Laser scribing control method, electronic device, storage medium, and program product

Abstract

Embodiments of the present application provide a laser scribing control method, an electronic device, a storage medium and a program product, a first image of a target workpiece is obtained, workpiece information of the target workpiece and a target path on the target workpiece are determined according to the first image, a laser emitting component is controlled to perform scribing on a plating layer along the target path according to the workpiece information, a second image of the target workpiece is obtained, a quality detection result of the scribing on the plating layer is determined according to the second image, and the laser emitting component is controlled to perform scribing again along the target path in a case where the quality detection result of the scribing does not meet scribing requirements, until the quality detection result of the scribing meets the scribing requirements. Through real-time monitoring of the scribing result and repeated scribing combined with the scribing result, the accuracy of the final scribing result is improved, and the power of the first scribing can be appropriately reduced as a supplement of the first scribing, so as to avoid damaging the substrate and improve the success rate of scribing.

Description

Technical Field

[0001] This application relates to the field of laser scribing, and more particularly to a laser scribing control method, electronic device, storage medium, and program product. Background Technology

[0002] Laser scribing is a technique that uses a laser to selectively remove specific areas of a thin film layer from a substrate. It achieves electrical isolation or structural separation of the thin film layer without damaging the substrate. For example, on a glass substrate coated with a conductive film, laser scribing can divide the continuous conductive film into multiple independent, electrically isolated regions. The challenge of laser scribing lies in precisely controlling the laser energy to avoid damaging the substrate or minimize its impact.

[0003] Currently, before laser scribing batches of products, fixed laser scribing parameters are determined based on human experience and trials on sample products. These fixed parameters are then used to perform laser scribing on the batches of products. This method relies on manual labor, and the fixed parameters have low flexibility, making scribing failures prone to occur. Summary of the Invention

[0004] This application provides a laser scribing control method, electronic device, storage medium, and program product to achieve automatic and precise scribing.

[0005] In a first aspect, embodiments of this application provide a laser scribing control method, the method comprising:

[0006] Acquire the first image of the target workpiece, and determine the workpiece information and the target path on the target workpiece based on the first image;

[0007] Based on the workpiece information, control the laser emitting component to scribble lines on the coating of the target workpiece along the target path;

[0008] Acquire a second image of the target workpiece, and determine the quality inspection result of the scribing on the coating based on the second image;

[0009] If the quality inspection result of the line marking does not meet the marking requirements, the laser emission component is controlled to mark the line again along the target path until the quality inspection result of the line marking meets the marking requirements.

[0010] In one possible implementation, based on workpiece information, controlling the laser emitting assembly to scribing lines on the coating along a target path includes:

[0011] Based on the workpiece information, determine the operating parameters of the laser emission assembly; the operating parameters include at least one of the following: laser wavelength, spot width, scribing speed, and power.

[0012] Based on the operating parameters of the laser emitting component, the laser emitting component is controlled to draw lines along the target path.

[0013] In one possible implementation, the workpiece information includes the workpiece shape, substrate material, coating material, and coating thickness; based on the workpiece information, the operating parameters of the laser emitting assembly are determined, including:

[0014] The laser wavelength is determined based on the substrate material and the coating material.

[0015] Based on the shape of the workpiece, determine the focal length of the laser emitting component and the focusing strategy;

[0016] The scribing speed and power of the laser emitting component are determined based on the focal length and coating thickness.

[0017] In one possible implementation, determining the quality inspection result of the scribing on the coating based on the second image includes:

[0018] Based on the second image, identify the depth of the lines scribing on the coating;

[0019] The continuous line segments within the same depth level are considered as a sub-segment; the quality inspection result of each sub-segment is determined based on its corresponding depth level.

[0020] The quality inspection result of the line marking is determined based on the quality inspection results of all sub-segments.

[0021] In one possible implementation, controlling the laser emitting assembly to draw a line again along the target path includes:

[0022] Update the working parameters corresponding to each sub-segment based on the depth level of each sub-segment in the drawing;

[0023] Based on the new operating parameters corresponding to each sub-segment, the laser emitting component is controlled to redraw lines at each sub-segment.

[0024] In one possible implementation, the quality inspection result of each sub-segment is determined based on the depth level corresponding to each sub-segment, including:

[0025] If the maximum depth in the depth level corresponding to each sub-segment is greater than or equal to the coating thickness and the difference between the depth and the coating thickness is less than the first threshold, the quality inspection result of each sub-segment is determined to meet the scribing requirements.

[0026] If the maximum depth in each sub-segment depth level is greater than the coating thickness and the difference between the depth and the coating thickness is greater than or equal to the first threshold, the quality inspection result of scribing on the coating is determined to be scribing failure.

[0027] If the maximum depth in the depth grade corresponding to each sub-segment is less than the coating thickness, the quality inspection result of scribing on the coating is determined to be unsatisfactory.

[0028] Secondly, embodiments of this application provide a laser scribing control device, the device comprising:

[0029] The first determining module is used to acquire a first image of the target workpiece, and determine the workpiece information and the target path on the target workpiece based on the first image.

[0030] The control module is used to control the laser emitting component to scribing lines on the coating of the target workpiece along the target path, based on the workpiece information.

[0031] The second determining module is used to acquire a second image of the target workpiece and determine the quality inspection result of the scribing on the coating based on the second image.

[0032] The control module is also used to control the laser emitting component to draw lines along the target path again when the quality inspection result of the line drawing does not meet the line drawing requirements, until the quality inspection result of the line drawing meets the line drawing requirements.

[0033] Thirdly, embodiments of this application provide an electronic device, including: a memory and a processor; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0034] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the first aspect and / or various possible implementations of the first aspect.

[0035] Fifthly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the first aspect and / or various possible implementations of the first aspect.

[0036] The laser scribing control method, electronic device, storage medium, and program product provided in this application acquire a first image of the target workpiece; based on the first image, determine the workpiece information and the target path on the target workpiece; based on the workpiece information, control the laser emitting component to scribing along the target path on the coating; acquire a second image of the target workpiece; based on the second image, determine the quality inspection result of the scribing on the coating; if the scribing quality inspection result does not meet the scribing requirements, control the laser emitting component to scribing along the target path again until the scribing quality inspection result meets the scribing requirements. By monitoring the scribing results in real time and performing repeated scribing based on the results, the accuracy of the final scribing result is improved; and the subsequent repeated scribing, as a supplement to the first scribing, can appropriately reduce the power of the first scribing to avoid damaging the substrate and improve the success rate of scribing. Attached Figure Description

[0037] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0038] Figure 1 A schematic diagram of a scenario for the laser scribing control method provided in this application;

[0039] Figure 2 Flowchart of the laser scribing control method provided in this application Figure 1 ;

[0040] Figure 3 Flowchart of the laser scribing control method provided in this application Figure 2 ;

[0041] Figure 4 Flowchart of the laser scribing control method provided in this application Figure 3 ;

[0042] Figure 5 A schematic diagram of the laser scribing control device provided in this application;

[0043] Figure 6 A schematic diagram of the structure of the electronic device provided in this application.

[0044] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0045] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0046] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] ITO: Indium Tin Oxide;

[0049] FTO: Fluorine-doped Tin Oxide.

[0050] Laser scribing is a process that uses a laser to selectively remove specific areas of a thin film layer on a substrate. It achieves electrical isolation or structural separation of the thin film layer without damaging the substrate. For example, on a glass substrate covered with a conductive film (such as ITO, FTO, or metal films), a laser is used to precisely "scribble" lines. These lines cut or remove the conductive film in that area, thus dividing the continuous conductive film into multiple independent, electrically isolated regions.

[0051] The core of laser scribing lies in selectivity, that is, removing only the conductive film without damaging the glass substrate. Therefore, the laser energy needs to be precisely controlled to ensure that it does not damage the glass substrate or minimizes the impact on the underlying glass substrate.

[0052] Currently, before laser scribing batches of products, fixed laser scribing parameters are determined based on human experience and trials on sample products. Then, laser scribing is performed on the batches of products based on these fixed parameters. This method relies on manual labor, and the fixed parameters have low flexibility, making scribing failures prone to occur.

[0053] To address the aforementioned technical problems, this application provides a laser scribing control method, which is applied to a working laser device to scribing a workpiece. Figure 1 As shown, the laser device includes a vision system 102, a controller 104, and a laser emitting component 106. The vision system 102 acts as the "eyes" of the laser device, sensing the state of the laser emitting component 106 and the workpiece, such as identifying the workpiece's position and shape, and detecting the position, height, and orientation of the laser emitting component 106. The vision system 102 may include an industrial camera, high-precision sensors (such as laser rangefinders or ultrasonic sensors), and a multispectral sensing system. The laser emitting component 106 emits laser light and has an optical system that focuses the emitted laser light onto the workpiece along a preset optical path to achieve scribing. The controller 104 is connected to the vision system 102 and the laser emitting component 106, acquiring data collected by the vision system 102, and then controlling the laser emitting component 106 to perform scribing based on the acquired data.

[0054] In one embodiment, a laser scribing control method is applied... Figure 1 Taking controller 104 as an example, Figure 2 As shown, the method includes:

[0055] Step 202: Obtain the first image of the target workpiece; based on the first image, determine the workpiece information of the target workpiece and the target path on the target workpiece.

[0056] Step 204: Based on the workpiece information, control the laser emitting component to scribble lines on the coating of the target workpiece along the target path;

[0057] Step 206: Obtain a second image of the target workpiece, and determine the quality inspection result of the scribing on the coating based on the second image;

[0058] Step 208: If the quality inspection result of the line marking does not meet the marking requirements, control the laser emitting component to mark the line again along the target path until the quality inspection result of the line marking meets the marking requirements.

[0059] Both the first image and the second image are acquired by the vision system 102. The first image is acquired after the target workpiece is loaded, and the target workpiece is present in the first image. The first image is used for initial identification of the target workpiece and is an image covering the entire scribing station to obtain a complete image of the target workpiece at the scribing station.

[0060] The laser equipment has a scribing station. The process of moving the target workpiece to the scribing station is called loading. The vision system 102 senses the scribing station in real time and can send the sensed image to the controller 104. The controller 104 performs target detection based on the sensed image. When a workpiece is detected on the scribing station, the loading is determined to be complete. At this time, the workpiece on the scribing station is the target workpiece. After determining that the loading is complete, the controller 104 adjusts the vision system 102 to obtain a first image that meets the requirements.

[0061] In addition, the vision system 102 can also integrate an image recognition algorithm. After real-time sensing of the marking station, the vision system 102 performs image recognition to determine whether there is a target workpiece. When the target workpiece is detected to be loaded, the first image is sent to the controller 104.

[0062] Furthermore, the first image needs to be clearly visible. In high-precision scribing scenarios, laser equipment typically has a housing to prevent stray light interference and ensure equipment safety during laser scribing. Therefore, the vision system 102 includes a light source to stabilize image quality. This light source can include ring light, backlight, coaxial light, or strip light. The controller 104 also needs to detect the quality of the image acquired by the vision system 102 and adjust the light source of the vision system 102 in cases of overexposure or underexposure.

[0063] After acquiring the first image, the controller 104 preprocesses the first image, including but not limited to noise reduction, contrast enhancement, and binarization. Then, based on the preprocessed first image, it performs feature matching to identify the target workpiece in the first image and converts the image pixel coordinates into a mechanical coordinate system to obtain information such as the position, angle, and feature point coordinates of the target workpiece.

[0064] It should be noted that in some embodiments, the vision system 102 has image processing and recognition positioning functions. Therefore, the above-mentioned target workpiece recognition process can be processed by the vision system 102. The vision system 102 outputs the first image and information such as the position, angle and feature point coordinates of the target workpiece in the first image to the controller 104, and then the controller 104 performs subsequent control processing.

[0065] The workpiece information includes the target workpiece's shape, substrate material, coating material, and coating thickness, which is determined by identifying the first image. This workpiece information is used to adjust the operating parameters of the laser emitting assembly 106 to suit different workpieces. For example, if the target workpiece includes a glass substrate and a conductive film, the first image identifies the substrate material as glass, and the material and thickness of the conductive film, allowing for the determination of a suitable laser wavelength to avoid damage to the glass substrate.

[0066] The target path is the precise movement path of the laser head in the laser emitting assembly 106. The laser head moves along the target path to complete the scribing. The target path is obtained by converting the scribing content into a pattern or text. First, it is necessary to obtain the pattern design file to be formed on the target workpiece. When scribing the target workpiece, this file is directly input into the controller 104. In one embodiment, when there are multiple types of target workpieces, the pattern design files of all types are uploaded to the host computer in advance. After the controller 104 identifies the type of target workpiece based on the first image, it obtains the corresponding pattern design file from the host computer.

[0067] After acquiring the pattern design file, the pattern is converted into the motion logic of the laser head. In one embodiment, a high-definition camera or industrial camera is used to capture real-time images of the target workpiece, and image processing algorithms, such as edge detection, target recognition, and image matching, are used to identify the target path and obstacles. Deep learning models, such as convolutional neural networks, can be used to automatically identify and process complex paths, ensuring the accuracy and flexibility of the path.

[0068] When the target path is known and relatively simple, the A algorithm can be used for path planning. The A algorithm searches for the optimal path from the starting point to the destination by incorporating a heuristic estimation function. The specific process is as follows:

[0069] State space representation: The scribing area on the surface of the target workpiece is represented as a grid, and each grid node represents a possible position of the laser head.

[0070] Heuristic function: Use the straight-line distance between the target and the current position as a heuristic estimation function, such as Euclidean distance or Manhattan distance, to help select the shortest path.

[0071] Path evaluation: Select the best path based on the cost function of the current position and the target position, and determine the trajectory of the laser head through search and backtracking.

[0072] It should be noted that the target path refers to the initial path determined by the first image. After determining the target path, the laser emitting assembly 106 (i.e., the laser head) is controlled to move along the target path to perform scribing on the coating of the target workpiece. When controlling the movement of the laser emitting assembly 106, the operating parameters of the laser emitting assembly 106 are determined based on the workpiece information of the target workpiece to ensure that the non-coating part of the target workpiece, i.e., the substrate part, is not damaged.

[0073] In one embodiment, to ensure no damage to the substrate, the initial scribing parameters are not designed for a single successful scribing attempt. Instead, sufficient space is reserved for subsequent scribing operations, such as secondary or tertiary scribing, to achieve finer lines. For example, if the ITO film thickness is 150 nm, the initial scribing parameters may target a scribing depth of 100 nm. After the initial scribing is completed, the results are evaluated, and the parameters for the next scribing operation are determined based on the evaluation results, continuing until the scribing meets the requirements.

[0074] The second image is an image of the target workpiece acquired after the initial scribing is completed. This second image primarily focuses on the scribing lines on the coating of the target workpiece. The quality inspection result is the result of inspecting the quality of the formed scribing lines, characterizing whether the scribing quality meets the scribing requirements, such as the depth and width of the scribing lines. Based on the second image, the completed scribing lines are inspected using image processing algorithms to determine the quality inspection result.

[0075] In one embodiment, to more precisely detect the quality of the scribing, the scribing is divided into sections, the pose of the vision system 102 is adjusted, and a second image of the scribing within each section is acquired. Then, based on the second image of each section, the quality of the scribing within that section is detected, and the quality detection result of the scribing within that section is determined. Finally, based on the quality detection results of the scribing in all sections, the quality detection result of the entire scribing is determined.

[0076] In this process, partitioning can be performed on the entire target workpiece, then each scribing line is identified and the quality inspection result is determined; alternatively, partitioning can be performed from the perspective of the scribing lines, only partitioning the areas where scribing lines exist. When there are no scribing lines in a certain area, there is no need to obtain a second image of that area, which can reduce the number of partitions and improve the efficiency of quality inspection.

[0077] When the quality inspection result of the scribing does not meet the scribing requirements, a second scribing is required. This second scribing is a reprocessing step, therefore, the operating parameters of the laser emitting component 106 need to be adjusted adaptively. Specifically, based on the second image and the scribing quality inspection result, the operating parameters of the laser emitting component 106 can be adjusted to adapt to the already scribed target trajectory. After the second scribing, a scribing quality inspection is still required. This time, the scribing is performed on the remaining scribing, i.e., the superposition effect of the first and second scribing. If it does not meet the scribing requirements, the above process is repeated to continue scribing until the resulting scribing meets the requirements, thus completing the scribing at the target path.

[0078] When there are multiple target paths on the target workpiece, you can first complete the initial drawing of each target path, and then use the second image to determine the paths that need to be drawn a second time, and then perform the second drawing; or you can draw along each path in sequence, and when the drawing along the current target path meets the drawing requirements, you can switch to the next target path to draw, thereby completing the drawing of all target paths.

[0079] For the intersection of multiple target paths, the operating parameters of the laser emitting component 106 can be dynamically adjusted during the marking process. Appropriate adjustment of the operating parameters at the intersection can avoid repeated marking at the intersection, which could damage the substrate under the coating.

[0080] The method provided in the above embodiments includes: acquiring a first image of the target workpiece; determining workpiece information and a target path on the target workpiece based on the first image; controlling a laser emitting component to scribble lines on the coating along the target path based on the workpiece information; acquiring a second image of the target workpiece; determining the quality inspection result of the scribing on the coating based on the second image; and controlling the laser emitting component to scribble lines again along the target path if the quality inspection result does not meet the scribing requirements, until the quality inspection result meets the scribing requirements. By monitoring the scribing results in real time and performing repeated scribing based on the results, the accuracy of the final scribing result is improved; and the subsequent repeated scribing, as a supplement to the first scribing, can appropriately reduce the power of the first scribing to avoid damaging the substrate and improve the success rate of scribing.

[0081] In one embodiment, based on workpiece information, controlling the laser emitting assembly to scribble lines on the coating along a target path includes:

[0082] Based on the workpiece information, determine the operating parameters of the laser emission assembly; the operating parameters include at least one of the following: laser wavelength, spot width, scribing speed, and power.

[0083] Based on the operating parameters of the laser emitting component, the laser emitting component is controlled to draw lines along the target path.

[0084] In the target workpiece, the coating and the substrate have different absorption characteristics to lasers. The purpose of scribing is usually to remove the coating precisely and cleanly without damaging or with minimal damage to the underlying substrate. Appropriate laser wavelengths are selected based on the substrate and coating materials to ensure good absorption by the coating and minimal absorption by the substrate.

[0085] The spot width is the actual diameter (or equivalent diameter) of the laser spot formed on the material surface after the laser beam is focused. The unit is usually micrometers, and it determines the area covered by the laser energy.

[0086] Power is the total energy flow rate output by the laser emitting component 106. Scribing speed is the speed at which the laser beam moves across the material surface.

[0087] In laser scribing, power density is a critical threshold parameter that determines whether material can be removed. Power density represents the laser energy received per unit area per unit time, and is determined by power and spot width.

[0088] Linear energy density is the total energy deposited by a laser beam on a scribe line of unit length. It is determined by both power and scribe speed.

[0089] Power density determines the instantaneous intensity of the action, i.e., whether the material removal threshold can be reached instantaneously. Linear energy density determines the total energy accumulated per unit length (affecting the scratch depth, width, and size of the heat-affected zone). High power density can quickly initiate the removal process, but the final scratch morphology, such as depth and width, also depends on the action time, which is determined by velocity, i.e., linear energy density.

[0090] Therefore, by adjusting the spot width, scribing speed, and power, and determining the appropriate power density and line energy density, the number of scribing operations can be reduced without damaging the substrate.

[0091] Specifically, in one embodiment, the working parameters for scribing can be determined by following these steps: Based on the coating material and substrate material, select a suitable laser wavelength to ensure good absorption by the coating and minimal absorption by the substrate; focus the laser spot to the minimum size allowed by the required precision to increase the line energy density; set a relatively high scribing speed to improve efficiency; start with a suitable power to perform a coarse scribing of the coating, ensuring that the coating is removed as much as possible without damaging the substrate; then observe whether the coating is removed cleanly and continuously. If not, increase the speed or decrease the power for fine scribing until the coating is observed to be removed cleanly and continuously. If any residue remains, the power can be slightly increased or the speed decreased.

[0092] During the process described above, the substrate is checked in real time for damage. If damage or excessive thermal impact is detected, the power is reduced or the speed is increased to lower the line energy density, or the spot size is further reduced. By repeatedly fine-tuning the power and scribing speed, and optimizing the spot width and focus position as necessary, the optimal balance between quality, efficiency, and substrate protection is achieved.

[0093] In one embodiment, the workpiece information includes the workpiece shape, substrate material, coating material, and coating thickness; based on the workpiece information, the operating parameters of the laser emitting assembly are determined, including:

[0094] The laser wavelength is determined based on the substrate material and the coating material.

[0095] Based on the shape of the workpiece, determine the focal length of the laser emitting component and the focusing strategy;

[0096] The scribing speed and power of the laser emitting component are determined based on the focal length and coating thickness.

[0097] Select an appropriate laser wavelength based on the substrate material and the coating material to ensure good absorption by the coating and as low absorption as possible by the substrate.

[0098] The workpiece shape indicates whether it is a planar or curved workpiece. When scribing a curved workpiece, the focusing of the laser beam needs to be considered. When the surface being processed is not on the focusing plane, the spot size will increase rapidly and the power density will decrease sharply, resulting in inconsistent scribing results.

[0099] In one embodiment, the laser focusing method of the laser emitting assembly 106 includes static focusing, dynamic focusing, 3D (three-dimensional) galvanometer focusing, and telecentric focusing. Static focusing uses a single fixed focal length focusing lens (such as a flat-field lens), through which the laser beam forms a minimum spot size on the working plane (i.e., the focal plane). The laser head moves in the X / Y directions (horizontal / vertical axes) to perform the scribing.

[0100] Dynamic focusing incorporates a rapidly moving focusing mirror, such as a dynamic focusing mirror, into the optical path, typically driven by an electric motor or voice coil motor. While the galvanometer scanning system performs X / Y scanning, this focusing mirror moves along the optical axis (Z direction), changing the focal point of the beam in real time to ensure it always falls on the changing surface of the workpiece.

[0101] 3D galvanometer focusing integrates the functions of X / Y scanning galvanometers and Z-axis dynamic focusing mirrors into a compact scanning head, and is coordinated by a unified high-speed control system.

[0102] Telecentric focusing uses a telecentric lens. The characteristic of this lens is that even if the angle of the incident beam changes (caused by the oscillation of the galvanometer), its outgoing beam is always perpendicular to the focal plane, and the spot size changes very little within a certain depth range near the focal plane.

[0103] For different workpiece shapes, appropriate focal lengths and focusing strategies are determined. For example, if the laser emitting component 106 has a 3D galvanometer focusing function, and the target workpiece is a curved glass component, then the 3D galvanometer focusing method is used to achieve precise focusing during the scribing process.

[0104] In the method provided in the above embodiments, the laser scribing is optimized in combination with the geometry of the target workpiece.

[0105] In one embodiment, such as Figure 3 As shown, based on the second image, the quality inspection results of the scribing on the coating are determined, including:

[0106] Step 302: Based on the second image, identify the depth of the lines on the coating;

[0107] Step 304: Take continuous line segments with the same depth level as a sub-segment; determine the quality inspection result of each sub-segment based on the depth level corresponding to each sub-segment.

[0108] Step 306: Determine the quality inspection result of the line drawing based on the quality inspection results of all sub-segments.

[0109] The depth of a line is a quality indicator. Depth levels describe the magnitude of the depth. There are multiple depth levels, determined by at least one depth threshold. Each depth level corresponds to a depth range. A continuous portion of the line within the same depth range is considered a sub-segment, thus dividing the line into at least one sub-segment. When there is only one sub-segment, that sub-segment constitutes the entire line, indicating that the depth of the entire line remains highly consistent.

[0110] For each sub-segment, the quality inspection result is determined based on its corresponding depth level, i.e., depth range. The overall quality inspection result of the line is determined by combining the quality inspection results of all sub-segments. For example, if even one sub-segment fails to meet the line-marking requirements, the entire line is deemed to fail. Alternatively, if the proportion of sub-segments meeting the requirements reaches a certain threshold, the entire line is considered to meet the requirements.

[0111] Based on this, in one embodiment, controlling the laser emitting component to draw a line again along the target path includes:

[0112] Update the working parameters corresponding to each sub-segment based on the depth level of each sub-segment in the drawing;

[0113] Based on the new operating parameters corresponding to each sub-segment, the laser emitting component is controlled to redraw lines at each sub-segment.

[0114] The depth level of each sub-segment represents the depth of the scribing within that sub-segment. When the depth meets the scribing requirements, scribing is unnecessary; otherwise, it is necessary. When the depth is insufficient, the thickness of the residual coating determines the operating parameters of the laser emitter. For example, a lower depth level indicates a shallower scribing depth and a larger residual thickness. In this case, higher power is required for scribing to remove the residual coating thickness.

[0115] Therefore, if the quality inspection result of the scribing does not meet the scribing requirements, at least some of the sub-segments need to be scribed again. At this time, based on the depth level of each sub-segment and new operating parameters, the laser emitting component 106 is controlled to re-scibble at each sub-segment. Specifically, when the quality inspection result of one sub-segment meets the scribing requirements, the operating parameter corresponding to its depth level is 0, indicating that this segment does not need to be scribed again.

[0116] In the method provided in the above embodiments, the scribing is segmented for detection, and the scribing is repeated for the parts where the coating has been completely removed, while the scribing is not repeated for the parts where the coating has been completely removed, thereby improving the accuracy of the scribing results through refined control.

[0117] In one embodiment, such as Figure 4 As shown, the quality inspection result of each sub-segment is determined based on the depth level corresponding to each sub-segment, including:

[0118] Step 402: If the maximum depth in the depth level corresponding to each sub-segment is greater than or equal to the coating thickness and the difference between the depth and the coating thickness is less than the first threshold, determine that the quality inspection result of each sub-segment meets the scribing requirements.

[0119] Step 404: If the maximum depth in the depth level corresponding to each sub-segment is greater than the coating thickness and the difference between the depth and the coating thickness is greater than or equal to the first threshold, the quality inspection result of the scribing on the coating is determined to be scribing failure.

[0120] Step 406: If the maximum depth in the depth grade corresponding to each sub-segment is less than the coating thickness, the quality inspection result of the scribing on the coating is determined to be that the scribing requirements are not met.

[0121] Among them, the maximum depth in the depth level refers to the maximum depth within the depth range of the depth level.

[0122] The required scribing depth is exactly equal to or slightly greater than the coating thickness. A first threshold characterizes the tolerance for a scribing depth greater than the coating thickness; within this range, no damage to the substrate is considered. However, when the difference between the scribing depth and the coating thickness is greater than or equal to the first threshold, it indicates that the scribing is too deep, potentially damaging the substrate; therefore, the scribing detection result is scribing failure. In one embodiment, when the scribing detection result is scribing failure, the vision system 102 can inspect the substrate to determine if damage has already occurred.

[0123] When the scribing depth is less than the coating thickness, it indicates that the scribing has not separated the coating into two independent parts, and the quality inspection result is deemed as not meeting the scribing requirements. In this case, scribing needs to be repeated until the requirements are met.

[0124] In one embodiment, the scribing requirements also include a limitation on the scribing width, restricting the scribing width to a preset range; a width that is too wide or too narrow will not meet the scribing requirements. Combined with the limitation on depth, the quality inspection result is determined. For example, if the depth meets the depth requirement, it is then determined whether the width meets the width requirement. Only if both requirements are met is the quality inspection result determined to meet the scribing requirements; otherwise, if either requirement is not met, and the scribing has not failed, the quality inspection result is determined to fail, and scribing needs to be repeated. At this time, based on the quality inspection result, the operating parameters of the laser emitting component 106 are adjusted to adjust the scribing depth and / or scribing width.

[0125] In one embodiment, the laser emitting component 106 scribing lines on the coating of the target workpiece along the target path can also be based on the vision system 102 to update the target path in real time and adjust the pose of the laser emitting component 106, which can be appropriately adjusted according to changes in the environment or target.

[0126] Specifically, real-time image analysis detects deviations from the target path and adjusts the path based on image feedback. Image recognition technology can identify interfering factors such as cracks and stains on the surface and adjust the path in a timely manner to prevent the laser head from deviating from the correct trajectory.

[0127] To avoid sudden turns of the laser head that could cause vibration or errors during the scribing process, Bézier curve interpolation can be used to smooth the path. By calculating the interpolation between multiple points on the path, a smooth motion trajectory is generated, reducing mechanical vibration of the laser head and ensuring the accuracy of the scribing. For example, cubic spline interpolation can be used to further smooth the path, making the movement of the laser head along the path smoother and preventing jumps or sharp turns.

[0128] Based on the path planning results, a PID controller (proportional-integral-derivative controller) is used to precisely control the speed and acceleration of the laser head, ensuring its smooth movement along the path. The PID controller can dynamically adjust the speed and position based on real-time errors, thereby ensuring the accuracy of path control. For example, when the laser head deviates from the path, a real-time correction is performed through an error feedback mechanism to ensure that the laser head moves precisely along the predetermined path.

[0129] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0130] Based on the same inventive concept, this application also provides a laser scribing control device. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations of one or more laser scribing control device embodiments provided below can be found in the limitations of the laser scribing control method above, and will not be repeated here.

[0131] In one embodiment, such as Figure 5 As shown, the laser scribing control device includes a first determining module 501, a control module 502, and a second determining module 503, wherein:

[0132] The first determining module 501 is used to acquire a first image of the target workpiece and determine the workpiece information and the target path on the target workpiece based on the first image.

[0133] The control module 502 is used to control the laser emitting component to scribing lines on the coating of the target workpiece along the target path according to the workpiece information.

[0134] The second determining module 503 is used to acquire a second image of the target workpiece and determine the quality inspection result of the scribing on the coating based on the second image.

[0135] The control module 502 is also used to control the laser emitting component to draw lines along the target path again when the quality inspection result of the line drawing does not meet the line drawing requirements, until the quality inspection result of the line drawing meets the line drawing requirements.

[0136] In one possible implementation, the control module 502 is specifically used for:

[0137] Based on the workpiece information, determine the operating parameters of the laser emission assembly; the operating parameters include at least one of the following: laser wavelength, spot width, scribing speed, and power.

[0138] Based on the operating parameters of the laser emitting component, the laser emitting component is controlled to draw lines along the target path.

[0139] In one possible implementation, the workpiece information includes the workpiece shape, substrate material, coating material, and coating thickness; the control module 502 is specifically used for:

[0140] The laser wavelength is determined based on the substrate material and the coating material.

[0141] Based on the shape of the workpiece, determine the focal length of the laser emitting component and the focusing strategy;

[0142] The scribing speed and power of the laser emitting component are determined based on the focal length and coating thickness.

[0143] In one possible implementation, the second determining module 503 is specifically used for:

[0144] Based on the second image, identify the depth of the lines scribing on the coating;

[0145] The continuous line segments within the same depth level are considered as a sub-segment; the quality inspection result of each sub-segment is determined based on its corresponding depth level.

[0146] The quality inspection result of the line marking is determined based on the quality inspection results of all sub-segments.

[0147] In one possible implementation, the second determining module 503 is specifically used for:

[0148] Update the working parameters corresponding to each sub-segment based on the depth level of each sub-segment in the drawing;

[0149] Based on the new operating parameters corresponding to each sub-segment, the laser emitting component is controlled to redraw lines at each sub-segment.

[0150] In one possible implementation, the second determining module 503 is specifically used for:

[0151] If the maximum depth in the depth level corresponding to each sub-segment is greater than or equal to the coating thickness and the difference between the depth and the coating thickness is less than the first threshold, the quality inspection result of each sub-segment is determined to meet the scribing requirements.

[0152] If the maximum depth in each sub-segment depth level is greater than the coating thickness and the difference between the depth and the coating thickness is greater than or equal to the first threshold, the quality inspection result of scribing on the coating is determined to be scribing failure.

[0153] If the maximum depth in the depth grade corresponding to each sub-segment is less than the coating thickness, the quality inspection result of scribing on the coating is determined to be unsatisfactory.

[0154] Each module in the aforementioned laser scribing control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0155] Figure 6 A schematic diagram of the structure of the electronic device provided in this application. Figure 6 As shown, the electronic device 60 provided in this embodiment includes at least one processor 601 and a memory 602. Optionally, the device 60 further includes a communication component 603. The processor 601, memory 602, and communication component 603 are connected via a bus 604.

[0156] In a specific implementation, at least one processor 601 executes computer execution instructions stored in memory 602, causing at least one processor 601 to perform the above-described method.

[0157] The specific implementation process of processor 601 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0158] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0159] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0160] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0161] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0162] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0163] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0164] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0165] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0166] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0167] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0168] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0169] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0170] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A laser scribing control method, characterized by, The method comprises: acquiring a first image of a target workpiece, determining workpiece information of the target workpiece and a target path on the target workpiece according to the first image, the workpiece information comprising a workpiece shape, a base material, a plating layer material and a plating layer thickness of the target workpiece; controlling a laser emitting assembly to perform scribing on the plating layer of the target workpiece along the target path according to the workpiece information; acquiring a second image of the target workpiece, and determining a quality detection result of the scribing on the plating layer according to the second image; in a case where the quality detection result of the scribing does not satisfy a scribing requirement, controlling the laser emitting assembly to perform scribing again along the target path until the quality detection result of the scribing satisfies the scribing requirement; wherein the determining the quality detection result of the scribing on the plating layer according to the second image comprises: recognizing a depth of the scribing on the plating layer according to the second image; regarding a line segment in the scribing that is continuous and has a depth within a same depth level as a sub-line segment, and determining a quality detection result of each sub-line segment according to a corresponding depth level of each sub-line segment; determining the quality detection result of the scribing according to the quality detection results of all sub-line segments; the controlling the laser emitting assembly to perform scribing again along the target path comprises: updating a corresponding working parameter of each sub-line segment according to a depth level of each sub-line segment in the scribing; controlling the laser emitting assembly to perform scribing again at each sub-line segment based on a new working parameter corresponding to each sub-line segment.

2. The method of claim 1, wherein, the controlling the laser emitting assembly to perform scribing on the plating layer along the target path according to the workpiece information comprises: determining a working parameter of the laser emitting assembly according to the workpiece information, the working parameter comprising at least one of a laser wavelength, a spot width, a scribing speed and a power; controlling the laser emitting assembly to perform scribing along the target path based on the working parameter of the laser emitting assembly.

3. The method of claim 2, wherein, the determining the working parameter of the laser emitting assembly according to the workpiece information comprises: determining the laser wavelength according to the base material and the plating layer material; determining a focal length and a focusing strategy of the laser emitting assembly according to the workpiece shape; determining the scribing speed and the power of the laser emitting assembly according to the focal length and the plating layer thickness.

4. The method of claim 1, wherein, the determining the quality detection result of each sub-line segment according to the corresponding depth level of each sub-line segment comprises: in a case where a maximum depth in the corresponding depth level of each sub-line segment is greater than or equal to the plating layer thickness and a difference between the maximum depth and the plating layer thickness is less than a first threshold value, determining that the quality detection result of each sub-line segment satisfies the scribing requirement; in a case where the maximum depth in the corresponding depth level of each sub-line segment is greater than the plating layer thickness and the difference between the maximum depth and the plating layer thickness is greater than or equal to the first threshold value, determining that the quality detection result of the scribing on the plating layer is scribing failure; in a case where the maximum depth in the corresponding depth level of each sub-line segment is less than the plating layer thickness, determining that the quality detection result of the scribing on the plating layer does not satisfy the scribing requirement.

5. A laser scribe control apparatus, characterized by, the device comprises: The first determining module is configured to acquire a first image of a target workpiece, and determine workpiece information of the target workpiece and a target path on the target workpiece according to the first image, the workpiece information including a workpiece shape, a base material, a plating layer material, and a plating layer thickness of the target workpiece. The control module is configured to control a laser emitting assembly to perform scribing on the plating layer of the target workpiece along the target path according to the workpiece information. The second determining module is configured to acquire a second image of the target workpiece, and determine a quality detection result of the scribing on the plating layer according to the second image. The control module is further configured to control the laser emitting assembly to perform scribing again along the target path until the quality detection result of the scribing meets the scribing requirement, in a case that the quality detection result of the scribing does not meet the scribing requirement. The method further includes: identifying a depth of the scribing on the plating layer according to the second image; regarding a line segment in the scribing that is continuous and has a depth within a same depth level as a sub-line segment, and determining a quality detection result of each sub-line segment according to a corresponding depth level of each sub-line segment; determining the quality detection result of the scribing according to the quality detection results of all sub-line segments; and The control of the laser emitting assembly to perform scribing again along the target path includes: updating a corresponding working parameter of each sub-line segment according to a depth level of each sub-line segment in the scribing; controlling the laser emitting assembly to perform scribing again at each sub-line segment based on the new working parameter corresponding to each sub-line segment.

6. An electronic device, comprising: The method further includes: a processor, and a memory connected to the processor in communication; the memory stores computer-executed instructions; the processor executes the computer-executed instructions stored in the memory to implement the method according to any one of claims 1 to 4.

7. A computer readable storage medium characterized by The computer-readable storage medium stores computer-executed instructions, and the computer-executed instructions are executed by a processor to implement the method according to any one of claims 1 to 4.

8. A computer program product, characterised in that, The computer program is executed by a processor to implement the method according to any one of claims 1 to 4.

Images