Chip board laser cutting device for chip production

Abstract

The invention relates to the technical field of laser cutting, and discloses a chip board laser cutting device for chip production, which comprises a bottom plate and a laser cutting head connected on the bottom plate through a moving mechanism, and further comprises an air nozzle in threaded connection with the bottom of the laser cutting head, the air inlet cavity is arranged in the laser cutting head, the air inlet cavity is connected with an external air source, the air inlet cavity is communicated with the air tap, an air pressure sensor is installed in the air inlet cavity, a first supporting frame is fixed to the bottom plate, a detection station is arranged on the first supporting frame, and a plurality of miniature pressure sensors are annularly and evenly arranged on the detection station. After the air nozzle sprays air, the miniature pressure sensors detect the pressure of the air sprayed from the peripheral side of the air nozzle, the air pressure sensor obtains the internal air pressure data of the air inlet cavity, the air nozzle detection system evaluates the state of the air nozzle based on the internal pressure change of the air nozzle and the external air spraying uniformity, and then the health state of the air nozzle is accurately obtained.

Description

Technical Field

[0001] The present invention belongs to the field of laser cutting technology, and in particular relates to a chip plate laser cutting device for chip production. Background Art

[0002] Chip laser cutting is a technology that uses a high-energy-density laser beam to perform non-contact cutting of wafers, separating chips by locally melting or evaporating materials.

[0003] During laser chip cutting, the nozzle on the laser cutting head releases high-pressure gas to blow molten waste material out of the cutting gap. Because the laser cutting head is a vulnerable component, the nozzle may crack, wear, or become clogged during operation due to factors such as localized high temperatures and wear. A damaged nozzle will result in uneven gas injection and a drop in pressure, which in turn affects the quality of the laser cutting.

[0004] Currently, laser cutting machines often rely on manual inspection to determine whether nozzle replacement is necessary. This process relies on operator experience, which carries the risk of misjudgment. Furthermore, manual inspection requires pausing the machine, which reduces efficiency. Summary of the Invention

[0005] The purpose of the embodiment of the present invention is to provide a chip board laser cutting device for chip production, aiming to solve the problem that the wear condition of the air nozzle of the current laser cutting machine needs to rely on manual inspection, which leads to misjudgment and reduced work efficiency.

[0006] The present invention is implemented as follows: a chip board laser cutting device for chip production includes a base plate and a laser cutting head connected to the base plate by a moving mechanism, the moving mechanism is used to drive the laser cutting head to move up and down and horizontally, and also includes: a gas nozzle threadedly connected to the bottom of the laser cutting head, and an air intake chamber provided in the laser cutting head, the air intake chamber is connected to an external air source, the air intake chamber is communicated with the gas nozzle, an air pressure sensor is installed in the air intake chamber, a support frame 1 is fixed to the base plate, a detection station is provided on the support frame 1, a plurality of micro pressure sensors are evenly arranged on the detection station in an annular manner, a gas nozzle cleaning mechanism is provided on the support frame 1, the gas nozzle cleaning mechanism is used to clean the gas nozzle; and also includes a gas nozzle detection system, which determines whether the gas nozzle needs to be replaced based on the gas pressure sensor and the plurality of micro pressure sensors. The gas nozzle detection system includes:

[0007] A data acquisition module, used to acquire internal air pressure data of the air inlet cavity and multiple external air pressure data around the air nozzle;

[0008] The air pressure analysis module builds an air pressure analysis model based on internal air pressure data and standard internal air pressure data and outputs the air pressure fluctuation coefficient;

[0009] Pressure distribution uniformity analysis module, which builds a pressure uniformity analysis model based on multiple external air pressure data and outputs the pressure uniformity coefficient;

[0010] The air nozzle state assessment module constructs an air nozzle state assessment model based on the air pressure fluctuation coefficient and the pressure uniformity coefficient and outputs the air nozzle state assessment coefficient.

[0011] A further technical solution is that the moving mechanism includes a lifting frame installed on the base plate, and a guide groove 1 is provided on the top of the lifting frame, and a guide block 1 is slidably connected in the guide groove 1, and a screw rod 1 is rotatably connected in the guide groove 1, and the screw rod 1 is threadedly connected to the guide block 1, a motor 1 is fixed on the side wall of the lifting frame, and the rotating end of the motor 1 is connected to the screw rod 1, and a guide frame is fixed to the bottom of the guide block 1, and a guide block 2 is slidably connected on the guide frame along the length direction of the guide frame, and a screw rod 2 is rotatably connected in the guide frame, and the screw rod 2 is threadedly connected to the guide block 2, and a motor 2 is fixed at one end of the guide frame, and the rotating end of the motor 2 is connected to the screw rod 2.

[0012] A further technical solution is that the lifting frame includes a fixed sleeve fixed on the top of the base plate, and a concave lifting plate vertically slidably connected in the fixed sleeve, a telescopic driving member is fixed on the top of the base plate, the telescopic end of the telescopic driving member is connected to the concave lifting plate, the guide groove is set on the top of the concave lifting plate, and the motor is fixed on the side wall of the concave lifting plate.

[0013] A further technical solution is that the air nozzle cleaning mechanism includes a rotating sleeve 2 rotatably connected to a support frame 1, a cleaning brush is fixed inside the rotating sleeve 2, a gear 1 is fixed on the side wall of the rotating sleeve 2, a motor 4 is fixed to the bottom of the support frame 1 through a bracket, a gear 2 is installed at the rotating end of the motor 4, and the gear 2 is meshed with the gear 1.

[0014] A further technical solution is that the air nozzle replacement mechanism includes a rotating sleeve 1 rotatably connected to the support frame 1, the internal cross-sectional profile of the rotating sleeve 1 is consistent with the cross-sectional profile of the air nozzle, a transmission gear is fixed on one side wall of the rotating sleeve, and the transmission gear is meshed with gear 1; a support frame 2 is fixed on the bottom plate, the support frame 2 is located below the support frame 1, a limiting sleeve is fixed on the support frame 2, and a switching block is rotatably connected to the support frame 2 in the limiting sleeve, a motor 3 is fixed at the bottom of the support frame 2, and the rotating end of the motor 3 is connected to the bottom of the switching block, and two work station slots are evenly arranged on the switching block, one of which is located directly below the rotating sleeve 1, and a feeding assembly is provided on the support frame 2, which is used to supply the air nozzle to the other work station slot; a rotating plate is rotatably connected to the support frame 2 directly below the rotating sleeve 1, and a top block is slidably connected to the rotating plate, a compression spring 1 is fixed on the side wall of the top block, and the end of the compression spring 1 is fixed on the rotating plate, and a telescopic driving member 2 is hinged on the bottom plate, and the telescopic end of the telescopic driving member 2 is hinged to the bottom of the top block.

[0015] A further technical solution is that the feeding assembly includes a feeding rack fixed on the second support frame, a pushing block is slidably connected inside the feeding rack, a tension spring is fixed on the pushing block, the end of the tension spring is connected to the second support frame, and one end of the feeding rack is connected to the limit sleeve.

[0016] According to a further technical solution, a sliding groove is provided in the top block, a sliding block is slidably connected in the sliding groove, a compression spring 2 is fixed to one end of the sliding block, and the end of the compression spring 2 is fixed in the sliding groove.

[0017] In a further technical solution, the valve state evaluation model is:

[0018]

[0019] in, is the valve status evaluation coefficient, is the volatility coefficient weight, is the uniformity coefficient weight, , is the pressure fluctuation coefficient, is the pressure uniformity coefficient.

[0020] Further technical solution, the air pressure analysis model is:

[0021]

[0022] described is the pressure fluctuation coefficient, is the measured internal air pressure value, is the standard internal air pressure value, is the maximum allowable deviation threshold.

[0023] In a further technical solution, the pressure uniformity analysis model is:

[0024]

[0025] in, is the pressure uniformity coefficient, is the pressure variation coefficient, , is the maximum allowable coefficient of variation threshold, is the mean pressure, is the pressure standard deviation.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention provides a chip board laser cutting device for chip production. After the gas nozzle sprays gas, multiple micro pressure sensors detect the pressure of the gas sprayed around the gas nozzle. The air pressure sensor obtains the internal air pressure data of the air inlet cavity. The gas nozzle detection system evaluates the state of the gas nozzle based on the internal pressure change of the gas nozzle and the external air jet uniformity, and then accurately obtains the health status of the gas nozzle. The state detection of the gas nozzle can be realized in the interval of replacing the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic structural diagram of a chip plate laser cutting device for chip production provided by the present invention;

[0029] Figure 2 The present invention provides Figure 1 Schematic diagram of the connection structure between the middle support frame 1 and the support frame 2;

[0030] Figure 3 The present invention provides Figure 1 Schematic diagram of the internal structure of the laser cutting head;

[0031] Figure 4 The present invention provides Figure 2 Schematic diagram of the structure when looking up at the tilt angle;

[0032] Figure 5 The present invention provides Figure 2 Schematic diagram of the structure of the middle support frame 2 when viewed from the top;

[0033] Figure 6 The present invention provides Figure 2 Schematic diagram of the connection structure of the middle support frame 2;

[0034] Figure 7 The present invention provides Figure 5 Schematic diagram of the internal structure of the middle top block;

[0035] Figure 8 A schematic structural diagram of the rotating plate and top block provided by the present invention in a discharging state;

[0036] Figure 9 A schematic structural diagram of the rotating plate and the top block provided by the present invention in a feeding state;

[0037] Figure 10 This is a structural schematic diagram of the rotating plate and the ejecting block provided by the present invention in the ejecting state.

[0038] In the accompanying drawings: 101, base plate; 102, laser cutting head; 103, air inlet chamber; 104, air nozzle; 105, air pressure sensor; 106, support frame 1; 107, detection station; 108, micro pressure sensor;

[0039] 2. Moving mechanism; 201. Guide groove 1; 202. Guide block 1; 203. Screw 1; 204. Motor 1; 205. Guide frame; 206. Screw 2; 207. Guide block 2; 208. Motor 2;

[0040] 3. Lifting frame; 301. Concave lifting plate; 302. Fixed sleeve; 303. Telescopic driving member 1;

[0041] 4. Gas nozzle replacement mechanism; 401. Rotating sleeve 1; 402. Support frame 2; 403. Limit sleeve; 404. Switching block; 405. Station slot; 406. Motor 3; 407. Rotating plate; 408. Ejector block; 409. Compression spring 1; 410. Telescopic drive member 2; 411. Transmission gear;

[0042] 5. Air nozzle cleaning mechanism; 501. Rotating sleeve 2; 502. Cleaning brush; 503. Gear 1; 504. Motor 4; 505. Gear 2;

[0043] 6. Feeding assembly; 601. Feeding rack; 602. Pushing block; 603. Tension spring; 701. Sliding slot; 702. Sliding block; 703. Compression spring 2. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0045] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0046] like Figure 1-Figure 3As shown, a chip board laser cutting device for chip production provided by an embodiment of the present invention includes a base plate 101, and a laser cutting head 102 connected to the base plate 101 through a moving mechanism 2, the laser cutting head 102 is connected to the laser cutting device, the moving mechanism 2 is used to drive the laser cutting head 102 to move up and down and horizontally, and also includes: a gas nozzle 104 threadedly connected to the bottom of the laser cutting head 102, and an air intake cavity 103 provided in the laser cutting head 102, the air intake cavity 103 is connected to an external air source, the air intake cavity 103 is communicated with the gas nozzle 104, an air pressure sensor 105 is installed in the air intake cavity 103, a support frame 106 is fixed on the base plate 101, a detection station 107 is provided on the support frame 106, a plurality of micro pressure sensors 108 are evenly arranged in a ring on the detection station 107, and a gas nozzle cleaning mechanism 5 is provided on the support frame 106, the gas nozzle cleaning mechanism 5 is used to clean the gas nozzle 104.

[0047] In the embodiment of the present invention, after each time the laser cutting head 102 cuts a chip, the moving mechanism 2 drives the laser cutting head 102 to move to the gas nozzle cleaning mechanism 5, which cleans the gas nozzle 104. Then, the moving mechanism 2 drives the moving mechanism 2 to move to the detection station 107, and the gas nozzle 104 sprays gas. A plurality of micro pressure sensors 108 detect the pressure of the gas sprayed from the peripheral side of the gas nozzle 104. In this embodiment, eight micro pressure sensors 108 are provided to obtain eight external air pressure data. The air pressure sensor 105 obtains the internal air pressure data of the air inlet cavity 103.

[0048] The air nozzle detection system is further included, which determines whether the air nozzle 104 needs to be replaced based on the air pressure sensor 105 and multiple micro pressure sensors 108. The air nozzle detection system includes:

[0049] A data acquisition module, configured to acquire internal air pressure data of the air inlet cavity 103 and a plurality of external air pressure data around the air nozzle 104;

[0050] The air pressure analysis module builds an air pressure analysis model based on internal air pressure data and standard internal air pressure data and outputs the air pressure fluctuation coefficient;

[0051] Pressure distribution uniformity analysis module, which builds a pressure uniformity analysis model based on multiple external air pressure data and outputs the pressure uniformity coefficient;

[0052] The air nozzle state assessment module builds an air nozzle state assessment model based on the air pressure fluctuation coefficient and the pressure uniformity coefficient to output the air nozzle state assessment coefficient;

[0053] Preferably, the valve state assessment model is:

[0054]

[0055] in, is the valve status evaluation coefficient, , the larger the value, the better the valve condition. is the volatility coefficient weight, is the uniformity coefficient weight, , is the pressure fluctuation coefficient, is the pressure uniformity coefficient;

[0056] The valve status evaluation coefficient is divided into status levels:

[0057]

[0058] The air pressure analysis model is:

[0059]

[0060] described is the pressure fluctuation coefficient, , when the actual deviation exceeds the threshold, the coefficient saturates to 1, is the measured internal air pressure value, is the standard internal air pressure value, is the maximum allowable deviation threshold;

[0061] The pressure uniformity analysis model is:

[0062]

[0063] in, is the pressure uniformity coefficient, , the larger the value, the more uniform the pressure distribution. is the pressure variation coefficient, , is the maximum allowable coefficient of variation threshold (recommended value 0.25), is the mean pressure, , is the pressure standard deviation, , .

[0064] like Figure 1As shown, as a preferred embodiment of the present invention, the moving mechanism 2 includes a lifting frame 3 installed on the base plate 101, a guide groove 201 is provided on the top of the lifting frame 3, a guide block 202 is slidably connected in the guide groove 201, a screw rod 203 is rotatably connected in the guide groove 201, and the screw rod 203 is threadedly connected to the guide block 202, a motor 204 is fixed on the side wall of the lifting frame 3, the rotating end of the motor 204 is connected to the screw rod 203, a guide frame 205 is fixed to the bottom of the guide block 202, and a guide block 207 is slidably connected to the guide frame 205 along the length direction of the guide frame 205. A screw rod 206 is connected to the frame 205 for rotation, and the screw rod 206 is threadedly connected to the guide block 207. A motor 208 is fixed to one end of the guide frame 205, and the rotating end of the motor 208 is connected to the screw rod 206. The lifting frame 3 includes a fixed sleeve 302 fixed to the top of the base plate 101, and a concave lifting plate 301 vertically slidably connected in the fixed sleeve 302. A telescopic driving member 303 is fixed to the top of the base plate 101, and the telescopic end of the telescopic driving member 303 is connected to the concave lifting plate 301. The guide groove 201 is set at the top of the concave lifting plate 301, and the motor 204 is fixed to the side wall of the concave lifting plate 301.

[0065] In an embodiment of the present invention, when adjusting the height of the laser cutting head 102, the telescopic driving member 303 is extended and retracted. The telescopic driving member 303 can adopt an electric telescopic rod. The telescopic driving member 303 drives the concave lifting plate 301 to move up and down, and the concave lifting plate 301 drives the guide block 1 202, the guide frame 205, the guide block 207 and the laser cutting head 102 to move up and down. When the laser cutting head 102 moves left and right, the motor 208 drives the screw rod 206 to rotate. Under the guiding action of the guide frame 205, the screw rod 206 moves the guide block 207 by screw transmission. The guide block 207 drives the laser cutting head 102 to move left and right. When the laser cutting head 102 moves forward and backward, the motor 1 204 drives the screw rod 1 203 to rotate. Under the guiding action of the guide groove 1 201, the screw rod 1 203 drives the guide block 1 202 to move forward and backward by screw transmission. The guide block 1 202 drives the guide frame 205, the guide block 207 and the laser cutting head 102 to move forward and backward.

[0066] like Figure 1 、 Figure 2 and Figure 4As shown, as a preferred embodiment of the present invention, the air nozzle cleaning mechanism 5 includes a rotating sleeve 2 501 rotatably connected to the support frame 106, a cleaning brush 502 is fixed in the rotating sleeve 2 501, a gear 1 503 is fixed on the side wall of the rotating sleeve 2 501, a motor 4 504 is fixed to the bottom of the support frame 106 through a bracket, a gear 2 505 is installed on the rotating end of the motor 4 504, and the gear 2 505 is meshed with the gear 1 503.

[0067] In an embodiment of the present invention, when cleaning the air nozzle 104 at the bottom of the laser cutting head 102, the air nozzle 104 moves into the rotating sleeve 2 501 and contacts the cleaning brush 502, the motor 4 504 drives the gear 2 505 to rotate, the gear 2 505 drives the gear 1 503 to rotate, the gear 1 503 drives the cleaning brush 502 to rotate, and the rotating cleaning brush 502 cleans the air nozzle 104 at the bottom of the laser cutting head 102. The cleaning brush 502 can be a copper wire brush.

[0068] like Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 、 Figure 9 and Figure 10As shown, as a preferred embodiment of the present invention, the gas nozzle replacement mechanism 4 includes a rotating sleeve 101 rotatably connected to the support frame 106, the internal cross-sectional profile of the rotating sleeve 101 is consistent with the cross-sectional profile of the gas nozzle 104, and a transmission gear 411 is fixed on the side wall of the rotating sleeve 101, and the transmission gear 411 is engaged with the gear 1 503; the base plate 101 is fixed with a support frame 2 402, the support frame 2 402 is located below the support frame 106, a limiting sleeve 403 is fixed on the support frame 2 402, and a switching block 404 is rotatably connected to the support frame 2 402 in the limiting sleeve 403, a motor 3 406 is fixed to the bottom of the support frame 2 402, and the rotating end of the motor 3 406 is connected to the bottom of the switching block 404, and two workstation slots 405 are evenly arranged on the switching block 404, one of which is located directly below the rotating sleeve 1 401 , the support frame 2 402 is provided with a feeding assembly 6, and the feeding assembly 6 is used to supply the air nozzle 104 to another station slot 405; the support frame 2 402 is located just below the rotating sleeve 1 401 and is rotatably connected to a rotating plate 407, and a top block 408 is slidably connected to the rotating plate 407, and a compression spring 1 409 is fixed on the side wall of the top block 408, and the end of the compression spring 1 409 is fixed on the rotating plate 407, and the bottom plate 1 01 is hinged with a telescopic driving member 2 410, and the telescopic end of the telescopic driving member 2 410 is hinged to the bottom of the top block 408; the feeding assembly 6 includes a feeding rack 601 fixed on the support frame 2 402, and a pushing block 602 is slidably connected inside the feeding rack 601, and a tension spring 603 is fixed on the pushing block 602, and the end of the tension spring 603 is connected to the support frame 2 402, and one end of the feeding rack 601 is connected to the limit sleeve 403.

[0069] In the embodiment of the present invention, in the initial state, a plurality of air nozzles 104 are linearly arranged in the feeding rack 601, the tension spring 603 pulls the pushing block 602, and the pushing block 602 pushes the plurality of air nozzles 104, thereby causing one of the air nozzles 104 to enter one of the station slots 405, and the other station slot 405 is located below the rotating sleeve 1 401, the telescopic driving member 2 410 is in a retracted state, the telescopic driving member 2 410 can adopt an electric telescopic rod, the rotating plate 407 is tilted downward (in the material guiding state), and the bottom of the rotating sleeve 1 401 is open (such as Figure 8 shown);

[0070] When replacing the gas nozzle 104, the laser cutting head 102 drives the bottom gas nozzle 104 to be inserted into the rotating sleeve 1 401, the gear 1 503 drives the transmission gear 411 to rotate, the transmission gear 411 drives the rotating sleeve 1 401 to rotate, and the rotating sleeve 1 401 drives the gas nozzle 104 to rotate. As the gas nozzle 104 rotates, the gas nozzle 104 is unscrewed from the laser cutting head 102, and the gas nozzle 104 falls onto the rotating plate 407 by its own weight, and falls into the collection box under the guidance of the rotating plate 407;

[0071] The telescopic driving member 2 410 is extended, and the telescopic driving member 2 410 drives the rotating plate 407 to rotate through the top block 408 and the compression spring 1 409 until the rotating plate 407 rotates to a horizontal state. At this time, the top of the rotating plate 407, the top of the top block 408 and the top of the support frame 2 402 form a complete plane (such as Figure 9 As shown), the motor three 406 drives the switching block 404 to rotate, and the switching block 404 drives the two station slots 405 to switch positions. One of the station slots 405 brings the new air nozzle 104 to the bottom of the rotating sleeve 1 401, and the pushing block 602 pushes the air nozzle 104 into the other station slot 405. At this time, the telescopic driving member 2 410 continues to extend, and the telescopic driving member 2 410 overcomes the elastic force of the compression spring 1 409 and pushes the top block 408 upward. The top block 408 moves upward relative to the rotating plate 407, and the top block 408 pushes the air nozzle 104 in the station slot 405 into the rotating sleeve 1 401 (as shown). Figure 10 As shown in the figure, the top of the air nozzle 104 contacts the bottom of the laser cutting head 102, the gear 1 503 drives the transmission gear 411 to reverse, the transmission gear 411 drives the rotating sleeve 1 401 to reverse, and the rotating sleeve 1 401 drives the air nozzle 104 to reverse. As the air nozzle 104 rotates, the air nozzle 104 is screwed onto the bottom of the laser cutting head 102, thereby completing the replacement of the air nozzle 104.

[0072] like Figure 2 and Figure 7 As shown, as a preferred embodiment of the present invention, a sliding groove 701 is provided in the top block 408, a sliding block 702 is slidably connected in the sliding groove 701, a compression spring 2 703 is fixed at one end of the sliding block 702, and the end of the compression spring 2 703 is fixed in the sliding groove 701.

[0073] In an embodiment of the present invention, when the top block 408 pushes the air nozzle 104 upward, the sliding block 702 contacts the bottom of the air nozzle 104 until the top of the air nozzle 104 contacts the laser cutting head 102. The sliding block 702 overcomes the elastic force of the compression spring 2 703 and retracts into the sliding groove 701. At this time, the air nozzle 104 is in elastic contact with the laser cutting head 102. As the rotating sleeve 1 401 drives the air nozzle 104 to rotate, the air nozzle 104 is screwed to the bottom of the laser cutting head 102. Through the arrangement of the sliding block 702 and the compression spring 2 703, the rigid contact between the air nozzle 104 and the laser cutting head 102 can be avoided, thereby protecting the air nozzle 104 and the laser cutting head 102.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip board laser cutting device for chip production, comprising a base plate and a laser cutting head connected to the base plate by a moving mechanism, the moving mechanism being used to drive the laser cutting head to move up and down and horizontally, characterized in that: Also includes: The air nozzle is threaded at the bottom of the laser cutting head, and the air inlet cavity is set in the laser cutting head. The air inlet cavity is connected to the external air source, and the air inlet cavity is connected to the air nozzle. An air pressure sensor is installed in the air inlet cavity. A support frame 1 is fixed on the bottom plate, and a detection station is set on the support frame 1. A plurality of micro pressure sensors are evenly arranged in a ring on the detection station. The support frame 1 is provided with an air nozzle cleaning mechanism, which is used to clean the air nozzle; It also includes a nozzle detection system, which uses an air pressure sensor and multiple micro pressure sensors to determine whether the nozzle needs to be replaced. The nozzle detection system includes: A data acquisition module, used to acquire internal air pressure data of the air inlet cavity and multiple external air pressure data around the air nozzle; The air pressure analysis module builds an air pressure analysis model based on internal air pressure data and standard internal air pressure data and outputs the air pressure fluctuation coefficient; Pressure distribution uniformity analysis module, which builds a pressure uniformity analysis model based on multiple external air pressure data and outputs the pressure uniformity coefficient; The air nozzle state assessment module constructs an air nozzle state assessment model based on the air pressure fluctuation coefficient and the pressure uniformity coefficient and outputs the air nozzle state assessment coefficient.

2. The chip sheet laser cutting device for chip production according to claim 1, characterized in that: The moving mechanism includes a lifting frame installed on the base plate, and a guide groove 1 is provided on the top of the lifting frame. A guide block 1 is slidably connected in the guide groove 1, a screw rod 1 is rotatably connected in the guide groove 1, and the screw rod 1 is threadedly connected to the guide block 1. A motor 1 is fixed on the side wall of the lifting frame, and the rotating end of the motor 1 is connected to the screw rod 1. A guide frame is fixed to the bottom of the guide block 1, and a guide block 2 is slidably connected on the guide frame along the length direction of the guide frame. A screw rod 2 is rotatably connected in the guide frame, and the screw rod 2 is threadedly connected to the guide block 2. A motor 2 is fixed at one end of the guide frame, and the rotating end of the motor 2 is connected to the screw rod 2.

3. The chip sheet laser cutting device for chip production according to claim 2, characterized in that: The lifting frame includes a fixed sleeve fixed on the top of the base plate, and a concave lifting plate vertically slidably connected in the fixed sleeve. A telescopic driving component is fixed on the top of the base plate, the telescopic end of the telescopic driving component is connected to the concave lifting plate, a guide groove is set on the top of the concave lifting plate, and a motor is fixed on the side wall of the concave lifting plate.

4. The chip sheet laser cutting device for chip production according to claim 1, characterized in that: The air nozzle cleaning mechanism includes a rotating sleeve 2 rotatably connected to a support frame 1, a cleaning brush is fixed inside the rotating sleeve 2, a gear 1 is fixed on the side wall of the rotating sleeve 2, a motor 4 is fixed to the bottom of the support frame 1 through a bracket, a gear 2 is installed on the rotating end of the motor 4, and the gear 2 is meshed with the gear 1.

5. The chip sheet laser cutting device for chip production according to claim 4, characterized in that: The air nozzle replacement mechanism includes a rotating sleeve 1 rotatably connected to the support frame 1, the internal cross-sectional profile of the rotating sleeve 1 is consistent with the cross-sectional profile of the air nozzle, and a transmission gear is fixed to a side wall of the rotating sleeve, and the transmission gear is meshed with the gear 1; A support frame 2 is fixed on the bottom plate, and the support frame 2 is located below the support frame 1. A limit sleeve is fixed on the support frame 2. A switching block is rotatably connected in the limit sleeve on the support frame 2. A motor 3 is fixed to the bottom of the support frame 2. The rotating end of the motor 3 is connected to the bottom of the switching block. Two workstation slots are evenly arranged on the switching block, one of which is located directly below the rotating sleeve 1. A feeding assembly is provided on the support frame 2, and the feeding assembly is used to supply an air nozzle to the other workstation slot. The support frame 2 is located just below the rotating sleeve 1 and is rotatably connected to a rotating plate, the rotating plate is slidably connected to a top block, a compression spring 1 is fixed on the side wall of the top block, the end of the compression spring 1 is fixed on the rotating plate, and a telescopic driving component 2 is hinged on the bottom plate, and the telescopic end of the telescopic driving component 2 is hinged to the bottom of the top block.

6. The chip sheet laser cutting device for chip production according to claim 5, characterized in that: The feeding assembly includes a feeding rack fixed on the second support frame, a pushing block is slidably connected in the feeding rack, a tension spring is fixed on the pushing block, the end of the tension spring is connected to the second support frame, and one end of the feeding rack is connected to the limit sleeve.

7. The chip sheet laser cutting device for chip production according to claim 5, characterized in that: A sliding groove is provided in the top block, a sliding block is slidably connected in the sliding groove, a compression spring 2 is fixed to one end of the sliding block, and the end of the compression spring 2 is fixed in the sliding groove.

8. The chip sheet laser cutting device for chip production according to claim 1, characterized in that: The valve status assessment model is: in, is the valve status evaluation coefficient, is the volatility coefficient weight, is the uniformity coefficient weight, , is the pressure fluctuation coefficient, is the pressure uniformity coefficient.

9. The chip sheet laser cutting device for chip production according to claim 8, characterized in that: The air pressure analysis model is: described is the pressure fluctuation coefficient, is the measured internal air pressure value, is the standard internal air pressure value, is the maximum allowable deviation threshold.

10. The chip sheet laser cutting device for chip production according to claim 8, characterized in that: The pressure uniformity analysis model is: in, is the pressure uniformity coefficient, is the pressure variation coefficient, , is the maximum allowable coefficient of variation threshold, is the mean pressure, is the pressure standard deviation.

Images