Display device and method for manufacturing display device

Abstract

A display device includes a first substrate including a main area and a pad area, and a second substrate on the main area and the pad area of the first substrate including a bending area between the main area and the pad area. The first substrate includes: a first sub-substrate overlapping the main region; and a second sub-substrate that overlaps the pad region and is spaced apart from the first sub-substrate such that a bending region is interposed between the second sub-substrate and the first sub-substrate. In the plane, the first sub-substrate includes a first edge portion overlapping an edge surrounding the first sub-substrate. The first edge portion includes: a first side portion facing the curved region; a second side portion spaced apart from the first side portion; and a first corner portion between the first side portion and the second side portion. In a cross section, cross-sectional structures of portions of the first sub-substrate overlapping the first side surface portion, the second side surface portion, and the first corner portion are different from each other.

Description

Technical Field

[0001] The present invention relates to a display device and a method for manufacturing the display device. Background Art

[0002] With the development of the information society, the demand for display devices for displaying images in various forms has increased. The display devices can be flat panel display devices such as liquid crystal display devices (LCD), field emission display devices (FED), light emitting display panels (LED), etc.

[0003] A display device includes a display area for displaying an image and a periphery of the display area, such as a non-display area surrounding the display area. Recently, the width of the non-display area has been gradually reduced to enhance the immersion of the display area and improve the aesthetics of the display device.

[0004] In addition, in a manufacturing process of the display device, the display device may be formed by cutting the mother substrate along a plurality of display units formed on the mother substrate. Summary of the Invention

[0005] An object of the present invention is to provide a method for manufacturing a display device, which can maximize the number of display units included in the mother substrate by reducing the intervals between the multiple display units configured in the mother substrate during the manufacturing process of the display device.

[0006] The objects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other objects not mentioned from the following description.

[0007] A display device according to an embodiment for solving the technical problem includes: a first substrate including a main area and a pad area, and a second substrate located on the main area and the pad area of ​​the first substrate, including a curved area located between the main area and the pad area. The first substrate includes: a first sub-substrate overlapping the main area; and a second sub-substrate overlapping the pad area and separated from the first sub-substrate with the curved area interposed therebetween. In a plan view, the first sub-substrate includes a first edge portion overlapping an edge surrounding the first sub-substrate. The first edge portion includes: a first side portion facing the curved area; a second side portion spaced apart from the first side portion; and a first corner portion located between the first side portion and the second side portion. In cross section, the cross-sectional structures of the portions of the first sub-substrate that overlap with the first side portion, the second side portion, and the first corner portion, respectively, are different from one another.

[0008] In several embodiments, the first sub-substrate may include a first surface facing the second substrate and a second surface facing the first surface. The first sub-substrate also includes a first side surface in a portion overlapping with the first corner portion. The first side surface is connected to the first surface, and a first inclination angle formed by the first surface and the first side surface is an obtuse angle.

[0009] In some embodiments, an undercut may be formed between the first side surface and the second substrate toward an outer side of the first sub-substrate.

[0010] In some embodiments, the first sub-substrate may further include a second side surface at a portion overlapping with the first corner portion, the second side surface connecting the second surface and the first side surface, and a second inclination angle formed by the second surface and the second side surface is an obtuse angle.

[0011] In some embodiments, the first sub-substrate further includes, at a portion overlapping the first side surface, a first curved side surface that engages the first surface; and a second curved side surface that connects the first curved side surface and the second surface. A first curved inclination angle formed by the first surface and the first curved side surface is an obtuse angle, and the first curved inclination angle and the first inclination angle are different from each other.

[0012] In some embodiments, in a portion of the first sub-substrate overlapping the first side surface, a second curved inclination angle formed by the second surface and the second curved side surface is an obtuse angle, and the second inclination angle is different from the second curved inclination angle.

[0013] In some embodiments, the portion of the first sub-substrate overlapping the second side surface may further include: a first edge surface engaging the first surface; and a second edge surface connecting the first edge surface and the second surface. In the portion of the first sub-substrate overlapping the second side surface, no undercut is provided between the second substrate and the first edge surface.

[0014] In some embodiments, the first edge inclination angle formed by the first edge surface and the second edge surface may be an obtuse angle.

[0015] In some embodiments, in the portion of the first sub-substrate overlapping the second side surface, the second edge inclination angle formed by the second surface and the second edge surface is an obtuse angle, and the second inclination angle and the second edge inclination angle may be different from each other.

[0016] In some embodiments, the thickness of the first substrate may be greater than the thickness of the second substrate.

[0017] In some embodiments, the thickness of the first substrate may be 200 μm.

[0018] In some embodiments, the second sub-substrate includes a second edge portion that overlaps with an edge surrounding the second sub-substrate in plan view. The second edge portion includes a third side portion facing the curved region; a fourth side portion spaced apart from the third side portion; and a second corner portion located between the third and fourth side portions. In cross-section, the portions of the second sub-substrate that overlap with the third, fourth, and second corner portions, respectively, may have different cross-sectional structures.

[0019] In several embodiments, the second sub-substrate includes a first surface facing the second substrate and a second surface facing the first surface. The portion of the second sub-substrate overlapping the second corner portion further includes: a first side surface connected to the first surface; and a second side surface connecting the second surface and the first side surface. The first inclination angle formed by the first surface and the first side surface, and the second inclination angle formed by the second surface and the second side surface, may be obtuse angles.

[0020] In some embodiments, an undercut may be formed between the first side surface and the second substrate toward an outer side of the second sub-substrate.

[0021] In some embodiments, the portion of the second sub-substrate overlapping the fourth side surface may further include: a first edge surface connected to the first surface; and a second edge surface connecting the first edge surface and the second surface. In the portion of the second sub-substrate overlapping the fourth side surface, no undercut is included between the second sub-substrate and the first edge surface.

[0022] In some embodiments, the second sub-substrate may further include, at a portion overlapping the third side surface, a first curved side surface engaging the first surface; and a second curved side surface connecting the first curved side surface and the second surface. A first bending inclination angle formed by the first surface and the first curved side surface, and a second bending inclination angle formed by the second surface and the second curved side surface are obtuse angles, the first bending inclination angle and the first inclination angle are different from each other, and the second bending inclination angle and the second inclination angle are different from each other.

[0023] A method for manufacturing a display device according to an embodiment for solving the above-mentioned technical problem includes the following steps: forming a mother substrate and forming a plurality of display units on the mother substrate, the mother substrate including a first mother substrate and a second mother substrate disposed on a first surface of the first mother substrate; etching a portion of the first mother substrate that overlaps with a curved pattern portion by spraying an etching liquid or forming a groove with a blade on the second surface of the first mother substrate, the second surface being located opposite the first surface; forming a unit cutting line along the edge of the display unit by irradiating a laser onto the second surface; and cutting the first mother substrate by spraying an etching liquid onto the second surface without a mask, removing the portion of the first mother substrate that overlaps with the curved pattern portion to form a first substrate. In the step of forming the unit cutting line, a portion of the unit cutting line may intersect with the curved pattern portion.

[0024] In several embodiments, in the step of forming the first substrate, a portion of the first mother substrate that overlaps with the intersection of the unit cutting line and the curved pattern portion includes a first side surface and a second side surface connected to the first side surface in the direction toward the unit cutting line and the curved pattern portion; the first side surface is connected to the first surface of the first mother substrate, and the second side surface is connected to the second surface of the first mother substrate; a bottom cut can be formed between the first side surface and the second mother substrate toward the outer side of the first substrate.

[0025] In some embodiments, in the step of forming the first substrate, a first inclination angle formed by the first surface and the first side surface of the first mother substrate may be an obtuse angle.

[0026] In some embodiments, in the step of forming the first substrate, the second inclination angle formed by the second surface and the second side surface of the first mother substrate may be an obtuse angle.

[0027] Specific details of other embodiments are included in the detailed description and drawings.

[0028] (Effects of the Invention)

[0029] In a display device manufacturing process according to one embodiment, unit cutting lines surrounding the perimeters of the plurality of display units and curved pattern portions overlapping the curved regions of the display units can be formed intersectingly. Thus, in a display device manufacturing process according to one embodiment, the steps of separating the plurality of display units and removing the portion of the first substrate overlapping the curved pattern portions can be performed in a single process.

[0030] Therefore, the display device of one embodiment can minimize the intervals between the multiple display units in the manufacturing process of the display device, thereby maximizing the number of the multiple display units in the mother substrate, and can facilitate and simplify manufacturing.

[0031] The effects of the embodiment are not limited to the above-mentioned examples, and more effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a perspective view showing a display device according to an embodiment.

[0033] Figure 2 FIG. 1 is a top view showing a display panel and a driver IC according to an embodiment.

[0034] Figure 3 yes Figure 2 A schematic cross-sectional view of a display device.

[0035] Figure 4 yes Figure 3 A schematic cross-sectional view of a display device in which the display panel is bent.

[0036] Figure 5 yes Figure 2 A schematic top view of the first substrate and the second substrate.

[0037] Figure 6 yes Figure 5 A sectional view taken along line Y1-Y1'.

[0038] Figure 7 yes Figure 5 A sectional view taken along line Y3-Y3'.

[0039] Figure 8 is a flowchart illustrating a method for manufacturing a display device according to an embodiment.

[0040] Figure 9 It shows Figure 8 A perspective view of step S100.

[0041] Figure 10 It is along Figure 9 A cross-sectional view taken along the line X1-X1'.

[0042] Figure 11 It shows Figure 8 A stereoscopic diagram of step S201 in step S200.

[0043] Figure 12 and Figure 13 It is along Figure 11 Cross-sectional view taken along the Y5-Y5' line.

[0044] Figure 14 It shows Figure 8 A perspective view of step S202 in step S200.

[0045] Figure 15 It is along Figure 14 Cross-sectional view taken along the Y7-Y7' line.

[0046] Figure 16 It shows Figure 8 A perspective view of step S300.

[0047] Figure 17 It is along Figure 16 Cross-sectional view taken along line X3-X3'.

[0048] Figure 18 It shows Figure 8 A perspective view of step S400.

[0049] Figure 19 and Figure 20 It is along Figure 18 Cross-sectional view taken along line X5-X5'.

[0050] Figure 21 It is along Figure 18 Cross-sectional view taken along the Y9-Y9' line.

[0051] Figure 22 It is along Figure 18 Cross-sectional view taken along line X7-X7'.

[0052] Figure 23 It shows Figure 8 A perspective view of step S500.

[0053] Description of Reference Signs

[0054] 10: Display device; 110: First substrate; 110a: First sub-substrate; 110b: Second sub-substrate; 112: Second substrate; 150: Display element layer; 170: Thin film encapsulation layer; 450: Bending protection layer; BA: Bending area; BP: Bending pattern portion; CL: Unit cutting line; EG: Edge portion; MSUB: Mother substrate; MSUB1: First mother substrate; MSUB2: Second mother substrate; GRV: Groove DETAILED DESCRIPTION

[0055] By attaching Figure 1The advantages, features, and methods of implementing the present invention can be clearly understood by referring to the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of different forms. However, these embodiments are provided to fully disclose the present invention and to fully inform those skilled in the art of the art to which the present invention belongs. The present invention is defined solely by the scope of the appended claims.

[0056] When an element or layer is referred to as "on" another element or layer, it includes the case where the element is directly above the other element or layer, or where another layer or element is disposed therebetween. Similarly, when referred to as "below," "left," and "right," it includes the case where the element is directly adjacent to another element or layer, or where another layer or element is disposed therebetween. Throughout this specification, the same reference numerals denote the same components.

[0057] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0058] Figure 1 1 is a perspective view showing a display device 10 according to an embodiment. Figure 2 FIG. 1 is a top view showing a display panel 100 and a driver IC 200 according to an embodiment.

[0059] Reference Figure 1 and Figure 2 The display device 10 of one embodiment is a device for displaying dynamic images or static images. It can be used not only as a display screen for portable electronic devices such as mobile phones, smart phones, tablet personal computers, smart watches, watch phones, mobile communication terminals, e-manuals, e-books, portable multimedia players (PMPs), navigation devices, and ultra mobile PCs (UMPCs), but can also be used as a display screen for a variety of products such as televisions, notebooks, monitors, billboards, and Internet of Things (IoT) devices.

[0060] The display device 10 of one embodiment may be an organic light-emitting display device such as an organic light-emitting diode (OLED), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, or an ultra-small light-emitting display device using micro or nano light-emitting diodes (micro-LEDs or nano-LEDs). The following description focuses on the case where the display device 10 is an organic light-emitting display device, but the present invention is not limited to this.

[0061] A display device 10 in one embodiment may include a display panel 100 , an integrated circuit (IC) 200 , and a circuit board 300 .

[0062] The display panel 100 may be formed into a rectangular plane having a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The corner where the long side in the first direction (X-axis direction) and the short side in the second direction (Y-axis direction) meet may be formed at a right angle or in an arc shape with a curvature. The planar shape of the display panel 100 is not limited to a quadrilateral and may be formed in other polygonal shapes, a circle, or an ellipse.

[0063] In the accompanying drawings, the first direction (X-axis direction) and the second direction (Y-axis direction) are horizontal directions that intersect each other. For example, the first direction (X-axis direction) and the second direction (Y-axis direction) may be orthogonal to each other. Furthermore, the third direction (Z-axis direction) may intersect the first direction (X-axis direction) and the second direction (Y-axis direction), for example, it may be a vertical direction orthogonal to the first direction (X-axis direction) and the second direction (Y-axis direction). In this specification, the direction indicated by the arrows from the first to the third directions (X-axis direction, Y-axis direction, Z-axis direction) may be referred to as one side, and the opposite direction thereof may be referred to as the other side.

[0064] The display panel 100 may be formed flat, but is not limited thereto. For example, the display panel 100 may include curved portions formed at the ends of the left and right sides of the display panel 100 and having a constant curvature or a variable curvature. Furthermore, the display panel 100 may be formed flexibly so as to bend, bend, curve, fold, or curl.

[0065] The display panel 100 may include a main area MA, a bending area BA, and a pad area PDA. The main area MA may include a display area DA displaying an image and a non-display area NDA disposed around the display area DA.

[0066] The display area DA may occupy most of the area of ​​the display panel 100. The display area DA may be disposed in the center of the display panel 100. Pixels including a plurality of light-emitting areas for displaying an image may be disposed in the display area DA.

[0067] The non-display area NDA may be disposed adjacent to the display area DA. The non-display area NDA may be an outer area of ​​the display area DA. The non-display area NDA may be disposed so as to surround the display area DA. The non-display area NDA may be an edge area of ​​the display panel 100.

[0068] The bending area BA can be arranged between the display area DA and the pad area PDA in the second direction (Y-axis direction). The bending area BA can extend in the first direction (X-axis direction). The bending area BA is an area that bends toward the back surface of the display panel 100. When the bending area BA bends toward the back surface of the display panel 100, multiple driver ICs 200 and the circuit board 300 can be arranged on the back surface of the display panel 100.

[0069] The pad area PDA may be a lower edge area of ​​the display panel 100. Display pads PD for connecting to the circuit board 300 may be configured in the pad area PDA. The display pads PD may be configured at one side edge of the display panel 100. For example, the display pads PD may be configured at the lower edge of the display panel 100.

[0070] The driver IC 200 can be disposed in the pad area PDA. The driver IC 200 can be disposed between the display pads PD and the display area DA in the pad area PDA. Each driver IC 200 can be attached to the pad area PDA of the display panel 100 using a chip on glass (COG) method. Alternatively, each driver IC 200 can be attached to the circuit board 300 using a chip on plastic (COP) method.

[0071] The circuit board 300 can be disposed on a display pad PD disposed on a side edge of the display panel 100. The circuit board 300 can be attached to the display pad PD using a conductive adhesive member such as an anisotropic conductive film or an anisotropic conductive adhesive. The circuit board 300 can be electrically connected to the signal wiring of the display panel 100. The circuit board 300 can be a flexible film such as a flexible printed circuit board (FPC) or a chip on film (CFT).

[0072] Figure 3 yes Figure 2 Schematic cross-sectional view of the display device 10.

[0073] Reference Figure 3 The display device 10 of one embodiment may include a display panel 100, a polarizing film 190, and a cover window 500. The display panel 100 may include a first substrate 110, a second substrate 112, a thin film transistor layer 130, a display element layer 150, a thin film encapsulation layer 170, a touch sensor layer 180, and a bending protection layer 450.

[0074] The first substrate 110 can include a light-transmitting and rigid material. For example, the first substrate 110 can be a glass substrate or a plastic substrate. The first substrate 110 can be made of ultra-thin-glass (UTG) having a thickness of less than 200 μm. In one embodiment, the first substrate 110 can support the second substrate 112.

[0075] The first substrate 110 of one embodiment may include a first sub-substrate 110a and a second sub-substrate 110b. In cross section, the first sub-substrate 110a and the second sub-substrate 110b may be spaced apart in the second direction (Y-axis direction). The first sub-substrate 110a may be arranged to overlap the main area MA, and the second sub-substrate 110b may be arranged to overlap the pad area PDA.

[0076] In one embodiment, the first substrate 110 can be formed by removing a portion of the curved area BA through an etching process during the manufacturing process of the display device 10. Specifically, the first sub-substrate 110a and the second sub-substrate 110b can be integrally formed and then separated by the aforementioned etching process. The manufacturing process will be described later. The figures illustrate that portions of the first sub-substrate 110a and the second sub-substrate 110b overlap the curved area BA, but this is not limiting.

[0077] The second substrate 112 may be located on the first substrate 110. The second substrate 112 may be located in a portion overlapping the main area MA and the sub-area SBA. The second substrate 112 may have a thickness of approximately 20 μm. The second substrate 112 may be made of a flexible polymer resin. As an example, the second substrate 112 may be formed of an organic material such as an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0078] The thin film transistor layer 130 may be located on the second substrate 112. The thin film transistor layer 130 may be located in a portion overlapping the display area DA and the non-display area NDA of the main area MA. The thin film transistor layer 130 may include a plurality of thin film transistors and a plurality of wirings.

[0079] The display element layer 150 may be located on the thin film transistor layer 130. The display element layer 150 may be arranged to overlap with the display area DA of the main area MA. The display element layer 150 may be a layer that displays an image.

[0080] The thin film encapsulation layer 170 may be located on the display element layer 150. The thin film encapsulation layer 170 may be located in a portion overlapping the display area DA and the non-display area NDA of the main area MA. The thin film encapsulation layer 170 may prevent oxygen or moisture from penetrating into the display element layer 150. The thin film encapsulation layer 170 may include at least one inorganic film and one organic film. The organic film of the thin film encapsulation layer 170 may protect the display element layer 150 from foreign matter such as dust.

[0081] The touch sensor layer 180 may be located on the display element layer 150. The touch sensor layer 180 may be located in a portion overlapping the display area DA and the non-display area NDA of the main area MA. The touch sensor layer 180 may include sensor electrodes and may sense a user's touch using the sensor electrodes.

[0082] The polarizing film 190 may be located on the touch sensor layer 180. The polarizing film 190 may be located in a portion overlapping the display area DA and the non-display area NDA of the main area MA. The polarizing film 190 may reduce external light reflection.

[0083] The cover window 500 may be located on the polarizing film 190. The cover window 500 may be located in a portion overlapping the display area DA and the non-display area NDA of the main area MA. The cover window 500 may be attached to the polarizing film 190 using a transparent adhesive member such as an optically clear adhesive (OCA) film.

[0084] The bending protection layer 450 may be located on the second substrate 112. The bending protection layer 450 may be located at a portion overlapping the bending area BA. When the portion of the display panel 100 overlapping the bending area BA is bent, the bending protection layer 450 may protect the display panel 100 from bending stress.

[0085] The bending protection layer 450 may include a synthetic resin. For example, the bending protection layer 450 may include at least one of acrylonitrile butadiene styrene copolymer (ABS), urethane acrylate (UA), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0086] The driver IC 200 and the circuit board 300 may be located on the second substrate 112. In cross section, the driver IC 200 and the circuit board 300 may be located in a portion overlapping the pad area PDA. In cross section, the driver IC 200 may be located between the curved protective layer 450 and the circuit board 300, with the driver IC 200 spaced apart from the curved protective layer 450 and the circuit board 300. One side of the circuit board 300 may contact the second substrate 112.

[0087] Figure 4 yes Figure 3 Schematic cross-sectional view of the display device 10 after the display panel 100 is bent.

[0088] Reference Figure 4 In one embodiment, the portion of the display panel 100 overlapping the bending area BA may be bent. When the portion of the display panel 100 overlapping the bending area BA is bent, the pad area PDA of the display device 10 may overlap with the main area MA in the third direction (Z-axis direction). Furthermore, when the portion of the display panel 100 overlapping the bending area BA is bent, the first sub-substrate 110a and the second sub-substrate 110b may overlap with each other in the third direction (Z-axis direction).

[0089] Figure 5 yes Figure 2 Schematic top view of the first substrate 110 and the second substrate 112.

[0090] Reference Figure 5In a planar view, the first substrate 110 of one embodiment may include a first sub-substrate 110a and a second sub-substrate 110b. The first sub-substrate 110a and the second sub-substrate 110b may be spaced apart in the second direction (Y-axis direction). In a planar view, the second substrate 112 of one embodiment may entirely cover the first substrate 110. In other words, in a planar view, the second substrate 112 of one embodiment may entirely cover the first sub-substrate 110a and the second sub-substrate 110b. The first sub-substrate 110a and the second sub-substrate 110b, which are spaced apart in the second direction (Y-axis direction), may be connected to each other via the second substrate 112.

[0091] On a plane, the first substrate 110 of an embodiment may include an edge portion EG (see Figure 6 ). The edge portion EG may represent a portion surrounding the outer contours of the first sub-substrate 110a and the second sub-substrate 110b. In other words, the edge portion EG may represent an edge of the first substrate 110. Specifically, the edge portion EG of the first sub-substrate 110a may be located in a portion overlapping with the non-display area NDA included in the main area MA, and may surround the display area DA included in the main area MA. In addition, the edge portion EG of the second sub-substrate 110b may be located in a portion overlapping with the pad area PDA. The drawings show that a portion of the edge portion EG included in the first sub-substrate 110a and a portion of the edge portion EG included in the second sub-substrate 110b overlap with the bending area BA, but are not limited to this.

[0092] On a planar surface, the first sub-substrate 110a may include a side surface AS and a corner portion AC in the portion overlapping the edge portion EG. The side surface AS included in the first sub-substrate 110a may include a first side surface AS1, a second side surface AS2, a third side surface AS3, and a fourth side surface AS4. The first side surface AS1 may be located to the left of the display area DA, the second side surface AS2 may be located below the display area DA, the third side surface AS3 may be located to the right of the display area DA, and the fourth side surface AS4 may be located above the display area DA.

[0093] Furthermore, the corner portion AC included in the first sub-substrate 110a may include a first corner portion AC1, a second corner portion AC2, a third corner portion AC3, and a fourth corner portion AC4. The first corner portion AC1 may be located between the first side portion AS1 and the second side portion AS2. Specifically, it may contact the bottom side of the first side portion AS1 and the left side of the second side portion AS2. The second corner portion AC2 may be located between the second side portion AS2 and the third side portion AS3. Specifically, it may contact the right side of the second side portion AS2 and the bottom side of the third side portion AS3. The third corner portion AC3 may be located between the third side portion AS3 and the fourth side portion AS4. Specifically, it may contact the top side of the third side portion AS3 and the right side of the fourth side portion AS4. The fourth corner portion AC4 may be located between the first side portion AS1 and the fourth side portion AS4. Specifically, it may contact the top side of the first side portion AS1 and the left side of the fourth side portion AS4.

[0094] In plan view, the second sub-substrate 110b may include a side portion BS and a corner portion BC in a portion overlapping with the edge portion EG. The side portions BS included in the second sub-substrate 110b may include a first side portion BS1, a second side portion BS2, a third side portion BS3, and a fourth side portion BS4. In plan view, the first side portion BS1 may be located in a portion overlapping with the left end of the pad area PDA, the second side portion BS2 may be located in a portion overlapping with the upper end of the pad area PDA, the third side portion BS3 may be located in a portion overlapping with the right end of the pad area PDA, and the fourth side portion BS4 may be located in a portion overlapping with the lower end of the pad area PDA.

[0095] In addition, the corner portion BC included in the second sub-substrate 110b may include a first corner portion BC1, a second corner portion BC2, a third corner portion BC3, and a fourth corner portion BC4. The first corner portion BC1 can be arranged between the first side portion BS1 and the second side portion BS2. Specifically, it can contact the upper side of the first side portion BS1 and the left side of the second side portion BS2. The second corner portion BC2 can be arranged between the second side portion BS2 and the third side portion BS3. Specifically, it can contact the right side of the second side portion BS2 and the upper side of the third side portion BS3. The third corner portion BC3 can be arranged between the third side portion BS3 and the fourth side portion BS4. Specifically, it can contact the lower side of the third side portion BS3 and the right side of the fourth side portion BS4. The fourth corner portion BC4 can be arranged between the first side portion BS1 and the fourth side portion BS4. Specifically, it can contact the lower side of the first side portion BS1 and the left side of the fourth side portion BS4.

[0096] The second side surface AS2, first corner AC1, and second corner AC2 included in the first sub-substrate 110a of one embodiment, and the second side surface BS2, first corner BC1, and second corner BC2 included in the second sub-substrate 110b of one embodiment can be arranged facing the curved area BA. Furthermore, the remaining side surfaces AS, BS, and corner AC, BC of one embodiment, excluding the second side surface AS2, first corner AC1, and second corner AC2 included in the first sub-substrate 110a, and the second side surface BS2, first corner BC1, and second corner BC2 included in the second sub-substrate 110b, can be arranged facing the outer contour of the display device 10.

[0097] Figure 6 yes Figure 5 A sectional view taken along line Y1-Y1'.

[0098] Reference Figure 6 In one embodiment, the first sub-substrate 110a may include a first surface a1, a second surface a2, a first side surface s1, and a second side surface s2. The first surface a1 of the first sub-substrate 110a may be the surface in contact with the second substrate 112, and the second surface a2 may be the surface facing the first surface a1. The first surface a1 and the second surface a2 may be connected to each other via the first side surface s1 and the second side surface s2.

[0099] In the cross section, the first side surface s1 and the second side surface s2 included in the first sub-substrate 110 a may be located at a portion overlapping with the second side surface portion AS2 included in the edge portion EG.

[0100] In some embodiments, the first side surface s1 and the second side surface s2 may be inclined surfaces. For example, the first side surface s1 and the second substrate 112 may be formed with an undercut in a direction toward the curved area BA, and the first inclination angle θ formed by the first surface a1 and the first side surface s1 is s1 In addition, the second inclination angle θ formed by the second surface a2 and the second side surface s2 of the first sub-substrate 110a is s2 The first side surface s1 and the second side surface s2 of one embodiment can be formed by removing a portion of the first substrate 110 overlapping the bending area BA through an etching process during the manufacturing process of the display device 10. The manufacturing process will be described later.

[0101] In a cross-section, the first sub-substrate 110a of one embodiment may include a first edge surface e1 and a second edge surface e2 in a portion overlapping with the fourth side surface AS4 included in the edge portion EG. The first edge surface e1 may be a surface that connects to the first surface a1 of the first sub-substrate 110a, and the second edge surface e2 may be a surface that connects to the second surface a2 of the first sub-substrate 110a. The first surface a1 and the second surface a2 of the first sub-substrate 110a may be connected to each other via the first edge surface e1 and the second edge surface e2.

[0102] The second edge surface e2 of one embodiment may be an inclined surface. For example, the first inclination angle θ formed by the first edge surface e1 and the second edge surface e2 is e1 and a second inclination angle θ formed by the second edge surface e2 and the second surface a2 e2 The first edge surface e1 and the second edge surface e2 can be formed by removing a portion of the first substrate 110 that overlaps with the edge portion EG through an etching process during the manufacturing process of the display device 10. The manufacturing process will be described later.

[0103] In several embodiments, the second sub-substrate 110b of one embodiment may include a first surface b1, a second surface b2, a first side surface s3, and a second side surface s4. The first surface b1 of the second sub-substrate 110b may be the surface in contact with the second substrate 112, and the second surface b2 of the second sub-substrate 110b may be the surface facing the first surface b1. The first surface b1 and the second surface b2 may be connected to each other via the first side surface s3 and the second side surface s4. The first side surface s1 and the second side surface s2 of the first sub-substrate 110a of one embodiment may face the first side surface s3 and the second side surface s4 of the second sub-substrate 110b across the bent area BA.

[0104] In the cross section, the first side surface s3 and the second side surface s4 included in the second sub-substrate 110 b may be located at a portion overlapping with the second side surface portion BS2 included in the edge portion EG.

[0105] In some embodiments, the first side surface s3 and the second side surface s4 may be inclined surfaces. For example, the first side surface s3 and the second substrate 112 may form an undercut in the direction toward the curved area BA, and the first surface b1 of the second sub-substrate 110b and the first side surface s3 may form a first inclination angle θ s3 In addition, the second inclination angle θ formed by the second surface b2 and the second side surface s4 of the second sub-substrate 110b is s4 It can be an obtuse angle.

[0106] In one embodiment, the first side surface s1 and second side surface s2 of the first sub-substrate 110a, which overlap with the second side surface AS2, and the first side surface s3 and second side surface s4 of the second sub-substrate 110b, which overlap with the second side surface BS2, can be formed by performing the same etching process during the manufacturing process of the display device 10. Thus, the first side surface s1 and second side surface s2 of the first sub-substrate 110a and the first side surface s3 and second side surface s4 of the second sub-substrate 110b can have the same shape. The manufacturing process will be described later.

[0107] In one embodiment, the second sub-substrate 110b may include a first edge surface e1 and a second edge surface e2 in a portion overlapping with the fourth side surface BS4 included in the edge portion EG. The first edge surface e1 may be a surface that interfaces with the first surface b1 of the second sub-substrate 110b, and the second edge surface e2 may be a surface that interfaces with the second surface b2 of the second sub-substrate 110b. The first surface b1 and the second surface b2 of the second sub-substrate 110b may be connected to each other via the first edge surface e1 and the second edge surface e2.

[0108] In one embodiment, the first edge surface e1 and second edge surface e2 of the first sub-substrate 110a, which overlap with the fourth side surface AS4, and the first edge surface e1 and second edge surface e2 of the second sub-substrate 110b, which overlap with the fourth side surface BS4, can be formed by performing the same etching process during the manufacturing process of the display device 10. As a result, the first edge surface e1 and second edge surface e2 of the first sub-substrate 110a and the first edge surface e1 and second edge surface e2 of the second sub-substrate 110b can have the same shape. The manufacturing process will be described later.

[0109] For ease of explanation, the structures and features of the first substrate 110 and the second substrate 112 that overlap with the fourth side portions AS4 and BS4 included in the edge portion EG are illustrated and described. However, the structures of the first substrate 110 and the second substrate 112 that overlap with the first side portions AS1 and BS1 and the third side portions AS3 and BS3 of one embodiment may be the same as the structures of the first substrate 110 and the second substrate 112 that overlap with the fourth side portions AS4 and BS4 described above. Repeated explanation will be omitted.

[0110] Figure 7 yes Figure 5 A sectional view taken along line Y3-Y3'.

[0111] Reference Figure 7In one embodiment, the first sub-substrate 110a may further include a first side surface es1 and a second side surface es2 on the basis of the first surface a1, the second surface a2, the first edge surface e1 and the second edge surface e2. In the cross section, the first edge surface e1 and the second edge surface e2 of the first sub-substrate 110a may be located in a portion overlapping with the third corner portion AC3 included in the edge portion EG. The first edge surface e1 and the second edge surface e2 included in the first sub-substrate 110a may be located in a portion overlapping with the third corner portion AC3 included in the edge portion EG. The first edge surface e1 and the second edge surface e2 located in the portion overlapping with the third corner portion AC3 may overlap with the third corner portion AC3. Figure 6 The first edge surface e1 and the second edge surface e2 at the portion overlapping with the fourth side surface AS4 described in the previous section have the same structure and features, and repeated descriptions are omitted.

[0112] In one embodiment, the first side surface es1 and the second side surface es2 of the first sub-substrate 110a may overlap with the second corner portion AC2 of the edge portion EG. The second corner portion AC2 may overlap with or be adjacent to the bending area BA.

[0113] In some embodiments, the first side surface es1 and the second side surface es2 of one embodiment may be inclined surfaces. For example, the first side surface es1 and the second substrate 112 may form an undercut in a direction toward the curved area BA, and the first inclination angle θ formed by the first surface a1 and the first side surface es1 is es1 In addition, the second inclination angle θ formed by the second surface a2 and the second side surface es2 of the first sub-substrate 110a is es2 It can be an obtuse angle.

[0114] As for the first side surface es1 and the second side surface es2 of one embodiment, they can be formed by removing a portion of the first substrate 110 that overlaps with the bending area BA through an etching process during the manufacturing process of the display device 10. At the same time, as for the first side surface es1 and the second side surface es2 of one embodiment, they can be formed by removing a portion of the first substrate 110 that overlaps with the cell cut line ( Figure 16 The manufacturing process will be described later.

[0115] In one embodiment, the second sub-substrate 110b may further include a first side surface es3 and a second side surface es4 on the basis of the first surface b1, the second surface b2, the first edge surface e1, and the second edge surface e2. The first edge surface e1 and the second edge surface e2 included in the second sub-substrate 110b may be located at a portion overlapping with the third corner portion BC3 included in the edge portion EG. The first edge surface e1 and the second edge surface e2 located at a portion overlapping with the third corner portion BC3 may overlap with the edge portion EG. Figure 6 The first edge surface e1 and the second edge surface e2 at the portion overlapping with the fourth side surface BS4 described in the previous section have the same structure and features, and repeated descriptions are omitted.

[0116] In cross section, the first side surface es3 and the second side surface es4 of the second sub-substrate 110b of one embodiment may overlap with the second corner portion BC2 of the edge portion EG. The second corner portion BC2 may overlap with or be adjacent to the bending area BA.

[0117] In some embodiments, the first side surface es3 and the second side surface es4 of one embodiment may be inclined surfaces. For example, the first side surface es3 and the second substrate 112 may form an undercut in the direction toward the curved area BA, and the first inclination angle θ formed by the first surface b1 and the first side surface es3 is es3 In addition, the second inclination angle θ formed by the second surface b2 and the second side surface es4 of the second sub-substrate 110b is es4 In one embodiment, the first side surface es1 and the second side surface es2 of the first sub-substrate 110a may face the first side surface es3 and the second side surface es4 of the second sub-substrate 110b across the bent area BA.

[0118] As for the first side surface es1 and the second side surface es2 of the first sub-substrate 110a that overlap with the second corner portion AC2 and the first side surface es3 and the second side surface es4 of the second sub-substrate 110b that overlap with the second corner portion BC2 of one embodiment, they can be products formed by performing the same etching process in the manufacturing process of the display device 10. Thus, the first side surface es1 and the second side surface es2 of the first sub-substrate 110a and the first side surface es3 and the second side surface es4 of the second sub-substrate 110b can have the same shape. That is, as for the first side surface es3 and the second side surface es4 included in the second sub-substrate 110b, a portion of the first substrate 110 that overlaps with the curved area BA can be removed by an etching process in the manufacturing process of the display device 10, and at the same time, a portion of the first substrate 110 that overlaps with the unit cutting line ( Figure 16The manufacturing process will be described later.

[0119] For ease of explanation, the structures and features of the first substrate 110 and the second substrate 112, which overlap with the second corner portions AC2, BC2 and the third corner portions AC3, BC3 included in the edge portion EG, are illustrated and described below. However, the structures of the first substrate 110 and the second substrate 112, which overlap with the first corner portions AC1, BC1, according to one embodiment, can be the same as the structures of the first substrate 110 and the second substrate 112, which overlap with the second corner portions AC2, BC2, described above. Furthermore, the structures of the first substrate 110 and the second substrate 112, which overlap with the fourth corner portions AC4, BC4, according to one embodiment, can be the same as the structures of the first substrate 110 and the second substrate 112, which overlap with the third corner portions AC3, BC3, described above. Repetitive descriptions are omitted.

[0120] Below, refer to Figures 8 to 23 , a method for manufacturing a display device according to an embodiment is described. Figure 8 1 is a flowchart illustrating a method for manufacturing the display device 10 according to an embodiment.

[0121] Reference Figure 8 , a manufacturing method S1 of a display device of an embodiment may include: step S100 of forming a display unit (display cell) on a mother substrate including a first mother substrate and a second mother substrate; step S200 of removing a portion of the first mother substrate overlapping with the curved pattern portion by spraying an etching liquid or forming a physical groove on the second surface of the first mother substrate; step S300 of irradiating a laser onto the second surface of the first mother substrate to form a unit cutting line, the unit cutting line simultaneously intersecting the edge portion of the display unit and the curved pattern portion, and laminating a second protective film on the first surface of the first mother substrate; step S400 of spraying an etching liquid onto the second surface of the first mother substrate to reduce the thickness of the first mother substrate, and simultaneously cutting the first mother substrate along the unit cutting line to form a first substrate; step S500 of separating a plurality of display units from the mother substrate. As Figure 8 As shown, step S200 of removing a portion of the first mother substrate that overlaps with the curved pattern portion by spraying an etching liquid or forming a physical groove on the second surface of the first mother substrate can be performed by one of the following two methods. The first method is to spray an etching liquid on the second surface of the first mother substrate after laminating a first protective film to the second surface of the first mother substrate, excluding the portion that overlaps with the curved pattern portion (S201). The second method is to use a blade to form a groove in the portion that overlaps with the curved pattern portion (S202).

[0122] Figure 9 It shows Figure 8 A perspective view of step S100. Figure 10 It is along Figure 9 A cross-sectional view taken along the line X1-X1'.

[0123] exist Figure 8 Further reference to Figure 9 and Figure 10 , performing a step of forming a display unit DPC on the mother substrate MSUB including the first mother substrate MSUB1 and the second mother substrate MSUB2 ( Figure 8 S100).

[0124] In one embodiment, a mother substrate MSUB may include a first mother substrate MSUB1 and a second mother substrate MSUB2. The second mother substrate MSUB2 may be disposed on the first mother substrate MSUB1. The first mother substrate MSUB1 may be made of a rigid material, while the second mother substrate MSUB2 may be made of a flexible material. In this process, the thickness T0 of the first mother substrate MSUB1 may be 500 μm, but this is not limited to this.

[0125] Next, a plurality of display units DPC are formed on the mother substrate MSUB. On a plane, the plurality of display units DPC may be spaced apart from each other in a first direction (X-axis direction) and a second direction (Y-axis direction).

[0126] In cross section, each display unit DPC may include: a first mother substrate MSUB1; a second mother substrate MSUB2, configured on the first surface M1 of the first mother substrate MSUB1; a thin film transistor layer 130, configured on the second mother substrate MSUB2; a display element layer 150, configured on the thin film transistor layer 130; a thin film encapsulation layer 170, configured on the display element layer 150; and a touch sensor layer 180, configured on the thin film encapsulation layer 170.

[0127] Figure 11 It shows Figure 8 A stereoscopic diagram of step S201 in step S200. Figure 12 and Figure 13 It is along Figure 11 Cross-sectional view taken along the Y5-Y5' line.

[0128] exist Figure 8 Further reference to Figures 11 to 13In step S200 of removing a portion of the first mother substrate MSUB1 overlapping with the bent pattern portion BP by spraying an etching liquid ECH on the second surface M2 of the first mother substrate MSUB1 or forming a physical groove, the following method is performed, namely: after attaching a first protective film PRF1 to the second surface M2 of the first mother substrate MSUB1, an etching liquid is sprayed onto the second surface M2 of the first mother substrate MSUB1 (S201), excluding the portion overlapping with the bent pattern portion BP.

[0129] First, a first protection film PRF1 may be attached to the second surface M2 of the first mother substrate MSUB1. The first protection film PRF1 may be attached to a portion of the second surface M2 of the first mother substrate MSUB1 excluding the bent pattern portion BP.

[0130] The first protection film PRF1 may be an acid-resistant film and may prevent the region of the first mother substrate MSUB1 to which the first protection film PRF1 is attached from being etched.

[0131] In this process, the bending pattern portion BP may be a region formed so that a portion of the first mother substrate MSUB1 can be etched to overlap with the bending area BA. The bending pattern portion BP may overlap with the bending protection layer 450. The second surface M2 of the first mother substrate MSUB1 overlapped with the bending pattern portion BP may be exposed.

[0132] Next, an etching solution ECH may be sprayed onto the second surface M2 of the first mother substrate MSUB1 to etch a portion of the first mother substrate MSUB1. As an example, the etching process of this process may be performed using an anisotropic wet etching process.

[0133] In this process, the thickness T1 of the portion of the first mother substrate MSUB1 overlapping with the bent pattern portion BP may be smaller than the thickness T0 of the portion of the first mother substrate MSUB1 overlapping with the remaining region excluding the bent pattern portion BP. After etching the first mother substrate MSUB1, the first mother substrate MSUB1 may have an inclined surface SL at the portion overlapping with the bent pattern portion BP.

[0134] Figure 14 It shows Figure 8 A perspective view of step S202 in step S200. Figure 15 It is along Figure 14 Cross-sectional view taken along the Y7-Y7' line.

[0135] exist Figure 8 Further reference to Figures 14 and 15In step S200 of removing a portion of the first mother substrate MSUB1 overlapping with the bending pattern portion BP by spraying an etching liquid or forming a physical groove on the second surface M2 of the first mother substrate MSUB1, the following method is performed, namely: forming a groove GRV in the portion overlapping with the bending pattern portion BP using a blade BLD (S202).

[0136] First, a groove line GL is formed on the second surface M2 of the first mother substrate MSUB1 in a portion overlapping the bent pattern portion BP. The groove line GL can serve as a guide line to assist in physically forming the groove GRV on the second surface M2 of the first mother substrate MSUB1 using a blade BLD. The blade BLD can move along the groove line GL in the first direction (X-axis direction) from one side of the first mother substrate MSUB1 to the other side of the first mother substrate MSUB1.

[0137] In cross-section, the thickness T2 of the portion of the first mother substrate MSUB1 that overlaps the groove GRV can be less than the thickness T0 of the region of the first mother substrate MSUB1 that does not overlap the bent pattern portion BP. The drawings illustrate the groove GRV as having a rectangular cross-section, but this is not a limitation. For example, the groove GRV can have a polygonal cross-section, such as a triangle or a trapezoid, or can include a curved line, such as a U-shape.

[0138] Figure 16 It shows Figure 8 A perspective view of step S300. Figure 17 It is along Figure 16 Cross-sectional view taken along line X3-X3'.

[0139] exist Figure 8 Further reference to Figure 16 and Figure 17 , performing step S300, that is: forming a unit cutting line CL by irradiating a laser onto the second surface M2 of the first mother substrate MSUB1, the unit cutting line CL simultaneously intersecting the edge of the display unit DPC and the bent pattern portion BP, and attaching a second protective film PRF2 on the first surface M1 of the first mother substrate MSUB1.

[0140] First, laser light LR is irradiated onto the second surface M2 of the first mother substrate MSUB1 to form a cell cutting line CL surrounding the display cell DPC. However, the embodiments of this specification are not limited to this embodiment; laser light LR may also be irradiated onto the first surface M1 of the first mother substrate MSUB1. In a planar view, the portion of the first mother substrate MSUB1 that overlaps the cell cutting line CL can form multiple laser irradiation areas CH in a cross-section. In other words, by connecting the multiple laser irradiation areas CH in a cross-section, a cell cutting line CL can be formed in a planar view.

[0141] In one embodiment, the laser LR can use a variety of lasers. For example, the laser LR can be an infrared Bessel beam having a wavelength of approximately 1030 nm, but the present invention is not limited thereto. When irradiating the second surface M2 of the first mother substrate MSUB1 with the laser LR, the depth T_CH of each of the multiple laser irradiation areas CH can be adjusted based on the repetition rate, processing speed, and pulse energy.

[0142] In some embodiments, the depth T_CH of each of the multiple laser irradiation areas CH can be less than the thickness of the first mother substrate MSUB1. As an example, when the thickness of the first mother substrate MSUB1 is approximately 500 μm, the depth T_CH of each of the multiple laser irradiation areas CH can be approximately 50 μm to 300 μm. However, this is not limiting, and the depth T_CH of each of the multiple laser irradiation areas CH can also be the same as the thickness of the first mother substrate MSUB1.

[0143] Next, a second protective film PRF2 can be applied to the multiple display cells DPC. The second protective film PRF2 can cover all of the multiple display cells DPC at once. The second protective film PRF2 can cover the multiple display cells DPC and the second mother substrate MSUB2. The second protective film PRF2 can be an acid-resistant film. The second protective film PRF2 can protect the multiple display cells DPC from the etching solution ECH during the etching process of the first mother substrate MSUB1.

[0144] In a planar view, the cell cutting lines CL of one embodiment can be formed to surround the perimeter of the display cells DPC while intersecting the curved pattern portion BP. In the display device 10 of one embodiment, during the manufacturing process, by forming the cell cutting lines CL so as to intersect the curved pattern portion BP, the thickness of the first mother substrate MSUB1 can be reduced during the subsequent etching process, while also separating the display cells DPC from the mother substrate MSUB. In other words, by forming the cell cutting lines CL so as to intersect the curved pattern portion BP, the manufacturing process can be simplified, thereby facilitating and easing manufacturing. Furthermore, by forming the cell cutting lines CL so as to intersect the curved pattern portion BP, the spacing between adjacent display cells DPC can be minimized, thereby increasing the number of display cells DPC included in the mother substrate MSUB. In other words, the area efficiency of the display cells DPC relative to the size of the mother substrate MSUB can be increased.

[0145] Figure 18 It shows Figure 8 A perspective view of step S400. Figure 19 and Figure 20 It is along Figure 18 The cross-sectional view taken along the X5-X5' line, Figure 21 It is along Figure 18 The cross-sectional view taken along the Y9-Y9' line, Figure 22 It is along Figure 18 Cross-sectional view taken along line X7-X7'.

[0146] exist Figure 8 Further reference to Figures 18 to 22 , step S400 is performed, namely, spraying an etching solution ECH onto the second surface M2 of the first mother substrate MSUB1 to reduce the thickness of the first mother substrate MSUB1, and simultaneously cutting the first mother substrate MSUB1 along the unit cutting lines CL to form the first substrate 110. In this process, the thickness T4 of the first mother substrate MSUB1 can be approximately 200 μm, but is not limited to this.

[0147] Reference Figure 19 Without an additional mask, the entire second surface M2 of the first mother substrate MSUB1 is etched using the etching liquid ECH. In cross-section, the laser-irradiated areas CH may be regions whose physical properties are altered by the laser. Therefore, in this process, as the etching liquid ECH reduces the thickness of the first mother substrate MSUB1, if the etching liquid ECH penetrates into multiple laser-irradiated areas CH, a difference in etching rate may occur between areas with laser-irradiated areas CH and areas without laser-irradiated areas CH. In other words, the etching rate of the laser-irradiated areas CH etched by the etching liquid ECH may be higher than the etching rate of other areas of the first mother substrate MSUB1 not irradiated by the laser. This results in anisotropic etching of the first mother substrate MSUB1, meaning that the etching rate of the laser-irradiated areas CH is higher than the etching rate of areas without laser-irradiated areas CH.

[0148] Reference Figure 20 In one embodiment, the first substrate 110 may further include a first edge surface e1 and a second edge surface e2 in the portion overlapping the edge portion EG, in addition to the first surface a1 and the second surface a2. The first edge surface e1 and the second edge surface e2 of one embodiment may overlap the periphery of the laser irradiation region CH in cross-section and the periphery of the unit cutting line CL in plan view. The second edge surface e2 of one embodiment may be an inclined surface. Repeated explanation is omitted.

[0149] During this process, a first substrate 110 may be formed. After the first substrate 110 is separated, a portion of the first mother substrate MSUB1 may be retained as a dummy DM. As described above, in the display device 10 of one embodiment, by forming the cell cutting lines CL to intersect the bent pattern portion BP during the manufacturing process, the distance ND1 between the multiple display cells DPC can be minimized. In other words, in the display device 10 of one embodiment, the portion where the dummy DM is formed can be minimized, thereby maximizing the layout efficiency of the multiple display cells DPC within the mother substrate MSUB.

[0150] In this process, while the first substrate 110 is separated from the first mother substrate MSUB1 , a portion of the first substrate 110 overlapping the bending pattern part BP can be etched.

[0151] Reference Figure 21 In this process, a portion of the first substrate 110 overlapping the bent pattern portion BP may be completely removed, thereby forming a first sub-substrate 110 a and a second sub-substrate 110 b .

[0152] In this process, the first sub-substrate 110a may have a first surface a1, a second surface a2, a first side surface s1, and a second side surface s2. The second sub-substrate 110b may have a first surface b1, a second surface b2, a first side surface s3, and a second side surface s4. In one embodiment, the second mother substrate MSUB and the first side surface s1 may have an undercut toward the curved pattern portion BP, and the first side surface s1 and the second side surface s2 may be inclined surfaces. Furthermore, in one embodiment, the second mother substrate MSUB and the first side surface s3 may have an undercut toward the curved pattern portion BP, and the first side surface s3 and the second side surface s4 may be inclined surfaces. Repetitive explanations are omitted.

[0153] Figure 22 Show Figure 18 The cross-sectional structure of the portion of the first substrate 110 that overlaps with the portion intersecting the bending pattern portion BP and the unit cutting line CL. On a plane, the cross-sectional structure of the portion of the first substrate 110 that overlaps with the portion intersecting the bending pattern portion BP and the unit cutting line CL may have a shape different from that of the portion of the first substrate 110 that overlaps with the peripheral portion of the unit cutting line CL and the portion of the first substrate 110 that overlaps with the bending pattern portion BP. Specifically, on a plane, the cross-sectional structure of the portion of the first substrate 110 that overlaps with the portion intersecting the bending pattern portion BP and the unit cutting line CL may have a shape different from that of the portion of the first substrate 110 that overlaps with the peripheral portion of the unit cutting line CL and the portion of the first substrate 110 that overlaps with the bending pattern portion BP. Figure 20 The first edge surface e1 and the second edge surface e2 of the first substrate 110 are shown Figure 21 The first side surfaces s1 and s3 and the second side surfaces s2 and s4 of the first substrate 110 shown in FIG. 1 are different in shape.

[0154] Reference Figure 22 In a planar view, a portion of the first substrate 110 that overlaps with the intersection of the bent pattern portion BP and the unit cutting line CL may include a first side surface es1 and a second side surface es2 that face the laser irradiation region CH in a cross-section. The first side surface es1 and the second side surface es2 may be inclined surfaces, and the second mother substrate MSUB2 and the first side surface es1 may have an undercut formed toward the outside of the first substrate 110.

[0155] In one embodiment, the first side surface es1 and the second side surface es2 can be formed by simultaneously performing an etching process on the portion overlapping with the bent pattern portion BP and an etching process on the portion overlapping with the cell cutting line CL. In other words, in a planar view, in the portion of the first substrate 110 that overlaps with the intersection of the bent pattern portion BP and the cell cutting line CL, anisotropic etching caused by forming the laser irradiation area CH and anisotropic etching caused by removing the portion of the first substrate 110 that overlaps with the bent pattern portion BP are simultaneously performed.

[0156] The first tilt angle θ of one embodiment es1 and the second tilt angle θ es2 The first tilt angle θ may vary depending on the process factors when forming the unit cutting line CL and the process factors when forming the bent pattern portion BP. In addition, the interval ND2 between the plurality of display units DPC may also vary depending on the process factors when forming the unit cutting line CL and the process factors when forming the bent pattern portion BP. As an example, the first tilt angle θ may vary depending on the process factors when forming the unit cutting line CL and the process factors when forming the bent pattern portion BP. es1 , the second tilt angle θ es2 The interval ND2 of the display cell DPC may vary depending on the position of the laser irradiation area CH, the intensity, type, and size of the laser, the type of etching solution, the etching solution exposure time, the depth of the groove, the type of groove, etc. Next, the second protection film PRF2 is removed, and the second mother substrate MSUB2 is cut along the cell cutting line CL.

[0157] Then refer to Figure 23 , performing the step of separating a plurality of display units DPC from the mother substrate MSUB ( Figure 8 In this process, the thickness T110 of the first substrate 110 may be formed to be 200 μm, and each display unit DPC may have Figure 3 The shape of the display device 10 is shown.

[0158] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art will appreciate that the present invention may be implemented in other specific forms without changing the technical concept or essential technical features of the present invention. Therefore, the embodiments described above should be understood in all respects to be illustrative rather than restrictive.

Claims

1. A display device, in, include: A first substrate including a main area and a pad area, and a second substrate, located on the main area and the pad area of ​​the first substrate, and comprising a curved area between the main area and the pad area; The first substrate includes: a first sub-substrate overlapping the main region, and a second sub-substrate overlapping the pad region and spaced apart from the first sub-substrate with the bending region interposed therebetween; On a plane, the first sub-substrate includes a first edge portion overlapping with an edge surrounding the first sub-substrate. And the first edge portion includes: a first side portion facing the curved area, a second side surface portion spaced apart from the first side surface portion, and a first corner portion, located between the first side portion and the second side portion; In cross section, portions of the first sub-substrate that overlap with the first side surface portion, the second side surface portion, and the first corner portion respectively have different cross-sectional structures.

2. The display device according to claim 1, wherein The first sub-substrate includes a first surface facing the second substrate and a second surface facing the first surface. The first sub-substrate further includes a first side surface at a portion overlapping with the first corner portion, the first side surface being connected to the first surface. A first inclination angle formed by the first surface and the first side surface is an obtuse angle.

3. The display device according to claim 2, wherein: An undercut is formed between the first side surface and the second substrate toward the outside of the first sub-substrate.

4. The display device according to claim 2, wherein The first sub-substrate further includes a second side surface at a portion overlapping with the first corner portion, wherein the second side surface connects the second side surface and the first side surface. A second inclination angle formed by the second surface and the second side surface is an obtuse angle.

5. The display device according to claim 4, wherein The first sub-substrate further includes, at a portion overlapping the first side surface, a first curved side surface connected to the first surface; and a second curved side surface connecting the first curved side surface and the second surface. The first curved inclination angle formed by the first surface and the first curved side surface is an obtuse angle, The first bending inclination angle and the first inclination angle are different from each other. The display device according to claim 5 , wherein: In the portion of the first sub-substrate overlapping the first side surface, the second curved inclination angle formed by the second surface and the second curved side surface is an obtuse angle. The second inclination angle and the second bending inclination angle are different from each other.

7. The display device according to claim 4, wherein The first sub-substrate further includes, at a portion overlapping the second side surface, a first edge surface connected to the first surface; and a second edge surface connecting the first edge surface and the second surface. In a portion of the first sub-substrate overlapping the second side surface portion, no undercut is included between the second substrate and the first edge surface.

8. The display device according to claim 7, wherein: A first edge inclination angle formed by the first edge surface and the second edge surface is an obtuse angle.

9. The display device according to claim 7, wherein: In a portion of the first sub-substrate overlapping the second side surface, a second edge inclination angle formed by the second surface and the second edge surface is an obtuse angle. The second inclination angle and the second edge inclination angle are different from each other.

10. The display device according to claim 1, wherein The thickness of the first substrate is greater than the thickness of the second substrate.

11. The display device according to claim 10, wherein: The thickness of the first substrate is 200 μm.

12. The display device according to claim 1, wherein On a plane, the second sub-substrate includes a second edge portion overlapping with an edge surrounding the second sub-substrate. The second edge portion includes: a third side portion, facing the curved area, a fourth side surface portion spaced apart from the third side surface portion, and a second corner portion, located between the third side portion and the fourth side portion; In cross section, portions of the second sub-substrate that overlap with the third side surface portion, the fourth side surface portion, and the second corner portion respectively have different cross-sectional structures.

13. The display device according to claim 12, wherein: The second sub-substrate includes a first surface facing the second substrate and a second surface facing the first surface. The second sub-substrate further includes, at a portion overlapping the second corner portion: a first side surface connected to the first side surface; and a second side surface connecting the second side surface and the first side surface. A first inclination angle formed by the first surface and the first side surface and a second inclination angle formed by the second surface and the second side surface are obtuse angles.

14. The display device according to claim 13, wherein: An undercut is formed between the first side surface and the second substrate toward the outside of the second sub-substrate.

15. The display device according to claim 14, wherein The second sub-substrate further includes, at a portion overlapping the fourth side surface, a first edge surface connected to the first surface; and a second edge surface connecting the first edge surface and the second surface. In a portion of the second sub-substrate overlapping the fourth side surface, no undercut is included between the second substrate and the first edge surface.

16. The display device according to claim 13, wherein The second sub-substrate further includes, at a portion overlapping the third side surface, a first curved side surface connected to the first surface; and a second curved side surface connecting the first curved side surface and the second surface. A first curvature angle formed by the first surface and the first curved side surface, and a second curvature angle formed by the second surface and the second curved side surface are obtuse angles. The first bending inclination angle and the first inclination angle are different from each other, The second bending inclination angle and the second inclination angle are different from each other.

17. A method for manufacturing a display device, in, include: forming a mother substrate and forming a plurality of display units on the mother substrate, wherein the mother substrate includes a first mother substrate and a second mother substrate disposed on a first surface of the first mother substrate; a step of etching a portion of the first mother substrate that overlaps with the curved pattern portion by spraying an etching liquid or forming a groove with a blade on the second surface of the first mother substrate, wherein the second surface is located on the opposite side of the first surface; forming a unit cutting line along an edge of the display unit by irradiating a laser onto the second surface, and In the absence of a mask, an etching liquid is sprayed onto the second surface to cut the first mother substrate, and a portion of the first mother substrate overlapping with the bent pattern portion is removed to form a first substrate; In the step of forming the unit cutting line, a portion of the unit cutting line crosses the bending pattern portion.

18. The method for manufacturing a display device according to claim 17, wherein: In the step of forming the first substrate, a portion of the first mother substrate that overlaps with a portion intersecting the unit cutting line and the curved pattern portion includes a first side surface and a second side surface connected to the first side surface in a direction toward the unit cutting line and the curved pattern portion. The first side surface is connected to the first surface of the first mother substrate, and the second side surface is connected to the second surface of the first mother substrate. An undercut is formed between the first side surface and the second mother substrate toward the outside of the first substrate.

19. The method for manufacturing a display device according to claim 18, wherein: In the step of forming the first substrate, a first inclination angle formed by the first surface and the first side surface of the first mother substrate is an obtuse angle.

20. The method for manufacturing a display device according to claim 19, wherein: In the step of forming the first substrate, a second inclination angle formed by the second surface and the second side surface of the first mother substrate is an obtuse angle.

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