Optical transceiver assembly and communication device

Abstract

The invention provides an optical transceiver assembly and a communication device, the optical transceiver assembly comprises a first chip and a second chip integrated on the first chip, the first chip is provided with an optical receiver and a modulator, and is provided with a light source input port, an optical signal input / output port and an electric signal input port; the optical receiver receives a first optical signal input from the optical signal input and output port, converts the first optical signal into a first electric signal and outputs the first electric signal; the second chip is provided with a light emitter, the light emitter inputs a second light signal to the modulator through the light source input port, and the modulator modulates the second light signal based on a second electric signal input by the electric signal input port and then outputs the second light signal. The structural design of the optical transceiver assembly greatly reduces the packaging volume, so that when the optical transceiver assembly is applied to photoelectric signal conversion in a communication device, the volume and the cost of the communication device can be greatly reduced. The communication device is provided with the optical transceiver assembly, the overall structural size is small, the cost is relatively low, and the use performance is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor and communication technology, and relates to an optical transceiver component and a communication device. Background Art

[0002] As the core structure in optical communications, the most basic function of optical modules is to complete optical-to-electrical conversion (i.e., optical-to-electrical conversion or electrical-to-optical conversion of optical signals). With the widespread popularization of optical networks, a large number of passive optical networks (PONs) are being laid out on a large scale, requiring a huge number of optical modules. Therefore, the demand for reducing the cost of optical modules is becoming increasingly strong.

[0003] Currently, in optical modules, the optical transmitting component (composed of structures such as lasers, tube core sleeves, and adapters, Transmitter Optical Subassembly, TOSA) used to convert electrical signals into optical signals, the optical receiving component (composed of detectors, adapters, etc., Receiver Optical Subassembly, ROSA) used to convert optical signals into electrical signals, and other functional components are usually packaged in a compact structure (such as TO coaxial package or butterfly package) to form a single-fiber bidirectional optical transceiver assembly (Bi-directional Optical Sub-assembly, BOSA).

[0004] The BOSA currently produced in large quantities on the market adopts the following technology: using two independent transmitting and receiving coaxial packaging devices (TO-CAN) and using thin film filters at the same time to achieve single-fiber bidirectional uplink and downlink transmission, or encapsulating the laser (Laserdiode, LD), photodetector (Photodiode, PD) and other components inside a TO-CAN, which in turn reduces the cost of the optical module and adapts to the trend of miniaturization. However, the first solution has the defects of large size and limited room for cost reduction, and cannot achieve further reduction in production costs. In the second solution, since the optoelectronic devices are encapsulated inside a package, the optoelectronic crosstalk inside it during operation will reduce product performance.

[0005] Therefore, how to provide an optical transceiver component and a communication device to reduce the package size and reduce costs while avoiding performance loss caused by optoelectronic crosstalk has become an important technical problem that needs to be solved urgently by those skilled in the art.

[0006] It should be noted that the above introduction to the technical background is merely intended to provide a clear and complete description of the technical solutions of this application and facilitate understanding by those skilled in the art. Simply because these solutions are described in the background technology section of this application, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0007] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an optical transceiver component and a communication device to solve the problem in the prior art that the BOSA package is large in size, which limits the room for cost reduction or the optical / electrical crosstalk during operation causes product performance loss.

[0008] To achieve the above-mentioned and other related objectives, the present invention provides an optical transceiver assembly, comprising:

[0009] A first chip is formed with an optical receiver and a modulator, and the first chip has a light source input port, an optical signal input / output port, and an electrical signal input port. The optical receiver receives a first optical signal input from the optical signal input / output port and converts the first optical signal into a first electrical signal for output;

[0010] A second chip is integrated on the first chip, and the second chip is formed with an optical transmitter. The optical transmitter inputs a second optical signal to the modulator through the light source input port. The modulator modulates the second optical signal based on the second electrical signal input from the electrical signal input port and outputs the modulated signal.

[0011] Optionally, the first chip is further formed with a splitter, the input end of the splitter is connected to the light source input port to divide the second optical signal into a target optical signal and a monitoring optical signal in a preset ratio, and the first output end of the splitter is connected to the modulator to output the functional optical signal.

[0012] Optionally, a monitoring detector is further formed on the first chip, and the monitoring detector is connected to the second output end of the optical splitter to receive the monitoring optical signal.

[0013] Optionally, the first chip further forms a wavelength division multiplexer, the wavelength division multiplexer is connected between the modulator and the optical signal input and output port, and the wavelength division multiplexer is connected between the optical receiver and the optical signal input and output port.

[0014] Optionally, the first chip further comprises a transimpedance amplifier, and the transimpedance amplifier is connected to the optical receiver.

[0015] Optionally, a groove is further formed on the first chip, and the groove is located between the modulator and the transimpedance amplifier.

[0016] Optionally, the optical receiver is a waveguide photodiode.

[0017] Optionally, the method of integrating the second chip onto the first chip includes Flip Chip.

[0018] Optionally, the optical transceiver assembly further includes a substrate, and the substrate is electrically connected to the first chip to implement electrical extraction of the first chip based on the substrate.

[0019] The present invention further provides a communication device, characterized by comprising:

[0020] tube socket;

[0021] The optical transceiver assembly as described above is arranged on the tube seat;

[0022] The ceramic ferrule is located above the optical transceiver assembly to input the first optical signal to the optical transceiver assembly and output the modulated second optical signal.

[0023] Optionally, a filter is provided at one end of the ceramic ferrule facing the tube cap to filter the light input from the ceramic ferrule.

[0024] Optionally, the communication device further includes a tube cap having a lens, which is located below the ceramic ferrule and sleeved over the optical transceiver assembly and connected to the tube seat. The light input from the ceramic ferrule passes through the lens and enters the first chip.

[0025] As described above, the optical transceiver assembly of the present invention includes a first chip and a second chip integrated on the first chip. The first chip is an optoelectronic integrated chip, which internally integrates multiple components (such as an optical receiver, a modulator, a transimpedance amplifier, etc.) that implement optical-to-electrical signal conversion and electro-optical signal conversion functions. The second chip with an optical transmitter is externally hybrid-integrated. The above-mentioned structural design greatly increases the integration level of the optical transceiver assembly and reduces the packaging volume. When the optical transceiver assembly is used for opto-electrical signal conversion in a communication device, it can significantly reduce the size and cost of the communication device. In addition, because the optical receiver and the transimpedance amplifier are simultaneously integrated within the first chip, the long electrical connection distance between the two due to the gold wire connection between them can be avoided, effectively improving the optical transceiver assembly's resistance to electrical crosstalk and enhancing the stability of its operating performance. The communication device of the present invention has a relatively small overall structure and relatively low cost. During operation, internal opto-electrical crosstalk is effectively suppressed, effectively improving the performance of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shown is a simplified structural diagram of the optical transceiver assembly of the present invention.

[0027] Figure 2 Shown is a schematic diagram of the working principle of the optical transceiver assembly of the present invention.

[0028] Figure 3 Shown is a schematic diagram of the partial packaging structure of the optical transceiver assembly of the present invention.

[0029] Figure 4 Shown is a schematic diagram of the overall packaging structure of the optical transceiver assembly of the present invention.

[0030] Figure 5 Shown is a schematic diagram of the overall structure of the communication device of the present invention.

[0031] Figure 6 Display as Figure 5 Schematic diagram of the longitudinal section of the structure shown in .

[0032] Description of Reference Numerals

[0033] 10 First Chip

[0034] 11 Optical Receiver

[0035] 12 Modulator

[0036] 13. Optical Splitter

[0037] 14 Monitoring detectors

[0038] 15 Wavelength Division Multiplexer

[0039] 16 Transimpedance Amplifier

[0040] 17 grooves

[0041] 10a Optical signal input and output port

[0042] 10b electrical signal output port

[0043] 10c Light source input port

[0044] 10d electrical signal input port

[0045] 20 Second chip

[0046] 21 Optical Transmitter

[0047] 30 substrate

[0048] 31 Capacitor

[0049] 40 tube socket

[0050] 50 Ceramic Ferrule

[0051] 51 filter

[0052] 60 pipe cap

[0053] 61 lens

[0054] 70 package shell DETAILED DESCRIPTION

[0055] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0056] See also Figures 1 to 6 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0057] Example 1

[0058] This embodiment provides an optical transceiver assembly. Figure 1 , which is a simplified structural diagram of the optical transceiver assembly, wherein the optical transceiver assembly includes a first chip 10 and a second chip 20 (please refer to Figure 2 and Figure 3 ).

[0059] Specifically, the first chip 10 is formed with an optical receiver 11 and a modulator 12, and the first chip 10 has an optical signal input and output port 10a, a light source input port 10c and an electrical signal input port 10d. The optical receiver 11 receives the first optical signal input from the optical signal input and output port 10a and converts the first optical signal into a first electrical signal and then outputs it (that is, the optical receiver 11 also has an electrical signal output port 10b, and the first electrical signal is output from the optical transceiver component via the electrical signal output port); the second chip 20 is integrated on the first chip 10, and the second chip 20 is formed with an optical transmitter 21. The optical transmitter 21 inputs a second optical signal to the modulator 12 through the light source input port 10c, and the modulator 12 modulates the second optical signal based on the second electrical signal input from the electrical signal input port 10d and then outputs it (the modulated second optical signal is output from the optical transceiver component via the optical signal input and output port).

[0060] As an example, the optical receiver 11 includes a photodiode (PD), and the optical transmitter 21 includes a semiconductor laser (LD). In this embodiment, the optical receiver is preferably a waveguide photodiode. Compared with the surface-receiving photodiode, which only has requirements for the intensity distribution of the received light, the waveguide photodiode has requirements for the phase and intensity distribution of the received light field, which can improve the optical transceiver component's resistance to stray light and improve performance.

[0061] As an example, the method for integrating the second chip 20 with the first chip 10 includes a flip chip method, in which the second chip 20 is flip-chip mounted on the first chip 10 using a hybrid integration method. This can significantly reduce the overall packaging volume of the optical transceiver assembly and reduce manufacturing costs. More specifically, the second chip 20 is integrated into the light source input port 10c of the first chip 10 so that the optical signal output by the optical transmitter 21 enters the optical signal transmission path of the first chip 10 (referring to the transmission path of the second optical signal) through the light source input port 10c.

[0062] As an example, the first chip 10 is further formed with a spectrometer 13, the input end of the spectrometer 13 is connected to the light source input port 10c to divide the second optical signal into a target optical signal and a monitoring optical signal in a preset ratio, and the first output end of the spectrometer 13 is connected to the modulator 12 to output the functional optical signal. It should be noted that when the first chip is further formed with the spectrometer, the modulator modulates and processes the target optical signal after being divided by the spectrometer rather than the original second optical signal. The ratio of the monitoring optical signal to the second optical signal is 0.5% to 10%, including but not limited to 3% and 5%. If the ratio of the monitoring optical signal to the entire second optical signal is too low, the accuracy of its detection of the optical signal power is limited. If the ratio of the monitoring optical signal to the entire optical signal is too high, the power of the target optical signal will be lost, which is not conducive to the actual working performance of the optical transceiver component. The specific ratio is set according to actual needs.

[0063] Furthermore, the first chip 10 is also formed with a monitoring detector 14, which is connected to the second output end of the optical splitter 13 to receive the monitoring optical signal. Since the light output efficiency of the semiconductor laser is different under different working environments (especially working temperature), in order to ensure that the light output intensity of the laser is consistent under different working temperatures, it is necessary to set the monitoring detector to perform power detection on the second optical signal. At the same time, the monitoring detector is also connected to the control unit (not shown) that controls the operation of the optical transceiver component to receive the detected power information, and adjust the output power of the laser in real time through the controller to achieve feedback regulation of the power of the target optical signal, thereby ensuring the working performance stability of the optical transceiver component. The monitoring detector includes a photodiode and can be manufactured in the same step as the optical receiver, saving manufacturing process.

[0064] As an example, the first chip 10 further includes a wavelength division multiplexer (WDM) 15, which is connected between the modulator 12 and the optical signal input / output port 10a, and is also connected between the optical receiver 11 and the optical signal input / output port 10a. The WDM allows a first optical signal input from the optical input / output port to pass through and enter the optical receiver, while also allowing a second optical signal modulated by the modulator to pass through and be output from the optical input / output port. This enables the transmission of optical signals of different wavelengths, increases the available bandwidth of the optical fiber connected to the optical input / output port, and enables the application of the optical transceiver assembly over a wide wavelength range.

[0065] As an example, the first chip 10 further includes a transimpedance amplifier (TIA) 16, which is connected to the optical receiver 11 and is configured to amplify and process the electrical signal output by the optical receiver 11 before outputting it. In the optical transceiver assembly of this embodiment, the optical receiver and the transimpedance amplifier are both integrated into the first chip, so that the electrical connection structure between the two can also be formed in the first chip. Compared to gold wire connections, this can significantly reduce the electrical connection distance between the two, thereby reducing the amplitude of interference sources that electromagnetically couple into the input of the transimpedance amplifier and improving the optical transceiver assembly's resistance to electrical crosstalk.

[0066] Furthermore, a groove 17 is formed on the first chip 10. The groove 17 is located between the modulator 12 and the transimpedance amplifier 16. The provision of the groove 17 can further reduce the electrical crosstalk between the transmitting and receiving ends, thereby improving the performance of the device.

[0067] Furthermore, the width of the groove 17 ranges from 100 μm to 200 μm, including but not limited to 130 μm, 150 μm, and 180 μm; the depth of the groove 17 ranges from 100 μm to 200 μm, including but not limited to 130 μm, 150 μm, and 180 μm; the cross-section of the groove in the extension direction of the groove in this embodiment is a trapezoidal morphology that is wide at the top and narrow at the bottom, which can achieve a good effect of reducing electrical crosstalk without occupying a large space. Of course, the parameters such as the width, depth and morphology of the groove are set based on the specific application scenario of the optical transceiver component, and no specific restrictions are made here.

[0068] For details, please refer to Figure 2 , which is a schematic diagram showing the working principle of the optical transceiver component, wherein the optical transceiver component includes two photoelectric signal transmission paths. In the first photoelectric signal transmission path ( Figure 2The optical signal receiving port 10a includes a wavelength division multiplexer 15, an optical receiver 11 and a transimpedance amplifier 16, which are arranged in sequence. The first optical signal ( Figure 2 As shown in λ1, the optical signal input and output port 10a is coupled with an external optical fiber to realize the input and output of the optical signal in the optical transceiver component), and is input into the optical receiver 11 after passing through the wavelength division multiplexer 15. The optical receiver 11 converts the received first optical signal into a photocurrent signal and outputs it to the transimpedance amplifier 16. The transimpedance amplifier 16 further converts the photocurrent signal into a voltage signal and amplifies it into a functional voltage signal and outputs it through the electrical signal output port 10b, thereby realizing the conversion of the optical and electrical signals; in the second optical and electrical signal transmission path ( Figure 2 The optical transmitter 21 outputs a second optical signal ( Figure 2 2) is input to the optical splitter 13 through the light source input port 10c on the first chip 10, and the optical splitter 13 divides the second optical signal into two parts (including Figure 2 Medium 21 The target light signal and Figure 2 Medium 22 The target optical signal is transmitted to the modulator 12, and the modulator 12 modulates the amplitude, frequency, phase and other parameters of the second optical signal based on the second electrical signal input from the electrical signal input port 10d (in this process, the electro-optical effect between the second electrical signal and the second optical signal is used for modulation). The modulator then inputs the modulated signal into the wavelength division multiplexer 15 and outputs the modulated signal through the optical signal input and output port 10a, thereby realizing the conversion of the electrical signal into an optical signal (optical conversion of the second electrical signal). The monitoring optical signal is input to the monitoring detector to detect the power of the second optical signal, thereby realizing the feedback and closed-loop control of the power of the second optical signal.

[0069] As an example, see Figure 3 and Figure 4 , Figure 3 Shown is a schematic diagram of the partial packaging structure of the optical transceiver component. Figure 4The schematic diagram shows the overall packaging structure of the optical transceiver assembly. The optical transceiver assembly also includes a substrate 30, which is electrically connected to the first chip 10 to enable electrical extraction of the first chip 10. Conductive circuits are provided within the substrate 30 to electrically connect to components within the first chip 10, thereby inputting or outputting electrical signals to the components within the first chip 10. For example, the conductive circuits on the substrate 30 can be used to input a second electrical signal to the modulator 12 so that the modulator 12 can modulate the second optical signal. The conductive circuits on the substrate 30 can be used to output the first electrical signal amplified by the transimpedance amplifier 16. The conductive circuits on the substrate 30 can be used to output the signal of the monitoring detector 14. In other words, the substrate 30 enables electrical signal connections on the first chip 10, avoiding the increased high-frequency signal loss caused by the long electrical connection paths between components resulting from the use of gold wire bonding. In this embodiment, the substrate is a ceramic substrate, which has greater structural stability and reliability than conventional PCBs.

[0070] Furthermore, a preset number of resistors (not shown in the figure) and capacitors 31 are provided on the substrate 30. The capacitors 31 and the resistors are used to be connected to the circuit structure of the optical transceiver component to adjust the electrical parameters and functions of the circuit structure, for example, to constitute the power supply filter circuit of the transimpedance amplifier 16.

[0071] The optical transceiver assembly of this embodiment includes a first chip and a second chip integrated on the first chip. The first chip is an optoelectronic integrated chip, which internally integrates multiple components (such as an optical receiver, a modulator, a transimpedance amplifier, etc.) that implement optical-to-electrical signal conversion and electro-optical signal conversion functions. The second chip with an optical transmitter is externally hybrid-integrated. The above-mentioned structural design greatly increases the integration level of the optical transceiver assembly and reduces the packaging volume of the optical transceiver assembly. When the optical transceiver assembly is used for opto-electrical signal conversion in a communication device, it can significantly reduce the size and cost of the communication device. In addition, because the optical receiver and transimpedance amplifier are simultaneously integrated within the first chip, the long electrical connection distance between the two due to the gold wire connection between them can be avoided, effectively improving the optical transceiver assembly's resistance to electrical crosstalk and enhancing the stability of its operating performance. The communication device of the present invention has a small overall structure and relatively low cost. During operation, internal opto-electrical crosstalk is effectively suppressed, effectively improving the performance of the device.

[0072] Example 2

[0073] This embodiment provides a communication device. Figure 5 and Figure 6 ,in, Figure 5 It shows the overall structure diagram of the communication device. Figure 6 Display as Figure 5 The longitudinal cross-sectional diagram of the structure shown in FIG. 4 shows a communication device including a tube base 40 , an optical transceiver assembly as described in the first embodiment, and a ceramic ferrule 50 .

[0074] Specifically, the optical transceiver assembly is disposed on the tube seat 40 , and the ceramic ferrule 50 is located above the optical transceiver assembly to input the first optical signal to the optical transceiver assembly and output the modulated second optical signal.

[0075] As an example, the communication device further includes a cap 60 having a lens 61. The cap 60 is positioned below the ceramic ferrule 50, sleeved over the optical transceiver assembly, and connected to the socket 40. Light input from the ceramic ferrule 50 passes through the lens 61 and enters the first chip 10. Preferably, the center of the optical signal input / output port 10a of the first chip 10, the center of the lens 61, and the center of the ceramic ferrule 50 are aligned, thereby achieving coaxial packaging of the optical transceiver assembly.

[0076] As an example, the tube seat 40 has a horizontal mounting surface and a vertical mounting surface (the tube seat 40 can be regarded as having a horizontal portion and a vertical portion, which is approximately L-shaped or T-shaped), the optical transceiver assembly is fixed on the vertical mounting surface, and the tube cap 60 is fixed on the horizontal mounting surface (the vertical portion of the tube seat 40 extends from the bottom to the top into the tube cap 60 so that the tube cap 60 is connected to the horizontal portion).

[0077] Furthermore, the first chip 10 and the substrate 30 are arranged side by side on the vertical mounting surface, the substrate 30 is located below the first chip 10, and a conductive circuit is also provided in the tube seat 40. The conductive circuit of the tube seat 40 is used to electrically lead out the conductive circuit in the substrate 30 to achieve electrical connection between the optical transceiver assembly sealed in the area between the tube cap 60 and the tube seat 40 and other components (such as a controller).

[0078] As an example, a filter 51 is provided at one end of the ceramic ferrule 50 facing the tube cap 60 to filter the light input from the ceramic ferrule 50. Since the light beam input through the ceramic ferrule 50 includes light of different wavelengths, the setting of the filter 51 can filter the input light. When a wavelength division multiplexer 15 is provided, the filter 51 can assist the wavelength division multiplexer 15 in filtering, thereby improving the isolation of the optical transceiver assembly from the remaining non-target wavelengths of light in the system.

[0079] As an example, the interior of the tube holder 40 is provided with a conductive circuit and the bottom of the tube holder 40 is provided with multiple pins for electrical connection with an external circuit board to realize power supply, working state feedback adjustment and control of the optical transceiver component.

[0080] As an example, the communication device further includes a housing 70, which includes a first cavity and a second cavity that communicate with each other vertically. The first cavity is used to accommodate the tube cap 60, the optical transceiver assembly, and the tube base 40, while the second cavity is used to accommodate the ceramic ferrule 50 and facilitate the insertion and connection of an external optical fiber. In addition to protecting the ceramic ferrule 50 and the optical transceiver assembly, the housing 70 also secures the positional relationship between the ceramic ferrule 50 and the optical transceiver assembly, thereby improving the structural and performance stability of the communication device.

[0081] The communication device of this embodiment has a small overall structure and relatively low cost. During operation, internal photoelectric crosstalk is effectively suppressed to effectively improve the performance of the device.

[0082] In summary, the optical transceiver assembly of the present invention comprises a first chip and a second chip integrated on the first chip. The first chip is an optoelectronic integrated chip, internally integrating multiple components (such as an optical receiver, a modulator, and a transimpedance amplifier) ​​that implement optical-to-electrical signal conversion and electro-optical signal conversion functions. The second chip, which has an optical transmitter, is externally hybrid-integrated. This structural design significantly increases the integration level of the optical transceiver assembly and reduces the package volume. When the optical transceiver assembly is used for opto-electrical signal conversion in a communication device, the size and cost of the communication device can be significantly reduced. Furthermore, since both the optical receiver and the transimpedance amplifier are integrated within the first chip, the long electrical connection distance between the two due to the gold wire connection between them can be avoided, effectively improving the optical transceiver assembly's resistance to electrical crosstalk and enhancing the stability of its operating performance. The communication device of the present invention has a relatively small overall structure and relatively low cost. During operation, internal opto-electrical crosstalk is effectively suppressed, effectively improving the device's performance. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0083] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. An optical transceiver assembly, characterized in that: include: A first chip is formed with an optical receiver and a modulator, and the first chip has a light source input port, an optical signal input / output port, and an electrical signal input port. The optical receiver receives a first optical signal input from the optical signal input / output port and converts the first optical signal into a first electrical signal for output; A second chip is integrated on the first chip, and the second chip is formed with an optical transmitter. The optical transmitter inputs a second optical signal to the modulator through the light source input port. The modulator modulates the second optical signal based on the second electrical signal input from the electrical signal input port and outputs the modulated signal.

2. The optical transceiver assembly according to claim 1, wherein: The first chip also forms a spectrometer, the input end of the spectrometer is connected to the light source input port to divide the second optical signal into a target optical signal and a monitoring optical signal in a preset ratio, and the first output end of the spectrometer is connected to the modulator to output the functional optical signal.

3. The optical transceiver assembly according to claim 2, wherein: The first chip is further formed with a monitoring detector, which is connected to the second output end of the optical splitter to receive the monitoring optical signal.

4. The optical transceiver assembly according to claim 1, wherein: The first chip further forms a wavelength division multiplexer, which is connected between the modulator and the optical signal input and output port, and the wavelength division multiplexer is connected between the optical receiver and the optical signal input and output port.

5. The optical transceiver assembly according to claim 1, wherein: The first chip further includes a transimpedance amplifier connected to the optical receiver.

6. The optical transceiver assembly according to claim 5, wherein: The first chip is further formed with a groove, and the groove is located between the modulator and the transimpedance amplifier.

7. The optical transceiver assembly according to claim 1, wherein: The optical receiver is a waveguide photodiode.

8. The optical transceiver assembly according to claim 1, wherein: The method of integrating the second chip on the first chip includes Flip Chip.

9. The optical transceiver assembly according to claim 1, wherein: The optical transceiver assembly further includes a substrate, which is internally connected to the first chip to implement electrical extraction of the first chip based on the substrate.

10. A communication device, characterized in that: include: tube socket; The optical transceiver assembly according to any one of claims 1 to 9, arranged on the tube seat; The ceramic ferrule is located above the optical transceiver assembly to input the first optical signal to the optical transceiver assembly and output the modulated second optical signal.

11. The communication device according to claim 10, wherein: An optical filter is provided on one end of the ceramic ferrule facing the tube cap to filter the light input from the ceramic ferrule.

12. The communication device according to claim 10, wherein: The communication device further includes a tube cap with a lens, which is located below the ceramic ferrule, sleeved above the optical transceiver assembly, and connected to the tube base. Light input from the ceramic ferrule passes through the lens and then enters the first chip.

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