Double-pressing-head main pressing equipment and main pressing method

Abstract

The invention provides double-pressure-head main pressure equipment and a main pressure method, and relates to the technical field of main pressure bonding, through flexible configuration of a first pressure head unit and a second pressure head unit, diversified production requirements are met, the productivity is remarkably improved, and a multi-section bonding process is rapidly completed through cooperation with a first product platform mechanism and a second product platform mechanism; the glass platform is rotated through the glass platform driving unit, and the glass platform is matched with the lifting part to achieve the multilateral bonding process at a time. The first adjusting piece and the second adjusting piece are adjusted rapidly and conveniently through cooperation of the testing area and testing, and the levelness of the pressing head is improved; the oil injection port is formed in the pressing head connecting part and connected with the oil inlet of the sliding block, so that the sliding block is conveniently maintained at any time, and the pressing precision of the pressing head is kept; by means of the gas path layout of the first heat insulation plate, the second heat insulation plate and the third heat insulation plate perfectly conduct high-temperature heat insulation, and the service life of surrounding parts is prolonged.

Description

Technical Field

[0001] The present application relates to the field of pressure bonding technology, and in particular to a dual-head pressure bonding device and a pressure bonding method. Background Art

[0002] In the electronics manufacturing sector, as consumer electronics products evolve toward larger sizes and higher integration, bonding technology faces significant upgrade challenges. The simple thermocompression bonding used in traditional display panel manufacturing has evolved into a multi-level interconnection process, requiring sequential thermocompression bonding of the substrate and the COF to form the second product, followed by a secondary bonding of the second product to the first. For large-sized glass substrates, zoned thermocompression bonding requires four or more sections, evolving from single-sided bonding to a complex multi-side, multi-segment bonding process.

[0003] Hot press bonding is a key process in display module assembly. Traditional hot press equipment typically utilizes a single press head, resulting in low production efficiency and difficulty adapting to the complex bonding requirements of varying sizes and materials. Furthermore, existing equipment lacks precision in press head leveling, which can lead to uneven bonding and negatively impact product yield. Therefore, a new generation of hot press equipment is urgently needed that features independent control of multiple press heads, compatibility with multi-sided and multi-section glass, coordinated bonding between secondary and primary products, high-precision leveling, and efficient synchronization. Summary of the Invention

[0004] The present invention proposes a dual-head pressing device and method to solve the technical problems existing in the prior art, such as low bonding efficiency, incompatibility with multilateral and multi-segment bonding processes, difficulty in adjusting the horizontality of the pressing head, inconvenient slider maintenance, and poor thermal insulation.

[0005] In order to solve the above problems, the technical solution adopted by the present invention is: The present invention provides a double-pressure head pressing device for hot-pressing bonding between a single or multiple first products and a second product, comprising a bracket on which are provided at least two pressure head units, a winding mechanism, a first product platform mechanism corresponding to the pressure head units, and a second product platform mechanism; the winding mechanism moves synchronously with the pressure head unit; the first product platform mechanism comprises a pressing table and a first product carrying area, the first product is carried on the first product carrying area and the bonding area of ​​the first product is located on the pressing table, the first product platform mechanism moves to the hot pressing station so that the pressing table is located directly below the pressure head unit; the second product platform mechanism carries the second product and switches it to the hot pressing station, and transfers the bonding area of ​​the second product to the pressing table; the winding mechanism releases a buffer material, and the buffer material passes through the area between the bottom of the pressure head unit and the top of the first product and the second product; the multiple pressure head units and the first product platform mechanism can selectively cooperate with the second product platform mechanism to perform the bonding action, or switch alternately, the second product platform mechanism transfers the second product to the corresponding hot pressing station and switches for the bonding action, or cooperate with the second product platform mechanism to perform the bonding action at the same time.

[0006] Furthermore, the pressure head unit includes a pressure head assembly, a pressure head driving part that drives the pressure head assembly to perform vertical movement, and a pressure head connecting part that connects the pressure head assembly to the pressure head driving part; the pressure head assembly is slidably connected to the guide rail on the bracket through a pressure head slider; the pressure head connecting part includes a slider connecting plate fixedly connected to the pressure head slider, and an oil filling port is provided on the slider connecting plate on the side where the operating area of ​​the dual pressure head pressure device is located, the oil filling port is fully exposed to the operating area, and the oil filling port is connected to the oil inlet of the pressure head slider through an oil pipe.

[0007] Furthermore, the pressure head assembly includes a pressure head and a horizontal adjustment part for adjusting the horizontality of the lower pressure surface of the pressure head; the horizontal adjustment part includes a first heat insulation board, and multiple groups of first air paths are horizontally opened in the first heat insulation board, and the head end and the end of the first air path are respectively connected to the first air inlet and the first air outlet; a second heat insulation board is provided below the first heat insulation board, and the second heat insulation board is embedded with evenly distributed pads; a horizontal adjustment block is fixed below the second heat insulation board, and multiple rows of second air paths are horizontally passed through the horizontal adjustment block, and a second air inlet and a second air outlet are provided behind the horizontal adjustment block, which are respectively connected to the head end and the end of the second air path.

[0008] Furthermore, the horizontal adjustment part includes a plurality of first adjustment members and second adjustment members, and the first adjustment members and the second adjustment members pass through the first heat insulation board, the second heat insulation board, and the horizontal adjustment block at the same time. The first adjustment member partially penetrates into the heating block located below the horizontal adjustment block, and the lower end portion of the second adjustment member abuts against the end face of the heating block facing the horizontal adjustment block.

[0009] Furthermore, there are at least multiple heating blocks on the front section, interruption and rear section of the pressure head. Each heating block is equipped with multiple heating tubes arranged side by side along the length direction of the heating block and arranged perpendicular to the length direction of the heating block. The temperatures on the front section, interruption and rear section of the pressure head are independently controllable.

[0010] Furthermore, the second product platform mechanism includes a glass platform, and a glass platform driving unit that drives the glass platform to perform lateral, longitudinal, vertical and rotational movements; the glass platform is divided into a glass support area, multiple groups of first product support components and second product support components, each group of first product support components includes a main support component and an auxiliary support component, the main support component is connected to the second product support component, and the glass support area, the first product support component and the second product support component are all provided with multiple adsorption parts; the auxiliary support components are symmetrically arranged on both sides of the glass support area.

[0011] Furthermore, the main support assembly includes a longitudinal adjustment slider and a bracket; the second product support assembly includes a second product support block, which is fixed on the bracket; the auxiliary support assembly includes a support plate, which is connected to the glass platform through a transverse adjustment slider.

[0012] Furthermore, the first product platform mechanism includes a first product platform support plate, a first product platform driving unit is provided below the first product platform support plate, a test area is provided on the first product platform support plate, and the test area is located in front of the pressing platform; the test area includes a fixed column fixed on the first product platform support plate, and the fixed column is fixed to the pressure sensing platform; a lifting part is provided behind the pressing platform; the lifting part includes a lifting slider and a lifting rod fixed on the lifting slider.

[0013] Furthermore, the upper surface of the pressure-sensing platform is at the same level as the upper surface of the pressing platform and the upper surface of the glass platform.

[0014] The main pressing method based on the dual-head main pressing device includes the following steps: S1. Adjust the level of the pressure head; S2. Main pressing correction: The first product platform mechanism and the second product platform mechanism move to the hot pressing station; the first product on the pressing table of the first product platform mechanism and the second product on the glass platform of the first product platform mechanism are aligned and corrected; S3, product in place: the second product platform mechanism moves toward the pressing table so that the hot pressing areas of the first and second products are both located on the pressing table; S4, main pressure: the tape winding mechanism moves down to the pressing table, the pressure head presses down to the pressing table, and keeps for a set time before rising, and the tape winding mechanism moves up; S5, handover after pressing: The longitudinal adjustment slider drives the bracket to extend toward the pressing table to support the first product; the lifting rod of the first product platform mechanism drives the lifting slider to lift the first product on the pressing table upward. At the same time, the glass platform drive unit drives the longitudinal adjustment slider and the adjustment mounting plate to move upward to the same height; S6. Move out after handover; the lifting rod drives the lifting slider downward, and the mounting plate is adjusted to keep supporting the first product; the second product platform mechanism is moved out from the hot pressing workstation, and the first finished product obtained by bonding the first and second products into one is simultaneously moved out; S7. The first finished product after bonding is transferred from the second product platform mechanism to the subsequent process, and the longitudinal adjustment slider drives the adjustment mounting plate to reset.

[0015] Furthermore, the step S6 includes the following steps: S6A, after the first product platform mechanism drives the first finished product to switch to the next pressing head unit and the hot pressing station corresponding to the first product platform mechanism, steps S2-S6 are executed.

[0016] Furthermore, the step S6A further includes the second product platform mechanism driving the glass platform to rotate a set angle so that the side of the second product to be bonded faces the pressing platform.

[0017] Furthermore, step S6A is repeated at least once.

[0018] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a dual-pressure head pressing device and a dual-pressure head pressing method. By arranging a flexible configuration of a first pressure head unit and a second pressure head unit, the device can adapt to diversified production needs and significantly improve production capacity. In cooperation with a first product platform mechanism and a second product platform mechanism, a multi-stage bonding process can be quickly completed. The glass platform is rotated by a glass platform driving unit, and the multi-sided bonding process can be completed in one go in cooperation with a lifting part. Through cooperative testing in a test area, the first adjustment member and the second adjustment member can be quickly and conveniently adjusted to improve the horizontality of the pressure head. By arranging an oil filling port at the pressure head connecting part and connecting it to the oil inlet of a slider, the slider can be conveniently maintained at any time, and the pressure head pressing accuracy can be maintained. The air path layout of the first heat insulation board, the second heat insulation board, and the third heat insulation board are perfectly used for high-temperature heat insulation, thereby extending the service life of surrounding components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions proposed in the present invention, they are described in detail below in conjunction with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, these drawings can be changed under the concept of the present invention.

[0020] Figure 1An assembly perspective view of an embodiment of a dual-head pressing device provided by the present invention; Figure 2 An assembly perspective view of an embodiment of a first pressure head unit provided by the present invention; Figure 3 A rear view of an embodiment of a first pressure head unit provided by the present invention; Figure 4 An assembly perspective view of an embodiment of a first product platform mechanism provided by the present invention; Figure 5 This is an assembly stereogram of an embodiment of the first product platform mechanism provided by the present invention.

[0021] 1. First ram unit; 11. Ram drive unit; 111. Ram slider; 112. Oil inlet; 12. Slider connecting plate; 121. Oil filling port; 13. First heat shield; 131. First air inlet; 132. First air outlet; 14. Second heat shield; 15. Leveling block; 151. Second air inlet; 152. Second air outlet; 153. First adjusting member; 154. Second adjusting member; 16. Heating block; 161. Heating tube; 17. Third heat shield; 18. Ram; 2. Second ram unit; 3. Second product platform mechanism; 31. Glass platform; 311. Glass Support area; 312, adsorption part; 313, first support assembly; 3131, adjustment mounting plate; 3132, adjustment hole; 3133, adjustment mounting block; 3134, longitudinal adjustment slider; 314, second support assembly; 3141, first product support assembly; 315, second product support assembly; 32, glass platform drive unit; 4, first product platform mechanism; 41, first product platform support plate; 42, pressing table; 43, lifting rod; 44, lifting slider; 45, fixed column; 46, pressure-sensing platform; 47, first product platform drive unit; 5, winding mechanism; 6, bracket. DETAILED DESCRIPTION

[0022] Example 1 See Figure 1-5As shown, the present invention discloses a double-pressing head pressing device for performing hot-pressing bonding between a single or multiple first products and a second product, comprising a bracket 6, on which a press unit is provided, the press unit comprising a first press unit 1 and a second press unit 2 arranged adjacent to each other, and a winding mechanism 5 arranged below the first press unit 1 and the second press unit 2, the winding mechanism 5 being multiple groups, the winding mechanism 5 corresponding to the first press unit 1 and the second press unit 2 one-to-one and moving synchronously, a movable second product platform mechanism 3 being provided below the winding mechanism 5, and two groups of movable first product platform mechanisms 4 being arranged side by side behind the second product platform mechanism 3, the first press unit 1 and the second press unit 2 can perform the pressing action synchronously or independently. It should be noted that, in this embodiment, for the convenience of description and understanding, PCBs are collectively referred to as the first product. Of course, it is not limited to PCBs, and can also be other components that need to be bonded. When the first product is PCB, the PCB here is not limited to the same type and specification. It can be a single PCB or a PCB of multiple specifications and sizes. The second product in this embodiment can be understood as a simple COF, or it can be other products such as a glass panel bonded with COF. Here, the second product is defined as a glass panel bonded with COF.

[0023] The upstream equipment has already bonded the glass panel to the COF. If the second product has only one section of the PCB to be bonded, the process can be completed by simply activating the first ram unit 1 or the second ram unit 2 and one of the two sets of first product platform mechanisms 4. If the first product to be bonded has two sections, the first ram unit 1 and the second ram unit 2 must be activated, and both sets of first product platform mechanisms 4 must be opened simultaneously. Alternatively, the first ram unit 1 and the second ram unit 2 can be controlled to alternately and individually press down and bond to complete the process. If the second product has three sections of the PCB to be bonded, the first ram unit 1 and the second ram unit 2 must be activated, and both sets of first product platform mechanisms 4 must be opened simultaneously. Either the first ram unit 1 or the second ram unit 2 must be pressed down twice. If the second product has four sections of the PCB to be bonded, the first ram unit 1 and the second ram unit 2 must be activated, and both sets of first product platform mechanisms 4 must be opened simultaneously. Both the first ram unit 1 and the second ram unit 2 must be pressed down twice. Of course, it should be noted that when the PCB to be bonded on the second product mentioned above is one, two, three or four sections, it can have multiple bonding positions with the PCB on a single side of the second product, or it can have multiple bonding positions on multiple sides of the second product; of course, in the bonding process of the above situation, the first product platform mechanism 4 needs to coordinate position switching or make corresponding adjustments to the glass platform 31 to ensure that the COF position to be bonded can be accurately positioned; and Then, the two groups of first product platform mechanisms 4 only need to match the PCBs loaded thereon with the PCBs that need to be bonded at the corresponding positions of the second product to determine which first product platform mechanism 4 will participate in the bonding; since the two groups of first product platform mechanisms 4 correspond one-to-one to the first press unit 1 and the second press unit 2 respectively, during the specific action, it is determined whether the first press unit 1 and the second press unit 2 act simultaneously (the bonding position just meets the simultaneous bonding of the first press unit 1 and the second press unit 2), or alternately (the bonding position can only meet the bonding of the first press unit 1 or the second press unit 2 alone, at this time the first product platform mechanism 4 needs to move the position and switch the hot pressing station of the first press unit 1 or the second press unit 2), or one of the press units acts continuously (the multiple bonding points on the second product use the same PCB, so the corresponding first product platform mechanism 4 and the press unit can continuously load the PCB, and cooperate with the switching of the bonding position of the first product platform mechanism 4, then the press unit is continuously bonded at this time without switching).

[0024] The first ram unit 1 includes a ram, a ram driving part 11 for driving the ram to move vertically, a horizontal adjustment part for adjusting the horizontality of the lower pressure surface of the ram, and a ram connecting part connecting the horizontal adjustment part and the ram driving part 11; the ram driving part 11 includes a ram slider 111, the ram connecting part includes a slider connecting plate 12, a slider connecting plate 12 is fixed on the ram slider 111, an oil filling port 121 is provided on the slider connecting plate 12, an oil inlet 112 is provided on the ram slider 111, and the oil filling port 121 is connected to the oil inlet 112 through an oil pipe. The oil filling port 121 here can use the oil filling nozzle in the prior art, which is fixedly installed on the slider connecting plate 12 so that its oil nozzle faces outward, and the oil outlet can be connected to the oil inlet 112 through an oil pipe by means of a conversion seat or the like. During the operation of the equipment, the pressure head often needs to be pressed down at a high frequency, which will undoubtedly cause the pressure head slider 111 to move up and down on the guide rail. If the lubrication is poor, it will inevitably lead to accelerated wear of the pressure head slider 111; then undoubtedly, the daily maintenance of the pressure head slider 111 is very important, and in the existing technology, the maintenance action is complicated, and all equipment needs to be paused before the operator can go to the back of the equipment to perform lubrication and maintenance operations. Often the entire production line is linked, so maintenance of a local pressure head slider 111 will cause the entire production line to stop, and restarting after the maintenance is completed will become more cumbersome. Therefore, in this embodiment, the oil filling port 121 is provided on the slider connecting plate 12, that is, the oil filling port 121 is forward-positioned, and the oil inlet 112 of the pressure head slider 111 is connected through an oil pipe. The operator only needs to easily and conveniently connect the oil gun to the oil filling port 121 in front of the equipment, and then inject high-temperature grease, observe the amount of oil overflowing from the oil inlet 112, and ensure that the grease covers the surface of the pressure head slider 111, thereby solving the problem of low maintenance efficiency caused by the structure.

[0025] During bonding, the pressure head 18 needs to reach a set high temperature, and high temperature can easily affect the surrounding core components. For this reason, four-stage heat insulation is implemented in this application.

[0026] Step 1: The horizontal adjustment portion includes a first heat insulation board 13, and multiple groups of first air paths are horizontally opened in the first heat insulation board 13. The first air paths are respectively connected to the first air inlet 131 and the first air outlet 132. By opening the first air path inside the first heat insulation board 13, air is introduced from the first air inlet 131 and discharged from the first air outlet 132. The heat of the first heat insulation board 13 is taken out by the circulating gas, and the backflow of hot air is avoided. The temperature of the first heat insulation board 13 is effectively reduced, and the problem of indirect horizontal deviation of the pressure head 18 caused by thermal expansion is solved; of course, an extension tube can be connected to the first air outlet 132 to guide the airflow blown out of the first air outlet 132 to a position away from the horizontal adjustment portion for discharge, thereby further avoiding the problem of hot air being directly discharged near the first heat insulation board 13, causing the ambient air temperature to rise and causing thermal expansion of the horizontal adjustment portion.

[0027] Step 2: A second heat insulation board 14 is provided below the first heat insulation board 13. The second heat insulation board 14 has evenly distributed pads embedded therein. The second heat insulation board 14 is made of ceramic material and the pads are made of stainless steel. Although the second heat insulation board 14 made of ceramic material has good heat insulation effect, good hardness and thermal stability, it is highly brittle. Under high-frequency downward pressure, if the second heat insulation board 14 is directly subjected to impact, it is easy to break, resulting in affected structural stability. Therefore, pads are embedded in the second heat insulation board 14 to cushion the impact on the second heat insulation board 14, thereby avoiding the occurrence of the above-mentioned problem.

[0028] Step 3: A horizontal adjustment block 15 is fixed under the second heat insulation board 14. Multiple rows of second air paths are horizontally passed through the horizontal adjustment block 15. A second air inlet 151 and a second air outlet 152 are provided at the rear of the horizontal adjustment block 15, which are respectively connected to the head end and the end end of the second air path. By opening a second air path inside the horizontal adjustment block 15, air is taken in from the second air inlet 151. After the gas absorbs heat through the second air path, it is blown out from the second air outlet 152, thereby reducing the temperature of the horizontal adjustment block 15. Preferably, each second air path is arranged in parallel along the length direction of the horizontal adjustment block 15, and then after the two end surfaces of the second adjustment block in the length direction are penetrated, the two end openings of the second air path are blocked by sealing, and the second air inlet 151 and the second air outlet 152 are arranged perpendicular to the second air path, and aligned and extended, so that the second air inlet 151 and the second air outlet 152 are respectively connected to the second air path at the beginning and end of the second air path, thereby forming multiple transverse and longitudinal air paths, which effectively take away the heat on the horizontal adjustment block 15 while making the temperature on the horizontal adjustment block 15 more uniform and consistent.

[0029] Step 4: Connect the third heat insulation board 17 on all sides of the heating block 16. The temperature of the heating block 16 is the highest. The heat of the heating tube 161 is blocked by the third heat insulation board 17 to prevent the temperature of the heating block 16 from dissipating to the surroundings and heating the air near the unit, thereby causing the temperature of the horizontal adjustment part to rise. As a result, the various components of the horizontal adjustment part expand due to the increase in temperature, indirectly causing the horizontal deviation of the pressure head 18.

[0030] The traditional heating method is to embed the heating tube 161 horizontally on the heating block 16. However, for the long pressure head 18, the temperature of the lower pressing surface of the pressure head 18 is uneven, which directly affects the bonding accuracy, and cannot achieve zoned temperature control, making temperature regulation difficult. In order to facilitate the adjustment of the level of the pressure head 18, the preferred horizontal adjustment part of this embodiment includes multiple first adjustment members 153 and second adjustment members 154. The first adjustment members 153 and the second adjustment members 154 simultaneously pass through the first insulation board 13, the second insulation board 14, and the horizontal adjustment block 15, wherein the first adjustment member 153 partially penetrates the heating block 16 located below the horizontal adjustment block 15, and the lower end of the second adjustment member 154 abuts against the end face of the heating block 16 facing the horizontal adjustment block 15. It is further preferred that heating tubes 161 are longitudinally arranged side by side within the heating block 16, dividing the heating block 16 into multiple temperature zones, each of which is independently controllable, such as the front, middle, and rear temperature zones of the heating block 16. This facilitates real-time monitoring of the temperatures of different zones of the pressure head 18. Of course, while monitoring the temperatures of the aforementioned zones, because the heating tubes 161 are controlled in multiple zones, if a zone is found to be too low, the temperature of the heating tubes 161 in the corresponding zone can be adjusted to maintain a balance.

[0031] The first product platform mechanism 4 includes a glass platform 31 and a glass platform drive unit 32 that drives the glass platform 31 in lateral, longitudinal, vertical, and rotational motion. The glass platform 31 is divided into a glass support area 311, multiple groups of first product support assemblies 3141, and second product support assemblies 315. Each group of first product support assemblies 3141 includes a first support assembly 313 and a second support assembly 314. The glass support area 311 is connected to the first support assembly 313 and the second support assembly 314, which are connected to the second product support assembly 315. The glass support area 311, the first support assembly 313, the second support assembly 314, and the second product support assembly 315 are each distributed with multiple suction portions 312. Preferably, there are two or more groups of first product support assemblies 3141, which are distributed on one or more sides of the glass support area 311. As shown in the figure, the second support assemblies 314 are symmetrically arranged on both sides of the glass support area 311. A semi-finished product is placed on the glass platform 31 , and the COF has been bonded to the glass substrate by upstream equipment.

[0032] The first support assembly 313 includes a longitudinal adjustment slider 3134 and a bracket. The bracket includes an adjustment mounting plate 3131 and an adjustment mounting block 3133 fixedly mounted on the adjustment mounting plate 3131. The adjustment mounting plate 3131 is provided with a plurality of adjustment holes 3132, each of which is fixed with an adjustment mounting block 3133. The longitudinal adjustment slider 3134 is connected to the bottom of the adjustment mounting plate 3131. By changing the adjustment mounting block 3133 and installing it in different adjustment holes 3132 on the adjustment mounting plate 3131, the position of the adjustment mounting block 3133 can be adjusted. Furthermore, the longitudinal position of the adjustment mounting plate 3131 can be adjusted by sliding the longitudinal adjustment slider 3134, thereby expanding the support range and adaptability of the first support assembly 313. The second product support assembly 315 includes a COF support block, and the other end of the adjustment mounting block 3133 is fixed on the COF support block. During use, the COF is supported by the COF support block so that the COF maintains a sufficient position and extends outward; the second support assembly 314 includes a first product support assembly 3141, and the first product support assembly 3141 is connected to the lateral adjustment slider to adjust the lateral support point of the PCB to achieve the optimal support position and support stability.

[0033] The first product platform mechanism 4 includes a first product platform support plate 41, a first product platform driving unit 47 is provided below the first product platform support plate 41, a test area is provided on the first product platform support plate 41, the test area includes a fixed column 45 fixed on the first product platform support plate 41, and a pressure sensing platform 46 is detachably fixed on the fixed column 45. A pressing table 42 is provided at the rear of the testing area, and a lifting part is provided at the rear of the pressing table 42; wherein the lifting part includes a lifting slider 44 and a lifting rod 43 fixed on the lifting slider 44, wherein the lifting slider 44 has a power to drive it to realize the lifting action, such as a cylinder, etc., and the lifting is located on the side of the pressing table 42 away from the first product platform mechanism 4. In the initial state, the upper end surface height of the lifting rod 43 is lower than the height of the upper end surface of the pressing table 42. The lifting slider 44 drives the lifting rod 43 to move upward, so that the upper end surface height of the lifting rod 43 can be made higher than the upper end surface height of the pressing table 42, thereby lifting the first product located on the pressing table 42 upward and separating it from the pressing table 42, which is beneficial to the smooth transfer of the first product in the later stage.

[0034] Example 2 This embodiment discloses a local pressing method based on a dual-head local pressing device, comprising the following steps: S1. Adjust the horizontality of the pressure head 18: Place the pressure-sensitive paper on the pressure-sensitive platform 46, and adjust the tightness of the first adjusting member 153 and the downward force of the second adjusting member 154 according to the depth of the stamping; specifically, regarding step S1: each time the product batch is changed or the current stamping is performed at a high frequency, when there is a difference in the current stamping accuracy, adjust it through step S1; in this embodiment, the pressure-sensitive platform 46 is preferably a quick-release design. When adjusting, first place the pressure-sensitive paper on the pressure-sensitive platform 46; it should be noted that before the test begins, the following preparations need to be made, including installing the pressure-sensitive platform 46 on the fixed column 45, and keeping the upper surface of the pressure-sensitive platform 46 at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the upper surface height of the fixed column 45 and the height of the pressure-sensitive platform 46, it can be achieved that after the pressure-sensitive platform 46 is installed on the fixed column 45, the upper surface of the pressure-sensitive platform 46 can be at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31 After the upper surfaces of the adsorption parts 312 are at the same horizontal height, the pressure-sensitive paper is placed on the upper end surface of the pressure-sensitive platform 46; then, the pressure head 18 is pressed downward, and the pressure-sensitive paper is pressed tightly between the pressure head 18 and the pressure-sensitive platform 46. If the left side of the pressure-sensitive paper is lighter and the right side is darker after being pressed downward, it means that the left side of the pressure head 18 is lower than the right side. The first adjusting member 153 can be loosened or the heating block 16 can be supported by the second adjusting member 154, or the first adjusting member 153 and the second adjusting member 154 can be coordinated and adjusted until the imprinted color of the pressure-sensitive paper is uniform and the downward pressing surface of the pressure head 18 is consistent with the imprint of the pressure-sensitive paper.

[0035] S2, main pressure correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 and the second product on the glass platform 31 of the second product platform mechanism 3 are aligned and corrected; specifically, regarding step S2: the marking points of the COF and the PCB can be aligned and corrected through multiple sets of image systems; such as using a camera to capture the images of the COF and the PCB, and grabbing their marking points, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to perform position compensation, and the COF and the PCB are aligned and corrected.

[0036] S3, the product is in place; the second product platform mechanism 3 moves toward the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0037] S4, main pressing: the winding mechanism 5 moves downward toward the pressing platform 42, the pressing head 18 presses downward toward the pressing platform 42, and rises after maintaining the pressure for a set period of time, and the winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released from the winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB and scalding the PCB when pressing at high temperature. The winding mechanism 5 is protected by the buffer material and moves up and down at the same frequency as the pressing head 18, which can protect the PCB while preventing interference with other mechanisms.

[0038] S5, post-pressing handover: the longitudinal adjustment slider 3134 drives the bracket to extend toward the pressing platform 42 to support the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slider 44 to lift the first product on the pressing platform 42 upward, and at the same time, the second product platform mechanism 3 drives the longitudinal adjustment slider 3134 and the adjustment mounting plate 3131 to move upward to the same height; specifically, the adjustment mounting plate 3131 drives the adjustment mounting block 3133 to extend toward the pressing platform 42 via the longitudinal adjustment slider 3134. At the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing platform 42 upward via the lifting slider 44, and the adjustment mounting plate 3131 is reset via the longitudinal adjustment slider 3134; specifically, regarding step S5: after completing the bonding of the single-sided PCB and the COF, it is necessary to transfer part of the PCB on the pressing platform 42 to the glass platform 31 for the next step or unloading. After the glass platform 31 receives the finished product, the suction cups of the adsorption part 312 are all opened to prevent the finished product from falling.

[0039] S6. Move out after handover; the lifting rod 43 drives the lifting slider 44 to move downward, and the adjusting mounting plate 3131 keeps supporting the first product; the second product platform mechanism 3 is moved out from the hot pressing workstation, and the first finished product obtained after the first product and the second product are bonded into one is moved out synchronously.

[0040] S7. The bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjustment slider 3134 drives the adjustment mounting plate 3131 to reset.

[0041] Example 3 When the PCB to be bonded on one side of the second product has more than two sections, the pressing method based on the dual-head pressing device in this embodiment includes the following steps: S1. Adjust the horizontality of the pressure head 18: Place the pressure-sensitive paper on the pressure-sensitive platform 46, and adjust the tightness of the first adjusting member 153 and the downward force of the second adjusting member 154 according to the depth of the stamping; specifically, regarding step S1: each time the product batch is changed or the current stamping is performed at a high frequency, when there is a difference in the current stamping accuracy, the pressure-sensitive platform 46 is preferably adjusted through step S1; in this embodiment, the pressure-sensitive platform 46 is preferably a quick-release design. When adjusting, first place the pressure-sensitive paper on the pressure-sensitive platform 46; it should be noted that before the test begins, the following preparations need to be made, including installing the pressure-sensitive platform 46 on the fixed column 45, and keeping the upper surface of the pressure-sensitive platform 46 at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the upper surface height of the fixed column 45 and the height of the pressure-sensitive platform 46, it can be achieved that after the pressure-sensitive platform 46 is installed on the fixed column 45, the upper surface of the pressure-sensitive platform 46 can be at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31). After the upper surface of the platform 31 is at the same horizontal height), the pressure-sensitive paper is placed on the upper end surface of the pressure-sensitive platform 46; then, the pressure head 18 is pressed down, and the pressure-sensitive paper is pressed tightly between the pressure head 18 and the pressure-sensitive platform 46. If the left side of the pressure-sensitive paper is lighter in color and the right side is darker in color after being pressed down, it means that the left side of the pressure head 18 is lower than the right side. The first adjusting member 153 can be loosened or the heating block 16 can be supported by the second adjusting member 154, or the first adjusting member 153 and the second adjusting member 154 can be coordinated and adjusted until the imprinted color of the pressure-sensitive paper is uniform and the lower pressing surface of the pressure head 18 is consistent with the imprint of the pressure-sensitive paper.

[0042] S2, main pressure correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 and the second product on the glass platform 31 of the first product platform mechanism 4 are aligned and corrected; specifically, regarding step S2: the marking points of the COF and the PCB can be aligned and corrected through multiple sets of image systems; such as using a camera to capture images of the COF and the PCB, and grabbing their marking points, so that the compensation displacement parameters of the second product platform mechanism 3 and the first product platform mechanism 4 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the first product platform mechanism 4 are controlled to perform position compensation, and the COF and the PCB are aligned and corrected.

[0043] S3, products are in place; the first product platform mechanism 4 moves toward the pressing table 42 so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0044] S4, main pressing: the winding mechanism 5 moves downward toward the pressing platform 42, the pressing head 18 presses downward toward the pressing platform 42, and rises after maintaining the pressure for a set period of time, and the winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released from the winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB and scalding the PCB when pressing at high temperature. The winding mechanism 5 is protected by the buffer material and moves up and down at the same frequency as the pressing head 18, which can protect the PCB while preventing interference with other mechanisms.

[0045] S5, post-pressing handover: the longitudinal adjustment slider 3134 drives the bracket to extend toward the pressing platform 42 to support the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slider 44 to lift the first product on the pressing platform 42 upward, and at the same time, the second product platform mechanism 3 drives the longitudinal adjustment slider 3134 and the adjustment mounting plate 3131 to move upward to the same height; specifically, the adjustment mounting plate 3131 drives the adjustment mounting block 3133 to extend toward the pressing platform 42 via the longitudinal adjustment slider 3134. At the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing platform 42 upward via the lifting slider 44, and the adjustment mounting plate 3131 is reset via the longitudinal adjustment slider 3134; specifically, regarding step S5: after completing the bonding of the single-sided PCB and the COF, it is necessary to transfer part of the PCB on the pressing platform 42 to the glass platform 31 for the next step or unloading. After the glass platform 31 receives the finished product, the suction cups of the adsorption part 312 are all opened to prevent the finished product from falling.

[0046] S6. Move out after handover; the lifting rod 43 drives the lifting slider 44 to move downward, and the adjusting mounting plate 3131 keeps supporting the first product; the second product platform mechanism 3 is moved out from the hot pressing workstation, and the first finished product obtained after the first product and the second product are bonded into one is moved out synchronously.

[0047] S7: After the second product platform mechanism 3 drives the first finished product to the next pressing head unit and the corresponding hot pressing station of the first product platform mechanism 4, steps S2-S6 are repeated at least once. It should be noted that the number of times steps S2-S6 are repeated here is determined by the number of PCBs of the same specifications that need to be bonded on the second product.

[0048] S8. The bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjustment slider 3134 drives the adjustment mounting plate 3131 to reset.

[0049] Example 4 For the second product, when the PCBs to be bonded are located on at least two sides of the second product, the present embodiment discloses a pressing method based on a dual-head pressing device, including the following steps: S1. Adjust the horizontality of the pressure head 18: Place the pressure-sensitive paper on the pressure-sensitive platform 46, and adjust the tightness of the first adjusting member 153 and the downward force of the second adjusting member 154 according to the depth of the stamping; specifically, regarding step S1: each time the product batch is changed or the current stamping is performed at a high frequency, when there is a difference in the current stamping accuracy, the pressure-sensitive platform 46 is preferably adjusted through step S1; in this embodiment, the pressure-sensitive platform 46 is preferably a quick-release design. When adjusting, first place the pressure-sensitive paper on the pressure-sensitive platform 46; it should be noted that before the test begins, the following preparations need to be made, including installing the pressure-sensitive platform 46 on the fixed column 45, and keeping the upper surface of the pressure-sensitive platform 46 at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the upper surface height of the fixed column 45 and the height of the pressure-sensitive platform 46, it can be achieved that after the pressure-sensitive platform 46 is installed on the fixed column 45, the upper surface of the pressure-sensitive platform 46 can be at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31). After the upper surface of the platform 31 is at the same horizontal height), the pressure-sensitive paper is placed on the upper end surface of the pressure-sensitive platform 46; then, the pressure head 18 is pressed down, and the pressure-sensitive paper is pressed tightly between the pressure head 18 and the pressure-sensitive platform 46. If the left side of the pressure-sensitive paper is lighter in color and the right side is darker in color after being pressed down, it means that the left side of the pressure head 18 is lower than the right side. The first adjusting member 153 can be loosened or the heating block 16 can be supported by the second adjusting member 154, or the first adjusting member 153 and the second adjusting member 154 can be coordinated and adjusted until the imprinted color of the pressure-sensitive paper is uniform and the lower pressing surface of the pressure head 18 is consistent with the imprint of the pressure-sensitive paper.

[0050] S2, main pressure correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 and the second product on the glass platform 31 of the second product platform mechanism 3 are aligned and corrected; specifically, regarding step S2: the marking points of the COF and the PCB can be aligned and corrected through multiple sets of image systems; such as using a camera to capture the images of the COF and the PCB, and grabbing their marking points, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to perform position compensation, and the COF and the PCB are aligned and corrected.

[0051] S3, the product is in place; the second product platform mechanism 3 moves toward the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0052] S4, main pressing: the winding mechanism 5 moves downward toward the pressing platform 42, the pressing head 18 presses downward toward the pressing platform 42, and rises after maintaining the pressure for a set period of time, and the winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released from the winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB and scalding the PCB when pressing at high temperature. The winding mechanism 5 is protected by the buffer material and moves up and down at the same frequency as the pressing head 18, which can protect the PCB while preventing interference with other mechanisms.

[0053] S5, post-pressing handover: the longitudinal adjustment slider 3134 drives the bracket to extend toward the pressing platform 42 to support the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slider 44 to lift the first product on the pressing platform 42 upward, and at the same time, the second product platform mechanism 3 drives the longitudinal adjustment slider 3134 and the adjustment mounting plate 3131 to move upward to the same height; specifically, the adjustment mounting plate 3131 drives the adjustment mounting block 3133 to extend toward the pressing platform 42 via the longitudinal adjustment slider 3134. At the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing platform 42 upward via the lifting slider 44, and the adjustment mounting plate 3131 is reset via the longitudinal adjustment slider 3134; specifically, regarding step S5: after completing the bonding of the single-sided PCB and the COF, it is necessary to transfer part of the PCB on the pressing platform 42 to the glass platform 31 for the next step or unloading. After the glass platform 31 receives the finished product, the suction cups of the adsorption part 312 are all opened to prevent the finished product from falling.

[0054] S6. Move out after handover; the lifting rod 43 drives the lifting slider 44 to move downward, and the adjusting mounting plate 3131 keeps supporting the first product; the second product platform mechanism 3 is moved out from the hot pressing workstation, and the first finished product obtained after the first product and the second product are bonded into one is moved out synchronously.

[0055] S7, the second product platform mechanism 3 drives the first finished product to switch to the next pressing head unit and the hot pressing station corresponding to the first product platform mechanism 4.

[0056] S8. The glass platform driving unit 32 drives the glass platform 31 to rotate the set angle so that the next bonding side of the second product faces the pressing table 42 of the first product platform mechanism 4 where the PCB to be bonded is located; then repeat steps S2-S6 once.

[0057] S9. The bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjustment slider 3134 drives the adjustment mounting plate 3131 to reset.

[0058] Example 5 For the second product, when the PCBs to be bonded are located on at least two sides of the second product, and there are at least two PCBs to be bonded on each side, the present embodiment discloses a pressing method based on a dual-head pressing device, including the following steps: S1. Adjust the horizontality of the pressure head 18: Place the pressure-sensitive paper on the pressure-sensitive platform 46, and adjust the tightness of the first adjusting member 153 and the downward force of the second adjusting member 154 according to the depth of the stamping; specifically, regarding step S1: each time the product batch is changed or the current stamping is performed at a high frequency, when there is a difference in the current stamping accuracy, the pressure-sensitive platform 46 is preferably adjusted through step S1; in this embodiment, the pressure-sensitive platform 46 is preferably a quick-release design. When adjusting, first place the pressure-sensitive paper on the pressure-sensitive platform 46; it should be noted that before the test begins, the following preparations need to be made, including installing the pressure-sensitive platform 46 on the fixed column 45, and keeping the upper surface of the pressure-sensitive platform 46 at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the upper surface height of the fixed column 45 and the height of the pressure-sensitive platform 46, it can be achieved that after the pressure-sensitive platform 46 is installed on the fixed column 45, the upper surface of the pressure-sensitive platform 46 can be at the same horizontal height as the upper surface of the stamping platform 42 and the upper surface of the glass platform 31). After the upper surface of the platform 31 is at the same horizontal height), the pressure-sensitive paper is placed on the upper end surface of the pressure-sensitive platform 46; then, the pressure head 18 is pressed down, and the pressure-sensitive paper is pressed tightly between the pressure head 18 and the pressure-sensitive platform 46. If the left side of the pressure-sensitive paper is lighter in color and the right side is darker in color after being pressed down, it means that the left side of the pressure head 18 is lower than the right side. The first adjusting member 153 can be loosened or the heating block 16 can be supported by the second adjusting member 154, or the first adjusting member 153 and the second adjusting member 154 can be coordinated and adjusted until the imprinted color of the pressure-sensitive paper is uniform and the lower pressing surface of the pressure head 18 is consistent with the imprint of the pressure-sensitive paper.

[0059] S2, main pressure correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 and the second product on the glass platform 31 of the second product platform mechanism 3 are aligned and corrected; specifically, regarding step S2: the marking points of the COF and the PCB can be aligned and corrected through multiple sets of image systems; such as using a camera to capture the images of the COF and the PCB, and grabbing their marking points, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to perform position compensation, and the COF and the PCB are aligned and corrected.

[0060] S3, the product is in place; the second product platform mechanism 3 moves toward the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0061] S4, main pressing: the winding mechanism 5 moves downward toward the pressing platform 42, the pressing head 18 presses downward toward the pressing platform 42, and rises after maintaining the pressure for a set period of time, and the winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released from the winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB and scalding the PCB when pressing at high temperature. The winding mechanism 5 is protected by the buffer material and moves up and down at the same frequency as the pressing head 18, which can protect the PCB while preventing interference with other mechanisms.

[0062] S5, post-pressing handover: the longitudinal adjustment slider 3134 drives the bracket to extend toward the pressing platform 42 to support the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slider 44 to lift the first product on the pressing platform 42 upward, and at the same time, the second product platform mechanism 3 drives the longitudinal adjustment slider 3134 and the adjustment mounting plate 3131 to move upward to the same height; specifically, the adjustment mounting plate 3131 drives the adjustment mounting block 3133 to extend toward the pressing platform 42 via the longitudinal adjustment slider 3134. At the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing platform 42 upward via the lifting slider 44, and the adjustment mounting plate 3131 is reset via the longitudinal adjustment slider 3134; specifically, regarding step S5: after completing the bonding of the single-sided PCB and the COF, it is necessary to transfer part of the PCB on the pressing platform 42 to the glass platform 31 for the next step or unloading. After the glass platform 31 receives the finished product, the suction cups of the adsorption part 312 are all opened to prevent the finished product from falling.

[0063] S6. Move out after handover; the lifting rod 43 drives the lifting slider 44 to move downward, and the adjusting mounting plate 3131 keeps supporting the first product; the second product platform mechanism 3 is moved out from the hot pressing workstation, and the first finished product obtained after the first product and the second product are bonded into one is moved out synchronously.

[0064] S7, the second product platform mechanism 3 drives the first finished product to switch to the next pressing head unit and the hot pressing station corresponding to the first product platform mechanism 4.

[0065] S8. The glass platform driving unit 32 drives the glass platform 31 to rotate the set angle so that the next bonding side of the second product faces the pressing table 42 of the first product platform mechanism 4 where the PCB to be bonded is located; then repeat steps S2-S6 once.

[0066] S9. Repeat steps S7-S8 at least once. The number of repetitions is equal to the number of sides of the PCB on the second product, so that all the PCBs that need to be bonded on the second product are bonded.

[0067] S10: The bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjustment slider 3134 drives the adjustment mounting plate 3131 to reset. In the above embodiments, the description of each embodiment has its own emphasis. For parts not described in detail in one embodiment, please refer to the relevant description of other embodiments.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0069] The above description is a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed by the present invention, and such modifications or substitutions should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A dual-head pressing device for hot pressing a single or multiple first products to a second product, characterized by: The invention comprises a bracket (6), wherein the bracket (6) is provided with at least two pressing head units, a tape reeling mechanism (5), a first product platform mechanism (4) corresponding to the pressing head units, and a second product platform mechanism; the tape reeling mechanism (5) moves synchronously with the pressing head unit; the first product platform mechanism (4) comprises a pressing table (42) and a first product carrying area, the first product is carried on the first product carrying area and the bonding area of ​​the first product is located on the pressing table (42); the first product platform mechanism (4) moves to a hot pressing station so that the pressing table (42) is located directly below the pressing head unit; the second product platform mechanism (3) The second product is carried and switched to the hot pressing station, and the bonding area of ​​the second product is transferred to the pressing table (42); the tape winding mechanism (5) releases the buffer material, and the buffer material passes through the area between the bottom of the pressure head unit and the top of the first product and the second product; the multiple pressure head units and the first product platform mechanism (4) can choose to cooperate with the second product platform mechanism (3) to perform the bonding action, or switch alternately, and the second product platform mechanism (3) transfers the second product to the corresponding hot pressing station to switch for bonding action, or cooperates with the second product platform mechanism (3) to perform the bonding action at the same time.

2. The double-head pressing device according to claim 1, characterized in that: The pressure head unit includes a pressure head assembly, a pressure head driving part (11) for driving the pressure head assembly to move vertically, and a pressure head connecting part connecting the pressure head assembly to the pressure head driving part (11); the pressure head assembly is slidably connected to the guide rail on the bracket (6) through a pressure head slider (111); the pressure head connecting part includes a slider connecting plate (12) fixedly connected to the pressure head slider (111), and an oil filling port (121) is provided on the slider connecting plate (12) on the side where the operating area of ​​the dual pressure head pressure device is located, the oil filling port (121) is fully exposed to the operating area, and the oil filling port (121) is connected to the oil inlet (112) of the pressure head slider (111) through an oil pipe.

3. The double-head pressing device according to claim 2, characterized in that: The pressure head assembly includes a pressure head (18) and a horizontal adjustment part for adjusting the horizontality of the lower pressure surface of the pressure head (18); the horizontal adjustment part includes a first heat insulation board (13), wherein a plurality of first air paths are transversely opened in the first heat insulation board (13), and the head end and the tail end of the first air path are respectively connected to a first air inlet (131) and a first air outlet (132); a second heat insulation board (14) is provided below the first heat insulation board (13), and the second heat insulation board (14) is embedded with evenly distributed pads; a horizontal adjustment block (15) is fixed below the second heat insulation board (14), and a plurality of rows of second air paths are transversely passed through the horizontal adjustment block (15), and a second air inlet (151) and a second air outlet (152) are provided at the rear of the horizontal adjustment block (15), which are respectively connected to the head end and the tail end of the second air path.

4. The double-head pressing device according to claim 3, characterized in that: The horizontal adjustment portion includes a plurality of first adjustment members (153) and second adjustment members (154), the first adjustment members (153) and the second adjustment members (154) simultaneously passing through the first heat insulation board (13), the second heat insulation board (14), and the horizontal adjustment block (15), the first adjustment member (153) partially penetrates into the heating block (16) located below the horizontal adjustment block (15), and the lower end portion of the second adjustment member (154) abuts against the end surface of the heating block (16) facing the horizontal adjustment block (15).

5. The double-head pressing device according to claim 4, characterized in that: The heating blocks (16) are provided in plurality at least on the front section, the interruption section and the rear section of the pressure head (18), and each heating block (16) is provided with a plurality of heating tubes (161) arranged side by side along the length direction of the heating block (16) and arranged perpendicularly to the length direction of the heating block (16). The temperatures of the front section, the interruption section and the rear section of the pressure head (18) are independently controllable.

6. The double-head pressing device according to claim 5, characterized in that: The second product platform mechanism (3) comprises a glass platform (31) and a glass platform driving unit (32) for driving the glass platform (31) to perform lateral, longitudinal, vertical and rotational movements; the glass platform (31) is divided into a glass support area (311), a plurality of groups of first product support assemblies (3141) and a second product support assembly (315); each group of the first product support assemblies (3141) comprises a main support assembly and an auxiliary support assembly; the main support assembly is connected to the second product support assembly (315); the glass support area (311), the first product support assembly (3141) and the second product support assembly (315) are all provided with a plurality of adsorption portions (312); the auxiliary support assemblies are symmetrically arranged on both sides of the glass support area (311).

7. The double-head pressing device according to claim 6, characterized in that: The main support assembly comprises a longitudinal adjustment slider (3134) and a bracket; the second product support assembly (315) comprises a second product support block, which is fixed on the bracket; and the auxiliary support assembly comprises a support plate, which is connected to the glass platform (31) via a transverse adjustment slider.

8. The double-head pressing device according to claim 7, characterized in that: The first product platform mechanism (4) includes a first product platform support plate (41), a first product platform driving unit (47) is provided below the first product platform support plate (41), a test area is provided on the first product platform support plate (41), and the test area is located in front of the pressing platform (42); the test area includes a fixed column (45) fixed on the first product platform support plate (41), and the fixed column (45) is fixed to the pressure-sensing platform (46); a lifting part is provided at the rear of the pressing platform (42); the lifting part includes a lifting slider (44) and a lifting rod (43) fixed on the lifting slider (44).

9. The double-head pressing device according to claim 8, characterized in that: The upper surface of the pressure-sensing platform (46), the upper surface of the pressing platform (42), and the upper surface of the glass platform (31) are at the same level.

10. A double-head pressing method, characterized in that: Using the double-head pressing device according to any one of claims 1 to 9 comprises the following steps: S1, adjust the levelness of the pressure head (18); S2, pressure correction: the first product platform mechanism (4) and the second product platform mechanism (3) are moved to the hot pressing station; the first product on the pressing platform (42) of the first product platform mechanism (4) and the second product on the glass platform (31) of the second product platform mechanism (3) are aligned and corrected; S3, product in place: the second product platform mechanism (3) moves toward the pressing table (42), so that the hot pressing areas of the first product and the second product are both located on the pressing table (42); S4, current pressure: the belt winding mechanism (5) moves downward toward the pressing platform (42), the pressing head (18) presses downward toward the pressing platform (42), and rises after maintaining the pressure for a set period of time, and the belt winding mechanism (5) moves upward; S5, post-pressing handover: the longitudinal adjustment slider (3134) drives the bracket to extend toward the pressing platform (42) to support the first product; the lifting rod (43) of the first product platform mechanism (4) drives the lifting slider (44) to lift the first product on the pressing platform (42) upwards, and at the same time, the glass platform driving unit (32) drives the longitudinal adjustment slider (3134) and the adjustment mounting plate (3131) to move upwards to the same height synchronously; S6. Moving out after handover: the lifting rod (43) drives the lifting slider (44) to move downward, and the adjustment mounting plate (3131) continues to support the first product; the second product platform mechanism (3) is moved out of the hot pressing workstation, and the first finished product obtained by bonding the first product and the second product into one is simultaneously moved out; S7, transferring the first finished product after bonding from the second product platform mechanism (3) to the subsequent process, and the longitudinal adjustment slider (3134) drives the adjustment mounting plate (3131) to reset.

11. The double-head pressing method according to claim 10, characterized in that: The step S6 includes the following steps: S6A: After the first product platform mechanism (4) drives the first finished product to switch to the next pressing head unit and the hot pressing station corresponding to the first product platform mechanism (4), steps S2-S6 are executed.

12. The double-head pressing method according to claim 11, wherein: The step S6A further includes the second product platform mechanism (3) driving the glass platform (31) to rotate at a set angle so that the side of the second product to be bonded faces the pressing platform (42).

13. The double-head pressing method according to claim 12, wherein: Step S6A is repeated at least once.

Images