Resin composition, prepreg, circuit board and printed circuit board

Abstract

The invention relates to a resin composition, a prepreg, a circuit substrate and a printed circuit board. The resin composition comprises first bismaleimide, second bismaleimide, a vinyl compound and a filler, wherein the structural formula of the first bismaleimide is shown as a formula (1), the structural formula of the second bismaleimide is shown as a formula (2), and the weight-average molecular weight of the vinyl compound is 1t; 20000, and the two ends of the molecular chain of the vinyl compound have at least two vinyl groups in total. The circuit substrate prepared from the resin composition provided by the invention has low thermal expansion coefficient and excellent dielectric property, and can meet more application scenes when being used for a printed circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic industry, and in particular to a resin composition, a prepreg, a circuit substrate and a printed circuit board. Background Art

[0002] As electronic information products evolve towards miniaturization and higher performance, higher requirements are placed on various aspects of circuit substrate performance. This is particularly true for high-performance printed circuit boards (PCBs), where substrates are required to have a lower coefficient of thermal expansion (X / Y-CTE) while also maintaining good dielectric properties to meet the demands of high-density interconnects and integrated packaging. However, existing circuit substrates struggle to achieve both a low coefficient of thermal expansion and excellent dielectric properties, limiting the application of PCBs. Summary of the Invention

[0003] Based on this, it is necessary to provide a resin composition, a prepreg, a circuit substrate and a printed circuit board to address the above problems. The circuit substrate made from the resin composition provided by the present invention has a low thermal expansion coefficient and excellent dielectric properties, and can be used for printed circuit boards to meet more application scenarios.

[0004] A resin composition comprising a first bismaleimide, a second bismaleimide, a vinyl compound and a filler; wherein the structural formula of the first bismaleimide is as shown in formula (1), In formula (1), X and Y are each independently selected from

[0005] or R is selected from ether bonds, or And R1~R 10 Each independently selected from -H or C1~C 12 The structural formula of the second bismaleimide is shown in formula (2), In formula (2), R' is selected from C 10 ~C 60 the weight average molecular weight of the vinyl compound is <20,000, and the molecular chain of the vinyl compound has at least two vinyl groups at both ends.

[0006] In one embodiment, the content of carbon atoms in the rigid structure of the first bismaleimide accounts for more than 50% of the content of carbon atoms in the overall structure of the first bismaleimide.

[0007] In one embodiment, the first bismaleimide has at least two benzene ring structures.

[0008] In one embodiment, the R′ contains at least one of an aliphatic ring and an aromatic ring, and the unsaturation degree of the R′ is ≤5.

[0009] In one embodiment, the vinyl compound includes a first vinyl compound and / or a second vinyl compound, wherein the main chain length of the first vinyl compound is ≤30, and the main chain length of the second vinyl compound is >50.

[0010] In one embodiment, the vinyl compound includes a first vinyl compound and a second vinyl compound.

[0011] In one embodiment, the mass ratio of the first vinyl compound to the second vinyl compound is 1:10 to 10:1.

[0012] In one embodiment, the first vinyl compound is selected from at least one of p-vinylbenzene, p-ethylvinylbenzene, trivinylbenzene, triallyl isocyanurate, P,P'-divinyl-1,2-diphenylethane, divinyl sulfoxide and trivinylsilane;

[0013] And / or, the second vinyl compound is at least one selected from polybutadiene, polybutadiene-styrene, polybutadiene-parastyrene and polydivinylbenzene.

[0014] In one embodiment, based on 100 parts by weight of the total weight of the first bismaleimide and the second bismaleimide, the amount of the vinyl compound is 5 to 100 parts by weight, and the amount of the filler is 200 to 800 parts by weight, wherein the mass ratio of the first bismaleimide to the second bismaleimide is 1:1 to 10:1.

[0015] In one embodiment, the resin composition further comprises a cyanate ester resin, and the molecular chain of the cyanate ester resin has at least three cyanate groups.

[0016] In one embodiment, the cyanate resin is selected from at least one of the compounds represented by formula (3), formula (4), formula (5) and formula (6).

[0017]

[0018] Wherein, Z1 to Z4 are each independently selected from or And R 11 ~R 20 Independently selected from -H or C1~C 12Alkyl, 2≤a≤30, 2≤b≤30, 2≤c≤30, 2≤d≤30.

[0019] In one embodiment, based on 100 parts by weight of the first bismaleimide and the second bismaleimide, the added amount of the cyanate ester resin is 60 parts by weight to 300 parts by weight.

[0020] A prepreg made from the resin composition described above.

[0021] A circuit substrate made of the prepreg described above.

[0022] A printed circuit board made of the circuit substrate described above.

[0023] In above-mentioned resin combination, the compatibility between the first bismaleimide with special structure, the second bismaleimide resin and vinyl compound is better, the cross-linking density of resin combination is higher, effectively reduces the thermal expansion coefficient (X / Y-CTE) of the circuit substrate obtained, and reduces the dielectric loss of circuit substrate, so that circuit substrate has excellent dielectric properties. Therefore, the circuit substrate obtained by the resin combination provided by the present invention is used to meet the needs of more use scenes in printed circuit board, with higher market application potential. DETAILED DESCRIPTION

[0024] To facilitate understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments or embodiments and are not intended to limit the present invention. The optional scope of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of related listed items, including any two related listed items, any more related listed items, or the combination of all related listed items.

[0026] The resin composition provided by the present invention comprises a first bismaleimide, a second bismaleimide, a vinyl compound and a filler; wherein the structural formula of the first bismaleimide is as shown in formula (1), In formula (1), X and Y are each independently selected from

[0027] or R is selected from ether bonds, or And R1~R 10 Each independently selected from -H or C1~C 12 The structural formula of the second bismaleimide is shown in formula (2), In formula (2), R' is selected from C 10 ~C 60 the weight average molecular weight of the vinyl compound is <20,000, and the molecular chain of the vinyl compound has at least two vinyl groups at both ends.

[0028] In the above-mentioned resin composition, the compatibility between the first bismaleimide, the second bismaleimide resin and the vinyl compound with a special structure is good, and the crosslinking density of the resin composition is high, which effectively reduces the thermal expansion coefficient (X / Y-CTE) of the circuit substrate obtained, and reduces the dielectric loss of the circuit substrate, so that the circuit substrate has excellent dielectric properties. In one embodiment, the content of carbon atoms in the rigid structure of the first bismaleimide accounts for more than 50% of the content of carbon atoms in the overall structure of the first bismaleimide, thereby facilitating reducing the thermal expansion coefficient of the circuit substrate obtained from the resin composition while taking into account the toughness of the circuit substrate.

[0029] In order to further reduce the thermal expansion coefficient of the circuit substrate made from the resin composition, the carbon atom content in the rigid structure of the first bismaleimide preferably accounts for more than 70% of the carbon atom content in the overall structure of the first bismaleimide.

[0030] It should be noted that the rigid structure of the present invention includes cyclic structures such as aromatic rings, aliphatic rings, and carbon rings containing heteroatoms. Specifically, the rigid structure of the first bismaleimide is represented by and cyclic structures such as bismaleimide.

[0031] In one embodiment, the first bismaleimide has at least two benzene ring structures. The benzene ring has strong rigidity, which is beneficial for further reducing the thermal expansion coefficient of the prepared circuit substrate while ensuring the toughness of the circuit substrate.

[0032] In one embodiment, the R′ contains at least one of an aliphatic ring and an aromatic ring, and the unsaturation degree of the R′ is ≤5, which can effectively reduce the thermal expansion coefficient of the prepared circuit substrate and ensure the molecular freedom of the second bismaleimide, thereby effectively improving the compatibility between the first bismaleimide and the vinyl compound, and further improving the thermal expansion coefficient and dielectric properties of the circuit substrate.

[0033] It is understandable that the aliphatic ring in the above hydrocarbon group can be selected from at least one of a three-membered carbon ring, a five-membered carbon ring or a six-membered carbon ring, and the aromatic ring in the above hydrocarbon group can be selected from at least one of a phenyl group, a naphthyl group, an anthracenyl group, a phenanthrenyl group or a condensed ring group with aromaticity.

[0034] In one embodiment, the vinyl compound includes a first vinyl compound and / or a second vinyl compound, wherein the main chain length of the first vinyl compound is ≤30, and the main chain length of the second vinyl compound is >50. The first vinyl compound with a shorter chain length can increase the crosslinking density of the resin composition, thereby reducing the thermal expansion coefficient of the circuit substrate and improving the dielectric properties. The second vinyl compound with a longer chain length can improve the toughness of the circuit substrate while ensuring the dielectric properties, further reducing the thermal expansion coefficient of the circuit substrate.

[0035] It should be noted that the chain length of the main chain of the vinyl compound refers to the number of carbon atoms and heteroatoms in the molecular chain of the vinyl compound with two or more vinyl groups connected at both ends, and does not include the chain length of the side chain; the vinyl compound may contain heteroatoms or not, and the present invention does not limit this.

[0036] In order to further achieve low thermal expansion and excellent dielectric properties of the circuit substrate, the vinyl compound preferably includes a first vinyl compound and a second vinyl compound.

[0037] More preferably, the mass ratio of the first bismaleimide to the second bismaleimide is 1:1 to 10:1, which is beneficial for improving the toughness of the circuit substrate, reducing the thermal expansion of the circuit substrate, and improving the compatibility with the vinyl compound, thereby reducing the dielectric loss of the circuit substrate, so that the circuit substrate has excellent dielectric properties.

[0038] Specifically, the first vinyl compound is at least one selected from p-m-vinylbenzene, p-ethylvinylbenzene, trivinylbenzene, triallyl isocyanurate, P,P'-divinyl-1,2-diphenylethane, divinyl sulfoxide and trivinylsilane.

[0039] Specifically, the second vinyl compound is at least one selected from polybutadiene, polybutadiene-styrene, polybutadiene-parastyrene and polydivinylbenzene.

[0040] It is understood that the main chain length of the polybutadiene, polybutadiene-styrene, polybutadiene-parastyrene and polydivinylbenzene is greater than 50.

[0041] In one embodiment, based on the total weight of the first bismaleimide and the second bismaleimide as 100 parts, the amount of the vinyl compound is 5 parts by weight to 100 parts by weight, and the amount of the filler is 200 parts by weight to 800 parts by weight, wherein the mass ratio of the first bismaleimide to the second bismaleimide is 1:1 to 10:1. By limiting the ratio of the first bismaleimide to the second bismaleimide, the circuit substrate further has a low thermal expansion coefficient, excellent dielectric properties and toughness.

[0042] In one embodiment, the resin composition further includes a cyanate ester resin, wherein the molecular chain of the cyanate ester resin has at least three cyanate ester groups, so that the rigid structure in the molecular chain of the cyanate ester resin is tighter, and is beneficial to increasing the crosslinking density of the resin composition, thereby reducing the thermal expansion coefficient of the circuit substrate made of the resin composition.

[0043] Preferably, the cyanate resin is selected from at least one of the compounds represented by formula (3), formula (4), formula (5) and formula (6).

[0044]

[0045] Wherein, Z1 to Z4 are each independently selected from or And R 11 ~R 20 Independently selected from -H or C1~C 12 The alkyl group has 2≤a≤30, 2≤b≤30, 2≤c≤30, and 2≤d≤30, thereby further reducing the thermal expansion coefficient of the circuit substrate prepared from the resin composition.

[0046] In one embodiment, the weight average molecular weight of the cyanate ester resin is 500 to 5000, which ensures the chain length of the rigid structure in the cyanate ester resin molecular chain and has good compatibility with other resins, thereby further reducing the thermal expansion coefficient of the circuit substrate made from the resin composition.

[0047] In one embodiment, the cyanate resin is at least one selected from the group consisting of phenolic cyanate resin, naphthol cyanate resin, biphenyl cyanate resin, naphthalene cyanate resin, and dicyclopentadiene cyanate resin.

[0048] In one embodiment, based on 100 parts by weight of the first bismaleimide and the second bismaleimide, the added amount of the cyanate ester resin is 60 parts by weight to 300 parts by weight.

[0049] It should be noted that the fillers are commonly used in the industry, and those skilled in the art can select them according to their needs, and the present invention does not limit this.

[0050] In one embodiment, the resin composition further comprises at least one of a catalyst, a coupling agent, and a flame retardant.

[0051] It should be noted that the above-mentioned catalysts, coupling agents and flame retardants are all commonly used additives in the industry. Those skilled in the art can select them according to their needs, and the present invention does not limit them.

[0052] In one embodiment, the resin composition further comprises a solvent, and the solvent is selected from at least one of acetone, butanone, propylene glycol methyl ether, and propylene glycol methyl ether acetate.

[0053] The present invention also provides a prepreg made from the resin composition.

[0054] It should be noted that the prepreg in the present invention can be produced using existing methods, which are not limited in the present invention. Preferably, the resin composition is mixed evenly, impregnated or coated onto a reinforcing material, and then dried in an oven at 120°C to 180°C for 1.5 to 6 minutes to produce the prepreg. The reinforcing material is preferably at least one of glass fiber cloth, aramid cloth, and carbon fiber cloth.

[0055] The present invention also provides a circuit substrate made of the prepreg, which has a low thermal expansion coefficient and excellent dielectric properties.

[0056] Specifically, the circuit substrate includes an insulating layer and a conductive layer arranged on at least one surface of the insulating layer, wherein the insulating layer is pressed from one or more superimposed semi-cured sheets as described above, and the conductive layer is selected from conductive materials such as copper foil and aluminum foil, and the present invention does not limit this.

[0057] The present invention also provides a printed circuit board made of the circuit substrate described above, which can meet the needs of more usage scenarios and has high market application potential.

[0058] Specifically, the printed circuit board is made from the circuit substrate through processes such as drilling, hole filling, micro-etching, pre-preg, activation, acceleration, chemical copper and copper thickening.

[0059] Hereinafter, the resin composition, prepreg, circuit substrate and printed circuit board will be further described through the following specific examples.

[0060] Example 1

[0061] 15 parts of a first maleimide resin (structural formula as shown in Formula 1-1, the content of carbon atoms in the rigid structure accounts for 53%), 10 parts of a second bismaleimide resin (structural formula as shown in Formula 2-1, the unsaturation degree of the alkylene group is 1), 10 parts of a first vinyl compound (triallyl isocyanurate-TAIC, weight average molecular weight = 249, main chain length = 9), 10 parts of a second vinyl compound (structural formula as shown in Formula 7, weight average molecular weight = 1950, main chain length = 60), 55 parts of a cyanate resin (phenolic cyanate, structural formula as shown in Formula 3-1, weight average molecular weight = 800), 0.03 parts of diethyltetramethylimidazole and 150 parts of silicon dioxide are added to a butanone solvent and stirred uniformly to form a resin composition.

[0062]

[0063] The glass fabric was immersed in the above resin composition and heated in an oven at 180°C for 3 minutes to obtain a prepreg. Four prepregs were stacked, each with a copper foil attached to the outer layer, and cured and pressed in a high-temperature press at 220°C for 3 hours to obtain a circuit substrate.

[0064] Example 2

[0065] 12 parts of a first maleimide resin (structural formula as shown in Formula 1-2, carbon atom content in the rigid structure = 87%), 10 parts of a second bismaleimide resin (structural formula as shown in Formula 2-2, unsaturation degree of the alkylene group = 4), 4 parts of a first vinyl compound (divinylbenzene, weight average molecular weight = 130, main chain length = 8), 10 parts of a second vinyl compound (polybutadiene-divinylbenzene, weight average molecular weight = 1000, main chain length = 58), 54 parts of a cyanate resin (naphthol-type cyanate, structural formula as shown in Formula 5-1, weight average molecular weight = 750), 0.03 parts of diethyltetramethylimidazole and 150 parts of boron nitride are added to a butanone solvent and stirred to form a resin composition.

[0066]

[0067]

[0068] The glass fabric was immersed in the above resin composition and heated in an oven at 180°C for 3 minutes to obtain a prepreg. Four prepregs were stacked, each with a copper foil attached to the outer layer, and cured and pressed in a high-temperature press at 220°C for 3 hours to obtain a circuit substrate.

[0069] Example 3

[0070] 20 parts of a first maleimide resin (structural formula as shown in Formula 1-3, the content of carbon atoms in the rigid structure accounts for 77%), 5 parts of a second bismaleimide resin (structural formula as shown in Formula 2-3, the unsaturation degree of the alkylene group is 3), 20 parts of a first vinyl compound (structural formula as shown in Formula 8, weight average molecular weight = 234, main chain length = 14), 2.5 parts of a second vinyl compound (polydivinylbenzene, weight average molecular weight = 1200, main chain length = 75), 52.5 parts of a cyanate resin (dicyclopentadiene type cyanate, structural formula as shown in Formula 3-2, weight average molecular weight = 1000), 0.03 parts of diethyltetramethylimidazole and 150 parts of talc are added to a butanone solvent and stirred uniformly to form a resin composition.

[0071]

[0072] The glass fabric was immersed in the above resin composition and heated in an oven at 180°C for 3 minutes to obtain a prepreg. Four prepregs were stacked, each with a copper foil attached to the outer layer, and cured and pressed in a high-temperature press at 220°C for 3 hours to obtain a circuit substrate.

[0073] Example 4

[0074] The difference between Example 4 and Example 1 is that the structural formula of the first maleimide resin is as shown in Formula (1-4), and the content of carbon atoms in the rigid structure accounts for 44%.

[0075]

[0076] Example 5

[0077] The difference between Example 5 and Example 1 is that the structural formula of the first maleimide resin is as shown in Formula (1-5), and the content of carbon atoms in the rigid structure accounts for 63%.

[0078]

[0079] Example 6

[0080] The difference between Example 6 and Example 1 is that the structural formula of the second maleimide resin is as shown in Formula (2-4), the unsaturation degree of the alkylene group is 0,

[0081] Example 7

[0082] The difference between Example 7 and Example 1 is that the structural formula of the second maleimide resin is as shown in Formula (2-5), the unsaturation degree of the alkylene group is 8,

[0083] Example 8

[0084] The difference between Example 8 and Example 1 is that 20 parts of the first vinyl compound (triallyl isocyanurate-TAIC, weight average molecular weight = 249, main chain length = 9) are used, and no second vinyl compound is added.

[0085] Example 9

[0086] The difference between Example 9 and Example 1 is that 20 parts of the second vinyl compound (structural formula is as shown in Formula 7, weight average molecular weight = 1950, main chain length = 60) are used, and the first vinyl compound is not added.

[0087] Example 10

[0088] The difference between Example 10 and Example 1 is that 5 parts of a first maleimide resin (structural formula as shown in Formula 1-1, the content of carbon atoms in the rigid structure = 53%) and 20 parts of a second bismaleimide resin (structural formula as shown in Formula 2-1, the unsaturation of the alkylene group = 1) are used.

[0089] Example 11

[0090] The difference between Example 11 and Example 1 is that 23 parts of a first maleimide resin (structural formula as shown in Formula 1-1, the content of carbon atoms in the rigid structure = 53%) and 2 parts of a second bismaleimide resin (structural formula as shown in Formula 2-1, the unsaturation of the alkylene group = 1) are used.

[0091] Example 12

[0092] The difference between Example 12 and Example 1 is that cyanate resin and diethyltetramethylimidazole are not added.

[0093] Example 13

[0094] The difference between Example 13 and Example 1 is that the structural formula of the cyanate resin is as shown in Formula (9), the weight average molecular weight is 306, and no diethyltetramethylimidazole is added.

[0095] Comparative Example 1

[0096] The difference between Comparative Example 1 and Example 1 is that the structural formula of the first bismaleimide is shown in Formula (10), the content of carbon atoms in the rigid structure accounts for 100%,

[0097]

[0098] Comparative Example 2

[0099] The difference between Comparative Example 2 and Example 1 is that the structural formula of the second bismaleimide is as shown in Formula (11),

[0100] Comparative Example 3

[0101] The difference between Comparative Example 3 and Example 1 is that 20 parts of a polybutadiene compound (structural formula shown in Formula 12, weight average molecular weight = 336, main chain length = 24) are used to replace the first vinyl compound and the second vinyl compound.

[0102] Comparative Example 4

[0103] The difference between Comparative Example 4 and Example 1 is that 20 parts of polydivinylbenzene (weight average molecular weight = 20800, main chain length = 1280) are used to replace the first vinyl compound and the second vinyl compound.

[0104] Comparative Example 5

[0105] The difference between Comparative Example 5 and Example 1 is that the first bismaleimide is not added.

[0106] Comparative Example 6

[0107] The difference between Comparative Example 6 and Example 1 is that the second bismaleimide is not added.

[0108] Comparative Example 7

[0109] The difference between Comparative Example 7 and Example 1 is that the first vinyl compound and the second vinyl compound are not added.

[0110] Performance tests were conducted on the circuit substrates prepared in all embodiments and comparative examples. The test indicators and test methods are as follows:

[0111] (1) Coefficient of thermal expansion (CTE): Tested in accordance with IPC-TM-650 2.4.24.

[0112] (2) Dielectric loss (Df): Tested in accordance with IEC-61189-721-2015.

[0113] (3) Flexural modulus: Tested in accordance with IPC-TM-650 2.4.4.

[0114] The performance test results of all embodiments and comparative examples are shown in Table 1.

[0115] Table 1

[0116]

[0117]

[0118] As can be seen from the test results in the table, the thermal expansion coefficient of the circuit substrates produced in all embodiments of the present invention is ≤8.9, and the dielectric loss is ≤0.0040. In addition, the flexural modulus reaches above 28.1. Therefore, the circuit substrate provided by the present invention has a low thermal expansion coefficient and excellent dielectric properties. In addition, it also has good toughness. The printed circuit boards produced therefrom can meet the needs of more usage scenarios and have high market application potential.

[0119] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0120] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A resin composition, characterized in that The resin composition comprises a first bismaleimide, a second bismaleimide, a vinyl compound and a filler; Wherein, the structural formula of the first bismaleimide is as shown in formula (1), In formula (1), X and Y are each independently selected from or R is selected from ether bonds, or And R1~R 10 Each independently selected from -H or C1~C 12 Alkyl; The structural formula of the second bismaleimide is shown in formula (2), In formula (2), R' is selected from C 10 ~C 60 alkylene; The weight average molecular weight of the vinyl compound <20000, and the molecular chain of the vinyl compound has at least two vinyl groups in total.

2. The resin composition according to claim 1, wherein The content of carbon atoms in the rigid structure of the first bismaleimide accounts for more than 50% of the content of carbon atoms in the overall structure of the first bismaleimide.

3. The resin composition according to claim 1, wherein The first bismaleimide has at least two benzene ring structures.

4. The resin composition according to claim 1, wherein The R' contains at least one of an aliphatic ring and an aromatic ring, and the unsaturation degree of the R' is ≤5.

5. The resin composition according to claim 1, wherein The vinyl compound includes a first vinyl compound and / or a second vinyl compound, wherein the main chain length of the first vinyl compound is ≤30, and the main chain length of the second vinyl compound is >50.

6. The resin composition according to claim 5, characterized in that The vinyl compound includes a first vinyl compound and a second vinyl compound.

7. The resin composition according to claim 6, characterized in that The mass ratio of the first vinyl compound to the second vinyl compound is 1:10 to 10:

1.

8. The resin composition according to claim 5, characterized in that The first vinyl compound is selected from at least one of p-m-vinylbenzene, p-ethylvinylbenzene, trivinylbenzene, triallyl isocyanurate, P,P'-divinyl-1,2-diphenylethane, divinyl sulfoxide and trivinylsilane; And / or, the second vinyl compound is at least one selected from polybutadiene, polybutadiene-styrene, polybutadiene-parastyrene and polydivinylbenzene.

9. The resin composition according to claim 1, characterized in that Based on 100 parts by weight of the total of the first bismaleimide and the second bismaleimide, the amount of the vinyl compound is 5 to 100 parts by weight, and the amount of the filler is 200 to 800 parts by weight, wherein the mass ratio of the first bismaleimide to the second bismaleimide is 1:1 to 10:

1.

10. The resin composition according to any one of claims 1 to 9, characterized in that The resin composition further includes a cyanate ester resin having at least three cyanate groups.

11. The resin composition according to claim 10, characterized in that The cyanate resin is selected from at least one of the compounds represented by formula (3), formula (4), formula (5) and formula (6), Wherein, Z1 to Z4 are each independently selected from or And R 11 ~R 20 Independently selected from -H or C1~C 12 Alkyl, 2≤a≤30, 2≤b≤30, 2≤c≤30, 2≤d≤30.

12. The resin composition according to claim 10, characterized in that Based on 100 parts by weight of the first bismaleimide and the second bismaleimide, the added amount of the cyanate ester resin is 60 parts by weight to 300 parts by weight.

13. A prepreg made from the resin composition according to any one of claims 1 to 12.

14. A circuit substrate made of the prepreg according to claim 13.

15. A printed circuit board manufactured using the circuit substrate according to claim 14.

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