COC chip pneumatic testing device and control method

Abstract

The invention discloses a COC chip pneumatic test device and a control method, and the device comprises a panel which is provided with a lifting mechanism at the bottom and is used for driving the panel to move vertically in a reciprocating manner; the supporting frame is arranged on the upper plate face of the panel, an air cylinder assembly is arranged on the supporting frame, the moving direction of the telescopic end of the air cylinder assembly is parallel to the lifting direction of the panel, and the telescopic end of the air cylinder assembly is connected with a probe; the limiting plate is arranged on the panel and used for fixing a product to be tested, and the vertical orthographic projection of the probe is completely located on the plate surface of the limiting plate. The panel is driven by the lifting mechanism, the probe is driven by the air cylinder assembly, the lifting mechanism and the air cylinder assembly move in the parallel direction, and therefore it is guaranteed that the probe is finally positioned accurately, the probe makes contact with a to-be-detected product in a stable pressure mode, it is guaranteed that the product cannot be crushed in the detection process, and the detection efficiency is improved. And the detection result is accurate and effective.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit and chip coupling testing, and in particular relates to a COC chip pneumatic testing device and a control method. Background Art

[0002] Before final packaging of integrated circuits, comprehensive circuit performance testing is performed on finished circuits according to test specifications to select qualified products. Spectral analysis uses the spectrum of a substance to identify its chemical composition and relative content, and its advantages are sensitivity and rapidity. Spectral analysis can be divided into emission spectroscopy and absorption spectroscopy based on the analytical principle. It can also be divided into atomic spectroscopy and molecular spectroscopy based on the form of the measured components. Spectral analysis involving atoms is called atomic spectroscopy, while molecular spectroscopy involves molecules.

[0003] Common chip testing equipment can only simulate a limited number of practical application scenarios, which reduces chip testing accuracy and increases product rejection rates. Specifically, manufacturers typically perform COC chip coupling tests using simple screw-locking devices. This method can easily damage the product, causing dents on the surface and reducing product yields.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] The present invention provides a COC chip pneumatic testing device, which drives the panel through a lifting mechanism and the probe through a cylinder assembly. The lifting mechanism and the cylinder assembly are displaced in parallel directions, thereby ensuring that the probe is finally accurately positioned, and then the probe is brought into contact with the product to be tested with stable pressure, ensuring that the product will not be crushed during the testing process, and the test results are accurate and effective.

[0006] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is: A COC chip pneumatic testing device, comprising: The panel is provided with a lifting mechanism at the bottom for driving the panel to move back and forth vertically; A support frame is provided on the upper surface of the panel, and a cylinder assembly is provided on the support frame. The moving direction of the telescopic end of the cylinder assembly is parallel to the lifting direction of the panel, and the telescopic end of the cylinder assembly is connected to a probe; The limiting plate is arranged on the panel and is used to fix the product to be tested. The vertical projection of the probe is completely on the plate surface of the limiting plate.

[0007] Furthermore, the limiting plate is provided with a limiting groove which is recessed downward from the plate surface thereof, and the vertical projection of the probe is located in the limiting groove.

[0008] Further, the cylinder assembly includes, The slide cylinder is arranged on the support frame; The pressure regulating valve is installed on the slide cylinder and is used to adjust the output pressure of the slide cylinder; The pneumatic reversing valve is installed on the panel and connected to the slide cylinder through the air pipe.

[0009] Furthermore, a cooling component is included for cooling the product to be tested fixed on the limiting plate; The cooling assembly includes: The water-passing plate is set on the panel, with water inlet and outlet holes at the front and rear ends respectively, and is connected to a water pipe to form a circulating water circuit; A semiconductor refrigeration plate is bonded to the top of the water-passing plate, and a metal electrode that can be electrically connected to the product to be tested is provided on the semiconductor refrigeration plate.

[0010] Furthermore, a pressing plate is provided on the top of the semiconductor refrigeration plate, and the pressing plate is fastened to the water-passing plate by bolts for pressing the semiconductor refrigeration plate.

[0011] Furthermore, the lifting mechanism includes: base; A fork frame is provided on the base, wherein the upper end of the fork frame is connected to the panel; The driving cylinder is arranged on the base or the panel, and is connected to the fork frame, and is used to drive the fork frame to make the panel move back and forth in the vertical direction.

[0012] A control method for a COC chip pneumatic test device as described above, wherein the COC chip pneumatic test device further comprises a pressure sensor disposed in a limiting plate and located on top of a probe, wherein the specific control steps include: The probe is driven to the preset position by the cylinder assembly, and the pressure sensor is used to detect the pressure value generated when the probe contacts the product to be tested in real time; Determine whether the obtained pressure value is within the preset pressure range to determine whether the pressure when the probe contacts the product to be tested is normal, so as to adjust the stroke of the cylinder assembly.

[0013] Furthermore, if the obtained pressure value is to the left of the endpoint value of the preset pressure range, it means that the stroke of the cylinder assembly is set too short, and it is necessary to stop testing and increase the preset stroke; if the obtained pressure value is to the right of the endpoint value of the preset pressure range, it means that the stroke of the cylinder assembly is set too long, and it is necessary to stop testing and reduce the preset stroke; if the obtained pressure value is within the preset pressure range, it means that the pressure when the probe contacts the product to be tested is normal, and testing should continue.

[0014] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: 1. The present invention drives the panel through a lifting mechanism and the probe through a cylinder assembly. The lifting mechanism and the cylinder assembly are displaced in parallel directions, thereby ensuring that the probe is finally accurately positioned, and then the probe is in contact with the product to be tested with stable pressure, ensuring that the product will not be crushed during the testing process, ensuring the appearance quality of the product, and the test results are accurate and effective.

[0015] 2. The present invention dissipates the heat generated by the product under test during the testing process by providing a water-passing plate and a semiconductor refrigeration plate through water cooling, thereby avoiding temperature runaway of the product under test during the testing process, causing the junction temperature to exceed the safety threshold, and causing thermal runaway, circuit performance degradation, or even physical damage.

[0016] 3. The present invention sets up a cylinder assembly, and configures a pressure regulating valve and a starting reversing valve in the slide cylinder, so as to effectively control the movement rate of the probe and the adjustment of the lifting mode, thereby ensuring that the probe can stably and effectively move to the preset position and contact with the product to be tested to achieve detection.

[0017] 4. The present invention uses a preset pressure sensor to detect the pressure value generated when the probe contacts the product to be tested in real time, and determines whether the obtained pressure value is within the preset pressure range, so as to determine whether the pressure when the probe contacts the product to be tested is normal, and adjust the stroke of the cylinder assembly, thereby providing effective feedback during testing of the entire test device.

[0018] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are part of the present invention and are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an undue limitation of the present invention. Obviously, the drawings described below are only some embodiments. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive effort. In the accompanying drawings: Figure 1 It is a right side view of the embodiment of the present invention; Figure 2 It is a left view of an embodiment of the present invention; Figure 3 Schematic diagram of the structure of the support frame and cooling assembly in an embodiment of the present invention; Figure 4 Schematic diagram of the structure of the cooling assembly in an embodiment of the present invention; Figure 5 is a flow chart in an embodiment of the present invention; Figure 6 Flowchart in an embodiment of the present invention.

[0020] Description of the main components in the figure: 1. Panel; 2. Support frame; 3. Cylinder assembly; 31. Slide cylinder; 32. Pneumatic reversing valve; 33. Pressure regulating valve; 4. Probe; 5. Cooling assembly; 51. Water flow plate; 52. Semiconductor refrigeration plate; 6. Lifting mechanism; 61. Drive cylinder; 62. Fork frame; 63. Base; 7. Limit plate; 8. Pressure plate.

[0021] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; and direct or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0025] like Figures 1 to 4 As shown, in the COC chip structure described in the present invention, the chip is connected to the carrier board through bonding (such as gold wire bonding, copper pillar bonding), flip-chip bonding, etc., to form an electrical or optical path. The core of coupling testing is verification. In existing coupling tests, the product under test needs to be fixed by a locking structure between the plates. The locking pressure generally depends entirely on the operator's experience and work habits, and it is difficult to achieve a precise and appropriate locking pressure to ensure that the product under test is not crushed or damaged.

[0026] In order to solve the above-mentioned defects, the following improvements are proposed: The present invention includes, The panel 1 is provided with a lifting mechanism 6 at the bottom thereof for driving the panel 1 to move back and forth vertically; A support frame 2 is provided on the upper surface of the panel 1. A cylinder assembly 3 is provided on the support frame 2. The moving direction of the telescopic end of the cylinder assembly 3 is parallel to the lifting direction of the panel 1. The telescopic end of the cylinder assembly 3 is connected to a probe 4. The limiting plate 7 is provided on the panel 1 and is used to fix the product to be tested. The vertical projection of the probe 4 is completely located on the surface of the limiting plate 7 .

[0027] In the present invention, the panel 1 is horizontally arranged, with pre-set fixing holes arranged at equal intervals on its surface. The bottom of the support frame 2 is provided with fixing plugs that match the spacing and size of the pre-set fixing holes. By plugging the fixing plugs of the support frame 2 into the fixing holes and locking them with locking bolts, quick assembly can be achieved. A lifting mechanism 6 is connected to the bottom of the panel 1 to enable the panel 1 to be raised or lowered in a controlled manner.

[0028] The support frame 2 is vertically arranged on the panel 1, with its top protruding to one side so that the overall stroke is approximately L-shaped. A cylinder assembly 3 is fixedly connected to the protruding end face by a locking bolt, and the telescopic end of the cylinder assembly 3 is connected to a probe 4 for detecting the product to be tested. The moving direction of the cylinder assembly 3 is always parallel to the lifting direction of the panel 1, ensuring that the displacement direction of the overall structure is on the same parallel line, that is, ensuring the accuracy of the probe 4 moving to the preset position. Specifically, an optical spherical analyzer is also provided on the working platform of the COC chip pneumatic testing device. By limiting the displacement directions of the panel 1 and the cylinder assembly 3 to be always parallel, it is ensured that after adjusting the preset position of the panel 1 and the preset working position of the probe 4, the optical spherical analyzer can detect the product to be tested on the probe 4, and its optical system captures the microscopic image of the connection between the probe 4 and the chip. Prevent inaccurate positioning due to deviation between the movement direction of the lifting mechanism 6 and the cylinder assembly 3, resulting in erroneous detection feedback.

[0029] The extension direction of the probe 4 is perpendicular to the surface of the panel 1. A limit plate 7 is also provided on the panel 1. In addition, the assembly and fixation of the limit plate 7 and the panel 1 also adopts the above-mentioned fixing method of the support frame 2 and the panel 1, which is fast to assemble and has wide adaptability.

[0030] Furthermore, the limiting plate 7 is provided with a limiting groove which is recessed downward from the plate surface thereof, and the vertical projection of the probe 4 is located in the limiting groove.

[0031] In the present invention, the limiting grooves on the limiting plate 7 can be matched to the size and shape of the specific product to be tested. During the specific operation, the product to be tested can be directly inserted into the preset limiting grooves, which quickly completes the fixation of the product to be tested. The size of the limiting grooves can completely cover the size of the probe 4, that is, ensure that the probe 4 can effectively contact the product to be tested after downward displacement.

[0032] Furthermore, the cylinder assembly 3 includes, The slide cylinder 31 is provided on the support frame 2; The pressure regulating valve 33 is provided on the slide cylinder 31 and is used to adjust the output pressure of the slide cylinder 31; The pneumatic reversing valve 32 is provided on the panel 1 and is connected to the slide cylinder 31 through an air pipe.

[0033] In the present invention, the base of the slide cylinder 31 is connected to the support frame 2, wherein the telescopic end of the slide cylinder 31 is vertically downward, and the end face of the telescopic end is provided with a mounting hole, and a probe clamping arm for fixing the probe 4 is provided in the mounting hole. The probe 4 is inserted into the clamping arm and fixed, thereby ensuring the verticality of the probe 4. A pressure regulating valve 33 is also provided on the slide cylinder 31, so as to ensure differentiated pressure control when the probe 4 needs to be precisely positioned. In actual operation, the air pressure value in the slide cylinder can be set accordingly according to the output and detection efficiency requirements of the entire production line, thereby effectively controlling the speed of the cylinder's telescopic movement.

[0034] In addition, a pneumatic reversing valve 32 is installed in the slide cylinder 31, which can be manually controlled. The operator can freely adjust the rise and fall of the slide cylinder 31 by turning the adjustment lever. Furthermore, to achieve fully automated production operations, an electromagnetic pneumatic reversing valve 32 can be installed to set the switching frequency for free control, effectively freeing up labor.

[0035] Furthermore, a cooling assembly 5 is included for cooling the product to be tested fixed on the limiting plate 7; The cooling assembly 5 includes: The water-passing plate 51 is provided on the panel 1, and is provided with a water inlet and a water outlet at the front and rear ends respectively, and is connected to a water pipe to form a circulating water circuit; A semiconductor refrigeration plate 52 is bonded to the top of the water-passing plate 51 , and a metal electrode that can be electrically connected to the product to be tested is provided on the semiconductor refrigeration plate 52 .

[0036] In the present invention, a water-passing plate 51 is provided directly below the limiting plate 7, and the assembly and fixing method is the same as the installation method of the support frame 2 described above. The water-passing plate 51 has a water-passing chamber inside, and water inlet holes and water outlet holes are provided at the front and rear ends of the water-passing chamber, and a circulating water path is formed by a water pipe. Among them, the interface between the water inlet and the water outlet is wrapped with raw tape or a silicone sealing ring, and then the water pipe is connected with a quick-tightening joint, a pagoda joint, etc. In addition, a water pump is connected to the water inlet, and the water outlet can be connected to a water tank or a radiator to enhance the heat dissipation efficiency.

[0037] A semiconductor refrigeration plate 52 is bonded to the top of the water-passing plate 51 using thermally conductive silicone. Specifically, a TEC semiconductor refrigeration plate 52 is used. The hot end of the TEC semiconductor refrigeration plate 52 and the contact surface with the water-passing plate 51 are polished as much as possible to ensure a smooth surface, thereby reducing the contact gap between the two and lowering the contact thermal resistance. In addition, the TEC semiconductor refrigeration plate 52 is provided with a metal electrode or metal wire that can be connected to the product to be tested. Thus, when the probe 4 detects the product to be tested, an electrical circuit can be formed to ensure the normal progress of the test. The product to be tested is cooled by water cooling to avoid temperature runaway of the product to be tested during the test process, which may cause the junction temperature to exceed the safety threshold, leading to thermal runaway, circuit performance degradation, or even physical damage.

[0038] Furthermore, a pressing plate 8 is provided on the top of the semiconductor refrigeration plate 52 , and the pressing plate 8 is fastened to the water-passing plate 51 by bolts to press the semiconductor refrigeration plate 52 .

[0039] In the present invention, a pressure plate 8 and a water-passing plate 51 are respectively disposed above and below the semiconductor cooling plate 52. The four corners of the pressure plate 8 and the water-passing plate 51 are fastened together by bolts, effectively pressing the semiconductor cooling plate 52 between them. A stop plate 7 is positioned at the top of the pressure plate 8.

[0040] Furthermore, the lifting mechanism 6 includes: Base 63; A fork frame 62 is provided on the base 63, and the upper end of the fork frame 62 is connected to the panel 1; The driving cylinder 61 is provided on the base 63 or the panel 1 . The driving cylinder 61 is connected to the fork frame 62 and is used to drive the fork frame 62 to make the panel 1 move back and forth in the vertical direction.

[0041] In the present invention, a base 63 is positioned parallel to the ground relative to panel 1. A fork frame 62 is mounted on base 63. Specifically, fork frame 62 comprises a first connecting rod and a second connecting rod. The middle portion of the first connecting rod and the middle portion of the second connecting rod are rotatably connected. One end of the first connecting rod is rotatably connected to base 63, and the other end is slidably connected to panel 1. The second connecting rod has one end slidably connected to base 63, and the other end is rotatably connected to panel 1. For example, in the case of a drive cylinder 61 mounted on base 63, pushing the second connecting rod causes the first and second connecting rods to rotate and slide, thereby driving panel 1 to rise or fall stably.

[0042] refer to Figure 5-Figure 6 The present invention also provides a control method for the COC chip pneumatic test device according to any of the above embodiments. The COC chip pneumatic test device further comprises a pressure sensor disposed in the limiting plate 7 and located on the top of the probe 4. The specific control steps include: The cylinder assembly 3 drives the probe 4 to a preset position, and the pressure sensor is used to detect the pressure value generated when the probe 4 contacts the product to be tested in real time; It is determined whether the obtained pressure value is within a preset pressure range to determine whether the pressure when the probe 4 contacts the product to be tested is normal, so as to adjust the stroke of the cylinder assembly 3 .

[0043] In the present invention, a pressure sensor is provided in the mounting hole of the telescopic end of the above-mentioned cylinder assembly 3. It can be provided on the internal probe clamping arm or the hole wall of the mounting hole and located at the top of the probe 4. Specifically, a micro-force sensor is selected. When the telescopic end of the cylinder assembly 3 drives the probe 4 to move to a preset position, it contacts the product to be tested, so that the pressure sensor detects the corresponding pressure value in real time, compares the pressure value with the preset pressure range, and thus can determine whether the pressure at the time of contact is normal. When the pressure value is not within the preset pressure range, it indicates that there is a problem with the entire detection device. Then an alarm can be provided. When the above-mentioned pressure value jumps out of the preset pressure range, the detection device can be automatically shut down by the preset processor analysis and automatic control, and an alarm can be issued to remind the operator to make a fault diagnosis and troubleshooting.

[0044] Furthermore, if the obtained pressure value is to the left of the endpoint value of the preset pressure range, it means that the stroke setting of the cylinder assembly 3 is too short, and it is necessary to stop the detection and increase the preset stroke; if the obtained pressure value is to the right of the endpoint value of the preset pressure range, it means that the stroke setting of the cylinder assembly 3 is too long, and it is necessary to stop the detection and reduce the preset stroke; if the obtained pressure value is within the preset pressure range, it means that the pressure when the probe 4 contacts the product to be tested is normal, and the detection continues.

[0045] In the present invention, the pressure value acquired by the pressure sensor is compared in real time with a preset pressure range. If the pressure value is less than the left endpoint of the range, it indicates that the probe 4 has not effectively reached the contact position with the product under test, thus indicating a low pressure value. Therefore, the machine needs to be shut down, and the operator needs to determine whether the stroke of the cylinder assembly 3 is set too short. If so, the stroke is increased. It should be noted that if the pressure value is too low, if the stroke setting is normal, it can be determined whether the probe 4 is worn, and the probe 4 can be replaced. Conversely, if the pressure value is greater than the right endpoint of the pressure range, it indicates that the contact depth between the probe 4 and the product under test is too great. Due to the excessive pressure value, the machine needs to be shut down, and the operator needs to determine whether the stroke setting of the cylinder assembly is too long. If so, the stroke is reduced. It should be noted that if the stroke setting is normal, it can be determined whether the product under test is loose in the stop slot. Of course, if the pressure value remains within the preset pressure range, it indicates that the probe 4 is in normal contact with the product under test, and the testing operation can continue.

[0046] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any technician familiar with this patent can make some changes or modifications to equivalent embodiments using the above technical content without departing from the scope of the technical solution of the present invention. The implementation schemes in the above embodiments can be further combined or replaced. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the solution of the present invention.

Claims

1. A COC chip pneumatic testing device, characterized by: include, The panel is provided with a lifting mechanism at the bottom for driving the panel to move back and forth vertically; A support frame is provided on the upper surface of the panel, and a cylinder assembly is provided on the support frame. The moving direction of the telescopic end of the cylinder assembly is parallel to the lifting direction of the panel, and the telescopic end of the cylinder assembly is connected to a probe; The limiting plate is arranged on the panel and is used to fix the product to be tested. The vertical projection of the probe is completely on the plate surface of the limiting plate.

2. A COC chip pneumatic testing device according to claim 1, characterized in that: The limiting plate is provided with a limiting groove which is recessed downward from the plate surface, and the vertical projection of the probe is located in the limiting groove.

3. A COC chip pneumatic testing device according to claim 2, characterized in that: The cylinder assembly includes, The slide cylinder is arranged on the support frame; The pressure regulating valve is installed on the slide cylinder and is used to adjust the output pressure of the slide cylinder; The pneumatic reversing valve is installed on the panel and connected to the slide cylinder through the air pipe.

4. A COC chip pneumatic testing device according to claim 3, characterized in that: It also includes a cooling component for cooling the product to be tested fixed on the limit plate; The cooling assembly includes: The water-passing plate is set on the panel, with water inlet and outlet holes at the front and rear ends respectively, and is connected to a water pipe to form a circulating water circuit; A semiconductor refrigeration plate is bonded to the top of the water-passing plate, and a metal electrode that can be electrically connected to the product to be tested is provided on the semiconductor refrigeration plate.

5. A COC chip pneumatic testing device according to claim 4, characterized in that: A pressing plate is provided on the top of the semiconductor refrigeration plate, and the pressing plate is fastened to the water-passing plate by bolts to press the semiconductor refrigeration plate.

6. A COC chip pneumatic testing device according to claim 1, characterized in that: The lifting mechanism includes: base; A fork frame is provided on the base, wherein the upper end of the fork frame is connected to the panel; The driving cylinder is arranged on the base or the panel, and is connected to the fork frame, and is used to drive the fork frame to make the panel move back and forth in the vertical direction.

7. A control method for the COC chip pneumatic testing device according to any one of claims 1 to 6, characterized in that: The COC chip pneumatic testing device also includes a pressure sensor, which is arranged in the limit plate and located on the top of the probe. The specific control steps include: The probe is driven to the preset position by the cylinder assembly, and the pressure sensor is used to detect the pressure value generated when the probe contacts the product to be tested in real time; Determine whether the obtained pressure value is within the preset pressure range to determine whether the pressure when the probe contacts the product to be tested is normal, so as to adjust the stroke of the cylinder assembly.

8. A control method according to claim 7, characterized in that: If the obtained pressure value is to the left of the endpoint value of the preset pressure range, it means that the stroke of the cylinder assembly is set too short and it is necessary to stop testing and increase the preset stroke; if the obtained pressure value is to the right of the endpoint value of the preset pressure range, it means that the stroke of the cylinder assembly is set too long and it is necessary to stop testing and reduce the preset stroke; if the obtained pressure value is within the preset pressure range, it means that the pressure when the probe contacts the product to be tested is normal and continue testing.

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