element 30 is disposed in the fixed portion of the lens drive assembly 20, and the optical lens 10 is disposed in the movable portion of the lens drive assembly 20, thereby achieving the optical focus function of the camera module 1 by driving the optical lens 10 to move.

[0151] Specifically, in one embodiment of the present application, the lens driving assembly 20 includes a fixed base 21, a lens carrier 23 and a lens driving unit 22, wherein the fixed base 21 is a stator, the lens carrier 23 is a mover, the lens carrier 23 is movably arranged on the fixed base 21, the optical lens 10 is fixed to the lens carrier 23, the light deflection element 30 is fixed to the fixed base 21, and the lens driving unit 22 is configured to drive the lens carrier 23 to move relative to the fixed base 21 along the optical axis.

[0152] The fixed base 21 includes a base body 211 and a mounting portion 213 disposed on the base body 211. The base body 211 extends horizontally, and the mounting portion 213 is located in the middle of the base body 211 and extends vertically from the base body 211. The mounting portion 213 has a mounting groove 2131 that gradually decreases in size from top to bottom along the optical axis. The opening of the mounting groove 2131 faces the side where the optical lens 10 and the photosensitive component 40 are located. The shape of the mounting groove 2131 matches the shape of the light deflecting element 30 to secure the light deflecting element 30 within the mounting groove 2131.

[0153] Furthermore, the height of the mounting portion 213 is not less than the height of the light deflecting element 30 to prevent the top surface of the light deflecting element 30 from protruding above the top surface of the mounting portion 213, thereby preventing the surface of the light deflecting element 30 from being scratched or damaged. For example, in one embodiment of the present application, the top surface of the light deflecting element 30 is flush with the top surface of the mounting portion 213.

[0154] The fixed base 21 further includes a base-side fixing portion 212, which is disposed on a short side of the fixed base 21 near the optical lens 10 and extends in height from the base body 211. In a specific example of the present application, the base-side fixing portion 212 is disposed on the first side 71 of the fixed base 21 and extends in height from the base body 211.

[0155] In one embodiment of the present application, a certain gap is provided between the lens carrier 23 and the fixed base 21, so that the lens carrier 23 is movably disposed in the fixed base 21. Furthermore, at least a portion of the lens carrier 23 is disposed between the base-side fixing portion 212 and the mounting portion 213 of the fixed base 21, so that when the lens carrier 23 is driven, it can move relative to the fixed base 21 along the optical axis.

[0156] The lens carrier 23 includes a lens fixing body 231 and a lens carrier side portion 232. The lens carrier side portion 232 is disposed on a side of the lens fixing body 231 near the base-side fixing portion 212. For example, the lens carrier side portion 232 is located on the first side 71 of the lens fixing body 231. In the present application, the lens carrier side portion 232 and the lens fixing body 231 can be separate structures, fixed together by bonding or snapping; or the lens carrier side portion 232 and the lens fixing body 231 can be an integral structure, with the two parts being integrally formed during the manufacturing process.

[0157] The optical lens 10 is fixed to the lens fixing body 231. The lens fixing body 231 has an opening, the shape of which is adapted to the shape of the optical lens 10 so that the optical lens 10 can be set in the opening. In a specific example of the present application, the lens fixing body 231 has a "C"-shaped groove, and the optical lens 10 is fixed in the "C"-shaped groove, with the opening of the "C"-shaped groove facing the photosensitive component 40; the lens carrier side portion 232 is located on the side of the lens fixing body 231 and is arranged opposite to the base side fixing portion 212. The lens driving portion 22 is arranged between the lens carrier side portion 232 and the lens fixing body 231 to drive the lens carrier 23 to drive the optical lens 10 to move along the optical axis relative to the fixed base 21.

[0158] The lens driving unit 22 includes a focusing magnet 221 and a focusing coil 222, which are arranged opposite to each other in the horizontal direction, wherein the focusing magnet 221 is arranged on one of the fixed base 21 and the lens carrier 23, and the focusing coil 222 is arranged on the other of the fixed base 21 and the lens carrier 23. When the focusing coil 222 is energized, the interaction between the focusing magnet 221 and the focusing coil 222 generates an electromagnetic force to drive the lens carrier 23 to move relative to the fixed base 21 along the optical axis.

[0159] In a specific example of the present application, the focus magnet 221 is fixed to the lens carrier side portion 232, and the focus coil 222 is directly or indirectly fixed to the base-side fixing portion 212. For example, the lens carrier side portion 232 has a focus magnet groove 2323, and the focus magnet 221 is positioned within the focus magnet groove 2323 to prevent the focus magnet 221 from protruding from the lens carrier side portion 232 and increasing the lateral dimensions of the lens drive assembly 20. Furthermore, the base-side fixing portion 212 includes a first support arm 2121 and a second support arm 2123 spaced apart from each other. The first support arm 2121 and the second support arm 2123 extend in the height direction along the short side of the fixing base 21. A coil opening 2125 is defined between the first support arm 2121 and the second support arm 2123, and the focus coil 222 is accommodated within the coil opening 2125. It should be understood that in the present application, the opening direction of the focusing magnet slot 2323 is toward the coil opening 2125 so that the focusing coil 222 and the focusing magnet 221 can be arranged relative to each other.

[0160] The height of the focus magnet 221 is greater than the height of the focus coil 222. When the focus magnet 221 moves along the optical axis with the lens carrier 23, the focus coil 222 is always located within the magnetic field of the focus magnet 221. This prevents the focus magnet 221 and the focus coil 222 from moving apart due to the focus magnet 221 moving relative to the focus coil 222, thereby reducing the interaction force between the focus magnet 221 and the focus coil 222.

[0161] In the present application, the focus drive unit further includes a focus circuit board 223, which is disposed between the first support arm 2121 and the second support arm 2123 of the fixed portion on the fixed base 21 side. The focus coil 222 is disposed and electrically connected to the focus circuit board 223, so that the focus coil 222 is indirectly fixed to the fixed base 21 via the focus circuit board 223. Furthermore, the focus circuit board 223 is disposed on the side of the focus coil 222 away from the focus magnet 221. That is, when the focus coil 222 is accommodated in the coil opening 2125 of the base-side fixed portion 212, one side of the focus coil 222 faces the focus magnet 221, and the other side of the focus coil 222 opposite to the first side faces the focus circuit board 223.

[0162] The area of ​​the focus circuit board 223 is larger than that of the focus coil 222, so that the entire focus coil 222 is disposed on the focus circuit board 223. Specifically, the focus circuit board 223 extends horizontally and vertically on the side of the base-side fixing portion 212. In the horizontal direction, the focus circuit board 223 extends to the first support arm 2121 and the second support arm 2123 to be fixed thereto; in the vertical direction, the focus circuit board 223 extends to the connection circuit board 44 of the photosensitive component 40 to electrically connect to the connection circuit board 44, thereby achieving circuit conduction with external electronic devices.

[0163] In one embodiment of the present application, the lens drive assembly 20 further includes a focus support portion 24, which is clamped between the fixed base 21 and the lens carrier 23. The focus support portion 24 extends parallel to the optical axis. When the lens drive unit 22 drives the lens carrier 23 to move along the optical axis, the focus support portion 24 always supports the lens carrier 23, allowing the lens carrier 23 to move smoothly relative to the fixed base 21. This improves the stability of the lens drive assembly 20 during the optical focusing process, thereby improving image quality.

[0164] In a specific example of the present application, the focus support portion 24 is disposed on the same side as the lens driving portion 22. The focus support portion 24 is disposed between the base-side fixing portion 212 of the fixed base 21 and the lens carrier side portion 232 of the lens carrier 23. Furthermore, the focus support portion 24 includes a top surface, a bottom surface opposite the top surface, and an outer peripheral wall connected between the top and bottom surfaces. The outer peripheral wall of the focus support portion 24 abuts against the base-side fixing portion 212 and the lens carrier side portion 232, respectively. The base body 211 has a guide rod fixing hole 2111, and the bottom surface of the focus support portion 24 is mounted in the guide rod fixing hole 2111 to fix the guide rod support portion to the fixed base 21.

[0165] Furthermore, the focus support portion 24 is implemented as a guide rod, that is, the focus support portion 24 includes a first guide rod 241 and a second guide rod 242. The first guide rod 241 and the second guide rod 242 are arranged parallel to each other and are arranged adjacent to either side of the lens driving portion 22. In other words, the lens driving portion 22 is arranged between the first guide rod 241 and the second guide rod 242. This ensures that when the lens driving portion 22 drives the lens carrier 23 to move along the optical axis, the first guide rod 241 and the second guide rod 242 always provide stable support for the lens carrier 23. It should be understood that in other embodiments of the present application, the focus support portion 24 can also be implemented as a ball bearing, or the focus support portion 24 can also be implemented as a slider, and the present application does not limit this.

[0166] In one embodiment of the present application, the side portion 232 of the lens carrier facing the focus support portion 24 has a first movable rail 2321 and a second movable rail 2322, and the side portion 212 of the base side facing the focus support portion 24 has a first fixed rail 2122 and a second fixed rail 2124, wherein the first movable rail 2321 is arranged opposite to the first fixed rail 2122 to clamp the first guide rod 241 therebetween, and the second movable rail 2322 is arranged opposite to the second fixed rail 2124 to clamp the second guide rod 242 therebetween.

[0167] In the present application, the shape of the first movable rail 2321 and the second movable rail 2322 can be a planar structure, a "∟"-shaped structure, a "["-shaped structure, or a "V"-shaped structure, that is, the contact points between the focus support portion 24 and the first movable rail 2321 or the second movable rail 2322 are one, two, or three. Furthermore, the first fixed rail 2122 and the second fixed rail 2124 are respectively provided on the first support arm 2121 and the second support arm 2123, and the shape of the first fixed rail 2122 and the second fixed rail 2124 can also be a planar structure, a "∟"-shaped structure, a "["-shaped structure, or a "V"-shaped structure, so that the contact points between the focus support portion 24 and the first fixed rail 2122 or the second fixed rail 2124 are one, two, or three. This arrangement allows the first guide rod 241 of the focus support 24 to be securely clamped between the first movable rail 2321 and the first fixed rail 2122, and the second guide rod 242 to be securely clamped between the second movable rail 2322 and the second fixed rail 2124. In one specific example, the first movable rail 2321 is shaped like a "V" and the second movable rail 2322 is shaped like a "["). This allows for precise guidance by the first movable rail 2321, while the structure of the second movable rail 2322 provides assembly tolerance.

[0168] In one embodiment of the present application, the lens drive assembly 20 also includes a focusing magnetic component 25, which is arranged on the focusing circuit board 223. The focusing magnetic component 25 is arranged horizontally relative to the focusing magnet 221 to generate a horizontal magnetic force between the focusing magnet 221 and the focusing magnet 221. The action of the magnetic force causes the focusing support portion 24 to be clamped between the lens carrier side portion 232 and the base side fixing portion 212. In the process of realizing the optical focusing function, the focusing support portion 24 always provides support for the lens carrier 23.

[0169] Specifically, the focusing magnetic component 25 and the focusing coil 222 are arranged on opposite sides of the focusing circuit board 223, that is, the focusing circuit board 223 and the focusing coil 222 are arranged in sequence between the focusing magnetic component 25 and the focusing magnet 221 to avoid excessive magnetic attraction between the focusing magnetic component 25 and the focusing magnet 221, which affects the optical focusing function of the lens drive assembly 20.

[0170] In one embodiment of the present application, the lens drive assembly 20 further includes a focus position sensing element 26. The focus position sensing element 26 is disposed on the focus circuit board 223 and horizontally opposite the focus magnet 221 to facilitate circuit conduction of the focus position sensing element 26. When the lens carrier 23 moves, the relative position of the focus position sensing element 26 and the focus magnet 221 changes. Based on the strength of the magnetic field of the focus magnet 221 sensed by the focus position sensing element 26, the position of the lens carrier 23 can be determined, and the current of the focus coil 222 can be adjusted to move the lens carrier 23 to the desired position.

[0171] In a specific example of the present application, the focus position sensing element 26 is disposed within the focus coil 222 to avoid increasing the size of the lens carrier 23. The focus position sensing element 26 can be implemented as a TMR, a Hall element, or a driver IC.

[0172] Furthermore, in one embodiment of the present application, the camera module 1 further includes a chip driver assembly 60, which is adapted to drive the photosensitive chip 41 of the photosensitive chip 41 to move horizontally, thereby achieving the optical image stabilization function of the camera module 1. In the present application, the chip driver assembly 60 and the lens driver assembly 20 together constitute the driver device of the camera module 1, thereby achieving the chip image stabilization function and lens focus function of the camera module 1. In other words, the driver device includes the lens driver assembly 20 for driving the optical lens 10 to move relative to the light deflection element 30 along the optical axis of the optical lens 10, and the chip driver assembly 60 for driving the photosensitive chip 41 to move relative to the light deflection element 30 along a direction perpendicular to the optical axis of the optical lens 10. It is worth noting that the light deflection element 30 is disposed in the fixed portion of the lens driver assembly 20, and the photosensitive component 40 is disposed in the movable portion of the chip driver assembly 60, thereby achieving the optical image stabilization function of the camera module 1 by driving the photosensitive component 40 to move.

[0173] It should be understood that in the present application, the light is reflected multiple times in the light deflection element 30, and the light deflection element 30 has a correspondingly larger size. In particular, when the light deflection element 30 is implemented as a prism, its weight is also relatively large. Therefore, driving the relatively light optical lens 10 and the photosensitive component 40 to move also reduces the driving force required for the driving component. Using a separate lens driving component 20 to drive the optical lens 10 to achieve the focusing function and using a separate chip driving component 60 to drive the photosensitive component 40 to move to achieve the anti-shake function can avoid interference in the implementation of the focusing function and the anti-shake function, which affects the imaging of the camera module 1.

[0174] The chip driving assembly 60 is configured to drive the photosensitive assembly 40 to move relative to the light deflection element 30 in a direction perpendicular to the optical axis. As shown in Figures 5 to 9, the chip driving assembly 60 includes a housing 61, a frame 63, a chip carrier 65, and a chip driving unit 64. The housing 61 and the fixed base 21 are interlocked. The housing 61 is fixed to the fixed base 21, the frame 63 is fixed to the housing 61, and the chip carrier 65 is movably disposed in the housing 61. The chip driving unit 64 is configured to drive the chip carrier 65 to move relative to the housing 61 and the frame 63. The chip carrier 65 is used to fix the photosensitive assembly 40. The photosensitive assembly 40 is fixed to the chip carrier 65, and the chip carrier 65 is movably disposed in the housing 61, so that the photosensitive chip 41 of the photosensitive assembly 40 moves with the movement of the chip carrier 65. In other words, the photosensitive assembly 40 is movably disposed at the end of the camera module 1 away from the optical lens 10. In a specific example, the chip driving unit 64 is configured to drive the chip carrier 65 to move in the horizontal direction, and the photosensitive chip 41 of the photosensitive component 40 moves in the horizontal direction along with the chip carrier 65 to achieve the chip anti-shake function.

[0175] In one embodiment of the present application, the lens driving unit 22 is located on the peripheral side of the light deflecting element 30 and is arranged close to the optical lens 10, and the chip driving unit 64 is located on the peripheral side of the light deflecting element 30 and is arranged close to the photosensitive component 40, so as to avoid increasing the height of the camera module 1 due to the arrangement of the lens driving unit 22 and the chip driving unit 64.

[0176] Furthermore, the light deflecting element 30 includes two opposite short sides and two opposite long sides, the lens driving unit 22 is arranged on a short side of the light deflecting element 30 close to the optical lens 10, and the chip driving unit 64 is arranged on the other short side and two long sides of the light deflecting element 30 close to the photosensitive component 40.

[0177] Specifically, the housing 61 includes a cover 611 and at least one housing side portion disposed around the cover 611. The at least one housing side portion includes a first housing side portion 612, a second housing side portion 613, a third housing side portion 614, and a fourth housing side portion 615. The first housing side portion 612, the second housing side portion 613, the third housing side portion 614, and the fourth housing side portion 615 integrally extend downward from the circumference of the cover 611 to wrap around the side surfaces of the frame 63, the chip carrier 65, and the chip driver 64. The side away from the optical lens 10 is the third housing side portion 614. The first housing side portion 612, the second housing side portion 613, the third housing side portion 614, and the fourth housing side portion 615 are disposed around the circumference of the cover 611 in a clockwise direction. It should be understood that the camera module 1 has a first side 71, a second side 72, a third side 73 and a fourth side 74 distributed in a clockwise direction, the first shell side 612 is located on the first side 71, the second shell side 613 is located on the second side 72, the third shell side 614 is located on the third side 73, and the fourth shell side 615 is located on the fourth side 74.

[0178] Furthermore, the cover 611 is formed with a lens opening 6111 and at least one frame opening 6112. The lens opening 6111 is located at a position on the cover 611 corresponding to the optical lens 10. The optical lens 10 passes through the lens opening 6111, allowing light to enter the optical lens 10. The at least one frame opening 6112 is located at a position on the cover 611 corresponding to the frame 63. At least a portion of the frame 63 extends toward the cover 611 and is disposed within the at least one frame opening 6112. The frame opening 6112 accommodates at least a portion of the frame 63, allowing the frame 63 to be made thinner while maintaining structural strength.

[0179] The frame 63 is disposed between the chip carrier 65 and the cover 611 of the housing 61 . The frame 63 is fixed to the side of the cover 611 facing the chip carrier 65 by, for example, bonding, so that the relative positions of the frame 63 and the housing 61 remain fixed.

[0180] The chip carrier 65 includes a chip carrier body 651 and at least one chip carrier side portion 652. The at least one chip carrier side portion 652 extends integrally from at least one side of the chip carrier body 651 along the height direction. In one specific example, the at least one chip carrier side portion 652 extends integrally from at least one side of the chip carrier body 651 along the height direction to the side surface of the light deflecting element 30. The photosensitive component 40 is fixed to the chip carrier 65 on the side of the chip carrier body 651 away from the frame 63, so that the photosensitive component 40 is fixed to the chip carrier 65 in a direction facing the light deflecting element 30. It should be understood that the direction of the photosensitive component 40 facing the light deflecting element 30 means that the photosensitive chip 41 of the photosensitive component 40 faces the light deflecting element 30, so that the photosensitive component 40 can receive light emitted from the light deflecting element 30 for imaging. In a specific example, the chip circuit board 42 of the photosensitive component 40 is fixed to the side of the chip carrier body 651 away from the frame 63 by, for example, bonding, so that the photosensitive chip 41 of the photosensitive component 40 is arranged facing the light output area 312 of the light turning element 30.

[0181] The chip driver 64 is disposed between the chip carrier 65 and the housing 61, so that the chip carrier 65 is driven by the chip driver 64 to move horizontally relative to the housing 61. Specifically, the chip driver 64 includes at least one anti-shake magnet 641 and at least one anti-shake coil 642 that are disposed opposite each other. The at least one anti-shake magnet 641 is fixed to one of the chip carrier 65 and the housing 61, and the at least one anti-shake coil 642 is fixed to the other of the chip carrier 65 and the housing 61. The at least one anti-shake magnet 641 and the at least one anti-shake coil 642 are disposed opposite each other in the horizontal direction, so that the chip carrier 65 can be driven to move relative to the housing 61 by the magnetic force between the at least one anti-shake magnet 641 and the at least one anti-shake coil 642, thereby realizing the chip anti-shake function.

[0182] In one example, at least one anti-shake magnet 641 and at least one anti-shake coil 642 are horizontally arranged between the chip carrier 65 and the housing 61. Specifically, the at least one anti-shake magnet 641 is fixed to at least one chip carrier side portion 652 of the chip carrier 65, and the at least one anti-shake coil 642 is fixed to at least one housing side portion of the housing 61. The at least one anti-shake magnet 641 and the at least one anti-shake coil 642 are arranged horizontally relative to each other. That is, in this example, the at least one anti-shake magnet 641 and the at least one anti-shake coil 642 are arranged horizontally relative to each other. In the process of implementing chip anti-shake, the at least one anti-shake magnet 641 serves as a mover, and the at least one anti-shake coil 642 serves as a stator. The at least one anti-shake coil 642 drives the at least one anti-shake magnet 641 to move, thereby driving the chip carrier 65 to move.

[0183] Among them, the focusing magnet 221 and at least one anti-shake magnet 641 extend in the height direction around the optical deflection element 30, and the bottom surface of the focusing magnet 221 is lower than the bottom surface of the at least one anti-shake magnet 641. The focusing coil 222 and at least one anti-shake coil 642 extend in the height direction around the optical deflection element 30, and the bottom surface of the focusing coil 222 is lower than the bottom surface of the at least one anti-shake coil 642. This arrangement allows the lens drive unit 22 to extend as downward as possible in the height direction. On the one hand, the height dimensions of the focusing coil 222 and the focusing magnet 221 can be increased so that a greater force is generated when the focusing magnet 221 and the focusing coil 222 interact with each other; on the other hand, a larger moving stroke can be provided for the lens drive unit 22 to meet the stroke requirements during optical focusing.

[0184] Furthermore, the chip driving unit 64 also includes an anti-shake circuit board 643, at least one anti-shake coil 642 is fixed and electrically connected to the anti-shake circuit board 643, and the anti-shake circuit board 643 is fixed to at least one shell side of the shell 61, so that at least one anti-shake coil 642 is fixed to at least one shell side of the shell 61 through the anti-shake circuit board 643.

[0185] In a specific example, the at least one anti-shake magnet 641 includes three anti-shake magnets: a first anti-shake magnet 6411, a second anti-shake magnet 6412, and a third anti-shake magnet 6413. The first anti-shake magnet 6411 and the third anti-shake magnet 6413 are respectively arranged on two sides adjacent to the second anti-shake magnet 6412; the at least one chip carrier side portion 652 includes a first chip carrier side portion 6521, a second chip carrier side portion 6522, and a second chip carrier side portion 6523 extending integrally from three sides of the chip carrier body 651 in the height direction. The chip carrier body 651 and the photosensitive component 40 are provided with three chip carrier side portions 652, namely, a first anti-shake magnet 6411 fixed to the first chip carrier side portion 6521, a second anti-shake magnet 6412 fixed to the second chip carrier side portion 6522, and a third anti-shake magnet 6413 fixed to the third chip carrier side portion 6523. The three anti-shake magnets are respectively fixed to the three chip carrier side portions 652 and are arranged on three sides of the chip carrier body 651 and the photosensitive component 40. The first anti-shake magnet 6411, the second anti-shake magnet 6412, and the third anti-shake magnet 6413 are respectively arranged on three sides close to the photosensitive component 40. It is worth noting that in the present application, since one side of the chip carrier 65 is adjacent to the optical lens 10 and the elongated light deflection element 30 is disposed below the optical lens 10 and the photosensitive component 40, in the technical solution of the present application, the chip carrier body 651 and the photosensitive component 40 include four sides, the optical lens 10 is disposed on one side, and the first anti-shake magnet 6411, the second anti-shake magnet 6412, and the third anti-shake magnet 6413, as well as the first chip carrier side portion 6521, the second chip carrier side portion 6522, and the third chip carrier side portion 6523 are disposed on the other three sides, respectively. According to the above-mentioned anti-shake magnet arrangement, the first anti-shake magnet 6411, the second anti-shake magnet 6412, and the third anti-shake magnet 6413 are distributed in a U-shape on three sides of the chip carrier body 651 and the photosensitive component 40, with the opening of the U-shape facing the optical lens 10.

[0186] It is worth mentioning that in the above specific example, the top surface of at least one anti-shake magnet 641 (the first anti-shake magnet 6411, the second anti-shake magnet 6412 and the third anti-shake magnet 6413) is higher than the chip circuit board 42, and the bottom surface of at least one anti-shake magnet 641 is lower than the top surface of the light turning element 30. The size of at least one anti-shake magnet 641 in the height direction can be designed to be larger, thereby having a greater driving force.

[0187] It should be understood that in this example, to ensure more reliable and precise fixation of the anti-shake magnets, the first chip carrier side 6521, the second chip carrier side 6522, and the third chip carrier side 6523 may respectively have a first anti-shake magnet slot 65211, a second anti-shake magnet slot, and a third anti-shake magnet slot facing the second housing side 613, the third housing side 614, and the fourth housing side 615. The first anti-shake magnet 6411, the second anti-shake magnet, and the third anti-shake magnet slot are respectively disposed in the first anti-shake magnet slot 65211, the second anti-shake magnet slot, and the third anti-shake magnet slot. This can also reduce the lateral size of the chip driver assembly 60.

[0188] Accordingly, the at least one anti-shake coil 642 includes a first anti-shake coil 6421 horizontally opposite the first anti-shake magnet 6411, a second anti-shake coil 6422 and a third anti-shake coil 6423 horizontally opposite the second anti-shake magnet 6412, and a fourth anti-shake coil 6424 horizontally opposite the third anti-shake magnet 6413. The first anti-shake coil 6421, the second anti-shake coil 6422, the third anti-shake coil 6423, and the fourth anti-shake coil 6424 are respectively fixed to the side of the anti-shake circuit board 643 facing the first anti-shake magnet 6411, the second anti-shake magnet 6412, and the third anti-shake magnet 6413. The second anti-shake coil 6422 and the third anti-shake coil 6423 are arranged on the same side, and the first anti-shake coil 6421 and the fourth anti-shake coil 6424 are respectively arranged on either side of the second anti-shake coil 6422 and the third anti-shake coil 6423. The anti-shake circuit board 643 is fixed to the second, third, and fourth housing sides 613, 614, and 615 of the housing 61, such that the anti-shake circuit board 643 surrounds the first, second, and third chip carrier sides 6521, 6522, and 6523 of the chip carrier 65. The anti-shake circuit board 643 is preferably a flexible circuit board or a rigid-flexible board that can be bent. It should be understood that to ensure sufficient structural strength for the anti-shake circuit board 643, four reinforcement plates 6431 are also fixed to the back surface of the anti-shake circuit board 643, opposite the front surface where the at least one anti-shake coil 642 is located. The four reinforcement plates 6431 correspond to the four anti-shake coils, respectively.

[0189] It is worth mentioning that the first anti-shake magnet 6411 and the third anti-shake magnet 6413 are adjacently arranged on both sides of the second anti-shake magnet 6412. The first anti-shake magnet 6411 and the third anti-shake magnet 6413 are parallel to each other, and the second anti-shake magnet 6412 is perpendicular to the first anti-shake magnet 6411 and the third anti-shake magnet 6413 respectively. In this way, the chip carrier 65 can be driven to move along the first horizontal direction through the magnetic force between the first anti-shake coil 6421 and the first anti-shake magnet 6411, and the magnetic force between the third anti-shake magnet 6413 and the fourth anti-shake coil 6424. The chip carrier 65 can be driven to move along the second horizontal direction through the magnetic force between the second anti-shake magnet 6412 and the third anti-shake coil 6423 and the fourth anti-shake coil 6424. The second horizontal direction and the first horizontal direction are perpendicular to each other.

[0190] Furthermore, the magnetic pole direction of at least one anti-shake magnet 641 is perpendicular to the winding plane of at least one anti-shake coil 642. It should be understood that the magnetic pole direction of a magnet refers to the direction in which the north pole (north pole) of the magnet points to the south pole (south pole), and the winding plane of a coil is the plane in which the largest surface of the coil is located. In other words, the magnetic pole direction of the first anti-shake magnet 6411 is perpendicular to the winding plane of the first anti-shake coil 6421, the magnetic pole direction of the second anti-shake magnet 6412 is perpendicular to the winding plane of the second anti-shake coil 6422 and the winding plane of the third anti-shake coil 6423, and the magnetic pole direction of the third anti-shake magnet 6413 is perpendicular to the winding plane of the fourth anti-shake coil 6424. Therefore, during the operation of the chip driving component 60, the first anti-shake coil 6421 drives the first anti-shake magnet 6411 to approach or move away from the first anti-shake coil 6421 so that the vertical distance between the first anti-shake coil 6421 and the first anti-shake magnet 6411 is changed, thereby realizing the movement of the chip carrier 65 along the first horizontal direction, the fourth anti-shake coil 6424 drives the third anti-shake magnet 6413 to approach or move away from the fourth anti-shake coil 6424 so that the vertical distance between the fourth anti-shake coil 6424 and the third anti-shake magnet 6413 is changed, thereby realizing the movement of the chip carrier 65 along the first horizontal direction, the second anti-shake coil 6422 or the third anti-shake coil 6423 drives the fourth anti-shake magnet to approach or move away from the second anti-shake coil 6422 or the third anti-shake coil 6423 so that the vertical distance between the second anti-shake coil 6422, the third anti-shake coil 6423 and the second anti-shake magnet 6412 is changed, thereby realizing the movement of the chip carrier 65 along the second horizontal direction. That is, at least one anti-shake coil 642 drives at least one anti-shake magnet 641 to move closer to or away from at least one anti-shake coil 642 so that the vertical distance between at least one anti-shake coil 642 and at least one anti-shake magnet 641 is changed, thereby realizing the chip anti-shake function.

[0191] It is worth mentioning that, in one example, the inner magnetic poles of the first, second, and third anti-shake magnets 6411, 6412, and 6413 are the same, that is, the magnetic poles of the first, second, and third anti-shake magnets 6411, 6412, and 6413 facing the photosensitive component 40 are the same. It should be understood that the anti-shake coil is disposed on the outer side of the anti-shake magnet, and the inner side of the anti-shake magnet refers to the side thereof away from the anti-shake coil.

[0192] It's worth noting that in the above example, the second anti-shake magnet 6412 is positioned opposite both the second anti-shake coil 6422 and the third anti-shake coil 6423. The second and third anti-shake coils 6422 and 6423 can be independently controlled, allowing the magnetic forces between the second anti-shake coil 6422 and the second anti-shake magnet 6412 and the magnetic forces between the third anti-shake coil 6423 and the second anti-shake magnet 6412 to differ in magnitude or direction, thereby driving the chip carrier 65 to rotate about the Z-axis, achieving chip rotation anti-shake. It should be understood that the second anti-shake magnet 6412 can also be implemented as two separate anti-shake magnets, each positioned opposite the second anti-shake coil 6422 and the third anti-shake coil 6423, respectively, to also achieve chip rotation anti-shake. It should be understood that the chip driver assembly 60 can also be devoid of the third anti-shake coil 6423, with the second anti-shake magnet 6412 positioned only horizontally opposite the second anti-shake coil 6422.

[0193] Furthermore, the chip driving component 60 also includes an anti-shake position sensing unit 68 for sensing the position of the chip carrier 65 and the photosensitive component 40. The anti-shake position sensing unit 68 includes at least two anti-shake sensing elements. The at least two anti-shake sensing elements are used to sense the position changes of at least two anti-shake magnets in at least one anti-shake magnet 641 to obtain the position of the chip carrier 65 and the photosensitive component 40 fixed to the at least one anti-shake magnet 641. Specifically, in one embodiment, the at least two anti-shake sensing elements include a first anti-shake sensing element 681 opposite the first anti-shake magnet 6411 and a second anti-shake sensing element 682 opposite the second anti-shake magnet 6412. The first anti-shake sensing element 681 and the second anti-shake sensing element 682 are fixed to and electrically connected to the anti-shake circuit board 643. Thus, the first anti-shake sensing element 681 is used to obtain position change information of the first anti-shake magnet 6411, and the second anti-shake sensing element 682 is used to obtain position change information of the second anti-shake magnet 6412, thereby obtaining position change information of the chip carrier 65 and the photosensitive component 40. In an alternative embodiment, the first anti-shake sensing element 681 is disposed in the first anti-shake coil 6421, and the second anti-shake sensing element 682 is disposed in the second anti-shake coil 6422.

[0194] In another specific example of the present application, the at least two anti-shake sensing elements further include a third anti-shake sensing element 683, located opposite the second anti-shake magnet 6412. This third anti-shake sensing element 683 is also fixed and electrically connected to the anti-shake circuit board 643. The third anti-shake sensing element 683 and the second anti-shake sensing element 682 are respectively configured to sense changes in the magnetic field across the second anti-shake magnet 6412, thereby detecting changes in the tilt of the second anti-shake magnet 6412 relative to the third housing side 614. This allows the anti-shake position sensing unit 68 to also detect the rotational state of the chip carrier 65 and the photosensitive component 40. In an alternative embodiment, the third anti-shake sensing element 683 is disposed within the third anti-shake coil 6423. The first anti-shake sensing element 681, the second anti-shake sensing element 682, and the third anti-shake sensing element 683 can be implemented as TMRs, Hall effect sensors, or driver ICs.

[0195] Furthermore, the chip driver assembly 60 also includes an anti-shake support portion 66 and an anti-shake magnetic portion 67. The anti-shake support portion 66 is disposed between the frame 63 and the chip carrier 65 to maintain an air gap between the chip carrier 65 and the frame 63, thereby reducing resistance to movement of the chip carrier 65 relative to the frame 63 and the housing 61. In one specific example, the anti-shake support portion 66 can be implemented as a ball bearing and include at least three balls 661. Specifically, the at least three balls 661 are disposed along the height direction between the frame 63 and the chip carrier body 651 of the chip carrier 65 to maintain a fixed height gap between the frame 63 and the chip carrier 65. It is worth noting that the at least three balls 661 can roll between the frame 63 and the chip carrier 65, or the at least three balls 661 can be fixed to one of the frame 63 or the chip carrier 65 so as to slide relative to the other. It should be understood that the anti-shake support portion 66 may also be implemented as other elements such as a spring or a slider.

[0196] The anti-shake magnetic portion 67 is fixed to the frame 63 and positioned above at least one anti-shake magnet 641. The anti-shake magnetic portion 67 and the at least one anti-shake magnet 641 are magnetically attracted to each other, thereby clamping the anti-shake support portion 66 between the frame 63 and the chip carrier 65. The anti-shake magnetic portion 67 is made of a material suitable for magnet attraction and can be magnetically attracted to the at least one anti-shake magnet 641, thereby vertically attracting the chip carrier 65 toward the frame 63. The frame 63 and the chip carrier 65 vertically clamp at least three balls 661. It should be understood that the anti-shake magnetic portion 67 can be fixed to the frame 63 by insert molding or bonding. Specifically, the anti-shake magnetic portion 67 can be embedded in the frame 63, or at least partially not enclosed by the frame 63.

[0197] Furthermore, in order to limit the range of movement of the ball 661, the frame 63 also includes at least three frame ball grooves 631 formed on the bottom surface of the frame 63, and the chip carrier body 651 also includes at least three carrier ball grooves 6511 formed on the top surface of the chip carrier body 651, and the positions of the frame ball grooves 631 and the carrier ball grooves 6511 correspond to each other to form a accommodating cavity suitable for accommodating and limiting the range of movement of the ball 661.

[0198] Furthermore, to reduce the height of the chip driver assembly 60, the portion of the frame 63 forming the at least three frame ball grooves 631 extends toward the cover 611 and is disposed in at least one frame opening 6112. Thus, a portion of the frame 63 is formed within the frame opening 6112, thereby preventing the thickness of the frame 63 from being excessively increased due to the provision of the frame ball grooves 631. In one embodiment, a portion of the frame 63 can be embedded in the frame opening 6112.

[0199] In a specific example, as shown in Figures 5, 6 and 8, the anti-shake support part 66 includes three balls 661 of the same size, three frame ball grooves 631 are formed on the bottom surface of the frame 63, and three carrier ball grooves 6511 corresponding to the three frame ball grooves 631 are formed on the top surface of the chip carrier body 651. The three balls 661 are respectively arranged in three ball accommodating cavities formed by the three frame ball grooves 631 and the three carrier ball grooves 6511. It should be understood that three balls 661 can form a support plane, and a larger number of balls 661 will form multiple support planes. For example, when the number of balls 661 is implemented as four, the four balls 661 will form four support planes (any three of the balls 661 form a support plane). The multiple support planes will make it possible for the chip carrier 65 to be adsorbed to the frame 63 through the anti-shake magnetic part 67. The chip carrier 65 will be supported on any three of the multiple balls 661. Therefore, due to the existence of multiple support planes, when the magnetic attraction force between the anti-shake magnetic part 67 and at least one anti-shake magnet 641 is uneven, the chip carrier 65 will be at risk of tilting relative to the frame 63. Accordingly, in a preferred example, three frame ball grooves 631 are formed in a triangular shape on the bottom surface of the frame 63, and three carrier ball grooves 6511 are formed in a triangular shape on the top surface of the chip carrier body 651 corresponding to the three frame ball grooves 631. The distance between any one of the three frame ball grooves 631 and the other two frame ball grooves 631 is equal, and the distance between any one of the three carrier ball grooves 6511 and the other two carrier ball grooves 6511 is equal.

[0200] In a specific example, as shown in Figures 5 to 7, the anti-shake magnetic part 67 includes a first anti-shake magnetic component 671 and a second anti-shake magnetic component 672. The first anti-shake magnetic component 671 and the second anti-shake magnetic component 672 are symmetrically arranged on both sides of the anti-shake support part 66, wherein the first anti-shake magnetic component 671 is arranged above the first anti-shake magnet 6411, and the second anti-shake magnetic component 672 is arranged above the third anti-shake magnet 6413. It should be understood that since in the chip driving component 60 of the present application, there is no anti-shake magnet on the opposite side of the second anti-shake magnet 6412, the first anti-shake magnet 6411, the second anti-shake magnet 6412 and the third anti-shake magnet 6413 are only arranged on three sides of the chip carrier 65, wherein the first anti-shake magnet 6411 and the third anti-shake magnet 6413 are arranged opposite to each other, and the first anti-shake magnetic attraction component 671 is arranged above the first anti-shake magnet 6411, and the second anti-shake magnetic attraction component 672 is arranged above the third anti-shake magnet 6413, so that the anti-shake magnetic attraction part 67 is only arranged opposite to the first anti-shake magnet 6411 and the third anti-shake magnet 6413, which can make the magnetic attraction force generated by the anti-shake magnetic attraction part 67 more uniform. In other words, in this example, at least part of the anti-shake magnetic part 67 overlaps with the first anti-shake magnet 6411 and the third anti-shake magnet 6413 in the height direction, and the anti-shake magnetic part 67 does not overlap with the second anti-shake magnet 6412 in the height direction. That is, at least part of the first anti-shake magnetic component 671 overlaps with the first anti-shake magnet 6411 in the height direction, and at least part of the second anti-shake magnetic component 672 overlaps with the third anti-shake magnet 6413 in the height direction.

[0201] Furthermore, in one example, in the longitudinal direction, the length of the first anti-shake magnetic assembly 671 is shorter than the length of the first anti-shake magnet 6411, and the length of the second anti-shake magnetic assembly 672 is shorter than the length of the third anti-shake magnet 6413. When the chip carrier 65 moves relative to the frame 63, at least a portion of the projection of the first anti-shake magnetic assembly 671 in the height direction falls on the projection of the first anti-shake magnet 6411 in the height direction, and the projection of the first anti-shake magnetic assembly 671 in the height direction is completely inside the projection of the first anti-shake magnet 6411 in the height direction. At least a portion of the projection of the second anti-shake magnetic assembly 672 in the height direction falls on the projection of the third anti-shake magnet 6413 in the height direction, and the projection of the second anti-shake magnetic assembly 672 in the height direction is completely inside the projection of the third anti-shake magnet 6413 in the height direction. In other words, when the chip carrier 65 moves relative to the frame 63, the first anti-shake magnetic component 671's longitudinal ends are always located within the longitudinal ends of the first anti-shake magnet 6411, and the second anti-shake magnetic component 672's longitudinal ends are always located within the longitudinal ends of the third anti-shake magnet 6413. This allows the anti-shake magnetic component 67 to maintain height overlap with the first and third anti-shake magnets 6411 and 6413 as the chip carrier 65 moves longitudinally relative to the frame 63, thereby maintaining sufficient magnetic attraction.

[0202] It is worth mentioning that in the present application, the height direction is parallel to the direction of light incident on the photosensitive component 40, the length direction is parallel to the direction of the longest side of the first anti-shake magnet 6411 or the third anti-shake magnet 6413, and the width direction is parallel to the direction of the longest side of the second anti-shake magnet 6412. Any one of the height direction, length direction and width direction is perpendicular to the other two directions.

[0203] In one example, in the width direction, the width of the first anti-shake magnetic assembly 671 is greater than the width of the first anti-shake magnet 6411, and the width of the second anti-shake magnetic assembly 672 is greater than the width of the third anti-shake magnet 6413. When the chip carrier 65 moves relative to the frame 63, at least a portion of the projection of the first anti-shake magnet 6411 in the height direction falls on the projection of the first anti-shake magnetic assembly 671 in the height direction, wherein, in the width direction, the projection of the first anti-shake magnet 6411 in the height direction is completely inside the projection of the first anti-shake magnetic assembly 671 in the height direction; and at least a portion of the projection of the third anti-shake magnet 6413 in the height direction falls on the projection of the second anti-shake magnetic assembly 672 in the height direction, wherein, in the width direction, the projection of the third anti-shake magnet 6413 in the height direction is completely inside the projection of the second anti-shake magnetic assembly 672 in the height direction. In other words, when the chip carrier 65 moves relative to the frame 63, the first anti-shake magnet 6411's longitudinal ends are always located within the longitudinal ends of the first anti-shake magnetic assembly 671, and the third anti-shake magnet 6413's longitudinal ends are always located within the longitudinal ends of the second anti-shake magnetic assembly 672. This allows the anti-shake magnetic portion 67 to maintain height overlap with the first and third anti-shake magnets 6411 and 6413 even when the chip carrier 65 moves widthwise relative to the frame 63, thereby maintaining sufficient magnetic attraction.

[0204] More specifically, the first anti-shake magnetic assembly 671 includes a first inner magnetic component 6711 and a first outer magnetic component 6712. The second anti-shake magnetic assembly 672 includes a second inner magnetic component 6721 and a second outer magnetic component 6722. The first inner magnetic component 6711, the first outer magnetic component 6712, the second inner magnetic component 6721, and the second outer magnetic component 6722 are respectively fixed to the frame 63. The first inner magnetic component 6711 and the first outer magnetic component 6712 are positioned above the first anti-shake magnet 6411, and the second inner magnetic component 6721 and the second outer magnetic component 6722 are positioned above the third anti-shake magnet 6413. In other words, along the height direction, at least portions of the first inner magnetic component 6711 and the first outer magnetic component 6712 overlap with the first anti-shake magnet 6411, and at least portions of the second inner magnetic component 6721 and the second outer magnetic component 6722 overlap with the third anti-shake magnet 6413. It should be understood that by providing four smaller anti-shake magnetic components, the required magnetic attraction force can be met while avoiding excessive magnetic attraction force. Furthermore, the four anti-shake magnetic components are evenly arranged around the at least three balls 661, ensuring a relatively uniform magnetic attraction force between the four anti-shake magnetic components and the at least one anti-shake magnet 641 acting on the at least three balls 661.

[0205] More specifically, the first inner magnetic member 6711 is positioned above the first anti-shake magnet 6411, close to the anti-shake support portion 66. The first outer magnetic member 6712 is positioned above the first anti-shake magnet 6411, away from the anti-shake support portion 66. The second inner magnetic member 6721 is positioned above the third anti-shake magnet 6413, close to the anti-shake support portion 66. The second outer magnetic member 6722 is positioned above the third anti-shake magnet 6413, away from the anti-shake support portion 66. This ensures that when the chip carrier 65 is driven to move relative to the frame 63, the magnetic attraction between the anti-shake magnetic portion 67 and the first and second anti-shake magnets 6411, 6412 is more evenly distributed.

[0206] It is worth mentioning that the setting method of the anti-shake magnetic attraction part 67 in this application also has a good chip carrier 65 reset function. It can not only achieve stable magnetic attraction in the linear motion of the chip carrier 65, but also achieve stable magnetic attraction in the rotational motion of the chip carrier 65, so that the chip carrier 65 can be reset quickly and accurately.

[0207] It should be understood that in other embodiments of the present application, the anti-shake magnetic portion 67 can also be replaced with a spring structure, or the anti-shake magnetic portion 67 and the spring can be used simultaneously as a suspension structure to suspend the chip carrier 65.

[0208] Furthermore, the chip driving component 60 also includes a base 62 arranged on the bottom surface of the chip driving component 60. The base 62 is fixed to the bottom of the fixed base 21 and the bottom of the shell 61, thereby enhancing the fixed connection strength between the shell 61 and the fixed base 21 and protecting internal components such as the photosensitive component 40.

[0209] Furthermore, the photosensitive component 40 also includes a connecting circuit board 44, which is fixed and electrically connected to the chip circuit board 42 to provide electrical conduction between the chip circuit board 42 and external electronic devices. The applicant has discovered that when the photosensitive component 40 is driven by the chip driving component 60 to achieve movement, the connecting circuit board 44 becomes one of the sources of resistance to the movement of the photosensitive component 40. Therefore, in this application, the applicant further improves the connecting circuit board 44 of the photosensitive component 40 to reduce the resistance encountered by the photosensitive component 40 when being driven to achieve chip anti-shake.

[0210] As further shown in Figures 2 and 9, the connecting circuit board 44 includes a first connecting portion 441, a second connecting portion 442 and a lead-out portion 443, wherein the first connecting portion 441 and the second connecting portion 442 are respectively connected to the chip circuit board 42 and electrically conductive, and the lead-out portion 443 is connected to the first connecting portion 441 and the second connecting portion 442 and electrically conductive. It is worth mentioning that in the present application, the connecting circuit board 44 can be a flexible circuit board or a soft-hard combination board, so that the connecting circuit board 44 can be bent to adapt to the space inside the camera module 1. For example, the connecting circuit board 44 is bent from the top of the chip circuit board 42 to the bottom of the fixed base 21 in the housing 61 and extends to the outside of the camera module 1 to achieve circuit conductivity between the chip circuit board 42 and the external electronic device.

[0211] Specifically, the first and second connecting portions 441, 442 extend laterally from either side of the chip circuit board 42, away from the chip circuit board 42, then bend toward the fixed base 21 and extend around the side of the fixed base 21. The first and second connecting portions 441, 442 connect near the second anti-shake magnet 6412 and are connected to the lead-out portion 443. This arrangement reduces resistance when the photosensitive assembly 40 is driven horizontally by the chip driver assembly 60. Furthermore, the lead-out portion 443 extends lengthwise below the fixed base 21, extending from the chip driver assembly 60 side of the camera module 1 to the lens driver assembly 20 side. The anti-shake circuit board 643 and the focus circuit board 223 are each electrically connected to the lead-out portion 443, ensuring electrical continuity between the chip driver assembly 60 and the lens driver assembly 20. It is worth mentioning that other electronic components can also be electrically connected and fixed on the lead-out part 443. For example, the anti-shake control chip 4431, capacitors and other electronic components used to control the chip driving component 60 can be electrically connected to the lead-out part 443. Accordingly, the fixed base 21 is concave to form an electronic component accommodating cavity to accommodate the above-mentioned electronic components.

[0212] It should be understood that the lens driver assembly 20 and chip driver assembly 60 of the present application can be used not only in a telephoto camera module having a light deflection element 30, but also in a vertical module. For example, Figure 10 shows an independent chip driver assembly 60, whose internal structure is the same as the chip driver assembly 60 shown in Figures 1 to 9 above.

[0213] Figures 11 to 17 illustrate a camera module 1a according to some embodiments of the present application. The camera module 1a includes an optical lens 10a, a light deflecting element 30a, a photosensitive component 40a, and a drive device 60a. The light deflecting element 30a is disposed between the optical lens 10a and the photosensitive component 40a, so that light incident on the optical lens 10a is reflected at least once within the light deflecting element 30a before reaching the photosensitive component 40a. The light deflecting element 30a folds the light emitted from the optical lens 10a and guides it to the photosensitive component 40a, thereby forming an image through the photosensitive component 40a to obtain image information. It is worth noting that the light deflecting element 30a is in an elongated strip shape, so that light can be reflected multiple times within the light deflecting element 30a, thereby folding the optical path multiple times.

[0214] It should be understood that in the present application, the position of one or more components in the optical lens 10a, the light deflection element 30a or the photosensitive component 40a in the camera module 1a can be adjusted to achieve the optical focus and / or optical image stabilization function of the camera module 1a. For example, the driving device 60a can be configured to drive one or more components in the optical lens 10a, the light deflection element 30a or the photosensitive component 40a to move.

[0215] The optical lens 10a has an optical axis. Light incident on the light deflection element 30a along the optical axis is reflected at least once within the light deflection element 30a, thereby deflecting the light from propagating along the optical axis to propagating in another direction approximately orthogonal to the optical axis, and finally exiting along the optical axis to reach the photosensitive component 40a. For ease of description, a rectangular coordinate system is established, with the Z axis approaching the optical axis of the optical lens 10a or parallel to the optical axis of the optical lens 10a. The Z axis is perpendicular to the plane containing the X and Y axes. The X and Y axes are mutually perpendicular. The XOY plane containing the X and Y axes is also referred to as the horizontal plane, with the horizontal direction being the direction perpendicular to the optical axis of the optical lens 10a. That is, the X axis represents the length of the camera module 1a, the Y axis represents the width of the camera module 1a, and the Z axis represents the height of the camera module 1a. It should be understood that in the embodiments of the present application, the optical axis of the optical lens 10a is also referred to as the optical axis of the camera module 1a.

[0216] As shown in Figures 11 to 13B, the light deflecting element 30a includes multiple reflective surfaces. The light emitted by the optical lens 10a is reflected multiple times on the multiple reflective surfaces of the light deflecting element 30a. After being emitted by the light deflecting element 30a, the light reaches the photosensitive component 40a. The photosensitive component 40a and the optical lens 10a are arranged on the same side of the light deflecting element 30a. Therefore, the height dimension of the camera module 1a only needs to consider the sum of the height dimension of one of the photosensitive component 40a and the optical lens 10a and the height dimension of the light deflecting element 30a, without having to simultaneously superimpose the heights of the optical lens 10a, the light deflecting element 30a and the photosensitive component 40a. In this way, the height dimension of the camera module 1a can be reduced. In a specific example, the optical lens 10a and the light deflecting element 30a form an "L"-shaped structure, and the photosensitive component 40a is arranged in the corner space formed by the optical lens 10a and the light deflecting element 30a. The height dimension of the optical lens 10a is greater than the height dimension of the photosensitive component 40a, and the top surface of the optical lens 10a is higher than the top surface of the photosensitive component 40a. In this way, the photosensitive component 40a does not affect the height of the camera module 1a, wherein the top surface of the optical lens 10a and the top surface of the photosensitive component 40a respectively refer to the side thereof away from the light deflecting element 30a. In the present application, the optical lens 10a and the light deflecting element 30a together constitute the optical component of the camera module 1a of the present application. In other words, the optical component includes the optical lens 10a and the light deflecting element 30a.

[0217] The optical lens 10a includes a lens barrel 12a and at least one optical lens 11a housed in the lens barrel 12a. The optical lens 10a collects light from the subject and transmits it to the light deflection element 30a. The optical lens 10a has an optical axis that is perpendicular to the light deflection element 30a. In a specific example of the present application, as shown in Figures 12A to 12C, the optical lens 10a includes three optical lenses 11a, namely, a first lens L1a, a second lens L2a, and a third lens L3a, arranged along the incident direction of the light. The first lens L1a, the second lens L2a, and the third lens L3a are fixed to the lens barrel 12a, thereby maintaining the spacing between the three optical lenses 11a.

[0218] In one embodiment of the present application, the optical lens 11a may be a spherical lens. Alternatively, in another embodiment of the present application, the optical lens 11a may include a combination of an aspherical lens and a spherical lens. It should be understood that a spherical lens may refer to a lens having a uniform curve across at least one surface thereof, similar to a sphere, while an aspherical lens may refer to a lens having a surface whose curvature gradually changes from the center of the lens to the edge.

[0219] In one embodiment of the present application, the camera module 1a further includes a compensation lens group 20a, which can be disposed between the light deflection element 30a and the photosensitive component 40a. The compensation lens group 20a can further modulate the light emitted from the light deflection element 30a. For example, the compensation lens group 20a can further converge the light emitted from the light deflection element 30a to reduce the back focus, thereby achieving the purpose of reducing the size of the camera module 1a. In a specific example, as shown in FIG12C , the compensation lens group 20a includes a compensation lens 21a, which is disposed between the light deflection element 30a and the photosensitive component 40a. For example, the compensation lens 21a can be fixed to the light deflection element 30a by gluing.

[0220] Continuing with Figures 12A to 12C , the photosensitive assembly 40a includes a circuit board assembly 401a, a photosensitive chip 41a electrically connected to the circuit board assembly 401a, and at least one electronic component 43a. The photosensitive surface of the photosensitive chip 41a faces the light deflection element 30a to receive light emitted from the light deflection element 30a. In one specific example, the photosensitive chip 41a is fixed to the side of the circuit board assembly 40a facing the light deflection element 30a. The at least one electronic component 43a can be implemented as a passive electronic device such as a capacitor or resistor, or an active electronic device such as a diode or memory chip. The at least one electronic component 43a can be disposed on the side of the circuit board assembly 401a facing the light deflection element 30a or on the other side away from the light deflection element 30a.

[0221] Furthermore, circuit board assembly 401a includes a chip circuit board 42a, a first connecting strip 44a, and a second connecting strip 45a. The first connecting strip 44a and the second connecting strip 45a are respectively arranged on opposite sides of chip circuit board 42a. The first connecting strip 44a and the second connecting strip 45a extend horizontally from chip circuit board 42a, that is, chip circuit board 42a, first connecting strip 44a, and second connecting strip 45a are connected as a whole. In one embodiment of the present application, photosensitive chip 41a is fixed to the side of chip circuit board 42a facing light deflection element 30a. Photosensitive chip 41a is connected to the circuit of external electronic equipment through chip circuit board 42a, first connecting strip 44a, and second connecting strip 45a.

[0222] Furthermore, in some embodiments of the present application, the camera module 1a also includes a filter component 50a, which is arranged on the optical path of the light, and the camera module 1a can filter out unnecessary stray light (such as infrared light) through the filter component 50a. In one embodiment of the present application, the filter component 50a is arranged between the light deflection element 30a and the photosensitive component 40a. For example, in a specific example, the filter component 50a includes a filter element 51a and a filter element bracket 52a for supporting the filter element 51a. The filter element 51a is supported on the filter element bracket 52a by, for example, gluing. The two sides of the filter element bracket 52a are respectively fixed to the chip circuit board 42a, so that the filter component 50a is arranged between the light deflection element 30a and the photosensitive chip 41a. In other embodiments of the present application, the filter component 50a can be arranged in the light deflecting element 30a and / or the optical lens 10a. For example, the filter component 50a can be implemented as a layer of filter film, which is attached to a surface of the light deflecting element 30a, or the filter film is attached to the surface of at least one optical lens 11a of the optical lens 10a, thereby achieving the function of filtering out infrared light.

[0223] In the present application, as shown in Figures 12A to 12C , light deflecting element 30a has multiple reflective surfaces, allowing light entering light deflecting element 30a to undergo multiple reflections. This effectively increases the optical TTL, making camera module 1a suitable for capturing distant objects and providing high-quality images of such distant objects. TTL refers to the distance on the optical axis between the front vertex of the light-entering side (facing the subject) of optical lens 10a of camera module 1a and the image plane at photosensitive component 40a.

[0224] Typically, an increase in TTL increases the size of the camera module 1a, making it unsuitable for integration into small mobile devices. In one embodiment of the present application, the light deflection element 30a extends horizontally, meaning that the horizontal length of the light deflection element 30a is greater than its height or thickness. When light is reflected multiple times within the light deflection element 30a, the light deflection element 30a can maintain a relatively low height or thickness, thereby preventing the camera module 1a from increasing in height. In other words, the horizontal length of the light deflection element 30a is greater than its height, allowing the camera module 1a to be reduced in height while maintaining its effectiveness, thereby meeting the need for miniaturization of the camera module 1a.

[0225] In one embodiment of the present application, the number of times light is reflected by the light deflecting element 30a is an odd number, and the photosensitive component 40a and the optical lens 10a are centrally located on the same side of the light deflecting element 30a. Light passing through the optical lens 10a is reflected an odd number of times within the light deflecting element 30a before being emitted to the photosensitive component 40a. In another embodiment of the present application, the number of times light is reflected by the light deflecting element 30a is an even number, and the photosensitive component 40a and the optical lens 10a are located on opposite sides of the light deflecting element 30a. Light passing through the optical lens 10a is reflected an even number of times within the light deflecting element 30a before being emitted to the photosensitive component 40a.

[0226] Specifically, in one embodiment of the present application, the light deflecting element 30a includes at least four surfaces, at least three of the at least four surfaces are reflective surfaces, and the light is reflected on the at least three reflective surfaces in the light deflecting element 30a. For example, the light deflecting element 30a includes a trapezoidal prism, and the cross-section of the light deflecting element 30a is trapezoidal. When the light deflecting element 30a includes three reflective surfaces, the light is reflected three times in the light deflecting element 30a; when the light deflecting element 30a includes four reflective surfaces, the light is reflected five times or four times in the light deflecting element 30a, which will be described in detail later in this application. Of course, in other embodiments of the present application, the light deflecting element 30a may include prisms of other shapes, such as triangular prisms, pentagonal prisms, hexagonal prisms, etc., and still provide the above-mentioned light deflection function and design benefits, and this application does not limit this.

[0227] As shown in Figures 12A and 12B, in one embodiment of the present application, the light deflecting element 30a is implemented as a trapezoidal prism. The light deflecting element 30a includes four surfaces, for example, a first surface 31a, a second surface 32a, a third surface 33a, and a fourth surface 34a. The planes of the first surface 31a and the third surface 33a are parallel to each other, the length of the third surface 33a is less than that of the first surface 31a, and the planes of the second surface 32a and the fourth surface 34a intersect. At least three of the four surfaces of the light deflecting element 30a have a reflective function. For example, the first surface 31a, the second surface 32a, the third surface 33a, and the fourth surface 34a are reflective surfaces capable of reflecting light, thereby achieving four, five, or more reflections of light within the light deflecting element 30a. Alternatively, only the first surface 31a, the second surface 32a, and the fourth surface 34a may be reflective surfaces capable of reflecting light, thereby achieving only three reflections of light within the light deflecting element 30a.

[0228] It should be understood that, in the present application, the first surface 31a of the light deflecting element 30a can be the incident surface of the light deflecting element 30a, wherein the optical lens 10a is disposed above the incident surface of the light deflecting element 30a. Alternatively, the first surface 31a of the light deflecting element 30a can be the exit surface of the light deflecting element 30a, with the photosensitive component 40a disposed above the exit surface of the light deflecting element 30a. In other words, light can both enter and exit the first surface 31a of the light deflecting element 30a. Therefore, the photosensitive component 40a and the optical lens 10a can be disposed on the same side of the light deflecting element 30a.

[0229] In a specific example, the angle between the second surface 32a and the first surface 31a is an acute angle, the angle between the fourth surface 34a and the first surface 31a is an acute angle, the angle between the second surface 32a and the third surface 33a is an obtuse angle, and the angle between the fourth surface 34a and the third surface 33a is an obtuse angle. The angle between the second surface 32a and the first surface 31a may be within a range of 25° and 35°, and the angle between the fourth surface 34a and the first surface 31a may be within a range of 25° and 35°. It should be understood that the angles between the various surfaces of the light deflecting element 30a can control the reflection angle of light when it is reflected within the light deflecting element 30a, thereby enabling the light deflecting element 30a to perform multiple reflections on light.

[0230] Furthermore, the light deflecting element 30a is an isosceles trapezoidal prism, that is, the cross-section of the light deflecting element 30a in the height direction is an isosceles trapezoid (similar to an isosceles trapezoid). As shown in the cross-sectional view of the trapezoidal prism (see Figures 12A and 12B), the second surface 32a and the fourth surface 34a are of equal length, and the second surface 32a and the fourth surface 34a are axially symmetrical. The angle between the second surface 32a and the first surface 31a is equal to the angle between the fourth surface 34a and the first surface 31a, and the angle between the second surface 32a and the third surface 33a is equal to the angle between the fourth surface 34a and the third surface 33a. In one specific example, the optical axis of the incident light is axially symmetrical in the light deflecting element 30a.

[0231] In one embodiment of the present application, the second surface 32a, the fourth surface 34a and / or the third surface 33a of the light deflecting element 30a may be provided with a reflective coating, or a reflector may be provided, so that light can be reflected on the second surface 32a, the fourth surface 34a and / or the third surface 33a. For example, in a specific example of the present application, the reflective coating may include a mirror coating based on a thin metal layer, a film with a white inner surface, etc. Further, at least a portion of the first surface 31a of the light deflecting element 30a is provided with a reflective coating, and at least a portion of the first surface 31a is not provided with a reflective coating, so that the first surface 31a can transmit light or allow light to pass through the first surface 31a. Furthermore, the first surface 31a can also reflect light under the phenomenon of total internal reflection.

[0232] It should be understood that total internal reflection can occur when the incident angle of light approaches or exceeds a certain limiting angle (called the critical angle). The incident angle refers to the angle between light incident on a surface and a line perpendicular to the surface at the point of incidence (called the normal). Therefore, when the incident angle of light is less than the critical angle, the first surface 31a of the light deflecting element 30a allows the light to pass through. When the incident angle of light approaches or exceeds the critical angle, the first surface 31a of the light deflecting element 30a reflects the light at the corresponding surface.

[0233] Specifically, in one embodiment of the present application, the first surface 31a includes a light entrance area 311a, a light exit area 312a, and a reflective area 313a disposed between the light entrance area 311a and the light exit area 312a. The light entrance area 311a and the light exit area 312a are not provided with a reflective coating, so that light can enter the light deflecting element 30a from the light entrance area 311a and exit the light deflecting element 30a from the light exit area 312a. The reflective area 313a is provided with a reflective coating so that light is reflected when passing through the reflective area 313a.

[0234] In one example, the size of the light entrance area 311a is equal to the size of the light exit area 312a, and the size of the reflection area 313a is no smaller than the size of the light entrance area 311a or the light exit area 312a. This ensures that light entering the light deflection element 30a from the light entrance area 311a is reflected and then emitted from the light exit area 312a to the photosensitive component 40a, thereby avoiding light loss and reducing the generation of stray light. In a specific example of the present application, the size of the light entrance area 311a is equal to the size of the reflection area 313a, and the size of the light exit area 312a is equal to the size of the light exit area 312a. This improves the effect of multiple reflections of the light deflection element 30a, avoids light loss, and reduces the generation of stray light.

[0235] Furthermore, both the light entrance area 311a and the light exit area 312a are located on the first surface 31a. This means that light from the camera module 1a enters and exits the camera module 1a on the same side of the light deflection element 30a. This way, the optical lens 10a and the photosensitive component 40a are located on the same side of the light deflection element 30a. Consequently, the height of the camera module 1a is determined solely by the sum of the height of the optical lens 10a or the photosensitive component 40a and the height of the light deflection element 30a, thus reducing the height of the camera module 1a.

[0236] In one embodiment of the present application, the light deflecting element 30a can reflect light within the light deflecting element 30a an odd number of times to guide the light from the optical lens 10a through the light deflecting element 30a to the photosensitive component 40a. When the light is reflected three times within the light deflecting element 30a, the light enters the light deflecting element 30a through the light entrance area 311a of the first surface 31a; at least some of the light that passes through the light entrance area 311a of the first surface 31a is reflected at the second surface 32a; at least some of the light reflected from the second surface 32a is reflected at the reflection area 313a of the first surface 31a; and at least some of the light reflected from the reflection area 313a of the first surface 31a is reflected at the fourth surface 34a, so that the light passes through the light exit area 312a of the first surface 31a to reach the photosensitive component 40a.

[0237] In another embodiment of the present application, as shown in Figure 12B, when the light is reflected five times in the light turning element 30a, the light passes through the light entrance area 311a of the first surface 31a and enters the light turning element 30a; at least some of the light passing through the light entrance area 311a of the first surface 31a is reflected at the second surface 32a; at least some of the light reflected from the second surface 32a is reflected at the reflection area 313a of the first surface 31a; at least some of the light reflected from the reflection area 313a of the first surface 31a is reflected at the third surface 33a; at least some of the light reflected from the third surface 33a is reflected at the light exit area 312a of the first surface 31a; and, at least some of the light reflected from the light exit area 312a of the first surface 31a is reflected at the fourth surface 34a, so that the light passes through the light exit area 312a of the first surface 31a and reaches the photosensitive component 40a.

[0238] It should be understood that light from the optical lens 10a may pass through the light incident area 311a of the first surface 31a, enter the light deflecting element 30a, and undergo an odd number of reflections within the light deflecting element 30a. At least some of the light may then reach the second surface 3a, be reflected by the second surface 32a, and at least some of the light reflected from the second surface 32a may reach the reflection area 313a or the light incident area 311a of the first surface 31a. When light reaches the reflection area 313a of the first surface 31a, it is reflected at the reflection area 313a of the first surface 31a, and at least some of the light reflected from the reflection area 313a of the first surface 31a can reach the third surface 33a or the fourth surface 34a, and be reflected at the third surface 33a or the fourth surface 34a; when light reaches the light entrance area 311a of the first surface 31a, when the incident angle of the light is close to or greater than the critical angle of the light turning element 30a, the light can be reflected at the light entrance area 311a of the first surface 31a under total internal reflection, and at least some of the light reflected from the light entrance area 311a of the first surface 31a can reach the third surface 33a or the fourth surface 34a, and be reflected at the third surface 33a or the fourth surface 34a.

[0239] If at least some of the light reflected from first surface 31a reaches fourth surface 34a and is ultimately reflected there, exiting light deflecting element 30a and reaching photosensitive component 40a, as shown in FIG12A , in this embodiment, the light is reflected three times in light deflecting element 30a, effectively increasing the focal length between optical lens 10a and photosensitive component 40a. This effectively increases the optical TTL of camera module 1a, making camera module 1a suitable for capturing distant objects and providing high-quality images of such distant objects.

[0240] If at least some of the light reflected from the first surface 31a reaches the third surface 33a, then at least some of the light reflected from the third surface 33a may reach the light exit area 312a of the first surface 31a. When the incident angle of the light is close to or greater than the critical angle of the light deflection element 30a, the light may be reflected at the light exit area 312a of the first surface 31a under total internal reflection. At least some of the light reflected from the light exit area 312a of the first surface 31a may reach the fourth surface 34a, and finally be reflected at the fourth surface 34a, leaving the light deflection element 30a to reach the photosensitive component 40a. As shown in FIG12B, in this embodiment, the light is reflected five times in the light deflection element 30a, which can effectively increase the focal length between the optical lens 10a and the photosensitive component 40a. In other words, it can effectively increase the optical TTL of the camera module 1a, making the camera module 1a suitable for capturing objects at a long distance and providing high-quality images of the distant objects.

[0241] In another embodiment of the present application, as shown in FIG12C , the light deflecting element 30a is implemented as a parallelogram prism. The light deflecting element 30a includes four surfaces, for example, a first surface 31a, a second surface 32a, a third surface 33a, and a fourth surface 34a. The planes of the first surface 31a and the third surface 33a are parallel to each other, and the planes of the second surface 32a and the fourth surface 34a are parallel to each other. The four surfaces of the light deflecting element 30a have a reflective function. For example, the first surface 31a, the second surface 32a, the third surface 33a, and the fourth surface 34a are reflective surfaces that can reflect light.

[0242] In this embodiment, light is reflected four times by the light deflecting element 30a. The photosensitive component 40a and the optical lens 10a are positioned on opposite sides of the light deflecting element 30a. Light passing through the optical lens 10a is reflected four times within the light deflecting element 30a before exiting and reaching the photosensitive component 40a. For example, the optical lens 10a is positioned on one side of the first surface 31a, and the photosensitive component 40a is positioned on one side of the third surface 33a.

[0243] In one embodiment of the present application, the light deflection element 30a can be implemented as an integrated prism, as shown in Figures 12A and 12B, and the integrated prism is a trapezoidal prism. In another embodiment of the present application, the light deflection element 30a can also be implemented as a split prism 35a, that is, the light deflection element 30a can be formed by combining multiple prisms. For example, as shown in Figure 13A, the split prism 35a includes at least two prisms: a first prism 351a and a second prism 352a, wherein, in a specific example of the present application, the first prism 351a is a parallelogram prism, and the second prism 352a is a triangular prism. The first prism 351a and the second prism 352a are joined together by optically transparent adhesives or snaps to form the light deflection element 30a. In this way, when the light deflection element 30a is manufactured by a paneling method, the manufacturing process can be simplified and the utilization rate of raw materials can be improved. Of course, it should be understood that in another specific example of the present application, the first prism 351a can be a right-angled trapezoidal prism, and the second prism 352a can be a right-angled triangular prism or a right-angled trapezoidal prism. The first prism 351a and the second prism 352a are joined together by optically transparent adhesive or snap fasteners to form a light turning element 30a.

[0244] In another specific example of the present application, as shown in Figure 13B, the split prism 35a also includes a third prism 353a, wherein the first prism 351a is a right-angled trapezoidal prism, the second prism 352a is a rectangular prism, and the third prism 353a is a right-angled trapezoidal prism. The first prism 351a, the second prism 352a and the third prism 353a are joined together by optically transparent adhesives or snaps to form a light-reflecting element 30a. In this way, when the light-reflecting element 30a is manufactured by means of panelization, the manufacturing process can be simplified and the utilization rate of raw materials can be improved. Alternatively, the first prism 351a and the third prism 353a are triangular prisms, and the second prism 352a is a quadrilateral prism. For example, the first prism 351a and the third prism 353a are right-angled triangular prisms, and the second prism 352a is a rectangular prism. Alternatively, the first prism 351a and the third prism 353a are triangular prisms, and the second prism 352a is a parallelogram prism. The first prism 351a, the second prism 352a and the third prism 353a are joined together by optically transparent adhesives or snaps to form a light turning element 30a.

[0245] Continuing with reference to Figure 13B, in the split prism 35a, the second prism 352a is arranged between the first prism 351a and the third prism 353a. When light passes through the light entrance area 311a of the first prism 351a and enters the first prism 351a, at least some of the light is reflected at least once in the first prism 351a and reaches the second prism 352a. Then, at least some of the light reaching the second prism 352a is reflected at least once in the second prism 352a and reaches the third prism 353a. Finally, at least some of the light reaching the third prism 353a is reflected at least once in the third prism 353a and reaches the light exit area 312a of the third prism 353a, and is emitted from the third prism 353a to reach the photosensitive component 40a.

[0246] It should be understood that in the present application, the light entrance area 311a of the first prism 351a and the light exit area 312a of the third prism 353a are both arranged on the same side of the light deflection element 30a (split prism 35a) so that light can enter and exit from the same side of the light deflection element 30a. In this way, the optical lens 10a and the photosensitive component 40a can be concentrated on the same side of the light deflection element 30a to reduce the height of the camera module 1a.

[0247] Furthermore, the light deflection element 30a may also include a light-shielding film disposed between the first prism 351a and the second prism 352a and / or between the second prism 352a and the third prism 353a. Specifically, as shown in Figures 13A and 13B, a U-shaped light-shielding film is provided on the side of the second prism 352a facing the first prism 351a, and a U-shaped light-shielding film is provided on the side of the second prism 352a facing the third prism 353a. It is understandable that the light-shielding film may also be provided on the side of the first prism 351a or the third prism 353a facing the second prism 352a. By providing the light-shielding film, the influence of stray light on imaging can be reduced, thereby alleviating the problem of glare.

[0248] It should be understood that the split prism 35a may also include other numbers of prisms, such as four prisms, five prisms, or six prisms, and this application is not limited thereto. Of course, in other embodiments of the application, the light deflection element 30a may also be implemented as multiple reflectors, with the multiple reflectors being disposed at locations where light needs to be reflected to form the light deflection element 30a.

[0249] In one embodiment of the present application, as shown in Figures 14A to 16B, the driving device 60a is implemented as a prism driving assembly. The driving device 60a is configured to drive the light deflecting element 30a to move relative to the photosensitive assembly 40a to achieve optical focus and / or optical image stabilization. It is worth noting that in this embodiment, the relative position of the optical lens 10a and the light deflecting element 30a is fixed. That is, the optical lens 10a moves with the movement of the light deflecting element 30a to maintain the relative position between the optical lens 10a and the light deflecting element 30a. This prevents the path of light incident on the light deflecting element 30a from changing, resulting in significant differences between the reflection path of the light within the light deflecting element 30a and the light exit path from the predetermined path, thereby reducing the imaging quality of the camera module 1a. In other words, the driving device 60a is configured to drive the light deflecting element 30a and the optical lens 10a to move relative to the photosensitive assembly 40a.

[0250] In one embodiment of the present application, the driving device 60a includes a fixed portion, a movable portion, and a driving portion. The light deflecting element 30a and the optical lens 10a are disposed in the movable portion, the photosensitive component 40a is disposed in the fixed portion, the movable portion is movably disposed in the fixed portion, and the driving portion is connected to the movable portion and the fixed portion. The driving portion is disposed around the light deflecting element 30a to drive the light deflecting element 30a and the optical lens 10a to move relative to the photosensitive component 40a. Furthermore, the optical lens 10a is directly or indirectly fixed to the light deflecting element 30a, and the filter assembly 50a is directly or indirectly fixed to the photosensitive component 40a. The driving device 60a can drive the light deflecting element 30a to move relative to the photosensitive component 40a, thereby changing the optical performance of the camera module 1a by means of a moving prism. In other words, the light deflecting element 30a can be moved relative to the photosensitive component 40a under the drive of the driving device 60a to achieve optical focus and / or optical image stabilization.

[0251] As mentioned above, when the light deflection element 30a is implemented as a trapezoidal prism, it includes a top side on which the optical lens 10a and the photosensitive component 40a are disposed, a bottom side opposite the top side, and a peripheral side disposed between the top side and the bottom side. The driving device 60a is disposed on the peripheral side of the light deflection element 30a, and at least a portion of the driving device 60a is lower than the top surface of the light deflection element 30a. This arrangement, on the one hand, provides ample space for the driving device 60a, making the structure of the camera module 1a more compact; on the other hand, it can reduce the height of the driving device 60a, thereby reducing the shoulder height of the camera module 1a, providing a certain amount of space for the photosensitive component 40a and the filter component 50a, and also achieving the purpose of reducing the height of the camera module 1a. It should be understood that the shoulder height of the camera module 1a is the height of the driving device 60a.

[0252] As shown in Figures 14A to 15B, the driving device 60a includes a frame 64a, a movable carrier 68a, and an anti-shake driving unit 67a. The anti-shake driving unit 67a connects the frame 64a and the movable carrier 68a to drive the movable carrier 68a to move horizontally relative to the frame 64a. Specifically, the movable carrier 68a is movably disposed within the frame 64a, and the anti-shake driving unit 67a is disposed between the frame 64a and the movable carrier 68a, such that the movable carrier 68a is driven by the anti-shake driving unit 67a to move horizontally relative to the frame 64a. In other words, the driving device 60a is configured to drive the light deflection element 30a to move, thereby driving the optical lens 10a to move along with the light deflection element 30a.

[0253] It should be understood that, in this application, the frame 64a and the movable carrier 68a are part of the movable portion, and the anti-shake drive unit 67a is part of the drive portion. Of course, when optical image stabilization is performed, the frame 64a can also be part of the fixed portion, that is, the frame 64a is fixed relative to the movable carrier 68a, and the movable carrier 68a is movable relative to the frame 64a.

[0254] In the present application, the anti-shake drive unit 67a is disposed between the frame 64a and the movable carrier 68a in the height direction. For example, this includes the anti-shake drive unit 67a being disposed between the top surface of the frame 64a facing the movable carrier 68a and the bottom surface of the movable carrier 68a facing the frame 64a. It should be understood that at least a portion of the anti-shake drive unit 67a is located between the frame 64a and the movable carrier 68a, which is considered to be the case. In this case, the frame 64a or the movable carrier 68a may be provided with a groove or through-hole to accommodate at least a portion of the anti-shake drive unit 67a.

[0255] The anti-shake drive unit 67a is disposed around the light deflection element 30a. The anti-shake drive unit 67a extends horizontally, with at least a portion of the anti-shake drive unit 67a positioned below the top surface of the light deflection element 30a. Specifically, the top surface of the anti-shake drive unit 67a is lower than the top surface of the light deflection element 30a, while the bottom surface of the anti-shake drive unit 67a is higher than the bottom surface of the light deflection element 30a.

[0256] Specifically, as shown in Figures 14A and 14B, the light deflecting element 30a is fixed to the movable carrier 68a, so that the light deflecting element 30a moves with the movable carrier 68a, thereby achieving optical image stabilization. In one embodiment of the present application, the movable carrier 68a includes a carrier body 681a and a supporting portion 682a. The supporting portion 682a includes a seating groove 6821a having an opening that gradually decreases in size from top to bottom along the optical axis to accommodate the light deflecting element 30a being implemented as a trapezoidal prism. Furthermore, the carrier body 681a integrally extends horizontally from the supporting portion 682a. The height of the supporting portion 682a is greater than that of the carrier body 681a, allowing the light deflecting element 30a to be fully accommodated within the seating groove 6821a, thereby preventing damage to the surface of the light deflecting element 30a during movement.

[0257] In one specific example of the present application, the top surface of the supporting portion 682a is higher than the top surface of the carrier body 681a; in another specific example of the present application, the bottom surface of the supporting portion 682a is lower than the bottom surface of the carrier body 681a; and in another specific example of the present application, the top surface of the supporting portion 682a is higher than the top surface of the carrier body 681a, and the bottom surface of the supporting portion 682a is lower than the bottom surface of the carrier body 681a. This arrangement not only meets the height requirements of the light deflection element 30a, but also reduces the height of the periphery of the light deflection element 30a, thereby reducing the shoulder height of the camera module 1a.

[0258] In one embodiment of the present application, an air gap is provided between the movable carrier 68a and the photosensitive component 40a, and between the movable carrier 68a and the frame 64a, respectively, so that the anti-shake drive unit 67a can drive the movable carrier 68a to move horizontally (i.e., perpendicular to the optical axis of the optical lens 10a) relative to the frame 64a and the photosensitive component 40a, thereby achieving the optical image stabilization function. It should be understood that in the present application, the horizontal portions of the air gaps formed between the movable carrier 68a and the photosensitive component 40a, and between the movable carrier 68a and the frame 64a, are suitable for being adjusted in achieving the optical image stabilization function.

[0259] Furthermore, as shown in Figures 15A and 15B, at least a portion of the frame 64a is positioned below the movable carrier 68a. The frame 64a includes an anti-shake frame 642a extending horizontally and a focus frame 641a extending vertically integrally from the anti-shake frame 642a. The focus frame 641a is positioned to the side of the anti-shake frame 642a. In other words, the frame 64a includes the anti-shake frame 642a extending horizontally and the focus frame 641a extending vertically from the anti-shake frame 642a.

[0260] The anti-shake frame 642a has an opening in the middle, and the portion of the bottom of the support portion 682a that protrudes from the carrier body 681a can be positioned within this opening, making the structure of the drive device 60a more compact. In this application, the bottom surface of the support portion 682a is not lower than the bottom surface of the anti-shake frame 642a to prevent the movable carrier 68a from protruding beyond the anti-shake frame 642a, thereby preventing the light deflection element 30a from being damaged by collision during the movement of the light deflection element 30a driven by the movable carrier 68a. For example, in one specific example of this application, the bottom surface of the support portion 682a is flush with the bottom surface of the anti-shake frame 642a.

[0261] In the height direction, the anti-shake frame 642a is disposed below the movable carrier 68a, and the anti-shake drive unit 67a is disposed between the movable carrier 68a and the frame 64a. The anti-shake drive unit 67a includes at least one anti-shake magnet 671a and at least one anti-shake coil 672a. The at least one anti-shake magnet 671a is directly or indirectly fixed to one of the movable carrier 68a and the frame 64a, and the at least one anti-shake coil 672a is directly or indirectly fixed to the other of the movable carrier 68a and the frame 64a. The at least one anti-shake magnet 671a and the at least one anti-shake coil 672a are disposed opposite each other in the height direction. The magnetic force between the at least one anti-shake magnet 671a and the at least one anti-shake coil 672a can drive the movable carrier 68a to move relative to the frame 64a, thereby achieving the optical image stabilization function.

[0262] In a specific example, at least one anti-shake magnet 671a is disposed on the movable carrier 68a, and at least one anti-shake coil 672a is disposed on the frame 64a. The at least one anti-shake magnet 671a includes a first anti-shake magnet 6711a, a second anti-shake magnet 6712a, and a third anti-shake magnet 6713a. The at least one anti-shake coil 672a includes a first anti-shake coil 6721a, a second anti-shake coil 6722a, and a third anti-shake coil 6723a. The first anti-shake magnet 6711a, the second anti-shake magnet 6712a, and the third anti-shake coil 6713a are disposed on three adjacent sides of the bottom surface of the carrier body 681a of the movable carrier 68a, and the first anti-shake coil 6721a, the second anti-shake coil 6722a, and the third anti-shake coil 6723a are disposed on three adjacent sides of the top surface of the anti-shake frame 642a of the frame 64a. The first anti-shake coil 6721a and the first anti-shake magnet 6711a are arranged relative to each other so that the first anti-shake coil 6721a interacts with the first anti-shake magnet 6711a after power is applied to generate a magnetic field. The third anti-shake coil 6723a and the third anti-shake magnet 6713a are arranged relative to each other so that the third anti-shake coil 6723a interacts with the third anti-shake magnet 6713a after power is applied to generate a magnetic field, thereby driving the movable carrier 68a to move relative to the frame 64a along the first horizontal direction; the second anti-shake coil 6722a and the second anti-shake magnet 6712a are arranged relative to each other so that the second anti-shake coil 6722a interacts with the second anti-shake magnet 6712a after power is applied to generate a magnetic field, thereby driving the movable carrier 68a to move relative to the frame 64a along the second horizontal direction. That is, in this example, in the process of realizing optical image stabilization, at least one anti-shake coil 672a (the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a) serves as a stator, and at least one anti-shake magnet 671a (the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a) serves as a mover.

[0263] It should be understood that in the present application, the at least one anti-shake magnet 671a and at least one anti-shake coil 672a of the anti-shake drive unit 67a are disposed around the periphery of the light deflection element 30a to avoid increasing the height of the drive device 60a. In other words, the first anti-shake magnet 6711a, the second anti-shake magnet 6712a, and the third anti-shake magnet 6713a are disposed around three sides of the light deflection element 30a, and the first anti-shake coil 6721a, the second anti-shake coil 6722a, and the third anti-shake coil 6723a are disposed around three sides of the light deflection element 30a.

[0264] Furthermore, a groove is provided on the bottom surface of the carrier body 681a of the movable carrier 68a, and the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a can be respectively arranged in the groove on the bottom surface of the carrier body 681a; correspondingly, the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a are respectively arranged on the top surface of the anti-shake frame 642a, so that the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a can be arranged relative to the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a.

[0265] Among them, in a specific example of the present application, the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a are roughly arranged in a U-shaped structure, that is, the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a are arranged on three mutually perpendicular adjacent sides of the bottom surface of the movable carrier 68a; the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a are roughly arranged in a U-shaped structure, the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a are arranged on three mutually perpendicular adjacent sides of the top surface of the frame 64a, and the first horizontal direction is perpendicular to the second horizontal direction. For example, the first horizontal direction can be the X-axis direction, and the second horizontal direction can be the Y-axis direction. For example, the first anti-shake magnet 6711a and the third anti-shake magnet 6713a are arranged opposite to each other, and the second anti-shake magnet 6712a is arranged adjacent to the first anti-shake magnet 6711a and the third anti-shake magnet 6713a, that is, the second anti-shake magnet 6712a is arranged between the first anti-shake magnet 6711a and the third anti-shake magnet 6713a; the first anti-shake coil 6721a and the third anti-shake coil 6723a are arranged opposite to each other, and the second anti-shake coil 6722a is arranged adjacent to the first anti-shake coil 6721a and the third anti-shake coil 6723a, that is, the second anti-shake coil 6722a is arranged between the first anti-shake coil 6721a and the third anti-shake coil 6723a.

[0266] In other words, the first anti-shake coil 6721a and the first anti-shake magnet 6711a are arranged opposite each other in the height direction, the second anti-shake coil 6722a and the second anti-shake magnet 6712a are arranged opposite each other in the height direction, and the third anti-shake coil 6723a and the third anti-shake magnet 6713a are arranged opposite each other in the height direction. That is, in this specific example, the anti-shake drive unit 67a includes at least one anti-shake magnet 671a and at least one anti-shake coil 672a arranged opposite each other in the height direction, and this height direction is parallel to the optical axis of the optical lens 10a. This allows for a larger relative area between the first anti-shake magnet 6711a and the first anti-shake coil 6721a, a larger relative area between the second anti-shake magnet 6712a and the second anti-shake coil 6722a, and a larger relative area between the third anti-shake magnet 6713a and the third anti-shake coil 6723a, while maintaining a smaller height dimension, thereby providing a greater horizontal driving force.

[0267] It's worth noting that the first anti-shake coil 6721a, the first anti-shake magnet 6711a, and the third anti-shake coil 6723a and the third anti-shake magnet 6713a work together to drive the movable carrier 68a to move relative to the frame 64a in a first horizontal direction, while the second anti-shake coil 6722a and the second anti-shake magnet 6712a drive the movable carrier 68a to move relative to the frame 64a in a second horizontal direction. Therefore, the driving force for moving the movable carrier 68a in the first horizontal direction is greater, while the driving force for moving the movable carrier 68a in the second horizontal direction is less. Therefore, in this application, the length of the second anti-shake magnet 6712a is greater than the lengths of the first anti-shake magnet 6711a and the third anti-shake magnet 6713a. Accordingly, there are two second anti-shake coils 6722a, and the two second anti-shake coils 6722a are arranged opposite the second anti-shake magnet 6712a in the height direction. It should be understood that when the length of the second anti-shake magnet 6712a increases, the driving force generated by the interaction between the two second anti-shake coils 6722a and the second anti-shake magnet 6712a is greater, so as to meet the driving force required when the movable carrier 68a moves along the second horizontal direction.

[0268] It is worth mentioning that, as shown in Figures 14A to 15B, the anti-shake drive unit 67a extends downward from the movable carrier 68a in the height direction, and the bottom surface of the anti-shake drive unit 67a is lower than the top surface of the light turning element 30a but higher than the bottom surface of the light turning element 30a. The anti-shake drive unit 67a is arranged on the side of the light turning element 30a, so that the height of the driving device 60a and the camera module 1a is not increased due to the setting of the anti-shake drive unit 67a. Specifically, the first anti-shake coil 6721a and the first anti-shake magnet 6711a extend downward from the movable carrier 68a along the height direction, and the bottom surface of the first anti-shake magnet 6711a is lower than the top surface of the light turning element 30a but higher than the bottom surface of the light turning element 30a; the second anti-shake coil 6722a and the second anti-shake magnet 6712a extend downward from the movable carrier 68a along the height direction, and the bottom surface of the second anti-shake magnet 6712a is lower than the top surface of the light turning element 30a but higher than the bottom surface of the light turning element 30a; the third anti-shake coil 6723a and the third anti-shake magnet 6713a extend downward from the movable carrier 68a along the height direction, and the bottom surface of the third anti-shake magnet 6713a is lower than the top surface of the light turning element 30a but higher than the bottom surface of the light turning element 30a.

[0269] In this application, the anti-shake drive unit 67a is a moving magnet type solution. In the process of realizing optical anti-shake, at least one anti-shake coil 672a (the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a) serves as a stator, and at least one anti-shake magnet 671a (the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a) serves as a mover.

[0270] In this embodiment, the drive device 60a also includes an anti-shake support portion 69a and an anti-shake magnetic member (not shown). As shown in Figures 14C, 15A, and 15B, the anti-shake support portion 69a is disposed between the frame 64a and the movable carrier 68a to maintain an air gap between the frame 64a and the movable carrier 68a, thereby reducing the resistance encountered by the movable carrier 68a when moving relative to the frame 64a. For example, the anti-shake support portion 69a is disposed between the anti-shake frame 642a of the frame 64a and the carrier body 681a of the movable carrier 68a. In a specific example, the anti-shake support portion 69a can be implemented as a ball bearing 691a. The anti-shake support portion 69a includes at least three ball bearings 691a. The at least three ball bearings 691a are disposed in the height direction between the movable carrier 68a and the frame 64a to support the movable carrier 68a and the frame 64a, thereby maintaining a fixed air gap in the height direction between the movable carrier 68a and the frame 64a. It should be understood that the ball 691a can roll between the movable carrier 68a and the frame 64a, or the ball 691a can interact between the movable carrier 68a and the frame 64a. For example, the ball 691a can be fixed to the movable carrier 68a or the frame 64a by insert molding or bonding. It should be understood that the anti-shake support portion 69a can also be implemented as other components such as a spring or a slider.

[0271] The anti-shake magnetic component is made of a material suitable for being attracted by magnets. The anti-shake magnetic component is directly or indirectly fixed to the anti-shake frame 642a and corresponds to at least one anti-shake magnet 671a. The anti-shake magnetic component is arranged below at least one anti-shake magnet 671a, so that the movable carrier 68a is adsorbed toward the frame 64a through the magnetic force between the anti-shake magnetic component and at least one anti-shake magnet 671a, so that at least three balls 691a are clamped between the movable carrier 68a and the frame 64a, so that the movable carrier 68a and the frame 64a clamp at least three balls 691a in the height direction.

[0272] It should be understood that in the present application, the anti-shake magnetic component is arranged on the side of at least one anti-shake coil 672a away from at least one anti-shake magnet 671a. Specifically, the anti-shake magnetic component is respectively arranged in the middle of the first anti-shake coil 6721a and the second anti-shake coil 6722a, and between the second anti-shake coil 6722a and the third anti-shake coil 6723a, so that the anti-shake magnetic component can correspond to the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a in the height direction. In other words, the anti-shake magnetic component overlaps with at least a part of the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a in the height direction. It should be understood that the anti-shake magnetic component can also be directly fixed to the movable carrier 68a by insert molding or bonding, so that the magnetic attraction between at least one anti-shake magnet 671a and the anti-shake magnetic component can attract the movable carrier 68a to the frame 64a.

[0273] Further, continuing to refer to Figures 15A and 15B, in order to limit the range of movement of the ball 691a, the frame 64a also includes at least three first ball grooves 643a formed on the top surface of the anti-shake frame 642a, and the movable carrier 68a also includes at least three second ball grooves 683a formed on the bottom surface of the carrier body 681a, wherein the top surface of the anti-shake frame 642a refers to its side facing the movable carrier 68a, and the bottom surface of the carrier body 681a refers to its side facing the frame 64a, and the positions of the at least three first ball grooves 643a and the at least three second ball grooves 683a correspond to each other. In one example, the anti-shake support portion 69a includes four balls 691a, four first ball grooves 643a are formed at the four corners of the top surface of the anti-shake frame 642a of the frame 64a, and four second ball grooves 683a corresponding to the four first ball grooves 643a are formed at the four corners of the bottom surface of the carrier body 681a of the movable carrier 68a. The anti-shake magnetic suction part fixed to the anti-shake frame 642a is magnetically attracted to at least one anti-shake magnet 671a so that the four balls 691a are respectively clamped between the four corners of the frame 64a and the four corners of the movable carrier 68a.

[0274] It is worth mentioning that the driving device 60a also includes a frame cover 640a fixed to the frame 64a. The frame cover 640a is arranged above the frame 64a and the movable carrier 68a in the height direction, so that the movable carrier 68a is confined in the accommodating cavity formed by the frame cover 640a and the frame 64a. It should be understood that during a fall, the magnetic attraction between the anti-shake magnetic element and the anti-shake magnet 671a is difficult to maintain the positional relationship between the movable carrier 68a and the frame 64a. After the movable carrier 68a has a large displacement relative to the frame 64a, the ball 691a will be separated from the first ball groove 643a and the second ball groove 683a. Therefore, in the present application, a frame cover 640a is further provided to limit the height movement of the movable carrier 68a by the frame cover 640a, thereby preventing the ball 691a from falling.

[0275] Furthermore, the drive device 60a can also implement an optical focus function. Specifically, as shown in Figures 16A and 16B, the drive device 60a also includes a fixed base 61a and a focus drive unit 63a. The photosensitive component 40a is fixed to the fixed base 61a. The focus drive unit 63a connects the fixed base 61a and the frame 64a to drive the frame 64a to move in the height direction relative to the fixed base 61a. Specifically, the frame 64a is movably disposed in the fixed base 61a, and the focus drive unit 63a is disposed between the fixed base 61a and the frame 64a, so that the frame 64a is driven by the focus drive unit 63a to move in the height direction relative to the fixed base 61a. Since the frame 64a is moved, the movable carrier 68a, the anti-shake drive part 67a, the anti-shake support part 69a and the anti-shake magnetic part arranged in the frame 64a also move with the movement of the frame 64a, and then the photosensitive component 40a fixed to the movable carrier 68a also moves with the movement of the frame 64a, thereby realizing the optical focusing function.

[0276] Furthermore, the focus drive unit 63a extends in the height direction, with the top surface of the focus drive unit 63a being higher than the top surface of the light deflection element 30a, and the bottom surface of the focus drive unit 63a being lower than the top surface of the light deflection element 30a. This arrangement can further reduce the height of the focus drive unit 63a, thereby reducing the height of the drive device 60a and the camera module 1a.

[0277] In the present application, the focus drive unit 63a is disposed between the frame 64a and the fixed base 61a. For example, this includes the case where the focus drive unit 63a is disposed between the side of the frame 64a facing the fixed base 61a and the side of the fixed base 61a facing the frame 64a. It should be understood that if at least a portion of the focus drive unit 63a is located between the frame 64a and the fixed base 61a, it is considered that the focus drive unit 63a is disposed between the frame 64a and the fixed base 61a. In this case, the frame 64a or the fixed base 61a may be provided with a groove or through-hole to accommodate a portion of the focus drive unit 63a.

[0278] Continuing to refer to Figures 16A and 16B, in one embodiment of the present application, the driving device 60a also includes an upper cover 610a and a base 62a, wherein the upper cover 610a and the base 62a form a accommodating cavity, and the fixed base 61a, the movable carrier 68a, the frame 64a, the focus driving part 63a and the anti-shake driving part 67a are accommodated in the accommodating cavity. The movable carrier 68a is movably arranged on the frame 64a, the frame 64a is movably arranged on the fixed base 61a, and the anti-shake drive unit 67a is connected to the movable carrier 68a and the frame 64a to drive the movable carrier 68a to move relative to the frame 64a along the X-axis and Y-axis directions, that is, the anti-shake drive unit 67a is configured to drive the movable carrier 68a to move relative to the frame 64a in a direction perpendicular to the optical axis of the camera module 1a; the focus drive unit 63a is connected to the frame 64a and the fixed base 61a to drive the frame 64a to move relative to the fixed base 61a along the Z-axis direction, that is, the focus drive unit 63a is configured to drive the frame 64a to move relative to the fixed base 61a in a direction parallel to the optical axis of the camera module 1a.

[0279] It should be understood that, in this application, the upper cover 610a, base 62a, and fixed base 61a are part of the fixed portion, and the focus drive unit 63a is part of the drive unit. In other words, when performing optical focus, the fixed portion includes the upper cover 610a, base 62a, fixed base 61a, and other components disposed on the fixed portion, such as the fixed base 61a; the movable portion includes the movable carrier 68a, frame 64a, frame cover 640a, and other components disposed on the movable portion, such as the frame 64a and movable carrier 68a; and the drive unit includes the anti-shake drive unit 67a and the focus drive unit 63a.

[0280] Furthermore, in one embodiment of the present application, the light deflection element 30a is mounted on the movable carrier 68a of the drive device 60a, and the photosensitive assembly 40a is mounted on the fixed base 61a of the drive device 60a. Thus, when the anti-shake drive unit 67a drives the movable carrier 68a to move, it can also drive the light deflection element 30a to move perpendicular to the optical axis, thereby achieving optical image stabilization. When the focus drive unit 63a drives the frame 64a to move, it can also drive the movable carrier 68a and the light deflection element 30a to move parallel to the optical axis, thereby achieving optical focus.

[0281] It should be understood that due to the large size of the light deflection element 30a, it occupies a significant amount of space within the drive device 60a. In this application, the focus drive unit 63a and the anti-shake drive unit 67a are positioned around the light deflection element 30a, with the bottom surface of the focus drive unit 63a lower than the top surface of the light deflection element 30a, and the top surface of the anti-shake drive unit 67a lower than the top surface of the light deflection element 30a. This arrangement, on the one hand, fully utilizes the space around the light deflection element 30a, making the camera module 1a more compact; on the other hand, it minimizes the height of the focus drive unit 60a and the anti-shake drive unit 60a, which helps reduce the height of the camera module 1a.

[0282] In one embodiment of the present application, the upper cover 610a and the base 62a interlock to form a housing cavity to accommodate components such as the fixed base 61a, the movable carrier 68a, the frame 64a, the focus drive unit 63a, and the anti-shake drive unit 67a. This prevents dust from entering and prevents the components from falling when impacted. Furthermore, the upper cover 610a has a lens opening 6101a at the position corresponding to the optical lens 10a. The optical lens 10a can pass through this lens opening 6101a and be fixed to the light deflection element 30a to avoid affecting the incident light.

[0283] The fixed base 61a is disposed below the upper cover 610a, that is, between the upper cover 610a and the base 62a, to provide a fixed connection between the upper cover 610a and the base 62a. The fixed base 61a includes a base body 611a extending horizontally and a focus fixing portion 612a extending vertically from the base body 611a. The focus fixing portion 612a is disposed on the side of the base body 611a and extends downwardly from the base body 611a, that is, toward the bottom side of the light deflecting element 30a.

[0284] In one embodiment of the present application, the middle portion of the base body 611a has an opening 6110a, and the photosensitive component 40a and the filter component 50a are fixed in the opening 6110a of the base body 611a to avoid increasing the height of the camera module 1a. Furthermore, the top surface of the base body 611a has a groove, and the first connecting band 44a and the second connecting band 45a of the photosensitive component 40a are respectively arranged in the groove. In a specific example of the present application, the top surface of the chip circuit board 42a is lower than the top surface of the first connecting band 44a, and the top surface of the chip circuit board 42a is lower than the top surface of the second connecting band 45a. This arrangement allows the photosensitive component 40a to be placed as close as possible to the opening 6110a of the base body 611a to avoid increasing the height of the camera module 1a.

[0285] It should be understood that in one embodiment of the present application, the photosensitive assembly 40a is assembled along the height direction from the top of the base body 611a. The photosensitive assembly 40a is positioned within the opening 6110a of the base body 611a by securing the first connecting strap 44a and the second connecting strap 45a to the grooves on the top surface of the base body 611a. Furthermore, the photosensitive assembly 40a and the filter assembly 50a can be secured within the opening 6110a of the base body 611a by securing the filter assembly 50a to the base body 611a. For example, adhesive can be provided between the filter element holder 52a and the inner sidewall of the opening to secure the filter assembly 50a and the photosensitive assembly 40a within the opening 6110a of the base body 611a.

[0286] Continuing with Figure 16A , the focus fixing portion 612a extends downward from the sidewall of the base body 611a along the height direction. Specifically, the focus fixing portion 612a extends along the height direction toward the bottom side of the light deflecting element 30a. The bottom surface of the focus fixing portion 612a is lower than the bottom surface of the base body 611a. In a specific example of the present application, the focus fixing portion 612a is disposed on a long side of the base body 611a, parallel to the length direction of the drive device 60a. It should be understood that the focus fixing portion 612a can be secured to the base body 611a by bonding or integral molding.

[0287] Furthermore, in one embodiment of the present application, the frame 64a is movably disposed on the fixed base 61a, the movable carrier 68a is movably disposed on the frame 64a, and the light deflection element 30a is fixedly disposed on the movable carrier 68a, so that when the frame 64a is driven to move along the Z-axis direction relative to the fixed base 61a, the frame 64a can drive the movable carrier 68a and then drive the light deflection element 30a to move along the Z-axis direction to realize the optical focusing function.

[0288] Continuing with reference to Figures 14B and 16A, the focus drive unit 63a is arranged between the focus frame 641a of the frame 64a and the focus fixing part 612a of the fixed base 61a. The focus drive unit 63a includes a pair of focus magnets 631a and a pair of focus coils 632a. The focus magnet 631a is fixed to one of the focus frame 641a and the focus fixing part 612a, and the focus coil 632a is fixed to the other of the focus frame 641a and the focus fixing part 612a. The focus magnet 631a and the focus coil 632a are arranged relative to each other in the horizontal direction, so that the frame 64a can be driven to move in the height direction relative to the fixed base 61a by the magnetic force between the focus magnet 631a and the focus coil 632a to realize the optical focusing function.

[0289] The anti-shake drive unit 67a extends in the horizontal direction, and the focus drive unit 63a extends in the height direction. The plane where the anti-shake drive unit 67a is located is perpendicular or approximately perpendicular to the plane where the focus drive unit 63a is located.

[0290] In a specific example, the focusing magnet 631a is fixed to the side of the focusing frame 641a of the frame 64a, the focusing coil 632a is fixed to the focusing fixing portion 612a of the fixed base 61a, and the focusing coil 632a and the focusing magnet 631a are arranged horizontally relative to each other. In other words, the focusing coil 632a and the focusing magnet 631a are arranged horizontally between the focusing frame 641a of the frame 64a and the focusing fixing portion 612a of the fixed base 61a, and the focusing drive unit 63a includes the focusing coil 632a and the focusing magnet 631a arranged horizontally relative to each other, and the horizontal direction refers to the direction perpendicular to the optical axis of the optical lens 10a. In this way, a larger driving force in the height direction can be provided under smaller lateral dimensions (dimensions in the length and width directions).

[0291] It should be understood that during optical focusing, the focus coil 632a, fixed to the focus fixing portion 612a, drives the focus magnet 631a to move in the height direction relative to the focus coil 632a. As a result, the frame 64a, fixed to the focus magnet 631a, moves in the height direction as the focus magnet 631a moves. In other words, in this example, during optical focusing, the focus magnet 631a acts as a mover, and the focus coil 632a acts as a stator.

[0292] Accordingly, the focus magnet 631a is mounted on the outer side of the frame 64a to maintain a small distance between the focus magnet 631a and the focus coil 632a, thereby enhancing the magnetic force between the focus magnet 631a and the focus coil 632a. Specifically, the focus magnet 631a is mounted on the outer side of the focus frame 641a, and the outer side of the focus frame 641a has a groove to accommodate the focus magnet 631a. In this way, the size of the drive device 60a and the camera module 1a can be reduced. It should be understood that the outer side of the focus frame 641a refers to the side of the focus frame 641a facing the focus fixing portion 612a of the fixed base 61a.

[0293] It is worth mentioning that in the present application, as shown in FIG14B , since the focus magnet 631a is arranged on the side of the focus frame 641a of the frame 64a, the bottom surface of the focus magnet 631a is lower than the bottom surface of at least one anti-shake magnet 671a. In other words, the focus magnet 631a extends downward, so that the relative area between the focus magnet 631a and the focus coil 632a can be increased, thereby improving the driving force of the focus drive unit 63a. Furthermore, in the present application, the focus magnet 631a, the first anti-shake magnet 6711a, the second anti-shake magnet 6712a, and the third anti-shake magnet 6713a are all arranged on the circumference of the light turning element 30a, so that the height dimensions of the drive device 60a and the camera module 1a can be designed to be smaller.

[0294] Furthermore, in one embodiment of the present application, the focus magnet 631a and the at least one anti-shake magnet 671a are disposed on opposite sides of the optical deflection element 30a. For example, the focus magnet 631a is disposed on one side of the optical deflection element 30a, while the at least one anti-shake magnet 671a is disposed on three other sides of the optical deflection element 30a, to prevent magnetic interference between the focus drive unit 63a and the anti-shake drive unit 67a. In a specific example of the present application, the first anti-shake magnet 6711a and the third anti-shake magnet 6713a of the at least one anti-shake magnet 671a are respectively located on the short sides of the drive device 60a, i.e., the lengths of the first and third anti-shake magnets 6711a and 6713a are along the Y-axis. The second anti-shake magnet 6712a of the at least one anti-shake magnet 671a is located on a long side of the drive device 60a, i.e., the length of the second anti-shake magnet 6712a is along the X-axis. The focusing magnet 631 a is located on the other side of the driving device 60 a opposite to the side where the second anti-shake magnet 6712 a is located. The length direction of the focusing magnet 631 a is along the X-axis direction.

[0295] Furthermore, in one example, the magnetic pole directions of the first anti-shake magnet 6711a and the third anti-shake magnet 6713a are perpendicular to the magnetic pole direction of the second anti-shake magnet 6712a, and the magnetic pole direction of the focus magnet 631a is perpendicular to the plane containing the magnetic pole directions of the first anti-shake magnet 6711a, the second anti-shake magnet 6712a, and the third anti-shake magnet 6713a. In this way, the driving direction of the focus drive unit 63a is perpendicular to the driving direction of the anti-shake drive unit 67a. In this application, the magnetic pole direction of a magnet refers to the direction in which the south pole of the magnet points to the north pole. Accordingly, the focus coil 632a, the first anti-shake coil 6721a, the second anti-shake coil 6722a, and the third anti-shake coil 6723a are all racetrack-type coils, wherein the winding plane of the focus coil 632a is perpendicular to the winding planes of the first anti-shake coil 6721a and the third anti-shake coil 6723a, and the winding plane of the focus coil 632a is perpendicular to the winding plane of the second anti-shake coil 6722a. In other words, in the present application, in the anti-shake drive unit 67a, the first anti-shake magnet 6711a, the second anti-shake magnet 6712a, and the third anti-shake magnet 6713a are horizontally disposed on the bottom surface of the carrier body 681a, while the first anti-shake coil 6721a, the second anti-shake coil 6722a, and the third anti-shake coil 6723a are horizontally disposed on the top surface of the anti-shake frame 642a. The first anti-shake magnet 6711a and the first anti-shake coil 6721a are arranged opposite to each other in the height direction, the second anti-shake magnet 6712a and the second anti-shake coil 6722a are arranged opposite to each other in the height direction, and the third anti-shake magnet 6713a and the third anti-shake coil 6723a are arranged opposite to each other in the height direction.

[0296] When the first and third anti-shake coils 6721a and 6723a are energized, the first anti-shake coil 6721a interacts with the first anti-shake magnet 6711a to generate a driving force, while the third anti-shake coil 6723a interacts with the third anti-shake magnet 6713a to generate a driving force. These driving forces drive the movable carrier 68a to move relative to the frame 64a in a first horizontal direction. When the second anti-shake coil 6722a is energized, the second anti-shake coil 6722a interacts with the second anti-shake magnet 6712a to generate a driving force. This driving force drives the movable carrier 68a to move relative to the frame 64a in a second horizontal direction, thereby achieving the optical image stabilization function of the drive device 60a.

[0297] In the focus drive unit 63a, a focus magnet 631a is vertically mounted on the outer surface of the focus frame 641a of the frame 64a. A focus coil 632a is vertically fixed to the inner surface of the focus fixing portion 612a of the fixed base 61a. The focus coil 632a and the focus magnet 631a are positioned horizontally opposite each other. When power is applied to the focus coil 632a, the interaction between the focus coil 632a and the focus magnet 631a generates a driving force. This driving force drives the frame 64a to move vertically relative to the fixed base 61a. This, in turn, drives the movable carrier 68a, the light deflecting element 30a, and the optical lens 10a through the frame 64a, thereby achieving the optical focusing function of the drive device 60a.

[0298] In the present application, the driving device 60a also includes a pair of focusing guides 65a and a pair of focusing magnetic parts 66a. The focusing guide 65a is arranged between the frame 64a and the fixed base 61a to maintain an air gap between the frame 64a and the fixed base 61a, thereby reducing the resistance encountered by the frame 64a when it moves relative to the fixed base 61a. In a specific example, the focusing guide 65a can be implemented as a guide rod 651a, and the focusing guide 65a includes two guide rods 651a. Specifically, the two guide rods 651a are vertically arranged between the focus frame 641a of the frame 64a and the focus fixing portion 612a of the fixed base 61a, so that the frame 64a and the fixed base 61a maintain a fixed gap in the horizontal direction. Furthermore, in this embodiment, two guide rods 651 a are respectively provided on both sides of the focus driving portion 63 a , and the two guide rods 651 a have the same size to prevent the frame 64 a and the focus fixing portion 612 a from tilting.

[0299] The focusing magnetic member 66a is fixed to the focusing fixing portion 612a of the fixed base 61a by being attached to the back of the focusing circuit board 633a. That is, in the width direction, the focusing magnet 631a, the focusing coil 632a, the focusing circuit board 633a and the focusing magnetic member 66a are arranged in sequence. Among them, the side of the focusing circuit board 633a on which the focusing coil 632a is arranged is the front side of the focusing circuit board 633a, and the other opposite side is the back side of the focusing circuit board 633a. The focusing magnetic member 66a is made of a material suitable for being attracted by magnets. It is magnetically attracted to the focusing magnet 631a so that the frame 64a is adsorbed toward the focusing fixing portion 612a of the fixed base 61a in the width direction. The frame 64a and the focusing fixing portion 612a of the fixed base 61a clamp the two guide rods 651a in the width direction. The focusing magnetic member 66a can be made of an iron-containing material.

[0300] In other words, the focus guide portion 65a is arranged between the focus frame 641a of the frame 64a and the focus fixing portion 612a of the fixed base 61a, the focus magnetic component 66a is fixed to the focus fixing portion 612a, and the focus magnetic component 66a and the focus magnet 631a are magnetically attracted to each other so that the focus guide portion 65a is clamped between the second frame 64a portion of the frame 64a and the focus fixing portion 612a of the fixed base 61a.

[0301] In a specific example, two first guide rails 6121a extending in the height direction are formed on the inner side surface of the focus fixing portion 612a opposite the focus frame 641a, and two second guide rails 6411a extending in the height direction are formed on the outer side surface of the focus frame 641a opposite the focus fixing portion 612a. The two first guide rails 6121a and the two second guide rails 6411a are respectively provided. Two guide rods 651a are respectively provided between the two first guide rails 6121a and the two second guide rails 6411a, and are clamped between the frame 64a and the focus fixing portion 612a by the magnetic attraction between the focus magnetic member 66a and the focus magnet 631a.

[0302] It is worth mentioning that in one example of the present application, the two guide rods 651a may not be fixed, and they are only clamped by the frame 64a and the focus fixing part 612a; in another example of the present application, the positions of the two guide rods 651a may also be fixed, for example, they may be fixed by fixing the bottom end of the guide rod 651a to the base 62a and / or fixing the top end of the guide rod 651a to the fixed base 61a, or, the two guide rods 651a are only restricted between the fixed base 61a and the base 62a by the snap fit between the fixed base 61a and the base 62a, or, the two guide rods 651a may be fixed to the focus frame 641a or the focus fixing part 612a.

[0303] In one embodiment of the present application, as shown in FIG17 , the anti-shake drive unit 67a further includes an anti-shake circuit board 673a, and the focus drive unit 63a further includes a focus circuit board 633a. The anti-shake circuit board 673a and the focus circuit board 633a extend in the height direction around the periphery of the light deflecting element 30a to connect the anti-shake circuit board 673a and the focus circuit board 633a to the circuit board assembly 401a of the photosensitive element 40a. Specifically, the anti-shake circuit board 673a extends in the height direction on a plane perpendicular to the incident surface of the light deflecting element 30a to electrically connect the anti-shake drive unit 67a to the circuit board assembly 401a. The focus circuit board 633a is disposed on the opposite side of the light deflecting element 30a from the anti-shake circuit board 673a and extends in the height direction to electrically connect the focus drive unit 63a to the circuit board assembly 401a.

[0304] At least one anti-shake coil 672a is electrically connected to the anti-shake circuit board 673a, and the focus coil 632a is electrically connected to the focus circuit board 633a. Since the anti-shake circuit board 673a and the focus circuit board 633a are both electrically connected to the circuit board assembly 401a, the circuit can be concentrated on the circuit board assembly 401a through the anti-shake circuit board 673a and the focus circuit board 633a, and the circuit conduction with external electronic equipment can be achieved through the circuit board assembly 401a.

[0305] It should be understood that in the present application, the anti-shake drive unit 67a and the focus drive unit 63a are arranged on opposite sides. If one wants to connect the anti-shake circuit board 673a to the focus circuit board 633a, or connect the focus circuit board 633a to the anti-shake circuit board 673a, it is necessary to cross the internal space of the drive device 60a horizontally. This setting method not only requires reserving more free space in the drive device 60a, but also makes the structure of the anti-shake circuit board 673a and the focus circuit board 633a more complicated and more difficult to manufacture. To solve the above problem, in the present application, the anti-shake circuit board 673a and the focus circuit board 633a are arranged on opposite sides. In other words, the anti-shake circuit board 673a and the focus circuit board 633a are arranged relative to each other on the long side of the driving device 60a. The anti-shake circuit board 673a and the focus circuit board 633a are respectively extended in the height direction on the peripheral side of the light deflection element 30a to connect the anti-shake circuit board 673a and the focus circuit board 633a to the first connecting strip 44a and the second connecting strip 45a of the circuit board assembly 401a, that is, the anti-shake circuit board 673a is connected to one of the first connecting strip 44a and the second connecting strip 45a, and the focus circuit board 633a is connected to the other of the first connecting strip 44a and the second connecting strip 45a, so that the circuit is centrally connected to the circuit board assembly 401a. The electrical connection setting method of the camera module 1a is optimized to make the electrical connection setting method simpler.

[0306] In a specific example of the present application, the anti-shake circuit board 673a and the focus circuit board 633a are arranged on opposite sides to avoid interference between the focus circuit board 633a and the anti-shake circuit board 673a, which may cause a short circuit.

[0307] Specifically, in one embodiment of the present application, the focus circuit board 633a is fixed to the focus fixing portion 612a, and the focus coil 632a is fixed and electrically connected to the focus circuit board 633a, so that the focus coil 632a is indirectly fixed to the focus fixing portion 612a through the focus circuit board 633a. In a specific example, the focus circuit board 633a is attached to the outer side of the focus fixing portion 612a, and a through hole is provided on the focus fixing portion 612a to expose the focus coil 632a and oppose the focus magnet 631a. The through hole on the focus fixing portion 612a accommodates the focus coil 632a, which can reduce the lateral size of the drive device 60a. It should be understood that the outer side of the focus fixing portion 612a refers to the side of the focus fixing portion 612a away from the frame 64a.

[0308] It's worth noting that the focus circuit board 633a is connected to the first connecting strap 44a or the second connecting strap 45a along the height direction, thereby achieving electrical continuity between the focus coil 632a and the circuit board assembly 401a. Furthermore, because both the focus fixing portion 612a and the focus circuit board 633a serve as stators during optical focusing, the focus circuit board 633a does not need to move, thus preventing the generation of a reaction force from the focus circuit board 633a.

[0309] The focusing circuit board 633a may be a flexible circuit board or a rigid-flexible circuit board, so that the focusing circuit board 633a can be extended to a position convenient for electrical connection with the circuit board assembly 401a.

[0310] It should be understood that, in this application, the at least one anti-shake coil 672a is located below the light deflecting element 30a, and the circuit board assembly 401a is located above the light deflecting element 30a, with a certain height difference between the at least one anti-shake coil 672a and the circuit board assembly 401a. To achieve electrical connection between the at least one anti-shake coil 672a and the circuit board assembly 401a, the anti-shake circuit board 673a extends along the circumference of the light deflecting element 30a from the bottom side of the light deflecting element 30a toward the top side of the light deflecting element 30a. The lower portion of the light deflecting element 30a refers to the portion away from the optical lens 10a and the photosensitive component 40a, while the upper portion of the light deflecting element 30a refers to the portion closer to the optical lens 10a and the photosensitive component 40a.

[0311] In one embodiment of the present application, an anti-shake circuit board 673a is disposed between the fixed base 61a and the frame 64a along the height direction. The anti-shake circuit board 673a includes a first fixed end 6731a, a second fixed end 6732a, an extension 6733a, and a bent portion 6734a. The first fixed end 6731a is connected to the frame 64a, the second fixed end 6732a is connected to the fixed base 61a, the extension 6733a is connected to the first fixed end 6731a, the bent portion 6734a is connected to the second fixed end 6732a, and the extension 6733a and the bent portion 6734a are connected to each other.

[0312] Specifically, the first fixed end 6731a extends horizontally and is mounted on the anti-shake frame 642a of the frame 64a. Since at least one anti-shake coil 672a is also mounted on the anti-shake frame 642a, the first fixed end 6731a can be electrically connected to the at least one anti-shake coil 672a. The second fixed end 6732a is mounted on the base body 611a of the fixed base 61a. Since the first connecting strap 44a or the second connecting strap 45a is mounted on the base body 611a, the second fixed end 6732a can be electrically connected to the first connecting strap 44a or the second connecting strap 45a.

[0313] In one embodiment of the present application, the second fixing end 6731a is either higher or lower in height than the incident parallel surface group of the light deflecting element 30a, and at least a portion of the bent portion 6734a overlaps in height with the light deflecting element 30a. In a specific embodiment of the present application, the first fixing end 6731a is lower in height than the top surface of the light deflecting element 30a, while the second fixing end 6732a is higher in height than the top surface of the light deflecting element 30a. Specifically, the height of the anti-shake circuit board 673a is higher than the height of the light deflecting element 30a. The incident parallel surface group comprises the incident surface of the light deflecting element 30a and surfaces parallel thereto.

[0314] In one embodiment of the present application, the bottom surface of the optical lens 10a is lower than the top surface of the first fixing end 6731a to reduce the height of the optical lens 10a in the camera module 1a.

[0315] Furthermore, the extension portion 6733a bends upward from the first fixed end 6731a and extends in the height direction, thereby changing the horizontal extension direction of the anti-shake circuit board 673a to a height extension direction. Due to the relatively small thickness of the anti-shake circuit board 673a, the lateral dimensions of the drive device 60a can be avoided from increasing. In a specific example of the present application, the extension portion 6733a extends upward in the height direction from the outer side surface of the frame cover 640a, making the structure of the drive device 60a more compact.

[0316] It should be understood that during optical image stabilization, the movable carrier 68a moves relative to the fixed base 61a and frame 64a under the drive of the anti-shake drive unit 67a, that is, the fixed base 61a and frame 64a remain relatively fixed. In other words, the anti-shake circuit board 673a does not move during optical image stabilization, preventing the anti-shake circuit board 673a from generating a horizontal reaction force that would affect the optical image stabilization effect.

[0317] Furthermore, during optical focusing, the frame 64a, driven by the focus drive unit 63a, moves relative to the fixed base 61a. This means that the height distance between the frame 64a and the fixed base 61a changes, and the anti-shake circuit board 673a needs to move in the height direction to accommodate this. Therefore, in this application, the anti-shake circuit board 673a requires the bent portion 6734a to provide the required travel.

[0318] Specifically, the bent portion 6734a bends from the extending portion 6733a toward the light deflecting element 30a and extends in the height direction. Specifically, the bent portion 6734a bends and extends in a direction perpendicular to the long side of the light deflecting element 30a. This allows the anti-shake circuit board 673a to move sufficiently when stretched in the height direction. Furthermore, it prevents the bent portion 6734a from protruding beyond the drive device 60a, thereby increasing the lateral dimensions of the drive device 60a. It should be understood that, in this application, the long side of the light deflecting element 30a refers to the relatively longer side of the incident surface of the light deflecting element 30a, and the direction perpendicular to the long side of the light deflecting element 30a refers to the direction in which the relatively shorter side of the incident surface of the light deflecting element 30a extends.

[0319] In a specific example of the present application, the base body 611a of the fixed base 61a is recessed inward to form a groove. The bent portion 6734a bends from the extension portion 6733a into the groove and continues to extend upward, allowing the bent portion 6734a to be accommodated within the groove, thereby avoiding increasing the lateral dimensions of the drive device. It should be understood that in this application, "inward" refers to the direction toward the light deflecting element.

[0320] It is worth noting that the anti-shake circuit board 673a can be a flexible circuit board or a soft-rigid combination board to meet the requirements of bending and extending the anti-shake circuit board 673a.

[0321] It should be understood that at least one anti-shake coil 672a is arranged on the anti-shake frame 642a. When the anti-shake frame 642a is made of metal material and the anti-shake circuit board 673a is connected to the first connecting band 44a or the second connecting band 45a of the anti-shake frame 642a and the circuit board assembly 401a, an electrical connection between at least one anti-shake coil 672a and the circuit board assembly 401a can be achieved. Of course, in other embodiments of the present application, a conductive circuit can also be set on the surface of the anti-shake frame 642a. When the anti-shake circuit board 673a is electrically connected to the conductive circuit, the circuit conduction between at least one anti-shake coil 672a and the circuit board assembly 401a can be achieved through the conductive circuit and the anti-shake circuit board 673a. Of course, the conductive circuit can also be set in the anti-shake frame 642a using an insert injection molding process. As long as the circuit conduction can be achieved, this application does not impose any restrictions on this.

[0322] It should be understood that in the present application, the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a are arranged below the first anti-shake magnet 6711a, the second anti-shake magnet 6712a and the third anti-shake magnet 6713a, and the focus coil 632a is located on the outside of the focus magnet 631a. In this way, the first anti-shake coil 6721a, the second anti-shake coil 6722a and the third anti-shake coil 6723a can extend upward from the outside through the anti-shake circuit board 673a and be electrically connected to the chip circuit board 42a of the photosensitive component 40a, while the focus coil 632a can be electrically connected to the chip circuit board 42a of the photosensitive component 40a from the outside through the focus circuit board 633a. The magnet-coil setting method of the present application optimizes the electrical connection setting method of the camera module 1a and makes the electrical connection setting method simpler.

[0323] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: An optical lens having an optical axis; A light deflection element, wherein the light deflection element comprises a plurality of reflective surfaces, and the light emitted by the optical lens is reflected multiple times on the plurality of reflective surfaces of the light deflection element; A photosensitive component, wherein the light is emitted from the light deflection element and reaches the photosensitive component, and the optical lens and the photosensitive component are arranged on the same side of the light deflection element; A lens driving assembly, wherein the lens driving assembly is configured to drive the optical lens to move relative to the light deflection element along the optical axis direction; as well as A chip driving component is configured to drive the photosensitive component to move relative to the light turning element along a direction perpendicular to the optical axis.

2. The camera module according to claim 1, characterized in that: The lens driving assembly includes a fixed base, a lens carrier and a lens driving unit, the light deflection element is fixed to the fixed base, the optical lens is fixed to the lens carrier, the lens carrier is movably arranged on the fixed base, and the lens driving unit is configured to drive the lens carrier to move relative to the fixed base along the optical axis.

3. The camera module according to claim 2, characterized in that: The lens driving unit includes a focus coil and a focus magnet, which are arranged opposite to each other in a horizontal direction. The focus coil is arranged at one of the fixed base and the lens carrier, and the focus magnet is arranged at the other of the fixed base and the lens carrier.

4. The camera module according to claim 3, characterized in that: The chip driving component includes a shell, a chip carrier and a chip driving part. The shell and the fixed base are interlocked with each other. The photosensitive component is fixed to the chip carrier. The chip carrier is movably arranged on the shell. The chip driving part is configured to drive the chip carrier to move in a horizontal direction relative to the shell and the fixed base.

5. The camera module according to claim 4, characterized in that: The chip driving unit includes at least one anti-shake magnet and at least one anti-shake coil, and the at least one anti-shake magnet and the at least one anti-shake coil are arranged opposite to each other in a horizontal direction. The at least one anti-shake magnet is arranged in one of the chip carrier and the shell, and the at least one anti-shake coil is arranged in the other of the chip carrier and the shell.

6. The camera module according to claim 5, characterized in that: The lens driving unit is located on the peripheral side of the light deflection element and is arranged close to the optical lens, and the chip driving unit is located on the peripheral side of the light deflection element and is arranged close to the photosensitive component.

7. The camera module according to claim 6, characterized in that: The light deflecting element includes two opposite short sides and two opposite long sides. The lens driving unit is arranged on a short side of the light deflecting element close to the optical lens, and the chip driving unit is arranged on the other short side and two long sides of the light deflecting element close to the photosensitive component.

8. The camera module according to claim 7, characterized in that: The focus magnet and the at least one anti-shake magnet extend along the height direction around the light deflection element, and the bottom surface of the focus magnet is lower than the bottom surface of the at least one anti-shake magnet.

9. The camera module according to claim 8, characterized in that: The focusing coil and the at least one anti-shake coil extend along the height direction on the peripheral side of the light deflection element, and the bottom surface of the focusing coil is lower than the bottom surface of the at least one anti-shake coil.

10. The camera module according to any one of claims 1 to 9, characterized in that: The photosensitive component also includes a photosensitive chip, a chip circuit board and a connecting circuit board. The photosensitive chip is arranged on the chip circuit board and electrically connected to the chip circuit board. The connecting circuit board is bent from the top of the chip circuit board to the bottom of the fixed base in the shell and extends to the outside of the camera module to achieve circuit conduction between the chip circuit board and external electronic equipment.

11. The camera module according to claim 10, characterized in that: The connecting circuit board extends from one side of the chip driving component to one side of the lens driving component. The lens driving component also includes a focusing circuit board. The chip driving component also includes an anti-shake circuit board. The focusing circuit board and the anti-shake circuit board are respectively electrically connected to the connecting circuit board to achieve circuit conduction between the chip driving component and the lens driving component.

12. The camera module according to any one of claims 2 to 9, characterized in that: The fixed base includes a base body, a mounting portion and a base side fixing portion, the fixed base extends in a horizontal direction, the mounting portion is arranged in the middle of the base body and extends in a height direction, the base side fixing portion is arranged on the short side of the base body close to the optical lens and extends in the height direction, and the light turning element is fixed to the mounting portion.

13. The camera module according to claim 12, characterized in that: The lens carrier includes a lens fixing body and a lens carrier side portion, the lens fixing body has a "C"-shaped groove, the optical lens is fixed in the "C"-shaped groove, and the opening of the "C"-shaped groove faces the photosensitive component; the lens carrier side portion is located on the side of the lens fixing body and is arranged opposite to the base side fixing portion.

14. The camera module according to any one of claims 4 to 9, characterized in that: The at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the first anti-shake magnet and the third anti-shake magnet are respectively arranged on two sides adjacent to the second anti-shake magnet; the at least one anti-shake coil includes a first anti-shake coil, a second anti-shake coil, a third anti-shake coil and a fourth anti-shake coil, the second anti-shake coil and the third anti-shake coil are arranged on the same side, the first anti-shake coil and the fourth anti-shake coil are respectively arranged on two sides adjacent to the second anti-shake coil and the third anti-shake coil, the first anti-shake magnet and the first anti-shake coil are arranged opposite to each other in a horizontal direction, the second anti-shake magnet and the second anti-shake coil and the third anti-shake coil are arranged opposite to each other in a horizontal direction, the third anti-shake magnet and the fourth anti-shake coil are arranged opposite to each other in a horizontal direction, and the first anti-shake magnet, the second anti-shake magnet and the third anti-shake magnet are respectively arranged on three sides close to the photosensitive component.

15. The camera module according to claim 14, characterized in that: The second anti-shake coil and the third anti-shake coil can be controlled separately, and the magnetic force between the second anti-shake coil and the second anti-shake magnet and the magnetic force between the third anti-shake coil and the second anti-shake magnet are different in magnitude or direction, thereby driving the chip carrier to rotate around the Z axis to realize the chip rotation anti-shake function.

16. The camera module according to claim 15, characterized in that: The chip driving component also includes a frame, which is arranged between the shell and the chip carrier along the height direction, and the frame is fixed to the shell. The frame and the chip carrier are supported by an anti-shake support part.

17. A chip driving component, characterized in that: include: case; A chip carrier, the chip carrier is movably disposed in the housing, and the chip carrier is used to fix the photosensitive component; as well as A chip driving unit, the chip driving unit includes at least one anti-shake magnet and at least one anti-shake coil arranged relatively to each other in a horizontal direction, the at least one anti-shake magnet is fixed to the chip carrier, the at least one anti-shake coil is fixed to the shell, and the at least one anti-shake coil drives the at least one anti-shake magnet to approach or move away from the at least one anti-shake coil so that the vertical distance between the at least one anti-shake coil and the at least one anti-shake magnet is changed, thereby realizing the chip anti-shake function.

18. The chip driving assembly according to claim 17, wherein: The magnetic pole direction of the at least one anti-shake magnet is perpendicular to the winding plane of the at least one anti-shake coil.

19. The chip driving assembly according to claim 17, wherein: The at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the at least one anti-shake coil includes a first anti-shake coil arranged opposite to the first anti-shake magnet, a second anti-shake coil and a third anti-shake coil arranged opposite to the second anti-shake magnet, and a fourth anti-shake coil arranged opposite to the third anti-shake magnet.

20. The chip driving assembly according to claim 17, wherein: The at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the at least one anti-shake coil includes a first anti-shake coil arranged opposite to the first anti-shake magnet, a second anti-shake coil arranged opposite to the second anti-shake magnet, and a fourth anti-shake coil arranged opposite to the third anti-shake magnet.

21. The chip driving component according to claim 19 or 20, wherein: The first anti-shake magnet and the third anti-shake magnet are adjacently arranged on both sides of the second anti-shake magnet, and the first anti-shake magnet and the third anti-shake magnet are parallel to each other, and the second anti-shake magnet is perpendicular to the first anti-shake magnet and the third anti-shake magnet respectively.

22. The chip driving assembly according to claim 21, wherein: The shell includes a cover body and at least one shell side portion arranged on the peripheral side of the cover body, the at least one anti-shake coil is fixed to the at least one shell side portion of the shell, and the chip carrier includes a chip carrier body and at least one chip carrier side portion extending integrally from at least one side of the chip carrier body along the height direction.

23. The chip driving assembly according to claim 22, wherein: The chip driving assembly further includes a frame fixed to a side facing the chip carrier.

24. The chip driving assembly according to claim 23, wherein: The chip driving component also includes an anti-shake support part and an anti-shake magnetic part. The anti-shake support part is arranged between the frame and the chip carrier, and the anti-shake magnetic part is fixed to the frame. The anti-shake magnetic part and the at least one anti-shake magnet are magnetically attracted to each other so that the anti-shake support part is clamped between the frame and the chip carrier.

25. The chip driving assembly according to claim 24, wherein: The anti-shake support part includes three balls of the same size, three frame ball grooves are formed on the bottom surface of the frame, and three carrier ball grooves corresponding to the three frame ball grooves are formed on the top surface of the chip carrier body. The three balls are respectively arranged in three ball accommodating cavities formed by the three frame ball grooves and the three carrier ball grooves.

26. The chip driving assembly according to claim 25, wherein: At least one frame opening is formed on the cover body, and the portion of the frame used to form the three frame ball grooves extends toward the cover body and is respectively arranged in the at least one frame opening, and a partial structure of the frame is formed in the frame opening.

27. The chip driving assembly according to claim 24, wherein: The anti-shake magnetic part includes a first anti-shake magnetic component and a second anti-shake magnetic component, and the first anti-shake magnetic component and the second anti-shake magnetic component are symmetrically arranged on both sides of the anti-shake support part, wherein the first anti-shake magnetic component is arranged above the first anti-shake magnet, and the second anti-shake magnetic component is arranged above the third anti-shake magnet.

28. The chip driving assembly according to claim 27, wherein: The length of the first anti-shake magnetic component is smaller than the length of the first anti-shake magnet, the length of the second anti-shake magnetic component is smaller than the length of the third anti-shake magnet, the width of the first anti-shake magnetic component is greater than the width of the first anti-shake magnet, and the width of the second anti-shake magnetic component is greater than the width of the third anti-shake magnet.

29. The chip driving assembly according to claim 28, wherein: The first anti-shake magnetic component includes a first inner magnetic component and a first outer magnetic component, and the second anti-shake magnetic component includes a second inner magnetic component and a second outer magnetic component. The first inner magnetic component is arranged above the first anti-shake magnet and close to the anti-shake support part, the first outer magnetic component is arranged above the first anti-shake magnet and away from the anti-shake support part, the second inner magnetic component is arranged above the third anti-shake magnet and close to the anti-shake support part, and the second outer magnetic component is arranged above the third anti-shake magnet and away from the anti-shake support part.

30. The chip driving assembly according to claim 22, wherein: The chip driving unit also includes an anti-shake circuit board, and the at least one anti-shake coil is fixed and electrically connected to the anti-shake circuit board. The anti-shake circuit board is fixed to the at least one side of the shell, so that the at least one anti-shake coil is fixed to the at least one side of the shell through the anti-shake circuit board.

31. A camera module, characterized in that: include: Optical lens; A photosensitive component, the photosensitive component receives the light emitted from the optical lens to form an image; as well as In the chip driving component described in any one of claims 17 to 30, the photosensitive component is fixed to the chip carrier of the chip driving component.

32. A camera module, characterized in that: include: Optical lens; The optical lens and the light deflection element are fixed in relative position, and the light deflection element includes a plurality of reflective surfaces. The light emitted by the optical lens is reflected multiple times on multiple reflection surfaces of the light deflection element; A photosensitive component, wherein the light is emitted from the light deflection element and reaches the photosensitive component, and the optical lens and the photosensitive component are arranged on the same side of the light deflection element; as well as A driving device, the driving device includes a fixed part, a movable part and a driving part, the light deflecting element and the optical lens are arranged in the movable part, the photosensitive component is arranged in the fixed part, the movable part is movably arranged in the fixed part, the driving part is connected to the movable part and the fixed part, and the driving part is arranged on the peripheral side of the light deflecting element to drive the light deflecting element and the optical lens to move relative to the photosensitive component.

33. The camera module according to claim 32, characterized in that: The driving device includes a frame, a movable carrier and an anti-shake driving unit, the light deflection element is fixed to the movable carrier, the movable carrier is movably arranged in the frame, the anti-shake driving unit connects the frame and the movable carrier to drive the movable carrier to move horizontally relative to the frame, and the anti-shake driving unit extends downward from the movable carrier to the peripheral side of the light deflection element.

34. The camera module according to claim 33, characterized in that: The anti-shake driving part extends in a horizontal direction, the top surface of the anti-shake driving part is lower than the top surface of the light deflection element, and the bottom surface of the anti-shake driving part is higher than the bottom surface of the light deflection element.

35. The camera module according to claim 34, characterized in that: The frame package includes an anti-shake frame extending in a horizontal direction, and a focus frame extending in a height direction integrally from the anti-shake frame, and the focus frame is arranged on the side of the anti-shake frame; the movable carrier includes a carrier body and a bearing part, and the carrier body extends in a horizontal direction integrally from the bearing part; wherein the anti-shake frame is arranged below the carrier body.

36. The camera module according to claim 35, characterized in that: The anti-shake driving unit includes at least one anti-shake magnet and at least one anti-shake coil, the at least one anti-shake magnet is directly or indirectly fixed to one of the movable carrier and the frame, the at least one anti-shake coil is directly or indirectly fixed to the other of the movable carrier and the frame, and the at least one anti-shake magnet and the at least one anti-shake coil are arranged relative to each other in the height direction.

37. The camera module according to claim 36, characterized in that: The at least one anti-shake magnet includes a first anti-shake magnet, a second anti-shake magnet and a third anti-shake magnet, and the first anti-shake magnet, the second anti-shake magnet and the third anti-shake magnet are arranged on three adjacent sides of the bottom surface of the carrier body; the at least one anti-shake coil includes a first anti-shake coil, a second anti-shake coil and a third anti-shake coil, and the first anti-shake coil, the second anti-shake coil and the third anti-shake coil are arranged on three adjacent sides of the top surface of the anti-shake frame.

38. The camera module according to claim 37, characterized in that: The driving device also includes a fixed base and a focus driving unit, the photosensitive component is fixed to the fixed base, the frame is movably arranged in the fixed base, and the focus driving unit connects the fixed base and the frame to drive the frame to move in the height direction relative to the fixed base.

39. The camera module according to claim 38, characterized in that: The focus driving part extends along the height direction, the top surface of the focus driving part is higher than the top surface of the light turning element, and the bottom surface of the focus driving part is lower than the top surface of the light turning element.

40. The camera module according to claim 39, characterized in that: The fixed base includes a base body extending in a horizontal direction, and a focus fixing part extending from the base body in a height direction, the focus fixing part is arranged on a side of the base body, and the focus driving part is arranged between the focus fixing part and the focus frame.

41. The camera module according to claim 40, characterized in that: The focus drive unit includes a focus magnet and a focus coil, the focus magnet is fixed to one of the focus frame and the focus fixing unit, the focus coil is fixed to the other of the focus frame and the focus fixing unit, and the focus magnet and the focus coil are arranged relative to each other in the horizontal direction.

42. The camera module according to claim 41, characterized in that: The bottom surface of the focusing magnet is lower than the bottom surface of the at least one anti-shake magnet.

43. The camera module according to claim 42, characterized in that: The focusing magnet and the at least one anti-shake magnet are arranged on opposite sides.

44. The camera module according to any one of claims 32 to 43, characterized in that: The focus driving unit also includes a focus circuit board, which is arranged on the focus fixing unit, and the focus coil is fixed and electrically connected to the focus circuit board; the anti-shake driving unit also includes an anti-shake circuit board, which extends from the anti-shake frame along the height direction to the photosensitive component, and the at least one anti-shake coil is electrically connected to the anti-shake circuit board; wherein the focus circuit board and the anti-shake circuit board are arranged on opposite sides and are electrically connected to the photosensitive component.

45. A camera module, characterized in that: include: Optical lens; A light deflection element, wherein the optical lens is disposed above an incident surface of the light deflection element, and the relative positions of the optical lens and the light deflection element are fixed; A photosensitive component, wherein the optical lens and the photosensitive component are arranged on the same side of the light deflection element, and the photosensitive component includes a circuit board component and a photosensitive chip electrically connected to the circuit board component; and The driving device includes an anti-shake driving unit and an anti-shake circuit board, wherein the anti-shake driving unit is configured to drive the light deflection element and the optical lens to move relative to the photosensitive component, and the anti-shake circuit board extends in the height direction on the plane side perpendicular to the incident surface of the light deflection element to electrically connect the anti-shake driving unit with the circuit board assembly.

46. ​​The camera module according to claim 45, characterized in that: The light deflection element comprises a top side, a bottom side, and a peripheral side connected to the top side and the bottom side, and the anti-shake circuit board extends along the height direction of the light deflection element on one side of the peripheral side of the light deflection element.

47. The camera module according to claim 46, characterized in that: The driving device includes a fixed base, a movable carrier and a frame which are arranged in sequence along the height direction, the light deflection element is fixed to the movable carrier, the photosensitive component is fixed to the fixed base, the movable carrier is movably arranged in the frame, and the frame is movably arranged in the fixed base; wherein the anti-shake circuit board is arranged between the fixed base and the frame along the height direction.

48. The camera module according to claim 47, characterized in that: The anti-shake circuit board includes a first fixed end, a second fixed end and a bending portion, the first fixed end is connected to the frame, the second fixed end is connected to the fixed base, and the bending portion is connected to the second fixed end.

49. The camera module according to claim 48, wherein: The bending portion of the anti-shake circuit board is bent and extended along a direction perpendicular to the long side direction of the light deflection element.

50. The camera module according to claim 49, characterized in that: The second fixing end is higher or lower than the incident parallel surface group of the light deflection element in the height direction, and at least a portion of the bending portion overlaps with the light deflection element in the height direction.

51. The camera module according to claim 50, characterized in that: The anti-shake circuit board further includes an extension portion, the extension portion is bent upward from the first fixed end and extends along the height direction, and the bending portion is bent from the extension portion toward the light turning element and extends along the height direction.

52. The camera module according to claim 51, characterized in that: The driving device also includes a focus driving unit and a focus circuit board. The focus driving unit is configured to drive the light deflection element and the optical lens to move in a height direction relative to the photosensitive component. The focus circuit board is arranged on the opposite side of the light deflection element where the anti-shake circuit board is arranged and extends in the height direction to electrically connect the focus driving unit with the circuit board assembly.

53. The camera module according to claim 52, characterized in that: The circuit board assembly includes a chip circuit board, a first connection belt and a second connection belt, wherein the first connection belt and the second connection belt are respectively arranged on opposite sides of the chip circuit board, and the chip circuit board, the first connection belt and the second connection belt are connected as a whole.

54. The camera module according to claim 53, characterized in that: The anti-shake circuit board is connected to one of the first connection belt and the second connection belt, and the focus circuit board is connected to the other of the first connection belt and the second connection belt, so as to centrally conduct the circuit on the circuit board assembly.

55. The camera module according to claim 54, characterized in that: The anti-shake driving unit includes at least one anti-shake magnet and at least one anti-shake coil, the at least one anti-shake magnet is directly or indirectly fixed to one of the movable carrier and the frame, the at least one anti-shake coil is directly or indirectly fixed to the other of the movable carrier and the frame, the at least one anti-shake magnet and the at least one anti-shake coil are arranged opposite to each other in the height direction, and the anti-shake circuit board is electrically connected to the at least one anti-shake coil and the circuit board assembly.

56. The camera module according to claim 55, characterized in that: The focus drive unit includes a focus magnet and a focus coil, the focus magnet is fixed to one of the frame and the fixed part, the focus coil is fixed to the other of the frame and the fixed part, the focus magnet and the focus coil are arranged opposite to each other in the horizontal direction, and the focus circuit board is electrically connected to the focus and circuit board assembly.

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