Mini LED circuit board mold high-precision material taking method and system

Abstract

The application discloses a mini LED circuit board mold high-precision material taking method and system, aiming to solve the problems of inaccurate positioning of the circuit board, inaccurate adjustment of suction force and clamping force, and poor material taking stability. Through the integration of a visual recognition and positioning module, an intelligent control and adjustment module, a sensor feedback module, and an automatic path planning module, high-precision automatic recognition, positioning, and grabbing of the circuit board are realized. The visual recognition module scans the position, shape, and size of the circuit board in real time, dynamically adjusts the positioning error, and the intelligent control module automatically adjusts the suction force and clamping force according to the sensor feedback data to avoid damage to the circuit board or improper grabbing. The system also has a self-adaptive learning function, which analyzes production data in real time through machine learning and optimization modules, optimizes operation strategies, and continuously improves material taking precision and efficiency. Through intelligent feedback control and optimization algorithms, the automation level, precision, and production efficiency of the production line are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of miniLED circuit board manufacturing technology, and in particular to a high-precision material handling method and system for miniLED circuit board die punching. Background Technology

[0002] In the production of miniLED circuit boards, positioning errors often occur, leading to insufficient picking accuracy. Especially in mass production, circuit boards may be irregularly shaped, have uneven surfaces, or exhibit displacement errors, resulting in inaccurate picking and impacting production efficiency and product quality. Traditional picking systems often lack precise adjustment of suction and clamping force when dealing with circuit boards of different sizes, shapes, and materials. Excessive suction can damage the circuit board; insufficient suction fails to effectively grip it. Too much or too little clamping force also affects the stability and accuracy of the circuit board. Due to the highly diverse sizes, shapes, and material characteristics of miniLED circuit boards, traditional picking devices struggle to efficiently and accurately adapt to these diverse needs. Especially when the circuit board is irregularly shaped or has a rough surface, the picking system often cannot provide sufficient adaptability. Factors such as temperature, humidity, and material variations in the production environment often cause deformation, warping, or displacement of the circuit board during handling, affecting picking accuracy. Manual adjustments are insufficient to adapt to these changes in real time. Summary of the Invention

[0003] A method for high-precision material handling in miniLED circuit board die punching includes the following steps;

[0004] S1. Equipment and Material Preparation: Select molds suitable for the size and shape of miniLED circuit boards, ensure the cutting accuracy and sharpness of the molds, inspect the molds regularly to ensure no wear or deformation, confirm the materials of miniLED circuit boards: the type and specifications of PCB boards and flexible circuit boards, ensure that the materials meet the production requirements, inspect and debug the stamping equipment, ensure that the equipment operates normally, and set appropriate stamping pressure, speed and other parameters.

[0005] S2. High-precision positioning: A high-precision vision recognition system is used to monitor the size and position of the circuit board in real time. It can quickly identify the accurate position of the circuit board and use sensors to detect the positioning error of the circuit board in real time to ensure that the position of the circuit board in the mold is always accurate. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system can make dynamic adjustments during the production process and continuously optimize the positioning accuracy. When a deviation occurs, the system will automatically correct it.

[0006] S3. Stamping Process: For different materials, circuit board thicknesses and specifications, the stamping parameters are adjusted: pressure, speed, and stroke depth to reduce damage and inaccuracies caused by excessive impact. By finely adjusting the stamping pressure and speed, and using machine learning algorithms, the optimal stamping parameters are intelligently selected based on real-time data of each circuit board (such as material, thickness, temperature, and humidity). The adaptive stamping process improves the flexibility and accuracy of the stamping process. When the punching of the circuit board is more complex, a step-by-step stamping method is adopted to complete the stamping operation step by step, thereby ensuring the accuracy of each step.

[0007] S4. Automated Material Handling System: The automated material handling system accurately extracts circuit boards from the mold through suction arms, robotic arms, and other automated equipment. The system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, ensuring the efficiency and accuracy of the material handling process.

[0008] S5. High-precision monitoring and feedback: During the stamping and material handling process, the system monitors the precision of each circuit board in real time through sensors and vision inspection equipment. The monitoring system can detect any potential deviations and immediately feed them back to the control system to ensure the accuracy of the operation. If the system detects positional errors or poor stamping of the circuit board, it will automatically make adjustments to ensure that subsequent operations are not affected.

[0009] S6. Fine post-processing: After stamping, the edges of the circuit board are deburred to ensure that there is no damage or burrs that will affect subsequent assembly. The circuit board after material removal is cleaned to remove any residual impurities or oil stains on the surface, ensuring that the circuit board surface is smooth and free of substances that may affect welding and other subsequent processes.

[0010] S7. Quality Inspection and Rejection of Non-conforming Products: After the circuit boards are taken out, their dimensions and hole positions are inspected to ensure that they meet the design requirements. High-precision inspection is carried out through laser measurement and CCD vision inspection technology, and electrical function tests are performed on the circuit boards to ensure that they will not have problems in subsequent use. For circuit boards with problems found during inspection, the automated system will reject them to prevent non-conforming products from flowing into the subsequent production line.

[0011] S8. Overall Optimization and Production Efficiency Improvement: Based on different production needs, the system can automatically adjust stamping parameters and material handling methods to adapt to circuit boards of different specifications and shapes, thereby improving overall production flexibility.

[0012] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0013] In step S2, sensors are used to detect the positioning error of the circuit board in real time. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system makes dynamic adjustments in the production process to continuously optimize the positioning accuracy. The specific steps are as follows:

[0014] S21. Sensor Placement: High-precision sensors are used to monitor the positioning error of the circuit board in real time, capture key data such as the position, angle, and tilt of the circuit board, and install the sensors in key positions, such as when the circuit board enters the mold, leaves the mold, and in the material picking area, to ensure that the positional changes of the circuit board can be fully monitored throughout the entire production process.

[0015] S22. Parameter setting: Based on the size, shape and characteristics of the circuit board, set the initial parameters of the visual recognition system, including camera resolution, exposure, focal length and image processing algorithm, to ensure that the system can clearly identify the position of the circuit board;

[0016] S23. Real-time monitoring and error detection: The visual recognition system and sensors work synchronously to collect the position data of the circuit board in real time. The sensors continuously monitor the actual position of the circuit board and compare it with the expected position. By calculating the error between the actual position and the target position of the circuit board, the offset of the circuit board is detected. The positioning error includes position error (such as displacement deviation) and angle error (such as rotation deviation).

[0017] S24. Data Analysis and Error Correction: The sensor data and the data fed back by the vision system are fused and analyzed to build a more accurate circuit board position model. Noise is eliminated by the least squares data processing algorithm to improve positioning accuracy. Based on the detected error, the algorithm calculates the required correction value and transmits the correction command to the production line control system. The system will automatically adjust the position of the circuit board to correct the error and ensure that the circuit board maintains a precise position in the mold.

[0018] S25. Dynamic adjustment: During the production process, the system needs to make real-time feedback adjustments. Through dual monitoring of sensors and vision systems, when the position of the circuit board deviates from the set value, the operating parameters are immediately adjusted: the position of the material handling robot arm is adjusted, and the movement trajectory of the stamping die is changed.

[0019] S26. Collaborative Work and Automated Adjustment: When the positioning error of the circuit board is detected to exceed the predetermined threshold, the automation system will perform corrective operations: automatically adjust the position of the robotic arm and the material handling device to ensure that the circuit board can be accurately grasped, and enable the vision recognition system, sensor system and automation equipment to work together. When the sensor detects the position error of the circuit board, the vision system will compare the image data of the circuit board, automatically correct the deviation and send adjustment instructions to the mechanical equipment on the production line to avoid delays and errors caused by human operation.

[0020] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0021] In step S4, the material handling system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, as detailed below;

[0022] S41. Detection and recognition of circuit board position and shape: Using 3D sensors (such as laser scanning, stereo vision) to scan the specific position, size and shape of the circuit board, the vision system needs to identify the outline of the circuit board, locate its center point, edge and corner key features, and automatically calculate the length, width, thickness and any possible deformation of the circuit board: bending, warping, and transmit the data to the intelligent control system.

[0023] S42. Intelligent Adjustment of Suction and Clamping Force: Based on the material, size, and shape of the circuit board, the suction force of the suction cup is automatically adjusted. Smaller and thinner circuit boards require less suction to avoid damage caused by excessive suction. For larger and thicker circuit boards, stronger suction is required to ensure reliable gripping. The suction force of the suction cup is monitored in real time by a pressure sensor, and the suction force is automatically adjusted according to the surface characteristics of the circuit board: flatness and smoothness. A PID control algorithm is used to achieve precise adjustment of suction force, continuously monitor feedback data, and adjust the suction output to achieve the optimal value. For circuit boards with irregular shapes that require additional fixation, a clamping robotic arm or gripper system is used for auxiliary clamping. The intelligent control system automatically adjusts the clamping force according to the size, shape, weight, and other information of the circuit board. The clamping force is monitored by a force sensor to ensure that the clamping force can firmly grasp the circuit board without damaging it.

[0024] S43. Monitoring and adjustment of circuit board status: Real-time monitoring of the position, clamping force, and suction status of the circuit board to ensure that all operations are always in the best condition. If the circuit board is found to be offset, tilted, or unstable during the material handling process, the intelligent control system will immediately issue an adjustment command, reposition the circuit board through the vision recognition system and adjust the suction and clamping force to ensure that the circuit board can be stably gripped.

[0025] S44. Automated Path Planning and Adjustment: After the circuit board is picked up, the intelligent control system uses a path planning algorithm to determine the optimal picking path and calculates the movement trajectory of the robotic arm. Based on the shape and size of the circuit board, the system optimizes the path to avoid excessive movement and collisions. The system adjusts the path planning in real time according to the actual shape and position of the circuit board to ensure a smooth and efficient picking process. When there are protrusions or damage on the edge of the circuit board, the path planning system will avoid collisions to ensure smooth picking. During the picking process, the system will continuously detect the position and shape of the circuit board and dynamically adjust the speed, angle and movement mode of the picking robotic arm based on feedback.

[0026] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0027] In specific step S43, the circuit board is repositioned and the suction and clamping forces are adjusted using a visual recognition system. The automated process for adjusting the suction and clamping forces is as follows:

[0028] S431. Data Input and Parameter Setting: Transmit the size, shape and material information of the circuit board to the intelligent control system as the initial parameters for adjusting the suction and clamping force. According to the different characteristics of the circuit board (such as smooth surface, rough surface or holes, etc.), the intelligent system sets the appropriate suction and clamping force.

[0029] S432. Suction Adjustment: The control system adjusts the suction power of the suction cup in real time through feedback sensors. According to the shape and material of the circuit board, the intelligent control system dynamically adjusts the suction power. For smooth circuit board surfaces, the suction power is reduced to avoid over-adsorption; for rough or porous surfaces, the suction power is automatically increased to ensure that the suction cup can adhere firmly.

[0030] S433. Clamping force adjustment: For irregularly shaped circuit boards, the control system monitors the clamping force through a force sensor to ensure that the clamping device grips the circuit board with appropriate force. During the clamping process, the force of the clamping arm will be dynamically adjusted according to the edge shape of the circuit board and the actual situation.

[0031] A high-precision material handling system for miniLED circuit board die punching is provided, wherein the system is used to implement any high-precision material handling method for miniLED circuit board die punching; the system comprises:

[0032] Visual recognition and positioning module: Scans the position, size and shape of the circuit board with a high-definition camera or 3D sensor, and uses image processing algorithms to accurately identify the positioning error of the circuit board based on the acquired image data;

[0033] Intelligent control and adjustment module: Based on real-time data from the circuit board, including position, shape, size, and surface characteristics, it automatically adjusts the suction and clamping force to ensure precise gripping and positioning. This includes a control system that automatically adjusts the suction of the suction cup and the clamping force of the gripper.

[0034] Automated material handling and gripping module: The robotic arm and suction device are responsible for gripping miniLED circuit boards from the mold. The module needs to dynamically adjust the gripping method, gripping path, speed and gripping force based on feedback from the vision system and sensors.

[0035] Dynamic adjustment and feedback control module: Through the feedback control system, the material handling action and clamping force are adjusted in real time, including error correction, clamping force adjustment and position feedback;

[0036] Path planning and motion control module: Based on the real-time position and shape data of the circuit board, it plans the optimal material picking path and controls the motion trajectory of the robotic arm and material picking device;

[0037] Quality monitoring and verification module: During material handling and transportation, the quality of the circuit boards is monitored in real time to ensure that each circuit board is not damaged or misaligned during operation, including visual inspection and force feedback quality control.

[0038] The beneficial effects of this invention are as follows: By introducing a visual recognition and positioning module, the system can accurately identify the position, shape, and size of the circuit board, and adjust and correct the positioning error of the circuit board in real time. The system effectively avoids picking errors caused by inaccurate positioning, improving picking accuracy. It reduces circuit board positioning errors, improves production stability, reduces scrap and rework rates, and ensures that every operation meets quality standards. Through the intelligent control and adjustment module, based on real-time data from the circuit board, the system can automatically adjust the suction and clamping force to ensure that the circuit board can be securely gripped without damage or displacement. The system can dynamically adjust according to different circuit board materials, sizes, and shapes, improving picking accuracy and reducing damage to the circuit board, especially for fragile and surface-sensitive miniLED circuit boards, ensuring high-precision operation. Attached Figure Description

[0039] Figure 1 A flowchart of a high-precision material handling method for miniLED circuit board die punching; Detailed Implementation

[0040] A method for high-precision material handling in miniLED circuit board die punching includes the following steps;

[0041] S1. Equipment and Material Preparation: Select molds suitable for the size and shape of miniLED circuit boards, ensure the cutting accuracy and sharpness of the molds, inspect the molds regularly to ensure no wear or deformation, confirm the materials of miniLED circuit boards: the type and specifications of PCB boards and flexible circuit boards, ensure that the materials meet the production requirements, inspect and debug the stamping equipment, ensure that the equipment operates normally, and set appropriate stamping pressure, speed and other parameters.

[0042] S2. High-precision positioning: A high-precision vision recognition system is used to monitor the size and position of the circuit board in real time. It can quickly identify the accurate position of the circuit board and use sensors to detect the positioning error of the circuit board in real time to ensure that the position of the circuit board in the mold is always accurate. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system can make dynamic adjustments during the production process and continuously optimize the positioning accuracy. When a deviation occurs, the system will automatically correct it.

[0043] S3. Stamping Process: For different materials, circuit board thicknesses and specifications, the stamping parameters are adjusted: pressure, speed, and stroke depth to reduce damage and inaccuracies caused by excessive impact. By finely adjusting the stamping pressure and speed, and using machine learning algorithms, the optimal stamping parameters are intelligently selected based on real-time data of each circuit board (such as material, thickness, temperature, and humidity). The adaptive stamping process improves the flexibility and accuracy of the stamping process. When the punching of the circuit board is more complex, a step-by-step stamping method is adopted to complete the stamping operation step by step, thereby ensuring the accuracy of each step.

[0044] S4. Automated Material Handling System: The automated material handling system accurately extracts circuit boards from the mold through suction arms, robotic arms, and other automated equipment. The system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, ensuring the efficiency and accuracy of the material handling process.

[0045] S5. High-precision monitoring and feedback: During the stamping and material handling process, the system monitors the precision of each circuit board in real time through sensors and vision inspection equipment. The monitoring system can detect any potential deviations and immediately feed them back to the control system to ensure the accuracy of the operation. If the system detects positional errors or poor stamping of the circuit board, it will automatically make adjustments to ensure that subsequent operations are not affected.

[0046] S6. Fine post-processing: After stamping, the edges of the circuit board are deburred to ensure that there is no damage or burrs that will affect subsequent assembly. The circuit board after material removal is cleaned to remove any residual impurities or oil stains on the surface, ensuring that the circuit board surface is smooth and free of substances that may affect welding and other subsequent processes.

[0047] S7. Quality Inspection and Rejection of Non-conforming Products: After the circuit boards are taken out, their dimensions and hole positions are inspected to ensure that they meet the design requirements. High-precision inspection is carried out through laser measurement and CCD vision inspection technology, and electrical function tests are performed on the circuit boards to ensure that they will not have problems in subsequent use. For circuit boards with problems found during inspection, the automated system will reject them to prevent non-conforming products from flowing into the subsequent production line.

[0048] S8. Overall Optimization and Production Efficiency Improvement: Based on different production needs, the system can automatically adjust stamping parameters and material handling methods to adapt to circuit boards of different specifications and shapes, thereby improving overall production flexibility.

[0049] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0050] In step S2, sensors are used to detect the positioning error of the circuit board in real time. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system makes dynamic adjustments in the production process to continuously optimize the positioning accuracy. The specific steps are as follows:

[0051] S21. Sensor Placement: High-precision sensors are used to monitor the positioning error of the circuit board in real time, capture key data such as the position, angle, and tilt of the circuit board, and install the sensors in key positions, such as when the circuit board enters the mold, leaves the mold, and in the material picking area, to ensure that the positional changes of the circuit board can be fully monitored throughout the entire production process.

[0052] S22. Parameter setting: Based on the size, shape and characteristics of the circuit board, set the initial parameters of the visual recognition system, including camera resolution, exposure, focal length and image processing algorithm, to ensure that the system can clearly identify the position of the circuit board;

[0053] S23. Real-time monitoring and error detection: The visual recognition system and sensors work synchronously to collect the position data of the circuit board in real time. The sensors continuously monitor the actual position of the circuit board and compare it with the expected position. By calculating the error between the actual position and the target position of the circuit board, the offset of the circuit board is detected. The positioning error includes position error (such as displacement deviation) and angle error (such as rotation deviation).

[0054] S24. Data Analysis and Error Correction: The sensor data and the data fed back by the vision system are fused and analyzed to build a more accurate circuit board position model. Noise is eliminated by the least squares data processing algorithm to improve positioning accuracy. Based on the detected error, the algorithm calculates the required correction value and transmits the correction command to the production line control system. The system will automatically adjust the position of the circuit board to correct the error and ensure that the circuit board maintains a precise position in the mold.

[0055] S25. Dynamic adjustment: During the production process, the system needs to make real-time feedback adjustments. Through dual monitoring of sensors and vision systems, when the position of the circuit board deviates from the set value, the operating parameters are immediately adjusted: the position of the material handling robot arm is adjusted, and the movement trajectory of the stamping die is changed.

[0056] S26. Collaborative Work and Automated Adjustment: When the positioning error of the circuit board is detected to exceed the predetermined threshold, the automation system will perform corrective operations: automatically adjust the position of the robotic arm and the material handling device to ensure that the circuit board can be accurately grasped, and enable the vision recognition system, sensor system and automation equipment to work together. When the sensor detects the position error of the circuit board, the vision system will compare the image data of the circuit board, automatically correct the deviation and send adjustment instructions to the mechanical equipment on the production line to avoid delays and errors caused by human operation.

[0057] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0058] In step S4, the material handling system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, as detailed below;

[0059] S41. Detection and recognition of circuit board position and shape: Using 3D sensors (such as laser scanning, stereo vision) to scan the specific position, size and shape of the circuit board, the vision system needs to identify the outline of the circuit board, locate its center point, edge and corner key features, and automatically calculate the length, width, thickness and any possible deformation of the circuit board: bending, warping, and transmit the data to the intelligent control system.

[0060] S42. Intelligent Adjustment of Suction and Clamping Force: Based on the material, size, and shape of the circuit board, the suction force of the suction cup is automatically adjusted. Smaller and thinner circuit boards require less suction to avoid damage caused by excessive suction. For larger and thicker circuit boards, stronger suction is required to ensure reliable gripping. The suction force of the suction cup is monitored in real time by a pressure sensor, and the suction force is automatically adjusted according to the surface characteristics of the circuit board: flatness and smoothness. A PID control algorithm is used to achieve precise adjustment of suction force, continuously monitor feedback data, and adjust the suction output to achieve the optimal value. For circuit boards with irregular shapes that require additional fixation, a clamping robotic arm or gripper system is used for auxiliary clamping. The intelligent control system automatically adjusts the clamping force according to the size, shape, weight, and other information of the circuit board. The clamping force is monitored by a force sensor to ensure that the clamping force can firmly grasp the circuit board without damaging it.

[0061] S43. Monitoring and adjustment of circuit board status: Real-time monitoring of the position, clamping force, and suction status of the circuit board to ensure that all operations are always in the best condition. If the circuit board is found to be offset, tilted, or unstable during the material handling process, the intelligent control system will immediately issue an adjustment command, reposition the circuit board through the vision recognition system and adjust the suction and clamping force to ensure that the circuit board can be stably gripped.

[0062] S44. Automated Path Planning and Adjustment: After the circuit board is picked up, the intelligent control system uses a path planning algorithm to determine the optimal picking path and calculates the movement trajectory of the robotic arm. Based on the shape and size of the circuit board, the system optimizes the path to avoid excessive movement and collisions. The system adjusts the path planning in real time according to the actual shape and position of the circuit board to ensure a smooth and efficient picking process. When there are protrusions or damage on the edge of the circuit board, the path planning system will avoid collisions to ensure smooth picking. During the picking process, the system will continuously detect the position and shape of the circuit board and dynamically adjust the speed, angle and movement mode of the picking robotic arm based on feedback.

[0063] Furthermore, a high-precision material handling method for miniLED circuit board die punching is provided.

[0064] In specific step S43, the circuit board is repositioned and the suction and clamping forces are adjusted using a visual recognition system. The automated process for adjusting the suction and clamping forces is as follows:

[0065] S431. Data Input and Parameter Setting: Transmit the size, shape and material information of the circuit board to the intelligent control system as the initial parameters for adjusting the suction and clamping force. According to the different characteristics of the circuit board (such as smooth surface, rough surface or holes, etc.), the intelligent system sets the appropriate suction and clamping force.

[0066] S432. Suction Adjustment: The control system adjusts the suction power of the suction cup in real time through feedback sensors. According to the shape and material of the circuit board, the intelligent control system dynamically adjusts the suction power. For smooth circuit board surfaces, the suction power is reduced to avoid over-adsorption; for rough or porous surfaces, the suction power is automatically increased to ensure that the suction cup can adhere firmly.

[0067] S433. Clamping force adjustment: For irregularly shaped circuit boards, the control system monitors the clamping force through a force sensor to ensure that the clamping device grips the circuit board with appropriate force. During the clamping process, the force of the clamping arm will be dynamically adjusted according to the edge shape of the circuit board and the actual situation.

[0068] A high-precision material handling system for miniLED circuit board die punching is provided, wherein the system is used to implement any high-precision material handling method for miniLED circuit board die punching; the system comprises:

[0069] Visual recognition and positioning module: Scans the position, size and shape of the circuit board with a high-definition camera or 3D sensor, and uses image processing algorithms to accurately identify the positioning error of the circuit board based on the acquired image data;

[0070] Intelligent control and adjustment module: Based on real-time data from the circuit board, including position, shape, size, and surface characteristics, it automatically adjusts the suction and clamping force to ensure precise gripping and positioning. This includes a control system that automatically adjusts the suction of the suction cup and the clamping force of the gripper.

[0071] Automated material handling and gripping module: The robotic arm and suction device are responsible for gripping miniLED circuit boards from the mold. The module needs to dynamically adjust the gripping method, gripping path, speed and gripping force based on feedback from the vision system and sensors.

[0072] Dynamic adjustment and feedback control module: Through the feedback control system, the material handling action and clamping force are adjusted in real time, including error correction, clamping force adjustment and position feedback;

[0073] Path planning and motion control module: Based on the real-time position and shape data of the circuit board, it plans the optimal material picking path and controls the motion trajectory of the robotic arm and material picking device;

[0074] Quality monitoring and verification module: During material handling and transportation, the quality of the circuit boards is monitored in real time to ensure that each circuit board is not damaged or misaligned during operation, including visual inspection and force feedback quality control.

Claims

1. A high-precision material feeding method for miniLED circuit board die punching, characterized in that, Includes the following steps; S1. Equipment and material preparation: Select molds suitable for the size and shape of miniLED circuit boards, ensure the cutting accuracy and sharpness of the molds, inspect the molds regularly, confirm the materials of miniLED circuit boards: the type and specifications of PCB boards and flexible circuit boards, check and debug the stamping equipment, ensure that the equipment is operating normally, and set appropriate stamping pressure and speed parameters; S2. High-precision positioning: A high-precision vision recognition system is used to monitor the size and position of the circuit board in real time. It can quickly identify the accurate position of the circuit board and use sensors to detect the positioning error of the circuit board in real time. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system makes dynamic adjustments in the production process and continuously optimizes the positioning accuracy. When a deviation occurs, the system automatically corrects it. S3. Stamping Process: For different materials, circuit board thicknesses and specifications, the stamping parameters are adjusted: pressure, speed, and stroke depth to reduce damage and inaccuracies caused by excessive impact. By finely adjusting the stamping pressure and speed, and using machine learning algorithms, the optimal stamping parameters are intelligently selected based on real-time data of each circuit board: material, thickness, temperature, and humidity. The adaptive stamping process improves the flexibility and accuracy of the stamping process. When the punching of the circuit board is more complex, a step-by-step stamping method is adopted to complete the stamping operation step by step, thereby ensuring the accuracy of each step. S4. Automated Material Handling System: The automated material handling system accurately extracts circuit boards from the mold through suction arms, robotic arms, and other automated equipment. The system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, ensuring the efficiency and accuracy of the material handling process. S5. High-precision monitoring and feedback: During the stamping and material handling process, the system monitors the precision of each circuit board in real time through sensors and vision inspection equipment. The monitoring system can detect any potential deviations and immediately feed them back to the control system. If the system finds that the circuit board has positional errors or poor stamping, it will automatically make adjustments to ensure that subsequent operations are not affected. S6. Fine post-processing: After stamping, the edges of the circuit board are deburred. The circuit board after material removal is cleaned to remove residual impurities or oil stains on the surface, so that there are no substances that will affect welding and other subsequent processes. S7. Quality Inspection and Rejection of Non-conforming Products: The dimensions and hole positions of the circuit boards after material are inspected. High-precision inspection is carried out through laser measurement and CCD vision inspection technology. Electrical function tests are also performed on the circuit boards. For circuit boards with problems found during inspection, the automated system rejects them to prevent non-conforming products from flowing into the subsequent production line. S8. Overall Optimization and Production Efficiency Improvement: Based on different production needs, the system can automatically adjust stamping parameters and material handling methods to adapt to circuit boards of different specifications and shapes, thereby improving overall production flexibility.

2. The high-precision material handling method for miniLED circuit board die punching as described in claim 1, characterized in that, In step S2, sensors are used to detect the positioning error of the circuit board in real time. By analyzing and learning the changes of the circuit board in the production process in real time, the vision recognition system makes dynamic adjustments in the production process to continuously optimize the positioning accuracy. The specific steps are as follows: S21. Sensor Placement: High-precision sensors are used to monitor the positioning error of the circuit board in real time, capture key data such as the position, angle and tilt of the circuit board, and install sensors in key positions, such as when the circuit board enters the mold, leaves the mold and in the material picking area, to comprehensively monitor the position changes of the circuit board throughout the entire production process. S22. Parameter setting: Based on the size, shape and characteristics of the circuit board, set the initial parameters of the visual recognition system, including camera resolution, exposure, focal length, and image processing algorithm, to clearly identify the position of the circuit board; S23. Real-time monitoring and error detection: The visual recognition system and sensors work synchronously to collect the position data of the circuit board in real time. The sensors continuously monitor the actual position of the circuit board and compare it with the expected position. By calculating the error between the actual position and the target position of the circuit board, the offset of the circuit board is detected. The positioning error includes position error: displacement deviation, angle error: rotation deviation. S24. Data Analysis and Error Correction: The sensor data and the data fed back by the vision system are fused and analyzed to build a more accurate circuit board position model. Noise is eliminated by the least squares data processing algorithm to improve positioning accuracy. Based on the detected error, the algorithm calculates the required correction value and transmits the correction command to the production line control system. The system will automatically adjust the position of the circuit board to correct the error and ensure that the circuit board maintains a precise position in the mold. S25. Dynamic adjustment: During the production process, the system needs to make real-time feedback adjustments. Through dual monitoring of sensors and vision systems, when the position of the circuit board deviates from the set value, the operating parameters are immediately adjusted: the position of the material handling robot arm is adjusted, and the movement trajectory of the stamping die is changed. S26. Collaborative Work and Automated Adjustment: When the positioning error of the circuit board is detected to exceed the predetermined threshold, the automation system will perform corrective operations: automatically adjust the position of the robotic arm and the material handling device to ensure that the circuit board can be accurately grasped, and enable the vision recognition system, sensor system and automation equipment to work together. When the sensor detects the position error of the circuit board, the vision system will compare the image data of the circuit board, automatically correct the deviation and send adjustment instructions to the mechanical equipment on the production line to avoid delays and errors caused by human operation.

3. The high-precision material feeding method for miniLED circuit board die punching as described in claim 1, characterized in that, In step S4, the material handling system uses an intelligent control system to automatically adjust the suction and clamping force according to the position and shape of the circuit board to adapt to circuit boards of different sizes and shapes, as detailed below; S41. Detection and recognition of circuit board position and shape: Using 3D sensors and laser scanning, the specific position, size and shape of the circuit board are determined. The vision system identifies the outline of the circuit board, locates its center point, edges and corners, and automatically calculates the length, width, thickness and any possible deformation of the circuit board, such as bending and warping, and transmits the data to the intelligent control system. S42. Intelligent adjustment of suction and clamping force: Based on the material, size and shape of the circuit board, the suction force of the suction cup is automatically adjusted. The suction force of the suction cup is monitored in real time by a pressure sensor, and the suction force is automatically adjusted according to the surface characteristics of the circuit board: flatness and smoothness. The PID control algorithm is used to achieve precise adjustment of suction force, continuously monitor feedback data and adjust the suction output to achieve the optimal value. For circuit boards with irregular shapes that require additional fixation, a clamping robotic arm and gripper system are used for auxiliary clamping. The intelligent control system automatically adjusts the clamping force according to the size, shape and weight information of the circuit board, and monitors the clamping force through a force sensor. S43. Monitoring and adjustment of circuit board status: Real-time monitoring of the position, clamping force, and suction status of the circuit board to ensure that all operations are always in the best condition. If the circuit board is found to be offset, tilted, or unstable during the material handling process, the intelligent control system will immediately issue an adjustment command, reposition the circuit board through the vision recognition system and adjust the suction and clamping force to ensure that the circuit board can be stably gripped. S44. Automated Path Planning and Adjustment: After the circuit board is picked up, the intelligent control system uses a path planning algorithm to determine the optimal picking path and calculates the movement trajectory of the robotic arm. Based on the shape and size of the circuit board, the system optimizes the path to avoid excessive movement and collisions. The system adjusts the path planning in real time according to the actual shape and position of the circuit board to ensure a smooth and efficient picking process. When there are protrusions or damage on the edge of the circuit board, the path planning system will avoid collisions to ensure smooth picking. During the picking process, the system will continuously detect the position and shape of the circuit board and dynamically adjust the speed, angle and movement mode of the picking robotic arm based on feedback.

4. The high-precision material feeding method for miniLED circuit board die punching as described in claim 3, characterized in that, In specific step S43, the circuit board is repositioned and the suction and clamping forces are adjusted using a visual recognition system. The automated process for adjusting the suction and clamping forces is as follows: S431. Data Input and Parameter Setting: Transmit the size, shape, and material information of the circuit board to the intelligent control system as initial parameters for adjusting the suction and clamping force. Based on the different characteristics of the circuit board: smooth surface, rough surface, or porous surface, the intelligent system sets appropriate suction and clamping force. S432. Suction Adjustment: The control system adjusts the suction power of the suction cup in real time through feedback sensors. According to the shape and material of the circuit board, the intelligent control system dynamically adjusts the suction power. For smooth circuit board surfaces, the suction power is reduced to avoid over-adsorption; for rough or porous surfaces, the suction power is automatically increased to ensure that the suction cup can adhere firmly. S433. Clamping force adjustment: For irregularly shaped circuit boards, the control system monitors the clamping force through a force sensor to ensure that the clamping device grips the circuit board with appropriate force. During the clamping process, the force of the clamping arm will be dynamically adjusted according to the edge shape of the circuit board and the actual situation.

5. A high-precision material handling system for miniLED circuit board die punching, characterized in that, The high-precision material handling system for miniLED circuit board die punching is used to implement the high-precision material handling method for miniLED circuit board die punching as described in any one of claims 1-4; the high-precision material handling system for miniLED circuit board die punching includes: Visual recognition and positioning module: Scans the position, size and shape of the circuit board with a high-definition camera and 3D sensor, and uses image processing algorithms to accurately identify the positioning error of the circuit board based on the acquired image data; Intelligent control and adjustment module: Based on real-time data from the circuit board, including position, shape, size, and surface characteristics, it automatically adjusts the suction and clamping force to ensure precise gripping and positioning. This includes a control system that automatically adjusts the suction of the suction cup and the clamping force of the gripper. Automated material handling and gripping module: The robotic arm and suction device are responsible for gripping miniLED circuit boards from the mold. The module dynamically adjusts the gripping method, gripping path, speed and gripping force based on feedback from the vision system and sensors. Dynamic adjustment and feedback control module: Through the feedback control system, the material handling action and clamping force are adjusted in real time, including error correction, clamping force adjustment and position feedback; Path planning and motion control module: Based on the real-time position and shape data of the circuit board, it plans the optimal material picking path and controls the motion trajectory of the robotic arm and material picking device; Quality monitoring and verification module: During material handling and transportation, the quality of the circuit boards is monitored in real time to ensure that each circuit board is not damaged or misaligned during operation, including quality control through visual inspection and force feedback.

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