Display device and tiled display device

Abstract

Embodiments of the present disclosure relate to a display device and a tiled display device, and more particularly, to a display device and a tiled display device, including: a first substrate including a display area and a non-display area surrounding the display area; a light emitting device disposed in the display area on the first substrate; a first pad portion disposed in the non-display area on the top surface of the first substrate and disposed at one edge of the first substrate; the second substrate is arranged below the bottom surface of the first substrate; a second pad portion disposed in the non-display area on the bottom surface of the second substrate and disposed at one edge of the second substrate; a side surface connection line electrically connecting the first pad portion and the second pad portion; a side coating disposed to cover the side connecting lines; a side protective layer provided to cover at least a portion of the side coating layer; and a side sealing layer provided to cover at least a portion of the side protection layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0030232, filed on February 29, 2024, which is hereby expressly incorporated by reference in its entirety for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments of the present disclosure relate to a display device and a spliced ​​display device. Background Art

[0004] In recent years, with the development of multimedia, the importance of display devices has been increasing, and in response to this, display devices such as liquid crystal display devices, organic light emitting display devices, and light emitting diode display devices are being commercialized.

[0005] Display devices are widely used as display screens for televisions, laptop computers and monitors, as well as portable electronic devices such as e-books, portable multimedia players (PMPs), GPS, mobile phones, smartphones, smart watches, tablet computers (PCs), watch phones and mobile communication terminals due to their excellent characteristics such as slimness, light weight and low power consumption.

[0006] Recently, use of a multi-display device in which display devices are arranged in a grid type to realize a large screen has been increasing. Summary of the Invention

[0007] Embodiments of the present disclosure may provide a display device and a spliced ​​display device capable of preventing static electricity from entering a side portion of a display module.

[0008] The embodiments of the present disclosure can absorb light incident into gaps between adjacent display modules to provide a display device and a spliced ​​display device in which seams are invisible to the user.

[0009] Embodiments of the present disclosure can provide a display device and a spliced ​​display device capable of preventing moisture from penetrating into the side of a display module.

[0010] An embodiment of the present disclosure may provide a display device, comprising: a first substrate, comprising a display area and a non-display area surrounding the display area; a light-emitting device, arranged in the display area on the first substrate; a first pad portion, arranged in the non-display area on the top surface of the first substrate, and arranged at one edge of the first substrate; a second substrate, arranged below the bottom surface of the first substrate; a second pad portion, arranged in the non-display area on the bottom surface of the second substrate, and arranged at one edge of the second substrate; a side connecting line, electrically connecting the first pad portion with the second pad portion; a side coating, arranged to cover the side connecting line; a side protective layer, arranged to cover at least a portion of the side coating; and a side sealing layer, arranged to cover at least a portion of the side protective layer.

[0011] An embodiment of the present disclosure may provide a spliced ​​display device, which includes a plurality of display modules, each of the plurality of display modules including: a first substrate, including a display area and a non-display area surrounding the display area; a light-emitting device, arranged in the display area on the first substrate; a first pad portion, arranged in the non-display area on the top surface of the first substrate, and arranged at one edge of the first substrate; a second substrate, arranged below the bottom surface of the first substrate; a second pad portion, arranged in the non-display area on the bottom surface of the second substrate, and arranged at one edge of the second substrate; a side connecting line, electrically connecting the first pad portion with the second pad portion; a side coating, arranged to cover the side connecting line; a side protective layer, arranged to cover at least a portion of the side coating; and a side sealing layer, arranged to cover at least a portion of the side protective layer.

[0012] Embodiments of the present disclosure may provide a display device and a spliced ​​display device capable of preventing static electricity from entering a side portion of a display module.

[0013] The embodiments of the present disclosure can absorb light incident into gaps between adjacent display modules to provide a display device and a spliced ​​display device in which seams are invisible to the user.

[0014] Embodiments of the present disclosure can provide a display device and a spliced ​​display device capable of preventing moisture from penetrating into the side of a display module.

[0015] The embodiments of the present disclosure can provide a display device and a spliced ​​display device that can reduce power consumption and thus extend the service life of a display module by preventing static electricity and moisture from invading the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a system structure diagram of a display device according to an embodiment of the present disclosure.

[0017] Figure 2is an equivalent circuit of a sub-pixel in a display device according to an embodiment of the present disclosure.

[0018] Figure 3 is a diagram schematically illustrating a spliced ​​display device according to an embodiment of the present disclosure.

[0019] Figure 4 It is along Figure 3 An exemplary cross-sectional view taken along line AB.

[0020] Figure 5 is a diagram schematically illustrating an ESD flow in a display device according to an embodiment of the present disclosure.

[0021] Figure 6 is an exemplary cross-sectional view of a partial structure of a display device according to an embodiment of the present disclosure.

[0022] Figures 7 to 10 2 is another exemplary cross-sectional view of a partial structure of a display device according to an embodiment of the present disclosure.

[0023] Figures 11 to 17 Schematic diagram of a manufacturing process of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0024] In the following description of examples or embodiments of the present disclosure, reference will be made to the accompanying drawings in which specific examples or embodiments that may be implemented are shown by way of illustration, and in the drawings, the same reference numerals and designations may be used to represent the same or similar components, even if the components are shown in different drawings. In addition, in the following description of examples or embodiments of the present disclosure, when it is determined that a detailed description of well-known functions and components incorporated herein may make the subject matter in some embodiments of the present disclosure less clear, the detailed description will be omitted. Terms such as "including," "having," "comprising," "consisting of," "composed of," and "formed" as used herein are generally intended to allow for the addition of other components unless these terms are used with the term "only." As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0025] Terms such as "first," "second," "A," "B," "(A)," or "(B)" may be used herein to describe elements of the present disclosure. Each of these terms is not used to define the nature, order, sequence, or quantity of an element, but is only used to distinguish the corresponding element from other elements.

[0026] When a first element is referred to as being “connected or coupled to,” “contacting or overlapping,” etc., with a second element, it should be understood that not only can the first element be “directly connected or coupled to,” or “directly contacting or overlapping,” with the second element, but a third element may also be “interposed” between the first and second elements, or the first and second elements may be “connected or coupled to,” “contacting or overlapping,” etc., with each other via a fourth element. Here, the second element may be included in at least one of the two or more elements that are “connected or coupled to,” “contacting or overlapping,” etc., with each other.

[0027] When time-related terms such as “after,” “subsequently,” “next,” “before,” etc. are used to describe a process or operation of an element or configuration, or a process or step in an operation, process, or manufacturing method, these terms may be used to describe non-continuous or non-sequential processes or operations, unless used with the terms “directly” or “immediately.”

[0028] Furthermore, when any dimension, relative size, etc. is mentioned, even if no relevant description is specified, it should be considered that the numerical value or corresponding information (e.g., level, range, etc.) of the element or feature includes a tolerance or error range that may be caused by various factors (e.g., process factors, internal or external impact, noise, etc.). In addition, the term "may" fully encompasses all meanings of the term "can."

[0029] Various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0030] Figure 1 1 is a system structure diagram of the display device 100 according to an embodiment of the present disclosure.

[0031] Reference Figure 1 , the display device 100 according to an embodiment of the present disclosure may include a display panel 110 and a driving circuit for driving the display panel 110 .

[0032] The driving circuit may include a data driving circuit 120 and a gate driving circuit 130 , and may further include a controller 140 that controls the data driving circuit 120 and the gate driving circuit 130 .

[0033] The display panel 110 may include a substrate SUB and signal lines disposed on the substrate SUB, such as a plurality of data lines DL and a plurality of gate lines GL. The display panel 110 may include a plurality of sub-pixels SP associated with the plurality of data lines DL and the plurality of gate lines GL.

[0034] The display panel 110 may include a display area AA for displaying a video and a non-display area NA for not displaying a video. In the display panel 110, the display area AA may include a plurality of sub-pixels SP for displaying a video, and the non-display area NA may include a pad portion, to which the driving circuits 120, 130, and 140 are electrically connected or mounted, and to which an integrated circuit or printed circuit is connected.

[0035] The data driving circuit 120 is a circuit for driving the plurality of data lines DL, and can supply data signals to the plurality of data lines DL.

[0036] The gate driving circuit 130 is a circuit for driving the plurality of gate lines GL, and may supply gate signals to the plurality of gate lines GL.

[0037] The controller 140 may supply a data control signal DCS to the data driving circuit 120 to control a driving timing of the data driving circuit 120 , and may supply a gate control signal GCS to the gate driving circuit 130 to control a driving timing of the gate driving circuit 130 .

[0038] The controller 140 can initialize scanning according to the timing implemented in each frame, convert the external input image data into a data signal format used by the data driving circuit 120, supply the converted image data Data to the data driving circuit 120, and control the driving of the data at an appropriate time according to the scanning.

[0039] In addition to input image data, the controller 140 also receives various timing signals including a vertical synchronization signal VSYNC, a horizontal synchronization signal HSYNC, an input data enable signal DE, and a clock signal CLK from an external source (eg, the host system 150 ).

[0040] The controller 140 receives timing signals such as a vertical synchronization signal VSYNC, a horizontal synchronization signal HSYNC, an input data enable signal DE, and a clock signal CLK to control the data driving circuit 120 and the gate driving circuit 130, and generates various control signals DCS, GCS to output to the data driving circuit 120 and the gate driving circuit 130.

[0041] For example, the controller 140 outputs various gate control signals GCS including a gate start pulse GSP, a gate shift clock GSC, a gate output enable signal GOE, etc., to control the gate driving circuit 130 .

[0042] In addition, the controller 140 outputs various data control signals DCS including a source start pulse SSP, a source sampling clock SSC, a source output enable signal SOE, etc., to control the data driving circuit 120 .

[0043] The controller 140 may be implemented as a separate component from the data driving circuit 120 , or may be integrated with the data driving circuit 120 to form an integrated circuit.

[0044] The data driving circuit 120 receives image data from the controller 140 and drives the plurality of data lines DL by supplying data voltages to the plurality of data lines DL. The data driving circuit 120 is also referred to as a source driving circuit.

[0045] Such a data driving circuit 120 may include one or more source driver integrated circuits (SDICs).

[0046] Each source driver integrated circuit (SDIC) may include a shift register, a latch circuit, a digital-to-analog converter (DAC), an output buffer, etc. In some cases, each source driver integrated circuit (SDIC) may also include an analog-to-digital converter (ADC).

[0047] For example, each source driver integrated circuit (SDIC) can be connected to the display panel 110 via a tape automated packaging (TAB) method, can be connected to the bonding pads on the display panel 110 via a chip on glass (COG) method or a chip on board (COP) method, or can be connected to the display panel 110 in a chip on film (COF) method.

[0048] The gate driving circuit 130 may output a gate signal of an on-level voltage or a gate signal of an off-level voltage according to the control of the controller 140. The gate driving circuit 130 may sequentially drive the plurality of gate lines GL by sequentially supplying gate signals of an on-level voltage to the plurality of gate lines GL.

[0049] The gate driver circuit 130 may be connected to the display panel 110 in a tape automated packaging (TAB) manner, or may be connected to a bonding pad of the display panel 110 in a chip-on-glass (COG) or chip-on-board (COP) manner, or may be connected to the display panel 110 in a chip-on-film (COF) manner. Alternatively, the gate driver circuit 130 may be formed in the non-display area NA of the display panel 110 in a gate-in-panel (GIP) manner. The gate driver circuit 130 may be disposed on or connected to the substrate SUB, that is, if the gate driver circuit 130 is a GIP manner, the gate driver circuit 130 may be disposed in the non-display area NA of the substrate SUB. If the gate driver circuit 130 is a chip-on-glass (COG) manner, a chip-on-film (COF) manner, or the like, the gate driver circuit 130 may be connected to the substrate SUB.

[0050] On the other hand, a driving circuit of at least one of the data driving circuit 120 and the gate driving circuit 130 may be provided in the display area AA.

[0051] For example, the gate driver circuit 130 may be provided in the display area AA. In this case, the gate driver circuit 130 may be provided over the entire display area AA, or may be provided only in a portion of the display area AA. The gate driver circuit 130 may be provided so as not to overlap with the sub-pixel SP, or may be provided so as to partially or completely overlap with the sub-pixel SP.

[0052] In another example, the data driving circuit 120 may be provided in the display area AA. In this case, the data driving circuit 120 may be provided in the entire display area AA, or may be provided only in a portion of the display area AA. The data driving circuit 120 may be provided so as not to overlap with the sub-pixel SP, or may be provided so as to partially or completely overlap with the sub-pixel SP.

[0053] When the gate driving circuit 130 selects a specific gate line GL, the data driving circuit 120 may convert image data received from the controller 140 into a data voltage in an analog form and supply it to the plurality of data lines DL.

[0054] The data driving circuit 120 may be connected to one side (e.g., the top side or the bottom side) of the display panel 110. Depending on its driving method, panel design method, etc., the data driving circuit 120 may be connected to both sides (e.g., the top side and the bottom side) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0055] The gate driver circuit 130 may be connected to one side (e.g., the left side or the right side) of the display panel 110. Depending on its driving method, panel design method, etc., the gate driver circuit 130 may be connected to both sides (e.g., the left side and the right side) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0056] The controller 140 may be a timing controller used in conventional display technology, or a control device that can perform other control functions in addition to timing control, or a control device that is different from a timing controller, or a circuit within a control device. The controller 140 may be implemented as various circuits or electronic components, such as an integrated circuit (IC), a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), or a processor.

[0057] The controller 140 may be mounted on a printed circuit board, a flexible printed circuit, or the like, and may be electrically connected to the data driving circuit 120 and the gate driving circuit 130 through the printed circuit board, the flexible printed circuit, or the like.

[0058] The controller 140 may send signals to the data driving circuit 120 and receive signals from the data driving circuit 120 according to one or more predetermined interfaces. Here, for example, the interface may include a low voltage differential signaling (LVDS) interface, an embedded clock point-to-point interface (EPI), a serial peripheral interface (SPI), etc.

[0059] The controller 140 may include a storage medium, such as one or more registers.

[0060] The display device 100 according to an embodiment of the present disclosure may be a display device in which the display panel 110 is not capable of self-luminescence. For example, the display device 100 according to an embodiment of the present disclosure may be a liquid crystal display device including a backlight unit.

[0061] Alternatively, the display device 100 according to an embodiment of the present disclosure may be a self-luminous display device in which the display panel 110 is capable of self-luminescence. For example, the display device 100 according to an embodiment of the present disclosure may be an organic light-emitting diode (OLED) display, a quantum dot (QD) display, a micro light-emitting diode (micro LED) display, and the like.

[0062] When the display device 100 according to an embodiment of the present disclosure is an organic light-emitting diode display device, each sub-pixel SP may include a self-luminous organic light-emitting diode (OLED) as a light-emitting device. If the display device 100 according to an embodiment of the present disclosure is a quantum dot display device, each sub-pixel SP may include a light-emitting device made of quantum dots, which are self-luminous semiconductor crystals. When the display device 100 according to an embodiment of the present disclosure is a micro light-emitting diode display device, each sub-pixel SP may include a micro light-emitting diode as a light-emitting device, which is a self-luminous semiconductor crystal and is made of an inorganic material.

[0063] Figure 2 is an equivalent circuit of the sub-pixel SP in the display device 100 according to an embodiment of the present disclosure.

[0064] Reference Figure 2 , the display panel 110 may include a plurality of sub-pixels SP formed on a substrate SUB.

[0065] Each of the plurality of sub-pixels SP may include a light emitting diode LED as a light emitting device, a driving transistor DRT for driving the light emitting diode LED, a scan transistor SCT for transmitting a data voltage VDATA to a first node N1 of the driving transistor DRT, and a storage capacitor Cst for maintaining a constant voltage during a frame.

[0066] The driving transistor DRT may include a first node N1 to which a data voltage VDATA may be applied, a second node N2 electrically connected to the light emitting diode LED, and a third node N3 to which a first power signal VDD is applied from a first power line DVL. In the driving transistor DRT, the first node N1 may be a gate node, the second node N2 may be a source node or a drain node, and the third node N3 may be a drain node or a source node.

[0067] The light emitting diode LED may also be referred to as a light emitting diode chip (LED chip). For example, the light emitting diode LED may also be a micro light emitting diode or a micro light emitting diode chip.

[0068] The light-emitting diode (LED) may include a first semiconductor layer SEM1, a second semiconductor layer SEM2, and an active layer AL. The first semiconductor layer SEM1 may be formed on at least a portion of the surface of the second semiconductor layer SEM2, exposing at least another portion of the surface of the second semiconductor layer SEM2. The active layer AL may be interposed between the first and second semiconductor layers SEM1 and SEM2. The active layer AL may also be referred to as a light-emitting layer. The light-emitting diode (LED) may also include a first electrode AND and a second electrode CAT.

[0069] The first electrode AND may be formed on the first semiconductor layer SEM1 and may be electrically connected to the first semiconductor layer SEM1. The second electrode CAT may be formed on the exposed second semiconductor layer SEM2 and may be electrically connected to the second semiconductor layer SEM2. The first electrode AND and the second electrode CAT may be arranged at a predetermined interval.

[0070] The first semiconductor layer SEM1 may be implemented as a p-type semiconductor layer.

[0071] The second semiconductor layer SEM2 may be implemented as an n-type semiconductor layer.

[0072] The active layer AL may be a layer in which holes injected through the first semiconductor layer SEM1 meet electrons injected through the second semiconductor layer SEM2 and emit light due to a difference in energy band gap depending on formation materials of the active layer AL.

[0073] The light-emitting diode LED may further include an insulating film PRT for protecting its components. The insulating film PRT may cover the exposed outer surface of the light-emitting diode LED but may expose at least a portion of the first electrode AND and at least a portion of the second electrode CAT. The insulating film PRT may include an insulating material. For example, the PRT may include a silicon oxide (SiOx) film and a silicon nitride (SiNx) film, or a laminated structure thereof.

[0074] Meanwhile, a first electrode AND of a light emitting diode (LED) may be electrically connected to the pixel electrode, and a second electrode CAT of the light emitting diode LED may be electrically connected to the common electrode.

[0075] The pixel electrode may be provided on each sub-pixel SP and may be electrically connected to the second node N2 of the driving transistor DRT of each sub-pixel SP. The common electrode may be provided to be shared by the plurality of sub-pixels SP.

[0076] The display panel 110 may further include a second power line BVL for supplying a second power signal VSS to the common electrode, the second power line BVL being electrically connected to the common electrode.

[0077] In another example, the light emitting diode (LED) may be an organic light emitting diode (OLED) including an organic light emitting layer between the first electrode AND and the second electrode CAT.

[0078] The scan transistor SCT is connected between the first node N1 of the driving transistor DRT and the corresponding data line DL, and can control a voltage state of the first node N1 of the driving transistor DRT.

[0079] The scan transistor SCT may control connection between the first node N1 , which is a gate node of the drive transistor DRT, and a corresponding data line DL of the plurality of scan lines SCL according to a scan signal SCAN supplied from a corresponding scan line SCL, which is a type of gate line GL.

[0080] The drain node or source node of the scan transistor SCT can be electrically connected to the corresponding data line DL. The source node or drain node of the scan transistor SCT can be electrically connected to the first node N1 of the drive transistor DRT. The gate node of the scan transistor SCT can be electrically connected to the scan line SCL to receive the scan signal SCAN.

[0081] The scan transistor SCT may be turned on by the scan signal SCAN at a turn-on level voltage and may transfer the data voltage VDATA supplied from the corresponding data line DL to the first node N1 of the driving transistor DRT.

[0082] The scanning transistor SCT is turned on by a scanning signal SCAN having an on-level voltage and is turned off by a scanning signal SCAN having an off-level voltage. Here, if the scanning transistor SCT is an n-type, the on-level voltage may be a high-level voltage and the off-level voltage may be a low-level voltage. If the scanning transistor SCT is a p-type, the on-level voltage may be a low-level voltage and the off-level voltage may be a high-level voltage.

[0083] The storage capacitor Cst may be electrically connected between the first node N1 and the second node N2 of the driving transistor DRT. The storage capacitor Cst may be an external capacitor intentionally designed outside the driving transistor DRT, rather than a parasitic capacitance (e.g., Cgs, Cgd) as an internal capacitance that may exist between the first node N1 and the second node N2 of the driving transistor DRT.

[0084] The driving transistor DRT and the scanning transistor SCT may both be n-type transistors or p-type transistors.

[0085] like Figure 2 As shown, each sub-pixel SP may have a 2T (transistor) 1C (capacitor) structure including two transistors DRT, SCT and one capacitor Cst, and may additionally include more than one transistor or more than one capacitor in some cases.

[0086] The display device 100 may have a top emission structure that emits light in a direction opposite to the substrate SUB of the display panel 110 .

[0087] Figure 3 is a diagram schematically illustrating a spliced ​​display device according to an embodiment of the present disclosure.

[0088] Reference Figure 3 According to an embodiment of the present disclosure, a spliced ​​display device may include a plurality of display modules DM1, DM2, DM3, and DM4.

[0089] Each of the plurality of display modules DM1, DM2, DM3, DM4 can display a separate video, or can display a single video in a partitioned manner. Each of the plurality of display modules DM1, DM2, DM3, DM4 includes Figure 1 The display device 100 according to the embodiment of the present disclosure is shown and will not be described again herein.

[0090] Each of the multiple display modules DM1, DM2, DM3, and DM4 can be spliced ​​together in a separate splicing frame so that their sides touch each other. For example, each of the multiple display modules DM1, DM2, DM3, and DM4 can be spliced ​​together into an N×M configuration to implement a large-screen multi-display device. For example, N can be a positive integer greater than or equal to 1, and M can be a positive integer greater than or equal to 2. Alternatively, for example, N can be a positive integer greater than or equal to 2, and M can be a positive integer greater than or equal to 1.

[0091] Each of the plurality of display modules DM1, DM2, DM3, and DM4 may have an air frame structure, wherein the display area AA is surrounded by air, and does not include a frame area (or non-display area) surrounding the entire display area AA where the video is displayed. That is, each of the plurality of display modules DM1, DM2, DM3, and DM4 may be implemented such that the entire first side of the first substrate 200 is the display area AA.

[0092] The spliced ​​display device can be configured by combining a plurality of display modules DM1, DM2, DM3, and DM4. In this case, the sides of each display module may be affected by external foreign matter or moisture. Moisture can be introduced in liquid or gaseous form. In addition, moisture can be introduced in the form of water droplets or water vapor, or in a form smaller than water vapor. Moisture can enter the empty space on the side of the display module, or directly enter the side coating or side sealing layer. In order to prevent such moisture from entering, the empty space on the side of the display module can be filled or the side coating or side sealing layer can be subjected to moisture-proof treatment. However, even in this case, there is a problem that moisture (including in a shape smaller than water vapor) may be introduced.

[0093] Figure 4 It is along Figure 3 Specifically, Figure 4 A cross-sectional view of a portion where the first display module DM1 and the third display module DM3 are in contact may be shown.

[0094] Reference Figure 4 The first display module DM1 may include a first substrate 200, a first layer 210, a first pad portion 220, a light emitting device 230, a second layer 240, a functional film layer 250, a second substrate 300, a third layer 310, a second pad portion 320, an adhesive layer 410, a side connection line 420, a side coating layer 430, a side sealing layer 440, and a side protection layer 500. In this case, the remaining multiple display modules including the second display module DM2 may have substantially the same structure as the first display module DM1, and may be configured differently as needed.

[0095] The first substrate 200 is a base substrate for supporting various components of the first display module DM1 and may be an insulating substrate. The first substrate 200 may be made of glass or plastic. The first substrate 200 may also be formed of a flexible material so as to be bendable.

[0096] The first substrate 200 may define a display area AA and a non-display area NA surrounding the display area AA. The display area AA is the area of ​​the display panel 200 where video is actually displayed, and the light-emitting device 230 may be disposed in the display area AA. The non-display area NA is an area where video is not displayed and may be defined as an area surrounding the display area AA.

[0097] A first layer 210 may be provided on the first substrate 200. A plurality of insulating layers and a plurality of signal lines may be provided on the first layer 210. The first layer 210 may be provided with the aforementioned various transistors and capacitors.

[0098] In the non-display area NA of the first substrate 200, a first pad portion 220 may be provided to connect to various signal lines. The first pad portion 220 may be provided at one edge of the non-display area NA. The first pad portion 220 may be electrically connected to a side connection line 420, which will be described later. The first pad portion 220 may be a metal layer extending from a plurality of signal lines.

[0099] The first layer 210 may be provided with a light emitting device 230 and a second layer 240 surrounding the light emitting device 230. As described above, the light emitting device 230 may be a light emitting diode (LED) or a micro light emitting diode (μLED).

[0100] The second layer 240 may include a plurality of planarization layers and insulating layers.

[0101] A functional film layer 250 may be provided on the second layer 240. The functional film layer 250 may include an anti-reflection layer (or anti-reflection film) for preventing external light reflection to improve the outdoor visibility and contrast of the image displayed on the display device. The functional film layer 250 may include a barrier layer (or barrier film) mainly for preventing the penetration of moisture or oxygen. The functional film layer 250 may also include a light path control layer (or light path control film) to control the path of light emitted outward from each pixel P.

[0102] A second substrate 300 may be disposed below the first substrate 200. The second substrate 300 may be an insulating substrate that supports components disposed below the display device. For example, it may be made of glass or plastic. The second substrate 300 may also be formed of a flexible material to allow for bending. The second substrate 300 may be formed of the same material as the first substrate 200.

[0103] A third layer 310 may be provided on the back surface of the second substrate 300. The third layer 310 may be provided with a plurality of insulating layers and a plurality of connection lines.

[0104] One edge of the second substrate 300 may be provided with a second pad portion 320. The second pad portion 320 may be a region electrically connected to the side connection line 420, which will be described later. The second pad portion 320 may be a metal layer extending from a plurality of connection lines.

[0105] An adhesive layer 410 may be provided between the first substrate 200 and the second substrate 300. The adhesive layer 410 may bond the first substrate 200 and the second substrate 300. The adhesive layer 410 may be made of a material that can be cured by various curing methods to bond the first substrate 200 and the second substrate 300. The adhesive layer 410 may be provided on a partial area between the first substrate 200 and the second substrate 300, or may be provided on the entire area.

[0106] Reference Figure 4 , a side connection line 420 may be provided on the side of the first substrate 200 and the second substrate 300. The side connection line 420 may include a plurality of connection lines. The side connection line 420 may electrically connect the plurality of signal lines provided on the top surface of the first substrate 200 with the plurality of connection lines provided on the back surface of the second substrate 300. The side connection line 420 may be provided to cover the ends of the plurality of signal lines provided on the top surface of the first substrate 200, the sides of the first substrate 200 and the second substrate 300, and the ends of the plurality of connection lines provided on the back surface of the second substrate 300. In other words, the side connection line 420 may be provided to continuously cover the first pad portion 220 connected to the plurality of signal lines, the sides of the first substrate 200 and the second substrate 300, and the second pad portion 320 connected to the plurality of connection lines.

[0107] The side connection lines 420 can be made of a patterned metal layer so that each signal line is connected to each corresponding connection line. In this case, the patterned metal layer can be formed by printing using a conductive paste. For example, the side connection lines 420 can be formed by pad printing using silver (Ag) paste, but the embodiments of the present disclosure are not limited thereto.

[0108] Reference Figure 4, the side coating layer 430 can be configured to cover the side connection line 420. The side coating layer 430 can be configured to cover not only the side connection line 420, but also a portion of one edge of one side of the first substrate 200 and a portion of one edge of one side of the second substrate 300. The side coating layer 430 can prevent corrosion of each connection line made of a conductive material or electrical short circuits between the connection lines of the side connection line 420. In addition, the side coating layer 430 can prevent or minimize the reflection of external light by the side connection line 420 and the pad of the first pad portion 220. The side coating layer 430 may include black ink, which includes at least one of carbon black, black dye, and black pigment. The side coating layer 430 may be formed by a printing method using black ink. For example, the side coating layer 430 can be formed by a pad printing method using black ink including carbon black, but the embodiments of the present disclosure are not limited thereto.

[0109] Reference Figure 4 , the side protective layer 500 can be configured to cover the side coating layer 430. The side protective layer 500 can be configured to cover not only the side coating layer 430, but also a portion of one edge of one side of the first substrate 200 and a portion of one edge of one side of the second substrate 300. The side protective layer 500 may include multiple layers. The side protective layer 500 may include a moisture-proof material. The side protective layer 500 may include a conductive material. The side protective layer 500 may include a light-absorbing material. The side protective layer 500 may prevent static electricity from entering the side of the display module. The side protective layer 500 may absorb light incident on the gap between adjacent display modules, making the seam invisible to the user. The side protective layer 500 may prevent moisture from entering the side of the display module.

[0110] The moisture-proof material may include an aromatic hydrocarbon compound, a deposited powder of the aromatic hydrocarbon compound, or an aromatic hydrocarbon compound formed by a polyparaxylene coating method.

[0111] The aromatic hydrocarbon compound may be at least one selected from the following compounds.

[0112]

[0113] The conductive material may include conductive particles and conductive polymers.

[0114] The conductive particles may be carbon nanotubes, which may be at least one selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0115] The conductive polymer may be at least one selected from the group consisting of polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), polyparaphenylene vinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyzepine, polythiopheneethylene, polyaniline (PANI), polythiophene, polyphenylene sulfide (PPS), poly(3,4-ethylenedioxythiophene) (PEDOT), poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonate (PEDOT:PSS), poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA) and polyfuran.

[0116] The conductive material may include conductive particles and black rubber.

[0117] The conductive particles may be the same as the carbon nanotubes described above.

[0118] The black rubber may include at least one of carbon black, a black dye, and a black pigment, and isoprene-based rubber.

[0119] The light absorbing material may be black ink, which may include at least one of carbon black, black dye, and black pigment.

[0120] Reference Figure 4 , the side sealing layer 440 can be provided to cover the side protective layer 500. The side sealing layer 440 can be provided not only to cover the side protective layer 500, but also to cover a portion of one edge of one side of the first substrate 200 and a portion of one edge of one side of the second substrate 300. The side sealing layer 440 can prevent corrosion of the conductive material connecting wires or electrical short circuits between the connecting wires of the side connecting wires 420. In addition, the side sealing layer 440 can prevent or minimize reflection of external light by the side connecting wires 420 and the pads of the first pad portion 220. The side sealing layer 440 can include at least one of carbon black, black dye, and black pigment. The side sealing layer 440 can fill the space formed between the functional film layer 250 and the side of the display module. Therefore, the side sealing layer 440 can prevent foreign matter or moisture from entering the space between the substrates 200, 300 and the functional film layer 250 from the outside.

[0121] Reference Figure 4 The side ends of the functional film layer 250 and the side sealing layer 440 can be arranged on the same line. By arranging the side ends of the functional film layer 250 and the side sealing layer 440 on the same line, the gaps formed between the display modules can be minimized, and the seams caused by the gaps can be minimized.

[0122] Figure 5FIG. 2 is a diagram schematically illustrating the flow of electrostatic discharge (ESD) in a display device according to an embodiment of the present disclosure.

[0123] Except that the side protection layer 500 is not provided between the side coating layer 430 and the side sealing layer 440, Figure 5 Can be used with Figure 4 One aspect of the display devices shown is essentially the same.

[0124] Reference Figure 5 When static electricity is generated from the outside, it may be introduced into the thinner portions of the side coating layer 430 and the side sealing layer 440, which are insulating layers, and transferred to the side connection line 420. The introduced static electricity may flow along the side connection line 420 formed to include silver (Ag) to various lines arranged on the display panel. In this case, if the static electricity exceeds the capacity of the anti-static circuit provided in the display panel, the lines may be damaged.

[0125] Figure 6 is an exemplary cross-sectional view of a partial structure of a display device according to an embodiment of the present disclosure.

[0126] Now refer to Figure 6 It should be understood that, in addition to the side protection layer 500 including the first side protection layer 510 and the second side protection layer 520, the side protection layer 500 can also be Figure 4 The side protection layers shown in FIG. 1 are substantially the same, and thus repeated descriptions may be omitted or shortened.

[0127] Reference Figure 6 , the side protection layer 500 may include a first side protection layer 510 and a second side protection layer 520 .

[0128] The first side protection layer 510 may include a moisture-proof material. The moisture-proof material may be Figure 4 The side protection layer 500 described in the foregoing description includes the same moisture-proof material.

[0129] The second side protection layer 520 may include a conductive material. The conductive material may include conductive particles and conductive polymers. The conductive particles and conductive polymers may be Figure 4 The conductive particles and the conductive polymer included in the side protection layer 500 described in .

[0130] Reference Figure 6 , the first side protection layer 510 may be disposed adjacent to the side coating layer 430 , the second side protection layer 520 may be disposed adjacent to the first side protection layer 510 , and the side sealing layer 440 may be disposed adjacent to the second side protection layer 520 .

[0131] The first side protection layer 510 may be a parylene coating. A parylene coating is a coating formed on a substrate at room temperature using at least one parylene dimer selected from parylene compounds. In this case, the parylene dimers may be used alone or in combination.

[0132] The first side protective layer 510 may include a moisture-proof material. The first side protective layer 510 may include a deposited powder of an aromatic hydrocarbon compound. The first side protective layer 510 may include an aromatic hydrocarbon compound formed by a parylene coating method. The first side protective layer 510 may be formed with a parylene coating comprising a moisture-proof material to prevent moisture from penetrating from the outside to the inside of the display module. The first side protective layer 510 may have both moisture-proof and moisture-proof properties.

[0133] The second side protection layer 520 may be formed by pad printing, for example, using a pad unit including a silicone pad and a head, and a mixture of multi-walled carbon nanotubes as conductive particles and PEDOT:PSS as a conductive polymer.

[0134] The second side protecting layer 520 may be formed to include conductive particles and a conductive polymer to prevent static electricity from entering from the outside.

[0135] Figures 7 to 10 2 is another exemplary cross-sectional view of a partial structure of a display device according to an embodiment of the present disclosure.

[0136] Now refer to Figure 7 , the side protection layer 500 includes a third side protection layer 530, and except for the placement order of the layers including the side protection layer 500, it can be the same as Figure 6 The side protection layers shown in FIG. 1 are substantially the same, so that repeated descriptions may be omitted or shortened.

[0137] Reference Figure 7 The side protection layer 500 may include a first side protection layer 510 , a second side protection layer 520 and a third side protection layer 530 .

[0138] The third side protection layer 530 may include a light absorbing material. The light absorbing material may be Figure 4 The light absorbing material included in the side protection layer 500 described in is the same.

[0139] Reference Figure 7 The first side protection layer 510 may be disposed adjacent to the third side protection layer 530 , the third side protection layer 530 may be disposed adjacent to the second side protection layer 520 , and the side sealing layer 440 may be disposed adjacent to the first side protection layer 510 .

[0140] The second side protection layer 520 may be disposed adjacent to the side coating layer 430 , the third side protection layer 530 may be disposed adjacent to the second side protection layer 520 , the first side protection layer 510 may be disposed adjacent to the third side protection layer 530 , and the side sealing layer 440 may be disposed adjacent to the first side protection layer 510 .

[0141] The third side protection layer 530 may be formed by pad printing. For example, the third side protection layer 530 may be formed by printing black ink including carbon particles as a light absorbing material using a pad unit including a silicone pad and a head.

[0142] The third side protection layer 530 may be formed to include a light absorbing material to absorb light incident into a gap between adjacent display modules so that the seam is invisible to the user.

[0143] Now refer to Figure 7 , the side protection layer 500 includes a third side protection layer 530, and except for the placement order of the layers including the side protection layer 500, it can be the same as Figure 6 The side protection layers shown in FIG. 1 are substantially the same, so that repeated descriptions may be omitted or shortened.

[0144] Reference Figure 7 The side protection layer 500 may include a first side protection layer 510 , a second side protection layer 520 and a third side protection layer 530 .

[0145] The third side protection layer 530 may include a light absorbing material. Figure 4 The light absorbing material included in the side protection layer 500 described in is the same.

[0146] Reference Figure 7 The first side protection layer 510 may be disposed adjacent to the third side protection layer 530 , the third side protection layer 530 may be disposed adjacent to the second side protection layer 520 , and the side sealing layer 440 may be disposed adjacent to the first side protection layer 510 .

[0147] The second side protection layer 520 may be disposed adjacent to the side coating layer 430 , the third side protection layer 530 may be disposed adjacent to the second side protection layer 520 , the first side protection layer 510 may be disposed adjacent to the third side protection layer 530 , and the side sealing layer 440 may be disposed adjacent to the first side protection layer 510 .

[0148] The third side protection layer 530 may be formed by pad printing. For example, the third side protection layer 530 may be formed by applying black ink including carbon particles as a light absorbing material using a pad unit including a silicone pad and a head.

[0149] The third side protection layer 530 may be formed to include a light absorbing material to absorb light incident into a gap between adjacent display modules so that the seam is invisible to the user.

[0150] Reference Figure 8 and Figure 9 , the side protection layer 500 may include a first side protection layer 510 and a fourth side protection layer 540 .

[0151] The first side protection layer 510 and Figure 6 The first side protection layer 510 is the same as that described in , and thus will not be described in detail.

[0152] The fourth side protection layer 540 may include a conductive material. The conductive material may include conductive particles and black rubber. The conductive particles and black rubber may be Figure 4 The conductive particles included in the side protection layer 500 described in are the same as the black rubber.

[0153] Reference Figure 8 The first side protection layer 510 may be disposed adjacent to the side coating layer 430 , the fourth side protection layer 540 may be disposed adjacent to the first side protection layer 510 , and the side sealing layer 440 may be disposed adjacent to the fourth side protection layer 540 .

[0154] The fourth side protection layer 540 may prevent static electricity from entering from the outside by being formed to include conductive particles and black rubber.

[0155] Reference Figure 9 The fourth side protection layer 540 may be disposed adjacent to the side coating layer 430 , the first side protection layer 510 may be disposed adjacent to the fourth side protection layer 540 , and the side sealing layer 440 may be disposed adjacent to the first side protection layer 510 .

[0156] The fourth side protection layer 540 may prevent static electricity from entering from the outside by being formed to include conductive particles and black rubber.

[0157] Reference Figure 10 , in addition to including an adhesive pad 610 and a cover bottom 620, it can be Figure 4 The same as shown in , the repeated description may be omitted or shortened.

[0158] Reference Figure 10 , an adhesive pad 610 and a cover bottom 620 may be disposed on the third layer 310 .

[0159] The cover bottom 620 may be provided to surround the display panel to prevent impact or foreign matter from intruding from the outside. The cover bottom 620 may be formed of a polymer material (eg, polypropylene or polyethylene) and may be a stretchable material.

[0160] Reference Figure 10 , the side protection layer 500 provided on the side may not extend to the adhesive pad 610 or the cover bottom 620. According to an embodiment of the present disclosure, the side protection layer 500 may include a conductive material, such as conductive particles and a conductive polymer, or conductive particles and black rubber, to prevent the introduction of external static electricity. Therefore, a plastic cover bottom 620 composed of a polymer material can be used instead of a cover bottom typically made of a metal material.

[0161] Figures 11 to 17 Schematic diagram illustrating a manufacturing process of a display device according to an embodiment of the present disclosure.

[0162] Reference Figure 11 , a side connection line 420 can be formed on the side of the display panel. The side connection line 420 can be formed using a pad unit 700 including a silicone pad 710 and a head 720, and a conductive adhesive 420a. Specifically, the conductive adhesive 420a can be attached to the silicone pad 710. Then, the pad unit 700 can be moved to one side of the display panel to move the silicone pad 710 to the side of the display panel where the side connection line 420 is to be formed. Then, the conductive adhesive 420a attached to the silicone pad 710 can be transferred to the side of the display panel to form the side connection line 420.

[0163] Reference Figure 12 , a side coating layer 430 can be formed on the side of the display panel. The side coating layer 430 can be formed using a pad unit 700 including a silicone pad 710 and a head 720, and a black ink composition 430a. Specifically, the black ink composition 430a can be attached to the silicone pad 710. Thereafter, the pad unit 700 can be moved to the side of the display panel to move the silicone pad 710 to the side of the display panel where the side coating layer 430 is to be formed. Thereafter, the black ink composition 430a attached to the silicone pad 710 can be transferred to the side of the display panel to form the side coating layer 430.

[0164] Reference Figure 13 A first side protective layer 510 may be formed on one side of the display panel. A parylene coating method may be used to form the first side protective layer 510. Parylene dimer 510a, which may be an aromatic hydrocarbon compound, may be heated and evaporated in a depositor 800. The parylene dimer may then be pyrolyzed at high temperature to form a parylene monomer. The pyrolyzed parylene monomer may then be deposited at room temperature to form the first side protective layer 510.

[0165] When forming the first side protection layer 510 using a deposited powder of an aromatic hydrocarbon compound, it can be applied uniformly and densely according to the shape of the material to be coated. Furthermore, when the deposited powder of an aromatic hydrocarbon compound is applied to the material to be coated using a parylene coating method, the coating thickness can be easily controlled without subjecting the material to be coated to thermal stress.

[0166] Reference Figure 14 , a second side protection layer 520 can be formed on the side of the display panel. The second side protection layer 520 can be formed using a pad unit 700 including a silicone pad 710 and a head 720, and a conductive material 520a. Specifically, the conductive material 520a can be attached to the silicone pad 710, and then the pad unit 700 can be moved to the side of the display panel to move the silicone pad 710 to the side of the display panel where the second side protection layer 520 is to be formed. Thereafter, the conductive material 520a attached to the silicone pad 710 can be transferred to the side of the display panel to form the second side protection layer 520.

[0167] Reference Figure 15 , a side sealing layer 440 may be formed on the side of the display panel. The side sealing layer 440 may be formed using a pad unit 700 including a silicone pad 710 and a head 720, and a light absorbing material 440a. Specifically, the light absorbing material 440a may be attached to the silicone pad 710, and then the pad unit 700 may be moved to the side of the display panel to move the silicone pad 710 to the side of the display panel where the side sealing layer 440 may be formed. Thereafter, referring to Figure 16 , the light absorbing material 440 a attached to the silicone pad 710 may be transferred to the side of the display panel to form a side sealing layer 440 .

[0168] Reference Figure 17 , a functional film layer 250 may be formed on the display panel. The functional film layer 250 may be attached to the display panel, and then the side of the functional film layer 250 may be cut so that the side of the functional film layer 250 and the side sealing layer 440 may be arranged on the same line.

[0169] The following is a brief description of the above disclosed embodiments.

[0170] According to an embodiment of the present disclosure, a display device may include: a first substrate, including a display area and a non-display area surrounding the display area; a light-emitting device, arranged in the display area on the first substrate; a first pad portion, arranged in the non-display area on the top surface of the first substrate, and arranged at one edge of the first substrate; a second substrate, arranged below the bottom surface of the first substrate; a second pad portion, arranged in the non-display area on the bottom surface of the second substrate, and arranged at one edge of the second substrate; a side connecting line, electrically connecting the first pad portion with the second pad portion; a side coating, arranged to cover the side connecting line; a side protective layer, arranged to cover at least a portion of the side coating; and a side sealing layer, arranged to cover at least a portion of the side protective layer.

[0171] In the display device according to the embodiment of the present disclosure, the light emitting device may be a micro LED (Light Emitting Diode).

[0172] In the display device according to the embodiment of the present disclosure, the side protection layer may include: a first side protection layer including a moisture-proof material; and a second side protection layer including conductive particles and a conductive polymer.

[0173] In the display device according to the embodiment of the present disclosure, the moisture-proof material may include an aromatic hydrocarbon compound.

[0174] In the display device according to the embodiment of the present disclosure, the aromatic hydrocarbon compound may be at least one selected from the following compounds:

[0175]

[0176] In the display device according to the embodiment of the present disclosure, the conductive particles may be at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0177] In the display device according to an embodiment of the present disclosure, the conductive polymer may be at least one selected from the group consisting of polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), polyparaphenylene vinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyzepine, polythiopheneethylene, polyaniline (PANI), polythiophene, polyphenylene sulfide (PPS), poly(3,4-ethylenedioxythiophene) (PEDOT), poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonate (PEDOT:PSS), poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA) and polyfuran.

[0178] In the display device according to the embodiment of the present disclosure, the first side protective layer may be disposed adjacent to the side coating layer, and the second side protective layer may be disposed adjacent to the first side protective layer.

[0179] In the display device according to the embodiment of the present disclosure, the side protection layer may further include a third side protection layer including a light absorbing material.

[0180] In the display device according to the embodiment of the present disclosure, the light absorbing material may include black ink including at least one of carbon black, black dye, and black pigment.

[0181] In the display device according to the embodiment of the present disclosure, the second side protective layer may be disposed adjacent to the side coating layer, the third side protective layer may be disposed adjacent to the second side protective layer, and the first side protective layer may be disposed adjacent to the third side protective layer.

[0182] In the display device according to the embodiment of the present disclosure, the side protection layer may include: a first side protection layer including a moisture-proof material; and a fourth side protection layer including conductive particles and black rubber.

[0183] In the display device according to the embodiment of the present disclosure, the moisture-proof material may include an aromatic hydrocarbon compound.

[0184] In the display device according to the embodiment of the present disclosure, the aromatic hydrocarbon compound may be at least one selected from the following compounds:

[0185]

[0186] In the display device according to the embodiment of the present disclosure, the conductive particles may be at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0187] In the display device according to the embodiment of the present disclosure, the black rubber may include at least one of carbon black, a black dye, and a black pigment, and isoprene-based rubber.

[0188] In the display device according to the embodiment of the present disclosure, the first side protective layer may be disposed adjacent to the side coating layer, and the fourth side protective layer may be disposed adjacent to the first side protective layer.

[0189] In the display device according to the embodiment of the present disclosure, the fourth side protective layer may be disposed adjacent to the side coating layer, and the first side protective layer may be disposed adjacent to the fourth side protective layer.

[0190] In the display device according to the embodiment of the present disclosure, the side connection line may include a conductive paste.

[0191] In the display device according to the embodiment of the present disclosure, the side coating layer may include black ink including at least one of carbon black, black dye, and black pigment.

[0192] In the display device according to the embodiment of the present disclosure, the side sealing layer may include at least one of carbon black, black dye, and black pigment.

[0193] The display device according to the embodiment of the present disclosure may further include a functional film layer, wherein a side end of the functional film layer and a side end of the side sealing layer are located on the same straight line.

[0194] The display device according to an embodiment of the present disclosure may further include an adhesive layer disposed between the first substrate and the second substrate.

[0195] In the display device according to the embodiment of the present disclosure, the side protection layer may include one or more of a moisture-proof material, a conductive material, and a light-absorbing material.

[0196] In the display device according to the embodiment of the present disclosure, the display device may further include: a third layer disposed on the bottom surface of the second substrate; a cover bottom disposed on the bottom surface of the third layer; and an adhesive pad disposed between the third layer and the cover bottom.

[0197] According to an embodiment of the present disclosure, a spliced ​​display device includes a plurality of display modules, each of the plurality of display modules including: a first substrate including a display area and a non-display area surrounding the display area; a light-emitting device arranged in the display area on the first substrate; a first pad portion arranged in the non-display area on the top surface of the first substrate and arranged at one edge of the first substrate; a second substrate arranged below the bottom surface of the first substrate; a second pad portion arranged in the non-display area on the bottom surface of the second substrate and arranged at one edge of the second substrate; a side connecting line electrically connecting the first pad portion with the second pad portion; a side coating layer arranged to cover the side connecting line; a side protective layer arranged to cover at least a portion of the side coating layer; and a side sealing layer arranged to cover at least a portion of the side protective layer.

[0198] The above description is provided to enable those skilled in the art to carry out and use the technical concepts of the present disclosure, and is provided in the context of specific applications and their requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure. The above description and accompanying drawings provide examples of the technical concepts of the present disclosure for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concepts of the present disclosure.

Claims

1. A display device comprising: A first substrate comprising a display area and a non-display area surrounding the display area; a light emitting device, disposed on the first substrate in the display area; a first pad portion, disposed in the non-display area on the top surface of the first substrate and disposed at one edge of the first substrate; a second substrate, disposed below the bottom surface of the first substrate; a second pad portion, disposed in the non-display area on the bottom surface of the second substrate and disposed at one edge of the second substrate; a side connection line, electrically connecting the first pad portion and the second pad portion; a side coating layer, configured to cover the side connecting line; a side protection layer configured to cover at least a portion of the side coating; as well as The side sealing layer is configured to cover at least a portion of the side protection layer.

2. The display device according to claim 1, wherein The light emitting device is a micro-LED, ie a micro light emitting diode.

3. The display device according to claim 1, wherein The side protection layer comprises: a first side protection layer comprising a moisture-proof material; and The second side protection layer includes conductive particles and conductive polymer.

4. The display device according to claim 3, wherein The moisture-proof material includes aromatic hydrocarbon compounds.

5. The display device according to claim 4, wherein The aromatic hydrocarbon compound is at least one selected from the following compounds: The display device according to claim 3 , wherein: The conductive particles are at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes and multi-walled carbon nanotubes.

7. The display device according to claim 3, wherein: The conductive polymer is at least one selected from the group consisting of polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), polyparaphenylene vinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyisocyanate, polythiopheneethylene, polyaniline (PANI), polythiophene, polyphenylene sulfide (PPS), poly(3,4-ethylenedioxythiophene) (PEDOT), poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonate (PEDOT:PSS), poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA) and polyfuran.

8. The display device according to claim 3, wherein: The first side protection layer is disposed adjacent to the side coating layer, and the second side protection layer is disposed adjacent to the first side protection layer.

9. The display device according to claim 3, wherein: The side protection layer includes a third side protection layer, and the third side protection layer includes a light absorbing material.

10. The display device according to claim 9, wherein The light absorbing material includes black ink, and the black ink includes at least one of carbon black, black dye, and black pigment.

11. The display device according to claim 9, wherein The second side protection layer is arranged adjacent to the side coating layer, Wherein, the third side protection layer is arranged adjacent to the second side protection layer, and Wherein, the first side protection layer is arranged to be adjacent to the third side protection layer.

12. The display device according to claim 1, wherein The side protection layer comprises: a first side protection layer comprising a moisture-proof material; and The fourth side protection layer includes conductive particles and black rubber.

13. The display device according to claim 12, wherein: The moisture-proof material includes aromatic hydrocarbon compounds.

14. The display device according to claim 13, wherein: The aromatic hydrocarbon compound is at least one selected from the following compounds:

15. The display device according to claim 12, wherein: The conductive particles are at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes and multi-walled carbon nanotubes.

16. The display device according to claim 12, wherein: The black rubber includes at least one of carbon black, black dye and black pigment, and isoprene-based rubber.

17. The display device according to claim 12, wherein: The first side protection layer is disposed adjacent to the side coating layer, and Wherein, the fourth side protection layer is arranged to be adjacent to the first side protection layer.

18. The display device according to claim 12, wherein: The fourth side protection layer is disposed adjacent to the side coating layer, and Wherein, the first side protection layer is arranged to be adjacent to the fourth side protection layer.

19. The display device according to claim 1, wherein The side connection lines include conductive glue.

20. The display device according to claim 1, wherein The side coating layer includes a black ink including at least one of carbon black, a black dye, and a black pigment.

21. The display device according to claim 1, wherein The side sealing layer includes at least one of carbon black, black dye, and black pigment.

22. The display device according to claim 1, further comprising: Functional film layer; and Wherein, the side end of the functional film layer and the side end of the side sealing layer are arranged on the same straight line. 23 . The display device according to claim 1 , further comprising an adhesive layer disposed between the first substrate and the second substrate.

24. The display device according to claim 1, wherein The side protection layer includes one or more of a moisture-proof material, a conductive material, and a light-absorbing material.

25. The display device according to claim 1, further comprising: a third layer, disposed on the bottom surface of the second substrate; a cover bottom, arranged on the bottom surface of the third layer; as well as An adhesive pad is arranged between the third layer and the cover bottom.

26. A spliced ​​display device, comprising a plurality of display modules, in, Each of the plurality of display modules comprises: A first substrate comprising a display area and a non-display area surrounding the display area; a light emitting device, disposed on the first substrate in the display area; a first pad portion, disposed in the non-display area on the top surface of the first substrate and disposed at one edge of the first substrate; a second substrate, disposed below the bottom surface of the first substrate; a second pad portion, disposed in the non-display area on the bottom surface of the second substrate and disposed at one edge of the second substrate; a side connection line, electrically connecting the first pad portion and the second pad portion; a side coating layer, configured to cover the side connecting line; a side protection layer configured to cover at least a portion of the side coating layer; and The side sealing layer is configured to cover at least a portion of the side protection layer.

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