Expansion card module

Abstract

The invention provides an expansion card module. The expansion card module comprises an expansion card, a circuit board, a storage unit and a radiator, the circuit board is arranged beside the expansion card and comprises a first connector and a second connector. The storage unit is arranged on the first connector of the circuit board in a pluggable mode. The radiator is located beside the expansion card and the storage unit and is thermally coupled to the expansion card and the storage unit. According to the expansion card module, the storage unit transmits signals through the circuit board, and due to the fact that the signals do not need to be transmitted through the expansion card, the storage unit and the main board have good compatibility. In addition, the heat of the storage unit and the expansion card is dissipated through the radiator, so that a good heat dissipation effect is achieved.

Description

Technical Field

[0001] The present invention relates to an expansion card module, and more particularly to an expansion card module with good compatibility and heat dissipation performance. Background Art

[0002] Currently, some expansion cards include a separate storage unit, which connects to the motherboard via a port on the expansion card. However, some motherboards may experience compatibility issues with these expansion cards, resulting in the inability to access the storage unit or limited functionality. Improving the compatibility of expansion card modules with motherboards is a research area in this field. Summary of the Invention

[0003] This patent discloses an expansion card module comprising an expansion card, a circuit board, a storage unit, and a heat sink. The circuit board is disposed adjacent to the expansion card and includes a first connector and a second connector. The storage unit is removably attached to the first connector of the circuit board. The heat sink is located adjacent to the expansion card and storage unit and is thermally coupled to the expansion card and storage unit.

[0004] The memory unit of the expansion card module in this embodiment transmits signals through the circuit board. This eliminates the need for signal transmission through the expansion card, resulting in better compatibility between the memory unit and the motherboard. Furthermore, the memory unit and the expansion card in this embodiment dissipate heat together through the heat sink, providing excellent heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figures 1 to 3 is a schematic diagram of an expansion card module from different perspectives according to an embodiment of the present invention;

[0006] Figure 4 yes Figure 3 A partially enlarged schematic diagram of the expansion card module from another perspective;

[0007] Figure 5 is hidden Figure 4 A schematic diagram of another perspective of the cover;

[0008] Figure 6 is hidden Figure 1 Schematic diagram of the cover and fan;

[0009] Figure 7 is hidden Figure 5 Schematic diagram of the radiator;

[0010] Figure 8 yes Figure 7 A schematic diagram of a circuit board, storage unit and connecting wires;

[0011] Figure 9 yes Figure 1 Schematic diagram of the bottom surface of the heat sink.

[0012] Description of Reference Numerals

[0013] 100: expansion card module;

[0014] 110: expansion card;

[0015] 112: port;

[0016] 120: circuit board;

[0017] 122: first connector;

[0018] 124: second connector;

[0019] 126: Page 1;

[0020] 128: Side 2;

[0021] 130: storage unit;

[0022] 140: Radiator;

[0023] 150: first backplane;

[0024] 155: second back plate;

[0025] 160: cover plate;

[0026] 170: connecting line;

[0027] 180, 182: heat conducting parts;

[0028] 190: Fan. DETAILED DESCRIPTION

[0029] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0030] Figures 1 to 3 1 is a schematic diagram of an expansion card module from different perspectives according to an embodiment of the present invention. Figure 4 yes Figure 3 A partially enlarged schematic diagram of the expansion card module from another perspective. Figure 5 is hidden Figure 4 Schematic diagram of another perspective of the cover. Figure 6 is hidden Figure 1 Schematic diagram of the cover and fan. Figure 7 is hidden Figure 5 Schematic diagram of the heat sink. Figure 8 yes Figure 7 Schematic diagram of the circuit board, storage unit and connecting wires. Figure 9 yes Figure 1Schematic diagram of the bottom surface of the heat sink.

[0031] See also Figures 1 to 9 The expansion card module 100 of this embodiment includes an expansion card 110, a circuit board 120 ( Figure 4 ), storage unit 130 ( Figure 4 ) and radiator 140( Figure 4 In this embodiment, the expansion card 110 is, for example, a display adapter, the port 112 of the expansion card 110 is, for example, a PCI-E interface, and the storage unit 130 is, for example, a solid-state drive (SSD). However, the type of the expansion card 110, the interface of the port 112, and the type of the storage unit 130 are not limited thereto.

[0032] Depend on Figure 7 As can be seen, in this embodiment, the circuit board 120 is disposed adjacent to the expansion card 110 and includes a first connector 122 and a second connector 124. The first connector 122 and the second connector 124 are located on a first surface 126 of the circuit board 120 and face in opposite directions. For example, the second connector 124 faces outward from the circuit board 120, e.g., away from the expansion card 110.

[0033] The storage unit 130 is pluggable and disposed on the first connector 122 of the circuit board 120. The expansion card module 100 further includes a connection cable 170 that is pluggable and disposed on the second connector 124. The storage unit 130 is connected to the circuit board 120 via the first connector 122, and the circuit board 120 is connected to the connection cable 170 via the second connector 124. The connection cable 170 can be connected to a slot (not shown) on a mainboard (not shown).

[0034] Therefore, the storage unit 130 of the expansion card module 100 of this embodiment is electrically connected to the motherboard via the circuit board 120 and the connection cable 170 for signal transmission. Since the storage unit 130 does not need to transmit signals through the port 112 of the expansion card 110, the storage unit 130 and the motherboard can achieve better compatibility. Furthermore, since the storage unit 130 is not located on the expansion card 110, it does not occupy the expansion card 110's space and does not affect the circuit layout of the expansion card 110.

[0035] The expansion card module 100 further includes a first backplane 150 and a second backplane 155. The expansion card 110 is fixed to the first backplane 150, and the circuit board 120 is fixed to the second backplane 155. The storage unit 130 can be fixed to the first backplane 150 at its end by a fixing structure such as a knob. In this embodiment, the first backplane 150 and the second backplane 155 are located on the same plane, but in other embodiments, the first backplane 150 and the second backplane 155 can also be located on different planes. The second backplane 155 is located on the second surface 128 ( Figure 7 ).

[0036] like Figure 4 As shown, the expansion card module 100 further includes a cover 160 secured to the first back plate 150 and the second back plate 155. The first back plate 150 and the second back plate 155 are secured to the cover 160 by, for example, locking means, but this is not limiting. Furthermore, the expansion card 110, circuit board 120, storage unit 130, heat sink 140, and fan 190 are located in the space surrounded by the cover 160, the first back plate 150, and the second back plate 155.

[0037] Depend on Figure 8 As can be seen, in this embodiment, the storage unit 130 extends beyond the circuit board 120, causing the projection of the storage unit 130 onto the second backplane 155 to extend beyond the projection of the circuit board 120 onto the second backplane 155. This means that the size of the circuit board 120 does not need to be too large, thus saving costs. In other embodiments, the projection of the storage unit 130 onto the second backplane 155 may also be within the projection of the circuit board 120 onto the second backplane 155. The size relationship between the storage unit 130 and the circuit board 120 is not limited to this.

[0038] like Figure 5 As shown, the heat sink 140 is located beside the expansion card 110 and the storage unit 130 and is thermally coupled to the expansion card 110 and the storage unit 130. Figure 6 As shown, the projection of the heat sink 140 on the first back plate 150 partially overlaps with the projection of the expansion card 110 on the first back plate 150, and the projection of the heat sink 140 on the second back plate 155 at least partially overlaps with the projection of the storage unit 130 on the second back plate 155. Figure 9 As shown, the expansion card module 100 further includes heat conducting members 180 and 182 located between the heat sink 140 and the memory unit 130 . Therefore, heat energy generated by the heat sink 140 and the memory unit 130 can be conducted to the heat sink 140 through the heat conducting members 180 and 182 .

[0039] Furthermore, the memory cells 130 of the expansion card module 100 of this embodiment are dissipated together with the expansion card module 100 through the heat sink 140, thereby achieving excellent heat dissipation. In other embodiments, if the number or area of ​​the memory cells 130 is larger, the size of the heat sink 140 can be increased accordingly to provide excellent heat dissipation for more memory cells 130.

[0040] The memory unit of the expansion card module in this embodiment transmits signals through the circuit board. This eliminates the need for signal transmission through the expansion card, resulting in better compatibility between the memory unit and the motherboard. Furthermore, the memory unit and the expansion card in this embodiment dissipate heat together through the heat sink, providing excellent heat dissipation.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this case, rather than to limit them. Although this case has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this case.

Claims

1. An expansion card module, characterized in that: include: expansion cards; A circuit board is disposed next to the expansion card and includes a first connector and a second connector; a storage unit, pluggably disposed on the first connector of the circuit board; as well as The heat sink is located beside the expansion card and the storage unit and is thermally coupled to the expansion card and the storage unit.

2. The expansion card module according to claim 1, wherein: The system further comprises a first back plate and a second back plate, wherein the expansion card is fixed to the first back plate, and the circuit board is fixed to the second back plate.

3. The expansion card module according to claim 2, wherein: It also includes a cover plate fixed to the first back plate and the second back plate. The expansion card, the circuit board, the storage unit and the heat sink are located in a space surrounded by the cover plate, the first back plate and the second back plate.

4. The expansion card module according to claim 2, wherein: The first back plate and the second back plate are located in the same plane.

5. The expansion card module according to claim 2, wherein: The first connector and the second connector are located on the first surface of the circuit board and face different directions, and the second backplane is located on the second surface of the circuit board.

6. The expansion card module according to claim 2, wherein: The projection of the storage unit on the second backplane exceeds the range of the projection of the circuit board on the second backplane.

7. The expansion card module according to claim 2, wherein: The projection of the heat sink on the second back plate at least partially overlaps with the projection of the storage unit on the second back plate.

8. The expansion card module according to claim 2, wherein: The projection of the heat sink on the first back plate partially overlaps with the projection of the expansion card on the first back plate.

9. The expansion card module according to claim 1, wherein: It also includes a connecting line that is pluggable and arranged on the second connector.

10. The expansion card module according to claim 1, wherein: A heat conducting member is also included, which is located between the heat sink and the storage unit.

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