X-ray imaging detection module, detection module group, detector and detection device

Abstract

The invention provides an X-ray imaging detection module, a detection module group, a detector and a detection device. The X-ray imaging detection module includes: a scintillator structure; the photodiode array structure is arranged on the scintillator structure in an optical coupling manner; the second surface of the first circuit board is electrically connected to the photodiode array structure, the first surface of the first circuit board comprises a first electrode array and a second electrode array, and electric signals of the photodiode array structure are fanned out to the first electrode array; a plurality of analog-to-digital conversion chips and at least one supporting part, the plurality of analog-to-digital conversion chips are stacked on the first surface of the first circuit board, the at least one supporting part and the plurality of analog-to-digital conversion chips are arranged in a staggered manner, and each supporting part is arranged between two analog-to-digital conversion chips; a chip electrode of each analog-to-digital conversion chip is connected with the first electrode array and the second electrode array through electrode leads, and digital signals output by the analog-to-digital conversion chips are output by the second electrode array.

Description

Technical Field

[0001] The present disclosure relates to the technical field of X-ray imaging detection, and in particular to an X-ray imaging detection module, a detection module, a detector, and a detection device. Background Art

[0002] In recent years, with the continuous development of X-ray imaging detection technology in the medical, security, and industrial CT application fields, the image recognition accuracy of X-ray inspection equipment has been gradually improving. This requires the imaging detection modules in X-ray inspection equipment to have smaller and larger pixel sizes. However, the increase in the number of pixels leads to more signal outputs, making it increasingly difficult to fan out high-density signals in circuit systems due to space constraints. Summary of the Invention

[0003] The solution disclosed herein provides an X-ray imaging detection module, a detection module, a detector, and a detection device.

[0004] According to one aspect of an embodiment of the present disclosure, an X-ray imaging detection module is provided, wherein the X-ray imaging detection module includes: a scintillator structure; a photodiode array structure, the photodiode array structure is optically coupled to the scintillator structure; a first circuit board, the first circuit board includes a first surface and a second surface, the second surface of the first circuit board is electrically connected to the photodiode array structure, the first surface of the first circuit board includes a first electrode array and a second electrode array, the electrical signal of the photodiode array structure fans out to the first electrode array; a plurality of analog-to-digital conversion chips and at least one supporting portion, the plurality of analog-to-digital conversion chips are stacked on the first surface of the first circuit board, the at least one supporting portion is staggered with the plurality of analog-to-digital conversion chips and each supporting portion is arranged between two analog-to-digital conversion chips, so that a lead space is formed between the two analog-to-digital conversion chips and the chip electrodes are exposed, the chip electrodes of each analog-to-digital conversion chip are connected to the first electrode array and the second electrode array through electrode leads, and the digital signal output by the analog-to-digital conversion chip is output by the second electrode array.

[0005] Furthermore, the X-ray imaging detection module further includes a shielding portion, which is disposed on the first surface of the first circuit board, and the plurality of analog-to-digital conversion chips are stacked on the shielding portion.

[0006] Furthermore, the shielding portion is adhered to the first surface of the first circuit board, and the material of the shielding portion includes tungsten, lead, molybdenum or a composite material.

[0007] Furthermore, the X-ray imaging detection module further includes a protective layer, which covers the first electrode array, the second electrode array, the electrode leads and the analog-to-digital conversion chip.

[0008] Furthermore, the first surface of the first circuit board also includes a third electrode array, which is electrically connected to the second electrode array, the digital signal is fanned out from the second electrode array to the third electrode array, and the spacing between the third electrodes in the third electrode array is greater than the spacing between the second electrodes in the second electrode array.

[0009] According to another aspect of an embodiment of the present disclosure, a method for preparing an X-ray imaging detection module is also provided, wherein the method for preparing the X-ray imaging detection module includes: providing a first circuit board, the first circuit board including a first surface and a second surface, the first surface of the first circuit board including a first electrode array and a second electrode array; stacking a plurality of analog-to-digital conversion chips and at least one supporting portion on the first surface of the first circuit board, so that the at least one supporting portion and the plurality of analog-to-digital conversion chips are staggered and each supporting portion is arranged between two analog-to-digital conversion chips, a lead space is formed between the two analog-to-digital conversion chips and the chip electrodes are exposed, and the chip electrodes of each analog-to-digital conversion chip are connected to the first electrode array and the second electrode array through electrode leads; a photodiode array structure is electrically connected on the second surface of the first circuit board, and the electrical signal of the photodiode array structure fans out to the first electrode array; and the scintillator structure is optically coupled on the photodiode array structure.

[0010] Furthermore, before stacking a plurality of analog-to-digital conversion chips and at least one supporting portion on the first surface of the first circuit board, the method also includes: setting a shielding portion on the first surface of the first circuit board, and stacking a plurality of analog-to-digital conversion chips and at least one supporting portion on the first surface of the first circuit board includes: stacking a plurality of analog-to-digital conversion chips and at least one supporting portion on the shielding portion.

[0011] Furthermore, before electrically connecting the photodiode array structure on the second surface of the first circuit board, the method further includes covering the first electrode array, the second electrode array, the electrode leads and the analog-to-digital conversion chip with a protective layer.

[0012] Furthermore, the first surface of the first circuit board also includes a third electrode array, which is electrically connected to the second electrode array, the digital signal is fanned out from the second electrode array to the third electrode array, and the spacing between the third electrodes in the third electrode array is greater than the spacing between the second electrodes in the second electrode array.

[0013] According to another aspect of an embodiment of the present disclosure, an X-ray imaging detection module is also provided, wherein the X-ray imaging detection module includes a second circuit board and the above-mentioned X-ray imaging detection module, the second circuit board includes a first groove and a first protrusion, the top of the first protrusion includes a fourth electrode array, multiple analog-to-digital conversion chips and multiple support parts of the X-ray imaging detection module are accommodated in the first groove, and the third electrode array is electrically connected to the fourth electrode array, and the complete projection of the second circuit board in a direction perpendicular to the scintillator structure is located within the scintillator structure.

[0014] Furthermore, the second circuit board further includes a first heat dissipation hole array, the first heat dissipation hole array is opposite to the analog-to-digital conversion chip, and each first heat dissipation hole in the first heat dissipation hole array is filled with a thermal conductive material.

[0015] Furthermore, the X-ray imaging detection module also includes a first heat conducting portion, which is located between the analog-to-digital conversion chip and the first heat dissipation hole array.

[0016] Furthermore, the second circuit board also includes a flexible circuit board portion or a first connector, which is located on a side of the second circuit board opposite to the analog-to-digital conversion chip, and an end portion of the flexible circuit board portion includes a second connector.

[0017] Furthermore, the flexible circuit board portion is formed separately from the hard board portion of the second circuit board at a position predetermined distance from an edge of the second circuit board, and the flexible circuit board portion extends along a stacking direction of the analog-to-digital conversion chip.

[0018] According to another aspect of an embodiment of the present disclosure, an X-ray imaging detection module is also provided, wherein the X-ray imaging detection module includes a third circuit board and a plurality of the above-mentioned X-ray imaging detection modules, the third circuit board includes a plurality of second grooves and second protrusions, the top of the second protrusion includes a plurality of fifth electrode arrays, the plurality of analog-to-digital conversion chips and a plurality of support parts in each X-ray imaging detection module are accommodated in a second groove, and the third electrode array is electrically connected to the fifth electrode array.

[0019] Furthermore, the third circuit board also includes a plurality of second heat dissipation hole arrays, the plurality of second heat dissipation hole arrays corresponding to the plurality of second grooves, each second heat dissipation hole array is opposite to the analog-to-digital conversion chip, and each second heat dissipation hole in the second heat dissipation hole array is filled with thermal conductive material.

[0020] Furthermore, the X-ray imaging detection module also includes a second heat conducting portion, which is located between the analog-to-digital conversion chip and the second heat dissipation hole array.

[0021] According to another aspect of an embodiment of the present disclosure, an X-ray imaging detector is also provided, wherein the X-ray imaging detector includes the above-mentioned X-ray imaging detection module, and the X-ray imaging detector also includes a first mounting bracket and a first signal processing module, the first mounting bracket is arranged on the side of the second circuit board opposite to the first groove, the first signal processing module is installed on the first mounting bracket, and the first signal processing module is electrically connected to the second circuit board of the X-ray imaging detection module.

[0022] Furthermore, the X-ray imaging detector also includes an intermediate bracket and a third heat-conducting part, the intermediate bracket is arranged on the side of the second circuit board opposite to the first groove, the first mounting bracket is arranged on the intermediate bracket, and the third heat-conducting part is arranged between the first heat dissipation hole array of the second circuit board and the intermediate bracket.

[0023] According to another aspect of an embodiment of the present disclosure, an X-ray imaging detector is also provided, wherein the X-ray imaging detector includes the above-mentioned X-ray imaging detection module, and the X-ray imaging detector also includes a second mounting bracket and a second signal processing circuit, the second mounting bracket is arranged on the side of the third circuit board of the X-ray imaging detection module opposite to the second groove, and the second signal processing circuit is installed on the protrusion located on the edge of the third circuit board of the X-ray imaging detection module.

[0024] Furthermore, the X-ray imaging detector further includes a plurality of fourth heat conducting portions corresponding to the plurality of second grooves, and each fourth heat conducting portion is arranged between the second heat dissipation hole array of the third circuit board and the second mounting bracket.

[0025] According to another aspect of the embodiments of the present disclosure, an X-ray imaging detection device is provided, which includes the above-mentioned X-ray imaging detector.

[0026] By applying the technical solution disclosed in the present invention, the scintillator structure is optically coupled with a photodiode array structure having high-density photodiodes, so that the X-rays irradiated on the scintillator structure are converted into high-density electrical signals through the joint action of the scintillator and the photodiode array structure. The second surface of the first circuit board is electrically connected to the photodiode array structure, and the high-density electrical signals are fanned out to the first electrode array on the first surface of the first circuit board. A plurality of analog-to-digital conversion chips are stacked on the first surface of the first circuit board, and a support portion is provided between each two analog-to-digital conversion chips, so that a lead space can be formed between the two analog-to-digital conversion chips and the chip electrodes are exposed. By utilizing the lead space, the chip electrodes of each analog-to-digital conversion chip are electrically connected to the first electrode array and the second electrode array on the first surface of the first circuit board through electrode leads. The electrical signal is input to the analog-to-digital conversion chip by the first electrode array, and converted into a digital signal by the analog-to-digital conversion chip, and then output by the second electrode array.

[0027] By stacking multiple analog-to-digital conversion chips and providing lead spaces between the chips, greater interconnection space is created between the first electrode array and the chip electrodes of the analog-to-digital conversion chip, reducing the risk of contact short circuits between the electrode leads. This allows the high-density electrical signals output by the photodiode array structure to be fanned out to the analog-to-digital conversion chip for processing. Furthermore, due to the stacking of multiple analog-to-digital conversion chips on the first circuit board, the X-ray imaging detection module uses the edge of the scintillator structure as the module edge, which facilitates the arbitrary and tight splicing of the X-ray imaging detection module in a direction perpendicular to the stacking direction of the analog-to-digital conversion chips. This avoids missing information about the detected target due to loose splicing while better meeting the larger detection size required in practical applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0029] Figure 1 is a schematic diagram illustrating an X-ray imaging detection module according to an embodiment of the present disclosure.

[0030] Figure 2 Schematic diagram showing a scintillator structure of an X-ray imaging detection module according to an embodiment of the present disclosure.

[0031] Figure 3 Schematic diagram showing the photodiode array structure of an X-ray imaging detection module according to one embodiment of the present disclosure.

[0032] Figure 4FIG. 1 is a schematic diagram illustrating a first surface of a first circuit board of an X-ray imaging detection module according to an embodiment of the present disclosure.

[0033] Figure 5 Schematic diagram showing the second surface of the first circuit board of the X-ray imaging detection module according to one embodiment of the present disclosure.

[0034] Figure 6 Schematic diagram of an X-ray imaging detection module according to an embodiment of the present disclosure.

[0035] Figure 7 is a schematic diagram showing an X-ray imaging detection module according to another embodiment of the present disclosure.

[0036] Figure 8 is a schematic diagram illustrating an X-ray imaging detector according to an embodiment of the present disclosure.

[0037] Figure 9 is a schematic diagram illustrating an X-ray imaging detector according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs.

[0040] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0041] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of layers and regions is exaggerated, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0042] The present disclosure provides an X-ray imaging detection module. Figures 1 to 5 , Figure 1 is a schematic structural diagram showing an X-ray imaging detection module 100 according to an embodiment of the present disclosure, Figure 2 is a schematic diagram showing a scintillator structure of an X-ray imaging detection module according to an embodiment of the present disclosure, Figure 3 is a schematic diagram showing a photodiode array structure of an X-ray imaging detection module according to an embodiment of the present disclosure, Figure 4 is a schematic diagram showing a first surface of a first circuit board of an X-ray imaging detection module according to an embodiment of the present disclosure, Figure 5 Schematic diagram showing the second surface of the first circuit board of the X-ray imaging detection module according to one embodiment of the present disclosure.

[0043] like Figures 1 to 5As shown, the X-ray imaging detection module 100 includes: a scintillator structure 101; a photodiode array structure 102, wherein the photodiode array structure 102 is optically coupled to the scintillator structure 101; a first circuit board 104, wherein the first circuit board 104 includes a first surface 1048 and a second surface 1049, wherein the second surface 1049 of the first circuit board 104 is electrically connected to the photodiode array structure 102, wherein the first surface 1048 of the first circuit board 104 includes a first electrode array composed of first electrodes 1041 and a second electrode array composed of second electrodes 1042, wherein the electrical signal of the photodiode array structure 102 is fanned out to the first surface 1048. An electrode array; a plurality of analog-to-digital conversion chips 106 and at least one supporting portion 107, wherein the plurality of analog-to-digital conversion chips 106 are stacked on the first surface 1048 of the first circuit board 104, the at least one supporting portion 107 and the plurality of analog-to-digital conversion chips 106 are staggered and each supporting portion 107 is arranged between two analog-to-digital conversion chips 106, so that a lead space 108 is formed between the two analog-to-digital conversion chips 106 and the chip electrodes (not shown in the figure) are exposed, the chip electrodes of each analog-to-digital conversion chip 106 are connected to the first electrode array and the second electrode array through electrode leads 109, and the digital signal output by the analog-to-digital conversion chip 106 is output by the second electrode array.

[0044] Specifically, after the X-rays released by the ray source penetrate the object to be inspected, the X-rays carrying the information of the object to be inspected are irradiated on the scintillator structure 101 and absorbed by the scintillator structure 101, and the scintillator structure 101 converts the X-rays into light signals. Figure 2 As shown, the scintillator structure 101 may include a scintillator array in the form of a pixel array consisting of a large number of scintillators 1011. Figure 2 The number of scintillators 1011 in the scintillator structure 101 is merely illustrative and is not intended to be limiting. Furthermore, the scintillator structure may include a single piece of scintillator. Furthermore, the scintillator may be made of materials such as GOS, GGAG, or CWO.

[0045] Because Figure 2 The scintillator 1011 in the scintillator structure 101 shown is similar to the scintillator 1011 in the scintillator structure 101 shown in FIG. Figure 3The high-density photodiodes 1021 in the photodiode array structure 102 are optically coupled one by one. The photodiode array structure 102 absorbs the light signal generated by the scintillator structure 101 and converts it into a high-density electrical signal. It should be understood that the photodiode array structure is composed of multiple photodiodes. The more photodiodes there are per unit area, the higher the density of the generated electrical signal. When the number of photodiodes in the photodiode array structure is sufficient to meet the high resolution requirements in practical applications, the electrical signal converted by the photodiode array structure can be called a high-density electrical signal. Figure 3 The number of photodiodes 1021 in the photodiode array structure 102 is only for illustration and is not limited herein. As long as the number of photodiodes 1021 is the same as that of the photodiode array structure 102, Figure 2 The number of scintillators 1011 shown corresponds. Figure 3 is a top view of the photodiode array structure 102, Figure 2 The light signal generated by the scintillator structure 101 is Figure 3 The photodiode array structure 102 shown in FIG. 1 is incident on one side of the photodiode 1021, and the high-density electrical signal converted by the photodiode array structure 102 is incident from the other side of the photodiode array structure 102 through the photodiode 1021. Figure 1 The electrode bump array formed by the electrode bumps 1022 shown is led out, and the electrode bump array includes anode bumps and cathode bumps.

[0046] The first circuit board 104 includes Figure 4 The first side 1048 shown and the Figure 5 The first surface 1048 of the first circuit board 104 includes a first electrode array consisting of first electrodes 1041 and a second electrode array consisting of second electrodes 1042, as shown in FIG. Figure 4 The number and array arrangement of the first electrodes 1041 and the second electrodes 1042 shown are merely illustrative and are not intended to be limiting. The second surface 1049 of the first circuit board 104 includes an anode array consisting of anodes 1044 and a cathode array consisting of cathodes 1045. Figure 5 The number and arrangement of anodes 1044 and cathodes 1045 shown are for illustrative purposes only and are not intended to be limiting. The anode and cathode arrays on the second side 1049 of the first circuit board 104 are electrically connected to the anode and cathode bumps in the electrode bump array of the photodiode array structure 102 via conductive adhesive. High-density electrical signals are fanned out to the first electrode array on the first side 1048 of the first circuit board 104 via internal leads on the first circuit board. Materials for the first circuit board include FR4, ceramic, or copper-clad laminate.

[0047] A plurality of analog-to-digital conversion chips 106 are stacked on the first surface 1048 of the first circuit board 104, and a support portion 107 is provided between every two analog-to-digital conversion chips 106. Figure 1 As shown, the size of the support portion 107 is smaller than that of the analog-to-digital conversion chip 106. The chip electrodes of the analog-to-digital conversion chip 106 (not shown in the figure) are located at the edge of the chip, thereby forming a lead space 108 between the two analog-to-digital conversion chips 106 and at the edge of the analog-to-digital conversion chip 106 and exposing the chip electrodes. Using the lead space 108, the chip electrodes of each analog-to-digital conversion chip 106 are electrically connected to the first electrode array and the second electrode array of the first surface 1048 of the first circuit board 104 through the electrode lead 109. The electrical signal generated by the photodiode array 102 is input to the analog-to-digital conversion chip 106 by the first electrode array, and is converted into a digital signal by the analog-to-digital conversion chip 106, and the digital signal is output to the second electrode array. The analog-to-digital conversion chip 106 can be fixed to the support portion 107 by, for example, epoxy structural adhesive.

[0048] According to the technical solution of this embodiment, by stacking multiple analog-to-digital conversion chips 106 and setting the lead space 108 between the analog-to-digital conversion chips 106, a larger interconnection space is provided between the first electrode array and the second electrode array and the chip electrodes of the analog-to-digital conversion chip 106, thereby reducing the risk of contact short circuit between the electrode leads 109, thereby allowing the high-density electrical signal output by the photodiode array structure 102 to be fanned out to multiple analog-to-digital conversion chips 106 for processing. Furthermore, due to the stacking of multiple analog-to-digital conversion chips 106 on the first circuit board 104, the X-ray imaging detection module 100 can use the edge of the scintillator structure 101 as the module edge, which is beneficial for the scintillator structure 101 of the X-ray imaging detection module 100 to be tightly spliced ​​on all four sides in a direction perpendicular to the stacking direction of the analog-to-digital conversion chip 106, thereby avoiding the loss of information of the target being inspected due to loose splicing, and better meeting the larger detection size required in practical applications. In addition, the splicing of multiple X-ray imaging detection modules enables the surfaces of multiple scintillator structures to be spliced ​​into an arc or straight line shape, which is beneficial for the X-ray imaging detection module to be applicable to detection equipment of more shapes.

[0049] It is worth noting that, depending on the size of the scintillator structure and the density of the photodiodes, multiple stacked analog-to-digital conversion chips can be arranged on the first circuit board to meet the signal processing requirements, such as Figure 4 As shown, two groups of stacked analog-to-digital conversion chips can be provided, each group of stacked analog-to-digital conversion chips can include multiple analog-to-digital conversion chips 106, and each group of multiple analog-to-digital conversion chips can be equipped with respective first electrode arrays and second electrode arrays.

[0050] According to an embodiment of the present disclosure, the X-ray imaging detection module 100 may further include a shielding portion 105 disposed on the first surface 1048 of the first circuit board 104, with the multiple analog-to-digital conversion chips 106 stacked on the shielding portion 105. Specifically, the shielding portion 105 may be attached to the first surface 1048 of the first circuit board 104, for example, using epoxy-based structural adhesive. The analog-to-digital conversion chips 106 adjacent to the shielding portion 105 may also be attached to the shielding portion 105 using epoxy-based structural adhesive. The shielding portion 105 may be made of any suitable material, such as tungsten, lead, molybdenum, or a composite material. The shielding portion 105 is located between the first surface 1048 of the first circuit board 104 and the analog-to-digital conversion chips 106. Thus, the shielding portion 105 prevents radiation damage to the analog-to-digital conversion chips 106 caused by some X-rays that pass through the scintillator structure 101, the photodiode array structure 102, and the first circuit board 104, thereby improving the shielding capability of the X-rays directed toward the analog-to-digital conversion chips 106.

[0051] According to an embodiment of the present disclosure, the X-ray imaging detection module 100 further includes a protective layer 110, which covers the first electrode array, the second electrode array, the electrode leads 109, and the analog-to-digital conversion chip 106. The material of the protective layer 110 can be any suitable material, such as glue. The protective layer 110 is used to protect the first electrode array, the second electrode array, the electrode leads 109, and the analog-to-digital conversion chip 106 from external physical and moisture effects, thereby ensuring the performance of the X-ray imaging detection module 100.

[0052] According to an embodiment of the present disclosure, the first surface 1048 of the first circuit board 104 may further include a third electrode array consisting of third electrodes 1043, the third electrode array being electrically connected to the second electrode array, the digital signal being fanned out from the second electrode array to the third electrode array, and the spacing between the third electrodes 1043 in the third electrode array being greater than the spacing between the second electrodes 1042 in the second electrode array. Figure 4The number and array arrangement of the third electrodes 1043 shown are merely schematic and are not intended to be limiting. The third electrodes 1043 also include third electrode bumps, which may be tin balls, gold balls, or copper core balls. Furthermore, the spacing between the third electrodes 1043 is greater than the spacing between the second electrodes 1042 in the second electrode array, so that the third electrodes 1043 constitute large-pitch electrodes on the PCB, wherein the spacing between the second electrodes 1042 is, for example, approximately 70 microns, and the spacing between the third electrodes 1043 is, for example, approximately 1 mm. By electrically connecting the third electrode array to the second electrode array, the conversion from the small-pitch electrodes of the analog-to-digital conversion chip to the large-pitch electrodes on the PCB is achieved, thereby facilitating subsequent circuit assembly. Furthermore, the analog-to-digital conversion chip 106 can be tested by connecting to the large-pitch third electrodes through a probe, and subsequent assembly can be performed after the test passes, greatly improving product yield. It is worth noting that the second electrode array also includes working electrodes such as power supply electrodes, ground electrodes and control electrodes for ensuring the normal operation of the analog-to-digital conversion chip, and the third electrode array also includes electrodes corresponding to these working electrodes. The third electrode array is electrically connected to the second electrode array through the internal leads of the first circuit board.

[0053] According to an embodiment of the present disclosure, the X-ray imaging detection module 100 further includes a sealant 103, which fills the gap between the first circuit board 104 and the photodiode array structure 102 so as to protect the electrodes on the second side 1049 of the first circuit board 104 and the electrodes of the photodiode array structure 102 from external environmental influences such as moisture, and provides support between the first circuit board 104 and the photodiode array structure 102.

[0054] According to an embodiment of the present disclosure, the complete projection of the photodiode array structure 102 in a direction perpendicular to the scintillator structure 101 is located within the scintillator structure 101, and the complete projection of the first circuit board 104 in a direction perpendicular to the scintillator structure 101 is located within the scintillator structure 101. Therefore, this structure is more conducive to the four-sided tight splicing of the scintillator structure 101 of the X-ray imaging detection module 100 in a direction perpendicular to the stacking direction of the analog-to-digital conversion chip 106, thereby avoiding the omission of detected target information due to loose splicing while better meeting the larger detection size required in practical applications.

[0055] The present disclosure also provides a method for preparing an X-ray imaging detection module. Figures 1 to 5The method includes: providing a first circuit board 104, the first circuit board 104 including a first surface 1048 and a second surface 1049, the first surface 1048 of the first circuit board 104 including a first electrode array and a second electrode array; stacking a plurality of analog-to-digital conversion chips 106 and at least one supporting portion 107 on the first surface 1048 of the first circuit board 104, so that the at least one supporting portion 107 and the plurality of analog-to-digital conversion chips 106 are staggered and each supporting portion 107 is arranged between two analog-to-digital conversion chips 106, forming a lead space 108 between the two analog-to-digital conversion chips 106 and exposing the chip electrodes, the chip electrodes of each analog-to-digital conversion chip 106 are connected to the first electrode array and the second electrode array through electrode leads 109; electrically connecting a photodiode array structure 102 on the second surface 1049 of the first circuit board 104, and the electrical signal of the photodiode array structure 102 is fanned out to the first electrode array; and optically coupling the scintillator structure 101 on the photodiode array structure 102.

[0056] Furthermore, before stacking a plurality of analog-to-digital conversion chips 106 and at least one supporting portion 107 on the first surface 1048 of the first circuit board 104, the method also includes: setting a shielding portion 105 on the first surface 1048 of the first circuit board 104, and stacking a plurality of analog-to-digital conversion chips 106 and at least one supporting portion 107 on the first surface 1048 of the first circuit board 104 includes: stacking a plurality of analog-to-digital conversion chips 106 and at least one supporting portion 107 on the shielding portion 105.

[0057] Furthermore, before electrically connecting the photodiode array structure 102 on the second surface 1049 of the first circuit board 104 , the method further includes covering the first electrode array, the second electrode array, the electrode leads 109 and the analog-to-digital conversion chip 106 with a protective layer 110 .

[0058] Furthermore, the first surface 1049 of the first circuit board 104 also includes a third electrode array, which is electrically connected to the second electrode array, the digital signal is fanned out from the second electrode array to the third electrode array, and the spacing between the third electrodes in the third electrode array is greater than the spacing between the second electrodes in the second electrode array.

[0059] It is worth noting that any relevant description of the above-mentioned X-ray imaging detection module (including but not limited to technical features and their functions, explanations, etc.) can be applied to the preparation method of the X-ray imaging detection module disclosed in the present invention.

[0060] The present disclosure also provides an embodiment of an X-ray imaging detection module. Figure 6 , Figure 6 Schematic diagram of an X-ray imaging detection module according to an embodiment of the present disclosure. Figure 6 As shown, the X-ray imaging detection module 200 includes a second circuit board 201 and the above-mentioned X-ray imaging detection module 100, the second circuit board 201 includes a first groove 2011 and a first protrusion 2012, the top of the first protrusion 2012 includes a fourth electrode array composed of a fourth electrode 2013, the multiple analog-to-digital conversion chips 106 and the multiple support parts 107 of the X-ray imaging detection module 100 are accommodated in the first groove 2011, and the third electrode array is electrically connected to the fourth electrode array, and the complete projection of the second circuit board 201 in a direction perpendicular to the scintillator structure 101 is located within the scintillator structure 101.

[0061] According to this embodiment, Figure 6 As shown, the second circuit board 201 includes a first groove 2011 having a predetermined depth D1, for example, between 0.5 mm and 3 mm, such that the first groove 2011 can accommodate the analog-to-digital conversion chip 106 and the support portion 107. The second circuit board 201 also includes a first protrusion 2012 surrounding the first groove 2011. For example, the first groove 2011 can be formed in the second circuit board 201 through a circuit board trenching process, with the untrenched portion forming the first protrusion 2012. The top of the first protrusion 2012 has a fourth electrode array composed of a plurality of fourth electrodes 2013. This fourth electrode array can be electrically connected to the third electrode array on the first surface 1048 of the first circuit board 104. The second circuit board 201 facilitates the installation of the X-ray imaging detection module 100 and facilitates signal input and output during subsequent use. Furthermore, by accommodating the stacked analog-to-digital conversion chip 106 and support portion 107 within the first recess 2011 of the second circuit board 201, the size and footprint of the X-ray imaging detection module are reduced, thereby facilitating the use of multiple X-ray imaging detection modules in a confined space. Furthermore, by providing a fourth electrode array on top of the first protrusion 2012 to directly connect to the third electrode array, the use of an additional wired connector is eliminated, further reducing the size and footprint of the X-ray imaging detection module. Furthermore, the fourth electrode 2013 is also a PCB electrode with a large spacing, which facilitates connection between the large-pitch third electrode array and the large-pitch fourth electrode array, thereby facilitating assembly and connection of the second circuit board 201 to the first circuit board 104.

[0062] The complete projection of the second circuit board 201 in a direction perpendicular to the scintillator structure 101 is located within the scintillator structure 101, that is, the size of the second circuit board 201 is less than or equal to the size of the scintillator structure 101, so that it does not exceed the scintillator structure 101 in the length and width directions of the scintillator structure 101, thereby ensuring that the scintillator structure can be tightly spliced ​​without being affected by the second circuit board 201.

[0063] According to an embodiment of the present disclosure, the second circuit board 201 further includes a first heat dissipation hole array consisting of first heat dissipation holes 2015. The first heat dissipation hole array is opposite the analog-to-digital conversion chip 106, and each first heat dissipation hole 2015 in the first heat dissipation hole array is filled with a thermally conductive material. By arranging the first heat dissipation hole array consisting of a plurality of first heat dissipation holes 2015 in the second circuit board 201 in the stacking direction of the analog-to-digital conversion chips, and filling the first heat dissipation holes 2015 with a thermally conductive material such as copper or silver, a high-performance heat dissipation channel is formed in the second circuit board 201, thereby providing an excellent heat dissipation path for the stacked analog-to-digital conversion chips 106.

[0064] According to an embodiment of the present disclosure, the X-ray imaging detection module 200 further includes a first heat conducting portion 202, which is located between the analog-to-digital conversion chip 106 and the first heat dissipation hole array. By disposing the first heat conducting portion 202, such as a thermal pad or thermally conductive adhesive, between the analog-to-digital conversion chip 106 and the first heat dissipation hole array, the analog-to-digital conversion chip 106 and the first heat dissipation hole array can be thermally coupled, thereby further facilitating heat dissipation from the analog-to-digital conversion chip 106.

[0065] According to an embodiment of the present disclosure, the second circuit board 201 further includes a flexible circuit board portion 2016 or a first connector. The flexible circuit board portion 2016 or the first connector is located on a side of the second circuit board 201 opposite the analog-to-digital conversion chip 106. Specifically, the flexible circuit board portion 2016 or the first connector is located on a side of the second circuit board 201 opposite the first groove in the stacking direction of the analog-to-digital conversion chips. The end of the flexible circuit board portion 2016 includes a second connector 2014. The first and second connectors 2014 are used to communicate signals from the third electrode array of the first circuit board 104. The flexible circuit board portion 2016 is formed separately from the rigid board portion at a predetermined distance from the edge of the second circuit board 201 and extends along the stacking direction of the analog-to-digital conversion chips 106.

[0066] The second circuit board 201 can adopt a rigid-flexible circuit board process, and is separated from the hard board part at a position a length D2 away from the edge of the second circuit board 201 to form a flexible circuit board part 2016. The flexible circuit board part 2016 extends upward along the stacking direction of the analog-to-digital conversion chip 106, so it will not hinder the splicing of the X-ray imaging detection module 200 in a direction perpendicular to the stacking direction of the analog-to-digital conversion chip 106.

[0067] According to an embodiment of the present disclosure, the X-ray imaging detection module 200 may further include a sealing structural adhesive 203, which fills the gap between the first protrusion 2012 of the second circuit board 201 and the first circuit board 104, so as to protect the third electrode array of the first surface 1048 of the first circuit board 104 and the fourth electrode array of the second circuit board 201 from external environmental influences such as moisture, and provide support between the first circuit board 104 and the second circuit board 201.

[0068] The present disclosure also provides another embodiment of an X-ray imaging detection module. Figure 7 , Figure 7 Schematic diagram showing an X-ray imaging detection module according to another embodiment of the present disclosure. Figure 7 As shown, the X-ray imaging detection module 300 includes a third circuit board 301 and multiple X-ray imaging detection modules 100 described above. The third circuit board 301 includes multiple second grooves 3011 and second protrusions 3012. The tops of the second protrusions 3012 include multiple fifth electrode arrays. The multiple analog-to-digital conversion chips and multiple support parts in each X-ray imaging detection module are accommodated in one of the second grooves 3011, and the third electrode array is electrically connected to the fifth electrode array. It is worth noting that after the multiple analog-to-digital conversion chips and multiple support parts in each X-ray imaging detection module are accommodated in one of the second grooves 3011, the scintillator structure in each X-ray imaging detection module is tightly fitted with the scintillator structure in the adjacent X-ray imaging detection module, thereby avoiding the omission of detected target information due to loose splicing.

[0069] According to an embodiment of the present disclosure, the third circuit board also includes a plurality of second heat dissipation hole arrays, the plurality of second heat dissipation hole arrays corresponding to the plurality of second grooves, each second heat dissipation hole array is opposite to the analog-to-digital conversion chip, and each second heat dissipation hole 3015 in the second heat dissipation hole array is filled with thermal conductive material.

[0070] According to an embodiment of the present disclosure, the X-ray imaging detection module 300 further includes a second heat conducting portion 302 , and the second heat conducting portion 302 is located between the analog-to-digital conversion chip and the second heat dissipation hole array.

[0071] It is worth noting that Figure 7 In the X-ray imaging detection module 300 shown in FIG, the specific structure of the circuit structure 310 marked by the dotted line is the same as that of the above reference Figure 6 The X-ray imaging detection module 200 is similar, and a detailed description can be found in the above reference. Figure 6 The description of the X-ray imaging detection module 200 is omitted here.

[0072] The present disclosure also provides an embodiment of an X-ray imaging detector. Figure 8 , Figure 8 is a schematic diagram showing an X-ray imaging detector according to an embodiment of the present disclosure. The X-ray imaging detector 400 includes Figure 6 The X-ray imaging detection module 200 shown in the figure, the X-ray imaging detector 400 also includes a first mounting bracket 402 and a first signal processing module 404, the first mounting bracket 402 is arranged on the side of the second circuit board 201 opposite to the first groove 2011, the first signal processing module 404 is installed on the first mounting bracket 402, the first signal processing module 404 is electrically connected to the second circuit board 201, specifically, the first signal processing module 404 includes a third connector 4041, the first connector of the second circuit board 201 is connected to the third connector 4041 through a connecting line or the second connector 2014 of the second circuit board 201 is electrically connected to the third connector 4041.

[0073] like Figure 8 As shown, the first signal processing module 404 includes a signal processing circuit board 4040 and a first signal processing circuit 4043 disposed on the signal processing circuit board 4040. The first signal processing circuit 4043 may include components such as a signal processing chip. The signal processing circuit board 4040 includes a third connector 4041 and a fourth connector 4042. The third connector 4041 is connected to the second connector 2014 of the second circuit board 201. As a result, digital signals can enter the first signal processing circuit 4043 through the second connector 2014 and the third connector 4041. After being processed by the first signal processing circuit 4043, the signals are output through the fourth connector 4042 to a terminal device, such as a computer for image reconstruction. In addition, the first signal processing circuit 4043 can also transmit control signals and other signals to the analog-to-digital conversion chip 106 via the third connector 4041, the second connector 2014, the fourth electrode array, and the working electrodes in the third electrode array, so that the analog-to-digital conversion chip 106 can operate as required.

[0074] According to an embodiment of the present disclosure, the X-ray imaging detector 400 also includes an intermediate bracket 401 and a third heat-conducting portion 405. The intermediate bracket 401 is arranged on a side of the second circuit board 201 opposite to the first groove 2011, and the third heat-conducting portion 405 is arranged between the first heat dissipation hole array of the second circuit board and the intermediate bracket 401. The first mounting bracket 402 is arranged on the intermediate bracket 401.

[0075] like Figure 8 As shown, the first mounting bracket 402 is disposed on the second circuit board 201 via the intermediate bracket 401. The intermediate bracket 401 is fixed to the second circuit board 201 using a structural adhesive bonding process. The intermediate bracket 401 and the first mounting bracket 402 are fixed together using pins 403. A third heat conducting portion 405, such as a thermal pad or thermally conductive adhesive, is located between the first heat dissipation hole array and the intermediate bracket 401, thereby conducting heat to the intermediate bracket 401, such as a metal material.

[0076] The present disclosure also provides another embodiment of an X-ray imaging detector. Figure 9 , Figure 9 is a schematic diagram showing an X-ray imaging detector according to another embodiment of the present disclosure. The X-ray imaging detector 500 includes Figure 7 The X-ray imaging detection module 300 shown in the figure, the X-ray imaging detector 500 includes a second mounting bracket 502 and a second signal processing circuit 504, and the second signal processing circuit 504 may include components such as a signal processing chip, for example. The second mounting bracket 502 is arranged on the side of the third circuit board 301 opposite to the second groove, and the second signal processing circuit 504 is installed on the protrusion located on the edge of the third circuit board 301 of the X-ray imaging detection module 300.

[0077] like Figure 9 As shown, the second signal processing circuit 504 is electrically connected to the fifth electrode array of the third circuit board 301 via internal wiring within the third circuit board 301. Signals entering the second signal processing circuit 504 are processed and then output via a fifth connector 505 located on a protruding edge of the third circuit board 301 to a terminal device, such as a computer for image reconstruction. Furthermore, the second mounting bracket 502 can be secured to the third circuit board 301 via screws 503. Furthermore, the second mounting bracket 502 can also include a flange 5021, which can be used to secure the X-ray imaging detector 500 to other components. Furthermore, the second signal processing circuit 504 can transmit control signals and other signals to the analog-to-digital conversion chip 106 via the internal leads of the third circuit board 301, the fifth electrode array, and the working electrodes in the third electrode array, so that the analog-to-digital conversion chip 106 can operate as required.

[0078] According to an embodiment of the present disclosure, the X-ray imaging detector 500 further includes a plurality of fourth heat conducting portions 506 corresponding to the plurality of second grooves 3012 , and each fourth heat conducting portion 506 is arranged between the second heat dissipation hole array of the third circuit board and the second mounting bracket 502 .

[0079] The present disclosure also provides an X-ray imaging detection device, which includes the above-mentioned X-ray imaging detector. The X-ray imaging detection device can be, for example, a medical CT, a security CT, an industrial CT, or other equipment.

[0080] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0081] It should be understood that “one embodiment” or “an embodiment” mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, “in one embodiment” or “in an embodiment” appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned steps / processes does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0082] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0083] The foregoing description is merely a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present disclosure shall be included within the scope of protection of the present disclosure.

Claims

1. An X-ray imaging detection module, wherein: The X-ray imaging detection module includes: Scintillator structure; a photodiode array structure, the photodiode array structure being optically coupled to the scintillator structure; a first circuit board, the first circuit board comprising a first surface and a second surface, the second surface of the first circuit board being electrically connected to the photodiode array structure, the first surface of the first circuit board comprising a first electrode array and a second electrode array, and electrical signals of the photodiode array structure fan out to the first electrode array; A plurality of analog-to-digital conversion chips and at least one supporting portion, the plurality of analog-to-digital conversion chips are stacked on the first surface of the first circuit board, the at least one supporting portion is staggered with the plurality of analog-to-digital conversion chips and each supporting portion is arranged between two analog-to-digital conversion chips, so that a lead space is formed between the two analog-to-digital conversion chips and the chip electrodes are exposed, the chip electrodes of each analog-to-digital conversion chip are connected to the first electrode array and the second electrode array through electrode leads, and the digital signal output by the analog-to-digital conversion chip is output by the second electrode array.

2. The X-ray imaging detection module according to claim 1, wherein: The X-ray imaging detection module further includes a shielding portion, which is disposed on the first surface of the first circuit board, and the plurality of analog-to-digital conversion chips are stacked on the shielding portion.

3. The X-ray imaging detection module according to claim 2, wherein: The shielding portion is adhered to the first surface of the first circuit board, and the material of the shielding portion includes tungsten, lead, molybdenum or a composite material.

4. The X-ray imaging detection module according to claim 1, wherein: The X-ray imaging detection module further includes a protective layer, which covers the first electrode array, the second electrode array, the electrode leads and the analog-to-digital conversion chip.

5. The X-ray imaging detection module according to any one of claims 1 to 4, wherein: The first side of the first circuit board also includes a third electrode array, which is electrically connected to the second electrode array. The digital signal is fanned out from the second electrode array to the third electrode array, and the spacing between the third electrodes in the third electrode array is greater than the spacing between the second electrodes in the second electrode array.

6. An X-ray imaging detection module, wherein: The X-ray imaging detection module includes a second circuit board and the X-ray imaging detection module according to claim 5, the second circuit board includes a first groove and a first protrusion, the top of the first protrusion includes a fourth electrode array, multiple analog-to-digital conversion chips and multiple support parts of the X-ray imaging detection module are accommodated in the first groove, and the third electrode array is electrically connected to the fourth electrode array, and the complete projection of the second circuit board in a direction perpendicular to the scintillator structure is located within the scintillator structure.

7. The X-ray imaging detection module according to claim 6, wherein: The second circuit board further includes a first heat dissipation hole array, the first heat dissipation hole array is opposite to the analog-to-digital conversion chip, and each first heat dissipation hole in the first heat dissipation hole array is filled with a thermal conductive material.

8. The X-ray imaging detection module according to claim 7, wherein: The X-ray imaging detection module further includes a first heat conducting portion, which is located between the analog-to-digital conversion chip and the first heat dissipation hole array.

9. The X-ray imaging detection module according to claim 6, wherein: The second circuit board further includes a flexible circuit board portion or a first connector, which is located on a side of the second circuit board opposite to the analog-to-digital conversion chip, and an end portion of the flexible circuit board portion includes a second connector.

10. The X-ray imaging detection module according to claim 9, wherein: The flexible circuit board portion is formed separately from the hard board portion of the second circuit board at a position predetermined distance from an edge of the second circuit board, and the flexible circuit board portion extends along a direction in which the analog-to-digital conversion chips are stacked.

11. An X-ray imaging detection module, wherein: The X-ray imaging detection module includes a third circuit board and multiple X-ray imaging detection modules according to claim 5, the third circuit board includes multiple second grooves and second protrusions, the top of the second protrusion includes multiple fifth electrode arrays, multiple analog-to-digital conversion chips and multiple support parts in each X-ray imaging detection module are accommodated in a second groove, and the third electrode array is electrically connected to the fifth electrode array.

12. The X-ray imaging detection module according to claim 11, wherein: The third circuit board also includes a plurality of second heat dissipation hole arrays, the plurality of second heat dissipation hole arrays corresponding to the plurality of second grooves, each second heat dissipation hole array opposite to the analog-to-digital conversion chip, and each second heat dissipation hole in the second heat dissipation hole array is filled with thermal conductive material.

13. The X-ray imaging detection module according to claim 12, wherein: The X-ray imaging detection module further includes a second heat conducting portion, which is located between the analog-to-digital conversion chip and the second heat dissipation hole array.

14. An X-ray imaging detector, wherein: The X-ray imaging detector includes the X-ray imaging detection module described in any one of claims 6 to 10, and the X-ray imaging detector also includes a first mounting bracket and a first signal processing module, the first mounting bracket is arranged on the side of the second circuit board opposite to the first groove, the first signal processing module is installed on the first mounting bracket, and the first signal processing module is electrically connected to the second circuit board of the X-ray imaging detection module.

15. The X-ray imaging detector according to claim 14, wherein: The X-ray imaging detector also includes an intermediate bracket and a third heat conducting part. The intermediate bracket is arranged on a side of the second circuit board opposite to the first groove, the first mounting bracket is arranged on the intermediate bracket, and the third heat conducting part is arranged between the first heat dissipation hole array of the second circuit board and the intermediate bracket.

16. An X-ray imaging detector, wherein: The X-ray imaging detector includes the X-ray imaging detection module described in any one of claims 11 to 13, and the X-ray imaging detector also includes a second mounting bracket and a second signal processing circuit, the second mounting bracket is arranged on the side of the third circuit board of the X-ray imaging detection module opposite to the second groove, and the second signal processing circuit is installed on the protrusion located on the edge of the third circuit board of the X-ray imaging detection module.

17. The X-ray imaging detector according to claim 16, wherein: The X-ray imaging detector further includes a plurality of fourth heat conducting portions corresponding to the plurality of second grooves, each of the fourth heat conducting portions being disposed between the second heat dissipation hole array of the third circuit board and the second mounting bracket.

18. An X-ray imaging detection device, wherein: The X-ray imaging detection device includes the X-ray imaging detector according to claim 14 or 15, or the X-ray imaging detection device includes the X-ray imaging detector according to claim 16 or 17.

Images