CSP with primary optical lens and processing method thereof

Abstract

The invention relates to the technical field of LED chips, and provides a CSP with a primary optical lens and a processing method thereof, the CSP with the primary optical lens comprises a packaging chip, the packaging chip comprises a substrate and a light-emitting chip arranged on the upper surface of the substrate, and the bottom of the substrate is provided with pins electrically connected with the light-emitting chip; the optical lens comprises a connecting part and a curved surface part which are integrally formed, the connecting part is integrally connected with the substrate, and the curved surface part covers the light-emitting side face and the light-emitting front face of the light-emitting chip. By integrating the CSP and the optical lens, the number of independent elements is reduced, so that the overall design is simplified, the step of independently installing the optical lens traditionally is eliminated, and the assembly complexity and the time cost in the production process are reduced.

Description

Technical Field

[0001] The present application relates to the technical field of LED chips, and more specifically, to a CSP with a primary optical lens and a processing method thereof. Background Art

[0002] In the field of mini-LED (Miniature Light-Emitting Diode), when CSP (Chip Scale Package) is installed on PCB (Printed Circuit Board), in order to expand the light output angle, it is necessary to separately dispense glue on the CSP to form an optical lens, or to attach a secondary lens to the CSP.

[0003] However, currently CSP and optical lenses are separate components. When installing CSP, glue needs to be dispensed on each CSP individually to form an optical lens. This is a cumbersome process, inconvenient to operate, and reduces production efficiency.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The purpose of this application is to propose a CSP with a primary optical lens and a processing method thereof, so as to solve the technical problem in the prior art that the CSP needs to be separately glued to form an optical lens, resulting in cumbersome steps and reduced production efficiency.

[0006] To achieve the above objectives, in a first aspect of the present application, a CSP with a primary optical lens is provided, comprising:

[0007] A packaged chip, comprising a substrate and a light-emitting chip disposed on an upper surface of the substrate, wherein a pin electrically connected to the light-emitting chip is disposed at the bottom of the substrate;

[0008] The optical lens comprises an integrally formed connecting portion and a curved portion, wherein the connecting portion is integrally connected to the substrate, and the curved portion covers the light-emitting side surface and the light-emitting front surface of the light-emitting chip.

[0009] Furthermore, the shape of the curved surface portion includes a spherical surface and an ellipsoidal surface, and the optical axis of the curved surface portion coincides with the central axis of the light-emitting chip.

[0010] Furthermore, a concave portion recessed toward the light emitting chip is provided at the center of the curved surface portion, and an optical axis of the concave portion coincides with a central axis of the light emitting chip.

[0011] In some embodiments, the optical lens is integrally formed on the substrate through an injection molding or molding process, the connecting portion is integrally connected to the substrate through thermosetting, and the packaged chip is embedded between the optical lens and the substrate.

[0012] Furthermore, the substrate includes a carrier and a base layer arranged on the top of the carrier, the packaged chip is arranged on the top of the base layer, the connecting portion of the optical lens is integrally connected to the carrier, the curved portion covers the base layer and the packaged chip, and the bottom of the carrier is provided with a conductive layer electrically connected to the pin.

[0013] In some embodiments, the pins include a positive terminal and a negative terminal.

[0014] Furthermore, the light emitting chip includes any one of a blue chip, a green chip or a red chip or a combination thereof, and at least a light emitting front surface of the light emitting chip is provided with a light conversion layer.

[0015] In some embodiments, the light-emitting chip is a blue light chip, the light conversion layer includes any one of a red light conversion layer and a green light conversion layer or a combination thereof, the red light conversion layer is provided with red light conversion particles, and the green light conversion layer is provided with green light conversion particles.

[0016] In a second aspect of the present application, a method for processing a CSP is provided. The CSP is the CSP with a primary optical lens as described in the above embodiment. The processing method comprises the following steps:

[0017] Providing a mold that matches the shape of the optical lens, the mold comprising a first wall surface and a second wall surface, the first wall surface matching the shape of the substrate, the second wall surface matching the shape of the optical lens, and uniformly coating the second wall surface of the mold with a release agent;

[0018] Place the packaged chip into a mold, fix the substrate to the first wall, cover the packaged chip with the second wall, and make the second wall coaxial with the packaged chip, leaving a molding space between the second wall and the packaged chip;

[0019] Injecting silicone or liquid resin into the mold, heating the silicone or liquid resin to melt it, and applying pressure to ensure that the silicone or liquid resin fully fills the molding space;

[0020] Allow the silicone or liquid resin in the mold to gradually cool and solidify into a shape, forming an optical lens on the substrate;

[0021] The finished CSP is taken out from the mold and cut and trimmed.

[0022] In some embodiments, removing the finished CSP from the mold and cutting and trimming the finished CSP specifically include the following steps:

[0023] On one side of the finished CSP where the optical lens is formed, a groove is prefabricated on the substrate along the circumference of the connecting portion;

[0024] cutting the substrate along the grooves using a laser beam;

[0025] Remove residue from the cutting process.

[0026] The CSP with a primary optical lens and the processing method thereof provided in the present application have at least the following beneficial effects: by integrating the CSP and the optical lens, the number of independent components is reduced, thereby simplifying the overall design, eliminating the step of traditionally requiring the separate installation of the optical lens, reducing the assembly complexity and time cost during the production process, and ensuring high-precision alignment between the light-emitting chip and the optical lens during the manufacturing process, avoiding deviations that may be caused by later assembly, and improving the consistency and efficiency of light output.

[0027] The integrated design provides more stable physical support, reducing the risk of damage caused by external shock or vibration. The integrated structure is usually more compact than the traditional discrete design, saving valuable PCB board space. In some cases, it can also reduce the need for additional brackets or fixings, helping to reduce the weight of the entire backlight panel.

[0028] At the same time, for large-scale production, the integrated structure can improve production efficiency and reduce unit costs through automated processes. Since the assembly steps and potential human errors are reduced, the possibility of product rework is reduced, which indirectly saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 A schematic structural diagram of a CSP with a primary optical lens provided in an embodiment of the present application;

[0031] Figure 2 Another structural schematic diagram of a CSP with a primary optical lens provided in an embodiment of the present application;

[0032] Figure 3 A flowchart of a CSP processing method provided in an embodiment of the present application;

[0033] Figure 4 for Figure 3 Flow chart of step S5 in FIG.

[0034] Among them, the reference numerals in the figures are:

[0035] 1. Package chip;

[0036] 11. Substrate; 111. Carrier board; 112. Base layer; 113. Conductive layer; 114. Pin; 115. Positive electrode connector; 116. Negative electrode connector;

[0037] 12. Light-emitting chip; 121. Light conversion layer; 122. Red light conversion layer; 123. Red light conversion particles; 124. Green light conversion layer; 125. Green light conversion particles;

[0038] 2. Optical lens; 21. Connecting portion; 22. Curved portion; 23. Concave portion. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0040] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be located directly or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and cannot be understood as limitations on this technical solution. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0041] The following describes a CSP with a primary optical lens and a processing method thereof according to an embodiment of the present application in conjunction with the accompanying drawings.

[0042] In the first aspect of the present application, a CSP with a primary optical lens is provided. Figure 1 , Figure 1 A schematic structural diagram of a CSP with a primary optical lens of the present application is shown, wherein the CSP is used to be mounted on a PCB board, and the CSP includes a package chip 1 and an optical lens 2 integrally provided with the package chip 1 .

[0043] Continue reading Figure 1 The packaged chip 1 includes a substrate 11 and a light-emitting chip 12 arranged on the upper surface of the substrate 11. The bottom of the substrate 11 is provided with a pin 114 electrically connected to the light-emitting chip 12. The pin 114 is used to connect to the light-emitting circuit on the PCB board, and the light-emitting circuit controls the light-emitting chip 12.

[0044] Further, see Figure 2 The optical lens 2 includes an integrally formed connecting portion 21 and a curved portion 22. It should be noted that the optical lens 2 is an integral structure. The connecting portion 21 and the curved portion 22 are names for different areas of the optical lens 2, and do not mean that the optical lens 2 is composed of two parts. Furthermore, the connecting portion 21 is integrally connected to the substrate 11, and the curved portion 22 covers the light-emitting side and light-emitting front of the light-emitting chip 12.

[0045] Among them, in the mini-LED lighting system, the optical lens 2 plays a vital role. The main function of the optical lens 2 is to control and optimize the distribution pattern of light emitted by the LED. For example, the optical lens 2 can change the original wide-angle light output of the light-emitting chip 12 and convert it into a more concentrated light beam, such as a spotlight effect or a floodlight effect. The optical lens 2 can also reduce unnecessary light scattering, so that more light energy can be directed to the target area, thereby improving the overall lighting efficiency. This not only helps to save energy, but also enhances the brightness of the target area, and can help to uniformize the light intensity distribution, providing a smoother and more consistent lighting effect, which is especially important for display applications. The optical lens 2 can also protect the internal mini-LED from environmental factors such as dust, moisture and physical shock, and can extend the service life of the product to a certain extent.

[0046] However, in traditional technology, when constructing mini-LED, the CSP is first installed on the PCB board. Usually, multiple CSPs are set on a PCB board to form the backlight panel of the display. Then, the optical lens 2 is set on the PCB board and covers the CSP by dispensing or pasting.

[0047] It can be found that the installation process involves two steps: one is to install the CSP on the PCB board, and the other is to apply glue on each CSP to form the optical lens 2, or to attach a prefabricated optical lens 2 to each CSP. The fundamental reason for the formation of these two steps is that the CSP and the optical lens 2 are two independent components, so they need to be installed in steps. This also leads to the problem of cumbersome installation steps and reduced installation efficiency. In addition, during the installation of the optical lens 2, since each CSP needs to be installed with the optical lens 2 separately, if the optical lens 2 on one of the multiple CSPs is not installed correctly, the entire backlight panel will not meet the display requirements.

[0048] To solve the above technical problems, the packaged chip 1 and the optical lens 2 in the CSP of the present invention are an integrated structure, and the optical lens 2 is integrally formed on the substrate 11 of the packaged chip 1. From the appearance, the CSP of the present invention has the packaged chip 1 embedded between the optical lens 2 and the substrate 11. That is, when installing the CSP on the PCB board, it is only necessary to install the substrate 11 in the CSP on the PCB board so that the pins 114 on the substrate 11 are connected to the light-emitting circuit on the PCB board. The installed CSP directly has the optical lens 2, and there is no need to perform the steps of dispensing glue or pasting a secondary lens, thereby achieving the effect of simplifying the installation steps and improving the installation efficiency. In addition, since the dispensing step is reduced, installation errors are less likely to occur during the installation of the CSP on the PCB board, and the yield of the backlight panel formed after installation is improved.

[0049] The beneficial effects of the present invention are as follows: by integrating the CSP and the optical lens 2, the number of independent components is reduced, thereby simplifying the overall design, eliminating the step of separately installing the optical lens 2 traditionally required, reducing the assembly complexity and time cost in the production process, and ensuring high-precision alignment between the light-emitting chip 12 and the optical lens 2 during the manufacturing process, avoiding deviations that may be caused by later assembly, and improving the consistency and efficiency of light output.

[0050] The integrated design provides more stable physical support, reducing the risk of damage caused by external shock or vibration. The integrated structure is usually more compact than the traditional discrete design, saving valuable PCB board space. In some cases, it can also reduce the need for additional brackets or fixings, helping to reduce the weight of the entire backlight panel.

[0051] At the same time, for large-scale production, the integrated structure can improve production efficiency and reduce unit costs through automated processes. Since the assembly steps and potential human errors are reduced, the possibility of product rework is reduced, which indirectly saves costs.

[0052] It should be noted that, in this embodiment, the packaged chip 1 includes a substrate 11 and a light-emitting chip 12 arranged on the upper surface of the substrate 11. The substrate 11 provides physical support for the light-emitting chip 12 and can also optimize electrical connection, thermal management and light output efficiency.

[0053] Exemplarily, the substrate 11 includes a ceramic (such as aluminum oxide or aluminum nitride) substrate 11 , a metal (such as copper or aluminum) substrate 11 , or a composite material (such as FR-4) substrate 11 .

[0054] The light emitting chip 12 is fixed on the substrate 11 by solder, silver glue or other adhesives. Of course, the light emitting chip 12 can also be directly attached to the substrate 11 with the electrode surface facing downward, reducing the need for wire bonding.

[0055] The optical lens 2 is a transparent packaging structure and can be made of silicone or epoxy resin injection molding, which can prevent physical damage, improve optical performance, and control the light beam angle.

[0056] In some embodiments, see Figure 1-Figure 2 The appearance of the curved portion 22 includes a spherical surface and an ellipsoidal surface. The curved portion 22 is set as a spherical lens to effectively expand the beam angle. When higher-precision light control, special light distribution patterns or higher-performance applications are required, such as high-end automotive lighting, professional-grade stage lighting equipment, etc., an ellipsoidal lens can be used. The ellipsoidal lens can provide more professional beam control and higher light efficiency utilization.

[0057] Furthermore, the optical axis of the curved portion 22 coincides with the central axis of the light-emitting chip 12, ensuring that the optical axes of the optical lens 2 and the light-emitting chip 12 coincide, ensuring efficient and precise light output. This alignment of the optical axis of the curved portion 22 with the central axis of the light-emitting chip 12 means that the center of the light emitted by the light-emitting chip 12 is perfectly aligned with the optical center of the optical lens 2, thereby maximizing light collection efficiency and optimizing the beam shape.

[0058] Further, see Figure 1 and Figure 2 A concave portion 23 is provided at the center of the curved portion 22 , which is recessed toward the light emitting chip 12 . The optical axis of the concave portion 23 coincides with the central axis of the light emitting chip 12 .

[0059] Providing an inner concave portion 23 (also referred to as a concave or non-planar design) on the curved portion 22 of a spherical or ellipsoidal surface can bring optical and mechanical benefits, and is particularly suitable for specific application scenarios.

[0060] Due to its geometric shape, traditional spherical lenses can produce spherical aberration when peripheral light passes through, resulting in image distortion or uneven light spots. The inner concave portion 23 can help realign the light path, reducing this effect and thus improving imaging quality.

[0061] The inner concave portion 23 can be designed with different curvatures according to specific needs, so that the optical lens 2 can better control the divergence or convergence characteristics of the light. For example, in some cases, it can distribute the light beam more evenly to a larger area, or concentrate it to a smaller target point.

[0062] For light sources such as LEDs, the inner recess 23 can serve as a reflective cavity to increase the capture range of emitted light, reduce unnecessary light loss, and thus improve the overall lighting effect.

[0063] In some embodiments, the optical lens 2 is integrally formed on the substrate 11 through an injection molding or molding process, and the connecting portion 21 is integrally connected to the substrate 11 through a thermal setting method.

[0064] In some embodiments, see Figure 2 The substrate 11 includes a carrier 111 and a base layer 112 arranged on the top of the carrier 111. The packaged chip 1 is arranged on the top of the base layer 112. The connecting portion 21 of the optical lens 2 is integrally connected to the carrier 111. The curved portion 22 covers the base layer 112 and the packaged chip 1. The bottom of the carrier 111 is provided with a conductive layer 113 electrically connected to the pin 114.

[0065] Placing a carrier plate 111 beneath the CSP substrate 11 supports the optical lens 2, making it suitable for applications requiring high-precision light control and stability. In some scenarios, a larger optical lens 2 is required. However, in the mini-LED field, the CSP is relatively small. If the CSP substrate 11 is used directly to support a large optical lens 2, the small substrate 11 will find it difficult to stably support the large optical lens 2.

[0066] After the carrier 111 is set under the substrate 11, the substrate 11 is divided into two layers: a small-sized base layer 112 and a large-sized carrier 111. Pins 114 are set at the bottom of the base layer 112. The pins 114 of the substrate 11 layer are electrically connected to the conductive layer 113 of the carrier 111. The conductive layer 113 is connected to the light-emitting circuit on the PCB board, so that the light-emitting circuit controls the light-emitting chip 12.

[0067] Moreover, the connection portion 21 of the optical lens 2 is only integrally connected to the carrier board 111, and the base layer 112 and the packaged chip 1 are both located within the coverage of the optical lens 2. This structure of the substrate 11 not only provides physical support, but also optimizes thermal management, electrical connection and overall performance.

[0068] Specifically, the carrier plate 111 provides a solid mounting platform for the optical lens 2 to ensure that the optical lens 2 will not be displaced or deformed during use, especially when subjected to external shock or vibration.

[0069] Furthermore, the carrier board 111 is made of a material with good thermal conductivity (such as ceramic or metal), effectively conducting heat away from the CSP, keeping the operating temperature of the LED chip within a safe range. If a problem occurs with the optical lens 2 or the CSP, the problem can be solved by simply removing and replacing the carrier board 111, without having to redesign the entire system.

[0070] In some embodiments, see Figure 2, pin 114 includes a positive terminal 115 and a negative terminal 116 .

[0071] Further, see Figure 1 and Figure 2 The light emitting chip 12 includes any one of a blue light chip, a green light chip or a red light chip or a combination thereof, and at least the light emitting front surface of the light emitting chip 12 is provided with a light conversion layer 121.

[0072] That is, the light-emitting chip 12 can be a separate blue light chip, a separate green light chip, or a separate red light chip, which correspond to mini-LEDs that can emit blue light, green light, and red light, respectively.

[0073] Of course, the light emitting chip 12 can also be a combination of a blue chip and a red chip, or a combination of a blue chip and a green chip, or a combination of a green chip and a red chip, or a combination of three chips: a blue chip, a red chip, and a green chip.

[0074] When the mini-LED is a white light LED, a combination of three chips, namely a blue light chip, a red light chip and a green light chip, can be used. The blue light, red light and green light are mixed to form white light. Of course, only a blue light chip can be used, and a light conversion layer 121 can be set on the blue light chip to convert the blue light of the blue light chip into white light through the light conversion layer 121.

[0075] For example, see Figure 2 The light-emitting chip 12 is a blue light chip. The light conversion layer 121 includes a red light conversion layer 122 and a green light conversion layer 124. The red light conversion layer 122 is provided with red light conversion particles 123, and the green light conversion layer 124 is provided with green light conversion particles 125. The red light conversion layer 122 and the green light conversion layer 124 are sequentially stacked on the light-emitting surface of the light-emitting chip 12.

[0076] Furthermore, the green light conversion particles 125 include any one of green phosphor particles and green quantum dot particles or a combination thereof, and the red light conversion particles 123 include any one of red phosphor particles and red quantum dot particles or a combination thereof.

[0077] Furthermore, the green light phosphor particles include β-SiAlON narrow peak width phosphor; the green light quantum dot particles include cadmium selenide (CdSe), indium phosphide (InP), and perovskite; the red light phosphor particles include fluoride KSF and KGF narrow peak width phosphor; the red light quantum dot particles include cadmium selenide (CdSe), indium phosphide (InP), and perovskite.

[0078] It should be noted that the green light conversion particles 125 are particles with a certain volume size composed of green light phosphor particles or green light quantum dot particles, and the red light conversion particles 123 are particles with a certain volume size composed of red light phosphor particles and red light quantum dot particles. The green light conversion particles 125 and the red light conversion particles 123 are arranged in the form of particles in the light conversion layer 121, and the light conversion layer 121 is a transparent layer composed of transparent silicone.

[0079] In a second aspect of the present application, a method for processing a CSP is provided. The CSP is a CSP with a primary optical lens 2 in the above embodiment. Figure 3 , the processing method comprises the following steps:

[0080] Step S1: Providing a mold that matches the shape of the optical lens 2, the mold including a first wall and a second wall, the first wall matching the shape of the substrate 11, and the second wall matching the shape of the optical lens 2, and uniformly applying a release agent on the second wall of the mold; wherein, a high-precision metal mold is manufactured with a smooth surface to ensure the optical quality of the optical lens 2, and the applied release agent facilitates subsequent demolding operations;

[0081] Step S2: placing the packaged chip 1 into the mold, fixing the substrate 11 on the first wall, and making the second wall cover the packaged chip 1 and coaxial with the packaged chip 1, with a molding space reserved between the second wall and the packaged chip 1;

[0082] Step S3: injecting silicone or liquid resin into the mold, heating the silicone or liquid resin to melt it, and applying pressure to ensure that the silicone or liquid resin fully fills the molding space;

[0083] Step S4: allowing the silicone or liquid resin in the mold to gradually cool and solidify into a shape, allowing the resin lens to cool naturally in the mold or accelerating cooling through a cooling system, and forming the optical lens 2 on the substrate 11;

[0084] Step S5: The finished CSP is removed from the mold and cut and trimmed, including trimming excess gates and other irregular parts, and lightly polishing if necessary.

[0085] In some embodiments, the processing method further comprises the following steps:

[0086] Use equipment to inspect lenses for dimensional accuracy, surface quality, and optical performance.

[0087] Clean the lens and ensure the surface is clean and dust-free.

[0088] A coating is performed on the surface of the optical lens 2 to improve its optical properties and durability.

[0089] Among them, the liquid resin is an optical-grade resin material in a molten state after heating. The optical-grade resin materials include polymethyl methacrylate (PMMA), cycloolefin copolymer (COC / COP), and epoxy resin. These materials have good transparency and processing performance.

[0090] Furthermore, in step S5, the finished CSP is taken out from the mold, and the finished CSP is cut and trimmed. Figure 4 , specifically including the following steps:

[0091] Step S501: Prefabricate grooves on the substrate 11 along the circumference of the connecting portion 21 on the side of the finished CSP where the optical lens 2 is formed. These grooves do not completely penetrate the substrate 11, but will help to more easily separate the finished CSP in subsequent steps.

[0092] Step S502: using a laser beam to cut the substrate 11 along the groove, specifically comprising: using a high-precision laser to carve fine cracks on the surface of the substrate 11 along a predetermined cutting path, and directly cutting the substrate 11 with the laser beam;

[0093] Step S503: remove the residues generated during the cutting process to ensure the cleanliness of the CSP device, and inspect each CSP device using an optical microscope or an automated optical inspection (AOI) system to ensure that its appearance is intact and its electrical performance is good.

[0094] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A CSP with a primary optical lens, characterized in that: include: A packaged chip, comprising a substrate and a light-emitting chip disposed on an upper surface of the substrate, wherein a pin electrically connected to the light-emitting chip is disposed at the bottom of the substrate; The optical lens comprises an integrally formed connecting portion and a curved portion, wherein the connecting portion is integrally connected to the substrate, and the curved portion covers the light-emitting side surface and the light-emitting front surface of the light-emitting chip.

2. The CSP with a primary optical lens according to claim 1, characterized in that: The shape of the curved surface portion includes a spherical surface and an ellipsoidal surface, and the optical axis of the curved surface portion coincides with the central axis of the light emitting chip.

3. The CSP with a primary optical lens according to claim 1, characterized in that: An inner concave portion recessed toward the light emitting chip is provided at the center of the curved surface portion, and an optical axis of the inner concave portion coincides with a central axis of the light emitting chip.

4. The CSP with a primary optical lens according to claim 1, wherein: The optical lens is integrally formed on the substrate through an injection molding or molding process, the connecting portion is integrally connected to the substrate through a thermosetting method, and the packaged chip is embedded between the optical lens and the substrate.

5. The CSP with a primary optical lens according to claim 1, characterized in that: The substrate includes a carrier and a base layer arranged on the top of the carrier, the packaged chip is arranged on the top of the base layer, the connecting portion of the optical lens is integrally connected to the carrier, the curved portion covers the base layer and the packaged chip, and the bottom of the carrier is provided with a conductive layer electrically connected to the pins.

6. The CSP with a primary optical lens according to claim 1, characterized in that: The pins include a positive electrode connector and a negative electrode connector.

7. The CSP with a primary optical lens according to claim 1, characterized in that: The light emitting chip includes any one of a blue chip, a green chip, and a red chip, or a combination thereof, and at least a light emitting front surface of the light emitting chip is provided with a light conversion layer.

8. The CSP with a primary optical lens according to claim 7, characterized in that: The light emitting chip is a blue light chip, the light conversion layer includes any one of a red light conversion layer and a green light conversion layer or a combination thereof, the red light conversion layer is provided with red light conversion particles, and the green light conversion layer is provided with green light conversion particles.

9. A method for processing a CSP, wherein the CSP is the CSP with a primary optical lens according to any one of claims 1 to 8, characterized in that: The following steps are involved: Providing a mold that matches the shape of the optical lens, the mold comprising a first wall surface and a second wall surface, the first wall surface matching the shape of the substrate, the second wall surface matching the shape of the optical lens, and uniformly coating the second wall surface of the mold with a release agent; Place the packaged chip into a mold, fix the substrate to the first wall, cover the packaged chip with the second wall, and make the second wall coaxial with the packaged chip, leaving a molding space between the second wall and the packaged chip; Injecting silicone or liquid resin into the mold, heating the silicone or liquid resin to melt it, and applying pressure to ensure that the silicone or liquid resin fully fills the molding space; Allow the silicone or liquid resin in the mold to gradually cool and solidify into a shape, forming an optical lens on the substrate; The finished CSP is taken out from the mold and cut and trimmed.

10. A CSP processing method according to claim 9, characterized in that: The process of removing the finished CSP from the mold and cutting and trimming the finished CSP specifically includes the following steps: On one side of the finished CSP where the optical lens is formed, a groove is prefabricated on the substrate along the circumference of the connecting portion; cutting the substrate along the grooves using a laser beam; Remove residue from the cutting process.

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