A manufacturing method of a high-precision flexible plate with plug-in pins for an intelligent vision module

Abstract

The application discloses a manufacturing method of a high-precision flexible plate with a plug-in PIN needle for an intelligent vision module, takes a double-sided flexible copper-clad plate, manufactures a circuit pattern, takes a single-sided flexible copper-clad plate and cuts, forms an auxiliary copper-clad plate, attaches the auxiliary copper-clad plate to the area of the circuit pattern, presses and combines, drills a through hole, makes a blind hole corresponding to the part of the circuit pattern on the auxiliary copper-clad plate, then performs whole plate electroplating, further manufactures a surface circuit pattern, takes a covering film, performs windowing, attaches to the surface of the surface circuit pattern, forms a flexible plate layer, takes a reinforcing plate, integrally attaches to the flexible plate layer, drills a reinforcing plate hole corresponding to the through hole, and forms the high-precision flexible plate. By moving part of the circuit pattern to the surface of the auxiliary copper-clad plate to provide a space for the through hole, the high-precision through hole with high reliability is manufactured, the reinforcing plate hole is drilled after the reinforcing plate is integrally attached, the high-precision alignment effect of the reinforcing plate hole and the through hole is formed, and the problems of poor plugging or excessive plugging of the plug-in precision PIN needle are effectively prevented.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of flexible circuit board processing, in particular to a manufacturing method of a high-precision flexible board with PIN insertion for an intelligent vision module. BACKGROUND

[0002] With the development of intelligent electronic modules, a class of vision products for identification, calculation or monitoring has higher and higher requirements for data transmission and analysis efficiency, and with the technical update iteration of electronic products, the application and implementation of flexible board PIN insertion are gradually applied effectively.

[0003] Because the flexible board is relatively soft, the general application of inserting precise PINs requires attaching a reinforcing plate to the corresponding position. At present, the hole of the reinforcing plate is drilled first, and then the reinforcing plate is attached to the corresponding position of the flexible board, realizing the processing of the flexible board with the reinforcing plate.

[0004] However, due to the expansion and contraction of the flexible board and the reinforcing plate during processing, and the attachment of the reinforcing plate after the flexible board is made, the diameter of the hole of the reinforcing plate needs to be larger than that of the through hole of the flexible board, and precise alignment is required to ensure that the through hole and the hole of the reinforcing plate are precisely attached. However, in actual processing, it is difficult to ensure that the hole of the reinforcing plate and the through hole are precisely fitted, which may cause misalignment and lead to problems such as difficulty in effectively inserting the precise PIN, poor contact, and damage to the flexible board.

[0005] Furthermore, even if the two holes are precisely aligned, the diameter difference between the small diameter section and the large diameter section of the precise PIN is small, and the precise PIN is easily squeezed when inserted, which may cause the through hole to be squeezed in the direction of the hole of the reinforcing plate, resulting in excessive insertion of the precise PIN or damage to the through hole.

[0006] In addition, the connection mode of the PIN insertion is prone to cause problems such as deformation or short circuit of the circuit pattern near the through hole due to the softness of the flexible board when the PIN is inserted into the through hole.

[0007] Based on the above background and problems, it is necessary to provide a manufacturing method of a high-precision flexible board with improved PIN insertion reliability. SUMMARY

[0008] The present application provides a manufacturing method of a high-precision flexible board with PIN insertion for an intelligent vision module, which solves the problems of difficulty in effectively inserting the PIN, poor contact, damage to the flexible board, and deformation or short circuit of the circuit pattern near the through hole caused by PIN insertion.

[0009] S10: take the double-sided flexible copper-clad plate which is stacked by the first copper layer, the first PI layer and the second copper layer in sequence, and take the single-sided flexible copper-clad plate which is stacked by the single-sided copper layer and the single-sided PI layer in sequence; make the circuit pattern on the first copper layer; cut the single-sided copper-clad plate to form an auxiliary copper-clad plate; attach the auxiliary copper-clad plate to the area of the circuit pattern and press together, then drill the through hole; then make the blind hole on the auxiliary copper-clad plate, the blind hole corresponds to part of the circuit pattern; form the through blind hole plate;

[0010] S20: plate electroplating is performed on the through blind hole plate, the through hole forms the through hole, and the blind hole forms the through blind hole; the first copper layer and the single-sided copper layer jointly form the surface copper layer; the through hole plate is formed;

[0011] S30: make the surface circuit pattern on the through hole plate to form the surface circuit pattern plate;

[0012] S40: take the cover film, perform windowing to form the windowed cover film, attach the windowed cover film to the surface of the surface circuit pattern; form the flexible plate layer;

[0013] S50: take the reinforcing plate, and attach the reinforcing plate to one side of the flexible plate layer as a whole; then drill the reinforcing plate hole on the reinforcing plate corresponding to the position of the through hole; after the post-process processing, the high-precision flexible plate is formed.

[0014] Further, the auxiliary copper-clad plate avoids the through hole.

[0015] Further, the thickness of the single-sided copper layer is equal to the thickness of the first copper layer, and the thickness of the single-sided PI layer is less than the thickness of the first PI layer.

[0016] Further, the through hole cover area is formed by extending the plate body of the double-sided flexible copper-clad plate from the edge of the through hole; the double-sided flexible copper-clad plate except the through hole and the through hole cover area is the circuit distribution area; the circuit pattern includes the dense circuit pattern distributed near the through hole; making the circuit pattern on the first copper layer includes removing the dense circuit pattern of the through hole cover area, and one end of the dense circuit pattern located in the circuit distribution area is a blind hole connection end; making the blind hole on the auxiliary copper-clad plate includes making the blind hole on the auxiliary copper-clad plate corresponding to the position of the blind hole connection end.

[0017] Further, making the surface circuit pattern on the through hole plate includes making the auxiliary circuit pattern on the through hole, and the auxiliary circuit pattern extends from the edge of the through hole to the plate body of the double-sided flexible copper-clad plate.

[0018] Further, the first copper layer corresponding to the manufacturing line pattern includes removing the first copper layer corresponding to the blind hole; the auxiliary copper-clad plate corresponding to the blind hole includes laser drilling the first PI layer to expose the line pattern.

[0019] Further, the reinforcing plate hole corresponding to the position of the through hole includes measuring the position of the through hole, forming a measurement result, and drilling the reinforcing plate hole according to the measurement result.

[0020] The diameter of the reinforcing plate hole is smaller than the diameter of the through hole on one side.

[0021] Further, the size of the window is larger than the diameter of the through hole on one side.

[0022] Further, after forming the flexible plate layer, the flexible plate layer is surface treated.

[0023] The technical scheme of the present application moves the line pattern near the through hole to the single-sided copper layer of the auxiliary copper-clad plate for manufacturing, forming a "line moving" process, which not only prevents the extrusion of the line pattern in this area when the high-precision flexible plate is inserted with a precision PIN needle, causing line deformation or short circuit, etc., but also provides space for the through-hole covering area, thereby providing space for manufacturing auxiliary line patterns, forming a flat area for inserting a precision PIN needle, and the auxiliary line pattern can effectively improve the bonding force and reliability of the through hole, preventing problems such as hole deformation during insertion.

[0024] The processing method of first attaching a complete reinforcing plate and then drilling a reinforcing plate hole effectively prevents the problem of deviation between the reinforcing plate hole and the through hole, and forms the effect that the reinforcing plate supports around the through hole (without a difference in position), effectively avoiding the problem of over-inserting a precision PIN needle or damaging the through hole. Further, it can also prevent the problem of the through hole being bent or the edge being pressed into the reinforcing plate hole when the reinforcing plate is pressed.

[0025] The overall processing process forms a correlation between the "line moving" process, the through-hole covering area 1, the auxiliary line pattern, the covering film window, and the drilling of the reinforcing plate hole based on the flatness around the through hole, providing an effective processing method for the processing of high-precision flexible plates with PIN needles. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings from the structures shown in the drawings without creative labor.

[0027] Figure 1 Cross-sectional structure diagram of a high-precision flexible plate of the prior art;

[0028] Figure 2 Cross-sectional structure diagram of a high-precision flexible plate of the prior art;

[0029] Figure 3 Main process flow diagram of the embodiment of the present application;

[0030] Figure 4 Cross-sectional structure diagram of the attaching plate of the present embodiment;

[0031] Figure 5 Planar structure diagram of the through blind hole plate of the present embodiment;

[0032] Figure 6 Cross-sectional structure diagram of A-A of Figure 5 ;

[0033] Figure 7 Cross-sectional structure diagram of B-B of Figure 5 ;

[0034] Figure 8 Cross-sectional structure diagram of the through hole plate of the present embodiment;

[0035] Figure 9 Cross-sectional structure diagram after the plate is based on Figure 7 and is processed by plate plating;

[0036] Figure 10 Planar structure diagram of the surface circuit pattern plate of the present embodiment;

[0037] Figure 11 Cross-sectional structure diagram of C-C of Figure 10 ;

[0038] Figure 12 Cross-sectional structure diagram of D-D of Figure 10 ;

[0039] Figure 13 Cross-sectional structure diagram of the flexible plate layer of the present embodiment;

[0040] Figure 14 Cross-sectional structure diagram of the reinforcing flexible plate of the present embodiment;

[0041] Figure 15 Planar structure diagram of the high-precision flexible plate of the present embodiment;

[0042] Figure 16 Cross-sectional structure diagram of Figure 15A cross-sectional structural schematic view of E-E;

[0043] Figure 17 A cross-sectional structural schematic view of F-F. Figure 15 A cross-sectional structural schematic view of F-F.

[0044] BRIEF DESCRIPTION OF DRAWINGS

[0045] 50X~ordinary flexible board layer; 1112~surface copper layer; 620X~ordinary reinforcing through-hole board; 1410~through-hole; 1310X~ordinary dense circuit pattern; 1510~through blind hole; 1410X~ordinary through-hole; 40~surface circuit pattern board; 300~precision PIN pin; 410~surface circuit pattern; 400~offset difference; 4110~first surface circuit pattern; 500~difference bit; 4120~second surface circuit pattern; 10~attached board; 4130~auxiliary circuit pattern; 110~double-sided flexible copper-clad plate; 1310~dense circuit pattern; 1110~first copper layer; 1320~blind hole connection end; 1120~first PI layer; 1411~hole ring; 1130~second copper layer; 1420~through-hole coverage area; 120~auxiliary copper-clad plate; 1430~circuit distribution area; 1210~single-sided copper layer; 50~flexible board layer; 1220~single-sided PI layer; 510~windowed cover film; 130~circuit pattern; 60~reinforced flexible board; 20~through blind hole board; 610~reinforcing plate; 140~through hole; 6110~reinforcing plate hole; 150~blind hole; 70~high-precision flexible board; 30~through-hole board; 620~reinforcing through-hole board.

[0046] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0048] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0049] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description and cannot be understood as indicating or implying the relative importance of the technical features indicated or implying the number of technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0050] In addition, the technical solutions of various embodiments of the present application can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, also not within the scope of protection required by the present application.

[0051] Please refer to Figure 1 and Figure 2 ; Figure 1 The cross-sectional structure diagram of the high-precision flexible plate of the prior art PIN needle is shown in the figure. Figure 2 The cross-sectional structure diagram of another high-precision flexible plate of the prior art PIN needle is shown in the figure.

[0052] In the conventional manufacturing method, the ordinary reinforcing through-hole plate 620X may be offset after being attached and pressed with the ordinary flexible plate layer 50X, resulting in an offset (as shown in Figure 1 ) between the ordinary reinforcing plate hole of the ordinary reinforcing through-hole plate 620X and the ordinary insertion through-hole 1410X of the ordinary flexible plate layer 50X, resulting in a large offset difference 400. After the insertion of the precision PIN needle 300, it is easy to cause problems such as ineffective insertion, poor contact, and insertion of the ordinary flexible plate layer 50X.

[0053] Even if the holes are accurately aligned, because the needle of the precision PIN needle 300 is relatively precise, the difference between the smaller diameter section and the larger diameter section is relatively small (for example, the diameter of the smaller diameter section is 0.2mm, and the diameter of the larger diameter section is 0.3mm), when the PIN needle is inserted, it is easy to cause extrusion to the ordinary flexible plate layer 50X from the difference position 500, resulting in the problem that the ordinary insertion through-hole 1410X is extruded to the direction of the ordinary reinforcing plate hole, thereby causing the problem of excessive insertion of the precision PIN needle 300 (i.e., the diameter section of 0.3mm passes through the flexible plate), or damage to the ordinary insertion through-hole 1410X.

[0054] The wiring density of the ordinary high-precision flexible plate is relatively high, and it is easy to cause the problem that after the insertion of the precision PIN needle 300 into the ordinary insertion through-hole 1410X, the ordinary dense circuit pattern 1310X (i.e., the dense circuit near the precision PIN needle 300) is extruded, causing the problem of circuit deformation or short circuit.

[0055] Please refer to Figure 3 ;Figure 3 The main process flow of the embodiment of the present application.

[0056] The manufacturing method of the high-precision flexible plate 70 of the embodiment of the present application comprises Figure 1 The main manufacturing process flow is described in detail in the following steps.

[0057] Step S10:

[0058] Take the double-sided flexible copper-clad plate 110 which is stacked by the first copper layer 1110, the first PI layer 1120, and the second copper layer 1130 in sequence, and take the single-sided flexible copper-clad plate which is stacked by the single-sided copper layer 1210 and the single-sided PI layer 1220 in sequence; make the circuit pattern 130 on the first copper layer 1110; cut the single-sided copper-clad plate to form the auxiliary copper-clad plate 120; attach the auxiliary copper-clad plate 120 to the area of the circuit pattern 130 to form the attached plate 10, and then press and combine, and then drill the through hole 140; then make the blind hole 150 on the auxiliary copper-clad plate 120, and the blind hole 150 corresponds to part of the circuit pattern 130; and form the through-blind hole plate 20.

[0059] The overall technical method of the embodiment adopts appropriate enhancement of the bonding force and strength between the through hole 1410 and the flexible plate layer 50, and adopts the "line moving" mode to avoid the through hole covering area 1420, so that the through hole 1410 has stronger supporting force when the precision PIN needle 300 is inserted, and at the same time, the adjacent circuit pattern 130 is not deformed, and further, the overall attached reinforcing plate 610 is used to drill the reinforcing plate hole 6110, thereby improving the precision of the reinforcing plate hole 6110 and the through hole 1410 of the flexible plate layer 50.

[0060] Based on the overall technical implementation process, the embodiment adopts the mode of first making the small-pitch high-density circuit pattern 130, and moving the adjacent lines to the single-sided copper-clad plate to make, thereby realizing the avoidance and conduction of the adjacent lines.

[0061] The auxiliary copper-clad plate 120 is attached to the area of the circuit pattern 130 to form the stacking basis for the subsequent process of making "line moving".

[0062] The auxiliary copper-clad plate 120 is cut from the single-sided flexible copper-clad plate, and the local attachment of the auxiliary copper-clad plate 120 to the double-sided flexible copper-clad plate 110 can effectively realize the process of "line moving", and avoid the deviation of the flexible plate layer 50 from the flexible plate in the design data of the processing guide in the overall attachment, the deviation of the conduction performance and the flexibility performance; on the other hand, the space of the plate surface with non-dense line distribution can be effectively utilized to realize the processing process of "line moving" through the auxiliary copper-clad plate 120.

[0063] The blind hole 150 is made to provide a conductive condition for the "wire shift" from the single copper layer 1210 to the circuit pattern 130.

[0064] The "wire shift" processing is not only based on the avoidance of the small-pitch high-density circuit pattern 130 near the through hole 1410, but also based on the subsequent production of the auxiliary circuit pattern 4130 to provide sufficient board space for the production of the auxiliary circuit pattern 4130 (see the following description).

[0065] In this embodiment, the auxiliary copper-clad plate 120 avoids the through hole 140; preferably, the avoidance size is 100 μm to 0.5 mm from the edge of the through hole 140 towards the board surface.

[0066] Since the high-precision flexible plate 70 formed by production needs to be plugged with a precision PIN needle 300, and the plugging position needs to be flat, the surface of the double-sided flexible copper-clad plate 110 forms a certain step structure after the auxiliary copper-clad plate 120 is attached and pressed. To avoid the step structure affecting the plugging effect of the precision PIN needle 300, the auxiliary copper-clad plate 120 needs to avoid the through hole 140, so that the board surface within the range of the through hole 140 is a flat surface.

[0067] In this embodiment, the thickness of the single copper layer 1210 is equal to the thickness of the first copper layer 1110, and the thickness of the single PI layer 1220 is less than the thickness of the first PI layer 1120.

[0068] Preferably, the line body after the "wire shift" needs to match the line body of the original circuit, therefore, the thickness of the single copper layer 1210 of the circuit after the "wire shift" needs to be the same as the thickness of the circuit without "wire shift", i.e. the same as the thickness of the first copper layer 1110, and to reduce the overall thickness of the auxiliary copper-clad plate 120, the thickness of the single PI layer 1220 can be reduced; for example, the thickness of the single PI layer 1220 is 20 μm, and the thickness of the first PI layer 1120 is 50 μm.

[0069] It is worth noting that the circuit processed by the "wire shift" in this embodiment is not a signal line, nor a line that carries a large current, but a common conductive circuit, therefore, the "wire shift" processing method does not affect the signal or the current carrying capacity.

[0070] Step S20:

[0071] The through blind hole plate 20 is subjected to whole-board electroplating, the through hole 140 forms a conductive hole 1410 (with a hole ring 1411), and the blind hole 150 forms a conductive blind hole 1510; the first copper layer 1110 and the single copper layer 1210 together form a surface copper layer 1112; and the whole board forms a conductive hole plate 30.

[0072] The plate body of the through blind hole plate 20 is an integral whole, so the whole plate can be processed by electroplating. After electroplating, the through holes 140 and the blind holes 150 are all plated with copper to form a conductive effect, and the surface electroplating effect is also completed, without the need for processing by multiple electroplating of the through holes 140, the blind holes 150, and the surface copper layer 1112, thereby effectively shortening the processing flow, improving the processing efficiency, and reducing the processing cost.

[0073] In this embodiment, the through hole covering area 1420 is formed by extending the plate body of the double-sided flexible copper-clad plate 110 from the edge of the through hole 140. The double-sided flexible copper-clad plate 110 other than the through hole 140 and the through hole covering area 1420 is a circuit distribution area 1430. The circuit pattern 130 includes dense circuit patterns 1310 distributed adjacent to the through hole 140 (generally, the circuit pattern 130 with a distance from the conductive hole 1410 less than or equal to 100 μm is the adjacent circuit pattern 130). The dense circuit patterns 1310 in the circuit distribution area 1430 have one end as a blind hole connection end 1320. The blind hole 150 is made on the auxiliary copper-clad plate 120 corresponding to the blind hole connection end 1320.

[0074] Optionally, the dense circuit pattern 1310 is a circuit pattern 130 with a line width / line gap ≤ 4 mil / 4 mil.

[0075] The above is the processing procedure of "line moving". The through hole covering area 1420 is provided to provide a space area for the insertion of the precision PIN 300. The adjacent dense circuit patterns 1310 in the through hole covering area 1420 are moved to the single-sided copper layer 1210 of the auxiliary copper-clad plate 120 for processing, and are interconnected and conducted through the conductive blind hole 1510, thereby forming the requirement for the insertion of the precision PIN 300. The through hole covering area 1420 is formed, the single-sided copper layer 1210 is formed to process the "line moving" circuit, and the conductive blind hole 1510 is formed in a flow process and in a correlated technical implementation process.

[0076] It is worth noting that the through hole covering area 1420 is matched with the size of the large diameter section of the precision PIN 300, so that the plate surface of the double-sided flexible copper-clad plate 110 corresponding to the insertion position of the precision PIN 300 is a flat area, rather than a stepped plate surface after the auxiliary copper-clad plate 120 is attached and compressed.

[0077] The auxiliary line pattern 4130 is matched with the through-hole covering area 1420, so as to meet the flat plate surface effect of the matched precision PIN needle 300 insertion, and meanwhile, the combination of the through-hole 1410 and the plate surface is improved, and the strength and reliability of the through-hole 1410 are enhanced.

[0078] In the embodiment, the manufacturing line pattern 130 corresponding to the first copper layer 1110 includes removing the first copper layer 1110 corresponding to the blind hole 150; and the manufacturing blind hole 150 of the auxiliary copper-clad plate 120 includes laser punching the first PI layer 1120 corresponding to the blind hole 150 to expose the line pattern 130.

[0079] Step S30:

[0080] The surface line pattern 410 is manufactured on the through-hole plate 30 to form a surface line pattern plate 40; the manufacturing includes manufacturing a first surface line pattern 4110 on the surface copper layer 1112, and manufacturing a second surface line pattern 4120 on the second copper layer 1130.

[0081] In the embodiment, the manufacturing surface line pattern 410 of the through-hole plate 30 includes manufacturing an auxiliary line pattern 4130 on the through-hole 1410, and the auxiliary line pattern 4130 extends from the edge of the through-hole 1410 to the plate body of the double-sided flexible copper-clad plate 110.

[0082] The manufacturing line pattern 130 is sequentially processed according to the process of sticking dry film, exposure, development, etching and film removal. Due to the above process, the auxiliary copper-clad plate 120 provides a space for the through-hole covering area 1420, forms a surface space for manufacturing the auxiliary line pattern 4130, and the auxiliary line pattern 4130 is the extension of the partial area of the hole ring 1411 in the non-line distributed area (i.e., the area avoiding line distribution) on the surface copper layer 1112 when manufacturing the surface line pattern 410, thereby forming an auxiliary pattern structure effectively increasing the through-hole 1410.

[0083] Generally, the line pattern 130 on the plate surface is relatively dense, and the width of the hole ring 1411 of the through-hole 1410 is generally 20 μm to 50 μm, and the minimum space provided for the auxiliary line pattern 4130 can be 70 μm, so that 2 to 4 lines can be removed by the "line moving" processing.

[0084] Step S40:

[0085] The covering film is taken, and the windowing is performed to form a windowing covering film 510, and the windowing covering film 510 is attached to the surface of the surface line pattern 410; and the flexible plate layer 50 is formed.

[0086] In this embodiment, the size of the window is larger than the diameter of the via hole 1410.

[0087] The covering film window is further matched with the via hole 1410, preferably, the size of the window is larger than the diameter of the via hole 1410 and smaller than the diameter of the via hole covering area 1420, forming the effect of covering the auxiliary circuit pattern 4130 of the covering film and exposing the hole ring 1411, providing the contact guide for the application of the precision PIN needle 300.

[0088] In this embodiment, after the flexible plate layer 50 is formed, the surface treatment is performed on the flexible plate layer 50.

[0089] After the surface treatment, the surface protection layer and the wear-resistant layer of the via hole 1410 are formed.

[0090] Step S50:

[0091] The reinforcing plate 610 is taken and attached to one side of the flexible plate layer 50, that is, attached to one side of the second surface circuit pattern 4120, forming the reinforced flexible plate 60; then the reinforcing plate hole 6110 is drilled in the position of the reinforcing plate 610 corresponding to the via hole 1410, and the reinforcing plate 610 forms the reinforcing via plate 620; after the post-processing, the whole plate forms the high-precision flexible plate 70.

[0092] Based on the high-precision and high-reliability processing basis of the via hole 1410 and the flexible plate layer 50, the reinforcing plate 610 is attached as a whole first, and then the reinforcing plate hole 6110 is drilled, which effectively improves the alignment accuracy of the reinforcing plate hole 6110 and the via hole 1410 compared with the prior art method of drilling first and then attaching, and forms the effect that the reinforcing plate 610 supports around the via hole 1410 (without the difference value position 500), and the prior art method of drilling first and then attaching can cause the via hole 1410 to be bent or the edge of the via hole 1410 to be pressed into the reinforcing plate hole 6110 when the reinforcing plate 610 is pressed, effectively improving the balance and reliability of the via hole 1410.

[0093] In this embodiment, drilling the reinforcing plate hole 6110 in the position of the reinforcing plate 610 corresponding to the via hole 1410 includes measuring the position of the via hole 1410, forming a measurement result, and drilling the reinforcing plate hole 6110 in the reinforcing plate 610 according to the measurement result.

[0094] Since the flexible plate layer 50 is processed through the intermediate process, there may be expansion and contraction effects, causing the through hole 1410 to deviate from the design data of the processing guide. If the reinforcing plate hole 6110 is directly drilled, it may cause drilling deviation or damage to the through hole 1410. Therefore, before drilling the reinforcing plate hole 6110, a two-dimensional measurement device, AOI optical scanning device, CCD lens alignment device or other optical scanning device can be used to measure the position of the through hole 1410. After comparing and adjusting the data with the design data, the drilling coefficient of the reinforcing plate hole 6110 is formed, and then the drilling process is performed, which can effectively improve the drilling precision.

[0095] In the embodiment, the diameter of the reinforcing plate hole 6110 is smaller than the diameter of the through hole 1410 on one side.

[0096] When the precision PIN needle 300 has a plug-in allowance space, since the reinforcing plate hole 6110 of the embodiment is processed after the through hole 1410 is processed, it has higher processing precision, so the processing process of the reinforcing plate hole 6110 can be used to further match the diameter of the precision PIN needle 300, so that the precision PIN needle 300 has better insertion firmness when applied.

[0097] It is worth noting that since the circuit board in the actual design and processing process is more precise, the actual structure diagram and the thickness, line width and other dimensions of each layer are all in microns, for example, the thickness of each layer is generally 5-50 microns. If the drawings of the specification are made according to the actual scale, there will be a problem of unclear illustration. Therefore, in order to more clearly represent the implementation process of the manufacturing method, the drawings of the embodiment are all schematic diagrams of the technical features, which do not represent the size of the actual structure diagram, nor represent the enlarged view of the actual structure diagram.

[0098] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the specification and drawings, or direct / indirect application in other related technical fields under the inventive concept of the present application is included in the patent protection scope of the present application.

Claims

1. A manufacturing method of a high-precision flexible plate with a PIN needle for an intelligent vision module, characterized in that: S10: taking a double-sided flexible copper-clad plate with a first copper layer, a first PI layer, and a second copper layer stacked in sequence, and taking a single-sided flexible copper-clad plate with a single copper layer and a single PI layer stacked in sequence; making a circuit pattern on the first copper layer; and cutting the single-sided flexible copper-clad plate to form an auxiliary copper-clad plate; attaching the auxiliary copper-clad plate to an area of the circuit pattern and pressing, and then drilling a through hole; then making a blind hole on the auxiliary copper-clad plate, the blind hole corresponding to part of the circuit pattern; and forming a through-blind hole plate; S20: performing whole-plate electroplating on the through-blind hole plate, the through hole forming a through hole, and the blind hole forming a through blind hole; the first copper layer and the single copper layer together forming a surface copper layer; and forming a through hole plate; S30: making a surface circuit pattern on the through hole plate to form a surface circuit pattern plate; S40: taking a cover film, performing windowing to form a windowed cover film, attaching the windowed cover film to the surface of the surface circuit pattern; and forming a flexible plate layer; S50: taking a reinforcing plate and attaching it to one side of the flexible plate layer as a whole; then drilling a reinforcing plate hole in the reinforcing plate corresponding to the position of the through hole; and after post-process processing, forming the high-precision flexible plate. The auxiliary copper-clad plate avoids the through hole. The thickness of the single copper layer is equal to the thickness of the first copper layer, and the thickness of the single PI layer is less than the thickness of the first PI layer. The edge of the through hole is taken as a starting position to extend the plate body of the double-sided flexible copper-clad plate to form a through hole coverage area, and the double-sided flexible copper-clad plate other than the through hole and the through hole coverage area is a circuit distribution area; the circuit pattern includes a dense circuit pattern distributed near the through hole; Making a circuit pattern on the first copper layer includes removing the dense circuit pattern of the through hole coverage area, and one end of the dense circuit pattern in the circuit distribution area is a blind hole connection end; Making a blind hole on the auxiliary copper-clad plate includes making the blind hole on the auxiliary copper-clad plate corresponding to the position of the blind hole connection end. Making a surface circuit pattern on the through hole plate includes making an auxiliary circuit pattern on the through hole, the auxiliary circuit pattern extending from the edge of the through hole to the plate body of the double-sided flexible copper-clad plate.

2. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, Making a circuit pattern on the first copper layer includes removing the first copper layer corresponding to the blind hole; making a blind hole on the auxiliary copper-clad plate includes laser punching the first PI layer corresponding to the blind hole to expose the circuit pattern.

3. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, Drilling a reinforcing plate hole in the reinforcing plate corresponding to the position of the through hole includes measuring the position of the through hole to form a measurement result, and drilling a reinforcing plate hole in the reinforcing plate according to the measurement result.

4. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, The diameter of the reinforcing plate hole is less than the diameter of the through hole on a single side. The size of the window is greater than the diameter of the through hole on a single side. After forming the flexible plate layer, the flexible plate layer is surface treated.

5. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1 or 4, characterized in that, ​ 6. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, ​ 7. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, ​ 8. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1 or 7, characterized in that, ​ 9. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, ​ 10. The method for manufacturing a high-precision flexible plate with plug-in pins for a smart vision module according to claim 1, characterized in that, ​

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