Micro-hemisphere gyroscope assembling method and device

Abstract

The present application relates to a kind of micro hemispherical gyro assembly method and assembly device, micro hemispherical gyro assembly method includes: micro hemispherical resonant structure is placed in assembly station, using first negative pressure to micro hemispherical resonant structure is vacuum adsorbed;Adjust the center anchor point of micro hemispherical resonant structure is in the center of assembly station;Plane electrode is vacuum adsorbed, based on plane electrode compression micro hemispherical resonant structure occurs elastic deformation, so that the center anchor point of micro hemispherical resonant structure and circumferential edge are contacted with plane electrode;Using laser to the center anchor point of micro hemispherical resonant structure and plane electrode is welded fixed;Disconnect the vacuum adsorption of micro hemispherical resonant structure and / or plane electrode, micro hemispherical resonant structure restores to original state, complete the assembly of micro hemispherical gyro.This scheme can be positioned and aligned and welded fixed to micro hemispherical resonant structure and electrode base in batches, significantly improve assembly precision and assembly efficiency.

Description

Technical Field

[0001] The present invention relates to the field of micro-mechanical sensors, and in particular to an assembly method and an assembly device for a micro-hemispherical gyroscope. Background Art

[0002] The electrode substrate is an indispensable component for driving and detecting a micro-hemispherical gyroscope. The resonant structure must be integrated with the electrode substrate through an assembly process to form a complete gyro sensing structure. Because the micro-hemispherical resonant structure is a three-dimensional shell with a small capacitance area, the electrode gap is typically limited to only a few microns to tens of microns to improve driving capability and detection sensitivity. In particular, horizontal alignment and tilt errors in electrode assembly have a significant impact on performance indicators such as the gyroscope's bias output and bias stability over the entire temperature range. Large errors in electrode assembly can lead to drive imbalance and detection mismatch, further increasing the gyroscope's bias noise. Therefore, achieving high-precision electrode assembly within the micron-level electrode gap requirement is a major challenge in the micro-hemispherical gyroscope assembly process.

[0003] In addition, the resonant structure and the electrode base form a parallel plate capacitor after assembly, and the longitudinal capacitor gap deviation must be small enough to ensure that it is within the range of measurement and control circuit identification and compensation; in addition, the connection between the resonant structure and the electrode base must be strong enough to work reliably for a long time. However, the current batch assembly scheme for the planar electrodes of micro-hemispherical gyroscopes only uses an assembly fixture to achieve alignment and connection, lacking refined adjustment operations and high-strength fixing means. For example, invention application authorization announcement number CN115014315B proposes a planar electrode micro-hemispherical resonant gyroscope assembly fixture and batch assembly method. Although its assembly fixture contains multiple electrode limit slots, which can realize batch assembly of gyroscopes, each electrode needs to be separately placed with a metal solder sheet and a gap limit sheet. The assembly benchmark is not uniform, and it is difficult to ensure the uniformity of the clamping force by only installing 4 screws to apply the clamping force, which easily causes the resonant structure to deflect, thereby affecting the uniformity of the capacitor gap.

[0004] Invention application authorization announcement No. CN115815807B proposes a gyroscope welding assembly device and method, which can realize the device-level assembly of a single gyroscope. However, the assembly process uses metal fasteners to fix the resonant structure and the electrode base, which can easily cause scratches and other damage to the resonant structure, and the applied clamping force cannot achieve visual stepless adjustment. Excessive pressure will cause stress concentration at the edge of the resonant structure, and too little pressure will cause the gap between the resonant structure and the electrode base to be too large, resulting in welding failure.

[0005] Invention application publication number CN110749315A proposes a micro-hemispherical resonant gyroscope structure, assembly method and wafer fixture. The resonant structure can be fixed by positioning holes, positioning pins and glue, but it cannot achieve precise control of the capacitor gap. The implementation steps involve laser cutting and multi-step cleaning, and the process links are cumbersome and complicated.

[0006] This shows that there are still some deficiencies in the current high-precision assembly solutions for micro-hemispherical resonant structures. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a micro-hemispherical gyroscope assembly method and assembly device.

[0008] To achieve the above-mentioned object of the invention, the present invention provides a method for assembling a micro-hemispherical gyroscope, comprising the following steps:

[0009] S1. The micro-hemispherical resonant structure is placed in an assembly station and vacuum-adsorbed by applying a first negative pressure to the micro-hemispherical resonant structure;

[0010] S2. Using an adjustment device to adjust the center anchor point of the micro-hemispherical resonant structure to the center of the assembly station;

[0011] S3. The planar electrode is placed in the assembly station so that the planar electrode contacts the central anchor point of the micro-hemispherical resonant structure;

[0012] S4. vacuum adsorbing the planar electrode, compressing the micro-hemispherical resonant structure based on the planar electrode to elastically deform the micro-hemispherical resonant structure, and making the central anchor point and the circumferential edge of the micro-hemispherical resonant structure contact the planar electrode;

[0013] S5. Using a laser to weld the center anchor point of the micro-hemispherical resonant structure to the planar electrode;

[0014] S6. disconnecting the vacuum adsorption of the micro-hemispherical resonant structure and / or the planar electrode, and returning the micro-hemispherical resonant structure to its original state, thereby completing the assembly of the micro-hemispherical gyroscope.

[0015] According to one aspect of the present invention, in step S1, placing the micro-hemispherical resonant structure in an assembly station and applying a first negative pressure to vacuum adsorb the micro-hemispherical resonant structure, the assembly station is provided on an assembly fixture, and there is at least one assembly station.

[0016] According to one aspect of the present invention, the assembly fixture comprises: a base, an assembly position base and a fixing ring;

[0017] The base is in the form of a plate with a regular shape, and is provided with a vacuum cavity, a first channel for connecting the vacuum cavity and an external vacuum source;

[0018] The opening side of the vacuum chamber is located on the upper side of the base, one end of the first channel forms a first communication opening on the inner side wall of the vacuum chamber, and the other end of the first channel forms a second communication opening on the circumferential outer side of the base;

[0019] The assembly base is a plate with a regular shape as a whole, and the assembly base is provided with an assembly cavity for assembling the micro-hemispherical resonant structure and the planar electrode, and is used to connect the assembly cavity with the second channel of the vacuum chamber;

[0020] There are a plurality of second channels regularly distributed at the bottom of the assembly cavity;

[0021] The fixing ring is matched with the assembly base and is sleeved on the outer side of the assembly base to press the assembly base against the upper side of the base;

[0022] The fixing ring is connected to the base based on a locking connector;

[0023] The assembly chamber and the vacuum chamber are combined to form the assembly station.

[0024] According to one aspect of the present invention, the assembly cavity is a stepped cavity, and comprises: a first cavity portion and a second cavity portion coaxially arranged from top to bottom;

[0025] The first cavity portion has a shape that matches the shape of the planar electrode;

[0026] The second concave cavity is a circular cavity, and is used to accommodate the curved thin-walled portion of the micro-hemispherical resonant structure;

[0027] The planar skirt teeth of the micro-hemispherical resonant structure are supported on the upper side of the edge of the second concave cavity portion.

[0028] According to one aspect of the present invention, in step S2, in the step of using an adjustment device to adjust the central anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station, the adjustment device includes: an image acquisition module, an image data processing module, a position adjustment module and a micro-probe three-axis micro-motion platform;

[0029] The image acquisition module is used to acquire an image of the relative position of the micro-hemispherical resonant structure and the assembly station, and transmit the image to the image data processing module;

[0030] The image data processing module obtains a center anchor point position of the micro hemispherical resonator structure and a center position of the assembly station based on the relative position image, and transmits the center anchor point position and the center position to the position adjustment module;

[0031] The position adjustment module obtains a relative position deviation based on the center anchor point position and the center position, and generates a control instruction based on the relative position deviation;

[0032] The micro probe three-axis micro motion platform operates based on the control instruction to adjust the center anchor point of the micro hemispherical resonator structure to be at the center of the assembly station.

[0033] According to one aspect of the present application, the micro probe three-axis micro motion platform comprises an X-axis drive, a Y-axis drive, a Z-axis drive, an extension arm mounted on the Z-axis drive, and a probe arranged at the end of the extension arm.

[0034] The X-axis drive and the Y-axis drive are connected to drive the probe to reciprocate in the horizontal direction, and the Z-axis drive is connected to the X-axis drive or the Y-axis drive to drive the probe to reciprocate in the vertical direction.

[0035] The probe is in a circular ring structure and is arranged to match the resonator support at the center position of the micro hemispherical resonator structure.

[0036] According to one aspect of the present application, in step S4, the planar electrode is vacuum adsorbed, and in the step of compressing the micro hemispherical resonator structure to cause elastic deformation based on the planar electrode, the negative pressure pressure of vacuum adsorbing the micro hemispherical resonator structure is increased to continue adsorbing the planar electrode for compressing the micro hemispherical resonator structure to cause elastic deformation based on the communication of the partial gap between the planar skirt teeth of the micro hemispherical resonator structure.

[0037] Alternatively, the assembly site base is also provided with a third channel, and the planar electrode is adsorbed for compressing the micro hemispherical resonator structure to cause elastic deformation based on the communication of the third channel; wherein the third channel is used to communicate the first recessed cavity portion and an external vacuum source, or the third channel is used to communicate the first recessed cavity portion and the vacuum cavity.

[0038] If the third channel is connected with the vacuum cavity, a vacuum negative pressure one-way valve is arranged at the position where the third channel is connected with the vacuum cavity.

[0039] In order to achieve the above-mentioned application purpose, the present application provides a micro hemispherical gyro assembly device, which comprises an assembly clamp, a laser welding platform, an adjustment device and a vacuum device.

[0040] The laser welding platform includes: a two-dimensional stage, a laser objective lens and a laser light source;

[0041] The laser objective lens is located above the two-dimensional stage;

[0042] The assembly fixture and the adjustment device are respectively mounted on the two-dimensional stage;

[0043] The vacuum device is connected to the assembly fixture;

[0044] The assembly fixture is provided with at least one assembly station for placing the micro-hemispherical resonant structure and the planar electrode;

[0045] The vacuum device acts on the planar electrode based on the assembly station, compresses the micro-hemispherical resonant structure to undergo elastic deformation based on the planar electrode, and makes the central anchor point and circumferential edge of the micro-hemispherical resonant structure contact the planar electrode.

[0046] According to one aspect of the present invention, the assembly fixture comprises: a base, an assembly position base and a fixing ring;

[0047] The base is in the form of a plate with a regular shape, and is provided with a vacuum cavity, a first channel for connecting the vacuum cavity and an external vacuum source;

[0048] The opening side of the vacuum chamber is located on the upper side of the base, one end of the first channel forms a first communication opening on the inner side wall of the vacuum chamber, and the other end forms a second communication opening on the circumferential outer side of the base;

[0049] The assembly base is a plate with a regular shape as a whole, and the assembly base is provided with an assembly cavity for assembling the micro-hemispherical resonant structure and the planar electrode, and is used to connect the assembly cavity with the second channel of the vacuum chamber;

[0050] There are a plurality of second channels regularly distributed at the bottom of the assembly cavity;

[0051] The fixing ring is matched with the assembly base and is sleeved on the outer side of the assembly base to press the assembly base against the upper side of the base;

[0052] The fixing ring is connected to the base based on a locking connector;

[0053] The assembly chamber and the vacuum chamber are combined to form the assembly station;

[0054] The assembly cavity is a stepped cavity, and comprises: a first cavity portion and a second cavity portion coaxially arranged from top to bottom;

[0055] The first cavity portion has a shape that matches the shape of the planar electrode;

[0056] The second concave cavity is a circular cavity, and is used to accommodate the curved thin-walled portion of the micro-hemispherical resonant structure;

[0057] The planar skirt teeth of the micro-hemispherical resonant structure are supported on the upper side of the edge of the second concave cavity portion.

[0058] According to one aspect of the present invention, if the assembly base is further provided with a third channel, the third channel is used to connect the first concave cavity portion with an external vacuum source, or the third channel is used to connect the first concave cavity portion with the vacuum cavity;

[0059] If the third channel is connected to the vacuum chamber, a vacuum negative pressure one-way valve is provided at the position where the third channel is connected to the vacuum chamber.

[0060] According to a solution of the present invention, this solution can position, align, and weld the micro-hemispherical resonant structure and the electrode substrate in batches, and can achieve wafer-level operation, thereby suppressing the horizontal alignment error and longitudinal tilt error during the assembly process of the micro-hemispherical resonant structure and the electrode substrate, and can significantly improve the assembly accuracy and assembly efficiency.

[0061] According to a solution of the present invention, this solution can accurately achieve high-precision assembly of the longitudinal capacitance gap of the electrode substrate, effectively suppressing the horizontal alignment error and longitudinal tilt error during the assembly process, and at the same time using laser welding technology to achieve high-strength fixed connection between the resonant structure and the electrode substrate, which can significantly improve assembly accuracy and assembly efficiency.

[0062] According to one solution of the present invention, this solution uses negative pressure adsorption to achieve elastic deformation of the micro-hemispherical resonant structure. Based on the negative pressure adsorption, it can effectively ensure that the applied negative pressure is uniform, which is more beneficial to ensuring the uniformity of the longitudinal capacitance gap between the micro-hemispherical resonant structure and the electrode substrate after welding.

[0063] According to one solution of the present invention, this solution can achieve high-precision center alignment between the micro-hemispherical resonant structure and the electrode substrate through the concentric design of the assembly fixture assembly station itself and the high-precision adjustment device, thereby avoiding the eccentricity error of the longitudinal capacitor gap.

[0064] According to one solution of the present invention, this solution uses vacuum adsorption to apply force, so that the pressure is evenly applied to the entire pressure surface, which can achieve stepless adjustment and will not cause scratches, chipping, cracks and other damage to the resonant structure, providing a guarantee for high-precision assembly.

[0065] According to one solution of the present invention, the gap can be ensured to be uniform only by the elastic deformation of the micro-hemispherical resonant structure itself. After vacuum unloading, the resonant structure can automatically maintain the electrode gap to be uniform when it recovers its deformation.

[0066] According to one solution of the present invention, laser welding technology is used to achieve melting and fixing of the interface between the micro-hemispherical resonant structure and the electrode, which has higher connection strength and shorter fixing time, and can effectively improve assembly efficiency.

[0067] According to one solution of the present invention, this solution is not only applicable to resonant structures manufactured from materials such as fused quartz, polysilicon, and diamond, but also to resonant structures of various structural forms such as hemispherical, bell-shaped, and bell-shaped; for the electrode configuration solution, this solution can also be applied to planar electrodes of various sizes such as square and circular, effectively ensuring the high applicability of this solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 A diagram showing the steps of a method for assembling a micro-hemispherical gyroscope according to an embodiment of the present invention;

[0069] Figure 2 A structural layout diagram of a micro-hemispherical gyroscope assembly device according to an embodiment of the present invention;

[0070] Figure 3 A structural diagram of an assembly fixture according to an embodiment of the present invention;

[0071] Figure 4 is a cross-sectional view of an assembly fixture according to an embodiment of the present invention;

[0072] Figure 5 A cross-sectional view of an assembly fixture and a micro-hemispherical resonant structure planar electrode assembly according to an embodiment of the present invention;

[0073] Figure 6 An exploded view of an assembly fixture and a micro-hemispherical resonant structure planar electrode assembly according to an embodiment of the present invention;

[0074] Figure 7 A structural diagram of a microprobe three-axis micro-motion platform according to an embodiment of the present invention

[0075] Figure 8 A partial cross-sectional view of an assembly station provided with a third channel according to an embodiment of the present invention;

[0076] Figure 9 A partial cross-sectional view of an assembly station provided with a third channel according to another embodiment of the present invention;

[0077] Figure 10 This is a structural diagram of an elastic seal according to an embodiment of the present invention.

[0078] In the figure, 1-assembly fixture; 11-base; 12-assembly position base; 13-fixing ring; 111-vacuum chamber; 112-first channel; 111a-annular groove; 12-assembly position base; 121-assembly chamber; 122-second channel; 121a-first concave cavity part; 121b-second concave cavity part; 123-third channel; 121a1-corner avoidance hole; 121a2-elastic sealing member; 13-fixing ring; 2-laser welding platform; 21-two-dimensional stage; 22-laser objective lens; 3-adjustment device; 31-image acquisition module; 32-microprobe three-axis micro-motion platform; 321-X-axis drive; 322-Y-axis drive; 323-Z-axis drive; 324-extension arm; 325-probe. DETAILED DESCRIPTION

[0079] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0080] When describing the embodiments of the present invention, the orientation or positional relationship expressed by the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the relevant drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0081] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments cannot be described one by one here, but the embodiments of the present invention are not limited to the following embodiments.

[0082] like Figure 1 As shown, according to one embodiment of the present invention, a method for assembling a micro-hemispherical gyroscope of the present invention includes the following steps:

[0083] S1. The micro-hemispherical resonant structure is placed in the assembly station and vacuum-adsorbed by applying a first negative pressure to the micro-hemispherical resonant structure;

[0084] S2. Use an adjustment device to adjust the center anchor point of the micro-hemispherical resonant structure to the center of the assembly station;

[0085] S3. Place the planar electrode in the assembly station so that the planar electrode contacts the central anchor point of the micro-hemispherical resonant structure;

[0086] S4. vacuum adsorbing the planar electrode, compressing the micro-hemispherical resonant structure with the planar electrode to cause elastic deformation, and making the central anchor point and the circumferential edge of the micro-hemispherical resonant structure contact the planar electrode;

[0087] S5. Use laser welding to fix the central anchor point of the micro-hemispherical resonant structure to the planar electrode;

[0088] S6. The vacuum adsorption of the micro-hemispherical resonant structure and / or the planar electrode is disconnected, and the micro-hemispherical resonant structure is restored to its original state, thereby completing the assembly of the micro-hemispherical gyroscope.

[0089] like Figure 2 As shown, according to one embodiment of the present invention, in step S1, a micro-hemispherical resonant structure is placed in an assembly station, and in the step of vacuum adsorbing the micro-hemispherical resonant structure using a first negative pressure, the assembly station is arranged on an assembly fixture 1, and at least one assembly station is provided. In this embodiment, a plurality of assembly stations are regularly distributed on the assembly fixture 1, wherein, in order to avoid interference with each other during the assembly process and the arrangement of other passage structures, adjacent assembly stations can be arranged in an interval or staggered manner, thereby effectively ensuring that there is sufficient space between adjacent assembly stations, improving the processing convenience of the assembly fixture 1, and realizing the smooth and reliable execution of the micro-hemispherical gyroscope assembly process.

[0090] In this embodiment, the first negative pressure is set between 5 kPa and 10 kPa. Based on this negative pressure range, the micro-hemispherical resonant structure can be slightly fixed without any or slight elastic deformation. As a result, the initial structural symmetry of the micro-hemispherical resonant structure can be fully maintained, making it easy to be stably driven and adjusted by the adjustment device, eliminating shaking during the adjustment process, and effectively ensuring the centering accuracy of the micro-hemispherical resonant structure and the assembly station.

[0091] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, according to one embodiment of the present invention, the assembly fixture 1 includes: a base 11, an assembly base 12, and a fixing ring 13; wherein the base 11 is a plate with a regular shape as a whole, for example, the base 11 can be set as a rectangle or a rectangle with chamfered corners. In this embodiment, the base 11 has a certain thickness to facilitate the setting of different structures, wherein the base 11 is provided with a vacuum chamber 111, and a first channel 112 for connecting the vacuum chamber 111 and an external vacuum source; in this embodiment, the vacuum chamber 111 can be set as a circular cavity, the bottom of which is closed and an opening is formed on the upper side of the base 11, and the opening is connected to the upper structure through the formed opening to provide a reliable and stable negative pressure environment. Furthermore, to facilitate the installation of the assembly fixture 1, the extension direction of the first channel 112 is set perpendicular to the axial direction of the vacuum chamber 111. This effectively ensures the flatness of the bottom surface of the base 11, thereby achieving stable and reliable installation with other supporting structures. In addition, by ensuring the flatness of the bottom surface of the base 11, it is also beneficial to adjust the horizontal accuracy of the installation of the base 11, which is more beneficial to improving and ensuring the assembly accuracy of the micro-hemispherical gyroscope. Thus, through the provided first channel 112, one end forms a first connecting opening on the inner wall of the vacuum chamber 111, and the other end forms a second connecting opening on the circumferential outer side of the base 11. For multiple vacuum chambers 111, corresponding second connecting openings can be opened based on different sides of the base 11, effectively ensuring the location space for the second connecting opening. In this embodiment, the provided second connecting opening can be conveniently connected to an external vacuum source using a quick-connect connector or other structure.

[0092] In this embodiment, an annular groove 111a is provided on the upper side surface of the base 11, corresponding one to one with the vacuum chamber 111. The annular groove 111a can be used to install an annular sealing ring around the opening side of the vacuum chamber 111. Therefore, based on the provided annular sealing ring, the airtightness between the connection position of the base 11 and the assembly position base 12 can be more effectively improved, which is more beneficial to ensuring the stability of the negative pressure environment in the assembly station, and further plays an excellent role in promoting the improvement of the accuracy of the assembly process.

[0093] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, according to one embodiment of the present invention, the assembly base 12 is generally a plate with a regular shape. Specifically, the assembly base 12 can be configured as a circular plate, which not only facilitates its processing and molding but also facilitates its installation with the base 11. Of course, depending on different installation requirements, the assembly base 12 can also be configured as other shapes, such as a rectangle, a regular polygon, etc. In this embodiment, to facilitate the installation of the assembly base 12 and the base 11, the size of the assembly base 12 is configured to be smaller than the base 11. As a result, the assembly base 12 can be stably pressed against the base 11 using the fixing ring 13.

[0094] In this embodiment, the assembly base 12 is provided with an assembly cavity 121 for assembling the micro-hemispherical resonant structure and the planar electrode, and a second channel 122 for connecting the assembly cavity 121 with the vacuum cavity 111. Multiple second channels 122 are regularly distributed at the bottom of the assembly cavity 121. For example, the second channels 122 are arranged at equal intervals along a circular path at the bottom of the assembly cavity 121, connecting the assembly cavity 121 with the vacuum cavity 111 below. For example, two, three, or four second channels 122 are arranged at equal intervals along a circular path. In this embodiment, the opening area of ​​the vacuum cavity 111 is larger than the distribution range of the second channels 122. This effectively ensures that each second channel 122 is in the same negative pressure state. Furthermore, based on the characteristic of uniform distribution, it is easier to ensure a uniform distribution of the negative pressure environment in the assembly cavity 121, resulting in a more balanced adsorption effect on the micro-hemispherical resonant structure, thereby further improving the assembly accuracy of this solution.

[0095] In this embodiment, the fixing ring 13 is matched with the assembly base 12 and is sleeved on the outer side of the assembly base 12 to press the assembly base 12 against the upper side of the base 11. Specifically, the fixing ring 13 is configured as a circular ring that matches the outer shape of the assembly base 12. The upper edge of the inner side surface of the fixing ring 13 is provided with an annular limiting protrusion that protrudes radially inward. Furthermore, the fixing ring 13 is sleeved coaxially with the assembly base 12 based on the inner side surface, and can press and limit the upper side edge of the assembly base 12 based on the provided annular limiting protrusion, making the positioning of the assembly base 12 more reliable and stable. In this embodiment, in order to achieve a matching connection with the annular limiting protrusion, an annular recess can be provided on the upper end edge of the assembly base 12 so that the annular limiting protrusion can be matched and embedded therein, thereby ensuring the flatness of the connection position.

[0096] In this embodiment, the fixing ring 13 is connected to the base 11 via a locking connector. A through hole for the locking connector can be provided on the fixing ring 13, and a corresponding threaded hole can be provided on the base 11, thereby achieving locking and positioning of the fixing ring 13. Of course, to ensure accurate positioning of the fixing ring 13, corresponding pin holes can also be provided on both the fixing ring 13 and the base 11. Positioning pins can be pre-inserted into the pin holes to accurately position the fixing ring 13 and then lock it.

[0097] In this embodiment, the assembly chamber 121 and the vacuum chamber 111 are combined to form an assembly station, wherein the vacuum chamber 111 and the corresponding first channel 112 are used to provide a negative pressure environment, and the assembly chamber 121 provides a corresponding positioning assembly environment, thereby realizing the construction of an overall assembly station.

[0098] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, according to one embodiment of the present invention, the assembly cavity 121 is a stepped cavity, and includes: a first cavity portion 121a and a second cavity portion 121b coaxially arranged from top to bottom; wherein the shape of the first cavity portion 121a is matched with the shape of the planar electrode; for example, if the planar electrode is a square structure, the first cavity portion 121a is correspondingly set to a matching square cavity; and the second cavity portion 121b is a circular cavity, and is used to accommodate the curved thin-walled portion of the micro-hemispherical resonant structure; and, in order to facilitate stable bearing of the micro-hemispherical resonant structure, the radial dimension of the second cavity portion 121b is smaller than the maximum radial dimension of the micro-hemispherical resonant structure, so that the planar skirt teeth of the micro-hemispherical resonant structure can be supported on the upper side edge of the second cavity portion 121b, so as to achieve reliable support for the micro-hemispherical resonant structure, and most of the gaps between the planar skirt teeth can also be blocked based on the upper side edge of the second cavity portion 121b.

[0099] like Figure 1As shown, according to one embodiment of the present invention, in step S2, in the step of using an adjustment device to adjust the center anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station, the adjustment device 3 includes: an image acquisition module 31, an image data processing module, a position adjustment module and a micro-probe three-axis micro-motion platform 32; wherein the image acquisition module 31 is used to acquire a relative position image of the micro-hemispherical resonant structure and the assembly station, and transmit it to the image data processing module; further, the image data processing module obtains the center anchor point position of the micro-hemispherical resonant structure and the center position of the assembly station based on the relative position image, and transmits the center anchor point position and the center position to the position adjustment module; specifically , the image of the assembly station can be pre-captured based on the image acquisition module 31, and the edge of the assembly station can be identified based on the image data processing module, and the corresponding center position can be calculated based on the edge; therefore, in the process of calculating the center anchor point position, the edge of the micro-hemispherical resonant structure is identified based on the relative position image and the center anchor point position of the micro-hemispherical resonant structure is obtained based on the edge. Therefore, based on the center position closest to the center anchor point position, the assembly station where the micro-hemispherical resonant structure is installed can be determined. Based on this result, a pair of center anchor point positions and center positions can be obtained, and then corresponding marks can be added to them and output to the position adjustment module for calculating the corresponding position deviation.

[0100] Furthermore, the position adjustment module obtains the relative position deviation based on the center anchor point position and the center position, and generates a control instruction based on the relative position deviation; the microprobe three-axis micro-motion platform 32 operates based on the control instruction to adjust the center anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station.

[0101] like Figure 7 As shown, according to one embodiment of the present invention, the microprobe three-axis fine-motion platform 32 includes: an X-axis drive 321, a Y-axis drive 322, a Z-axis drive 323, an extension arm 324 installed on the Z-axis drive 323, and a probe 325 arranged at the end of the extension arm 324; wherein the X-axis drive 321 and the Y-axis drive 322 are connected to drive the probe 325 to move back and forth in the horizontal direction, and the Z-axis drive 323 is connected to the X-axis drive 321 or the Y-axis drive 322 to drive the probe to move back and forth in the vertical direction; in this embodiment, the X-axis drive 321, the Y-axis drive 322 and the Z-axis drive 323 are all electric linear drives, thereby enabling the corresponding control instructions to be executed quickly and accurately to achieve precise adjustment of the position of the micro-hemispherical resonant structure.

[0102] In the embodiment, the probe 325 is in a circular ring structure, and is matched with the resonant structure support at the center position of the micro-hemisphere resonant structure. When adjustment of the corresponding micro-hemisphere resonant structure is needed, the probe 325 is connected with the corresponding resonant structure support based on the combined action of the X-axis drive 321, the Y-axis drive 322 and the Z-axis drive 323, and then is moved slightly in the horizontal direction to accurately adjust the center anchor point of the micro-hemisphere resonant structure. After the adjustment is completed, the probe 325 is further moved to the next micro-hemisphere resonant structure by the combined action of the X-axis drive 321, the Y-axis drive 322 and the Z-axis drive 323, and the position adjustment of all the micro-hemisphere resonant structures is sequentially performed.

[0103] In combination Figure 5 and Figure 6 As shown in FIG. 6, according to an embodiment of the present application, in the step S3 of placing the planar electrode in the assembly station and making the planar electrode contact the center anchor point of the micro-hemisphere resonant structure, after the position adjustment of the micro-hemisphere resonant structure is completed, the planar electrode is installed in the first cavity portion 121a in parallel with the assembly station base 12. Since the first cavity portion 121a is matched with the planar electrode, the planar electrode is accurately limited in the first cavity portion 121a, and the center of the planar electrode is aligned with the center anchor point of the micro-hemisphere resonant structure. Meanwhile, the planar electrode can be moved up and down along the axis of the first cavity portion 121a to adapt to the elastic deformation of the micro-hemisphere resonant structure, so that the center of the planar electrode is always in contact with the center anchor point of the micro-hemisphere resonant structure, facilitating the welding in the subsequent process.

[0104] According to an embodiment of the present application, in the step S4 of vacuum adsorbing the planar electrode and making the planar electrode compress the micro-hemisphere resonant structure to elastically deform and make the center anchor point and the circumferential edge of the micro-hemisphere resonant structure contact the planar electrode, the negative pressure of the assembly cavity 121 is increased by the vacuum source, so that the part of the planar skirt of the micro-hemisphere resonant structure which is not blocked by the second cavity portion 121b can conduct the increased negative pressure to the first cavity portion 121a, and then the planar electrode can compress the micro-hemisphere resonant structure to produce corresponding elastic deformation under the action of the external atmospheric pressure, so that the center anchor point of the micro-hemisphere resonant structure gradually descends until the center anchor point and the circumferential edge of the micro-hemisphere resonant structure contact the planar electrode. Thus, the elastic deformation process of the whole micro-hemisphere resonant structure is completed by keeping the negative pressure constant.

[0105] In this embodiment, in order to ensure the initial positioning of the micro-hemispherical resonant structure under the first negative pressure and the adsorption effect on the planar electrode when the negative pressure is increased, the proportion of the part where the gap between the planar skirt teeth is blocked can be adjusted according to the actual test results, which will not be repeated here.

[0106] Through the above arrangement, the adsorption method of directly increasing the negative pressure on the micro-hemispherical resonant structure through the gap between the plane skirt teeth of the micro-hemispherical resonant structure is adopted, which can effectively streamline the corresponding negative pressure path and is more beneficial to improving its convenience of use.

[0107] like Figure 8 As shown, according to another embodiment of the present invention, in step S4, the planar electrode is vacuum adsorbed, and the micro-hemispherical resonant structure is elastically deformed based on the planar electrode, and the central anchor point and the circumferential edge of the micro-hemispherical resonant structure are in contact with the planar electrode. The assembly position substrate 12 is further provided with a third channel 123, and the planar electrode is adsorbed based on the communication effect of the third channel 123 to compress the micro-hemispherical resonant structure to elastically deform; in this embodiment, the third channel 123 is used to connect the first concave cavity portion 121a and the external vacuum source, wherein the second concave cavity portion 121b can be further controlled. The radial dimension of the second concave cavity portion 121b is set so that the upper side surface of the edge of the second concave cavity portion 121b can close the gap between the planar skirt teeth of the micro-hemispherical resonant structure as much as possible under the abutment effect. For example, the radial dimension of the second concave cavity portion 121b is set to match the position where the planar skirt teeth and the curved thin-walled portion are connected, thereby enabling the gap between the planar skirt teeth to be closed to the greatest extent. Of course, since the gap lengths between the planar skirt teeth of different micro-hemispherical resonant structures are set to be different, the gap between the planar skirt teeth can be completely closed by setting the corresponding second concave cavity portion 121b for different gap lengths. Furthermore, the installed planar electrode and the matching first concave portion 121a form a nearly closed cavity. Furthermore, by connecting the first concave portion 121a to an external vacuum source via the third channel 123, the external vacuum source and the third channel 123 can independently apply negative pressure to the first concave portion 121a. Thus, under the action of external atmospheric pressure, elastic downward pressure can be applied to the micro-hemispherical resonant structure. The applied negative pressure can be maintained constant until the planar electrode contacts both the central anchor point and the surrounding edges of the micro-hemispherical resonant structure, thereby maintaining the compressive effect of the planar electrode. In this embodiment, although there are potential leaks at the mating locations between the first concave portion 121a and the other structures, these leaks can be compensated for by accurately controlling the external vacuum source, thereby fully ensuring the downward pressure effect of the planar electrode on the micro-hemispherical resonant structure.

[0108] Through the above-mentioned arrangement, the method of providing negative pressure to the planar electrode to compress the micro-hemispherical resonant structure can be based on the flexible control of the negative pressure of the external vacuum source to accurately adjust the downward pressure accuracy of the planar electrode, which is more beneficial to ensuring close contact at the assembly position. In addition, by adopting an additional external vacuum source and the third channel 123 to adsorb the planar electrode, the number of third channels 123 and their passage diameters can be arranged more flexibly, and combined with the independence of the external vacuum source, the adsorption efficiency of the planar electrode can be greatly improved. Compared with the method of connecting only through the gap between the planar skirt teeth, its adsorption efficiency can be significantly improved. Furthermore, while adsorbing the planar electrode, the micro-hemispherical resonant structure can be combined with the second concave cavity portion 121b to perform negative pressure adsorption on the micro-hemispherical resonant structure to balance the negative pressure on the opposite sides of the micro-hemispherical resonant structure, thereby making the elastic deformation process of the micro-hemispherical resonant structure faster and more stable.

[0109] like Figure 9 As shown, in another embodiment, the third channel 123 is used to connect the first concave cavity portion 121a and the vacuum chamber 111; wherein, a vacuum negative pressure one-way valve is provided at the position where the third channel 123 is connected to the vacuum chamber 111. In this embodiment, the vacuum negative pressure one-way valve is directly installed at the opening where the third channel 123 is connected to the vacuum chamber 111. In this embodiment, the opening negative pressure of the vacuum negative pressure one-way valve is greater than the first negative pressure, that is, the first negative pressure used in the process of centering the micro-hemispherical resonant structure in step S1 cannot open the vacuum negative pressure one-way valve. As a result, the positioning and adsorption of the micro-hemispherical resonant structure can be achieved by only maintaining the second concave cavity portion 121b in communication with the vacuum chamber 111. When it is necessary to further achieve downward pressure of the center of the micro-hemispherical resonant structure by the planar electrode, the increased negative pressure can open the vacuum negative pressure one-way valve, so that the vacuum chamber 111 is connected to the first concave cavity portion 121a. In this state, the negative pressure is continuously increased, so that the planar electrode can be subjected to the action of the external atmospheric pressure to press the micro-hemispherical resonant structure until the planar electrode contacts the central anchor point and the surrounding edges of the micro-hemispherical resonant structure. The negative pressure provided can be kept constant to maintain the compressive effect of the planar electrode.

[0110] Through the above arrangement, by controlling the third channel 123 to communicate with the vacuum chamber 111, the planar electrode compresses the micro-hemispherical resonant structure, effectively ensuring that the micro-hemispherical resonant structure and the planar electrode are simultaneously subjected to the same negative pressure. This maintains the synchronous control of the planar electrode's fall and the elastic deformation of the micro-hemispherical resonant structure, further contributing to ensuring contact consistency in the assembly position. Furthermore, this approach fully ensures negative pressure balance on both the inside and outside of the micro-hemispherical resonant structure, allowing it to experience only elastic deformation, further contributing to ensuring the structural reliability and stability of the micro-hemispherical resonant structure during and after welding. Thus, when the third channel 123 is open, if the gaps between the planar skirt teeth are not fully closed, it can also form a parallel path with the path formed by the gaps between the planar skirt teeth that are not fully closed, further expanding the path diameter. This can repeatedly eliminate the disadvantage of low adsorption efficiency when communicating only through the gaps between the planar skirt teeth, significantly improving adsorption efficiency without adding additional equipment or structural complexity.

[0111] like Figure 2 As shown, according to one embodiment of the present invention, a micro-hemispherical gyroscope assembly device is provided, comprising: an assembly fixture 1, a laser welding platform 2, an adjustment device 3, and a vacuum device. In this embodiment, the laser welding platform 2 comprises: a two-dimensional stage 21, a laser objective lens 22, and a laser light source; wherein the laser objective lens 22 is located above the two-dimensional stage 21; the assembly fixture 1 and the adjustment device 3 are respectively mounted on the two-dimensional stage 21. In this embodiment, the vacuum device is connected to the assembly fixture 1; wherein the vacuum device serves as a vacuum source for providing negative pressure and comprises: a vacuum pump, a pressure reducing valve, and connecting pipelines. The pressure reducing valve can be used to control the negative pressure.

[0112] In this embodiment, the assembly fixture 1 is provided with at least one assembly station for placing the micro-hemispherical resonant structure and the planar electrode; thus, the vacuum device acts on the planar electrode based on the assembly station, and compresses the micro-hemispherical resonant structure to undergo elastic deformation based on the planar electrode, so that the central anchor point and the circumferential edge of the micro-hemispherical resonant structure are in contact with the planar electrode.

[0113] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, according to one embodiment of the present invention, the assembly fixture includes: a base 11, an assembly base 12, and a fixing ring 13; wherein the base 11 is a plate with a regular shape as a whole, for example, the base 11 can be set as a rectangle or a rectangle with chamfered corners. In this embodiment, the base 11 has a certain thickness to facilitate the setting of different structures, wherein the base 11 is provided with a vacuum chamber 111, and a first channel 112 for connecting the vacuum chamber 111 and an external vacuum source; in this embodiment, the vacuum chamber 111 can be set as a circular cavity, the bottom of which is closed and an opening is formed on the upper side of the base 11, and the opening is connected to the upper structure through the formed opening to provide a reliable and stable negative pressure environment. Furthermore, to facilitate the installation of the assembly fixture 1, the extension direction of the first channel 112 is set perpendicular to the axial direction of the vacuum chamber 111. This effectively ensures the flatness of the bottom surface of the base 11, thereby achieving stable and reliable installation with other supporting structures. In addition, by ensuring the flatness of the bottom surface of the base 11, it is also beneficial to adjust the horizontal accuracy of the installation of the base 11, which is more beneficial to improving and ensuring the assembly accuracy of the micro-hemispherical gyroscope. Thus, through the provided first channel 112, one end forms a first connecting opening on the inner wall of the vacuum chamber 111, and the other end forms a second connecting opening on the circumferential outer side of the base 11. For multiple vacuum chambers 111, corresponding second connecting openings can be opened based on different sides of the base 11, effectively ensuring the location space for the second connecting opening. In this embodiment, the provided second connecting opening can be conveniently connected to an external vacuum source using a quick-connect connector or other structure.

[0114] In this embodiment, an annular groove 111a is provided on the upper side surface of the base 11, corresponding one to one with the vacuum chamber 111. The annular groove 111a can be used to install an annular sealing ring around the opening side of the vacuum chamber 111. Therefore, based on the provided annular sealing ring, the airtightness between the connection position of the base 11 and the assembly position base 12 can be more effectively improved, which is more beneficial to ensuring the stability of the negative pressure environment in the assembly station, and further plays an excellent role in promoting the improvement of the accuracy of the assembly process.

[0115] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, according to one embodiment of the present invention, the assembly base 12 is generally a plate with a regular shape. Specifically, the assembly base 12 can be configured as a circular plate, which not only facilitates its processing and molding but also facilitates its installation with the base 11. Of course, depending on different installation requirements, the assembly base 12 can also be configured as other shapes, such as a rectangle, a regular polygon, etc. In this embodiment, to facilitate the installation of the assembly base 12 and the base 11, the size of the assembly base 12 is configured to be smaller than the base 11. As a result, the assembly base 12 can be stably pressed against the base 11 using the fixing ring 13.

[0116] In this embodiment, the assembly base 12 is provided with an assembly cavity 121 for assembling the micro-hemispherical resonant structure and the planar electrode, and a second channel 122 for connecting the assembly cavity 121 with the vacuum cavity 111. A plurality of second channels 122 are regularly distributed at the bottom of the assembly cavity 121. For example, the second channels 122 are arranged at equal intervals along a ring at the bottom of the assembly cavity 121, connecting the assembly cavity 121 with the vacuum cavity 111 below. For example, two, three, four, etc. second channels 122 are arranged at equal intervals along a ring. In this embodiment, the opening area of ​​the vacuum cavity 111 is larger than the distribution range of the second channels 122. This effectively ensures that each second channel 122 is in the same negative pressure state. Furthermore, based on the characteristic of uniform distribution, it is easier to ensure the uniform distribution of the negative pressure environment in the assembly cavity 121, so that its adsorption effect on the micro-hemispherical resonant structure is more balanced, thereby reliably ensuring the improvement of the assembly accuracy of this solution.

[0117] In this embodiment, the fixing ring 13 is matched with the assembly base 12 and is sleeved on the outer side of the assembly base 12 to press the assembly base 12 against the upper side of the base 11. Specifically, the fixing ring 13 is configured as a circular ring that matches the outer shape of the assembly base 12. The upper edge of the inner side surface of the fixing ring 13 is provided with an annular limiting protrusion that protrudes radially inward. Furthermore, the fixing ring 13 is sleeved coaxially with the assembly base 12 based on the inner side surface, and can press and limit the upper side edge of the assembly base 12 based on the provided annular limiting protrusion, making the positioning of the assembly base 12 more reliable and stable. In this embodiment, in order to achieve a matching connection with the annular limiting protrusion, an annular recess can be provided on the upper end edge of the assembly base 12 so that the annular limiting protrusion can be matched and embedded therein, thereby ensuring the flatness of the connection position.

[0118] In this embodiment, the fixing ring 13 is connected to the base 11 via a locking connector. A through hole for the locking connector can be provided on the fixing ring 13, and a corresponding threaded hole can be provided on the base 11, thereby achieving locking and positioning of the fixing ring 13. Of course, to ensure accurate positioning of the fixing ring 13, corresponding pin holes can also be provided on both the fixing ring 13 and the base 11. Positioning pins can be pre-inserted into the pin holes to accurately position the fixing ring 13 and then lock it.

[0119] In this embodiment, the assembly chamber 121 and the vacuum chamber 111 are combined to form an assembly station, wherein the vacuum chamber 111 and the corresponding first channel 112 are used to provide a negative pressure environment, and the assembly chamber 121 provides a corresponding positioning assembly environment, thereby realizing the construction of an overall assembly station.

[0120] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, according to one embodiment of the present invention, the assembly cavity 121 is a stepped cavity, and includes: a first cavity portion 121a and a second cavity portion 121b coaxially arranged from top to bottom; wherein the shape of the first cavity portion 121a is matched with the shape of the planar electrode; for example, if the planar electrode is a square structure, the first cavity portion 121a is correspondingly set to a matching square cavity; and the second cavity portion 121b is a circular cavity, and is used to accommodate the curved thin-walled portion of the micro-hemispherical resonant structure; and, in order to facilitate stable bearing of the micro-hemispherical resonant structure, the radial dimension of the second cavity portion 121b is smaller than the maximum radial dimension of the micro-hemispherical resonant structure, so that the planar skirt teeth of the micro-hemispherical resonant structure can be supported on the upper side edge of the second cavity portion 121b, so as to achieve reliable support for the micro-hemispherical resonant structure, and most of the gaps between the planar skirt teeth can also be blocked based on the upper side edge of the second cavity portion 121b.

[0121] Combine Figure 3 、 Figure 4 、 Figure 5 and Figure 6As shown, according to an embodiment of the present application, corner avoiding holes 121a1 can be optionally arranged at four corner positions of the first concave cavity portion 121a, wherein the depth of the corner avoiding holes 121a1 is consistent with the depth of the first concave cavity portion 121a. The corner avoiding holes 121a1 not only eliminate the potential interference between the four corner positions of the first concave cavity portion 121a and the planar electrode, but also effectively eliminate the stress at the corner positions of the first concave cavity portion 121a, so as to ensure the structural stability of the first concave cavity portion 121a. In the embodiment, the diameter of the corner avoiding holes 121a1 can be set within a small range (e.g. less than 1 mm, preferably 0.5 mm), so as to avoid the generation of a large leakage point during vacuum adsorption, thereby ensuring the adsorption effect of the present application.

[0122] According to an embodiment of the present application, the planar electrode is vacuum adsorbed, and based on the process that the planar electrode compresses the micro-hemispherical resonant structure to generate elastic deformation and makes the center anchor point and the circumferential edge of the micro-hemispherical resonant structure contact the planar electrode, the negative pressure of the assembly cavity 121 is increased by the vacuum source, so that the part of the planar skirt teeth of the micro-hemispherical resonant structure which is not blocked by the second concave cavity portion 121b can conduct the increased negative pressure to the first concave cavity portion 121a, and then under the action of the external atmospheric pressure, the planar electrode can compress the micro-hemispherical resonant structure to generate corresponding elastic deformation, so that the center anchor point of the micro-hemispherical resonant structure gradually descends until the center anchor point and the circumferential edge of the micro-hemispherical resonant structure contact the planar electrode. Thus, the elastic deformation process of the whole micro-hemispherical resonant structure can be completed by keeping the negative pressure constant.

[0123] In the embodiment, in order to ensure the initial positioning of the micro-hemispherical resonant structure under the first negative pressure and the adsorption effect of the planar electrode under the increased negative pressure, the proportion of the part of the gap between the planar skirt teeth which is blocked can be adjusted according to the actual test results, which will not be described here.

[0124] As Figure 8As shown, according to another embodiment of the present invention, in the step of vacuum adsorption of the planar electrode, compressing the micro-hemispherical resonant structure based on the planar electrode to cause elastic deformation, and causing the central anchor point and circumferential edge of the micro-hemispherical resonant structure to contact the planar electrode, the assembly base 12 is further provided with a third channel 123. In this embodiment, the third channel 123 is used to connect the first concave cavity portion 121a with an external vacuum source. The radial dimension of the second concave cavity portion 121b can be further controlled so that the upper side surface of the edge of the second concave cavity portion 121b can close as much of the gap between the planar skirt teeth of the micro-hemispherical resonant structure as possible under the abutment effect. For example, the radial dimension of the second concave cavity portion 121b is set to match the position where the planar skirt teeth and the curved thin-walled portion are connected, thereby maximally closing the gap between the planar skirt teeth. Of course, since the gap lengths between the planar skirt teeth of different micro-hemispherical resonant structures are set to be different, the gap between the planar skirt teeth can also be completely closed by providing corresponding second concave cavity portions 121b for different gap lengths. Furthermore, the installed planar electrode and the matching first concave portion 121a form a nearly closed cavity. Furthermore, the third channel 123 connects the first concave portion 121a to an external vacuum source. This allows the external vacuum source and the third channel 123 to independently apply negative pressure to the first concave portion 121a. Consequently, under the action of external atmospheric pressure, the micro-hemispherical resonant structure can be elastically pressed downward. The applied negative pressure can be maintained constant until the planar electrode contacts both the central anchor point and the surrounding edges of the micro-hemispherical resonant structure, thereby maintaining the compressive effect of the planar electrode. In this embodiment, the opening formed by the third channel 123 on the bottom surface of the first concave portion 121a can be an annular opening coaxial with the second concave portion 121b, or can be configured as multiple openings evenly distributed along the circumference. In this embodiment, although there are potential leakage points at the mating locations between the first concave portion 121a and the other structures, these leaks can be compensated for through precise control of the external vacuum source, thereby fully ensuring the compressive effect of the planar electrode on the micro-hemispherical resonant structure.

[0125] like Figure 9As shown, in another embodiment, the third channel 123 is used to connect the first concave cavity portion 121a and the vacuum chamber 111; wherein, if the third channel 123 is connected to the vacuum chamber 111, a vacuum negative pressure one-way valve is provided at the position where the third channel 123 connects to the vacuum chamber 111. In this embodiment, the vacuum negative pressure one-way valve is directly installed at the opening where the third channel 123 connects to the vacuum chamber 111. In this embodiment, the opening negative pressure of the vacuum negative pressure one-way valve is greater than the first negative pressure, that is, the first negative pressure used in the process of centering the micro-hemispherical resonant structure cannot open the vacuum negative pressure one-way valve. As a result, the positioning and adsorption of the micro-hemispherical resonant structure can be achieved by only maintaining the second concave cavity portion 121b in communication with the vacuum chamber 111. When it is necessary to further achieve downward pressure of the center of the micro-hemispherical resonant structure by the planar electrode, the increased negative pressure can open the vacuum negative pressure one-way valve, so that the vacuum chamber 111 is connected to the first concave cavity portion 121a. In this state, the negative pressure is continuously increased, so that the planar electrode can be subjected to the action of the external atmospheric pressure to press the micro-hemispherical resonant structure until the planar electrode contacts the central anchor point and the surrounding edges of the micro-hemispherical resonant structure. The negative pressure provided can be kept constant to maintain the compressive effect of the planar electrode.

[0126] In this embodiment, the opening formed by the third channel 123 on the bottom surface of the first concave portion 121a can be configured as an annular opening coaxial with the second concave portion 121b, or can be configured as multiple openings evenly distributed along the circumference. Furthermore, multiple third channels 123 can be arranged at equal intervals along the annular direction.

[0127] In another embodiment, when the micro-hemispherical resonant structure is elastically deformed due to pressure from the planar electrode, the four corner positions of the first concave cavity portion 121a are matched with the corners of the planar electrode to ensure the airtightness of the space after the first concave cavity portion 121a is connected to the planar electrode, so as to facilitate the stable and reliable negative pressure effect. Of course, in another embodiment, it is also possible to optionally set corner avoidance holes 121a1 at the four corner positions of the first concave cavity portion 121a, and add elastic sealing members 121a2 to the corner avoidance holes 121a1, see Figure 10 As shown; the elastic seal 121a2 is a fan-shaped cylinder as a whole, and the outer side surface of the fan-shaped cylinder is matched with the inner side surface of the corner avoidance hole 121a1, and the notch position set on the elastic seal 121a2 is flush with the inner side surface of the first concave cavity part 121a. Therefore, when installing the planar electrode, based on the flexible characteristics of the elastic seal 121a2, interference with the corner position of the planar electrode can be avoided, and the sealing of the corner position can be ensured based on the elastic force of the elastic seal 121a2, which effectively ensures the airtightness of the space between the planar electrode and the first concave cavity part 121a, thereby conveniently realizing the corresponding negative pressure adsorption effect.

[0128] like Figure 1 As shown, according to one embodiment of the present invention, the adjustment device 3 includes: an image acquisition module 31, an image data processing module, a position adjustment module and a microprobe three-axis micro-motion platform 32; wherein the image acquisition module 31 is used to acquire the relative position image of the micro-hemispherical resonant structure and the assembly station, and transmit it to the image data processing module; further, the image data processing module obtains the center anchor point position of the micro-hemispherical resonant structure and the center position of the assembly station based on the relative position image, and transmits the center anchor point position and the center position to the position adjustment module; further, the position adjustment module obtains the relative position deviation based on the center anchor point position and the center position, and generates a control instruction based on the relative position deviation; the microprobe three-axis micro-motion platform 32 operates based on the control instruction to adjust the center anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station.

[0129] like Figure 7 As shown, according to one embodiment of the present invention, the microprobe three-axis fine-motion platform 32 includes: an X-axis drive 321, a Y-axis drive 322 arranged on the X-axis drive 321, a Z-axis drive 323 arranged on the Y-axis drive 322, an extension arm 324 installed on the Z-axis drive 323, and a probe 325 arranged at the end of the extension arm 324; in this embodiment, the X-axis drive 321, the Y-axis drive 322 and the Z-axis drive 323 are all electric linear drives, thereby enabling the corresponding control instructions to be executed quickly and accurately to achieve precise adjustment of the position of the micro-hemispherical resonant structure.

[0130] In this embodiment, probe 325 is a circular ring-shaped structure that matches the resonant structure support at the center of the micro-hemispherical resonant structure. When the corresponding micro-hemispherical resonant structure needs to be adjusted, the combined action of X-axis drive 321, Y-axis drive 322, and Z-axis drive 323 drives probe 325 to connect to the corresponding resonant structure support. Then, probe 325 is sequentially moved slightly in the horizontal direction to accurately adjust the center anchor point of the micro-hemispherical resonant structure. After the adjustment is completed, probe 325 is further moved to the next micro-hemispherical resonant structure through the combined action of X-axis drive 321, Y-axis drive 322, and Z-axis drive 323. This sequential adjustment completes the position adjustment of all micro-hemispherical resonant structures.

[0131] The present invention has built a complete assembly device, which has realized the batch assembly of micro-hemispherical resonant structures. By adjusting the laser scanning speed and scanning trajectory, the assembly of a single resonant structure can be completed within 3-5 minutes. The electrode gap measurement results show that the gap error is only about 5% of the gap value, indicating that the assembly effect is very ideal and consistent with expectations.

[0132] The above contents are merely examples of specific solutions of the present invention. For devices and structures not described in detail, it should be understood that they can be implemented by adopting general devices and methods available in the art.

[0133] The above description is merely one embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for assembling a micro-hemispherical gyroscope, characterized in that: The following steps are involved: S1. placing the micro-hemispherical resonant structure in an assembly station, and applying a first negative pressure to vacuum adsorb the micro-hemispherical resonant structure; wherein the assembly station is provided on an assembly fixture (1), and at least one assembly station is provided; The assembly fixture (1) comprises: a base (11), an assembly position base (12) and a fixing ring (13); The base (11) is in the form of a plate with a regular shape as a whole, and the base (11) is provided with a vacuum cavity (111), and a first channel (112) for connecting the vacuum cavity (111) and an external vacuum source; The opening side of the vacuum cavity (111) is located on the upper side of the base (11); one end of the first channel (112) forms a first communication opening on the inner side wall of the vacuum cavity (111); and the other end forms a second communication opening on the circumferential outer side of the base (11); The assembly position base (12) is in the form of a plate with a regular shape as a whole, and the assembly position base (12) is provided with an assembly cavity (121) for assembling the micro-hemispherical resonant structure and the planar electrode, and a second channel (122) for connecting the assembly cavity (121) and the vacuum cavity (111); A plurality of second channels (122) are regularly distributed at the bottom of the assembly cavity (121); The fixing ring (13) is matched with the assembly base (12) and is sleeved on the outer side of the assembly base (12) to press the assembly base (12) against the upper side of the base (11); The fixing ring (13) is connected to the base (11) based on a locking connector; The assembly chamber (121) and the vacuum chamber (111) are combined to form the assembly station; S2. Using an adjustment device to adjust the center anchor point of the micro-hemispherical resonant structure to the center of the assembly station; S3. The planar electrode is placed in the assembly station so that the planar electrode contacts the central anchor point of the micro-hemispherical resonant structure; S4. vacuum adsorbing the planar electrode, compressing the micro-hemispherical resonant structure based on the planar electrode to elastically deform the micro-hemispherical resonant structure, and making the central anchor point and the circumferential edge of the micro-hemispherical resonant structure contact the planar electrode; S5. Using a laser to weld the center anchor point of the micro-hemispherical resonant structure to the planar electrode; S6. disconnecting the vacuum adsorption of the micro-hemispherical resonant structure and / or the planar electrode, and returning the micro-hemispherical resonant structure to its original state, thereby completing the assembly of the micro-hemispherical gyroscope.

2. The micro-hemispherical gyroscope assembly method according to claim 1, characterized in that: The assembly cavity (121) is a stepped cavity, and comprises: a first cavity portion (121a) and a second cavity portion (121b) coaxially arranged from top to bottom; The first concave cavity portion (121a) is configured such that the shape matches the shape of the planar electrode; The second concave cavity portion (121b) is a circular concave cavity, and is used to accommodate the curved thin-wall portion of the micro-hemispherical resonant structure; The planar skirt teeth of the micro-hemispherical resonant structure are supported on the upper side of the edge of the second concave cavity portion (121b).

3. The micro-hemispherical gyroscope assembly method according to claim 2, characterized in that: In step S2, an adjustment device is used to adjust the central anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station, wherein the adjustment device includes: an image acquisition module, an image data processing module, a position adjustment module, and a micro-probe three-axis fine-motion platform; The image acquisition module is used to acquire an image of the relative position of the micro-hemispherical resonant structure and the assembly station, and transmit the image to the image data processing module; The image data processing module obtains the central anchor point position of the micro-hemispherical resonant structure and the central position of the assembly station based on the relative position image, and transmits the central anchor point position and the central position to the position adjustment module; The position adjustment module obtains a relative position deviation based on the central anchor point position and the central position, and generates a control instruction based on the relative position deviation; The microprobe three-axis micro-motion platform operates based on the control instruction to adjust the central anchor point of the micro-hemispherical resonant structure to be at the center of the assembly station.

4. The micro-hemispherical gyroscope assembly method according to claim 3, characterized in that: The microprobe three-axis fine-motion platform includes: an X-axis drive, a Y-axis drive, a Z-axis drive, an extension arm mounted on the Z-axis drive, and a probe arranged at the end of the extension arm; The X-axis drive is connected to the Y-axis drive and is used to drive the probe to move back and forth in the horizontal direction. The Z-axis drive is connected to the X-axis drive or the Y-axis drive and is used to drive the probe to move back and forth in the vertical direction. The probe is a circular ring structure, and is matched with the resonant structure support at the center of the micro-hemispherical resonant structure.

5. The micro-hemispherical gyroscope assembly method according to claim 4, characterized in that: In step S4, the planar electrode is vacuum adsorbed, and in the step of compressing the micro-hemispherical resonant structure to cause elastic deformation based on the planar electrode, the negative pressure of the vacuum adsorption of the micro-hemispherical resonant structure is increased, so as to continue to adsorb the planar electrode based on the communication effect of the partial gap between the planar skirt teeth of the micro-hemispherical resonant structure to compress the micro-hemispherical resonant structure to cause elastic deformation; or, the assembly position substrate (12) is further provided with a third channel (123), and the planar electrode is adsorbed based on the communication effect of the third channel (123) to compress the micro-hemispherical resonant structure to cause elastic deformation; wherein the third channel (123) is used to connect the first concave cavity portion (121a) and the external vacuum source, or the third channel (123) is used to connect the first concave cavity portion (121a) and the vacuum cavity (111); If the third channel (123) is connected to the vacuum chamber (111), a vacuum negative pressure one-way valve is provided at the position where the third channel (123) is connected to the vacuum chamber (111).

6. A micro-hemispherical gyroscope assembly device, characterized in that: include: An assembly fixture (1), a laser welding platform (2), an adjustment device (3) and a vacuum device; The laser welding platform (2) comprises: a two-dimensional stage (21), a laser objective lens (22) and a laser light source; The laser objective lens (22) is located above the two-dimensional stage (21); The assembly fixture (1) and the adjustment device (3) are respectively mounted on the two-dimensional stage (21); The vacuum device is connected to the assembly fixture (1); The assembly fixture (1) is provided with at least one assembly station for placing a micro-hemispherical resonant structure and a planar electrode; The vacuum device acts on the planar electrode based on the assembly station, and compresses the micro-hemispherical resonant structure to elastically deform based on the planar electrode, so that the central anchor point and the circumferential edge of the micro-hemispherical resonant structure are in contact with the planar electrode; The assembly fixture comprises: a base (11), an assembly position base (12) and a fixing ring (13); The base (11) is in the form of a plate with a regular shape as a whole, and the base (11) is provided with a vacuum cavity (111), and a first channel (112) for connecting the vacuum cavity (111) and an external vacuum source; The opening side of the vacuum cavity (111) is located on the upper side of the base (11); one end of the first channel (112) forms a first communication opening on the inner side wall of the vacuum cavity (111); and the other end forms a second communication opening on the circumferential outer side of the base (11); The assembly position base (12) is in the form of a plate with a regular shape as a whole, and the assembly position base (12) is provided with an assembly cavity (121) for assembling the micro-hemispherical resonant structure and the planar electrode, and a second channel (122) for connecting the assembly cavity (121) and the vacuum cavity (111); A plurality of second channels (122) are regularly distributed at the bottom of the assembly cavity (121); The fixing ring (13) is matched with the assembly base (12) and is sleeved on the outer side of the assembly base (12) to press the assembly base (12) against the upper side of the base (11); The fixing ring (13) is connected to the base (11) based on a locking connector; The assembly chamber (121) and the vacuum chamber (111) are combined to form the assembly station; The assembly cavity (121) is a stepped cavity, and comprises: a first cavity portion (121a) and a second cavity portion (121b) coaxially arranged from top to bottom; The first concave cavity portion (121a) is configured such that the shape matches the shape of the planar electrode; The second concave cavity portion (121b) is a circular concave cavity, and is used to accommodate the curved thin-wall portion of the micro-hemispherical resonant structure; The planar skirt teeth of the micro-hemispherical resonant structure are supported on the upper side of the edge of the second concave cavity portion (121b).

7. The micro-hemispherical gyroscope assembly device according to claim 6, characterized in that: If the assembly position base (12) is further provided with a third channel (123), the third channel (123) is used to connect the first concave cavity portion (121a) and an external vacuum source, or the third channel (123) is used to connect the first concave cavity portion (121a) and the vacuum cavity (111); If the third channel (123) is connected to the vacuum chamber (111), a vacuum negative pressure one-way valve is provided at the position where the third channel (123) is connected to the vacuum chamber (111).

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