Micro-force measuring device

Abstract

The application discloses a micro-force measuring device, and relates to the field of micro-nano scale mechanical testing, wherein a first parallel-plate capacitor comprises a first electrode plate and a second electrode plate, a second parallel-plate capacitor comprises a third electrode plate and a fourth electrode plate, the first electrode plate and the third electrode plate are connected with a device body, the second electrode plate is connected with a force loading probe, the fourth electrode plate is connected with a displacement transmission member, the force loading probe is movable relative to the device body along a first direction, and the displacement transmission member is configured to move together with the force loading probe after the force loading probe moves a preset distance along the first direction. Thus, by enabling the displacement transmission member to move together with the force loading probe after the force loading probe moves a preset distance along the first direction, the micro-force measuring device can automatically switch to large-range measurement through the displacement transmission member after small-range measurement reaches a limit, so that the micro-force measuring device has high sensitivity, high resolution and large range, and the accuracy and convenience of measurement of the micro-force measuring device are improved.

Description

Technical Field

[0001] This invention relates to the field of micro-nano scale mechanical testing, and in particular to a micro-force measurement device. Background Technology

[0002] With the rise of nanoscience and technology, there is an urgent need to develop experimental testing techniques and methods at the micro- and nanoscale. In related technologies, the design of micro-force measurement devices is often flawed. High-sensitivity, high-resolution micro-force measurement devices have small ranges, while large-range micro-force measurement devices have lower sensitivity and resolution. This results in a situation where micro-force measurement devices cannot simultaneously achieve high sensitivity, high resolution, and large range, affecting the accuracy and convenience of measurement. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a micro-force measuring device that can balance high sensitivity, high resolution, and large range, thereby improving the accuracy and convenience of measurement.

[0004] The micro-force measuring device according to the present invention includes: a device body; a first parallel plate capacitor and a second parallel plate capacitor, the first parallel plate capacitor including a first electrode plate and a second electrode plate, the second parallel plate capacitor including a third electrode plate and a fourth electrode plate, the first electrode plate and the third electrode plate being connected to the device body; a force loading probe, a first force-sensitive element, a second force-sensitive element, and a displacement transmitter, the second electrode plate being connected to the force loading probe, the fourth electrode plate being connected to the displacement transmitter, the first force-sensitive element being connected between the device body and the force loading probe, the second force-sensitive element being connected between the displacement transmitter and the device body, the force loading probe being movable relative to the device body along a first direction, and the displacement transmitter being configured such that after the force loading probe moves a predetermined distance along the first direction, it moves together with the force loading probe.

[0005] According to the micro-force measuring device of the present invention, by enabling the displacement transmission element to move together with the force-loaded probe after the force-loaded probe has moved a preset distance along the first direction, the micro-force measuring device can automatically switch to a large-range measurement after the small-range measurement reaches its limit, so that the micro-force measuring device can take into account both high sensitivity / high resolution and large range, which is beneficial to improving the accuracy and convenience of the micro-force measuring device.

[0006] In some examples of the present invention, there are multiple first electrode plates, multiple second electrode plates, multiple third electrode plates, and multiple fourth electrode plates. Along the first direction, multiple first electrode plates and multiple second electrode plates are arranged alternately, and multiple third electrode plates and multiple fourth electrode plates are arranged alternately.

[0007] In some examples of the present invention, the spacing between at least one pair of adjacent first electrode plates and second electrode plates is different from the spacing between another pair of adjacent first electrode plates and second electrode plates;

[0008] And / or, the spacing between at least one pair of adjacent third plates and fourth plates is different from the spacing between another pair of adjacent third plates and fourth plates.

[0009] In some examples of the present invention, the force-loading probe has a first mating part, the displacement transmitter has a second mating part, and after the force-loading probe moves a preset distance along the first direction, the first mating part can engage with the second mating part so that the displacement transmitter moves together with the force-loading probe.

[0010] In some examples of the present invention, the first mating portion includes: a first sub-part and a second sub-part, the second sub-part being connected to the first sub-part, and along the first direction, at least a portion of the first sub-part being located on one side of the second mating portion and corresponding to the second mating portion, and at least a portion of the second sub-part being located on the other side of the second mating portion and corresponding to the second mating portion.

[0011] In some examples of the present invention, the micro-force measuring device is made of an amorphous alloy.

[0012] In some examples of the present invention, the first parallel plate capacitor and the second parallel plate capacitor are spaced apart along the first direction, the first force-sensitive element is located at one end of the first parallel plate capacitor away from the second parallel plate capacitor, and the second force-sensitive element is located at one end of the second parallel plate capacitor away from the first parallel plate capacitor.

[0013] In some examples of the present invention, the micro-force measuring device further includes a third force-sensitive element connected between the device body and the force-loading probe, and located between the first force-sensitive element and the second force-sensitive element along the first direction.

[0014] In some examples of the present invention, the device body includes: a first sub-body, a second sub-body, and a third sub-body, wherein the second sub-body and the third sub-body are both disposed inside the first sub-body, the first force-sensitive element is connected between the first sub-body and the force loading probe, the second force-sensitive element is connected between the displacement transmitter and the third sub-body, the third force-sensitive element is connected between the third sub-body and the force loading probe, and the first electrode plate and the third electrode plate are both connected to the second sub-body.

[0015] In some examples of the present invention, the first parallel plate capacitor, the second parallel plate capacitor, the first force-sensitive element, the second force-sensitive element, and the third force-sensitive element are all two in number and are all spaced apart along a second direction, which is perpendicular to the first direction;

[0016] And / or, the force-loaded probe, the first sub-body, and the third sub-body are connected to the ground terminal, and the second sub-body is connected to the voltage terminal.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a top view of the micro-force measuring device according to an embodiment of the present invention;

[0020] Figure 2 This is an enlarged schematic diagram of the first parallel plate capacitor according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the first mating part and the second mating part according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the second force-sensitive element according to an embodiment of the present invention;

[0023] Figure 5 This is a graph showing the relationship between capacitance and displacement of the micro-force measuring device according to an embodiment of the present invention;

[0024] Figure 6 This is a diagram showing the relationship between displacement and force of a micro-force measuring device corresponding to a second force-sensitive element of different length dimensions according to an embodiment of the present invention.

[0025] Figure label:

[0026] Microforce measuring device 100;

[0027] Device body 10; first sub-body 11; second sub-body 12; third sub-body 13;

[0028] First parallel plate capacitor 20; First electrode 21; Second electrode 22;

[0029] Second parallel plate capacitor 30; Third plate 31; Fourth plate 32;

[0030] Force-loaded probe 40; first mating part 41; first sub-part 411; second sub-part 412;

[0031] First force-sensitive element 51; Second force-sensitive element 52; Third force-sensitive element 53;

[0032] Displacement transmission component 60; second mating part 61. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0034] The following is for reference. Figures 1-6 A micro-force measuring device 100 according to an embodiment of the present invention is described.

[0035] like Figures 1-6 As shown, the micro-force measuring device 100 according to an embodiment of the present invention includes: a device body 10, a first parallel plate capacitor 20, a second parallel plate capacitor 30, a force loading probe 40, a first force-sensitive element 51, a second force-sensitive element 52, and a displacement transmission element 60.

[0036] The first parallel-plate capacitor 20 includes a first plate 21 and a second plate 22, and the second parallel-plate capacitor 30 includes a third plate 31 and a fourth plate 32. The first plate 21 and the third plate 31 are connected to the device body 10; the second plate 22 is connected to the force-loading probe 40, and the fourth plate 32 is connected to the displacement transmitter 60. A first force-sensitive element 51 is connected between the device body 10 and the force-loading probe 40, and a second force-sensitive element 52 is connected between the displacement transmitter 60 and the device body 10. The force-loading probe 40 is movable relative to the device body 10 along a first direction, and the displacement transmitter 60 is configured such that the force-loading probe 40 moves along the first direction (i.e., ...). Figure 1 After moving a preset distance in the Z direction (as shown), the probe 40 with the same force load moves together.

[0037] Among them, as some embodiments of this application, along the first direction (i.e. Figure 1 (As shown in the Z direction), the first parallel plate capacitor 20 and the second parallel plate capacitor 30 are spaced apart, and the distance between the first parallel plate capacitor 20 and the force loading probe 40 is less than the distance between the second parallel plate capacitor 30 and the force loading probe 40.

[0038] The first parallel plate capacitor 20 includes a first electrode plate 21 and a second electrode plate 22. In some embodiments of the present application, the first electrode plate 21 is configured as the positive electrode plate, and the second electrode plate 22 is configured as the negative electrode plate. The second parallel plate capacitor 30 includes a third electrode plate 31 and a fourth electrode plate 32. In some embodiments of the present application, the third electrode plate 31 is configured as the positive electrode plate, and the fourth electrode plate 32 is configured as the negative electrode plate. When the relative positions of the first electrode plate 21 and the second electrode plate 22 of the first parallel plate capacitor 20 change, the capacitance of the first parallel plate capacitor 20 will change. When the relative positions of the third electrode plate 31 and the fourth electrode plate 32 of the second parallel plate capacitor 30 change, the capacitance of the second parallel plate capacitor 30 will also change.

[0039] In some embodiments of the present application, the dimensional parameters of the first parallel plate capacitor 20 and the second parallel plate capacitor 30 can be adjusted according to actual requirements.

[0040] The first electrode plate 21 and the third electrode plate 31 are connected to the device body 10. In some embodiments of the present application, the first electrode plate 21 and the third electrode plate 31 are integrally formed with the device body 10. The second electrode plate 22 is connected to the force loading probe 40. In some embodiments of the present application, the second electrode plate 22 is integrally formed with the force loading probe 40. The fourth electrode plate 32 is connected to the displacement transfer member 60. In some embodiments of the present application, the fourth electrode plate 32 is integrally formed with the displacement transfer member 60.

[0041] The first force sensitive element 51 is connected between the device body 10 and the force loading probe 40. In some embodiments of the present application, the first force sensitive element 51 is configured as a structure similar to the Chinese character "ji". The first force sensitive element 51 has two ends, one end of which is connected to the device body 10 and the other end is connected to the force loading probe 40. In some embodiments of the present application, the first force sensitive element 51, the device body 10, and the force loading probe 40 are configured as an integrally formed part.

[0042] As Figure 1 and Figure 4 shown, the second force sensitive element 52 is connected between the displacement transfer member 60 and the device body 10. Along the first direction (i.e., Figure 1 the Z direction shown), the second force sensitive element 52 has one end close to the displacement transfer member 60 and one end far from the displacement transfer member 60. The end of the second force sensitive element 52 close to the displacement transfer member 60 is connected to the displacement transfer member 60, and the end of the second force sensitive element 52 far from the displacement transfer member 60 is connected to the device body 10.

[0043] The force loading probe 40 can move relative to the device body 10 along the first direction (i.e., Figure 1 the Z direction shown). That is to say, the force loading probe 40 can move along the first direction (i.e., Figure 1The Z-direction shown can be moved toward the direction closer to the device body 10, or the force-loaded probe 40 can move along the first direction (i.e., Figure 1 The Z direction shown can be moved away from the device body 10.

[0044] The displacement transmitter 60 is configured such that the force-loaded probe 40 is along the first direction (i.e. Figure 1 After moving a preset distance in the Z direction (as shown), it moves together with the force-loading probe 40. That is, the force-loading probe 40 and the displacement transmitter 60 are spaced at a preset distance. Figure 3 and Figure 5 As shown, the preset distance is represented by h, and the force applied to the force-loaded probe 40 will be along the first direction (i.e., Figure 1 The force-loading probe 40 moves in the Z direction (as shown). When the displacement of the force-loading probe 40 is less than a preset distance, the displacement transmitter 60 will not contact the force-loading probe 40 and will not move together with the force-loading probe 40, so that the micro-force measuring device 100 remains in a small range. When the displacement of the force-loading probe 40 exceeds the preset distance, the force-loading probe 40 will contact the displacement transmitter 60, and the displacement transmitter 60 will move together with the force-loading probe 40, so that the micro-force measuring device 100 enters a large range.

[0045] Both the first force-sensitive element 51 and the second force-sensitive element 52 have elasticity. The first force-sensitive element 51 may, but is not limited to, be constructed as a spring-like structure, and the second force-sensitive element 52 may, but is not limited to, be constructed as a spring-like structure. The force-loading probe 40 is along the first direction (i.e., Figure 1 The movement of the Z-direction (as shown) relative to the device body 10 can cause elastic deformation of the first force-sensitive element 51 and / or the second force-sensitive element 52. Within the elastic range, the force and displacement of the first force-sensitive element 51 and the second force-sensitive element 52 satisfy Hooke's Law.

[0046] F = kx

[0047] In the above formula, k can be the elastic stiffness of the first force-sensitive element 51 or the second force-sensitive element 52, x is the displacement magnitude when the first force-sensitive element 51 or the second force-sensitive element 52 deforms, and F is the magnitude of the force. As some embodiments of this application, such as... Figure 6 As shown, the range of the micro-force measuring device 100 can be adjusted by adjusting the elastic stiffness and dimensional parameters of the first force-sensitive element 51 and / or the second force-sensitive element 52.

[0048] As some embodiments of this application, such as Figure 4 As shown, the dimensional parameter of the second force-sensitive element 52 is l, as follows: Figure 6 As shown, the elastic stiffness of the second force-sensitive element 52 can be changed by altering the dimensional parameter l of the second force-sensitive element 52, thereby adjusting the range of the micro-force measuring device 100.

[0049] As some embodiments of this application, the micro-force measuring device 100 further includes a capacitance measuring circuit. The first parallel plate capacitor 20 and the second parallel plate capacitor 30 are both connected to the capacitance measuring circuit via wires, so that the capacitance of the first parallel plate capacitor 20 and the second parallel plate capacitor 30 can be determined by the capacitance measuring circuit, thereby determining the displacement of the force-loaded probe 40. For example, as... Figure 1 and Figure 3 As shown, the force-loaded probe 40 is subjected to force within a preset distance along the first direction (i.e., Figure 1 As the Z-direction (as shown) moves, the capacitance of the first parallel plate capacitor 20 will change, and the displacement of the force-loaded probe 40 can be determined based on the change in capacitance.

[0050] As some embodiments of this application, such as Figure 5 As shown, the relationship between the capacitance of the first parallel plate capacitor 20 and the second parallel plate capacitor 30 and the displacement of the force-loaded probe 40 needs to be calibrated before measurement in order to plot a graph showing the relationship between the capacitance of the first parallel plate capacitor 20 and the second parallel plate capacitor 30 and the displacement of the force-loaded probe 40. Figure 5 It can be seen that the micro-force measuring device 100 has high measurement accuracy even with a large range, and this makes it easier to determine the correspondence between the capacitance of the first parallel plate capacitor 20 and the second parallel plate capacitor 30 and the displacement of the force-loaded probe 40.

[0051] As some embodiments of this application, when the micro-force measuring device 100 is used for measurement, the force loading probe 40 is subjected to force along the first direction (i.e., Figure 1 The force-loaded probe 40 moves along the first direction (i.e., the Z direction shown) and moves along the Z direction. Figure 1 The movement in the Z direction (as shown) can change the distance between the first electrode 21 and the second electrode 22. The change in the distance between the first electrode 21 and the second electrode 22 can change the capacitance of the first parallel plate capacitor 20. Thus, the moving distance of the force-loaded probe 40 can be obtained from the capacitance. If the moving distance of the force-loaded probe 40 is less than the preset distance, the magnitude of the force can be obtained from the elastic stiffness of the first force-sensitive element 51, so that the micro-force measuring device 100 can measure in a small range. If the moving distance of the force-loaded probe 40 is greater than the preset distance, the force-loaded probe 40 will contact the displacement transmission element 60, and the displacement transmission element 60 will move together with the force-loaded probe 40, so that the micro-force measuring device 100 enters a large range. Then, the magnitude of the force can be obtained from the elastic stiffness of the first force-sensitive element 51 and the second force-sensitive element 52, so that the micro-force measuring device 100 can measure in a large range.

[0052] As some embodiments of this application, the sensitivity of the micro-force measuring device 100 in the small range and the sensitivity in the large range can be obtained by the following formulas:

[0053]

[0054] Where S is the sensitivity, n is the number of capacitors in the small range (number of capacitors in the first parallel plate) or the number of capacitors in the large range (number of capacitors in the first parallel plate and number of capacitors in the second parallel plate), ε is the dielectric constant between the plates, A is the plate area, and d is the plate spacing. From this formula, it can be seen that the resolution of the micro-force measuring device 100 can be improved by reducing the plate spacing, or by reducing the number of capacitors. Furthermore, the range can be adjusted by adjusting the preset distance of the displacement transmission element 60.

[0055] It should be noted that the micro-force measuring device 100 can achieve high-precision and high-resolution micro-force measurement when the range is small (the force loading probe 40 moves a distance less than the preset distance), and when the range is large (the force loading probe 40 moves a distance greater than the preset distance), the micro-force measuring device 100 can perform large-range micro-force measurement that balances accuracy and resolution. Furthermore, no additional switching operation is required when switching between the small and large ranges, which helps to improve the reliability and convenience of the micro-force measuring device 100.

[0056] Therefore, by connecting the first force-sensitive element 51 between the device body 10 and the force loading probe 40, and the second force-sensitive element 52 between the displacement transmission element 60 and the device body 10, and by enabling the displacement transmission element 60 to move together with the force loading probe 40 after the force loading probe 40 has moved a preset distance in the first direction, the micro-force measuring device 100 can automatically switch to a large-range measurement through the displacement transmission element after the small-range measurement reaches its limit. This allows the micro-force measuring device 100 to balance high sensitivity, high resolution, and large range, which is beneficial to improving the accuracy and convenience of the micro-force measuring device 100.

[0057] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, there are multiple first electrode plates 21, second electrode plates 22, third electrode plates 31, and fourth electrode plates 32. Along the first direction, multiple first electrode plates 21 and multiple second electrode plates 22 are arranged alternately, and multiple third electrode plates 31 and multiple fourth electrode plates 32 are arranged alternately.

[0058] The number of first electrode plates 21 is multiple, and the number of first electrode plates 21 can be, but is not limited to, four or five, etc. As some embodiments of this application, the number of first electrode plates 21 is seventeen. The number of second electrode plates 22 is also multiple, and the number of second electrode plates 22 can be, but is not limited to, four or five, etc. As some embodiments of this application, the number of second electrode plates 22 is seventeen.

[0059] As some embodiments of this application, the number of first electrode plates 21 is seventeen, and the number of second electrode plates 22 is the same as the number of first electrode plates 21 and they are arranged in a one-to-one correspondence, along the first direction (i.e. Figure 1 (As shown in the Z direction), seventeen first electrode plates 21 and seventeen second electrode plates 22 are alternately arranged. In some embodiments of this application, the number of first electrode plates 21 is eighteen, and the number of second electrode plates 22 is seventeen, along the first direction (i.e., Figure 1 (As shown in the Z direction), eighteen first electrode plates 21 and seventeen second electrode plates 22 are arranged alternately.

[0060] The number of third electrode plates 31 is multiple, and the number of third electrode plates 31 can be, but is not limited to, four or five, etc. As some embodiments of this application, the number of third electrode plates 31 is seventeen. The number of fourth electrode plates 32 is multiple, and the number of fourth electrode plates 32 can be, but is not limited to, four or five, etc. As some embodiments of this application, the number of fourth electrode plates 32 is seventeen.

[0061] As some embodiments of this application, the number of third electrode plates 31 is seventeen, and the number of fourth electrode plates 32 is the same as that of the third electrode plates 31 and they are arranged in a one-to-one correspondence, along the first direction (i.e. Figure 1 (As shown in the Z direction), seventeen third electrode plates 31 and seventeen fourth electrode plates 32 are alternately arranged. In some embodiments of this application, the number of third electrode plates 31 is eighteen, and the number of fourth electrode plates 32 is seventeen, along the first direction (i.e., Figure 1 (As shown in the Z direction), eighteen third plates 31 and seventeen fourth plates 32 are arranged alternately.

[0062] As some embodiments of this application, the number of first electrode plates 21 is eighteen, and the number of second electrode plates 22 is seventeen. Any two adjacent first electrode plates 21 and one second electrode plate 22 between them can form a first-level plate group. The distance between the second electrode plate 22 and the two first electrode plates 21 is different; in other words, along the first direction (i.e.,...) Figure 1 (As shown in the Z direction), the second electrode 22 will shift toward one of the first-stage plates 21 in the first-stage plate group, and the shifting direction of the second electrode 22 of multiple first-stage plate groups is the same.

[0063] There are eighteen third plates 31 and seventeen fourth plates 32. Any two adjacent third plates 31 and one fourth plate 32 between them can form a second-level plate group. The distance between the fourth plate 32 and the two third plates 31 is different; in other words, along the first direction (i.e.,...) Figure 1(As shown in the Z direction), the fourth electrode 32 will shift towards one of the third-stage plates 31 in the second-stage plate group. The shifting direction of the fourth electrode 32 in multiple second-stage plate groups is the same, and along the first direction (i.e. Figure 1 (As shown in the Z direction), the offset directions of the second electrode 22 and the fourth electrode 32 are different.

[0064] As some embodiments of this application, the number of first electrode plates 21 is seventeen, and the number of second electrode plates 22 is eighteen. Any two adjacent second electrode plates 22 and one of the first electrode plates 21 between them can form a third-level plate group. The distance between the first electrode plate 21 and the two second electrode plates 22 is different; in other words, along the first direction (i.e.,...) Figure 1 (As shown in the Z direction), the first electrode 21 will shift toward one of the second-level plates 22 in the third-level plate group, and the first electrode 21 of multiple third-level plate groups will shift in the same direction.

[0065] There are seventeen third plates 31 and eighteen fourth plates 32. Any two adjacent fourth plates 32 and one third plate 31 between them can form a fourth-level plate group. The distance between the third plates 31 and the two fourth plates 32 is different; in other words, along the first direction (i.e.,...) Figure 1 (As shown in the Z direction), the third electrode 31 will shift toward one of the fourth electrode 32 in the fourth-stage plate group. The shifting direction of the third electrode 31 in multiple fourth-stage plate groups is the same, and along the first direction (i.e. Figure 1 (As shown in the Z direction), the offset direction of the third electrode 31 is different from that of the first electrode 21.

[0066] As some embodiments of this application, both the first parallel plate capacitor 20 and the second parallel plate capacitor 30 are constructed as comb-shaped structures.

[0067] This configuration increases the electrode area of ​​the first parallel plate capacitor 20 and the second parallel plate capacitor 30, which helps to improve the sensitivity and measurement accuracy of the micro-force measuring device 100.

[0068] In some embodiments of the present invention, such as Figure 2 As shown, the spacing between at least one pair of adjacent first electrode plates 21 and second electrode plates 22 is different from the spacing between another pair of adjacent first electrode plates 21 and second electrode plates 22.

[0069] In this embodiment, the spacing between at least one pair of adjacent first electrode plates 21 and second electrode plates 22 is different from the spacing between another pair of adjacent first electrode plates 21 and second electrode plates 22. That is, the spacing between one pair of adjacent first electrode plates 21 and second electrode plates 22 is different from the spacing between another pair of adjacent first electrode plates 21 and second electrode plates 22. Alternatively, the spacing between multiple pairs of adjacent first electrode plates 21 and second electrode plates 22 is different from the spacing between multiple pairs of adjacent first electrode plates 21 and second electrode plates 22. As some embodiments of this application, the spacing between multiple pairs of adjacent first electrode plates 21 and second electrode plates 22 is different from the spacing between multiple pairs of adjacent first electrode plates 21 and second electrode plates 22.

[0070] This configuration enables the first parallel plate capacitor 20 to form a differential circuit, which improves the linearity of the capacitance of the first plate 21 and the second plate 22 and the distance between the first plate 21 and the second plate 22. This facilitates the correspondence between the displacement of the force-loaded probe 40 and the capacitance of the first plate 21 and the second plate 22, thereby improving the accuracy of the measurement.

[0071] In some embodiments of the present invention, such as Figure 2 As shown, the spacing between at least one pair of adjacent third plates 31 and fourth plates 32 is different from the spacing between another pair of adjacent third plates 31 and fourth plates 32.

[0072] In this embodiment, the spacing between at least one pair of adjacent third electrode plates 31 and fourth electrode plates 32 is different from the spacing between another pair of adjacent third electrode plates 31 and fourth electrode plates 32. That is, the spacing between one pair of adjacent third electrode plates 31 and fourth electrode plates 32 is different from the spacing between another pair of adjacent third electrode plates 31 and fourth electrode plates 32. Alternatively, the spacing between multiple pairs of adjacent third electrode plates 31 and fourth electrode plates 32 is different from the spacing between multiple pairs of adjacent third electrode plates 31 and fourth electrode plates 32. As some embodiments of this application, the spacing between multiple pairs of adjacent third electrode plates 31 and fourth electrode plates 32 is different from the spacing between multiple pairs of adjacent third electrode plates 31 and fourth electrode plates 32.

[0073] This configuration enables the second parallel plate capacitor 30 to form a differential circuit, which improves the linearity of the capacitance of the third plate 31 and the fourth plate 32 and the distance between the third plate 31 and the fourth plate 32. This facilitates the correspondence between the displacement of the force-loaded probe 40 and the capacitance of the third plate 31 and the fourth plate 32, thereby improving the accuracy of the measurement.

[0074] In some embodiments of the present invention, such as Figure 1 and Figure 3 As shown, the force-loading probe 40 has a first mating part 41, and the displacement transmission member 60 has a second mating part 61. The force-loading probe 40 is along a first direction (i.e., Figure 1After moving a preset distance in the Z direction (as shown), the first mating part 41 can engage with the second mating part 61 so that the displacement transmission member 60 moves together with the force applied to the probe 40.

[0075] As some embodiments of this application, the force-loading probe 40 is along a first direction (i.e. Figure 1 After moving a preset distance in the Z direction (as shown), towards the side closer to the device body 10, the first mating part 41 can abut against the second mating part 61, and the first mating part 41 can push the second mating part 61 so that the displacement transmission member 60 moves together with the force-loaded probe 40 towards the side closer to the device body 10.

[0076] As some embodiments of this application, the force-loading probe 40 is along a first direction (i.e. Figure 1 After moving a preset distance away from the device body 10 in the Z direction (as shown), the first mating part 41 can abut against the second mating part 61, and the first mating part 41 can pull the second mating part 61 so that the displacement transmission member 60 and the probe 40 move together in the same direction away from the device body 10.

[0077] This design allows the force-loading probe 40 and the displacement transmitter 60 to be designed reasonably, enabling the micro-force measuring device 100 to automatically switch from a small range to a large range when under force (after the force-loading probe 40 moves beyond a preset distance) without the need for other operations, which helps to improve the ease of use of the micro-force measuring device 100.

[0078] In some embodiments of the present invention, such as Figure 1 As shown, the first mating part 41 includes: a first sub-part 411 and a second sub-part 412, the second sub-part 412 being connected to the first sub-part 411 along a first direction (i.e. Figure 1 (in the Z direction shown), at least a portion of the first sub-part 411 is located on one side of the second mating part 61 and corresponds to the second mating part 61, and at least a portion of the second sub-part 412 is located on the other side of the second mating part 61 and corresponds to the second mating part 61.

[0079] The second sub-part 412 is connected to the first sub-part 411. The connection between the second sub-part 412 and the first sub-part 411 can be, but is not limited to, welding, bolt connection, etc. As some embodiments of this application, the second sub-part 412 and the first sub-part 411 are integrally formed.

[0080] Along the first direction (i.e.) Figure 1(in the Z direction shown), at least a portion of the first sub-part 411 is located on one side of the second mating part 61 and corresponds to the second mating part 61. That is, a portion of the first sub-part 411 is located on one side of the second mating part 61 and corresponds to the second mating part 61, or all of the first sub-part 411 is located on one side of the second mating part 61 and corresponds to the second mating part 61.

[0081] The second mating part 61 has a side close to the force-loading probe 40 and a side away from the force-loading probe 40. As in some embodiments of this application, along the first direction (i.e. Figure 1 (As shown in the Z direction), a portion of the first sub-part 411 is located on the side of the second mating part 61 near the force-loading probe 40 and corresponds to the second mating part 61.

[0082] As some embodiments of this application, along the first direction (i.e. Figure 1 (As shown in the Z direction), the entire first sub-part 411 is located on the side of the second mating part 61 close to the force-loading probe 40 and corresponds to the second mating part 61.

[0083] At least a portion of the second sub-part 412 is located on the other side of the second mating part 61 and corresponds to the second mating part 61. That is, a portion of the second sub-part 412 is located on the other side of the second mating part 61 and corresponds to the second mating part 61, or all of the second sub-part 412 is located on the other side of the second mating part 61 and corresponds to the second mating part 61.

[0084] As some embodiments of this application, along the first direction (i.e. Figure 1 (As shown in the Z direction), the portion of the second sub-part 412 is located on the side of the second mating part 61 away from the force-loaded probe 40 and corresponds to the second mating part 61.

[0085] As some embodiments of this application, along the first direction (i.e. Figure 1 (as shown in the Z direction), the entire second sub-part 412 is located on the side of the second mating part 61 away from the force-loaded probe 40 and corresponds to the second mating part 61.

[0086] This configuration allows for a reasonable structural design of the first mating part 41, enabling the micro-force measuring device 100 to automatically switch from a small range to a large range during the force application process (after the force loading probe 40 moves beyond a preset distance) without requiring any other operations, thus improving the ease of use of the micro-force measuring device 100.

[0087] In some embodiments of the present invention, the micro-force measuring device 100 is made of an amorphous alloy. That is, the device body 10, the first parallel plate capacitor 20, the second parallel plate capacitor 30, the force loading probe 40, the first force-sensitive element 51, the second force-sensitive element 52, and the displacement transmission element 60 are all constructed of an amorphous alloy. The amorphous alloy can be, but is not limited to, iron-based amorphous alloys, cobalt-based amorphous alloys, etc. In some embodiments of this application, the amorphous alloy is a cobalt-based amorphous alloy. In some embodiments of this application, the micro-force measuring device 100 is constructed as a single-piece molded component.

[0088] Amorphous alloys have the characteristics of high hardness, high strength and high elasticity. This configuration can increase the range of the micro-force measuring device 100, which is beneficial to increasing the service life of the micro-force measuring device 100. In addition, this configuration can reduce the production difficulty of the micro-force measuring device 100 and improve the production efficiency of the micro-force measuring device 100.

[0089] In some embodiments of the present invention, such as Figure 1 As shown, the first parallel plate capacitor 20 and the second parallel plate capacitor 30 are along the first direction (i.e., Figure 1 (As shown in the Z direction) interval, the first force-sensitive element 51 is located at the end of the first parallel plate capacitor 20 away from the second parallel plate capacitor 30, and the second force-sensitive element 52 is located at the end of the second parallel plate capacitor 30 away from the first parallel plate capacitor 20.

[0090] Among them, the first parallel plate capacitor 20 and the second parallel plate capacitor 30 are along the first direction (i.e. Figure 1 The intervals are set along the Z direction (as shown), specifically, along the first direction (i.e. Figure 1 (As shown in the Z direction), the distance between the first parallel plate capacitor 20 and the force-loaded probe 40 is less than the distance between the second parallel plate capacitor 30 and the force-loaded probe 40.

[0091] The first parallel plate capacitor 20 has one end close to the second parallel plate capacitor 30 and one end away from the second parallel plate capacitor 30, and the first force-sensitive element 51 is located at the end of the first parallel plate capacitor 20 away from the second parallel plate capacitor 30.

[0092] The second parallel plate capacitor 30 has one end close to the first parallel plate capacitor 20 and one end away from the first parallel plate capacitor 20, and the second force-sensitive element 52 is located at the end of the second parallel plate capacitor 30 away from the first parallel plate capacitor 20.

[0093] This arrangement allows the first force-sensitive element 51 to correspond to the first parallel plate capacitor 20, and the second force-sensitive element 52 to correspond to the second parallel plate capacitor 30. The structure is reasonable and helps to improve the accuracy and convenience of the micro-force measuring device 100, and can also reduce the manufacturing difficulty of the micro-force measuring device 100.

[0094] In some embodiments of the present invention, such as Figure 1 As shown, the micro-force measuring device 100 further includes a third force-sensitive element 53, which is connected between the device body 10 and the force loading probe 40, and along the first direction (i.e. Figure 1 (as shown in the Z direction), the third force-sensitive element 53 is located between the first force-sensitive element 51 and the second force-sensitive element 52.

[0095] The third force-sensitive element 53 is connected between the device body 10 and the force-loading probe 40. As some embodiments of this application, it is positioned along the first direction (i.e., Figure 1 (As shown in the Z direction), the third force-sensitive element 53 has two opposite ends, one end of which is connected to the force loading probe 40, and the other end is connected to the device body 10.

[0096] And, along the first direction (i.e. Figure 1 The third force-sensitive element 53 is located between the first force-sensitive element 51 and the second force-sensitive element 52 (shown in the Z direction). The third force-sensitive element 53 has elasticity and can be, but is not limited to, constructed as a spring-like structure. The force-loading probe 40 is along the first direction (i.e., Figure 1 The movement of the Z-direction (as shown) relative to the device body 10 can cause elastic deformation of the first force-sensitive element 51 and the third force-sensitive element 53. Within the elastic range, the force and displacement of the third force-sensitive element 53 satisfy Hooke's Law as described above.

[0097] By including a third force-sensitive element 53 in the micro-force measuring device 100, the displacement of the force-loaded probe 40 can be smoothly and easily switched to a large range when it approaches the limit of the small range. Furthermore, this arrangement can reduce the risk of overloading the micro-force measuring device 100 at small ranges, which is beneficial to improving the reliability of the micro-force measuring device 100.

[0098] In some embodiments of the present invention, such as Figure 1As shown, the device body 10 includes: a first sub-body 11, a second sub-body 12, and a third sub-body 13. The second sub-body 12 and the third sub-body 13 are both disposed inside the first sub-body 11. A first force-sensitive element 51 is connected between the first sub-body 11 and the force loading probe 40. A second force-sensitive element 52 is connected between the displacement transmission element 60 and the third sub-body 13. A third force-sensitive element 53 is connected between the third sub-body 13 and the force loading probe 40. A first electrode plate 21 and a third electrode plate 31 are both connected to the second sub-body 12.

[0099] As some embodiments of this application, the first sub-body 11, the second sub-body 12, and the third sub-body 13 are integrally formed. The second sub-body 12 and the third sub-body 13 are both disposed inside the first sub-body 11. As some embodiments of this application, the first sub-body 11 can define an accommodating space, and the second sub-body 12 and the third sub-body 13 are both disposed in the accommodating space inside the first sub-body 11.

[0100] like Figure 1 As shown, the first force-sensitive element 51 is connected between the first sub-body 11 and the force loading probe 40, the second force-sensitive element 52 is connected between the displacement transmission element 60 and the third sub-body 13, the third force-sensitive element 53 is connected between the third sub-body 13 and the force loading probe 40, and the first electrode plate 21 and the third electrode plate 31 are both located on the second sub-body 12.

[0101] This configuration allows for a reasonable design of the device body 10, reduces the manufacturing difficulty of the device body 10, and ensures that when the force-loading probe 40 moves less than a preset distance, only the first force-sensitive element 51 and the third force-sensitive element 53 deform. When the force-loading probe 40 moves more than a preset distance, the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53 all deform, thereby achieving the conversion from a small range to a large range, which is beneficial to improving the reliability of the micro-force measuring device 100.

[0102] In some embodiments of the present invention, such as Figure 1 As shown, the first parallel plate capacitor 20, the second parallel plate capacitor 30, the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53 are all in pairs and are all along the second direction (i.e., Figure 1 The X-direction (as shown) is spaced at intervals, and the second direction (i.e.) Figure 1 The X direction shown) and the first direction (i.e. Figure 1 The Z direction shown is perpendicular to the direction indicated.

[0103] The first parallel plate capacitor 20, the second parallel plate capacitor 30, the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53 are all in pairs. Furthermore, the two first parallel plate capacitors 20 are positioned along the second direction (i.e.,...). Figure 1 The two second parallel plate capacitors 30 are spaced apart in the X direction (as shown), and are arranged along the second direction (i.e., Figure 1 The two first force-sensitive elements 51 are spaced apart in the X direction (as shown) and along the second direction (i.e., Figure 1 The two second force-sensitive elements 52 are spaced apart in the X direction (as shown), and are arranged along the second direction (i.e., Figure 1 The two third force-sensitive elements 53 are spaced apart in the X direction (as shown) and along the second direction (i.e., Figure 1 The X-direction (as shown) is spaced out. The second direction (i.e.) Figure 1 The X direction shown) and the first direction (i.e. Figure 1 The Z-direction shown is perpendicular to each other.

[0104] This configuration can significantly improve the range and resolution of the micro-force measuring device 100, which is beneficial to improving the measurement accuracy of the micro-force measuring device 100.

[0105] In some embodiments of the present invention, the force-loaded probe 40, the first sub-body 11, and the third sub-body 13 are connected to the ground terminal, and the second sub-body 12 is connected to the voltage terminal.

[0106] The grounding terminal can be constructed as, but is not limited to, a substrate. The substrate can be made of, but is not limited to, silicon wafers, ceramic wafers, or glass wafers. As some embodiments of this application, the grounding terminal is constructed as a substrate, and the substrate is made of silicon wafers.

[0107] The force-loading probe 40, the first sub-body 11, and the third sub-body 13 are connected to the grounding terminal. As some embodiments of this application, the force-loading probe 40, the first sub-body 11, and the third sub-body 13 are connected to the grounding terminal via wires.

[0108] The second sub-body 12 is connected to a voltage terminal to energize the first electrode plate 21 and the third electrode plate 31 disposed on the second sub-body 12. The voltage terminal connected to the second sub-body 12 can be a positive or negative terminal. As some embodiments of this application, the second sub-body 12 is connected to the positive terminal of the voltage terminal to energize the first electrode plate 21 and the third electrode plate 31. As some embodiments of this application, the second sub-body 12 is connected to the negative terminal of the voltage terminal to energize the first electrode plate 21 and the third electrode plate 31.

[0109] This configuration can improve the measurement safety of the micro-force measuring device 100, reduce the risk of leakage or short circuit in the micro-force measuring device 100, reduce the risk of inaccurate measurement due to leakage, and help improve the stability and measurement accuracy of the micro-force measuring device 100.

[0110] As some embodiments of this application, when micro-force measurement is required, a micro-force measuring device 100 with a suitable range is first selected (e.g., ...). Figure 6As shown, the elastic stiffness of the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53 are different, and the measuring range of the micro-force measuring device 100 is different.

[0111] Next, the micro-force measuring device 100 is connected to the capacitance measuring circuit, and the probe 40 is loaded with the force to be measured. The capacitance of the micro-force measuring device 100 is detected when the force-loaded probe 40 moves under the force. Specifically, the force on the force-loaded probe 40 will be along the first direction (i.e., Figure 1 The force-loaded probe 40 moves along the first direction (i.e., the Z direction shown) and moves along the Z direction. Figure 1 Moving the plate in the Z direction (as shown) can change the distance between the first plate 21 and the second plate 22, and the change in the distance between the first plate 21 and the second plate 22 can change the capacitance of the first parallel plate capacitor 20.

[0112] Next, the displacement of the force-loaded probe 40 under the action of the measured force is determined based on the capacitance obtained from the test.

[0113] Finally, the magnitude of the force on the force-loading probe 40 is determined based on the elastic stiffness of the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53, and the displacement of the force-loading probe 40 under force. It should be noted that if the moving distance of the force-loading probe 40 is less than the preset distance, the magnitude of the force to be measured can be obtained based on the elastic stiffness of the first force-sensitive element 51 and the third force-sensitive element 53, so that the micro-force measuring device 100 can measure in a small range. If the moving distance of the force-loading probe 40 is greater than the preset distance, the force-loading probe 40 will contact the displacement transmission element 60, and the displacement transmission element 60 will move together with the force-loading probe 40, so that the micro-force measuring device 100 enters a large range. Then, the magnitude of the force can be obtained based on the elastic stiffness of the first force-sensitive element 51, the second force-sensitive element 52, and the third force-sensitive element 53, so that the micro-force measuring device 100 can measure in a large range.

[0114] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0115] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0116] In the description of this invention, "a plurality of" means two or more.

[0117] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0118] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0119] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0120] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A micro-force measuring device, characterized in that, include: device body; A first parallel plate capacitor and a second parallel plate capacitor, wherein the first parallel plate capacitor includes a first electrode plate and a second electrode plate, and the second parallel plate capacitor includes a third electrode plate and a fourth electrode plate, and the first electrode plate and the third electrode plate are connected to the device body. The device comprises a force-loading probe, a first force-sensitive element, a second force-sensitive element, and a displacement transmitter. A second electrode plate is connected to the force-loading probe, and a fourth electrode plate is connected to the displacement transmitter. The first force-sensitive element is connected between the device body and the force-loading probe, and the second force-sensitive element is connected between the displacement transmitter and the device body. The force-loading probe is movable relative to the device body along a first direction. The displacement transmitter is configured such that the force-loading probe moves a preset distance along the first direction and then moves together with the force-loading probe.

2. The micro-force measuring device according to claim 1, characterized in that, There are multiple first electrode plates, multiple second electrode plates, multiple third electrode plates, and multiple fourth electrode plates arranged alternately along the first direction.

3. The micro-force measuring device according to claim 2, characterized in that, The spacing between at least one pair of adjacent first electrode plates and second electrode plates is different from the spacing between another pair of adjacent first electrode plates and second electrode plates; And / or, the spacing between at least one pair of adjacent third plates and fourth plates is different from the spacing between another pair of adjacent third plates and fourth plates.

4. The micro-force measuring device according to claim 1, characterized in that, The force-loading probe has a first mating part, and the displacement transmitter has a second mating part. After the force-loading probe moves a preset distance along the first direction, the first mating part can engage with the second mating part so that the displacement transmitter moves together with the force-loading probe.

5. The micro-force measuring device according to claim 4, characterized in that, The first mating part includes: a first sub-part and a second sub-part, the second sub-part being connected to the first sub-part, and along the first direction, at least a portion of the first sub-part being located on one side of the second mating part and corresponding to the second mating part, and at least a portion of the second sub-part being located on the other side of the second mating part and corresponding to the second mating part.

6. The micro-force measuring device according to claim 1, characterized in that, The micro-force measuring device is made of amorphous alloy.

7. The micro-force measuring device according to claim 1, characterized in that, The first parallel plate capacitor and the second parallel plate capacitor are spaced apart along the first direction. The first force-sensitive element is located at the end of the first parallel plate capacitor away from the second parallel plate capacitor, and the second force-sensitive element is located at the end of the second parallel plate capacitor away from the first parallel plate capacitor.

8. The micro-force measuring device according to claim 7, characterized in that, Also includes: A third force-sensitive element is connected between the device body and the force-loading probe, and along the first direction, the third force-sensitive element is located between the first force-sensitive element and the second force-sensitive element.

9. The micro-force measuring device according to claim 8, characterized in that, The device body includes: a first sub-body, a second sub-body, and a third sub-body. The second sub-body and the third sub-body are both disposed inside the first sub-body. The first force-sensitive element is connected between the first sub-body and the force loading probe. The second force-sensitive element is connected between the displacement transmitter and the third sub-body. The third force-sensitive element is connected between the third sub-body and the force loading probe. The first electrode plate and the third electrode plate are both connected to the second sub-body.

10. The micro-force measuring device according to claim 9, characterized in that, The first parallel plate capacitor, the second parallel plate capacitor, the first force-sensitive element, the second force-sensitive element, and the third force-sensitive element are all in pairs and are all spaced apart along the second direction, which is perpendicular to the first direction; And / or, the force-loaded probe, the first sub-body, and the third sub-body are connected to the ground terminal, and the second sub-body is connected to the voltage terminal.

Images