Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device, and relates to the technical field of display. The display panel comprises a substrate, an isolation structure, a plurality of light emitting units and a first encapsulation layer. The isolation structure is located on one side of the substrate, and the isolation structure is enclosed to form a plurality of isolated openings. At least part of the orthographic projection of the light emitting unit on the substrate is located in the orthographic projection of the corresponding isolated opening on the substrate. The first encapsulation layer is located on the side of the light emitting unit away from the substrate. The inside of the first encapsulation layer is provided with a closed cavity. The cavity is located on the side of the isolation structure facing the isolated opening. The first encapsulation layer comprises an organic filling part, and the organic filling part is located in the cavity. The display panel provided by the application is beneficial to improving the use performance of the display device.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Currently, flat panel displays have advantages such as high image quality, energy saving, small thickness and wide application range, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the performance and manufacturing process of current display devices need to be improved. Summary of the Invention

[0005] The purpose of this application is to provide a display panel, a method for manufacturing the same, and a display device, so as to improve the performance of the display device.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] In a first aspect, a display panel is provided, including a substrate, an isolation structure, a plurality of light-emitting units, and a first encapsulation layer. The isolation structure is located on one side of the substrate and forms a plurality of isolation openings. At least a portion of the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate. The first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The interior of the first encapsulation layer is provided with a closed cavity, which is located on the side of the isolation structure facing the isolation openings. The first encapsulation layer includes an organic filling portion, which is located within the cavity.

[0008] Through the above technical solution, the display panel provided in this application uses the organic filling portion to fill the cavity closed by the first encapsulation layer, which can support the part of the first encapsulation layer that is attached to the isolation structure. This helps to reduce the stress on the part of the first encapsulation layer that is attached to the isolation structure, and helps to reduce the risk of breakage of the part of the first encapsulation layer that is attached to the isolation structure, thereby improving the display effect.

[0009] Therefore, the display panel provided in this application is beneficial to improving the performance of the display device.

[0010] In some embodiments, the organic filler portion includes photoresist.

[0011] Optionally, the organic filler extends circumferentially along the isolation opening.

[0012] In some embodiments, the organic filler portion is annular and extends circumferentially along the isolation opening; or, there are multiple organic filler portions, which are spaced apart circumferentially along the isolation opening.

[0013] In some embodiments, the first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer disposed sequentially in a direction away from the substrate, and a cavity is formed between the first encapsulation sublayer and the second encapsulation sublayer.

[0014] Optionally, the cavity is an annular cavity.

[0015] In some implementations, both the first and second encapsulation sublayers comprise inorganic materials.

[0016] Optionally, the first encapsulation sublayer and the second encapsulation sublayer may be made of different materials.

[0017] Optionally, the first encapsulation sublayer and the second encapsulation sublayer are made of the same material.

[0018] In some embodiments, the materials of the first and second encapsulation sublayers include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0019] In some embodiments, the first encapsulation sublayer includes a first body portion and a first extension portion, the first body portion covering at least a portion of the light-emitting unit, and the first extension portion connected to the periphery of the first body portion and connected to the sidewall of the isolation junction facing the isolation opening.

[0020] Optionally, a portion of the first extension is located on the side of the isolation structure away from the substrate.

[0021] In some embodiments, the second encapsulation sublayer includes a second body portion and a second extension portion, the second extension portion being connected to the periphery of the second body portion, the second body portion being located on the side of the first body portion away from the substrate, and the orthographic projection of the second body portion on the substrate being located within the orthographic projection of the first body portion on the substrate.

[0022] In some embodiments, the first main body, the second main body, and the first extension form a cavity;

[0023] And / or, the second extension is located on the side of the first extension away from the substrate.

[0024] In some embodiments, the isolation structure includes a support portion and an eaves portion arranged sequentially in a direction away from the substrate. The orthographic projection of the side of the support portion away from the substrate onto the substrate is located within the orthographic projection of the side of the eaves portion facing the substrate onto the substrate. The distance between the sidewall of the support portion facing the isolation opening and the center of the isolation opening gradually increases in the direction away from the substrate.

[0025] In some embodiments, the organic filler portion is located on the side of the eaves facing the substrate.

[0026] Optionally, the isolation structure also includes a base portion located on the side of the support portion facing the substrate, and the orthographic projection of the side of the support portion facing the substrate onto the substrate is located within the orthographic projection of the side of the base portion facing away from the substrate onto the substrate.

[0027] In some embodiments, the display panel further includes a pixel definition layer located on one side of the substrate, an isolation structure located on the side of the pixel definition layer opposite to the substrate, the pixel definition layer having a plurality of pixel openings, at least a portion of the light-emitting unit being disposed within a corresponding pixel opening, and the pixel openings communicating with each other.

[0028] In some embodiments, the display panel further includes a second encapsulation layer located on the side of the first encapsulation layer and the isolation structure facing away from the substrate.

[0029] Optionally, the material of the second encapsulation layer may include organic materials.

[0030] In some embodiments, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer opposite to the substrate.

[0031] Optionally, the material of the third encapsulation layer may include inorganic materials.

[0032] Optionally, the material of the third encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0033] Secondly, this application provides a method for manufacturing a display panel, the method comprising:

[0034] Provide substrate;

[0035] A pixel definition layer and an isolation structure are fabricated on one side of the substrate;

[0036] The graphical pixel definition layer and isolation structure form pixel openings and isolation openings, and the pixel openings and isolation openings are connected.

[0037] Prepare a light-emitting unit, wherein at least a portion of the light-emitting unit is disposed within a pixel opening;

[0038] A first encapsulation layer is prepared on the side of the light-emitting unit away from the substrate;

[0039] The first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The interior of the first encapsulation layer is provided with a closed cavity. The cavity is located on the side of the isolation structure facing the isolation opening. The first encapsulation layer includes an organic filling portion, which is located inside the cavity.

[0040] Through the above technical solution, the preparation method provided in this application can utilize the organic filling portion to fill the closed cavity of the first encapsulation layer, so that the organic filling portion can support the sidewall portion of the first encapsulation layer that is attached to the isolation structure. This helps to reduce the stress on the sidewall portion of the first encapsulation layer that is attached to the isolation structure, and helps to reduce the risk of breakage of the sidewall portion of the first encapsulation layer that is attached to the isolation structure, thereby improving the display effect.

[0041] In some embodiments, fabricating a first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes:

[0042] A first encapsulation sublayer is prepared, wherein the first encapsulation sublayer forms a trench with an opening, the trench being located on the side of the isolation structure facing the isolation opening;

[0043] An organic layer is prepared on the side of the first encapsulation sublayer that faces away from the substrate;

[0044] The patterned organic layer forms the organic filling part, which fills the trench;

[0045] A second encapsulation sublayer is prepared on the side of the first encapsulation sublayer facing away from the substrate. The second encapsulation sublayer seals the opening of the trench, so that the trench forms a closed cavity.

[0046] The first and second encapsulation sublayers are graphically represented to form the first encapsulation layer.

[0047] In some embodiments, the patterned organic layer forms an organic filling portion, including:

[0048] Photolithography or dry etching is performed on the organic layer.

[0049] Optionally, the organic layer includes photoresist.

[0050] In some embodiments, fabricating the light-emitting unit includes:

[0051] Fabrication of the first light-emitting unit;

[0052] After fabricating the first light-emitting unit, fabricating a first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes:

[0053] A first encapsulation portion is prepared on the side of the first light-emitting unit away from the substrate. The first encapsulation portion has a cavity and an organic filling portion located within the cavity.

[0054] Optionally, after fabricating the first encapsulation portion on the side of the first light-emitting unit facing away from the substrate, fabricating the light-emitting unit includes:

[0055] Fabrication of a second light-emitting unit;

[0056] After fabricating the second light-emitting unit, fabricating a first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes:

[0057] A second encapsulation portion is prepared on the side of the second light-emitting unit away from the substrate. The second encapsulation portion has a cavity and an organic filling portion located within the cavity.

[0058] Optionally, after fabricating the second encapsulation portion on the side of the second light-emitting unit facing away from the substrate, fabricating the light-emitting unit includes:

[0059] Fabrication of the third light-emitting unit;

[0060] After fabricating the third light-emitting unit, fabricating a first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes:

[0061] A third encapsulation portion is prepared on the side of the third light-emitting unit away from the substrate. The third encapsulation portion has a cavity and an organic filling portion located within the cavity.

[0062] Thirdly, this application provides a display device comprising a display panel according to any of the above embodiments or a display panel prepared by the preparation method of any of the above embodiments. The display device provided by this application has the same or similar technical effects as the display panel of any of the above embodiments or the preparation method of any of the above embodiments, and will not be described again here. Attached Figure Description

[0063] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0064] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0065] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0066] Figure 3 For along Figure 2 One of the cross-sectional structural diagrams of the CC line;

[0067] Figure 4 This is one of the structural schematic diagrams in the display panel manufacturing process of related technologies;

[0068] Figure 5 This is the second structural schematic diagram of the display panel manufacturing process in related technologies;

[0069] Figure 6 This is the third structural schematic diagram of the display panel manufacturing process in related technologies;

[0070] Figure 7 For along Figure 2 Sectional view of the CC line, part two;

[0071] Figure 8 This is one of the structural schematic diagrams of the display panel during the manufacturing process provided in the embodiments of this application;

[0072] Figure 9 This is the second schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0073] Figure 10 This is the third schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0074] Figure 11 This is the fourth schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0075] Figure 12 Fifth schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0076] Figure 13 This is the sixth schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0077] Figure 14 This is the seventh schematic diagram of the structure of the display panel during the manufacturing process provided in the embodiments of this application;

[0078] Figure 15 This is the eighth schematic diagram of the structure of the display panel provided in the embodiments of this application during the manufacturing process;

[0079] Figure 16 For along Figure 2 The third sectional view of the CC line.

[0080] The following are the labeling elements in the figure:

[0081] 100 - Display panel; 10 - Substrate; 20 - First electrode; 30 - Pixel definition layer; 40 - Isolation structure; 401 - First isolation opening; 402 - Second isolation opening; 403 - Third isolation opening; 50 - Light-emitting layer; 51 - First light-emitting layer; 52 - Second light-emitting layer; 53 - Third light-emitting layer; 60 - Second electrode; 70 - First encapsulation layer; 7001 - Cavity; 7002 - Organic filling portion; 7003 - Trench; 70031 - Opening; 701 - First encapsulation Sublayer; 7011-First main body; 7012-First extension; 702-Second encapsulation sublayer; 7021-Second main body; 7022-Second extension; 71-First encapsulation part; 711-First encapsulation sub-part; 712-Second encapsulation sub-part; 72-Second encapsulation part; 721-Third encapsulation sub-part; 722-Fourth encapsulation sub-part; 73-Third encapsulation part; 731-Fifth encapsulation sub-part; 732-Sixth encapsulation sub-part; 80-Second encapsulation layer; 90-Third encapsulation layer. Detailed Implementation

[0082] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0083] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0084] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0085] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0086] Please refer to the following: Figure 1 , Figure 2 and Figure 3 This application provides a display panel 100, which can be an organic light-emitting diode (OLED) display panel 100 or a micro light-emitting diode (Micro LED / μLED) display panel 100.

[0087] The display panel 100 includes a substrate 10, which includes a display area AA and a non-display area NA, with the non-display area NA surrounding at least a portion of the display area AA.

[0088] Please continue reading. Figure 3 The display panel 100 provided in this embodiment further includes multiple light-emitting units. These light-emitting units are located on one side of the substrate 10 along its thickness direction, and can be manufactured in batches according to a process flow. For example, the multiple light-emitting units may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, which can emit light of different colors. For example, the first light-emitting unit can emit red light, the second light-emitting unit can emit green light, and the third light-emitting unit can emit blue light.

[0089] It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are sequentially vapor-deposited and patterned. That is, when the display panel 100 provided in this application embodiment is manufactured, the first light-emitting unit can be vapor-deposited and patterned first, the second light-emitting unit can be vapor-deposited and patterned second, and the third light-emitting unit can be vapor-deposited and patterned last.

[0090] In some embodiments, the display panel 100 further includes a pixel defined layer (PDL) 30 and an isolation structure 40. The isolation structure 40 and the pixel defined layer 30 are disposed on the same side of the substrate 10 along the thickness direction, and the isolation structure 40 is disposed on the side of the pixel defined layer 30 facing away from the substrate 10, and the isolation structure 40 encloses to form a plurality of isolation openings. The orthographic projection of the light-emitting unit on the substrate 10 can be located within the orthographic projection of the corresponding isolation opening on the substrate 10. Optionally, the pixel defined layer 30 and the isolation structure 40 can be located in the display area AA. It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned using the isolation structure 40 instead of a photomask. The pixel defined layer 30 has pixel openings located within the isolation openings.

[0091] The multiple isolation openings may include a first isolation opening 401, a second isolation opening 402 and a third isolation opening 403, with the first light-emitting unit corresponding to the first isolation opening 401, the second light-emitting unit corresponding to the second isolation opening 402 and the third light-emitting unit corresponding to the third isolation opening 403.

[0092] The display panel 100 also includes a first electrode 20 layer, a portion of which is located between the pixel definition layer 30 and the substrate 10. The first electrode 20 layer includes a plurality of spaced first electrodes 20, the pixel opening is connected to the isolation opening, the pixel opening exposes a portion of the first electrode 20, and the light-emitting layer 50 can pass through the pixel opening and connect to the first electrode 20.

[0093] It is understood that the first electrode 20 of the light-emitting unit is located on the side of the pixel definition layer 30 facing the substrate 10. The light-emitting unit includes a light-emitting layer 50 and a second electrode 60 located on the side of the light-emitting layer 50 away from the substrate 10. The light-emitting layer 50 and the second electrode 60 of the light-emitting unit are located in the isolation opening, and the light-emitting layer 50 is located between the first electrode 20 and the second electrode 60.

[0094] Optionally, the first electrode 20 can be an anode, and the second electrode 60 can be a cathode.

[0095] It is understood that the light-emitting layer 50 of the first light-emitting unit is the first light-emitting layer 51, the light-emitting layer 50 of the second light-emitting unit is the second light-emitting layer 52, and the light-emitting layer 50 of the third light-emitting unit is the third light-emitting layer 53.

[0096] The display panel 100 provided in this embodiment further includes a first encapsulation layer 70. The first encapsulation layer 70 is disposed on the side of the pixel definition layer 30 facing away from the substrate 10 and is located on the side of the light-emitting unit facing away from the substrate 10. The first encapsulation layer 70 is adjacent to the light-emitting unit. The first encapsulation layer 70 includes a plurality of encapsulation portions, which cover corresponding isolation openings and light-emitting units. In other words, the orthographic projection of the isolation opening on the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion on the substrate 10, and the orthographic projection of the light-emitting unit on the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion on the substrate 10.

[0097] The multiple encapsulation portions may include a first encapsulation portion 71, a second encapsulation portion 72, and a third encapsulation portion 73. The first encapsulation portion 71 corresponds to the first light-emitting unit and is also formed by patterning. The second encapsulation portion 72 corresponds to the second light-emitting unit and is also formed by patterning. The third encapsulation portion 73 corresponds to the third light-emitting unit and is also formed by patterning.

[0098] Optionally, the manufacturing order of the first encapsulation part 71, the second encapsulation part 72, and the third encapsulation part 73 is consistent with the manufacturing order of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit.

[0099] Please refer to the following: Figure 4 , Figure 5 and Figure 6 It is understood that the isolation openings and pixel openings can be fabricated first, followed by the fabrication of the light-emitting unit and the first encapsulation layer 70. Optionally, please refer to... Figure 4 The isolation openings and pixel openings corresponding to light-emitting units of different light-emitting colors are also prepared in different processes (for example, the first isolation opening 401 corresponding to the first light-emitting unit and the second isolation opening 402 corresponding to the second light-emitting unit are prepared in different processes). The first encapsulation layer 70 is usually used to encapsulate the light-emitting unit after it is formed. After encapsulating the light-emitting unit (e.g., the first light-emitting unit) prepared earlier, the first encapsulation layer 70 then prepares the isolation openings (e.g., the second isolation opening 402 and / or the third isolation opening 403) corresponding to the subsequent light-emitting units.

[0100] When preparing the isolation openings corresponding to the subsequent light-emitting units, it is necessary to use an adhesive layer (e.g., photoresist) to cover the already prepared first encapsulation layer 70 (e.g., the first encapsulation part 71) in order to pattern the isolation structure 40 to prepare the isolation openings corresponding to the subsequent light-emitting units.

[0101] It should be noted that, in addition to covering the already prepared first encapsulation layer 70, the adhesive layer also needs to cover the areas of the isolation structure 40 where no isolation openings are required.

[0102] For example, please see Figure 5 After the first encapsulation portion 71 and the second encapsulation portion 72 are prepared, and before the third isolation opening 403 is prepared, the second adhesive layer covers the first encapsulation portion 71 and the isolation structure 40 at the locations where no isolation opening needs to be formed. The first isolation opening 401 and the second isolation opening 402 can be prepared simultaneously. Optionally, the second isolation opening 402 can also be prepared after the first isolation opening 401.

[0103] For example, please see Figure 6 After the first encapsulation part 71 is prepared and before the second isolation opening 402 is prepared, the first adhesive layer covers the encapsulation part and the isolation structure 40 at the position where the isolation opening does not need to be opened.

[0104] For example, after the first encapsulation portion 71 is fabricated, but before the second isolation opening 402 and the third isolation opening 403 are fabricated, the first adhesive layer covers the first encapsulation portion 71 and the isolation structure 40 at locations where isolation openings are not required. The second isolation opening 402 and the third isolation opening 403 can be fabricated simultaneously or sequentially.

[0105] The following explanation will take the example of fabricating the isolation opening and pixel opening first, and then fabricating the light-emitting unit and the first encapsulation layer 70.

[0106] The inventor discovered this; please continue reading. Figure 3 During the fabrication of the first encapsulation layer 70, due to the eaves shape of the isolation structure 40, a closed cavity 7001 is provided inside the first encapsulation layer 70. The cavity 7001 is located on the side of the isolation structure 40 facing the isolation opening. This results in greater stress on the portion of the first encapsulation layer 70 that adheres to the sidewall of the isolation structure 40, making this portion prone to cracking during the fabrication of the display panel 100. This could allow water and oxygen to easily enter the encapsulation part and the isolation structure 40 through this gap during the fabrication process, and subsequently enter the light-emitting unit, causing damage to the light-emitting unit and affecting the light-emitting effect.

[0107] To resolve the above technical issues, please refer to the following: Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 This application provides a display panel 100. In the display panel 100 provided in this application, the first encapsulation layer 70 includes an organic filling portion 7002, which is located in the cavity 7001.

[0108] Through the above technical solution, the display panel 100 provided in this application embodiment uses the organic filling portion 7002 to fill the cavity 7001 closed by the first encapsulation layer 70, which can support the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40. This helps to reduce the stress on the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40, and helps to reduce the risk of breakage of the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40, thereby improving the display effect.

[0109] Therefore, the display panel 100 provided in this application embodiment is beneficial to improving the performance of the display device.

[0110] In some embodiments, the organic filler portion 7002 includes photoresist. Thus, the display panel 100 provided in this application embodiment can utilize photoresist to fabricate the organic filler portion 7002, which is convenient for material sourcing and helps save costs.

[0111] Alternatively, the organic filler portion 7002 may also be a planarization layer.

[0112] Optionally, the organic filler portion 7002 extends circumferentially along the isolation opening. In this way, the organic filler portion 7002 can support multiple locations of the organic encapsulation layer bonding isolation structure 40 along the circumferential direction of the isolation opening.

[0113] In some examples, the organic filler 7002 is annular and extends circumferentially along the isolation opening. In this way, the organic filler 7002 can support various positions of the organic encapsulation layer bonding isolation structure 40 along the circumferential direction of the isolation opening.

[0114] In other examples, there are multiple organic fillers 7002, and the multiple organic fillers 7002 are spaced apart circumferentially along the isolation opening. In this way, the multiple organic fillers 7002 can support multiple locations where the organic encapsulation layer is bonded to the isolation structure 40.

[0115] In some embodiments, please continue reading Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 The first encapsulation layer 70 includes a first encapsulation sublayer 701 and a second encapsulation sublayer 702 arranged sequentially in a direction away from the substrate 10, and a cavity 7001 is formed between the first encapsulation sublayer 701 and the second encapsulation sublayer 702.

[0116] It is understandable that the first encapsulation layer 70 is divided into a first encapsulation sublayer 701 and a second encapsulation sublayer 702. The first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be manufactured separately, which makes it easier to fill the cavity 7002 with the organic filling part 7002, thereby supporting the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40, and thus reducing the stress on the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40.

[0117] Optionally, cavity 7001 is an annular cavity 7001.

[0118] In some embodiments, both the first encapsulation sublayer 701 and the second encapsulation sublayer 702 comprise inorganic materials. Thus, the primary material of the first encapsulation layer 70 is inorganic, which allows for effective encapsulation of the light-emitting unit.

[0119] In some examples, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 are made of different materials. In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can have different etching selectivity ratios, which can reduce the risk of over-etching the first encapsulation layer 70 and improve the encapsulation effect.

[0120] Optionally, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 are made of the same material. In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be patterned together.

[0121] Optionally, the materials of the first encapsulation sublayer 701 and the second encapsulation sublayer 702 include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0122] For example, the material of the first encapsulation sublayer 701 includes one of silicon nitride, silicon oxide, and silicon oxynitride, and the material of the second encapsulation sublayer 702 includes another of silicon nitride, silicon oxide, and silicon oxynitride.

[0123] Please continue reading. Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 In some embodiments, the first encapsulation sublayer 701 includes a first body portion 7011 and a first extension portion 7012. The first body portion 7011 covers at least a portion of the light-emitting unit, and the first extension portion 7012 is connected to the periphery of the first body portion 7011 and is connected to the sidewall of the isolation junction facing the isolation opening.

[0124] Understandably, the first encapsulation sublayer 701 can effectively encapsulate the light-emitting unit, thus avoiding damage to the light-emitting unit during the subsequent fabrication of the organic encapsulation part.

[0125] Optionally, a portion of the first extension 7012 is located on the side of the isolation structure 40 away from the substrate 10. In this way, the first extension 7012 can increase the packaging path of the first packaging sublayer 701, which is beneficial to improving the packaging effect.

[0126] In some embodiments, the second encapsulation sublayer 702 includes a second main body portion 7021 and a second extension portion 7022. The second extension portion 7022 is connected to the periphery of the second main body portion 7021. The second main body portion 7021 is located on the side of the first main body portion 7011 away from the substrate 10. The orthographic projection of the second main body portion 7021 on the substrate 10 is located within the orthographic projection of the first main body portion 7011 on the substrate 10.

[0127] It is understandable that the second encapsulation sublayer 702 and the first encapsulation sublayer 701 jointly encapsulate the light-emitting unit. The second encapsulation sublayer 702 can cover the first encapsulation sublayer 701, and the second encapsulation sublayer 702 can increase the weight of the first encapsulation layer 70 and improve the bonding force between the first encapsulation sublayer 701 and the isolation structure 40, thus improving the encapsulation effect.

[0128] Optionally, the first main body portion 7011, the second main body portion 7021, and the first extension portion 7012 enclose to form a cavity 7001. In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can enclose a closed cavity 7001.

[0129] Optionally, the second extension 7022 is located on the side of the first extension 7012 away from the substrate 10.

[0130] In some embodiments, the isolation structure 40 includes a support portion and an eaves portion sequentially arranged along a direction away from the substrate 10. The orthographic projection of the side of the support portion away from the substrate 10 onto the substrate 10 lies within the orthographic projection of the side of the eaves portion facing the substrate 10 onto the substrate 10. This allows for a step at the connection between the support portion and the eaves portion, which is beneficial for increasing the bonding area between the first encapsulation layer 70 and the isolation structure 40, improving the encapsulation path, and thus enhancing the encapsulation effect. The support portion includes a first support portion and a second support portion sequentially arranged along a direction away from the substrate 10. The orthographic projection of the second support portion onto the substrate 10 lies within the orthographic projection of the first support portion onto the substrate 10, i.e., the first support portion protrudes relative to the second support portion along a direction perpendicular to the thickness of the substrate 10. The material of the first support portion can be Mo or Ti. In some embodiments, the second electrode 60 contacts and is electrically connected to the first support portion.

[0131] The distance between the sidewall of the support portion facing the isolation opening and the center of the isolation opening gradually increases along the direction away from the substrate 10. This increases the lateral area of ​​the support portion, which is beneficial for increasing the bonding area between the first encapsulation layer 70 and the isolation structure 40, and also helps to improve the encapsulation path, thereby improving the encapsulation effect.

[0132] Optionally, the organic filler portion 7002 is located on the side of the eaves facing the substrate 10. In this way, the organic filler portion 7002 can support the portion of the first encapsulation layer 70 that adheres to the sidewall of the isolation structure 40.

[0133] Optionally, the isolation structure 40 also includes a base portion located on the side of the support portion facing the substrate 10, and the orthographic projection of the side of the support portion facing the substrate 10 on the substrate 10 is located within the orthographic projection of the side of the base portion away from the substrate 10 on the substrate 10.

[0134] In some embodiments, the display panel 100 provided in this application further includes a pixel definition layer 30, which is located on one side of the substrate 10. An isolation structure 40 is located on the side of the pixel definition layer 30 facing away from the substrate 10. The pixel definition layer 30 has a plurality of pixel openings, and at least a portion of the light-emitting unit is disposed in the corresponding pixel opening. The pixel openings are connected to each other. This facilitates the fabrication of the light-emitting unit.

[0135] Optionally, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be inorganic encapsulation layers formed by chemical vapor deposition (CVD) and patterning.

[0136] In some embodiments, please refer to Figure 8 The display panel 100 provided in this application embodiment may further include a second encapsulation layer 80, which is located on the side of the first encapsulation layer 70 and the isolation structure 40 away from the substrate 10.

[0137] Optionally, the second encapsulation layer 80 can be an organic encapsulation layer made by inkjet printing (IJP).

[0138] In some embodiments, the display panel 100 provided in this application may further include a third encapsulation layer 90 located on the side of the second encapsulation layer 80 away from the substrate 10.

[0139] Optionally, the third encapsulation layer 90 can be an inorganic encapsulation layer formed by chemical vapor deposition (CVD).

[0140] Optionally, the display panel 100 provided in this embodiment may further include other film layers, which are located on the side of the third encapsulation layer 90 opposite to the substrate 10. These other film layers may include polarizing films, optically clear adhesive (OCA), etc.

[0141] In some embodiments, please continue reading Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 This application embodiment also provides a method for manufacturing a display panel 100, the method comprising:

[0142] S100, provides substrate 10;

[0143] S200, a pixel definition layer 30 and an isolation structure 40 are prepared on one side of the substrate 10;

[0144] S300, the graphical pixel definition layer 30 and the isolation structure 40 form a pixel opening and an isolation opening, and the pixel opening and the isolation opening are connected;

[0145] S400, Prepare a light-emitting unit, at least a portion of which is disposed within a pixel opening;

[0146] S500, a first encapsulation layer 70 is prepared on the side of the light-emitting unit away from the substrate 10;

[0147] The first encapsulation layer 70 is located on the side of the light-emitting unit away from the substrate 10. The first encapsulation layer 70 has a closed cavity 7001 inside. The cavity 7001 is located on the side of the isolation structure 40 facing the isolation opening. The first encapsulation layer 70 includes an organic filling portion 7002, which is located inside the cavity 7001.

[0148] Through the above technical solution, the preparation method provided in this application embodiment can utilize the organic filling portion 7002 to fill the closed cavity 7001 of the first encapsulation layer 70, so that the organic filling portion 7002 can support the portion of the first encapsulation layer 70 that adheres to the sidewall of the isolation structure 40. This helps to reduce the stress on the portion of the first encapsulation layer 70 that adheres to the sidewall of the isolation structure 40, and helps to reduce the risk of breakage of the portion of the first encapsulation layer 70 that adheres to the sidewall of the isolation structure 40, thereby improving the display effect.

[0149] In some embodiments, step S500, preparing the first encapsulation layer 70 on the side of the light-emitting unit away from the substrate 10 includes:

[0150] S510, Prepare a first encapsulation sublayer 701, the first encapsulation sublayer 701 forms a trench 7003 with an opening, the trench 7003 is located on the side of the isolation structure 40 facing the isolation opening;

[0151] S520, an organic layer is prepared on the side of the first encapsulation sublayer 701 that is away from the substrate 10;

[0152] S530, a patterned organic layer forms an organic filling portion 7002, and the organic filling portion 7002 fills the trench 7003;

[0153] S540, a second encapsulation sublayer 702 is prepared on the side of the first encapsulation sublayer 701 away from the substrate 10. The second encapsulation sublayer 702 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001.

[0154] S550, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 are graphically represented to form the first encapsulation layer 70.

[0155] In this way, the method for preparing the display panel 100 provided in this application embodiment can fill the cavity 7001 with the organic filling portion 7002 when preparing the first encapsulation layer 70.

[0156] It is understandable that the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be graphically represented together, or the first encapsulation sublayer 701 can be graphically represented first, and then the second encapsulation sublayer 702 can be graphically represented.

[0157] Optionally, in step S520, when the organic layer is prepared on the side of the first encapsulation sublayer 701 facing away from the substrate 10, the organic layer is prepared by a coating process. In order to ensure that the organic layer can fill the trench 7003, pressure is increased in the coating process so that the organic layer can enter the trench 7003.

[0158] In step S530, the organic layer is patterned, excess organic layer is removed, and the organic filling portion 7002 in the trench 7003 is retained.

[0159] In some embodiments, in step S530, the patterned organic layer forms an organic filling portion 7002, including:

[0160] S531, photolithography or dry etching is performed on the organic layer. This avoids the accumulation of residual chemicals during wet etching.

[0161] Optionally, the organic layer includes photoresist.

[0162] In some embodiments, step S400, fabricating the light-emitting unit includes:

[0163] S410, fabrication of the first light-emitting unit;

[0164] After the first light-emitting unit is fabricated, step S500, which involves fabricating a first encapsulation layer 70 on the side of the light-emitting unit facing away from the substrate 10, includes:

[0165] S501, a first encapsulation portion 71 is prepared on the side of the first light-emitting unit away from the substrate 10. The first encapsulation portion 71 has a cavity 7001 and an organic filling portion 7002 located within the cavity 7001. This helps to reduce the stress on the portion of the first encapsulation portion 71 that is attached to the sidewall of the isolation structure 40, and helps to reduce the risk of breakage of the portion of the first encapsulation portion 71 that is attached to the sidewall of the isolation structure 40, thereby helping to improve the display effect.

[0166] Optionally, in step S501, after fabricating the first encapsulation portion 71 on the side of the first light-emitting unit facing away from the substrate 10, fabricating the light-emitting unit includes:

[0167] S420, fabrication of the second light-emitting unit;

[0168] After fabricating the second light-emitting unit, step S500, fabricating the first encapsulation layer 70 on the side of the light-emitting unit facing away from the substrate 10, includes:

[0169] S502, a second encapsulation portion 72 is prepared on the side of the second light-emitting unit away from the substrate 10. The second encapsulation portion 72 has a cavity 7001 and an organic filling portion 7002 located within the cavity 7001. This helps to reduce the stress on the portion of the second encapsulation portion 72 that is attached to the sidewall of the isolation structure 40, and helps to reduce the risk of breakage of the portion of the second encapsulation portion 72 that is attached to the sidewall of the isolation structure 40, thereby helping to improve the display effect.

[0170] Optionally, in step S502, after fabricating the second encapsulation portion 72 on the side of the second light-emitting unit facing away from the substrate 10, the fabrication of the light-emitting unit includes:

[0171] S430, fabricating the third light-emitting unit;

[0172] After fabricating the third light-emitting unit, step S500, which involves fabricating a first encapsulation layer 70 on the side of the light-emitting unit facing away from the substrate 10, includes:

[0173] S503, a third encapsulation portion 73 is prepared on the side of the third light-emitting unit away from the substrate 10. The third encapsulation portion 73 has a cavity 7001 and an organic filling portion 7002 located within the cavity 7001. This helps to reduce the stress on the portion of the third encapsulation portion 73 that is attached to the sidewall of the isolation structure 40, and helps to reduce the risk of breakage of the portion of the third encapsulation portion 73 that is attached to the sidewall of the isolation structure 40, thereby helping to improve the display effect.

[0174] It is understood that the first encapsulation part 71, the second encapsulation part 72 and the third encapsulation part 73 may each include a portion of the first encapsulation sublayer 701 and a portion of the second encapsulation sublayer 702, wherein the manufacturing processes of the first encapsulation part 71, the second encapsulation part 72 and the third encapsulation part 73 are the same.

[0175] Please see Figure 9 , Figure 10 and Figure 11 After the first encapsulation portion 71 is prepared, the cavity 7001 can be filled by the organic filling portion 7002. The first encapsulation portion 71 also includes a first encapsulation sub-portion 711 and a second encapsulation sub-portion 712 arranged sequentially in a direction away from the substrate 10, and a cavity 7001 is formed between the first encapsulation sub-portion 711 and the second encapsulation sub-portion 712. The first encapsulation sub-layer 701 includes the first encapsulation sub-portion 711, and the second encapsulation sub-layer 702 includes the second encapsulation sub-portion 712.

[0176] Optionally, in step S501, a first encapsulation portion 71 is formed on the side of the first light-emitting unit facing away from the substrate 10, including:

[0177] S5011, Prepare a first package sub-part 711, the first package sub-part 711 forms a trench 7003 with an opening, the trench 7003 is located on the side of the isolation structure 40 facing the isolation opening;

[0178] S5012, an organic layer is prepared on the side of the first package sub-part 711 away from the substrate 10;

[0179] S5013, a patterned organic layer forms an organic filling portion 7002, and the organic filling portion 7002 fills the trench 7003;

[0180] S5014, a second package sub-part 712 is prepared on the side of the first package sub-part 711 away from the substrate 10, and the second package sub-part 712 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001.

[0181] S5015, the first package sub-part 711 and the second package sub-part 712 are graphically represented to form the first package part 71.

[0182] It is understandable that the first package sub-part 711 and the second package sub-part 712 can be graphically represented together, or the first package sub-part 711 can be graphically represented first, and then the second package sub-part 712 can be graphically represented.

[0183] Please see Figure 12 , Figure 13 and Figure 14 After the second encapsulation portion 72 is prepared, the cavity 7001 can be filled by the organic filling portion 7002. The second encapsulation portion 72 also includes a third encapsulation sub-portion 721 and a fourth encapsulation sub-portion 722 arranged sequentially in a direction away from the substrate 10, and a cavity 7001 is formed between the third encapsulation sub-portion 721 and the fourth encapsulation sub-portion 722. The first encapsulation sub-layer 701 includes the third encapsulation sub-portion 721, and the second encapsulation sub-layer 702 includes the fourth encapsulation sub-portion 722.

[0184] Optionally, in step S502, a second encapsulation portion 72 is formed on the side of the second light-emitting unit facing away from the substrate 10, including:

[0185] S5021, Prepare a third encapsulation sub-part 721, the third encapsulation sub-part 721 forms a trench 7003 with an opening, the trench 7003 is located on the side of the isolation structure 40 facing the isolation opening;

[0186] S5022, An organic layer is prepared on the side of the third package sub-part 721 that is away from the substrate 10;

[0187] S5023, a patterned organic layer forms an organic filling portion 7002, and the organic filling portion 7002 fills the trench 7003;

[0188] S5024, a fourth package sub-part 722 is prepared on the side of the third package sub-part 721 away from the substrate 10, and the fourth package sub-part 722 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001.

[0189] S5025, the third package sub-section 721 and the fourth package sub-section 722 are graphically represented to form the second package section 72.

[0190] It is understandable that the third package sub-section 721 and the fourth package sub-section 722 can be graphically represented together, or the third package sub-section 721 can be graphically represented first, and then the fourth package sub-section 722 can be graphically represented.

[0191] Please see Figure 7 , Figure 15 and Figure 16 After the third encapsulation portion 73 is prepared, the cavity 7001 can be filled by the organic filling portion 7002. The third encapsulation portion 73 also includes a fifth encapsulation sub-portion 731 and a sixth encapsulation sub-portion 732 arranged sequentially in a direction away from the substrate 10, and a cavity 7001 is formed between the fifth encapsulation sub-portion 731 and the sixth encapsulation sub-portion 732. The first encapsulation sub-layer 701 includes the fifth encapsulation sub-portion 731, and the second encapsulation sub-layer 702 includes the sixth encapsulation sub-portion 732.

[0192] Optionally, in step S503, a third encapsulation portion 73 is formed on the side of the third light-emitting unit facing away from the substrate 10, including:

[0193] S5031, Prepare the fifth package sub-part 731, the fifth package sub-part 731 forms a trench 7003 with an opening, the trench 7003 is located on the side of the isolation structure 40 facing the isolation opening;

[0194] S5032, an organic layer is prepared on the side of the fifth package sub-part 731 facing away from the substrate 10;

[0195] S5033, a patterned organic layer forms an organic filling portion 7002, and the organic filling portion 7002 fills the trench 7003;

[0196] S5034, a sixth package sub-part 732 is prepared on the side of the fifth package sub-part 731 away from the substrate 10. The sixth package sub-part 732 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001.

[0197] S5035, the fifth package sub-section 731 and the sixth package sub-section 732 are graphically represented to form the third package section 73.

[0198] It is understandable that the fifth package sub-section 731 and the sixth package sub-section 732 can be graphically represented together, or the fifth package sub-section 731 can be graphically represented first, and then the sixth package sub-section 732 can be graphically represented.

[0199] In some embodiments, this application provides a display device, which includes the display panel 100 of any of the above embodiments or the display panel 100 prepared by the preparation method of any of the above embodiments.

[0200] Optionally, the display device can be a mobile phone, television, tablet computer, laptop computer, desktop computer, in-vehicle display terminal, wearable device, advertising display device, or other products.

[0201] The display device provided in this application has the same or similar technical effects as the display panel 100 of any of the above embodiments or the preparation method of any of the above embodiments, and will not be described again here.

[0202] The above are merely specific embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings; Multiple light-emitting units, at least a portion of the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate; A first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The first encapsulation layer has a closed cavity inside, which is located on the side of the isolation structure facing the isolation opening. The first encapsulation layer includes an organic filling portion, which is located inside the cavity. Along the direction of the isolation structure toward the isolation opening, the size of the organic filling portion first decreases and then increases in the direction perpendicular to the substrate; The isolation structure includes a support portion and an eaves portion arranged sequentially in a direction away from the substrate. The orthographic projection of the side of the support portion away from the substrate on the substrate is located within the orthographic projection of the side of the eaves portion facing the substrate on the substrate. The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer disposed sequentially along a direction away from the substrate, and the cavity is formed between the first encapsulation sublayer and the second encapsulation sublayer; The first encapsulation sublayer includes a first main body and a first extension. The first main body covers at least a portion of the light-emitting unit, and the first extension is connected to the periphery of the first main body and to the sidewall of the isolation structure facing the isolation opening. The orthographic projection of the eaves onto the substrate toward the edge of the isolation opening is located within the orthographic projection of the organic filling portion onto the substrate; The orthographic projection of the portion of the first extension located on the side of the eaves facing the isolation opening on the substrate is within the orthographic projection of the organic filler portion on the substrate.

2. The display panel as described in claim 1, characterized in that, The organic filler portion includes photoresist.

3. The display panel as described in claim 1, characterized in that, The organic filler portion is annular and extends circumferentially along the isolation opening; Alternatively, there may be multiple organic filling portions, spaced circumferentially along the isolation opening.

4. The display panel as described in claim 1, characterized in that, Both the first and second encapsulation sublayers comprise inorganic materials.

5. The display panel as described in claim 4, characterized in that, The materials of the first and second encapsulation sublayers include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

6. The display panel as described in claim 1, characterized in that, The second encapsulation sublayer includes a second main body portion and a second extension portion. The second extension portion is connected to the periphery of the second main body portion. The second main body portion is located on the side of the first main body portion away from the substrate. The orthographic projection of the second main body portion on the substrate is located within the orthographic projection of the first main body portion on the substrate.

7. The display panel as described in claim 6, characterized in that, The first main body portion, the second main body portion, and the first extension portion enclose and form the cavity; And / or, the second extension is located on the side of the first extension away from the substrate.

8. The display panel as described in any one of claims 1 to 7, characterized in that, The distance between the sidewall of the support portion facing the isolation opening and the center of the isolation opening gradually increases in the direction away from the substrate.

9. The display panel as described in claim 8, characterized in that, The organic filler portion is located on the side of the eaves facing the substrate.

10. A method for manufacturing a display panel, characterized in that, The preparation method includes: Provide substrate; A pixel definition layer and an isolation structure are fabricated on one side of the substrate; The pixel definition layer and the isolation structure are graphically represented to form pixel openings and isolation openings, and the pixel openings are connected to the isolation openings; A light-emitting unit is prepared, wherein at least a portion of the light-emitting unit is disposed within the pixel opening; A first encapsulation layer is prepared on the side of the light-emitting unit that is away from the substrate; The first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The first encapsulation layer has a closed cavity inside, which is located on the side of the isolation structure facing the isolation opening. The first encapsulation layer includes an organic filling portion, which is located inside the cavity. Along the direction of the isolation structure toward the isolation opening, the size of the organic filling portion first decreases and then increases in the direction perpendicular to the substrate; The isolation structure includes a support portion and an eaves portion arranged sequentially in a direction away from the substrate. The orthographic projection of the side of the support portion away from the substrate on the substrate is located within the orthographic projection of the side of the eaves portion facing the substrate on the substrate. The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer disposed sequentially along a direction away from the substrate, and the cavity is formed between the first encapsulation sublayer and the second encapsulation sublayer; The first encapsulation sublayer includes a first main body and a first extension. The first main body covers at least a portion of the light-emitting unit, and the first extension is connected to the periphery of the first main body and to the sidewall of the isolation structure facing the isolation opening. The orthographic projection of the eaves onto the substrate toward the edge of the isolation opening is located within the orthographic projection of the organic filling portion onto the substrate; The orthographic projection of the portion of the first extension located on the side of the eaves facing the isolation opening on the substrate is within the orthographic projection of the organic filler portion on the substrate.

11. The preparation method according to claim 10, characterized in that, The process of fabricating a first encapsulation layer on the side of the light-emitting unit away from the substrate includes: A first encapsulation sublayer is prepared, wherein the first encapsulation sublayer forms a trench with an opening, the trench being located on the side of the isolation structure facing the isolation opening; An organic layer is prepared on the side of the first encapsulation sublayer facing away from the substrate; The organic layer is graphically formed to create an organic filler portion, which fills the trench. A second encapsulation sublayer is prepared on the side of the first encapsulation sublayer facing away from the substrate. The second encapsulation sublayer blocks the opening of the trench, so that the trench forms a closed cavity. The first encapsulation sublayer and the second encapsulation sublayer are graphically represented to form the first encapsulation layer.

12. The preparation method according to claim 11, characterized in that, The patterning of the organic layer to form an organic filling portion includes: The organic layer is subjected to photolithography or dry etching.

13. The preparation method according to any one of claims 10 to 12, characterized in that, The preparation of the light-emitting unit includes: Fabrication of the first light-emitting unit; After fabricating the first light-emitting unit, fabricating the first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes: A first encapsulation portion is prepared on the side of the first light-emitting unit away from the substrate, the first encapsulation portion having the cavity and the organic filling portion located within the cavity.

14. The preparation method according to claim 13, characterized in that, After fabricating the first encapsulation portion on the side of the first light-emitting unit facing away from the substrate, the fabrication of the light-emitting unit includes: Fabrication of a second light-emitting unit; After fabricating the second light-emitting unit, fabricating the first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes: A second encapsulation portion is prepared on the side of the second light-emitting unit away from the substrate, the second encapsulation portion having the cavity and the organic filling portion located within the cavity.

15. The preparation method according to claim 14, characterized in that, After fabricating the second encapsulation portion on the side of the second light-emitting unit facing away from the substrate, the fabrication of the light-emitting unit includes: Fabrication of the third light-emitting unit; After the fabrication of the third light-emitting unit, the fabrication of the first encapsulation layer on the side of the light-emitting unit facing away from the substrate includes: A third encapsulation portion is prepared on the side of the third light-emitting unit away from the substrate, the third encapsulation portion having the cavity and the organic filling portion located within the cavity.

16. A display device, characterized in that, The display panel includes the display panel according to any one of claims 1 to 9 or the display panel prepared by the preparation method according to any one of claims 10 to 15.

Images