Display panel and preparation method thereof

Abstract

The invention provides a display panel and a preparation method thereof. The display panel comprises a first substrate, a second substrate, a frame adhesive layer, a hot melt adhesive, a heating assembly and a control unit, wherein the first substrate and the second substrate are oppositely arranged. Wherein the frame glue layer is arranged between the first substrate and the second substrate in the non-display area; the frame glue layer is provided with a cavity; the hot melt adhesive is arranged in the cavity; the heating assembly comprises a sensing piece capable of detecting water vapor and a heating piece capable of generating heat; one end of the control unit is connected with the induction piece and used for receiving electric signals sent by the induction piece, and the other end of the control unit is connected with the heating piece and used for controlling whether the heating piece is powered on or not; wherein the sensing piece sends an electric signal to the control unit after detecting water vapor, and the control unit controls the heating piece to be electrified and heat, so that the hot melt adhesive is melted. The display panel can automatically repair the frame glue layer in the water vapor permeation process, meanwhile, the situation of poor sealing caused by non-uniform melting of the hot melt glue is avoided, and the service life of the display panel is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Art

[0002] In the field of display technology, liquid crystal display (LCD) panels and organic light emitting diode (OLED) display panels are widely used in devices such as televisions, computer monitors, smartphones, and tablets. For flat-panel display technologies like LCD and OLED panels, bonding two sheets of flat glass is a crucial technique, as the encapsulation directly impacts device performance.

[0003] The organic materials and electrode materials in OLED display panels are highly sensitive to moisture. Water vapor penetration can lead to performance degradation, reduced service life, and poor display quality. Furthermore, if moisture penetrates LCD display panels, it can disrupt the proper alignment of liquid crystal molecules, corrode internal circuitry, affect display quality, and reduce service life.

[0004] Existing display panels typically use sealant to bond the two substrates together. However, during the thermal curing process, the sealant can develop defects such as chipping and cracking, allowing moisture to easily penetrate the interior of the display panel. Furthermore, during the LCD panel manufacturing process, when liquid crystal is dripped into the sealant during the process, the liquid crystal may diffuse outside the sealant, making it difficult to form the seal. Summary of the Invention

[0005] The display panel and the manufacturing method thereof provided in the present application are intended to solve the problem of water vapor intrusion caused by poor packaging in existing display panels, which affects the display effect and service life of the display panel.

[0006] To solve the above technical problems, a technical solution adopted in the present application is to provide a display panel, the display panel comprising a display area and a non-display area surrounding the display area; including:

[0007] a first substrate;

[0008] a second substrate, disposed opposite to the first substrate;

[0009] a sealant layer, disposed between the first substrate and the second substrate located in the non-display area and bonding the first substrate and the second substrate; the sealant layer having a cavity;

[0010] hot melt adhesive, disposed in the cavity;

[0011] a heating assembly disposed in the non-display area between the first substrate and the second substrate, for heating the hot melt adhesive; the heating assembly comprises a sensing element and a heating element; wherein the sensing element is capable of detecting water vapor, and the heating element is capable of generating heat;

[0012] a control unit, one end of which is connected to the induction element for receiving an electrical signal from the induction element, and the other end of which is connected to the heating element for controlling whether to energize the heating element;

[0013] The sensing element sends an electrical signal to the control unit after detecting the water vapor, and the control unit controls the heating element to be energized and generate heat, so as to melt the hot melt adhesive.

[0014] In a specific embodiment, the sensing element is disposed in the cavity to detect water vapor entering the sealant layer; the sensing element includes:

[0015] A water absorbing layer; the water absorbing layer is configured to generate heat when absorbing water vapor entering the sealant layer;

[0016] A sensor is connected to one end of the control unit; the sensor is configured to send an electrical signal to the control unit when the heat generated by the water absorbing layer is detected.

[0017] In a specific embodiment, the water absorbing layer includes a moisture-curing sealant, and the moisture-curing sealant is capable of curing when absorbing water vapor; and the sensor includes a thermistor.

[0018] In a specific embodiment, the sealant layer includes:

[0019] A first sealant is provided on the first substrate and protrudes toward the second substrate;

[0020] a second sealant disposed on the first substrate and protruding toward the second substrate; the second sealant being spaced apart from the first sealant and located on a side of the first sealant facing the display area; and a distance between the first sealant and the second sealant in a direction perpendicular to the display panel being greater than or equal to a size of the first sealant and less than or equal to twice the size of the first sealant;

[0021] a third sealant disposed on the second substrate and protruding toward the first substrate; the third sealant separates the first sealant from the second sealant; and a size of the third sealant in a direction perpendicular to the display panel is less than or equal to a distance between the first sealant and the second sealant;

[0022] The third sealant is recessed away from the surface of the second substrate toward the second substrate to form a groove; and the third sealant cooperates with the first sealant, the second sealant, the first substrate and the second substrate to form the cavity.

[0023] In one embodiment, the thermistor is disposed on the first substrate;

[0024] The moisture-curing sealant is disposed on the first substrate and covers the thermistor; and the moisture-curing sealant is embedded in the groove;

[0025] The hot melt adhesive is disposed in the cavity and covers the moisture curing sealant.

[0026] In a specific embodiment, the heating element is disposed on the second substrate, and the third sealant covers the heating element.

[0027] To solve the above technical problems, another technical solution adopted in the present application is to provide a method for manufacturing a display panel, wherein the display panel includes a display area and a non-display area surrounding the display area; the method comprises:

[0028] A first substrate and a second substrate are provided; the first substrate or the second substrate is provided with a control unit;

[0029] A sensor capable of detecting water vapor is provided on a surface of the first substrate on a side located in the non-display area, and sealant is deposited on both sides of the sensor; and one end of the control unit is connected to the sensor to receive an electrical signal from the sensor;

[0030] A heat generating element capable of generating heat is provided on a surface of the second substrate on one side located in the non-display area, and a sealant is deposited on the heat generating element; and the other end of the control unit is connected to the heat generating element to control whether to supply power to the heat generating element;

[0031] depositing hot melt adhesive on the induction element;

[0032] The side of the first substrate facing the induction element is aligned with the side of the second substrate facing the heating element, and the sealant is heated and cured to form a sealant layer.

[0033] In a specific embodiment, the step of disposing a sensor capable of detecting water vapor on a surface of the first substrate on a side located in the non-display area and depositing sealant on both sides of the sensor includes:

[0034] Depositing a thermistor material on a surface of the first substrate located in the non-display area to form a sensor;

[0035] Depositing the sealant on both sides of the sensor in sequence, and spacing the sealants on both sides of the sensor; wherein the distance between two sealants is greater than or equal to the size of the sealant and less than or equal to twice the size of the sealant;

[0036] A moisture-curing sealant is deposited on the first substrate and covers the sensor with the moisture-curing sealant.

[0037] In a specific embodiment, the step of disposing a heat-generating element on a surface of the second substrate on a side located in the non-display area and depositing a sealant on the heat-generating element includes:

[0038] Depositing a transparent conductive material on a surface of the second substrate at a side located in the non-display area to form the heating element;

[0039] Depositing the sealant on one side of the heating element, and making the sealant cover only a portion of the surface of the heating element close to the sealant;

[0040] The sealant is deposited on the other side of the heating element so that the sealant covers the other exposed surface of the heating element; wherein the sealants on both sides of the heating element partially overlap, and the sealant is recessed away from the surface of the second substrate toward the second substrate.

[0041] In a specific embodiment, the step of aligning the side of the first substrate facing the induction element with the side of the second substrate facing the heating element includes:

[0042] The sealant on the second substrate is aligned with the space between the two sealants on the first substrate, and the moisture-curing sealant is embedded in the recess of the sealant on the second substrate.

[0043] Beneficial effects of the embodiments of the present application: Different from the prior art, the embodiments of the present application provide a display panel and a preparation method thereof, wherein the display panel includes a display area and a non-display area arranged around the display area; the display panel includes a first substrate and a second substrate arranged opposite to each other, a sealant layer, a hot melt adhesive, a heating component and a control unit. The sealant layer is arranged between the first substrate and the second substrate located in the non-display area and bonds the first substrate and the second substrate; the sealant layer has a cavity; the hot melt adhesive is arranged in the cavity; the heating component is arranged in the non-display area between the first substrate and the second substrate for heating the hot melt adhesive; the heating component includes a sensing element and a heating element; the sensing element can detect water vapor and the heating element can generate heat; one end of the control unit is connected to the sensing element for receiving an electrical signal emitted by the sensing element, and the other end of the control unit is connected to the heating element for controlling whether to energize the heating element; the sensing element sends an electrical signal to the control unit after detecting water vapor, and the control unit controls the heating element to energize and generate heat to melt the hot melt adhesive. By placing hot melt adhesive in the cavity of the sealant layer, when the sealant layer is cured at high temperature to form the sealant layer, the hot melt adhesive can melt into a fluid and fill defects such as chipped corners and cracks in the sealant layer, thereby improving product yield. By providing a heating component and a control unit, the sensing element can send an electrical signal to the control unit when detecting water vapor. After receiving the electrical signal, the control unit controls the heating element to energize and generate heat, causing the hot melt adhesive to melt again and fill the cracks in the sealant layer. This allows the display panel to automatically repair the sealant layer during water vapor penetration, thereby preventing water vapor from entering the interior of the display panel. This heating method can also evenly heat the hot melt adhesive in various parts, avoiding the occurrence of poor sealing due to uneven melting of the hot melt adhesive, effectively increasing the service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic structural diagram of a display panel provided in one embodiment of the present application;

[0045] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0046] Figure 3 for Figure 1 The connection diagram of the control unit in the display panel is shown;

[0047] Figure 4 for Figure 2 The structure shown is a schematic diagram of the structure after removing the hot melt adhesive and the induction component;

[0048] Figure 5 A schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0049] Figure 6 for Figure 5 Schematic diagram of the process of step S2;

[0050] Figure 7 for Figure 6 The structural diagram of step S21;

[0051] Figure 8a for Figure 6 A schematic diagram of the structure of depositing sealant on one side of the sensor in step 22;

[0052] Figure 8b for Figure 6 A schematic diagram of a structure in which a sealant is deposited on the other side of the sensor in step 22;

[0053] Figure 9 for Figure 6 The structural diagram of step S23;

[0054] Figure 10 for Figure 5 Schematic diagram of the process of step S3;

[0055] Figure 11 for Figure 10 The structural diagram of step S31;

[0056] Figure 12 for Figure 10 The structural diagram of step S32;

[0057] Figure 13 for Figure 10 The structural diagram of step S33;

[0058] Figure 14 for Figure 5 The structural diagram of step S4;

[0059] Figure 15 for Figure 5 Schematic diagram of the structure of step S5 in FIG.

[0060] Description of Figure Numbers:

[0061] 10. Display area; 20. Non-display area; 1. First substrate; 2. Second substrate; 3. Frame glue layer; 4. Hot melt adhesive; 5. Heating component; 6. Control unit; 30. Cavity; 31. First frame glue; 32. Second frame glue; 33. Third frame glue; 51. Sensing element; 52. Heating element; 300. Sealant; 331. Groove; 511. Water-absorbing layer; 512. Sensor; 5110. Moisture-curing sealant; 5120. Thermistor. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0063] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0064] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0065] In existing display panel packaging structures, sealant is typically used to bond the two substrates together. However, during the thermal curing process, the sealant can develop defects such as chipping and cracking, allowing moisture to easily penetrate the interior of the display panel. Therefore, some display panels incorporate a repair layer within the sealant. The heat released by the water-absorbing layer heats the repair layer, preventing moisture from entering. However, this passive heating method has uncontrollable heating effects, and uneven heating can lead to poor sealing after subsequent cooling and curing.

[0066] Based on this, an embodiment of the present application provides a display panel that can automatically repair the frame glue layer during water vapor penetration to prevent water vapor from entering the interior of the display panel; and can avoid the occurrence of poor sealing due to uneven melting of hot melt adhesive, thereby effectively improving the service life of the display panel.

[0067] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0068] See Figure 1-Figure 3 , Figure 1 A schematic structural diagram of a display panel provided in one embodiment of the present application; Figure 2 for Figure 1 A partial enlarged view of point A in the middle; Figure 3 for Figure 1 The embodiment of the present application provides a display panel, which can be an LCD display panel or an OLED display panel; the following embodiments of the present application are explained using the LCD display panel as an example.

[0069] like Figure 1 As shown, the display panel may include a display area 10 and a non-display area 20 disposed around the display area 10; wherein the area of ​​the display panel corresponding to the display area 10 includes a plurality of pixel units (not shown) for displaying images; the area of ​​the display panel corresponding to the non-display area 20 is provided with circuits (not shown), solder pads (not shown), and a frame (not shown). The display panel includes a first substrate 1, a second substrate 2, a sealant layer 3, hot melt adhesive 4, a heating assembly 5, and a control unit 6.

[0070] A first substrate 1 and a second substrate 2 are disposed opposite each other. The first substrate 1 and the second substrate 2 may be glass substrates, with one serving as an array substrate and the other as a cover plate. For example, the first substrate 1 may be an array substrate and the second substrate 2 a cover plate, or the first substrate 1 may be a cover plate and the second substrate 2 an array substrate. Specifically, a thin-film transistor (TFT) array (not shown) is provided on the array substrate to control the display image; the cover plate protects other film layers within the display panel. For ease of understanding, the following embodiments of this application are described using the example of the first substrate 1 serving as the array substrate and the second substrate 2 serving as the cover plate.

[0071] The sealant layer 3 is disposed between the first substrate 1 and the second substrate 2 located in the non-display area 20, and the two side surfaces of the sealant layer 3 along the thickness direction Z of the display panel are at least partially in contact with the surface of the first substrate 1 and the surface of the second substrate 2, so as to bond the first substrate 1 and the second substrate 2 together and seal the display area 10 of the display panel to prevent external moisture from entering the display panel.

[0072] like Figure 2 As shown, specifically, there is a cavity 30 inside the frame glue layer 3, and the hot melt adhesive 4 is arranged in the cavity 30; the hot melt adhesive 4 can melt to form a fluid when the temperature rises, and then cool to form a solid when the temperature drops, thereby filling defects such as missing corners and cracks that may exist in the frame glue layer 3.

[0073] The heating element 5 is disposed in the non-display area 20 between the first substrate 1 and the second substrate 2 to heat the hot melt adhesive 4 to increase the temperature of the hot melt adhesive 4. Specifically, the heating element 5 can be disposed in the same area as the sealant layer 3 to reduce the time required for heat conduction.

[0074] The heating assembly 5 may specifically include a sensing element 51 and a heating element 52. The sensing element 51 can detect water vapor and send an electrical signal to detect whether water vapor has entered or penetrated the sealant layer 3. The heating element 52 can generate heat to heat the hot melt adhesive 4 when water vapor has entered or penetrated the sealant layer 3.

[0075] like Figure 3 As shown, the control unit 6 can be arranged in the array substrate, and one end of the control unit 6 is connected to the sensing element 51 for receiving the electrical signal sent by the sensing element 51, and the other end of the control unit 6 is connected to the heating element 52 for controlling whether to power on the heating element 52. Among them, the sensing element 51 sends an electrical signal to the control unit 6 after detecting water vapor, and the control unit 6 controls the heating element 52 to power on and generate heat to melt the hot melt adhesive 4. That is, when the control unit 6 receives the electrical signal sent by the sensing element 51, it supplies power to the heating element 52 to make it generate heat; and when the control unit 6 does not receive the electrical signal sent by the sensing element 51, it disconnects the current of the heating element 52. It can be understood that the heat resistance of the frame glue layer 3 is stronger than that of the hot melt adhesive 4. By controlling the current size, when the hot melt adhesive 4 melts, it will not affect the physical structure of the frame glue.

[0076] By providing hot melt adhesive 4 in the cavity 30 of the sealant layer 3, when the sealant layer 3 is cured at high temperature to form the sealant layer 3, the hot melt adhesive 4 can melt into a fluid and fill defects such as missing corners and cracks in the sealant layer 3, thereby improving the product yield. By providing a heating component 5 and a control unit 6, the sensing element 51 can send an electrical signal to the control unit 6 when detecting water vapor. After receiving the electrical signal, the control unit 6 controls the heating element 52 to be energized and heated, causing the hot melt adhesive 4 to melt again and fill the cracks in the sealant layer 3, thereby allowing the display panel to automatically repair the sealant layer 3 during water vapor penetration to prevent water vapor from entering the interior of the display panel. In addition, this heating method can evenly heat the hot melt adhesive 4 in various parts, avoiding the occurrence of poor sealing due to uneven melting of the hot melt adhesive 4.

[0077] like Figure 2As shown, in a specific embodiment, a sensing element 51 can be disposed in the cavity 30 to detect water vapor entering the cavity 30 of the sealant layer 3. Specifically, the sensing element 51 can include a water-absorbing layer 511 and a sensor 512. The water-absorbing layer 511 is configured to generate heat when absorbing water vapor entering the cavity 30, thereby absorbing the water vapor that has penetrated into the sealant layer 3, thereby preventing the water vapor from continuing to penetrate into the display panel, thereby affecting the display effect and even reducing the service life of the display panel. The sensor 512 is also stimulated by the heat generated by the reaction of absorbing water vapor.

[0078] The sensor 512 may be a thermal sensor capable of accurately detecting whether the water-absorbing layer 511 generates heat. Specifically, the sensor 512 is connected to one end of the control unit 6. The sensor 512 is configured to send an electrical signal to the control unit 6 upon detecting heat generated by the water-absorbing layer 511, so that the control unit 6 can promptly control the heating element 52 to generate heat.

[0079] It is understood that the method of directly heating the hot melt adhesive 4 using the heat generated by the water-absorbing layer 511 is less sensitive. If the amount of water vapor immersed in a single time is small, the heat generated by the water-absorbing layer 511 is insufficient to melt the hot melt adhesive 4, and thus cannot repair the cracks in the frame adhesive layer 3. In addition, if the water-absorbing layer 511 absorbs water vapor unevenly at different locations, the heat it generates is also uneven, which may cause the hot melt adhesive 4 at different locations to melt unevenly, resulting in poor sealing after the hot melt adhesive 4 cools and solidifies again.

[0080] Compared to the aforementioned heating method, the sensor 512 in the display panel of the present embodiment detects the heat generated by the water-absorbing layer 511 and then controls the heating element 52 to generate heat through the control unit 6. This active heating method is more sensitive. Even if the heat generated by the water-absorbing layer 511 is relatively small, the thermal sensor 512 is highly sensitive to heat and can promptly send an electrical signal to activate the heating element 52, melting the hot melt adhesive 4 and promptly repairing the cracks in the frame adhesive layer 3. At the same time, the heat generated by the water vapor absorbed by the water-absorbing layer 511 at any position can be detected by the sensor 512, causing the heating element 52 to generate heat, thereby uniformly heating the hot melt adhesive 4 at all locations and preventing uneven melting of the hot melt adhesive 4 and poor sealing.

[0081] In a specific embodiment, the water-absorbing layer 511 may include a moisture-curing sealant 5110. Moisture-curing sealant 5110 is an adhesive that forms a cross-linked structure by reacting with moisture in the environment. The active groups in the prepolymer (such as isocyanate groups -NCO or silane groups -Si-OR) react with water molecules in the air to form a three-dimensional network structure to achieve curing. In this way, the moisture-curing sealant 5110 cures after absorbing water vapor, which can further enhance the sealing effect. Specifically, the moisture-curing sealant 5110 may include at least one of a polyurethane sealant, a silane-modified polyurethane, a butyl sealant, and a silicone sealant.

[0082] The sensor 512 may include a thermistor 5120 ; it is understood that the thermistor 5120 has high sensitivity and accuracy, and can better detect whether the water absorption layer 511 generates heat. The control unit 6 can determine its temperature based on the resistance value of the thermistor 5120 .

[0083] like Figure 4 As shown, Figure 4 for Figure 2 The structure shown is a schematic diagram of the structure after removing the hot melt adhesive 4 and the sensing element 51; in a specific embodiment, the sealant layer 3 may further include a first sealant 31 and a second sealant 32 arranged on the first substrate 1, and a third sealant 33 arranged on the second substrate 2.

[0084] Among them, the first frame glue 31 and the second frame glue 32 are arranged at intervals on the first substrate 1 and protrude toward the second substrate 2, and the second frame glue 32 is located on the side of the first frame glue 31 facing the display area 10; that is, the first frame glue 31 is located on the side of the non-display area 20 away from the display area 10, and the second frame glue 32 is located on the side of the non-display area 20 close to the display area 10.

[0085] The third sealant 33 is disposed on the second substrate 2 and protrudes toward the first substrate 1 . The third sealant 33 separates the first sealant 31 from the second sealant 32 . That is, the third sealant 33 is disposed corresponding to the spacing area between the first sealant 31 and the second sealant 32 .

[0086] As can be understood, by providing multiple spaced sealant layers between the first substrate 1 and the second substrate 2, it is possible to prevent liquid crystal from overflowing from the sealant layer 3 during liquid crystal injection, allowing the LCD panel to be successfully assembled. Furthermore, the multiple sealant layers increase the path length for water vapor intrusion, reducing the risk of water vapor intrusion into the display panel.

[0087] Among them, one end of the first frame glue 31 and the second frame glue 32 along the thickness direction Z is set on the surface of the first substrate 1, and the other end extends toward the second substrate 2 and abuts against the second substrate 2; one end of the third frame glue 33 along the thickness direction Z is set on the surface of the second substrate 2, and the other end extends toward the first substrate 1 and is spaced apart from the first substrate 1, so that the third frame glue 33 cooperates with the first frame glue 31, the second frame glue 32, the first substrate 1 and the second substrate 2 to form a closed cavity 30, thereby preventing the hot melt adhesive 4 from overflowing into the display area 10 or outside the display panel.

[0088] In the direction X perpendicular to the display panel, the size a of the third sealant 33 is smaller than or equal to the distance d between the first sealant 31 and the second sealant 32 , so that the third sealant 33 does not contact the first sealant 31 and the second sealant 32 and can cooperate to form the cavity 30 .

[0089] The third sealant 33 is recessed from the surface of the second substrate 2 toward the second substrate 2 to form a groove 331 to accommodate the moisture-curing sealant 5110. Specifically, the third sealant 33 can be formed by two sealants partially overlapping; wherein the edges of the two sealants overlap to form the groove 331.

[0090] Specifically, along the direction X perpendicular to the display panel, the distance d between the first frame glue 31 and the second frame glue 32 is greater than or equal to the size b of the first frame glue 31 and less than or equal to twice the size 2b of the first frame glue 31, so as to avoid the problem that the distance d between the first frame glue 31 and the second frame glue 32 is too small to accommodate the third frame glue 33. At the same time, it can also avoid the problem that the distance d between the first frame glue 31 and the second frame glue 32 is too large, resulting in the formation of an overly large cavity 30.

[0091] In the direction from the first substrate 1 to the second substrate 2 , the size b of the first sealant 31 gradually decreases and forms an arc surface; the shape and size of the second sealant 32 can be the same as those of the first sealant 31 for easy preparation.

[0092] like Figure 2 As shown, specifically, a thermistor 5120 can be disposed on the surface of the first substrate 1 to facilitate connection between the thermistor 5120 and the control unit 6 within the first substrate 1. A moisture-curing sealant 5110 can be disposed on the first substrate 1 and cover the thermistor 5120, enabling the thermistor 5120 to promptly detect heat generated by the moisture-curing sealant 5110 and protecting the thermistor 5120 from moisture corrosion, thereby preventing the thermistor 5120 from malfunctioning due to corrosion. A hot melt adhesive 4 is disposed within the cavity 30 and covers the moisture-curing sealant 5110.

[0093] Further, combined with Figure 2 and Figure 4The moisture-curing sealant 5110 is embedded in the groove 331 to further increase the path length of water vapor intrusion and reduce the risk of water vapor intrusion.

[0094] Specifically, the heating element 52 can be disposed on the second substrate 2 , and the third sealant 33 covers the heating element 52 to save space and reduce the proportion of the non-display area 20 .

[0095] An embodiment of the present application provides a display panel, which includes a display area 10 and a non-display area 20 arranged around the display area 10; the display panel includes a first substrate 1 and a second substrate 2 arranged opposite to each other, a frame glue layer 3, hot melt adhesive 4, a heating component 5 and a control unit 6. Among them, the frame glue layer 3 is arranged between the first substrate 1 and the second substrate 2 located in the non-display area 20 and bonds the first substrate 1 and the second substrate 2; the frame glue layer 3 has a cavity 30; the hot melt adhesive 4 is arranged in the cavity 30; the heating component 5 is arranged in the non-display area 20 between the first substrate 1 and the second substrate 2, for heating the hot melt adhesive 4; the heating component 5 includes a sensing element 51 and a heating element 52; wherein the sensing element 51 can detect water vapor and the heating element 52 can generate heat; one end of the control unit 6 is connected to the sensing element 51 for receiving the electrical signal emitted by the sensing element 51, and the other end of the control unit 6 is connected to the heating element 52 for controlling whether to power on the heating element 52; wherein, in response to the sensing element 51 detecting water vapor, the sensing element 51 sends an electrical signal to the control unit 6, and the control unit 6 controls the heating element 52 to power on and generate heat to melt the hot melt adhesive 4. By setting hot melt adhesive 4 in the cavity 30 of the sealant layer 3, when the sealant layer 3 is cured at high temperature to form the sealant layer 3, the hot melt adhesive 4 can melt into a fluid and fill defects such as missing corners and cracks in the sealant layer 3, thereby improving the product yield. By setting a heating component 5 and a control unit 6, the sensing element 51 can send an electrical signal to the control unit 6 when detecting water vapor. After receiving the electrical signal, the control unit 6 controls the heating element 52 to be energized and heated, so that the hot melt adhesive 4 melts again and fills the cracks in the sealant layer 3, thereby enabling the display panel to automatically repair the sealant layer 3 during water vapor penetration to prevent water vapor from entering the interior of the display panel; and this heating method can evenly heat the hot melt adhesive 4 in various parts, avoiding the occurrence of poor sealing due to uneven melting of the hot melt adhesive 4, effectively improving the service life of the display panel.

[0096] See Figure 5-Figure 15 , Figure 5 A schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application; Figure 6 for Figure 5 Schematic diagram of the process of step S2; Figure 7 for Figure 6 The structural diagram of step S21; Figure 8a for Figure 6A schematic diagram of the structure of depositing sealant on one side of the sensor 512 in step 22; Figure 8b for Figure 6 A schematic diagram of the structure of depositing sealant on the other side of the sensor 512 in step 22; Figure 9 for Figure 6 The structural diagram of step S23; Figure 10 for Figure 5 Schematic diagram of the process of step S3; Figure 11 for Figure 10 The structural diagram of step S31; Figure 12 for Figure 10 The structural diagram of step S32; Figure 13 for Figure 10 The structural diagram of step S33; Figure 14 for Figure 5 The structural diagram of step S4; Figure 15 for Figure 5 Schematic diagram of the structure of step S5 in FIG.

[0097] The present application provides a method for preparing a display panel, which is used to prepare the display panel involved in any of the above embodiments; Figure 5 As shown, the specific steps of the method for preparing the display panel include:

[0098] Step S1: providing a first substrate and a second substrate; the first substrate or the second substrate is provided with a control unit.

[0099] like Figure 7 As shown, the first substrate 1 and the second substrate 2 can be glass substrates, with one being an array substrate and the other being a cover plate. In this embodiment, the first substrate 1 is the array substrate and the second substrate 2 is the cover plate. A thin film transistor array is provided on the array substrate, and a control unit (not shown) is provided within the first substrate 1. Specifically, the first substrate 1 and the second substrate 2 each include a display area 10 and a non-display area 20 surrounding the display area 10.

[0100] Step S2: a sensing element capable of detecting water vapor is provided on a surface of the first substrate on one side located in the non-display area, and a sealant is deposited on both sides of the sensing element.

[0101] Specifically, after the induction element 51 is provided, one end of the control unit is connected to the induction element 51 , so that the control unit can receive the electrical signal sent by the induction element 51 .

[0102] like Figure 6 As shown, in the specific implementation process, step S2 may specifically include:

[0103] Step S21: depositing a thermistor material on a surface of the first substrate located in the non-display area to form a sensor.

[0104] Combine Figure 3 and Figure 7 In a specific implementation, physical vapor deposition can be used to deposit thermistor 5120 material on the surface of the non-display area 20 on the light-emitting side of the first substrate 1 to form thermistor 5120, i.e., the sensor 512 in this embodiment. Simultaneously, thermistor 5120 is electrically connected to the control unit 6, so that the control unit 6 can determine temperature changes based on changes in the resistance value of thermistor 5120.

[0105] Specifically, the material of the thermistor 5120 may include at least one of metal oxide, silicon-based semiconductor or composite ceramic; specifically, the above materials may be deposited on the surface of the first substrate 1 by sputtering deposition.

[0106] Step S22: Sealants are sequentially deposited on both sides of the sensor, and the sealants on both sides of the sensor are spaced apart.

[0107] Specifically, after applying a layer of sealant 300 on one side of the thermistor 5120 and at a position a certain distance away from the thermistor 5120 , another layer of sealant 300 is applied on the other side of the thermistor 5120 and at a position a certain distance away from the thermistor 5120 .

[0108] For example, combined with Figure 8a and Figure 8b A layer of sealant 300 may be first applied to the outer side of the thermistor 5120 away from the display area 10 , and then a layer of sealant 300 may be applied to the inner side of the thermistor 5120 close to the display area 10 .

[0109] Among them, the distance d between the two sealants 300 is greater than or equal to the size b of the sealant 300 and less than or equal to twice the size 2b of the sealant 300, so as to accommodate the sealant 300 set on the second substrate 2 in the subsequent process while avoiding the problem of the cavity 30 formed therewith being too large.

[0110] Of course, in other embodiments, a layer of sealant 300 may be first applied on the inner side of the thermistor 5120 close to the display area 10 , and then a layer of sealant 300 may be applied on the outer side of the thermistor 5120 away from the display area 10 .

[0111] Step S23: depositing a moisture-curing sealant on the first substrate and allowing the moisture-curing sealant to cover the sensor.

[0112] like Figure 9As shown, a moisture-curing sealant 5110 is coated on the surface of the non-display area 20 on the light-emitting side of the first substrate 1, and the moisture-curing sealant 5110 covers the thermistor 5120, so that the thermistor 5120 can detect the heat generated by the moisture-curing sealant 5110 in time, and can also protect the thermistor 5120 from erosion by water vapor, thereby preventing it from being corroded and causing functional failure.

[0113] The thermistor 5120 and the moisture-curing sealant 5110 constitute the sensing element 51 .

[0114] Step S3: a heat generating element capable of generating heat is provided on a surface of the second substrate on one side located in the non-display area, and a sealant is deposited on the heat generating element.

[0115] Specifically, after the heating element 52 is provided, the other end of the control unit 6 is connected to the heating element 52 to control whether the display panel supplies power to the heating element 52 .

[0116] like Figure 10 As shown, in the specific implementation process, step S3 may specifically include:

[0117] Step S31: depositing a transparent conductive material on a surface of the second substrate located in the non-display area to form a heating element.

[0118] like Figure 11 As shown, in a specific embodiment, a transparent conductive material can be deposited on the surface of the second substrate 2 located in the non-display area 20 using physical vapor deposition to form the heating element 52. It will be understood that using a transparent conductive material as the heating element 52 can avoid affecting the display effect of the display panel. The transparent conductive material can be an indium tin oxide material.

[0119] Combine Figure 3 After the heating element 52 is formed, the heating element 52 is electrically connected to the control unit 6 so that the control unit 6 can control whether the display panel supplies power to the heating element 52 to generate heat.

[0120] Step S32: depositing sealant on one side of the heating element, and making the sealant cover only a portion of the surface of the heating element close to the sealant side.

[0121] like Figure 12 As shown, in a specific implementation, the sealant 300 can be applied to the heating element 52 at a position away from the display area 10, so that the sealant 300 only covers a portion of the surface of the heating element 52 away from the display area 10, and the side of the sealant 300 away from the display area 10 overlaps with the second substrate 2. The area of ​​the portion of the surface of the heating element 52 covered by the sealant 300 is greater than or equal to one-half of the entire area of ​​the heating element 52, so that it can overlap with the sealant 300 on the other side in subsequent manufacturing processes.

[0122] Step S33: depositing sealant on the other side of the heating element so that the sealant covers the other exposed surface of the heating element.

[0123] like Figure 13 As shown, sealant 300 is applied to the heating element 52 on the side close to the display area 10, and the sealant 300 covers the other uncovered surface of the heating element 52, that is, the uncovered surface of the heating element 52 on the side close to the display area 10, and the sealant 300 overlaps with the second substrate 2 on the side close to the display area 10 to completely cover the heating element 52.

[0124] Specifically, the sealant 300 near the display area 10 and the sealant 300 away from the display area 10 only partially overlap, and the surface of the sealant 300 away from the second substrate 2 is recessed toward the second substrate 2 to facilitate the formation of the groove 331 in subsequent processes.

[0125] Step S4: depositing hot melt adhesive on the induction component.

[0126] like Figure 14 As shown, in a specific implementation, hot melt adhesive 4 can be applied to the surface of the moisture-curing sealant 5110 of the sensing element 51, and the hot melt adhesive 4 can completely cover the moisture-curing sealant 5110 to prevent the moisture-curing sealant 5110 from prematurely absorbing moisture during subsequent manufacturing processes. Specifically, the hot melt adhesive 4 can include at least one of polyurethane hot melt adhesive, thermoplastic polyurethane, and polyolefin hot melt adhesive.

[0127] It should be noted that step S4 of depositing the hot melt adhesive 4 may also be performed after step S2 and before step S3.

[0128] Step S5: aligning the side of the first substrate facing the sensing element with the side of the second substrate facing the heating element, and heating and curing the sealant to form a sealant layer.

[0129] like Figure 15 As shown, in the specific implementation process, the side of the first substrate 1 facing the sensing element 51 and the side of the second substrate 2 facing the heating element 52 are aligned and pressed together, so that the sealant 300 on the first substrate 1 abuts against the second substrate 2, and the sealant 300 on the second substrate 2 is spaced apart from the first substrate 1 to enclose and form a cavity 30.

[0130] Then, the sealant 300 between the first substrate 1 and the second substrate 2 is heated to solidify the sealant 300 to form a sealant layer 3. Figure 1The display panel shown in FIG. The sealant 300 on the first substrate 1 away from the display area 10 is cured to form a first sealant 31 , the sealant 300 on the first substrate 1 close to the display area 10 is cured to form a second sealant 32 , and the sealant 300 on the second substrate 2 is cured to form a third sealant 33 , with the concave portion cured to form a groove 331 .

[0131] It should be noted that when the sealant 300 is heated and cured, the hot melt adhesive 4 on the surface of the moisture-curing sealant 5110 will melt and fill the cavity 30, and will also fill the corners and cracks of the frame glue layer 3 to further improve the sealing effect.

[0132] Specifically, when the first substrate 1 and the second substrate 2 are aligned and pressed together, the sealant 300 on the second substrate 2 is aligned with the gap between the two sealants 300 on the first substrate 1, and the moisture-curing sealant 5110 is embedded in the recess of the sealant 300 on the second substrate 2 to further increase the length of the water vapor intrusion path.

[0133] After step S5 , the process further includes steps such as cutting the first substrate 1 and the second substrate 2 . These steps are the same or similar to the related steps in the prior art. For details, please refer to the prior art and will not be described again.

[0134] The present application provides a method for preparing a display panel, which includes: first providing a first substrate 1 and a second substrate 2; a control unit 6 is provided on the first substrate 1 or the second substrate 2; then, a sensing element 51 capable of detecting water vapor is provided on a surface of the first substrate 1 located in the non-display area 20, and a sealant 300 is deposited on both sides of the sensing element 51; then, a heating element 52 capable of generating heat is provided on a surface of the second substrate 2 located in the non-display area 20, and a sealant 300 is deposited on the heating element 52; then, a hot melt adhesive 4 is deposited on the sensing element 51; finally, the side of the first substrate 1 facing the sensing element 51 is aligned with the side of the second substrate 2 facing the heating element 52, and the sealant 300 is heated and cured to form a sealant layer 3. The display panel prepared by this preparation method can automatically repair the sealant layer 3 during water vapor penetration while avoiding the occurrence of poor sealing caused by uneven melting of the hot melt adhesive 4, thereby improving the service life of the display panel.

[0135] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel comprising a display area and a non-display area surrounding the display area; characterized in that: include: a first substrate; a second substrate, disposed opposite to the first substrate; a sealant layer, disposed between the first substrate and the second substrate located in the non-display area and bonding the first substrate and the second substrate; the sealant layer having a cavity; hot melt adhesive, disposed in the cavity; a heating assembly disposed in the non-display area between the first substrate and the second substrate, for heating the hot melt adhesive; the heating assembly comprises a sensing element and a heating element; wherein the sensing element is capable of detecting water vapor, and the heating element is capable of generating heat; a control unit, one end of which is connected to the induction element for receiving an electrical signal from the induction element, and the other end of which is connected to the heating element for controlling whether to energize the heating element; The sensing element detects the water vapor and sends an electrical signal to the control unit, and the control unit controls the heating element to be energized and generate heat, so as to melt the hot melt adhesive.

2. The display panel according to claim 1, wherein: The sensing element is disposed in the cavity and is used to detect water vapor entering the sealant layer; the sensing element includes: A water absorbing layer; the water absorbing layer is configured to generate heat when absorbing water vapor entering the sealant layer; A sensor is connected to one end of the control unit; the sensor is configured to send an electrical signal to the control unit when the heat generated by the water absorbing layer is detected.

3. The display panel according to claim 2, wherein: The water absorbing layer includes a moisture-curing sealant, which can be cured when absorbing water vapor; and the sensor includes a thermistor.

4. The display panel according to claim 3, wherein: The sealant layer includes: A first sealant is provided on the first substrate and protrudes toward the second substrate; a second sealant disposed on the first substrate and protruding toward the second substrate; the second sealant being spaced apart from the first sealant and located on a side of the first sealant facing the display area; and a distance between the first sealant and the second sealant in a direction perpendicular to the display panel being greater than or equal to a size of the first sealant and less than or equal to twice the size of the first sealant; a third sealant disposed on the second substrate and protruding toward the first substrate; the third sealant separates the first sealant from the second sealant; and a size of the third sealant in a direction perpendicular to the display panel is less than or equal to a distance between the first sealant and the second sealant; The third sealant is recessed away from the surface of the second substrate toward the second substrate to form a groove; and the third sealant cooperates with the first sealant, the second sealant, the first substrate and the second substrate to form the cavity.

5. The display panel according to claim 4, wherein: The thermistor is disposed on the first substrate; The moisture-curing sealant is disposed on the first substrate and covers the thermistor; and the moisture-curing sealant is embedded in the groove; The hot melt adhesive is disposed in the cavity and covers the moisture curing sealant.

6. The display panel according to claim 5, wherein: The heating element is disposed on the second substrate, and the third sealant covers the heating element.

7. A method for manufacturing a display panel, wherein the display panel comprises a display area and a non-display area surrounding the display area; include: A first substrate and a second substrate are provided; the first substrate or the second substrate is provided with a control unit; A sensor capable of detecting water vapor is provided on a surface of the first substrate on a side located in the non-display area, and sealant is deposited on both sides of the sensor; and one end of the control unit is connected to the sensor to receive an electrical signal from the sensor; A heat generating element capable of generating heat is provided on a surface of the second substrate on one side located in the non-display area, and a sealant is deposited on the heat generating element; and the other end of the control unit is connected to the heat generating element to control whether to supply power to the heat generating element; depositing hot melt adhesive on the induction element; The side of the first substrate facing the induction element is aligned with the side of the second substrate facing the heating element, and the sealant is heated and cured to form a sealant layer.

8. The method for manufacturing a display panel according to claim 7, wherein: The step of disposing a sensor capable of detecting water vapor on a surface of the first substrate on a side located in the non-display area and depositing sealant on both sides of the sensor comprises: Depositing a thermistor material on a surface of the first substrate located in the non-display area to form a sensor; Depositing the sealant on both sides of the sensor in sequence, and spacing the sealants on both sides of the sensor; wherein the distance between two sealants is greater than or equal to the size of the sealant and less than or equal to twice the size of the sealant; A moisture-curing sealant is deposited on the first substrate and covers the sensor with the moisture-curing sealant.

9. The method for manufacturing a display panel according to claim 7, wherein: The step of disposing a heat generating element capable of generating heat on a surface of the second substrate on a side located in the non-display area and depositing a sealant on the heat generating element comprises: Depositing a transparent conductive material on a surface of the second substrate at a side located in the non-display area to form the heating element; Depositing the sealant on one side of the heating element, and making the sealant cover only a portion of the surface of the heating element close to the sealant; The sealant is deposited on the other side of the heating element so that the sealant covers the other exposed surface of the heating element; wherein the sealants on both sides of the heating element partially overlap, and the sealant is recessed away from the surface of the second substrate toward the second substrate.

10. The method for manufacturing a display panel according to claim 8, wherein: The step of aligning the side of the first substrate facing the induction element with the side of the second substrate facing the heating element comprises: The sealant on the second substrate is aligned with the space between the two sealants on the first substrate, and the moisture-curing sealant is embedded in the recess of the sealant on the second substrate.

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