Packaging device for electronic component production

Abstract

The invention discloses a packaging device for electronic component production, and relates to the technical field of electronic component packaging. The packaging device for electronic component production comprises a packaging mold, a discharging channel is arranged at the bottom of the packaging mold, a finished product collecting frame is arranged at the bottom of the discharging channel, a forming mechanism is arranged at the bottom of the packaging mold, and a layer-by-layer cooling mechanism is movably connected to the outer wall of the packaging mold. The forming mechanism comprises a first sealing plate, and the first sealing plate is arranged at the bottom of the packaging mold. According to the packaging device for production of the electronic components, the electronic components are packaged by putting the electronic components into the packaging mold and slowly injecting a sealing material into the packaging mold through the injection molding equipment, and during packaging, the packaging mold vibrates back and forth in a small amplitude between the two supporting plates, so that the packaging effect is improved, and the packaging efficiency is improved. And bubbles between the injected materials are discharged from the top of the injection molding materials in a shaking manner.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, in particular to a packaging device for electronic component production. Background Art

[0002] Plastic encapsulation of electronic components involves wrapping the chip and lead frame in an insulating material such as epoxy resin to form a protective shell. This process typically uses injection molding or compression molding to ensure stable molding of precise structures under high temperature and pressure. The plastic encapsulation effectively isolates moisture, dust, and mechanical shock, while also providing heat dissipation and electrical insulation. Patent application number CN202010802283.7 discloses a packaging device for electronic component production, including a left mounting side plate and a right mounting side plate, wherein the left mounting side plate is connected to a left connecting rod clamping mechanism, and the right mounting side plate is connected to a right connecting rod clamping mechanism, wherein the upper ends of the right connecting rod clamping mechanism and the left connecting rod clamping mechanism are connected to a sliding mechanism, and the right connecting rod clamping mechanism and the left connecting rod clamping mechanism are connected to a packaging mold device, and an intermittent power device is provided below the two mounting side plates; When injection molding electronic components, if the viscosity of the packaging material is too high or the fluidity is insufficient, air can easily be trapped during high-speed injection molding to form bubbles, leading to the formation of bubbles inside the package. The presence of bubbles will reduce product reliability and quality in multiple dimensions, including electrical performance, mechanical strength, environmental tolerance, and heat dissipation efficiency. Summary of the Invention

[0003] In view of the deficiencies in the prior art, the present invention provides a packaging device for producing electronic components to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: A packaging device for producing electronic components, comprising a packaging mold, a discharge channel provided at the bottom of the packaging mold, a finished product collection frame provided at the bottom of the discharge channel, a molding mechanism provided at the bottom of the packaging mold, and a layer-by-layer cooling mechanism movably connected to the outer wall of the packaging mold; The molding mechanism includes: a first sealing plate, wherein the first sealing plate is arranged at the bottom of the packaging mold; a second sealing plate, the second sealing plate being arranged at the bottom of the packaging mold; A needle pushing plate is fixedly connected to the bottom of the first sealing plate.

[0005] Preferably, the first sealing plate is provided with a groove, and the second sealing plate is provided with a protrusion that cooperates with the first sealing plate.

[0006] Preferably, the packaging mold is fixedly connected to a fixing frame on both the left and right sides, and the inside of the fixing frame is fixedly connected to a pushing telescopic rod, and the inner sides of the pushing telescopic rods are fixedly connected to the corresponding pushing telescopic rods. When the electronic components are not placed inside the packaging mold, the first sealing plate is located at the bottom of the packaging mold. When the electronic components are placed, the pins of the electronic components will pass through the first sealing plate.

[0007] Preferably, the outer walls of the fixing frames are movably connected to support plates, a connecting base is provided at the bottom of the finished product collection frame, and the two support plates are fixedly connected to the top of the connecting base, a return spring is fixedly connected to the bottom of the left support plate, and the right side of the return spring is fixedly connected to the corresponding support plate.

[0008] Preferably, a driving motor is provided on the right side of the packaging mold, and the driving motor is fixedly connected to the top of the right support plate, a cam is fixedly connected to the bottom of the driving motor, and a pushing block is fixedly connected to the top of the right fixing frame located on the left side of the cam. The driving motor drives the cam to rotate and pushes the pushing block intermittently to push the packaging mold to move to the right.

[0009] Preferably, the layer-by-layer cooling mechanism includes a lifting telescopic rod, two of which are fixedly connected to the top of the fixing frame respectively, and the outer wall of the packaging mold is movably connected to a heat dissipation frame, and the outer wall of the heat dissipation frame is fixedly connected to the lifting telescopic rod.

[0010] Preferably, the left and right sides of the heat dissipation frame are fixedly connected to the first heat dissipation plate, and the front and back sides of the heat dissipation frame are fixedly connected to the second heat dissipation plate. During the injection molding process, the lifting telescopic rod will shrink as the injection molding proceeds, stretching the heat dissipation frame upward so that the heat dissipation frame is close to the top position of the injection molding material surface.

[0011] Preferably, a circulation hole is provided at the bottom of the discharge channel, and an air guide box is fixedly connected to the bottom of the discharge channel at the bottom of the circulation hole. A fan motor is provided on the top of the air guide box. During injection molding, the fan motor pushes the outside air into the air guide box and discharges it upward through the circulation hole, so that the gas flows to the first heat dissipation plate.

[0012] Preferably, an extension tube is fixedly connected to the top of the air guide box, and the extension tube is located at the bottom of the corresponding second heat sink. The fan motor is fixedly connected to the inner wall of the extension tube. When the fan motor discharges the gas into the air guide box, it will suck in the gas from the extension tube, thereby roughly cutting the gas flow at the second heat sink.

[0013] The present invention provides a packaging device for electronic component production, which has the following beneficial effects: 1. The packaging device for electronic component production encapsulates the electronic components by placing the electronic components into the packaging mold and slowly injecting the sealing material into the packaging mold through injection molding equipment. During the packaging process, the packaging mold is vibrated back and forth slightly between two support plates, so that the bubbles in the injected material are discharged from the top of the injection molding material through shaking, thereby enhancing the quality of the product.

[0014] 2. This packaging device for electronic component production continuously pulls up the heat dissipation frame by lifting the telescopic rod, so that the heat dissipation frame is close to the top position of the injection molding material surface, so that the heat dissipation frame conducts the heat of the injection molding packaging material and improves the cooling effect of the heat dissipation frame through airflow, thereby achieving the effect of layer-by-layer injection molding and layer-by-layer cooling, thereby effectively reducing thermal stress, improving filling quality and interface bonding strength, and improving product quality.

[0015] 3. In the packaging device used for the production of electronic components, no electronic components are placed inside the packaging mold before injection packaging. The fan motor pushes the airflow discharged from the circulation hole to blow toward the packaging mold. At the same time, the drive motor drives the cam to rotate, causing the packaging mold to vibrate to loosen impurities that may be attached to the inner wall of the packaging mold, which are blown out by the airflow, and then the inner wall of the packaging mold is quickly cleaned, preventing impurities from affecting the injection molding process and improving product quality.

[0016] 4. After the injection molding and packaging are completed, the two telescopic rods of the electronic component production packaging device will contract to drop the materials. The falling electronic components will be blown upward by the airflow discharged from the circulation holes, which will slow down the falling speed of the electronic components and avoid serious collisions of the electronic components during the dropping process, which will cause damage to the packaged electronic components and improve the quality of the products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the main three-dimensional structure of the present invention; Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle part A; Figure 3 This is a left-side perspective structural diagram of the present invention; Figure 4 This is a schematic structural diagram of the fixing frame of the present invention; Figure 5 for Figure 4 The enlarged structural diagram of the middle D part; Figure 6 for Figure 3 Schematic diagram of cross-section structure; Figure 7 for Figure 6 A schematic diagram of the enlarged structure of the middle B part; Figure 8 for Figure 6 Schematic diagram of the enlarged structure of part C in the middle.

[0018] In the figure: 1. Packaging mold; 2. Discharge channel; 3. Finished product collection frame; 4. Molding mechanism; 41. First sealing plate; 42. Second sealing plate; 43. Push pin plate; 44. Push telescopic rod; 45. Fixed frame; 46. Support plate; 47. Connecting base; 48. Driving motor; 49. Pushing block; 410. Cam; 411. Return spring; 5. Layer-by-layer cooling mechanism; 51. Lifting telescopic rod; 52. Heat dissipation frame; 53. First heat dissipation plate; 54. Second heat dissipation plate; 55. Circulation hole; 56. Air guide box; 57. Fan motor; 58. Extension tube. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention.

[0021] Example 1: Please refer to Figure 1-7 The present invention provides a technical solution: a packaging device for producing electronic components, comprising a packaging mold 1, a discharge channel 2 is provided at the bottom of the packaging mold 1, a finished product collection frame 3 is provided at the bottom of the discharge channel 2, a molding mechanism 4 is provided at the bottom of the packaging mold 1, and a layer-by-layer cooling mechanism 5 is movably connected to the outer wall of the packaging mold 1; The forming mechanism 4 includes: A first sealing plate 41, which is arranged at the bottom of the packaging mold 1; A second sealing plate 42, which is arranged at the bottom of the packaging mold 1; The needle pushing plate 43 is fixedly connected to the bottom of the first sealing plate 41 .

[0022] The first sealing plate 41 is provided with a groove, and the second sealing plate 42 is provided with a protrusion that cooperates with the first sealing plate 41 .

[0023] The electronic components with soldered pins are placed into the packaging mold 1, and the sealing material is slowly injected into the packaging mold 1 through the injection molding equipment to encapsulate the electronic components. The encapsulated electronic components are discharged from the bottom of the packaging mold 1, and then fall into the finished product collection frame 3 through the discharge channel 2 to collect the encapsulated electronic components.

[0024] The left and right sides of the packaging mold 1 are fixedly connected to the fixing frames 45, and the inside of the fixing frames 45 is fixedly connected to the pushing telescopic rods 44, and the inner sides of the pushing telescopic rods 44 are fixedly connected to the corresponding pushing telescopic rods 44. When the electronic components are not placed inside the packaging mold 1, the first sealing plate 41 is located at the bottom of the packaging mold 1. When the electronic components are placed, the pins of the electronic components will pass through the first sealing plate 41.

[0025] When placing the electronic components into the packaging mold 1, the two telescopic rods 44 are controlled to extend inward so that the first sealing plate 41 and the second sealing plate 42 fit each other. At the same time, the protrusion of the second sealing plate 42 will push the pins of the electronic components into the grooves of the first sealing plate 41. At the same time, due to the push of the pins by the second sealing plate 42, the pins will support the electronic components and move upward along the top of the push pin plate 43 until the first sealing plate 41 and the second sealing plate 42 are completely in contact with the pins of the electronic components. At this time, the bottom of the packaging mold 1 is completely closed by the pins and the first sealing plate 41 and the second sealing plate 42, and the electronic components are fixed. Then injection molding and packaging are started.

[0026] After the injection molding is completed, the two telescopic rods 44 are retracted so that the first sealing plate 41 and the second sealing plate 42 no longer seal the bottom of the mold 1, making it easier for the packaged electronic components to fall into the discharge channel 2. Then the first sealing plate 41 will move to a position that prevents the electronic components from falling directly into the discharge channel 2.

[0027] The outer walls of the fixing frame 45 are movably connected with support plates 46, a connecting base 47 is provided at the bottom of the finished product collection frame 3, and the two support plates 46 are fixedly connected to the top of the connecting base 47, a return spring 411 is fixedly connected to the bottom of the left support plate 46, and the right side of the return spring 411 is fixedly connected to the corresponding support plate 46.

[0028] The support plate 46 supports the packaging mold 1 through the fixing frame 45. When packaging, the packaging mold 1 is allowed to vibrate back and forth with a small amplitude between the two support plates 46, so that the bubbles in the injected material are discharged from the top of the injection material through shaking.

[0029] A drive motor 48 is provided on the right side of the packaging mold 1 and is fixedly connected to the top of the right support plate 46 . A cam 410 is fixedly connected to the bottom of the drive motor 48 . A push block 49 is fixedly connected to the top of the right fixing frame 45 on the left side of the cam 410 .

[0030] During injection molding, the driving motor 48 drives the cam 410 to rotate and pushes the push block 49 intermittently to push the packaging mold 1 to the right. Then the fixing frame 45 is pushed back by the reset spring 411, so that the packaging mold 1 vibrates back and forth directly on the two support plates 46.

[0031] When the injection packaging is completed and demoulding is required, the driving motor 48 drives the cam 410 to rotate, so that the packaging mold 1 vibrates, which facilitates demoulding.

[0032] Example 2: Please refer to Figure 1-8 Based on the first embodiment, the present invention provides a technical solution: The layer-by-layer cooling mechanism 5 includes a lifting telescopic rod 51, two of which are fixedly connected to the top of the fixing frame 45 respectively. The outer wall of the packaging mold 1 is movably connected to a heat dissipation frame 52, and the outer wall of the heat dissipation frame 52 is fixedly connected to the lifting telescopic rod 51.

[0033] The left and right sides of the heat dissipation frame 52 are fixedly connected to the first heat dissipation plate 53, and the front and back sides of the heat dissipation frame 52 are fixedly connected to the second heat dissipation plate 54. During the injection molding process, the lifting telescopic rod 51 will shrink as the injection molding proceeds, stretching the heat dissipation frame 52 upward so that the heat dissipation frame 52 is close to the top position of the injection molding material surface.

[0034] During the injection process, the telescopic rod 51 is lifted and continuously pulls the heat dissipation frame 52 upward, so that the heat dissipation frame 52 is close to the top position of the injection molding material surface, and the heat dissipation frame 52 is dissipated through the first heat dissipation plate 53 and the second heat dissipation plate 54. At the same time, the heat dissipation frame 52 conducts the heat of the injection molding packaging material, thereby achieving the effect of layer-by-layer injection molding and layer-by-layer cooling, thereby effectively reducing thermal stress, improving filling quality and interface bonding strength.

[0035] A circulation hole 55 is provided at the bottom of the discharge channel 2 . An air guide box 56 is fixedly connected to the bottom of the discharge channel 2 at the bottom of the circulation hole 55 . A fan motor 57 is provided on the top of the air guide box 56 .

[0036] During injection molding, the fan motor 57 will push the outside air into the air guide box 56 and discharge it upward through the circulation hole 55, so that the gas flows to the first heat sink 53 to enhance the cooling effect of the heat sink frame 52. At the same time, the air flow will blow toward the pins of the electronic components, transfer the heat of the electronic components through the pins, and dissipate the heat of the electronic components to avoid overheating and damage of the electronic components during injection molding.

[0037] In addition, before injection packaging, no electronic components are placed inside the packaging mold 1. Since the fan motor 57 pushes the airflow discharged from the circulation hole 55 to blow toward the packaging mold 1, and at the same time cooperates with the drive motor 48 to drive the cam 410 to rotate, the packaging mold 1 vibrates to loosen impurities that may be attached to the inner wall of the packaging mold 1, and the impurities are blown out by the airflow, thereby quickly cleaning the inner wall of the packaging mold 1 to prevent impurities from affecting the injection molding process.

[0038] After the injection molding is completed, the two telescopic rods 44 are retracted to drop the material, which will cause the falling electronic components to be blown upward by the airflow discharged from the flow holes 55, thereby slowing down the falling speed of the electronic components and avoiding serious collisions of the electronic components during the dropping process, which may cause damage to the packaged electronic components.

[0039] An extension pipe 58 is fixedly connected to the top of the air guide box 56 . The extension pipe 58 is located at the bottom of the corresponding second heat sink 54 . The fan motor 57 is fixedly connected to the inner wall of the extension pipe 58 .

[0040] When the fan motor 57 discharges the gas into the air guide box 56 , it will suck the gas from the extension tube 58 , thereby promoting the gas flow at the second heat sink 54 , so that the second heat sink 54 can better dissipate heat and enhance the cooling effect of the heat sink frame 52 .

[0041] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A packaging device for producing electronic components, comprising a packaging mold (1), characterized in that: A discharge channel (2) is provided at the bottom of the encapsulation mold (1), a finished product collection frame (3) is provided at the bottom of the discharge channel (2), a molding mechanism (4) is provided at the bottom of the encapsulation mold (1), and a layer-by-layer cooling mechanism (5) is movably connected to the outer wall of the encapsulation mold (1); The forming mechanism (4) comprises: A first sealing plate (41), the first sealing plate (41) being arranged at the bottom of the packaging mold (1); A second sealing plate (42), the second sealing plate (42) being arranged at the bottom of the packaging mold (1); A needle pushing plate (43) is fixedly connected to the bottom of the first sealing plate (41).

2. The packaging device for electronic component production according to claim 1, characterized in that: The first sealing plate (41) is provided with a groove, and the second sealing plate (42) is provided with a protrusion that cooperates with the first sealing plate (41).

3. The packaging device for electronic component production according to claim 1, characterized in that: The left and right sides of the packaging mold (1) are fixedly connected to fixing frames (45), the interiors of the fixing frames (45) are fixedly connected to push telescopic rods (44), and the inner sides of the push telescopic rods (44) are respectively fixedly connected to corresponding push telescopic rods (44).

4. The packaging device for electronic component production according to claim 3, characterized in that: The outer wall of the fixing frame (45) is movably connected to a support plate (46), a connecting base (47) is provided at the bottom of the finished product collection frame (3), and the two support plates (46) are fixedly connected to the top of the connecting base (47), the bottom of the left support plate (46) is fixedly connected to a return spring (411), and the right side of the return spring (411) is fixedly connected to the corresponding support plate (46).

5. The packaging device for electronic component production according to claim 3, characterized in that: A drive motor (48) is provided on the right side of the packaging mold (1), and the drive motor (48) is fixedly connected to the top of the right support plate (46), a cam (410) is fixedly connected to the bottom of the drive motor (48), and a push block (49) is fixedly connected to the top of the right fixing frame (45) on the left side of the cam (410).

6. The packaging device for electronic component production according to claim 1, characterized in that: The layer-by-layer cooling mechanism (5) includes a lifting telescopic rod (51), two of which are provided, and the two lifting telescopic rods (51) are respectively fixedly connected to the top of the fixing frame (45), and the outer wall of the packaging mold (1) is movably connected to a heat dissipation frame (52), and the outer wall of the heat dissipation frame (52) is fixedly connected to the lifting telescopic rod (51).

7. The packaging device for electronic component production according to claim 6, characterized in that: The left and right sides of the heat dissipation frame (52) are both fixedly connected to first heat dissipation plates (53), and the front and back sides of the heat dissipation frame (52) are both fixedly connected to second heat dissipation plates (54).

8. The packaging device for electronic component production according to claim 7, characterized in that: A circulation hole (55) is provided at the bottom of the discharge channel (2), an air guide box (56) is fixedly connected to the bottom of the discharge channel (2) at the bottom of the circulation hole (55), and a fan motor (57) is provided at the top of the air guide box (56).

9. The packaging device for electronic component production according to claim 8, characterized in that: An extension tube (58) is fixedly connected to the top of the air guide box (56), the extension tube (58) is located at the bottom of the corresponding second heat sink (54), and the fan motor (57) is fixedly connected to the inner wall of the extension tube (58).

Images