Indoor temperature control method and device, electronic equipment and storage medium
By combining liquid metal phase change materials and semiconductor refrigeration devices, the problems of low temperature control accuracy and slow response speed of air-conditioning systems are solved, and high-precision and fast temperature control effects are achieved, which is suitable for scenarios such as semiconductor manufacturing and biological sample storage.
Patent Information
- Application Number
- CN202510775656.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-11
- Publication Date
- 2025-09-09
AI Technical Summary
The temperature control accuracy of existing air-conditioning systems is low and cannot meet the needs of high-precision temperature control. They have slow response speeds and high energy consumption, making it difficult to achieve dynamic adjustment in seconds, especially in scenarios such as semiconductor manufacturing and biological sample storage.
Liquid metal phase change material is combined with a semiconductor refrigeration device. By adjusting the power of the heating and cooling module and the phase change of the liquid metal phase change material, precise temperature control is achieved using a PID controller and a phase prediction model. The temperature control accuracy and response speed are improved by combining a porous thermal conductive skeleton and a packaging layer.
The accuracy of the target space temperature has been improved to within ±0.3°C, the response time has been shortened to less than 20s, and the energy efficiency ratio has been increased to above 4, covering the needs of all scenarios such as semiconductor manufacturing and biological sample storage.
Smart Images
Figure CN120609138A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of temperature control technology, and in particular to an indoor temperature control method, device, electronic equipment and storage medium. Background Art
[0002] Existing air conditioning systems mostly use compressor refrigeration systems, relying on the refrigerant's gas-liquid phase change cycle to transfer heat. Their temperature control accuracy is typically limited to ±0.5°C or better, and they suffer from slow response, high energy consumption, and temperature overshoot. Existing technologies struggle to meet the precise temperature control requirements of ±0.3°C, particularly in scenarios like semiconductor manufacturing and biological sample storage.
[0003] Existing air-conditioning systems have the following core defects. (1) Nonlinear control with limited precision. Experiments show that when a semiconductor etching chamber generates an instantaneous heat load of 3-5kW due to plasma reaction, the existing air-conditioning system takes at least 120 seconds to suppress the temperature fluctuation to within ±0.5℃, and is accompanied by an overshoot of ±0.8℃, which is far from meeting the process requirement of ±0.3℃. (2) Response delay caused by mechanical inertia: The compressor is limited by the mechanical structure characteristics, and the start-stop cycle is as long as several minutes, which cannot achieve dynamic adjustment in seconds. For example, in a biological sample library, the heat shock introduced by frequent door opening operations requires the system to complete compensation within 10 seconds, while the traditional solution causes the sample area temperature to fluctuate by more than ±1.5℃ due to the delay.
[0004] In summary, the temperature control accuracy of existing air-conditioning systems is low and cannot meet the needs of the field of high-precision temperature control. Summary of the Invention
[0005] The present invention provides an indoor temperature control method, device, electronic device and storage medium, which are used to solve the defect of low temperature control accuracy of air-conditioning systems in the prior art and improve the temperature control accuracy of air-conditioning systems.
[0006] The present invention provides an indoor temperature control method, comprising: regulating the power of a heating-cooling module of a target space so that the detected temperature of the target space approaches a set temperature, obtaining the detected temperature and a target error between the detected temperature and the set temperature; when the target error reaches the set error, triggering a phase change of a liquid metal phase change material, obtaining compensation temperature information generated by the phase change; and regulating the power of the heating-cooling module based on the compensation temperature information and the target error until the target error is less than the set error.
[0007] According to the indoor temperature control method provided by the present invention, the power of the heating-cooling module is adjusted, including: adjusting the power of the heating-cooling module based on a PID controller; adjusting the power of the heating-cooling module based on compensated temperature information and a target error until the target error is less than a set error, including: adjusting the parameters of the PID controller based on a preset adjustment information library, the compensated temperature information, the target error, and the rate of change of the target error to obtain an adjusted PID controller, the parameters of the PID controller including a control factor of the target error, a control factor of the target error integral, and a control factor of the target error differential; and adjusting the power of the heating-cooling module based on the adjusted PID controller until the target error is less than the set error.
[0008] According to the indoor temperature control method provided by the present invention, the compensation temperature information includes the compensation temperature difference of the target space at different times due to the phase change of the liquid metal phase change material, and obtaining the compensation temperature information generated by the phase change includes: obtaining the temperature of the liquid metal phase change material at the current moment based on the temperature sensor, and obtaining the conductivity of the liquid metal phase change material at the current moment based on the electrical impedance analyzer; inputting the temperature of the liquid metal phase change material and the conductivity of the liquid metal phase change material into the phase prediction model, and obtaining the compensation temperature difference output by the phase prediction model at different future times; wherein the phase prediction model is based on a preset model and is trained based on the sample temperature of the sample liquid metal phase change material at different times, the sample conductivity at different times, and the sample compensation temperature difference at different times when the sample liquid metal phase change material undergoes phase change.
[0009] According to the indoor temperature control method provided by the present invention, the heating-cooling module includes a semiconductor heating-cooling device.
[0010] According to the indoor temperature control method provided by the present invention, the liquid metal phase change material includes a gallium-zinc alloy or a tin-bismuth alloy manufactured according to a preset ratio.
[0011] The present invention also provides an indoor temperature control device, including: a temperature control module, used to adjust the power of the heating-cooling module of the target space so that the detected temperature of the target space is close to the set temperature, and obtain the detected temperature and the target error between the detected temperature and the set temperature; a liquid metal phase change module, used to trigger the liquid metal phase change material to undergo phase change when the target error is greater than the set error; the temperature control module is also used to obtain the compensation temperature information generated by the phase change; the temperature control module is also used to adjust the power of the heating-cooling module based on the compensation temperature information and the target error until the target error is less than the set error.
[0012] According to the indoor temperature control device provided by the present invention, the liquid metal phase change module is connected to the heating-cooling module through an air delivery pipe. The liquid metal phase change module includes a porous heat-conducting skeleton, and the porous heat-conducting skeleton includes a plurality of first through holes and a plurality of second through holes: the heating-cooling module is used to heat or cool the gas in the air delivery pipe, and transmit the gas to the target space based on the second through holes to make the detected temperature close to the set temperature; the first through holes are filled with liquid metal phase change material to heat or cool the gas based on the phase change of the liquid metal phase change material to regulate the temperature of the target space and form compensated temperature information.
[0013] According to the indoor temperature control device provided by the present invention, the porous heat-conducting skeleton further includes a packaging layer: the packaging layer is used to seal the liquid metal phase change material.
[0014] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, any of the indoor temperature control methods described above is implemented.
[0015] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, any of the indoor temperature control methods described above is implemented.
[0016] The present invention also provides a computer program product, comprising a computer program, which implements any of the above-mentioned indoor temperature control methods when executed by a processor.
[0017] The indoor temperature control method, device, electronic device, and storage medium provided by this invention achieve preliminary control of the target space's detected temperature within a set temperature range by adjusting the power of the heating and cooling module. Through the phase transition of the liquid metal phase-change material, heat absorption or heat release occurs, further fine-tuning the target space's detected temperature is achieved, ensuring that the target error is less than the set error, thereby improving the temperature control accuracy of the target space. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0019] Figure 1 It is a flow chart of the indoor temperature control method provided by the present invention.
[0020] Figure 2 It is a structural schematic diagram of the indoor temperature control device provided by the present invention.
[0021] Figure 3 It is a structural schematic diagram of the liquid metal phase change module provided by the present invention.
[0022] Figure 4 It is a structural schematic diagram of the electronic device provided by the present invention.
[0023] Reference numerals: 10: Liquid metal phase change module; 20: Heating-cooling module; 30: Temperature control module; 40: Primary temperature sensor; 50: Secondary temperature sensor; 60: Electrical impedance analyzer; 70: Target space; 11: Porous thermal conductive skeleton; 12: Encapsulation layer; 13: Liquid metal phase change material; 14: Second through hole. DETAILED DESCRIPTION
[0024] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0025] The following combination Figure 1-Figure 4 The indoor temperature control method, device and electronic equipment of the present invention are described.
[0026] Figure 1 It is a flow chart of the indoor temperature control method provided by the present invention, such as Figure 1 As shown, the indoor temperature control method includes steps S100 to S300, and each step is specifically described as follows.
[0027] S100: regulating the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, and obtaining the detected temperature and a target error between the detected temperature and the set temperature.
[0028] The execution subject of the present invention is an indoor temperature control device, which includes a temperature control module 30 and a liquid metal phase change module 10. Figure 2 As shown in the figure, the target space is equipped with a temperature sensor (primary temperature sensor 40) for real-time detection of the target space's temperature 70. Target space 70 is the space to be temperature-controlled. The heating / cooling module controls the target space's temperature by delivering hot or cold air to the target space. The target space's temperature sensor detects the target space's temperature in real time and calculates the target error between the target space's detected temperature and the set temperature, as well as the rate of change of the target error. The temperature control module regulates the rate of temperature increase or decrease in the target space by adjusting the power of the heating / cooling module.
[0029] The temperature control module 30 is also equipped with a PID controller, which regulates the temperature of the target space so that the temperature of the target space approaches the set temperature. For example, if the set temperature is 25°C, the detected temperature of the target space at the current moment (for example, 35°C), the target error at the current moment, and the rate of change of the target error at the current moment are obtained. The detected temperature at the current moment, the target error at the current moment, and the rate of change of the target error at the current moment are input into the PID controller to obtain the detected temperature at the next moment. The detected temperature at the next moment is compared with the detected temperature at the current moment. Based on the comparison result, the power of the heating-cooling module 20 is adjusted so that the detected temperature of the target space approaches the set temperature (for example, the detected temperature of the target space is regulated to 25±0.5°C).
[0030] S200: When the target error reaches the set error, the liquid metal phase change material is triggered to undergo a phase change, and compensation temperature information generated by the phase change is obtained.
[0031] The liquid metal phase change module 10 is provided with a liquid metal phase change material 13. The set temperature includes the melting point of the liquid metal phase change material. For example, if the set temperature is 25°C, the melting point of the liquid metal phase change material is 25°C. The set temperature tolerance is the phase change trigger threshold of the liquid metal phase change material. For example, if the set tolerance is ±0.2°C, the phase change trigger threshold of the liquid metal phase change material is 25±0.2°C.
[0032] When the temperature reaches the phase change trigger threshold of the liquid metal phase change material, the liquid metal phase change material undergoes a phase change, absorbing or releasing heat (for example, the liquid metal phase change material absorbs heat when melting and releases heat when solidifying), thereby cooling the hot air delivered to the target space by the heating-cooling module, or heating the cold air delivered to the target space by the heating-cooling module, thereby forming compensation temperature information for the target space. The compensation temperature information is used to finely control the temperature of the target space. The liquid metal phase change material of the present invention does not volatilize or phase separate during the phase change process, and the latent heat decay after 10,000 cycles is less than 2%. At the same time, by adjusting the ratio of the liquid metal phase change material, the phase change temperature can be precisely controlled to 25±0.2°C, which can be applied to semiconductor manufacturing (-50°C~150°C).
[0033] S300: Based on the compensated temperature information and the target error, adjust the power of the heating-cooling module until the target error is less than the set error.
[0034] The liquid metal phase change material undergoes a phase change, generating compensation temperature information. The target error of the detected temperature relative to the set temperature in the target space is monitored. Combining the target error and compensation temperature information, the power of the heating and cooling module is adjusted until the target error of the detected temperature relative to the set temperature is less than the set error or reaches zero.
[0035] The indoor temperature control method provided by the present invention achieves a preliminary control of the target space's detected temperature within a set temperature range by adjusting the power of the heating and cooling module. The phase transition of the liquid metal phase-change material, which absorbs or releases heat, further finely controls the target space's detected temperature, ensuring that the target error is less than the set error, thereby improving the temperature control accuracy of the target space.
[0036] Based on the above embodiment, adjusting the power of the heating-cooling module includes the following steps: The power of the heating and cooling module is adjusted based on the PID controller; Based on the compensated temperature information and the target error, the power of the heating-cooling module is adjusted until the target error is less than the set error, including the following steps: According to a preset adjustment information library, based on the compensation temperature information, the target error and the rate of change of the target error, the parameters of the PID controller are adjusted to obtain an adjusted PID controller, the parameters of the PID controller including a control factor of the target error, a control factor of the target error integral and a control factor of the target error differential; Based on the adjusted PID controller, the power of the heating-cooling module is adjusted until the target error is less than the set error.
[0037] The compensation temperature information represents the deviation of the predicted temperature of the target space in the future time period. In the process of adjusting the power of the heating-cooling module based on the PID controller, the adjustment amount of the PID controller parameters (including the adjustment amount of the control factor of the target error) is dynamically calculated based on the preset adjustment information library, the compensation temperature information (compensated temperature difference) at different moments in the future, the target error at different moments, and the rate of change of the target error at different moments. , the adjustment amount of the control factor of the integral of the target error , and the adjustment amount of the control factor of the differential of the target error ). According to the adjustment amount of the parameters of the PID controller, the parameters of the PID controller are dynamically adjusted to obtain an adjusted PID controller.
[0038] ; in, is the temperature control value of the target space, is the target error, is the integral of the target error, is the differential of the target error, is the control factor of the adjusted target error, is the control factor of the integral of the adjusted target error, is the control factor of the differential of the adjusted target error, is the control factor of the integral of the target error before adjustment, is the control factor of the integral of the target error before adjustment, is the control factor of the differential of the target error before adjustment, is the adjustment amount of the control factor of the target error, is the adjustment amount of the control factor of the integral of the target error, The adjustment amount of the control factor is the differential of the target error.
[0039] The present invention dynamically adjusts the parameters of the PID controller by compensating temperature information, thereby integrating the compensated temperature information with the regulation of the target space temperature by the heating-cooling module, and improving the accuracy of the power regulation of the heating-cooling module based on the PID controller.
[0040] Based on the above embodiment, the compensation temperature information includes the compensation temperature difference of the target space at different times caused by the phase change of the liquid metal phase change material. Acquiring the compensation temperature information generated by the phase change includes the following steps: The temperature of the liquid metal phase change material at the current moment is obtained based on the temperature sensor, and the conductivity of the liquid metal phase change material at the current moment is obtained based on the electrical impedance analyzer; The temperature and electrical conductivity of the liquid metal phase change material are input into a phase prediction model to obtain the compensated temperature difference at different future moments output by the phase prediction model; wherein, the phase prediction model is trained based on a preset model based on the sample temperature of the sample liquid metal phase change material at different moments, the sample electrical conductivity at different moments, and the compensated temperature difference of the sample at different moments when the sample liquid metal phase change material undergoes phase change.
[0041] The indoor temperature control device also includes a secondary temperature sensor 50 (e.g., a distributed optical fiber sensor) and an electrical impedance analyzer 60. The secondary temperature sensor is used to monitor the temperature of the liquid metal phase change material in real time, and the electrical impedance analyzer is used to monitor the electrical conductivity of the liquid metal phase change material in real time (the liquid phase ratio of the liquid metal phase change material can be derived from the electrical conductivity).
[0042] The temperature of the liquid metal phase change material and the electrical conductivity of the liquid metal phase change material are input into the phase prediction model to obtain the compensated temperature difference at different future moments output by the phase prediction model.
[0043] The phase prediction model is obtained by training based on the preset model and the sample temperature, sample conductivity and sample compensation temperature difference of the sample liquid metal phase change material at different times when the sample liquid metal phase change material undergoes phase change.
[0044] This invention uses a pre-built phase prediction model to obtain the compensated temperature difference at different moments in the future, improving the efficiency of obtaining compensated temperature information and also improving the efficiency of indoor temperature control. Furthermore, based on the temperature and conductivity of the liquid metal phase-change material, the phase change process and heat absorption / exothermic behavior of the liquid metal phase-change material can be accurately deduced, enabling accurate derivation of the compensated temperature difference at different moments in the future.
[0045] Based on the above embodiment, the heating-cooling module includes a semiconductor heating-cooling device.
[0046] Compared to compressor-based temperature control, thermal electric cooler (TEC) devices can achieve rapid temperature control, significantly reducing the response time of the indoor temperature control module. For example, while compressor-based control typically requires a 120-second response time, TEC-based control takes only 20 seconds under the same circumstances.
[0047] Based on the above embodiment, the liquid metal phase change material includes a gallium-zinc alloy or a tin-bismuth alloy manufactured according to a preset ratio.
[0048] The liquid metal phase-change material of the present invention includes binary or multi-component alloys of gallium, indium, tin, bismuth, lead, zinc, aluminum, antimony, and the like. By adjusting the component ratios, the phase-change temperature can be precisely controlled within the range of 8°C to 200°C. Preferably, the liquid metal phase-change material includes gallium-based, bismuth-based, or indium-based alloys and composite materials thereof. The liquid metal phase-change material has a phase-change latent heat of 30 to 200 J / g, a volume latent heat of 250 J / cm³ to 500 J / cm³, and a thermal conductivity of ≥10 W / m·K.
[0049] Gallium-zinc alloys include an alloy with a gallium content of 96% and a zinc content of 4% (Ga96Zn4 alloy), with a preset ratio of 96 (gallium content):4 (zinc content). Its melting point is 25°C, the latent heat of phase change of Ga96Zn4 alloy is 85 J / g (516 J / cm³), and the thermal conductivity of Ga96Zn4 alloy is 27.3 W / m·K. The latent heat decay of Ga96Zn4 alloy after 10,000 cycles is less than 2%.
[0050] Tin-bismuth alloys include an alloy with a 42% tin content and a 58% bismuth content (Sn42Bi58 alloy), with a preset ratio of 42 (tin content): 58 (bismuth content). The melting point of Sn42Bi58 alloy is 138°C, the latent heat of phase change is 48.5 J / g (410 J / cm³), and the thermal conductivity is 26.5 W / m·K. The latent heat decay of Sn42Bi58 alloy is less than 2% after 10,000 cycles.
[0051] The gallium-zinc alloy or tin-bismuth alloy produced according to the preset ratio in the present invention can achieve precise control of the phase transition temperature within the range of 8°C-200°C.
[0052] Different liquid metal phase change materials and heating-cooling modules (including TEC devices and compressors) were selected to carry out indoor temperature control experiments. The specific experimental results are shown in Table 1.
[0053] Table 1
[0054] The first temperature control response time is the time it takes to adjust the power of the heating and cooling module in step S100 to bring the detected temperature of the target space closer to the set temperature. For example, if the first temperature control response time is 20 seconds to adjust to 25°C ± 0.5°C, this means that the detected temperature of the target space is adjusted to 25°C ± 0.5°C within 20 seconds. In this case, the target error is ± 0.5°C.
[0055] The second temperature control response time is the time it takes to adjust the power of the heating and cooling module in step S300, based on the compensated temperature information and the target error, until the target error is less than the set error. For example, if the second control response time is 10 seconds to adjust to 25°C ± 0.1°C, this means that within 10 seconds, the detected temperature of the target space is further adjusted to 25°C ± 0.1°C. At this time, the target error is ± 0.1°C.
[0056] According to the comparison of Experiments 1, 2, 3, and 4, the use of TEC devices + liquid metal phase change materials for indoor temperature control can significantly reduce the first temperature control response time and the second temperature control response time. At the same time, it also improves the accuracy of temperature control (reduces the target error).
[0057] The indoor temperature control device provided by the present invention is described below. The indoor temperature control device described below and the indoor temperature control method described above can be referenced to each other.
[0058] like Figure 2 As shown, an indoor temperature control device includes a temperature control module 30 and a liquid metal phase change module 10.
[0059] The temperature control module 30 is used to regulate the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, and obtain the detected temperature and the target error between the detected temperature and the set temperature.
[0060] The liquid metal phase change module 10 is used to trigger the phase change of the liquid metal phase change material when the target error is greater than the set error.
[0061] The temperature control module 30 is also used to obtain compensation temperature information generated by phase change.
[0062] The temperature control module 30 is further configured to adjust the power of the heating-cooling module based on the compensated temperature information and the target error until the target error is less than the set error.
[0063] The indoor temperature control device provided by the present invention achieves preliminary control of the target space's detected temperature within a set temperature range by adjusting the power of the heating and cooling module. The phase transition of the liquid metal phase-change material, which absorbs or releases heat, further finely controls the target space's detected temperature, ensuring that the target error is less than the set error, thereby improving the temperature control accuracy of the target space.
[0064] Based on the above embodiment, the liquid metal phase change module is connected to the heating-cooling module through the air delivery pipe. The liquid metal phase change module includes a porous heat-conducting skeleton, and the porous heat-conducting skeleton includes a plurality of first through holes and a plurality of second through holes.
[0065] The heating-cooling module is used to heat or cool the gas in the air delivery pipe and transmit the gas to the target space based on the second through hole so that the detected temperature approaches the set temperature.
[0066] The first through hole is filled with a liquid metal phase change material to heat or cool the gas based on the phase change of the liquid metal phase change material, so as to regulate the temperature of the target space and form compensated temperature information.
[0067] The porous heat-conducting skeleton 11 includes a plurality of first through holes and a plurality of second through holes 14. For example, the porous heat-conducting skeleton is made of copper, has a honeycomb shape, and has a porosity of 85%.
[0068] like Figure 2 and Figure 3 As shown, the heating-cooling module is provided with an air delivery pipe (e.g., a micro heat pipe). The heating-cooling module heats or cools the air in the air delivery pipe and transmits the heated or cooled air to the target space through the second through hole 14 (heat exchange air duct), thereby bringing the detected temperature closer to the set temperature.
[0069] The first through hole is filled with liquid metal phase change material to heat or cool the gas in the heat exchange channel based on the phase change of the liquid metal phase change material, thereby controlling the temperature of the target space and forming compensated temperature information.
[0070] The target space is equipped with a temperature sensor (a primary temperature sensor), while the liquid metal phase change module is equipped with a secondary temperature sensor and an electrical impedance analyzer. The temperature control module features a PID controller and a phase change prediction model. The temperature control module receives the detected temperature from the primary temperature sensor and, in conjunction with the PID controller, adjusts the target space's detected temperature toward the set point.
[0071] When the target error reaches the set error, the liquid metal phase change material in the liquid metal phase change module begins to undergo a phase change and release or absorb heat. The temperature and conductivity of the liquid metal phase change material are collected using a secondary temperature sensor and an electrical impedance analyzer. The temperature control module receives these data and, based on the phase change prediction model, calculates the compensation temperature difference of the target space at different future times. The PID controller parameters are dynamically adjusted based on this compensation temperature difference, the real-time detected temperature, the target error, and the rate of change of the target error. Using the adjusted PID controller, the temperature of the target space is further regulated to approach the set temperature.
[0072] The present invention realizes the fusion of the temperature adjustment of the heating-cooling module and the temperature adjustment of the liquid metal phase change module through the first through hole and the second through hole of the porous heat-conducting skeleton, which is beneficial to improving the accuracy of indoor temperature control.
[0073] Based on the above embodiment, the porous thermally conductive skeleton further includes a packaging layer: the packaging layer is used to seal the liquid metal phase change material.
[0074] The encapsulation layer 12 includes a microcapsule encapsulation layer. For example, the microcapsule encapsulation layer is made of polyimide and is a thin film that wraps the liquid metal phase change material to prevent the liquid metal phase change material from being oxidized, thereby increasing the service life of the liquid metal phase change material.
[0075] The beneficial effects of the present invention are as follows.
[0076] a. A multimodal thermal management architecture addresses the long response time and low energy efficiency of traditional temperature control systems. By integrating a porous thermally conductive skeleton (e.g., copper / aluminum) with a microchannel packaging technology and a semiconductor refrigeration (TEC) device, the rapid latent heat absorption of liquid metal phase change materials (LMPMs) is leveraged to buffer transient heat loads. Combined with the TEC's mechanically component-free rapid temperature control, the response time of the indoor temperature control device is significantly reduced. The LMPMs, by storing excess cooling / heating capacity, reduce the frequency of heating and cooling module startups and shutdowns, boosting the indoor temperature control device's energy efficiency (COP) to above 4.
[0077] b. This invention addresses the poor temperature control accuracy of traditional temperature control systems by leveraging real-time phase change state monitoring data from liquid metal phase change materials (such as temperature gradient and conductivity). This algorithm utilizes a dual-loop monitoring feedback algorithm combined with fuzzy PID control and a phase state prediction model. By synergizing the passive heat absorption and release of the liquid metal phase change material with the active temperature control of the heating and cooling modules, high-precision temperature control is achieved, keeping temperature fluctuations within ±0.3°C.
[0078] c. This invention uses liquid metal as the phase change temperature control medium, addressing the narrow phase change temperature range and poor cyclic stability of traditional temperature control media. Liquid metal phase change materials exhibit no volatilization or phase separation during the phase change process, resulting in excellent cyclic stability. Furthermore, by adjusting the liquid metal ratio, the phase change temperature can be precisely controlled within a range of 8°C to 200°C, covering a wide range of scenarios, including semiconductor manufacturing (-50°C to 150°C), biological cryogenic storage (-80°C to -20°C), and high-temperature industrial furnaces (100°C to 300°C).
[0079] In one embodiment, the temperature control module 30 is configured to adjust the power of the heating-cooling module based on a PID controller. The temperature control module 30 is configured to adjust the parameters of the PID controller based on a preset adjustment information library, the compensation temperature information, the target error, and the rate of change of the target error, thereby obtaining an adjusted PID controller. The PID controller parameters include a control factor for the target error, a control factor for the integral of the target error, and a control factor for the differential of the target error. The power of the heating-cooling module is then adjusted based on the adjusted PID controller until the target error is less than a set error.
[0080] In one embodiment, the compensated temperature information includes the compensated temperature difference of the target space at different times due to the phase change of the liquid metal phase change material. The temperature control module is used to: obtain the temperature of the liquid metal phase change material at the current moment based on the temperature sensor, and obtain the conductivity of the liquid metal phase change material at the current moment based on the electrical impedance analyzer; input the temperature of the liquid metal phase change material and the conductivity of the liquid metal phase change material into the phase prediction model to obtain the compensated temperature difference output by the phase prediction model at different future times; wherein the phase prediction model is based on a preset model and is trained based on the sample temperature of the sample liquid metal phase change material at different times, the sample conductivity at different times, and the compensated temperature difference of the sample at different times when the sample liquid metal phase change material undergoes phase change.
[0081] In one embodiment, the heating-cooling module includes a semiconductor heating-cooling device.
[0082] In one embodiment, the liquid metal phase change material includes a gallium-zinc alloy or a tin-bismuth alloy prepared according to a preset ratio.
[0083] Figure 4 An example of a physical structure diagram of an electronic device is shown below. Figure 4As shown, the electronic device may include: a processor 410, a communications interface 420, a memory 430, and a communications bus 440, wherein the processor 410, the communications interface 420, and the memory 430 communicate with each other via the communications bus 440. The processor 410 may call logic instructions in the memory 430 to execute an indoor temperature control method, which includes: regulating the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, obtaining the detected temperature and a target error between the detected temperature and the set temperature; when the target error reaches the set error, triggering a phase change of the liquid metal phase change material to obtain compensation temperature information generated by the phase change; and regulating the power of the heating-cooling module based on the compensation temperature information and the target error until the target error is less than the set error.
[0084] Furthermore, the logic instructions in the aforementioned memory 430 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product, stored in a storage medium, includes instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.
[0085] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the indoor temperature control method provided by the above-mentioned methods, the method comprising: regulating the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, obtaining the detected temperature and the target error between the detected temperature and the set temperature; when the target error reaches the set error, triggering the liquid metal phase change material to undergo a phase change, obtaining the compensation temperature information generated by the phase change; based on the compensation temperature information and the target error, regulating the power of the heating-cooling module until the target error is less than the set error.
[0086] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.
[0087] Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented using software plus a necessary general-purpose hardware platform, or of course, hardware. Based on this understanding, the essence of the above technical solution, or the portion that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, or an optical disk, and includes a number of instructions for causing a computer device (such as a personal computer, server, or network device) to execute the methods described in each embodiment or certain portions of the embodiments.
[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A method for controlling indoor temperature, characterized in that: include: regulating the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, and obtaining the detected temperature and a target error between the detected temperature and the set temperature; When the target error reaches the set error, the liquid metal phase change material is triggered to undergo phase change, and compensation temperature information generated by the phase change is obtained; Based on the compensated temperature information and the target error, the power of the heating-cooling module is regulated until the target error is less than the set error.
2. The indoor temperature control method according to claim 1, characterized in that: Regulating the power of the heating-cooling module, including: Regulating the power of the heating-cooling module based on a PID controller; The regulating the power of the heating-cooling module based on the compensated temperature information and the target error until the target error is less than the set error includes: According to a preset adjustment information library, based on the compensation temperature information, the target error, and the rate of change of the target error, the parameters of the PID controller are adjusted to obtain an adjusted PID controller, wherein the parameters of the PID controller include a control factor of the target error, a control factor of the target error integral, and a control factor of the target error differential; Based on the adjusted PID controller, the power of the heating-cooling module is regulated until the target error is less than the set error.
3. The indoor temperature control method according to claim 1, characterized in that: The compensation temperature information includes the compensation temperature difference of the target space at different times caused by the phase change of the liquid metal phase change material. The obtaining of the compensation temperature information generated by the phase change includes: The temperature of the liquid metal phase change material at the current moment is obtained based on the temperature sensor, and the conductivity of the liquid metal phase change material at the current moment is obtained based on the electrical impedance analyzer; The temperature of the liquid metal phase change material and the electrical conductivity of the liquid metal phase change material are input into a phase prediction model to obtain the compensated temperature difference at different future moments output by the phase prediction model; wherein, the phase prediction model is trained based on a preset model based on the sample temperature of the sample liquid metal phase change material at different moments, the sample electrical conductivity at different moments, and the compensated temperature difference of the sample at different moments when the sample liquid metal phase change material undergoes phase change.
4. The indoor temperature control method according to claim 3, characterized in that: The heating-cooling module includes a semiconductor heating-cooling device.
5. The indoor temperature control method according to claim 1, characterized in that: The liquid metal phase change material includes a gallium-zinc alloy or a tin-bismuth alloy made according to a preset ratio.
6. An indoor temperature control device, characterized in that: include: a temperature control module, configured to regulate the power of the heating-cooling module of the target space so that the detected temperature of the target space approaches the set temperature, and obtain the detected temperature and a target error between the detected temperature and the set temperature; A liquid metal phase change module, configured to trigger a phase change of the liquid metal phase change material when the target error is greater than a set error; The temperature control module is also used to obtain compensation temperature information generated by phase change; The temperature control module is further configured to regulate the power of the heating-cooling module based on the compensated temperature information and the target error until the target error is less than the set error.
7. The indoor temperature control device according to claim 6, characterized in that: The liquid metal phase change module is connected to the heating-cooling module via an air delivery pipe. The liquid metal phase change module includes a porous heat-conducting skeleton, and the porous heat-conducting skeleton includes a plurality of first through holes and a plurality of second through holes. The heating-cooling module is used to heat or cool the gas in the air delivery pipe and transmit the gas to the target space through the second through hole so that the detected temperature approaches the set temperature; The first through hole is filled with the liquid metal phase change material to heat or cool the gas based on the phase change of the liquid metal phase change material, so as to regulate the temperature of the target space and form the compensated temperature information.
8. The indoor temperature control device according to claim 7, characterized in that: The porous thermally conductive skeleton further includes an encapsulation layer: The encapsulation layer is used to seal the liquid metal phase change material.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the computer program, the indoor temperature control method according to any one of claims 1 to 5 is implemented.
10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the indoor temperature control method according to any one of claims 1 to 5 is implemented.