Thermal desorption laser assisted plasma source apparatus and methods of use thereof

Abstract

The application relates to the technical field of semiconductor device manufacturing, and discloses a thermal desorption laser-assisted plasma source device and a use method thereof, which comprises a metal shell, a ceramic tube, a grounding electrode and a cooling jacket; the cooling jacket comprises a fixing seat, a control tube and a control ball, the fixing seat is fixedly arranged on the metal shell and internally provided with a cavity; two communication holes are arranged on the control tube and are communicated with the cavity and the interior of the control tube; the control ball is movably arranged in the control tube, and the control ball blocks the communication holes or a position in the control tube located between the two communication holes. By arranging the fixing seat, the control tube and the control ball, the flow path of the cooling medium can be quickly changed by adjusting the control tube and blocking the communication holes or the control tube with the control ball, the cooling effect of the cooling jacket is adjusted, and the plasma source device can be adapted to different working conditions.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device manufacturing, and in particular to a thermal desorption laser-assisted plasma source device and a method for using the same. BACKGROUND

[0002] Plasma technology has been widely concerned in recent years as a powerful means of material processing. Plasma is rich in active particles such as high-energy electrons, ions, and free radicals, which can interact with the surface of a material in a series of complex physical and chemical processes, such as etching, modification, and activation, and is widely used in the field of electronic device processing. For example, in the field of semiconductor manufacturing, plasma etching is a key micro-fabrication method in the field of semiconductor manufacturing. By adjusting the gas composition (such as CF4, Cl2), power, and pressure, plasma can accurately remove specific material layers to achieve sub-micron pattern transfer. Compared with traditional wet etching, it has the advantages of high anisotropy, less pollution, and strong controllability, and is suitable for processing structures such as channels and isolation trenches of advanced chips.

[0003] A plasma source device, also known as a plasma generating device, is provided with a corresponding cooling mechanism during use to prevent electrode overheating and control the temperature of the plasma. For example, the plasma torch with self-assembled separated electrodes disclosed in the patent CN116723623A has a first water-cooled interlayer in the anode sleeve and a second water-cooled interlayer in the cathode sleeve, which cools the anode sleeve and the cathode sleeve, respectively, by the cooling medium flowing in the first and second water-cooled interlayers.

[0004] However, as the working conditions of the plasma source device change, the required cooling effect also changes. If the cooling effect is simply adjusted by adjusting the cooling medium circulation equipment, the cooling response will be delayed, the cooling effect cannot be quickly changed, and the local cooling performance cannot be changed, which cannot meet the use requirements of the plasma source device. SUMMARY

[0005] Therefore, the present application provides a thermal desorption laser-assisted plasma source device and a method for using the same, which can quickly adjust the cooling effect of the cooling jacket to quickly adapt the plasma source device to the working conditions.

[0006] The technical scheme of the present application is implemented as follows: In a first aspect, the present application provides a thermal desorption laser-assisted plasma source device and a method for using the same, comprising a metal shell, a ceramic tube, a grounding electrode and a cooling jacket, wherein the metal shell is provided with an air inlet on the lateral side thereof; the ceramic tube is fixedly arranged in the metal shell and is spaced apart from the metal shell; the grounding electrode is fixedly arranged in the ceramic tube; the cooling jacket comprises a fixing seat, a control tube and a control ball, the fixing seat is fixedly arranged on the metal shell and is internally provided with a cavity; the control tube is located in the cavity and extends out of the fixing seat at both ends thereof and is rotatably connected to the fixing seat, the control tube is provided with two communication holes, the communication holes are in communication with the cavity and the interior of the control tube; the control ball is movably arranged in the control tube and blocks the communication holes or a position in the control tube located between the two communication holes.

[0007] On the basis of the above technical scheme, preferably, a plurality of cooling jackets are arranged, the plurality of cooling jackets are arranged in abutment along the axial direction of the metal shell, and the plurality of control tubes are sequentially and sealingly connected.

[0008] On the basis of the above technical scheme, preferably, the control tube comprises a tube body, an extension cylinder and a blocking plate, wherein the tube body is located in the cavity and is rotatably arranged on the fixing seat at both ends thereof; one end of the extension cylinder penetrates through and is fixed on the lateral side of the tube body, the control ball is slidingly arranged between the tube body and the extension cylinder; and the blocking plate is sealingly and fixedly arranged at the end of the extension cylinder away from the tube body.

[0009] Further preferably, the control tube further comprises a blocking tube and two partition plates, wherein the blocking tube is arranged at one end in the tube body in a spaced apart manner, the lateral side of the blocking tube is provided with a medium hole, and the control ball can block the blocking tube; the partition plates are sealingly and fixedly arranged between the blocking tube and the tube body, and the two partition plates are oppositely arranged on the two sides of the medium hole and one of the control balls.

[0010] Further preferably, the cooling jacket further comprises a water receiving pipe, one end of the water receiving pipe is fixedly arranged at the top of the cavity, and the other end of the water receiving pipe can sealingly communicate with the communication hole.

[0011] Further preferably, the cooling jacket further comprises a water distribution pipe, the water distribution pipe is in the shape of a ring and is fixedly arranged in the cavity, a plurality of water distribution holes are arranged on the lateral side of the water distribution pipe, and the water distribution pipe can sealingly communicate with the communication hole.

[0012] Further preferably, one side of the tube body connected to the extension cylinder is in the shape of W.

[0013] Further preferably, the communication hole is arranged on the blocking plate.

[0014] Further preferably, each of the blocking plates is provided with a plurality of the communication holes, and the plurality of the communication holes on the same blocking plate are arranged in a circumferential array around the axis of the extending cylinder.

[0015] In a second aspect, the present application provides a method for using a thermal desorption laser-assisted plasma source device, comprising the following steps: S1, connecting both ends of the control tube with a cooling medium circulation device, adjusting the position of the control ball to control the flow direction of the cooling medium in the cooling jacket; S2, connecting the gas inlet with a gas supply device to make the gas flow into the metal shell; S3, connecting the metal shell to the high-voltage end of the power supply and grounding the grounding electrode to ionize the gas molecules in the metal shell to generate plasma.

[0016] The thermal desorption laser-assisted plasma source device and the method for using the same of the present application have the following beneficial effects compared with the prior art:

[0017] (1) By arranging the fixing seat, the control tube and the control ball, the control ball can block the communication hole or the control tube by adjusting the control tube, so as to quickly change the flow path of the cooling medium, adjust the cooling effect of the cooling jacket, and make the plasma source device adapt to different working conditions.

[0018] (2) By arranging a plurality of cooling jackets, the local cooling performance of the metal shell can be changed to further improve the adaptability of the plasma source device.

[0019] (3) By arranging the water collecting pipe and the water distributing pipe, the cooling medium can quickly fill the cavity, and the cooling uniformity of the cooling medium to the metal shell can be improved, and the cooling effect of the cooling jacket can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0021] Figure 1 It is a sectional view of the thermal desorption laser-assisted plasma source device of the present application.

[0022] Figure 2 It is a sectional view of the cooling jacket in the thermal desorption laser-assisted plasma source device of the present application.

[0023] Figure 3A cross-sectional view of the control tube when the control ball blocks the control tube of a thermal desorption laser-assisted plasma source device of the present application.

[0024] Figure 4 A cross-sectional view of the control tube when the control ball blocks the control tube of a thermal desorption laser-assisted plasma source device of the present application.

[0025] Figure 5 A cross-sectional view of the control tube when the control ball blocks the control tube of a thermal desorption laser-assisted plasma source device of the present application. Figure 3 An enlarged view of the middle B.

[0026] Figure 6 A perspective view of the water distribution pipe of a thermal desorption laser-assisted plasma source device of the present application.

[0027] Figure 7 A perspective view of the water distribution pipe of a thermal desorption laser-assisted plasma source device of the present application.

[0028] Figure 8 A cross-sectional view of the control tube when the control ball blocks the control tube of a thermal desorption laser-assisted plasma source device of the present application. Figure 2 An enlarged view of the middle A.

[0029] Figure 9 A perspective view of the blocking plate of a thermal desorption laser-assisted plasma source device of the present application.

[0030] Figure 10 A perspective view of a thermal desorption laser-assisted plasma source device of the present application.

[0031] Wherein: 1, metal shell; 101, air inlet; 2, ceramic tube; 3, grounding electrode; 4, cooling jacket; 41, fixing seat; 42, control tube; 421, tube body; 422, extension cylinder; 423, blocking plate; 424, blocking tube; 425, partition plate; 43, control ball; 44, water receiving pipe; 45, water distribution pipe; 401, cavity; 402, communication hole; 403, medium hole; 404, water distribution hole. DETAILED DESCRIPTION

[0032] The technical solutions in the present application will be described clearly and completely below in combination with the specific embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0033] A thermal desorption laser-assisted plasma source device of the present application comprises a metal shell 1, a ceramic tube 2, a grounding electrode 3 and a cooling jacket 4, for generating plasma.

[0034] As Figure 1As shown, the metal shell 1 is connected with the high voltage end of the power supply, and an air inlet 101 is formed on the side of the metal shell 1, the ceramic tube 2 is fixedly arranged in the metal shell 1, the outer side of the ceramic tube 2 is arranged in the inner wall of the metal shell 1 in a spaced manner, the grounding electrode 3 is fixedly arranged in the ceramic tube 2 and grounded, and an electric field is formed between the grounding electrode 3 and the metal shell 1, so as to ionize the gas and generate plasma.

[0035] The cooling jacket 4 is sleeved on the outer side of the metal shell 1, and in the use process of the plasma source device, the cooling jacket 4 is used to cool the metal shell 1, which not only prevents the electrode from overheating, but also controls the temperature of the plasma, so as to realize precise control of the temperature of the plasma in cooperation with the laser technology.

[0036] The cooling jacket 4 includes a fixed seat 41, a control pipe 42, a control ball 43, a water inlet pipe 44 and a water distribution pipe 45, the fixed seat 41 is fixedly arranged on the metal shell 1 and is internally provided with a cavity 401, the control pipe 42 is located in the cavity 401, both ends of the control pipe 42 extend out of the fixed seat 41 and are connected with a cooling medium circulating device, and the control pipe 42 is rotationally connected with the fixed seat 41, the control pipe 42 is provided with two communication holes 402, the communication holes 402 are in communication with the cavity 401 and the inside of the control pipe 42, the control ball 43 is movably arranged in the control pipe 42, and the control ball 43 can block the communication holes 402 and a position in the control pipe 42 which is located between the two communication holes 402; when the control ball 43 blocks the position in the control pipe 42 which is located between the two communication holes 402, the cooling medium first enters into the control pipe 42 from one end of the control pipe 42, then flows into the cavity 401 through one of the communication holes 402, and then flows back to the control pipe 42 through the other communication hole 402 and flows back to the cooling medium circulating device from the other end of the control pipe 42; and when the control ball 43 blocks the communication holes 402, the cooling medium first enters into the control pipe 42 from one end of the control pipe 42, then flows to the other end of the control pipe 42, and flows back to the cooling medium circulating device from the other end of the control pipe 42 without passing through the cavity 401, thereby realizing two kinds of cooling effects.

[0037] The fixed seat 41 is preferably in the shape of a ring, and the cavity 401 is also in the shape of a ring, so that the metal shell 1 can be provided with stable and uniform cooling effect when the cooling medium flows through the cavity 401.

[0038] As shown in the drawings, Figure 2 One end of the water inlet pipe 44 is fixedly arranged at the top of the cavity 401, and the other end of the water inlet pipe 44 can be in sealed communication with the communication hole 402 close to the water outlet of the control pipe 42, and since the end of the water inlet pipe 44 away from the communication hole 402 is located at the top of the cavity 401, the bubbles in the cavity 401 can be quickly and completely removed, thereby ensuring the cooling effect of the cooling jacket 4.

[0039] As shown in the drawings,Figure 7 As shown, the middle position of the water inlet pipe 44 is preferably annular, so that the cooling medium flowing back into the water inlet pipe 44 can pass evenly through the outside of the metal casing 1, further improving the cooling uniformity of the cooling jacket 4.

[0040] like Figure 2 As shown, the water distribution pipe 45 is annular and coaxially arranged with the metal outer shell 1. The water distribution pipe 45 is fixedly installed in the cavity 401. Multiple water distribution holes 404 are opened on the periphery of the water distribution pipe 45, and the water distribution pipe 45 is sealed and connected to the connecting hole 402. Preferably, the multiple water distribution holes 404 are arranged in a circular array around the axis of the metal outer shell 1, so that the cooling medium sprayed from the water distribution holes 404 can evenly contact the position on the fixed seat 41 connected to the metal outer shell 1, thereby improving the cooling uniformity of the cooling jacket 4.

[0041] like Figure 1 and Figure 10 As shown, multiple cooling jackets 4 are provided, and the multiple cooling jackets 4 are abutted against each other along the axial direction of the metal shell 1. Multiple control pipes 42 are sequentially sealed and connected. By adjusting the position of the control ball 43 in each cooling jacket 4, different cooling effects can be achieved, and the local cooling performance of the metal shell 1 can be adjusted.

[0042] In a preferred embodiment, the control tube 42 includes a tube body 421, an extension tube 422, a blocking plate 423, a sealing tube 424, and two partitions 425. The tube body 421 is located inside the cavity 401, and both ends of the tube body 421 are rotatably mounted on the fixed base 41. One end of the extension tube 422 is fixed through and fixed to the periphery of the tube body 421. The blocking plate 423 is sealed and fixed to the end of the extension tube 422 away from the tube body 421. The connecting hole 402 can be opened on the blocking plate 423 or at a position near the blocking plate 423 on the periphery of the extension tube 422. The control ball 43 is slidably disposed between the tube body 421 and the extension tube 422. When the tube body 421 rotates to such a position... Figure 4 When the position is shown, the control ball 43 slides into the extension tube 422, so that the connecting hole 402 is not connected to the inside of the tube body 421, thereby allowing the cooling medium input from one end of the tube body 421 to flow out along the other end of the tube body 421, reducing the cooling effect of the cooling jacket 4.

[0043] A sealing tube 424 is spaced apart and disposed at one end inside the tube body 421. A medium hole 403 is formed on the circumference of the sealing tube 424. A partition plate 425 is sealed and fixed between the sealing tube 424 and the tube body 421. Two partition plates 425 are disposed opposite each other on both sides of the medium hole 403. One control ball 43 is located on the same side of the two partition plates 425, and the other control ball 43 is located between the two partition plates 425. When the tube body 421 rotates to... Figure 3 and Figure 5When the position shown is reached, the cooling medium entering from the left end of the tube 421 impacts the control ball 43 to block the sealing tube 424, thereby blocking the position on the control tube 42 located between the two connecting holes 402. At this time, the cooling medium entering from the left end of the tube 421 first flows into the cavity 401 along the left connecting hole 402. After the cooling medium fills the cavity 401, the cooling medium in the cavity 401 flows into the right side of the tube 421 along the right connecting hole 402, and finally flows into the sealing tube 424 along the medium hole 403, and then flows back to the cooling medium circulation device along the right end of the sealing tube 424. At this time, the cooling effect of the cooling jacket 4 is optimal.

[0044] like Figure 4 As shown, it is preferable to make the side of the tube body 421 connected to the extension tube 422 W-shaped, that is, at this time the height of the position where the bottom side of the tube body 421 is connected to the extension tube 422 is the lowest, which can guide the control ball 43 so that the control ball 43 can slide smoothly into the extension tube 422.

[0045] Preferably, the connecting hole 402 is formed on the blocking plate 423, thereby making it easier for the control ball 43 to block the connecting hole 402. Figure 8 and Figure 9 As shown, each block plate 423 is provided with multiple connecting holes 402, and the multiple connecting holes 402 on the same block plate 423 are arranged in a circumferential array around the axis of the extension cylinder 422, thereby ensuring the throughput of the cooling medium.

[0046] like Figure 8 and Figure 9 As shown, the blocking plate 423 has a structure that is high in the middle and low at both ends. When the control tube 42 is rotated to the position shown... Figure 3 When the position shown is reached, the two blocking plates 423 are sealed and connected to the lower ends of the water inlet pipe 44 and the water distribution pipe 45, respectively, so that the cooling medium can quickly and evenly cool the metal casing 1. When the control pipe 42 is rotated to the position shown, Figure 4 When the position shown is reached, the blocking plate 423 is separated from the water inlet pipe 44 and the water distribution pipe 45, and there is no need to improve the cooling effect through the water inlet pipe 44 and the water distribution pipe 45.

[0047] The method of using the thermal desorption laser-assisted plasma source device of the present invention is as follows:

[0048] S1, connect the two ends of the control pipe 42 to the inlet pipe and outlet pipe of the cooling medium circulation equipment, respectively. Adjust the position of the control ball 43 by rotating the pipe body 421, moving the control ball 43 to the desired position. Figure 3 or Figure 4 The positions shown are used to control the flow direction of the cooling medium within the cooling jacket 4, thereby achieving different cooling effects.

[0049] S2, connect the air inlet 101 to the gas supply equipment to allow gas to flow into the metal casing 1, and adjust the gas flow rate and pressure to meet actual needs. The gas is preferably helium.

[0050] S3, connect the metal casing 1 to the high-voltage end of the power supply, ground the grounding electrode 3, slowly increase the voltage, and adjust the voltage, frequency, flow rate and pressure of the power supply and working gas according to actual needs, so that the gas molecules in the metal casing 1 are ionized and plasma is generated.

[0051] Plasma technology plays a crucial role in the field of electronic device manufacturing.

[0052] Plasma etching is a key miniaturization technique in semiconductor manufacturing. By adjusting the gas composition (such as CF4 and Cl2), power, and pressure, plasma can precisely remove specific material layers, achieving sub-micron pattern transfer. Compared to traditional wet etching, it offers advantages such as high anisotropy, less contamination, and stronger controllability, making it suitable for processing structures such as channels and isolation trenches in advanced chips.

[0053] In plasma-enhanced chemical vapor deposition (PECVD) or physical vapor deposition (PVD), plasma excites precursor gases, promoting thin film growth on the substrate surface. For example, the deposition of insulating layers such as silicon dioxide and silicon nitride, as well as metal interconnect layers, relies on this technology, which can significantly improve film uniformity, density, and adhesion. Chemical vapor deposition (CVD), on the other hand, enables the growth of single-crystal silicon epitaxial layers, providing high-quality substrates for transistor manufacturing.

[0054] Plasma cleaning utilizes active particles (such as oxygen ions and free radicals) to react with surface contaminants, removing organic residues, oxides, or particles without damaging the substrate. This process can improve bond strength and reduce contact resistance, making it indispensable, especially in wafer cleaning before semiconductor packaging. Furthermore, plasma can be used for surface activation (such as increasing hydrophilicity) or passivation, optimizing compatibility with subsequent processes.

[0055] With the continuous development of science and technology, the requirements for sample pretreatment techniques are becoming increasingly stringent in many fields such as materials science, environmental science, and chemical analysis. Traditional thermal desorption methods often suffer from drawbacks such as low desorption efficiency, long operation time, and difficulty in achieving precise control when processing certain complex samples. For example, when performing thermal desorption on solid samples containing a large amount of volatile organic compounds (VOCs), conventional heating methods may lead to uneven heating of the sample, resulting in some components not being fully desorbed. Furthermore, the desorption process may trigger some side reactions, affecting the accuracy of subsequent analysis and detection.

[0056] Meanwhile, plasma technology, as a powerful means of material processing, has received widespread attention in recent years. However, when relying solely on plasma to process samples, it is difficult to achieve ideal processing results for some samples that require a specific temperature atmosphere to effectively release components. For example, certain organic polymer materials require specific thermal conditions to induce the diffusion of certain internal components outward, thereby interacting with the plasma.

[0057] Laser technology, with its high energy density and precise focusing, makes rapid local heating of samples possible. However, in practical applications, laser heating alone cannot meet the needs of some scenarios requiring multi-faceted processing. For example, when processing samples that contain components that can be released through thermal desorption and require further modification or reaction in a plasma environment, neither laser heating nor plasma treatment alone is sufficient.

[0058] Combining thermal desorption, laser, and plasma technologies to achieve synergy among these techniques is of great significance for improving the efficiency and quality of sample pretreatment and expanding its applications in fields such as materials analysis, environmental monitoring, and chemical research.

[0059] The in-situ ionization technique for drug residues utilizes a thermal desorption laser-assisted plasma source device, a three-dimensional moving stage, a heating plate fixed on the three-dimensional moving stage, and a laser-assisted heating device, as described in this invention. The specific operation is as follows.

[0060] Liquid sample testing steps:

[0061] S1. Use standards to calibrate the mass spectrometer and plasma discharge parameters to ensure the equipment is in an accurate detection state, and place the sample on the heating platform.

[0062] S2, the plasma is applied to the sample to be tested, and the mass spectrometer uses a single scan mode to detect and obtain the signal value.

[0063] S3, determine whether the signal value has reached the specified value. If the signal value has not reached the specified value, execute S4; if the signal value has reached the specified value, execute S6.

[0064] S4, the heating platform is heated by 8-15°C, and S2 is repeated. If the temperature of the heating platform reaches the upper limit, then S5 is executed.

[0065] S5, use a laser-assisted heating device to heat the sample. Increase the energy of the laser-assisted heating device by 0.5-1W, and repeat S2.

[0066] S6, save the current detection method and output the mass spectrometry detection results. The detection method includes mass spectrometry parameters, plasma spray gun gas flow rate, current and voltage parameters, heating platform heating temperature, and laser-assisted heating equipment energy.

[0067] Solid sample testing steps:

[0068] S1. Use standards to calibrate the mass spectrometer and plasma discharge parameters to ensure the equipment is in an accurate detection state, and place the sample on the heating platform.

[0069] S2, set the sample range and target mass spectrum ion pairs, let the plasma act on the sample to be tested, and use the three-dimensional moving stage to drive the sample to be tested to move back and forth, so that the mass spectrometer can be detected in continuous scanning mode to obtain signal values.

[0070] S3, determine whether the signal value has reached the specified value. If the signal value has not reached the specified value, execute S4; if the signal value has reached the specified value, execute S6.

[0071] S4, the heating platform is heated by 8-15°C, and S2 is repeated. If the temperature of the heating platform reaches the upper limit, then S5 is executed.

[0072] S5, use a laser-assisted heating device to heat the sample. Increase the energy of the laser-assisted heating device by 0.5-1W, and repeat S2.

[0073] S6 saves the current detection method and outputs the mass spectrometry detection results. The mass spectrometry data is reconstructed into a mass spectrometry image, displaying the concentration content at each location of the sample. The detection method includes mass spectrometry parameters, plasma spray gun gas flow rate, current and voltage parameters, heating platform heating temperature, and laser-assisted heating equipment energy.

[0074] In some embodiments, the temperature range of the heating platform is 30-200°C, the energy of the laser-assisted heating device is 0.5W-3W, the heating platform heats up by 10°C each time, and the energy of the laser-assisted heating device increases by 0.5W each time.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A thermal desorption laser assisted plasma source apparatus, characterized by: The utility model relates to a kind of cooling device, including metal shell (1), ceramic tube (2), ground electrode (3) and cooling jacket (4), wherein, Air inlet (101) is set on the circumferential side of the metal shell (1); The ceramic tube (2) is fixedly arranged in the metal shell (1), and is arranged with interval with it; The ground electrode (3) is fixedly arranged in the ceramic tube (2); The cooling jacket (4) includes fixed seat (41), control pipe (42) and control ball (43), the fixed seat (41) is fixedly arranged on the metal shell (1), and the inside is equipped with cavity (401);The control pipe (42) is located in the cavity (401), and both ends of the control pipe (42) are stretched out from the fixed seat (41) and are rotatably connected with the fixed seat (41), and the control pipe (42) is equipped with two communication holes (402), and the communication hole (402) is communicated with the inside of the cavity (401) and the control pipe (42);The control ball (43) is movably arranged in the control pipe (42), and the control ball (43) blocks the communication hole (402) or blocks the position in the control pipe (42) between the two communication holes (402).

2. A thermal desorption laser assisted plasma source apparatus as claimed in claim 1, characterized in that: The cooling jacket (4) is provided with a plurality of, and a plurality of the cooling jacket (4) is arranged along the axial direction of the metal shell (1) and is tightly arranged, and a plurality of the control pipe (42) is sealed in sequence.

3. A thermal desorption laser assisted plasma source device as claimed in claim 1, characterized in that: The control pipe (42) includes pipe body (421), extension cylinder (422) and baffle (423), wherein, The pipe body (421) is located in the cavity (401), and both ends of the pipe body (421) are rotatably arranged on the fixed seat (41); One end of the extension cylinder (422) penetrates and is fixed on the circumferential side of the pipe body (421), and the control ball (43) is slidably arranged between the pipe body (421) and the extension cylinder (422); The baffle (423) is sealingly fixed to one end of the extension cylinder (422) away from the pipe body (421).

4. A thermal desorption laser assisted plasma source device as claimed in claim 3, characterized in that: The control pipe (42) further includes blocking pipe (424) and two partitions (425), wherein, The blocking pipe (424) is arranged with interval in one end of the pipe body (421), and a medium hole (403) is formed in the circumferential side of the blocking pipe (424), and the control ball (43) can block the blocking pipe (424); The partition (425) is sealingly fixed between the blocking pipe (424) and the pipe body (421), and the two partitions (425) are oppositely arranged on the two sides of the medium hole (403) and one of the control balls (43).

5. A thermal desorption laser assisted plasma source device as claimed in claim 4, characterized in that: The cooling jacket (4) further includes water collecting pipe (44), one end of the water collecting pipe (44) is fixedly arranged in the top of the cavity (401), and the other end of the water collecting pipe (44) can be sealingly communicated with the communication hole (402).

6. A thermal desorption laser assisted plasma source device as claimed in claim 5, characterized in that: The cooling jacket (4) further includes water distribution pipe (45), the water distribution pipe (45) is circular ring, and is fixedly arranged in the cavity (401), a plurality of water distribution holes (404) are formed in the circumferential side of the water distribution pipe (45), and the water distribution pipe (45) can be sealingly communicated with the communication hole (402).

7. A thermal desorption laser assisted plasma source device as claimed in claim 4, characterized in that: The side of the pipe body (421) connected with the extension cylinder (422) is W-shaped.

8. A thermal desorption laser assisted plasma source device as claimed in claim 3, characterized in that: The communication holes (402) are arranged on the blocking plates (423).

9. A thermal desorption laser assisted plasma source device as claimed in claim 8, characterized in that: Each of the blocking plates (423) is provided with a plurality of the communication holes (402), and the plurality of the communication holes (402) on the same blocking plate (423) are arranged in a circumferential array around the axis of the extension cylinder (422).

10. A method of using a thermal desorption laser-assisted plasma source device as claimed in any one of claims 1-9, characterized in that, The method comprises the following steps: S1, the two ends of the control pipe (42) are connected with a cooling medium circulating device, the position of the control ball (43) is adjusted, and the flow direction of the cooling medium in the cooling jacket (4) is controlled; S2, the air inlet (101) is connected with a gas supply device, and gas flows into the metal shell (1); S3, the metal shell (1) is connected to a high-voltage end of a power supply, the grounding electrode (3) is grounded, and the gas molecules in the metal shell (1) are ionized to generate plasma.

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